JP2006303163A - Circuit board, manufacturing method therefor, and device and electronic equipment using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent malfunction, degradation in picture quality and reliability, and the like caused by incident light on a driving IC in a liquid crystal display device used in a liquid crystal projector device, even when the liquid crystal display device is of such a structure that the driving IC is provided separately from a liquid crystal display panel. <P>SOLUTION: A reinforcing plate 180 is provided in a connector insertion terminal 164 over a film substrate 160 coupled with the liquid crystal panel 110. The reinforcing plate is utilized not only as a reinforcing plate 180a for reinforcing the connector insertion terminal 164, but also as a reinforcing plate 180b for shielding the driving IC 170 from light. The reinforcing plate 180b is mounted over a non-mounting surface 160b on the opposite side to the driving IC 170 with the film substrate 160 in-between. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit board connected to a predetermined member such as a display device, a manufacturing method thereof, and an electronic apparatus such as an apparatus main body and a display apparatus using the circuit board.

  For reasons such as reducing the size and weight of the substrate and adapting it to a foldable structure, a technique for mounting a semiconductor device such as an IC chip on a flexible circuit board (FPC board: Flexible Printed Circuit) may be used. .

  For example, by using an optical switching element that can individually control the light transmission state and the light blocking state, an image is displayed on a two-dimensional array of display pixels made up of the optical switching element, and a light beam is irradiated to the image. A projection-type display device that enlarges and displays an image by projecting and forming transmitted light on a screen is known. For example, a liquid crystal display device is used as a display device main body, and light emitted from a light source is selectively transmitted through the liquid crystal display device, and the transmitted light is projected on a screen, thereby realizing a large screen image display. There is a liquid crystal projector device.

  A liquid crystal display device used in such a liquid crystal projector device generally has a built-in drive circuit thereof. Many drive circuits use, for example, a polysilicon film having a higher electron mobility, not an amorphous silicon film, as a thin film transistor (TFT). This is because high temperature polysilicon has high mobility.

  On the other hand, for liquid crystal display devices for use in liquid crystal projector devices, there are increasing demands for higher definition, higher aperture, lower costs, and the like. Therefore, it has been proposed that a liquid crystal display device for use in a liquid crystal projector device is externally installed rather than having a built-in drive circuit, as in a liquid crystal display device other than a liquid crystal projector device (for example, (See Patent Documents 1 and 2).

JP 2000-294895 A JP 2003-332585 A

  In the mechanisms described in Patent Documents 1 and 2, by providing a driving IC for driving the liquid crystal display panel separately from the liquid crystal display panel portion constituting the effective pixel, the effective pixel area of the liquid crystal display panel is reduced. It is possible to increase the number of liquid crystal display panel parts that can be obtained from the same substrate, thereby realizing the demands for higher definition, higher aperture, lower cost, and the like.

  However, when a semiconductor device such as a driving IC is not built in the apparatus but is externally attached, light enters the semiconductor device, and performance degradation due to photocurrent leakage becomes a problem.

  For example, when a liquid crystal display device is used in a liquid crystal projector device, intense light of about 40 million lux, for example, in terms of white light is incident on the liquid crystal display panel portion of the liquid crystal display device. When such strong light is directly incident on the driving IC, carriers are generated in the driving IC by the incident light, and there is a possibility that the driving of the liquid crystal display panel portion may malfunction. Such a drive malfunction in the driving IC leads to deterioration of the image quality of the display image in the liquid crystal projector device, and the reliability of the liquid crystal display device itself.

  As a method for solving this problem, for example, as described in Patent Document 1, it is conceivable to mount a semiconductor device on a circuit board surface opposite to a surface on which light is incident. However, when a flexible substrate is used as the circuit substrate, the base film that is the base material of the substrate is thin, so that light is easily transmitted, and the light transmitted through the substrate hits the back side of the semiconductor device. Thus, problems such as a malfunction of the semiconductor device or a decrease in reliability and performance of the semiconductor device occur due to the photovoltaic power (light leakage) due to the light transmitted through the base film. This problem becomes more prominent when the base film is made thinner.

  On the other hand, as described in Patent Document 1, it is also conceivable to attach a light shielding member to the upper part of the corresponding part through the substrate of the semiconductor device. However, in this mechanism, steps and materials are added to attach a light shielding member, and the circuit board becomes expensive.

  The present invention has been made in view of the above circumstances, and even when a semiconductor device is mounted on a circuit board outside the apparatus, problems such as malfunction due to light, a decrease in reliability, and performance deterioration are inexpensive and simple. The purpose is to provide a mechanism that can prevent this.

  In the present invention, the light shielding means for performing light shielding on the semiconductor device mounted so that the arrangement location is located further outward than the outer edge of the support member that supports a predetermined member such as a display device is flexible. In mounting on the substrate, a member made of the same material as the contact terminal reinforcing member that reinforces the contact terminal portion of the flexible substrate is used as the light shielding means.

  By using the same material for the contact terminal reinforcing member and the member used for the light shielding means, both can be attached at the same time in the same process.

  When the circuit board manufactured in this way is used, a light shielding unit is provided for a semiconductor device such as a liquid crystal driving IC, and the light shielding unit blocks the light emitted from the light source of the apparatus. That is, irradiation light from a light source does not directly enter the semiconductor device. Therefore, temperature rise and carrier generation do not occur in the semiconductor device.

  According to the present invention, a member made of the same material as the contact terminal reinforcing member that reinforces the contact terminal portion of the flexible substrate is used for the light shielding means, and both are attached at the same time in the same process. Thereby, a process and material are not newly added for attaching the light shielding member, and a flexible circuit board on which the light shielding member is mounted can be manufactured at low cost.

  In addition, since the light-shielding member for the semiconductor device is mounted, irradiation light or the like does not directly enter the semiconductor device. To meet the demands for higher definition, higher aperture, lower cost, etc. Even when a semiconductor device is provided outside the apparatus separately from a predetermined member such as a display panel, the reliability of the semiconductor device may be reduced due to light incident on the semiconductor device, or malfunction of the circuit function may be caused. Absent. In addition, since it is not necessary to increase the number of special components, the reliability can be improved without increasing the cost of the apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Outline of optical system>
FIG. 1 shows an optical system of a liquid crystal projector that is an example of a projection display device that is configured using a liquid crystal display device (hereinafter also referred to as a liquid crystal display unit) that is an example of a display device body according to the present invention. It is the figure which showed schematic structure.

  The liquid crystal projector device 1 is provided with a monochrome liquid crystal display device for each color for processing any one of B (blue), G (green), and R (red) for each light path of B, G, and R. It is configured as a configured three-plate type color display device, and is configured for a standard three-plate transmission type liquid crystal projector device for 15.6 μm pitch.

  Specifically, the optical system 3 of the liquid crystal projector 1 includes a light source 5 that emits illumination light L0, a projection optical system 7 that projects on a screen (not shown), and an optical projection light that emits the illumination light L0 emitted from the light source 5. And an optical member group 9 guided to the system 7 side.

  The light source 5 has a light source lamp that emits illumination light L0. The light source lamp is a light source having a short arc length that can emit white parallel light with high brightness in order to prevent registration deviation (and also to prevent color mixing in the case of a single plate type). As an example, a metal halide lamp having an arc length of 1.0 mm or a short arc mercury high pressure lamp (UHP; Ultra High Performance) is used. When a complex optical system such as an integrator lens or a polarization conversion element is used as the optical system 3, it is desirable that the light source be as close to an ideal point light source as possible in order to sufficiently bring out these performances. In this regard, the UHP lamp can suppress the arc length to about ½ as compared with a conventionally used metal halide lamp, and achieves high efficiency of the optical system 3 of the liquid crystal projector device 1 with high brightness and high performance. Preferred above.

