KR102599626B1 - Manufacturing apparatus for energy conversion device, manufacturing method for energy conversion device using the same and energy conversion device - Google Patents

Abstract

The present invention relates to an energy conversion element manufacturing apparatus, an energy conversion element manufacturing method, and an energy conversion element.
An energy conversion device manufacturing apparatus according to an embodiment of the present invention includes a substrate transfer unit for transferring a substrate, an adhesive applicator disposed on one side of the substrate transfer unit to apply an adhesive on the substrate, and a plurality of adhesive applicators disposed on the other side of the substrate transfer unit. A pin array transfer unit that receives a pin array including pins and a film, places the pin array on the substrate coated with adhesive, and transfers the pin array onto the substrate to couple the substrate and the pin array. and a press unit that presses the upper surface of the pin array coupled to the substrate so that the thickness of the adhesive is less than a preset thickness.

Description

Energy conversion device manufacturing apparatus, energy conversion device manufacturing method, and energy conversion device {Manufacturing apparatus for energy conversion device, manufacturing method for energy conversion device using the same and energy conversion device}

The present invention relates to an energy conversion element manufacturing apparatus, an energy conversion element manufacturing method, and an energy conversion element.

Recently, interest in devices that can convert energy has increased, and research on them is actively underway. Among these energy conversion devices, thermoelectric devices are devices used to convert thermal energy into electrical energy or electrical energy into thermal energy, and generally refer to devices using the Peltier effect. Thermoelectric elements are widely used in a variety of fields, including automobile temperature control seats, semiconductor circulators and cooling plates, and computer coolers.

However, in the case of the conventional method of manufacturing a thermoelectric element, there is a problem in that the electrical contact between the substrate and the pin array is not good due to the adhesive applied on the substrate, resulting in low efficiency.

The above-mentioned background technology is technical information that the inventor possessed for deriving the present invention or acquired in the process of deriving the present invention, and cannot necessarily be said to be known technology disclosed to the general public before filing the application for the present invention.

Japanese Patent Publication JP 2003-101087 A

The present invention is an invention to solve the above-mentioned problems, and can ensure that the substrate and the pin array are in good electrical contact with each other.

However, these problems are illustrative, and the problems to be solved by the present invention are not limited thereto.

An energy conversion device manufacturing apparatus according to an embodiment of the present invention includes a substrate transfer unit for transferring a substrate, an adhesive applicator disposed on one side of the substrate transfer unit to apply an adhesive on the substrate, and a plurality of adhesive applicators disposed on the other side of the substrate transfer unit. A pin array transfer unit that receives a pin array including pins and a film, places the pin array on the substrate coated with adhesive, and transfers the pin array onto the substrate to couple the substrate and the pin array. and a press unit that presses the upper surface of the pin array coupled to the substrate so that the thickness of the adhesive is less than a preset thickness.

In the energy conversion element manufacturing apparatus according to an embodiment of the present invention, the curing unit further includes a curing unit that cures the adhesive by heating the substrate and the pin array coupled to the substrate, and the press unit determines the thickness of the adhesive. It may flow into the hardened portion while maintaining a preset thickness or less.

In the energy conversion device manufacturing apparatus according to an embodiment of the present invention, the press unit may include a press plate disposed on an upper surface of the pin array and transferred by the substrate transfer unit together with the substrate and the pin array.

In the energy conversion device manufacturing apparatus according to an embodiment of the present invention, the curing unit has a portion of the substrate transfer unit disposed therein and heats the substrate and the pin array transferred by the substrate transfer unit to a predetermined temperature to It may be a reflow type that hardens the adhesive.

In the energy conversion device manufacturing apparatus according to an embodiment of the present invention, the hardening part is heated to a predetermined temperature and may include a heat insulation member in contact with the lower surface of the substrate.

In the energy conversion element manufacturing apparatus according to an embodiment of the present invention, the press unit includes a base plate supporting the substrate, a pressure plate for pressing the upper surface of the pin array coupled to the substrate, and the base plate and the pressure. It may include a clamping member connecting the plates.

In the energy conversion device manufacturing apparatus according to an embodiment of the present invention, a plurality of the substrate and the pin array coupled to each other between the base plate and the pressure plate may be stacked to form a laminate.

In the energy conversion element manufacturing apparatus according to an embodiment of the present invention, the clamping member may fix the base plate and the pressure plate to press the laminate at a predetermined pressure.

In the energy conversion element manufacturing apparatus according to an embodiment of the present invention, the curing unit has an internal space in which the substrate and the pin array are accommodated while being pressed by the press unit, and the internal space is maintained at a predetermined temperature. It may be an oven type that hardens the adhesive by receiving the substrate and the pin array for a predetermined period of time while maintaining the temperature.

In the energy conversion device manufacturing apparatus according to an embodiment of the present invention, the press unit may press the pin array so that the thickness of the adhesive maintains the thickness of the diameter of the metal particles included in the adhesive.

A method of manufacturing an energy conversion device according to an embodiment of the present invention includes the steps of a substrate transfer unit receiving and transferring a substrate, an adhesive applicator applying an adhesive on the substrate, and a pin array transfer unit comprising a plurality of pins and a film. A step of receiving a pin array, placing the pin array on the substrate to which adhesive is applied, transferring the pin array onto the substrate to combine the substrate and the pin array, and a press unit measuring the thickness of the adhesive. and pressing the upper surface of the pin array coupled to the substrate to a set thickness or less.

The method of manufacturing an energy conversion element according to an embodiment of the present invention further includes a step of curing the adhesive by a curing unit heating the substrate and the pin array coupled to the substrate, and the pressing step is performed to cure the adhesive. It can be introduced into the hardening unit while maintaining the thickness below a preset thickness.

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the pressurizing step may be performed by placing the press unit on the upper surface of the pin array and transferring the substrate and the pin array to the substrate transfer unit.

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the curing step is performed by prescribing the substrate and the pin array to be transferred by the substrate transfer unit in the curing unit, in which a portion of the substrate transfer unit is disposed. The adhesive can be hardened by heating to a temperature of .

