KR102672854B1 - Substrate cleaning apparatus - Google Patents

Abstract

Disclosed is a substrate cleaning device. A substrate cleaning apparatus according to an embodiment includes a substrate chuck that supports a substrate to be cleaned; a spray cap including a lower frame connected to the substrate chuck and an upper frame connected to an upper part of the lower frame; and a lower injection pipe that vertically penetrates the lower frame, an upper injection pipe formed in the upper frame and one side of which communicates with the lower injection pipe, and a lower injection pipe that communicates with the other side of the upper injection pipe and penetrates a side of the upper frame. It may include a side nozzle unit including a side injection port.

Description

Substrate cleaning device {SUBSTRATE CLEANING APPARATUS}

The example below relates to a substrate cleaning device.

In general, semiconductors are manufactured by repeatedly performing a series of processes such as lithography, deposition, and etching. Contaminants such as various particles, metal impurities, or organic substances remain on the surface of the substrate that makes up such a semiconductor due to repetitive processes. Contaminants remaining on the substrate reduce the reliability of the semiconductor being manufactured, so a substrate cleaning device is employed during the semiconductor manufacturing process to improve this. A substrate cleaning device sprays a cleaning liquid onto a substrate to clean the surface of the substrate.

Recently, in the substrate cleaning process, technology for managing particles on the back of the substrate has been highlighted as important. Therefore, in the substrate cleaning process, there is an emerging need to spray cleaning liquid on both sides of the substrate simultaneously. Conventionally, a process of flipping the substrate was performed to clean both sides of the substrate, but this may delay the cleaning process and cause damage to the substrate during the flipping process. On the other hand, when the cleaning liquid is sprayed directly on the back of the substrate without turning the substrate over, problems arise such as the cleaning liquid falling from the back of the substrate due to its own weight or the cleaning liquid not being evenly distributed over the entire substrate.

Therefore, in the process of cleaning both sides of the substrate, there is a need for a cleaning device and method that can efficiently clean the back side of the substrate without turning the substrate over.

The content described as the above-mentioned background technology is what the inventor possessed or acquired in the process of deriving the present invention, and it cannot necessarily be said to be recognized as known technology disclosed to the general public before the application for the present invention.

The purpose of one embodiment is to provide a substrate cleaning device that can ensure an efficient cleaning effect by spraying a cleaning liquid directly on the back of the substrate without turning the substrate over.

The purpose of one embodiment is to provide a substrate cleaning device that can secure high cleaning uniformity by evenly applying a cleaning solution to the entire area of the substrate.

The purpose of one embodiment is to provide a substrate cleaning device that can prevent the cleaning solution from falling during the process of spraying the cleaning solution on the back of the substrate.

The problems to be solved in one embodiment are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A substrate cleaning apparatus according to an embodiment includes a substrate chuck that supports a substrate to be cleaned; a spray cap including a lower frame connected to the substrate chuck and an upper frame connected to an upper part of the lower frame; and a lower injection pipe that vertically penetrates the lower frame, an upper injection pipe formed in the upper frame and one side of which communicates with the lower injection pipe, and a lower injection pipe that communicates with the other side of the upper injection pipe and penetrates a side of the upper frame. It may include a side nozzle portion including a side nozzle.\

On one side, the injection cap includes a lower fastening portion formed at the top of the lower frame along the circumference of the lower injection pipe; And it may include an upper fastening part formed at the bottom of the upper frame along the circumference of the upper injection pipe and fastened to the lower fastening part.

On one side, the lower fastening part includes a lower protruding member whose outer peripheral surface of the lower injection pipe protrudes toward the upper end of the lower frame, and wherein the upper fastening portion includes an outer peripheral surface of the upper injection pipe protruding toward the lower end of the upper frame. , may include an upper protruding member engaged with the lower protruding member.

On one side, the upper protruding member may have a bottom shape that slopes downward toward the outside of the lower injection pipe.

On one side, the upper fastening part is formed along the circumference of the upper protruding member and includes a fastening groove recessed into the inside of the upper frame, and the lower fastening part is formed along the circumference of the lower protruding member, It may include a fastening member inserted into the fastening groove.

On one side, the injection cap may further include a cover member connected to the upper frame to seal a screw groove for connecting the upper frame and the lower frame.

On one side, the cover member may include a sealing protrusion protruding from the lower side to be inserted into the screw groove.

On one side, the upper frame includes an extension portion whose side surface protrudes outward, and the side injection hole may have a longitudinal direction formed along the extension portion.

On one side, the central injection axis of the side injection hole may have an inclination ranging from 10 degrees to 30 degrees relative to the ground.

On one side, the side nozzle unit may be detachably connected to the side injection hole and may further include a nozzle tip having a spray passage formed along the longitudinal direction.

On one side, the connection angle of the nozzle tip to the side nozzle can be adjusted.

On one side, the upper frame may include a crater whose upper surface is concave inward.

On one side, the substrate cleaning device may further include a center nozzle portion that penetrates the spray cap vertically and sprays the cleaning liquid to a portion closer to the center of the substrate than the side nozzle portion.

On one side, the center nozzle unit includes a lower center pipe penetrating the lower frame in a vertical direction; And it may include an upper center pipe that communicates with the lower center injection pipe and penetrates the upper frame in a vertical direction.

On one side, the upper center pipe may be formed in an inclined direction with respect to the ground.

On one side, the center nozzle unit may further include a center tube that is inserted into the upper center tube and protrudes to a higher position than the upper surface of the upper frame.

On one side, the center nozzle unit may selectively perform a spraying function of spraying a cleaning liquid on the back of the substrate and a suction function of sucking in the cleaning liquid collected on the upper surface of the upper frame.

On one side, the substrate cleaning device further includes a gas injection unit for spraying a dry gas toward the rear surface of the substrate, wherein the gas injection unit includes a gas injection pipe that vertically penetrates the injection cap, and a gas injection pipe connected to the gas injection pipe. It may include a gas injection tube that is inserted and whose upper end protrudes to a higher position than the upper surface of the upper frame.

On one side, the substrate cleaning device further includes a control unit that controls spraying of the cleaning liquid on the substrate, and the control unit is configured to allow the cleaning liquid sprayed on the back of the substrate to be sprayed to the edge area of the substrate without falling. The spraying of the cleaning liquid can be controlled so that

On one side, the control unit includes a first phase in which cleaning liquid is sprayed from the side nozzle unit; After the first phase, a second phase in which cleaning liquid is sprayed from the center nozzle unit and the side nozzle unit; And after the second phase, it may include a third phase for adjusting the spray flow rate of the cleaning liquid sprayed from the center nozzle.

