KR102612462B1 - UV coating method with antistatic function - Google Patents

Abstract

The present invention includes the steps of forming an anodizing layer by an anodizing process including a pretreatment process of degreasing and etching the surface of a work stage containing a metal material capable of anodizing, an anodizing process, and a sealing process; and immersing the work stage on which the anodized layer is formed in an anti-static coating solution to form an anti-static coating layer.

Description

UV coating method with antistatic function}

The present invention relates to a UV coating method having an antistatic function.

The work stage used in semiconductor manufacturing equipment is where the wafer substrate is placed and is usually made of metal and ceramic materials. In a semiconductor manufacturing apparatus using the work stage, friction static electricity is generated between the work stage and the wafer substrate when a handler places the wafer substrate on the work stage after fixing and moving the wafer substrate to the work stage.

In addition, the work stage used in the dispenser for FPD (Flat Panel Display) usually adsorbs the display substrate using a vacuum method. The work stage in this case is also usually made of a metallic material, and when the display substrate is adsorbed on the work stage or the display substrate that has been adsorbed and fixed is peeled off from the work stage, electricity is generated on the work stage, and the display The substrate is charged. Recently, as display substrates become larger, the amount of charge increases, which tends to increase the problem of electrostatic charging.

A plurality of electronic components such as semiconductor devices are disposed on the wafer substrate and the display substrate. Therefore, when static electricity is generated, it can be applied to the electronic component and transmitted to its internal circuit. This ultimately causes fatal damage to the reliability of electronic components. Additionally, there is a problem that particles attach to the substrate due to static electricity or the substrate breaks when the substrate is lifted up.

Conventionally, in order to prevent charging of static electricity, an ionizer was installed on the work stage to neutralize the charging potential. However, in this case, lift-up is impossible and the ion wind from the ionizer does not reach, and even if lift-up occurs, problems such as discharge may occur before the ion wind reaches the area requiring neutralization. The static electricity generated between the work stage and the substrate is momentary. It is not possible to solve the problem of peeling and electrification caused by

To solve this problem, the work stage can be coated with fluorine resin (aka Teflon coating) to prevent static electricity. Since fluoropolymers have low adsorption energy with other substances, excellent non-adhesiveness, and low friction coefficient, their correlation with the glass substrate is reduced, and the amount of static electricity generated due to peeling is reduced.

In this case, since the normal fluorine component has insulating properties, the Teflon coating contains an electrifying material in the fluorine component. That is, the work stage was coated with Teflon to prevent the generation of static electricity on the work stage. However, the Teflon coating method requires relatively high manufacturing costs. In particular, in the case of dispensers, as the size of the display substrate increases, the size of the work stage also increases, so the manufacturing cost inevitably increases.

In addition, since the hardness of fluorine itself is low, the hardness of the coating film made of fluorine is inevitably low, so scratches easily occur. This makes it difficult to maintain the flatness of the scratched area and becomes a factor in generating particles.

The present invention was developed to solve the above problems, and the purpose of the present invention is to provide a method for anti-static treatment of the surface of a work stage of a metal material with excellent anti-static performance, excellent durability, and high surface hardness.

The object of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to achieve the above object, the present invention

Forming an anodizing layer by an anodizing process including a pretreatment process of degreasing and etching the surface of a work stage containing a metal material capable of anodizing, an anodizing process, and a sealing process; and

It provides an antistatic treatment method for the surface of a work stage made of metal, including the step of immersing the work stage on which the anodized layer is formed in an antistatic coating solution to form an antistatic coating layer.