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the curing step may heat a thermal insulation member disposed inside the cured portion to a predetermined temperature and bring the thermal insulation member into contact with the lower surface of the substrate.

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the pressing step includes placing a substrate on the base plate of the press unit, pressing the upper surface of the pin array coupled to the substrate with a pressing plate, and clamping. The base plate and the pressing plate may be connected to each other by a member.

In the method of manufacturing an energy conversion device according to an embodiment of the present invention, the pressing step may form a laminate by stacking a plurality of the substrate and the pin array coupled to each other between the base plate and the pressing plate.

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the pressing step may be performed by fixing the base plate and the pressing plate with the clamping member to press the laminate to a predetermined pressure.

The method of manufacturing an energy conversion element according to an embodiment of the present invention includes the curing step in the curing unit having an internal space in which the substrate and the pin array are accommodated while being pressed by the press unit, The adhesive may be cured by accommodating the substrate and the pin array for a predetermined time while maintaining the space at a predetermined temperature.

In the method of manufacturing an energy conversion element according to an embodiment of the present invention, the pressing step may pressurize the pin array so that the thickness of the adhesive maintains the thickness of the diameter of the metal particles included in the adhesive.

The energy conversion device according to an embodiment of the present invention is an energy conversion device manufactured by the energy conversion device manufacturing method according to an embodiment of the present invention, and the energy conversion device includes a substrate that is a metal plate, and a material applied on the substrate. It includes an adhesive and a pin array including a plurality of pins disposed on the adhesive and a film supporting the plurality of pins, and the separation distance between the upper surface of the substrate and the pins is the diameter of the metal particles included in the adhesive.

Other aspects, features and advantages other than those described above will become apparent from the detailed description, claims and drawings for carrying out the invention below.

The energy conversion device manufacturing apparatus and energy conversion device manufacturing method according to an embodiment of the present invention minimize the thickness of the adhesive included in the energy conversion device, thereby minimizing the separation distance between the substrate and the pin, thereby increasing the efficiency of the energy conversion device. You can.

Figure 1 shows a block diagram of an energy conversion element manufacturing apparatus according to an embodiment of the present invention.
Figure 2 schematically shows an energy conversion element manufacturing apparatus according to an embodiment of the present invention.
3 and 4 show a substrate according to an embodiment of the present invention.
Figure 5 shows a pin array according to an embodiment of the present invention.
Figure 6 shows a thermoelectric element according to an embodiment of the present invention.
Figure 7 shows a state in which a press unit presses a thermoelectric element according to an embodiment of the present invention.
Figure 8 shows a state in which a curing unit hardens a thermoelectric element according to an embodiment of the present invention.
Figure 9 shows a state in which a press unit presses a thermoelectric element according to another embodiment of the present invention.
Figure 10 shows a state in which a curing unit hardens a thermoelectric element according to another embodiment of the present invention.
Figure 11 shows a portion of a thermoelectric element manufactured according to an embodiment of the present invention.
12 and 13 show a state in which the second position alignment unit corrects the position of the pin array according to an embodiment of the present invention.
Figure 14 shows a method of manufacturing an energy conversion element according to an embodiment of the present invention.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all transformations, equivalents, and substitutes included in the spirit and technical scope of the present invention. In describing the present invention, the same identification numbers are used for the same components even if they are shown in different embodiments.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

In cases where an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

FIG. 1 shows a block diagram of an energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention, and FIG. 2 schematically shows an energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention. 3 and 4 show a substrate (S) according to an embodiment of the present invention, Figure 5 shows a pin array (A) according to an embodiment of the present invention, and Figure 6 shows a substrate (S) according to an embodiment of the present invention. Shows a thermoelectric element (T), Figure 7 shows a state in which the press unit 180 presses the thermoelectric element (T) according to an embodiment of the present invention, and Figure 8 shows a curing unit according to an embodiment of the present invention. (190) shows a state in which the thermoelectric element (T) is cured, Figure 9 shows a state in which the press unit 180 according to another embodiment of the present invention presses the thermoelectric element (T), and Figure 10 shows a state in which the thermoelectric element (T) is pressed. Shows a state in which the curing unit 190 according to another embodiment hardens the thermoelectric element (T), Figure 11 shows a part of the thermoelectric element (T) manufactured according to an embodiment of the present invention, Figures 12 and FIG. 13 shows a state in which the second position alignment unit 220 corrects the position of the pin array A according to an embodiment of the present invention.

The energy conversion element and its manufacturing apparatus according to the present invention relate to energy conversion elements having various types, shapes, and sizes, and are not limited to a specific type of energy conversion element. For example, the energy conversion device according to an embodiment of the present invention may include an energy harvesting device such as a piezoelectric device, a solar cell, etc. However, for convenience of explanation, the following description will focus on the thermoelectric element (T) among the energy conversion elements as an embodiment of the present invention.

Referring to Figures 1 to 13, the energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention can be used to manufacture a thermoelectric element (T). Here, the thermoelectric element (T) may be a finished thermoelectric element or a semi-finished product produced in the thermoelectric element manufacturing process. For example, a thermoelectric element (T) manufactured using the energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention may have a fin array (A) disposed on a substrate (S). More specifically, the thermoelectric element (T) may have a structure in which a fin array (A) is disposed on a lower substrate (S1) or an upper substrate (S2) as a substrate (S), and may also be referred to as a semi-finished thermoelectric element. Each manufactured thermoelectric element semi-finished product can be made into a completed thermoelectric element by having each fin array (A) connected to each other and conducting a post-process, and then additionally arranging a heat dissipation structure. Hereinafter, for convenience of explanation, the thermoelectric element (T) manufactured by the energy conversion element manufacturing apparatus (1) according to an embodiment of the present invention has a fin array (A) disposed on the substrate (S). The explanation is centered on .

