KR102670700B1 - Apparatus for checking of COF appearance with scale variability - Google Patents

Abstract

The present invention relates to a chip-on-film inspection device, and more specifically, to a technology that can perform an external inspection of a chip-on-film by acquiring inspection images at various magnifications through a single optical system.
A chip-on-film inspection device with a variable magnification function according to the present invention includes a main body, a transfer unit installed on one side of the main body and transporting a chip-on-film (COF) with a test target chip mounted on the bottom in one direction, and the chip-on film An imaging unit is installed at the top of one side of the moving path of the film and acquires multiple inspection images by photographing the chip-on-film at different magnifications, and controls the transport unit, imaging unit, and lighting unit to control the chip-on-film when it is stopped moving. It is comprised of an inspection control unit that collects a low-magnification first inspection image and a high-magnification second inspection image taken from the imaging unit and uses them to inspect the external condition of the chip-on film, and the imaging unit is located at the upper part of the chip-on film. A camera that photographs the inspection area containing the chip to be inspected, a view angle adjustment motor for adjusting the camera height, a camera bracket that has a length of a certain height and provides an optical path for the camera fixedly placed on the upper surface, and the view angle adjustment motor. An angle of view adjustment means including a rod-shaped camera bracket transfer unit that moves the camera bracket up and down in response to the rotation of the camera, a lens disposed below the camera to set focus, and a focus control motor for adjusting the lens height, A focus control unit including a lens bracket that has a certain height and provides an optical path for a lens fixedly coupled to the bottom, and a lens bracket transfer unit that moves the lens bracket in the up and down direction within the camera bracket in response to rotation of the focus control motor. It is characterized by comprising a means and an illumination means disposed below the focus adjustment means to irradiate illumination light to a preset photographing position under the control of an inspection control unit.

Description

Chip-on-film inspection device with variable magnification function {Apparatus for checking of COF appearance with scale variability}

The present invention relates to a chip-on-film inspection device, and more specifically, to a technology that can perform an external inspection of a chip-on-film by acquiring inspection images at various magnifications through a single optical system.

In general, Chip On Film (COF) is a film-shaped circuit board that has multiple holes (sprocket holes) formed in a row on the top and bottom, can use a thin board, and has a pitch (between leads). As the distance) can be made more detailed, the demand for it as a material for lightness and simplicity in the field of communication devices such as mobile phones is rapidly increasing.

Conventionally, COF products are manufactured in the form of a long film and then inspected for defects through appearance inspection and electrical property evaluation before being shipped out. Testing is done through electrical property evaluation.

However, with the recent miniaturization and high integration of COFs, there are cases where COFs that were judged good through appearance inspection and electrical characteristic evaluation are judged to be defective during the aging test process, and precise appearance inspection of COFs is required.

Precise external inspection of these COFs is mostly done through visual inspection, so the inspection process takes a lot of time, making it impossible to inspect all of them. Not only does the inspection result vary depending on the skill level of the inspection personnel, but labor costs are added as a result. There were concerns that manufacturing costs would rise.

Accordingly, a method of performing an external inspection of the COF(F) using a first inspection image taken at low magnification and a second inspection image taken at high magnification through a camera has been proposed and is being used.

Figure 1 is a COF automatic appearance inspection device using a conventional camera, which includes first and second imaging devices 10 and 20 installed above the movement path of the COF (F) to photograph the inspection area of the COF (F); It includes a transfer unit 30 that transfers the COF (F) in one direction through a pair of reels (L1, L2) installed on both sides of the main body.

At this time, the first and second imaging devices (10, 20) photograph the inspection area of the COF (F) at different magnifications, and the first imaging device (10, Camera1) photographs a wide area at low magnification to perform the first inspection. The image (I1) is acquired, and the second photographing device (20, Camera2) zooms in and photographs the inspection target chip area at high magnification to obtain the second inspection image (I2).

Meanwhile, the COF (F) is composed of a chip (C) to be inspected on a wiring board (SR) as shown in FIG. 2, and the first inspection image at low magnification is a first inspection area including the wiring board (SR). Vision1), and the second inspection image at high magnification is an image of the second inspection area (Vision2) including the inspection target chip (C), and the COF automatic appearance inspection device using a camera uses the first inspection image to control the wiring board (Vision2). SR) surface is inspected, and the top of the inspection target chip (C) is inspected using the second inspection image.

