KR102663958B1 - 분사 디스펜서 위치 제어를 위한 시스템 및 방법 - Google Patents

분사 디스펜서 위치 제어를 위한 시스템 및 방법 Download PDF

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Publication number
KR102663958B1
KR102663958B1 KR1020217001902A KR20217001902A KR102663958B1 KR 102663958 B1 KR102663958 B1 KR 102663958B1 KR 1020217001902 A KR1020217001902 A KR 1020217001902A KR 20217001902 A KR20217001902 A KR 20217001902A KR 102663958 B1 KR102663958 B1 KR 102663958B1
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South Korea
Prior art keywords
moving part
piezoelectric device
needle
voltage waveform
amplifier
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KR1020217001902A
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English (en)
Korean (ko)
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KR20210022698A (ko
Inventor
앤드류 펠버
리차드 머피
프레데릭 도링
Original Assignee
노드슨 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B05B1/304—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
    • B05B1/3046—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • G05D3/12—Control of position or direction using feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Feedback Control In General (AREA)
KR1020217001902A 2018-06-25 2019-06-25 분사 디스펜서 위치 제어를 위한 시스템 및 방법 Active KR102663958B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862689694P 2018-06-25 2018-06-25
US62/689,694 2018-06-25
PCT/US2019/038968 WO2020005929A2 (en) 2018-06-25 2019-06-25 System and method for jetting dispenser positional control

Publications (2)

Publication Number Publication Date
KR20210022698A KR20210022698A (ko) 2021-03-03
KR102663958B1 true KR102663958B1 (ko) 2024-05-09

Family

ID=67480279

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217001902A Active KR102663958B1 (ko) 2018-06-25 2019-06-25 분사 디스펜서 위치 제어를 위한 시스템 및 방법

Country Status (6)

Country Link
US (1) US12145161B2 (https=)
EP (1) EP3810336A2 (https=)
JP (1) JP7481271B2 (https=)
KR (1) KR102663958B1 (https=)
CN (1) CN112334237B (https=)
WO (1) WO2020005929A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113811397A (zh) * 2019-05-12 2021-12-17 诺信公司 具有机械放大器的分配系统
WO2021151971A1 (en) 2020-01-28 2021-08-05 Mycronic AB Jetting devices with flexible jetting nozzle
JP7560849B2 (ja) * 2020-06-25 2024-10-03 武蔵エンジニアリング株式会社 液体材料吐出装置
DE102021114302A1 (de) * 2021-06-02 2022-12-08 Vermes Microdispensing GmbH Dosiersystem
TWI837657B (zh) * 2022-05-06 2024-04-01 庫力索法高科股份有限公司 具二段式校正機構的噴射閥
KR20240105606A (ko) 2022-12-28 2024-07-08 주식회사 지엔테크 위치기반 정밀도포 시스템
CN116764903A (zh) * 2023-06-30 2023-09-19 深圳市捷特精密技术有限公司 一种高精密压电喷射阀

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101614312B1 (ko) 2014-11-18 2016-04-22 주식회사 프로텍 압전 디스펜서 및 압전 디스펜서의 작동 스트로크 보정방법
CN106583166A (zh) * 2017-01-22 2017-04-26 山东大学 一种压电驱动的喷射式点胶装置
WO2017202985A1 (en) 2016-05-26 2017-11-30 Mycronic AB Method and apparatus for controlling jet dispensing by displacement measurement

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US5490015A (en) 1993-03-04 1996-02-06 Olympus Optical Co., Ltd. Actuator apparatus
DE10248214A1 (de) * 2002-10-16 2004-05-13 Siemens Ag Schaltung mit mindestens einem Piezoaktor
US8271141B2 (en) * 2008-06-09 2012-09-18 Ross Operating Valve Company Control valve system with cycle monitoring, diagnostics and degradation prediction
DE102011075732B4 (de) * 2011-05-12 2021-02-11 Vitesco Technologies GmbH Regelverfahren für ein Einspritzventil und Einspritzsystem
US9243626B2 (en) * 2012-11-19 2016-01-26 Nordson Corporation Adhesive dispensing system and method including a pump with integrated diagnostics
JP6412025B2 (ja) * 2013-03-13 2018-10-24 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ 液滴噴射方法及び液滴噴射装置
DE102013226849B3 (de) * 2013-12-20 2015-04-30 Continental Automotive Gmbh Verfahren zum Betreiben eines Einspritzventils
CN105983506B (zh) * 2015-01-29 2018-05-18 北京派和科技股份有限公司 压电喷射阀及喷射装置
US10022744B2 (en) * 2015-05-22 2018-07-17 Nordson Corporation Piezoelectric jetting system with quick release jetting valve
WO2017040648A1 (en) * 2015-08-31 2017-03-09 Nordson Corporation Automatic piezo stroke adjustment
JP6623846B2 (ja) * 2016-03-03 2019-12-25 セイコーエプソン株式会社 流体噴射装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101614312B1 (ko) 2014-11-18 2016-04-22 주식회사 프로텍 압전 디스펜서 및 압전 디스펜서의 작동 스트로크 보정방법
WO2017202985A1 (en) 2016-05-26 2017-11-30 Mycronic AB Method and apparatus for controlling jet dispensing by displacement measurement
CN106583166A (zh) * 2017-01-22 2017-04-26 山东大学 一种压电驱动的喷射式点胶装置

Also Published As

Publication number Publication date
US20210245188A1 (en) 2021-08-12
JP2021528242A (ja) 2021-10-21
CN112334237A (zh) 2021-02-05
WO2020005929A3 (en) 2020-02-13
CN112334237B (zh) 2022-08-26
US12145161B2 (en) 2024-11-19
JP7481271B2 (ja) 2024-05-10
EP3810336A2 (en) 2021-04-28
KR20210022698A (ko) 2021-03-03
WO2020005929A2 (en) 2020-01-02

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