On one side, the control unit controls the side nozzle unit to spray the cleaning liquid at a first flow rate, and after the center nozzle unit sprays the cleaning liquid at a second flow rate higher than the first flow rate, the control unit controls the side nozzle unit to spray the cleaning liquid at a second flow rate lower than the first flow rate. It can be controlled to spray the cleaning liquid at 3 flow rates.

On one side, the first flow rate may be in the range of 200 ml/min to 800 ml/min.

On one side, in the second phase, the side nozzle unit and the center nozzle unit spray the cleaning liquid at the same pressure, and the cleaning liquid injection pressure may be in the range of 0.1 mpa to 0.3 mpa.

On one side, the control unit may control the center nozzle unit and the side nozzle unit to spray cleaning liquid on the back surface of the substrate after spraying pure water (DIW) on the center portion of the back surface of the substrate.

The substrate cleaning device of one embodiment can ensure an efficient cleaning effect by spraying a cleaning liquid directly on the back of the substrate without turning the substrate over.

The substrate cleaning device of one embodiment can ensure high cleaning uniformity by evenly applying a cleaning solution to the entire area of the substrate.

The substrate cleaning device of one embodiment can prevent the cleaning solution from falling during the process of spraying the cleaning solution on the back of the substrate.

The effects of the substrate cleaning device according to one embodiment are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description below.

The following drawings attached to this specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention along with the detailed description of the invention. Therefore, the present invention is limited to the matters described in such drawings. It should not be interpreted in a limited way.
1 is a schematic diagram of a substrate cleaning device according to an embodiment.
Figure 2 is a block diagram of a substrate cleaning device according to one embodiment.
3 to 5 are diagrams of the operation of a substrate cleaning device according to an embodiment.
Figure 6 is a perspective view of a spray cap according to one embodiment.
FIG. 7 is a cross-sectional view of the substrate cleaning device along line AA in FIG. 6.
Figure 8 is an exploded view of a spray cap according to one embodiment.
Figure 9 is an enlarged view of portion C of Figure 7.
Figure 10 is a cross-sectional view of the injection cap along line BB in Figure 6.
Figures 11a and 11b are perspective views of a cover member according to one embodiment.
Figure 12 is a cross-sectional view of a substrate cleaning device according to one embodiment.
13 is a perspective view of a spray cap according to one embodiment.
14 is a cross-sectional view of a spray cap according to one embodiment.
15 is a flowchart of a substrate cleaning method according to one embodiment.
16 is a flowchart of a substrate cleaning method according to one embodiment.

Hereinafter, embodiments will be described in detail through illustrative drawings. When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing an embodiment, if a detailed description of a related known configuration or function is judged to impede understanding of the embodiment, the detailed description will be omitted.

Additionally, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the component is not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be directly connected or connected to that other component, but there is no need for another component between each component. It should be understood that may be “connected,” “combined,” or “connected.”

Components included in one embodiment and components including common functions will be described using the same names in other embodiments. Unless stated to the contrary, the description given in one embodiment may be applied to other embodiments, and detailed description will be omitted to the extent of overlap.

FIG. 1 is a schematic diagram of a substrate cleaning device according to an embodiment, and FIG. 2 is a block diagram of a substrate cleaning device according to an embodiment.

Referring to FIGS. 1 and 2 , the substrate cleaning device 1 according to one embodiment may be used to clean the substrate (W). Since the substrate W includes both sides, the cleaning process for the substrate W requires cleaning both sides of the substrate W. Generally, since the cleaning liquid for cleaning the substrate (W) falls in the direction of gravity, the conventional substrate (W) cleaning process is performed by spraying the cleaning liquid on the upper surface of the substrate (W). The substrate cleaning device 1 can clean both sides of the substrate W without the process of turning the substrate W over. The substrate cleaning device 1 sprays the cleaning liquid directly toward the back of the substrate W during the substrate W cleaning process, thereby omitting the separate process of turning the substrate W over. Hereinafter, for convenience of explanation, based on the state in which the substrate to be cleaned (W) is seated, the side of the substrate (W) facing the top is referred to as the front side of the substrate (W), and the substrate (W) facing the bottom is referred to as the front side of the substrate (W). The (W) side is expressed as the back side of the substrate (W).

The substrate W on which processing is performed through the substrate cleaning device 1 may be a silicon wafer for manufacturing a semiconductor device. On the other hand, the substrate W is glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or plasma display panel (PDP), or a large-area panel such as a solar cell panel. It could be glass. In other words, the type of substrate W on which cleaning processing is performed through the substrate cleaning device 1 is not limited.

The substrate cleaning device 1 can spray the cleaning liquid directly from the lower side of the substrate W toward the back surface. When the cleaning solution is directly sprayed on the back of the substrate W, the cleaning solution may drop due to its own weight from the back of the substrate W. Dropping of the cleaning liquid may cause damage and contamination of the substrate cleaning device and surrounding devices, and may cause problems in which the cleaning liquid is not evenly distributed over the entire back surface of the substrate W. The uniform distribution of the cleaning solution on the surface of the substrate W is directly related to the cleaning uniformity and etching uniformity of the substrate W, and can ultimately affect the performance of the substrate W.

The substrate cleaning device 1 according to one embodiment may spray a cleaning liquid to multiple areas on the back of the substrate W. The substrate cleaning device 1 can adjust the spray angle of the cleaning liquid sprayed on the back surface of the substrate W. The substrate cleaning device 1 controls the spraying method of the cleaning liquid sprayed on the substrate W according to set conditions, thereby minimizing the phenomenon of the cleaning liquid dropping from the back of the substrate W, and controlling the spraying method of the cleaning liquid sprayed on the substrate W according to set conditions. You can ensure the effect of evenly applying the cleaning solution. As a result, the substrate cleaning device 1 can secure the cleaning uniformity and etching uniformity of the substrate W and ultimately reduce the defect rate of the substrate W.

The substrate cleaning device 1 can simultaneously clean both sides of the substrate W. In other words, the substrate cleaning device 1 can clean the front side of the substrate W through a separate component located on top of the substrate W while cleaning the back side of the substrate W. As a configuration for cleaning the front side of the substrate W, a typical cleaning device configuration can be applied. Hereinafter, for convenience of explanation, the configuration for cleaning the front side of the substrate W will be omitted, and the description will focus on the device for cleaning the back side of the substrate W.

