KR102645782B1 - Slitting apparatus of substrate for superconducting wire and superconducting wire slitting method using the same - Google Patents

Abstract

The present invention relates to a slitting device for superconducting wires and a slitting method using the same, comprising a supply unit that supplies superconducting wires with a buffer layer, a superconducting layer, and a protective layer formed on a substrate, and a slitting device that slits the superconducting wires supplied from the supply unit. It includes a slitting part, and the slitting part is characterized by slitting the superconducting wire using a slitting laser.

Description

Slitting device for superconducting wire and slitting method using the same {SLITTING APPARATUS OF SUBSTRATE FOR SUPERCONDUCTING WIRE AND SUPERCONDUCTING WIRE SLITTING METHOD USING THE SAME}

The present invention relates to a slitting device for superconducting wires and a slitting method using the same. A slitting device for superconducting wires that can improve the performance of superconducting wires by reducing damage occurring during slitting of superconducting wires, and a slitting method using the same. It's about how to chat.

Superconductors can conduct current without loss of power. For example, superconductors have the characteristic of having zero resistance below the critical temperature. Due to these characteristics, superconductors are being researched and developed for commercialization in power devices such as cables, transformers, generators, current limiters, nuclear fusion devices, and motors, as well as medical/bio application devices such as magnetic resonance imaging (MRI) and nuclear magnetic resonance (NMR). This is being actively done.

In particular, high temperature superconductor (HTS) materials, which are oxide superconductors, provide a means to transport large amounts of current with extremely low losses at liquid nitrogen temperature (77K).

The superconducting wire is made by forming a buffer layer composed of Al ₂ O ₃ , Y ₂ O ₃ , MgO, and LaMnO ₃ on a metal substrate made of Hastelloy or STS, then forming a ReBaCuO layer, which is a superconducting film, and Ag covers the entire surface of the wire. It is formed as follows, and finally Cu is plated to complete the wire production.

In general, slitting of superconducting wire uses a mechanical slitting cutter, which may cause plastic deformation on the cut surface of the superconducting wire and cause cracks to occur inside the cut surface.

As a result, there is a problem that the mechanical and electrical properties of the superconducting wire may deteriorate, ultimately causing delamination and critical current deterioration of the superconducting wire.

Therefore, there is a need to improve this.

The background technology of the present invention is published in Republic of Korea Patent Publication No. 10-1593101, title of the invention: Ceramic wire, method of manufacturing the same, and device for manufacturing the same.

The present invention was made to improve the above problems, and provides a slitting device for superconducting wires that can improve the performance of superconducting wires by reducing damage generated during slitting of superconducting wires, and a slitting method using the same. The purpose is to

The slitting device for superconducting wire according to the present invention includes a supply unit for supplying a superconducting wire on which a buffer layer, a superconducting layer, and a protective layer are formed on a substrate, and a slitting unit for slitting the superconducting wire supplied from the supply unit, The slitting unit may slit the superconducting wire using a slitting laser.

Additionally, the supply unit may include a supply vacuum chamber in a vacuum state and an unwinding roller provided in the supply vacuum chamber from which the superconducting wire is unwinded.

In addition, the slitting unit includes a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes, and the slitting laser includes a first slitting laser that forms a cutting groove in the superconducting wire and within the cutting groove. It may include a second slitting laser for slitting the superconducting wire.

Additionally, the slitting unit may include a cooling block that cools the superconducting wire to prevent deformation due to heat generated during slitting of the superconducting wire by the slitting laser.

Additionally, the first slitting laser may be made of an ion beam, and the cutting groove formed by the first slitting laser may have rounded edges on both sides.

Additionally, the second slitting laser may be a femtosecond pulse laser that slits the center of the cutting groove formed by the first slitting laser.

Additionally, the first slitting laser may be provided inside the slitting vacuum chamber, and the second slitting laser may be provided outside the slitting vacuum chamber.

Additionally, the slitting unit may include a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes, and the slitting laser may be a femtosecond pulse laser.