In one embodiment, the energy conversion element manufacturing apparatus 1 receives a lower substrate (S1) as a substrate (S) to manufacture a thermoelectric element (T), and then receives an upper substrate (S2) as a substrate (S). Thermoelectric elements (T) can be manufactured.

Referring to FIG. 1, the energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention includes a substrate loading unit 110, a substrate transfer unit 120, an adhesive application unit 130, an inspection unit 140, and a pin array. The transfer unit 150, the pin array manufacturing unit 160, the first position alignment unit 170, the press unit 180, the pin array loading unit 200, the controller 210, and the second position alignment unit 220. It can be included.

First, the substrate S is input into the substrate loading unit 110. The substrate S is a metal plate disposed on the top or bottom of the thermoelectric element T, and may be made of copper in one embodiment. The substrate S may be a lower substrate S1 or an upper substrate S2. The lower substrate S1 and the upper substrate S2 may have different sizes or shapes. In one embodiment, the lower substrate S1 may have a larger size than the upper substrate S2.

The substrate loading unit 110 may be a magazine type in which a plurality of substrates S are loaded. The substrate S on which pretreatment, etc. has been completed, may be stacked in a plurality of layers on the substrate loading unit 110.

The substrate transfer unit 120 receives the substrate S from the substrate loading unit 110 and transfers it for the thermoelectric element manufacturing process. For example, as shown in FIG. 2, the substrate transfer unit 120 may be a conveyor. The substrate S input into the substrate transfer unit 120 moves in one direction and goes through a thermoelectric element manufacturing process. When the process is completed, it is taken out and moved to the next process.

In Figure 1, the substrate transfer unit 120 is shown as being disposed between the substrate loading unit 110 and the adhesive application unit 130. However, this is for convenience of explanation, and the substrate transfer unit 120 is an embodiment of the present invention. It may be arranged throughout the thermoelectric element manufacturing process according to the example.

In one embodiment, the substrate transfer unit 120 may include a transfer plate 121a. As shown in FIG. 3, the transfer plate 121a may include a plurality of seating grooves 123a on the upper surface of which the plurality of lower substrates S1 are seated. The substrate transfer unit 120 can transfer a plurality of lower substrates S1 while each is seated in the seating groove 123a through the transfer plate 121a.

Alternatively, the substrate transfer unit 120 may include a transfer plate 121b. As shown in FIG. 4, the transfer plate 121b may include a plurality of seating grooves 123b on its upper surface in which a plurality of upper substrates S2 are seated. The substrate transfer unit 120 can transfer a plurality of upper substrates S2 while each is seated in the seating groove 123b through the transfer plate 121b.

The adhesive applicator 130 is disposed on one side of the substrate transfer unit 120 and applies the adhesive G on the substrate S. For example, the adhesive applicator 130 may apply the adhesive G contained in a syringe to the upper surface of the substrate transfer unit 120 on which electrodes are patterned. Adhesive (G) is used to bond the pin array (A) to the substrate (S). In one embodiment, the adhesive (G) is a conductive adhesive and may include metal particles, more specifically, silver particles.

The inspection unit 140 may inspect the substrate S on which the adhesive G is applied to the upper surface by the adhesive applicator 130. The inspection unit 140 may inspect the state of the electrode of the substrate S, the state of application of the adhesive G, etc. For example, the inspection unit 140 measures the spacing between the substrates (S) placed on the transfer plate (121a), the electrode pattern of the substrate (S), and the application thickness of the adhesive (G), etc., and if it does not meet the standard, it is measured by a controller. It can be notified to the worker by sending it to (210).

The pin array transfer unit 150 receives and transfers the pin array A manufactured by the pin array manufacturing unit 160, which will be described later. The pin array transfer unit 150 is disposed on the other side of the substrate transfer unit 120 to place the pin array (A) at a preset position and couple the pin array (A) to the substrate (S).

The fin array (A) may include a plurality of fins (P) and a film (F) supporting them. For example, in the pin array (A), as shown in FIGS. 5 and 6, the pins (P) are arranged in a plurality of rows and columns, and a film (F) is disposed on the upper surface to support the pins (P). there is. In one embodiment, before being pressed by the press unit 180, which will be described later, the thickness of the adhesive G interposed between the substrate S and the pin P may be H.

In one embodiment, the pin array transfer unit 150 may include a first gantry 151, a first moving table 153, a first support head 155, and a support plate 157.

The first gantry 151 may be placed on one side of the substrate transfer unit 120. The first gantry 151 may have a bar shape extending across the substrate transfer unit 120 . For example, the first gantry 151 may extend in a direction in which the substrate transfer unit 120 extends or in a second direction that intersects (more specifically, intersects perpendicularly) the first direction, which is the transfer direction of the substrate S. .

The first moving stand 153 can be placed on one side of the first gantry 151 and moved. For example, as shown in FIG. 2, the first movable base 153 can move between both ends of the first gantry 151 in the longitudinal direction of the first gantry 151. The first moving table 153 moves near the pin array loading unit 200, supports the pin array (A), and then moves near the substrate (S) to combine the substrate (S) and the pin array (A). The process can be carried out.

The first support head 155 is disposed on one side of the first moving table 153 and supports the pin array (A). For example, as shown in FIG. 2, the first support head 155 may be disposed on the lower surface of the first movable base 153, and the support plate 157 may be disposed on the lower side. The first support head 155 may be rotatably connected to the first movable base 153. Accordingly, when the support plate 157 supports the pin array A or when the pin array A is placed on the substrate S, the position can be corrected by rotating the first support head 155.

The support plate 157 may be connected to the first support head 155. As shown in FIG. 2, the support plate 157 is a flat member disposed below the first support head 155 and supports the pin array A. For example, when supporting the pin array (A) manufactured in the pin array manufacturing unit 160, the support plate 157 supports the upper surface of the film (F) of the pin array (A) to maintain the pin array (A). It can be lifted. Additionally, the support plate 157 can be moved to the substrate (S) while lifting the pin array (A), thereby placing the pin array (A) on the substrate (S).