  The projection optical system 7 applies the B, G, and R color component lights LB, LG, and LR onto the B, G, and R liquid crystal display devices toward one liquid crystal display device for each of the B, G, and R colors. So that the color component lights LB, LG, and LR of B, G, and R are taken in, and the color component lights LR, LG, and LB that are taken in by the incident parts 72B, 72G, and 72R, respectively. Are combined in substantially the same optical path and emitted from the emission end 79a, and a projection lens 80 that projects the light of each color emitted from the liquid crystal display unit 76 and synthesized by the dichroic prism 79 onto a screen (not shown). I have. The color component lights LB, LR, LG emitted from the emission end 79a are collected by the projection lens 80 and are color-synthesized on a screen (not shown).

  Each of the incident portions 72B, 72G, and 72R includes a field lens 74 such as a condenser lens to which a color trimming coat is applied, and a liquid crystal display portion 76. Although not shown, polarizing plates are disposed on both sides of the liquid crystal display unit 76 on the optical path. As will be described in detail later, the liquid crystal display unit 76 drives a liquid crystal display panel using a thin film transistor (TFT) as an optical switch element, a casing (frame) surrounding the liquid crystal display panel, and the liquid crystal display panel. A board module on which a driving element is mounted.

  The optical member group 9 blocks UV (UltraViolet rays) and IR (InfRared rays) in the illumination light L0 emitted from the light source 5, and transmits visible light VL (Visible light). 54, a multi-lens array (MLA) 56 which is an example of a flat plate optical device (collective lens) in which lens cells of a predetermined shape are arranged, and UV emitted from the light source 5 The optical member group 220 that transmits the visible light components VL (LB, LR, LG) transmitted through the / IR cut filter 54 and the multi-lens array 56 is provided in this order on the optical path.

  The optical member group 9 reflects the red component light LR in the visible light component L1 (LB, LR, LG) transmitted through the optical member group 220, and transmits the remaining blue component light LB and green component light LG. The dichroic mirror (DM) 232 and the red component light LR reflected by the dichroic mirror 232 are reflected toward the incident portion 72R, thereby causing total reflection to enter the liquid crystal display portion 76R of the incident portion 72R at a predetermined incident light divergence angle. A mirror 214 is provided.

  The optical member group 9 reflects the green component light LG of the blue component light LB and the green component light LG transmitted through the dichroic mirror 232 toward the incident portion 72G, thereby causing the liquid crystal display portion 76G of the incident portion 72G to have a predetermined value. And a dichroic mirror (DM) 234 that transmits the blue component light LB.

  The optical member group 9 includes a total reflection mirror 216 that reflects the blue component light LB transmitted through the dichroic mirror 234, and a blue component light LB that is reflected by the total reflection mirror 216 toward the incident portion 72B, thereby reflecting the incident portion. And a total reflection mirror 218 that enters the liquid crystal display unit 76B of 72B at a predetermined incident light divergence angle.

  Although not shown, the optical member group 220 includes a multi-lens array (MLA), which is an example of a flat optical device in which lens cells having a predetermined shape are arranged, and incident light to the liquid crystal display device using polarized light. Are arranged in this order such that the microlens array is on the light source 5 side in the optical path. Although not shown, a condenser lens that guides the visible light component VL transmitted through the PS combining element to a predetermined position of the dichroic mirror 232 is provided on the dichroic mirror 232 side of the PS combining element.

  The microlens array has m convex lens-type lens cells in the X direction and n convex lens-type lens cells on a transparent substrate, and functions as a light combining unit. Lead to. The PS synthesis element is used for the purpose of utilizing polarized light that has been absorbed in the past by aligning the polarization of incident light to the liquid crystal display device. That is, the liquid crystal display device outputs an image by modulating one polarized light out of the light from the light source, but the other polarized light is not utilized and is absorbed as heat by the polarizing plate. On the other hand, by using the PS synthesis element to align the polarization of the incident light to the liquid crystal display device, the conventionally used polarized light is utilized.

  With such a configuration, the optical system 3 of the liquid crystal projector device 1 allows the visible light component VL (LB, LR, LG) in the illumination light L0 emitted from the light source 5 to be converted into the UV / IR cut filter 54, the microlens. After passing through the array 56 and the optical member group 220, the two dichroic mirrors 232 and 234 separate the color component lights LB, LR, and LG, respectively, pass through the field lens 74 of the incident unit 72, and then the liquid crystal display unit 76. A uniform illumination is obtained on the liquid crystal display panel surface.

  Each color component light LB, LR, LG is condensed at a predetermined position in the liquid crystal display panel constituting the liquid crystal display unit 76 and passes through a corresponding pixel position of the liquid crystal display panel. At this time, the applied voltage to the pixel electrode (not shown) of the liquid crystal display panel changes according to the given pixel signal, and the polarization direction of each color component light LB, LR, LG that passes through the liquid crystal layer (not shown) according to this change. Is modulated.

  The B, R, and G color component lights LB, LR, and LG that are focused in the liquid crystal display panel are emitted from the back surface of the liquid crystal display panel, selectively transmitted through the polarizing plate, and are transmitted to the dichroic prism 79. The light is incident, synthesized by the dichroic prism 79, emitted from the exit end 79a, and projected on the screen by the projection lens 80 while being color synthesized in accordance with the degree of modulation on the screen.

  The dichroic prism 79 is designed such that, for example, light emitted from the liquid crystal display unit 76 is designed to be P waves for green and S waves for red and blue, so that green transmission characteristics and red / blue reflection can be achieved even with the same dichroic film. The wavelength range of the characteristics can be expanded, and as a result, the spectrum of the light source 5 can be widely used.

<Configuration of liquid crystal display>
2-4 is a figure which shows schematic structure of the liquid crystal display part 76 which is an example of the display apparatus main body which concerns on this invention. FIG. 5 is a diagram showing a comparative example. Here, FIG. 2A is an external view showing the entire liquid crystal display portion 76 with the wiring pattern etc. omitted, and FIG. 2B is a perspective view focusing on the liquid crystal display panel. C) is a perspective view focusing on a board module in which a semiconductor device or the like is mounted on a circuit board. FIG. 3 is a cross-sectional view at a position along the line P-P drawn in FIG. FIG. 4 is another diagram illustrating a schematic configuration of the liquid crystal display unit 76.

  As shown in FIGS. 2 and 3, the liquid crystal display unit 76 includes a substrate module 102, a liquid crystal display panel 110 that is an example of a display device, and a display window 146, and is a support member that supports the liquid crystal display panel 110. The frame (frame body) 140 which is an example, and the light-shielding plate 150 in which the display window 156 was formed are provided. Although not shown, the liquid crystal display unit 76 is configured such that the frame 140 side is attached to a fixed plate (support plate) having a display window (see FIG. 10 described later).

  The frame 140 is disposed on the light emission side of the liquid crystal display panel 110 and serves as a frame for supporting the liquid crystal display panel 110. As such a frame 140, for example, a metal member such as aluminum (Al), magnesium (Mg), and stainless steel (SUS) excellent in thermal conductivity, or a resin member also excellent in thermal conductivity in a frame shape. What was shape | molded is mentioned.

  Further, the light shielding plate 150 is disposed on the light incident side of the liquid crystal display panel 110 and is used to block light incident on portions other than the effective pixel portion of the liquid crystal display panel 110. Examples of such a light shielding plate 150 include a plate in which an opening having a shape corresponding to an effective pixel portion is formed on a metal plate or a resin plate having excellent thermal conductivity. The light incident direction may be reversed.

  The liquid crystal display panel 110 has a counter substrate 113 as a support substrate made of a transparent thin glass plate or the like, as well as a transparent TFT substrate 112 made of a transparent thin glass plate or the like. On the TFT substrate 112, TFTs that are pixel electrodes constituting pixels are arranged in a matrix. On the other hand, a counter electrode or a common (common) electrode is disposed on the counter substrate 113 facing this with the liquid crystal interposed therebetween.

  Although not shown, a sealing material is disposed on the periphery of the TFT substrate 112 and the counter substrate 113, and the TFT substrate 112 and the counter substrate 113 are bonded to each other with a predetermined gap (cell gap) sandwiched between the sealing materials. It is fixed. Here, the cell gap, which is the distance between the TFT substrate 112 and the counter substrate 113, is defined by a number of spacers (not shown) sandwiched between the TFT substrate 112 and the counter substrate 113. Then, a liquid crystal (not shown) is sealed in the region defined by the TFT substrate 112, the counter substrate 113, and the sealing material. That is, the liquid crystal display panel 110 is configured by sandwiching a liquid crystal layer (not shown) between the TFT substrate 112 and the counter substrate 113.

