KR102597382B1 - Substrate processing apparatus - Google Patents

Abstract

[Problem] The purpose is to provide a substrate processing device that can properly exhaust gas from the processing housing.
[Solution] The substrate processing apparatus 1 includes a processing housing 23A1, a holding portion 31, and a liquid supply portion 33. The holding portion 31 is accommodated in the processing housing 23A1. The holding portion 31 holds the substrate W. The liquid supply unit 33 is accommodated in the processing housing 23A1. The liquid supply unit 33 supplies processing liquid to the substrate W held by the holding unit 31 . The substrate processing apparatus 1 is provided with exhaust pipes 41A and 42A. The exhaust pipes 41A and 42A are respectively disposed on the side of the processing housing 23A1. Exhaust pipes 41A and 42A each exhaust gas. The substrate processing apparatus 1 is provided with a switching mechanism 51A1. The switching mechanism 51A1 is disposed at the same height as the processing housing 23A1. The switching mechanism 51A1 switches the exhaust path of the processing housing 23A1 to one of the exhaust pipes 41A and 42A.

Description

Substrate processing apparatus {SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a substrate processing apparatus that processes a substrate. Substrates include, for example, semiconductor wafers, liquid crystal display substrates, organic EL (electroluminescence) substrates, FPD (Flat Panel Display) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, and magneto-optical disk substrates. These are substrates, photomask substrates, and solar cell substrates.

Japanese Patent Publication No. 2019-16818 discloses a substrate processing system. Hereinafter, symbols described in Japanese Patent Laid-Open No. 2019-16818 are indicated in parentheses. The substrate processing system 1 includes a processing unit 16 that processes a wafer W. The processing unit 16 includes a chamber 20, a substrate holding mechanism 30, and a processing fluid supply unit 40. Chamber 20 is a processing housing. The substrate holding mechanism 30 and the processing fluid supply unit 40 are installed inside the chamber 20 . The substrate holding mechanism 30 holds the wafer W. The processing fluid supply unit 40 supplies processing fluid to the wafer W held in the substrate holding mechanism 30 . Treatment fluids include, for example, an alkaline treatment liquid, an acidic treatment liquid, and an organic treatment liquid.

The substrate processing system 1 includes a second exhaust pipe 200, an exhaust switching unit 300, and three individual exhaust pipes 101, 102, and 103. The second exhaust pipe 200 connects the chamber 20 and the exhaust switching unit 300. The second exhaust pipe 200 has a horizontal portion 201 and a rising portion 202. The horizontal portion 201 is connected to the chamber 20. The horizontal portion 201 extends horizontally from the chamber 20. The raised portion 202 extends upward from the horizontal portion 201. The rising portion 202 has an upper end. The upper end of the rising portion 202 is connected to the exhaust switching unit 300. The exhaust switching unit 300 also connects to three individual exhaust pipes 101, 102, and 103. The exhaust switching unit 300 communicates the second exhaust pipe 200 with one of the three individual exhaust pipes 101, 102, and 103. The gas in the chamber 20 flows into one of the three individual exhaust pipes 101, 102, and 103 through the second exhaust pipe 200.

For example, when the processing fluid supply unit 40 supplies alkaline processing liquid, the exhaust switching unit 300 communicates the second exhaust pipe 200 with the individual exhaust pipe 101. When the treatment fluid supply unit 40 supplies the acidic treatment liquid, the exhaust switching unit 300 communicates the second exhaust pipe 200 with the individual exhaust pipe 102. When the processing fluid supply unit 40 supplies the organic processing liquid, the exhaust switching unit 300 communicates the second exhaust pipe 200 with the individual exhaust pipe 103. As a result of these, when the alkaline treatment liquid is used within the chamber 20, the individual exhaust pipe 101 exhausts the gas from the chamber 20. When the acid treatment liquid is used within the chamber 20, a separate exhaust pipe 102 exhausts the gas from the chamber 20. When the organic treatment liquid is used within the chamber 20, a separate exhaust pipe 103 exhausts the gas from the chamber 20.

The exhaust conversion unit 300 is disposed at a higher position than the treatment unit 16. The rise 202 of the second exhaust pipe 200 extends to a position higher than the processing unit 16. For this reason, it is difficult for the mist contained in the gas to ascend the rising portion 202. It is difficult for the mist to rise up to the exhaust switching unit 300. Accordingly, the exhaust switching unit 300 can be protected from mist.

As mentioned above, the exhaust conversion unit 300 is located at a higher position than the treatment unit 16. For this reason, the individual exhaust pipes 101, 102, 103 are also placed at a higher position than the processing unit 16.

However, the coating and developing device 1 shown in Japanese Patent Laid-Open No. 2019-16818 has the following problems. The chamber 20 and the exhaust switching unit 300 are connected by a second exhaust pipe 200. Since the exhaust conversion unit 300 is located at a higher position than the processing unit 16, the second exhaust pipe 200 has a riser 202. For this reason, the second exhaust pipe 200 is relatively long.

The gas in the chamber 20 necessarily flows through the second exhaust pipe 200. For example, no matter which of the alkaline treatment liquid, acidic treatment liquid, and organic treatment liquid is used in the chamber 20, the second exhaust pipe 200 exhausts the gas in the chamber 20.

In this way, the second exhaust pipe 200 is relatively long and discharges various gases, so the second exhaust pipe 200 is prone to contamination. For example, crystals (salt) are likely to occur inside the second exhaust pipe 200. For example, crystals are likely to accumulate inside the second exhaust pipe 200.

If the second exhaust pipe 200 is dirty, gas does not flow smoothly through the second exhaust pipe 200. That is, the second exhaust pipe 200 cannot smoothly discharge the gas in the chamber 20. For this reason, it is necessary to regularly perform maintenance on the second exhaust pipe 200. Maintenance of the second exhaust pipe 200 includes, for example, cleaning the second exhaust pipe 200 or replacing the second exhaust pipe 200 .

When performing maintenance on the second exhaust pipe 200, the processing unit 16 cannot process the wafer W. When performing maintenance on the second exhaust pipe 200, the substrate processing system 1 stops processing the wafer W. For this reason, the throughput of the substrate processing system 1 decreases.

The present invention has been made in consideration of such circumstances, and its purpose is to provide a substrate processing apparatus capable of appropriately exhausting gas from a processing housing.

In order to achieve this object, the present invention adopts the following configuration. That is, the present invention is a substrate processing apparatus, comprising a first processing housing, a first holding portion installed inside the first processing housing and holding a substrate, and installed inside the first processing housing, a first liquid supply unit that supplies processing liquid to the substrate held in the first holding unit, a first exhaust pipe installed on a side of the first processing housing and discharging gas, and a first exhaust pipe installed on the side of the first processing housing; , a second exhaust pipe for discharging gas, and a first switching mechanism disposed at the same height as the first processing housing and switching the exhaust path of the first processing housing to one of the first exhaust pipe and the second exhaust pipe. It is a substrate processing device provided.

A substrate processing apparatus includes a first processing housing, a first holding portion, and a first liquid supply portion. The substrate processing apparatus supplies a processing liquid to the substrate inside the first processing housing. That is, the substrate processing apparatus performs liquid processing on the substrate inside the first processing housing.

The substrate processing apparatus includes a first exhaust pipe, a second exhaust pipe, and a first switching mechanism. The first switching mechanism switches the exhaust path of the first processing housing to one of the first exhaust pipe and the second exhaust pipe. Specifically, the first switching mechanism causes the first processing housing to communicate with the first exhaust pipe, and the first processing housing is blocked from the second exhaust pipe, and the first processing housing communicates with the second exhaust pipe, Additionally, the first processing housing is switched to a state blocked from the first exhaust pipe. When the exhaust path of the first processing housing is the first exhaust pipe, the first exhaust pipe exhausts gas from the first processing housing, and the second exhaust pipe does not exhaust gas from the first processing housing. When the exhaust path of the first processing housing is the second exhaust pipe, the second exhaust pipe exhausts gas from the first processing housing, and the second exhaust pipe does not exhaust gas from the first processing housing.

The first switching mechanism is disposed at the same height as the first processing housing. For this reason, the flow path between the first processing housing and the first switching mechanism can be appropriately shortened. Therefore, contamination of the flow path between the first processing housing and the first switching mechanism can be appropriately suppressed. Accordingly, gas flows smoothly from the first processing housing to the first diversion mechanism. As a result, the gas in the first processing housing can be properly exhausted.

The first exhaust pipe is disposed on the side of the first processing housing. For this reason, the first switching mechanism can be easily connected to the first exhaust pipe. The second exhaust pipe is disposed on the side of the first processing housing. For this reason, the first switching mechanism can be easily connected to the second exhaust pipe.

As described above, the present substrate processing apparatus can properly exhaust gas from the first processing housing.

In the above-mentioned substrate processing apparatus, the first switching mechanism is preferably disposed at a position equal to or lower than the upper end of the first holding portion. The size of the first switching mechanism is relatively small. Therefore, the enlargement of the substrate processing apparatus can be appropriately suppressed.

In the substrate processing apparatus described above, the first switching mechanism is preferably disposed at a position that does not overlap the first holding portion when viewed from the top. Interference between the first switching mechanism and the first holding portion can be easily avoided.

In the substrate processing apparatus described above, the first exhaust pipe preferably extends in the vertical direction, and the second exhaust pipe preferably extends in the vertical direction. The installation space of the first exhaust pipe and the second exhaust pipe when viewed from the top can be suitably small.

In the substrate processing apparatus described above, the substrate processing apparatus extends in a horizontal first direction, includes a transfer space adjacent to the first processing housing, is installed in the transfer space, and transfers the substrate to the first holding unit. a transfer mechanism, and a first piping space adjacent to the first processing housing and accommodating the first exhaust pipe and the second exhaust pipe, wherein the first processing housing and the first piping space include the first It is preferable that the first exhaust pipe and the second exhaust pipe are aligned in a second direction perpendicular to the first direction and horizontal. The substrate processing apparatus is provided with a transfer space and a transfer mechanism. The transfer space is adjacent to the first processing housing. For this reason, the transport mechanism can easily transport the substrate to the first holding part. The substrate processing apparatus has a first piping space. Therefore, the first exhaust pipe and the second exhaust pipe can be appropriately installed. The first piping space is adjacent to the first processing housing. For this reason, the first exhaust pipe and the second exhaust pipe can be installed near the first processing housing. The conveyance space extends in the first direction. The first processing housing and the first piping space are aligned in the first direction. For this reason, the transfer space adjacent to the first processing housing and the first piping space adjacent to the first processing housing can each be appropriately arranged. Therefore, it is possible to appropriately prevent the conveyance mechanism from interfering with the first exhaust pipe and the second exhaust pipe. The first piping space and the first processing housing are aligned in the first direction. The first exhaust pipe and the second exhaust pipe are aligned in the second direction. For this reason, the first exhaust pipe and the second exhaust pipe can each be installed near the first processing housing.

In the above-mentioned substrate processing apparatus, it is preferable that at least a part of the first switching mechanism is installed in the first piping space. The first switching mechanism can be installed near the first processing housing.

In the above-mentioned substrate processing apparatus, the first switching mechanism is a first switch mechanism that can be moved between a position that communicates the first processing housing with the first exhaust pipe and a position that blocks the first processing housing from the first exhaust pipe. an opening and closing unit, and a second opening and closing unit that is movable, independently of the first opening and closing unit, to a position that communicates the first processing housing to the second exhaust pipe and a position that blocks the first processing housing from the second exhaust pipe. It is desirable to do so. The first opening and closing part and the second opening and closing part are movable independently of each other. For this reason, the first switching mechanism can individually communicate the first exhaust pipe and the second exhaust pipe to the first processing housing. The switching mechanism can separate the first exhaust pipe and the second exhaust pipe from the first processing housing.

In the above-described substrate processing apparatus, the first switching mechanism preferably includes a switching housing that is connected to the first processing housing and accommodates the first opening and closing portion and the second opening and closing portion. The switching housing can appropriately form a flow path from the first processing housing to the first opening and closing portion and the second opening and closing portion.

In the substrate processing apparatus described above, the switching housing includes an introduction portion connected to the first processing housing and extending in the first direction, a lead portion connected to the introduction portion and extending in the second direction, and the first exhaust pipe. and a distribution part connected to both of the second exhaust pipes and accommodating both the first opening and closing part and the second opening and closing part. The introduction portion is connected to the first processing housing. For this reason, gas can be easily introduced from the first processing housing to the conversion housing. The lead-in section extends in a first direction. As described above, the conveyance space extends in the first direction. For this reason, the transfer space adjacent to the first processing housing and the introduction portion connected to the first processing housing can each be appropriately arranged. Therefore, it is possible to appropriately prevent the conveyance mechanism from interfering with the introduction portion. The distribution section is connected to the introduction section. The distribution unit is connected to the first exhaust pipe and the second exhaust pipe. For this reason, gas can be easily discharged from the conversion housing to the first exhaust pipe and the second exhaust pipe. The distribution section accommodates both the first opening and closing section and the second opening and closing section. Therefore, the first switching mechanism can easily switch the exhaust path of the first processing housing between the first exhaust pipe and the second exhaust pipe. The distribution portion extends in the second direction. As described above, the first exhaust pipe and the second exhaust pipe are aligned in the second direction. Accordingly, the distribution unit can be easily connected to the first exhaust pipe and the second exhaust pipe.

In the substrate processing apparatus described above, it is preferable that the separation distance between the introduction part and the transfer space is smaller than the separation distance between the first holding unit and the transfer space when viewed from a plan view. The introduction part is disposed at a position relatively close to the conveyance space. Therefore, gas can be smoothly introduced from the first processing housing to the conversion housing.

In the above-mentioned substrate processing apparatus, the substrate processing apparatus is provided with a supply pipe for supplying gas to the first processing housing, and a second piping space adjacent to the first processing housing and accommodating the air supply pipe, It is preferable that the first piping space, the first processing housing, and the second piping space are lined up in this order in the first direction. The substrate processing apparatus is provided with an air supply pipe and a second piping space. The second piping space is adjacent to the first processing housing. Therefore, the air supply pipe can easily supply gas to the first processing housing. The first piping space, the first processing housing, and the second piping space are lined up in the first direction in this order. For this reason, the first piping space and the second piping space are spaced apart from each other by the first processing housing. Therefore, the arrangement of the first exhaust pipe and the second exhaust pipe is not limited by the air supply pipe. In other words, the degree of freedom in arranging the first exhaust pipe and the second exhaust pipe can be appropriately increased.

In the above-described substrate processing apparatus, the substrate processing apparatus includes: a second processing housing disposed below the first processing housing; a second holding portion installed inside the second processing housing and holding a substrate; , a second liquid supply unit installed inside the second processing housing and supplying a processing liquid to the substrate held by the second holding unit, disposed at the same height as the second processing housing, and performing the second processing. It is desirable to provide a second switching mechanism for switching the exhaust path of the housing to one of the first exhaust pipe and the second exhaust pipe.

The substrate processing apparatus includes a second processing housing, a second holding portion, and a second liquid supply portion. For this reason, liquid treatment can be performed on the substrate inside the second processing housing. Therefore, the throughput of the substrate processing device can be appropriately improved.

The second processing housing is disposed below the first processing housing. Therefore, an increase in the footprint of the substrate processing apparatus can be appropriately suppressed.

The substrate processing apparatus includes a second switching mechanism. The second switching mechanism switches the exhaust path of the second processing housing to one of the first exhaust pipe and the second exhaust pipe. Specifically, the second switching mechanism causes the second processing housing to communicate with the first exhaust pipe, and the second processing housing is blocked from the second exhaust pipe, and the second processing housing communicates with the second exhaust pipe, Additionally, the second processing housing is switched to a state blocked from the first exhaust pipe. When the exhaust path of the second processing housing is the first exhaust pipe, the first exhaust pipe exhausts gas from the second processing housing, and the second exhaust pipe does not exhaust gas from the second processing housing. When the exhaust path of the second processing housing is the second exhaust pipe, the second exhaust pipe exhausts gas from the second processing housing, and the first exhaust pipe does not exhaust gas from the second processing housing. Accordingly, the first exhaust pipe exhausts the gas of the second processing housing in addition to the gas of the first processing housing. The second exhaust pipe also exhausts gas from the second processing housing in addition to gas from the first processing housing. Therefore, the structure of the substrate processing device can be simplified.

The second switching mechanism is disposed at the same height as the second processing housing. For this reason, the flow path between the second processing housing and the second switching mechanism can be appropriately shortened. Therefore, contamination of the flow path between the second processing housing and the second switching mechanism can be appropriately suppressed. Accordingly, gas flows smoothly from the second processing housing to the second diversion mechanism. As a result, the gas in the second processing housing can be properly exhausted.

As described above, the present substrate processing apparatus can appropriately exhaust the gas from the second processing housing in addition to the gas from the first processing housing.

In the above-described substrate processing apparatus, the second processing housing is disposed at the same position as the first processing housing when viewed in plan, and the second switching mechanism includes the first switching mechanism and the first switching mechanism when viewed in plan. It is preferable that the first exhaust pipe extends in the vertical direction and the second exhaust pipe extends in the vertical direction. The second processing housing is disposed at the same position as the first processing housing when viewed from the top. The second switching mechanism is disposed at the same position as the first switching mechanism when viewed from the top. For this reason, the relative position of the second processing housing and the second switching mechanism is approximately the same as the relative position of the first processing housing and the first switching mechanism. Therefore, the conditions for discharging gas can be easily made the same between the first processing housing and the second processing housing. As a result, the quality of the processing performed on the substrate can be suitably equalized between the first processing housing and the second processing housing. The first exhaust pipe extends in the vertical direction. Therefore, the first switching mechanism and the second switching mechanism can each be easily connected to the first exhaust pipe. The second exhaust pipe extends in the vertical direction. Therefore, the first switching mechanism and the second switching mechanism can each be easily connected to the second exhaust pipe.

In the above-mentioned substrate processing apparatus, the substrate processing apparatus includes a third processing housing disposed at the same height as the first processing housing, and a third holding portion installed inside the third processing housing and holding the substrate. and a third liquid supply unit installed inside the third processing housing and supplying processing liquid to the substrate held by the third holding unit, and a third liquid supply unit installed on a side of the third processing housing and discharging gas. 3 exhaust pipes, a fourth exhaust pipe installed on the side of the third processing housing, and discharging gas, and disposed at the same height as the third processing housing, and connecting the exhaust path of the third processing housing to the third exhaust pipe. and a third switching mechanism for switching to one of the fourth exhaust pipes.

The substrate processing apparatus includes a third processing housing, a third holding portion, and a third liquid supply portion. For this reason, liquid treatment can be performed on the substrate inside the third processing housing. Therefore, the throughput of the substrate processing device can be appropriately improved.

The third processing housing is disposed at the same height as the first processing housing. The substrate processing apparatus includes a third switching mechanism, a third exhaust pipe, and a fourth exhaust pipe. The third switching mechanism switches the exhaust path of the third processing housing to one of the third exhaust pipe and the fourth exhaust pipe. Specifically, the third switching mechanism causes the third processing housing to communicate with the third exhaust pipe, and the third processing housing is blocked from the fourth exhaust pipe, and the third processing housing communicates with the fourth exhaust pipe, Additionally, the third processing housing is switched to a state blocked from the third exhaust pipe. When the exhaust path of the third processing housing is the third exhaust pipe, the third exhaust pipe exhausts gas from the third processing housing, and the fourth exhaust pipe does not exhaust gas from the third processing housing. When the exhaust path of the third processing housing is the fourth exhaust pipe, the fourth exhaust pipe exhausts gas from the third processing housing, and the third exhaust pipe does not exhaust gas from the third processing housing.

The third switching mechanism is disposed at the same height as the third processing housing. For this reason, the flow path between the third processing housing and the third switching mechanism can be appropriately shortened. Therefore, contamination of the flow path between the third processing housing and the third switching mechanism can be appropriately suppressed. Accordingly, gas flows smoothly from the third processing housing to the third diversion mechanism. As a result, the gas in the third processing housing can be properly exhausted.

The third exhaust pipe is disposed on the side of the third processing housing. For this reason, the third switching mechanism can be easily connected to the third exhaust pipe. The fourth exhaust pipe is disposed on the side of the third processing housing. For this reason, the third switching mechanism can be easily connected to the fourth exhaust pipe.

As described above, the present substrate processing apparatus can properly exhaust gas from the third processing housing.

