KR102583622B1 - Organic light emitting display device and method of fabricating the same - Google Patents

Abstract

An organic light emitting display device according to the present invention includes a first substrate including a plurality of pixel regions, a hydrophobic first bank formed at the boundary of the pixel regions, and an organic light emitting element disposed in the pixel region and including a light emitting auxiliary layer. , It consists of a conductive pattern formed in a grid shape disposed on the first bank and surrounding a plurality of pixel areas, the conductive pattern is in direct contact with the light emitting auxiliary layer and is formed to have a narrower width than the first bank, so that the first bank Both sides of the upper surface are exposed.

Description

Organic light emitting display device and method of fabricating the same}

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and in particular, to an organic light emitting display device and a manufacturing method thereof that can improve lifespan and suppress defects when forming an organic light emitting layer using a liquid organic light emitting material. .

An organic light emitting display device, one of the display devices, has high brightness and low operating voltage characteristics. In addition, since organic light emitting display devices are self-emitting, they have a high contrast ratio, enable the implementation of ultra-thin displays, and have a response time of several microseconds (㎲), resulting in delays when displaying video. There is no phenomenon, so the video display quality is excellent. In addition, it is stable even at low temperatures and operates at a low direct current voltage of 5V to 15V, making it easy to manufacture and design the driving circuit. Therefore, organic light emitting display devices having the above-mentioned advantages have recently been used in various IT devices such as TVs, monitors, and mobile phones.

Hereinafter, the basic structure of the organic light emitting display device will be described in more detail.

Organic light emitting display devices are largely composed of array elements and organic light emitting diodes. The array element consists of a switching thin-film transistor connected to a gate and a data line, and a driving thin-film transistor connected to the organic light-emitting diode. The organic light-emitting diode includes a first electrode, an organic light-emitting layer, and a second connected to the driving thin-film transistor. It is made up of electrodes.

An organic light emitting display device having this configuration displays an image by emitting light generated from the organic light emitting layer toward the first electrode or the second electrode, and is ultimately emitted to the outside through the first electrode or the second electrode. 2 Depending on whether it is emitted through an electrode, it is divided into a bottom emission method or an upper emission method.

Meanwhile, in such general organic light emitting display devices, the organic light emitting layer is usually formed by a thermal evaporation method using a shadow mask. However, as display devices have recently become larger, sagging of the shadow mask has occurred significantly, leading to an increase in deposition defects. Application to large-area substrates is becoming increasingly difficult, and in the case of thermal evaporation using a shadow mask, a shadow effect is generated, making it difficult to manufacture an organic light-emitting display device with high resolution.

Therefore, a method of forming an organic light emitting layer that replaces the thermal evaporation process using a shadow mask has been proposed to manufacture a large-area organic light emitting display device.

The proposed method of forming an organic light-emitting layer is to spray or drop a liquid organic light-emitting material into an area surrounded by a bank using an inkjet device or a nozzle coating device and then cure it.

Figure 1 is a cross-sectional view of an organic light emitting display device after the step of forming an organic light emitting layer by dropping a liquid organic light emitting material through an ink jet device.

In order to spray liquid organic light emitting material into each pixel area (P1) through an inkjet device or drop it through a nozzle coating device, the liquid organic light emitting material must flow around within each pixel area (P). In order to prevent this, a bank is essentially required to surround each pixel area P where the first electrode 50 is formed.

Therefore, as shown, a bank 53 having a single-layer structure is provided along the boundary of each pixel area P before the organic light emitting layer is provided.

At this time, the bank 53 is made of an organic material with hydrophobic properties. The reason why the bank 53 has hydrophobic properties is that when the liquid organic light-emitting material is sprayed or dropped, it is not sprayed in the center of the pixel area P surrounded by the bank due to errors in the equipment itself, but is sprayed slightly skewed to the bank ( 53) Even if a certain amount is injected onto the top, it flows down from the bank 53 and is located within each pixel area (P). Furthermore, even if the amount of liquid organic light-emitting material injected is slightly excessive, it overflows into the upper part of the bank 53. This is to suppress the flow.

When it has hydrophobic properties, it has the property of repelling the liquid organic luminescent material with hydrophilic properties, so the organic luminescent material is not coated on the top of the bank 53 and is concentrated only in the area surrounded by the bank 53. Because you can.

When the head of the inkjet device or the nozzle of the nozzle coating device 98 is located in each pixel area (P) surrounded by the bank 53 and sprays or drops the liquid organic luminescent material, an organic light emitting material is formed in each pixel area (P). The light-emitting material is filled, and in this state, heat treatment is performed to dry and harden the organic light-emitting layer 55.

Meanwhile, in an organic light emitting display device having this structure, liquid organic light emitting material is formed through an inkjet or nozzle coating device, so the spreading characteristic within each pixel area is very important.

The surface of the first electrode is contaminated with organic substances, etc., or the spreading characteristics of foreign matter, etc. are poor, resulting in a large partial thickness deviation, which ultimately reduces the quantum efficiency of the organic light-emitting layer itself, thereby reducing its lifespan. And there is a problem that the display quality is reduced.

Therefore, in order to improve the spreading characteristics through surface modification of the first electrode and further remove organic substances or foreign substances, the reaction is performed while forming a bank with the first electrode before ink jetting or nozzle coating of the liquid organic light-emitting material. Plasma treatment using gas is being performed.

After performing the plasma process using a reactive gas in this way, it was found that the surface of the first electrode was modified and at the same time foreign substances and organic matter were removed, thereby improving the spreading characteristics when jetting the liquid organic light-emitting material.

However, due to the plasma process using the reaction gas, the hydrophobic properties of the bank with hydrophobic properties are rapidly deteriorated, and due to the jetting error of the inkjet device, the hydrophobic properties are not smoothly expressed during ink jetting of the organic light emitting material, causing damage to neighboring pixels. A phenomenon occurs in which liquid organic light-emitting material invades the area or is located on the bank, and as a result, defects in the formation of the organic light-emitting layer occur frequently.

In addition, the presence of organic light-emitting material on these banks causes a difference in the content of the organic light-emitting material located inside the area surrounded by the bank of each pixel area, which in turn causes a difference in the thickness of the organic light-emitting layer for each pixel area. The color reproduction rate for each pixel area position within the display area is different, which is deteriorating the display quality.

The present invention was developed to solve the above problems, and while performing plasma treatment to modify the surface of the first electrode and remove organic contamination, the hydrophobic properties of the bank are not deteriorated, thereby extending the lifespan and improving the efficiency of the organic light-emitting layer when forming the organic light-emitting layer. The purpose is to provide an organic light emitting device that can reduce the defect rate and a method of manufacturing the same.

In order to achieve the above object, an organic light emitting display device according to the present invention includes a first substrate including a plurality of pixel regions, a hydrophobic first bank formed at the boundary of the pixel regions, and a light emitting auxiliary layer disposed in the pixel region. It consists of an organic light emitting element including an organic light emitting element, and a conductive pattern formed in a grid shape disposed on the first bank and surrounding a plurality of pixel areas, wherein the conductive pattern is in direct contact with the light emitting auxiliary layer and is narrower than the first bank. It is formed wide to expose both sides of the upper surface of the first bank.

The organic light emitting device includes a first electrode formed in each of the plurality of pixel regions and an edge of which overlaps the first bank, an organic light emitting layer disposed on the first electrode inside the pixel region, and disposed on the front surface of the first substrate. It further includes a second electrode.

A light emitting auxiliary layer is disposed between the conductive pattern and the second electrode to electrically insulate the conductive pattern and the second electrode.

The organic light emitting display device further includes an insulating layer formed on the first substrate and a trench formed in the insulating layer at a boundary between each pixel area, and the trench is formed by completely removing the insulating layer to expose underlying components. . The trench is configured so that the thickness of the insulating layer in the pixel area is thinner than that in other areas.

The organic light emitting display device further includes a connection wire connected to the conductive pattern and a pad electrode connected to the connection wire to supply a charge charging voltage applied from the outside to the conductive pattern through the connection wire.

A second bank is disposed below the first bank, and the second bank has a width greater than that of the first bank and overlaps the edge of the adjacent first electrode.

The second bank is provided in the form of a double line spaced apart from each other by removing the central portion from the boundary of each pixel area, and the first bank may be arranged to overlap the spaced area of the second bank having the double line shape. there is.

A color filter layer may be disposed below the insulating layer, and the first bank may be disposed inside the trench.

Due to the structural characteristics described above, the organic light emitting display device according to the present invention does not affect the hydrophobic properties of the bank at all even if a plasma process is performed using a reactive gas to modify the surface of the first electrode and remove organic contaminated portions. This has the effect of improving lifespan and suppressing defects that occur when forming an organic light emitting layer using an ink jet device.

Furthermore, the surface of the first electrode is modified to improve the spreading characteristics, thereby improving the thickness uniformity of the organic light-emitting layer, thereby improving display quality.

