KR102604674B1 - Film alignment device for chip mounting and roll-to-roll flexible substrate manufacturing apparatus having the same - Google Patents

Abstract

A film flattening device for chip mounting and a roll-to-roll flexible substrate manufacturing device having the same are disclosed.
The present invention relates to a device for flattening a film on which an electrode pattern is pattern-printed on which at least one light-emitting chip is mounted, comprising: a first positioning pin at each lower end corresponding to an alignment hole formed through both edges of the film; A plurality of first operating bars including one elastic body; A pair of first support plates formed through first through holes corresponding to the first positioning pins and fixed to both edges of the lower surface of the film; and a first actuator that moves the first operation bar up and down in the Z-axis direction perpendicular to the film, and a second actuator that horizontally moves the first operation bar in the Y-axis direction equal to the width direction of the film. A first operating unit that sequentially operates the first actuator and the second actuator; Including, by operation of the first actuator, the first positioning pin of the first operation bar is correspondingly inserted into the first through hole through the alignment hole of the temporarily stopped film, and the first elastic body mediates the film. After elastically adhering to the upper surface of the first support plate, both edges of the film in elastic contact with the first elastic body are pulled in the Y-axis direction by the operation of the second actuator to flatten the surface of the film. can do.

Description

Film alignment device for chip mounting and roll-to-roll flexible substrate manufacturing apparatus having the same}

The present invention relates to a device for flattening a film on which a chip is mounted and a device equipped with the same to manufacture a flexible substrate using a roll-to-roll method. More specifically, the present invention relates to a device for flattening a film paused in a roll-to-roll pass line and a light-emitting chip. The present invention relates to a film flattening device for chip mounting that can increase mounting efficiency by mounting electrode patterns printed on a film at the correct mounting position without defects, and to a roll-to-roll flexible substrate manufacturing device having the same.

In general, digital signage refers to a display device that provides one-way and two-way services that provide various information, including video advertisements, to the public in real time.

Recently, transparent displays that use light sources such as LEDs as pixels are being applied to digital signage to be installed indoors or outdoors to deliver a variety of contents including news, weather information, sports, public service announcements, and facility information.

The purpose of this transparent digital signage is to provide a high-resolution, transparent digital display when installed in places with a lot of population movement, such as airports, bus terminals, stadiums, hotels, shopping malls, museums, and hospitals.

Displays such as transparent digital signage are made by stacking a printed circuit board with LEDs that make up pixels mounted on a transparent base panel and stacking a transparent window cover on top of them to form a transparent display device, and a light-emitting chip that is a light source like the LED. This printed circuit board is made by printing an electrode pattern on a film of a transparent material such as PET (Polyethylene Terephthalate), and a light-emitting chip, which is a light source, is mounted on the printed electrode pattern.

(Patent Document 1) KR 10-2162880 B1

Patent Document 1 discloses a transparent digital signage display that reduces the line resistance of the driving line by composing the LED driving line formed on a transparent circuit board with three or more layers including a base line layer, an electrode line layer, and an anti-oxidation film layer, there is.

On the other hand, when the transparent circuit board is made of a transparent film that is easy to bend and deform, the circuit board with the electrode pattern printed on one side of the transparent film is transferred to the post-process through the roll-to-roll process, and then transferred to the post-process, the light-emitting chip mounting process. The circuit board is temporarily stopped, and then a light-emitting chip, which is a light source such as an LED, is mounted on the electrode pattern of the transparent film and electrically connected.

However, since the circuit board temporarily stopped in the mounting process is made of a transparent film that is easily bendable and deformed, external factors cause a portion of the surface of the transparent film on which the electrode pattern is printed to be wrinkled in a convex upward or concave downward manner, causing the rigid substrate to be damaged. It was difficult to maintain constant and uniform flatness like the surface of .

If the process of mounting the light-emitting chip is carried out in a state where the flatness of the transparent film is poor, the electrode terminal of the light-emitting chip cannot be mounted accurately in the preset position on the electrode pattern of the transparent film with poor flatness, causing the mounting position to be damaged. This caused the problem of causing mounting defects and increasing the product defect rate.

The present invention is intended to solve the above-described problems. The purpose of the present invention is to flatten the film paused in the roll-to-roll pass line and mount the light-emitting chip at the correct mounting position of the electrode pattern printed on the film without defects. The object is to provide a film flattening device for chip mounting that can increase efficiency and a roll-to-roll flexible substrate manufacturing device having the same.

The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.

According to one aspect of the present invention, in an apparatus for flattening a film on which an electrode pattern on which at least one light-emitting chip is mounted is pattern printed, a first positioning pin is provided at each lower end corresponding to an alignment hole formed through penetrating edges of both sides of the film. A plurality of first operating bars including a first elastic body; A pair of first support plates formed through first through holes corresponding to the first positioning pins and fixed to both edges of the lower surface of the film; and a first actuator that moves the first operation bar up and down in the Z-axis direction perpendicular to the film, and a second actuator that horizontally moves the first operation bar in the Y-axis direction equal to the width direction of the film. A first operating unit that sequentially operates the first actuator and the second actuator; Including, by operation of the first actuator, the first positioning pin of the first operation bar is correspondingly inserted into the first through hole through the alignment hole of the temporarily stopped film, and the first elastic body mediates the film. After elastically adhering to the upper surface of the first support plate, both edges of the film in elastic contact with the first elastic body are pulled in the Y-axis direction by the operation of the second actuator to flatten the surface of the film. Provides a film flattening device for chip mounting.

At this time, the first operating unit may include a third actuator that horizontally operates the first operating bar in the X-axis direction, which is the same as the longitudinal direction of the film.

