KR102660422B1 - Deposition Apparatus - Google Patents

Abstract

A deposition apparatus according to an embodiment of the present invention provides a process space in which the deposited object is deposited, a filter member formed to allow the process gas to pass through, and on which the deposited object located in the process space is seated by its own weight. a chamber drum comprising: gas injection for spraying the process gas toward the filter member from outside the process space so that the process gas passes through the filter member and passes through a deposition area where the deposited object is located in the process space; Includes wealth.

Description

Deposition Apparatus

The present invention relates to a deposition apparatus.

Atomic layer deposition (ALD) is divided into time-division deposition and space-division deposition.

Among them, the time-division atomic layer deposition method generally supplies precursor gas, purge gas, and reactant gas sequentially into the reaction chamber to form a thin film on the surface of the deposited object inside the reaction chamber. ) is formed.

The atomic layer deposition method has the advantage of being able to control the thickness in units of angstrom (0.1 nm) and having excellent step coverage, enabling the growth of a uniform thin film even on deposited objects of relatively complex shapes such as powder. The efficiency of this time-division atomic layer deposition method can generally be evaluated by the time required to complete the deposition process.

Meanwhile, when depositing nanopowder materials based on atomic layer deposition, the powders may form aggregates due to liquid bridges or solid bridges that occur between small-sized particles.

These agglomerated nano powder materials had areas that were not in contact with the gas, resulting in non-deposited areas on the surface, or some nano powder materials were deposited and others were not.

The problem to be solved by the present invention is to provide a deposition apparatus capable of depositing a deposited object during a short process time.

In addition, the problem to be solved by the present invention is to provide a deposition device capable of uniformly depositing a thin film even when depositing a powder-type object by stirring the object during the deposition process.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A deposition apparatus according to an embodiment of the present invention for solving the above problem provides a process space in which the deposited object is deposited, is formed to allow the process gas to pass, and the deposited object located in the process space is subject to its own weight. A chamber drum including a filter member seated by the process gas toward the filter member from outside the process space such that the process gas passes through the filter member and passes through a deposition area where the deposited object is located in the process space. It includes a gas injection unit that sprays gas.

It may further include a driving unit that rotates the chamber drum.

The driving unit rotates the chamber drum with a direction intersecting the self-weight direction of the deposited object as a rotation axis, and at least a portion of a side surface of the chamber drum surrounding the rotation axis may be formed of the filter member.

The gas injection unit sprays the process gas toward the filter member to pass through a deposition gas injection unit that sprays the process gas toward the filter member to pass through the deposition region and a separation region spaced apart from the deposition region, It may include a deposition auxiliary part that prevents the deposited material from coming into close contact with the filter member and rotating together with the filter member.

The driving unit may include a rotating heater that is connected to the chamber drum, rotates the chamber drum, and transfers heat necessary for deposition of the deposited material to the chamber drum.

A mounting end is formed at one end of the chamber drum to be detachably coupled to a rotating end that rotates the chamber drum in the driving unit, and an exhaust port through which the process gas in the process space is exhausted is formed at the other end of the chamber drum, A chamber housing that provides an accommodating space for accommodating the chamber drum and is connected to the driving unit so that the rotating end is exposed to the accommodating space, and is detachably mounted on the chamber housing to separate the accommodating space from the external space. In this state, it may include a cover housing in which an exhaust path connected to the exhaust port is formed.

The chamber drum has one end connected to the exhaust port and the other end protruding into the process space to prevent the exhaust port through which the process gas in the process space is exhausted and the deposited object from moving to the exhaust port, thereby exhausting the process gas. It may further include a gas discharge pipe that diverts the path.

It further includes a driving part that rotates the chamber drum, wherein the gas discharge pipe includes a body with one end connected to the exhaust port and the other end protruding into the process space, and a body that rotates with the body during rotation of the chamber drum and a plurality of the gas discharge pipes. It may include a stirring member protruding from the body to stir the deposit.

The process gas includes different first gases and second gases, and the gas injection unit includes an injection block, a first gas passage formed in the injection block and through which the first gas moves, and connected to the first gas passage. an injection nozzle that injects the first gas toward the filter member, a second gas passage formed in the injection block and through which the second gas moves, and a second gas passage connected to the second gas passage toward the filter member. 2 It may include a spray hole for spraying gas.

The injection nozzle is disposed in the injection hole, the first gas is injected toward the filter member through the injection nozzle, and the second gas may be injected through a gap between the injection hole and the injection nozzle. .

The process gas may include a deposition gas that reacts with the deposited material and a purge gas that does not react with the deposited material.