In the substrate processing apparatus described above, the substrate processing apparatus includes a first pressure sensor that measures the pressure of the gas on the primary side of the first switching mechanism, and, based on a detection result of the first pressure sensor, the first switching mechanism. A first pressure adjustment mechanism that adjusts the gas pressure on the primary side of the mechanism, a third pressure sensor that measures the gas pressure on the primary side of the third switching mechanism, and based on the detection result of the third pressure sensor , it is preferable to provide a third pressure adjustment mechanism that adjusts the pressure of the gas on the primary side of the third switching mechanism. A substrate processing apparatus includes a first pressure sensor and a first pressure adjustment mechanism. For this reason, the pressure on the primary side of the first switching mechanism can be adjusted appropriately. Likewise, the substrate processing apparatus includes a third pressure sensor and a third pressure adjustment mechanism. For this reason, the pressure on the primary side of the third switching mechanism can be adjusted appropriately.

In the above-mentioned substrate processing apparatus, the first pressure adjustment mechanism and the third pressure adjustment mechanism equalize the pressure of the gas on the primary side of the first switching mechanism and the pressure of the gas on the primary side of the third switching mechanism. It is desirable to do so. Between the first processing housing and the third processing housing, the quality of processing performed on the substrate can be suitably equalized.

In the substrate processing apparatus described above, the substrate processing apparatus includes a fifth exhaust pipe connected to the first exhaust pipe and the third exhaust pipe and discharging the gas of the first exhaust pipe and the gas of the third exhaust pipe, and the second exhaust pipe. It is preferable to provide a sixth exhaust pipe connected to the exhaust pipe and the fourth exhaust pipe, and discharging the gas of the second exhaust pipe and the gas of the fourth exhaust pipe. The structure of the substrate processing device can be simplified.

In the above-mentioned substrate processing apparatus, the substrate processing apparatus includes a fifth pressure sensor that measures the pressure of the gas inside the fifth exhaust pipe, and a fifth pressure sensor that measures the pressure of the gas inside the fifth exhaust pipe, based on the detection result of the fifth pressure sensor. a fifth pressure adjustment mechanism that adjusts the pressure of the gas, a sixth pressure sensor that measures the pressure of the gas inside the sixth exhaust pipe, and, based on the detection result of the sixth pressure sensor, It is desirable to provide a sixth pressure adjustment mechanism that adjusts the pressure of the internal gas. The substrate processing apparatus includes a fifth pressure sensor and a fifth switching mechanism. For this reason, the pressure inside the fifth exhaust pipe can be appropriately adjusted. Similarly, the substrate processing apparatus includes a sixth pressure sensor and a sixth switching mechanism. For this reason, the pressure inside the sixth exhaust pipe can be appropriately adjusted.

In the substrate processing apparatus described above, the fifth pressure sensor is installed downstream of the connection position of the first exhaust pipe and the fifth exhaust pipe, and the connection position of the third exhaust pipe and the fifth exhaust pipe, and 6 The pressure sensor is preferably installed downstream of the connection position of the second exhaust pipe and the sixth exhaust pipe, and the connection position of the fourth exhaust pipe and the sixth exhaust pipe. The fifth pressure sensor can appropriately detect the entire exhaust pressure of the first exhaust pipe and the third exhaust pipe. The sixth pressure sensor can appropriately detect the entire exhaust pressure of the second exhaust pipe and the fourth exhaust pipe.

In the above-described substrate processing apparatus, the first liquid supply unit is capable of supplying a first processing liquid and a second processing liquid, and when the first liquid supply unit supplies the first processing liquid, the first switching mechanism When the exhaust path of the first processing housing is switched to the first exhaust pipe, and the first liquid supply unit supplies the second processing liquid, the first switching mechanism switches the exhaust path of the first processing housing to the first exhaust pipe. It is desirable to switch to a second exhaust pipe. When the first liquid supply unit supplies the first treatment liquid, the first exhaust pipe discharges the gas in the first treatment housing. When the first liquid supply unit supplies the second treatment liquid, the first exhaust pipe does not exhaust the gas in the first treatment housing. Therefore, contamination of the inside of the first exhaust pipe can be appropriately suppressed. Likewise, when the first liquid supply unit supplies the second treatment liquid, the second exhaust pipe exhausts the gas in the first treatment housing. When the first liquid supply unit supplies the first treatment liquid, the second exhaust pipe does not exhaust the gas in the first treatment housing. Therefore, contamination of the inside of the second exhaust pipe can be appropriately suppressed. As a result, the gas in the first processing housing can be exhausted more appropriately.

Although several forms currently considered suitable are shown to illustrate the invention, it is to be understood that the invention is not limited to the configuration and arrangement as shown.
1 is a plan view showing the inside of a substrate processing apparatus of an embodiment.
FIG. 2 is a right side view showing the configuration of the central portion of the substrate processing apparatus in the width direction.
Figure 3 is a front view of the processing block.
Figure 4 is a right side view showing the configuration of the right side of the substrate processing apparatus.
Fig. 5 is a left side view showing the configuration of the left side of the substrate processing apparatus.
Figure 6 is a top view of the processing unit.
Figure 7 is a side view of the processing unit.
Fig. 8 is a front view of the switching mechanism.
9 is a schematic diagram of the exhaust path from the processing housing.
Fig. 10 is a plan view showing the upper part of the processing block.
Figure 11 is a control block diagram of a substrate processing device.
Fig. 12 is a flowchart showing the sequence of operations for processing a substrate.
Figure 13 is a top view of a processing unit in a modified embodiment.
Figure 14 is a top view of a processing unit in a modified embodiment.
Figure 15 is a plan view of a processing unit in a modified embodiment.
Figure 16 is a plan view of a processing unit in a modified embodiment.
Figure 17 is a plan view showing the inside of a substrate processing apparatus in a modified embodiment.
Fig. 18 is a front view of the switching mechanism in the modified embodiment.
Fig. 19A is a side view of a switching mechanism in a modified embodiment.
Fig. 19B is a side view of the switching mechanism in the modified embodiment.
Fig. 20A is a plan view showing an example of arrangement of a wind speed sensor in a modified embodiment.
FIG. 20B is a plan view showing an example of arrangement of a wind speed sensor in a modified embodiment.
Fig. 21A is a plan view showing an example of arrangement of a wind speed sensor in a modified embodiment.
FIG. 21B is a plan view showing an example of arrangement of a wind speed sensor in a modified embodiment.

Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the drawings.

<Overview of substrate processing equipment>

1 is a plan view showing the inside of a substrate processing apparatus of an embodiment. The substrate processing apparatus 1 processes a substrate (eg, semiconductor wafer) W.

The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, an optical These are substrates for magnetic disks, photomasks, and solar cells. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape when viewed from the top.

The substrate processing apparatus 1 includes an indexer unit 3 and a processing block 11. The processing block 11 is connected to the indexer unit 3. The indexer unit 3 and the processing block 11 are aligned in the horizontal direction. The indexer unit 3 supplies the substrate W to the processing block 11 . The processing block 11 performs processing on the substrate W. The indexer unit 3 retrieves the substrate W from the processing block 11 .

In this specification, for convenience, the horizontal direction in which the indexer unit 3 and the processing block 11 are aligned is called the “front-back direction (X).” Among the front-back directions (X), the direction from the processing block 11 toward the indexer unit 3 is called “forward.” The direction opposite to the front is called “backward.” The horizontal direction orthogonal to the front-back direction (X) is called the “width direction (Y).” One direction of the “width direction (Y)” is appropriately called “right direction.” The direction opposite to the right direction is called “left direction.” The direction perpendicular to the horizontal direction is called the “vertical direction (Z).” In each drawing, the front, back, right, left, top, and bottom are shown appropriately for reference.

When “anterior”, “posterior”, “right” and “left” are not specifically distinguished, they are called “lateral”.

The indexer unit 3 is provided with a plurality of (for example, four) carrier placement units 4. The carrier placement portions 4 are lined up in the width direction (Y). Each carrier placement unit 4 places one carrier C each. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a front opening unified pod (FOUP).

The indexer unit 3 is provided with a conveyance space 5. The conveyance space 5 is disposed behind the carrier placement unit 4. The conveyance space 5 extends in the width direction (Y).

The indexer unit 3 is provided with a conveyance mechanism 6. The conveyance mechanism 6 is installed in the conveyance space 5 . The conveyance mechanism 6 is disposed behind the carrier placement unit 4. The transport mechanism 6 transports the substrate W. The transport mechanism 6 can access the carrier C placed on the carrier placement unit 4.

The processing block 11 has a conveyance space 12A. The conveyance space 12A is disposed at the center of the processing block 11 in the width direction (Y). The conveyance space 12A extends in the front-back direction (X). The front part of the conveyance space 12A is connected to the conveyance space 5 of the indexer portion 3.

The processing block 11 includes a substrate placement unit 14A. The substrate placement unit 14A is installed in the transfer space 12A. The substrate placement unit 14A is disposed at the front of the transfer space 12A. The transport mechanism 6 of the indexer unit 3 can also access the substrate placement unit 14A. The substrate placement unit 14A places the substrate W.

The processing block 11 is provided with a conveyance mechanism 16A. The conveyance mechanism 16A is installed in the conveyance space 12A. The transport mechanism 16A transports the substrate W. The transport mechanism 16A can access the substrate placement unit 14A.

The processing block 11 includes processing units 21A1, 21B1, 21C1, and 21D1. Processing units 21A1 and 21B1 are disposed to the right of the conveyance space 12A. Processing units 21A1 and 21B1 are lined up in the front-back direction (X). The processing unit 21B1 is disposed behind the processing unit 21A1. Processing units 21C1 and 21D1 are disposed on the left side of the transfer space 12A. Processing units 21C1 and 21D1 are lined up in the front-back direction (X). The processing unit 21D1 is disposed behind the processing unit 21C1.

When the processing units 21A1, 21B1, 21C1, and 21D1 are not distinguished, they are called processing units 21. Each processing unit 21 processes the substrate W. The processing performed by each processing unit 21 is the same.

The structure of the processing unit 21 will be briefly explained. Each processing unit 21 is provided with a processing housing 23 .

Each processing unit 21 is provided with a holding portion 31 . The holding portion 31 is installed inside the processing housing 23 . The holding portion 31 holds the substrate W. Figure 1 shows the substrate W held by the holding portion 31 with a broken line.

The processing unit 21 is provided with a liquid supply unit 33. The liquid supply unit 33 is installed inside the processing housing 23. The liquid supply unit 33 supplies processing liquid to the substrate W held by the holding unit 31 .

The transfer mechanism 16A is accessible to each processing unit 21. Specifically, the transfer mechanism 16A can access the holding portion 31 of each processing unit 21.

Hereinafter, the processing housing 23 of the processing unit 21A1 is appropriately referred to as the processing housing 23A1. Likewise, the processing housings 23 of the processing units 21B1, 21C1, and 21D1 are appropriately called processing housings 23B1, 23C1, and 23D1. The processing housings 23A1, 23B1, 23C1, and 23D1 are arranged at the same height.

The processing block 11 is provided with exhaust pipes 41A, 42A, and 43A. The exhaust pipes 41A, 42A, and 43A are all installed outside the processing housing 23. The exhaust pipes 41A-43A are respectively installed on the side of the processing housing 23A1. The exhaust pipes 41A-43A respectively pass through positions on the sides of the processing housing 23A1. Exhaust pipes 41A-43A respectively exhaust gas. The exhaust pipes 41A-43A are not connected to each other. The exhaust pipes 41A-43A each have exhaust paths separated from each other.

Likewise, the processing block 11 is provided with exhaust pipes 41B-43B, 41C-43C, and 41D-43D. Exhaust pipes 41B-43B, 41C-43C, and 41D-43D are installed on the sides of the processing housings 23B1, 23C1, and 23D1, respectively. Exhaust pipes 41B-43B, 41C-43C, and 41D-43D respectively exhaust gas.

The processing block 11 includes switching mechanisms 51A1, 51B1, 51C1, and 51D1. The switching mechanism 51A1 is disposed at approximately the same height as the processing housing 23A1. Likewise, the switching mechanisms 51B1, 51C1, and 51D1 are disposed at approximately the same height as the processing housings 23B1, 23C1, and 23D1, respectively.

The switching mechanism 51A1 switches the exhaust path of the processing housing 23A1 to one of the exhaust pipes 41A-43A. The switching mechanism 51A1 switches the exhaust path of the gas from the processing housing 23A1 between the exhaust pipes 41A-43A.

Specifically, the switching mechanism 51A1 switches between the first state, the second state, and the third state. In the first state, the switching mechanism 51A1 communicates the processing housing 23A1 with the exhaust pipe 41A and blocks the processing housing 23A1 from the exhaust pipes 42A and 43A. In the second state, the switching mechanism 51A1 connects the processing housing 23A1 to the exhaust pipe 42A and blocks the processing housing 23A1 from the exhaust pipes 41A and 43A. In the third state, the switching mechanism 51A1 connects the processing housing 23A1 to the exhaust pipe 43A and blocks the processing housing 23A1 from the exhaust pipes 41A and 42A. In this way, the switching mechanism 51A1 is configured to individually communicate the exhaust pipes 41A-43A with the processing housing 23A1 and to individually block the exhaust pipes 41A-43A from the processing housing 23A1.

Likewise, the switching mechanism 51B1 switches the exhaust path of the processing housing 23B1 to one of the exhaust pipes 41B-43B. The switching mechanism 51C1 switches the exhaust path of the processing housing 23C1 to one of the exhaust pipes 41C-43C. The switching mechanism 51D1 switches the exhaust path of the processing housing 23D1 to one of the exhaust pipes 41D-43D.

In FIG. 1, the switching mechanism 51A1 switches the exhaust path of the processing housing 23A1 to the exhaust pipe 41A. The switching mechanism 51B1 switches the exhaust path of the processing housing 23B1 to the exhaust pipe 41B. The switching mechanism 51C1 switches the exhaust path of the processing housing 23C1 to the exhaust pipe 42C. The switching mechanism 51D1 switches the exhaust path of the processing housing 23D1 to the exhaust pipe 43D.

Specifically, the switching mechanism 51A1 connects the processing housing 23A1 to the exhaust pipe 41A and blocks the processing housing 23A1 from the exhaust pipes 42A and 43A. The exhaust pipe 41A exhausts gas from the processing housing 23A1. Exhaust pipes 42A and 43A do not exhaust gases from processing housing 23A1.

The switching mechanism 51B1 connects the processing housing 23B1 to the exhaust pipe 41B and blocks the processing housing 23B1 from the exhaust pipes 42B and 43B. The exhaust pipe 41B exhausts gas from the processing housing 23B1. The exhaust pipes 42B and 43B do not exhaust gases from the processing housing 23B1.

The switching mechanism 51C1 connects the processing housing 23C1 to the exhaust pipe 42C and blocks the processing housing 23C1 from the exhaust pipes 41C and 43C. Exhaust pipe 42C exhausts gas from processing housing 23C1. Exhaust pipes 41C and 43C do not exhaust gases from processing housing 23C1.

The switching mechanism 51D1 connects the processing housing 23D1 to the exhaust pipe 43D and blocks the processing housing 23D1 from the exhaust pipes 41D and 42D. The exhaust pipe 43D exhausts gas from the processing housing 23D1. The exhaust pipes 41D and 42D do not exhaust gases from the processing housing 23D1.

Here, the processing housing 23A1 is an example of the first processing housing in the present invention. The holding portion 31 of the processing unit 21A1 is an example of the first holding portion in the present invention. The liquid supply unit 33 of the processing unit 21A1 is an example of the first liquid supply unit in the present invention. The exhaust pipe 41A is an example of the first exhaust pipe in the present invention. The exhaust pipe 42A is an example of the second exhaust pipe in the present invention. Switching mechanism 51A1 is an example of the first switching mechanism in the present invention.

The processing housing 23B1 is an example of the third processing housing in the present invention. The holding portion 31 of the processing unit 21B1 is an example of the third holding portion in the present invention. The liquid supply unit 33 of the processing unit 21B1 is an example of the third liquid supply unit in the present invention. The exhaust pipe 41B is an example of the third exhaust pipe in the present invention. The exhaust pipe 42B is an example of the fourth exhaust pipe in the present invention. The switching mechanism 51B1 is an example of the third switching mechanism in the present invention.

The substrate processing apparatus 1 operates as follows, for example. The transfer mechanism 6 transfers the substrate W from the carrier C on the carrier placement unit 4 to the substrate placement unit 14A. The transport mechanism 16A transports the substrate W from the substrate placement unit 14A to the processing unit 21. Specifically, the transport mechanism 16A places the substrate W on the holding portion 31. The processing unit 21 performs liquid processing on the substrate W inside the processing housing 23 . Each processing unit 21 processes one substrate W at a time. Specifically, the liquid supply unit 33 supplies processing liquid to the substrate W held in the holding unit 31 . After the substrate W is processed, the transport mechanism 16A transports the substrate W from the processing unit 21 to the substrate placing unit 14A. The transfer mechanism 6 transfers the substrate W from the substrate placement unit 14A to the carrier C on the carrier placement unit 4.

When one processing unit 21 processes the substrate W, another processing unit 21 may process another substrate W. The number of processing units 21 in which each substrate W is transported is, for example, one.

When processing is performed on the substrate W inside the processing housing 23, the switching mechanism 51 switches the exhaust path of the processing housing 23. For example, when processing the substrate W, the switching mechanism 51A1 switches the exhaust path one or more times. For example, the period for processing one substrate W in one processing housing 23 may include two or more of the first period, second period, and third period. Here, the first period is a period in which the first exhaust pipe exhausts the gas from the processing housing 23. The second period is a period in which the second exhaust pipe exhausts the gas from the processing housing 23. The third period is a period in which the third exhaust pipe exhausts the gas from the processing housing 23.

According to the above-described substrate processing apparatus 1, the following effects can be obtained. That is, the switching mechanism 51A1 is disposed at approximately the same height as the processing housing 23A1. For this reason, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be appropriately shortened.

Additionally, the processing housing 23A1 and the switching mechanism 51A1 are connected without passing through a pipe. For this reason, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be appropriately shortened.

Since the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be appropriately shortened, contamination of the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be appropriately suppressed. Accordingly, gas flows smoothly from the processing housing 23A1 to the diversion mechanism 51A1. As a result, the gas in the processing housing 23A1 can be properly exhausted.

However, the switching timing is determined, for example, depending on the gas change timing and delay time. Here, the switching timing is the timing at which the switching mechanism 51 switches the exhaust path. The gas change timing is the timing at which the components of the gas in the processing housing 23 change. The delay time is the time required for the gas to reach the diversion mechanism 51 from the processing housing 23. The shorter the flow path between the processing housing 23 and the switching mechanism 51, the shorter the delay time. The shorter the flow path between the processing housing 23 and the switching mechanism 51, the smaller the variation in delay time. As described above, according to the substrate processing apparatus 1, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be appropriately shortened. For this reason, the delay time can be appropriately shortened. Additionally, unevenness in delay time can be appropriately suppressed. Therefore, the switching timing can be accurately determined. Accordingly, the switching mechanism 51A1 can switch the exhaust path of the processing housing 23A1 at accurate timing.

Since the switching mechanism 51A1 is disposed at approximately the same height as the processing housing 23A1, the flow path between the processing housing 23A1 and the switching mechanism 51A1 extends in a substantially horizontal direction. Accordingly, gas flows more smoothly from the processing housing 23A1 to the switching mechanism 51A1. As a result, the gas in the processing housing 23A1 can be exhausted more appropriately.

Likewise, the switching mechanisms 51B1, 51C1, and 51D1 are disposed at approximately the same height as the processing housings 23B1, 23C1, and 23D1, respectively. For this reason, the gas in the processing housings 23A1, 23C1, and 23D1 can be properly exhausted.

The exhaust pipe 41A is disposed on the side of the processing housing 23A1. For this reason, the switching mechanism 51A1 can be easily connected to the exhaust pipe 41A. Exhaust pipes 42A and 43A are also disposed on the side of the processing housing 23A1. For this reason, the switching mechanism 51A1 can be easily connected to the exhaust pipes 42A and 43A.

Likewise, the exhaust pipes 41B-43B are disposed on the side of the processing housing 23B1. For this reason, the switching mechanism 51B1 can be easily connected to the exhaust pipes 41B-43B. The exhaust pipes 41C-43C are disposed on the side of the processing housing 23C1. For this reason, the switching mechanism 51C1 can be easily connected to the exhaust pipes 41C-43C. The exhaust pipes 41D-43D are disposed on the side of the processing housing 23D1. For this reason, the switching mechanism 51D1 can be easily connected to the exhaust pipes 41D-43D.

