KR102614453B1 - High pressure wafer processing apparatus - Google Patents

Abstract

The present invention includes an inner chamber having an inner housing formed to accommodate a substrate to be processed, and an inner door formed to open and close the inner housing; an outer chamber having an outer housing accommodating the inner chamber and an outer door configured to move between a closed state to close the outer housing and an open state to open the outer housing; and when the process gas for processing the substrate to be processed in the inner chamber has a first pressure higher than atmospheric pressure, a protective gas in the outer chamber is set in relation to the first pressure and has a second pressure higher than atmospheric pressure. Provided is a high-pressure substrate processing apparatus, including a fastening module that fastens the outer housing and the outer door in the closed state and allows the outer door to move along a straight path when transitioning to the open state so as to maintain the outer housing and the outer door in the closed state. do.

Description

High pressure substrate processing device {HIGH PRESSURE WAFER PROCESSING APPARATUS}

The present invention relates to processing equipment used to process substrates in high pressure environments.

Generally, during the manufacturing process of a semiconductor device, various treatments are performed on the semiconductor substrate. Examples of such treatments include oxidation, nitriding, silicide, ion implantation, and deposition processes. There is also a hydrogen or deuterium heat treatment process to improve the interface properties of semiconductor devices.

The gas used to process the substrate is supplied to the chamber at high pressure and acts on the semiconductor substrate. To maintain the chamber at high pressure, the chamber's housing must be securely closed by a door.

If the closed state of the chamber is loosened by high-pressure gas, a gap may form between the housing and the door. These gaps may serve as passages through which gas within the chamber leaks to the outside.

One object of the present invention is to provide a high-pressure substrate processing device that can firmly maintain a closed state between the housing and the door even under high pressure within the chamber.

A high-pressure substrate processing apparatus according to one aspect of the present invention for realizing the above-described object includes an internal chamber formed to accommodate a substrate to be processed; an outer chamber having an outer housing accommodating the inner chamber and an outer door configured to move between a closed state to close the outer housing and an open state to open the outer housing; and when the process gas for processing the substrate to be processed in the inner chamber has a first pressure higher than atmospheric pressure, a protective gas in the outer chamber is set in relation to the first pressure and has a second pressure higher than atmospheric pressure. and a fastening module configured to fasten the outer housing and the outer door in the closed state to maintain the outer housing and the outer door in the closed state. a pressing unit configured to move between a first posture pressing against another of the exterior doors and a second posture allowing the exterior door to move along a straight path from the closed state to the open state; and a driving unit configured to drive the pressing unit to switch the pressing unit between the first posture and the second posture, wherein the pressing unit corresponds to one of the external housing and the external door. support part; And it may include a driven part connected to the support part and driven to rotate by engaging the driving unit.

Here, the pressing unit may be formed to rotate between the first posture and the second posture about a rotation axis that passes through the center of the main surface of the external door and is different from a central axis perpendicular to the main surface.

Here, the direction of action of the force by which the pressing unit presses one of the outer housing and the outer door against the other one of the outer housing and the outer door by driving the driving unit includes the main surface of the outer door. It may be a direction that passes through the plane.

Here, the support part is an area near one end of the pressing unit, and the driven part is an area near the other end of the pressing unit, and may be arranged along a direction intersecting the extension direction of the support part.

Here, the driving unit may include a lifting type driver configured to lift and lower the other one of the external housing and the external door along the longitudinal direction and drive the driven part.

Here, the lifting type driver may push the driven part in a direction away from the external housing as it moves up or down.

Here, the lifting type actuator may further include a wedge surface engaged with the driven part.

Here, the lifting type actuator may further include a lubricating member that reduces friction with the driven part.

Here, the lifting type driver includes a rotating ring installed to surround the other one of the outer housing and the outer door; a first screw thread formed on the outer peripheral surface of the other one of the outer housing and the outer door; And it may further include a second screw thread formed on the inner peripheral surface of the rotating ring and engaged with the first screw thread.

A high-pressure substrate processing apparatus according to another aspect of the present invention includes a chamber having a housing formed to accommodate a substrate to be processed, and a door formed to move between a closed state to close the housing and an open state to open the housing. ; and a fastening module that fastens the housing and the door in the closed state to maintain the pressure of gas for processing the substrate in the chamber, wherein the fastening module connects the housing and the door in the closed state. configured to move between a first posture that presses one of the doors against the housing and the other of the doors and a second posture that allows the door to move along a straight path from the closed state to the open state. pressurization unit; and a driving unit configured to drive the pressing unit to switch the pressing unit between the first posture and the second posture, wherein the pressing unit includes: a support portion corresponding to one of the housing and the door; And it may include a driven part connected to the support part and driven to rotate by the driving unit.