The substrate cleaning device 1 may include a substrate chuck 100, a cleaning liquid spray unit 110, and a control unit 120.

The substrate chuck 100 may support the substrate W. Through the substrate chuck 100, the substrate W can be placed with its back side horizontal to the ground. The substrate chuck 100 may include a rotating platen 101 and a support portion 102 connected to the rotating platen 101.

The rotation platen 101 may rotate about a rotation axis perpendicular to the ground. The support portion 102 is connected to the rotating platen 101 and extends upward to support the outside of the substrate W, that is, the edge area of the substrate W. When the rotation platen 101 rotates, the substrate W supported by the support portion 102 may rotate together. When the substrate W is seated on the rotating platen 101, the rotation axis of the rotating platen 101 may pass through the center of the substrate W. That is, the substrate W can rotate based on an axis passing through the center.

Since the substrate W is supported through the support portion 102, the rotating platen 101 and the substrate W can be spaced apart from each other and form a constant gap. That is, the back of the substrate W faces the upper surface of the rotating platen 101, and a constant distance from the rotating platen 101 can be maintained.

The cleaning liquid spray unit 110 may spray the cleaning liquid toward the back of the substrate (W). The cleaning liquid is a chemical liquid for treating the substrate W, and the type of chemical liquid is not limited to the purpose of cleaning the substrate W. That is, the cleaning liquid is just a name for convenience of explanation, and various types of chemical solutions for treating the substrate W can be sprayed through the cleaning liquid spray unit 110. For example, the cleaning solution may be pure water (DIW, deionized water) or a high-temperature acidic treatment solution such as sulfuric acid or phosphoric acid. However, the types are not limited to the examples described above.

The cleaning liquid spray unit 110 may be connected to the substrate chuck 100. The cleaning liquid spray unit 110 may be disposed on the upper surface of the rotating platen 101 so that the end from which the cleaning liquid is discharged faces the back of the substrate (W). The cleaning liquid spray unit 110 may spray the cleaning liquid toward multiple areas on the back of the substrate W.

For example, the cleaning liquid spray unit 110 includes a center nozzle 111 and a side nozzle 112, and the center nozzle 111 and the side nozzle 112 are located at the first and second portions of the back of the substrate W. You can spray the cleaning solution to each area. The cleaning liquid spray unit 110 may spray the cleaning liquid to multiple areas of the substrate W from various angles.

The center nozzle 111 may spray the cleaning liquid to the first area on the back of the substrate W. For example, the first portion may be the central portion of the rear surface of the substrate W supported on the substrate chuck 100. The center nozzle 111 may be disposed at a portion of the rotating platen 101 corresponding to the center portion of the rear surface of the substrate W. The center nozzle 111 may spray the cleaning liquid in a direction perpendicular to the surface of the substrate W. Accordingly, the cleaning liquid sprayed through the center nozzle 111 may be sprayed toward the center of the back of the substrate W. When the substrate W rotates, the cleaning liquid sprayed from the center nozzle 111 may be dispersed from the center of the substrate W toward the edge.

The side nozzle 112 may spray the cleaning liquid to a second portion of the rear surface of the substrate W. The second region may be a region of the substrate W spaced apart from the first region, for example, a region adjacent to an edge region of the substrate W. The side nozzle 112 may spray the cleaning liquid in an inclined direction on the surface of the substrate W. That is, the cleaning liquid sprayed from the side nozzle 112 may be sprayed in a diagonal direction toward the back of the substrate W. Based on the surface of the substrate W, the side nozzle 112 may spray the cleaning liquid in an upwardly inclined direction at an angle of 10 to 45 degrees. Preferably, the side nozzle 112 may spray the cleaning liquid at an upward incline of 10 to 30 degrees with respect to the surface of the substrate W. The cleaning liquid sprayed from the side nozzle 112 is sprayed at a position spaced apart from the center of the back of the substrate W, that is, at a position spaced a certain distance from the position where the cleaning liquid sprayed from the center nozzle 111 is sprayed on the substrate W. It can be.

The cleaning liquid spray unit 110 can control the spraying of the cleaning liquid to each of the center nozzle 111 and the side nozzles 112. Each nozzle of the cleaning liquid spray unit 110 may be connected to a cleaning liquid supply unit (not shown) that supplies the cleaning liquid to receive the cleaning liquid. Conditions such as whether the cleaning liquid sprayed from the center nozzle 111 and the side nozzle 112 are sprayed, spray flow rate, spray intensity, spray speed, spray cycle, etc. can be adjusted individually.

The control unit 120 may control the operation of the cleaning liquid spray unit 110. The control unit 120 operates the center nozzle 111 and the side nozzles 112 to prevent the cleaning liquid sprayed on the back of the substrate W from falling, and to evenly distribute the cleaning liquid over the entire back of the substrate W. can be controlled. A method of controlling the cleaning liquid spray unit 110 through the control unit 120 will be described later.

3 to 5 are diagrams of the operation of a substrate cleaning device according to an embodiment.

Referring to FIGS. 3 to 5 , the substrate cleaning device may perform a substrate (W) cleaning operation according to a set process. The detailed conditions of the set process may be partially changed depending on the type and size of the substrate W, but the basic conditions according to the process can be maintained regardless of the type and size of the substrate W.

Figure 3 shows the initial stage of cleaning the substrate W. During the initial cleaning process of cleaning the back surface of the substrate W, the controller 120 may control the cleaning solution to be sprayed from the side nozzle 112. In this case, spraying of the cleaning liquid from the center nozzle 111 may be stopped. Accordingly, the cleaning liquid may be initially sprayed to a location spaced apart from the center of the substrate W. Since the substrate (W) rotates about its central axis during the cleaning process, the cleaning liquid sprayed from the side nozzle 112 spreads and disperses from the initial contact point on the surface of the substrate (W) to the edge area of the substrate (W) by centrifugal force. It can be. The control unit 120 may maintain the flow rate of the cleaning liquid sprayed from the side nozzle 112 at the set first flow rate F1. The first flow rate F1 may range from 200 ml/min to 800 ml/min, for example. However, the flow rate value may change depending on the type or size of the substrate (W).