The gas injection unit includes a deposition gas injection unit for spraying the deposition gas toward the filter member to pass through the deposition area, a first deposition auxiliary unit for spraying the purge gas from one side of the deposition gas unit toward the process space, and A second deposition auxiliary unit that sprays the purge gas from the other side of the deposition gas unit in a direction intersecting the gas injection direction of the first deposition auxiliary unit, and the purge gas injected from the first deposition auxiliary unit and the second deposition auxiliary unit. The deposition gas sprayed by the gas flow may be concentrated in the deposition area.

Other specific details of the invention are included in the detailed description and drawings.

According to embodiments of the present invention, there are at least the following effects.

Deposition of the deposited material is possible during a short process time.

It is possible to form a uniform thin film even on powder-type deposited materials.

The effects according to the present invention are not limited to the contents exemplified above, and further various effects are included in the present specification.

1 is an overall perspective view of a deposition apparatus according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of a deposition apparatus according to an embodiment of the present invention.
Figure 3 is an overall perspective view of a chamber housing according to an embodiment of the present invention.
Figure 4 is an overall perspective view of the chamber housing according to an embodiment of the present invention viewed from a different angle than Figure 3.
Figure 5 is an overall perspective view of the cover housing according to an embodiment of the present invention.
Figure 6 is a perspective view of a deposition gas injection unit according to an embodiment of the present invention.
Figure 7 is a front view of the deposition gas injection unit and the chamber housing in a combined state according to an embodiment of the present invention.
Figure 8 is a view showing the injection hole and main nozzle viewed from the inside of the chamber housing.
Figure 9 is a diagram showing gas injection directions of the deposition gas injection unit and the deposition auxiliary unit in the chamber housing according to an embodiment of the present invention.
Figure 10 is an overall perspective view of a chamber drum according to an embodiment of the present invention.
Figure 11 is an exploded perspective view of a chamber drum according to an embodiment of the present invention.
Figure 12 is a cross-sectional view showing a deposited material in the form of powder accommodated in a chamber drum according to an embodiment of the present invention.
Figure 13 is a cross-sectional view showing the chamber drum being rotated and powder being deposited.
FIG. 14 is a diagram illustrating concentrating deposition gas into a deposition area using a deposition auxiliary unit.
Figure 15 is a diagram showing that the gas exhaust path is bypassed due to the gas discharge pipe.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. The present embodiments are merely provided to ensure that the disclosure of the present invention is complete and to be understood by those skilled in the art in the technical field to which the present invention pertains. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

Additionally, embodiments described in this specification will be described with reference to cross-sectional views and/or schematic diagrams that are ideal illustrations of the present invention. Accordingly, the form of the illustration may be modified depending on manufacturing technology and/or tolerance. Additionally, in each drawing shown in the present invention, each component may be shown somewhat enlarged or reduced in consideration of convenience of explanation. Like reference numerals refer to like elements throughout the specification.

The 'deposited object' mentioned below refers to the material that is the subject of deposition. For example, the deposited material may be a powder-type material.

The 'precursor gas' mentioned below is a gas that reacts with the surface of the deposited object. Additionally, the 'reactive gas' may be a gas that reacts with the surface of the deposited object that has reacted with the precursor gas. Additionally, the 'purge gas' may be a gas that does not react with the deposited material, precursor gas, and reaction gas. For example, an inert gas such as nitrogen (N2), argon (Ar), or helium (He) gas may be supplied as the purge gas.

'Process gas' mentioned below refers to a gas that can be used in the deposition process of a deposited object. For example, process gas may refer to the precursor gas, reaction gas, and/or purge gas described above.

Hereinafter, the present invention will be described with reference to the drawings for explaining a deposition apparatus according to an embodiment of the present invention.

1 is an overall perspective view of a deposition apparatus according to an embodiment of the present invention. Additionally, Figure 2 is an exploded perspective view of a deposition apparatus according to an embodiment of the present invention.

As shown in FIGS. 1 and 2, the deposition apparatus 1 according to an embodiment of the present invention includes a housing unit 100, a gas injection unit 200, a driving unit 300, and a chamber drum 400. .

The housing unit 100 is a component that isolates the space where the deposition process takes place from external space. To this end, the housing unit 100 according to an embodiment of the present invention includes a chamber housing 110 and a cover housing 120.

The chamber housing 110 is a component that accommodates the chamber drum 400. This chamber housing 110 is connected to the driving unit 300 and the gas injection unit 200 so that the chamber drum 400 accommodated therein is rotated and deposited.

