KR102579307B1 - Organic light emitting display device - Google Patents

Abstract

An organic light emitting display device is provided. The organic light emitting display device includes a plurality of sub-pixels including an anode and a cathode, an anode wiring configured to supply an anode voltage to the anode, and a cathode wiring configured to supply a cathode voltage to the cathode, and in each of the plurality of sub-pixels In order to reduce the potential difference between the anode and the cathode, the anode voltage input direction of the anode wiring and the cathode voltage input direction of the cathode wiring are configured to be different from each other and face each other. Accordingly, the uniformity of the anode-cathode potential difference according to the wiring resistance can be improved.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device, and more specifically, when the organic light emitting display device is enlarged, the potential difference between the anode and the cathode according to the position of the pixel area of the organic light emitting display device is reduced, and the organic light emitting display device is improved. It relates to an organic light emitting display device having a voltage supply wiring structure capable of improving luminance uniformity.

As we enter the full-fledged information age, the field of display devices that visually display electrical information signals is rapidly developing. Accordingly, research is continuing to develop performance such as thinner, lighter, and lower power consumption for various flat panel display devices. Representative examples of such flat panel display devices include Liquid Crystal Display device (LCD), Plasma Display Panel device (PDP), Field Emission Display device (FED), and electrowetting display device. (Electro-Wetting Display device: EWD) and Organic Light Emitting Display device (OLED).

Organic light emitting display devices are self-emitting display devices, and unlike liquid crystal displays, they do not require a separate light source and can be manufactured in a lightweight and thin form. In addition, organic light emitting display devices are not only advantageous in terms of power consumption due to low voltage driving, but also have excellent color reproduction, response speed, viewing angle, and contrast ratio (CR), and are being studied as next-generation display devices.

The active area (AA) of an organic light emitting display device includes a plurality of sub-pixels. Each sub-pixel includes an organic light emitting diode (OLED). Each organic light emitting diode includes an anode, an organic light emitting layer, and a cathode. The anode voltage (ELVDD) is supplied to the anode, and the cathode voltage (ELVSS) is supplied to the cathode.

In the case of a top-emission organic light emitting display device, the cathode uses a transparent or translucent electrode to emit light emitted from the organic light emitting layer upward. This cathode is formed to be thin in order to have transparency. Therefore, the resistance of the cathode increases significantly.

In order to ensure the reliability of the organic light emitting display device, an encapsulation portion is formed on the organic light emitting device including the organic light emitting layer to protect the organic light emitting layer from moisture, physical shock, or foreign substances that may occur during the manufacturing process. In a top emission type organic light emitting display device, a glass encapsulation part or an encapsulation part with a thin film encapsulation structure in which inorganic encapsulation layers and organic material layers are alternately stacked to delay moisture penetration are used as the encapsulation part.

As the size of the top-emission organic light emitting display device becomes larger, the length of the wiring that supplies voltage becomes longer. The wiring resistance applied to each sub-pixel increases in proportion to the length of the wiring. Therefore, the voltage transmitted along the wiring varies for each sub-pixel. Therefore, a problem occurs in which the luminance uniformity of the organic light emitting display device deteriorates.

[Related technical literature]

1. Organic light emitting display device and method of manufacturing organic light emitting display device (Korean Patent Application No. 10-2013-0158972)

Recently, organic light emitting display devices with high integration and high resolution are required. Additionally, in order to improve the image quality of organic light emitting display devices, various additional compensation circuits are required in the pixel area. Therefore, when arranging the wires that supply the anode voltage (ELVDD) and the wires that supply the cathode voltage (ELVSS) to the organic light emitting display device, it is difficult to secure a sufficient width of the wires.

The inventor of the present invention has continued various studies to improve the problem of deterioration of image luminance uniformity, which becomes more vulnerable as top-emission organic light emitting display devices become larger. Specifically, continuous research and development was conducted on the arrangement structure of the cathode voltage supply wiring and anode voltage supply wiring that can reduce wiring resistance problems.

Specifically, research has been conducted on a new arrangement structure of voltage supply wiring that can improve the uniformity of the potential difference between the anode and cathode applied to each sub-pixel, even if the voltage reduction problem occurs due to the resistance of the wiring.

In particular, note that the anode voltage (ELVDD) has the characteristic of gradually decreasing as the wiring distance from the voltage source increases, and the cathode voltage (ELVSS) has the characteristic of gradually increasing as the wiring distance from the voltage source increases. did.

The inventor of the present invention invented an organic light emitting display device in which the potential difference between anode and cathode can be uniformly improved by optimizing the input direction of the anode voltage (ELVDD) supply wiring and the input direction of the cathode voltage (ELVSS) supply wiring. .

Accordingly, the problem to be solved by the present invention is to make the voltage input directions of the anode voltage (ELVDD) supply wiring and the cathode voltage (ELVSS) supply wiring opposite to each other, so that the wiring resistance can be made uniform regardless of the location of the sub-pixel. An organic light emitting display device in which the potential difference between an anode and a cathode can be uniformly improved is provided by providing a voltage supply wiring structure.

Another problem to be solved by the present invention is to provide an organic light emitting display device having a structure of a voltage supply wiring and a voltage supply pad that can be applied to a transparent organic light emitting display device by optimizing the voltage supply wiring structure.

Another problem to be solved by the present invention is to provide an organic light emitting display device having sub-pixel structures optimized for the above-described voltage supply wiring structures and an image signal compensation unit corresponding to the sub-pixel structures.

Another problem to be solved by the present invention is to provide an organic light emitting display device having a transparent portion optimized for the above-described sub-pixel structures.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

An organic light emitting display device according to an embodiment of the present invention is provided. The organic light emitting display device includes a plurality of sub-pixels including an anode and a cathode, an anode wiring configured to supply an anode voltage to the anode, and a cathode wiring configured to supply a cathode voltage to the cathode, and in each of the plurality of sub-pixels In order to reduce the potential difference between the anode and the cathode, the anode voltage input direction of the anode wiring and the cathode voltage input direction of the cathode wiring are configured to be different from each other and face each other. Accordingly, the uniformity of the anode-cathode potential difference according to wiring resistance can be improved.

According to another feature of the present invention, the organic light emitting display device is configured such that the anode voltage of the anode wiring is gradually reduced along the anode voltage input direction, and the organic light emitting display device is configured such that the cathode voltage of the cathode wiring is gradually reduced along the cathode voltage input direction. Therefore, it is configured to gradually increase, and the degree of reduction according to the distance of the anode voltage of the anode wiring and the degree of increase according to the distance of the cathode voltage of the cathode wiring are set respectively by the wiring resistance of the anode wiring and the wiring resistance of the cathode wiring. do.

According to another feature of the present invention, the organic light emitting display device is configured such that the reduced anode voltage of the anode wiring offsets the increased cathode voltage of the cathode wiring, so that the potential difference between the anode and cathode of the plurality of sub-pixels is compensated. It is characterized by being composed of:

According to another feature of the present invention, the difference between the wiring resistance of the anode wiring and the wiring resistance of the cathode wiring is less than 10%.

According to another feature of the present invention, the organic light emitting display device further includes a pixel area including a plurality of sub-pixels and a peripheral area configured to surround the pixel area, wherein the anode wire extends from one side to one side of the peripheral area. It extends in the direction of the other side facing the other side and is connected to a plurality of sub-pixels, and the cathode wiring extends from the other side of the peripheral area in the direction of one side facing the other side and is connected to the plurality of sub-pixels. Do it as

According to another feature of the present invention, the anode wiring and the cathode wiring include unidirectional input wiring, and the anode wiring and the cathode wiring are shorted at the ends of the pixel area.

According to another feature of the present invention, the anode wiring and the cathode wiring have a comb shape, and the anode wiring and the cathode wiring are configured so that the teeth of the anode and cathode wiring are interlaced with each other in the pixel area.

An organic light emitting display device according to another embodiment of the present invention is provided. The organic light emitting display device includes a pixel area including a plurality of sub-pixels, a peripheral area configured to surround the pixel area, disposed on one side of the peripheral area, extending from one side toward the other side facing the other side, and forming an anode in the pixel area. It includes an anode wiring configured to supply a voltage, and a cathode wiring configured to supply a cathode voltage to the pixel area, which is disposed on the other opposite side of the peripheral area and extends from the other facing side toward one side. Accordingly, the uniformity of the anode-cathode potential difference according to wiring resistance can be improved.

According to another feature of the present invention, each of the plurality of sub-pixels is driven by a driving transistor including an active layer, a gate electrode, a source electrode, and a drain electrode, a data line configured to apply an image signal to the driving transistor, and a driving transistor. It includes an organic light-emitting diode including an anode, an organic light-emitting layer, and a cathode, the data wire is electrically connected to the gate electrode of the driving transistor, the anode wire is electrically connected to the drain electrode of the driving transistor, and the cathode wire is an organic light-emitting diode. It is characterized by being electrically connected to the cathode of the light emitting diode.

According to another feature of the present invention, the image signal applied to the driving transistor through the data line is an image signal changed to compensate for the Vgs voltage according to the increase in cathode voltage of the cathode of each of the plurality of sub-pixels.

According to another feature of the present invention, the plurality of sub-pixels further include a transparent portion to provide transparency.