That is, the COF automatic appearance inspection device using a conventional camera uses the first and second inspection images obtained through the first and second imaging devices 10 and 20 fixed at different magnifications to determine the COF (F). ) perform an overall visual inspection.

However, the first and second imaging devices 10 and 20 are devices having the same components, and only their imaging magnifications are set differently. Therefore, installation costs above a certain level are required due to the provision of multiple imaging devices having the same components. do.

In addition, in these two optical system structures, the process of moving the COF (F) a certain distance and then stopping it for the second high-magnification shooting after the first low-magnification shooting is essential. Due to the repetition of the operation of moving and then stopping the COF (F), many There is a problem that inspection efficiency is reduced due to the inspection time required.

In addition, in Figure 2, the height of the inspection target chip (C) may vary depending on the type, and the magnification of the second imaging device 20 must be adjusted when inspecting the appearance of the COF (F) including the inspection target chip (C) of different heights. There is the inconvenience of having to reset it yourself.

1. Korean Patent No. 1183179 (Name: ｃｏｆ appearance inspection method using a laser 3D measuring device)

Accordingly, the present invention was created in consideration of the above circumstances. By acquiring COF inspection images of various magnifications through an optical system that can adjust the camera angle of view and lens focus, various COF appearance inspections requiring different magnifications can be performed. The technical purpose is to provide a chip-on-film inspection device with a variable magnification function that allows for faster processing.

According to one aspect of the present invention for achieving the above object, a main body, a transfer unit installed on one side of the main body and transporting a chip-on-film (COF) with a test target chip mounted on the bottom in one direction, the chip-on film An imaging unit is installed at the top of one side of the moving path of the chip-on-film and acquires multiple inspection images by photographing the chip-on-film at different magnifications, and controls the transport unit, imaging unit, and lighting unit to capture images while the chip-on-film is stopped moving. It is composed of an inspection control unit that collects a low-magnification first inspection image and a high-magnification second inspection image taken from the unit and uses them to inspect the external condition of the chip-on film, and the imaging unit is located at the top of the chip-on film. A camera for photographing the inspection area containing the chip to be inspected, a view angle adjustment motor for adjusting the camera height, a camera bracket that has a length of a certain height and provides an optical path for the camera fixedly placed on the upper surface, and the view angle adjustment motor An angle of view adjustment means including a rod-shaped camera bracket transfer unit that moves the camera bracket up and down in response to rotation, a lens disposed below the camera to set focus, a focus control motor for adjusting the lens height, and a constant A focus control means including a lens bracket that has a height and provides an optical path for a lens fixedly coupled to the lower surface, and a lens bracket transfer unit that moves the lens bracket in the up and down direction within the camera bracket in response to rotation of the focus control motor. And, a chip-on-film inspection device with a variable magnification function is provided, comprising an illumination means disposed below the focus control means and irradiating illumination light to a preset shooting position under the control of the inspection control unit. .

In addition, the lighting means includes a coaxial lighting disposed on the upper side of the chip-on film and a backlight disposed on the lower side of the chip-on film, and the coaxial lighting is variable magnification, characterized in that it irradiates red light to the shooting position. A chip-on-film inspection device having a function is provided.

In addition, the lighting means further includes a side light that irradiates illumination light with a certain inclination angle from the upper side of the chip-on film, and the inspection control unit provides coaxial lighting, side lighting, and backlight for each shooting environment at different magnifications. Chip-on-film inspection with variable magnification function, characterized by acquiring a plurality of inspection images corresponding to a combination of lighting, selecting inspection images of a preset lighting combination for each inspection item, and performing an external inspection of the chip-on film. A device is provided.

In addition, a chip-on film inspection device with a variable magnification function is provided, wherein the lighting means irradiates illumination light with a brighter brightness level in a low-magnification shooting environment than in a high-magnification shooting environment.

In addition, the inspection control unit has a first shooting mode for acquiring a low-magnification inspection image in a low-magnification shooting environment and then changing to a high-magnification shooting environment to obtain a high-magnification inspection image, and a first shooting mode for acquiring a high-magnification inspection image in a high-magnification shooting environment and then changing to a low-magnification shooting environment for low-magnification inspection. A chip-on-film inspection device with a variable magnification function is provided, characterized in that the second shooting mode for acquiring images is alternately controlled on an inspection area basis.