1 is a cross-sectional view of an organic light emitting display device after the step of forming an organic light emitting layer by dropping a liquid organic light emitting material through an ink jet device.
Figure 2 is a circuit diagram of one pixel of an organic light emitting display device.
Figure 3 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to an embodiment of the present invention, showing first, second, and third pixel areas showing red, green, and blue.
Figure 4 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to a first modification of the first embodiment of the present invention, showing first, second, and third pixel areas showing red, green, and blue.
FIGS. 5A and 5B are diagrams briefly illustrating a conductive pattern and a connection wire connected thereto in a display area and a non-display area in an organic light emitting display device according to a first embodiment of the present invention, respectively.
Figures 6A to 6K are cross-sectional views of the manufacturing process of the organic electroluminescent device according to the first embodiment of the present invention, showing the first, second, and third pixel regions showing red, green, and blue.
7A and 7B are diagrams showing changes in surface properties of a bank of a conventional organic light emitting display device without a conductive pattern before and after plasma treatment, respectively.
FIGS. 8A and 8B and FIGS. 9A and 9B are diagrams showing the hydrophobic characteristics before and after plasma treatment in the organic light emitting display device according to the first embodiment of the present invention in which a conductive pattern is formed, respectively, and FIGS. 8A and 9A are diagrams showing the hydrophobic characteristics before plasma treatment. The surface characteristics of the first electrode and the bank are shown, and FIGS. 8B and 9B are diagrams showing changes in the surface characteristics of the first electrode and the bank after plasma treatment, respectively.
Figure 10 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to a second embodiment of the present invention, showing first, second, and third pixel areas showing red, green, and blue.
Figure 11 is a cross-sectional view of a portion of an organic light emitting display device according to a first modified example of the second embodiment of the present invention, showing first, second, and third pixel regions showing red, green, and blue.
FIG. 12 is a diagram showing an organic light emitting display device according to a second modification of the second embodiment of the present invention, showing a differentiated bank and its surroundings.
Figure 13 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to a third embodiment of the present invention, and is a cross-sectional view of one pixel area.
Figure 14 is a cross-sectional view of a portion of an organic light emitting display device according to a first modified example of the third embodiment of the present invention, showing a cross-sectional view of one pixel area.
Figure 15 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to a fourth embodiment of the present invention, and is a cross-sectional view of one pixel area.
16 is a cross-sectional view of a portion of an organic light emitting display device according to a first modified example of the fourth embodiment of the present invention, showing a cross-sectional view of one pixel area.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. These embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as ‘after’, ‘after’, ‘after’, ‘before’, etc., ‘immediately’ or ‘directly’ Non-consecutive cases may also be included unless ' is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Each feature of the various embodiments of the present invention can be combined or combined with each other, partially or entirely, and various technological interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

First, the configuration and operation of the organic light emitting display device will be described with reference to FIG. 2, which is a circuit diagram of one pixel of the organic light emitting display device.

As shown in FIG. 2, each subpixel of the organic light emitting display device includes a switching thin film transistor (STr), a driving thin film transistor (DTr), a storage capacitor (StgC), and an organic light emitting diode (E). is being provided.

That is, a gate line (GL) is formed in a first direction, a data line (DL) is formed defining a pixel area (P) in a second direction crossing the first direction, and the data line (DL) ) and a power wiring (PL) is formed to apply the power voltage.

In addition, a switching thin film transistor (STr) is formed at the intersection of the data line (DL) and the gate line (GL), and a driving thin film transistor (DTr) is formed that is electrically connected to the switching thin film transistor (STr). there is.

The first electrode 147, which is one terminal of the organic light emitting diode (E), is connected to the drain electrode of the driving thin film transistor (DTr), and the second electrode, which is the other terminal, is grounded. At this time, the power wiring (PL) transmits the power voltage to the organic light emitting diode (E). Additionally, a storage capacitor (StgC) is formed between the gate electrode and the source electrode of the driving thin film transistor (DTr).

Therefore, when a signal is applied through the gate wire (GL), the switching thin film transistor (STr) is turned on, and the signal of the data wire (DL) is transmitted to the gate electrode of the driving thin film transistor (DTr) to drive the Since the thin film transistor (DTr) is turned on, light is output through the organic light emitting diode (E).

At this time, when the driving thin film transistor (DTr) is in the on state, the level of the current flowing from the power wiring (PL) to the organic light emitting diode (E) is determined, and as a result, the organic light emitting diode (E) turns gray. Gray scale can be implemented, and the storage capacitor (StgC) serves to keep the gate voltage of the driving thin film transistor (DTr) constant when the switching thin film transistor (STr) is turned off. Even if the switching thin film transistor (STr) is turned off, the level of current flowing through the organic light emitting diode (E) can be maintained constant until the next frame.

<First Example>

Figure 3 is a cross-sectional view of a portion of the display area of an organic light emitting display device according to an embodiment of the present invention, showing the first, second, and third pixel areas showing red, green, and blue. For convenience of explanation, the area where the driving thin film transistor (DTr) and the switching thin film transistor (not shown) are formed within each pixel area (P1, P2, P3) is defined as the device area (TrA). In the drawing, for convenience, only the first pixel area (P1) is shown, but it is also provided in the second and third pixel areas (P2 and P3), respectively.

As shown, the organic light emitting display device 101 according to an embodiment of the present invention includes a first substrate 110 on which a driving and switching thin film transistor (DTr, not shown) and an organic light emitting diode (E) are formed, and an encapsulation device. It consists of a second substrate 170 for lithography. At this time, the second substrate 170 may be replaced with an inorganic film or/or organic film having a multi-layer structure, or may be omitted by attaching a film through a face seal (not shown).

The main components that make up the organic light emitting display device are all provided on the first substrate, and the focus is on the configuration of the first substrate 110, which is equipped with a driving and switching thin film transistor (DTr, not shown) and an organic light emitting diode (E). This explains.

In each device region (TrA) in the first, second, and third pixel regions (P1, P2, and P3) on the first substrate 110, a first region (113a) forming a channel passage and the first region (113a) A semiconductor layer 113 is formed on both sides of the semiconductor layer 113 and is composed of a second region 113b with higher conductivity than the first region 113a.

At this time, a buffer layer (not shown) made of an inorganic insulating material, for example, silicon oxide (SiO2) or silicon nitride (SiNx), may be further provided on the entire surface between the semiconductor layer 113 and the first substrate 110. there is. The buffer layer (not shown) is formed to prevent the characteristics of the semiconductor layer 113 from being deteriorated due to the emission of alkaline ions from the inside of the first substrate 110, and is made of a material that does not emit such alkaline ions. In this case, it may be omitted.

In addition, a gate insulating film 116 is formed on the entire surface covering the semiconductor layer 113, and a gate electrode 120 is formed on the gate insulating film 116 corresponding to the first region 113a of the semiconductor layer 113. ) is formed. At this time, although not shown in the drawing, the same layer on which the gate electrode 120 is formed is provided with a gate wire (not shown) made of the same material that forms the gate electrode 120 and extending in one direction.

Next, an interlayer insulating film 123 made of an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiNx), is formed on the gate electrode 120 and the gate wiring (not shown). At this time, the interlayer insulating film 123 and the gate insulating film 116 below it are provided with semiconductor layer contact holes 125 that respectively expose the second region 113b.

Next, a data wire 130 is formed on the upper part of the interlayer insulating film 123 where the semiconductor layer contact hole 125 is provided, crossing the gate wire (not shown) to define each pixel area (P1, P2, and P3). and a power wiring (not shown) is formed spaced apart from the data wiring 130.

In addition, in each device region (TrA) above the interlayer insulating film 123, source and drain electrodes 133 and 136 are spaced apart from each other and are in contact with the second region 113b exposed through the semiconductor layer contact hole 125, respectively. This is formed.

Meanwhile, the semiconductor layer 113, the gate insulating film 116, the gate electrode 120, and the interlayer insulating film 123 sequentially stacked in the device region TrA, and the source and drain electrodes 133 spaced apart from each other. , 136) forms a thin film transistor (DTr).

At this time, the thin film transistor (DTr) provided in the device area (TrA) substantially becomes a driving thin film transistor (DTr), and the device area (TrA) is a switching thin film having the same stacking structure as the driving thin film transistor (DTr). Additional transistors (not shown) may be provided. And this switching thin film transistor (not shown) is electrically connected to the gate wire (not shown) and the data wire 130, and is also connected to the driving thin film transistor (DTr).

Meanwhile, in the organic light emitting display device 101 according to an embodiment of the present invention, the semiconductor layer 113 may be made of any one of poly-silicon (Poly-Si), amorphous silicon (a-Si), and oxide semiconductor material. .

In the drawing, the driving thin film transistor (DTr) is shown as an example of a top gate type.

However, the driving and switching thin film transistor (DTr, not shown) provided in the device region within each pixel region (P1, P2, and P3) of the organic light emitting display device 101 according to an embodiment of the present invention is of the top gate type. Without being limited thereto, the gate electrode 120 may be configured as a bottom gate type located below the semiconductor layer 113.

That is, the switching and driving thin film transistor (DTr, not shown) provided in each device region TrA may be modified in various ways depending on the material characteristics of the semiconductor layer 113 in addition to the form shown in the drawing.

Meanwhile, a planarization layer 140 having a flat surface is formed on the driving and switching thin film transistor (DTr, not shown) made of an organic insulating material, for example, photo acryl.