  With such a configuration, in the liquid crystal display panel 110, when a voltage is applied between the opposed electrodes, the director alignment direction of the liquid crystal molecules is unidirectional, and the uniaxial birefringence anisotropy is expressed. The amount of transmitted light can be controlled, and the light modulated from the light source 5 according to the video signal is modulated. A cover glass 120 for protecting the TFT substrate 112 and the counter substrate 113 is provided on each of the light incident side and the light emitting side of the liquid crystal display panel 110.

  Here, in the liquid crystal display panel 110 of the present embodiment, in order to meet the demands for high definition, high aperture, low cost, etc., a voltage is applied to each electrode in the TFT substrate 112 and the counter substrate 113 to display the liquid crystal display. A drive circuit for driving the panel 110 is not built in the liquid crystal display panel but is externally attached. For example, the liquid crystal display panel 110 has a laminated body of a plurality (two or more layers) of base films (base materials) that are electrically connected to the electrodes of the TFT substrate 112 and the counter substrate 113 in the liquid crystal display panel 110. A flexible (flexible) film substrate 160 such as a configured FPC substrate is attached.

  A wiring substrate having a wiring layer is provided as a partial base material of the laminate. A driving IC 170 which is an example of a semiconductor device having a function as a driving circuit for driving the liquid crystal display panel 110 is mounted on the film substrate 160 while being electrically connected to the wiring layer. A driving IC 170 and other members are mounted on the film substrate 160 to constitute a substrate module 102 as shown in FIG. The substrate module 102 can also be called a semiconductor device because the driving IC 170 is mounted on the film substrate 160.

  For example, in the example shown in FIG. 3, since the TFT substrate 112 is larger than the counter substrate 113, a part of the TFT substrate 112 protrudes from the lower edge of the counter substrate 113, and is formed at the end of the protruding portion. The panel side end portion (device side end portion) 162 of the film substrate 160 as the wiring substrate base is connected to the terminal being connected via an anisotropic conductive film or the like. The panel-side end 162 is fixed to the TFT substrate 112 by a resin mold or the like on the surface (referred to as the non-mounting surface 160b) opposite to the surface on which the terminal of the panel-side end 162 is provided (referred to as the mounting surface 160a). Has been.

  Here, the terminals provided on the panel-side end 162 are formed on the counter substrate 113, for example, in which a striped electrode (not shown) formed on the TFT substrate 112 is formed with wiring (extending) in the protruding portion as it is. The striped electrodes (not shown) are electrically connected between the opposing substrate 113 and the TFT substrate 112 by a conductive material (not shown), and the wiring formed in the protruding portion is arranged and used for connection. Is done.

  Therefore, when a drive signal such as various control signals or a power source is input from an external circuit via the film substrate 160, a voltage can be applied to an appropriate stripe electrode desired based on the drive signal. Thereby, the alignment state of the liquid crystal in each pixel can be controlled, and a desired image can be displayed on the liquid crystal display panel 110.

  In order to input such a driving signal, a driving IC 170 as an electronic component is mounted on the film substrate 160 to form a circuit board. The film substrate 160 has a wiring pattern (not shown) formed of copper and covered with nickel-gold or the like on the surface of a base film made of a thin polyimide film having a thickness of about 25 μm, for example. The driving IC 170 is mounted via metal-to-metal bonding, NCP (non-conductive paste), or anisotropic conductive film. Further, in the vicinity of the connection portion with the terminal at the panel side end portion 162 of the film substrate 160, the film substrate 160 and the liquid crystal panel are connected by an ACF (anisotropic conductive film), and the resin is cured after coating, whereby the film The substrate 160 and the liquid crystal panel are fixed (reinforced).

  Thus, the liquid crystal display unit (liquid crystal display device) 76 is provided with the driving IC 170 separately from the liquid crystal display panel 110, and the so-called COF (Chip) in which the driving IC 170 is provided on the film substrate 160. The structure uses a substrate module (semiconductor device) 102 having an On Film (chip-on-film) structure. Although illustration is omitted, on the film substrate 160, in addition to the driving IC 170, a circuit member other than a semiconductor such as a surface mount type ceramic capacitor for noise suppression, for example, may be mounted.

  In the mounting of the COF structure, for example, a sheet-like or paste-like anisotropic conductive film in which a plurality of conductive particles formed by plating gold or the like on the surface of a plastic ball is dispersed in a resin is driven with the film substrate 160. The driving IC 170 is pressed while being heated by the pressure-bonding head while being sandwiched between the IC 170 for use.

  That is, flip-chip connection is performed on the film substrate 160 via a plurality of bumps, and a non-conductive paste (NCP; Non Conductive Paste) between the connected driving IC 170 and the film substrate 160 is used for anisotropic conductive connection. An underfill agent such as a film (Anisotropic Conductive Film; ACF) or an anisotropic conductive connection paste (ACP) is filled. Then, the molten resin is pushed away between the terminal of the driving IC 170 and the wiring pattern of the film substrate 160 to form a resin sealing portion, and together with that, between the terminal of the driving IC 170 and the wiring pattern of the film substrate. The conductive particles are pressed, and the terminals of the driving IC 170 and the wiring pattern of the film substrate 160 are electrically connected. Such a mounting method is advantageous in that it can cope with finer pitches of wiring patterns and terminals and can electrically connect a large number of terminals at once.

  Further, according to this COF structure, since the driving IC 170 is separate from the liquid crystal display panel 110, the effective pixel area in the liquid crystal display panel 110 is increased and the number of portions of the liquid crystal display panel 110 that can be obtained from the same substrate is reduced. It is possible to easily increase the size of the liquid crystal display device, thereby realizing high definition, high aperture, low cost, etc. of the liquid crystal display device. In addition, since the driving IC 170 is disposed on the film substrate 160, the TFT substrate 112 and the counter substrate 113 constituting the liquid crystal display panel 110 can be easily downsized, and the layout can be secured with a high degree of freedom. become able to.

  Further, although not shown, on the mounting surface 160a side of the end of the film substrate 160 opposite to the panel side end 162 on the liquid crystal display panel 110 side (in particular, the connector insertion terminal portion 164), the liquid crystal display 76 is not shown. And terminals for electrical connection with the circuit board of the device body are formed and arranged by a wiring pattern (in particular, also called a contact terminal). This connector insertion terminal part 164 is inserted into the connector insertion part 194 of the connector 192 provided in the apparatus main body. In the connector insertion terminal portion 164 of the film substrate 160, a reinforcing plate 180 for reinforcing the contact terminals is attached to a predetermined region in the vicinity of the contact terminals of the non-mounting surface 160b opposite to the mounting surface 160a. ing.

  Although illustration is omitted, a heat sink for heat dissipation may be attached to the driving IC 170. The heat sink is a device (heat radiator) for radiating heat generated in the driving IC 170 to the outside, and is made of, for example, a metal member having a large surface area with a large number of fins. It is conceivable that this heat sink is fixed on the chip surface of the driving IC 170 via a heat conductive resin. By interposing the heat conductive resin, the heat conductivity can be improved by fixing and flattening the contact surface (filling the minute irregularities with the resin and increasing the contact area). The difference in the linear expansion coefficient can be absorbed. When such a heat sink is attached, heat can be radiated from the driving IC 170 very efficiently, and further suppression of the temperature rise of the driving IC 170 can be ensured.

  By the way, the liquid crystal display unit 76 of the present embodiment has a great feature in the location where the driving IC 170 is arranged. That is, as shown in FIG. 3A, the location where the driving IC 170 is disposed is located further outward than the outer edge of the support member of the liquid crystal display panel 110 (see A in the figure). In particular, the driving IC 170 is disposed in the vicinity of the connector insertion terminal portion 164.