In addition, it includes a winding part for winding each of the superconducting wires slit by the slitting part, wherein the winding part is arranged in a vertical direction in a winding vacuum chamber and the winding vacuum chamber, and winds each of the slitted superconducting wires. It may include a take-up roller.

Additionally, the winding part may include a coating part that coats the superconducting wire in the winding vacuum chamber.

Additionally, the coating unit may fill the winding vacuum chamber with nitrogen to coat the cut surface of the superconducting wire with nitrogen.

The slitting method of a superconducting wire according to the present invention includes a supply step of supplying a superconducting wire on which a buffer layer, a superconducting layer, and a protective layer are formed on a substrate, and a slitting step of slitting the supplied superconducting wire using a slitting laser. can do.

In addition, the slitting step includes a first slitting step of removing the buffer layer and the superconducting layer on the substrate by a first slitting laser to form a cutting groove in the superconducting wire, and a second slitting within the cutting groove. It may include a second slitting step of cutting the substrate with a laser.

Additionally, the first slitting laser may be made of an ion beam, and the cutting groove formed by the first slitting laser may have rounded edges on both sides.

In addition, the second slitting laser is made of a femtosecond pulse laser, and the second slitting step can slit the center of the cutting groove formed by the first slitting laser.

Additionally, it may include a winding step of winding the superconducting wire slit by the slitting laser, and in the winding step, the slit superconducting wire may be wound on a vertically arranged winding roller.

Additionally, the superconducting wire may be supplied, slitted, and wound in a vacuum state.

In addition, a coating step of coating the cut surface of the superconducting wire slit after the winding step may be further performed.

Additionally, in the coating step, after winding of the superconducting wire is completed, nitrogen is filled in the winding vacuum chamber to coat the cut surface of the superconducting wire with nitrogen.

As described above, the slitting device for superconducting wire according to the present invention and the slitting method using the same can reduce damage to the superconducting wire and improve the performance of the superconducting wire by slitting the superconducting wire with a slitting laser. .

In particular, by slitting the superconducting layer with a slitting laser, plastic deformation can be prevented and the effective current transfer area can be maintained as much as possible.

In addition, in the present invention, the slitting laser consists of a first slitting laser made of an ion beam and a second slitting laser made of a femtosecond pulse laser, and after forming a cutting groove through melting by the first slitting laser, the second slitting laser is used. By slitting with a laser, the superconducting layer is not cut off or only a part of it can be removed, thereby improving the performance of the superconducting wire.

In addition, the present invention is equipped with a supply vacuum chamber, a slitting vacuum chamber, and a winding vacuum chamber, so that all processes for supplying, slitting, and winding the superconducting wire are carried out in a vacuum state, thereby preventing corrosion of the cut surface of the superconducting wire due to moisture adhesion. You can.

In addition, in the present invention, nitrogen is filled from the nitrogen filling section after completion of winding in the winding vacuum chamber, so that the pressure can be maintained horizontally when vacuum is broken, and nitrogen coating is applied to the cut surface of the superconducting wire, preventing moisture adhesion even when exposed to the atmosphere. Corrosion due to corrosion can be prevented.

1 is a diagram for explaining the structure of a superconducting wire according to an embodiment of the present invention.
Figure 2 is a diagram for explaining the configuration of a slitting device for superconducting wire according to an embodiment of the present invention.
Figure 3 is a front view showing the formation of cutting grooves by the first slitting laser of the slitting device for superconducting wire according to an embodiment of the present invention.
Figure 4 is a side cross-sectional view showing the formation of cutting grooves by the first slitting laser of the slitting device for superconducting wire according to an embodiment of the present invention.
Figure 5 is a photograph showing the cutting groove by the first slitting laser of the slitting device for superconducting wire according to an embodiment of the present invention.
Figure 6 is a diagram for explaining the cutting process by the slitting unit of the slitting device for superconducting wire according to an embodiment of the present invention.
Figure 7 is a diagram for explaining a modification of the slitting laser of the superconducting wire slitting device according to an embodiment of the present invention.
Figure 8 is a flowchart showing a slitting method for superconducting wire according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of a slitting device for superconducting wire and a slitting method using the same according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines or sizes of components shown in the drawing may be exaggerated for clarity and convenience of explanation.