At this time, the planarization layer 140 is provided with a drain contact hole 143 that exposes the drain electrode 136 of the driving thin film transistor (DTr) provided in the device region (TrA) in each pixel region (P1, P2, and P3). This is provided.

The drawing shows as an example that only the planarization layer 140 having a flat surface is formed on the driving and switching thin film transistor (DTr, not shown), but the planarization layer 140 and the driving and switching thin film transistor (DTr, not shown) are formed as an example. A protective layer (not shown) made of an inorganic insulating material, for example, silicon oxide (SiO2) or silicon nitride (SiNx) may be further formed between the layers. The protective layer (not shown) made of the inorganic insulating material can improve bonding strength.

Meanwhile, referring to FIG. 4 as an organic light emitting display device according to a first modified example of the first embodiment of the present invention, color filter layers 139 (139a, 139b, 139c) are formed between the protective layer 138 and the planarization layer 140. ) may be further provided. When such a color filter layer 139 is provided, the organic light emitting display device 102 operates in a bottom emission method, and the color filter layer 139 is located in the first, second, and third pixel areas. (P1, P2, P3) each has red, green, and blue color filter patterns (139a, 139b, and 139c).

This color filter layer 139 improves color gamut along with the organic light emitting layer 152 that emits red, green, and blue (R, G, B) for each of the first, second, and third pixel areas (P1, P2, and P3). It plays a role in implementing full color, or when the organic light emitting layer 152 is configured to emit white (W) regardless of the pixel areas (P1, P2, and P3).

In the case of the organic light emitting display device 102 according to the first modification of the first embodiment of the present invention having such a configuration provided with the color filter layer 139, the color filter layer 139 is further provided and the organic light emitting layer 152 ), except that it may be configured to emit white light regardless of the first, second, and third pixel areas (P1, P2, and P3), all configurations are the organic light emitting display device according to the first embodiment of the present invention (FIG. Since it is the same as 101 in Figure 3, the following description will focus on the configuration of the organic light emitting display device (101 in Figure 3) according to the first embodiment of the present invention.

Referring to FIG. 3, on the planarization layer 140, the drain electrode 136 of the driving thin film transistor (DTr) and the first electrode 147 in contact through the drain contact hole 143 are formed in each pixel region (P1). , P2, P3) are formed as stars.

The first electrode 147 is made of a transparent conductive material, for example, indium-tin-oxide (ITO), with a relatively large work function value, that is, about 4.8 eV to 5.2 eV, and serves as an anode electrode. ) plays the role of

Meanwhile, when the first electrode 147 is made of indium-tin-oxide (ITO), a transparent conductive material with a high work function value, when operated in the top emission method, light is emitted from the top of the organic light-emitting diode (E). To increase efficiency, a reflective layer (not shown) made of aluminum (Al) or aluminum alloy (AlNd), which are metal materials with excellent reflectivity, may be further provided below the first electrode 147. When such a reflective layer (not shown) is provided below the first electrode 147, light emitted from the organic light-emitting layer 152 formed on the top of the first electrode 147 passes through the reflective layer (not shown). By reflecting the light upward, the use efficiency of the emitted light is increased and the final brightness characteristics are improved.

At this time, the material of the first electrode 147 is not limited to the materials mentioned above.

Meanwhile, in the drawing, the first electrode 147 is shown as an example of having a single-layer structure made of a transparent conductive material.

Meanwhile, in the organic light emitting display device 101 and 102 in FIG. 4 according to the first embodiment of the present invention and its first modified example, the first electrode 147 is the drain electrode ( 136) and a configuration connected through the drain contact hole 143 are shown as an example.

However, depending on the type of thin film transistor, the first electrode 147 may be connected to the source electrode 133 of the driving thin film transistor (DTr). In this case, the drain contact hole 143 is connected to the driving thin film transistor (DTr). ) is formed to correspond to the source electrode 133, and at this time, the drain contact hole 143 may be called a source contact hole.

Next, a bank 150 that partially overlaps the edge of each first electrode 147 is formed at the boundary of the first, second, and third pixel areas (P1, P2, and P3). The bank 150 is made of a polymer material with hydrophobic properties, for example, polyimide, styrene, methyl mathacrylate, poly containing fluorine (F) as a hydrophobic additive. It may be made of any one or a mixture of two or more of polytetrafluoroethylene.

The bank 150, made of a material with such hydrophobic properties, forms a grid shape that opens each pixel area (P1, P2, and P3) in the display area, exposing the central part of the first electrode 147. there is.

And, as the most characteristic configuration in the present invention, a conductive material, such as the gate or data wire (130), is in contact with the bank 150 on the upper part of the bank 150 forming a lattice shape with respect to the display area. A conductive pattern 160 made of a metal material is being formed. This conductive pattern 160 is characterized in that it has a width smaller than the top width of the bank 150 and is configured to completely overlap the bank 150. That is, when the upper surface width of the bank 150 is defined as the first width, the width of the conductive pattern 160 has a second width smaller than the first width, and both side ends of the conductive pattern 160 have the above-mentioned width. By being located on the upper surface of the bank 150, the upper surface of the bank 150 is exposed to the outside of both sides of the conductive pattern 160.

In this way, the conductive pattern 160 is made to have a second width smaller than the first width of the upper surface of the bank 150 to expose the upper surface of the bank 150 to the outside of the conductive pattern 160 by a predetermined width. This is to enable the bank 150 to perform its own role, that is, to suppress defects that occur when forming the organic light-emitting layer 152 by using the hydrophobic properties of the upper surface of the bank 150.

In addition, when the conductive pattern 160 is formed to have a second width to expose the upper surface of the bank 150 as described above, the first light emitting auxiliary layer 155 provided on the upper surface of the bank 150 ) and is formed stably and without interruption on the upper part of the conductive pattern 160, thereby preventing short circuit between the conductive pattern 160 and the second electrode 158.

Meanwhile, the conductive pattern 160 formed on the bank 150 in a grid shape within the display area is shown in FIGS. 5A and 5B (a comparison with the display area of the organic light emitting display device according to the first embodiment of the present invention). Referring to the diagram (a diagram briefly showing the conductive pattern in the display area and the form of the connection wiring connected thereto), at least one non-display area (NA) located on the top, bottom, left, and right outside of the display area (AA) As for NA), all ends thereof are extended, and each end of the conductive pattern 160 extending to the non-display area (NA) of the top, bottom, left, and right sides is connected by a connecting wire 163. It is a characteristic.

In addition, a pad electrode 165 for voltage application is provided at one end of the connection wire 163 (see FIG. 5A), or a branch wire 164 is further provided by branching from the connection wire 163, and the branch wire 164 is provided at one end of the connection wire 163. A configuration in which a pad electrode 165 is provided at one end of the wiring 164 (see FIG. 5B) can be achieved.

In this way, the pad electrode 165 is formed for the connection wire 163 or the branch wire 164 branched from the connection wire 163 by simply contacting the power application probe through one or two pad electrodes 165. This is to achieve a state in which positive or negative charges are collected by simply applying a predetermined voltage to the conductive pattern 160 connected to the connection wire 163.

The formation of a structure in which a voltage can be applied to the conductive pattern 160 and positive or negative charges can accumulate will be described in detail later through a manufacturing method.

Next, referring to FIG. 3, an organic light emitting layer 152 is formed inside each pixel area (P1, P2, and P3) surrounded by the bank 150. At this time, the organic light-emitting layer 152 forms an organic light-emitting layer 152 (152a, 152b, 152c) that emits red, green, and blue colors for each of the first, second, and third pixel regions (P1, P2, and P3), respectively. In the case where the color filter layer 139 is provided as in the first modification of the first embodiment (see FIG. 4), the organic light emitting layer 152 is located in the first, second, and third pixel areas (P1, P2, and P3). Regardless, the organic light emitting layer 152 that emits white light may be formed in all pixel areas (P1, P2, and P3).

This organic light-emitting layer 152 is characterized by being formed by spraying or dropping a liquid organic light-emitting material through an inkjet device or a nozzle coating device and then curing it.

Next, a first light emitting auxiliary layer 155 is provided on the organic light emitting layer 152, the conductive pattern 160, and the entire surface of the display area above the bank 150 exposed outside the conductive pattern 160. This first light-emitting auxiliary layer 155 may have a single-layer structure of the electron transport layer 155a or the electron injection layer 155b, or may have a double-layer structure of the electron transport layer 155a and the electron injection layer 155b. .

This first light-emitting auxiliary layer 155, unlike the organic light-emitting layer 152 formed for each pixel area (P1, P2, and P3), is formed on the front of the display area, covering only the non-display area. Since thermal evaporation is possible for each pixel area (P1, P2, P3), it is characterized by being formed through thermal evaporation without a shadow mask having an opening for each pixel area (P1, P2, P3).

The first light-emitting auxiliary layer 155 is formed on the entire display area in this way because the conductive pattern 160 formed on the bank 150 and the second electrode formed on the first light-emitting auxiliary layer 155 ( This is to prevent contact with 158).

Meanwhile, although not shown in the drawing, a second auxiliary light emitting layer (not shown) may be further provided between the first electrode 147 and the organic light emitting layer 152. At this time, the second light emitting auxiliary layer (not shown) has a single-layer structure of a hole injection layer (not shown) or a hole transport layer (not shown), or a hole injection layer (not shown) and a hole transport layer (not shown). A double layer structure can be formed.