Below, the structure of the substrate processing apparatus 1 will be described in more detail.

<Indexer Department (3)>

See Figures 1 and 2. FIG. 2 is a right side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction (Y). The structure of the conveyance mechanism 6 will be described. The conveyance mechanism 6 includes a hand 7 and a hand drive unit 8. The hand 7 supports one substrate W in a horizontal position. The hand drive unit 8 is connected to the hand 7. The hand drive unit 8 moves the hand 7. The hand drive unit 8 moves the hand 7 in the front-back direction (X), the width direction (Y), and the vertical direction (Z).

The structure of the hand drive unit 8 is illustrated. The hand drive unit 8 includes, for example, a rail 8a, a horizontal moving part 8b, a vertical moving part 8c, a rotating part 8d, and a forward/backward moving part 8e. The rail 8a is fixedly installed. The rail 8a is disposed at the bottom of the conveyance space 5. The rail 8a extends in the width direction (Y). The horizontal moving part 8b is supported on the rail 8a. The horizontal moving part 8b moves in the width direction Y with respect to the rail 8a. The vertical moving part 8c is supported by the horizontal moving part 8b. The vertical moving part 8c moves in the vertical direction (Z) with respect to the horizontal moving part 8b. The rotating part 8d is supported by the vertical moving part 8c. The rotating part 8d rotates with respect to the vertical moving part 8c. The rotating portion 8d rotates around a rotation axis parallel to the vertical direction Z. The forward/backward movement unit 8e moves with respect to the rotation unit 8d. The forward/backward movement unit 8e reciprocates in one horizontal direction determined by the direction of the rotation unit 8d. The forward and backward movement unit 8e is connected to the hand 7. Since the hand drive unit 8 has this configuration, the hand 7 can move in parallel in the vertical direction Z. The hand 7 can move in parallel in any horizontal direction. The hand 7 is rotatable in a horizontal plane.

<Overview of processing block 11>

See Figures 2 and 3. Figure 3 is a front view of the processing block 11. Fig. 3 omits illustration of the substrate placement unit 14A and the like. The processing block 11 includes a conveyance space 12B in addition to the conveyance space 12A. The conveyance space 12B is located below the conveyance space 12A. The conveyance space 12B is also connected to the conveyance space 5 of the indexer unit 3. Although not shown, the conveyance space 12B is disposed at the same position as the conveyance space 12A when viewed from the top.

When the conveyance spaces 12A and 12B are not distinguished, they are called conveyance spaces 12.

The processing block 11 is provided with one partition 13. The partition wall 13 is disposed below the conveyance space 12A and above the conveyance space 12B. The partition 13 has a horizontal plate shape. The partition wall 13 separates the conveyance space 12A from the conveyance space 12B.

See Figure 2. The processing block 11 includes a substrate placement unit 14B in addition to the substrate placement unit 14A. The substrate placement unit 14B places the substrate W. The substrate placement unit 14B is disposed below the substrate placement unit 14A. The substrate placement unit 14B is installed in the transfer space 12B. The substrate placement unit 14B is disposed at the front of the transfer space 12B. The transport mechanism 6 of the indexer unit 3 can also access the substrate placement unit 14B. The transport mechanism 6 transports the substrate W alternately to, for example, the substrate placement units 14A and 14B.

The processing block 11 includes a conveyance mechanism 16B in addition to the conveyance mechanism 16A. The conveyance mechanism 16B is installed in the conveyance space 12B. The transport mechanism 16B transports the substrate W. The transport mechanism 16B can access the substrate placement unit 14B.

When there is no distinction between the conveyance mechanisms 16A and 16B, they are referred to as the conveyance mechanism 16.

See Figures 1, 2, and 3. The structure of the conveyance mechanism 16 will be explained. The conveyance mechanism 16 includes a hand 17 and a hand drive unit 18. The hand 17 supports one substrate W in a horizontal position. The hand drive unit 18 is connected to the hand 17. The hand drive unit 18 moves the hand 17. The hand drive unit 18 moves the hand 17 in the front-back direction (X), the width direction (Y), and the vertical direction (Z).

The structure of the hand drive unit 18 is illustrated. The hand drive unit 18 includes, for example, two pillars 18a, a vertical movement unit 18b, a horizontal movement unit 18c, a rotation unit 18d, and a forward/backward movement unit 18e. The support 18a is fixedly installed. The support post 18a is disposed on the side of the conveyance space 12. The two struts 18a are lined up in the front-back direction (X). Each support 18a extends in the vertical direction Z. The vertical moving part 18b is supported on the support 18a. The vertical moving portion 18b extends in the front-back direction (X) between the two struts 18a. The vertical moving portion 18b moves in the vertical direction Z with respect to the support column 18a. The horizontal moving part 18c is supported by the vertical moving part 18b. The horizontal moving part 18c moves in the front-back direction (X) with respect to the vertical moving part 18b. The rotating part 18d is supported by the horizontal moving part 18c. The rotating part 18d rotates with respect to the horizontal moving part 18c. The rotating portion 18d rotates around a rotation axis parallel to the vertical direction Z. The forward/backward movement unit 18e moves with respect to the rotation unit 18d. The forward/backward movement unit 18e reciprocates in one horizontal direction determined by the direction of the rotation unit 18d. The forward and backward movement unit 18e is connected to the hand 17. Since the hand drive unit 18 is configured in this way, the hand 17 can move in parallel in the vertical direction Z. The hand 7 can move in parallel in any horizontal direction. The hand 7 is rotatable in a horizontal plane.

FIG. 4 is a right side view showing the configuration of the right side of the substrate processing apparatus 1. The processing block 11 includes five processing units 21A2-21A6 in addition to the processing unit 21A1. The processing units 21A2-21A6 each have processing housings 23A2-23A6. The processing housings 23A2-23A6 are disposed below the processing housing 23A1. The processing housings 23A1-23A6 are lined up from top to bottom. The processing housings 23A1-23A6 are arranged in one row in the vertical direction (Z). Although not shown, the processing housings 23A2 - 23A6 are each disposed at the same position as the processing housing 23A1 when viewed from the top. The processing housings 23A1-23A6 are stacked on top of each other.

Likewise, the processing block 11 includes processing units 21B2-21B6 in addition to the processing unit 21B1. The processing units 21B2-21B6 each have processing housings 23B2-23B6. The relative positions of the processing housings 23B1-23B6 are the same as the relative positions of the processing housings 23A1-23A6.

FIG. 5 is a left side view showing the configuration of the left side of the substrate processing apparatus 1. The processing block 11 includes processing units 21C2-21C6 and 21D2-21D6 in addition to the processing units 21C1 and 21D1. The processing units 21C2-21C6 and 21D2-21D6 have processing housings 23C2-23C6 and 23D2-23D6, respectively. The processing housings 23C1-23C6 and 23D1-23D6 are respectively disposed identically to the processing housings 23A1-23A6.

See Figures 3, 4, and 5. As described above, the processing housings 23A1, 23B1, 23C1, and 23D1 are arranged at the same height. The processing housings 23A2-23A6, 23B2-23B6, 23C2-23C6, and 23D2-23D6 are also arranged in the same manner. That is, the processing housings 23An, 23Bn, 23Cn, and 23Dn are arranged at the same height position. Here, “n” is an integer from 1 to 6.

See Figure 3. The processing housings 23A1-23A3, 23B1-23B3, 23C1-23C3, and 23D1-23D3 are each disposed at the same height as the conveyance space 12A. For this reason, the transport mechanism 16A can access the processing housings 23A1-23A3, 23B1-23B3, 23C1-23C3, and 23D1-23D3.

The processing housings 23A4-23A6, 23B4-23B6, 23C4-23C6, and 23D4-23D6 are arranged at the same height as the conveyance space 12B. For this reason, the transfer mechanism 16B can access the processing housings 23A4-23A6, 23B4-23B6, 23C4-23C6, and 23D4-23D6.

If processing units 21A1-21A6 are not distinguished, they are referred to as processing unit 21A. If processing units 21B1-21B6 are not distinguished, they are referred to as processing unit 21B. If processing units 21C1-21C6 are not distinguished, they are referred to as processing unit 21C. If processing units 21D1-21D6 are not distinguished, they are referred to as processing unit 21D. If the processing units 21A, 21B, 21C, and 21D are not distinguished, they are called processing units 21.

If no distinction is made between the processing housings 23A1-23A6, they are referred to as the processing housing 23A. If no distinction is made between the processing housings 23B1-23B6, they are referred to as the processing housing 23B. If no distinction is made between the processing housings 23C1-23C6, they are referred to as processing housing 23C. If no distinction is made between the processing housings 23D1-23D6, they are referred to as the processing housing 23D. If the processing housings 23A, 23B, 23C, and 23D are not distinguished, they are referred to as the processing housing 23.

See Figure 1. Each processing housing 23 is adjacent to the transfer space 12 . Each processing housing 23A, 23B is disposed on the right side of the transfer space 12, respectively. Each processing housing 23C and 23D is disposed on the left side of the transfer space 12, respectively.

The processing block 11 includes first piping spaces 44A and 44B and second piping spaces 46A and 46B. The first piping spaces 44A and 44B and the second piping spaces 46A and 46B are respectively adjacent to the conveyance space 12. The 1st piping space 44A, 44B and the 2nd piping space 46A, 46B are arrange|positioned to the right of the conveyance space 12.

The first piping space 44A, the processing housing 23A, and the second piping space 46A are aligned in the front-back direction (X). The first piping space 44A, the processing housing 23A, and the second piping space 46A are lined up in this order. The first piping space 44A is disposed in front of the processing housing 23A. The first piping space 44A is adjacent to the processing housing 23A. The second piping space 46A is disposed behind the processing housing 23A. The second piping space 46A is adjacent to the processing housing 23A.

The relative positions of the processing housing 23B, the first piping space 44B, and the second piping space 46B are the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. It's the same. The first piping space 44B is located behind the second piping space 46A. The first piping space 44B is adjacent to the second piping space 46A.

The processing block 11 includes first piping spaces 44C and 44D and second piping spaces 46C and 46D. The first piping spaces 44C and 44D and the second piping spaces 46C and 46D are respectively adjacent to the conveyance space 12. The first piping spaces 44C and 44D and the second piping spaces 46C and 46D are located on the left side of the conveyance space 12. The relative positions of the processing housing 23C, the first piping space 44C, and the second piping space 46C are the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. Wow, the direction is just different. The relative positions of the processing housing 23C, the first piping space 44C, and the second piping space 46C are the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. This corresponds to a rotation of 180 degrees around an axis parallel to the vertical direction (Z). For this reason, the first piping space 44C is located behind the processing housing 23C. The second piping space 46C is disposed in front of the processing housing 23C. In this way, the relative positions of the processing housing 23C, the first piping space 44C, and the second piping space 46C are the processing housing 23A, the first piping space 44A, and the second piping space 46A. It is the same as the relative position of . The processing housing 23C, the first piping space 44C, and the second piping space 46C are installed in the same direction as the processing housing 23A, the first piping space 44A, and the second piping space 46A. It's just different. Relative positions of the processing housing 23D, the first piping space 44D, and the second piping space 46D, and the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. It's the same. The processing housing 23D, the first piping space 44D, and the second piping space 46D have directions in which the processing housing 23A, the first piping space 44A, and the second piping space 46A are installed. It's just different.

The first piping space 44A accommodates exhaust pipes 41A-43A. In other words, the exhaust pipes 41A-43A are installed in the first piping space 44A. Likewise, the first piping space 44B accommodates exhaust pipes 41B-43B. The first piping space 44C accommodates exhaust pipes 41C-43C. The first piping space 44D accommodates exhaust pipes 41D-43D.

Exhaust pipes 41A-43A are disposed in front of the processing housing 23A. The exhaust pipes 41B-43B are disposed in front of the processing housing 23B. Exhaust pipes 41C-43C are disposed behind the processing housing 23C. The exhaust pipes 41D-43D are disposed at the rear of the processing housing 23D.

Exhaust pipes 41A-43A are lined up in the width direction (Y). Exhaust pipes 41A-43A are each adjacent to the processing housing 23A. Similarly, the exhaust pipes 41B-43B are lined up in the width direction (Y). Exhaust pipes 41B-43B are each adjacent to the processing housing 23B. Exhaust pipes 41C-43C are lined up in the width direction (Y). Exhaust pipes 41C-43C are each adjacent to the processing housing 23C. Exhaust pipes 41D-43D are lined up in the width direction (Y). Exhaust pipes 41D-43D are each adjacent to the processing housing 23C.

The processing block 11 is provided with air supply pipes 48A, 48B, 48C, and 48D. The air supply pipe 48A is installed in the second piping space 46A. The air supply pipe 48A supplies gas (eg, clean air) to the processing housing 23A. Similarly, the air supply pipes 48B, 48C, and 48D are accommodated in the second piping spaces 46B, 46C, and 46D, respectively. The air supply pipes 48B, 48C, and 48D supply gas to the processing housings 23B, 23C, and 23D, respectively.

See Figures 3, 4, and 5. The exhaust pipes 41A-43A each extend in the vertical direction (Z). The exhaust pipes 41A-43A extend from a height position of the processing housing 23A1 to a height position of the processing housing 23A6, respectively. Likewise, the exhaust pipes 41B-43B, 41C-43C, and 41D-43D each extend in the vertical direction (Z).

See Figures 4 and 5. The air supply pipes 48A-48D each extend in the vertical direction. The air supply pipes 48A-48D are installed on the sides of the processing housings 23A-23D, respectively.

The front-back direction (X) is an example of the first direction in the present invention. The width direction (Y) is an example of the second direction in the present invention.

When no distinction is made between the exhaust pipes 41A-41D, they are referred to as the exhaust pipe 41. When no distinction is made between the exhaust pipes 42A-42D, they are referred to as the exhaust pipe 42. When no distinction is made between the exhaust pipes 43A-43D, they are referred to as the exhaust pipe 43. When the first piping spaces 44A, 44B, 44C, and 44D are not distinguished, they are called the first piping spaces 44. When the second piping spaces 46A, 46B, 46C, and 46D are not distinguished, they are called the second piping spaces 46. When no distinction is made between the air supply pipes 48A-48D, they are referred to as the air supply pipe 48.

The first piping space 44 does not accommodate the piping that supplies gas to the processing housing 23 . The first piping space 44 does not accommodate the piping that supplies the processing liquid to the processing unit 21 (liquid supply unit 33). The first piping space 44 does not accommodate a piping discharging the processing liquid from the processing unit 21 .

The second piping space 46 may accommodate, for example, a piping that supplies processing liquid to the processing unit 21 (liquid supply unit 33). The second piping space 46 may accommodate a piping that discharges the processing liquid from the processing unit 21, for example.

See Figures 3 and 4. As described above, the switching mechanism 51A1 is disposed at approximately the same height as the processing housing 23A1. The switching mechanism 51A1 overlaps the processing housing 23A1 when viewed from the front. Specifically, the entire switching mechanism 51A1 overlaps the processing housing 23A1 when viewed from the front. The relative position of the switching mechanism 51B1 and the processing housing 23B1 is the same as the relative position of the switching mechanism 51A1 and the processing housing 23A1. The relative positions of the switching mechanisms 51C1 and 51D1 and the processing housings 23C1 and 23D1 are also the same as the relative positions of the switching mechanisms 51A1 and the processing housing 23A1.

The processing block 11 includes switching mechanisms 51A2-51A6 in addition to the switching mechanism 51A1. The relative position of the switching mechanism 51A2 and the processing housing 23A2 is the same as the relative position of the switching mechanism 51A1 and the processing housing 23A1. Specifically, the switching mechanism 51A2 is disposed at approximately the same height as the processing housing 23A2. The switching mechanism 51A2 overlaps the processing housing 23A2 when viewed from the front. Likewise, the relative positions of the switching mechanisms 51A3 - 51A6 and the processing housings 23A3 - 23A6 are the same as the relative positions of the switching mechanisms 51A1 and the processing housing 23A1.

The switching mechanism 51A2 switches the exhaust path of the processing housing 23A2 to one of the exhaust pipes 41A-43A. Likewise, the switching mechanisms 51A3 - 51A6 respectively switch the exhaust path of the processing housings 23A3 - 23A6 to one of the exhaust pipes 41A - 43A. Accordingly, exhaust pipes 41A-43A exhaust gas from processing housings 23A1-23A6, respectively.

See Figure 4. The processing block 11 includes switching mechanisms 51B2-51B6 in addition to the switching mechanism 51B1. The relative positions of the switching mechanisms 51B2-51B6 and the processing housings 23B2-23B6 are the same as the relative positions of the switching mechanisms 51B1 and the processing housing 23B1. The switching mechanisms 51B2 - 51B6 respectively switch the exhaust path of the processing housings 23B2 - 23B6 to one of the exhaust pipes 41B - 43B. Accordingly, exhaust pipes 41B-43B exhaust gas from processing housings 23B1-23B6, respectively.

See Figure 5. The processing block 11 includes switching mechanisms 51C2-51C6 in addition to the switching mechanism 51C1. The relative positions of the switching mechanisms 51C2-51C6 and the processing housings 23C2-23C6 are the same as the relative positions of the switching mechanisms 51C1 and the processing housing 23C1. The switching mechanisms 51C2 - 51C6 respectively switch the exhaust path of the processing housings 23C2 - 23C6 to one of the exhaust pipes 41C - 43C. Accordingly, exhaust pipes 41C-43C exhaust gas from processing housings 23C1-23C6, respectively.

The processing block 11 includes switching mechanisms 51D2-51D6 in addition to the switching mechanism 51D1. The relative positions of the switching mechanism 51D2-51D6 and the processing housings 23D2-23D6 are the same as the relative positions of the switching mechanism 51D1 and the processing housing 23D1. The switching mechanisms 51D2-51D6 respectively switch the exhaust path of the processing housings 23D2-23D6 to one of the exhaust pipes 41D-43D. Accordingly, the exhaust pipes 41D-43D exhaust gas from the processing housings 23D1-23D6.

Although not shown, the switching mechanisms 51A2 - 51A6 are each disposed at the same position as the switching mechanism 51A1 when viewed from the top. Likewise, the switching mechanisms 51B2 - 51B6 are each disposed at the same position as the switching mechanism 51B1 when viewed from the top. The switching mechanisms 51C2 - 51C6 are each disposed at the same position as the switching mechanism 51C1 when viewed from the top. The switching mechanisms 51D2-51D6 are each disposed at the same position as the switching mechanism 51D1 when viewed from the top.

When no distinction is made between the switching mechanisms 51A1-51A6, they are referred to as the switching mechanism 51A. When no distinction is made between the switching mechanisms 51B1-51B6, they are referred to as the switching mechanism 51B. When no distinction is made between the switching mechanisms 51C1-51C6, they are referred to as the switching mechanism 51C. When no distinction is made between the switching mechanisms 51D1-51D6, they are called the switching mechanisms 51D. When no distinction is made between the switching mechanisms 51A, 51B, 51C, and 51D, they are referred to as switching mechanisms 51.

See Figure 1. The switching mechanism 51 is installed at a position that does not overlap the holding portion 31 when viewed from the top. At least a part of the switching mechanism 51 is installed outside the processing housing 23 . At least a part of the switching mechanism 51 is installed on the side of the processing housing 23 . At least a part of the switching mechanism 51 is installed in the first piping space 44 . At least a part of each switching mechanism 51A is installed in the first piping space 44A. At least a part of each switching mechanism 51B is installed in the first piping space 44B. At least a part of each switching mechanism 51C is installed in the first piping space 44C. At least a part of each switching mechanism 51D is installed in the first piping space 44D.

<Structure of processing unit 21>

Figure 6 is a top view of the processing unit 21. Figure 7 is a side view of the processing unit 21. Each processing unit 21 is provided with a processing housing 23, a holding portion 31, and a liquid supply portion 33, as described above. In addition, since FIG. 1 shows the liquid supply unit 33 simply for convenience, the liquid supply unit 33 shown in FIG. 6 is slightly different from the liquid supply unit 33 shown in FIG. 1.

The structure of the processing housing 23 will be described. The processing housing 23 has a substantially box shape. The processing housing 23 has an approximately rectangular shape when viewed from the top, from the front, and from the side.

Each processing housing 23 has four side walls 25a, 25b, 25c, 25d, an upper plate 25e, and a bottom plate 25f. The side walls 25a-25d each have a substantially vertical plate shape. The top plate 25e and the bottom plate 25f have a substantially horizontal plate shape.