In addition, the imaging unit is configured to further include a tension state detection unit at a position where the chip on film is transferred, wherein the tension state detection unit has a cube-shaped housing with an empty interior, and is formed on one side of the housing to detect a chip inside the housing. A film inflow slit for introducing the on-film, a film outflow slit formed on the other side of the housing where the film inlet slit is formed, and a film outflow slit for flowing out the chip-on film to the outside of the housing, and disposed on the upper and lower sides of the film inlet slit, respectively, to form a chip-on slit. It is configured to include first and second distance sensors that measure the distance value to the film, and the inspection control unit detects first and second distance sensors through the first and second distance sensors while the movement of the chip-on film is stopped. A chip-on film inspection device with a variable magnification function is provided, which collects distance values and corrects the moving height of the camera and lens of the imaging unit based on the difference between the first distance value and the second distance value.

In addition, the tension state detection unit further includes third and fourth distance sensors that are disposed on the upper and lower sides of the film outflow slit and measure the distance value from the chip-on film, and the inspection control unit detects the chip-on film. A first average value of the first and third distance values, which are distance values for the upper side of the film, and a second average value for the second and fourth distance values, which are distance values for the lower side of the chip-on film, are calculated, respectively, and the first and A chip-on film inspection device with a variable magnification function is provided, characterized in that it corrects the moving height of the camera and lens based on the difference between the two average values.

According to the present invention, various inspection items for COF can be quickly inspected by acquiring COF images of various magnifications through a single optical system that can adjust the camera angle of view and lens focus. In particular, when two optical systems are provided on the main body as in the past, COF appearance inspection is possible more quickly than before.

In addition, the present invention enables external inspection of COF(F) using at least one variable magnification optical system, and additionally arranges imaging equipment such as a line scan camera or bottom camera in the remaining space to perform a better inspection on a single inspection equipment. It is possible to perform a variety of COF(F) tests.

In addition, the present invention adjusts the height of the camera and lens based on the current position of the COF (F) measured through the tension state detection unit, thereby providing an inspection image with accurate focus at all times regardless of the tension state of the COF (F). A more reliable COF(F) appearance inspection is possible.

Figure 1 is a diagram showing the schematic configuration of a COF automatic appearance inspection device using a conventional camera.
Figure 2 is a diagram for explaining the inspection area of COF(F).
Figure 3 is a diagram showing a schematic configuration of a chip-on-film inspection device with a variable magnification function according to the first embodiment of the invention.
Figure 4 is a diagram for explaining in more detail the structure of the imaging unit 300 shown in Figure 3.
Figure 5 is a diagram showing images acquired using white light and red light used as general coaxial lighting in the COF inspection device according to this embodiment.
Figure 6 is a block diagram showing the internal structure of the inspection control unit 400 shown in Figure 3, separated functionally.
FIG. 7 is a diagram illustrating the positions of the camera 311 and lens 321 in a low-magnification imaging environment of the imaging unit 300 shown in FIG. 3 and the positions of the camera 321 and lens 321 in a high-magnification imaging environment. .
Figure 8 is a diagram for explaining a chip-on-film inspection device with a variable magnification function according to a second embodiment of the present invention.
Figure 9 is a diagram for explaining in more detail the configuration of the tension state detection unit 350 shown in Figure 8.
Figure 10 is a diagram illustrating another embodiment of a chip-on-film inspection device with a variable magnification function according to the present invention.

The embodiments described in the present invention and the configurations shown in the drawings are only preferred embodiments of the present invention and do not express the entire technical idea of the present invention. Therefore, the scope of rights of the present invention is limited to the embodiments and drawings described in the text. It should not be construed as limited by. In other words, since the embodiment can be modified in various ways and can have various forms, the scope of rights of the present invention should be understood to include equivalents that can realize the technical idea. In addition, the purpose or effect presented in the present invention does not mean that a specific embodiment must include all or only such effects, so the scope of the present invention should not be understood as limited thereby.

All terms used herein, unless otherwise defined, have the same meaning as commonly understood by a person of ordinary skill in the field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as consistent with the meaning they have in the context of the related technology, and cannot be interpreted as having an ideal or excessively formal meaning that is not clearly defined in the present invention.