In addition, according to another aspect of the present invention, in an apparatus for flattening a film on which an electrode pattern is pattern-printed on which at least one light-emitting chip is mounted, a second position is provided at each upper end corresponding to an alignment hole formed through penetrating edges on both sides of the film. A plurality of second operating bars including decision pins and second elastic bodies; A pair of second support plates formed through second through holes corresponding to the second positioning pins and fixed to both edges of the upper surface of the film; and a fourth actuator that moves the second operation bar up and down in the Z-axis direction perpendicular to the film, and a fifth actuator that horizontally moves the second operation bar in the Y-axis direction equal to the width direction of the film. A second operating unit that sequentially operates the 4th actuator and the 5th actuator; Including, by the operation of the fourth actuator, the second positioning pin of the second operation bar is correspondingly inserted into the second through hole through the alignment hole of the temporarily stopped film, and the second elastic body mediates the film. After elastically adhering to the lower surface of the second support plate, both edges of the film in elastic contact with the second elastic body are pulled in the Y-axis direction by the operation of the fifth actuator to flatten the surface of the film. Provided is a film flattening device for chip mounting, characterized in that:

At this time, the second operating unit may include a sixth actuator that horizontally operates the second operating bar in the X-axis direction, which is the same as the longitudinal direction of the film.

In addition, according to another aspect of the present invention, in an apparatus for forming an electrode pattern on the surface of a film that moves in one direction and manufacturing a substrate on which a light-emitting chip electrically connected to the electrode pattern is mounted, the film is wound by a certain amount. a film supply unit including a first unwinder and a second unwinder on which a predetermined amount of protective film is wound; a printing unit that forms an electrode pattern on the surface of the film that is unwound and supplied from the first unwinder and wound on a support roll; A film flattening device for chip mounting that flattens the film on which the electrode pattern is pattern printed; a chip mounting unit that mounts the light emitting chip on the aligned electrode pattern of the film so that the electrode terminal of the light emitting chip and the electrode pattern formed on the film are electrically connected; And a pattern curing unit that cures the electrode pattern on which the light emitting chip is mounted while passing the film in one direction. It provides a roll-to-roll flexible substrate manufacturing apparatus, including a.

At this time, the pattern curing unit may include a drying furnace that heat-treats and cures the electrode pattern on which the light-emitting chip is mounted while passing the film in one direction from the inlet to the outlet.

At this time, the pattern curing unit may include an infrared heater that hardens the electrode pattern of the film drawn from the outlet of the drying furnace by heat treating it with infrared rays.

At this time, it is equipped with an upper laminating roll circumscribed with the other side of the film and a lower laminating roll circumscribed with the other side of the protective film on which resin is applied on one side while unwinding and supplied from the second unwinder, so that the film and the protective film are placed on the top, It may include a laminating part that passes between the lower laminating rolls and laminates them into a film laminate.

At this time, it may include a curing machine that cures the resin by transferring heat to the film laminate or irradiating ultraviolet rays, and a rewinder that winds the film laminate.

According to the above configuration, the film flattening device for chip mounting and the roll-to-roll flexible substrate manufacturing device having the same according to the present invention emit light in the chip mounting portion by flattening the paused film after forming an electrode pattern in the roll-to-roll pass line. Since the chip can be accurately mounted on the electrode pattern of the flattened film, the mounting efficiency can be increased by mounting the light-emitting chip without defects, and the flexible substrate with the light-emitting chip mounted on it can be mass-produced using a roll-to-roll method without product defects, increasing the defect rate. It is possible to reduce manufacturing costs by lowering the product yield and increasing product yield.

Figure 1 is an overall configuration diagram showing a roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention.
Figure 2 is a partial detailed view showing a printing unit, a film flattening device for chip mounting, and a chip mounting unit applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention.
Figure 3 is a perspective view showing a state in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is waiting on the upper side of the film.
Figure 4 is a perspective view showing an operating part of a film flattening device for chip mounting applied to a roll-to-roll flexible substrate manufacturing device according to an embodiment of the present invention.
Figures 5a, 5b, and 5c are diagrams showing a state in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is operated in the longitudinal direction of the film.
Figures 6a, 6b, and 6c are diagrams showing a state in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is operated in the width direction of the film.
Figure 7 is a perspective view showing another film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention, waiting at the lower side of the film.
Figure 8 is a perspective view showing another operating part of another film planarization device for chip mounting applied to the roll-to-roll flexible substrate manufacturing device according to an embodiment of the present invention.
FIGS. 9A, 9B, and 9C are diagrams showing a state in which another film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is operated in the longitudinal direction of the film.
Figures 10a, 10b, and 10c are diagrams showing another film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention being operated in the width direction of the film.
Figures 11a and 11b are perspective views showing first and second positioning pins provided in the film flattening device for chip mounting of the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention and alignment holes formed through the film.

Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention, parts not related to the description have been omitted in the drawings, and identical or similar components are given the same reference numerals throughout the specification.

The words and terms used in this specification and claims are not to be construed as limited in their usual or dictionary meanings, but according to the principle that the inventor can define terms and concepts in order to explain his or her invention in the best way. It must be interpreted with meaning and concepts consistent with technical ideas.

Therefore, the embodiments described in this specification and the configuration shown in the drawings correspond to a preferred embodiment of the present invention, and do not represent the entire technical idea of the present invention, so the configuration may be replaced by various alternatives at the time of filing of the present invention. There may be equivalents and variations.

In this specification, terms such as “comprise” or “have” are intended to describe the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to describe the presence of one or more other features. It should be understood that it does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

A component being “in front,” “rear,” “above,” or “below” another component means that it is in direct contact with the other component, unless there are special circumstances. This includes not only those placed at the “bottom” but also cases where another component is placed in the middle. In addition, the fact that a component is "connected" to another component includes not only being directly connected to each other, but also indirectly connected to each other, unless there are special circumstances.