  Here, the “support member” refers to a member for supporting the liquid crystal display panel 110. Typically, the frame 140 corresponds to this, but the light shielding plate 150 is also included in the support member here. Further, for example, as shown in FIG. 3B, in order to mount the frame 140 of the liquid crystal display device on the dichroic prism 79 of the liquid crystal projector device 1 using a fixing plate or an attachment member (not shown) (see FIG. 10 described later). In the case where the attachment plate 142 is attached to the frame 140, the attachment plate 142 is also included in the support member here (see B in the figure).

  “Further outward than the outer edge of the support member” means the outer side of the edge forming the outer shape (planar outer shape) of the support member as viewed from the direction of light incident on the liquid crystal display device, that is, FIG. As shown in the figure, it means a side farther from the effective pixel portion 111 of the liquid crystal display panel 110 than the outer edge which is the outer edge. The outer edge of the support member is not necessarily a rectangular shape as shown in FIG. 4A, and may have a notch 144 as shown in FIG. 4B, for example. In this case, the inside of the cutout portion 144 also corresponds to “more outward than the outer edge”.

  As described above, when the drive IC 170 is disposed further outward than the outer edge of the support member, the drive IC 170 is arranged so as to be exposed to the outside of the support member. Therefore, since the driving IC 170 is not covered with a support member such as the frame 140 or the light shielding plate 150, the heat generated in the driving IC 170 can be easily released.

  In addition, if the driving IC 170 is located outside the outer edge of the support member, the driving IC 170 can be cooled. Usually, the liquid crystal projector device 1 includes a blower fan, and the blower fan generates an air flow around the liquid crystal display device. Therefore, if the driving IC 170 is located outside the outer edge of the support member, the driving IC 170 is arranged on the air flow (the path of the cooling air). Cooling is possible (for example, refer to FIG. 10 described later). As a result, the strength (reliability) of the driving IC 170 can be increased at a low cost.

  From the above, according to the liquid crystal display unit 76 of the present embodiment, the heat radiation of the driving IC 170 is facilitated and the driving IC 170 can be cooled, so that the temperature rise of the driving IC 170 is suppressed. Can do. Therefore, when this liquid crystal display unit 76 is used in a projector device, the temperature rises even if the liquid crystal display device is configured with a COF structure in order to meet the demands for high definition, high aperture, low cost, etc. This does not cause a malfunction of the driving IC 170.

  Further, improper light modulation in the liquid crystal display panel 110 due to the malfunction, that is, deterioration of the image quality of the display image is not caused, and furthermore, the image quality of the display image due to heat transfer from the driving IC 170 to the liquid crystal display panel 110. Deterioration can also be suppressed. For these reasons, the liquid crystal display unit 76 described here can improve the reliability of the driving IC 170 functioning as the driving circuit of the liquid crystal display panel 110 and also improve the reliability of the liquid crystal display unit 76 itself. Can be planned. Moreover, since it is not necessary to increase the number of special components, the reliability can be improved without increasing the cost of the apparatus.

  The driving IC 170 is desirably disposed on the light emitting side surface of the film substrate 160. If it is disposed on the surface on the emission side, light does not directly enter the driving IC 170, and light (diffraction to the driving IC 170) is compared to the case where it is disposed on the surface on the light incident side. This is because the possibility of incidence of light or the like is reduced. In other words, the light intensity is attenuated by the film substrate 160, and it is considered that light hardly enters the mounting surface 160a of the film substrate 160. Therefore, the incidence of light on the driving IC 170 can be suppressed, and the light Can be prevented from causing the temperature of the driving IC 170 to rise, or the performance of the driving IC 170 due to photocurrent leakage, that is, the occurrence of carriers due to incident light and the malfunction of the TFT.

  However, in this case, although the light does not directly enter the driving IC 170, the base film of the film substrate 160 is as thin as, for example, 25 μm or less, so even if a material having excellent light shielding properties is used. As in the comparative example shown in FIG. 5, there is still a concern that the driving IC 170 that is a semiconductor receives a small amount of light that has passed through the film substrate 160 and that the photovoltaic IC induces a malfunction due to the photovoltaic force. The If the light intensity incident on the non-mounting surface 160b side is weak, the influence of transmitted light may be negligible. However, for example, the liquid crystal projector device 1 in which the mounted liquid crystal panel is likely to be exposed to projection light or the like. The problem of light transmitted through the film substrate 160 cannot be ignored when the light intensity is particularly strong as in the case where it is used.

  In order to solve this problem, for example, as described in Japanese Patent Application Laid-Open No. 2000-294895, dummy wiring is provided on a non-mounting surface 160b opposite to the mounting surface 160a on which the driving IC 170 is mounted on the film substrate 160. It is conceivable to provide a light-shielding member such as a layer. However, providing such a light shielding member separately adds steps and materials to provide this light shielding member, and the film substrate 160 becomes expensive.

  Therefore, in this embodiment, an effective method for solving this problem is proposed as follows. That is, the basis of the method is that the reinforcing plate 180 provided in the connector insertion portion 164 of the film substrate 160 is used as a light shielding member.

  In addition, in terms of using the reinforcing plate 180 as a light-shielding member, not only the performance as a reinforcing material of the connector insertion terminal portion 164 but also a film that hardly transmits visible light from a material that transmits visible light (such as polyimide). It is preferable to use a material (for example, white or black polyethylene terephthalate (PET)), a metal material, or a material colored in white or black.

  By using the reinforcing plate 180 as a light shielding member, the connector of the film substrate 160 is inserted into the semiconductor packaged circuit board (substrate module 102) on which the semiconductor device (driving IC 170 in this example) is mounted. The reinforcing plate 180 attached to the terminal portion 164 and the plate used for light shielding attached to the driving IC 170 side can be attached at the same time using the same material and in the same process. This will be specifically described below.

<First embodiment; basic structure>
2A, 2C, and 3, the basic structure of the first embodiment of the reinforcing plate 180 is shown. In the first embodiment, the reinforcing plate 180 attached to the non-mounting surface 160b opposite to the mounting surface 160a provided with the contact terminals of the connector insertion terminal portion 164 of the film substrate 160 is used for driving as it is. It is characterized in that it is enlarged to cover the IC 170. The driving IC 170 placed on the film substrate 160 is covered with the reinforcing plate 180 at a position corresponding to the opposite side of the driving IC 170, thereby shielding the driving IC 170 from light.

  That is, as shown in FIG. 3A, the reinforcing plate 180 for reinforcement attached to the connector insertion terminal portion 164 on the non-mounting surface 160b of the film substrate 160 on which the driving IC 170 is mounted is formed on the film substrate 160. It is characterized in that it extends to the upper part of the driving IC 170 which is a semiconductor device mounted on the mounting surface 160a side. In short, the reinforcing plate 180 includes a portion of the reinforcing plate (contact terminal reinforcing member) 180a that functions to reinforce the connector insertion terminal portion 164 and a reinforcing plate (light shielding member) 180b that functions to shield the driving IC 170 from light. Are in an integrally configured state.

  When the reinforcing plate 180 of the connector insertion portion 164 is also used as a light shielding member for the driving IC 170, it is preferable to dispose the driving IC 170 in the vicinity of the connector insertion terminal portion 164. The closer they are, the smaller the size of the reinforcing plate 180 and the lower the cost.

  In the case of such a structure of the reinforcing plate 180 of the first embodiment, the number of man-hours for component management is reduced as compared with the case of separate bodies. In addition, since it is arranged on the film substrate 160 so as to integrally cover the connector insertion terminal portion 164 and the driving IC 170, it is inevitably attached to the connector insertion terminal portion 164 in the film substrate 160. The portion of the reinforcing plate 180a and the portion of the upper reinforcing plate 180b sandwiching the film substrate 160 of the driving IC 170 can be attached in the same process. Therefore, the driving IC 170 mounted on the film substrate 160 can be shielded from light at low cost.