According to another feature of the present invention, the organic light emitting display device further includes at least one circuit board, and the at least one circuit board is arranged so as not to overlap the back surface of the pixel area.

According to another feature of the present invention, one of the anode wiring and the cathode wiring is configured to surround the peripheral area, and the anode wiring and the cathode wiring are configured to receive voltage from the same side of the peripheral area.

According to another feature of the present invention, the organic light emitting display device further includes a jump wiring, the anode wiring and the cathode wiring are made of the same material, and one of the anode wiring and the cathode wiring has at least two wires in the surrounding area. It is separated into parts, and the wiring separated into at least two parts is characterized by being connected by jump wiring.

According to another feature of the present invention, the cathode wiring is composed of at least two metal layers, and the at least two metal layers are connected to each other through a contact hole.

Specific details of other embodiments are included in the detailed description and drawings.

The present invention has the effect of improving the luminance uniformity of the organic light emitting display device by making the input directions of the anode voltage (ELVDD) supply wiring and the cathode voltage (ELVSS) supply wiring be opposite to each other.

In addition, the present invention has the effect of improving the luminance uniformity of the organic light emitting display device by making the unit wire resistance value of the anode voltage (ELVDD) supply wire and the unit wire resistance value of the cathode voltage (ELVSS) supply wire substantially the same. There is.

In addition, the present invention provides transparency by arranging various circuit boards only on the first side of the peripheral area of the organic light emitting display panel and extending one voltage supply wire through the peripheral area to the third side facing the first side. This has the effect of providing a voltage supply wiring structure applicable to organic light emitting display devices.

Additionally, the present invention has the effect of further improving luminance uniformity by using an image signal compensator.

The effects according to the present invention are not limited to the contents exemplified above, and further various effects are included in the present specification.

1A is a schematic plan view of an organic light emitting display device according to an embodiment of the present invention.
FIG. 1B is a schematic plan view illustrating the arrangement positions of circuit boards on the back of an organic light emitting display device according to an embodiment of the present invention.
FIG. 1C is a schematic cross-sectional view of a sub-pixel of an organic light emitting display device according to an embodiment of the present invention.
FIG. 1D is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of an organic light emitting display device according to an embodiment of the present invention.
FIG. 1E is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of an organic light emitting display device according to an embodiment of the present invention.
FIG. 1F is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of the organic light emitting display device according to Comparative Example 1.
FIG. 1G is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of the organic light emitting display device according to Comparative Example 1.
FIG. 1H is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of the organic light emitting display device according to Comparative Example 2.
FIG. 1I is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of the organic light emitting display device according to Comparative Example 2.
Figure 2 is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.
Figure 3 is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.
FIG. 4A is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.
FIG. 4B is a schematic cross-sectional view of a sub-pixel of an organic light emitting display device according to another embodiment of the present invention shown in FIG. 4A.
FIG. 5A is a schematic plan view of an organic light emitting display device including an image signal compensator according to another embodiment of the present invention.
FIG. 5B is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of an organic light emitting display device to which a compensated image signal is supplied according to another embodiment of the present invention.
FIG. 5C is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of an organic light emitting display device according to another embodiment of the present invention and a compensated image signal.
FIG. 6A is a schematic plan view of an organic light emitting display device including a data driving circuit according to another embodiment of the present invention.
FIG. 6B is a schematic equivalent circuit diagram illustrating the resistance value of each modified sub-pixel of an organic light emitting display device supplied with a compensated image signal according to another embodiment of the present invention.
FIG. 6C is a schematic graph illustrating the potential difference between the anode and cathode of each modified sub-pixel of the organic light emitting display device according to another embodiment of the present invention and the compensated image signal.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

When an element or layer is referred to as “on” another element or layer, it includes instances where the other layer or other element is directly on top of or interposed between the other elements.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, and as can be fully understood by those skilled in the art, various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other. It may be possible to conduct them together due to a related relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

1A to 1B are schematic plan views of an organic light emitting display device according to an embodiment of the present invention.

1A to 1B, an organic light emitting display device 100 according to an embodiment of the present invention includes an organic light emitting display panel 110, a data circuit board 140, a control circuit board 142, and a first flexible display panel. It includes a circuit board 144, a second flexible circuit board 146, and a flexible cable 148.

The control circuit board 142 is electrically connected to the data circuit board 140 by a flexible cable 148. The data circuit board 140 is electrically connected to the organic light emitting display panel 110 by the first flexible circuit board 144 and the second flexible circuit board 146.

1. Organic light emitting display panel

The organic light emitting display panel 110 includes a pixel area (active area) and a peripheral area (PA). In the pixel area AA of the organic light emitting display panel 110, a plurality of sub-pixels 112 including a white sub-pixel, a red sub-pixel, a green sub-pixel, and a blue sub-pixel. , a plurality of gate wires 116, a plurality of data wires 120, a plurality of second anode wires 130a, and a plurality of second cathode wires 134a are disposed, and the pixel area AA displays an image. It is configured to do so. The peripheral area PA of the organic light emitting display panel 110 is configured to surround the pixel area AA. Various wires and circuits for driving the plurality of sub-pixels 112 of the pixel area AA are arranged in the peripheral area PA. A first anode wire 130, a first cathode wire 134, and a plurality of pads are disposed in the peripheral area PA, and additional circuit components may also be disposed. For example, a flexible printed circuit board (FPCB), a flexible cable, or a semiconductor chip may be bonded onto the plurality of pads using a bonding member. For example, wires that can be connected to a plurality of pads may include a plurality of gate wires 116, a plurality of data wires 120, a first anode wire 130, and a first cathode wire 134.

2. Control circuit board

The control circuit board 142 receives digital image signals, various reference voltages, and various control signals from an external system, and controls the organic light emitting display panel 110 to display images on the organic light emitting display panel 110. performs its function. In order to perform the above-described functions, the control circuit board 142 includes a processor, memory, look-up table, and buffer on a printed circuit board (PCB). , circuit elements such as a gamma control circuit, a low voltage differential signal (LVDS) wiring, a connector, and a power control unit may be arranged. However, it is not limited to this.

The control circuit board 142 precisely controls the time interval and frequency period of the image signal and control signals so that the input digital image signal can be displayed on the organic light emitting display panel 110. Circuit elements disposed on the control circuit board 142 may be implemented with various image processing algorithms capable of implementing various image quality or low power consumption.

The digital image signal input to the control circuit board 142 from an external system is generally an image signal composed of three primary color information: red, green, and blue (RGB). Since the organic light emitting display panel 110 according to an embodiment of the present invention is composed of white, red, green, and blue sub-pixels 112, the circuit elements disposed on the control circuit board 142 are in RGB format. A rendering algorithm that can convert an image signal into a WRGB (white, red, green, blue) format image signal can be implemented.

The digital video signal output from the control circuit board 142 is a video signal in WRGB format. However, it is not limited to this. However, for convenience of explanation, only the control signals related to the present invention among the various control signals described above will be described in detail below.

Various reference voltages output from the control circuit board 142 include anode voltage (ELVDD), cathode voltage (ELVSS), gamma reference voltage, initial voltage (V _init ), and gate high voltage (gate). high voltage (VGH), gate low voltage (VGL), and external compensation reference voltage (Vref). However, it is not limited to this. However, for convenience of explanation, only the reference voltage related to the present invention among the various reference voltages described above will be described in detail below.

The anode voltage ELVDD is a voltage applied to the anode electrode of the pixel area AA of the organic light emitting display panel 110. The cathode voltage ELVSS is a voltage applied to the cathode electrode of the pixel area AA of the organic light emitting display panel 110. The gamma reference voltage is a reference voltage used when converting a digital image signal into an analog image signal in the data driving circuit 118. The initialization voltage is a voltage used to prevent the black gradation of the image from being distorted by discharging the image signal of the previous image frame previously stored in the capacitor of the sub-pixel 112 of the pixel area (AA). am. The gate high voltage and gate low voltage are voltages for switching the gate driving circuit on-off. The external compensation reference voltage is a reference voltage for compensating for threshold-voltage (Vth) deviation of the driving transistor (D _TR ) of the sub-pixel 112.

Among the above-mentioned reference voltages, the anode voltage (ELVDD), cathode voltage (ELVSS), and gamma reference voltage are major reference voltages that can directly affect the quality of the image of the organic light emitting display panel 110, so the organic light emitting display panel 110 It must be provided uniformly and stably to the panel. However, this should not be interpreted to mean that other voltages do not directly affect image quality.

Various control signals output from the control circuit board 142 include gate start pulse (GSP), gate out enable (GOE), and dot clock. However, it is not limited to this. However, for convenience of explanation, control signals related to the present invention among the various control signals described above will be described in detail later.

In some embodiments, an organic light emitting display panel may be composed of red, green, blue, and green sub-pixels. Therefore, a rendering algorithm capable of converting an image signal in RGB format into a signal in RGBG (red, green, blue, green) format can be implemented in circuit elements disposed on the control circuit board.

In some embodiments, an organic light emitting display panel may be composed of red, green, blue, and yellow sub-pixels. Therefore, a rendering algorithm capable of converting an RGB format image signal into an RGBY (red, green, blue, yellow) format signal can be implemented in circuit elements placed on the control circuit board.