Hereinafter, a roll-to-roll flexible substrate manufacturing apparatus having a film flattening apparatus for chip mounting according to an embodiment of the present invention will be described with reference to the drawings.

Figure 1 is an overall configuration diagram showing a roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention, and Figure 2 is a printing unit and chip mounting film applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention. This is a partial detailed view showing the planarization device and chip mounting section.

As shown in FIGS. 1 and 2, the roll-to-roll flexible substrate manufacturing apparatus 100 according to an embodiment of the present invention includes a film supply unit, a printing unit 110, a film flattening device for chip mounting (120a), and a chip mounting unit. (120), a pattern curing unit 130, an infrared heater 140, a laminating unit 150, a curing machine 160, and a rewinder 103, and the electrode pattern is printed on the film (S1) by the printing unit 110. ) is formed by printing a pattern on the surface, the film moving in one direction is temporarily stopped, the film is flattened so that it is positioned in a preset position, and then the light-emitting chip is precisely mounted on the electrode pattern of the flattened film, The electrode pattern on which the light-emitting chip is mounted is hardened by heat treatment and infrared treatment, and then a protective film coated with a resin is laminated on the surface of the film on which the light-emitting chip is mounted on the cured electrode pattern to manufacture a flexible substrate, which is a film laminate. These flexible substrates are rolled up in the form of a roll so that they can be shipped to the outside.

As shown in FIG. 1, the film supply unit includes a first unwinder 101 in which a certain amount of the film S1 is wound in the form of a scroll on a roll, and a protective film S2 is wound in a certain amount in the form of a scroll in the roll. Includes a second unwinder (102).

The first unwinder 101 and the second unwinder 102 unwind and supply the film (S1) to the printing unit (110) in one direction, and supply the protective film (S2) to the laminating unit (150). It can be installed on both sides of the main frame (F), which is fixed to the floor to provide one-way release.

Accordingly, the film (S1) unwinded and supplied from the first unwinder (101) is wound around the support roll (R) provided on one upper side of the main frame and changes direction from the left to the right in the drawing while the tension is adjusted. A process of printing an electrode pattern by the printing unit while proceeding in one direction, a process of flattening the film by the chip mounting device, a process of mounting a light emitting chip on the electrode pattern by the chip mounting unit, and the above. The electrode pattern on which the light-emitting chip is mounted can be transported in one direction to sequentially perform a process of drying and curing the pattern curing unit.

The printing unit 110 changes the direction of the film (S1) unwound and supplied from the first unwinder (101) toward the film flattening device (120a) for chip mounting adjacent to the support roll (R), and then The electrode pattern is printed using a screen method on one side of the film, the upper surface, by temporarily stopping the one-way movement of the film and fixing the position, using the squeezer and sprayer that move up and down in opposite directions, and the screen mask that operates forward and backward.

This printing unit is not limited to printing electrode patterns using a screen method, and non-contact electronic printing technologies such as inkjet, spray, and slot die coating, or contact electronic printing technologies such as gravure, gravure offset, and reverse offset can be selectively applied. You can.

The film (S1) may be made of a transparent film made of a thin resin material such as PI, PET, etc., and the material of the electrode pattern printed on the film is silver (Ag), copper (Cu), and aluminum (Al). , conductive metals such as gold (Au), platinum (Pt), nickel (Ni), tin (Sn), chromium (Cr), zinc (Zn), or alloys thereof, or indium tin oxide (ITO), indium zinc oxide. (IZO), Indium Zinc Tin Oxide (IZTO), Aluminum Zinc Oxide (AZO), Indium Tin Oxide-Silver-Indium Tin Oxide (ITO-Ag-ITO), Indium Zinc Oxide-Silver-Indium Zinc Oxide (IZO-Ag- It may be made of one or more conductive metal oxides such as IZO), indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO), and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO). .

When the printing unit 110 is equipped with a squeezer 112, a sprayer 111, and a screen mask (M) to print an electrode pattern using a screen method, the lower end of the squeezer faces the screen mask and is in contact with or spaced apart from the screen mask. Preferably, it is provided to be able to move up and down by the actuator 114, and the sprayer can be provided to be able to move up and down by another actuator 113 so that the screen mask and the lower end face each other or are spaced apart.

The screen mask (M) is formed in the form of perforations with an electrode pattern of a specific design to be printed on the surface of a film that is transported in one direction in a roll-to-roll manner, the rest is blocked, and liquid conductive ink for printing, which is applied and sprayed, is applied to the surface. It can be made of a fabric material so that it naturally permeates.

In this state, when the lower end is in contact with the screen mask and the mask frame 116 is moved backward by the driving force of the drive motor 115 with respect to the fixed sprayer, the mask frame 116 is provided between the squeezer and the sprayer. The conductive ink for printing applied in a certain amount to the surface of the screen mask by the dispenser is sprayed evenly to have a constant thickness overall on the surface of the screen mask that returns backwards while in contact with the bottom of the sprayer, so that the conductive ink for printing is applied to the surface of the film. Ink is applied to form a preset electrode pattern.

Figure 3 is a perspective view showing a state in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is waiting on the upper side of the film, and Figure 4 is a perspective view showing a state according to an embodiment of the present invention. This is a perspective view showing the operating part of a film flattening device for chip mounting applied to a roll-to-roll flexible substrate manufacturing device.