  Note that the reinforcing plate 180 is set to a size that covers the entire driving IC 170 in that the driving IC 170 is shielded from light by the reinforcing plate 180 (particularly, the reinforcing plate 180b). For example, the portion of the reinforcing plate 180b of the reinforcing plate 180 is preferably formed as a region that is at least 0.1 mm wider than the mounting region of the driving IC 170. More preferably, it is formed as a wide region having a width of 1 mm or more. Increasing the width makes it possible to prevent oblique incidence due to diffracted light or the like. That is, the size of the reinforcing plate 180b on the non-mounting surface 160b sandwiching the film substrate 160 of the driving IC 170 disposed on the film substrate 160 covers the entire driving IC 170 on the non-mounting surface 160b side. That is, it is desirable that the design is larger than the driving IC 170.

  In the present application, “covering further outward than the outer edge of the semiconductor device” means not only the semiconductor chip which is the main part of the semiconductor device but also the outside of the semiconductor chip. When the driving IC 170 is not a single semiconductor chip but the semiconductor chip is covered with a resin mold or the like, the outline of the reinforcing plate 180b covers at least the outside of the semiconductor chip portion. It is sufficient that the semiconductor chip is completely covered, and it is not essential that the semiconductor chip is completely covered including the resin mold portion. However, if the semiconductor chip is covered with a resin mold, it is difficult to uniquely identify the part in the resin mold where the semiconductor chip is present. It is preferable to completely cover the resin mold part as well.

<First Embodiment; Modification>
FIG. 6 and FIG. 7 are diagrams for explaining a modification of the board module 102 on which the reinforcing plate 180 of the first embodiment is mounted. Here, FIG. 6 is a diagram showing a structure of a modified example, and FIG. 7 is a diagram for explaining the manufacturing method.

  In the description of the basic structure of the reinforcing plate 180 of the first embodiment described above, the size relationship between the reinforcing plate 180 and the film substrate 160 and the material of the reinforcing plate 180 are not described, but various aspects are adopted. Can do.

  First, in order to perform the function of reinforcing the connector insertion terminal portion 164 by the reinforcement plate 180 while allowing the connector insertion terminal portion 164 to be inserted into the connector insertion portion 194 of the connector 192, the portion of the reinforcement plate 180a is: It is desirable that the size is substantially the same as the size of the connector insertion terminal portion 164 of the film substrate 160. That is, as shown in each drawing of FIG. 6, it is desirable that the width W180a of the reinforcing plate 180a that reinforces the connector insertion terminal portion 164 is substantially the same as the width W160a of the film substrate 160 of the corresponding portion. .

  On the other hand, the reinforcing plate 180b only needs to fulfill the function of shielding the driving IC 170, and various shapes and materials can be adopted as long as this is the case. For example, in the substrate module 102 of the first example shown in FIG. 6A, the width W180b of the reinforcing plate 180b that shields the driving IC 170 is narrower than the width W160b of the film substrate 160 in the corresponding portion. On the other hand, in the substrate module 102 of the second example shown in FIG. 6B, the width W180b of the reinforcing plate 180b that shields the driving IC 170 is in the same state as the width W160b of the film substrate 160 of the corresponding part.

  In the case of the substrate module 102 of the first example, the load can be reduced in the film substrate punching process when the substrate module 102 is manufactured. That is, as shown in FIG. 7, in the process of manufacturing the substrate module 102, first, a wiring pattern is formed on the film substrate 260 larger than the finished substrate module 102, and further, the driving IC 170 and the wide (W180) are formed. A reinforcing plate 180 is mounted. Then, in the film substrate punching step, the remaining portion (invalid area) 264 excluding the portion of the film substrate 160 inside the punching line 262 is punched and dropped at the punching line 262 indicated by a dotted line in FIG.

  At this time, as shown in FIG. 7A, if the width W180b of the reinforcing plate 180b that shields the driving IC 170 is narrower than the width W160b of the film substrate 160 of the corresponding portion, As shown in FIG. 7B, the load W of the reinforcing plate 180b that shields the driving IC 170 is wider than the width of the film substrate 160 in the corresponding portion. The punching load can be reduced as compared with the case.

  The state shown in FIG. 7B shows a film substrate punching process in the case of manufacturing the substrate module 102 of the second example shown in FIG. Also in the substrate module 102 of the second example, when the film substrate 160 is punched from the film substrate 260 to form the substrate module 102, the punch line 262 indicated by a dotted line in FIG. The remaining portion 264 excluding the portion of the film substrate 160 is punched and dropped, and at the same time, the entire reinforcing plate 180 can be punched.

  Further, in the board module 102 of the third example shown in FIG. 6C, the reinforcing plate 180 is entirely formed of the same material, but the reinforcing plate 180a that reinforces the connector insertion terminal portion 164. This portion is characterized in that the portion of the reinforcing plate 180b that shields the driving IC 170 is colored in different colors.

  Here, regarding the reinforcing plate 180 having the same shape as the first example shown in FIG. 6A, the coloring of the reinforcing plate 180a and the reinforcing plate 180b is different, but the second example shown in FIG. 6B. The reinforcing plate 180 having the same shape as that of the reinforcing plate 180a and the reinforcing plate 180b may be colored differently.

  Since the portion of the reinforcing plate 180b needs to fulfill the function of shielding the driving IC 170, in the case of the structure of the third example, the colored b of the reinforcing plate 180b is lighter than the colored a of the reinforcing plate 180a. It is important to color black with good absorbability or white with good light blocking properties. The reinforcing plate 180a does not need to be shielded from light, so it is not necessary to carry out positive coloring, and the color of the film substrate 160 may be used.

  By using the substrate module 102 of the third example as described above, even if the reinforcing plate 180 is made of a material that allows visible light to pass through, positive coloring is used to block the portion of the reinforcing plate 180b. Performance can be improved. The entire reinforcing plate 180 is not colored with the same color, but only the necessary portion (in this example, the region of the reinforcing plate 180b) is colored on the film substrate 160, so that the entire reinforcing plate 180 is colored. The cost of the colorant can be reduced.

  Further, the substrate module 102 of the fourth example shown in FIG. 6D is characterized in that a metal material that does not easily transmit visible light is used as the reinforcing plate 180. Examples of the metal material include members such as aluminum (Al) and copper (Cu).

<Second Embodiment; Basic Structure>
8-10 is a figure explaining the basic structure of 2nd Embodiment of the reinforcement board 180. FIG. Here, FIG. 8 is a view showing the structure of the substrate module on which the reinforcing plate of the second embodiment is mounted, and FIG. 9 is a view for explaining the manufacturing method. FIG. 10 is a diagram showing an example of an embodiment in which the liquid crystal display unit 76 is mounted on the liquid crystal projector device 1, and is a diagram schematically showing an outline of the air flow particularly around the liquid crystal display unit 76.

  This second embodiment is characterized in that a reinforcing plate 180a that reinforces the connector insertion terminal portion 164 and a reinforcing plate 180b that shields the driving IC 170 are separated. That is, as shown in FIG. 8A, a reinforcing plate 180a for reinforcement is attached to the connector insertion terminal portion 164 on the non-mounting surface 160b of the film substrate 160 on which the driving IC 170 is mounted. On the other hand, a reinforcing plate 180b that shields the driving IC 170 is attached to a non-mounting surface 160b that sandwiches the film substrate 160 of the driving IC 170 mounted on the mounting surface 160a side of the film substrate 160. Since the reinforcing plate 180a and the reinforcing plate 180b are arranged at a predetermined interval, a slit (gap) 182 is formed between them. By making the reinforcing plate 180a and the reinforcing plate 180b separate from each other, the degree of freedom of the location where the driving IC 170 is disposed becomes larger than in the case of being integrated, and the size and cost need not be considered.

  In addition, in the point that the driving IC 170 is shielded from light by the reinforcing plate (particularly the reinforcing plate 180b), as in the first embodiment, the reinforcing plate 180b is used for driving as shown in the enlarged view of FIG. 8B. The size is set so as to cover the entire IC 170. For example, the reinforcing plate 180b may be formed as a region that is at least 0.1 mm wider than the mounting region of the driving IC 170. More preferably, it is formed as a wide region having a width of 1 mm or more. That is, the size of the reinforcing plate 180b on the non-mounting surface 160b sandwiching the film substrate 160 of the driving IC 170 disposed on the film substrate 160 covers the entire driving IC 170 on the non-mounting surface 160b side. That is, it is desirable that the design is larger than the driving IC 170.