In some embodiments, an organic light emitting display panel may be composed of red, green, and blue sub-pixels.

3. Flexible cable

The flexible cable 148 electrically connects the control circuit board 142 and the data circuit board 140. The flexible cable 148 transmits digital image signals, various reference voltages, and various control signals output from the control circuit board 142 to the data circuit board 140. One side of the flexible cable 148 is connected by a connector disposed on the control circuit board 142, and the other side is connected by a connector disposed on the data circuit board 140. However, the flexible cable and connector structure are only a means of electrical connection and are not limited thereto.

1A and 1B, four connectors are disposed on the control circuit board 142, and each connector is connected to each flexible cable 148. According to this configuration, the control circuit board 142 can provide various signals to the upper side (first side) and lower side (third side) of the organic light emitting display panel 110 based on the Y-axis.

Here, the first side can be defined as the upper side, the second side as the left side, the third side as the lower side, and the fourth side as the right side.

4. Data circuit board

The data circuit board 140 receives digital image signals, various reference voltages, and various control signals output from the control circuit board 142, and transmits them through the first flexible circuit board 144 and the second flexible circuit board 146. The above-described signals and voltages are transmitted to the organic light emitting display panel 110. To perform the above-described functions, the data circuit board 140 includes various circuit elements disposed on a printed circuit board (PCB). For example, the data circuit board 140 includes passive elements such as resistors and capacitors to stabilize the gamma reference voltage, which is the standard for generating analog image signals of the data driving circuit 118. It is composed. In addition, the data circuit board 140 is configured to minimize the line resistance of the data circuit board 140 in order to minimize the voltage drop of the anode voltage (ELVDD), cathode voltage (ELVSS), and gamma reference voltage. do.

1A to 1B, the data circuit board 140 disposed on the lower side (or third side) of the organic light emitting display panel 110 in the Y-axis direction does not include the data driving circuit 118. Therefore, passive elements to stabilize the gamma reference voltage are not included.

In some embodiments, the control circuit board and data circuit board may be integrated into one circuit board. In this case the flexible cable is unnecessary and can be eliminated.

5. Data driving circuit

The data-driver IC 118 performs a digital to analogue converter (DAC) function that converts digital image signals into analog image signals, so that the organic light-emitting display panel 110 connected to the data-drive circuit 118 An analog image signal is supplied to the data line 120 of the pixel area (AA). The data driving circuit 118 is composed of a semiconductor chip and is bonded to the first flexible circuit board 144 in the form of a COF (chip on film) using a bonding fan. The data driving circuit 118 in the form of a semiconductor chip has a predetermined controllable number of data lines or channels, and the number of data driving circuits 118 is equal to the number of data lines 120 of the organic light emitting display panel 110. It may be determined according to the number of channels of the data driving circuit 118. However, the number of data driving circuits 118 is not limited to this.

The data driving circuit 118 converts the digital image signal received from the control circuit board 142 into an analog image signal using a gamma reference voltage in order to display the gray level value of the image signal on the sub-pixel 112. do. The data driving circuit 118 receives a gamma reference voltage from the data circuit board 140. Analog video signals are generated using a gamma reference voltage. The video signal preferably has a gamma curve with a gamma characteristic of 2.2. However, it is not limited to this.

The sub-pixel 112 includes red, green, and blue color filters and an organic light emitting layer that emits white light. In particular, according to this configuration, since the organic light emitting layer is the same regardless of the color of each sub-pixel, the gamma curve for each color can be configured to be the same. However, it is not limited to this, and can also be configured to have an independent gamma curve for each color.

An anisotropic conductive film (ACF) is used as a cementing member. In particular, the organic light emitting display panel 110 is vulnerable to high temperatures, making general soldering difficult, so it is desirable to use an anisotropic conductive film. In an anisotropic conductive film, conductive particles are dispersed and adhered by heat and pressure. At this time, the film layer of the anisotropic conductive film maintains adhesion between the plurality of pads and the semiconductor chip, and the dispersed conductive particles electrically connect the plurality of pads and the semiconductor chip to each other in the bonded area. However, the cementation member is not limited to this.

In some embodiments, a plurality of sub-pixels of an organic light emitting display panel may be formed to include red, green, and blue organic light emitting layers that emit red, green, and blue light. At this time, it is possible for the color filter to be removed. When the organic light-emitting layers are different from each other, the electrical characteristics of the organic light-emitting layers are different, so the gamma voltage must be configured differently for each color of each sub-pixel.

6. First flexible circuit board

The first flexible circuit board 144 includes a data driving circuit 118 and electrically connects the data circuit board 140 and the organic light emitting display panel 110. One side of the first flexible circuit board 144 is bonded to the organic light emitting display panel 110, the other side is bonded to one side of the data circuit board 140, and the central region of the first flexible circuit board 144 A data driving circuit 118 is attached to . The first flexible circuit board 144 has a plurality of pads on one side, a plurality of pads on the other side, and a plurality of pads in the central portion. That is, the first flexible circuit board 144 is in a COF (chip on film) form in which a semiconductor chip is disposed on a film. Bonding members are disposed on the plurality of pads. An anisotropic conductive film is used as a bonding member. However, the cementation member is not limited to this.

7. Second flexible circuit board

The second flexible circuit board 146 electrically connects the data circuit board 140 and the organic light emitting display panel 110 and supplies at least one reference voltage to the organic light emitting display panel 110. One side of the second flexible circuit board 146 is bonded to the organic light emitting display panel 110, and the other side is bonded to one side of the data circuit board 140. The second flexible circuit board 146 has a plurality of pads on one side and a plurality of pads on the other side. That is, the second flexible circuit board 146 is in a FOG (film on glass) form in which electrical wiring is formed on a film. Bonding members are disposed on the plurality of pads. An anisotropic conductive film is used as a bonding member. However, the cementation member is not limited to this.

Specifically, the second flexible circuit board 146 receives the anode voltage (ELVDD) or cathode voltage (ELVSS) from the data circuit board 140 and generates a plurality of cells disposed in the pixel area (AA) of the organic light emitting display panel 110. is supplied to the sub-pixel 112.

In order to improve the luminance uniformity of the organic light emitting display panel 110, the anode voltage (ELVDD) and cathode voltage (ELVSS) must be stable. Accordingly, the overall width of the voltage supply wiring of the second flexible circuit board 146 is formed sufficiently wide so that the wiring resistance of the voltage supply wiring of the second flexible circuit board 146 is minimized. At this time, the voltage supply wiring may be implemented in a form in which narrow-width wiring is divided into a plurality of lines and arranged. If the wiring resistance is large and the potential difference between the anode voltage (ELVDD) and the cathode voltage (ELVSS) is not uniform in the pixel area (AA), the brightness of the displayed image of the organic light emitting display panel 110 varies depending on the location of the pixel area (AA). Problems that vary greatly may arise. To solve this problem, a plurality of second flexible circuit boards 146 are disposed in the peripheral area PA of the organic light emitting display panel 110. At this time, the second flexible circuit board 146 is preferably arranged to be spaced apart at a predetermined interval. According to the above-described configuration, since the amount of current that can flow through each flexible circuit board can be distributed, there is an advantage in alleviating heat generation and burnt problems caused by overcurrent.

In some embodiments, the data driving circuit may be in the form of a chip on glass (COG) and may be bonded onto a plurality of pads disposed in the peripheral area (PA) of the organic light emitting display panel. At this time, the first flexible circuit board does not have a plurality of pads in the center, electrically connects the data circuit board and the organic light emitting display panel, and transmits the image signal transmitted from the data circuit board to the data driving circuit. If the data driving circuit is arranged in the COG form, there is no need to arrange the data driving circuit on the first flexible circuit board, so the first flexible circuit board can be configured in the FOG form.

In some embodiments, both the first flexible circuit board and the second flexible circuit board may be configured to receive an anode voltage (ELVDD) and a cathode voltage (ELVSS) from the data circuit board. At this time, the first flexible circuit board includes a data driving circuit. If both the first flexible circuit board and the second flexible circuit board are configured to supply the anode voltage (ELVDD) and the cathode voltage (ELVSS), the amount of current that can flow through each flexible circuit board can be distributed more evenly, It has the advantage of further alleviating heat generation and burnt problems caused by overcurrent.

In some embodiments, the first flexible circuit board and the second flexible circuit board may be alternately disposed along the top side (first side) of the organic light emitting display panel 110. There is an advantage in that the problem of overcurrent flowing to a specific flexible circuit board can be alleviated by flexible circuit boards arranged alternately.

In some embodiments, an integrated flexible circuit board may be disposed, in which a first flexible circuit board and a second flexible circuit board are integrated. That is, the first flexible circuit board and the second flexible circuit board can be integrated or separated in various forms as needed.

8. Gate driving circuit

A gate-driver IC 114 supplies a gate wire driving signal to a plurality of gate wires 116 connected to a plurality of sub-pixels 112 of the organic light emitting display panel 110. The control circuit board 142 generates a driving signal for driving the gate driving circuit 114 and provides the driving signal to the gate driving circuit 114 . The gate driving circuit 114 is disposed in the peripheral area PA of the organic light emitting display panel 110. Specifically, the gate driving circuit 114 is disposed on both sides (second side and fourth side) of the organic light emitting display panel 110. In particular, according to this configuration, since the gate wiring driving signal can be applied from both sides (second side and fourth side), the quality of the gate wiring driving signal is reduced in a large organic light emitting display panel in which the length of the gate wiring 116 is long. It has the effect of alleviating.

