KR102671979B1 - Printed circuit board - Google Patents

Abstract

A printed circuit board according to one aspect of the present invention includes a laminate in which a plurality of insulating layers including a rigid insulating layer are stacked vertically; a flexible insulating layer in which some areas are in vertical contact with at least one of the plurality of insulating layers, and other areas are located outside the laminate; a device mounting area formed on one surface of the flexible insulating layer; and a first reinforcing member formed on the other surface of the flexible insulating layer to correspond to the device mounting area.

Description

Printed circuit board {PRINTED CIRCUIT BOARD}

The present invention relates to printed circuit boards.

As the smartphone market continues to grow, PCB high-performance and thinning technologies are required. Regarding RFPCB, product development is underway for the purpose of thinning, miniaturization, and miniaturization compared to existing product lines.

Public Patent Publication 10-2013-0018027 (Published: 2013.02.20)

According to one aspect of the present invention, a laminate in which a plurality of insulating layers including a rigid insulating layer are stacked vertically; a flexible insulating layer in which some areas are in vertical contact with at least one of the plurality of insulating layers, and other areas are located outside the laminate; a device mounting area formed on one surface of the flexible insulating layer; and a first reinforcing member formed on the other surface of the flexible insulating layer to correspond to the device mounting area.

According to another aspect of the present invention, a printed circuit board including a rigid portion and a flexible portion, comprising: a device mounting area formed on one surface of the flexible portion; and a first reinforcing member formed on the other surface of the flexible portion to correspond to the device mounting area.

1 and 2 are diagrams showing a printed circuit board according to a first embodiment of the present invention.
Figure 3 is a diagram showing a printed circuit board according to a second embodiment of the present invention.
Figure 4 is a diagram showing a printed circuit board according to a third embodiment of the present invention.
Figure 5 is a diagram showing a printed circuit board according to a fourth embodiment of the present invention.
Figure 6 is a diagram showing a printed circuit board according to a fifth embodiment of the present invention.
Figure 7 is a diagram showing a printed circuit board according to a sixth embodiment of the present invention.
Figure 8 is a diagram showing a printed circuit board according to a seventh embodiment of the present invention.

Embodiments of the printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are assigned the same drawing numbers and overlapping descriptions thereof are provided. Decided to omit it.

In addition, terms such as first, second, etc. used below are merely identifiers to distinguish identical or corresponding components, and the same or corresponding components are not limited by terms such as first, second, etc. no.

In addition, coupling does not mean only the case of direct physical contact between each component in the contact relationship between each component, but also means that another component is interposed between each component, and the component is in that other component. It should be used as a concept that encompasses even the cases where each is in contact.

Hereinafter, various embodiments of the printed circuit board will be separately described, but it is not excluded that the description of one embodiment can be applied to other embodiments. Description of one embodiment may also be applied to other embodiments unless there is an incompatible relationship.

1 and 2 are diagrams showing a printed circuit board according to a first embodiment of the present invention.

The printed circuit board according to the first embodiment of the present invention is a rigid substrate that includes a rigid portion (R) and a flexible portion (F), and the rigid portion (R) and the flexible portion (F) are formed integrally. This is different from a substrate in which a rigid substrate and a flexible substrate are manufactured separately and then joined through soldering.

Referring to FIG. 1(a), the printed circuit board according to the first embodiment of the present invention includes a rigid portion (R) and a flexible portion (F), and the flexible portion (F) includes a device mounting area (M1) and A first reinforcing member 300 is formed.

The rigid portion (R) may be composed of a plurality of insulating layers including the rigid insulating layer 110 and the flexible insulating layer 200, and the flexible portion (F) may be composed of the flexible insulating layer 200. Here, the flexible insulating layer 200 is formed across the hard part (R) and the flexible part (F). A circuit may be formed in the plurality of insulating layers and the flexible insulating layer 200. In particular, the circuit formed in the flexible insulating layer 200 may include a straight circuit line connecting the hard part (R) and the flexible part (F).

The rigid insulating layer 110 is made of an insulating material with relatively low flexibility and may include a hard resin layer. The hard resin layer may include epoxy resin and/or imidazole resin.

The rigid insulating layer 110 may include a solder resist layer. The solder resist layer is photosensitive and may be located on the outermost layer of the hard portion (R).