As shown in FIGS. 1, 2, 3, and 4, the film flattening device 120a for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus 100 according to an embodiment of the present invention includes the printing unit ( 110) and the chip mounting unit 120, and is provided on the upper edges of both sides of the film so that the light-emitting chip (C) is accurately mounted on the electrode pattern (P) at a preset mounting position. A plurality of first operating bars 121 and a pair of first support plates ( 124) and a plurality of first operating units 122.

The first operation bar 121 includes a first positioning pin 121a at each lower end corresponding to an alignment hole H formed through both edges of the film S1, and the first positioning pin and It may include a first elastic body 123 integrally provided on the adjacent outer surface.

The first positioning pin (121a) is a pin member that has an outer diameter that is approximately the same as the inner diameter of the alignment hole (H) and has a predetermined length so as to be located in a first through hole formed through the first support plate through the alignment hole. It can be done with

At this time, the first positioning pin 121a may be integrally provided at the bottom of the first operation bar or may be detachably provided.

The first operating bar 121 is disposed directly above the edges of both sides of the film, and operates in the Z-axis direction orthogonal to the film by the first operating unit 122, in the X-axis direction, which is the same as the width direction of the film, It can be selectively operated in the Y-axis direction, which is the same as the longitudinal direction of the film.

The pair of first support plates 124 are each fixedly installed adjacent to both edges of the lower surface of the film by forming a first through hole 124a of a certain size on the upper surface corresponding to the first positioning pin. It may be provided as a roughly square-shaped plate.

The first through hole 124a is formed through the first support plate 124 to a size larger than the inner diameter of the alignment hole formed through both edges of the film and smaller than the outer diameter of the first elastic body 123. By forming a gap of a certain size between the outer diameter of the first positioning pin and the inner diameter of the first through hole, the first positioning pin can move in the X-axis direction and the Y-axis direction by an amount corresponding to the gap. .

The first operation unit 122 is positioned directly above the edges of both sides of the film S1 so that the first positioning pin is positioned in the first through hole through the alignment hole or the first positioning pin is positioned at the top. It includes a first actuator (122a) that moves the first operation bar up and down in the Z-axis direction perpendicular to the film, and a first positioning pin (121a) inserted into the first through hole (124a) moves the film. In addition to the first elastic body in elastic contact with the upper surface, the first actuator 122c includes a second actuator 122c that horizontally operates the first operation bar in the Y-axis direction, which is the same as the width direction of the film, so as to move in the Y-axis direction. Two actuators (122a, 122c) can be operated sequentially.

This first operating unit 122 has a first positioning pin 121a inserted into the first through hole 124a, and a first elastic body 123 that is in elastic contact with the upper surface of the film and moves along the X-axis. It may include a third actuator 122e that horizontally operates the first operation bar 121 in the X-axis direction, which is the same as the longitudinal direction of the film, so that it moves in this direction.

The first actuator (122a) is provided with a cylinder member whose rod end is connected to the upper end of the first operating bar (121), which is assembled to be movable up and down through a central hole formed through the first moving block (122b) and a bearing member. The second actuator (122c) includes a second moving block (122d) having a rail on which a slider provided on the lower surface of the first moving block (122b) can slide in the Y-axis direction and a rod end. It is provided with a connected cylinder member, and the third actuator (122e) is a third moving block (122f) having another rail on which another slider provided on the lower surface of the second moving block can slide in the X-axis direction. ) can be provided as a cylinder member to which the rod end is connected.

FIGS. 5A, 5B, and 5C are diagrams showing a state in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is operated in the longitudinal direction of the film; FIGS. 6A, 6B, and 6C; is a state diagram in which the film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention is operated in the width direction of the film.

The process of flattening the film (S1) on which the electrode pattern is pattern-printed is, as shown in FIGS. 5A and 6A, alignment holes (H) formed through both edges of the film and the first operation bar (121). When the first positioning pin provided at the bottom of is positioned on the same vertical line, the film (S1) on which the electrode pattern is printed in the printing unit temporarily stops moving in one direction and stops.

At this time, temporarily stopping the film moving in one direction in order to flatten the film means that the first positioning pin of the first support plate is positioned on the same vertical line as the alignment hole of the film and the first positioning pin of the first operating bar. This can be achieved by a detection signal from an optical sensor such as a camera fixed to the lower part of the first support plate to detect the end of the first positioning pin located at the top through a through hole.

Next, the process of elastically contacting the first elastic body of the first operation bar with the upper surface of the film is performed by operating the first actuator, as shown in FIGS. 5B and 6B. ) is moved downward in the Z-axis direction directly below, the first positioning pin (121a) is inserted into and positioned in the first through hole (124a) of the first support plate through the alignment hole (H), and at the same time, the first positioning pin (121a) is positioned and inserted into the first through hole (124a) of the first support plate The first elastic body 123 provided on the top of the first positioning pin is elastically adhered to the upper surface of the first support plate through the film.

In this state, the process of flattening the film on which the electrode pattern is pattern-printed is performed by operating the second actuator to move the first actuating bar 121 in the width direction of the film, as shown in FIGS. 5C and 6C. When horizontally moved in the X-axis direction, both edges of the film in close contact with the first elastic body are pulled while sliding along the upper surface of the first support plate in the It can be flattened so that the light emitting chip can be accurately mounted and mounted at a preset mounting position of the electrode pattern in the chip mounting unit 120, which is a post-process.

Figure 7 is a perspective view showing another chip mounting film flattening device applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention, waiting at the lower side of the film, and Figure 8 is a perspective view showing an embodiment of the present invention. This is a perspective view showing another operating part of another film flattening device for chip mounting applied to a roll-to-roll flexible substrate manufacturing device.