The gate driving circuit 114 is made of a semiconductor chip, and is bonded to a plurality of pads disposed in the peripheral area (PA) of the organic light emitting display panel 110 in the form of a COG (chip on glass). The gate driving circuit 114 in the form of a semiconductor chip has a predetermined controllable number of gate wires or channels, and the number of gate driving circuits 114 is equal to the number of gate wires 116 of the organic light emitting display panel 110. It may be determined according to the number of channels of the gate driving circuit 114. However, the number of gate driving circuits 114 is not limited to this. An anisotropic conductive film is used as a bonding member. However, the cementation member is not limited to this.

9. Sub-pixel

Referring to FIG. 1C, the sub-pixel 112 in the pixel area AA is connected to at least the first substrate 160, the driving transistor 162 disposed on the first substrate 160, and the driving transistor 162. It includes an organic light emitting diode 164 driven by an organic light emitting diode 164, a second anode wire 130a, and a second cathode wire 134a.

The first substrate 160 is made of a material suitable for depositing a semiconductor layer, a metal layer, an organic thin film, or an inorganic thin film. For example, a plastic such as glass or polyimide, which has excellent heat resistance and chemical resistance, may be applied to the first substrate 160.

The driving transistor 162 according to an embodiment of the present invention has an N-type structure. The driving transistor 162 according to an embodiment of the present invention has a coplanar structure.

The driving transistor 162 includes an active layer 168, a gate electrode 170, a source electrode 172, and a drain electrode 174.

The active layer 168 is disposed on the first substrate 160. The active layer 168 is formed of a material having semiconductor properties. For example, amorphous silicon, low-temperature polysilicon, oxide-based, or organic-based materials may be applied to the active layer 168. However, it is not limited to this.

The gate insulating film 176 is disposed on the active layer 168. The gate insulating film 176 is configured to cover the active layer 168. The gate insulating film 176 is formed of an inorganic material. For example, silicon oxide (SiOx), silicon nitride (SiNx), or aluminum oxide (Al ₂ O ₃ ) may be applied to the gate insulating film 176 . However, it is not limited to this.

The gate electrode 170 is disposed on the gate insulating film 176. And the gate electrode 170 is configured to overlap at least a portion of the active layer 168. The gate electrode 170 is made of metal. The gate electrode 170 may be formed of the same material as the gate wire 116. For example, the gate electrode 170 includes copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), titanium (Ti), gold (Au), and transparent conductive oxide (TCO). Alternatively, a structure in which these are stacked may be applied. However, it is not limited to this.

The interlayer insulating film 178 is disposed on the gate electrode 170. The interlayer insulating film 178 is configured to cover the gate electrode 170. The interlayer insulating film 178 is formed of an inorganic material. For example, silicon oxide, silicon nitride, or aluminum oxide may be applied to the interlayer insulating film 178. Alternatively, the interlayer insulating film 178 may have a multi-layer structure formed of silicon oxide and silicon nitride. However, it is not limited to this.

The source electrode 172 and the drain electrode 174 are disposed on the interlayer insulating film 178. The source electrode 172 and the drain electrode 174 are configured to be electrically connected to the active layer 168. Specifically, the source electrode 172 is connected to one end of the active layer 168 through the first contact hole 178a that penetrates the gate insulating film 176 and the interlayer insulating film 178. And, the drain electrode 174 is connected to the other end of the active layer 168 through the first contact hole 178a that penetrates the gate insulating film 176 and the interlayer insulating film 178. The source electrode 172 and the drain electrode 174 are made of metal. The source electrode 172 and the drain electrode 174 may be formed of the same material as the data wire 120. For example, the source electrode 172 and the drain electrode 174 include copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), titanium (Ti), gold (Au), and transparent conductive oxide ( Transparent conductive oxide (TCO) or a structure in which they are laminated can be applied. However, it is not limited to this.

The second anode wire 130a is disposed on the interlayer insulating film 178. The second anode wire 130a supplies the anode voltage ELVDD to the pixel area AA. Specifically, the second anode wire 130a is configured to be electrically connected to the drain electrode 174 of the driving transistor 162. The second anode wire 130a is configured to be electrically connected to the first anode wire 130 disposed in the peripheral area PA. According to the above-described configuration, the anode voltage ELVDD is supplied to the driving transistor 162. The second anode wire 130a may be formed of the same material as the data wire 120. However, it is not limited to this.

The transistor insulating film 180 is disposed on the driving transistor 162. The transistor insulating film 180 is formed of an inorganic material. For example, silicon oxide, silicon nitride, or aluminum oxide may be applied to the transistor insulating film 180. However, it is not limited to this. The transistor insulating film 180 may additionally block moisture from penetrating into the driving transistor 162.

The organic material layer 182 is disposed on the transistor insulating film 180. The organic material layer 182 is formed of an organic material with a low permittivity (ε). Therefore, the organic material layer 182 can reduce parasitic capacitance generated between the anode 184, the driving transistor 162, the gate wire 116, and the data wire 115. For example, photo acryl, etc. may be applied to the organic material layer 182. However, it is not limited to this. Additionally, the organic material layer 182 can flatten steps formed by various configurations of the driving transistor 162.

The organic light emitting diode 164 includes an anode 184, a cathode 190, and an organic light emitting layer 188 interposed between them. The light emitting area of the organic light emitting layer 188 may be defined by the bank 186.

The anode 184 is disposed on the organic material layer 182. The anode 184 is configured to correspond to the light emitting area of each sub-pixel 112. The second contact hole 182a is configured to penetrate the organic material layer 182 and the transistor insulating film 180. Accordingly, the anode 184 is connected to the source electrode 172 of the driving transistor 162 through the second contact hole 182a. The anode 184 is made of a material with a high work function. The anode 184 may be made of a reflective material or may include a reflector below the anode 184 so that the anode 184 has reflective properties.

For convenience of explanation, the anode 184 will be described based on its structure including a reflector. The reflector is made of a metallic material with a high reflectance of visible light. For example, the anode 184 may be made of an alloy such as silver (Ag) or APC. However, it is not limited to this. A current corresponding to the image signal is applied to the anode 184 by the driving transistor 162.

The bank 186 is disposed on the organic material layer 182. The bank 186 is configured to surround each sub-pixel 112. The bank 186 is configured to have a tapered shape. The bank 186 is configured to overlap at least a portion of the edge of the anode 184. Bank 186 is formed of organic material. For example, photo acrylic or polyimide may be applied to the bank 186. However, it is not limited to this.

The organic light emitting layer 188 is disposed on the anode 184. The organic emission layer 188 is configured to be entirely deposited on the pixel area AA. The organic light-emitting layer 188 may be made of a phosphorescent or fluorescent material, and may further include an electron transport layer, a hole transport layer, and a charge generation layer.

The cathode 190 is disposed on the organic light emitting layer 188. The cathode 190 is made of a very thin metallic material with a low work function or transparent conductive oxide (TCO). The cathode 190 is formed to a thickness of 1500 Å or less, and is preferably formed to a thickness of 400 Å or less. When the cathode 190 is formed to this thickness, the cathode 190 becomes a substantially translucent layer and becomes a substantially transparent layer. However, this cathode 190 has high electrical resistance. Accordingly, the cathode 190 is configured to be electrically connected to the adjacent second cathode wire 134a.

The partition 192 is disposed adjacent to the sub-pixel 112. The partition wall 192 is formed in a reverse tapered shape. The reverse taper shape means that the width of the barrier rib 192 increases as it moves upward from the substrate 101. The partition 192 is disposed within the opening of the bank 186. This opening may be referred to as a contact (C/A) area. The lower surface of the partition 192 is in contact with a portion of the second cathode wiring 134a, and the area of the upper surface of the partition 192 is larger than the area of the lower surface of the partition 192. Accordingly, a shadow is generated at the lower part of the partition wall 192 due to the reverse taper shape of the partition wall 192.

The partition wall 192 is configured to be thicker than the bank 186. When the partition wall 192 is thicker than the bank 186, it may be easier to form the partition wall 192 into a reverse tapered shape.

Generally, the organic light-emitting layer is made of a material with low step coverage. Due to the step coverage of the organic light-emitting layer, the organic light-emitting layer is not deposited on the side of the partition 192 and the shaded portion created by the reverse taper shape of the partition 192, and is not deposited on the upper surfaces of the partition 192 and the bank 186. An organic light emitting layer is deposited. Accordingly, a physical space where the second cathode wire 134a and the cathode 190 can be electrically connected can be secured between the side of the partition 192 and the side of the bank 186. And the organic light-emitting layer residue 188a remains on the partition wall 192.

The cathode 190 may be in direct contact with the upper surface of the second cathode wire 134a exposed between the side surface of the partition wall 192 and the side surface of the bank 186 in the contact area C/A. Since the transparent conductive oxide constituting the cathode 190 has high step coverage, the cathode 190 may be in contact with the second cathode wiring 134a exposed between the side of the partition 192 and the side of the bank 186. As a result, the cathode 190 and the second cathode wiring 134a are electrically connected to each other.