The cover housing 120 is a cover that is detachably mounted on the chamber housing 110. The cover housing 120 is mounted on the chamber housing 110 to prevent the process gas inside the chamber housing 110 from being indiscriminately exposed to the external space.

The gas injection unit 200 is a component connected to the chamber housing 110 and sprays process gas toward the chamber drum 400. The gas injection unit 200 may include a deposition gas injection unit 210 and a deposition auxiliary unit 220.

First, the deposition gas injection unit 210 may be a gas injection unit that sprays deposition gas (precursor gas and/or reaction gas), which is a gas that reacts with the deposited object. Specifically, the deposition gas injection unit 210 may spray deposition gas toward a filter member (described later) of the chamber drum 400.

In contrast, the deposition assistant 220 may be a gas injection unit that sprays purge gas. Specifically, the deposition assistant 220 may spray purge gas toward the filter member (described later) of the chamber drum 400. However, the present invention is not limited to this, and the deposition assistant 220 may inject deposition gas toward the filter member in the same or similar manner as the deposition gas injection unit 210.

The deposition gas injection unit 210 is located on the side of the chamber housing 110, and an end at which gas is sprayed may communicate with the internal space of the chamber housing 110. The deposition auxiliary unit 220 may include a first deposition auxiliary unit 222 located on one side of the deposition gas injection unit 210 and a second deposition auxiliary unit 224 located on the other side. Details about this will be described later.

The driving unit 300 is a component that rotates the chamber drum 400 disposed in the chamber housing 110. Specifically, the driving unit 300 may include a rotating heater 310 and a power transmission unit (not shown).

The power transmission unit is a component that is connected to the rotating heater 310 and rotates the rotating heater 310. For example, the power transmission unit may include a gear structure that engages the end of the motor and the rotating heater 310 to transmit the power of the motor.

The rotating heater 310 is a component whose one end is located within the chamber housing 110 and the other end is connected to the power transmission unit. For example, the rotating heater 310 may be inserted through a groove formed in the chamber housing 110, one end may be located inside the chamber housing 110, and the other end may be located outside the chamber housing 110.

A rotating stage 312 (see FIG. 7) that is inserted into the chamber drum 400 is formed at one end of the rotating heater 310. The rotating end 312 is a protruding portion to be inserted into the chamber drum 400. The rotating stage 312 may be provided in a shape that facilitates transmitting the rotational force of the rotating heater 310 to the chamber drum 400 when the rotating heater 310 is rotated while inserted into the chamber drum 400.

Meanwhile, the rotating heater 310 includes a separate heat generating unit or is connected to the heat generating unit to transfer heat necessary for deposition to the chamber drum 400. For example, the rotating heater 310 may be configured to heat the temperature inside the chamber drum 400 to a temperature of approximately 400 degrees Celsius. Additionally, in order to increase heat conduction efficiency, the portion of the rotating heater 310 that contacts the chamber drum 400 may be formed to have an area corresponding to the end of the chamber drum 400.

The chamber drum 400 is a reaction chamber that provides a space to accommodate the deposited material. As shown in FIG. 2, the chamber drum 400 may be configured to have a substantially cylindrical shape. Additionally, the side of the chamber drum 400 is made of a gas-permeable material so that the gas injected from the gas injection unit 200 is supplied to the deposited object. Details about this will be described later.

Hereinafter, the housing portion 100 included in the deposition apparatus 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5.

Figure 3 is an overall perspective view of a chamber housing according to an embodiment of the present invention. Additionally, Figure 4 is an overall perspective view of the chamber housing according to an embodiment of the present invention viewed from a different angle than Figure 3.

As shown in FIGS. 3 and 4, the chamber housing 110 according to an embodiment of the present invention provides an accommodating space 111 surrounded by the side and rear sides.

An entrance connected to the receiving space 111 is formed on the front of the chamber housing 110. In addition, a rotation axis insertion groove 112 into which the rotation heater 310 is inserted is formed on the rear side of the chamber housing 110. Due to this, in the process of receiving the chamber drum 400 into the receiving space 111 through the entrance of the chamber housing 110, the chamber drum 400 and the rotating heater 310 are naturally connected.

A plurality of through holes 113 are perforated on the side of the chamber housing 110 along the longitudinal direction of the chamber housing 110. The through hole 113 is connected to the gas injection unit 200, and then serves as the injection hole of the gas injection unit 200. This will be explained later.

Due to the above structure, the chamber drum 400 inserted into the receiving space 111 is rotated with its front end connected to the rotating heater 310, and has a plurality of through holes 113 arranged on the side of the receiving space 111. Process gas is supplied through

The shape and size of the receiving space 111 may be formed in consideration of the rotation radius and size of the chamber drum 400. For example, the accommodation space 111 may be provided as a substantially cylindrical space.