In addition, the antistatic coating solution contains 23-27% by weight of diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer units and 23% by weight of hydroxyethyl methacrylate (2-hydroxyethyl methacrylate; HEMA) monomer units. -27% by weight, 23-27% by weight of methoxyethyl acrylate (MEA) monomer units, and 23-27% by weight of hydroxyethyl acrylate (HEA) monomer units. 1 14-18 parts by weight of copolymer; [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit 68-72% by weight, 3-(trimethoxysilyl)propyl methacrylate 5-9 parts by weight of a second copolymer comprising 13-17% by weight of (3-(trimethoxysilyl)propyl methacrylate; TMSPMA) monomer units and 13-17% by weight of acrylic acid (AA) monomer units; 30-34 parts by weight of copper powder with a particle size of 20-50 um; 6-10 parts by weight of polyethylene dioxithiophene (PEDOT); 4-8 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 0.5-4 parts by weight of chlorosulfonated polyethylene rubber; 0.5-4 parts by weight of 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA); 0.5-4 parts by weight of surfactant; 0.3-3 parts by weight of caustic soda; 0.3-3 parts by weight of silicon; 0.3-3 parts by weight of pH adjuster; and 18-22 parts by weight of a mixed solvent in which isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) are mixed at a weight ratio of 1:1.

In addition, the step of forming an antistatic coating layer by immersing in the antistatic coating solution is performed by immersing the antistatic coating solution at a temperature of 65-75°C for 25-35 minutes,

The antistatic coating solution is,

23-27% by weight of diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer unit, 23-27% by weight of 2-hydroxyethyl methacrylate (HEMA) monomer unit, methoxy 14-18% by weight of a first copolymer comprising 23-27% by weight of 2-methoxyethyl acrylate (MEA) monomer units and 23-27% by weight of 2-hydroxyethyl acrylate (HEA) monomer units. wealth; [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit 68-72% by weight, 3-(trimethoxysilyl)propyl methacrylate 5-9 parts by weight of a second copolymer comprising 13-17% by weight of (3-(trimethoxysilyl)propyl methacrylate; TMSPMA) monomer units and 13-17% by weight of acrylic acid (AA) monomer units; and 6-10 parts by weight of polyethylene dioxithiophene (PEDOT); preparing a first mixture by stirring for 30-90 minutes at a temperature of 25-35°C;

18-22 parts by weight of a mixed solvent of isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) mixed in a weight ratio of 1:1 and 0.5-4 parts by weight of surfactant are mixed at a temperature of 25-35°C for 5-15 minutes. Preparing a second mixture by stirring;

30-34 parts by weight of copper powder with a particle size of 20-50 um in the second mixture; 4-8 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 0.5-4 parts by weight of chlorosulfonated polyethylene rubber; 0.5-4 parts by weight of 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA); 0.3-3 parts by weight of caustic soda; and 0.3-3 parts by weight of silicon; heating to a temperature of 65-75° C. and stirring for 30-90 minutes to prepare a third mixture; and

It is characterized in that it is prepared by mixing the first mixture and the third mixture to prepare a fourth mixture, and adding 0.3-3 parts by weight of a pH adjuster to the fourth mixture.

The antistatic coating layer formed by the antistatic treatment method according to the present invention has excellent antistatic performance, excellent durability, and high surface hardness.

Figure 1 is a flowchart showing an antistatic treatment method provided in one aspect of the present invention.

Hereinafter, various embodiments will be described in more detail with reference to the attached drawings. The embodiments described herein may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, the specific embodiments disclosed in the attached drawings are only intended to facilitate understanding of the various embodiments. Accordingly, the technical idea is not limited to the specific embodiments disclosed in the attached drawings, and should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

Terms containing ordinal numbers, such as primary, secondary, first, second, etc., may be used to describe various components, but these components are not limited by the above-mentioned terms. The above-mentioned terms are used only for the purpose of distinguishing one component from another.

In this specification, terms such as 'include' or 'have' are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof. When a component is said to be 'connected' or 'connected' to another component, it is understood that it may be directly connected or connected to the other component, but that other components may exist in between. It should be. On the other hand, when a component is mentioned as being 'directly connected' or 'directly connected' to another component, it should be understood that there are no other components in between.

In addition, when describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof is abbreviated or omitted.

This invention

Forming an anodizing layer by an anodizing process including a pretreatment process of degreasing and etching the surface of a work stage containing a metal material capable of anodizing, an anodizing process, and a sealing process; and

It provides an antistatic treatment method for the surface of a work stage made of metal, including the step of immersing the work stage on which the anodized layer is formed in an antistatic coating solution to form an antistatic coating layer.

