KR102644438B1 - 웨이퍼 형상 물품들의 표면들을 처리하기 위한 장치 - Google Patents

웨이퍼 형상 물품들의 표면들을 처리하기 위한 장치 Download PDF

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Publication number
KR102644438B1
KR102644438B1 KR1020160144909A KR20160144909A KR102644438B1 KR 102644438 B1 KR102644438 B1 KR 102644438B1 KR 1020160144909 A KR1020160144909 A KR 1020160144909A KR 20160144909 A KR20160144909 A KR 20160144909A KR 102644438 B1 KR102644438 B1 KR 102644438B1
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KR
South Korea
Prior art keywords
chuck
chuck body
wafer
gripping pins
series
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KR1020160144909A
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English (en)
Korean (ko)
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KR20170054279A (ko
Inventor
안드레아스 글라이스너
마이클 브루거
토마스 비른스베르거
Original Assignee
램 리서치 아게
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Publication of KR20170054279A publication Critical patent/KR20170054279A/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H01L21/68721—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
    • B23B31/02—Chucks
    • B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
    • B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
    • B23B31/16—Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially
    • B23B31/16004—Jaws movement actuated by one or more spiral grooves
    • H01L21/68728—
    • H01L21/68735—
    • H01L21/6875—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2260/00—Details of constructional elements
    • B23B2260/10—Magnets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/19—Radially reciprocating jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/19—Radially reciprocating jaws
    • Y10T279/1926—Spiral cam or scroll actuated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Units (AREA)
KR1020160144909A 2015-11-03 2016-11-02 웨이퍼 형상 물품들의 표면들을 처리하기 위한 장치 Active KR102644438B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/931,577 2015-11-03
US14/931,577 US9887120B2 (en) 2015-11-03 2015-11-03 Apparatus for treating surfaces of wafer-shaped articles

Publications (2)

Publication Number Publication Date
KR20170054279A KR20170054279A (ko) 2017-05-17
KR102644438B1 true KR102644438B1 (ko) 2024-03-06

Family

ID=58635242

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160144909A Active KR102644438B1 (ko) 2015-11-03 2016-11-02 웨이퍼 형상 물품들의 표면들을 처리하기 위한 장치

Country Status (5)

Country Link
US (1) US9887120B2 (https=)
JP (1) JP6792414B2 (https=)
KR (1) KR102644438B1 (https=)
CN (1) CN106952859B (https=)
TW (1) TWI710056B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7256728B2 (ja) 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
CN110976933B (zh) * 2019-12-10 2021-10-29 安庆师范大学 一种机械精加工用机床
JP7558043B2 (ja) * 2020-11-30 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
TWI831361B (zh) * 2022-09-06 2024-02-01 天正國際精密機械股份有限公司 檢測元件的承載裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103521A (ja) 2006-10-19 2008-05-01 Dainippon Screen Mfg Co Ltd 基板回転保持装置および基板処理装置

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US2977128A (en) * 1959-03-19 1961-03-28 Judelshon Inc Oscar I Chuck for rotary knife cutting machine
US3892419A (en) * 1974-06-19 1975-07-01 Gen Motors Corp Balanced floating machine tool chuck
US4222577A (en) * 1978-07-19 1980-09-16 Giffin Brian K Centering and holding devices for potter's wheelhead
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
US5531549A (en) * 1989-07-28 1996-07-02 Great Bay Tool Corporation Auto-lock drill chuck
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
AT405225B (de) 1995-05-02 1999-06-25 Sez Semiconduct Equip Zubehoer Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer
JPH11354617A (ja) * 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
US6394691B1 (en) * 2000-07-21 2002-05-28 George V. Stephan Gripping apparatus
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP4468775B2 (ja) * 2004-09-14 2010-05-26 大日本スクリーン製造株式会社 基板保持回転装置
ITMO20050009A1 (it) * 2005-01-19 2006-07-20 Gino Ferrari Apparato di serraggio.
TWI348934B (en) * 2007-08-30 2011-09-21 Lam Res Ag Apparatus for wet treatment of plate-like articles
TWI591757B (zh) * 2009-03-31 2017-07-11 蘭研究公司 用以處理盤狀物品的裝置
US9190310B2 (en) * 2010-04-16 2015-11-17 Lam Research Ag Grounded chuck
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
US20120152069A1 (en) * 2010-12-15 2012-06-21 Mori Seiki Co., Ltd. CNC MACHINES, ADJUSTABLE TOOLS FOR CNC MACHINES, AND METHODS of OPERATING AN ADJUSTABLE TOOL ON A CNC MACHINE
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
US10269615B2 (en) * 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
TWI725067B (zh) * 2015-10-28 2021-04-21 美商應用材料股份有限公司 可旋轉靜電夾盤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103521A (ja) 2006-10-19 2008-05-01 Dainippon Screen Mfg Co Ltd 基板回転保持装置および基板処理装置

Also Published As

Publication number Publication date
US9887120B2 (en) 2018-02-06
US20170125281A1 (en) 2017-05-04
KR20170054279A (ko) 2017-05-17
TW201727821A (zh) 2017-08-01
CN106952859B (zh) 2020-10-02
TWI710056B (zh) 2020-11-11
CN106952859A (zh) 2017-07-14
JP6792414B2 (ja) 2020-11-25
JP2017108115A (ja) 2017-06-15

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