The method by which the support plate 157 supports the pin array (A) is not particularly limited. For example, the support plate 157 may mechanically support the pin array (A) using a clamp, or may support the pin array (A) using an electromagnet. In one embodiment, the support plate 157 may be provided with a plurality of suction holes connected to a negative pressure source. Through this, the support plate 157 can adsorb and support the pin array (A).

The pin array manufacturing unit 160 manufactures the pin array (A) by combining the pins (P) and the film (F). The pin array manufacturing unit 160 receives pins (P) and films (F) from outside and manufactures the pin array (A). For example, the pin (P) may be made of metal. In one embodiment, as shown in FIG. 5, the pins (P) may be respectively disposed in a plurality of seating grooves (g) of the jig (J). And the pin array manufacturing unit 160 can manufacture the pin array (A) by placing the film (F) on the jig (J). For example, the pin array manufacturing unit 160 may manufacture the pin array (A) by transferring the film (F) onto the jig (J) on which a plurality of pins (P) are arranged. This allows the pin array (A) to be manufactured quickly compared to manual or mounting methods.

The position alignment unit 170 checks the position of the pin array transfer unit 150 and corrects it when the pin array transfer unit 150 supports the pin array (A) or places the pin array (A) on the substrate (S). do. For example, as shown in FIG. 2, the position alignment unit 170 may be disposed on one side of the pin array transfer unit 150, and more specifically, on one side of the first moving base 153. In another embodiment, the position alignment unit 170 may be placed on a separate gantry and moving platform away from the pin array transfer unit 150.

In one embodiment, the position alignment unit 170 may include one or more sensors. The position alignment unit 170 may align the position of the pin array (A) using the one or more sensors. For example, the position alignment unit 170 corrects the position of the support plate 157 when supporting the pin array (A) with the support plate 157 using the one or more sensors, or adjusts the position of the pin array (A) to the substrate ( When placed on S), the position of the support plate 157 can be corrected.

In one embodiment, the position alignment unit 170 may include a first camera 171 and a second camera 173 as the one or more sensors. The first camera 171 and the second camera 173 may be disposed on one side and the other, respectively, with respect to the first support head 155.

For example, the first camera 171 confirms the position of the support plate 157 by taking images from below the support plate 157, and the second camera 173 detects the pin array (A) or the substrate (S). ), the position of the pin array (A) or the substrate (S) can be confirmed by taking an image from above toward downward.

The press unit 180 is disposed on one side of the substrate transfer unit 120, and when the pin array (A) is disposed on the substrate (S), the adhesive (G) between the substrate (S) and the pin (P) is The upper surface of the fin array (A) coupled to the substrate (S) is pressed so that the thickness is less than a preset thickness.

In one embodiment, the press unit 180 may include a second gantry 181, a second moving table 183, a second support head 185, a second support plate 187, and a pressure plate 189. there is.

The second gantry 181 may be placed on one side of the substrate transfer unit 120. The second gantry 181 may extend across the substrate transfer unit 120 . For example, the second gantry 181 may extend in a second direction that intersects (more specifically, perpendicularly intersects) the direction in which the substrate transfer unit 120 extends or the first direction, which is the transfer direction of the substrate S. .

The second mobile platform 183 can be placed on one side of the second gantry 181 and move. For example, as shown in FIG. 2, the second movable base 183 can move between both ends of the second gantry 181 in the longitudinal direction of the second gantry 181. The second moving table 183 supports the pressing plate 189 and then moves near the substrate S to place the pressing plate 189 on the pin array A.

The second support head 185 is disposed on one side of the second moving table 183 and supports the pressure plate 189. For example, as shown in FIGS. 2 and 12 , the second support head 185 may be disposed on the lower surface of the second movable base 183, and a pressure plate 189 may be disposed on the lower side. The second support head 185 may be rotatably connected to the second movable base 183. Accordingly, when the pressure plate 189 is placed on the substrate S, its position can be corrected.

The second support plate 187 may be connected to the second support head 185. As shown in FIGS. 2 and 12 , the second support plate 187 is a flat member disposed below the second support head 185 and supports the pressure plate 189. For example, the second support plate 187 may support the upper surface of the pressure plate 189 loaded on the loader (L). In addition, the second support plate 187 moves onto the substrate (S), more specifically, the thermoelectric element (T) on which the fin array (A) is disposed on the substrate (S) while lifting the fin array (A). , the pressure plate 189 can be placed on the pin array (A).

The method by which the second support plate 187 supports the pin array (A) is not particularly limited. For example, the second support plate 187 may mechanically support the pressure plate 189 using a clamp, or may support the pressure plate 189 using an electromagnet. In one embodiment, the second support plate 187 may be provided with a plurality of suction holes connected to a negative pressure source. Through this, the second support plate 187 can adsorb and support the pressure plate 189.

The pressure plate 189 is a flat member and directly presses the pin array A. For example, as shown in FIG. 7, when the pin array A is disposed on the substrate S, the pressure plate 189 presses the upper surface of the pin array A. Accordingly, the thickness of the adhesive (G) disposed between the substrate (S) and the pin (P) becomes less than a preset thickness, and the substrate (S) and the pin (P) are in good contact. For example, in a state pressed by the pressing plate 189, the thickness of the adhesive G may be the diameter of a metal particle, for example, a silver particle included in the adhesive G. Through this, the separation distance between the substrate S and the pins P can be minimized, thereby ensuring good electrical coupling between the substrate S and the pin array A.

In one embodiment, the pressure plate 189 does not temporarily pressurize the pin array (A), but continuously presses the pin array (A) even during the process of curing the thermoelectric element (T) in the curing unit 190, as will be described later. It can be pressurized. Accordingly, the curing process can be performed while maintaining the distance between the substrate S and the pin P to a minimum, and the distance between the substrate S and the pin P can be minimized even after curing is completed.