At this time, the antistatic treatment method provided in one aspect of the present invention is shown in a flowchart in Figure 1. Hereinafter, with reference to Figure 1, the antistatic treatment method for the surface of a work stage of a metal material according to the present invention will be described in detail at each step. Explain.

First, the method for antistatic treatment of the surface of a work stage for a metal material according to the present invention is anodizing the surface of the work stage containing a metal material capable of anodizing by anodizing treatment including a pretreatment process of degreasing and etching, an anodizing process, and a sealing process. It includes forming a layer.

A workpiece capable of charging the work stage, for example, including an electronic component, is placed on the work stage. An example of the work may be a wafer substrate or a glass substrate for a display. In this case, the device to which the work stage is applied may include a semiconductor manufacturing device on which the wafer substrate is mounted, a dispenser on which a display glass substrate is mounted, etc. It is clear that the present invention is not limited to this, and is applicable to all work stages that require anti-static protection.

The most representative metal material for anodizing is aluminum (Al), and other metal materials such as magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb). Anodizing is also being done. Recently, the use of anodizing magnesium and titanium materials is gradually increasing. Therefore, the metal materials of the present invention include aluminum (Al), magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), niobium (Nb), magnesium (Mg), and titanium ( Ti) material, etc.

In the present invention, an aluminum alloy is used as an example. Aluminum material is light, has a certain strength, and has excellent processability.

Anodizing treatment is performed on the upper surface of the work stage. Anodizing (anodizing) is a process where a metal or part is placed on an anode and electrolyzed in a diluted acid electrolyte, resulting in an oxide film (e.g. aluminum oxide: Al ₂ O ₃ ) is formed. Anodic oxidation is a combination of the words anode and oxidizing. This is different from normal electroplating where metal parts are placed on a cathode and then plated. In this case, anodizing (Anodizing on Aluminum Alloys), which treats an oxide film on the surface of the work stage made of aluminum, forms a film of aluminum oxide (Al ₂ O ₃ ) on the metal surface, and the aluminum part is used as an anode in the electrolyte solution. When electricity is applied, the aluminum surface is oxidized by oxygen generated at the anode, forming an aluminum oxide film.

There are various electrolytes used in the anodizing process, for example, oxalic acid such as sodium hydroxide and sulfuric acid can be used.

The anodizing process may be performed after performing a pretreatment process (degreasing and etching), and after performing the anodizing process, a sealing process may be performed.

The pretreatment process may be performed as a degreasing process and an etching process. Specifically, after the degreasing process, washing with water and an etching process may be performed. Even if not specifically mentioned, according to one embodiment of the present invention, a water washing process may be performed between each process. Specifically, it can be washed with a spray method. Additionally, the degreasing process may be performed at a temperature of 20°C or higher, specifically 20-40°C for 10-20 minutes. The degreasing agent is not particularly limited, and materials commonly used in the art can be used.

The etching process may be performed using sodium hydroxide (NaOH), and the concentration of the sodium hydroxide may be 5-20% by weight. The temperature of the etching process may be 35-45° C. and may be performed for 1-5 minutes. For precision processes, it can be performed for 0.5-1 minutes, and for general processes, it can be performed for 3-5 minutes.

Through the pretreatment process, the oxide film formed in the anodizing process, that is, the anodic oxidation layer, can be formed uniformly and thinly.

A sealing process may be performed after the anodizing process. The anodizing layer formed through the anodizing treatment may have an irregular surface such as a large number of pores formed. The surface of the anodizing layer can be made uniform through the sealing process, and thus the formation process of the antistatic coating layer can be easily performed later.

The sealing process can be performed as a hydration process. It is not limited thereto, but for example, weakly acidic water, deionized water, sodium dichromate, nickel acetate solution, etc. can be used.

A ₂ O ₃ formed by anodizing during the hydration sealing process may change into boehmite (Al ₂ O ₃ ·H ₂ O). Accordingly, the uniformity of the anodizing layer can be improved by filling the pores formed on the surface of the anodizing layer, and the stickiness phenomenon can be improved.