The rigid insulating layer 110 may include a fiber reinforcement such as glass fiber. Specifically, the rigid insulating layer 110 may be prepreg (PPG), which is an epoxy resin containing a fiber reinforcement. Meanwhile, the rigid insulating layer 110 may contain an inorganic filler. The rigid insulating layer 110 may be formed of a low dielectric loss tangent insulating material, and the dielectric dissipation factor (Df) of the rigid insulating layer 110 may be 0.003 or less, but is not limited.

The flexible insulating layer 200 of the flexible portion (F) has relatively greater flexibility than the hard insulating layer 110 and is formed of a flexible insulating material, such as polyimide (PI), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and Teflon ( It may include at least one of Teflon), PFA (perfluoroalkoxy), PPS (Polyphenylene Sulfide), PPE (Polyphenylene Ether), and PPO (Poly Phenylene Oxide).

The rigid portion R may include a flexible layer made of a material softer than the rigid insulating layer 110 described above, and the flexible layer may be made of the same material as the flexible insulating layer 200 described above. However, in this embodiment, the description will be limited to a printed circuit board without a flexible layer, as shown in FIG. 1(a).

A device mounting area (M1) is formed on one side of the flexible portion (F). The device mounting area M1 is an area where the electronic device E1 is mounted and may include a plurality of connection pads. Electronic devices (E1) mounted in the device mounting area (M1) may include active devices, passive devices, integrated circuits, etc., especially DDI (Display Driver IC) and TDDI (Touch Display Driver IC) for driving the display unit. It may include etc. Additionally, the DDI or TDDI may have a rectangular shape, and in this case, the device mounting area M1 may also be divided into a rectangular shape corresponding to the shape of the electronic device E1.

A first reinforcing member 300 may be formed on the other surface of the flexible portion (F). The first reinforcing member 300 is formed corresponding to the device mounting area M1. Here, 'correspondence' can be understood as when the first reinforcing member 300 is projected onto one side of the flexible portion (F), the projected first reinforcing member 300 overlaps the device mounting area (M1). (See Figure 1(b)).

The first reinforcing member 300 may be formed of a material with a lower coefficient of thermal expansion (or CTE) than the flexible insulating layer 200 of the flexible portion (F). The first reinforcing member 300 may be formed of a resin containing glass fiber or an inorganic filler, and the coefficient of thermal expansion of the first reinforcing member 300 may be adjusted by the glass fiber or the inorganic filler. The first reinforcing member 300 may be formed of a material with higher rigidity than the flexible insulating layer 200. The first reinforcing member 300 may be formed of a material that has a greater modulus of elasticity than the flexible insulating layer 200.

In the thermal process (e.g., ACF bonding or reflow) required when the electronic device (E1) is mounted in the device mounting area (M1), thermal deformation may occur in the flexible portion (F), and the first reinforcing member ( According to 300), thermal strain of the soft portion (F) can be reduced.

The first reinforcing member 300 may be formed of the same material as the rigid insulating layer 110 of the rigid portion R, for example, PPG. Alternatively, the first reinforcing member 300 may be formed of a material containing metal, for example, SUS.

A connection terminal 200T may be formed on one end of the flexible portion F. In Figure 1(a), the device mounting area (M1) and the connection terminal (200T) are formed on different sides of the flexible portion (F), but the device mounting area (M1) and the connection terminal (200T) are not limited thereto. ) may be formed on the same side of the soft portion (F). Meanwhile, the connection terminal 200T may be embedded in the flexible insulating layer 200 or may be formed to protrude from the flexible insulating layer 200. The connection terminal 200T may be connected to an external device. For example, the external device may be an external substrate (eg, a main board) or a display unit.

A second reinforcing member 400 may be formed on the other surface of the end of the flexible portion (F). The second reinforcing member 400 may be formed to correspond to the connection terminal 200T, and when the connection terminal 200T is connected to an external device, problems caused by the flexibility of the flexible portion F can be reduced. For example, the second reinforcing member 400 may provide rigidity to the flexible portion (F). The second reinforcing member 400 may have a rectangular shape, as shown in FIG. 1(b), but is not limited. The second reinforcing member 400 may be formed of the same material as the first reinforcing member 300 described above. For example, the second reinforcing member 400 may be formed of prepreg (PPG).