The curing unit 190 heats the substrate S and the pin array A coupled to the substrate S to cure the adhesive G. As shown in FIG. 2, the curing unit 190 may be disposed on one side of the substrate transfer unit 120, more specifically, at the rear of the press unit 180. The curing unit 190 can cure the adhesive G by heating the thermoelectric element T in a state pressed by the pressure plate 189.

In one embodiment, the thermoelectric element T may be introduced into the curing unit 190 by the press unit 180 while the thickness of the adhesive G is maintained below a preset level. For example, as shown in FIG. 8, the thermoelectric element T is pressed by the pressure plate 189 of the press unit 180, and may be introduced into the curing unit 190 in this state. In addition, even when introduced into the curing unit 190, the thermoelectric element (T) is pressed by the pressure plate 189, so that the thickness of the adhesive (G) can be maintained below a preset thickness. The adhesive (G) may be exported from the curing unit 190 in a cured form (G').

In one embodiment, the hardening unit 190 may be a reflow type. For example, as shown in FIG. 8, it may be provided with an internal space 191 and may be provided with an inlet and an outlet through which the substrate S and the pin array A are introduced and exported through the substrate transfer unit 120. The internal space of the hardening unit 190 can be maintained at a predetermined temperature. The thermoelectric element (T) is introduced into the curing unit 190 through the substrate transfer unit 120 and heated, and thus the adhesive G may be exported in a cured state.

In one embodiment, the hardening unit 190 may further include a thermal insulation member 193. As shown in FIG. 8, the thermal insulation member 193 is heated to a predetermined temperature and may be disposed at the bottom of the cured portion 190 so as to contact the lower surface of the substrate S. The thermoelectric element (T) introduced into the curing unit 190 through the substrate transfer unit 120 is seated on the thermal insulation member 193 disposed on the bottom of the curing unit 190. Here, the thermal insulation member 193 can rotate infinitely by a conveyor or track disposed within the hardening unit 190. Accordingly, the curing quality of the adhesive (G) can be improved by uniformly transferring heat to the thermoelectric element (T), more specifically, to the lower surface of the substrate (S).

In one embodiment, the thermal insulation member 193 may be a metal mesh heated to the temperature of the internal space 191 of the hardening unit 190 or higher.

In one embodiment, the energy conversion element manufacturing apparatus 1 may further include a backup plate 230.

As shown in FIG. 7 , the backup plate 230 may be disposed on one side of the substrate transfer unit 120 . More specifically, the backup plate 230 may be disposed below the transfer plate 121 on which the substrate S transferred by the substrate transfer unit 120 is placed.

The backup plate 230 may rise upward to support the pressure of the pressure plate 189 when the pressure plate 189 presses the thermoelectric element T. As the backup plate 230 rises, the substrate transfer unit 120 is prevented from descending due to the load of the pressure plate 189, and the thermoelectric element T can be pressed more strongly.

In another embodiment, the press unit 180A may include a base plate 182A, a clamping member 184A, and a pressing plate 189A.

As shown in Figure 9, a plurality of thermoelectric elements (T) in which the substrate (S) and the fin array (A) are combined may be stacked in the height direction. And the base plate 182A may be a flat member that supports the lower surface of the substrate S of the thermoelectric element T located at the bottom. The pressure plate 189A is arranged to be spaced apart from the base plate 182A in the height direction, forming a space between the base plate 182A and the base plate 182A where a plurality of thermoelectric elements T are disposed. The pressure plate 189A can pressurize the upper surface of the thermoelectric element T located at the top among the plurality of thermoelectric elements T, that is, the fin array A.

The clamping member 184A is disposed between the base plate 182A and the pressure plate 189A and fixes the base plate 182A and the pressure plate 189A. For example, the clamping member 184A may be a bolt that penetrates the base plate 182A and the pressure plate 189A and a nut that secures it. In addition, the clamping member 184A may be a variety of mechanical fixing means for fixing the positions of the base plate 182A and the pressure plate 189A.

Through this configuration, the press unit 180A can press a plurality of thermoelectric elements T at once with the base plate 182A and the pressure plate 189A, thereby reducing the time required for the press process. Here, the press unit 180A may be placed at the rear of the process of placing the pin array A on the substrate S, and each thermoelectric element T is loaded on the press unit 180A through a separate transfer member. can do. First, a plurality of thermoelectric elements (T) are stacked on the base plate (182A), then a pressure plate (189A) is placed on the uppermost thermoelectric element (T), and the base plate (182A) is clamped with the clamping member (184A). The pressure plate 189A can be fixed.

Likewise, the press unit 180A can compress the adhesive G of the thermoelectric element T to a predetermined thickness or less, thereby minimizing the distance between the pin P and the substrate S. For example, the distance between the pin (P) and the substrate (S) can be determined by the diameter of the metal (eg, silver) particles contained in the adhesive (G).

In another embodiment, the curing unit 190A may be an oven type having an internal space for accommodating a press unit 180A in which a plurality of thermoelectric elements T are stacked. For example, as shown in FIG. 10, the curing unit 190A accommodates the press unit 180A itself, in which a plurality of thermoelectric elements T are stacked. Additionally, the curing unit 190A may cure the adhesive G by heating the plurality of thermoelectric elements T in a pressurized state for a predetermined period of time.

In this way, when the thermoelectric element T that has gone through the pressing and curing processes by the pressing units 180 and 180A and the curing units 190 and 190A is enlarged, it may have a shape as shown in FIG. 11. That is, the thermoelectric element (T) has a cured adhesive (G') disposed on the substrate (S), a pin (P) and a film (F) are disposed in that order, and a pressure plate (189) is placed on the film (F). It is placed.

Additionally, the separation distance between the upper surface of the substrate S and the pin P may be less than a predetermined distance. More specifically, the cured adhesive (G') may have a thickness h that is smaller than the initial thickness H. Additionally, the cured adhesive (G') has metal particles (M) inside, and the separation distance between the upper surface of the substrate (S) and the pin (P) may be the diameter (D) of the metal particles (M).