Figure 5 is an overall perspective view of the cover housing according to an embodiment of the present invention. The cover housing 120 is a cover that is detachably mounted on the chamber housing 110 to shield the entrance of the chamber housing 110.

The cover housing 120 includes a cover plate 123 that is shaped to match the end of the chamber housing 110 and an exhaust passage 121 formed to penetrate the cover plate 123.

The cover plate 123 is fitted or fastened to the chamber housing 110 to prevent gas used during the deposition process from being indiscriminately exhausted outside the housing unit 100.

The exhaust passage 121 is a gas transfer passage formed to be connected to the chamber drum 400 accommodated therein when the cover housing 120 is coupled to the chamber housing 110. Specifically, one end of the exhaust passage 121 may be connected to the chamber drum 400 and the other end may be connected to an exhaust pump (not shown). Here, the exhaust pump is a pump that creates negative pressure in the exhaust passage 121 and exhausts the process gas in the chamber drum 400 based on the pressure difference.

Hereinafter, with reference to FIGS. 6 to 8 , the deposition gas injection unit 210 according to an embodiment of the present invention will be described in detail.

Figure 6 is a perspective view of a deposition gas injection unit according to an embodiment of the present invention. In addition, Figure 7 is a front view of the deposition gas injection unit and the chamber housing in a combined state according to an embodiment of the present invention. Figure 8 is a view showing the injection hole and main nozzle viewed from the inside of the chamber housing.

As shown in FIGS. 6 to 8, the deposition gas injection unit 210 according to an embodiment of the present invention includes an injection block 212, a first gas passage 216, an injection nozzle 214, and a second gas passage. (218) and includes a spray hole (215).

The injection block 212 is a block connected to and fixed to the chamber housing 110. For example, the injection block 212 may be connected to the chamber housing 110 by being fastened or assembled. Meanwhile, the injection block 212 may be connected to an external gas supply source (not shown) to receive gas.

Hereinafter, for convenience of explanation, it will be explained on the basis that two flow paths are formed in the injection block 212 and different types of gas flow through each, but the present invention is not limited thereto. For example, the injection block 212 may include three or more flow paths through which precursor gas, reaction gas, and purge gas flow separately. Or, as another example, the injection block 212 may be formed to allow at least two or more gases to flow together in one flow path, or to allow at least two or more gases to flow through the same flow path for different times.

The first gas flow path 216 is a gas flow path formed within the injection block 212 and is a flow path through which a first gas, which is one of the process gases, flows. The first gas flow path 216 may be formed in a substantially straight line along the longitudinal direction of the injection block 212.

Here, the first gas may be any one of a precursor gas, a reaction gas, and a purge gas. However, hereinafter, for convenience of explanation, it is assumed that the first gas is a precursor gas.

The second gas flow path 218 is a gas flow path formed within the injection block 212 and is a flow path through which a second gas, which is one of the process gases, flows. Here, the second gas may be any one of a precursor gas, a reaction gas, and a purge gas. However, hereinafter, for convenience of explanation, it is assumed that the second gas is a reactive gas.

The second gas flow path 218 may be formed at the top of the injection block 212 so that the top surface is open. In this case, when the injection block 212 is mounted on the chamber housing 110, the part of the chamber housing 110 that is in close contact with the top of the injection block 212 forms the upper surface of the second gas flow path 218. .

Additionally, the second gas flow path 218 may be formed to be located above the first gas flow path 216 on the injection block 212. In this case, the injection nozzle 214 mounted on the injection block 212 may be located within the second gas flow path 218.

The injection nozzle 214 is a nozzle mounted on the injection block 212 to be connected to the first gas flow path 216. For example, the injection nozzle 214 may be detachably coupled to the injection block 212 and connected to the first gas flow path 216.

The number of injection nozzles 214 mounted on the injection block 212 may correspond to the number of through holes 113 formed in the chamber housing 110. The plurality of injection nozzles 214 may be arranged approximately in a row to be inserted into the plurality of through holes 113.

Meanwhile, the injection hole 215 may be provided as a through hole 113 formed in the chamber housing 110. Additionally, the injection hole 215 is connected to the second gas flow path 218 to inject the second gas into the interior of the chamber housing 110.

To explain this in detail, the injection block 212 is mounted on the chamber housing 110 so that the second gas flow path 218 is in close contact with the bottom of the through hole 113. Because of this, when the second gas is supplied to the second gas flow path 218, the second gas moves to the through hole 113 of the chamber housing 110.

