CN112334237B - 用于喷射分配器位置控制的系统和方法 - Google Patents

用于喷射分配器位置控制的系统和方法 Download PDF

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Publication number
CN112334237B
CN112334237B CN201980041976.4A CN201980041976A CN112334237B CN 112334237 B CN112334237 B CN 112334237B CN 201980041976 A CN201980041976 A CN 201980041976A CN 112334237 B CN112334237 B CN 112334237B
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CN
China
Prior art keywords
piezoelectric device
dispensing operation
needle
amplifier
voltage waveform
Prior art date
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Active
Application number
CN201980041976.4A
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English (en)
Chinese (zh)
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CN112334237A (zh
Inventor
安德鲁·费尔伯
理查德·墨菲
弗雷德里克·德林
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Nordson Corp
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Nordson Corp
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Publication date
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Publication of CN112334237A publication Critical patent/CN112334237A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B05B1/304—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
    • B05B1/3046—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • G05D3/12—Control of position or direction using feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Feedback Control In General (AREA)
CN201980041976.4A 2018-06-25 2019-06-25 用于喷射分配器位置控制的系统和方法 Active CN112334237B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862689694P 2018-06-25 2018-06-25
US62/689,694 2018-06-25
PCT/US2019/038968 WO2020005929A2 (en) 2018-06-25 2019-06-25 System and method for jetting dispenser positional control

Publications (2)

Publication Number Publication Date
CN112334237A CN112334237A (zh) 2021-02-05
CN112334237B true CN112334237B (zh) 2022-08-26

Family

ID=67480279

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980041976.4A Active CN112334237B (zh) 2018-06-25 2019-06-25 用于喷射分配器位置控制的系统和方法

Country Status (6)

Country Link
US (1) US12145161B2 (https=)
EP (1) EP3810336A2 (https=)
JP (1) JP7481271B2 (https=)
KR (1) KR102663958B1 (https=)
CN (1) CN112334237B (https=)
WO (1) WO2020005929A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113811397A (zh) * 2019-05-12 2021-12-17 诺信公司 具有机械放大器的分配系统
WO2021151971A1 (en) 2020-01-28 2021-08-05 Mycronic AB Jetting devices with flexible jetting nozzle
JP7560849B2 (ja) * 2020-06-25 2024-10-03 武蔵エンジニアリング株式会社 液体材料吐出装置
DE102021114302A1 (de) * 2021-06-02 2022-12-08 Vermes Microdispensing GmbH Dosiersystem
TWI837657B (zh) * 2022-05-06 2024-04-01 庫力索法高科股份有限公司 具二段式校正機構的噴射閥
KR20240105606A (ko) 2022-12-28 2024-07-08 주식회사 지엔테크 위치기반 정밀도포 시스템
CN116764903A (zh) * 2023-06-30 2023-09-19 深圳市捷特精密技术有限公司 一种高精密压电喷射阀

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490015A (en) * 1993-03-04 1996-02-06 Olympus Optical Co., Ltd. Actuator apparatus
CN103502614A (zh) * 2011-05-12 2014-01-08 大陆汽车有限公司 用于喷射阀的控制方法和喷射系统
CN105934577A (zh) * 2013-12-20 2016-09-07 大陆汽车有限公司 用于操作喷射阀的方法
CN107149996A (zh) * 2016-03-03 2017-09-12 精工爱普生株式会社 流体喷射装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10248214A1 (de) * 2002-10-16 2004-05-13 Siemens Ag Schaltung mit mindestens einem Piezoaktor
US8271141B2 (en) * 2008-06-09 2012-09-18 Ross Operating Valve Company Control valve system with cycle monitoring, diagnostics and degradation prediction
US9243626B2 (en) * 2012-11-19 2016-01-26 Nordson Corporation Adhesive dispensing system and method including a pump with integrated diagnostics
JP6412025B2 (ja) * 2013-03-13 2018-10-24 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ 液滴噴射方法及び液滴噴射装置
KR101614312B1 (ko) * 2014-11-18 2016-04-22 주식회사 프로텍 압전 디스펜서 및 압전 디스펜서의 작동 스트로크 보정방법
CN105983506B (zh) * 2015-01-29 2018-05-18 北京派和科技股份有限公司 压电喷射阀及喷射装置
US10022744B2 (en) * 2015-05-22 2018-07-17 Nordson Corporation Piezoelectric jetting system with quick release jetting valve
WO2017040648A1 (en) * 2015-08-31 2017-03-09 Nordson Corporation Automatic piezo stroke adjustment
WO2017202985A1 (en) * 2016-05-26 2017-11-30 Mycronic AB Method and apparatus for controlling jet dispensing by displacement measurement
CN106583166A (zh) * 2017-01-22 2017-04-26 山东大学 一种压电驱动的喷射式点胶装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490015A (en) * 1993-03-04 1996-02-06 Olympus Optical Co., Ltd. Actuator apparatus
CN103502614A (zh) * 2011-05-12 2014-01-08 大陆汽车有限公司 用于喷射阀的控制方法和喷射系统
CN105934577A (zh) * 2013-12-20 2016-09-07 大陆汽车有限公司 用于操作喷射阀的方法
CN107149996A (zh) * 2016-03-03 2017-09-12 精工爱普生株式会社 流体喷射装置

Also Published As

Publication number Publication date
US20210245188A1 (en) 2021-08-12
JP2021528242A (ja) 2021-10-21
CN112334237A (zh) 2021-02-05
WO2020005929A3 (en) 2020-02-13
KR102663958B1 (ko) 2024-05-09
US12145161B2 (en) 2024-11-19
JP7481271B2 (ja) 2024-05-10
EP3810336A2 (en) 2021-04-28
KR20210022698A (ko) 2021-03-03
WO2020005929A2 (en) 2020-01-02

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