That is, the energy conversion element manufacturing apparatus 1 according to an embodiment of the present invention can minimize the separation distance between the substrate S and the pin P by pressing the thermoelectric element T through the press units 180 and 180A. You can. Accordingly, by ensuring good electrical contact between the substrate S and the pin P, the efficiency of the thermoelectric element T can be increased.

The pin array loading unit 200 loads the pin array A manufactured by the pin array manufacturing unit 160. For example, the pin array loading unit 200 may be a magazine type in which a plurality of pin arrays A are stacked in a plurality of layers. The pin array transfer unit 150 may receive each pin array (A) loaded on the pin array loading unit 200 and transfer it onto the substrate (S).

The controller 210 may communicate wired or wirelessly with other components of the energy conversion element manufacturing apparatus 1 or external devices. The controller 210 may control other configurations of the energy conversion element manufacturing apparatus 1 based on preset conditions or programs or external inputs. For example, the controller 210 controls the speed at which the substrate transfer unit 120 transfers the substrate S, the application amount and application speed of the adhesive applicator 130, the pin array transfer unit 150, and the first position alignment unit 170. and the operation of the second position alignment unit 220, etc. can be controlled.

The second position alignment unit 220 is a second support plate when the press unit 180 supports the pressure plate 189 in the loader (L) or places the pressure plate 189 on the thermoelectric element (T). (187) Or check the positions of the pressure plate (189) and the thermoelectric element (T) and correct them. For example, as shown in FIG. 12, the second support plate 187 of the press unit 180 supports the pressure plate 189 and moves the thermoelectric element T according to the movement of the second moving table 183. Move to the top. And the second position alignment unit 220 includes one or more sensors, wherein the one or more sensors confirm the positions of the second support plate 187 or the pressure plate 189 and the thermoelectric element (T), and the second position alignment unit 220 The position of the pressure plate 189 can be corrected by moving the support plate 187.

More specifically, as shown in FIGS. 2 and 12 , the second position alignment unit 220 may include a third camera 221 and a fourth camera 223 as one or more sensors. The third camera 221 may capture images of the second support plate 187 or the pressure plate 189 from below the pressure plate 189. For example, the third camera 221 may check the position of one or more corners among a plurality of corners of the second support plate 187 or the pressure plate 189. In one embodiment, as shown in FIG. 13, the third camera 221 can confirm the positions of the corner portions E1 and E2 of the second support plate 187. Alternatively, the third camera 221 may check the position of the corner portion of the pressure plate 189.

And the fourth camera 223 can capture an image of the thermoelectric element (T) from above. For example, the fourth camera 223 may check the location of one or more corners among a plurality of corners of the thermoelectric element T. In one embodiment, as shown in FIG. 13, the fourth camera 223 can check the location of the thermoelectric element T, and more specifically, the corner portions E3 and E4 of the fin array A.

Here, the corner portions E1 and E2 and the corner portions E3 and E4 may be disposed at positions corresponding to each other. Also, the meaning of “corresponding” does not mean that the corner parts must have the same coordinates on the plane, and each corner part is based on the second support plate 187 or the pressure plate 189 to support the pin array (A). This may mean that it corresponds to the set coordinate value.

The second support plate 187 or pressure plate 189 and the pin array (A) are rotated at a predetermined angle to each other. As the second support plate 187 or the pressure plate 189 is distorted or displaced in the horizontal direction from the pin array (A), the corner portions (E1, E2) and the corner portions (E3, E4) identified in the captured image ) lines may not match each other. In this case, the second position alignment unit 220 rotates the second support head 185 to match the lines. Additionally, the second position alignment unit 220 moves the second moving table 183 to match the lines. When the operation of the second moving table 183 and the second support head 185 is completed, the second position alignment unit 170 is again connected to the second support plate 187 or the pressure plate 189 and the pin array (A). The lines are checked, and if they match, the second support head 225 descends so that the second support plate 227 presses the upper surface of the pin array (A).

In one embodiment, the second position alignment unit 220 uses the one or more sensors to identify the press unit 180, more specifically the second support plate 187, when the press unit 180 receives the pressure plate 189. ) by comparing the initial position of the pressing plate 189 with the later position of the press unit 180, more specifically the second support plate 187, confirmed by the one or more sensors when placing the pressure plate 189 on the pin array (A) , the position of the pressure plate 189 supported by the press unit 180 can be aligned. Here, the one or more sensors may be the third camera 221 or the fourth camera 223.

In FIG. 12, the second support plate 187 is shown to have the same area as the pressure plate 189, but the present invention is not limited thereto. Preferably, the second support plate 187 may have a larger area than the pressure plate 189.

Figure 14 shows a method of manufacturing an energy conversion element according to an embodiment of the present invention.

The method of manufacturing an energy conversion device according to an embodiment of the present invention includes the steps of transferring a substrate (S), applying an adhesive (G) on the substrate (S), and combining the substrate (S) and the pin array (A). It may include the step of pressing the pin array (A).

First, the substrate S that has completed pretreatment, etc. is loaded on the substrate loading unit 110, and the substrate transfer unit 120 transfers the substrate S loaded on the substrate loading unit 110. In one embodiment, the substrate transfer unit 120 may transfer the lower substrate S1 or the upper substrate S2 while seating it in the seating grooves 123a and 123b of the transfer plates 121a and 121b.

Next, the adhesive applicator 130 applies the adhesive (G) on the substrate (S). The substrate S may enter the adhesive applicator 130 through the substrate transfer unit 120 and then be taken out of the adhesive applicator 130 through the substrate transfer unit 120 . In one embodiment, the adhesive applicator 130 may apply the adhesive G on the plurality of substrates S on the transfer plate 121.

In one embodiment, after applying the adhesive G on the substrate S, the inspection unit 140 may further include inspecting the substrate S.