Each processing housing 23 has a processing space 24 therein. The substrate W is processed in the processing space 24 . The processing space 24 is partitioned by side walls 25a-25d, an upper plate 25e, and a bottom plate 25f.

The side walls 25a and 25c extend in the front-back direction (X) when viewed from the top. The side wall 25c is installed opposite the side wall 25a. The side walls 25b and 25d extend in the width direction Y when viewed from the top. The side walls 25b and 25d extend from the side wall 25a to the side wall 25c, respectively. The side wall 25d is installed opposite the side wall 25b.

The processing housing 23B has the same structure as the processing housing 23A. The processing housings 23C and 23D also have the same structure as the processing housing 23A. The processing housings 23C and 23D differ from the processing housing 23A only in the direction in which they are installed. The processing housings 23C and 23D correspond to the processing housing 23A rotated by 180 degrees around an axis parallel to the vertical direction Z. Accordingly, in any of the processing housings 23A-23D, the side wall 25a is in contact with the conveyance space 12. In any of the processing housings 23A-23D, the side wall 25b is in contact with the first piping space 44. In any of the processing housings 23A-23D, the side wall 25d is in contact with the second piping space 46.

The processing housing 23 has a substrate transfer port 27 . The substrate transport port 27 is formed on the side wall 25a. The substrate W can pass through the substrate transfer port 27. The substrate W moves between the outside of the processing housing 23 and the inside of the processing housing 23 through the substrate transfer port 27 . Specifically, the substrate W moves between the transport space 12 and the processing space 24 through the substrate transport port 27 .

Each processing unit 21 may be provided with a shutter not shown. The shutter is mounted on the side wall 25a. The shutter opens and closes the substrate transfer port 27.

The holding portion 31 holds one substrate W in a horizontal position. The holding portion 31 has an upper surface 31a. The upper surface 31a is substantially horizontal. The substrate W is placed on the upper surface 31a.

Figures 6 and 7 show the center point G. The center point G is the position of the center of the substrate W when the substrate W is held by the holding portion 31.

See Figure 7. Each processing unit 21 also includes a rotation drive unit 32 . The rotation drive unit 32 is installed inside the processing housing 23. The rotation drive unit 32 is connected to the holding unit 31. The rotation drive unit 32 rotates the holding unit 31. The substrate W held by the holding portion 31 rotates integrally with the holding portion 31 . The holding portion 31 and the substrate W rotate around the rotation axis Aw. The rotation axis Aw is, for example, an imaginary line parallel to the vertical direction Z. The rotation axis Aw passes through the center point G, for example.

See Figure 6. The liquid supply unit 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid. The first processing liquid, the second processing liquid, and the third processing liquid are different from each other. That is, the liquid supply unit 33 supplies multiple (three) types of processing liquid.

The first treatment liquid is classified as an acidic liquid, for example. The first treatment liquid contains, for example, at least one of hydrofluoric acid (hydrofluoric acid), hydrochloric acid hydrogen peroxide solution, sulfuric acid, sulfuric acid hydrogen peroxide solution, hydrofluoric acid (mixture of hydrofluoric acid and nitric acid), and hydrochloric acid.

The second treatment liquid is classified as an alkaline liquid, for example. The second treatment liquid contains, for example, at least one of ammonia hydrogen peroxide (SC1), ammonia water, ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH).

The third treatment liquid is classified as an organic liquid, for example. The organic liquid contains at least one of isopropyl alcohol (IPA), methanol, ethanol, hydrofluoroether (HFE), and acetone.

The liquid supply unit 33 is provided with nozzles 34A, 34B, and 34C. The nozzles 34A, 34B, and 34C each discharge processing liquid. The nozzle 34A discharges, for example, the first processing liquid. The nozzle 34B discharges, for example, the second processing liquid. The nozzle 34C discharges, for example, the third processing liquid.

Each nozzle 34A, 34B, and 34C has a linearly extending tube shape. The nozzles 34A, 34B, and 34C have tip portions 35A, 35B, and 35C and proximal ends 36A, 36B, and 36C, respectively. The tip portions 35A, 35B, and 35C each have a discharge port (not shown) through which the treatment liquid is discharged.

The liquid supply section 33 includes base sections 37A, 37B, and 37C. Base portions 37A, 37B, and 37C support nozzles 34A, 34B, and 34C, respectively. Specifically, the base portions 37A, 37B, and 37C are connected to the proximal end portions 36A, 36B, and 36C.

The base portion 37A further moves the nozzle 34A. For example, passing through the base portion 37A, the base portion 37A rotates the nozzle 34A around a rotation axis parallel to the vertical direction Z. Likewise, the base portions 37B and 37C move the nozzles 34B and 34C, respectively.

The base portion 37A allows the nozzle 34A to move between the processing position and the retraction position. When the nozzle 34A is in the processing position, the tip portion 35A (discharge port) is located above the substrate W held by the holding portion 31. When the nozzle 34A is in the processing position, the tip portion 35A (discharge port) overlaps the substrate W held by the holding portion 31 when viewed from the top. When the nozzle 34A is in the retracted position, the entire nozzle 34A does not overlap the substrate W held by the holding portion 31 when viewed from the top. Likewise, the nozzles 34B and 34C are movable to the processing position and retraction position, respectively. Figure 6 shows the nozzles 34A, 34B, and 34C in the retracted position.

The base portions 37A-37C are each disposed near the side wall 25c. The base portion 37A is disposed at a corner where the side walls 25c and 25b are connected. The base portions 37B and 37C are disposed at corners where the side walls 25c and 25d are connected.

Each processing unit 21 is provided with a cup 38 . The cup 38 is disposed around the holding portion 31. The cup 38 surrounds the side of the substrate W held by the holding portion 31. The cup 38 catches the processing liquid splashed from the substrate W held on the holding portion 31.

See Figure 7. Each processing unit 21 is provided with an extraction unit 39 . The extraction unit 39 supplies gas to the processing space 24 . The extraction unit 39 is mounted on the upper plate 25e. The extraction unit 39 is disposed above the holding portion 31 . The blowing unit 39 blows gas (eg, clean air) downward.

The extraction unit 39 is connected to the air supply pipe 48. The air supply pipe 48 supplies gas to the extraction unit 39.

The relative positions of the processing housing 23, the holding portion 31, and the liquid supply portion 33 are the same among the processing units 21A-21D. The relative positions of the processing housing 23, the holding portion 31, and the liquid supply portion 33 in the processing units 21C and 21D are the relative positions of the processing housing 23 and the holding portion 31 in the processing unit 21A. ) and the liquid supply unit 33 only have different relative positions and directions.

<Structure of switching mechanism 51>

See Figures 6 and 7. The switching mechanism 51 includes a switching housing 53 . The size of the conversion housing 53 is smaller than the processing housing 23. The switching housing 53 is connected to the processing housing 23 . The transition housing 53 is also connected to the exhaust pipes 41-43. Each conversion housing 53 extends in the horizontal direction. Each switching housing 53 is bent approximately into an L-shape when viewed from the top. The transition housing 53 has a transition space 54 therein.

Each conversion housing 53 is provided with an introduction portion 55 . The introduction portion 55 is connected to the processing housing 23 . The introduction portion 55 is connected to the side wall 25b of the processing housing 23.

The introduction portion 55 extends from the processing housing 23 in the front-back direction (X). The introduction portion 55 has a first end 55a and a second end 55b. The first stage 55a corresponds to the upstream end of the switching space 54. The transition space 54 is open to the processing space 24 at the first stage 55a. In this way, the transition housing 53 communicates with the processing housing 23 at the introduction portion 55 . Gas flows into the conversion space 54 from the processing housing 23 through the first stage 55a.

The introduction portion 55 penetrates the processing housing 23 . The first stage 55a is disposed inside the processing housing 23. That is, the first stage 55a is disposed in the processing space 24. The second stage 55b is disposed outside the processing housing 23. Specifically, the second stage 55b is disposed in the first piping space 44.

The introduction portion 55 is disposed at a position close to the side wall 25a. In contrast, the base portions 37A-37C are disposed close to the side wall 25c. In other words, the introduction portion 55 is disposed at a position close to the conveyance space 12. The base portions 37A-37C are disposed at a position far from the conveyance space 12.

The positions of the introduction portion 55 and the like will be explained based on the side wall 25a. Figure 6 shows distances D1, D2, D3, and D4. The distance D1 is the separation distance between the introduction portion 55 and the side wall 25a when viewed from the top. The distance D2 is the separation distance between the holding portion 31 and the side wall 25a when viewed from the top. The distance D3 is the separation distance between the center point G and the side wall 25a when viewed from the top. The distance D4 is the separation distance between the base portion 37A and the side wall 25a when viewed from the top. Distance D1 is smaller than distance D2. Distance D2 is smaller than distance D3. Distance D3 is smaller than distance D4.

Here, the side wall 25a is in contact with the conveyance space 12. For this reason, the above-mentioned distances D1-D4 are close to the distance based on the conveyance space 12. That is, the distance D1 is approximate to the separation distance between the introduction portion 55 and the conveyance space 12 when viewed from the top. The distance D2 is similar to the separation distance between the holding portion 31 and the conveyance space 12 when viewed from the top. The distance D3 is similar to the separation distance between the center point G and the conveyance space 12 when viewed from a planar view. The distance D4 is similar to the separation distance between the base portion 37A and the conveyance space 12 when viewed from the top. Therefore, when viewed from the top, the separation distance between the introduction portion 55 and the conveyance space 12 is smaller than the separation distance between the holding portion 31 and the conveyance space 12. When viewed from the top, the separation distance between the holding portion 31 and the conveyance space 12 is smaller than the separation distance between the center point G and the conveyance space 12. In plan view, the separation distance between the center point G and the conveyance space 12 is smaller than the separation distance between the base portion 37A and the conveyance space 12.

Each conversion housing 53 is provided with a distribution portion 56 . The distribution section 56 is connected to the introduction section 55. The distribution section 56 is connected to the second end 55b of the introduction section 55. The distribution portion 56 extends in the width direction (Y).

The distribution unit 56 is disposed outside the processing housing 23 . The distribution unit 56 is disposed in the first piping space 44 . The distribution section 56 is disposed near the exhaust pipes 41-43.

The exhaust pipes 41-43 each contact the processing housing 23. The exhaust pipes 41-43 are disposed between the processing housing 23 and the distribution unit 56 when viewed in plan. Specifically, the exhaust pipes 41 to 43 each contact the side wall 25b of the processing housing 23. The exhaust pipes 41-43 are disposed between the side wall 25b and the distribution section 56.

The distribution unit 56 is connected to the exhaust pipes 41-43. The distribution section 56 is connected to the outer surface of the exhaust pipes 41-43. The switching housing 53 communicates with the exhaust pipes 41-43 in the distribution section 56.

Specifically, the exhaust pipe 41 has an opening 41k. The opening 41k is formed on the outer surface of the exhaust pipe 41. The opening 41k communicates with the flow path within the exhaust pipe 41. The distribution section 56 is connected to a portion of the exhaust pipe 41 located around the opening 41k. Thereby, the switching space 54 communicates with the flow path within the exhaust pipe 41 through the opening 41k. Likewise, the exhaust pipes 42 and 43 have openings 42k and 43k, respectively. The distribution section 56 is connected to the exhaust pipes 42 and 43 around the openings 42k and 43k.

See Figures 6 and 8. Fig. 8 is a front view of the switching mechanism 51. In Fig. 8, for convenience, the transition housing 53 is indicated by a broken line. Each conversion housing 53 is provided with three opening and closing portions 61, 62, and 63. The opening and closing portions 61-63 are each installed inside the switching housing 53. That is, the transition housing 53 accommodates the opening and closing portions 61-63. Specifically, the opening and closing sections 61 to 63 are each installed inside the distribution section 56. The opening and closing portions 61-63 are installed outside the processing housing 23. The opening and closing portions 61-63 are installed in the first piping space 44. The opening and closing portions 61, 62, and 63 are disposed at positions opposite to the openings 41k, 42k, and 43k, respectively. The opening and closing portions 61, 62, and 63 are movable to positions that open the openings 41k, 42k, and 43k and positions that close the openings 41k, 42k, and 43k, respectively.

6 and 8, the opening and closing portions 61 are positioned to open the openings 41k, and the opening and closing portions 62 and 63 are positioned to close the openings 42k and 43k, respectively.

When the opening/closing portion 61 opens the opening 41k, the exhaust pipe 41 communicates with the processing housing 23. When the opening/closing portion 61 closes the opening 41k, the exhaust pipe 41 is blocked from the processing housing 23. In this way, the position of the opening and closing part 61 that opens the opening 41k corresponds to the position of the opening and closing part 61 that communicates the processing housing 23 with the exhaust pipe 41. The position of the opening and closing part 61 that closes the opening 41k corresponds to the position of the opening and closing part 61 that blocks the processing housing 23 from the exhaust pipe 41.

Likewise, when the openings 62 and 63 open the openings 42k and 43k, respectively, the exhaust pipes 42 and 43 communicate with the processing housing 23, respectively. When the openings 62 and 63 close the openings 42k and 43k, respectively, the exhaust pipes 42 and 43 are blocked from the processing housing 23, respectively. In this way, the positions of the opening and closing portions 62 and 63 that open the openings 42k and 43k respectively correspond to the positions of the opening and closing portions 62 and 63 that communicate the processing housing 23 with the exhaust pipes 42-43. The positions of the opening and closing portions 62 and 63 that close the openings 42k and 43k respectively correspond to the positions of the opening and closing portions 62 and 63 that block the processing housing 23 from the exhaust pipes 42-43.

The opening and closing portions 61, 62, and 63 are movable independently of each other. For this reason, the exhaust pipes 41, 42, and 43 can individually communicate with the processing housing 23. The exhaust pipes 41, 42, 43 are individually separable from the processing housing 23.

The opening and closing portions 61, 62, and 63 have the following structure, for example. The opening and closing portion 61 has a substantially vertical plate shape. The opening/closing portion 61 is installed to be able to swing around the rotation axis A1. The rotation axis A1 is an imaginary line parallel to the vertical direction Z. The rotation axis A1 passes through the first end of the opening and closing portion 61. The opening/closing portion 61 swings around the rotation axis A1. The opening and closing parts 62 and 63 also have the same structure as the opening and closing part 61. The opening and closing portions 62 and 63 swing around the rotation axes A2 and A3, respectively.

The opening and closing portions 61, 62, and 63 are moved by a power source (for example, an electric motor), not shown. Here, the power source is not an element of the switching mechanism 51. The power source is an external element of the switching mechanism 51. The power source may be placed, for example, outside the conversion housing 53.

The opening and closing section 61 is an example of the first opening and closing section in the present invention. The opening and closing section 62 is an example of the second opening and closing section in the present invention.

As described above, the switching mechanism 51 is disposed at a position that does not overlap the holding portion 31 when viewed from the top. The position of the switching mechanism 51 when viewed from the plane will be described in detail.

Fig. 6 shows the virtual circle E3r with a dashed-dotted line. The virtual circle E3r is centered on the central point G. The radius of the virtual circle E3r is three times the radius of the substrate W. The switching mechanism 51 is disposed outside the virtual circle E3r when viewed from the top. That is, the distance from the center point G to the switching mechanism 51 is greater than three times the radius of the substrate W when viewed from a plan view.

Fig. 6 shows the virtual circle E5r with a dashed-dotted line. The virtual circle E5r is centered on the central point G. The radius of the virtual circle E5r is 5 times the radius of the substrate W. The switching mechanism 51 is disposed inside the virtual circle E5r when viewed from the top. That is, the distance from the center point G to the switching mechanism 51 is smaller than 5 times the radius of the substrate W when viewed from the top.

As described above, the switching mechanism 51 is disposed at approximately the same height as the processing housing 23. The height position of the switching mechanism 51 will be described in more detail.

See Figure 7. The switching mechanism 51 has an upper end (P1) and a lower end (Q1). The top (P1) and bottom (Q1) correspond to the top and bottom of the transition housing 53, respectively. The processing housing 23 has an upper end (P2) and a lower end (Q2). The upper end P2 corresponds to the upper surface of the upper plate 25e. The lower end Q2 corresponds to the lower surface of the bottom plate 25f. The upper end (P1) is placed at a position equal to or lower than the upper end (P2). Specifically, the upper end (P1) is placed at a lower position than the upper end (P2). The lower end (Q1) is placed at a position equal to or higher than the lower end (Q2). Specifically, the lower end Q1 is placed at a higher position than the lower end Q2.

The switching mechanism 51 is disposed at a position equal to or lower than the upper surface 31a of the holding portion 31. That is, the upper end P1 is disposed at a position equal to or lower than the upper surface 31a. Specifically, the upper end P1 is disposed at a lower position than the upper surface 31a. Here, the upper surface 31a of the holding part 31 is an example of the upper end of the holding part 31 in the present invention.

<Configuration of exhaust path>

Figure 9 is a schematic diagram of the exhaust path from the processing housing 23. The substrate processing apparatus 1 includes a pressure sensor 71A1. Pressure sensor 71A1 detects exhaust pressure. Specifically, the pressure sensor 71A1 measures the gas pressure on the primary side (upstream side) of the switching mechanism 51A1. The pressure sensor 71A1 measures the pressure of gas flowing into the switching mechanism 51A1 from the processing housing 23A1.

The substrate processing apparatus 1 is provided with a pressure adjustment mechanism 73A1. The pressure adjustment mechanism 73 adjusts the exhaust pressure. Specifically, the pressure adjustment mechanism 73A1 adjusts the pressure of the gas on the primary side of the switching mechanism 51A1. More specifically, the pressure adjustment mechanism 73A1 adjusts the pressure of the gas on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71A1.

Similarly, the substrate processing apparatus 1 is provided with pressure sensors 71A2-71A6, 71B1-71B6, 71C1-71C6, and 71D1-71D6. If pressure sensors 71A1-71A6, 71B1-71B6, 71C1-71C6, and 71D1-71D6 are not distinguished, they are called pressure sensors 71. Each pressure sensor 71 detects exhaust pressure. Each pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51.

The substrate processing apparatus 1 is provided with pressure adjustment mechanisms 73A2-73A6, 73B1-73B6, 73C1-73C6, and 73D1-73D6. If no distinction is made between the pressure adjustment mechanisms 73A1-73A6, 73B1-73B6, 73C1-73C6, and 73D1-73D6, they are referred to as the pressure adjustment mechanism 73. Each pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

The substrate processing apparatus 1 is provided with exhaust pipes 81A, 82A, and 83A. The exhaust pipe 81A is connected to the exhaust pipes 41A and 41B. The exhaust pipe 81A discharges the gas of the exhaust pipe 41A and the gas of the exhaust pipe 41B. The exhaust pipe 82A is connected to the exhaust pipes 42A and 42B. The exhaust pipe 82A discharges the gas of the exhaust pipe 42A and the gas of the exhaust pipe 42B. The exhaust pipe 83A is connected to the exhaust pipes 43A and 43B. The exhaust pipe 83A discharges the gas of the exhaust pipe 43A and the gas of the exhaust pipe 43B.

Similarly, the substrate processing apparatus 1 is provided with exhaust pipes 81B, 82B, and 83B. The connection relationship between the exhaust pipe 81B-83B and the exhaust pipes 41C-43C and 41D-43D is the same as that between the exhaust pipe 81A-83A and the exhaust pipes 41A-43A and 41B-43B.

The substrate processing apparatus 1 is provided with a pressure sensor 84A. The pressure sensor 84A detects exhaust pressure. Specifically, the pressure sensor 84A measures the pressure of the gas inside the exhaust pipe 81A.

The substrate processing apparatus 1 is provided with a pressure adjustment mechanism 87A. The pressure adjustment mechanism 87A adjusts the exhaust pressure. Specifically, the pressure adjustment mechanism 87A adjusts the pressure of the gas inside the exhaust pipe 81A. More specifically, the pressure adjustment mechanism 87A adjusts the pressure of the gas inside the exhaust pipe 81A based on the detection result of the pressure sensor 84A.

Similarly, the substrate processing apparatus 1 is provided with pressure sensors 85A, 86A, 84B, 85B, and 86B. Pressure sensors 85A-86A and 84B-86B respectively detect exhaust pressure. Pressure sensors 85A-86A and 84B-86B measure the pressure of gas inside the exhaust pipes 82A-83A and 81B-83B, respectively.

The substrate processing apparatus 1 is provided with pressure adjustment mechanisms 88A, 89A, 87B, 88B, and 89B. The pressure adjustment mechanisms 88A-89A and 87B-89B adjust the gas pressure inside the exhaust pipes 82A-83A and 81B-83B based on the detection results of the pressure sensors 85A-86A and 84B-86B, respectively. Adjust.