  Here, even if the reinforcing plate 180a and the reinforcing plate 180b are separate, component management can be facilitated by using the same material for both. In addition, depending on the shape, the portion of the reinforcing plate 180a attached to the connector insertion terminal portion 164 in the film substrate 160 and the portion of the upper reinforcing plate 180b sandwiching the film substrate 160 of the driving IC 170 in the same process. Can be pasted at once. Therefore, also in the second embodiment, similarly to the first embodiment, it is possible to shield the driving IC 170 mounted on the film substrate 160 at a low cost.

  That is, when the reinforcing plate 180a and the reinforcing plate 180b are made of different materials, different member manufacturers may occur, and it is necessary to arrange and manage each of them. In addition, as shown in FIG. 9A, a step of attaching a reinforcing plate 180a made of the first material on the film substrate 160 and a reinforcing plate 180b made of the second material on the film substrate 160 are provided. The process of pasting is indispensable.

  On the other hand, if the reinforcing plate 180a and the reinforcing plate 180b are made of the same material (the same material), it is possible to place an order with the same manufacturer, and the man-hours for component management are reduced. Of course, as shown in FIG. 9B, the separate reinforcing plates 180a and 180b divided in advance can be attached to the film substrate 160 at the same time in the same process.

  For example, when the reinforcing plate 180a and the reinforcing plate 180b have the same shape, that is, the vertical and horizontal sizes are the same size, the film is used as the reinforcing plate 180a and the reinforcing plate 180b by using two types of members. It can be pasted on the substrate 160. Further, when the reinforcing plate 180a and the reinforcing plate 180b are different in shape, that is, having different vertical or horizontal sizes, for example, a perforation or a V-cut is used so that it can be easily separated immediately before the attaching process. Then, if a single member connecting the reinforcing plate 180a and the reinforcing plate 180b is prepared, each of the separate reinforcing plates 180a and 180b divided immediately before the attaching step is attached to the film substrate 160 at the same time. Can do.

  In addition, by providing a slit 182 for separation in advance and preparing a wide reinforcing plate 181 in which the reinforcing plate 180a and the reinforcing plate 180b are connected by the connecting portion 184, the sticking plate (reinforcing plate 181) is 1 After the punching, the reinforcing plate 181 can be divided into the reinforcing plate 180a and the reinforcing plate 180b. For example, as shown in FIG. 9 (C), the ineffective portions on both sides (or one side) which are punched off in the film substrate punching process are used as connecting portions 184, and the reinforcing plate 180a and the reinforcing plate 180b are slit 182. A wide reinforcing plate 181 that is connected by the connecting portion 184 in a state of being separated from each other is provided.

  The reinforcing plate 181 is positioned on the non-mounting surface 160b of the film substrate 260 (finished film substrate 160), the reinforcing plate 180a is positioned at the connector insertion terminal portion 164 portion, and the reinforcing plate 180b is positioned at the driving IC 170 portion. Place it so that it is positioned. Thereafter, in the film substrate punching process, the remaining portion 264 is struck down along the punching line 262 of the film substrate 260. Since the connecting portion 184 of the reinforcing plate 181 is disposed on the remaining portion 264 of the film substrate 260, when the remaining portion 264 is driven down, the connecting portion 184 is also driven down simultaneously.

  In this way, if one reinforcing plate 181 is attached to the film substrate 160 and the two are connected by the connecting portion 184 so that it can be divided into the reinforcing plate 180a and the reinforcing plate 180b after punching, it is attached to the film substrate 160. The plate itself may be one of the reinforcing plates 180, and after punching, the reinforcing plate 181 is automatically divided into the reinforcing plate 180a and the reinforcing plate 180b, so that the film substrate punching process can be simplified. Further, at the component level, since the reinforcing plate 180a and the reinforcing plate 180b are the integrated reinforcing plate 181, the man-hours for component management are reduced as compared with the case of separate components.

  Further, by separating the reinforcing plate 180a and the reinforcing plate 180b, the substrate module 102 is structured so that the film substrate 160 can be easily bent between the connector insertion terminal portion 164 and the driving IC 170. Can do. That is, as shown in FIG. 10, when the reinforcing plate 180 is divided, when the frame 140 of the liquid crystal display unit 76 is attached to the dichroic prism 79 of the liquid crystal projector device 1, the connector insertion terminal unit 164 and the driving IC 170 are connected. Thus, the film substrate 160 can be mounted while being bent, and the area of the mounting substrate 190 on which the connector 192 is disposed and the size of the mounted device can be reduced.

  On the other hand, in the case of the reinforcing plate 180 in which the reinforcing plate 180a and the reinforcing plate 180b are integrated, it is necessary to be mounted on the liquid crystal display panel 110 side more than the driving IC 170. As shown in a reduced size in the upper right corner, the area of the mounting substrate 190 on which the connector 192 is disposed may increase, and the device size after mounting must be increased. Further, the driving IC 170 cannot be cooled by cooling air sent from below.

  Further, as shown in FIG. 10, when the mounting structure is bent, when the liquid crystal display unit 76 is mounted on the liquid crystal projector device 1, the cooling air for cooling the liquid crystal display panel 110 is not hindered by the connector 192. Since the wind can be applied to the driving IC 170 and exhausted efficiently, the driving IC 170 can be easily dissipated. As a result, similar to the first embodiment, the strength (reliability) of the driving IC 170 can be increased at low cost.

  In particular, even when a blower fan is not provided, the liquid crystal display panel 110 is arranged vertically so that air can flow from the ground side to the ceiling side as shown in FIG. The cooling air can be passed and the connector 192 does not block the cooling air. As a result, if the driving IC 170 is positioned outside the outer edge of the support member and the driving IC 170 is arranged in the path of the cooling air, the cooling of the driving IC 170 using natural convection is performed. Therefore, the strength (reliability) of the driving IC 170 can be increased at a lower cost.

  In other words, when convection heat transfer using cooling air is used for heat energy transfer, heat dissipation is performed by using natural convection heat transfer instead of forced convection heat transfer using a blower fan. There is no need for power and maintenance, and there are advantages that are not found in forced convection in terms of noise and vibration.

  As shown in FIG. 10, the film substrate 160 connected to the liquid crystal display panel 110 and the driving IC 170 mounted on the film substrate 160 are moved leeward of the liquid crystal display panel 110 with respect to the cooling fan. If it is disposed on the side, there is a possibility that the liquid crystal display panel 110 may be hindered. In this respect, it is advisable to devise such as providing a ventilation hole in the frame 140 or the fixing plate surrounding the liquid crystal display panel 110 so as not to obstruct the passage of the cooling air. Alternatively, the film substrate 160 and the driving IC 170 mounted on the film substrate 160 may be disposed on the windward side of the liquid crystal display panel 110 with respect to the wind of the cooling fan. In this case, even if the cooling air is blocked by the liquid crystal display panel 110, the cooling can be performed because the cooling air has already been applied to the driving IC 170.

<Second Embodiment; Modification>
FIG. 11 is a diagram illustrating a modification of the board module 102 on which the reinforcing plate 180 of the second embodiment is mounted. Also in the second embodiment, various aspects can be adopted as in the modification of the first embodiment.

  For example, in order to perform the function of reinforcing the connector insertion terminal portion 164 with the reinforcement plate 180a while allowing the connector insertion terminal portion 164 to be inserted into the connector insertion portion 194 of the connector 192, the portion of the reinforcement plate 180a is: Similar to the first embodiment, it is desirable that the size of the connector insertion terminal portion 164 of the film substrate 160 is substantially the same. That is, as shown in each drawing of FIG. 11, it is desirable that the width W180a of the reinforcing plate 180a that reinforces the connector insertion terminal portion 164 is substantially the same as the width W160a of the film substrate 160 of the corresponding portion. .