Figure 3 is a diagram showing the schematic configuration of a chip-on-film inspection device with a variable magnification function according to the first embodiment of the invention.

Referring to Figure 3, the chip-on-film inspection device with variable magnification function according to the present invention is comprised of a main body 100, a transfer unit 200, an imaging unit 300, and an inspection control unit 400. . Figure 3 illustrates the arrangement of two imaging units 300 having the same structure.

The main body 100 is formed in a substantially rectangular frame shape, and provides an installation area for each component described later and serves to support them.

The transfer unit 200 serves to transfer the chip-on-film (hereinafter referred to as 'COF') in one direction, and a reel-to-reel method is used to transfer the film-type COF (F) in one direction. Accordingly, the transfer unit 20 includes a pair of reels installed on one side of the main body 10 to be spaced apart from each other, and as the reel located at the rear end in the transfer direction of the COF (F) among the pair of reels rotates, the COF (F) ) is transported in one direction while maintaining a constant tension.

The imaging unit 300 is installed on one side of the main body 100, above the moving path of the COF (F), and photographs the COF (F) in a stopped state at different magnifications under the control of the inspection control unit 400. Thus, a plurality of different inspection images are obtained. At this time, the imaging unit 300 acquires a first inspection image (I1) at low magnification and a second inspection image (I2) at high magnification, and the first and second inspection images (I1, I2) are in a plurality of different lighting environments. It can be made up of inspection images.

The inspection control unit 400 controls the operation of the transfer unit 200 and the imaging unit 300 to collect the first inspection image at low magnification and the second inspection image at high magnification taken from the imaging unit, and uses these to produce a chip-on-film Inspect the external condition of (F).

At this time, the inspection control unit 400 transfers the chip-on-film (F) through the transfer unit 200, and the inspection area of the chip-on-film (F) where the inspection target chip is placed is stopped at the capturing position of the imaging unit 300. control to change the camera position by controlling the imaging unit 300 while the chip-on film (F) is stopped in transport, and then change the lens position to correspond to the changed camera position to output an inspection image of the desired magnification. Set up a shooting environment that can be used.

FIG. 4 is a diagram for explaining in more detail the structure of the imaging unit 300 shown in FIG. 3.

Referring to Figure 4, the imaging unit 300 basically includes a view angle adjusting means 310 that changes the up and down position of the camera, a focus adjusting means 320 that changes the up and down position of the lens, and outputs illumination light to the shooting position. It includes a lighting means 330 that does. At this time, the imaging unit 300 is configured to form an optical path while the camera, lens, and lighting are optically coaxial in correspondence to the capturing position.

First, the angle of view adjustment means 310 includes a camera 311 for photographing the inspection area including the inspection target chip from the upper part of the COF (F), and a view angle adjustment motor for adjusting the vertical position, that is, the height, of the camera 311. (312), a camera bracket 313 that has a length of a certain height and provides an optical path for the camera 311 fixedly placed on the upper surface, and a camera bracket 313 in response to the rotation of the angle of view adjustment motor 312. It is comprised of a rod-shaped camera bracket transfer unit 314 that transfers in the vertical direction.

At this time, the camera bracket 313 is formed in a “ㄷ” shape, the camera 311 is fixedly coupled to the upper surface of the camera bracket 313, and the camera bracket transfer unit 314 is fastened to the side to enable transfer. In addition, a through hole of a certain diameter is formed in the central portion of the upper and lower surfaces of the camera bracket 313 to secure an optical path for the camera 311 disposed on the upper surface of the camera bracket 313.

The camera bracket transfer unit 314 includes a transfer body 314a that is fixedly connected to the camera bracket 313, and a guide 314b that is formed in the shape of a rectangular bar with a certain length and is fastened to move up and down with the transfer body 314a. It is composed including. At this time, the angle of view adjustment motor 312 is disposed on one side of the camera bracket transfer unit 314, and Figure 4 illustrates the shape of the angle of view adjustment motor 312 disposed on the lower surface of the camera bracket transfer unit 314. .