After the cleaning liquid is first sprayed on the back of the substrate W, the control unit 120 can control the cleaning liquid to be simultaneously sprayed from the side nozzle 112 and the center nozzle 111 toward the substrate W, as shown in FIG. 4 . That is, while spraying the cleaning liquid from the side nozzle 112 is maintained, the spraying of the cleaning liquid through the center nozzle 111 can be performed. The center nozzle 111 may spray the cleaning liquid to the central area of the back of the substrate W. In this case, the flow rate of the cleaning liquid sprayed from the side nozzle 112 is maintained at the first flow rate (F1), and the flow rate of the cleaning liquid sprayed from the center nozzle 111 is maintained at a second flow rate (F2) that is higher than the first flow rate (F1). ) can be.

According to this injection control method, the cleaning liquid sprayed onto the substrate W through the center nozzle 111 can be dispersed from the center area of the substrate W toward the edge. The cleaning liquid sprayed from the center nozzle 111 spreads toward the edge of the substrate W as the substrate W rotates and may be mixed with the cleaning liquid sprayed from the side nozzle 112.

After the cleaning liquid is sprayed from the center nozzle 111, when a predetermined time has elapsed, the control unit 120 may change the flow rate of the cleaning liquid sprayed from the center nozzle 111 as shown in FIG. 5. In this case, the control unit 120 may control the center nozzle 111 to spray the cleaning liquid at a third flow rate (F3) that is lower than the first flow rate (F1).

By controlling the spraying of the cleaning liquid according to the above-described process, the cleaning liquid sprayed from the center nozzle 111 and the side nozzle 112 are combined at a specific point on the back of the substrate W. In the process of spreading the cleaning liquid sprayed from the center nozzle 111 to the edge area of the substrate W, the cleaning liquid sprayed from the side nozzle 112 is spread evenly to the edge of the substrate W without any intermediate dropping phenomenon due to the surface tension of the cleaning liquid sprayed from the side nozzle 112. It can spread.

In the above-described cleaning liquid spraying process, the spray pressure of the cleaning liquid sprayed through the side nozzle 112 and the center nozzle 111 may be the same. For example, the spray pressure of the cleaning liquid may range from 0.1 mpa to 0.3 mpa.

As a result, according to the cleaning liquid injection control process through the substrate cleaning device, it is possible to prevent the cleaning degree of the substrate W from deteriorating while spraying the cleaning liquid directly on the back surface of the substrate W. For example, when the cleaning liquid is sprayed only at the center of the back of the substrate (W), if the spray intensity of the cleaning liquid becomes stronger, the degree of dispersion of the cleaning liquid in the edge area is lower than in the center area of the substrate (W), and the entire substrate (W) is damaged. A problem may occur in which the cleaning uniformity varies, and if the spray intensity of the cleaning solution is weak, the cleaning solution may not reach the edge area of the substrate (W). On the other hand, if the cleaning liquid is sprayed at various locations on the substrate W at the same time, the sprayed cleaning liquid collides with each other and causes splash, which may cause a process defect to occur on the front of the substrate W. . On the other hand, when the cleaning liquid spray of the center nozzle 111 and the side nozzle 112 is controlled according to a set process, such as in a substrate cleaning device, the cleaning liquid is sprayed directly from the bottom toward the back of the substrate W, while following gravity. While preventing the cleaning solution from falling, it is possible to prevent the cleaning solution from becoming thin while it moves to the edge area of the substrate (W). Accordingly, it is possible to prevent contamination problems caused by dropping of the cleaning solution or a decrease in the cleaning accuracy of the edge area of the substrate W.

Below, the structure of the substrate cleaning device will be described. In describing the structure of the substrate cleaning device, descriptions that overlap with those described above will be omitted. The substrate cleaning device can effectively clean the back side of the substrate W facing the ground without the process of turning the substrate W over.

FIG. 6 is a perspective view of a spray cap according to an embodiment, and FIG. 7 is a cross-sectional view of the substrate cleaning device taken along line A-A of FIG. 6.

Referring to FIGS. 6 and 7 , the substrate cleaning device 2 according to an embodiment includes a substrate chuck 200, a spray cap 210, a center nozzle portion 230, a side nozzle portion 220, and a gas spray portion. It may include (240) and a control unit (not shown).

The substrate chuck 200 may support the substrate W to be cleaned. The substrate chuck 200 may rotate while supporting the substrate W. During the cleaning process, the substrate W may be rotated by the substrate chuck 200. The substrate W may be placed on the upper part of the substrate chuck 200 while being spaced apart from each other.

The spray cap 210 may be connected to the substrate chuck 200. The spray cap 210 is connected to the substrate chuck 200 with a bearing, so that it can remain fixed during the cleaning process. In other words, while the substrate chuck 200 rotates, the injection cap 210 does not rotate. The spray cap 210 may include a lower frame 212 and an upper frame 211.

The lower frame 212 may be connected to the substrate chuck 200. The upper frame 211 may be connected to the upper part of the lower frame 212. The lower frame and the upper frame 211 may be connected to each other to form the spray cap 210. For example, the lower frame 212 and the upper frame 211 include a screw groove penetrating vertically inside, and a screw that is simultaneously inserted into the lower frame 212 and the upper frame 211 is inserted into the screw groove. It can be.

The lower frame 212 and the upper frame 211 may be fastened and assembled to enable sealing to prevent fluid flowing inside from leaking through the connection portion. For example, the injection cap may include a lower fastening part 214 formed on the lower frame 212 and an upper fastening part 213 formed on the upper frame 211 and fastened to the lower fastening part 214. there is. This will be described later.

The upper surface of the upper frame 211 may face the rear surface of the substrate W seated on the substrate chuck 200. Accordingly, the side nozzle unit 220, the center nozzle unit 230, and the gas injection unit 240, which will be described later, can spray cleaning liquid or gas from the upper frame 211 toward the substrate W.

The upper frame 211 may include a crater 2111 formed on the upper surface. The crater 2111 may be formed in a shape where the upper surface of the upper frame 211 is concave inward. The crater 2111 may include a shape whose depth increases from the outside toward the center. Since the center injection hole of the center nozzle unit 230, which will be described later, is formed in the central portion of the upper frame 211, the center injection hole may be located at the deepest point of the crater 2111.

The crater 2111 may provide a space where cleaning liquid dropped due to a drop phenomenon is collected during the cleaning process of the substrate W. The cleaning liquid collected in the crater 2111 may be sucked in through the center nozzle unit 230 and discharged to the outside. As a result, the crater 2111 can prevent the cleaning liquid from splashing out of the substrate cleaning device 2 and contaminating or damaging the substrate W or surrounding equipment.