In addition, the terms described below are terms defined in consideration of functions in the present invention, and may vary depending on the intention or custom of the user or operator. Therefore, definitions of these terms should be made based on the content throughout this specification.

FIG. 1 is a diagram for explaining the structure of a superconducting wire according to an embodiment of the present invention, FIG. 2 is a diagram for explaining the structure of a slitting device for a superconducting wire according to an embodiment of the present invention, and FIG. 3 is a front view showing the formation of cutting grooves by the first slitting laser of the slitting device for superconducting wires according to an embodiment of the present invention, and Figure 4 is a front view showing the formation of cutting grooves by the first slitting laser of the slitting device for superconducting wires according to an embodiment of the present invention. 1 is a side cross-sectional view showing the formation of a cutting groove by a slitting laser, and Figure 5 is a photograph showing a cutting groove formed by a first slitting laser of a slitting device for superconducting wire according to an embodiment of the present invention, and Figure 6 is a photograph showing the cutting groove formed by a first slitting laser. It is a diagram for explaining the cutting process by the slitting unit of the superconducting wire slitting device according to an embodiment of the present invention, and Figure 7 is a modification of the slitting laser of the superconducting wire slitting device according to an embodiment of the present invention. It is a drawing for explaining an example, and FIG. 8 is a flowchart showing a slitting method of a superconducting wire according to an embodiment of the present invention.

Referring to FIGS. 1 to 7 , the slitting device 100 for superconducting wire 10 according to an embodiment of the present invention may include a supply unit 110 and a slitting unit 120.

The supply unit 110 provides the superconducting wire 10 and consists of a supply vacuum chamber 112 in a vacuum state and an unwinding roller 114 provided in the supply vacuum chamber 112 from which the superconducting wire 10 is unwound. . The superconducting wire 10 is wound around the unwinding roller 114, and as the unwinding roller 114 rotates, the superconducting wire 10 is sequentially pulled out and provided to the slitting unit 120.

At this time, the superconducting wire 10 provided from the supply unit 110 is provided with a protective layer 18 formed on both sides.

In more detail, referring to FIG. 1, a buffer layer 14 and a superconducting layer 16 are formed on the substrate 12, and a protective layer 18 formed so that Ag covers the entire surface is formed only on both sides of the superconducting wire 10. It can be provided in the formed state.

In addition, since the supply vacuum chamber 112 is in a vacuum state, the superconducting wire 10, which is vulnerable to moisture, can be prevented from being corroded.

The slitting unit 120 slits the superconducting wire 10 supplied from the supply unit 110, and can slit the superconducting wire 10 using the slitting laser 124.

Referring to FIG. 2, the slitting laser 124 is a first slitting laser 125 that forms a cutting groove 19 in the superconducting wire 10 and slitting the superconducting wire 10 within the cutting groove 19. It may be composed of a second slitting laser 126 that performs slitting.

The first slitting laser 125 can remove the buffer layer 14 and the superconducting layer 16 on the substrate 12 to form a cutting groove 19 in the superconducting wire 10.

Additionally, the slitting unit 120 may include a slitting vacuum chamber 122 through which the superconducting wire 10 supplied from the supply unit 110 passes. This means that the slitting of the superconducting wire 10 by the slitting laser 124 can be performed in a vacuum state, thereby protecting the superconducting wire 10 from moisture and preventing corrosion.

The first slitting laser 125 is made of an ion beam, and the cutting groove 19 formed by the first slitting laser 125 may have rounded edges on both sides.

In more detail, as shown in FIGS. 3 and 4, the first slitting laser 125 includes ion milling, and ion milling is a patterning mask in which slits (S) are formed in the form of a wide beam by ions of an inert gas (Argon). Using (125a), the material can be etched by accelerating it to the surface of the superconducting wire 10 in a vacuum state. That is, the penetration depth is very small due to the first slitting laser 125 composed of an ion beam, but it emits energy at once in a small range without scattering, so the buffer layer 14 and the superconducting layer 16 on the substrate 12 are separated. It can be removed by rapid melting and evaporation.