Here, the pressing unit is formed to rotate around a rotation axis that passes through the center of the main surface of the door and is different from a central axis perpendicular to the main surface, and the driving unit moves the pressing unit in the first posture and the first position. It can be rotated between two postures.

Here, the driving unit may include a wedge surface that pushes the pressing unit in a direction away from the housing by being lowered or lifted along the longitudinal direction of the chamber.

According to the high-pressure substrate processing apparatus according to the present invention configured as described above, the housing and the door containing the substrate and high-pressure gas are maintained in a fastened state by a fastening module, and the fastening module is one of the housing and the door in the closed state. Since the door is moved between a first posture that presses the door against the other and a second posture that allows the door to move to the open state along a straight path, the fastening state between the housing and the door is maintained firmly and the fastening is maintained despite the high pressure in the chamber. The module does not interfere with the intended opening of the chamber.

Figure 1 is a conceptual diagram of a high-pressure substrate processing apparatus 100 according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing the high pressure substrate processing apparatus 100 of FIG. 1 in an open state.
FIG. 3 is a partial cross-sectional view showing a state of the fastening module 150 in a closed state of the high-pressure substrate processing apparatus 100 of FIG. 1 .
FIG. 4 is a partial cross-sectional view showing another state of the fastening module 150 in a closed state of the high-pressure substrate processing apparatus 100 of FIG. 1 .
Figure 5 is a partial cross-sectional view of a high-pressure substrate processing apparatus 200 according to another embodiment of the present invention.
FIG. 6 is a partial cross-sectional view showing another state of the high-pressure substrate processing apparatus 200 of FIG. 5.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention is not limited to the embodiments disclosed below, but may be subject to various changes and may be implemented in various different forms. Only this example is provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but substitutes or adds to the configuration of one embodiment and the configuration of another embodiment, as well as all changes and equivalents included in the technical spirit and scope of the present invention. It should be understood to include substitutes.

The attached drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the attached drawings, and all changes and equivalents included in the spirit and technical scope of the present invention are not limited to the attached drawings. It should be understood to include water or substitutes. In the drawings, components may be expressed exaggeratedly large or small in size or thickness for convenience of understanding, etc., but the scope of protection of the present invention should not be construed as limited due to this.

The terms used in this specification are only used to describe specific implementations or examples, and are not intended to limit the invention. And singular expressions include plural expressions, unless the context clearly dictates otherwise. In the specification, terms such as ~include, ~consist of, etc. are intended to indicate the existence of features, numbers, steps, operations, components, parts, or a combination thereof described in the specification. That is, in the specification, terms such as ~include, ~consist of, etc. should be understood as not precluding the existence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Terms containing ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

When a component is referred to as being "on top" or "below" another component, it should be understood that not only is it placed directly on top of the other component, but there may also be other components in between. .

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

Figure 1 is a conceptual diagram of a high-pressure substrate processing apparatus 100 according to an embodiment of the present invention.

Referring to this drawing, the high-pressure substrate processing apparatus 100 may include an internal chamber 110, an external chamber 120, an air supply module 130, and an exhaust module 140.

The inner chamber 110 forms a receiving space for receiving an object for processing. The inner chamber 110 may be made of a non-metallic material, for example, quartz, to reduce contamination in a high temperature and high pressure working environment. Depending on the operation of a heater (not shown) disposed outside the internal chamber 110, the temperature of the internal chamber 110 may range from hundreds to thousands of degrees Celsius. The object may be, for example, a semiconductor substrate (W, see FIG. 2) mounted on a holder. The holder may be a wafer boat (113, see FIG. 2) capable of stacking the substrate to be processed (W) in multiple layers.

The outer chamber 120 is arranged to accommodate the inner chamber 110. Unlike the inner chamber 110, the outer chamber 120 is free from concerns of causing contamination to the object, and may be made of a metal material. The outer chamber 120 has a hollow shape with an inner space that accommodates the inner chamber 110.