At this time, since the injection nozzle 214 disposed in the second gas flow path 218 is also inserted into the through hole 113, the second gas is moved into the gap between the injection nozzle 214 and the through hole 113.

Referring to FIG. 8, the spray nozzle 214 is formed to have a diameter smaller than the inner diameter of the through hole 113, so that when the spray nozzle 214 is inserted into the through hole 113, the spray nozzle 214 and the through hole 113 penetrate. A gap is created between the holes 113.

Therefore, the first gas is injected toward the chamber drum 400 through the injection hole 2141 of the injection nozzle 214, and the second gas is injected through the gap between the injection nozzle 214 and the through hole 113. It will happen.

The first gas flow path 216 and the second gas flow path 218 according to an embodiment of the present invention may have the advantage of easy post-process management due to the above-described structure.

For example, if internal contamination occurs in the first gas flow path 216 and the second gas flow path 218 due to the flow of process gas, there is an advantage in that it is easy to clean.

Specifically, in the case of the first gas flow path 216, since it has a straight structure, curved parts are minimized, making it easy to remove contaminants. Additionally, the second gas flow path 218 can be easily cleaned by separating the injection block 212 from the chamber housing 110 and then separating the injection nozzle 214 from the injection block 212.

In the above example, the injection hole 215 is provided as an example of the through hole 113 of the chamber housing 110, but the present invention is not limited thereto. For example, the injection hole 215 may be formed in the injection block 212 to be connected to the second gas flow path 218.

Meanwhile, since the specific configuration of the first deposition auxiliary unit 222 and the second deposition auxiliary unit 224 may be the same or similar to that of the deposition gas injection unit 210, this is omitted to avoid redundant description.

Hereinafter, the gas injection direction of the gas injection unit 200 will be described with reference to FIG. 9.

Figure 9 is a diagram showing gas injection directions of the deposition gas injection unit and the deposition auxiliary unit in the chamber housing according to an embodiment of the present invention.

As shown in FIG. 9, the deposition gas injection unit 210 is disposed between the first deposition auxiliary unit 222 and the second deposition auxiliary unit 224.

The deposition gas injection unit 210 is mounted on the chamber housing 110 so that when the chamber drum 400 is accommodated in the receiving space 111, the deposition gas can be sprayed in the direction A1 opposite the weight of the deposited object.

The first deposition auxiliary unit 222 and the second deposition auxiliary unit 224 spray gas in a different direction from the deposition gas injection unit 210, preventing the deposited material from coming into close contact with the surface of the chamber drum 400 and rotating together. do. Details about this will be described later.

Additionally, the first deposition auxiliary unit 222 and the second deposition auxiliary unit 224 may function to spray purge gas and concentrate the deposition gas sprayed from the deposition gas injection unit 210 on a predetermined area. In this case, the first deposition auxiliary part 222 and the second deposition auxiliary part 224 are mounted on the chamber housing 110 to spray gas in directions intersecting each other.

Specifically, the first deposition auxiliary unit 222 injects gas to intersect the injection direction A1 of the deposition gas injection unit 210, and the second deposition auxiliary unit 224 injects gas so as to intersect the injection direction A1 of the deposition gas injection unit 210. 1 Gas is injected in a direction (A3) that intersects both the injection directions (A2) of the deposition auxiliary unit 222.

Below, the chamber drum will be described with reference to FIGS. 10 and 11. Figure 10 is an overall perspective view of a chamber drum according to an embodiment of the present invention. Figure 11 is an exploded perspective view of the chamber drum 400 according to an embodiment of the present invention.

As shown in Figures 10 and 11, the chamber drum 400 according to an embodiment of the present invention includes a mounting plate 410, an exhaust plate 420, a filter member 430, an exhaust filter 440, and a gas discharge pipe. It may include (450).

The mounting plate 410 is located at the front end of the chamber drum 400 and is rotated by the driving unit 300. For example, a mounting end 412 having a structure corresponding to the rotating end 312 of the rotating heater 310 may be formed on the mounting plate 410. The mounting plate 410 rotates when the rotating heater 310 is rotated through the combination of the mounting end 412 and the rotating end 312.

The exhaust plate 420 is a plate on which the exhaust port 422 is formed and is located at the rear end of the chamber drum 400. The exhaust port 422 is a hole formed to exhaust the process gas inside the chamber drum 400 to the outside. When the chamber drum 400 is accommodated in the receiving space 111 and the cover housing 120 is mounted on the chamber housing 110, the exhaust port 422 is connected to the exhaust passage 121.

