KR102672853B1 - Cleaning apparatus for substrate - Google Patents

Abstract

A substrate cleaning device capable of cleaning the inner wall of a chamber is disclosed. The substrate cleaning device includes a chamber that provides a space where a substrate cleaning process is performed, a spin chuck provided inside the chamber, on which the substrate is seated and rotatable, and a spin chuck provided inside the chamber around the spin chuck, , a cleaning part that provides a cleaning solution to the substrate, and a wall cleaning nozzle provided in a portion of the cleaning part facing the inner wall of the chamber to provide a cleaning solution to the inner wall.

Description

Substrate cleaning device {CLEANING APPARATUS FOR SUBSTRATE}

It relates to a substrate cleaning device for cleaning semiconductor substrates.

In general, in the semiconductor manufacturing process, deposition of insulating films and metal materials, etching, coating of photoresist, development, and removal of impurities such as asher or particles are repeated several times. This creates an array of fine patterning, and as this process progresses, impurities that are not completely removed through the etching or impurity removal process remain within the semiconductor substrate. As the miniaturization of semiconductor devices progresses, the importance of removing impurities such as fine particles, metal impurities, organic contaminants, and natural oxide films is also increasing in terms of yield and reliability. Since these impurities are important factors that determine the performance and yield of semiconductor devices, they must undergo a cleaning process before proceeding with each process to manufacture semiconductor devices.

As such, the substrate cleaning process for manufacturing a semiconductor device is performed to remove various objects such as fine particles remaining on the surface of the substrate, metal impurities, organic contaminants, and surface films such as natural oxide films. Typically, the cleaning process accounts for about 1/4 to 1/3 of the total process for manufacturing a semiconductor device, which means that not only the number of cleanings but also various cleaning processes suitable for each process are required.

In general, wet cleaning devices for semiconductor substrates are of the batch type, which processes multiple substrates by immersing them in a cleaning bath filled with a chemical solution, and the batch type, which processes a single substrate by placing it horizontally and rotating it. It is classified into a single type.

A single-wafer cleaning device sprays a cleaner on the surface of a substrate rotating at high speed, cleans the substrate surface using centrifugal force, and dries the substrate using a drying liquid such as liquid isopropyl alcohol (IPA) on the substrate surface. do. In addition, the cleaning process in the single wafer type cleaning device is the RCA process, that is, SC1 (Standard Cleaning 1, a mixed cleaner of NH4OH:H2O2:H2O), SC2 (Standard Cleaning 2, a mixed cleaner of HPM-HCl:H2O2:H2O) ), Piranha (SPM, Sulfuric Peroxide Mixture), and DHF (Dilute HF) chemicals are used to remove the thin film from the substrate surface, remove particles, rinse with ultrapure water (DI), and then go through a drying process. The drying process is generally a spin method in which the substrate is dried by rotating it at high RPM (e.g., 1500 to 2500 RPM), and at the same time, an inert gas (e.g., N2 gas) is supplied to the surface of the substrate to dry it. There is. Recently, the Rotagoni Dry method, which involves drying by spraying IPA/N2 gas at the same time as the spin method, has been in the spotlight. The Rotagoni method provides IPA in a liquid or gaseous state while spraying N2 gas to remove moisture from the substrate using the Marangoni Effect (an effect that dries by lowering the surface tension of moisture remaining on the substrate). do.

Meanwhile, in existing single wafer cleaning devices, contaminants may adhere to the inner wall of the chamber during the cleaning process, and an additional cleaning process must be performed to remove them.

The content described as the above-mentioned background technology is what the inventor possessed or acquired in the process of deriving the present invention, and it cannot necessarily be said to be recognized as known technology disclosed to the general public before the application for the present invention.

The purpose of the embodiment is to provide a substrate cleaning device capable of removing contamination from the inner wall surface of the chamber.

In addition, the present invention provides a substrate cleaning device that can clean the inner wall of a chamber using an existing cleaning unit.