Meanwhile, a second device mounting area (M2) may be formed on one surface of the rigid portion (R). The second device mounting area M2 is an area where the second electronic device E2 is mounted, and may include a plurality of connection pads. The second electronic device E2 mounted in the second device mounting area M2 may be different from the electronic device E1 mounted in the device mounting area M1 described above. The second electronic device (E2) may include a Power Management IC (PMIC). In addition, a third device mounting area (M3) including a plurality of connection pads is formed on one surface of the rigid portion (R), and a third electronic device (E2) including a passive device such as a capacitor is formed. It can be mounted in the device mounting area (M3) of 3.

Referring to FIG. 2, the printed circuit board may be coupled to the display unit 10.

An electronic device (E1) including DDI or TDDI is mounted in the device mounting area (M1) of the flexible portion (F) of the printed circuit board. A second electronic device (E2) including a PMIC is mounted in the second device mounting area (M2) of the rigid portion (R) of the printed circuit board, and a second electronic device (E2) including a capacitor is mounted in the third device mounting region (M3). The electronic device (E2) of 3 can be mounted. The electronic device E1 may be bonded to the connection pad of the device mounting area M1 using a bonding member A such as solder or ACF. Likewise, the second electronic device (E2) can be bonded to the connection pad of the second device mounting area (M2) using a bonding member (solder or ACF) (A), and the third electronic device (E2) can be bonded to the connection pad of the second device mounting area (M2) using a bonding member (solder or ACF) (A). It can be connected to the connection pad of the third device mounting area (M3) with (solder or ACF) (A). Here, joining by the joining member (solder or ACF) (A) may involve a thermal process, and when the thermal process proceeds, the first reinforcing member 300 reduces thermal deformation of the device mounting area (M1). You can.

Meanwhile, the connection terminal 200T is joined to the terminal 10T of the display unit 10 with a joining member (solder or ACF) (A). When the heat process proceeds, the second reinforcing member 400 is connected to the connection terminal ( 200T) can reduce thermal strain in the area.

The display unit 10 may include a display panel 11, and the display panel 11 may be an LED panel, an OLED panel, an electrophoretic display panel, an electrochromic display (ECD), etc. there is. Additionally, the display unit 10 may include a touch screen panel 12.

The flexible insulating layer 200 of the flexible portion (F) extends toward the display unit 10 and may be coupled to the terminal 10T of the display unit 10. In this case, the connection terminal 200T of the flexible portion F may be joined to the terminal 10T of the display portion 10 using a bonding member A. The joining member (A) may include a conductive member (eg, solder) or an adhesive film (eg, ACF) containing a low melting point metal. The terminal 10T of the display unit 10 is formed on the display panel 11, so that the connection terminal 200T of the flexible insulating layer 200 can be coupled to the display panel 11 of the display unit 10.

Meanwhile, when the printed circuit board and the display unit 10 are coupled, at least a portion of the flexible unit F is bent. As shown in FIG. 2, the end of the flexible portion (F) may be bonded to one side of the display panel 11, and the hard portion (R) may be located on the other side of the display panel. At this time, the middle area of the soft portion (F) may be bent into a U shape. Here, the device mounting area M1 may be located on the other side of the display panel, and the device mounting area M1 may be located in a portion of the flexible portion F that is relatively less curved. Additionally, the area of the connection terminal 200T may also be located in a region of the flexible portion F that is relatively less curved. Likewise, the first reinforcing member 300 and the second reinforcing member 400 may be located in a portion of the flexible portion F that is relatively less curved.

Figure 3 is a diagram showing a printed circuit board according to a second embodiment of the present invention.

Referring to FIG. 3(a), in the printed circuit board according to the second embodiment of the present invention, the first reinforcing member 300 extends inside the rigid portion (R). This first reinforcing member 300 may be prepared by extending the rigid insulating layer 110 forming the rigid portion (R) to the outside of the rigid portion (R). For example, the rigid insulating layer 110 that provides the first reinforcing member 300 may be prepreg (PPG).

Referring to FIG. 3(b), a printed circuit board can be coupled to the display unit 10, and the description thereof is the same as that described with reference to FIG. 2.

Figure 4 is a diagram showing a printed circuit board according to a third embodiment of the present invention.