The air supply module 130 supplies gas to the inner chamber 110 and the outer chamber 120. The air supply module 130 has a gas supplier 131 that serves as a source of gas. The gas supplier 131 may selectively provide, for example, hydrogen/deuterium, fluorine, ammonia, chlorine, nitrogen, etc. as process gas for a heat treatment process to the internal chamber 110. The gas supplier 131 may provide, for example, nitrogen, an inert gas, as a protective gas to the external chamber 120. The process gas and the shielding gas are introduced into the inner chamber 110 or the outer chamber 120 through the process gas line 133 or the shielding gas line 135, respectively. The protective gas introduced into the external chamber 120 is specifically supplied to the space between the external chamber 120 and the internal chamber 110.

The process gas and the protective gas may be supplied to form a high pressure higher than atmospheric pressure, for example, from several atmospheres to tens of atmospheres. When the pressure of the process gas is a first pressure and the pressure of the protective gas is a second pressure, they can be maintained in a set relationship (range). For example, the second pressure may be set to be somewhat greater than the first pressure. Such a pressure difference provides the advantage that the process gas does not leak from the internal chamber 110.

The exhaust module 140 is configured to exhaust the process gas and the protective gas. In order to exhaust the process gas from the internal chamber 110, an exhaust pipe 141 is connected to the upper part of the internal chamber 110. In order to exhaust the protective gas from the external chamber 120, an exhaust pipe 145 that similarly communicates with the external chamber 120 may be provided. Since these exhaust pipes 141 and 145 are integrated into one, the process gas is diluted with the protective gas in the process of being exhausted, thereby lowering its concentration.

FIG. 2 is a cross-sectional view showing the high-pressure substrate processing apparatus 100 of FIG. 1 in an open state, and FIG. 3 is a partial cross-sectional view showing a state of the fastening module 150 in the closed state of the high-pressure substrate processing apparatus 100 of FIG. 1. , and FIG. 4 is a partial cross-sectional view showing another state of the fastening module 150 in the closed state of the high-pressure substrate processing apparatus 100 of FIG. 1. In these drawings, some components, such as the air supply module 130 of FIG. 1, are omitted to simplify the drawing.

Referring to these drawings, the inner chamber 110 includes an inner housing 111 and an inner door 115. The inner housing 111 forms the accommodation space, and its lower part has an open shape. The inner door 115 has a shape that closes the open lower part of the inner housing 111. The inner door 115 may have a trough shape with an overall downward opening. A heater (not shown) may be installed in the open space.

As the inner door 115 moves, for example, lowers, the receiving space is opened (open state). In the open state, the inner door 115 is spaced apart from the inner housing 111. As the inner door 115 moves in the opposite direction, for example, rises, the receiving space is closed (closed state, see Figure 3). In the closed state, the inner door 115 is in contact with the inner housing 111. The object is loaded/unloaded into the inner housing 111 in the open state.

The outer chamber 120 also includes an outer housing 121 and an outer door 125. The inner housing 111 is coupled to the outer housing 121. The outer housing 121 has a size to accommodate the inner chamber 110. As the outer door 125 is also moved, the outer housing 121 can be opened and closed. The outer door 125 is connected to the inner door 115 by a support member 119. The outer door 125 moves up and down together with the inner door 115 to open and close the outer housing 121. Unlike the above, the inner door 115 and the outer door 125 may be opened and closed independently.

The outer door 125 is also moved between the open state and the closed state like the inner door 115. In the open state, the outer door 125 is positioned spaced apart from the outer housing 121. In the closed state, the outer door 125 is in contact with the outer housing 121. The outer door 125, inner door 115, and wafer boat 113 are moved along a straight path by a lifter (not shown). The straight path follows the opening/closing direction (H). When the external housing 121, etc. is erected, the opening/closing direction (H) refers to the vertical direction.

In order to maintain close contact between the outer housing 121 and the outer door 125 and further between the inner housing 111 and the inner door 115 in the closed state, a fastening module 150 is provided. The fastening module 150 is a component that fastens the external door 125 to the external housing 121 in order to maintain the second pressure of the external chamber 120 (further, the first pressure of the internal chamber 110). . At least some of the fastening modules 150 may be provided in plural numbers along the circumferential direction of the external door 125 .