The problems to be solved in the embodiments are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

According to embodiments of the present invention for achieving the above-described object of the present invention, a substrate cleaning device includes a chamber that provides a space where a substrate cleaning process is performed, and is provided inside the chamber, and the substrate is seated and rotated. A spin chuck that can be provided, a cleaning part that is provided around the spin chuck inside the chamber and provides cleaning liquid to the substrate, and a part of the cleaning part that faces the inner wall of the chamber and that provides cleaning liquid to the inner wall. It is configured to include a wall cleaning nozzle that provides.

As seen above, according to this embodiment, the inner wall surface of the chamber can be cleaned and the internal environment of the substrate cleaning device can be kept constant. In addition, the structure is simple because it can be applied without changing the structure of the existing cleaning unit.

The effects of the substrate cleaning device according to one embodiment are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description below.

1 is a plan view of a substrate cleaning device according to an embodiment.
Figure 2 is a perspective view of a cleaning unit in the substrate cleaning device of Figure 1.
FIG. 3 is a plan view for explaining the operation of the substrate cleaning device of FIG. 1.
FIG. 4 is a front view of the substrate cleaning device of FIG. 1.

Hereinafter, embodiments will be described in detail through illustrative drawings. When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing an embodiment, if a detailed description of a related known configuration or function is judged to impede understanding of the embodiment, the detailed description will be omitted.

Additionally, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the essence, order, or order of the component is not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component can be connected or connected directly to that other component, but there is no need for another component between each component. It should be understood that may be “connected,” “combined,” or “connected.”

Components included in one embodiment and components including common functions will be described using the same names in other embodiments. Unless stated to the contrary, the description given in one embodiment may be applied to other embodiments, and detailed description will be omitted to the extent of overlap.

Hereinafter, with reference to FIGS. 1 to 4 , the substrate cleaning device 10 according to embodiments will be described in detail. For reference, FIG. 1 is a perspective view of a substrate cleaning device 10 according to an embodiment, and FIG. 2 is a perspective view of a cleaning unit in the substrate cleaning device 10 of FIG. 1 . FIG. 3 is a top view for explaining the operation of the substrate cleaning device 10 of FIG. 1, and FIG. 4 is a front view of the substrate cleaning device 10.

Referring to the drawing, the substrate cleaning device 10 supports a sheet of substrate 1 horizontally, rotates it at a predetermined speed, and cleans the substrate 1 by providing a cleaning liquid for cleaning on the rotating substrate 1. and a drying type single spin type cleaning device. The cleaning liquid contains substances such as liquid or gas for cleaning the substrate 1. Depending on the type of substance to be removed, multiple chemical liquids may be used. In addition to the chemical liquid, it also includes IPA and N2 gas provided for drying. do.

The substrate cleaning device 10 includes a spin chuck 13 that supports and rotates the substrate 1, a chamber 11 that accommodates the spin chuck 13 and provides a space where the cleaning process of the substrate 1 is performed, and It may include a cleaning unit 14 that provides cleaning liquid to the substrate 1.

As an example, the substrate 1 may be a silicon wafer that becomes a semiconductor substrate. However, the present invention is not limited to this, and the substrate 1 is glass for a flat panel display (FPD) device such as a liquid crystal display (LCD) or a plasma display panel (PDP). It may be a substrate. In addition, the shape and size of the substrate 1 are not limited by the drawings, and may have substantially various shapes and sizes, such as a circular or square plate. And, depending on the shape and size of the substrate 1, the size and shape of the spin chuck 13 may also be changed.

The chamber 11 provides a space in which the spin chuck 13 is accommodated, and provides an environment for a cleaning process of the substrate 1. Additionally, a fan filter unit (FFU) (not shown), etc. may be provided at the upper part of the chamber 11 to create an environment inside the chamber 11. In addition, the bottom surface 112 of the chamber 11 is provided with an outlet 115 and a discharge part 15 for discharging the cleaning liquid from inside the chamber 11.