The sealing process can be managed at pH 6-8, specifically pH 7-8. Specifically, a high temperature process of 40-45°C can be performed for 1-2 minutes. A low temperature process of 20-30°C can be performed for 5-10 minutes.

After the sealing process, a water washing and drying process can be performed. In the case of the black process, a dye treatment process may be performed before the sealing process. The dye treatment process can be carried out at a temperature of 35-45°C and controlled at pH 4.5-5.5.

Next, the method for antistatic treatment of the surface of a work stage of a metal material according to the present invention includes the step of immersing the work stage on which the anodized layer is formed in an antistatic coating solution to form an antistatic coating layer.

In the above step, an anodization process is performed and the work stage on which the anodize layer is formed is immersed in an antistatic coating solution, thereby forming an antistatic coating layer.

In the present invention, an immersion process using an antistatic coating solution is intended to be performed, through which an antistatic coating layer that is easy to automate and more stable can be formed.

The antistatic coating solution contains 23-27% by weight of diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer units and 23-27% by weight of hydroxyethyl methacrylate (2-hydroxyethyl methacrylate; HEMA) monomer units. % by weight, 23-27% by weight of 2-methoxyethyl acrylate (MEA) monomer units, 23-27% by weight of 2-hydroxyethyl acrylate (HEA) monomer units. 14-18 parts by weight of the polymer; [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit 68-72% by weight, 3-(trimethoxysilyl)propyl methacrylate 5-9 parts by weight of a second copolymer comprising 13-17% by weight of (3-(trimethoxysilyl)propyl methacrylate; TMSPMA) monomer units and 13-17% by weight of acrylic acid (AA) monomer units; 30-34 parts by weight of copper powder with a particle size of 20-50 um; 6-10 parts by weight of polyethylene dioxithiophene (PEDOT); 4-8 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 0.5-4 parts by weight of chlorosulfonated polyethylene rubber; 0.5-4 parts by weight of 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA); 0.5-4 parts by weight of surfactant; 0.3-3 parts by weight of caustic soda; 0.3-3 parts by weight of silicon; 0.3-3 parts by weight of pH adjuster; and 18-22 parts by weight of a mixed solvent in which isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) are mixed in a weight ratio of 1:1, preferably comprising 24-26 weight % of DEAEMA monomer units and HEMA monomer. 15-17 parts by weight of a first copolymer comprising 24-26% by weight of monomer units, 24-26% by weight of MEA monomer units, and 24-26% by weight of HEA monomer units; 6-8 parts by weight of a second copolymer comprising 69-71% by weight MAPTAC monomer units, 14-16% by weight TMSPMA monomer units and 14-16% by weight AA monomer units; 31-33 parts by weight of copper powder with a particle size of 20-50 um; PEDOT 7-9 parts by weight; 5-7 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 1-3 parts by weight of chlorosulfonated polyethylene rubber; TMOS-PDOA 1-3 parts by weight; 1-3 parts by weight of surfactant; 0.5-1.5 parts by weight of caustic soda; 0.5-1.5 parts by weight of silicon; 0.5-1.5 parts by weight of pH adjuster; And it is more preferable to include 19-21 parts by weight of a mixed solvent in which IPA and DMSO are mixed at a weight ratio of 1:1.

By including the first copolymer, an antistatic coating layer that exhibits excellent durability and has high adhesion to an anodizing layer can be formed. In particular, diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer, 2-hydroxyethyl methacrylate (HEMA) monomer, methoxyethyl acrylate (MEA) ) monomer and 2-hydroxyethyl acrylate (HEA) monomer unit, providing better adhesion and durability.

By including the second copolymer, it is possible to form an antistatic coating layer that exhibits excellent durability and has high adhesion to the anodizing layer. In addition, [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit and 3-(trimethoxysilyl)propyl methacrylate (3- Excellent antistatic performance can be developed and maintained through the (trimethoxysilyl)propyl methacrylate; TMSPMA) monomer unit, and adhesion is assisted through the acrylic acid (AA) monomer unit.