Next, the pin array transfer unit 150 receives the pin array (A) and places it on the substrate (S) on which the adhesive (G) is applied. The pin array transfer unit 150 supports the pin array A loaded on the pin array loading unit 200 and then moves onto the substrate S. Here, the pin array A may be manufactured by the pin array manufacturing unit 160 and loaded on the pin array loading unit 200. For example, the pin array manufacturing unit 160 can manufacture the pin array (A) by placing the pin (P) in the seating groove (g) of the jig (J) and transferring the film (F) to the upper surface. And the step of loading the manufactured pin array (A) into the pin array loading unit 200 may be further included. Additionally, the pin array transfer unit 150 may receive the pin array (A) loaded on the pin array loading unit 200 and transfer it.

In one embodiment, when the pin array transfer unit 150 receives the pin array A, a step of confirming the position of the pin array transfer unit 150 may be further included.

For example, the position alignment unit 170 uses the first camera 171 and the second camera 173 as one or more sensors, and when the pin array transfer unit 150 receives the pin array (A), the pin array transfer unit 170 uses the first camera 171 and the second camera 173 as one or more sensors. Check the position of 150 and correct the position of the pin array (A) based on this. When position correction is completed, the pin array transfer unit 150 transfers the pin array (A) onto the substrate (S).

Next, the press unit 180 presses the substrate S and the pin array A, that is, the thermoelectric element T. For example, the press unit 180 may place the second support plate 187 on the pin array A while supporting the pressure plate 189. The pressure plate 189 may press the pin array (A) so that the thickness of the adhesive (G) applied on the substrate (S) is less than or equal to a preset thickness. For example, the pressure plate 189 may maintain the thickness of the adhesive G to maintain the diameter of the metal particles M included in the adhesive G.

In one embodiment, the pressurizing step may transfer the thermoelectric element T to the substrate transfer unit 120 while maintaining the thermoelectric element T in a pressurized state with the press unit 180, that is, the pressure plate 189. . For example, even in the curing process described later, the pressure plate 189 can maintain the state of pressing the thermoelectric element T.

In one embodiment, a step of correcting the position of the press unit 180 may be further included before the pressing step. For example, when the press unit 180 supports the pressure plate 189 mounted on the loader L, the second position alignment unit 220 may correct the position of the press unit 180. More specifically, the second position alignment unit 220 includes one or more sensors, wherein the one or more sensors confirm the position of the press unit 180, more specifically the second support plate 187, and also determine the position of the pressing plate ( 189) Check the location. For example, the third camera 221 and the fourth camera 223 as one or more sensors may check the positions of the second support plate 187 and the pressure plate 189, respectively. And based on this, the second moving table 183 and/or the second support head 185 are moved to correct the position of the second support plate 187 and then the pressure plate 189 is supported.

Additionally, the second position alignment unit 220 may correct the position of the pressure plate 189 when the pressure plate 189 is placed on the thermoelectric element T. For example, the third camera 221 may check the positions of one or more corner portions E1 and E2 of the second support plate 187 below the second support plate 187. The fourth camera 223 can check the positions of one or more corner portions (E3, E4) of the thermoelectric element (T) from above the thermoelectric element (T). And based on this, the position of the pressure plate 189 is corrected by moving the second moving table 183 and/or the second support head 185, and then the pressure plate 189 is placed on the thermoelectric element (T). You can.

Next, the curing unit 190 heats the thermoelectric element T in a state pressed by the press unit 180 to cure the adhesive G. For example, the curing unit 190 may be a reflow type having an inlet and an outlet so that the thermoelectric element T transported by the substrate transfer unit 120 can enter and exit. Additionally, the internal space 191 of the curing unit 190 may be maintained at a predetermined temperature to cure the adhesive G.

In one embodiment, the curing step may harden the thermoelectric element (T) in a pressurized state by the press unit 180.

In one embodiment, in the curing step, the heat insulating member 193 may be placed under the thermoelectric element T in a state pressed by the press unit 180, that is, on the lower surface of the substrate S.

In another embodiment, the pressing step may use the press unit 180A. For example, after combining the substrate S and the fin array A to form a thermoelectric element T, a plurality of thermoelectric elements T may be stacked on the base plate 182A. Next, a pressure plate (189A) can be placed on the uppermost thermoelectric element (T), and the base plate (182A) and the pressure plate (189A) can be fixed with a clamping member (184A). Through this, the press unit 180A can maintain the thickness of the adhesive G below a preset thickness, for example, the diameter of the metal particles M included in the adhesive G.

In another embodiment, the curing step may use the curing unit 190A. For example, the press unit 180A that pressurizes the plurality of thermoelectric elements T may itself enter the oven-type curing unit 190A. The curing unit 190A may heat the entire press unit 180A to a predetermined temperature for curing the adhesive G. When curing is completed, the thermoelectric element (T) can be taken out from the press unit 180A or the press unit 180A taken out of the curing unit 190A and transferred to the next process.

The energy conversion device manufacturing apparatus (1) and the energy conversion device manufacturing method according to an embodiment of the present invention minimize the thickness of the adhesive (G) included in the thermoelectric element (T), thereby forming the substrate (S) and the pin (P). By minimizing the separation distance, the efficiency of the thermoelectric element (T) can be increased.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely examples. Those skilled in the art can fully understand that various modifications and equivalent other embodiments are possible from the embodiments. Therefore, the true technical protection scope of the present invention should be determined based on the attached claims.

The specific technical content described in the embodiment is an example and does not limit the technical scope of the embodiment. In order to describe the invention concisely and clearly, descriptions of conventional general techniques and configurations may be omitted. In addition, the connection of lines or the absence of connections between components shown in the drawings exemplify functional connections and/or physical or circuit connections, and in actual devices, various functional connections or physical connections may be replaced or added. It can be expressed as connections, or circuit connections. Additionally, if there is no specific mention such as “essential,” “important,” etc., it may not be a necessary component for the application of the present invention.