The upper frame 211 may include an extension portion 2112 whose side surface partially protrudes outward. In other words, a specific portion of the side of the upper frame 211 may protrude outward. A side injection hole 223, which will be described later, may be formed in the extension portion 2112.

The center nozzle unit 230 may spray the cleaning liquid C1 toward the back of the substrate W. The center nozzle unit 230 penetrates the spray cap 210 vertically and can spray the cleaning liquid C1 to an area closer to the center of the substrate W than the side nozzle unit 220, which will be described later. The cleaning liquid C1 sprayed by the center nozzle unit 230 may reach the first portion of the rear surface of the substrate W. For example, the first portion may be the center portion of the back surface of the seated substrate W.

The center nozzle unit 230 may include a center injection pipe and a center tube 233.

The center injection pipe may include a lower center pipe 231 and an upper center pipe 232. The lower center pipe 231 may be formed by penetrating the lower frame 212 in the vertical direction. The lower center pipe 231 is connected to a cleaning fluid supply unit (not shown) to receive cleaning fluid.

The upper center pipe 232 may be formed by penetrating the upper frame 211 in the vertical direction. The lower end of the upper center pipe 232 may be in communication with the lower center pipe 231. The upper center pipe 232 may communicate with the center injection hole 234 formed on the upper surface of the upper frame 211. The central axis of the center nozzle 234 may be inclined with respect to the ground. On the other hand, unlike this, the central axis of the center nozzle 234 may be perpendicular to the ground. The upper center pipe 232 may be formed in a direction perpendicular to the ground. On the other hand, unlike this, the upper center pipe 232 may be formed in an inclined direction with respect to the ground.

The center tube 233 may be inserted into the upper center tube 232. The cleaning liquid may be sprayed toward the substrate (W) through the center tube 233. The end of the center tube 233 may protrude to a higher position than the upper surface of the upper frame 211. Accordingly, the cleaning liquid sprayed through the center tube 233 can be prevented from falling from the substrate W and mixing with the cleaning liquid collected on the upper surface of the upper frame 211.

Since the center tube 233 is connected to the substrate chuck 200 along the longitudinal direction of the upper center tube 232, the angle at which the cleaning liquid is sprayed can be adjusted depending on the shape of the upper center tube 232. For example, when the upper center tube 232 has a longitudinal direction perpendicular to the ground as shown in FIG. 7, the center tube 233 has a longitudinal direction perpendicular to the ground and extends in a direction perpendicular to the substrate W. Cleaning liquid can be sprayed. On the other hand, when the upper center tube 232 has a longitudinal direction inclined to the ground, the center tube 233 has a longitudinal direction inclined to the ground and can spray the cleaning liquid in an inclined direction with respect to the substrate W. .

The center nozzle unit 230 can selectively perform the function of spraying cleaning liquid on the back of the substrate W or suctioning the dropped cleaning liquid. For example, the center nozzle unit 230 has a spray function to spray the cleaning liquid on the substrate W through the center tube 233, and the cleaning liquid collected on the upper surface of the upper frame 211 is sprayed through the upper center tube 232. The suction function can be selectively performed.

The side nozzle unit 220 may spray the cleaning liquid C2 toward the back of the substrate W. The side nozzle unit 220 may spray the cleaning liquid C2 to a second portion of the rear surface of the substrate W. The second portion may be located at a distance from the first portion, for example, may be located further apart than the first portion based on the center of the substrate W. The side nozzle unit 220 may spray the cleaning liquid C2 in a diagonal direction with respect to the substrate W. The side nozzle unit 220 may include a side injection pipe and a side injection port 223.

The side injection pipe may include a lower injection pipe 221 formed in the lower frame 212, and an upper injection pipe 222 formed in the upper frame 211 and communicating with the lower injection pipe 221.

The lower injection pipe 221 may penetrate the lower frame 212 vertically. One side of the lower injection pipe 221 may be connected to a cleaning liquid supply unit (not shown), and the other side may be in communication with the upper surface of the lower frame 212. One side of the upper injection pipe 222 may be in communication with the lower surface of the upper frame 211. In this case, one side of the upper frame 211 and the other side of the lower frame 212 may be in communication with each other.

The side injection hole 223 communicates with the other side of the upper injection pipe 222 and may be formed to penetrate the side of the upper frame 211. The side nozzle unit 220 may receive the cleaning liquid through the upper spray pipe 222 and spray the cleaning liquid from the side of the upper frame 211 toward the substrate W.

The side injection hole 223 may have a longitudinal direction penetrating the upper frame 211 in a diagonal direction with respect to the ground. In this case, the central axis of the side injection hole 223 may have an inclination of 10 to 45 degrees with respect to the ground. Preferably, the central axis of the side nozzle 223 may have an inclination ranging from 10 degrees to 30 degrees relative to the ground. The central axis of the side nozzle 223 can be adjusted.

Since the side spray hole 223 has a longitudinal channel structure inclined upward with respect to the ground, the cleaning liquid sprayed through the side spray hole 223 may be sprayed in a diagonal direction with respect to the substrate W.

Meanwhile, the side injection hole 223 may have a longitudinal direction formed along the extension portion 2112. The extension portion 2112 has a longitudinal direction extending to the outside of the injection cap, that is, to the outside of the upper frame 211. When the side injection hole 223 is formed along the protruding direction of the extension portion 2112, The longitudinal direction of the side injection hole 223 may increase by the protrusion length of the extension portion 2112. Accordingly, the side spray hole 223 has a length sufficient to serve as a guide necessary for spraying the cleaning liquid, thereby achieving the effect of maintaining the sprayed cleaning liquid to be sprayed along the spray angle.

The gas injection unit 240 may spray dry gas toward the back of the substrate W. The gas injected through the gas injection unit 240 may be, for example, a dry gas such as nitrogen (N ₂ ). The drying gas may perform the function of drying the cleaning liquid applied to the back of the substrate W.

The gas injection unit 240 may include a gas injection pipe 241 and a gas injection tube 242 inserted into the gas injection pipe 241.