  On the other hand, the reinforcing plate 180b only needs to fulfill the function of shielding the driving IC 170, and as long as this is the case, various shapes and materials can be employed as in the first embodiment. For example, in the substrate module 102 of the first example shown in FIG. 11A corresponding to FIG. 6A, the width W180b of the reinforcing plate 180b that shields the driving IC 170 is larger than the width W160b of the film substrate 160 of the corresponding portion. It is in a narrow state. On the other hand, in the substrate module 102 of the second example shown in FIG. 11B corresponding to FIG. 6B, the width W180b of the reinforcing plate 180b that shields the driving IC 170 is the same as the width of the film substrate 160 of the corresponding part. It is in the state.

  Similarly to the first embodiment, in the case of the substrate module 102 of the first example, the load can be reduced in the film substrate punching process when the substrate module 102 is manufactured. As described above, in the case of the substrate module 102 of the second example, the portion of the film substrate 160 inside the punching line 262 is cut by the punching line 262 shown by a dotted line in FIG. The remaining portion 264 except for the punching is punched and dropped, and at the same time, the entire reinforcing plate 180 formed with the slit 182 is punched, so that both the reinforcing plate 180a and the reinforcing plate 180b can be punched and divided.

  Further, in the board module 102 of the third example shown in FIG. 11C corresponding to FIG. 6C, the reinforcing plates 180a and 180b are formed of the same material, but the connector insertion terminal The portion of the reinforcing plate 180a that reinforces the portion 164 and the portion of the reinforcing plate 180b that shields the driving IC 170 are colored in different colors. The coloring relationship between the reinforcing plate 180a and the reinforcing plate 180b is the same as that in the third example of the first embodiment, and the coloring b of the reinforcing plate 180b is more black than the coloring a of the reinforcing plate 180a. It is important to color the white or the like with good light blocking properties, and the effects obtained thereby are the same as in the third example of the first embodiment.

  Here, regarding the reinforcing plate 180 having the same shape as the first example shown in FIG. 11A, the coloring of the reinforcing plate 180a and the reinforcing plate 180b is different, but the second example shown in FIG. 11B. The reinforcing plate 180 having the same shape as that of the reinforcing plate 180a and the reinforcing plate 180b may be colored differently.

  In addition, the substrate module 102 of the fourth example shown in FIG. 11D corresponding to FIG. 6D is characterized in that a metal material that does not easily transmit visible light is used as the reinforcing plate 180. . As the metal material, the same material as in the fourth example of the first embodiment can be used.

<Outline of manufacturing method>
FIG. 12 is a flowchart summarizing an outline of a method for manufacturing the substrate module 102 of the first embodiment and the second embodiment described above.

  In the semiconductor device mounting process, on the wider film substrate 260 including the finished substrate module 102, the disposition location is located further outward than the outer edge of the frame 140 or the like that supports the liquid crystal display panel 110. The driving IC 170 is mounted on (S1).

  Next, prior to mounting the reinforcing plate on the film substrate 260 including the portion of the film substrate 160, the form of the reinforcing plate to be mounted delivered by the manufacturer is the one for the substrate module 102 of the first embodiment. The processing is divided depending on whether it is for the substrate module 102 of the second embodiment. Specifically, it is determined whether the reinforcing plate 180a and the reinforcing plate 180b are an inseparable integral, an integral but separable, or whether they are delivered separately. (S10).

  In the case where the reinforcing plate 180a and the reinforcing plate 180b are inseparable and integral, it is for the board module 102 of the first embodiment. Therefore, in the reinforcing plate pasting process, the portion of the reinforcing plate 180a is the connector. The integral reinforcing plate 180 is affixed on the non-mounting surface 160b of the film substrate 260 so that it becomes a predetermined position of the insertion terminal portion 164 and a portion of the reinforcing plate 180b corresponds to the driving IC 170 (S10-). Inseparable, S20). Since each of the reinforcing plates 180a and 180b is an integral reinforcing plate 180, both are attached at the same time.

  Further, when the reinforcing plate 180a and the reinforcing plate 180b are separated and delivered in advance, the reinforcing plate 180a is for the board module 102 of the second embodiment. On the non-mounting surface 160b of the film substrate 260 so that the portion is a predetermined position of the connector insertion terminal portion 164 and the portion of the reinforcing plate 180b is a position corresponding to the driving IC 170. 180b is pasted at the same time (S10-separate, S22).

  In addition, when the reinforcing plate 180a and the reinforcing plate 180b are integrated but separable, a perforation or a V-cut is further provided between the reinforcing plate 180a and the reinforcing plate 180b. It is judged whether it is easily separable immediately before the cage pasting process or whether it is separable in the film substrate punching process since a slit 182 is provided between the reinforcing plate 180a and the reinforcing plate 180b ( S10-separable, S12).

  If it can be easily separated immediately before the attaching step, it is separated into reinforcing plates 180a and 180b immediately before the reinforcing plate attaching step (S12-before attaching step, S14), and separated in the reinforcing plate attaching step. On the non-mounting surface 160b of the film substrate 260, the reinforcing plate 180a is a predetermined position of the connector insertion terminal portion 164 and the separated reinforcing plate 180b is a position corresponding to the driving IC 170. The reinforcing plates 180a and 180b are attached at the same time (S22).

  On the other hand, when the reinforcing plate 181 is separable in the film substrate punching step, the reinforcing plate 180a remains the integral reinforcing plate 181 in the reinforcing plate attaching step, and the portion of the reinforcing plate 180a is a predetermined portion of the connector insertion terminal portion 164. The integrated reinforcing plate 180 is affixed on the non-mounting surface 160b of the film substrate 260 so that the position of the reinforcing plate 180b corresponds to the driving IC 170 (S12—punching step, S26). Since each of the reinforcing plates 180a and 180b is an integrated reinforcing plate 181, both are attached at the same time.

  In the film substrate punching step after the reinforcing plate pasting step, the remainder of the film substrate 160 is removed by punching the film substrate 260 with the auxiliary reinforcing plates 180a and 180b pasted at predetermined positions along the punching line 262. The remaining portion 264 other than the region forming the substrate module 102 is separated from the wider film substrate 260 including the region forming the substrate module 102 by knocking down the portion 264 (S30).

  As a result, the substrate module 102 on which the driving IC 170 and the two reinforcing plates 180a and 180b are mounted as an integrated or separated state is formed on the film substrate 160 (S34). At this time, in the case of the integral reinforcing plate 181 that can be separated in the film substrate punching step, the remaining portion 264 is simultaneously punched (S32). Therefore, after punching, the reinforcing plate 181 is automatically separated into the reinforcing plate 180a and the reinforcing plate 180b.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. Various changes or improvements can be added to the above-described embodiment without departing from the gist of the invention, and embodiments to which such changes or improvements are added are also included in the technical scope of the present invention.

  Further, the above embodiments do not limit the invention according to the claims (claims), and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. Absent. The embodiments described above include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. Even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, as long as an effect is obtained, a configuration from which these some constituent requirements are deleted can be extracted as an invention.

  In particular, regarding the forming material, size, shape, etc. of the reinforcing plate, as long as the reinforcing plate that reinforces the connector insertion terminal portion and the reinforcing plate that shields the semiconductor device are made of the same material, it has been described above. It is not limited to the embodiment.

  In the above embodiment, an example of application to a liquid crystal display device used in a three-plate type liquid crystal projector device in which a monochrome liquid crystal panel is provided for each of the B, R, and G optical paths has been described. , G can also be applied to a liquid crystal display device used in a single-plate liquid crystal projector device configured using a single liquid crystal display device including three color filters.

  In addition, the substrate module itself provided with a semiconductor device and a reinforcing plate for shielding the semiconductor device on the film substrate is not limited to the application example to the liquid crystal display device, and can be applied to other display devices. The target device to which the flexible substrate is connected is not limited to a display device, and may be any device. For example, the flat display panel is not limited to a liquid crystal panel, but is another flat display panel such as an EL (Electro-Luminescence) display panel, a PDP (Plasma Display Panel) display panel, an FED (Field Emission Display) panel, etc. Also good.