Referring to FIG. 4(a), the printed circuit board according to the third embodiment of the present invention may further include an additional layer 500.

The additional layer 500 is formed on one surface of the flexible portion (F) and may be formed adjacent to the device mounting area (M1). In FIG. 4(b), the additional layer 500 is formed in a rectangular shape adjacent to the device mounting area M1. However, the additional layer 500 may be formed to completely surround the device mounting area M1.

The additional layer 500 is relatively harder than the flexible insulating layer 200 and may be formed of the same material as the hard insulating layer 110. Meanwhile, the additional layer 500 may be located on the same plane as the second reinforcing member 400, and in particular, the top surface of the additional layer 500 is located on the same plane as the top surface of the second reinforcing member 400. can do. The additional layer 500 may be formed of the same material as the second reinforcing member 400. For example, the first reinforcing member 300, the second reinforcing member 400, and the additional layer 500 may all be formed of prepreg (PPG).

Referring to FIG. 4(c), the printed circuit board may be coupled to the display unit 10, and the additional layer 500 may be located in a portion of the flexible portion F that is relatively less curved.

Figure 5 is a diagram showing a printed circuit board according to a fourth embodiment of the present invention.

Referring to FIG. 5, the printed circuit board according to the fourth embodiment of the present invention may include one rigid portion (R) and a plurality of flexible portions (F1 and F2). The first flexible portion (F1) is the same as the flexible portion (F) described above. The second flexible portion F2 may extend in a different direction from the first flexible portion F1 (see FIG. 5(a)). As shown in FIG. 5(b), the second flexible portion F2 ) is bent so that the connection terminal 200T' formed at the end of the second flexible part F2 can be connected to the display unit 10 and another external device. Meanwhile, the first flexible portion (F1) and the second flexible portion (F2) may be formed integrally.

Figure 6 is a diagram showing a printed circuit board according to a fifth embodiment of the present invention.

Referring to FIG. 6, the printed circuit board according to the fifth embodiment includes a rigid portion (R) and a flexible portion (F), and is a rigid substrate in which the rigid portion (R) and the flexible portion (F) are formed integrally. . This is different from a substrate in which a rigid substrate and a flexible substrate are manufactured separately and then joined through soldering. A circuit may be formed in the plurality of insulating layers and the flexible insulating layer 200. In particular, the circuit formed in the flexible insulating layer 200 may include a straight circuit line connecting the hard part (R) and the flexible part (F).

The printed circuit board according to the fifth embodiment may include a laminate 100 and a flexible insulating layer 200.

The laminate 100 is included in the rigid portion (R) and may be formed by stacking a plurality of insulating layers including a rigid insulating layer 110 vertically. That is, the laminate 100 includes a plurality of insulating layers stacked up and down, and at least one of the plurality of insulating layers may be the rigid insulating layer 110. For example, all of the plurality of insulating layers may be rigid insulating layers 110 . Alternatively, some of the plurality of insulating layers may be the rigid insulating layer 110, and the rest may be layers that have higher flexibility and are more flexible than the rigid insulating layer 110. Among the laminate 100, a layer that has higher flexibility and is more flexible than the rigid insulating layer 110 may be referred to as the 'flexible layer 120'.

The rigid insulating layer 110 is made of an insulating material with relatively low flexibility and may include a hard resin layer 111. The hard resin layer 111 may include epoxy resin and/or imidazole resin.

The rigid insulating layer 110 may include a solder resist layer 112. The solder resist layer 112 is photosensitive and may be located on the outermost layer of the laminate 100.

The rigid insulating layer 110 may include a fiber reinforcement such as glass fiber. Specifically, the rigid insulating layer 110 may be prepreg (PPG), which is an epoxy resin containing a fiber reinforcement. Meanwhile, the rigid insulating layer 110 may contain an inorganic filler. The rigid insulating layer 110 may be formed of a low dielectric loss tangent insulating material, and the dielectric dissipation factor (Df) of the rigid insulating layer 110 may be 0.003 or less, but is not limited.

The flexible insulating layer 200 is included in the hard part (R) and the flexible part (F), and is made of an insulating material that is relatively more flexible and flexible than the hard insulating layer 110. Some areas of the flexible insulating layer 200 may be in vertical contact with at least one layer among the plurality of insulating layers, and the remaining areas may be located outside the laminate 100 . The partial area of the flexible insulating layer 200 constitutes the hard part (R) of the printed circuit board, and the remaining area of the flexible insulating layer 200 located outside the laminate 100 is the flexible part (R) of the printed circuit board. Configure F).