Accordingly, as shown in FIG. 5, an inverted mountain shape is formed, and rounds can be formed at both corners.

In addition, a cooling block 125b is provided at the lower part of the superconducting wire 10 to prevent deformation and damage due to heat generated during slitting by the first slitting laser 125.

As shown in FIG. 4, the cooling block 125b is formed in a cross-sectional shape with a convex center when viewed in the direction in which the superconducting wire 10 moves, thereby minimizing the contact area with the superconducting wire 10. This is to prevent damage to the superconducting wire 10 by the cooling block 125b due to friction, etc.

It is preferable that this cooling block (125b) is made of copper material with excellent thermal conductivity.

The second slitting laser 126 consists of a femtosecond pulse laser that slits the center of the cutting groove 19 formed by the first slitting laser 125.

Femto second laser technology is a laser system technology that generates pulses with an extremely short time width of one quadrillionth of a second.

When using this femtosecond pulse laser as a slitting laser, distortion caused by shock waves, surface debris, deterioration of surrounding materials due to heat, and occurrence of micro cracks can be prevented.

According to this embodiment, as shown in FIG. 6, a cutting groove 19 is formed by removing the buffer layer 14 and the superconducting layer 16 by the first slitting laser 124, and the cutting groove 19 is formed within the cutting groove 19. By slitting the substrate 12 by the second slitting laser 126, the superconducting layer 16 is not cut or only part of it is removed, thereby minimizing the loss of the superconducting layer 16, thereby reducing the effective current transfer area. can be maintained as much as possible.

The first slitting laser 125 is provided inside the slitting vacuum chamber 122, and the second slitting laser 126 is provided outside the slitting vacuum chamber 122. At this time, the slitting vacuum chamber 122 has a laser beam introduction part 127 formed on one surface so that the laser beam of the second slitting laser 126 can be transmitted.

In this embodiment, the first slitting laser 125 is shown as ion milling, but it is not limited to this, and the first slitting laser 125 is formed as a general laser and is disposed on the outside of the slitting vacuum chamber 122. It is provided and may be transmitted through the glass on the upper surface of the slitting vacuum chamber 122. In other words, the buffer layer 14 and the superconducting layer 16 can be removed by rapidly melting and evaporating by reducing the amount of energy of the general laser.

At this time, the laser introduction part 127 of the slitting vacuum chamber 122 is formed with an anti-reflective coating layer, so that the general laser and the femtosecond pulse laser, which is the second slitting laser 126, can be transmitted into the slitting vacuum chamber 122. .

In addition, a plurality of first slitting lasers 125 and second slitting lasers 126 may be installed in a direction perpendicular to the direction of travel of the superconducting wire 10.

Each superconducting wire 10 slit by the slitting unit 120 is wound by the winding unit 130.

The winding unit 130 includes a winding vacuum chamber 132 and a winding roller 134 that is arranged in the vertical direction within the winding vacuum chamber 132 and winds each of the slitted superconducting wires 10.

Since the slitted superconducting wire 10 is wound in a vacuum state within the winding vacuum chamber 132, it is protected from moisture and can prevent corrosion.

As described above, in this embodiment, the superconducting wire 10 can be supplied, slitted, and wound in a vacuum state, so it can be protected from moisture.

Additionally, the slit superconducting wire 10 may be guided by a plurality of guide rollers.

The winding part 130 may include a coating part 140. The coating unit 140 coats the superconducting wire 10 in the winding vacuum chamber 132, and the cut surface of the superconducting wire 10 can be coated with nitrogen by filling the winding vacuum chamber 132 with nitrogen. This fills nitrogen after completion of winding of the superconducting wire 10 by the winding roller 134, so that not only can the pressure be leveled when the vacuum is broken, but nitrogen coating can also be performed at once.