When no distinction is made between the exhaust pipes 81A and 81B, they are referred to as the exhaust pipe 81. When no distinction is made between the exhaust pipes 82A and 82B, they are referred to as the exhaust pipe 82. If the exhaust pipes 83A and 83B are not distinguished, they are called exhaust pipes 83. If pressure sensors 84A and 84B are not distinguished, they are called pressure sensors 84. If pressure sensors 85A and 85B are not distinguished, they are called pressure sensors 85. If pressure sensors 86A and 86B are not distinguished, they are called pressure sensors 86. When no distinction is made between the pressure adjustment mechanisms 87A and 87B, they are referred to as the pressure adjustment mechanism 87. When no distinction is made between the pressure adjustment mechanisms 88A and 88B, they are referred to as the pressure adjustment mechanism 88. When no distinction is made between the pressure adjustment mechanisms 89A and 89B, they are referred to as the pressure adjustment mechanism 89.

See Figure 6. The pressure sensor 71 is installed in the flow path between the processing housing 23 and the switching mechanism 51, for example. The pressure sensor 71 is installed, for example, inside the switching housing 53 (i.e., switching space 54). The pressure sensor 71 is installed in the introduction part 55, for example. The pressure sensor 71 is installed on the primary side of the distribution unit 56, for example. The pressure sensor 71 is installed, for example, on the primary side of the opening and closing portions 61-63.

The pressure adjustment mechanism 73 is installed in the flow path between the processing housing 23 and the switching mechanism 51, for example. The pressure adjustment mechanism 73 is installed, for example, inside the switching housing 53 (i.e., switching space 54). The pressure adjustment mechanism 73 is installed in the introduction part 55, for example. The pressure adjustment mechanism 73 is installed on the primary side of the distribution section 56, for example. The pressure adjustment mechanism 73 is installed, for example, on the primary side of the opening and closing portions 61-63. The pressure adjustment mechanism 73 is installed near the pressure sensor 71, for example. The pressure adjustment mechanism 73 is disposed on the secondary side (downstream side) of the pressure sensor 71, for example. The pressure adjustment mechanism 73 is disposed on the primary side of the pressure sensor 71, for example.

The pressure adjustment mechanism 73 may adjust the pressure of the gas, for example, by adjusting the flow rate of the gas. The pressure adjustment mechanism 73 is, for example, a damper or a fan.

7 omits illustration of the pressure sensor 71 and the pressure adjustment mechanism 73.

See Figures 3, 4, and 5. The exhaust pipes 81-83 are each disposed at a higher position than the processing housing 23. Each exhaust pipe 81 is connected to two exhaust pipes 41 at a position higher than the processing housing 23. Each exhaust pipe 82 is connected to two exhaust pipes 42 at a position higher than the processing housing 23. Each exhaust pipe 83 is connected to two exhaust pipes 43 at a position higher than the processing housing 23.

The exhaust pipes 41-43 each extend to a position higher than the processing housing 23. Gas flows upward inside the exhaust pipes 41-43. The exhaust pipes 41-43 each have a lower end. The lower ends of the exhaust pipes 41-43 are respectively blocked.

See Figure 3. Exhaust pipes 81A-83A are disposed above the processing housings 23A and 23B. Exhaust pipes 81A-83A are lined up in the width direction (Y). The exhaust pipes 81A-83A are arranged at the same height. Exhaust pipes 81B-83B are disposed above the processing housings 23C and 23D. Exhaust pipes 81B-83B are lined up in the width direction (Y). The exhaust pipes 81B-83B are arranged at the same height. The exhaust pipes 81B-83B are arranged at the same height as the exhaust pipes 81A-83A.

FIG. 10 is a plan view showing the upper part of the processing block 11. The exhaust pipes 81A-83A and 81B-83B extend in the front-back direction (X), respectively. The exhaust pipes 81A-83A have the same length. The exhaust pipes 81B-83B have the same length. The exhaust pipes 81B-83B are shorter than the exhaust pipes 81A-83A.

The exhaust pipes 81A, 82A, and 83A have front ends 81Af, 82Af, and 83Af, respectively. The exhaust pipes 81B, 82B, and 83B have front ends 81Bf, 82Bf, and 83Bf, respectively. The front ends 81Af-83Af are arranged ahead of the front ends 81Bf-83Bf. The front ends (81Af-83Af) are disposed rearward than the indexer portion (3).

The exhaust pipe 81 extends to a position rearward of the processing block 11 and is connected in communication with a first exhaust treatment facility (not shown). The first exhaust treatment facility recovers gas from the exhaust pipe 81. Similarly, the exhaust pipes 82 and 83 each extend to a position rearward of the processing block 11 and are connected in communication with second and third exhaust treatment facilities (not shown). The second and third exhaust treatment facilities recover gas from the exhaust pipes 82 and 83, respectively. The first to third exhaust treatment facilities are all external elements of the substrate processing apparatus 1. The first to third exhaust treatment facilities are installed, for example, in a factory where the substrate processing device 1 is installed.

The gas flows rearward in the exhaust pipes 81-83. The front ends (81Af-83Af, 81Bf-83Bf) correspond to the upstream ends of the exhaust pipes (81A-83A, 81B-83B), respectively.

The front ends 81Af-83Af and 81Bf-83Bf are open to the outside of the substrate processing apparatus 1. For example, the front ends 81Af-83Af and 81Bf-83Bf are open to the clean room where the substrate processing apparatus 1 is installed.

The pressure sensor 84 is installed in the exhaust pipe 81. The pressure sensor 84 is installed downstream from the connection position between the exhaust pipe 81 and the exhaust pipe 41. For example, the pressure sensor 84A is installed downstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure sensor 84A is installed rearward than the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B.

Likewise, pressure sensors 85 and 86 are installed in exhaust pipes 82 and 83, respectively.

The pressure adjustment mechanism 87 is installed in the exhaust pipe 81. The pressure adjustment mechanism 87 is installed upstream of the pressure sensor 84. The pressure adjustment mechanism 87 is installed upstream of the connection position between the exhaust pipe 81 and the exhaust pipe 41. For example, the pressure adjustment mechanism 87A is installed upstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure adjustment mechanism 87A is installed ahead of the connection position between the exhaust pipe 81A and the exhaust pipe 41A and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure adjustment mechanism 87A is installed at the front end 81Af of the exhaust pipe 81A. The pressure adjustment mechanism 87A adjusts the flow rate of gas flowing into the exhaust pipe 81A from the outside of the substrate processing apparatus 1 through the front end 81Af of the exhaust pipe 81A.

Likewise, the pressure adjustment mechanisms 88 and 89 are installed in the exhaust pipes 82 and 83, respectively.

The pressure adjustment mechanism 87-89 may adjust the pressure of the gas, for example, by adjusting the flow rate of the gas. The pressure adjustment mechanisms 87-89 are, for example, dampers or fans.

<Control of substrate processing device (1)>

See Figure 1. The substrate processing apparatus 1 includes a control unit 91 . The control unit 91 is installed in the indexer unit 3, for example. The control unit 91 controls the substrate processing apparatus 1.

FIG. 11 is a control block diagram of the substrate processing apparatus 1. The control unit 91 controls the conveyance mechanisms 6 and 16. Specifically, the control unit 91 controls the hand drive units 8 and 18. The control unit 91 controls the processing unit 21. Specifically, the control unit 91 controls the holding unit 31, the rotation driving unit 32, the liquid supply unit 33, the cup 38, and the dispensing unit 39. The control unit 91 controls the switching mechanism 51 . Specifically, the control unit 91 controls the opening and closing units 61-63. The control unit 91 acquires the detection results of the pressure sensors 71, 84, 85, and 86. The control unit 91 controls the pressure adjustment mechanisms 73, 87, 88, and 89. The control unit 91 is connected to enable communication with these elements.

The control unit 91 is realized by a central processing unit (CPU) that executes various processes, RAM (Random-Access Memory) that serves as a work area for computational processing, and a storage medium such as a fixed disk. A storage medium stores various information in advance. The storage medium stores, for example, information (processing recipe) that specifies operating conditions related to processing performed by each processing unit 21. The storage medium stores, for example, information specifying operating conditions related to switching to the exhaust path performed by the switching mechanism 51. The storage medium stores information specifying operating conditions for adjustment of exhaust pressure performed by the pressure adjustment mechanisms 73, 87-89.

Here, the processing housing 23A2 is an example of the second processing housing in the present invention. The holding portion 32 of the processing unit 21A2 is an example of the second holding portion in the present invention. The liquid supply unit 33 of the processing unit 21A2 is an example of the second liquid supply unit in the present invention. The switching mechanism 51A2 is an example of the second switching mechanism in the present invention.

Pressure sensor 71A1 is an example of the first pressure sensor in the present invention. Pressure sensor 71B1 is an example of the third pressure sensor in the present invention. The pressure adjustment mechanism 73A1 is an example of the first pressure adjustment mechanism in the present invention. The pressure adjustment mechanism 73B1 is an example of the third pressure adjustment mechanism in the present invention.

The exhaust pipe 81A is an example of the fifth exhaust pipe in the present invention. The exhaust pipe 82A is an example of the sixth exhaust pipe in the present invention. The pressure sensor 84A is an example of the fifth pressure sensor in the present invention. The pressure sensor 85A is an example of the sixth pressure sensor in the present invention. The pressure adjustment mechanism 87A is an example of the fifth pressure adjustment mechanism in the present invention. The pressure adjustment mechanism 88A is an example of the sixth pressure adjustment mechanism in the present invention.

<Example of operation of substrate processing device 1>

FIG. 12 is a flowchart showing the sequence of operations for performing processing on the substrate W. An example of operation related to one processing unit 21 will be described. It is assumed that the substrate W is already held by the holding portion 31. Each element operates according to control by the control unit 91.

<<Step S1>>

The liquid supply unit 33 supplies the first processing liquid. Specifically, the nozzle 34A moves from the retracted position to the processing position. The nozzle 34A supplies the first processing liquid to the substrate W held by the holding portion 31. The gas in the processing housing 23 contains components derived from the first processing liquid.

The switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 41 . Specifically, the switching mechanism 51 causes the processing housing 23 to communicate with the exhaust pipe 41 . Gas flows from the processing housing 23 through the diversion mechanism 51 to the exhaust pipe 41 . The exhaust pipe 41 discharges gas from the processing housing 23. Gas also flows from the exhaust pipe 41 to the exhaust pipe 81. The exhaust pipe 81 discharges gas from the exhaust pipe 41.

Additionally, when step S1 is being performed, at least one of the exhaust pipes 42 and 43 may exhaust gas from the other processing housing 23. The same applies to steps S2 and S3 described later.

The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

A more detailed operation of the pressure adjustment mechanism 73 is illustrated below. Also in steps S2 and S3 described later, the pressure adjustment mechanism 73 may perform the following operation examples. Each pressure adjustment mechanism 73 adjusts, for example, so that the exhaust pressure becomes constant. Each pressure adjustment mechanism 73 adjusts, for example, so that the detection result of the pressure sensor 71 becomes constant. The pressure adjustment mechanisms 73A1 and 73A2, for example, equalize the pressure of the gas on the primary side of the switching mechanism 51A1 and the pressure of the gas on the primary side of the switching mechanism 51A2. For example, the pressure adjustment mechanisms 73A1 to 73A6 equalize the pressure of the gas on the primary side of the switching mechanisms 51A1 to 51A6. The pressure adjustment mechanisms 73A1 and 73B1, for example, equalize the pressure of the gas on the primary side of the switching mechanism 51A1 and the pressure of the gas on the primary side of the switching mechanism 51B1. The pressure adjustment mechanisms 73A1, 73B1, 73C1, and 73D1, for example, equalize the pressure of the gas on the primary side of the switching mechanisms 51A1, 51B1, 51C1, and 51D1. For example, the pressure adjustment mechanism 73 equalizes the pressure of the gas on the primary side of each switching mechanism 51.

Pressure sensors 84-86 measure the gas pressure inside the exhaust pipes 81-83, respectively. The pressure adjustment mechanisms 87-89 adjust the gas pressure inside the exhaust pipes 81-83 based on the detection results of the pressure sensors 84-86, respectively.

A more detailed operation of the pressure adjustment mechanism 87-89 is illustrated below. Also, in steps S2 and S3 described later, the pressure adjustment mechanism 87-89 may perform the following operation examples. Each pressure adjustment mechanism 87-89 adjusts, for example, so that the exhaust pressure becomes constant. For example, the pressure adjustment mechanism 87A adjusts the detection result of the pressure sensor 84A so that it becomes constant. The pressure adjustment mechanisms 87A-89A, for example, equalize the pressure of the gas inside the exhaust pipe 81A, the pressure of the gas inside the exhaust pipe 82B, and the pressure of the gas inside the exhaust pipe 83A. . The pressure adjustment mechanisms 87A and 87B, for example, equalize the pressure of the gas inside the exhaust pipe 81A and the pressure of the gas inside the exhaust pipe 81B. The pressure adjustment mechanisms 87A-89A and 87B-89B, for example, equalize the pressure of the gas inside the exhaust pipes 81A-83A and 81B-83B.

<<Step S2>>

The liquid supply unit 33 supplies the second processing liquid. Specifically, the nozzle 34A moves from the processing position to the retracted position, and the nozzle 34B moves from the retracted position to the processing position. The nozzle 34B supplies the second processing liquid to the substrate W held by the holding portion 31. The gas in the processing housing 23 contains components derived from the second processing liquid.

The switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 42 . Specifically, the switching mechanism 51 causes the processing housing 23 to communicate with the exhaust pipe 42 . Gas flows from the processing housing 23 through the diversion mechanism 51 to the exhaust pipe 42 . The exhaust pipe 42 exhausts gas from the processing housing 23. Gas also flows from the exhaust pipe 42 to the exhaust pipe 82. The exhaust pipe 82 discharges gas from the exhaust pipe 42.

The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

Pressure sensors 84-86 measure the gas pressure inside the exhaust pipes 81-83, respectively. The pressure adjustment mechanisms 87-89 adjust the gas pressure inside the exhaust pipes 81-83 based on the detection results of the pressure sensors 84-86, respectively.

<<Step S3>>

The liquid supply unit 33 supplies the third processing liquid. Specifically, the nozzle 34B moves from the processing position to the retracted position, and the nozzle 34C moves from the retracted position to the processing position. The nozzle 34C supplies the third processing liquid to the substrate W held by the holding portion 31. The gas in the processing housing 23 contains components derived from the third processing liquid.

The switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 43 . Specifically, the switching mechanism 51 causes the processing housing 23 to communicate with the exhaust pipe 43 . Gas flows from the processing housing 23 through the diversion mechanism 51 to the exhaust pipe 43. The exhaust pipe 43 discharges gas from the processing housing 23. Gas also flows from the exhaust pipe 43 to the exhaust pipe 83. The exhaust pipe 83 discharges gas from the exhaust pipe 43.

The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

Pressure sensors 84-86 measure the gas pressure inside the exhaust pipes 81-83, respectively. The pressure adjustment mechanisms 87-89 adjust the gas pressure inside the exhaust pipes 81-83 based on the detection results of the pressure sensors 84-86, respectively.

<Effect of Embodiment>

As described above, according to the substrate processing apparatus 1, the switching mechanism 51 is disposed at approximately the same height as the processing housing 23. Therefore, the flow path between the switching mechanism 51 and the processing housing 23 can be appropriately shortened. As a result, gas can be properly discharged from the processing housing 23.

Additionally, the substrate processing apparatus 1 can achieve the following effects.

At least a portion of the switching mechanism 51 is disposed on the side of the processing housing 23 . For this reason, the overall height of the processing housing 23 and the switching mechanism 51 can be suppressed. For this reason, the height of the substrate processing device 1 can be kept low. Additionally, the number of processing housings 23 lined up in the vertical direction Z can be easily increased. In this way, the throughput of the substrate processing apparatus 1 can be appropriately improved while suppressing the enlargement of the substrate processing apparatus 1. Here, “height” is the length in the vertical direction (Z).

The upper end P1 of the switching mechanism 51 is equal to or lower than the upper end P2 of the processing housing 23. The lower end Q1 of the switching mechanism 51 is equal to or higher than the lower end Q2 of the processing housing 23. In this way, the entire switching mechanism 51 is disposed at a position equal to or lower than the upper end P2 and at a position equal to or higher than the lower end Q2. For this reason, the flow path between the switching mechanism 51 and the processing housing 23 can be appropriately shortened.

The switching housing 53 is disposed at a position equal to or lower than the upper surface 31a of the holding portion 31. For this reason, the size of the switching mechanism 51 is relatively small. Specifically, the height of the switching mechanism 51 is smaller than the height of the processing housing 23. Therefore, enlargement of the substrate processing apparatus 1 can be appropriately suppressed.

The switching mechanism 51 is disposed at a position that does not overlap the holding portion 31 when viewed from the top. For this reason, interference between the holding portion 31 and the switching mechanism 51 can be easily avoided.

The distance from the center point G to the switching mechanism 51 is greater than three times the radius of the substrate W when viewed from a plan view. That is, the switching mechanism 51 is disposed in an area where the distance from the center point G is larger than 3 times the radius of the substrate W when viewed from the top. Therefore, interference between the holding portion 31 and the switching mechanism 51 can be reliably avoided.

The distance from the center point G to the switching mechanism 51 is smaller than 5 times the radius of the substrate W when viewed from the top. That is, the switching mechanism 51 is disposed in an area where the distance from the center point G is smaller than 5 times the radius of the substrate W when viewed from the top. For this reason, the flow path between the switching mechanism 51 and the processing housing 23 can be effectively shortened. Additionally, the switching mechanism 51 is relatively small when viewed from the top. Therefore, an increase in the footprint of the substrate processing apparatus 1 can be appropriately suppressed.

The exhaust pipes 41-43 each extend in the vertical direction (Z). For this reason, the installation area of the exhaust pipes 41-43 when viewed from the top can be appropriately reduced. Therefore, an increase in the footprint of the substrate processing apparatus 1 can be appropriately suppressed.

The substrate processing apparatus 1 is provided with a first piping space 44 . For this reason, the exhaust pipes 41-43 can be installed appropriately.

The transport mechanism 16 transports the substrate W to the holding unit 31 . The conveyance mechanism 16 is installed in the conveyance space 12 . The transfer space 12 is adjacent to the processing housing 23 . Therefore, the transport mechanism 16 can easily transport the substrate W to the holding part 31 .

The substrate processing apparatus 1 is provided with a first piping space 44 . For this reason, the exhaust pipes 41-43 can be installed appropriately.

The first piping space 44 is adjacent to the processing housing 23 . For this reason, the exhaust pipes 41-43 can be installed near the processing housing 23.

The conveyance space 12 extends in the front-back direction (X). The processing housing 23 and the first piping space 44 are aligned in the front-back direction (X). For this reason, the transfer space 12 adjacent to the processing housing 23 and the first piping space 44 adjacent to the processing housing 23 can each be appropriately arranged. Therefore, it is possible to appropriately prevent the conveyance mechanism 16 from interfering with the exhaust pipes 41-43.

The first piping space 44 and the processing housing 23 are aligned in the front-back direction (X). The exhaust pipes 41-43 are lined up in the width direction (Y). For this reason, each of the exhaust pipes 41 to 43 can be installed near the processing housing 23.

At least a part of the switching mechanism 51 is installed in the first piping space 44 . For this reason, the switching mechanism 51 can be installed near the processing housing 23. Additionally, the switching mechanism 51 can be easily connected to the exhaust pipes 41-43.

The switching mechanism 51 includes opening and closing portions 61, 62, and 63. The opening and closing portion 61 is movable to a position that communicates the processing housing 23 to the exhaust pipe 41 and a position that blocks the processing housing 23 from the exhaust pipe 41 . The opening and closing portion 62 is movable to a position that communicates the processing housing 23 to the exhaust pipe 42 and a position that blocks the processing housing 23 from the exhaust pipe 42 . The opening and closing portion 63 is movable to a position that communicates the processing housing 23 to the exhaust pipe 43 and a position that blocks the processing housing 23 from the exhaust pipe 43 . The opening and closing portions 61, 62, and 63 are movable independently of each other. For this reason, the switching mechanism 51 can individually communicate the exhaust pipes 41 - 43 to the processing housing 23 . The diverting mechanism 51 can separate the exhaust pipes 41 - 43 from the processing housing 23 .