This second light-emitting auxiliary layer (not shown) is formed for each pixel area (P1, P2, and P3) by spraying or dropping using an inkjet device or a nozzle coating device in the same way as forming the organic light-emitting layer 152. am.

Next, a second electrode 158 is formed on the entire surface of the display area and is in direct contact with the first light-emitting auxiliary layer 155 . The second electrode 158 is made of a metal material with a lower work function value than that of the first electrode 147, such as aluminum (Al), aluminum alloy (AlNd), silver (Ag), magnesium (Mg), and gold (Au). ), aluminum magnesium alloy (AlMg), and serves as a cathode electrode.

At this time, the first electrode 147, the organic light-emitting layer 152, the first light-emitting auxiliary layer 155, and the second electrode 158 form an organic light-emitting diode (E). When the second light emitting auxiliary layer (not shown) is further provided, the second light emitting auxiliary layer (not shown) also becomes a component of the organic light emitting diode (E).

Meanwhile, a second substrate 170 for encapsulation is provided corresponding to the first substrate 110 of the organic light emitting display device 101 according to the first embodiment of the present invention having the above-described configuration.

The first substrate 110 and the second substrate 170 are provided with an adhesive (not shown) made of a sealant or frit along their edges, and the adhesive (not shown) is used to form the first substrate 110 and the second substrate 170. The first substrate 110 and the second substrate 170 are bonded to maintain the panel state.

At this time, the space between the first substrate 110 and the second substrate 170 that are spaced apart from each other may be in a vacuum state or may be filled with an inert gas to create an inert gas atmosphere.

The second substrate 170 for encapsulation may be made of plastic with flexible characteristics, or may be made of a glass substrate.

Meanwhile, the organic light emitting display device 101 according to the first embodiment of the present invention described above is provided with a second substrate 170 for encapsulation in a form that faces and is spaced apart from the first substrate 110. However, the second substrate 170 may be configured to contact the second electrode 158 provided on the uppermost layer of the first substrate 110 in the form of a film including an adhesive layer.

In addition, the organic light emitting display device 101 according to the first embodiment of the present invention may be further provided with an organic insulating film (not shown) or an inorganic insulating film (not shown) on the second electrode 158 to form a capping film. In addition, the organic insulating film (not shown) or the inorganic insulating film 162 may itself be used as an encapsulation film (not shown), in which case the second substrate 170 may be omitted.

The organic light emitting display device 101 according to the first embodiment of the present invention having the above-described configuration includes a conductive pattern having a second width smaller than the first width on the top of the bank 150 whose upper surface has a first width. (160) is provided.

Therefore, before forming the organic light-emitting layer 152, when a plasma process using a reactive gas is performed to modify the surface of the first electrode 147 exposed to the outside of the bank 150 and remove organic contaminants and foreign substances, the conductive pattern 160 When a predetermined voltage is applied to the conductive pattern 160 itself, negative or positive charges are collected depending on whether the applied voltage is negative or positive, thereby forming the bank (centering on the conductive pattern 160). Since the entire upper surface of the bank 150 and a portion of the side surface of the bank 150 are unaffected by the plasma process, the upper surface and a portion of the side surface of the bank 150 can maintain hydrophobic properties.

For example, the plasma process using a reaction gas is mainly carried out in an atmosphere of positive ions. In this case, when a positive voltage is applied to the conductive pattern 160 to allow positive charges to be charged, the positive charges and positive ions repel each other. As this occurs, a shield that prevents penetration of the positive ions is formed around the conductive pattern 160 charged with the positive charge, so that during plasma treatment, a portion of the top and side surfaces of the bank 150 remain constant without changing the hydrophobic properties. It can be maintained.

As the plasma process progresses, the surface of the first electrode 147 is modified to improve spreadability and organic contaminants are removed, while the hydrophobic properties of the upper surface and part of the side of the bank 150 are maintained, ink jetting or nozzle coating As a result, the defect rate can be reduced when the organic light emitting layer 152 is formed, and by improving the spreading characteristics, it is formed with an even thickness within each pixel area (P1, P2, and P3), which has the effect of improving display quality and lifespan. will be.

<Manufacturing method of the first embodiment>

Hereinafter, a method of manufacturing an organic light emitting display device according to a first embodiment of the present invention having the above-described configuration and a modification thereof will be described. At this time, the organic light emitting display device according to the first embodiment of the present invention is characterized by the configuration of the bank and the conductive pattern provided on the bank top and the surface modification of the first electrode 147 through plasma processing, and the switching and driving thin film. Since the transistor is manufactured by a general method up to the step of forming the transistor, the description will be brief and the subsequent steps will be explained in detail. In the case of the organic light emitting display device 102 according to a modified example of the first embodiment of the present invention shown in FIG. 4, a color filter layer 139 is further provided, and only the step of forming this color filter layer 139 is performed in the first embodiment. For added contrast, the description will focus on the organic light emitting display device (101 in FIG. 3) according to the first embodiment, and only the steps with differences will be briefly mentioned.

FIGS. 6A to 6K are cross-sectional views of the manufacturing step of the organic electroluminescent device according to the first embodiment of the present invention, showing the step-by-step manufacturing process for the first, second, and third pixel regions representing red, green, and blue. For convenience of explanation, the area where the driving thin film transistor (DTr) and the switching thin film transistor (not shown) are formed within each pixel area (P1, P2, P3) is defined as the device area (TrA). In the drawing, for convenience, only the first pixel area (P1) is shown, but it is also provided in the second and third pixel areas (P2 and P3), respectively.

First, as shown in FIG. 6A, a general method is performed on a first substrate 110 made of a transparent material to form a gate wire (not shown) and a date wire 130 that intersect each other, and the data wire 130. A parallel power wiring (not shown) is formed, and further, a switching thin film transistor (not shown) connected to the gate and data wiring (not shown, 130) is formed in the device area (TrA), and at the same time, the switching thin film transistor (not shown) is formed. ) and a driving thin film transistor (DTr) connected to the power wiring (not shown).

At this time, the switching and driving thin film transistor (DTr, not shown) includes an oxide semiconductor layer, or a semiconductor layer consisting of an active layer of amorphous silicon and an ohmic contact layer of impurity amorphous silicon, and a bottom with a gate electrode at the bottom. It may be formed as a gate type, or as a top gate type in which a polysilicon semiconductor layer is provided and the polysilicon semiconductor layer is formed on the lowest surface.

In the drawing, as an example, the switching and driving thin film transistor (DTr, not shown) includes a semiconductor layer 113 of polysilicon, and a gate electrode 120 is formed over the semiconductor layer 113 of polysilicon through a gate insulating film 116. ) is shown as an example of a top gate type.

Next, as shown in FIG. 6B, a planarization layer 140 having a flat surface is formed by applying an organic insulating material, such as photoacrylic, onto the switching and driving thin film transistor (DTr, not shown), and a mask is applied to this. Through the process and patterning, a drain contact hole 143 is formed that exposes the drain electrode 136 of the driving thin film transistor (DTr).

At this time, although not shown in the drawing, before forming the planarization layer 140 having a flat surface, a protective layer (not shown) made of an inorganic insulating material is first formed, and the planarization layer 140 is formed on top of this. The drain contact hole 143 may also be formed.

Meanwhile, in the case of the first modification of the first embodiment of the present invention, referring to FIG. 4, after forming the protective layer 138 made of the inorganic insulating material, the first, second, and third pixel regions (P1, The color filter layer 139 is formed by further sequentially forming red, green, and blue color filter patterns (P2, P3) (P2, P3).

This color filter layer 139 is formed by jetting red, green, and blue liquid color resist for each of the first, second, and third pixel areas (P1, P2, and P3) using an ink jet device (not shown) and baking it. Alternatively, a color resist may be applied to the entire surface, exposure and development may be performed to form a red color filter pattern 139a for the first pixel area P1, and the second and third pixel areas (P1) may be formed in the same manner. The color filter layer 139 may be formed by forming green and blue color filter patterns 139b and 139c on P2 and P3, respectively.

Next, a planarization layer 140 is formed on the color filter layer 139, and a drain contact hole 143 is formed for the planarization layer 140, the color filter layer 139, and the protective layer 138.

Since the subsequent steps are the same as the manufacturing method of the organic light emitting display device (101 in FIG. 6K) according to the first embodiment of the present invention, the description will mainly focus on the manufacturing method of the organic light emitting display device (101 in FIG. 6K) according to the first embodiment of the present invention. do.

Next, as shown in FIG. 6C, a transparent conductive material with a relatively large work function value, such as indium-tin-oxide ( ITO) is deposited, or aluminum (Al) or aluminum alloy (AlNd), a metal material with excellent reflectivity, is first deposited and then indium-tin-oxide (ITO) is deposited on top of it, and a mask process is performed on this. By patterning, a first electrode 147 is formed in each pixel region (P1, P2, P3) that contacts the drain electrode 136 of the driving thin film transistor (DTr) through the drain contact hole 143.

At this time, when a metal material with excellent reflectivity is deposited, the first electrode 147 forms a double-layer structure, and when it is made of only a transparent conductive material, it forms a single-layer structure. In the drawing, it is shown as an example that the first electrode 147 is formed as a single layer structure.