  In addition, an example in which a drive circuit as a semiconductor device is mounted on a board module, which is an example of a circuit board, and the circuit board is connected to a flat display panel is shown. A semiconductor device is mounted on a flexible substrate, and a reinforcing plate of the same material as the reinforcing plate that reinforces the connector insertion terminal is pasted on the substrate surface at the corresponding position on the opposite side where the semiconductor device is mounted. The semiconductor device is not limited to the one for the drive circuit, and may be at least one for the image signal processing circuit or another circuit.

  In addition to projectors, electronic devices incorporating display devices include, for example, liquid crystal televisions, viewfinder type / monitor direct-view type video tape recorders, car navigation devices, portable information devices such as electronic notebooks, calculators, and word processors. , Notebook computers, workstations, mobile phones, watches, pagers, videophones, POS (Point Of Sales) terminals, devices equipped with touch panels, and the like. The structures described in the above embodiments are included in these various electronic devices. It is possible to apply a display device mounted with a substrate module having

It is the figure which showed schematic structure of the optical system in the liquid crystal projector device comprised using the liquid crystal display device which is an example of the display apparatus main body which concerns on this invention. It is a figure which shows schematic structure of the liquid crystal display part which is an example of the display apparatus main body which concerns on this invention. It is sectional drawing in the position along line PP drawn to FIG. 2 (A). It is another figure explaining schematic structure of the liquid crystal display part which is an example of the display apparatus main body which concerns on this invention. It is a figure which shows a comparative example. FIG. 6 is a structural diagram illustrating a modified example of the board module on which the reinforcing plate of the first embodiment is mounted. It is a figure explaining the manufacturing method of the modification of the board | substrate module with which the reinforcement board of 1st Embodiment was mounted. It is a structural diagram explaining the basic structure of 2nd Embodiment of a reinforcement board. It is a figure explaining the manufacturing method of the board | substrate module with which the reinforcement board of 2nd Embodiment was mounted. It is a figure which shows the example of mounting mode to the liquid crystal projector device of a liquid crystal display part. It is a figure explaining the modification of the board | substrate module with which the reinforcement board of 2nd Embodiment was mounted. It is the flowchart which summarized the outline | summary of the method of manufacturing the board | substrate module of 1st Embodiment and 2nd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal projector device, 3 ... Optical system, 5 ... Light source, 7 ... Projection optical system, 9 ... Optical member group, 76 ... Liquid crystal display part, 102 ... Substrate module, 110 ... Liquid crystal display panel, 112 ... TFT substrate, 113 DESCRIPTION OF SYMBOLS ... Opposite substrate, 120 ... Cover glass, 140 ... Frame, 150 ... Light shielding plate, 160 ... Film substrate, 162 ... Panel side end portion, 164 ... Connector insertion terminal portion, 170 ... Driving IC, 180, 181 ... Reinforcing plate , 180a ... reinforcing plate (contact terminal reinforcing member), 180b ... reinforcing plate (light shielding member), 182 ... slit, 184 ... connecting portion, 190 ... mounting substrate, 192 ... connector, 194 ... connector insertion portion, 260 ... film substrate 262 ... Punching line, 264 ... Remaining part

Claims (13)

A circuit board connected to a predetermined member such as a display device,
A flexible substrate;
A wiring board having a wiring layer provided on the substrate;
A semiconductor device that is electrically connected to the wiring layer and mounted on the wiring board so that the disposition location is located further outward than the outer edge of the support member that supports the predetermined member;
Other apparatus provided on a non-mounting surface opposite to the surface on which the semiconductor device is mounted on the base material and patterned in the vicinity of an end different from the end connected to the predetermined member A contact terminal reinforcing member for reinforcing the contact terminal connected to
A light shielding member that is provided at a position corresponding to a region where the semiconductor device is mounted on the non-mounting surface and is made of the same material as the contact terminal reinforcing member, and shields the semiconductor device. Circuit board to do. The circuit board according to claim 1, wherein the contact terminal reinforcing member and the light shielding member are integrally formed. The circuit board according to claim 1, wherein the contact terminal reinforcing member and the light shielding member are separated at a predetermined interval. The circuit board according to claim 1, wherein the light shielding member is in a state of covering an outer side further than an outer edge of the semiconductor device. Manufacturing a flexible circuit board on which a semiconductor device is mounted and connected to the predetermined member so that the disposition location is located further outward than the outer edge of a support member that supports the predetermined member such as a display device A way to
Mounting the semiconductor device on a wider base material including a region forming the circuit board so that a disposition location is located further outward than an outer edge of a support member supporting the predetermined member; ,
Reinforcing a contact terminal connected to another device, which is patterned on a wider base including an area forming the circuit board and in the vicinity of an end different from the end connected to the predetermined member An integrated member in which a portion of a contact terminal reinforcing member for light shielding and a portion of a light shielding member for shielding light from the semiconductor device made of the same material as the contact terminal reinforcing member are connected inseparably Mounting on a surface opposite to the surface on which the device is mounted;
Separating the region other than the region forming the circuit board from a wider base material including the region forming the circuit board. Manufacturing a flexible circuit board on which a semiconductor device is mounted and connected to the predetermined member so that the disposition location is located further outward than the outer edge of a support member that supports the predetermined member such as a display device A way to
Mounting the semiconductor device on a wider base material including a region forming the circuit board so that a disposition location is located further outward than an outer edge of a support member supporting the predetermined member; ,
On a wider base material including a region forming the circuit board, on a wider base material including a region forming the circuit board, and near an end different from an end connected to the predetermined member A contact terminal reinforcing member for reinforcing a contact terminal connected to another device, and a light shielding member for shielding the semiconductor device made of the same material as the contact terminal reinforcing member. Mounting an integral member that is detachably connected to a portion on a surface opposite to the surface on which the semiconductor device is mounted;
Separating the region other than the region forming the circuit board from a wider base material including the region forming the circuit board. As an integral member connected in a separable manner, a slit for separating the contact terminal reinforcing member portion and the light shielding member portion is formed in the region of the circuit board, and other than the region forming the circuit board. The manufacturing method according to claim 6, wherein a connecting portion that connects the contact terminal reinforcing member and the light shielding member is formed in a region. A flexible base material, a wiring board having a wiring layer provided on the base material, and a wider base material including a region forming a circuit board, where an arrangement place is a predetermined member such as a display device A semiconductor device mounted so as to be located further outward than the outer edge of the support member that supports the semiconductor device, on a side opposite to the surface on which the semiconductor device is mounted on a wider base including a region forming the circuit board Contact terminal reinforcing member that is provided on a non-mounting surface and that reinforces a contact terminal connected to another device patterned in the vicinity of an end portion different from a device-side end portion connected to the predetermined member, and the non-mounting state A circuit board provided with a light shielding member that shields the semiconductor device made of the same material as the contact terminal reinforcing member provided at a position corresponding to a region where the semiconductor device is mounted on a surface;
And a predetermined device connected at the device side end of the circuit board. The apparatus according to claim 8, wherein the predetermined device has a display function. The device according to claim 9, wherein the device having the display function is a liquid crystal panel having a pair of opposing substrates and a liquid crystal sealed between the pair of substrates. A flexible base material, a wiring board having a wiring layer provided on the base material, and a wider base material including a region forming a circuit board, where an arrangement place is a predetermined member such as a display device A semiconductor device mounted so as to be located further outward than an outer edge of a support member for supporting the substrate, and provided on a non-mounting surface on the opposite side to the surface on which the semiconductor device is mounted on the base material A contact terminal reinforcing member that reinforces a contact terminal connected to another device patterned in the vicinity of an end portion different from the device side end portion connected to the member, and the semiconductor device on the non-mounting surface is mounted A circuit board provided with a light shielding member that shields the semiconductor device made of the same material as the contact terminal reinforcing member, and is connected to the device side end of the circuit board. A device body having a predetermined device,
An electronic device comprising: a connection connector electrically connected by the contact terminal of the circuit board. The electronic device according to claim 11, wherein the predetermined device is a liquid crystal panel having a pair of opposing substrates and a liquid crystal sealed between the pair of substrates. On the circuit board, the contact terminal reinforcing member and the light shielding member are separately arranged with a predetermined interval,
The electronic device according to claim 11, wherein the circuit board is bent between the contact terminal reinforcing member and the light shielding member.

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