The flexible insulating layer 200 is located inside the laminate 100 so that the partial area of the flexible insulating layer 200 can be in vertical contact with two of the plurality of insulating layers of the laminate 100.

Referring to FIG. 6(a), when viewed in the vertical direction, the laminate 100 has a solder resist layer 112/hard resin layer 111/flexible layer 120/flexible insulating layer 200/hard water. It is composed of a ground layer 111 and a solder resist layer 112, and this laminate 100 becomes the hard part (R). Here, the flexible insulating layer 200 is located inside the laminate 100 and may be in contact with the flexible layer 120 and the hard insulating layer 110 (hard resin layer 111), respectively.

A flexible coverlay 230 may be laminated on the outer surface of the flexible insulating layer 200. The coverlay 230 may protect the circuit C2 formed on the flexible insulating layer 200. Referring to FIG. 6(b), the flexible portion (F) is composed of a coverlay 230/flexible insulating layer 200/coverlay 230.

The flexible insulating layer 200 is made of polyimide (PI), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), Teflon, perfluoroalkoxy (PFA), polyphenylene sulfide (PPS), polyphenylene ether (PPE), and polyphenylene (PPO). Oxide) may be included. The dielectric dissipation factor (Df) of the flexible insulating layer 200 may be 0.003 or less, but is not limited.

The flexible insulating layer 200 may include a thermoplastic resin layer 210 and a thermosetting resin layer 220. The thermoplastic resin layer 210 and the thermosetting resin layer 220 may be stacked vertically to form the flexible insulating layer 200. The thermosetting resin layer 220 has adhesive properties and can serve as an adhesive layer. Liquid crystal polymer (LCP), etc. may be used as the thermoplastic resin layer 210, and polyphenylene ether (PPE) may be used as the thermosetting resin layer 220, but are not limited thereto. Meanwhile, the thickness of the thermoplastic resin layer 210 may be greater than the thickness of the thermosetting resin layer 220, but is not limited thereto.

Referring to FIG. 6(a), the flexible insulating layer 200 is composed of a thermoplastic resin layer 210/thermosetting resin layer 220 in the vertical direction.

When the laminate 100 includes the flexible layer 120 described above, the flexible layer 120 may be made of the same material as the flexible insulating layer 200 described above. Referring to FIG. 6(a), the flexible layer 120 is composed of a thermoplastic resin layer 121/thermosetting resin layer 122 in the vertical direction and has the same structure as the flexible insulating layer 200.

A circuit may be formed in each of the plurality of insulating layers and the flexible insulating layer 200 of the laminate 100. The circuit may include metals such as copper, nickel, aluminum, silver, palladium, and gold. Here, the circuit formed on one side of each of the plurality of insulating layers of the laminate 100 is referred to as the first circuit (C1), and the circuit formed on one or both sides of the flexible insulating layer 200 is referred to as the second circuit (C2). It can be distinguished as follows. However, this distinction is for convenience of explanation.

The first circuits C1 of different layers may be electrically connected to the first via V1. When the flexible layer 120 includes the thermoplastic resin layer 121 and the thermosetting resin layer 122, the first via (V1) penetrates the flexible layer 120 all together, and the thermoplastic resin layer 121 and the thermosetting resin layer 122. The first circuit C1 may not be formed at the boundary of the ground layer 122.

The second circuit C2 formed in the flexible insulating layer 200 may include a straight circuit line connecting the hard part (R) and the flexible part (F). Meanwhile, the second circuits C2 of different layers may be electrically connected to the second via V2. Additionally, within the laminate 100, the first circuit (C1) and the second circuit (C2) may be electrically connected to the third via (V3). When the flexible insulating layer 200 includes the thermoplastic resin layer 210 and the thermosetting resin layer 220, the second via (V2) and the third via (V3) penetrate the flexible insulating layer 200 all together, The second circuit C2 may not be formed at the interface between the thermoplastic resin layer 210 and the thermosetting resin layer 220.