To explain this in detail, the coating unit 140 performs nitrogen coating by introducing high purity (99.99% or higher) nitrogen gas into the winding vacuum chamber 132 for several minutes (5 to 10 minutes) through an MFC (Mass Flow Controller). do. Introduction of nitrogen gas can be repeated several times.

Then, when the nitrogen coating is completed, the vent valve 141 connected to the winding vacuum chamber 132 is opened so that the internal pressure of the winding vacuum chamber 132 matches atmospheric pressure.

As a result, the cut surface of the slitted superconducting wire 10 is coated with nitrogen, thereby protecting the superconducting wire 10 from corrosion due to oxidation by oxygen and moisture adhesion when exposed to atmospheric conditions.

Meanwhile, as shown in FIG. 7, as a modification of the slitting laser 124 of the slitting device 100 of the superconducting wire 10 according to an embodiment of the present invention, the slitting laser 124 uses a femtosecond pulse. It could be a laser. That is, the slitting laser 124 may be composed of a single femtosecond pulse laser provided on the outside of the slitting vacuum chamber 122. As described above, the femtosecond pulse laser transmits the laser through the laser beam introduction part 127 formed on one side of the slitting vacuum chamber 122 and slits the superconducting wire 10 passing through the inside of the slitting vacuum chamber 122. You can chat.

Hereinafter, a slitting method using a slitting device for superconducting wire according to an embodiment of the present invention will be described.

Referring to FIG. 8, the slitting method of the superconducting wire 10 using the slitting device 100 according to an embodiment of the present invention includes a supply step (S100) and a slitting step (S200).

The supply step (S100) is to provide the superconducting wire 10 from the supply unit 110. The superconducting wire 10 is wound around the unwinding roller 114, and the superconducting wire 10 is sequentially withdrawn from the slitting unit. Supplied as (120).

At this time, the superconducting wire 10 has a buffer layer 14 and a superconducting layer 16 formed on a rolled substrate 12, and a protective layer 18 formed so that Ag covers the entire surface is formed on both sides of the superconducting wire 10. Can only be provided in the formed state.

The buffer layer 14 is formed by treating the surface using the electrolytic polishing process described above, depositing an Al ₂ O ₃ anti-diffusion layer on a metal substrate 12 made of Hastelloy or STS, and depositing a Y ₂ O ₃ seed layer on top. It is formed by sequentially depositing _three layers of MgO and LaMnO.

And, the superconducting layer 16 is formed by depositing a ReBaCuO layer, which is a superconducting film.

After the buffer layer 14 and the superconducting layer 16 are formed on the entire surface of the substrate 12, the first protective layer 18 is formed. The first protective layer 18 may be supplied to the slitting unit 120 in a state in which Ag is deposited to cover both sides of the substrate 12 to protect the ReBaCuO superconducting metal oxide containing a rare earth material.

And, the unwinding roller 114 is provided in the supply vacuum chamber 112. Therefore, since the superconducting wire 10 is supplied in a vacuum state, it is possible to prevent the superconducting wire 10, which is vulnerable to moisture, from being corroded.

The slitting step (S200) is to slit the superconducting wire 10 supplied from the supply unit 110 by the slitting laser 124, and the buffer layer ( A first slitting step (S210) of forming a cutting groove 19 in the superconducting wire 10 by removing the superconducting layer 16 and the protective layer 18 (14) and a second slit within the cutting groove 19. It may consist of a second slitting step (S220) of slitting the substrate 12 by the ting laser 126.

The first slitting laser 125 is made of an ion beam, and the second slitting laser 126 is made of a femtosecond pulse laser. And, the first slitting laser 125 is provided within the slitting vacuum chamber 122, and the second slitting laser 126 is provided outside the slitting vacuum chamber 122.

Therefore, the buffer layer 14 is formed by using the pattering mask 125a in the form of a wide beam to direct ions of the inert gas (Argon) to the surface of the superconducting wire 10 in a vacuum state by the first slitting laser 125 consisting of an ion beam. ) and the superconducting layer 16 can be removed by rapidly melting and evaporating (S210).