The switching mechanism 51 includes a switching housing 53 . The switching housing 53 is connected to the processing housing 23 . The transition housing 53 accommodates the opening and closing portions 61-63. For this reason, the switching housing 53 can appropriately form a flow path from the processing housing 23 to the opening and closing portions 61-63.

The switching housing 53 is connected to the processing housing 23 and the exhaust pipe 41 . For this reason, the switching housing 53 can appropriately form a flow path from the processing housing 23 to the exhaust pipe 41. Additionally, the switching housing 53 is connected to the exhaust pipes 42 and 43. For this reason, the switching housing 53 can appropriately form a flow path from the processing housing 23 to the exhaust pipes 42 and 43.

The opening and closing portions 61-63 are installed within one switching housing 53. For this reason, the flow path from the processing housing 23 to the opening and closing portions 61-63 can be further shortened.

The opening and closing sections 61-63 are installed in one switching space 54. For this reason, the opening and closing portions 61-63 can open and close the openings 41k-43k of the exhaust pipes 41-43 under the same conditions. Therefore, the conditions for discharging gas from the processing housing 23 can be easily made the same between the exhaust pipes 41-43. For example, uneven exhaust pressure between the exhaust pipes 41-43 can be suppressed. For example, uneven exhaust flow rate between the exhaust pipes 41-43 can be suppressed. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be appropriately improved.

The transition housing 53 has an introduction portion 55 . The introduction portion 55 is connected to the processing housing 23 . For this reason, gas can be easily introduced from the processing housing 23 to the conversion housing 53.

The introduction portion 55 extends in the front-back direction (X). As described above, the conveyance space 12 extends in the front-back direction (X). For this reason, the transfer space 12 adjacent to the processing housing 23 and the introduction portion 55 connected to the processing housing 23 can each be appropriately arranged. Therefore, it is possible to appropriately prevent the conveyance mechanism 16 from interfering with the introduction portion 55.

The transition housing 53 is provided with a distribution portion 56 . The distribution section 56 is connected to the introduction section 55. The distribution unit 56 is connected to the exhaust pipes 41-43. For this reason, gas can be easily discharged from the conversion housing 53 to the exhaust pipes 41-43.

The distribution unit 56 is connected to the exhaust pipes 41-43. The distribution section 56 accommodates the opening and closing sections 61-63. Accordingly, the switching mechanism 51 can easily switch the exhaust path of the processing housing 23 between the exhaust pipes 41 and 43.

The distribution portion 56 extends in the width direction (Y). As described above, the exhaust pipes 41-43 are lined up in the width direction (Y). In this way, the direction in which the distribution section 56 extends is parallel to the direction in which the exhaust pipes 41-43 are lined up. Therefore, the distribution section 56 can be easily connected to the exhaust pipes 41-43.

The introduction portion 55 is disposed at a position relatively close to the conveyance space 12. Specifically, when viewed from the top, the separation distance between the introduction portion 55 and the conveyance space 12 is smaller than the separation distance between the holding portion 31 and the conveyance space 12. For this reason, the introduction portion 55 can easily be prevented from interfering with members installed within the processing housing 23 (for example, base portions 37A-37C). Therefore, gas can be smoothly introduced from the processing housing 23 to the introduction portion 55. For example, the flow of gas entering the introduction portion 55 from the processing housing 23 can be appropriately prevented from being disturbed by a member provided within the processing housing 23.

The air supply pipe 48 supplies gas to the processing housing 23. The second piping space 46 accommodates the air supply pipe 48. The second piping space 46 is adjacent to the processing housing 23 . Therefore, the air supply pipe 48 can easily supply gas to the processing housing 23.

The first piping space 44A, the processing housing 23A, and the second piping space 46 are lined up in the front-back direction (X) in this order. For this reason, the first piping space 44 and the second piping space 46 are spaced apart by the processing housing 23 . Accordingly, the arrangement of the exhaust pipes 41-43 is not limited by the air supply pipe 48. In other words, the degree of freedom in arranging the exhaust pipes 41-43 can be appropriately increased. For example, the exhaust pipes 41-43 can be easily installed near the processing housing 23.

The description will be made by taking the processing housing 23A as an example. The substrate processing apparatus 1 includes a processing housing 23A2. The processing housing 23A2 is disposed below the processing housing 23A1. For this reason, the installation area of the processing housings 23A1 and 23A2 when viewed from the top can be appropriately reduced. Therefore, an increase in the footprint of the substrate processing apparatus 1 can be appropriately suppressed.

The substrate processing apparatus 1 is provided with a switching mechanism 51A2. The switching mechanism 51A2 switches the exhaust path of the processing housing 23A2 to one of the exhaust pipes 41A-43A. Accordingly, the exhaust pipes 41A-43A each exhaust the gas from the processing housing 23A2 in addition to the gas from the processing housing 23A1. Therefore, the structure of the substrate processing apparatus 1 can be simplified.

The switching mechanism 51A2 is disposed at approximately the same height as the processing housing 23A2. For this reason, the flow path between the processing housing 23A2 and the switching mechanism 51A2 can be appropriately shortened. As a result, gas can be properly discharged from the processing housing 23A2.

The processing housing 23A2 is disposed at the same position as the processing housing 23A1 when viewed from the top. The switching mechanism 51A2 is disposed at the same position as the switching mechanism 51A1 when viewed from the top. For this reason, the relative position of the processing housing 23A2 and the switching mechanism 51A2 is approximately the same as the relative position of the processing housing 23A1 and the switching mechanism 51A1. Accordingly, the flow path between the processing housing 23A2 and the switching mechanism 51A2 has the same length and the same shape as the flow path between the processing housing 23A1 and the switching mechanism 51A1. Therefore, the conditions for discharging gas can be easily made the same between the processing housings 23A1 and 23A2. For example, uneven exhaust pressure between the processing housings 23A1 and 23A2 can be suppressed. For example, uneven exhaust flow rate between the processing housings 23A1 and 23A2 can be suppressed. As a result, the quality of the processing performed on the substrate W can be suitably equalized between the processing housings 23A1 and 23A2.

The switching mechanism 51A2 is disposed at the same position as the switching mechanism 51A1 when viewed from the top. The exhaust pipe 41A extends in the vertical direction Z. Therefore, the switching mechanisms 51A1 and 51A2 can each be easily connected to the exhaust pipe 41A. Likewise, the exhaust pipes 42A and 43A each extend in the vertical direction Z. Therefore, the switching mechanisms 51A1 and 51A2 can be easily connected to the exhaust pipes 42A and 43A, respectively.

Similarly, the substrate processing apparatus 1 includes processing housings 23A3-23A6. The processing housings 23A3-23A6 are each disposed below the processing housing 23A1. Accordingly, an increase in the footprint of the substrate processing apparatus 1 can be further appropriately suppressed.

The substrate processing apparatus 1 is provided with switching mechanisms 51A3-51A6. The switching mechanisms 51A3 - 51A6 respectively switch the exhaust path of the processing housings 23A3 - 23A6 to one of the exhaust pipes 41A - 43A. Accordingly, exhaust pipes 41A-43A exhaust gases from processing housings 23A1-23A6, respectively. Therefore, the structure of the substrate processing apparatus 1 can be further simplified.

The processing housings 23A3-23A6 are disposed at the same position as the processing housing 23A1 when viewed from the top. The switching mechanisms 51A3 - 51A6 are each disposed at the same position as the switching mechanism 51A1 when viewed from the top. For this reason, the relative positions of the processing housings 23A3-23A6 and the switching mechanisms 51A3-51A6 are approximately the same as the relative positions of the processing housing 23A1 and the switching mechanisms 51A1. As a result, the quality of the processing performed on the substrate W can be suitably equalized between the processing housings 23A1 - 23A6.

The switching mechanisms 51A3 - 51A6 are each disposed at the same position as the switching mechanism 51A1 when viewed from the top. The exhaust pipes 41A-43A each extend in the vertical direction (Z). Accordingly, the switching mechanisms 51A3-51A6 can be easily connected to the exhaust pipes 41A-43A, respectively.

The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure of the gas on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71. For this reason, the pressure on the primary side of the switching mechanism 51 can be adjusted appropriately. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be appropriately improved.

The pressure adjustment mechanism 73 adjusts the exhaust pressure so that it becomes constant, for example. As a result, it is possible to suppress fluctuations in the exhaust pressure when processing the substrate W within the processing housing 23. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be appropriately improved.

The pressure adjustment mechanisms 73A1 and 73A2, for example, equalize the pressure of the gas on the primary side of the switching mechanism 51A1 and the pressure of the gas on the primary side of the switching mechanism 51A2. As a result, the exhaust pressure when processing the substrate W in the processing housing 23A1 and the exhaust pressure when processing the substrate W in the processing housing 23A2 can be suitably equalized. there is. Therefore, the quality of the processing performed on the substrate W can be suitably equalized between the processing housings 23A1 and 23A2 arranged in the vertical direction Z.

For example, the pressure adjustment mechanisms 73A1 to 73A6 equalize the gas pressures on the primary side of the switching mechanisms 51A1 to 51A6. As a result, the quality of the processing performed on the substrate W can be suitably equalized between all the processing housings 23A1 to 23A6 arranged in the vertical direction Z.

The pressure adjustment mechanisms 73A1 and 73B1, for example, equalize the pressure of the gas on the primary side of the switching mechanism 51A1 and the pressure of the gas on the primary side of the switching mechanism 51B1. As a result, the quality of the processing performed on the substrate W can be suitably equalized between the processing housings 23A1 and 23B1 disposed at the same height.

The pressure adjustment mechanisms 73A1, 73B1, 73C1, and 73D1, for example, equalize the pressure of the gas on the primary side of the switching mechanisms 51A1, 51B1, 51C1, and 51D1. As a result, the quality of the processing performed on the substrate W can be suitably equalized among all the processing housings 23A1, 23B1, 23C1, and 23D1 arranged at the same height.

For example, the pressure adjustment mechanism 73 equalizes the pressure of the gas on the primary side of each switching mechanism 51. As a result, the quality of the processing performed on the substrate W can be suitably equalized among all processing housings 23.

The exhaust pipe 81A is connected to the exhaust pipes 41A and 41B. The exhaust pipe 81A discharges gas from the exhaust pipes 41A and 41B. In this way, the two exhaust pipes 41A and 41B are integrated into one exhaust pipe 81A. For this reason, the structure of the substrate processing apparatus 1 can be simplified.

Similarly, the exhaust pipe 82A is connected to the exhaust pipes 42A and 42B. The exhaust pipe 82A discharges gas from the exhaust pipes 42A and 42B. The exhaust pipe 83A is connected to the exhaust pipes 43A and 43B. The exhaust pipe 83A discharges gas from the exhaust pipes 43A and 43B. For this reason, the structure of the substrate processing apparatus 1 can be further simplified.

The pressure sensor 84 measures the pressure of the gas inside the exhaust pipe 81. The pressure adjustment mechanism 87 adjusts the pressure of the gas inside the exhaust pipe 81 based on the detection result of the pressure sensor 84. For this reason, the pressure inside the exhaust pipe 81 can be adjusted appropriately. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be further improved appropriately.

Similarly, the pressure sensors 85 and 86 measure the pressure of the gas inside the exhaust pipes 82 and 83. The pressure adjustment mechanisms 88 and 89 adjust the pressure of the gas inside the exhaust pipes 82 and 83 based on the detection results of the pressure sensors 85 and 86. For this reason, the pressure inside the exhaust pipes 82 and 83 can be adjusted appropriately. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be appropriately improved.

This will be explained using the exhaust pipe 81A as an example. The pressure sensor 84A is installed downstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. At the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and at a position downstream from the connection position between the exhaust pipe 81A and the exhaust pipe 41B, both the gas from the exhaust pipe 41A and the gas from the exhaust pipe 41B Everything flows. Therefore, the pressure sensor 84A can appropriately detect the entire exhaust pressure of the exhaust pipes 41A and 41B.

Similarly, the pressure sensor 85A is installed downstream of the connection position between the exhaust pipe 82A and the exhaust pipe 42A, and the connection position between the exhaust pipe 82A and the exhaust pipe 42B. Therefore, the pressure sensor 85A can appropriately detect the entire exhaust pressure of the exhaust pipes 42A and 42B. The pressure sensor 86A is installed at a position downstream from the connection position between the exhaust pipe 83A and the exhaust pipe 43A, and the connection position between the exhaust pipe 83A and the exhaust pipe 43B. Therefore, the pressure sensor 86A can appropriately detect the entire exhaust pressure of the exhaust pipes 43A and 43B.

For example, the pressure adjustment mechanism 87 adjusts the exhaust pressure so that it becomes constant. Similarly, the pressure adjustment mechanisms 88 and 89 adjust the exhaust pressure so that it becomes constant. As a result, it is possible to suppress fluctuations in the exhaust pressure when processing the substrate W within the processing housing 23. Accordingly, the quality of processing performed on the substrate W within the processing housing 23 can be appropriately improved.

The pressure adjustment mechanisms 87A-89A equalize, for example, the pressure of the gas inside the exhaust pipe 81A, the pressure of the gas inside the exhaust pipe 82A, and the pressure of the gas inside the exhaust pipe 83A. Thereby, the exhaust pressure can be suitably equalized between the exhaust pipes 41A-43A and 41B-43B. Therefore, when the exhaust path of the processing housings 23A and 23B is switched, it is possible to suppress the exhaust pressure from fluctuating. Accordingly, the quality of processing performed on the substrate W within the processing housings 23A and 23B can be appropriately improved.

The pressure adjustment mechanisms 87A and 87B, for example, equalize the pressure of the gas inside the exhaust pipe 81A and the pressure of the gas inside the exhaust pipe 81B. Accordingly, even if the exhaust pipes 81A and 81B have different lengths, uneven exhaust pressure between the exhaust pipes 81A and 81B can be suppressed. Therefore, the exhaust pressure can be made equal between the exhaust pipes 41A and 41B and the exhaust pipes 41C and 41D. Therefore, the quality of the processing performed on the substrate W can be suitably equalized between the processing housings 23A and 23B and the processing housings 23C and 23D.

The pressure adjustment mechanisms 87A-89A and 87B-89B, for example, equalize the pressure of the gas inside the exhaust pipes 81A-83A and 81B-83B. Accordingly, even if the exhaust pipes 81A-83A and 81B-83B have different lengths, uneven exhaust pressure between the exhaust pipes 81A-83A and 81B-83B can be suppressed. Therefore, the exhaust pressure can be made the same between the exhaust pipes 41A-43A, 41B-43B, 41C-43C, and 41D-43D. Accordingly, the quality of the processing performed on the substrate W can be more appropriately equalized between the processing housings 23A, 23B, 23C, and 23D.

The liquid supply unit 33 is capable of supplying the first processing liquid, the second processing liquid, and the third processing liquid. The liquid supply unit 33 switches the supplied processing liquid between the first processing liquid, the second processing liquid, and the third processing liquid. As the processing liquid used in the processing housing 23 is switched, the switching mechanism 51 switches the exhaust path of the processing housing 23 between the exhaust pipes 41 and 43. When the liquid supply unit 33 supplies the first processing liquid, the switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 41 . When the liquid supply unit 33 supplies the second processing liquid, the switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 42 . When the liquid supply unit 33 supplies the third processing liquid, the switching mechanism 51 switches the exhaust path of the processing housing 23 to the exhaust pipe 43. As a result, when the liquid supply unit 33 supplies the first processing liquid, the exhaust pipe 41 exhausts the gas in the processing housing 23. When the liquid supply unit 33 supplies the second processing liquid or the third processing liquid, the exhaust pipe 41 does not exhaust the gas in the processing housing 23. Therefore, contamination of the inside of the exhaust pipe 41 can be appropriately suppressed. For the same reason, contamination of the interior of the exhaust pipes 42 and 43 can also be appropriately suppressed. Therefore, the gas flows smoothly through the exhaust pipes 41-43. As a result, the gas in the processing housing 23 can be discharged more appropriately.

Additionally, contamination of the interior of the exhaust pipes 81-83 can be appropriately suppressed. Therefore, the gas flows smoothly through the exhaust pipes 81-83. As a result, the gas in the processing housing 23 can be discharged more appropriately.

The present invention is not limited to the embodiments and can be modified and implemented as follows.

In the embodiment, the switching mechanism 51 switches the gas exhaust path of the processing housing 23 to one of the exhaust pipes 41-43. That is, the switching mechanism 51 switches between the three exhaust pipes (specifically, the exhaust pipes 41-43). However, it is not limited to this. The switching mechanism 51 may switch between the two exhaust pipes. For example, the exhaust pipe 43 may be omitted. In this case, the switching mechanism 51 switches the exhaust path of the processing housing 23 to one of the exhaust pipes 41 and 42. The switching mechanism 51 switches the exhaust path of the processing housing 23 between the exhaust pipes 41 and 42. The switching mechanism 51 may switch between four or more exhaust pipes. For example, the substrate processing apparatus 1 may be provided with additional exhaust pipes in addition to the exhaust pipes 41-43. In this case, the switching mechanism 51 switches the exhaust path of the processing housing 23 to one of the exhaust pipes 41-43 and the additional exhaust pipe. The switching mechanism 51 switches the exhaust path of the processing housing 23 between the exhaust pipes 41-43 and the additional exhaust pipe.

In the embodiment, the exhaust pipes 41-43 are disposed between the processing housing 23 and the distribution unit 56 when viewed in plan. However, it is not limited to this. The distribution section 56 may be disposed between the exhaust pipes 41 - 43 and the processing housing 23 when viewed in plan.

Fig. 13 is a top view of the processing unit 21 in a modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

The substrate processing apparatus 1 is provided with a switching mechanism 101 . The switching mechanism 101 includes a switching housing 103. The transition housing 103 is provided with a distribution portion 106. The distribution unit 106 is installed outside the processing housing 23. The distribution unit 106 is installed in the first piping space 44 . The distribution portion 106 is in contact with the processing housing 23 . The distribution portion 106 is disposed between the processing housing 23 and the exhaust pipes 41-43 when viewed in plan. Specifically, the distribution portion 106 is in contact with the side wall 25b of the processing housing 23. The distribution section 106 is disposed between the side wall 25b and the exhaust pipes 41-43.

In the embodiment, a part of the switching mechanism 51 (for example, the first end 55a) is disposed inside the processing housing 23. However, it is not limited to this. The entire switching mechanism 51 may be disposed outside the processing housing 23 . Likewise, in the embodiment, a portion of the transition housing 53 (for example, the first end 55a) is disposed inside the processing housing 23. However, it is not limited to this. The entire switching housing 53 may be disposed outside the processing housing 23 .

See Figure 13. The switching mechanism 101 has an introduction portion 105. The introduction portion 105 extends in the front-back direction (X). The introduction portion 105 has a first end 105a and a second end 105b. The first stage 105a corresponds to the upstream end of the switching space 54. The first end 105a is disposed on the side wall 25b of the processing housing 23. The first end 105a is connected to the side wall 25b of the processing housing 23. The first stage 105a is not disposed inside the processing housing 23. The second stage 105b is installed outside the processing housing 23. For this reason, the entire introduction portion 105 is installed outside the processing housing 23. As a result, the entire transition housing 103 is installed outside the processing housing 23. The entire switching mechanism 101 is installed outside the processing housing 23. Here, the outside of the processing housing 23 is specifically the first piping space 44.

In the embodiment, a part of the switching mechanism 51 (for example, the first end 55a) is installed inside the processing housing 23. However, it is not limited to this. The entire switching mechanism 51 may be installed inside the processing housing 23 . Likewise, in the embodiment, a portion of the transition housing 53 is disposed inside the processing housing 23 . However, it is not limited to this. The entire switching housing 53 may be disposed inside the processing housing 23 . In the embodiment, the opening and closing portions 61-63 are disposed outside the processing housing 23. However, it is not limited to this. The opening and closing portions 61-63 may be disposed inside the processing housing 23.

Fig. 14 is a top view of the processing unit 21 in a modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted. FIG. 14 briefly shows the liquid supply unit 33 for convenience.

The exhaust pipes 41-43 are installed in the first piping space 44. The openings k1-k3 of the exhaust pipes 41-43 each contact the processing housing 23 (specifically, the side wall 25b).

The substrate processing apparatus 1 is provided with a switching mechanism 111 . The switching mechanism 111 includes opening and closing portions 113, 114, and 115. The opening and closing portions 113-115 are each installed inside the processing housing 23. The opening and closing portions 113-115 are each installed near the side wall 25b. The opening and closing portions 113 to 115 are respectively disposed at positions opposite to the openings 41k to 43k.