The focus control means 320 includes a lens 321 located on the lower side of the camera 311 and setting the focus of the camera 311, and a focus control motor 322 for adjusting the vertical position, that is, the height, of the lens 321. ), a lens bracket 323 that has a certain height and provides an optical path for the lens 321 fixedly coupled to the lower surface, and the lens bracket 323 is connected to the camera bracket 313 in response to the rotation of the focus control motor 322. ) and includes a lens bracket transfer unit 324 that transfers the lens in the vertical direction.

At this time, the lens bracket 323 is formed in a "ㄷ" shape, the lens 321 is fixedly coupled to the bottom of the lens bracket 323, and the lens bracket transfer unit 324 is installed on the side of the camera bracket 313. It is fastened so that it can be transported in the vertical direction from the inside.

In addition, through holes of a certain diameter are formed in the centers of the upper and lower surfaces of the lens bracket 323 to secure an optical path between the lens 321 and the camera 313 disposed on the lower surface of the lens bracket 323.

The illumination means 330 is disposed below the focus control means 320 and serves to irradiate illumination light to a preset shooting position under the control of the inspection control unit 400, and is disposed at the upper part of the COF (F). It includes coaxial lighting 331 and a backlight 332 disposed below the COF (F).

At this time, the coaxial lighting 331 is installed coaxially with the light source that outputs a certain illumination light under the control of the inspection control unit 400 and the lens 321, and passes some of the light irradiated from the light source, as well as the light irradiated from the light source. It is configured to include a half mirror that allows light to be irradiated to the shooting position by reflecting part of it to an area corresponding to the shooting position.

Additionally, the backlight 332 serves to provide background light by irradiating light from the bottom of the COF (F) toward the COF (F). At this time, the backlight 332 can provide illumination light of various colors depending on the environment, and in this embodiment, white light is preferably used.

In addition, although not shown, the lighting unit 330 may be additionally provided with side lighting around the coaxial lighting 331, and the coaxial lighting 331 and the side lighting are provided with red LEDs that emit red light, so that the lighting unit 330 emits red light as illumination light. can be investigated. In the case of red light, the transmittance to a film made of polyimide material is high, which has the effect of greatly improving noise and contrast in the image.

Figure 5 shows images acquired using white light and red light, which are used as general coaxial lighting in the COF inspection device according to this embodiment. (a) is an image acquired using white illumination light, and (b) is an image acquired using red illumination light. .

For bonding inspection of COF(F), the inspection is performed with the chip facing downwards, and the illumination light passes through the film, is reflected in the shooting area, and enters the camera. However, looking at the image in Figure 5 (a), the image acquired using white illumination light has a high possibility of inspection errors due to the noise component due to the polyimide film surface, whereas the image acquired using red illumination light has a high possibility of occurrence of inspection errors due to the polyimide material film surface. It can be seen that the noise component due to the film surface is relatively much smaller, and an image with high contrast of red light can be obtained, further improving inspection accuracy.

FIG. 6 is a block diagram showing the internal structure of the inspection control unit 400 shown in FIG. 3 in functional isolation.

Referring to Figure 6, the inspection control unit 400 includes a COF transfer block 410, a shooting environment setting block 420, and an inspection processing block 430.

The COF transfer block 410 controls the rear reel of the transfer unit 200 to move in one direction with a constant COF(F)DL tension, and the inspection area where the inspection target chip is placed is the imaging unit 300. When the shooting position is reached, the transfer is stopped. At this time, the COF transfer block 410 recognizes that the inspection area has reached the imaging position based on the distance between the inspection target chips placed in the COF (F), or recognizes the marker (not shown) displayed on the COF (F). In this way, it can be recognized that the inspection area has reached the shooting position.

In a state where the movement of the COF (F) is stopped, the shooting environment setting block 420 controls the angle of view adjustment means 310 to position the camera 311 at a height corresponding to the preset magnification, and the focus adjustment means 320 ) is controlled to set the height of the lens 321 to correspond to the camera 311 of the corresponding height to focus the camera, and by driving the lighting means 330 to radiate illumination light to the shooting position, a shooting environment with a preset magnification is created. Set it.

In more detail, the shooting environment setting block 420 supplies a driving signal corresponding to the camera movement height to the angle of view control motor 312. The field of view control motor 312 rotates according to the drive signal, and the transfer body 314a of the camera bracket transfer unit 314 is kept constant on the guide 314b in correspondence to the rotation direction and number of rotations of the view angle control motor 312. moves to height. Accordingly, the height of the camera bracket 313 fixed to the transfer body 314a of the camera bracket transfer unit 314 is varied, thereby changing the height of the camera 311 disposed on the upper surface of the camera bracket 313.