By using this first slitting laser 125, both corners can be rounded in an inverted shape as shown in FIG. 5. As a result, the loss of the superconducting layer 16 can be minimized, sharp edges do not occur at the edges of the cut surface, and cracks do not occur inside, so the effective current transfer area can be maintained as much as possible, thereby improving the mechanical and electrical stability of the superconducting wire 10. Performance can be improved.

Afterwards, the second slitting laser 126 made of a femtosecond pulse laser is transmitted inside through the laser beam introduction part 127 of the slitting vacuum chamber 122, and the cutting groove formed by the first slitting laser 125 ( Slit the center of 19) (S220).

The second slitting laser 126 can prevent distortion caused by shock waves, fragments on the surface, deterioration of surrounding materials due to heat, and occurrence of microcracks, thereby forming a cutting surface without plastic deformation.

Since this slitting step (S200) is also performed within the slitting vacuum chamber 122, the superconducting wire 10 can be protected from moisture in the atmosphere, thereby preventing corrosion of the cut surface.

Meanwhile, as a modification of this embodiment, as shown in FIG. 7, the slitting laser 224 in the slitting step (S200) sends a laser into the inside through the laser beam introduction part 127 of the slitting vacuum chamber 122. It may be composed of a single slitting laser 224 that transmits light. At this time, the slitting laser 224 is made up of a femtosecond pulse laser and can slit the superconducting wire 10 to a certain size without cracking around the cutting surface.

Afterwards, a winding step (S300) of winding the superconducting wire 10 slit by the slitting laser (124, 224) is performed. In the winding step (S300), the slit superconducting wire 10 is wound on a vertically arranged winding roller 134, and the superconducting wire 10 supplied in a wide width is slit into a plurality of pieces and each winding is vertically arranged. It may be wound on the roller 134.

At this time, in the winding step (S300), the superconducting wire 10 can be protected from moisture in the atmosphere because the winding is carried out in a vacuum state within the winding vacuum chamber 132.

In other words, the superconducting wire 10 can be protected from moisture in the atmosphere because all processes of supply (S100), slitting (S200), and winding (S300) are performed in a vacuum state.

After the winding step (S300), a coating step (S400) of coating the cut surface of the slitted superconducting wire 10 is further performed. The coating step (S400) is to coat the superconducting wire 10 in the winding vacuum chamber 132. After the winding of the superconducting wire 10 is completed, nitrogen is filled into the winding vacuum chamber 132 to form the superconducting wire 10. The cut surface can be nitrogen coated.

This coating step (S400) makes it possible to level the pressure of the vacuum release of the wound vacuum chamber 132, which is in a vacuum state, and to coat the cut surface of the superconducting wire 10 in a single process.

This means that the coating unit 140 can perform nitrogen coating by introducing high-purity (99.99% or higher) nitrogen gas into the winding vacuum chamber 132 for several minutes (5 to 10 minutes) through an MFC (Mass Flow Controller).

As a result, the cut surface of the superconducting wire 10 is coated with nitrogen, thereby preventing oxidation by oxygen and corrosion by moisture adhesion when exposed to atmospheric conditions.

Afterwards, when the nitrogen coating is completed, the vent valve 141 connected to the winding vacuum chamber 132 is opened so that the internal pressure of the winding vacuum chamber 132 matches the atmospheric pressure.

As described above, according to the present invention, by slitting the superconducting wire using a slitting laser, plastic deformation of the superconducting wire can be prevented and the effective current transfer area can be maintained as much as possible.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will recognize that various modifications and other equivalent embodiments are possible therefrom. You will understand.

Therefore, the true technical protection scope of the present invention should be determined by the scope of the patent claims.