The filter member 430 is a component that forms at least a portion of the side surface of the chamber drum 400. For example, the filter member 430 may be configured to have a substantially cylindrical shape to form a side surface of the chamber drum 400. In this case, the front end of the filter member 430 may be connected to the mounting plate 410, and the rear end of the filter member 430 may be connected to the exhaust plate 420.

Meanwhile, the filter member 430 may be made of a breathable material so that deposits inside the chamber drum 400 are not discharged to the outside of the chamber drum 400, but gas can be supplied into the chamber drum 400. As an example, the filter member 430 may be made of a porous material such as mesh.

Hereinafter, the space surrounded by the filter member 430, the exhaust plate 420, and the mounting plate 410 is referred to as a process space. The process space is a space where the deposited material is deposited and is an internal space of the chamber drum 400.

At this time, since the mounting plate 410 is located at the front of the chamber drum 400, when the chamber drum 400 is mounted on the rotating heater 310, it has a shape similar to a cylinder lying on its side. Accordingly, the deposited material contained in the chamber drum 400 is supported by the filter member 430. Due to this positional relationship, the driving unit 300 rotates the chamber drum 400 using an axis intersecting the weight direction of the deposited object as a rotation axis. Additionally, the deposited object may be deposited by deposition gas injected from below while being supported on the rotating filter member 430.

The exhaust filter 440 is a filter disposed on the exhaust port 422. The exhaust filter 440 exhausts the process gas through the exhaust port 422 and prevents the deposited material from being discharged. For example, the exhaust filter 440 may be formed of the same or similar material as the filter member 430.

The gas discharge pipe 450 is connected to the exhaust plate 420 so that the exhaust filter 440 is in close contact with the exhaust port 422. For example, the gas discharge pipe 450 may be fastened to the exhaust plate 420 to cover the exhaust port 422 with the exhaust filter 440 interposed therebetween.

The gas discharge pipe 450 may include a body 452 and a stirring member 456.

The body 452 is a pipe-shaped member that forms the main skeleton of the gas discharge pipe 450. With the gas discharge pipe 450 connected to the exhaust plate 420, the rear end of the body 452 is connected to the exhaust port 422, and the front end protrudes into the process space. An exhaust passage 454 is formed inside the body 452, connecting the exhaust port 422 and the process space.

The stirring member 456 is formed to protrude from the body 452 in the radial direction. The stirring member 456 rotates together with the body 452 when the chamber drum 400 is rotated, and stirs the deposited material inside the chamber drum 400. For example, a plurality of stirring members 456 may be protruding from the body 452.

Below, based on the above description, deposition of a deposited object using the deposition apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. 12 to 15.

Figure 12 is a cross-sectional view showing a deposited material in the form of powder accommodated in a chamber drum according to an embodiment of the present invention. Figure 13 is a cross-sectional view showing the chamber drum being rotated and powder being deposited.

Hereinafter, to facilitate understanding of the present invention, the description will be made assuming that the deposited object is powder (P), but the present invention is not limited thereto.

The user receives and mounts the chamber drum 400 containing the powder (P) in the chamber housing 110 and connects the chamber drum 400 to the rotating heater 310. Afterwards, the cover housing 120 is coupled to the chamber housing 110, and the rotating heater 310, the power transmission unit, the exhaust passage 121, and the exhaust pump are connected respectively.

At this time, the interior of the chamber drum 400 will be similar to that shown in FIG. 12.

As shown in FIG. 12, the powder P located inside the chamber drum 400 is concentrated on the lower side of the filter member 430 due to its own weight. This is because the powder P slides along the inner surface of the filter member 430 due to its own weight and moves to the lower side of the filter member 430. Hereinafter, the area where the powders P are densely located in the process space 460 is referred to as the deposition area 461 (see FIG. 13).

When the user operates the gas injection unit 200 and the driving unit 300, the interior of the chamber drum 400 is in a state similar to that of FIG. 13. Hereinafter, for convenience of explanation, it is assumed that the chamber drum 400 rotates clockwise with respect to FIG. 13, but the present invention is not limited thereto. For example, the chamber drum 400 may rotate counterclockwise or alternately rotate clockwise and counterclockwise.

As shown in FIG. 13, the deposition gas injection unit 210 sprays the deposition gas G1 toward the filter member 430 from below the deposition area 461 so that the deposition gas G1 is injected into the deposition area 461. Spray. The injection direction of the deposition gas G1 may coincide with or be similar to the direction opposite to the self-weight direction of the powder P.

The deposition gas G1 injected from below the powder P is moved to the process space 460 through the gap between the powders P. Since the deposition gas (G1) moves through the space between the powders (P), according to the present invention, the deposition gas (G1) moves and the area in contact with the deposited object increases. Because of this, the process time for deposition of the deposited object can be shortened.