A device mounting area (M1) is formed on one surface of the flexible insulating layer 200. The device mounting area M1 is an area where the electronic device E1 is mounted and may include a plurality of connection pads. The plurality of connection pads described above may be part of the second circuit C2. Electronic devices (E1) mounted in the device mounting area (M1) may include active devices, passive devices, integrated circuits, etc., especially DDI (Display Driver IC) and TDDI (Touch Display Driver IC) for driving the display unit. It may include etc. Additionally, the DDI or TDDI may have a rectangular shape, and in this case, the device mounting area M1 may also be divided into a rectangular shape corresponding to the shape of the electronic device E1.

A first reinforcing member 300 may be formed on the other surface of the flexible insulating layer 200. The first reinforcing member 300 is formed corresponding to the device mounting area M1. Here, 'correspondence' can be understood as when the first reinforcing member 300 is projected onto one side of the flexible insulating layer 200, the projected first reinforcing member 300 overlaps the device mounting area M1. there is

The first reinforcing member 300 may be formed of a material with a lower coefficient of thermal expansion (or CTE) than the flexible insulating layer 200. The first reinforcing member 300 may be formed of a resin containing glass fiber or an inorganic filler, and the coefficient of thermal expansion of the first reinforcing member 300 may be adjusted by the glass fiber or the inorganic filler. The first reinforcing member 300 may be formed of a material with higher rigidity than the flexible insulating layer 200. The first reinforcing member 300 may be formed of a material that has a greater modulus of elasticity than the flexible insulating layer 200.

In the thermal process (e.g., ACF bonding or reflow) required when the electronic device (E1) is mounted in the device mounting area (M1), thermal deformation may occur in the flexible insulating layer 200, and the first reinforcing member According to (300), thermal strain of the flexible insulating layer 200 can be reduced.

The first reinforcing member 300 may be formed of the same material as the rigid insulating layer 110 of the laminate 100, and may be formed of prepreg (PPG), for example. Meanwhile, the first reinforcing member 300 may be formed of a material containing metal, for example, SUS. The first reinforcing member 300 is spaced apart from the laminate 100 and may be formed like an island within the flexible portion (F). This first reinforcing member 300 may be formed by being manufactured separately and then attached.

A connection terminal 200T may be formed on one end of the flexible insulating layer 200. In Figure 6(a), the device mounting area (M1) and the connection terminal (200T) are formed on different sides of the flexible insulating layer 200, but the device mounting area (M1) and the connection terminal (200T) are not limited thereto. 200T) may be formed on the same side of the flexible insulating layer 200. Meanwhile, the connection terminal 200T may be embedded in the flexible insulating layer 200 or may be formed to protrude from the flexible insulating layer 200. The connection terminal 200T may be connected to an external device. For example, the external device may be an external substrate (eg, a main board) or a display unit.

A second reinforcing member 400 may be formed on the other surface of the end of the flexible insulating layer 200. The second reinforcing member 400 may be formed to correspond to the connection terminal 200T, and when the connection terminal 200T is connected to an external device, problems caused by the flexibility of the flexible insulating layer 200 can be reduced. . For example, the second reinforcing member 400 may provide rigidity to the flexible insulating layer 200. The second reinforcing member 400 may be formed of the same material as the first reinforcing member 300 described above. For example, the second reinforcing member 400 may be formed of prepreg (PPG). This second reinforcing member 400 may be formed by being manufactured separately and then attached.

Meanwhile, a second device mounting area M2 may be formed on one surface of the laminate 100. The second device mounting area M2 is an area where the second electronic device E2 is mounted, and may include a plurality of connection pads. The connection pads of the second device mounting area M2 may be part of the first circuit C1. The second electronic device E2 mounted in the second device mounting area M2 may be different from the electronic device E1 mounted in the device mounting area M1 described above. The second electronic device (E2) may include a Power Management IC (PMIC). In addition, a third device mounting area (M3) including a plurality of connection pads is formed on one surface of the laminate 100, and the connection pads of the third device mounting area (M3) are connected to the first circuit (C1). It may be part of it. A third electronic device E2 including a passive device such as a capacitor may be mounted in the third device mounting area M3.

Referring to FIG. 6(b), the printed circuit board may be coupled to the display unit 10.