The fastening module 150 has a pressing unit 151 that acts on the external door 125 . The pressing unit 151 is moved between the first posture (see FIG. 4) and the second posture (see FIG. 2). In the first posture, the pressing unit 151 exerts a pressing force to press the external door 125 toward the external housing 121 by driving the driving unit 155, which will be described later. The direction of action of the pressing force may be a direction penetrating a plane including the main surface of the external door 125. Depending on the configuration illustrated in the drawings, the direction of action may be approximately perpendicular to the main surface. Here, the main surface is the bottom surface of the external door 125, and the plane may be a virtual plane on which the bottom surface is located. When the external door 125 is in the closed state, the pressing unit 151 may reach the first posture. In the second posture, the pressing unit 151 is separated from the outer door 125, allowing the outer door 125 to switch to the open state. In that case, the external door 125 may be moved along a straight path consistent with the opening/closing direction (H).

For switching between the first posture and the second posture, the pressing unit 151 is not coupled to the external door 125. The pressurizing unit 151 is installed in the external housing 121. The pressing unit 151 may be rotatably coupled to the external housing 121 through, for example, a center pin or a rotating shaft 152. The rotation axis 152 passes through the center of the main surface of the outer door 125 and may be an axis different from the central axis C perpendicular to the main surface. Alternatively, the pressurizing unit 151 may be installed in a frame (not shown) separate from the external housing 121. Even in that case, the frame can be interpreted as forming part of the external housing 121.

The pressing unit 151 may have a support part 153 and a driven part 154. The support portion 153 is a portion corresponding to the main surface of the external door 125. In the first posture, the support part 153 contacts the external door 125 and presses the external door 125 toward the external housing 121. The support portion 153 is arranged along a direction generally perpendicular to the main surface of the outer door 125, but is not limited to that direction. Based on the center pin 152, when the support part 153 occupies the area at one end of the pressing unit 151, the driven part 154 may occupy the area at the other end of the pressing unit 151. The driven part 154 may be arranged along a direction intersecting the extension direction of the support part 153.

The pressing unit 151 may be rotationally driven by the driving unit 155. The driving unit 155 drives the pressing unit 151 to switch between the first posture and the second posture.

The drive unit 155 is, in this embodiment, illustrated as a lifting type driver 156. The lifting type driver 156 moves up and down along the longitudinal direction of the external housing 121, while pushing the pressing unit 151, specifically the driven part 154, in the separation direction A away from the external housing 121. It is composed.

The lifting type driver 156 may be installed on the outer surface of the external housing 121. The lifting type actuator 156 may be provided in a number corresponding to the pressurizing unit 151. The lifting type driver 156 moves up and down along the longitudinal direction or opening/closing direction (H) of the external housing 121. The lifting type driver 156 acts on the driven part 154 when descending and pushes the driven part 154 in the separation direction (A). Among the elevating actuators 156, the surface facing the driven part 154 may be the wedge surface 157. The wedge surface 157 has an outer surface that gets closer to the center of the outer housing 121 as it approaches the outer door 125. As a result, when the wedge surface 157 descends, the driven part 154 is pushed in the separation direction A.

If the lifting type driver 156 has a certain level of weight, the lifting type driver 156 can push the driven part 154 by its own weight. The lifting actuator 156 may also cause the support 153 to press against the exterior door 125 .

The lifting type actuator 156 may be lowered by a force other than gravity. For example, the lifting type actuator 156 may be lifted and lowered by a hydraulic cylinder (not shown). In contrast, this embodiment illustrates a configuration in which the lifting type driver 156 is raised and lowered by a screw engagement force. The lifting type driver 156 may specifically be a rotating ring surrounding the external housing 121.

For screw coupling, a first screw thread 158 is formed on the outer surface of the outer housing 121. A second screw thread 159 is formed on the inner peripheral surface of the rotating ring 156. The first screw thread 158 and the second screw thread 159 engage with each other to form a screw connection. In that state, when the rotary ring 156 is rotated by a separate force, the rotary ring 156 is raised and lowered by the screw engagement. When the rotating ring 156 is lowered, the wedge surface 157 pushes the driven part 154 in the separation direction A.

When the rotating ring 156 rises, the pressing unit 151 is in a state where it can return from the first posture to the second posture. Additional force is required to return the pressurizing unit 151. For this purpose, a torsion spring (not shown) may be installed on the center pin 152. The spring returns the pressing unit 151 to the second posture in a state in which the structural restriction caused by the rotating ring 156 disappears as the rotating ring 156 rises. The external door 125 may assist in the return action of the spring. The outer door 125 may push the support portion 153 while descending, causing the pressing unit 151 to rotate toward the second posture.