The copper powder preferably has a particle size of 20-50 um, and more preferably 30-40 um. Antistatic performance can be achieved by applying the copper powder as a conductive additive.

The antistatic performance of the coating layer can be improved by including polyethylene dioxithiophene (PEDOT).

The copper fiber is preferably copper ultrafiber, more preferably 300-600 nm in diameter and 1-10 um in length, and most preferably 400-500 nm and 5-10 um in length. desirable. By introducing copper fibers in the form of ultra-microfibers as the copper fibers, it can be used as a passage to connect conductive additives when they are dispersed, thereby realizing higher anti-static performance.

The chlorosulfonated rubber is an antistatic coating composition that improves the heat resistance and mechanical properties of the antistatic coating layer and assists antistatic performance.

The 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA) is an antistatic coating composition that improves the antistatic performance of the antistatic coating layer. , does not deteriorate mechanical properties.

The surfactant is N-(carboxylmethyl)-N,N-dimethyl-2-[(( 2-methyl-1-oxo-2-propenyl)oxy]-ethanamine intramolecular salt polymer [N-(Carboxymethyl)-N,N-dimethyl-2- [(2-methyl-1-oxo-2-propenyl )oxy]-ethanaminium inner salt polymer with 2-hydroxyethyl 2-methyl-2-propenoate and methyl 2-methyl-2-propenoate]. N-(carboxylmethyl)-N,N-dimethyl-2-[( 2-methyl-1-oxo-2-propenyl)oxy]-ethanamine intramolecular salt polymer [N-(Carboxymethyl)-N,N-dimethyl-2- [(2-methyl-1-oxo-2-propenyl )oxy]-ethanaminium inner salt polymer with 2-hydroxyethyl 2-methyl-2-propenoate and methyl 2-methyl-2-propenoate], it has excellent surface resistance maintenance due to its own anti-static performance.

The pH adjuster may be an inorganic base or monoamine, and sodium hydroxide or N,N-dimethylethanolamine may be used to adjust the pH of the antistatic coating solution.

The pH of the antistatic coating solution is preferably 8-13, preferably 9-12, and more preferably 11-12. By adjusting the pH of the antistatic coating solution, coating properties are excellent.

The isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) are used as solvents. It is easy to disperse the entire composition by applying a mixed solvent in which isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) are mixed at a weight ratio of 1:1 as the solvent.

In addition, the step of forming an antistatic coating layer by immersing in the antistatic coating solution is preferably performed by immersing in an antistatic coating solution at a temperature of 65-75°C for 25-35 minutes, and the antistatic coating solution at a temperature of 68-72°C. It is more preferably performed by immersing in the anti-coating liquid for 28-32 minutes.

In addition, the antistatic coating solution,

23-27% by weight of diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer unit, 23-27% by weight of 2-hydroxyethyl methacrylate (HEMA) monomer unit, methoxy 14-18% by weight of a first copolymer comprising 23-27% by weight of 2-methoxyethyl acrylate (MEA) monomer units and 23-27% by weight of 2-hydroxyethyl acrylate (HEA) monomer units. wealth; [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit 68-72% by weight, 3-(trimethoxysilyl)propyl methacrylate 5-9 parts by weight of a second copolymer comprising 13-17% by weight of (3-(trimethoxysilyl)propyl methacrylate; TMSPMA) monomer units and 13-17% by weight of acrylic acid (AA) monomer units; and 6-10 parts by weight of polyethylene dioxithiophene (PEDOT); preparing a first mixture by stirring for 30-90 minutes at a temperature of 25-35°C;

18-22 parts by weight of a mixed solvent of isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) mixed in a weight ratio of 1:1 and 0.5-4 parts by weight of surfactant are mixed at a temperature of 25-35°C for 5-15 minutes. Preparing a second mixture by stirring;

30-34 parts by weight of copper powder with a particle size of 20-50 um in the second mixture; 4-8 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 0.5-4 parts by weight of chlorosulfonated polyethylene rubber; and 0.5-4 parts by weight of 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA); 0.3-3 parts by weight of caustic soda; and 0.3-3 parts by weight of silicon; heating to a temperature of 65-75° C. and stirring for 30-90 minutes to prepare a third mixture; and

It is preferable to use one prepared by mixing the first mixture and the third mixture to prepare a fourth mixture, and adding 0.3-3 parts by weight of a pH adjuster to the fourth mixture.