The gas injection pipe 241 may penetrate the injection cap 210 vertically. One side of the gas injection pipe 241 may communicate with the gas injection hole 243 formed at the top of the injection cap 210. The gas injection hole 243 may be formed at a location spaced apart from the center injection hole 223. The central axis of the gas nozzle 243 may be inclined to the ground. On the other hand, unlike this, the central axis of the gas injection hole 243 may be perpendicular to the ground. The gas injection pipe 241 may be formed to have a diagonal slope with respect to the ground. On the other hand, unlike this, the gas injection pipe 241 may be formed to have a vertical inclination with respect to the ground.

The gas injection tube 242 may be inserted into the gas injection pipe 241. The gas injection tube 242 is connected to a gas supply unit (not shown) and may serve as a gas flow path for spraying gas to the top of the injection cap 210. The gas injection tube 242 may protrude to the top of the gas injection hole. For example, the top of the gas injection tube 242 may protrude to a higher position than the top surface of the upper frame 211. When a crater 2111 is formed on the top of the injection cap 210, the gas injection tube 242 may protrude up to the top of the crater 2111. According to this structure, it is possible to prevent the gas injection tube 242 and the gas from being contaminated by the cleaning liquid collected in the crater 2111 during the process of spraying gas through the gas injection tube 242.

The control unit may control spraying of the cleaning liquid on the substrate W.

The control unit may control the spraying of the cleaning liquid so that the cleaning liquid sprayed on the back of the substrate W can be dispersed to the edge area of the substrate W without falling. For example, the control unit may control the spraying method of the cleaning solution on the substrate W through a plurality of phases. The plurality of phases may include a first phase, a second phase, and a third phase.

In the first phase, cleaning liquid may be sprayed from the side nozzle unit 220. The cleaning liquid sprayed from the side nozzle unit 220 may be sprayed at a first flow rate. The first flow rate may vary depending on the type and size of the substrate W, the type of cleaning solution, and the cleaning profile.

The second phase may be performed after the first phase. In the second phase, cleaning liquid may be sprayed from the center nozzle unit 230 and the side nozzle unit 220. In this case, the side nozzle unit 220 may spray the cleaning liquid at a first flow rate, and the center nozzle unit 230 may spray the cleaning liquid at a second flow rate that is higher than the first flow rate. The cleaning liquid sprayed from the side nozzle unit 220 may be sprayed at a location spaced apart from the center of the substrate W, and the cleaning liquid sprayed from the center nozzle unit 230 may be sprayed toward the center of the substrate W. In this case, the first flow rate may range from 200 ml/min to 800 ml/min.

In the third phase, while spraying the cleaning liquid from the side nozzle unit 220 and the center nozzle unit 230 is maintained, the flow rate of the cleaning liquid sprayed from the center nozzle (part) may change. The center sprayed in the third phase The cleaning liquid spray flow rate of the nozzle unit 230 may be a third flow rate that is lower than the first flow rate.

In multiple phases, the side nozzle unit 220 and the center nozzle unit 230 may spray the cleaning liquid at the same pressure. For example, the cleaning liquid spray pressure may range from 0.1 mpa to 0.3 mpa.

By the cleaning liquid spraying method according to the plurality of phases described above, the cleaning liquid sprayed from the center nozzle unit 230 and the side nozzle unit 220 are combined in a specific area on the back of the substrate W, where the center nozzle unit 230 In the process of spreading to the edge area of the substrate (W), the new liquid sprayed from the can be distributed evenly.

Meanwhile, the control unit sprays deionized water on the back of the substrate W through the center nozzle portion 230 and then simultaneously sprays the cleaning liquid through the center nozzle portion 230 and the side nozzle portion 220. You can also control it.

Figure 8 is an exploded view of a spray cap according to an embodiment, and Figure 9 is an enlarged view of portion C of Figure 7.

Referring to FIGS. 8 and 9 , the injection cap 210 has a fastening structure in which the lower frame 212 and the upper frame 211 can be separated, so that it can be easily coupled to the substrate chuck 200. At the same time, the spray cap 210 has a fastening structure that seals the connection portion of the lower frame 212 and the upper frame 211, thereby preventing the cleaning liquid flowing through the side nozzle unit 220 from leaking.

The substrate chuck 200 includes a screw groove (H) vertically penetrating the upper frame 211 and the lower frame 212, and the screw groove (H) has a screw groove (H) connected to the upper frame 211 and the lower frame 212. Bolts that are inserted simultaneously can be inserted.

The substrate chuck 200 may include a fastening structure that prevents the cleaning liquid from leaking from the connection portion of the upper injection pipe 222 and the lower injection pipe 221 of the side nozzle unit 220. The spray cap 210 may include a lower fastening part 214 formed on the lower frame 212 and an upper fastening part 213 formed on the upper frame 211 and capable of being fastened to the lower fastening part 214. there is.

The lower fastening portion 214 may be formed at the upper end of the lower frame 212 along the circumference of the lower injection pipe 221. The lower fastening part 214 is formed along the outer circumference of the lower protruding member 2141, where the outer peripheral surface of the lower injection pipe 221 protrudes from the top of the lower frame 212, and the lower protruding member 2141. It may include a fastening member 2142 that protrudes at a higher height than 2141.

The upper fastening portion 213 may be formed at the lower end of the upper frame 211 along the circumference of the upper injection pipe 222. The upper fastening part 213 includes an upper protruding member 2131, where the outer peripheral surface of the upper injection pipe 222 protrudes from the bottom of the upper frame 211 and engages with the lower protruding member 2141, and the upper protruding member 2131. It may include a fastening groove 2132 formed along the outer circumference and recessed into the inside of the upper frame 211.

The upper protruding member 2131 and the lower protruding member 2141 may be formed in a shape that engages each other. In this case, the upper protruding member 2131 has a bottom shape that slopes downward along the outer radius of the lower injection pipe 221, and the lower protruding member 2141 has a bottom shape that slopes upward along the outer radius of the upper injection pipe 222. It can have a top shape.

The fastening member 2142 of the lower fastening part 214 may be inserted into the fastening groove 2132 of the upper fastening part 213.

According to this structure, the upper fastening part 213 and the lower fastening part 214 are fastened in a two-stage fastening structure to seal the gap between the upper injection pipe 222 and the lower injection pipe 221 of the side injection part. function can be achieved. Accordingly, the side injection unit can achieve the effect of flowing fluid without a tube inserted therein.

FIG. 10 is a cross-sectional view of the spray cap taken along line B-B of FIG. 6, and FIGS. 11A and 11B are perspective views of the cover member according to one embodiment.