Another chip mounting film flattening device 120b applied to the roll-to-roll flexible substrate manufacturing apparatus 100 according to an embodiment of the present invention is a light emitting chip on the electrode pattern P, as shown in FIGS. 7 and 8. (C) is provided at the bottom of both sides of the film so that it is mounted accurately at the preset mounting position, and the both sides of the paused film are pulled outward to make the film (S1) convex upward or concave downward. It may include a plurality of second operating bars 125, a pair of second support plates 128, and a plurality of second operating units 126 to flatten the surface uniformly and consistently.

The second operation bar 125 includes a second positioning pin 125a at each upper end corresponding to an alignment hole H formed through both edges of the film S1, and the second positioning pin and It may include a second elastic body 127 integrally provided on the adjacent outer surface.

The second positioning pin (125a) has an outer diameter that is approximately the same as the inner diameter of the alignment hole (H) and has a certain length so as to be located in the second through hole (128a) formed through the alignment hole to penetrate the second support plate. It may be made of a pin member having.

At this time, the second positioning pin 125a may be integrally provided at the top of the second operation bar or may be detachably provided.

The second operating bar 125 is disposed directly below the edges of both sides of the film, and is operated by the second operating unit 126 in the Z-axis direction orthogonal to the film, the X-axis direction equal to the width direction of the film, It can be selectively operated in the Y-axis direction, which is the same as the longitudinal direction of the film.

The pair of second support plates 128 are fixedly installed adjacent to both edges of the upper surface of the film by forming a second through hole 128a of a certain size on the lower surface corresponding to the second positioning pin. It may be provided as a roughly square-shaped plate.

The second through hole 128a is formed through the second support plate 128 to a size larger than the inner diameter of the alignment hole formed through both edges of the film and smaller than the outer diameter of the second elastic body 127. By forming a gap of a certain size between the outer diameter of the second positioning pin and the inner diameter of the second through hole, the second positioning pin can move in the X-axis direction and in the Y-axis direction by an amount corresponding to the gap. .

The second operation unit 126 is positioned below the edges of both sides of the film S1 so that the second positioning pin is positioned in the second through hole through the alignment hole or the second positioning pin is positioned at the bottom. It includes a fourth actuator (126a) that moves the second operation bar up and down in the Z-axis direction perpendicular to the film, and a second positioning pin (125a) inserted into the second through hole (124a) is positioned at the lower part of the film. The fourth and fifth actuators, including a fifth actuator (126c) that horizontally operates the second actuating bar in the Y-axis direction, which is the same as the width direction of the film, so as to move in the Y-axis direction along with the second elastic body in elastic contact with the surface. The actuators 126a and 126c can be operated sequentially.

This second operating unit 126 has a second positioning pin 125a inserted into the second through hole 124a, and a second elastic body 127 in elastic contact with the lower surface of the film, along with the X-axis. It may include a sixth actuator 126e that horizontally operates the second operation bar 125 in the X-axis direction, which is the same as the longitudinal direction of the film, so that it moves in this direction.

The fourth actuator (126a) is provided with a cylinder member whose rod end is connected to the lower end of the second operating bar (125), which is assembled to be movable up and down through a central hole formed through the fourth moving block (126b) and a bearing member. The fifth actuator (126c) has a rod end and a fifth moving block (126d) having a rail on which the slider provided on the lower surface of the fourth moving block (126b) can slide in the Y-axis direction. It is provided with a connected cylinder member, and the sixth actuator (126e) is a sixth moving block (126f) having another rail on which another slider provided on the lower surface of the fifth moving block is movable in the X-axis direction. ) can be provided as a cylinder member to which the rod end is connected.

FIGS. 9A, 9B, and 9C are diagrams showing another chip mounting film flattening device applied to the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention being operated in the longitudinal direction of the film; FIGS. 10A, 10B, and FIG. 10c is a state diagram in which another film flattening device for chip mounting applied to the roll-to-roll flexible substrate manufacturing device according to an embodiment of the present invention is operated in the width direction of the film.

The process of flattening the film (S1) on which the electrode pattern is pattern-printed is, as shown in FIGS. 9A and 10A, alignment holes (H) formed through both edges of the film and the second operation bar (125). When the second positioning pin provided at the top of is positioned on the same vertical line, the film (S1) on which the electrode pattern is printed in the printing unit temporarily stops moving in one direction and stops.

At this time, temporarily stopping the film moving in one direction in order to flatten the film means that the second positioning pin of the second support plate is positioned on the same vertical line as the alignment hole of the film and the second positioning pin of the second operating bar. This can be achieved by a detection signal from an optical sensor such as a camera fixed to the upper part of the second support plate to detect the end of the second positioning pin located below through the through hole.

Subsequently, the process of elastically contacting the second elastic body of the second operating bar with the lower surface of the film is performed by operating the fourth actuator to move the second operating bar 125, as shown in FIGS. 9B and 10B. ) moves upward in the Z-axis direction directly below, the second positioning pin (125a) is inserted into and positioned in the second through hole (128a) of the second support plate through the alignment hole (H), and at the same time, the second positioning pin (125a) is positioned and inserted into the second through hole (128a) of the second support plate through the alignment hole (H). The second elastic body 127 provided at the lower part of the second positioning pin is elastically adhered to the lower surface of the second support plate through the film.

In this state, the process of flattening the film on which the electrode pattern is pattern-printed is, as shown in FIGS. 9C and 10C, the second operation bar 125 moves in the width direction of the film by operation of the fifth actuator. When horizontally moved in the X-axis direction, both edges of the film in close contact with the second elastic body are pulled while sliding in the It can be flattened so that the light emitting chip can be accurately mounted and mounted at a preset mounting position of the electrode pattern in the chip mounting unit 120, which is a post-process.