When the rotary ring 156 rotates, the driven part 154 rubs against the wedge surface 157. In order to reduce friction between the wedge surface 157 and the driven part 154, a lubricating member (not shown) may be installed on the wedge surface 157 or the driven part 154. The lubricating member may be a material with a low coefficient of friction. The lubricating member may be a ball installed on the driven part 154 and rolling in contact with the wedge surface 157.

According to this configuration, in a state in which the support portion 153 is separated from the outer door 125 and moved away (FIG. 2), the outer door 125 can descend along the opening/closing direction (H). Together with the outer door 125, the inner door 115 and the wafer boat 113 are also lowered along a straight path.

In a state where the wafer substrate W is unloaded from the wafer boat 113 and a new wafer substrate is loaded, the outer door 125 is raised by the operation of the lifter. Accordingly, the outer door 125 meets the outer housing 121 and reaches the closed state. The inner chamber 110 is also in the closed state. A new wafer substrate is loaded into the internal chamber 110.

It is necessary to fasten the outer door 125 to the outer housing 121 in the closed state. When the rotating ring 156 rotates and descends, the wedge surface 157 pushes the driven part 154 (see Figure 3). As a result, the pressurizing unit 151 is in a rotated state compared to that in FIG. 2.

As the rotating ring 156 rotates further, the rotating ring 156 descends to its maximum (see Figure 4). As a result, the pressing unit 151 rotates to the maximum, causing the support portion 153 to press the outer door 125 against the outer housing 121. Through this, the outer door 125 is fastened to the outer housing 121. As a result, the first pressure and the second pressure can be stably maintained.

If the pressing unit 151 is to be switched to the second posture, the rotation ring 156 may be rotated in the opposite direction. By the screw coupling, the rotating ring 156 moves upward. In a state where the wedge surface 157 does not pressurize the driven part 154, the pressing unit 151 reaches the second posture due to the restoring force of the spring.

Other forms of the fastening module 150 will be described with reference to FIGS. 5 and 6. FIG. 5 is a partial cross-sectional view of the high-pressure substrate processing apparatus 200 according to another embodiment of the present invention, and FIG. 6 is a partial cross-sectional view showing the high-pressure substrate processing apparatus 200 of FIG. 5 in another state.

Referring to these drawings, the configuration of the fastening module 250 of the high-pressure substrate processing apparatus 200 according to this embodiment is generally the same as the fastening module 150 according to the previous embodiment, but the main difference is in the installation location. Specifically, the fastening module 250 is the same as the previous fastening module 150 in that it has a pressing unit 251 and a driving unit 255. However, the pressurizing unit 251 and the driving unit 255 are installed on the external door 225. The outer door 225 has a shape that extends longer along the opening/closing direction (H, see FIG. 2) than the previous outer door 125.

The pressurizing unit 251 is rotatably installed on the external door 225. The support portion 253 of the pressing unit 251 moves the outer housing 221, specifically the flange portion 223, toward the outer door 225 by driving the drive unit 255 in the first posture (see FIG. 5). It exerts a pressing force that presses in one direction. The direction of action of the pressing force may be substantially the same as the previous embodiment. The pressing unit 251 is separated from the outer housing 221 in the second posture (see Figure 6), allowing the outer door 225 to be switched to the open state. The rotating ring 256 of the driving unit 255 is screwed to the external door 225. A first screw thread 258 is formed on the outer peripheral surface of the outer door 225, and a second screw thread 259 is formed on the inner peripheral surface of the rotating ring 256. The rotating ring 256 moves up and down according to the relative rotation between the screw threads 258 and 259, and pushes or does not push the driven part 254 of the pressing unit 251.

According to this configuration, the pressing unit 251 is rotated around the rotation axis 252 by the rotation of the rotating ring 256, so that the pressing unit 251 is caught in the external housing 221 or is attached to the external housing 221. is cleared for. As in the previous embodiment, the rotation axis 252 may be an axis different from the central axis C that passes through the center of the main surface of the outer door 225 and is perpendicular to the main surface.

In this specification, the high-pressure substrate processing apparatus 100 and 200 has been described as an example of a processing apparatus having a dual chamber, but the present invention is not limited thereto. Processing devices with a single chamber are also within the scope of the present invention. The single chamber consists of one housing and one door. A wafer substrate is placed in the chamber, and gas for processing the wafer substrate is supplied. The fastening modules 150 and 250 are also applied to this single chamber. The fastening modules 150 and 250 ensure that the door is firmly fastened to the housing despite the pressure of the gas.