In some embodiments, a multi-buffer layer formed of silicon nitride (SiNx) and silicon oxide (SiOx) may be further disposed between the first substrate 160 and the driving transistor 162. By disposing the multi-buffer layer, the driving transistor 162 can be protected from foreign substances on the first substrate 160, and there is an advantage in protecting the driving transistor 162 from moisture and oxygen.

In some embodiments, the driving transistor 162 may be implemented in an inverted staggered structure.

In some embodiments, the driving transistor 162 may be configured as a P-type. At this time, the positions of the drain electrode 174 and the source electrode 172 of the driving transistor 162 are changed. And the placement position of the capacitor also changes accordingly.

In some embodiments, it is also possible for the transistor insulation film 180 to be removed.

In some embodiments, a lens portion to improve light extraction efficiency may be formed in the organic material layer 182 in the area where the anode 184 is disposed.

In some embodiments, spacers may further be placed on bank 186. The spacer may be made of the same material as the bank 186.

In some embodiments, partitions may be disposed on banks. In this case, an island-shaped bank may be additionally disposed in the center of the contact area, and the partition wall may be disposed on the island-shaped bank.

In some embodiments, the septum may be eliminated. In this case, the organic light emitting layer is configured not to be deposited on the entire surface, and the area corresponding to the contact area is patterned using a mask.

10. First anode wiring

Referring again to FIG. 1A , the first anode wire 130 is disposed along the upper side (first side) of the peripheral area PA of the organic light emitting display panel 110. For example, the first anode wire 130 is disposed along the X-axis direction, which is the long side direction of the organic light emitting display panel 110.

The first anode wiring 130 receives the anode voltage ELVDD from the second flexible circuit board 146 and supplies it to the second anode wiring 130a.

The first anode wire 130 includes an extended pad portion configured to be partially bonded to the second flexible circuit board 146 . The extended pad portion of the first anode wire 130 is bonded to the second flexible circuit board 146 by a bonding member. An anisotropic conductive film is used as the bonding member. However, the cementation member is not limited to this.

The first anode wire 130 is configured to be relatively wider in width than the various wires arranged in the pixel area AA to minimize wire resistance. For example, the width L1 of the first anode wire 130 may be 1 mm to 3 mm, and therefore the wire resistance may have a negligible variation depending on the distance. According to the above-described configuration, when the organic light emitting display panel 110 is enlarged, the voltage drop phenomenon due to the wiring resistance of the first anode wiring 130 can be minimized.

Since the wiring resistance of the first anode wiring 130 is relatively low, the description will be omitted below, but this does not mean that the resistance of the first anode wiring 130 is 0Ω.

The first anode wire 130 may be formed by selectively using some of the various wires constituting the sub-pixel 112 of the organic light emitting display panel 110. For example, the first anode wire 130 is made of copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), titanium (Ti), gold (Au), and transparent conductive oxide (TCO). ) or may be composed of a stacked structure.

The first anode wire 130 is formed of the same material as the data wire 120. Although not shown in detail in FIG. 1A, since the data wire 120 is formed of the same material as the first anode wire 130, they cannot be placed on the same plane. If placed on the same plane, an electrical short occurs between them. Therefore, in the area where the data wire 120 and the first anode wire 130 overlap, a jump wire is formed using a separate metal layer. For example, the jump wire in the area where the first anode wire 130 and the data wire 120 overlap may be formed using the same material as the gate wire 116. And the jump wires are configured to be electrically insulated from each other by an insulating layer. The insulating layer may be formed using, for example, an interlayer insulating film or a gate insulating film.

To specifically describe the wiring resistance (R _Line ), each wiring is composed of a unique conductive material. Each conductive material has a specific resistance (ρ). And the wiring resistance (R _Line ) is determined by the specific resistance (ρ), the length (L) of the wiring, the thickness (T) of the wiring, and the width (W) of the wiring. The wiring resistance calculation method can be calculated by Equation 1.

[Equation 1]

11. First cathode wiring

The first cathode wire 134 is disposed along the lower side (third side) of the peripheral area PA of the organic light emitting display panel 110 in a direction opposite to the upper side (first side). For example, the first cathode wire 134 is disposed along the X-axis direction, which is the long side direction of the organic light emitting display panel 110. At this time, the first cathode wire 134 and the first anode wire 130 are preferably arranged to be parallel to each other.

The first cathode wiring 134 receives the cathode voltage ELVSS from the second flexible circuit board 146 and supplies it to the plurality of second cathode wirings 134a.

The first cathode wiring 134 includes an extended pad portion configured to be partially bonded to the second flexible circuit board 146 . The extended pad portion of the first cathode wiring 134 is bonded to the second flexible circuit board 146 by a bonding member. An anisotropic conductive film is used as a bonding member. However, the cementation member is not limited to this.

The first cathode wire 134 is configured to be relatively wider in width than the various wires arranged in the pixel area AA to minimize wire resistance. For example, the width L3 of the first cathode wire 134 may be 1 mm to 4 mm, and therefore the wire resistance may have a negligible variation depending on the distance.

Since the wiring resistance of the first cathode wiring 134 is relatively low, the description is omitted. However, this does not mean that the resistance of the first cathode wiring 134 is 0Ω.

According to the above-described configuration, when the organic light emitting display panel 110 is enlarged, the voltage drop phenomenon due to the wiring resistance of the first cathode wiring 134 can be minimized. Hereinafter, description of overlapping wiring resistance will be omitted.

The first cathode wire 134 may be formed by selectively using some of the various wires constituting the sub-pixel 112 of the organic light emitting display panel 110. For example, the first cathode wiring 134 is made of copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), titanium (Ti), gold (Au), and transparent conductive oxide (TCO). ) or may be composed of a stacked structure. The first cathode wire 134 is formed of the same material as the anode 184. Alternatively, the first cathode wire 134 may be formed of the same material as the reflective layer of the anode 184.

12. Second anode wiring

The plurality of second anode wires 130a are electrically connected to the first anode wire 130 and refer to a plurality of wires extending to the pixel area AA. For example, the plurality of second anode wires 130a are configured to extend from the first anode wire 130 in the vertical Y-axis direction. That is, it extends from the first side to the third side. The second anode wire 130a may be formed of the same material as the first anode wire 130 or may be formed of a different material. And the first anode wire 130 and the second anode wire 130a may have a thickness of 3000A to 6000A.

The plurality of second anode wires 130a are connected to the first anode wire 130, extend in the Y-axis direction in the pixel area AA, and are configured to be short-circuited at an end of the pixel area AA. That is, the second anode wire 130a is a unidirectional input.

The first anode wire 130 is preferably made of the same material as the data wire 120. In particular, according to the above-described configuration, there is an advantage that the second anode wire 130a and the data wire 120 can be arranged parallel to each other in the Y-axis direction. However, it is not limited to this.

Referring to FIG. 1A, the data wire 120 and the second anode wire 130a are spaced apart from each other at a predetermined distance and are arranged along the Y-axis direction. The second anode wire 130a is configured to have a considerably narrower width than the first anode wire 130. For example, the width L2 of the second anode wire 130a may be 10 ㎛ to 100 ㎛, and the wiring resistance of the second anode wire 130a is at a level that can take into account variation depending on the distance.

The reason for this is that, since the integration degree of the sub-pixel 112 in the pixel area AA increases, the area where the width of the second anode wire 130a can be substantially increased is limited. Accordingly, the wiring resistance per unit length of the second anode wiring 130a is greater than the wiring resistance per unit length of the first anode wiring 130. That is, the wiring resistance of the second anode wiring 130a is relatively significantly greater than that of the first anode wiring 130.

13. Second cathode wiring

The plurality of second cathode wires 134a refers to a plurality of wires that are electrically connected to the first cathode wire 134 and extend to the pixel area AA. The plurality of second cathode wires 134a supply the cathode voltage ELVSS to the pixel area AA. For example, the second cathode wire 134a is configured to extend from the first cathode wire 134 in the vertical Y-axis direction. At this time, the input directions of the second cathode wire 134a and the second anode wire 130a are configured to be in opposite directions. That is, it extends from the third side toward the first side. The second cathode wiring 134a may be formed of the same material as the first cathode wiring 134 or may be formed of a different material. And the first cathode wire 134 and the second cathode wire 134a may have a thickness of 800A to 1500A.

The second cathode wire 134a, which is electrically connected to the first cathode wire 134, extends in the opposite direction to the second anode wire 130a and is electrically connected to the cathode of the organic light emitting diode of each sub-pixel 112. connected.

The second cathode wire 134a is connected to the first cathode wire 134, extends in the Y-axis direction in the pixel area AA, and is configured to be short-circuited at an end of the pixel area AA. That is, the second cathode wire 134a is a unidirectional input.

According to the above-described configuration, the second anode wire 130a and the second cathode wire 134a extend in opposite directions and are configured to be short-circuited in opposite directions.

The second cathode wiring 134a is preferably made of the same material as the anode of the organic light emitting diode (OLED). However, it is not limited to this.

Referring to FIG. 1A, the second cathode wires 134a are spaced apart from each other at a predetermined interval and are arranged along the Y-axis direction. The second cathode wiring 134a is configured to have a considerably narrower width than the first cathode wiring 134. For example, the width L4 of the second cathode wire 134a may be 10 ㎛ to 400 ㎛, and the wiring resistance is at a level that takes into account variation depending on the distance.