Referring to FIG. 10, the injection cap 210 may be fastened through a screw (bolt) connecting the upper frame 211 and the lower frame 212. A screw (blot) may be inserted into the injection cap 210 through a screw groove (H) that communicates from the top of the upper frame 211 to the lower frame 212. In this case, a problem may occur where the cleaning liquid dropped on the spray cap 210 flows into the screw groove (H).

The substrate cleaning device 2 according to one embodiment may include a cover member 250 connected to the upper frame 211 to seal the screw groove for connecting the upper frame 211 and the lower frame 212. there is.

Referring to FIGS. 11A and 12B , the cover member 250 may be connected to the upper frame 211 to cover the upper surface of the upper frame 211. The cover member 250 may include a groove communicating with the center injection port and the gas injection port. The side surface of the cover member 250 may include a groove into which the extension portion 2112 of the upper frame 211 is inserted. The cover member 250 may be formed in a shape corresponding to the top shape of the upper frame 211. For example, the cover member 250 may include a crater 2111 having the same shape as the crater 2111 formed on the upper surface of the upper frame 211.

The cover member 250 may include a sealing protrusion 251 protruding from the lower surface to be inserted into the screw groove. The sealing protrusion 251 is formed in a shape corresponding to the screw groove, and can be fitted into the screw groove while the cover member 250 is connected to the upper frame 211.

According to this structure, the cover member 250 prevents the cleaning liquid dropped on the upper frame 211 from flowing into the screw groove, thereby preventing the screw from being damaged or the spray cap 210 from being contaminated.

Figure 12 is a cross-sectional view of a substrate cleaning device according to one embodiment.

Referring to FIG. 12, the substrate cleaning device 3 according to one embodiment includes a substrate chuck (not shown), an injection cap 310, a center nozzle unit 330, a side nozzle unit 320, and a gas injection unit ( 340) may be included.

The side nozzle unit 320 may include a lower center pipe 321 formed on the lower frame 311, and an upper center pipe 322 formed on the upper frame 312 and communicating with the lower center pipe 321. there is.

The upper center pipe 322 may communicate with the center nozzle opening formed on the upper surface of the upper frame 312. The upper center pipe 322 may have a longitudinal direction inclined with respect to the ground. In this case, the cleaning liquid sprayed through the center nozzle opening may be sprayed on the substrate at an angle equal to the inclination of the upper center pipe 322. Additionally, when the center tube is inserted into the upper center tube 322, the center tube has the same angle as the longitudinal direction of the upper center tube and can spray the cleaning liquid toward the substrate.

The gas injection unit 340 may include a gas injection pipe 341 that penetrates the injection cap 310 up and down. The gas injection pipe 341 may communicate with a gas injection hole formed on the upper surface of the upper frame 312. The gas injection pipe 341 may have a longitudinal direction inclined with respect to the ground. When the gas injection tube is inserted into the gas injection pipe 341, the gas injection tube may spray gas in the same direction as the longitudinal direction of the gas injection pipe 341.

Figure 13 is a perspective view of a spray cap according to an embodiment, and Figure 14 is a cross-sectional view of a spray cap according to an embodiment.

Referring to FIGS. 13 and 14 , the substrate cleaning device according to one embodiment may include a spray cap 410, a center spray unit 430, a side spray unit 420, and a gas spray unit 440. .

The spray cap 410 may include an upper frame 411 and a lower frame 412.

The side injection unit 420 may include a side injection pipe 421, a side injection port 423, and a nozzle tip 424.

The side injection pipe 421 may be formed on the injection cap in a vertical direction. The side spray pipe 421 is connected to a cleaning liquid supply unit (not shown) and can receive cleaning liquid.

The side injection port 423 is connected to the side injection pipe 421 and may communicate with the side of the injection cap.

The nozzle tip 424 may be detachably connected to the side nozzle 423. For example, the nozzle tip 424 may be inserted into the side injection hole 423. The nozzle tip 424 may include a spray passage 4241 formed along the longitudinal direction. The slope of the spray flow path 4241 formed at the nozzle tip may vary depending on the type of nozzle tip. According to this structure, the inclination of the spray path 4241 with respect to the ground can be adjusted depending on the type of nozzle tip 424 inserted into the side spray hole. Accordingly, the spray angle of the cleaning liquid sprayed through the spray passage 4241 may vary.

Meanwhile, the connection angle of the nozzle tip 424 to the side nozzle 423 can be adjusted. For example, the insertion angle of the nozzle tip 424 with respect to the side injection hole 423 may be changed. In this case, the spray angle of the cleaning liquid sprayed through the nozzle tip 424 may change depending on the insertion angle of the nozzle tip 424.

FIG. 15 is a flowchart of a substrate cleaning method according to an embodiment, and FIG. 16 is a flowchart of a substrate cleaning method according to an embodiment.

15 and 16, the substrate cleaning method according to an embodiment includes providing a center nozzle and a side nozzle (510), rotating the substrate (520), and spraying a cleaning liquid through the side nozzle. It may include (530) and spraying the cleaning liquid through the side nozzle and the center nozzle (540).

In step 510, a center nozzle and a side nozzle may be provided for spraying the cleaning liquid onto the back of the substrate. The center nozzle sprays the cleaning liquid on the lower surface of the substrate in a direction perpendicular to the ground, and the side nozzle sprays the cleaning liquid on the lower surface of the substrate in a direction inclined to the ground. The center nozzle and side nozzle may be located below the center of the substrate.

In step 520, the substrate may be rotated. The substrate can rotate about an axis perpendicular to its center. Accordingly, the center nozzle and the side nozzle may be located below the rotation axis of the substrate.

In step 530, a cleaning liquid may be sprayed on the substrate through a side nozzle. In this case, the side nozzle can spray the cleaning liquid onto the back of the substrate at a set first flow rate. The first flow rate may be, for example, a flow rate ranging from 200 ml/min to 800 ml/min. Since the substrate is rotating while the cleaning liquid is sprayed through the side nozzle, the cleaning liquid can be evenly distributed from a position spaced a certain distance away from the center of the substrate to the edge area.

In step 540, the cleaning liquid can be simultaneously sprayed on the back of the substrate through the center nozzle and the side nozzle. In other words, after the cleaning liquid is sprayed onto the back of the substrate through the side nozzle, the cleaning liquid may be sprayed onto the central portion of the back of the substrate through the center nozzle. Step 540 includes spraying the cleaning liquid at a first flow rate through the side nozzle (541), spraying the cleaning liquid at a second flow rate through the center nozzle (542), and spraying the cleaning liquid at a third flow rate through the center nozzle. It may include step 543.