In this specification, a batch type processing device is exemplified, but the present invention is not limited thereto. The present invention can also be applied to a single wafer type processing device.

100,200: High pressure substrate processing device 110: Internal chamber
120: external chamber 130: air supply module
140: Exhaust module 150,250: Fastening module
151,251: Pressurizing unit 155,255: Drive unit

Claims (12)

an internal chamber formed to accommodate a substrate to be processed;
an outer chamber having an outer housing accommodating the inner chamber and an outer door configured to move between a closed state to close the outer housing and an open state to open the outer housing; and
When the process gas for processing the substrate in the inner chamber has a first pressure higher than atmospheric pressure, a protective gas in the outer chamber is set in relation to the first pressure and maintained at a second pressure higher than atmospheric pressure. In order to do so, it includes a fastening module configured to fasten the outer housing and the outer door in the closed state,
The fastening module is,
A first posture of pressing one of the outer housing and the outer door against the other of the outer housing and the outer door in the closed state, and moving the outer door along a straight path from the closed state to the open state a pressing unit configured to be moved between second postures allowing for; and
a driving unit configured to drive the pressing unit to switch the pressing unit between the first posture and the second posture;
The pressurizing unit is,
a support portion corresponding to one of the outer housing and the outer door; and
A high-pressure substrate processing apparatus comprising a driven part connected to the support part and rotationally driven by the driving unit.
According to paragraph 1,
The pressurizing unit is,
A high-pressure substrate processing apparatus configured to rotate between the first posture and the second posture about a rotation axis that passes through the center of the main surface of the external door and is different from a central axis perpendicular to the main surface.
According to paragraph 1,
The direction of action of the force by which the pressing unit presses one of the outer housing and the outer door against the other of the outer housing and the outer door by driving the driving unit is:
A high-pressure substrate processing apparatus in a direction penetrating a plane including a main surface of the external door.
According to paragraph 1,
The support part,
It is an area at one end of the pressurizing unit,
The driven part,
A high-pressure substrate processing device that is an area at the other end of the pressing unit and is arranged along a direction intersecting the extension direction of the support part.
According to paragraph 1,
The driving unit is,
A high-pressure substrate processing apparatus comprising a lifting type driver configured to lift and lower the other one of the external housing and the external door along a longitudinal direction and drive the driven part.
According to clause 5,
The lifting type actuator,
A high-pressure substrate processing apparatus configured to push the driven part in a direction away from the external housing as it is raised or lowered.
According to clause 5,
The lifting type actuator,
A high pressure substrate processing apparatus further comprising a wedge surface engaged with the driven portion.
According to clause 5,
The lifting type actuator,
A high-pressure substrate processing apparatus further comprising a lubricating member that reduces friction with the driven part.
According to clause 5,
The lifting type actuator,
a rotating ring installed to surround the other of the outer housing and the outer door;
a first screw thread formed on the outer peripheral surface of the other one of the outer housing and the outer door; and
The high-pressure substrate processing apparatus further includes a second screw thread formed on an inner peripheral surface of the rotating ring and engaged with the first screw thread.
A chamber including a housing configured to accommodate a substrate to be processed, and a door configured to move between a closed state to close the housing and an open state to open the housing; and
A fastening module that fastens the housing and the door in the closed state to maintain a gas pressure for processing the substrate in the chamber,
The fastening module is,
a first posture that presses one of the housing and the door against the other of the housing and the door in the closed state, and a posture that allows the door to move along a straight path from the closed state to the open state a pressing unit configured to be moved between two postures; and
a driving unit configured to drive the pressing unit to switch the pressing unit between the first posture and the second posture;
The pressurizing unit is,
a support portion corresponding to one of the housing and the door; and
A high-pressure substrate processing apparatus comprising a driven part connected to the support part and rotationally driven by the driving unit.
According to clause 10,
The pressurizing unit is,
It is formed to pass through the center of the main surface of the door and rotate around a rotation axis different from a central axis perpendicular to the main surface,
The driving unit is,
A high-pressure substrate processing apparatus that rotates the pressing unit between the first posture and the second posture.
According to clause 10,
The driving unit is,
A high-pressure substrate processing apparatus comprising a wedge surface that pushes the pressing unit in a direction away from the housing by being lowered or lifted along the longitudinal direction of the chamber.

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