10: superconducting wire 12: substrate
14: buffer layer 16: superconducting layer
18: protective layer 19: cutting groove
100: slitting device 110: supply unit
112: Supply vacuum chamber 114: Unwinding roller
120: Slitting unit 122: Slitting vacuum chamber
124, 224: Slitting laser 125: First slitting laser
125a: Pattering mask 125b: Cooling block
126: Second slitting laser 130: Winding unit
132: Winding vacuum chamber 134: Winding roller
140: coating part

Claims (19)

A supply unit that supplies superconducting wires on which a buffer layer, a superconducting layer, and a protective layer are formed on a substrate; And a slitting unit for slitting the superconducting wire supplied from the supply unit,
The slitting unit slits the superconducting wire using a slitting laser,
The slitting laser includes a first slitting laser that forms a cutting groove in the superconducting wire; and
A slitting device for superconducting wire, comprising a second slitting laser for slitting the superconducting wire within the cutting groove.
According to clause 1,
The supply unit includes a supply vacuum chamber in a vacuum state; and
A slitting device for superconducting wire, comprising an unwinding roller provided in the supply vacuum chamber and unwinding the superconducting wire.
In paragraph 1
A slitting device for superconducting wire, wherein the slitting unit includes a slitting vacuum chamber through which the superconducting wire supplied from the supply unit passes.
According to clause 1,
The slitting unit is a slitting device for superconducting wire, characterized in that it includes a cooling block that cools the superconducting wire to prevent deformation due to heat generated during slitting of the superconducting wire by the slitting laser.
According to clause 1,
The first slitting laser consists of an ion beam,
A slitting device for superconducting wire, wherein the cutting groove formed by the first slitting laser has both edges formed in a rounded shape.
According to clause 1,
The second slitting laser is a femtosecond pulse laser that slits the center of the cutting groove formed by the first slitting laser.
According to clause 3,
A slitting device for superconducting wire, characterized in that the first slitting laser is provided inside the slitting vacuum chamber, and the second slitting laser is provided outside the slitting vacuum chamber.
delete According to clause 1,
It includes a winding unit that winds each of the superconducting wires slit by the slitting unit;
The winding unit includes a winding vacuum chamber; and
A slitting device for superconducting wire, comprising a winding roller arranged vertically in the winding vacuum chamber and winding each slitted superconducting wire.
According to clause 9,
A slitting device for a superconducting wire, wherein the winding unit includes a coating unit that coats the superconducting wire in the winding vacuum chamber.
According to clause 10,
A slitting device for superconducting wire, wherein the coating unit fills the winding vacuum chamber with nitrogen to coat the cut surface of the superconducting wire with nitrogen.
A supply step of supplying a superconducting wire having a buffer layer, a superconducting layer, and a protective layer formed on a substrate; and
A slitting step of slitting the supplied superconducting wire using a slitting laser,
The slitting step includes a first slitting step of removing the buffer layer and the superconducting layer on the substrate using a first slitting laser to form a cutting groove in the superconducting wire; and
A second slitting step of cutting the substrate within the cutting groove using a second slitting laser,
The second slitting step is a slitting method of a superconducting wire, characterized in that slitting the center of the cutting groove formed by the first slitting laser.
delete According to clause 12,
The first slitting laser consists of an ion beam,
A slitting method for a superconducting wire, wherein the cutting groove formed by the first slitting laser has both edges formed in a rounded shape.
According to clause 12,
A method of slitting a superconducting wire, characterized in that the second slitting laser is made of a femtosecond pulse laser.
According to clause 12,
A winding step of winding the superconducting wire slit by the slitting laser;
The winding step is a slitting method of a superconducting wire, characterized in that the slitted superconducting wire is wound on a vertically arranged winding roller.
According to clause 16,
A slitting method for a superconducting wire, characterized in that the superconducting wire is supplied, slitted, and wound in a vacuum state.
According to clause 16,
A method of slitting a superconducting wire, characterized in that a coating step of coating a cut surface of the slitted superconducting wire after the winding step is further performed.
According to clause 18,
The coating step is a slitting method of a superconducting wire, characterized in that after winding of the superconducting wire is completed, nitrogen is filled in the winding vacuum chamber to coat the cut surface of the superconducting wire with nitrogen.

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