In addition, when the height of the camera 311 is moved to correspond to the desired magnification, the shooting environment setting block 420 supplies a driving signal corresponding to the camera movement height to the focus control motor 322. The focus control motor 322 rotates according to the drive signal, and the lens bracket transfer unit 334 is moved to a certain height in correspondence to the rotation direction and number of rotations of the focus control motor 322. Accordingly, the height of the lens bracket 323 fastened to the lens bracket transfer unit 324 is varied, thereby changing the height of the lens 321 disposed on the lower surface of the lens bracket 323.

In addition, the shooting environment setting block 420 sets the height of the inspection target chip (C) to obtain a high-magnification inspection image for the inspection target chip (C) area (second inspection area (vision 2) in FIG. 2) having a certain height. Based on this, the focus position can be varied by setting the height of the lens 321 higher. At this time, environmental setting information corresponding to the camera movement height and lens movement height for each preset magnification is stored in advance in the shooting environment setting block 420, and the shooting environment can be set based on this.

Figure 7 illustrates the positions of the camera 311 and the lens 321 in a low-magnification photographing environment of the imaging unit 300 and the positions of the camera 321 and the lens 321 in a high-magnification photographing environment. As shown in Figure 7, the camera height in the low-magnification imaging environment is set higher than the height in the high-magnification imaging environment to capture the entire inspection area of the COF(F), and the camera height in the high-magnification imaging environment is set higher than the height in the high-magnification imaging environment. It is set lower than the height, so only the inspection target chip area of the COF (F) is photographed at high magnification.

In addition, the shooting environment setting block 420 variably sets a low-magnification shooting environment and a high-magnification shooting environment, and the lighting brightness of the low-magnification shooting environment can be set to have a brightness level that is brighter than the lighting brightness of the high-magnification shooting environment.

Additionally, the imaging environment setting block 420 can acquire a low-magnification inspection image in a low-magnification imaging environment for each COF (F) inspection area and then acquire a high-magnification inspection image in a high-magnification imaging environment.

In addition, the shooting environment setting block 420 has a first shooting mode in which a low-magnification inspection image is acquired in a low-magnification shooting environment and then changed to a high-magnification shooting environment to obtain a high-magnification inspection image, and a first shooting mode in which a high-magnification inspection image is acquired in a high-magnification shooting environment and then changed to a low-magnification shooting environment. The operation of the second shooting mode, which acquires a variable low-magnification inspection image, can be controlled by alternating on a unit of inspection area basis. That is, for the first inspection target chip, the shooting environment is set in the order of low magnification -> high magnification, for the second inspection target chip, the shooting environment is set in the order of high magnification -> low magnification, and for the subsequent third inspection target chip, the shooting environment is set in the order of high magnification -> low magnification. For this reason, the imaging unit 300 can be controlled by setting the shooting environment in the order of low magnification -> high magnification. This is to reduce the transfer control of the imaging unit 300 according to the magnification setting by half, thereby minimizing the vibration of the inspection device, maintaining the optical alignment more stably, and improving the durability of the mechanical device. .

The inspection processing block 430 collects each of seven inspection images in response to the combination of coaxial lighting, side lighting, and backlight in each low-magnification and low-magnification shooting environment set through the shooting environment setting block 420, and inspects each inspection item. Select an inspection image with a preset optimal lighting environment and determine the quality of payment for each inspection item. At this time, the inspection processing block 430 can determine the pass/fail status of one inspection item using multiple inspection images in different lighting environments. This takes into account that the state analysis in coaxial lighting or side lighting may appear differently depending on the inspection item, and that different state analysis results may be derived depending on the presence or absence of a backlight. For example, for the first inspection item, the good or bad state can be determined using an inspection image of a coaxial lighting environment and an inspection image of a combined lighting environment of side lighting and backlight.

Meanwhile, in the present invention, the height of the camera 311 and the lens 321 are adjusted based on the position of the COF (F) in the imaging unit 300 for acquiring an inspection image, regardless of the tension state of the COF (F). It can be performed to always obtain an inspection image with accurate focus.