The reason for this is that, since the integration degree of the sub-pixel 112 in the pixel area AA increases, the area where the width of the second cathode wiring 134a can be substantially increased is limited. Accordingly, the wiring resistance per unit length of the second cathode wiring 134a is greater than the wiring resistance per unit length of the first cathode wiring 134. Accordingly, the wiring resistance of the second cathode wiring 134a is relatively greater than that of the first cathode wiring 134.

The wiring resistance of the second anode wiring 130a and the wiring resistance of the second cathode wiring 134a may be configured to be the same. Each wiring resistance can be designed by making the cross-sectional area of each wiring the same.

For example, the second anode wire 130a may be configured with a wire thickness of 4500A and a wire width of 10㎛. At this time, the second cathode wire 134a may be configured with a wire thickness of 1000A and a wire width of 45㎛. At this time, if the materials of the second anode wire 130a and the second cathode wire 134a are the same, the cross-sectional area of each wire is the same, so the wire resistance per unit length becomes the same. If the material of each wiring is different, it is also possible to design the wiring resistance to be the same by substituting the specific resistance value using [Equation 1].

14. Equivalent circuit of sub-pixel

Referring to FIG. 1D, an equivalent circuit of the first anode wire 130 and the second anode wire 130a connected to the sub-pixel 112 shown in FIG. 1A is schematically shown.

The sub-pixel 112 includes at least an organic light emitting diode, a driving transistor (D _TR ), a switching transistor (SW _TR ), a capacitor (C _ST ), a gate line (GATE) 116, and a data line (DATA) 120. . However, it is not limited to this.

The sub-pixel 112 is an initial voltage (Vint) driving circuit for discharging the capacitor (C _ST ), and is additionally disposed between the anode of the organic light emitting diode and the driving transistor (D _TR ) to determine the duty of the voltage flowing through the anode. ) may further include an emission duty control circuit capable of controlling the light emission (emission) duty control circuit, or a threshold voltage deviation compensation circuit capable of compensating for the threshold voltage (Vth) deviation of the driving transistor (D _TR ). At this time, the threshold voltage deviation compensation circuit may be placed within the sub-pixel 112 or may be placed in the peripheral area (PA). However, it is not limited to this.

Each driving transistor (D _TR ) includes a source electrode (S), a drain electrode (D), and a gate electrode (G).

The second anode wire 130a, which is electrically connected to the first anode wire 130, extends in the Y-axis direction and connects the drain electrodes D of the driving transistor D _TR of each sub-pixel 112. are electrically connected. However, the above-described configuration applies to the case where the driving transistor (D _TR ) is N-type, and in the case of P-type, the second anode wire 130a is connected to the driving transistor (D _TR ) of each sub-pixel 112. It is electrically connected to the source electrode (S). The capacitor (C _ST ) is electrically connected to the gate electrode (G) and source electrode (S) of the driving transistor (D _TR ).

Each data wire (DATA) is electrically connected to the gate electrode (G) of each driving transistor (D _TR ). A switching transistor (SW _TR ) is disposed between the data line (DATA) and the driving transistor (D _TR ). The data line (DATA) receives an analog image signal from the data driving circuit 118 and transmits it to the gate electrode (G) of the driving transistor (D _TR ). At this time, the amount of current flowing through the organic light emitting diode through the driving transistor (D _TR ) is controlled according to the voltage value of the image signal.

Each gate wire (GATE) is electrically connected to the gate electrode of each switching transistor (SW _TR ). Gate high voltage (VGH) and gate low voltage (VGL) are applied through the gate wiring (GATE) to control the switching transistor (SW _TR ).

15. Wiring resistance of the second anode wiring

Referring to FIG. 1D, the unit wire resistance (R _ELVDD )Ω of the second anode wire 130a is that of the second anode wire 130a corresponding to the length of one sub-pixel 112 in the Y-axis direction. Wiring resistance (R _ELVDD ) can be defined as Ω. Accordingly, the total anode wiring resistance (RT _ELVDD )Ω increases in proportion to the number of corresponding sub-pixels 112.

Hereinafter, the description will be made assuming that the number of gate wires 116 of the organic light emitting display panel 110 is N. (N is a positive number greater than 0)

And the gate wiring at the Nth position is assumed to be (GATE N). For example, the first gate wire is (GATE 1) and the 100th gate wire is (GATE 100).

For example, the total anode wiring resistance (RT _ELVDD )Ω of the sub-pixel 112 connected to the first gate wiring (GATE 1) is (R _ELVDD ) x (GATE 1)Ω = (1) x (R _ELVDD ) It is Ω.

For example, the total anode wiring resistance (RT _ELVDD )Ω of the sub-pixel 112 connected to the (N-2)th gate wiring (GATE N-2) is (R _ELVDD ) x (GATE N-2)Ω = (N-2) x (R _ELVDD )Ω.

For example, the total anode wiring resistance (RT _ELVDD )Ω of the sub-pixel 112 connected to the (N-1)th gate wiring (GATE N-1) is (R _ELVDD ) x (GATE N-1)Ω = (N-1) x (R _ELVDD )Ω.

For example, the total anode wiring resistance (RT _ELVDD )Ω of the sub-pixel 112 connected to the (N)th gate wiring (GATE N) is (R _ELVDD ) x (GATE N)Ω = (N) x (R _ELVDD )Ω.

Accordingly, as the second anode wire 130a moves away from the first anode wire 130, the total wire resistance RT _ELVDD increases. And as the total wiring resistance (RT _ELVDD ) increases, the anode voltage (ELVDD) applied to the anode of the organic light emitting diode decreases according to the total anode wiring resistance (RT _ELVDD ).

16. Wiring resistance of the second cathode wiring

Referring to FIG. 1D, the unit wiring resistance (R _ELVSS )Ω of the second cathode wiring 134a is that of the second cathode wiring 134a corresponding to the length of one sub-pixel 112 in the Y-axis direction. Wiring resistance (R _ELVSS )can be defined as Ω.

Therefore, the total cathode wiring resistance (RT _ELVSS )Ω increases in proportion to the number of corresponding sub-pixels 112.

For example, the total cathode wiring resistance (RT _ELVSS )Ω of the sub-pixel 112 connected to the (N)th gate wiring (GATE N) is (R _ELVSS ) x (N - (GATE N) + 1)Ω = (1) x (R _ELVSS )Ω.

For example, the total cathode wiring resistance (RT _ELVSS )Ω of the sub-pixel 112 connected to the (N-1)th gate wiring (GATE N-1) is (R _ELVSS ) x (N - (GATE N-1) ) + 1)Ω = (2) x (R _ELVSS )Ω.

For example, the total cathode wiring resistance (RT _ELVSS )Ω of the sub-pixel 112 connected to the (N-2)th gate wiring (GATE N-2) is (R _ELVSS ) x (N - (GATE N-2) ) + 1)Ω = (3) x (R _ELVSS )Ω.

For example, the total cathode wiring resistance (RT _ELVSS )Ω of the sub-pixel 112 connected to the first gate wiring (GATE 1) is (R _ELVSS ) x (N - (GATE 1) + 1)Ω = (N ) x (R _ELVSS )Ω.

Accordingly, as the second cathode wire 134a moves away from the first cathode wire 134, the total cathode wire resistance RT _ELVSS increases. And as the total cathode wiring resistance (RT _ELVSS ) increases, the cathode voltage (ELVSS) applied to the cathode of the organic light emitting diode decreases according to the total cathode wiring resistance (R _ELVSS ).

17. Total wiring resistance applied to the organic light emitting diode

The gate driving circuit 114 of the organic light emitting display panel 110 sequentially activates one gate wire 116. Accordingly, except for the gate wire activated in FIG. 1D, the remaining gate wires are deactivated.

For example, when the first gate wire (GATE 1) is activated, the remaining gate wires do not operate. Accordingly, the total wiring resistance of the second anode wiring 130a and the second cathode wiring 134a connected to the driving transistor D _TR activated by the first gate wiring GATE 1 can be calculated as follows. Hereinafter, the description will be made assuming that the number (N) of gate wires is 1080.

For example, the total wiring resistance of the sub-pixel 112 connected to the first gate wiring (GATE1) is (1) x (R _ELVDD ) + (1081) x (R _ELVSS )Ω. That is, the total wiring resistance of the second anode becomes one second anode unit wiring resistance, and the total wiring resistance of the second cathode becomes 1081 second cathode unit wiring resistances.

For example, the total wiring resistance of the sub-pixel 112 connected to the 100th gate wiring (GATE 100) is (100) x (R _ELVDD ) + (981) x (R _ELVSS )Ω. That is, the total wiring resistance of the second anode becomes 100 second anode unit wiring resistances, and the total wiring resistance of the second cathode becomes 981 second cathode unit wiring resistances.

For example, the total wiring resistance of the sub-pixel 112 connected to the 1080th gate wiring (GATE 1080) is (1080) x (R _ELVDD ) + (1) x (R _ELVSS )Ω. That is, the total wiring resistance of the second anode becomes 1080 second anode unit wiring resistances, and the total wiring resistance of the second cathode becomes one second cathode unit wiring resistance.