Figures 11a and 11b are perspective views showing first and second positioning pins provided in the film flattening device for chip mounting of the roll-to-roll flexible substrate manufacturing apparatus according to an embodiment of the present invention and alignment holes formed through the film.

A first positioning pin 121a provided at the bottom of the first operation bar 121 located above both edges of the film (S1), and a second positioning pin 121a of the second operation bar located below both sides of the film S1. The positioning pin 125a is shown and described as being provided as a pin member whose outer surface is in contact with the inner circumferential surface of the alignment hole and has the same circular cross-section as the alignment hole formed through a roughly circular hole on both edges of the film, but is limited thereto. This is not the case and may be provided in a square or triangular cross-section.

That is, the first positioning pin (121a) and the second positioning pin (125a) have the same square cross-section as the alignment hole (H), which is formed through approximately square holes on both edges of the film, as shown in FIG. 11a. The straight inner surface of the alignment hole is in contact with the flat outer surface of the first and second positioning pins.

In this state, horizontal movement in the X-axis direction by the second actuator and horizontal movement in the Y-axis direction by the third actuator are sequentially performed, and horizontal movement in the When the movement and horizontal movement in the Y-axis direction by the sixth actuator are sequentially performed, when the first positioning pin (121a) and the second positioning pin (125a) are sequentially moved in the horizontal direction, the film It is possible to prevent tearing damage to the film by more efficiently transmitting the external force that pulls both edges of the film in the horizontal direction.

In addition, as shown in FIG. 11b, the first positioning pin 121a and the second positioning pin 125a have the same triangular cross-section as the alignment hole H, which is formed through approximately triangular holes on both edges of the film. The straight inner surface of the alignment hole is in contact with the flat outer surface of the first and second positioning pins.

In this state, horizontal movement in the X-axis direction and Y-axis direction due to the simultaneous operation of the 2nd and 3rd actuators, and horizontal movement in the When horizontal movements in the axial direction are performed simultaneously and in combination, when the first positioning pin (121a) and the second positioning pin (125a) move horizontally in the oblique direction, an external force is applied that pulls both edges of the film in the oblique direction. It can prevent tearing damage to the film while delivering more efficiently.

As shown in FIGS. 1 and 2, the chip mounting unit 120 is provided between the chip mounting film flattening devices 120a and 120b and the pattern hardening unit 130 and is a tray in which a plurality of light-emitting chips are stored. The light emitting chip picked up is electrically connected to the chip mounting film so that the electrode terminal of the light emitting chip (C) selectively picked up from (not shown) and the electrode pattern printed on the surface of one side of the film (S1) are electrically connected to each other. It is mounted on the electrode pattern of the film flattened by the flattening devices 120a and 120b.

At this time, the light emitting chip (C) may be a light emitting device such as an LED that generates light when power is applied.

This chip mounting unit 120 includes a carriage 53 that is assembled on a horizontal stand extending a certain length along the moving direction of the film S1 so as to be movable in the forward and backward direction, which is the longitudinal direction of the film. The shuttle 53 is a jig-robot equipped with a slider that is movably assembled on a guide bar provided on the horizontal bar and moves back and forth in the Y-axis direction, which is parallel to the direction of movement of the film, by a drive source (not shown). You can.

It includes an adsorption transfer block 55 that transfers the light emitting chip stored in the tray by vacuum adsorption, and the adsorption transfer block 55 connected to a vacuum suction line (not shown) is a light emitting chip that generates light when power is applied to the lower surface. It is equipped with a plurality of suction holes to adsorb and fix the light-emitting chip, which is a mounting object, by vacuum adsorption and transport. On the other hand, when the vacuum suction force is released, the adsorbed light-emitting chip can be dropped and separated by its own weight.

This adsorption transfer block 55 may be mounted on the rod end of the mounting cylinder 56 to move the light emitting chip as close to or as spaced from it so that it can be mounted on the electrode pattern of the flattened film.

The mounting cylinder 56 is fixed to the moving bracket 54 provided on the carriage and can be moved back and forth together with the carriage when picking up the light-emitting chip.

The moving bracket 54 is equipped with at least one pattern confirmation camera 57 to check the electrode pattern of the film S1 on which the surface of the electrode pattern is flattened by the chip mounting film flattening device, An illumination unit 58 may be provided to illuminate the film surface so that the mounting position of the electrode pattern can be accurately detected and confirmed by the pattern confirmation camera 57.

Accordingly, in a state in which the one-way movement of the film is temporarily stopped, the light-emitting chip adsorbed and fixed to the suction transfer block is positioned at the mounting position of the electrode pattern confirmed by the pattern confirmation camera by the lowering operation of the mounting cylinder. It is raised accurately.

At the same time, the connection terminal of the light-emitting chip separated from the lower surface of the adsorption transfer block by releasing the vacuum suction force of the adsorption transfer block is undried and mounted by being adhered and mounted in contact with an electrode pattern having an adhesive force of a certain size.

As shown in FIG. 1, the pattern hardening unit 130 is provided with an inlet through which the film S1 enters and an outlet through which it goes out on both sides, and an internal space through which the film passes in one direction is heated at 150°C. It is equipped with a drying furnace having a heating means that provides a heat source, so that while passing the film in one direction, the electrode pattern (P) in a solid state printed on the surface of the film and equipped with a light-emitting chip is heated with a high temperature heat source to completely cure it. It is heat treated.

At this time, the resistance value of the electrode pattern P to be heat-treated can be lowered by heat-treating it with a heat source at 150°C, and the temperature for drying and heat-treating the electrode pattern is appropriately adjusted depending on the type of conductive ink for printing that is the material of the pattern. desirable.