Each of the opening and closing portions 113-115 has the same structure as the opening and closing portions 61-63. The opening and closing portion 113 is movable to a position that communicates the processing housing 23 to the exhaust pipe 41 and a position that blocks the processing housing 23 from the exhaust pipe 41 . The opening and closing portion 114 is movable to a position that communicates the processing housing 23 to the exhaust pipe 42 and a position that blocks the processing housing 23 from the exhaust pipe 42 . The opening and closing portion 115 is movable to a position that communicates the processing housing 23 to the exhaust pipe 43 and a position that blocks the processing housing 23 from the exhaust pipe 43 .

In this way, the entire switching mechanism 111 is installed inside the processing housing 23.

In the modified embodiment shown in FIG. 14, the switching mechanism 111 may be provided with a switching housing or may not be provided with a switching housing. When the switching mechanism 111 has a switching housing, the entire switching housing of the switching mechanism 111 may be installed inside the processing housing 23 .

In an embodiment, the switching mechanism 51 has a switching housing 53 . However, it is not limited to this. As illustrated in the modified embodiment of Fig. 14, the transition housing 53 may be appropriately omitted.

In the embodiment, the transition housing 53 is not connected to the cup 38. However, it is not limited to this. The conversion housing 53 may be connected to the cup 38. The transition housing 53 may form a flow path from the inside of the cup 38 to the exhaust pipes 41-43.

In the embodiment, when the opening and closing portion 61 is in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening and closing portion 61 does not block the processing housing 23 from the exhaust pipes 42 and 43. However, it is not limited to this. When the opening and closing portion 61 is in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening and closing portion 61 may block the processing housing 23 from the exhaust pipes 42 and 43. Likewise, in the embodiment, when the opening and closing portion 62 is in a position to communicate the processing housing 23 to the exhaust pipe 42, the opening and closing portion 62 does not block the processing housing 23 from the exhaust pipe 43. However, it is not limited to this. When the opening/closing portion 62 is in a position to communicate the processing housing 23 to the exhaust pipe 42, the opening/closing portion 62 may block the processing housing 23 from the exhaust pipe 43.

Fig. 15 is a top view of the processing unit 21 in a modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

The substrate processing apparatus 1 is provided with a switching mechanism 121 . The switching mechanism 121 includes opening and closing portions 123 and 124. The opening and closing portions 123 and 124 are installed inside the switching housing 53. That is, the opening and closing portions 123 and 124 are installed in the switching space 54 . The opening and closing portions 123 and 124 are disposed at positions opposite to the openings 41k and 42k, respectively. The opening and closing portion 123 opens and closes the opening 41k. The opening/closing portion 124 opens and closes the opening 42k. Additionally, the switching mechanism 121 is not provided with a member corresponding to the opening/closing portion 63.

Gas flows in one direction through the switching space 54. Gas flows from the introduction part 55 to the distribution part 56. The openings 41k, 42k, and 43k each communicate with the transition space 54. The position where the opening 42k communicates with the switching space 54 is downstream from the position where the opening 41k communicates with the switching space 54. The position where the opening 43k communicates with the switching space 54 is downstream from the position where the opening 42k communicates with the switching space 54.

Here, the transition space 54 is divided into a first area 126, a second area 127, and a third area 128 by virtual boundaries B1 and B2. Figure 15 illustrates the positions of boundaries B1 and B2 with dashed and dotted lines. The boundary B1 is located downstream from the position where the opening 41k communicates with the switching space 54, and is located upstream from the position where the opening 42k communicates with the switching space 54. The boundary B2 is located downstream from the position where the opening 42k communicates with the switching space 54, and is located upstream from the position where the opening 43k communicates with the switching space 54. The first zone 126 is a portion of the transition space 54 located upstream of the boundary B1. The second zone 127 is a portion of the transition space 54 located downstream from the boundary B1 and upstream from the boundary B2. The third zone 128 is a portion of the transition space 54 located downstream from the boundary B2.

The opening and closing portion 123 is movable to a position that communicates the processing housing 23 to the exhaust pipe 41 and a position that blocks the processing housing 23 from the exhaust pipe 41 . FIG. 15 shows the opening and closing portion 123 at a position where the processing housing 23 communicates with the exhaust pipe 41 with a solid line. FIG. 15 shows the opening and closing portion 123 in a position to block the processing housing 23 from the exhaust pipe 41 with a broken line.

When the opening/closing portion 123 is in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening/closing portion 123, in addition to opening the opening 41k, opens the first zone 126 to the second zone ( 127). That is, when the opening and closing unit 123 connects the processing housing 23 to the exhaust pipe 41, the opening and closing unit 123 blocks the processing housing 23 from the exhaust pipes 42 and 43. When the opening/closing portion 123 is in a position to block the processing housing 23 from the exhaust pipe 41, the opening/closing portion 123, in addition to blocking the opening 41k, opens the first zone 126 to the second zone ( 127). That is, when the opening and closing unit 123 blocks the processing housing 23 from the exhaust pipe 41, the opening and closing unit 123 does not block the processing housing 23 from the exhaust pipes 42 and 43.

The opening and closing portion 124 is movable to a position that communicates the processing housing 23 to the exhaust pipe 42 and a position that blocks the processing housing 23 from the exhaust pipe 42 . FIG. 15 shows the opening/closing portion 124 at a position that communicates the processing housing 23 to the exhaust pipe 42 with a solid line. FIG. 15 shows the opening and closing portion 124 in a position to block the processing housing 23 from the exhaust pipe 42 with a broken line.

When the opening/closing portion 124 is in a position to communicate the processing housing 23 to the exhaust pipe 42, the opening/closing portion 124, in addition to opening the opening 42k, opens the second zone 127 into the third zone ( 128). That is, when the opening and closing unit 124 connects the processing housing 23 to the exhaust pipe 42, the opening and closing unit 124 blocks the processing housing 23 from the exhaust pipe 43. When the opening/closing portion 124 is in a position to block the processing housing 23 from the exhaust pipe 42, the opening/closing portion 124, in addition to blocking the opening 42k, opens the second zone 127 to the third zone ( 128). That is, when the opening/closing unit 124 blocks the processing housing 23 from the exhaust pipe 42, the opening/closing unit 124 does not block the processing housing 23 from the exhaust pipe 43.

When the switching mechanism 121 switches the exhaust path of the processing housing 23 to the exhaust pipe 41, the opening/closing portion 123 moves to a position that causes the processing housing 23 to communicate with the exhaust pipe 41. The opening and closing portion 124 may be moved to either a position that communicates the processing housing 23 to the exhaust pipe 42 or a position that blocks the processing housing 23 from the exhaust pipe 42 . In other words, the opening/closing portion 124 may open the opening 42k or may close the opening 42k.

When the switching mechanism 121 switches the exhaust path of the processing housing 23 to the exhaust pipe 42, the opening and closing portion 123 moves to a position that blocks the processing housing 23 from the exhaust pipe 41. The opening/closing portion 124 moves to a position that allows the processing housing 23 to communicate with the exhaust pipe 42 .

When the switching mechanism 121 switches the exhaust path of the processing housing 23 to the exhaust pipe 43, the opening and closing portion 123 moves to a position that blocks the processing housing 23 from the exhaust pipe 41. The opening/closing portion 124 moves to a position that blocks the processing housing 23 from the exhaust pipe 42 .

According to this modified embodiment, the member corresponding to the opening and closing portion 63 can be omitted. That is, the number of openings and closing portions 123 and 124 is sufficient to be at least one greater than the number of exhaust pipes 41-43. Therefore, the structure of the switching mechanism 121 can be simplified.

When the switching mechanism 121 switches the exhaust path of the processing housing 23 to the exhaust pipe 41, the gas can be prevented from flowing into the second zone 127 and the third zone 128, and the gas can be prevented from flowing into the second zone 127 and the third zone 128. Residence in the second zone 127 and the third zone 128 can be appropriately prevented. Accordingly, the gas in the processing housing 23 can be discharged more appropriately.

When the switching mechanism 121 switches the exhaust path of the processing housing 23 to the exhaust pipe 42, the gas can be prevented from flowing into the third zone 128, and the gas stays in the third zone 128. This can be appropriately prevented. Accordingly, the gas in the processing housing 23 can be discharged more appropriately.

In the embodiment, the rotation axis A1 of the opening and closing section 61 passes through the first end of the opening and closing section 61. However, it is not limited to this. The position of the rotation axis A1 of the opening and closing portion 61 can be appropriately changed.

Figure 16 is a top view of the processing unit 21 in a modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

The substrate processing apparatus 1 is provided with a switching mechanism 131 . The switching mechanism 131 includes opening and closing portions 133 and 134. The opening and closing portions 133 and 134 are installed inside the switching housing 53. The opening and closing portions 133 and 134 are disposed at positions opposite to the openings 41k and 42k, respectively. The opening/closing portion 133 opens and closes the opening 41k. The opening and closing portion 134 opens and closes the opening 42k. Additionally, the switching mechanism 131 does not include a member corresponding to the opening/closing portion 63.

The opening/closing portion 133 has an approximately T-shape when viewed from the top. The opening and closing portion 133 includes a plate portion 133a and a base portion 133b. The plate 133a has a substantially vertical plate shape. The base 133b is connected to the central part of the plate portion 133a when viewed from the top. The base 133b protrudes from the plate portion 133a in the horizontal direction. The opening/closing portion 133 swings around the rotation axis A4. The rotation axis A4 is an imaginary line parallel to the vertical direction Z. The rotation axis A4 passes through the base 133b. The rotation axis A4 does not pass through the plate portion 133a. The opening/closing portion 133 swings around the rotation axis A4.

The opening/closing unit 134 has the same structure as the opening/closing unit 133. That is, the opening and closing portion 134 includes a plate portion 134a and a base portion 134b. The opening/closing portion 134 swings around the rotation axis A5.

The opening and closing portion 133 is movable to a position that communicates the processing housing 23 to the exhaust pipe 41 and a position that blocks the processing housing 23 from the exhaust pipe 41 . FIG. 16 shows the opening and closing portion 133 at a position where the processing housing 23 communicates with the exhaust pipe 41 with a solid line. FIG. 16 shows the opening and closing portion 133 in a position to block the processing housing 23 from the exhaust pipe 41 with a broken line.

The opening and closing portion 134 is movable to a position that communicates the processing housing 23 to the exhaust pipe 42 and a position that blocks the processing housing 23 from the exhaust pipe 42 . FIG. 16 shows the opening/closing portion 134 at a position that communicates the processing housing 23 to the exhaust pipe 42 with a broken line. FIG. 16 shows the opening and closing portion 134 in a position to block the processing housing 23 from the exhaust pipe 42 with a solid line.

The opening and closing sections 133 and 134 have the same function as the opening and closing sections 123 and 124 shown in FIG. 15 . For example, when the opening and closing portion 133 is in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening and closing portion 133 blocks the processing housing 23 from the exhaust pipes 42 and 43. When the opening/closing portion 134 is in a position to communicate the processing housing 23 to the exhaust pipe 42, the opening/closing portion 134 blocks the processing housing 23 from the exhaust pipe 43.

In the embodiment, the liquid supply unit 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid. That is, the number of types of processing liquid that the liquid supply unit 33 can supply is three. However, it is not limited to this. The number of types of processing liquid that the liquid supply unit 33 can supply may be less than three. The number of types of processing liquid that the liquid supply unit 33 can supply may be more than three.

For example, the liquid supply unit 33 may be capable of supplying the fourth processing liquid. The fourth treatment liquid is classified as a rinse liquid, for example. The fourth treatment liquid includes, for example, at least one of pure water, carbonated water, electrolyzed ion water, hydrogen water, ozone water, and diluted hydrochloric acid water.

In an embodiment, the processing unit 21 may further include a processing gas supply unit. The processing gas supply unit is installed inside the processing housing 23. The processing gas supply unit supplies processing gas to the substrate W held by the holding unit 31 . The processing gas supply unit supplies at least one type of processing gas. The processing gas is, for example, a gas other than clean air.

When the processing unit 21 includes a processing gas supply unit, the switching mechanism 51 may operate as follows. In response to switching between use and non-use of the processing gas in the processing housing 23, the switching mechanism 51 may switch the exhaust path of the processing housing 23. When switching the processing gas used in the processing housing 23 between a plurality of types of processing gas, the switching mechanism 51 switches the exhaust path of the processing housing 23 according to the type of processing gas. You can do it. In response to switching between supply of processing liquid and supply of processing gas, the switching mechanism 51 may switch the exhaust path of the processing housing 23 .

In the embodiment, the liquid supply unit 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid to the substrate W held by the holding unit 31 in this order. However, it is not limited to this. The order in which the first processing liquid, second processing liquid, and third processing liquid are supplied may be changed as appropriate.

In the embodiment, the number of processing housings 23 installed at approximately the same height position is four. However, it is not limited to this. The number of processing housings 23 installed at approximately the same height may be less than four or more than four. In the above-described embodiment, the number of processing housings 23 lined up in the vertical direction Z is six. However, it is not limited to this. The number of processing housings 23 lined up in the vertical direction Z may be less than 6 or more than 6.

In the embodiment, the substrate processing apparatus 1 is provided with two transport spaces 12A and 12B. That is, the number of conveyance spaces 12 is two. However, it is not limited to this. For example, the number of conveyance spaces 12 may be one. For example, the conveyance space 12B may be omitted. For example, the number of conveyance spaces 12 may be three or more.

In the embodiment, the number of conveyance mechanisms 16 installed in one conveyance space 12 is one. However, it is not limited to this. For example, the number of conveyance mechanisms 16 installed in one conveyance space 12 may be two or more.

In the embodiment, the first piping space 44A is disposed in front of the processing housing 23A. The second piping space 46A is disposed behind the processing housing 23A. However, it is not limited to this. The relative positions of the processing housing 23A and the first piping space 44A and the second piping space 46A may be changed as appropriate.

FIG. 17 is a plan view showing the inside of the substrate processing apparatus 141 in the modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

In the substrate processing apparatus 141, the first piping space 44A is disposed behind the processing housing 23A. The second piping space 46A is disposed in front of the processing housing 23A.

Additionally, in the substrate processing apparatus 141, the first piping space 44B is disposed behind the processing housing 23B. The second piping space 46B is disposed in front of the processing housing 23B. The first piping space 44C is disposed in front of the processing housing 23C. The second piping space 46C is disposed behind the processing housing 23C. The first piping space 44D is disposed in front of the processing housing 23D. The second piping space 46D is disposed behind the processing housing 23D.

Also in the substrate processing apparatus 141, the relative positions of the processing housing 23B, the first piping space 44B, and the second piping space 46B are the same as those of the processing housing 23A and the first piping space 44A. 2 Same as the relative position of the piping space (46A). The relative positions of the processing housing 23C, the first piping space 44C, and the second piping space 46C are the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. It's the same. The relative positions of the processing housing 23D, the first piping space 44D, and the second piping space 46D are the relative positions of the processing housing 23A, the first piping space 44A, and the second piping space 46A. It's the same.

In the embodiment, the exhaust pipes 41A-43A are disposed in front of the processing housing 23A. However, it is not limited to this.

See Figure 17. In the substrate processing apparatus 141, the exhaust pipes 41A-43A are disposed behind the processing housing 23A.

Additionally, in the substrate processing apparatus 141, the exhaust pipes 41B-43B are disposed behind the processing housing 23B. Exhaust pipes 41C-43C are disposed in front of the processing housing 23C. The exhaust pipes 41D-43D are disposed in front of the processing housing 23D.

In the embodiment, the structure of the conveyance mechanism 6 of the indexer unit 3 is exemplified. However, it is not limited to this. The structure of the conveyance mechanism 6 may be changed appropriately.

See Figure 17. The indexer unit 3 is provided with a conveyance mechanism 146. The conveyance mechanism 146 includes a hand 147 and a hand drive unit 148. The hand 147 holds one board W in a horizontal position. The hand drive unit 148 is connected to the hand 147. The hand drive unit 148 moves the hand 147. The hand drive unit 148 moves the hand 147 in the front-back direction (X), the width direction (Y), and the vertical direction (Z).

The hand drive unit 148 includes a first drive unit 148a and a second drive unit 148b. The second driving unit 148b is supported by the first driving unit 148a. The first drive unit 148a moves the second drive unit 148b in the vertical direction (Z). The first driving unit 148a further rotates the second driving unit 148b around a rotation axis parallel to the vertical direction Z. However, the first driver 148a does not move the second driver 148b in the horizontal direction. The first driving unit 148a itself cannot move in the horizontal direction. The second driving unit 148b moves in the horizontal direction with respect to the first driving unit 148a. The second drive unit 148b is composed of, for example, a multi-joint arm. The second drive unit 148b is connected to the hand 147. Since the hand drive unit 148 has this configuration, the hand 147 can move in parallel in the vertical direction (Z). The hand 147 can move in parallel in any horizontal direction. The hand 147 is rotatable in a horizontal plane.

In the embodiment, the structure of the conveyance mechanism 16 of the processing block 11 is exemplified. However, it is not limited to this. The structure of the conveyance mechanism 16 may be changed appropriately. For example, the conveyance mechanism 16 may have the same structure as the conveyance mechanism 146 described above.

In the embodiment, as shown in FIG. 8, the opening and closing portion 61 has a substantially rectangular shape when viewed from the front. However, it is not limited to this. The shape of the opening/closing portion 61 may be changed appropriately. Likewise, the shapes of the opening and closing portions 62 and 63 may be changed as appropriate.

Fig. 18 is a front view of the switching mechanism in the modified embodiment. 19A and 19B are side views of the switching mechanism in the modified embodiment. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

See Figure 18. The substrate processing apparatus 1 is provided with a switching mechanism 151 . The switching mechanism 151 includes opening and closing portions 152, 153, and 154. The opening and closing portions 152-154 are respectively installed inside the switching housing 53. The opening and closing portions 152-154 each have a substantially circular shape.

The opening/closing portion 152 is capable of swinging around the rotation axis A6. The rotation axis A6 is a horizontal virtual line. The rotation axis A6 is parallel to the width direction Y. The rotation axis A6 is disposed above the opening and closing portion 152. The rotation axis A6 does not pass through the center of the opening/closing portion 152. By swinging the opening/closing portion 152 around the rotation axis A6, the opening/closing portion 152 has a position that communicates the processing housing 23 to the exhaust pipe 41 and a position that blocks the processing housing 23 from the exhaust pipe 41. Move to location. Likewise, the opening and closing portions 153 and 154 are capable of swinging around the rotation axes A7 and A8, respectively.

In FIG. 18 , the opening and closing portion 152 is disposed at a position that blocks the processing housing 23 from the exhaust pipe 41 . Likewise, the opening and closing portions 153 and 154 are disposed at positions that block the processing housing 23 from the exhaust pipes 42 and 43, respectively.

In FIG. 19A , the opening and closing portion 152 is disposed at a position that blocks the processing housing 23 from the exhaust pipe 41 . The opening/closing portion 152 closes the opening 41k of the exhaust pipe 41. In FIG. 19B, the opening and closing portion 152 is disposed at a position that communicates the processing housing 23 with the exhaust pipe 41. The opening/closing unit 152 opens the opening 41k.

See Figures 19a and 19b. The opening/closing portion 152 is supported by the switching housing 53. The opening and closing portion 152 is supported by the distribution portion 56 . Specifically, the switching mechanism 151 includes a stay 156 and a mounting member 157. The stay 156 is fixed to the transition housing 53. The stay 156 is fixed to the distribution portion 56. The mounting member 157 is supported on the stay 156. The mounting member 157 is rotatable about the rotation axis A6 with respect to the stay 156. The mounting member 157 is fixed to the opening and closing portion 152.

See Figure 18. Similarly to the opening and closing portion 152, the opening and closing portions 153 and 154 are respectively fixed to the mounting members 158 and 159.

In the embodiment, the mechanism for moving the opening and closing portions 61-63 is not specifically illustrated. So, with reference to FIGS. 19A and 19B, the mechanism for moving the opening and closing portion 152 is illustrated.

The processing block 11 includes a driving unit 161 that moves the opening and closing unit 152. Additionally, the drive unit 161 is not an element of the switching mechanism 151.

The driving unit 161 includes an actuator 161a. The actuator 161a generates power to move the opening and closing portion 152. The actuator 161a is, for example, an air cylinder, hydraulic cylinder, or electric motor. The actuator 161a is disposed outside the switching housing 53. The actuator 161a is disposed in the first piping space 44. The actuator 161a is disposed above the switching housing 53. The actuator 161a is disposed above the distribution section 56.