An electronic device (E1) including DDI or TDDI is mounted in the device mounting area (M1) of the flexible insulating layer 200 of the printed circuit board. A second electronic device (E2) including a PMIC is mounted in the second device mounting area (M2) of the printed circuit board laminate 100, and a capacitor is installed in the third device mounting region (M3). A third electronic element (E2) may be mounted. The electronic device E1 may be bonded to the connection pad of the device mounting area M1 using a bonding member A such as solder or ACF. Likewise, the second electronic device (E2) can be bonded to the connection pad of the second device mounting area (M2) using a bonding member (solder or ACF) (A), and the third electronic device (E2) can be bonded to the connection pad of the second device mounting area (M2) using a bonding member (solder or ACF) (A). It can be connected to the connection pad of the third device mounting area (M3) with (solder or ACF) (A). Here, joining by the joining member (solder or ACF) (A) may involve a thermal process, and when the thermal process proceeds, the first reinforcing member 300 reduces thermal deformation of the device mounting area (M1). You can.

Meanwhile, the connection terminal 200T is joined to the display unit 10 with a joining member (solder or ACF) (A). When the thermal process proceeds, the second reinforcing member 400 heats the area of the connection terminal 200T. Deformation can be reduced.

The display unit 10 may include a display panel 11, and the display panel 11 may be an LED panel, an OLED panel, an electrophoretic display panel, an electrochromic display (ECD), etc. there is. Additionally, the display unit 10 may include a touch screen panel 12.

Meanwhile, when the printed circuit board and the display unit 10 are combined, at least a portion of the flexible insulating layer 200 is bent. As shown in FIG. 6(b), the end of the flexible insulating layer 200 is bonded to one surface of the display panel 11, and the middle area of the flexible insulating layer 200 is bent into a U shape, forming a laminate. (100) may be located on the other side of the display panel. As a result, similar to FIG. 2, the device mounting area (M1) can be located on the other side of the display panel, and the device mounting area (M1) can be located in a portion of the flexible insulating layer 200 that is relatively less curved. there is. Additionally, the connection terminal 200T area may also be located in a relatively less curved area of the flexible insulating layer 200. Likewise, the first reinforcing member 300 and the second reinforcing member 400 may be located in a portion of the flexible insulating layer 200 that is relatively less curved.

Figure 7 is a diagram showing a printed circuit board according to a sixth embodiment of the present invention.

Referring to FIG. 7, in the printed circuit board according to the sixth embodiment of the present invention, the first reinforcing member 300 extends into the rigid portion (R). This first reinforcing member 300 may be prepared by extending at least one rigid insulating layer 110 forming the rigid portion (R) to the outside of the rigid portion (R). Accordingly, the first reinforcing member 300 and the rigid insulating layer 110 may be continuously formed of the same material. In this case, at least one rigid insulating layer 110 (hard insulating layer 110 providing the first reinforcing member 300) is laminated on both the hard part (R) and the flexible part (F), and then the hard insulating layer When (110) is punched out (removed) corresponding to the flexible portion (F), it is not punched out corresponding to the area where the first reinforcing member 300 will be located, so that the first reinforcing member 300 can be provided. . The first reinforcing member 300 and the rigid insulating layer 110 may be composed of a rigid resin layer 111 (eg, prepreg (PPG)) and a solder resist layer 112.

Meanwhile, the first reinforcing member 300 and the second reinforcing member 400 may be formed in different layer configurations. For example, the first reinforcing member 300 includes a hard resin layer 111 (prepreg ( PPG)) + solder resist layer 112, while the second reinforcing member 400 may be made of prepreg (PPG).

Figure 8 is a diagram showing a printed circuit board according to a seventh embodiment of the present invention.

Referring to FIG. 8, the printed circuit board according to the seventh embodiment of the present invention may further include an additional layer 500.

The additional layer 500 is formed on one surface of the flexible insulating layer 200 and may be formed adjacent to the device mounting area (M1). The additional layer 500 may be formed in a rectangular shape adjacent to the device mounting area M1, but is not limited thereto, and may be formed to completely surround the device mounting area M1.

The additional layer 500 is relatively harder than the flexible insulating layer 200 and may be formed of the same material as the rigid insulating layer 110 of the laminate 100. The additional layer 500 may be composed of a hard resin layer 111 (prepreg (PPG)) + a solder resist layer 112, and in this case, it is the same as the hard insulating layer 110 of the laminate 100. It can be located on a plane.