Next, as shown in FIG. 6D, a polymer material having hydrophobic properties is placed on the entire surface of the first electrode 147 and the planarization layer 140 exposed between the adjacent first electrodes 147, for example. Polymer materials that contain fluorine (F) as a hydrophobic additive, for example, exhibit properties and at the same time have photosensitive properties that are advantageous for patterning, such as polyimide, styrene, and methylmasacrylate, which contain fluorine as a hydrophobic additive. After forming a bank material layer (not shown) by applying one or a mixture of two or more of methyl mathacrylate and polytetrafluoroethylene, soft baking is performed to remove moisture. ) After performing the treatment, the exposure and development process is performed, patterning is performed, and then hard baking is performed for curing, so that the cross-sectional shape forms a dam shape at the border of each pixel area (P1, P2, P3), and the upper surface is formed. A bank 150 having this first width is formed. This bank 150 forms a grid shape that captures each pixel area (P1, P2, and P3) in a two-dimensional manner in the display area.

The bank 150 made of the above-described polymer material is arranged so that all of the minor additives, such as fluorine, move from the inside to the surface during the soft baking process and are concentrated on the surface, and when the hard baking process after patterning, the fluorine molecules and the polymer material As the main molecule is cross-linked, hydrophobic properties are expressed on the surface of the bank.

Next, as shown in FIG. 6E, a conductive material, such as a gate or data line (not shown, 130), is placed on the bank 150 having the hydrophobic characteristic, such as copper (Cu), a metal material having a low resistance characteristic. A conductive material layer (not shown) is formed by depositing any one of alloy (AlNd), aluminum (Al), aluminum alloy (AlNd), molybdenum (Mo), and molybdenum alloy (MoTi) on the entire surface, and patterning this to form the bank. (150) A conductive pattern 160 is formed on the upper surface. At this time, the conductive pattern 160 has a lattice shape in the display area, the same as the bank 150, and is formed in at least one non-display area located outside the top, bottom, left, and right sides of the display area. A characteristic feature is that each end of the conductive pattern 160 is formed to extend.

At the same time, a connection wire connecting each end of the conductive pattern 160 is further formed in the non-display area where one end of the conductive pattern 160 is extended, and a pad electrode is further formed at one end of the connection pattern. do. Alternatively, the connection wire connecting each end of the conductive pattern 160, a branch wire branched from the connection wire, and a pad electrode are formed on one end of the branch wire.

Meanwhile, the conductive pattern 160 formed on the upper surface of the bank 150 in the display area has a second width smaller than the first width of the upper surface of the bank 150, and the conductive pattern 160 is formed on both sides of the conductive pattern 160. A characteristic feature is that the upper surface of the bank 150 is exposed.

Next, as shown in FIG. 6F, the first substrate 110 on which the conductive pattern 160 is formed is placed in a reactive gas atmosphere, for example, a gas atmosphere in which oxygen (O ₂ ) and argon (Ar) are supplied at an appropriate flow rate. After being placed inside the chamber 195 of a plasma processing device having a pad electrode (not shown) at the end of a connection wire (not shown) connected to the conductive pattern 160 or a pad electrode (not shown) at the end of a branch wire (not shown) By applying a predetermined voltage by contacting a probe such as a probe (not shown), for example, positive charges are collected on the conductive pattern 160.

Thereafter, positive (+) ion plasma is generated in a state in which positive (+) charges are collected on the conductive pattern (160), thereby modifying the surface of the first electrode (147) to improve spreading characteristics and simultaneously (147) Removes organic contaminants from surfaces.

When the plasma process for surface modification of the first electrode 147 is performed, the conductive pattern 160 provided on the top of the bank 150 is filled with positive charges, so the positive (+) charge is charged. ) A repulsive force is generated between the electric charge and the positive (+) ions generated by the plasma process, so that the positive (+) ions are formed around the portion where the conductive pattern 160 is provided, similar to a shield. It becomes unaffected by ions.

When the plasma process is performed without a conductive pattern filled with positive (+) charge, as in a conventional organic light emitting display device, positive (+) ions are generated on the surface of the bank 53, or more precisely, on the surface of the bank 53. By destroying the cross-linked portion between the molecule and the main molecule of the polymer material, the hydrophobic properties of the bank 53 are reduced.

7A and 7B are diagrams showing changes in surface properties of a bank of a conventional organic light emitting display device without a conductive pattern before and after plasma treatment, respectively.

Hydrophobic and hydrophilic properties can usually be determined by measuring the contact angle, and the contact angle is the angle formed between the surface and the outermost surface of the liquid drop after dropping a certain amount of liquid on the surface of the material layer whose hydrophobic properties are to be measured. is being defined.

At this time, when the contact angle is typically 60 to 90 degrees, it has hydrophobic properties. As it approaches 90 degrees, it means that the hydrophobic properties are greatly expressed. When the contact angle is typically 40 degrees or less, it is said to have hydrophilic properties. 0 The closer it is to the degree, the greater the hydrophilic properties are expressed.

Referring to FIG. 7A, in the case of a conventional organic light emitting display device, the contact angle (C/A) of the bank before the plasma process is shown to be about 90 degrees, which shows that the hydrophobic characteristic is very strongly expressed.

However, referring to Figure 7b, the bank after the plasma process shows that its contact angle (C/A) is about 10 degrees, which shows that the hydrophobic properties are very rapidly reduced.

On the other hand, referring to FIG. 6F, in the case of the organic light emitting display device (101 in FIG. 6K) according to the first embodiment of the present invention, the plasma process is performed as if a shield is formed around the bank 150 by the conductive pattern 160. As the reaction with positive ions is suppressed during the process, the bank 150 is not affected at all even if the plasma process proceeds at least on the upper surface and part or all of the side surfaces adjacent to the upper surface due to this phenomenon. Deterioration of the hydrophobic properties of the upper and side surfaces of (150) is fundamentally suppressed.

FIGS. 8A and 8B and FIGS. 9A and 9B are diagrams showing the hydrophobic characteristics before and after plasma treatment in the organic light emitting display device according to the first embodiment of the present invention in which the conductive pattern 160 is formed, respectively. The surface characteristics of the first electrode 147 and the bank are shown before plasma treatment, and FIGS. 8B and 9B are diagrams showing changes in the surface characteristics of the first electrode 147 and the bank after plasma treatment, respectively.

Referring to FIGS. 8A and 9A, in the case of the organic light emitting display device according to the first embodiment of the present invention, before plasma treatment, the first electrode 147 shows a contact angle of about 45 degrees, and the bank shows a contact angle of about 90 degrees. It is showing. Therefore, it can be seen that the bank has very high hydrophobic properties, and the first electrode 147 shows a tendency to be hydrophilic rather than hydrophobic.

Meanwhile, referring to FIGS. 8B and 9B, it can be seen that after plasma treatment, the first electrode 147 shows a contact angle of about 10 degrees, and the bank maintains a contact angle of about 90 degrees, the same as before plasma treatment.

Therefore, in the case of the organic light emitting display device according to the first embodiment of the present invention, it can be seen that the surface of the first electrode 147 has been modified to greatly exhibit hydrophilicity by plasma treatment, and the bank is the conductive pattern 160. It can be seen that there is no change in the hydrophobic properties of the surface depending on the role.

Through this, the lifespan of the organic light emitting display device according to the first embodiment of the present invention is improved by modifying the surface of the first electrode 147 through the plasma process, and at the same time, the reduction of the hydrophobic characteristics of the bank is fundamentally suppressed. This has the effect of improving yield and reducing manufacturing costs by suppressing defects that occur during the formation of an organic light-emitting layer through later jetting of liquid organic light-emitting material through an ink jet or nozzle coating device.

Next, as shown in FIG. 6g, after the plasma process is performed to modify the surface of the first electrode 147, an inkjet device 190 or a nozzle coating device is used in response to the first substrate 110. An organic light emitting material layer 151 is formed on the top of the first electrode 147 by jetting or dropping a liquid organic light emitting material corresponding to the area surrounded by the bank 150.

At this time, in the step of jetting or dropping the liquid organic light emitting material, the liquid organic light emitting material is jetted or dropped within each pixel area (P1, P2, P3) of the inkjet device 190 or the nozzle coating device. Even if the injection or dropping position is biased due to its own error and is dropped on the bank 150, the bank 150 still has hydrophobic properties, so each pixel area (P1, P2, P3) surrounded by the bank 150 It flows inside.

In this state, as shown in FIG. 6h, a drying and curing process is performed on the organic light-emitting material layer (151 in FIG. 6g) to remove solvent and moisture, thereby forming a cured layer in each pixel region (P1, P2, and P3). The organic light-emitting layer 152 can be formed.

This organic light-emitting layer 152 causes organic light-emitting materials that emit red, green, and blue colors to be jetted or dropped for each of the first, second, and third pixel areas (P1, P2, and P3), respectively. An organic light emitting layer 152 that emits red, green, and blue light can be formed for each (P1, P2, and P3), or if a color filter layer 139 is provided as in a modified example of the first embodiment of the present invention. , the organic light emitting layer 152 that emits white light may be formed in all pixel areas (P1, P2, P3) regardless of the first, second, and third pixel areas (P1, P2, and P3).