The spin chuck 13 rotates the substrate 1 by seating it on the upper surface and rotating it at a predetermined speed. Additionally, the spin chuck 13 is provided to be able to move up and down to a predetermined height within the chamber 11.

The spin chuck 13 is provided with a plurality of chuck pins 131 on which the substrate 1 is seated and fixed. The chuck pin 131 is provided on the upper surface of the spin chuck 13 and is arranged along the circumference of the spin chuck 13 to support the edge of the substrate 1. A plurality of chuck pins 131 (for example, three, four, etc.) may be provided and arranged at equal intervals.

A recovery cup 12 may be provided around the spin chuck 13 to collect the cleaning liquid flying from the substrate 1 that is supported and rotated by the spin chuck 13. The recovery cup 12 has a shape surrounding the spin chuck 13.

The cleaning unit 14 is provided on the outside of the spin chuck 13 inside the chamber 11 and is provided above the spin chuck 13 to provide cleaning liquid to the surface of the substrate 1. The cleaning unit 14 includes a plurality of nozzles. Additionally, a plurality of cleaning units 14 may be provided along the circumference of the spin chuck 13. For example, in this embodiment, four cleaning parts 14 are provided around the spin chuck 13, and the four cleaning parts 14 use different cleaning solutions (e.g. , chemical solution, DIW, IPA, etc.) and can be installed independently or to be driven. However, this is only an example, and a detailed description of the configuration and operation of each cleaning unit 14 will be omitted.

Below, one cleaning unit 14 will be described with reference to FIG. 2 .

The cleaning unit 14 includes a nozzle arm 142 having a cantilever shape, a substrate cleaning nozzle 141 provided at one end of the nozzle arm to provide cleaning liquid on the substrate 1, and the other side of the nozzle arm 142. It is comprised of a head part 143 and a drive part 144 that fix the end and rotate and lift the nozzle arm 142.

The substrate cleaning nozzle 141 is formed to provide cleaning liquid onto the substrate 1. Additionally, the substrate cleaning nozzle 141 may be formed to provide one cleaning liquid, or may be formed to provide a plurality of cleaning liquids.

The nozzle arm 142 has a rod shape extending from the head portion 143 to the substrate 1.

The head part 143 and the driving part 144 are provided on the outside of the spin chuck 13 and swing or rotate the substrate cleaning nozzle 141 with respect to the substrate 1. Additionally, the driving unit 144 moves the substrate cleaning nozzle 141 up and down with respect to the substrate 1.

In the drawing, the head part 143 and the driving part 144 are shown separately, but this is only an example, and the position of the driving part 144 can be substantially changed in various ways. Additionally, the shapes of the head unit 143 and the driving unit 144 are not limited by the drawings.

A wall cleaning nozzle 145 is provided at a portion of the head portion 143 facing the inner wall surface 111 of the chamber 11. The wall cleaning nozzle 145 is formed to spray the cleaning liquid at a predetermined angle toward the inner wall surface 111. Additionally, the wall cleaning nozzle 145 may have one injection port or may be formed with a plurality of injection ports.

After the cleaning process of the substrate 1 is completed, the head part 143 rotates and moves up and down inside the chamber 11, and the wall cleaning nozzle 145 provides cleaning liquid to the inner wall surface 111 to clean the inner wall surface 111. Clean. Additionally, after providing the cleaning liquid to the inner wall surface 111, it is also possible to dry the inner wall surface 111 by providing a predetermined drying gas from the wall cleaning nozzle 145.

The cleaning liquid provided from the wall cleaning nozzle 145 flows down the inner wall surface 111 to the floor surface 112 by gravity to clean the inner wall surface 111. And the cleaning liquid that flows down the inner wall surface 111 is discharged to the outside from the discharge portion 15 through the discharge port 115 formed on the bottom surface 112 of the chamber 11.