Only when an antistatic coating solution is prepared and used through the above process can the antistatic coating layer be uniformly formed and the performance of the antistatic coating layer can be properly exhibited.

The pH adjuster is formed so that the pH of the finally prepared antistatic coating solution is 11-13, preferably 11-12.

Hereinafter, the present invention will be explained in more detail by the following examples.

However, the following examples only illustrate the content of the present invention and the scope of the invention is not limited by the examples and experimental examples.

<Preparation Example 1> Preparation of the first copolymer

Add diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) and 2-hydroxyethyl methacrylate (HEMA) to a four-necked flask and stir to dissolve methoxyethyl acrylate (2- Methoxyethyl acrylate (MEA) and 2-hydroxyethyl acrylate (HEA) were added sequentially, and 2 g of azobisisobutyronitrile (AIBN) as a catalyst was added dropwise and the temperature was raised to 88°C. When the temperature became constant, it was maintained for 90 minutes. After the reaction was completed, the first copolymer in a transparent liquid state was obtained.

<Preparation Example 2> Preparation of the second copolymer

In a four-necked flask, [3-(methacryloylamino)propyl]trimethyl ammonium chloride (MAPTAC) and 3-(trimethoxysilyl)propyl methacrylate (3- (trimethoxysilyl)propyl methacrylate; TMSPMA) was added, acrylic acid (AA) was sequentially added while stirring, and 1 g of potassium persulfate (K ₂ S ₂ O ₈ ) was added dropwise as a catalyst and the temperature was raised to 70°C. . When the temperature became constant, it was maintained for 60 minutes. After the reaction was completed, a second copolymer in a transparent liquid state was obtained.

<Preparation Example 3> Preparation of antistatic coating solution

16 parts by weight of the first copolymer prepared in Preparation Example 1, 7 parts by weight of the second copolymer prepared in Preparation Example 2, and 8 parts by weight of polyethylene dioxithiophene (PEDOT) were mixed, and the temperature was 30°C. The first mixture was prepared by stirring for 60 minutes.

20 parts by weight of a mixed solvent of isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) in a weight ratio of 1:1, and 2-hydroxyethyl-2-methyl-2-propenoate and methyl 2 as surfactants. N-(carboxylmethyl)-N,N-dimethyl-2-[(2-methyl-1-oxo-2-propenyl)oxy]-ethanamine intramolecular salt polymer with -methyl-2-propenoate [N-(Carboxymethyl)-N,N-dimethyl-2-[(2-methyl-1-oxo-2-propenyl)oxy]-ethanaminium inner salt polymer with 2-hydroxyethyl 2-methyl-2-propenoate and methyl 2 -methyl-2-propenoate] was mixed with 2 parts by weight and stirred for 10 minutes at a temperature of 30° C. to prepare a second mixture.

In the second mixture, 32 parts by weight of copper powder with a particle size of 30-40 um, 6 parts by weight of copper fiber with a diameter of 400-500 nm and a length of 5-10 um, 2 parts by weight of chlorosulfonated polyethylene rubber, 3 -(Trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride; TMOS-PDOA) 2 parts by weight, 1 part by weight of caustic soda and 1 part by weight of silicon were added and incubated at 70°C. A third mixture was prepared by heating to temperature and stirring for 60 minutes.

The first mixture and the third mixture were mixed, and a pH adjuster was used to prepare an antistatic coating solution with a pH of 12.