For example, the total wiring resistance of the sub-pixel 112 connected to the Nth gate wiring (GATE N) is (GATE N) x (R _ELVDD ) + (N - (GATE N-1) + 1) x (R _ELVSS )Ω. That is, the total wiring resistance of the second anode becomes N second anode unit wiring resistance, and the total wiring resistance of the second cathode becomes (N - (GATE N-1) + 1) unit wiring resistance of second cathodes.

At this time, the second anode unit wiring resistance (R _ELVDD ) and the second cathode unit wiring resistance (R _ELVSS ) may be configured to be substantially equal. In this case, the total wiring resistance of the sub-pixel 112 connected to the N-th gate wiring (GATE N) is (R _ELVDD ) x (N + 1). Here, since N refers to the total number of gate wires 116, the total wire resistance of each sub-pixel 112 connected to each gate wire can always be the same. According to the above-described configuration, the sum of the total anode wiring resistance (RT _ELVDD ) and the total cathode wiring resistance (RT _ELVSS ) applied to any sub-pixel 112 becomes the same regardless of the position in the Y-axis direction. Therefore, there is an advantage that the potential difference (ΔV) between the anode and cathode can always be uniform.

In some embodiments, the difference between the unit wire resistance (R _ELVDD ) of the anode and the unit wire resistance (R _ELVSS ) of the cathode may be configured to be within 10%.

1E shows the sub-pixels 112 of the pixel area AA of the organic light emitting display device 100 when the unit wire resistance (R _ELVDD ) of the anode and the unit wire resistance (R _ELVSS ) of the cathode are substantially the same. This is a graph explaining the potential difference (ΔV) between the anode and cathode of the sub-pixels 112 arranged in an arbitrary Y-axis direction. According to FIG. 1E, it can be seen that the potential difference (ΔV) between the anode and cathode of each sub-pixel 112 in the Y-axis direction is always uniform regardless of position.

Comparative example One

Figure 1f schematically explains the equivalent circuit of Comparative Example 1. The difference between the organic light emitting display device of Comparative Example 1 and the organic light emitting display device 100 according to an embodiment of the present invention is that the first anode wire and the first cathode wire are disposed on the same side in the peripheral area of the organic light emitting display panel. It is structured so that it can be done. Accordingly, the second anode wiring and the second cathode wiring are also input in the same direction.

In Comparative Example 1, as the second anode wiring and the second cathode wiring increase in the Y-axis direction, the total anode wiring resistance (RT _ELVDD ) and the total cathode wiring resistance (RT _ELVSS ) increase simultaneously.

For example, the total anode wire resistance (RT _ELVDD )Ω of the sub-pixel connected to the first gate wire (GATE 1) is (R _ELVDD ) x (GATE 1)Ω = (1) x (R _ELVDD )Ω and the total The cathode wiring resistance (RT _ELVSS )Ω is (R _ELVSS ) x (GATE 1)Ω = (1) x (R _ELVSS )Ω.

For example, the total anode wire resistance (RT _ELVDD )Ω of the sub-pixel connected to the 100th gate wire (GATE 100) is (R _ELVDD ) x (GATE 100)Ω = (100) x (R _ELVDD )Ω and the total The cathode wiring resistance (RT _ELVSS )Ω is (R _ELVSS ) x (GATE 100)Ω = (100) x (R _ELVSS )Ω.

In other words, the problem can be confirmed that the size of the wiring resistance of the sub-pixel connected to the 100th gate wiring and the first gate wiring is 100 times different.

For example, the total anode wire resistance (RT _ELVDD )Ω of the sub-pixel connected to the 1080th gate wire (GATE 1080) is (R _ELVDD ) x (GATE 1080)Ω = (1080) x (R _ELVDD )Ω and the total The cathode wiring resistance (RT _ELVSS )Ω is (R _ELVSS ) x (GATE 1080)Ω = (1080) x (R _ELVSS )Ω.

In other words, it can be seen that the size of the wiring resistance of the sub-pixel connected to the 1080th gate wiring and the first gate wiring is 1080 times different.

FIG. 1G is a graph illustrating the potential difference (ΔV) between the anode and cathode of sub-pixels arranged in a random Y-axis direction among the sub-pixels of the pixel area of the organic light emitting display device 100 according to Comparative Example 1. .

According to Figure 1g, it can be seen that the potential difference (ΔV) between the anode and cathode gradually decreases as it moves in the Y-axis direction. Accordingly, the luminance of the organic light emitting display device gradually decreases in the Y-axis direction. As a result, in the case of Comparative Example 1, a problem occurs in which the lower side (third side) appears dark, and luminance uniformity is significantly reduced.

Comparative example 2

Figure 1h schematically explains the equivalent circuit of Comparative Example 2. The difference between the organic light emitting display device of Comparative Example 2 and the organic light emitting display device of Comparative Example 1 is that the first anode wire and the first cathode wire are located on both sides (first side and third side) in the peripheral area of the organic light emitting display panel. It is configured to be placed in . Accordingly, the second anode wiring and the second cathode wiring are also input in both directions.

In Comparative Example 2, since the anode voltage (ELVDD) and cathode voltage (ELVSS) are applied from both sides (first side and third side), the potential difference (ΔV) between the anode and cathode increases toward the center of the pixel area. There is a problem that is being reduced.

FIG. 1I is a graph illustrating the potential difference (ΔV) between the anode and cathode of sub-pixels arranged in a random Y-axis direction among the sub-pixels of the pixel area of the organic light emitting display device 100 according to Comparative Example 2. .

According to Figure 1i, it can be seen that the potential difference (ΔV) between the anode and cathode gradually decreases toward the center of the pixel area. Therefore, a problem occurs where the central part of the pixel area appears dark, and luminance uniformity becomes significantly worse.

Figure 2 is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.

In the organic light emitting display device 200 according to another embodiment of the present invention, in order to implement a narrow bezel, the gate driving circuit 214 is implemented as a gate-driver in panel (GIP). The gate driving circuit 214 is a process used when forming the plurality of sub-pixels 112 of the organic light emitting display panel 210, and is formed simultaneously in the peripheral area PA of the organic light emitting display panel 210.

The gate driving circuit 214 includes a plurality of shift registers, and each shift register is connected to each gate wire 116. The gate driving circuit 214 receives a gate start pulse (GSP) and a plurality of clock signals from the data driving circuit 118, and the shift register of the gate driving circuit 214 sequentially starts the gate. By shifting the pulse (GSP), a plurality of sub-pixels 112 connected to each gate wire 116 are activated.

When the panel-embedded gate driving circuit 214 is disposed, the semiconductor chip-type gate driving circuit 114, the anisotropic conductive film, and the corresponding pad portion can be removed, and the bezel width is narrower than that of the semiconductor chip-type gate driving circuit. There is an advantage in being able to implement a narrow bezel.

Except for the parts described above, the organic light emitting display device 200 according to another embodiment of the present invention is the same as the organic light emitting display device 100 according to an embodiment of the present invention, so description of overlapping content will be omitted.

In some embodiments, the gate driving circuit may be formed on only one side (second side) of the organic light emitting display panel. When the gate driving circuit formed on only one side (the second side) is disposed, the other side (the fourth side) has the advantage of being able to implement a narrow bezel with a narrower bezel width than one side (the second side).

In some embodiments, the panel-embedded gate driving circuit (GIP) shown in FIG. 2 can be applied to all other embodiments.

Figure 3 is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.

The first anode wire 130 and the first cathode wire 334 of the organic light emitting display device 300 according to another embodiment of the present invention are disposed on the upper side (first side) of the organic light emitting display panel 310. do. At this time, the first cathode wire 334 is arranged to surround the peripheral area PA of the organic light emitting display panel 110. That is, it is disposed along the first side, second side, third side, and fourth side of the organic light emitting display panel 310. Or, it is configured to have a “ㅁ” shape or a “ring” shape. At this time, since the wiring length of the first cathode wiring 334 is longer than the first anode wiring 130, the width of the first cathode wiring 334 is equal to the width of the first anode wiring 130 to prevent the wiring resistance from increasing. It is desirable to form it to be wider. Accordingly, the width of the first cathode wire 334 is configured to be wider than the width of the first anode wire 130.

Since the first anode wire 130 and the first cathode wire 334 of the organic light emitting display device 300 are disposed on the upper side (first side) of the organic light emitting display panel 310, the second flexible circuit board ( 346) is configured to simultaneously supply the anode voltage (ELVDD) and cathode voltage (ELVSS).

According to the above-described configuration, the organic light emitting display device 300 can remove the data circuit board 142 and the second flexible circuit board 146 disposed on the lower side (third side) of the organic light emitting display device 100. There is a possible effect.

According to the above-described configuration, there is an advantage in that the organic light emitting display device 300 can be a transparent organic light emitting display device. Specifically, as shown in FIG. 1B, in order to input the anode voltage (ELVDD) and cathode voltage (ELVSS) from opposite directions, various circuit boards and wires must be placed on the back of the organic light emitting display panel 110. did. However, in the case of the organic light emitting display panel 310 according to another embodiment of the present invention, circuit boards and wiring may be provided on the upper side (first side), so that the rear surface of the organic light emitting display panel 310 This has the advantage of preventing various circuit boards and wiring from being placed. Therefore, even when the organic light emitting display panel 310 is transparent, it is possible to make circuit boards and wires on the back surface invisible.