Figures 8 and 9 are diagrams for explaining a chip-on-film inspection device with a variable magnification function according to a second embodiment of the present invention. Figure 8 shows the configuration of the imaging unit 300, and Figure 9 shows the tension A perspective view and a cross-sectional view of the state detection unit 350 are shown, and in FIG. 8, the same components as those shown in FIG. 3 are given the same reference numerals and their detailed descriptions are omitted.

Referring to Figures 8 and 9, the imaging unit 300 is configured to additionally include a tension state detection unit 350 at the position where the COF (F) is transported.

The tension state detection unit 350 includes a housing 351 that is roughly cubic in shape and has an empty interior, and a film inflow slit ( 352), a film outflow slit 353 formed on the other side of the housing 351 where the film inlet slit 352 is formed to discharge the COF (F) to the outside of the housing 351, and an upper side of the film inlet slit 352 It includes first and second distance sensors 354 and 355 respectively disposed below.

At this time, the film inlet slit 352 and the film outflow slit 353 are formed to have a height of a certain level or more at a position corresponding to the transfer position of the COF (F), which is transferred with a certain tension by the transfer unit 200. When the COF (F) maintains the preset tension by (200), the COF (F) is transferred to the center position (C) of the film inlet slit 352 and the film outflow slit 353.

And, the first distance sensor 354 measures the first distance d1 with the COF (F) and transmits it to the inspection control unit 400, and the second distance sensor 355 measures the second distance with the COF (F) ( d2) is measured and transmitted to the inspection control unit 400.

When the COF (F) is located in the imaging area, the inspection control unit 400 stops the movement of the COF (F) and determines the first and second distance values (d1, d2) is collected, the preset camera and lens heights are corrected based on the difference value (d1-d2) between the first and second distance values (d1, d2), and the corresponding camera and lens heights are adjusted based on the corrected camera and lens height values. Perform shooting environment setting processing corresponding to the magnification. For example, if the difference value (d1-d2) between the first distance value and the second distance value is "0", the shooting environment is set according to the preset camera height and lens height, and the difference value (d1-d2) is "0". In the case of +", the COF (F) position of the inspection area is judged to be located higher, and the height of the camera and lens is corrected to be higher by the difference value. If the difference value (d1-d2) is "-", the inspection area is It is determined that the COF(F) position is located higher, and the moving height of the camera and lens is corrected to be lower by the difference value to obtain an inspection image of the desired magnification with accurate focus.

In addition, in the present invention, the third and fourth distance sensors 356 and 357 are additionally disposed on the upper and lower sides of the film outflow slit 353, and the inspection control unit 400 uses the third and fourth distance sensors 356 and 357 to determine the third and fourth distance sensors 356 and 357. It is also possible to additionally collect the fourth distance values (d3, d4) and correct the heights of the camera 311 and the lens 321 based on the first to fourth distance values (d3, d4). At this time, the inspection control unit 400 uses the first average value of the first and third distance values (d1, d3), which are the distance values to the upper side of the COF (F), and the second and third average values, which are the distance values to the lower side of the COF (F). The second average values of the fourth distance values (d2, d4) can be calculated, respectively, and the moving height of the camera and lens can be corrected based on the difference between the first and second average values (first average value - second average value). .

In addition, in the present invention, inspection images of low and high magnification can be obtained by using a single variable magnification imaging unit 300, and as shown in FIG. 10, in the space secured on the main body 100, More accurate and diverse COF(F) appearance inspection can be performed by additionally deploying other inspection equipment, such as scan cameras 710 and 720.

In addition, in the present invention, as shown in FIG. 10, it is possible to additionally arrange a variable magnification imaging unit 730 of the same structure on the lower side of the main body 100 for inspection of the lower surface. At this time, it is preferable that the variable magnification imaging unit 730 disposed on the lower side is placed in a different position from the variable magnification imaging unit 300 disposed on the upper side in order to avoid being influenced by mutual illumination.

100: main body, 200: transfer unit,
300: imaging unit, 400: inspection control unit,
310: View angle adjustment means, 311: Camera,
312: view angle adjustment motor, 313: camera bracket,
314: camera bracket transfer unit, 314a: transfer body,
314b: guide, 320: focus control means,
321: Lens, 322: Focus control motor,
323: lens bracket, 324: lens bracket transfer unit,
330: lighting means, 331: coaxial lighting,
332: backlight, 350: tension state detection unit,
351: housing, 352: film inlet slit,
353: film outflow slit, 354,355,356,357: distance sensor,
F: Chip on film (COF).