In addition, since the deposition gas (G1) is sprayed from below the powder (P) and passes through the powders (P), a plurality of powders (P) are naturally agitated by the moving force of the deposition gas (G1). .

In order to grow a thin film on the powder P, the user can set the deposition gas injection unit 210 to first spray the precursor gas for a set time and then spray the reaction gas. Alternatively, the deposition gas injection unit 210 may be set to simultaneously spray the precursor gas as one of the first gas and the second gas and the reaction gas as the other one of the first gas and the second gas to the deposition area 461. .

Meanwhile, since the chamber drum 400 and the stirring member 456 continue to rotate even while the deposition gas G1 is injected, the powder P is naturally stirred.

However, during the rotation of the chamber drum 400, some of the powder P may come into close contact with the surface of the filter member 430 and rotate together due to centrifugal force. If the powder in close contact with the surface of the filter member 430 is left unattended, it becomes difficult for the deposition gas G1 to flow through the filter member 430, which may reduce the efficiency of the deposition process.

In the case of the present invention, the powder P in close contact with the filter member 430 can be separated from the filter member 430 through the deposition auxiliary part 220.

As described above, the deposition auxiliary unit 220 sprays purge gases G2 and G3 on both sides of the deposition gas injection unit 210. If this is explained in relation to the process space 460, the deposition auxiliary unit 220 performs the deposition Process gas is sprayed toward the detachment areas 462 and 463 spaced apart from the area 461.

Specifically, the first deposition auxiliary unit 222 may spray a purge gas (G2) toward the first separation area 462, and the second deposition auxiliary unit 224 may spray a purge gas (G2) towards the second separation area 463. G3) can be sprayed.

The first separation area 462 is an area in the process space 460 near the area where the gas G2 sprayed from the first deposition auxiliary unit 222 enters, and the second separation area 463 is an area in the process space 460. ) is an area adjacent to the part where the gas G3 injected from the second deposition auxiliary part 224 enters.

At this time, the gas injection pressure of the deposition auxiliary unit 220 may be set to be stronger than the gas injection pressure of the deposition gas injection unit 210 to facilitate separation of the powder P that rotates in close contact.

Hereinafter, with reference to FIG. 14 , it will be described in detail how the deposition auxiliary unit 220 concentrates the deposition gas into the deposition area 461. FIG. 14 is a diagram illustrating concentrating deposition gas into a deposition area using a deposition auxiliary unit.

As described above, the first deposition auxiliary unit 222 and the second deposition auxiliary unit 224 spray purge gases G2 and G3 toward the filter member 430 from both sides, thereby discharging the deposition gas within the process space 460. Ensure that (G1) is positioned between purge gases (G2, G3). The purge gases G2 and G3 introduced into the process space 460 are moved to the exhaust passage 454 and press the deposition gas G1 from both sides.

To facilitate understanding, the purge gases G2 and G3 may flow within the process space 460 similar to a curtain hanging on both sides with the deposition gas G1 in between. The deposition gas G1 is prevented from diffusing out of the deposition region 461 due to the purge gas curtain. For this reason, in the case of the deposition apparatus according to an embodiment of the present invention, the deposition gas (G1) flows concentrated in an area where the powders (P) are densely concentrated. Therefore, there is an advantage in that deposition can be performed using a small amount of deposition gas (G1).

Additionally, the purge gases G1 and G2 injected toward the filter member 430 can increase the exhaust efficiency of the deposition gas G1 that has passed through the powder P by pushing it into the exhaust passage 454.

Below, with reference to FIG. 15, bypass of the gas exhaust path due to the gas discharge pipe will be described in detail. Figure 15 is a diagram showing that the gas exhaust path is bypassed due to the gas discharge pipe.

The gas G4 inside the rotating chamber drum 400 is exhausted through the exhaust path shown in FIG. 15. Specifically, the gas G4 may have an exhaust path that bypasses the body 452 and enters the exhaust passage 454 through the gap between the body 452 and the mounting plate 410.

The deposition device 1 including the gas discharge pipe 450 according to an embodiment of the present invention prevents the surface of the exhaust filter 440 from being shielded by the powder P by using the bypass of the exhaust path.

As shown in FIG. 15, even if the powder P seated on the filter member 430 is scattered due to external force due to rotation and gas, most of it is blocked by the body 452 and falls back toward the filter member 430. .

Accordingly, the deposition device 1 including the gas discharge pipe 450 according to an embodiment of the present invention prevents the surface of the exhaust filter 440 from being shielded by the powder P, thereby impairing exhaust efficiency.