Accordingly, the film (S1) on which the light-emitting chip (C) is mounted on the pattern-printed electrode pattern is heat-treated while providing a heat source to the electrode pattern in a reactive solid state while passing in one direction through the internal space of a high-temperature atmosphere, and the light-emitting chip is mounted. It is dried to completely harden so that it does not separate.

Because the pattern hardening unit is provided with at least one infrared heater 140 on the outlet side of the drying furnace, the infrared rays generated by the infrared heater can be uniformly irradiated to the surface of the film S1 that advances from the outlet to the outside. The electrode pattern (P), which is pattern printed on the surface of the film and has a light-emitting chip mounted thereon, can be completely cured by secondary heat treatment.

As shown in FIG. 1, the laminating unit 150 sequentially passes through the chip mounting film flattening devices 120a and 120b, the chip mounting unit 120, the pattern hardening unit 130, and the infrared heater 140. It sequentially heat-treats and hardens the electrode pattern on which the light-emitting chip is mounted, and includes an upper laminating roll 151 that circumscribes the other side of the film (S1) forming the cured electrode pattern on one side, and rolls from the second unwinder. It may include a lower laminating roll 152 that circumscribes the other side of the protective film (S2) on which resin is applied on one side while being unrolled and supplied.

By simultaneously entering and laminating the film (S1) and the protective film (S2) between the upper laminating roll 151 and the lower laminating roll 152, the electrode pattern of the film (S1) and the light emitting chip (C) mounted thereon are formed. ) can be embedded in the resin of the protective film (S2) to form a film laminate (S3) in which the film and the protective film are stacked.

The roll bracket supporting both ends of the upper laminating roll 151 is equipped with a vertical guider that is movably assembled on the vertical guide rail of the main frame (F), and moves up and down toward the lower laminating roll 152, which is fixed in position. It may be connected to an adjustment member for gap adjustment so as to adjust the gap size, which is the distance between the lower laminating roll and the lower laminating roll.

Accordingly, the film (S1) on which the pattern on which the light-emitting chip is mounted is formed on one side, and the protective film (S2) on which the resin is applied on one side are unidirectionally formed between the upper laminating roll (151) and the lower laminating roll (152). By passing through and laminated into a film laminate (S3), a process of manufacturing a film laminate in which the electrode pattern and the light-emitting chip mounted thereon are embedded in the resin of the protective film is performed.

At this time, a resin applicator is included between the laminating part and the second unwinder, and this resin applicator is unwound in one direction from the second unwinder 102 provided on the other side of the main frame (F). By applying resin to one side of the supplied protective film (S2), a resin layer of a certain thickness having a size equal to or relatively thick as the electrode pattern of the film and the layer thickness of the light emitting chip mounted thereon is formed on one side of the protective film. will be.

This resin applicator includes a slot die for applying liquid resin to one side of the protective film (S2) horizontally transferred to the laminating unit 150, and the other side and the outer peripheral surface of the protective film (S2) are circumscribed in one direction. It includes a rotating guide support roll, and may include a separate adjustment member that moves the slot die up and down to adjust the gap between the discharge port of the slot die and the protective film.

At this time, the protective film may be provided with a transparent film such as PI or PET that is the same or different from the above film, and the resin may be a thermosetting or ultraviolet curing resin.

Accordingly, the resin discharged through the slot die of the resin applicator is applied to one surface of the protective film to form a resin layer with a certain thickness.

The curing machine 160 is provided on the exit side of the laminating part and selectively transfers heat or irradiates ultraviolet rays to the film laminate (S3) in which the film and the protective film are laminated at the top and bottom, thereby covering the electrode pattern and the light-emitting chip mounted thereon. This is to harden the resin.

The resin layer formed by the resin may be made of a thermosetting resin or an ultraviolet curing resin, and the curing device 160 is a curing means such as a heater that provides a heat source or a UV irradiator that irradiates ultraviolet light depending on the type of resin. Can be optionally provided.

At this time, the curing machine 160 is shown and explained as being installed at the upper part corresponding to the upper surface, which is the other surface of the film (S1), but is not limited thereto, and is installed at the lower part corresponding to the lower surface, which is the other surface of the protective film, for film lamination. The curing process can be performed by providing heat or ultraviolet rays to the body side.

The rewinder 103 winds the film laminate S3, in which a protective film and a film are stacked top and bottom, in a roll shape so that the electrode pattern and the light emitting chip mounted thereon are embedded in the resin.

Meanwhile, a synchronization circulation belt 170 that is wound simultaneously with the guide support roll of the resin applicator, the lower laminating roll of the laminating part, and the lower contact roll of the curing machine and circulates in one direction is provided to apply resin to one side of the protective film. In order to form a resin layer by applying the protective film, the speed of advancing the protective film in one direction, the speed of passing the film and the protective film between the upper and lower laminating rolls, and the speed of passing the curing machine that hardens the resin can be controlled by synchronizing them. there is.

Here, the flexible substrate, which is a film laminate in which a light-emitting chip is mounted on an electrode pattern formed on one side of the film and a protective film is laminated, is shown and explained as being rolled up and shipped in the form of a roll, but is not limited thereto, and is not limited to this, and is The film laminate can be cut to a predetermined length and shipped.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention as is known in the technical field to which the present invention pertains. It will be clear to those who have the knowledge of.