Next, as shown in FIG. 6I, deposition, or more precisely, thermal evaporation, is performed on the first substrate on which the organic light-emitting layer 152 is formed, thereby forming a first light-emitting auxiliary layer ( 155).

The first auxiliary light emitting layer 155 is not formed for each pixel area (P1, P2, P3) but is formed on the entire display area, so it is a shadow having an opening corresponding to each pixel area (P1, P2, P3). Since there is no need to use a mask, it can be applied to large-area substrates.

This first light-emitting auxiliary layer 155 has a single-layer structure of an electron transport layer (not shown) or an electron injection layer (not shown), or a double-layer structure of an electron transport layer (not shown) and an electron injection layer (not shown). It is desirable to form it to achieve. In the drawing, an example in which an electron transport layer and an electron injection layer are formed as the first light emitting auxiliary layer 155 is shown.

The reason why the first light-emitting auxiliary layer 155 is formed on the entire surface of the display area is to prevent the second electrode formed later from contacting the conductive pattern 160 formed on the top of the bank 150.

Although not shown in the drawing, before forming the organic light emitting layer 152, a liquid light emitting auxiliary material is jetted or dropped on the first electrode 147 using an ink jet device or a nozzle coating device to form a layer in each pixel area (P1, A second light emitting auxiliary layer may be further formed for each (P2, P3). The second auxiliary light emitting layer preferably has a single-layer structure of a hole injection layer (not shown) or a hole transport layer 152, or a double-layer structure of a hole injection layer (not shown) and a hole transport layer 152. do.

These first and second light-emitting auxiliary layers allow holes and electrons to flow better into the organic light-emitting layer 152, thereby improving quantum efficiency by allowing smooth recombination of electrons and holes within the organic light-emitting layer 152. It serves to improve luminance characteristics.

Next, as shown in FIG. 6J, a metal material with a relatively low work function value, such as aluminum (Al), aluminum alloy (AlNd), silver (Ag), or magnesium (Mg), is placed on the first light emitting auxiliary layer 155. ), gold (Au), aluminum magnesium alloy (AlMg) or a mixture of two or more is deposited on the entire display area to form the second electrode 158 in the first embodiment of the present invention and its modifications. The first substrate 110 for an organic electroluminescent device is completed.

At this time, the first electrode 147, the organic light-emitting layer 152, the first light-emitting auxiliary layer 155, and the second electrode 158 are sequentially stacked in each pixel area (P1, P2, and P3) by the above-described method. It forms an organic light emitting diode (E), and when a second light emitting auxiliary layer is further provided, it also becomes a component of the organic light emitting diode.

Next, as shown in FIG. 6K, a second substrate 170 is placed for encapsulation of the organic light emitting diode (E) in correspondence with the first substrate 110 manufactured as described above, and the Between the first substrate 110 and the second substrate 170, a face seal (not shown) made of any one of frit, organic insulating material, and polymer material that is transparent and has adhesive properties is placed between the first substrate 110 and the second substrate 170. ), the first substrate 110 and the second substrate 170 are bonded together in a state of coating the entire surface, or a seal pattern (not shown) is applied along the edge of the first substrate 110 in a vacuum or inert gas atmosphere. After forming, the first and second substrates 110 and 170 are bonded to complete the organic light emitting display device according to the first embodiment or a modification of the first embodiment of the present invention.

Meanwhile, by depositing or coating an inorganic insulating material or an organic insulating material on the second electrode 158 of the first substrate 110, or by restarting an adhesive layer (not shown) and attaching a film (not shown), When used as an encapsulation film (not shown), the second substrate 170 may be omitted.

In the organic light emitting display device according to the first embodiment of the present invention or a modification thereof manufactured as described above, the surface is modified by performing a plasma process on the first electrode 147 exposed to the outside of the bank 150. Organic contaminants are removed, which has the effect of improving its lifespan.

At the same time, a conductive pattern 160 is provided on the upper surface of the bank 150 to ensure that positive charges are filled during the plasma process, thereby generating a repulsive force and fundamentally blocking positive ions and reactions generated during the plasma process. Therefore, the reduction of the hydrophobic properties of the bank 150 is fundamentally suppressed, and defects that occur when forming the organic light-emitting layer 152 through jetting of liquid organic light-emitting material through an ink jet or nozzle coating device can be suppressed. It has the effect of improving yield and reducing manufacturing costs.

<Second Embodiment>

Figure 10 is a cross-sectional view of a portion of the display area of the organic light emitting display device according to the second embodiment of the present invention, showing the first, second, and third pixel areas (P1, P2, and P3) showing red, green, and blue. 11 is a cross-sectional view of a portion of an organic light emitting display device according to a first modified example of the second embodiment of the present invention, showing red, green, and blue color in the first, second, and third pixel regions (P1, P2, and P3). This is a cross-sectional view. At this time, in the case of the second embodiment of the present invention and its first modification, the part where the driving and switching thin film transistor is configured is the same as the above-described first embodiment, so the configuration of the driving and switching thin film transistor on the first substrate is placed on the upper part thereof. It is briefly shown with only the components provided.

Furthermore, in the case of the organic light emitting display device according to the second embodiment and the first modification thereof, only the structure of the bank is different compared to the organic light emitting display device according to the first embodiment and the first modification example thereof, and all other components are different. Since they are the same, the explanation will focus on the banks that have differences.

First, referring to FIG. 10, a first electrode 147 is provided for each pixel region (P1, P2, and P3) on the top of the planarization layer 140 of the first substrate, and each electrode 147 is disposed above the first electrode 147. A characteristic feature is that banks 149 and 150 of a double-layer structure are provided at the boundaries of the pixel areas (P1, P2, and P3).

That is, in the case of the first embodiment, a bank (150 in FIG. 3) of a single-layer structure made of a polymer material with hydrophobic properties is provided, but the organic light emitting display device 103 according to the second embodiment of the present invention has the first bank (150 in FIG. 3). Bank 149 having a double-layer structure of the upper bank 150, which is made of a polymer material with hydrophobic properties, and the lower bank 149, which is made of an inorganic insulating material with hydrophilic properties, as disclosed in Example 1. 150) is provided.

At this time, the lower bank 149 located below the upper bank 150 has a width greater than the width of the lower surface of the upper bank 150, so that the lower bank 149 extends to both outer sides of the upper bank 150. It is characterized by an exposed configuration.

To be more specific, it overlaps the edge of the first electrode 147 and is made of an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiNx), and exposes the central portion of the first electrode 147. and the lower bank 149 is formed.

And on the lower bank 149, it has the same planar structure as the lower part, is made of a polymer material with hydrophobic properties, and has a smaller width than the lower bank 149, so that the lower bank 149 is formed at both ends. The upper bank 150 is formed by exposing a predetermined width as a standard.

As described above, the organic electroluminescent device 101 according to the second embodiment of the present invention has a lower bank 149 made of an inorganic insulating material with hydrophilic properties, and a width smaller than the lower bank 149. is exposed on both sides and is provided with an upper bank 150 made of a polymer material with hydrophobic properties, thereby forming an organic light-emitting layer 152 on the upper part of the lower bank 149, and the pixel area (P1) is formed by this lower bank 149. , P2, P3) to collect the organic light-emitting material when dropping it in the central part, thereby reducing the pile-up phenomenon in which the thickness of the organic light-emitting layer 152 increases, especially in the area adjacent to the upper bank 150. It plays a role.

Meanwhile, a conductive pattern 160 is provided on the upper surface of the upper bank 150 in the same manner as in the first embodiment. Since all other components are the same as the first embodiment described above, the following description is omitted.

Referring to FIG. 11, the organic light emitting display device 104 according to the first modified example of the second embodiment has the same color as the organic light emitting display device (102 in FIG. 4) according to the first modified example of the first embodiment. A filter layer 139 is further provided. The color filter layer 139 is provided below the planarization layer 140 above the switching and driving thin film transistor (not shown). At this time, when the color filter layer 139 is provided, a protective layer 138 made of an inorganic insulating material is further provided to cover the switching and driving thin film transistor (DTr, not shown), and the color is applied on this protective layer 138. A filter layer 139 is provided. Since other components are the same as those of the organic light emitting display device (103 in FIG. 10) according to the second embodiment, the following description is omitted.

Meanwhile, in the organic light emitting display device (103 in FIG. 10 and 104 in FIG. 11) according to the second embodiment of the present invention and the first modification thereof, the lower bank 149 made of an inorganic insulating material is located in each pixel area (P1). , P2, P3), the lower bank 149 is formed to have a single width in a shape that is continuously connected to the boundary of the P2, P3), but this lower bank 149 is shown in FIG. As shown in the figure (a drawing showing a bank with a difference and its surroundings), a break occurs at the boundary of each pixel area (P1, P2, not shown) in a portion overlapping with the upper bank 150. They may be formed in the same layer at the boundaries of each pixel area (P1, P2, P3) and spaced apart from each other by a predetermined width.

In this case, the separation area between the lower banks 149 is provided with the upper bank 150 having a width larger than the separation area, so that the upper bank 150 is spaced apart from the lower bank 149. It is characterized by a composition formed by filling an area.