“The” or similar designators used in the description and claims may refer to both the singular and the plural, unless otherwise specified. In addition, when a range is described in an example, the invention includes the application of individual values within the range (unless there is a statement to the contrary), and each individual value constituting the range is described in the description of the invention. same. Additionally, unless the order of the steps constituting the method according to the embodiment is clearly stated or there is no description to the contrary, the steps may be performed in an appropriate order. The embodiments are not necessarily limited by the order of description of the steps above. The use of any examples or illustrative terms (e.g., etc.) in the embodiments is merely to describe the embodiments in detail, and unless limited by the claims, the examples or illustrative terms do not limit the scope of the embodiments. That is not the case. Additionally, those skilled in the art will appreciate that various modifications, combinations and changes may be made according to design conditions and factors within the scope of the appended claims or their equivalents.

1: Energy conversion element manufacturing device
110: substrate loading unit
120: Adhesive application part
140: Inspection department
150: Pin array transfer unit
160: Pin array manufacturing department
170: first position alignment unit
180: Press department
190: Hardening department
200: pin array loading unit
210: controller
220: second position alignment unit

Claims (20)

A substrate transfer unit that transfers a substrate;
an adhesive applicator disposed on one side of the substrate transfer unit to apply adhesive on the substrate;
It is placed on the other side of the substrate transfer unit and receives a pin array including a plurality of pins and a film, the pin array is placed on the substrate to which adhesive is applied, and the pin array is transferred onto the substrate to form the substrate and the substrate. a pin array transfer unit combining the pin arrays; and
It includes a press unit that presses the upper surface of the pin array coupled to the substrate so that the thickness of the adhesive is less than a preset thickness,
The plurality of pins are arranged in a plurality of rows and columns on one of the films,
The pin array transfer unit moves toward the substrate while supporting the upper surface of the film and transfers the plurality of pins together on the substrate,
The press unit presses the upper surface of the film included in the fin array so that the thickness of the adhesive maintains the thickness of the diameter of the metal particle included in the adhesive. According to claim 1,
Further comprising a curing unit that cures the adhesive by heating the substrate and the pin array coupled to the substrate,
The press unit flows into the curing unit while maintaining the thickness of the adhesive below a preset thickness. According to claim 1,
The press unit includes a press plate disposed on an upper surface of the pin array and transferred by the substrate transfer unit together with the substrate and the pin array. According to clause 2,
The curing unit is a reflow type in which a portion of the substrate transfer unit is disposed therein and heats the substrate and the pin array transferred by the substrate transfer unit to a predetermined temperature to cure the adhesive. According to clause 4,
The curing part is heated to a predetermined temperature and includes a heat insulating member in contact with the lower surface of the substrate. According to claim 1,
The press section
a base plate supporting the substrate;
a pressure plate that presses the upper surface of the pin array coupled to the substrate; and
An energy conversion element manufacturing apparatus comprising: a clamping member connecting the base plate and the pressure plate. According to clause 6,
An energy conversion element manufacturing apparatus, wherein a plurality of the substrate and the fin array coupled to each other between the base plate and the pressure plate are stacked to form a laminate. According to clause 7,
The clamping member fixes the base plate and the pressure plate and presses the laminate to a predetermined pressure. According to clause 2,
The curing unit has an internal space in which the substrate and the pin array are accommodated while being pressed by the press unit, and the substrate and the pin array are maintained for a predetermined time while maintaining the internal space at a predetermined temperature. An energy conversion element manufacturing device that is an oven type that accommodates and hardens the adhesive. delete A substrate transfer unit receiving and transferring a substrate;
applying an adhesive to the substrate by an adhesive applicator;
A pin array transfer unit receives a pin array including a plurality of pins and a film, places the pin array on the substrate coated with adhesive, and transfers the pin array onto the substrate to connect the substrate and the pin array. combining; and
A press unit pressing the upper surface of the pin array coupled to the substrate so that the thickness of the adhesive is less than or equal to a preset thickness,
The plurality of pins are arranged in a plurality of rows and columns on one of the films,
The pin array transfer unit moves toward the substrate while supporting the upper surface of the film and transfers the plurality of pins together on the substrate,
The pressing step is to press the upper surface of the film included in the fin array so that the thickness of the adhesive maintains the thickness of the diameter of the metal particles included in the adhesive. According to claim 11,
A curing unit further includes curing the adhesive by heating the substrate and the pin array coupled to the substrate,
The pressing step is a method of manufacturing an energy conversion element in which the adhesive is introduced into the cured portion while maintaining the thickness of the adhesive below a preset thickness. According to claim 11,
The pressing step is a method of manufacturing an energy conversion element in which the press unit is placed on the upper surface of the pin array and transferred to the substrate transfer unit along with the substrate and the pin array. According to claim 12,
The curing step includes curing the adhesive by heating the substrate and the pin array transported by the substrate transfer unit to a predetermined temperature in the curing unit in which a portion of the substrate transfer unit is disposed, manufacturing an energy conversion element. method. According to claim 14,
The curing step is a method of manufacturing an energy conversion element, wherein the thermal insulation member disposed inside the hardening unit is heated to a predetermined temperature and the thermal insulation member is brought into contact with the lower surface of the substrate. According to claim 11,
The pressing step includes placing a substrate on the base plate of the press unit, pressing the upper surface of the pin array coupled to the substrate with a pressure plate, and connecting the base plate and the pressure plate with a clamping member. Conversion element manufacturing method. According to claim 16,
The pressing step is a method of manufacturing an energy conversion element, wherein a laminate is formed by stacking a plurality of the substrate and the pin array coupled to each other between the base plate and the pressing plate. According to claim 12,
The curing step includes, in the curing unit having an internal space in which the substrate and the pin array are received while being pressed by the press unit, the substrate and the pin array while maintaining the internal space at a predetermined temperature. A method of manufacturing an energy conversion element, wherein the adhesive is cured by receiving a pin array for a predetermined period of time. delete An energy conversion element manufactured by the energy conversion element manufacturing method according to any one of claims 11 to 18,
The energy conversion element includes a substrate that is a metal plate, an adhesive applied on the substrate, and a fin array including a plurality of pins disposed on the adhesive and a film supporting the plurality of fins,
The energy conversion element wherein the distance between the upper surface of the substrate and the pin is the diameter of the metal particles included in the adhesive.

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