In step 541, the cleaning liquid may be continuously sprayed at a first flow rate on the back of the substrate through the side nozzle.

Thereafter, in step 542, while the cleaning liquid is being sprayed through the side nozzle, the cleaning liquid can be sprayed onto the center of the back of the substrate at a second flow rate through the center nozzle. In this case, the second flow rate may have a higher flow rate than the first flow rate.

In step 543, after a predetermined time has elapsed in step 542, the flow rate of the cleaning liquid sprayed through the center nozzle may be changed from the second flow rate to the third flow rate. In this case, the third flow rate may have a lower flow rate than the first flow rate.

In the above-described cleaning liquid spraying process, the side nozzles and the center nozzle may spray the cleaning liquid at the same injection pressure. In this case, the cleaning liquid injection pressure may be in the range of 0.1 mpa to 0.3 mpa.

As described above, although the embodiments have been described with limited drawings, various modifications and variations can be made by those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and/or components of the described structure, device, etc. may be combined or combined in a different form than the described method, or may be used with other components or equivalents. Appropriate results can be achieved even if replaced or substituted by .

W: substrate
100: substrate chuck
110: Cleaning liquid spray unit

Claims (24)

A substrate chuck that supports the substrate to be cleaned;
a spray cap including a lower frame connected to the substrate chuck and an upper frame connected to an upper part of the lower frame; and
A lower injection pipe that penetrates the lower frame vertically, an upper injection pipe formed in the upper frame and one side of which communicates with the lower injection pipe, and a lower injection pipe that communicates with the other side of the upper injection pipe and penetrates a side of the upper frame. Includes a side nozzle portion including a side nozzle,
The spray cap is,
a lower fastening portion formed at the top of the lower frame along the circumference of the lower injection pipe; and
An upper fastening part formed at the bottom of the upper frame along the circumference of the upper injection pipe and engaged with the lower fastening part,
The lower fastening part includes a lower protruding member whose outer peripheral surface of the lower injection pipe protrudes toward the top of the lower frame, and a fastening member formed along the outer circumference of the lower protruding member and protruding at a higher height than the lower protruding member,
The upper fastening part includes an upper protruding member on which the outer peripheral surface of the upper injection pipe protrudes to the lower end of the upper frame and engages with the lower protruding member, and is formed along the outer circumference of the upper protruding member and is recessed into the inside of the upper frame. Includes a fastening groove that is
The upper protruding member has a cross-sectional shape with an upper end sloping downward along the outer radius of the lower injection pipe, and the lower protruding member has a cross-sectional shape with a lower end sloping upward along the outer radius of the upper injection pipe. Device. delete delete delete delete According to paragraph 1,
The spray cap is,
A substrate cleaning device further comprising a cover member connected to the upper frame to seal a screw groove for connecting the upper frame and the lower frame. According to clause 6,
The cover member includes a sealing protrusion protruding from a lower side to be inserted into the screw groove. According to paragraph 1,
The upper frame includes an extension portion whose side surface protrudes outward,
The side spray hole has a longitudinal direction formed along the extension part. According to clause 8,
The injection central axis of the side nozzle is,
A substrate cleaning device having an inclination ranging from 10 degrees to 30 degrees relative to the ground. According to paragraph 1,
The side nozzle part,
A substrate cleaning device further comprising a nozzle tip that is detachably connected to the side spray hole and has a spray flow path formed along a longitudinal direction. According to clause 10,
The connection angle of the nozzle tip to the side nozzle is adjustable. According to paragraph 1,
The upper frame is a substrate cleaning device including a crater whose upper surface is concave inward. According to paragraph 1,
The substrate cleaning device further includes a center nozzle portion that penetrates the spray cap vertically and sprays the cleaning liquid to a region closer to the center of the substrate than the side nozzle portion. According to clause 13,
The center nozzle part,
a lower center pipe penetrating the lower frame in a vertical direction; and
A substrate cleaning device comprising an upper center pipe that communicates with the lower center pipe and penetrates the upper frame in a vertical direction. According to clause 14,
The upper center pipe is formed in an inclined direction with respect to the ground, a substrate cleaning device. According to clause 14,
The center nozzle part,
A substrate cleaning device further comprising a center tube inserted into the upper center tube. According to clause 14,
The center nozzle part,
A substrate cleaning device that selectively performs a spray function for spraying a cleaning liquid on the back of the substrate and a suction function for sucking in the cleaning liquid collected on the upper surface of the upper frame. According to clause 13,
It further includes a gas injection unit for spraying dry gas toward the back of the substrate,
The gas injection unit includes a gas injection pipe that vertically penetrates the injection cap, and a gas injection tube that is inserted into the gas injection pipe and whose upper end protrudes to a higher position than the top surface of the upper frame. According to clause 18,
It further includes a control unit that controls spraying of the cleaning liquid on the substrate,
The control unit controls the spraying of the cleaning liquid so that the cleaning liquid sprayed on the back of the substrate can be dispersed without falling to the edge area of the substrate. According to clause 19,
The control unit,
A first phase in which cleaning liquid is sprayed from the side nozzle portion;
After the first phase, a second phase in which cleaning liquid is sprayed from the center nozzle unit and the side nozzle unit; and
After the second phase, the substrate cleaning device includes a third phase for adjusting the spray flow rate of the cleaning liquid sprayed from the center nozzle. According to clause 20,
The control unit,
The side nozzle unit is controlled to spray the cleaning liquid at a first flow rate, and the center nozzle unit is controlled to spray the cleaning liquid at a second flow rate higher than the first flow rate and then to spray the cleaning liquid at a third flow rate lower than the first flow rate. Controlling a substrate cleaning device. According to clause 21,
The first flow rate is in the range of 200 ml/min to 800 ml/min. According to clause 21,
In the second phase, the side nozzle unit and the center nozzle unit spray the cleaning liquid at the same pressure,
The cleaning liquid injection pressure is in the range of 0.1 mpa to 0.3 mpa. According to clause 19,
The control unit,
A substrate cleaning device that controls the center nozzle unit and the side nozzle unit to spray cleaning liquid on the back surface of the substrate after spraying pure water (DIW) on the center portion of the back surface of the substrate.

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