Here, an inclined surface 113 may be formed at a corner where the inner wall surface 111 and the bottom surface 112 of the chamber 11 are connected. By forming the inclined surface 113, the cleaning liquid flowing along the inner wall surface 111 can be prevented from stagnating at the corners of the inner wall surface 111 and the bottom surface 112, and can be smoothly guided to the bottom surface 112. there is. For example, the shape of the inclined surface 113 is not limited by the drawings, and may be substantially changed in various ways as long as it slopes downward at a predetermined angle from the inner wall surface 111 toward the floor surface 112.

According to the present embodiments, the wall cleaning nozzle 145 can be added to the cleaning unit 14 without changing the structure of the existing substrate cleaning device 10, so the substrate cleaning device 10 and the cleaning unit 14 )'s structure does not become complicated. In addition, since the wall cleaning nozzle 145 is provided in the existing cleaning unit 14, it is easy to apply to the substrate cleaning device 10. In addition, the wall cleaning nozzle 145 provides cleaning liquid to the inner wall surface 111 of the chamber 11 to clean it, and also provides drying gas to enable drying, so that the inner wall surface 111 can be managed more effectively. . Additionally, the environment inside the chamber 11 can be continuously managed by removing contamination from the inner wall surface 111.

As described above, although the embodiments have been described with limited drawings, various modifications and variations can be made by those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and/or components of the described structure, device, etc. may be combined or combined in a different form than the described method, or may be used with other components or equivalents. Appropriate results can be achieved even if replaced or substituted by .

Therefore, the spirit of the present invention should not be limited to the described embodiments, and the scope of the patent claims described below as well as all things that are equivalent or equivalent to the scope of this patent claim shall fall within the scope of the spirit of the present invention. .

1: substrate
10: Substrate cleaning device
11: Chamber
111: Inner wall surface
112: bottom surface
113: slope
115: outlet
12: Recovery cup
13: Spin chuck
131: Chuck pin
14: Tax department
141: Substrate cleaning nozzle
142: nozzle arm
143: Head part
144: driving unit
145: Wall cleaning nozzle
15: discharge part

Claims (7)

A chamber providing a space where a substrate cleaning process is performed;
a spin chuck provided inside the chamber, on which the substrate is seated and rotatable;
A head part provided around the substrate on the spin chuck, a nozzle arm extending from the head part to the substrate and having a substrate cleaning nozzle at an end of the head part for providing a cleaning liquid to the substrate, and a nozzle arm provided in the head part, a cleaning unit including a driving unit that swings or rotates the substrate cleaning nozzle with respect to the substrate and also moves the substrate cleaning nozzle up and down; and
a wall cleaning nozzle provided at a portion of the head opposite to the inner wall of the chamber to provide cleaning liquid and dry gas to the inner wall;
Including,
The wall cleaning nozzle is a substrate cleaning device that cleans the inner wall while rotating and moving up and down by the driving unit after the cleaning of the substrate in the cleaning unit is completed.
delete According to paragraph 1,
The wall cleaning nozzle is a substrate cleaning device having a nozzle shape capable of spraying a cleaning liquid over a certain area with respect to the inner wall surface.
According to paragraph 1,
The cleaning unit adjusts the spraying area of the wall cleaning nozzle by adjusting the rotation angle of the head unit.
According to paragraph 1,
A plurality of the cleaning units are provided along the circumference of the spin chuck,
The wall cleaning nozzle is a substrate cleaning device in which the wall cleaning nozzle is provided in at least two cleaning parts that face each other in the radial direction of the substrate among the plurality of cleaning parts.
According to clause 5,
A substrate cleaning device in which wall cleaning nozzles provided in the plurality of cleaning units are formed to have different discharge angles.
According to paragraph 1,
An outlet is formed on the bottom of the chamber to discharge the cleaning liquid to the outside,
A substrate cleaning device wherein an inclined surface is formed at a boundary between the inner wall surface and the bottom surface to guide the cleaning liquid provided on the inner wall surface to the outlet.

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