The driving unit 161 includes a rod 161b. The rod 161b is connected to the actuator 161a. The rod 161b extends downward from the actuator 161a. The rod 161b penetrates the conversion housing 53. At least a portion of the rod 161b is disposed inside the switching housing 53. The actuator 161a moves the rod 161b in the vertical direction (Z).

The driving unit 161 includes a link 161c. The link 161c is disposed inside the switching housing 53. Link 161c connects rod 161b and mounting member 157. The link 161c is rotatable about the axis A11 with respect to the rod 161b. The link 161c is rotatable about the axis A12 with respect to the mounting member 157. The axes A11 and A12 are respectively horizontal virtual lines. The axes A11 and A12 are each parallel to the width direction Y.

When the actuator 161a moves the rod 161b in the vertical direction (Z), the opening/closing portion 152 rotates around the rotation axis A6. When the actuator 161a moves the rod 161b upward, the opening/closing portion 152 moves to a position that communicates the processing housing 23 with the exhaust pipe 41. When the actuator 161a moves the rod 161b downward, the opening/closing portion 152 moves to a position that blocks the processing housing 23 from the exhaust pipe 41.

In the embodiment, gas leakage in the exhaust passage of the processing housing 23 may also be detected. For example, gas leakage from the opening and closing portions 61-63 may be detected.

See Figures 18, 19a, 19b. The processing block 11 includes wind speed sensors 162, 163, and 164. The wind speed sensor 162 is disposed near the opening and closing portion 152. The wind speed sensor 162 is disposed inside the conversion housing 53, for example. The wind speed sensor 162 is disposed inside the distribution unit 56, for example. When the rotation axis A6 is disposed above the opening and closing portion 152, the wind speed sensor 162 is preferably disposed below the opening and closing portion 152. Similarly, the wind speed sensors 163 and 164 are disposed near the opening and closing portions 153 and 154.

The wind speed sensor 162 detects the wind speed of the gas (specifically, the moving speed of the gas) in the vicinity of the opening and closing portion 152. Similarly, the wind speed sensors 163 and 164 detect the wind speed of the gas in the vicinity of the opening and closing portions 153 and 154. The wind speed sensors 162-164 are, for example, hot-wire anemometers.

The wind speed sensor 162 may also detect the wind direction of the gas (specifically, the direction of movement of the gas) in the vicinity of the opening and closing portion 152. Similarly, the wind speed sensors 163 and 164 may also detect the wind direction of the gas in the vicinity of the opening and closing portions 153 and 154.

Although not shown, the control unit 91 is connected to enable communication with the wind speed sensors 162-164. The control unit 91 acquires the detection results of the wind speed sensors 162-164.

The control unit 91 determines the presence or absence of gas leak from the opening/closing unit 152 based on the detection result of the wind speed sensor 162. Leakage of gas from the opening/closing unit 152 refers to leakage of gas from the processing housing 23 to the exhaust pipe 41 when the opening/closing unit 152 is disposed at a position that blocks the processing housing 23 from the exhaust pipe 41. Leaking the aircraft.

Specifically, the control unit 91 calculates the wind speed of the gas in the vicinity of the opening/closing unit 152 based on the detection result of the wind speed sensor 162. The calculated wind speed of the gas in the vicinity of the opening/closing portion 152 is called the “actual measurement value.”

When the opening/closing unit 152 is disposed at a position that blocks the processing housing 23 from the exhaust pipe 41, the control unit 91 monitors whether the actual measurement value satisfies a predetermined condition. The predetermined condition is, for example, that the actual measured value is less than a preset first reference value. The predetermined condition is, for example, that the change in the actual measured value per unit time is less than the second reference value. And, when the opening/closing unit 152 is disposed at a position that blocks the processing housing 23 from the exhaust pipe 41, and the actual measured value does not satisfy the predetermined condition, it is said that gas leakage from the opening/closing unit 152 is occurring. The control unit 91 makes the decision.

Here, it is preferable that at least one of the first reference value and the second reference value is, for example, a variable. At least one of the first reference value and the second reference value may change, for example, depending on the positions of the different opening and closing portions 153 and 154. At least one of the first reference value and the second reference value may change, for example, depending on the position of the opening and closing portion 152 belonging to the different switching mechanism 151. At least one of the first reference value and the second reference value may change, for example, depending on the positions of the opening and closing portions 152, 153, and 154 belonging to different switching mechanisms 151. According to this, even if the gas wind speed in the vicinity of the opening/closing unit 152 is susceptible to disturbance, the control unit 91 can determine the presence or absence of gas leak from the opening/closing unit 152 with high precision.

Alternatively, at least one of the first reference value and the second reference value may be a constant.

Similarly, the control unit 91 determines the presence or absence of gas leak from the opening and closing units 153 and 154 based on the detection results of the wind speed sensors 163 and 164.

According to this modified embodiment, it is possible to appropriately monitor whether the exhaust path of the processing housing 23 is normally switched between the exhaust pipes 41-43.

Additionally, the wind speed sensors 162-164 can appropriately detect the flow of minute gas. Therefore, it is possible to monitor with high precision whether the exhaust path of the processing housing 23 is normally switched between the exhaust pipes 41-43.

In this modified embodiment, when the control unit 91 detects gas leak in the exhaust passage, the control unit 91 issues an alarm and stops the operation of the liquid supply unit 33. You may execute at least one of the following. When the control unit 91 issues an alarm, the user of the substrate processing apparatus 1 can be quickly notified of the gas leak in the exhaust path. When the control unit 91 stops the operation of the liquid supply unit 33, the amount of components derived from the processing liquid contained in the gas in the processing housing 23 can be quickly suppressed. In either case, contamination of the inside of the exhaust pipes 41-43 can be appropriately suppressed. For example, the generation of crystals (salts) inside the exhaust pipes 41-43 can be appropriately suppressed. For example, deposition of crystals inside the exhaust pipes 41-43 can be appropriately suppressed.

In the modified embodiment shown in FIGS. 18, 19a, and 19b, the wind speed sensors 162-164 are disposed inside the switching housing 53. However, it is not limited to this.

For example, the wind speed sensor 162 may be placed inside the exhaust pipe 41. Even in the case where the wind speed sensor 162 is disposed inside the exhaust pipe 41, an appropriate reference value included in the predetermined condition can be set in advance. Therefore, the control unit 91 can appropriately determine the presence or absence of gas leak from the opening/closing unit 152. The arrangement of the wind speed sensors 163 and 164 may be similarly changed.

For example, the wind speed sensor 162 may be placed inside the processing housing 23. Even in the case where the wind speed sensor 162 is disposed inside the processing housing 23, an appropriate reference value included in the predetermined condition can be set in advance. Therefore, the control unit 91 can appropriately determine the presence or absence of gas leak from the opening/closing unit 152. The arrangement of the wind speed sensors 163 and 164 may be similarly changed.

Referring to the drawings, the arrangement of wind speed sensors 162-164 is illustrated. FIG. 20A is a plan view drawing an example of the arrangement of the wind speed sensor in addition to FIG. 6. Figure 20b is a plan view drawn by adding an example of the arrangement of the wind speed sensor to Figure 13. FIG. 21A is a plan view drawn by adding an example of the arrangement of the wind speed sensor to FIG. 15. Figure 21b is a plan view drawn by adding an example of the arrangement of the wind speed sensor to Figure 16. In addition, the same components as in the embodiment are given the same reference numerals and detailed descriptions are omitted.

See Figure 20A. The wind speed sensor 162 includes at least one of the wind speed sensors 162a and 162b. Wind speed sensors 162a and 162b are respectively disposed near the opening and closing portion 61. The wind speed sensor 162a is disposed inside the exhaust pipe 41. The wind speed sensor 162a is disposed near the opening 41k. The wind speed sensor 162b is disposed inside the switching housing 53. Likewise, the wind speed sensor 163 includes at least one of the wind speed sensors 163a and 163b. The wind speed sensor 164 includes at least one of the wind speed sensors 164a and 164b.

See Figure 20b. The wind speed sensor 162 includes at least one of the wind speed sensors 162c and 162d. Wind speed sensors 162c and 162d are respectively disposed near the opening and closing portion 113. The wind speed sensor 162c is disposed inside the processing housing 23. The wind speed sensor 162d is disposed inside the exhaust pipe 41. The wind speed sensor 162d is disposed near the opening 41k. Likewise, the wind speed sensor 163 includes at least one of the wind speed sensors 163c and 163d. The wind speed sensor 164 includes at least one of the wind speed sensors 164c and 164d.

See Figure 21a. The wind speed sensor 162 includes at least one of the wind speed sensors 162e, 162f, and 162g. Wind speed sensors 162e-162g are each disposed near the opening/closing portion 123. The wind speed sensor 162e is disposed inside the exhaust pipe 41. The wind speed sensor 162e is disposed near the opening 41k. Wind speed sensors 162f and 162g are respectively disposed inside the switching housing 53. As described above, when the opening/closing portion 123 is disposed in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening/closing portion 123 blocks the first zone 126 from the second zone 127. . At this time, a wind speed sensor 162g is installed to detect gas leakage from the opening/closing portion 123. When the opening/closing unit 123 is disposed in a position to communicate the processing housing 23 to the exhaust pipe 41, the amount of gas that the opening/closing unit 123 leaks from the first zone 126 to the second zone 127 is, The wind speed sensor 162g can detect appropriately. Likewise, the wind speed sensor 163 includes at least one of the wind speed sensors 163e, 163f, and 163g. The wind speed sensor 163g is installed for a similar purpose to the wind speed sensor 162g. The wind speed sensor 164 includes at least one of the wind speed sensors 164e and 164f.

See Figure 21b. The wind speed sensor 162 includes at least one of the wind speed sensors 162h, 162i, 162j, 162k, and 162l. Wind speed sensors 162h-162l are each disposed near the opening/closing portion 133. Wind speed sensors 162h and 162i are disposed inside the exhaust pipe 41. Wind speed sensors 162h and 162i are disposed near the opening 41k. Wind speed sensors 162j-162l are each disposed inside the transition housing 53. As described above, when the opening and closing portion 133 is disposed in a position to communicate the processing housing 23 to the exhaust pipe 41, the opening and closing portion 133 blocks the processing housing 23 from the exhaust pipes 42 and 43. At this time, wind speed sensors 162k and 162l are installed to detect gas leakage from the opening and closing portion 133. When the opening/closing unit 133 is disposed at a position that communicates the processing housing 23 to the exhaust pipe 41, the amount of gas that the opening/closing unit 133 leaks from the processing housing 23 to the exhaust pipes 42, 43 is determined by the wind speed. Sensors 162k and 162l can detect appropriately. Likewise, the wind speed sensor 163 includes at least one of the wind speed sensors 163h, 163i, 163j, 163k, and 163l. The wind speed sensors 163k and 163l are installed for a similar purpose as the wind speed sensors 162k and 162l. The wind speed sensor 164 includes at least one of the wind speed sensors 164h, 164i, and 164j.

The embodiment and each modified embodiment may be appropriately changed, such as by substituting or combining each configuration with a configuration of another modified embodiment.

The present invention can be implemented in other specific forms without departing from its spirit or essence, and therefore, reference should be made to the appended claims rather than the above description as indicating the scope of the invention.

1, 141 Substrate processing device
11 processing blocks
12A, 12B, 12 return space
16A, 16B, 16 conveyance mechanism
21 processing units
23 Processing Housing
23A1 Processing Housing (Primary Processing Housing)
23A2 processing housing (second processing housing)
23B1 Processing Housing (Third Processing Housing)
24 processing space
31 Holding part (1st holding part, 2nd holding part, 3rd holding part)
33 Liquid supply unit (1st liquid supply unit, 2nd liquid supply unit, 3rd liquid supply unit)
41, 42, 43 exhaust pipe
41A exhaust pipe (1st exhaust pipe)
42A exhaust pipe (second exhaust pipe)
41B exhaust pipe (3rd exhaust pipe)
42B exhaust pipe (4th exhaust pipe)
44 1st piping space
46 2nd piping space
48 air supply pipe
51, 101, 111, 121, 131, 151 Transition Mechanism
51A1 Transition Mechanism (First Transition Mechanism)
51A2 Transition Mechanism (Second Transition Mechanism)
51B1 Transition Mechanism (Third Transition Mechanism)
53, 103 transition housing
54 transition space
55, 105 introduction
56, 106 distribution department
61-63, 113-115, 123-124, 133-134, 152-154 openings
61, 113, 123, 133, 152 opening and closing section (first opening and closing section)
62, 114, 124, 134, 153 opening and closing section (second opening and closing section)
71 pressure sensor
71A1 pressure sensor (first pressure sensor)
71B1 pressure sensor (third pressure sensor)
73 Pressure adjustment mechanism
73A1 pressure adjustment mechanism (first pressure adjustment mechanism)
73B1 pressure adjustment mechanism (third pressure adjustment mechanism)
81, 82, 83 exhaust pipe
81A exhaust pipe (5th exhaust pipe)
82A exhaust pipe (6th exhaust pipe)
84-86 pressure sensor
84A pressure sensor (fifth pressure sensor)
85A pressure sensor (6th pressure sensor)
87-89 Pressure adjustment mechanism
87A pressure adjustment mechanism (fifth pressure adjustment mechanism)
88A pressure adjustment mechanism (6th pressure adjustment mechanism)
91 control unit
W substrate
X forward-forward direction (first direction)
Y width direction (second direction)
Z vertical direction

Claims (23)

A substrate processing device, comprising:
a first processing housing;
a first holding portion installed inside the first processing housing and holding a substrate;
a first liquid supply unit installed inside the first processing housing and supplying a processing liquid to the substrate held by the first holding unit;
a first exhaust pipe installed on a side of the first processing housing and discharging gas;
a second exhaust pipe installed on a side of the first processing housing and discharging gas;
A first switching mechanism is disposed at the same height as the first processing housing and switches an exhaust path of the first processing housing to one of the first exhaust pipe and the second exhaust pipe,
The first conversion mechanism is,
a first opening and closing portion movable to a position that communicates the first processing housing to the first exhaust pipe and a position that blocks the first processing housing from the first exhaust pipe;
A second opening and closing unit that is movable, independently of the first opening and closing unit, to a position that communicates the first processing housing to the second exhaust pipe and a position that blocks the first processing housing from the second exhaust pipe;
It has a transition housing connected to the first processing housing and accommodating the first opening and closing portion and the second opening and closing portion,
A substrate processing apparatus, wherein the first processing housing and the switching housing are directly connected. In claim 1,
The switching housing is disposed at a position equal to or lower than the top of the first holding part. In claim 1,
The substrate processing apparatus, wherein the switching housing is disposed at a position that does not overlap the first holding portion when viewed from a plan view. In claim 1,
The first exhaust pipe extends in a vertical direction,
The second exhaust pipe extends in a vertical direction. In claim 1,
The substrate processing device is,
a conveyance space extending in a horizontal first direction and adjacent to the first processing housing;
a transport mechanism installed in the transport space and transporting the substrate to the first holding unit;
Adjacent to the first processing housing, a first piping space is provided for accommodating the first exhaust pipe and the second exhaust pipe,
The first processing housing and the first piping space are aligned in the first direction,
The substrate processing apparatus wherein the first exhaust pipe and the second exhaust pipe are aligned in a second direction that is perpendicular to the first direction and is horizontal. In claim 5,
At least a portion of the switching housing is installed in the first piping space. In claim 5,
The conversion housing is,
an introduction portion connected to the first processing housing and extending in the first direction;
a distribution portion connected to the introduction portion, extending in the second direction, connected to both the first exhaust pipe and the second exhaust pipe, and receiving both the first opening and closing portion and the second opening and closing portion; A substrate processing device. In claim 7,
A substrate processing apparatus wherein, when viewed from the top, a separation distance between the introduction part and the transfer space is smaller than a separation distance between the first holding unit and the transfer space. In claim 5,
The substrate processing device is,
an air supply pipe supplying gas to the first processing housing;
Adjacent to the first processing housing, a second piping space is provided for accommodating the air supply pipe,
The substrate processing apparatus wherein the first piping space, the first processing housing, and the second piping space are lined up in this order in the first direction. In claim 1,
The substrate processing device is,
a second processing housing disposed below the first processing housing;
a second holding portion installed inside the second processing housing and holding the substrate;
a second liquid supply unit installed inside the second processing housing and supplying a processing liquid to the substrate held by the second holding unit;
A substrate processing apparatus disposed at the same height as the second processing housing and including a second switching mechanism that switches an exhaust path of the second processing housing to one of the first exhaust pipe and the second exhaust pipe. In claim 10,
The second processing housing is disposed at the same position as the first processing housing when viewed from the top,
The second switching mechanism is disposed at the same position as the first switching mechanism when viewed in plan,
The first exhaust pipe extends in a vertical direction,
The second exhaust pipe extends in a vertical direction. In claim 1,
The substrate processing device is,
a third processing housing disposed at the same height as the first processing housing;
a third holding portion installed inside the third processing housing and holding the substrate;
a third liquid supply unit installed inside the third processing housing and supplying a processing liquid to the substrate held by the third holding unit;
a third exhaust pipe installed on a side of the third processing housing and discharging gas;
a fourth exhaust pipe installed on a side of the third processing housing and discharging gas;
A substrate processing apparatus disposed at the same height as the third processing housing and including a third switching mechanism for switching an exhaust path of the third processing housing to one of the third exhaust pipe and the fourth exhaust pipe. In claim 12,
The substrate processing device is,
a first pressure sensor that measures the pressure of gas on the primary side of the first switching mechanism;
a first pressure adjustment mechanism that adjusts the pressure of gas on the primary side of the first switching mechanism based on the detection result of the first pressure sensor;
a third pressure sensor that measures the pressure of gas on the primary side of the third switching mechanism;
A substrate processing apparatus comprising a third pressure adjustment mechanism that adjusts the pressure of gas on the primary side of the third switching mechanism based on the detection result of the third pressure sensor. In claim 13,
The substrate processing apparatus, wherein the first pressure adjustment mechanism and the third pressure adjustment mechanism equalize the pressure of the gas on the primary side of the first switching mechanism and the pressure of the gas on the primary side of the third switching mechanism. In claim 12,
The substrate processing device is,
a fifth exhaust pipe connected to the first exhaust pipe and the third exhaust pipe, and discharging gas of the first exhaust pipe and gas of the third exhaust pipe;
A substrate processing apparatus, comprising a sixth exhaust pipe connected to the second exhaust pipe and the fourth exhaust pipe, and discharging gas of the second exhaust pipe and gas of the fourth exhaust pipe. In claim 15,
The substrate processing device is,
a fifth pressure sensor that measures the pressure of gas inside the fifth exhaust pipe;
a fifth pressure adjustment mechanism that adjusts the pressure of gas inside the fifth exhaust pipe based on the detection result of the fifth pressure sensor;
a sixth pressure sensor that measures the pressure of gas inside the sixth exhaust pipe;
A substrate processing apparatus comprising a sixth pressure adjustment mechanism that adjusts the pressure of gas inside the sixth exhaust pipe based on the detection result of the sixth pressure sensor. In claim 16,
The fifth pressure sensor is installed downstream of the connection position of the first exhaust pipe and the fifth exhaust pipe, and the connection position of the third exhaust pipe and the fifth exhaust pipe,
The substrate processing apparatus wherein the sixth pressure sensor is installed downstream from the connection position of the second exhaust pipe and the sixth exhaust pipe, and the connection position of the fourth exhaust pipe and the sixth exhaust pipe. In claim 1,
The first liquid supply unit is capable of supplying a first treatment liquid and a second treatment liquid,
When the first liquid supply unit supplies the first processing liquid, the first opening/closing unit switches the exhaust path of the first processing housing to the first exhaust pipe,
When the first liquid supply unit supplies the second processing liquid, the second opening/closing unit switches the exhaust path of the first processing housing to the second exhaust pipe. In claim 1,
The position of the center of the substrate when the substrate is held in the first holding portion is taken as the center point,
The substrate processing apparatus, wherein the distance in the horizontal direction between the center point and the conversion housing is less than 5 times the radius of the substrate. In claim 1,
Both the first exhaust pipe and the second exhaust pipe are in contact with the first processing housing. In claim 1,
The conversion housing is,
an introduction portion connected to the first processing housing;
It is connected to the introduction part, is connected to both the first exhaust pipe and the second exhaust pipe, and has a distribution part that accommodates both the first opening and closing part and the second opening and closing part,
A substrate processing apparatus, wherein both the first exhaust pipe and the second exhaust pipe, or the distribution portion, are in contact with the first processing housing. delete delete

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