In the organic light emitting display device 105 according to the second modification of the second embodiment having the two-stage bank 149, 150 configuration, the lower bank 149 made of an inorganic insulating material is spaced apart, and the upper bank 150 is a planarization layer. The purpose of forming a configuration in contact with 140 is to improve the adhesion of the upper bank 150. Since the bonding strength between the upper bank 150 made of a polymer material and the planarization layer 140 made of an organic material is better than the bonding force between the lower bank 149 made of an inorganic insulating material and the upper bank 150 made of a polymer material, these two The lower banks 149 are spaced apart in order to create adhesion between material layers.

The lower bank 149, which is a characteristic configuration of the second modification of the second embodiment having this configuration, is formed to be spaced apart, and the upper bank 150 and the planarization layer 140 are in contact with the spaced area of the lower bank 149. The configuration can also be applied to the organic light emitting display device (104 in FIG. 11) according to the first modification of the second embodiment of the present invention.

<Manufacturing method of the second embodiment>

In the case of the manufacturing method of the organic light emitting display device according to the second embodiment of the present invention, only the formation step of the bank with a double layer structure is different compared to the manufacturing method of the organic light emitting display device according to the first embodiment, so that the bank with the double layer structure is formed. It mainly explains the steps.

Referring to FIG. 10, after forming a first electrode 147 for each pixel region (P1, P2, and P3) on the planarization layer 140, an inorganic insulating material, such as silicon oxide, is formed on the first electrode 147. (SiO2) or silicon nitride (SiNx) is deposited on the entire surface of the first substrate to form an inorganic insulating material layer and then patterned to form the adjacent first electrodes 147 at the boundaries of each pixel region (P1, P2, and P3). ) The lower bank 149 is formed to overlap the predetermined border width.

At this time, in the case of the second modification of the first embodiment, referring to FIG. 12, when the inorganic insulating material layer is patterned, the planarization layer 140 is spaced apart from each other by a predetermined width at the boundary of each pixel region (P1, P2, and P3). A lower bank 149 is formed to expose the.

Next, as shown in FIG. 10, a polymer material with hydrophobic properties is applied onto the lower bank 149 and then patterned to form an upper bank in the form of exposing a predetermined width of both layers of the lower bank 149. 150).

At this time, referring to FIG. 12, in the case of the organic light emitting display device 105 according to the second modification of the second embodiment of the present invention, the lower bank 149 is the boundary of each pixel area (P1, P2, and P3). The upper bank 150 is formed at a predetermined distance apart from the upper bank 150 and is configured to contact the planarization layer 140 at the boundary of each pixel area (P1, P2, P3), and the upper bank 150 outside of the upper bank 150 A structure is formed in which a predetermined width of the side edge of the lower bank 149 is exposed.

Since the subsequent steps are carried out in the same manner as the manufacturing method of the organic light emitting display device according to the first embodiment, the following description will be omitted.

Meanwhile, in the case of the first modification of the second embodiment of the present invention, the manufacturing method of the second embodiment can be completed by proceeding only with the step of forming the color filter layer 139 in the same manner as in the modification of the first embodiment.

<Third Embodiment>

FIG. 13 is a cross-sectional view of a portion of the display area of the organic light emitting display device according to the third embodiment of the present invention and is a cross-sectional view of three pixel areas, and FIG. 14 is a cross-sectional view of the organic light emitting display device according to the first modification of the third embodiment of the present invention. This is a cross-sectional view of a part of a light-emitting display device and is a cross-sectional view of three pixel areas. At this time, in the case of the organic light emitting display device according to the third embodiment of the present invention and its first modification, the parts where the driving and switching thin film transistors are configured are the same as the above-described first embodiment, so the driving and switching are performed on the first substrate. The thin film transistor is omitted and only the upper part of the configuration is briefly shown.

In the case of the organic light emitting display device (106 in FIG. 13 and 107 in FIG. 14) according to the third embodiment of the present invention and its first modified example, the configuration that differs from the first embodiment is the planarization layer 140 and the bank. (159, 150), and in the case of the bank (149, 150) structure, the lower and upper banks (149, 150) are formed as shown in the organic light emitting display device (103 in FIG. 10) according to the second embodiment of the present invention. ) is characterized by a double-layer structure.

Therefore, the organic light emitting display device 106 according to the third embodiment of the present invention has the same configuration as the organic light emitting display device (103 in FIG. 10) according to the second embodiment of the present invention except for the configuration of the planarization layer 140. has

Therefore, in the case of the organic light emitting display device 106 according to the third embodiment of the present invention, the stacked form of the portion where the banks 149 and 150 are formed due to the structure of the planarization layer 140 and its structural characteristics is similar to that of the second embodiment. Since there is a difference compared to the organic light emitting display device (103 in FIG. 10) according to the example, the description will focus on the planarization layer 140 and the banks 149 and 150 of the double layer structure.

Referring to FIG. 13, in the case of the organic light emitting display device 106 according to the third embodiment of the present invention, unlike the second embodiment in which the planarization layer (140 in FIG. 10) is formed on the entire display area, the planarization layer (140 in FIG. 10) is formed on the entire display area. In this case, the boundaries of each pixel area (P1, P2, P3) in which the banks 149 and 150 are provided are patterned and removed, so that if an interlayer insulating film 123 or a protective layer (not shown) is provided, the protective layer (not shown) ) is characterized by forming a trench that exposes the The portion from which the planarization layer 140 is removed is smaller than the width of the lower bank 149 made of an inorganic insulating material, and the upper bank 150 made of a hydrophobic polymer material on the upper part of the lower bank 149 It is being formed to have a width greater than the width.

At this time, the lower bank 149 includes a portion forming the trench (trch) and extends to the upper surface of the planarization layer 140 adjacent to the left and right or top and bottom sides of the trench (trch), and the planarization layer ( 140) It is characterized by being formed to overlap a predetermined width of the edge with the first electrode 147 provided for each pixel area (P1, P2, P3) at the top.

In addition, an upper bank 150 is provided on the upper part of the lower electrode inside the trench (trch) provided by forming the planarization layer 140 to be spaced apart, and a conductive pattern 160 is provided on the upper bank 150. It is becoming.

In the case of the organic light emitting display device according to the third embodiment of the present invention having this configuration, other configurations are the same as those of the second embodiment and are therefore omitted.

In the organic light emitting display device according to the third embodiment of the present invention having this configuration, the upper bank 150 having hydrophobic characteristics is provided inside the trench (trch), which is a separation area of the planarization layer 140, so that the upper bank 150 ) The pile-up phenomenon in the periphery is reduced, and as a result, the organic light-emitting layer 152 can be formed with a more even thickness in the area where the first electrode 147, which is provided only on the top of the planarization layer 140, is located. It has the effect of further improving bar life.

Meanwhile, referring to FIG. 14, the organic light emitting display device 107 according to the first modification example of the third embodiment of the present invention has a color filter layer (a color filter layer) under the planarization layer 140 in the same manner as the first modification example of the second embodiment. 139) is further provided, and the portion forming the trench (trch) of the planarization layer 140 is characterized in that the surface of the color filter layer 139 is exposed. Components other than the addition of the color filter layer 139 are the same as those of the organic light emitting display device (106 in FIG. 13) according to the third embodiment described above, so description thereof will be omitted.

<Manufacturing method of the third embodiment>

The manufacturing method of the organic light emitting display device according to the third embodiment differs from the manufacturing method of the organic light emitting display device according to the second embodiment only in the step of forming the planarization layer 140 and the formation of other components. Since the steps are the same, the description will focus on the step of forming the planarization layer 140.

Referring to FIG. 13, after forming a switching and driving thin film transistor (not shown), an organic insulating material, such as photoacrylic, is applied on the entire surface of the first substrate 110 to form an organic insulating material layer (not shown). forms.

Afterwards, an exposure and development process using an exposure mask is performed on the organic insulating material layer (not shown) to remove a portion corresponding to a predetermined width in the non-display area and the boundary of each pixel area (P1, P2, P3). As a result, each pixel area (P1, P2, P3) is spaced apart in the display area, and a lower component, such as an interlayer insulating film (not shown) or a protective layer (not shown), is formed for each pixel area (P1, P2, P3). In this case, a trench (trch) is formed to expose the protective layer (not shown). Although not shown in the drawing, in the process of forming the trench (trch), a drain contact hole (not shown) that exposes the drain electrode (not shown) of the driving thin film transistor (not shown) is also formed at the same time.

Thereafter, a first electrode 147 is formed for each pixel region (P1, P2, P3) on the planarization layer 140 formed to be spaced apart from each other. At this time, the first electrode 147 completely overlaps the planarization layer 140 formed for each pixel region (P1, P2, P3) with a trench (trch) in between, and at the same time, the edge of each planarization layer 140 The characteristic feature is that it is formed to form a shape that exposes a predetermined width.

Next, with the first electrode 147 formed, an inorganic insulating material is deposited on the entire surface of the first substrate 110 over the first electrode 147 and patterned to form the boundaries of each pixel region (P1, P2, and P3). A lower bank 149 is formed in . At this time, the lower bank extends inside the trench (trch) and to the upper part of the planarization layer 140 adjacent to each other up and down or left and right with each trench (trch) in between, forming the upper part of each planarization layer 140. It is formed to cover the edge of the first electrode 147 up to a predetermined width.