In addition, the additional layer 500 may be located on the same plane as the second reinforcing member 400, and the rigid insulating layer 110, the additional layer 500, and the second reinforcing member 400 are all made of the same material. formed and may have the same layer composition. For example, the hard insulating layer 110, the additional layer 500, and the second reinforcing member 400 may all be composed of a hard resin layer 111 (prepreg (PPG)) + a solder resist layer 112. . In this case, a base material consisting of a hard resin layer 111 (prepreg (PPG)) + solder resist layer 112 is formed over the hard part (R) and the soft part (F), and then the base material becomes soft. When the portion F is punched out (removed), a portion remains in the area of the soft portion F, so that the remaining base material can be provided as the additional layer 500 and the second reinforcing member 400.

Meanwhile, in this embodiment, in the flexible insulating layer 200, the thickness of a portion that is the device mounting area (M1) and a portion that is not the device mounting area (M1) may be different from each other.

Above, an embodiment of the present invention has been described, but those skilled in the art can add, change, delete or add components without departing from the spirit of the present invention as set forth in the patent claims. The present invention may be modified and changed in various ways, and this will also be included within the scope of rights of the present invention.

R: Gyeongseongbu
F: soft part
100: Laminate
110: Rigid insulating layer
111: Hard resin layer
112: Solder resist layer
120: Flexible layer
121: Thermoplastic resin layer
122: Thermosetting resin layer
200: Flexible insulating layer
200T: Connection terminal
210: thermoplastic resin layer
220: Thermosetting resin layer
230: Coverlay
300: First reinforcing member
400: Second reinforcing member
500: Additional layer
M1: Device mounting area
M2: Second device mounting area
M3: Third device mounting area
E1: Electronic device
E2: Second electronic device
E3: Third electronic device
A: Joint member

Claims (15)

A laminate in which a plurality of insulating layers including a rigid insulating layer are stacked vertically;
a flexible insulating layer in which some areas are in vertical contact with at least one of the plurality of insulating layers, and other areas are located outside the laminate;
a device mounting area formed on one surface of the flexible insulating layer; and
It includes a first reinforcing member formed on the other surface of the flexible insulating layer to correspond to the device mounting area,
The first reinforcing member is a printed circuit board extending into the interior of the laminate.
According to paragraph 1,
A connection terminal is formed on one end of the flexible insulating layer,
A printed circuit board further comprising a second reinforcing member formed on the other side of the end of the flexible insulating layer to correspond to the connection terminal.
According to paragraph 1,
A printed circuit board wherein the coefficient of thermal expansion of the first reinforcing member is smaller than that of the flexible insulating layer.
delete According to paragraph 1,
Further comprising an additional layer formed on one surface of the flexible insulating layer adjacent to the device mounting area,
A printed circuit board wherein the additional layer is harder than the flexible insulating layer.
According to paragraph 1,
The flexible insulating layer is a printed circuit board including a thermoplastic resin layer and a thermosetting resin layer stacked vertically.
According to paragraph 1,
The first reinforcing member is a printed circuit board formed of a material containing metal.
According to paragraph 1,
The plurality of insulating layers include the rigid insulating layer and the flexible layer,
A printed circuit board in which the flexible layer is softer than the rigid insulating layer.
According to clause 8,
The flexible layer is a printed circuit board including a thermoplastic resin layer and a thermosetting resin layer.
According to paragraph 1,
A printed circuit board further comprising a second device mounting area formed on one surface of the laminate.
In a printed circuit board including a hard part and a flexible part,
a device mounting area formed on one surface of the flexible portion; and
It includes a first reinforcing member formed on the other side of the flexible portion to correspond to the device mounting area,
Further comprising an additional layer formed on one surface of the flexible portion adjacent to the device mounting area,
A printed circuit board wherein the additional layer is harder than the flexible portion.
According to clause 11,
A connection terminal is formed on one side of the end of the flexible portion,
A printed circuit board further comprising a second reinforcing member formed on the other side of the end of the flexible portion to correspond to the connection terminal.
According to clause 11,
The first reinforcing member is a printed circuit board extending inside the rigid portion.
delete According to clause 11,
A printed circuit board further comprising a second device mounting area formed on one surface of the rigid portion.

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