A person skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

1: Deposition device 100: Housing portion
110: chamber housing 111: receiving space
112: Rotation shaft insertion groove 113: Through hole
120: cover housing 121: exhaust passage
123: Cover plate 200: Gas injection unit
210: deposition gas injection unit 212: injection block
214: spray nozzle 2141: spray nozzle
215: injection hole 216: first gas flow path
218: second gas flow path 220: deposition auxiliary unit
222: first deposition auxiliary unit 224: second deposition auxiliary unit
300: Drive unit 310: Rotate heater
312: Rotating stage 400: Chamber drum
410: Mounting plate 412: Mounting end
420: exhaust plate 422: exhaust port
430: filter member 440: exhaust filter
450: gas discharge pipe 452: body
454: exhaust passage 456: stirring member
460: Process space 461: Deposition area
462: first tally area 463: second tally area
P: Powder

Claims (11)

In a deposition apparatus for depositing at least one deposition object using a process gas,
a chamber drum that provides a process space in which the deposited material is deposited, is formed to allow the process gas to pass through, and includes a filter member on which the deposited material located in the process space is seated by its own weight; and
It includes a gas injection unit that sprays the process gas toward the filter member from outside the process space so that the process gas passes through the filter member and passes through a deposition area where the deposited object is located in the process space. ,
The chamber drum is,
An exhaust port through which the process gas in the process space is exhausted, and
The deposition apparatus further includes a gas discharge pipe, one end of which is connected to the exhaust hole and the other end of which protrudes into the process space to divert the exhaust path of the process gas, to prevent the deposited material from moving to the exhaust hole. According to claim 1,
A deposition apparatus further comprising a driving unit that rotates the chamber drum. According to clause 2,
The driving unit rotates the chamber drum with a direction intersecting the self-weight direction of the deposited object as a rotation axis,
At least a portion of a side surface of the chamber drum surrounding the rotation axis is formed by the filter member. According to clause 2,
The gas injection unit,
a deposition gas injection unit that sprays the process gas toward the filter member to pass through the deposition area; and
A deposition auxiliary unit that injects the process gas toward the filter member to pass through a separation area spaced apart from the deposition area to prevent the deposited material from coming into close contact with the filter member and rotating with the filter member. Deposition device. According to clause 2,
The driving unit,
A rotating heater connected to the chamber drum to rotate the chamber drum and transmitting heat necessary for deposition of the deposited material to the chamber drum. According to clause 2,
At one end of the chamber drum, a mounting end is formed that is detachably coupled to a rotating end that rotates the chamber drum in the driving unit,
An exhaust port through which the process gas in the process space is exhausted is formed at the other end of the chamber drum,
a chamber housing that provides a receiving space for accommodating the chamber drum and is connected to the driving unit so that the rotating end is exposed to the receiving space; and
A cover housing that is detachably mounted on the chamber housing to separate the accommodation space from the external space and has an exhaust passage connected to the exhaust port when mounted. delete According to claim 1,
It further includes a driving unit that rotates the chamber drum,
The gas discharge pipe is,
A body with one end connected to the exhaust port and the other end protruding into the process space, and
A deposition apparatus comprising a stirring member that rotates with the body during rotation of the chamber drum and protrudes from the body to stir the plurality of deposited objects. According to claim 1,
The process gas includes different first gases and second gases,
The gas injection unit,
injection block;
a first gas flow path formed in the injection block through which the first gas moves;
a spray nozzle connected to the first gas flow path to spray the first gas toward the filter member;
a second gas flow path formed in the injection block through which the second gas moves; and
A deposition device comprising a spray hole connected to the second gas flow path and spraying the second gas toward the filter member. According to clause 9,
The injection nozzle is disposed in the injection hole, the first gas is injected toward the filter member through the injection nozzle, and the second gas is injected through a gap between the injection hole and the injection nozzle. Device. According to claim 1,
The process gas includes a deposition gas that reacts with the deposited material and a purge gas that does not react with the deposited material,
The gas injection unit,
a deposition gas injection unit that sprays the deposition gas toward the filter member to pass through the deposition area;
a first deposition auxiliary unit that sprays the purge gas from one side of the deposition gas injection unit toward the process space; and
Including; a second deposition auxiliary unit that sprays the purge gas on the other side of the deposition gas injection unit in a direction crossing the gas injection direction of the first deposition auxiliary unit;
A deposition apparatus in which the deposition gas sprayed by the flow of the purge gas sprayed from the first deposition auxiliary unit and the second deposition auxiliary unit is concentrated in the deposition area.

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