<Example 1>

The surface of the work stage was degreased (concentration DR500 5%, temperature 20°C, 10 minutes), washed with water, and then etched (concentration caustic soda (NaOH) 10%, temperature 40°C, precise 1 minute). Next, it was treated with nitric acid (concentration 30%, temperature 20°C, 5 seconds), washed with water, matted (acid ammonium fluoride (NH ₄ HF ₂ ) 3%, temperature 40°C, 3 minutes), and then treated with nitric acid (concentration 40°C, 3 minutes). 30%, temperature 20°C, 5 seconds) and washed with water. It was treated with sulfuric acid (concentration 20%, temperature 20°C, 10 minutes) to form an anodizing layer, sealed (pH 7, temperature 40°C, 1 minute), washed in hot water, and dried.

The temperature of the antistatic coating solution prepared in Preparation Example 3 was maintained at 70°C, and the washed and dried work stage was immersed in the antistatic coating solution for 30 minutes, taken out, and dried to form an antistatic coating layer.

<Experimental Example 1>

The surface resistivity, pencil hardness, and scratch resistance of the antistatic coating layer coated in Example 1 were evaluated.

The surface resistivity was measured using Hiresta's MCP-HT450.

The pencil hardness was measured by applying a load of 500 g using a pencil hardness tester (PHT, Korea Seokbo Science Co., Ltd.). The pencil was a Mitsubishi product, and the test was conducted 5 times per pencil hardness.

The scratch resistance was tested by reciprocating 10 times under 1kg/(2cm×2cm) using a steel wool tester (WT-LCM100, Korea Protex). #0000 steel wool was used, S has 0 scratches, A has 1 to 10 scratches, B has 11 to 20 scratches, C has 21 to 30 scratches, and D has 31 or more scratches. am.

Surface resistivity (Ω/sq) pencil hardness scratch resistance Example 1 10 ⁶ 3H A

As shown in Table 1, it can be confirmed that the antistatic coating layer formed by the surface antistatic treatment method according to the present invention exhibits excellent antistatic performance and physical properties.

Claims (3)

Forming an anodizing layer by an anodizing process including a pretreatment process of degreasing and etching the surface of a work stage containing a metal material capable of anodizing, an anodizing process, and a sealing process; and
A step of forming an antistatic coating layer by immersing the work stage on which the anodized layer is formed in an antistatic coating solution,
The antistatic coating solution contains 23-27% by weight of diethylaminoethyl methacrylate (2-(diethylamino)ethyl methacrylate; DEAEMA) monomer units and 23-27% by weight of hydroxyethyl methacrylate (2-hydroxyethyl methacrylate; HEMA) monomer units. % by weight, a first copolymer comprising 23-27% by weight of 2-methoxyethyl acrylate (MEA) monomer units and 23-27% by weight of 2-hydroxyethyl acrylate (HEA) monomer units. 14-18 parts by weight of the polymer; [3-(methacryloylamino)propyl]trimethyl ammonium chloride ([3-(methacryloylamino)propyl]trimethyl ammonium chloride; MAPTAC) monomer unit 68-72% by weight, 3-(trimethoxysilyl)propyl methacrylate 5-9 parts by weight of a second copolymer comprising 13-17% by weight of (3-(trimethoxysilyl)propyl methacrylate; TMSPMA) monomer units and 13-17% by weight of acrylic acid (AA) monomer units; 30-34 parts by weight of copper powder with a particle size of 20-50 um; 6-10 parts by weight of polyethylene dioxithiophene (PEDOT); 4-8 parts by weight of copper fibers with a diameter of 300-600 nm and a length of 1-10 um; 0.5-4 parts by weight of chlorosulfonated polyethylene rubber; 0.5-4 parts by weight of 3-(trimethoxysilyl)-propyl dimethyl octadecyl ammonium chloride (TMOS-PDOA); 0.5-4 parts by weight of surfactant; 0.3-3 parts by weight of caustic soda; 0.3-3 parts by weight of silicon; 0.3-3 parts by weight of pH adjuster; and 18-22 parts by weight of a mixed solvent containing isopropyl alcohol (IPA) and dimethyl sulfoxide (DMSO) mixed at a weight ratio of 1:1. delete delete