110: printing unit 120: chip mounting unit
120a, 120b: Film flattening device for chip mounting
121: first operating bar 121a: first positioning pin
122: first operating unit 123: first elastic body
124: first support plate 124a: first through hole
125: second operating bar 125a: second positioning pin
126: second operating unit 127: second elastic body
128: second support plate 128a: second through hole
130: Pattern hardening unit 140: Infrared heater
150: Laminating part 160: Curing machine

Claims (9)

In the device for flattening a film on which an electrode pattern on which at least one light-emitting chip is mounted, the film is pattern-printed,
a plurality of first operation bars each having first positioning pins at lower ends corresponding to alignment holes formed through both edges of the film, and integrally equipped with a first elastic body on an outer surface adjacent to the first positioning pins;
A pair of first support plates formed through first through holes corresponding to the first positioning pins and fixed to both edges of the lower surface of the film; and
It is equipped with a first actuator that moves the first operation bar up and down in the Z-axis direction orthogonal to the film, and a second actuator that horizontally moves the first operation bar in the Y-axis direction equal to the width direction of the film. A first operating unit that sequentially operates the actuator and the second actuator; Including,
The first operating unit includes a third actuator that horizontally operates the first operating bar in the X-axis direction, which is the same as the longitudinal direction of the film,
The first positioning pin has an outer diameter that is the same as the inner diameter of the alignment hole, and the first through hole has an inner diameter that is larger than the inner diameter of the alignment hole and smaller than the outer diameter of the first elastic body. Forming a gap of a certain size between the outer diameter of the positioning pin and the inner diameter of the first through hole,
The first actuator is connected to the upper end of the first operating bar that is movably assembled in the central hole of the first moving block, and the second actuator is capable of sliding in the Y-axis direction on the lower surface of the first moving block. It is connected to a second moving block that is assembled, and the third actuator is connected to a third moving block that is assembled to slide in the X-axis direction on the lower surface of the second moving block,
By operating the first actuator, the first positioning pin of the first operation bar is correspondingly inserted into the first through hole through the alignment hole of the temporarily stopped film, and the first elastic body is moved to the first through hole through the film. A chip mounting device that elastically adheres to the upper surface of the support plate and then flattens the surface of the film by pulling both edges of the film in elastic contact with the first elastic body in the Y-axis direction by the operation of the second actuator. Film flattening device for use. delete In the device for flattening a film on which an electrode pattern on which at least one light-emitting chip is mounted, the film is pattern-printed,
a plurality of second operation bars each having a second positioning pin at the upper end corresponding to an alignment hole formed through an edge of both sides of the film, and integrally provided with a second elastic body on an outer surface adjacent to the second positioning pin;
A pair of second support plates formed through second through holes corresponding to the second positioning pins and fixed to both edges of the upper surface of the film; and
A fourth actuator is provided to move the second operation bar up and down in the Z-axis direction perpendicular to the film, and a fifth actuator is provided to horizontally move the second operation bar in the Y-axis direction equal to the width direction of the film. A second operating unit that sequentially operates the actuator and the fifth actuator; Including,
The second positioning pin has an outer diameter that is the same as the inner diameter of the alignment hole, and the second through hole has an inner diameter that is larger than the inner diameter of the alignment hole and smaller than the outer diameter of the second elastic body. Forming a gap of a certain size between the outer diameter of the positioning pin and the inner diameter of the second through hole,
The second operating unit includes a sixth actuator that horizontally operates the second operating bar in the X-axis direction, which is the same as the longitudinal direction of the film,
The fourth actuator is connected to the lower end of the second operating bar that is movably assembled in the central hole of the fourth moving block, and the fifth actuator is capable of sliding in the Y-axis direction on the lower surface of the fourth moving block. It is connected to a fifth moving block that is assembled, and the sixth actuator is connected to a sixth moving block that is assembled to slide in the X-axis direction on the lower surface of the fifth moving block,
By operation of the fourth actuator, the second positioning pin of the second operation bar is correspondingly inserted into the second through hole through the alignment hole of the temporarily stopped film, and the second elastic body is moved to the second through hole through the film. A chip mounting device that elastically adheres to the lower surface of the support plate and then flattens the surface of the film by pulling both edges of the film in elastic contact with the second elastic body in the Y-axis direction by the operation of the fifth actuator. Film flattening device for use. delete In an apparatus for forming an electrode pattern on the surface of a film that moves in one direction and manufacturing a substrate on which a light-emitting chip electrically connected to the electrode pattern is mounted,
a film supply unit including a first unwinder on which a predetermined amount of the film is wound, and a second unwinder on which a predetermined amount of the protective film is wound;
a printing unit that forms an electrode pattern on the surface of the film that is unwound and supplied from the first unwinder and wound on a support roll;
The film flattening device for chip mounting according to claim 1 or 3;
a chip mounting unit that mounts the light emitting chip on the aligned electrode pattern of the film so that the electrode terminal of the light emitting chip and the electrode pattern formed on the film are electrically connected; and
A roll-to-roll flexible substrate manufacturing apparatus comprising; a pattern curing unit that cures the electrode pattern on which the light-emitting chip is mounted while passing the film in one direction. According to clause 5,
The pattern curing unit includes a drying furnace that heat-treats and cures the electrode pattern on which the light-emitting chip is mounted while passing the film in one direction from the inlet to the outlet. According to clause 6,
The pattern curing unit includes an infrared heater that hardens the electrode pattern of the film drawn from the outlet of the drying furnace by heat treating it with infrared rays. According to clause 5,
It is equipped with an upper laminating roll that circumscribes the other side of the film and a lower laminating roll that circumscribes the other side of the protective film on which resin is applied on one side while being unwinded and supplied from the second unwinder, and laminates the film and the protective film on the upper and lower sides. A roll-to-roll flexible substrate manufacturing device comprising a laminating unit that passes between rolls and laminates them into a film laminate. According to clause 8,
A roll-to-roll flexible substrate manufacturing apparatus comprising a curing machine that cures the resin by transferring heat to the film laminate or irradiating ultraviolet rays, and a rewinder that winds the film laminate.

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