Next, a polymer material having hydrophobic properties is applied to the entire surface of the first substrate 110 over the lower bank 149 and the first electrode 147, and then patterned to form the lower bank into the trench (trch). (149) Forms an upper bank 150 with hydrophobic properties at the top.

Since the subsequent manufacturing steps are the same as the manufacturing method of the organic light emitting display device (103 in FIG. 10) according to the second embodiment, the description thereof will be omitted below.

Meanwhile, the organic light emitting display device (107 in FIG. 14) according to the first modification of the third embodiment of the present invention proceeds with the step of further forming the color filter layer 139 before forming the planarization layer 140. , It can be completed by proceeding with the manufacturing method of the organic light emitting display device (106 in FIG. 13) according to the third embodiment described above.

<Fourth Embodiment>

Figure 15 is a cross-sectional view of a portion of the display area of the organic light emitting display device according to the fourth embodiment of the present invention and is a cross-sectional view of three pixel areas, and Figure 16 is a cross-sectional view of the organic light emitting display device according to the first modification of the fourth embodiment of the present invention. This is a cross-sectional view of a part of a light-emitting display device and is a cross-sectional view of three pixel areas. At this time, in the case of the fourth embodiment of the present invention and its first modification, the part where the driving and switching thin film transistor is configured is the same as the first embodiment described above, so the driving and switching thin film transistor is omitted on the first substrate and the upper part thereof is omitted. Only the configuration is briefly shown.

The organic light emitting display device according to the fourth embodiment of the present invention is similar to the above-described third embodiment of the present invention, and the different part is the planarization layer 140.

In the case of the organic light emitting display device (106 in FIG. 13) according to the third embodiment of the present invention, referring to FIG. 13, the planarization layer 140 is removed at the boundary of each pixel area (P1, P2, and P3). In the portion forming the trench (trch), the planarization layer 140 is completely removed, so that the interlayer insulating film (not shown), which is a component located below, is exposed, or if a protective layer (not shown) is provided, the protective layer (not shown) is exposed. A structure was created to expose poetry).

However, referring to FIG. 15, in the case of the organic light emitting display device 108 according to the fourth embodiment of the present invention, the portion forming the trench (trch) is not completely removed, but the planarization layer 140 is removed from the upper surface. It is characterized by being formed with a thinner thickness compared to other areas by removing a certain thickness.

Therefore, in the case of the organic light emitting display device 108 according to the fourth embodiment of the present invention, the planarization layer 140 provided on the entire display area has a first thickness corresponding to each pixel area (P1, P2, and P3). (t1), and at the boundary of each pixel area (P1, P2, P3), a second thickness (t2) is thinner than the first thickness (t1) and is formed low, forming a trench (trch).

Since the rest of the configuration is the same as the organic light emitting display device (106 in FIG. 13) according to the third embodiment of the present invention described above, the following description is omitted.

Meanwhile, referring to FIG. 16, the organic light emitting display device 109 according to the first modified example of the fourth embodiment of the present invention is the second embodiment in the organic light emitting display device (108 in FIG. 15) according to the fourth embodiment of the present invention. In the same manner as the organic light emitting display device (104 in FIG. 11) according to the first modification example, the color filter layer 139 is further provided below the planarization layer 140. Components other than the addition of the color filter layer 139 have the same configuration as the fourth embodiment described above, so description thereof will be omitted.

<Manufacturing method of the fourth embodiment>

The manufacturing method of the organic light emitting display device (108 in FIG. 15) according to the fourth embodiment of the present invention has a planarization layer 140 compared to the manufacturing method of the organic light emitting display device (106 in FIG. 13) according to the third embodiment of the present invention. ) There is only a difference in the forming step, and since the forming steps of other components are the same, the description will focus on the forming step of the planarization layer 140.

Referring to FIG. 15, after forming a switching and driving thin film transistor (not shown), an organic insulating material, such as photoacrylic, is applied on top of the entire surface of the first substrate 110 to form an organic insulating material layer having a flat surface. (not shown).

Afterwards, halftone exposure or diffraction exposure is performed on the organic insulating material layer (not shown) using an exposure mask having a transmission area, a blocking area, and a semi-transmission area, and then a development process is performed and patterning is performed to form a non-display area. The organic insulating material layer (not shown) is completely removed, and in the display area, a predetermined thickness is removed as the upper surface of the portion corresponding to the predetermined width of the border of each pixel area (P1, P2, P3). As a result, a planarization layer 140 having a flat surface is formed in each pixel region (P1, P2, P3) while forming a thinner shape compared to other regions.

At this time, in the planarization layer 140 formed in the display area, the portion where the thickness of the border of each pixel region (P1, P2, P3) is thinner than the portion formed inside each pixel region (P1, P2, P3) is a trench (trch). ) is achieved. The trench (trch) having this structure has a structure that exposes the interlayer insulating film (not shown) or the protective layer (not shown) in the case of the organic light emitting display device (106 in FIG. 13) according to the third embodiment. In the case of the organic light emitting display device (108 in FIG. 15) according to the fourth embodiment, a portion made of organic insulating material still remains, so that the components located below are not exposed.

Although not shown in the drawing, in the process of forming the planarization layer 140 with the trench (trch), which is an area whose thickness is thinner than the area formed in each pixel area, the drain electrode (not shown) of the driving thin film transistor (not shown) A drain contact hole (not shown) exposing is also formed at the same time.

Since the subsequent manufacturing steps are the same as the manufacturing method of the organic light emitting display device (106 in FIG. 13) according to the third embodiment of the present invention, the description thereof will be omitted below.

Meanwhile, in the case of the manufacturing method of the organic light emitting display device (109 in FIG. 16) according to the first modification of the fourth embodiment of the present invention, the color filter layer 139 is further formed before forming the planarization layer 140. After proceeding with the steps, it can be completed by proceeding with the manufacturing method of the organic light emitting display device (108 in FIG. 15) according to the fourth embodiment described above.

The present invention is not limited to the above-described embodiments and modifications, and may be implemented with various changes without departing from the spirit of the present invention.

101: Organic light emitting display device
110: first substrate
113: semiconductor layer
113a, 113b: Areas 1 and 2
116: gate insulating film
120: gate electrode
123: Interlayer insulating film
125: semiconductor layer contact hole
130: data wiring
133: source electrode
136: drain electrode
140: Flattening layer
143: drain contact hole
147: first electrode
150: bank
152: Organic light emitting layer
155: first light emitting auxiliary layer
155a: electron transport layer
155b: electron injection layer
158: second electrode
160: conductive pattern
170: second substrate
DTr: Driving thin film transistor
P(P1, P2, P3): Pixel area (1st, 2nd, 3rd pixel area)
TrA: device area

Claims (15)

A first substrate including a plurality of pixel areas;
a first hydrophobic bank formed at the boundary of the pixel area;
A first electrode disposed in the pixel area, formed in each of the plurality of pixel areas and having an edge overlapping with the first bank, an organic light-emitting layer disposed on the first electrode inside the pixel area, and on the organic light-emitting layer An organic light emitting device including a light emitting auxiliary layer and a second electrode disposed on the front surface of the first substrate; and
It consists of a conductive pattern formed in a grid shape disposed on the first bank and surrounding a plurality of pixel areas,
The conductive pattern is in direct contact with the light emitting auxiliary layer and is formed to have a width narrower than that of the first bank, exposing both sides of the upper surface of the first bank,
The light emitting auxiliary layer extends from the top of the organic light emitting layer between the conductive pattern and the second electrode to electrically insulate the conductive pattern and the second electrode. delete delete According to paragraph 1,
an insulating layer formed on the first substrate and having an organic light emitting device disposed thereon; and
The organic light emitting display device further includes a trench formed in the insulating layer at a boundary of each pixel area. The organic light emitting display device of claim 4, wherein the trench is formed by completely removing the insulating layer to expose underlying components. The organic light emitting display device of claim 4, wherein the trench is formed by having an insulating layer in the pixel area be thinner than that in other areas. According to paragraph 1,
Connection wiring connected to the conductive pattern; and
The organic light emitting display device further includes a pad electrode connected to the connection wire to supply a charge charging voltage applied from the outside to the conductive pattern through the connection wire. According to claim 1,
The organic light emitting display device further includes a second bank disposed below the first bank. The organic light emitting display device of claim 8, wherein the second bank has a width greater than that of the first bank and overlaps an edge of an adjacent first electrode. The organic light emitting display device of claim 8, wherein the second bank is made of an inorganic insulating material. According to clause 8,
The second bank is provided in the form of double lines spaced apart from each other by removing the central portion from the border of each pixel area,
The first bank is arranged to overlap a spaced area of the second bank having the double line shape. According to claim 4,
An organic light emitting display device further comprising a color filter layer disposed below the insulating layer. According to paragraph 4,
The first bank is an organic light emitting display device located inside the trench.
The organic light emitting display device of claim 4, wherein the organic light emitting layer is disposed inside the trench. The organic light emitting display device of claim 1, wherein the auxiliary light emitting layer includes at least one of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.