Claims (7)

The main body,
A transfer unit installed on one side of the main body and transporting the chip-on-film (COF) with the inspection target chip mounted on the bottom in one direction,
An imaging unit installed on one side of the moving path of the chip-on film and acquiring a plurality of inspection images by photographing the chip-on film at different magnifications;
By controlling the transfer unit, imaging unit, and lighting unit, the low-magnification first inspection image and the high-magnification second inspection image taken from the imaging unit while the chip-on film is stopped moving are collected, and these are used to determine the appearance state of the chip-on film. It consists of an inspection control unit that inspects,
The imaging unit provides a camera that photographs the inspection area containing the inspection target chip from the top of the chip-on-film, a view angle adjustment motor for adjusting the camera height, and an optical path for the camera that has a length of a certain height and is fixedly placed on the upper surface. a camera bracket, a view angle adjustment means including a rod-shaped camera bracket transfer unit that moves the camera bracket in an upward and downward direction in response to rotation of the view angle adjustment motor;
A lens disposed below the camera to set the focus, a focus control motor for adjusting the lens height, a lens bracket that has a certain height and provides an optical path for the lens fixedly coupled to the bottom, and a motor that responds to rotation of the focus control motor. A focus control means including a lens bracket transfer unit that transfers the lens bracket in the vertical direction within the camera bracket,
It is configured to include an illumination means disposed below the focus control means and irradiating illumination light to a preset shooting position under the control of the inspection control unit,
The imaging unit is configured to additionally include a tension state detection unit at the location where the chip-on film is transferred,
The tension state detection unit has a cube-shaped housing with an empty interior, a film inlet slit formed on one side of the housing to introduce a chip-on film into the inside of the housing, and a film inlet slit formed on the other side of the housing to the outside of the housing. It is configured to include a film outflow slit for flowing out the chip-on film, and first and second distance sensors disposed on the upper and lower sides of the film inlet slit, respectively, to measure the distance value from the chip-on film,
The inspection control unit collects first and second distance values through the first and second distance sensors while the movement of the chip on film is stopped, and based on the difference between the first and second distance values, A chip-on film inspection device with a variable magnification function, characterized in that it corrects the moving height of the camera and lens of the imaging unit.
According to paragraph 1,
The lighting means includes a coaxial light disposed above the chip-on film and a backlight disposed below the chip-on film,
The coaxial lighting is a chip-on-film inspection device with a variable magnification function, characterized in that it irradiates red light to the shooting position.
According to paragraph 2,
The lighting means further includes a side light that irradiates illumination light with a certain inclination angle from the upper side of the chip-on film,
The inspection control unit acquires a plurality of inspection images corresponding to a combination of coaxial lighting, side lighting, and backlight lighting for each shooting environment at different magnifications, selects inspection images with a preset lighting combination for each inspection item, and selects an inspection image with a preset lighting combination for each inspection item. A chip-on-film inspection device with a variable magnification function, characterized in that it performs an external inspection.
According to any one of claims 1 to 3,
A chip-on film inspection device with a variable magnification function, wherein the lighting means irradiates illumination light with a brighter brightness level in a low-magnification shooting environment than in a high-magnification shooting environment.
According to paragraph 1,
The inspection control unit has a first shooting mode for acquiring a low-magnification inspection image in a low-magnification shooting environment and then changing to a high-magnification shooting environment to obtain a high-magnification inspection image; A chip-on-film inspection device with a variable magnification function, characterized in that the operation of the acquired second shooting mode is controlled alternately on an inspection area basis.
delete In paragraph 1
The tension state detection unit is configured to further include third and fourth distance sensors that are disposed on the upper and lower sides of the film outflow slit, respectively, and measure the distance value from the chip-on film,
The inspection control unit calculates the first average value of the first and third distance values, which are the distance values with respect to the upper side of the chip-on film, and the second average value of the second and fourth distance values, which are the distance values with respect to the lower side of the chip-on film, respectively. A chip-on film inspection device with a variable magnification function, characterized in that the moving height of the camera and lens is corrected based on the difference between the first and second average values.