Except for the parts described above, the organic light emitting display device 300 according to another embodiment of the present invention is the same as the organic light emitting display device 100 according to an embodiment of the present invention, so description of overlapping content will be omitted.

In some embodiments, it is possible to implement the first anode wiring and the first cathode wiring interchangeably. Specifically, the first anode wire is arranged to surround the peripheral area (PA) of the organic light emitting display panel, and the first cathode wire is arranged along the top side (first side) of the organic light emitting display panel.

In some embodiments, the sub-pixel 412 of the organic light emitting display panel 410 may further include a transmissive portion capable of providing transparency.

FIG. 4A is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention.

The organic light emitting display device 400 according to another embodiment of the present invention is a modified example of the organic light emitting display device 300 according to another embodiment of the present invention.

The first anode wire 130 and the first cathode wire 434 of the organic light emitting display device 400 are formed of the same material. Therefore, since the first anode wire 130 and the first cathode wire 434 cannot overlap each other, a jump wire is formed in the area where the first anode wire 130 and the first cathode wire 434 overlap so that they do not overlap each other. (437) is placed.

FIG. 4B is a cross-sectional view of the sub-pixel 412 of the organic light emitting display device 400 shown in FIG. 4A.

The second cathode wiring 434a includes a first second cathode wiring 434b, a second second cathode wiring 434c, and a third contact hole 434d.

The second cathode first wiring 434b is formed of the same material as the anode 184. The second cathode second wiring 434c is formed of the same material as the second anode wiring 130a. The second cathode first wire 434b and the second cathode second wire 434c are connected to each other through the third contact hole 434d.

According to the above-described configuration, there is an advantage in that the thickness of the first cathode wiring 434 can be reduced. Specifically, the first cathode wire 434 may be formed of the same material as the data line 120. Accordingly, since the thickness of the first cathode wiring 434 can be formed thicker, there is an advantage in that the width L1 of the first cathode wiring 434 can be reduced.

According to the above-described configuration, there is an advantage in that the width L4 of the second cathode wiring 434a can be reduced. Specifically, since the cross-sectional area can be increased by the second cathode first wire 434b and the second cathode second wire 434b, the advantage is that the width of the second cathode wire 434a can be reduced. there is.

Except for the parts described above, the organic light emitting display device 400 according to another embodiment of the present invention is the same as the organic light emitting display device 300 according to one embodiment of the present invention, so description of overlapping content will be omitted.

FIG. 5A is a schematic plan view of an organic light emitting display device according to another embodiment of the present invention. The organic light emitting display device 500 according to another embodiment of the present invention is a modified example of the organic light emitting display device 100 according to an embodiment of the present invention.

An image signal compensator 550 is disposed on the control circuit board 542 of the organic light emitting display device 500.

The image signal compensation unit 550 is configured to store voltage compensation data. Voltage compensation data may be stored in a memory within the image signal compensation unit 550 or may be stored in a separate external memory. The voltage compensation data is configured to store respective compensation values corresponding to each sub-pixel 112. The voltage compensation data is information that can compensate for the cathode voltage increase (ΔELVSS) corresponding to each sub-pixel 112 based on the wiring resistance information of the first cathode wiring 134 in the pixel area AA. Includes. Voltage compensation data may be determined based on design values of wires of the organic light emitting display panel 110. For example, the design value of the wires may be calculated based on the width, thickness, and length of the wire, the specific resistance (ρ) of the wire, and the position information of each sub-pixel 112 to be compensated. Alternatively, when designing a panel, the total cathode wiring resistance (RT _ELVSS )Ω or the second cathode unit wiring resistance (R _ELVSS ) information already calculated can be used.

When the cathode voltage (ELVSS) is varied by the wiring resistance, the potential difference between the gate electrode (G) and the source electrode (S) of the driving transistor (D _TR ), that is, the gate electrode-source electrode potential difference (Vgs), can be varied. Therefore, the luminance may be partially variable.

The image signal compensator 550 varies the image signal based on the stored voltage compensation data. Then, the compensated image signal is transmitted to the data driving circuit 118.

In some embodiments, the image signal compensator 550 may be configured to calculate voltage compensation data while the organic light emitting display device 100 is operating. The image signal compensator 550 stores only the design values of the wires of the organic light emitting display panel 110 required for calculating voltage compensation data. And the voltage compensation data operation is processed while the organic light emitting display device is operating. In particular, the above-described configuration has the advantage of not storing voltage compensation data. And it has the advantage of being easily applied to organic light emitting display panels of various sizes and shapes.

In some embodiments, the image signal compensator 550 may store only voltage compensation data corresponding to one row of sub-pixels 112 arranged in the vertical direction (Y-axis). In particular, as shown in FIG. 1D, since the plurality of sub-pixels 112 in a row have similar wiring resistance characteristics, the voltage compensation data for the sub-pixels 112 in a row are used as reference voltage compensation data. By setting this, there is an advantage that the remaining rows of sub-pixels 112 can also be compensated.

In some embodiments, when the image signal compensator 550 compensates a plurality of rows of sub-pixels 112 with reference voltage compensation data corresponding to one row of sub-pixels 112, each row of sub-pixels 112 It may be configured to further include an offset value that can compensate for differences between sub-pixels 112. Especially the voltage supply pad

In some embodiments, the image signal compensator 550 may calculate design values of some wires by excluding or adding some information. According to the above-described configuration, the image signal compensator 550 has the advantage of increasing compensation efficiency by updating only information optimized for the organic light emitting display panel.

In some embodiments, the voltage compensation data of the image signal compensator 550 may be configured in the form of a look-up table.

In some embodiments, the image signal compensator 550 may be configured to be included in the data driving circuit 118. Alternatively, the image signal compensation unit 550 may be disposed on the data circuit board 140. That is, the image signal compensator 550 is not limited to the control circuit board 542 and can be disposed or included in various components.

FIG. 5B is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of the organic light emitting display device to which a compensated image signal is supplied according to another embodiment of the present invention disclosed in FIG. 5A.

Each sub-pixel 112 includes at least an organic light emitting diode, a driving transistor (D _TR ), a switching transistor (SW _TR ), a capacitor (C _ST ), a gate line (GATE), and a data line (DATA). This structure can be divided into a 2T1C structure consisting of two transistors and one capacitor (C _ST ).

The first image signal (C-Data1) compensated by the image signal compensator 550 is applied to the gate electrode (G) of the driving transistor (D _TR ). Therefore, the potential difference between the gate electrode (G) and the source electrode (S), that is, the gate electrode-source electrode potential difference (Vgs), can be compensated. Therefore, luminance uniformity can be further improved.

FIG. 5C is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of an organic light emitting display device according to another embodiment of the present invention and a compensated image signal.

The compensated first image signal (C-Data1) shown in FIG. 5C is divided into each sub-pixel (ΔELVSS) by the cathode voltage increase (ΔELVSS) corresponding to each sub-pixel 112 in the 2T1C sub-pixel 112 structure. It shows compensation data that increases the voltage of the video signal applied to 112). Here, since all image signals before compensation display the same luminance, the same voltage must be applied, but since the cathode voltage (ELVSS) has increased, the compensated first image signal (C-Data1) is also directly proportional to the increase in cathode voltage (ELVSS). It is characterized by:

For example, the first image signal C-Data1 compensated according to the voltage compensation data applied to one sub-pixel 112 can be explained with reference to [Equation 2].

C-Data1 is a compensated video signal applied through the data line. The video signal in Equation 2 is an analog video signal obtained by converting a digital video signal input from an external system into a voltage value by a data driving circuit. The cathode voltage increase (-ELVSS) refers to the voltage value increased by wiring resistance.

In other words, if the cathode voltage (ELVSS) of a sub-pixel 112 of a random 2T1C structure increases by 0.1V, the image signal compensation unit 550 increases the image signal applied to that random sub-pixel 112 by 0.1V. C-Data1 is generated by compensating the voltage value of the video signal using voltage compensation data so that it rises by as much as .

That is, voltage compensation data can be implemented by adding an amount equal to the increase in cathode voltage (ELVSS) corresponding to each sub-pixel 112 to the image signal applied to each sub-pixel 112. The compensated first image signal C-Data1 is applied to the gate electrode G of the driving transistor D _TR of the random sub-pixel 112. Therefore, the luminance uniformity of the organic light emitting display device can be further improved by voltage compensation data.

Except for the parts described above, the organic light emitting display device 500 according to another embodiment of the present invention is the same as the organic light emitting display device 100 according to an embodiment of the present invention, so description of overlapping content is omitted. do

FIG. 6A is a schematic plan view of an organic light emitting display device including a data driving circuit according to another embodiment of the present invention. The organic light emitting display device 600 according to another embodiment of the present invention is a modified example of the organic light emitting display device 100 according to an embodiment of the present invention. FIG. 5B is a schematic equivalent circuit diagram illustrating the resistance value of each sub-pixel of the organic light emitting display device to which a compensated image signal is supplied according to another embodiment of the present invention disclosed in FIG. 5A.

Each sub-pixel 612 includes at least an organic light emitting diode, a driving transistor (D _TR ), a switching transistor (SW _TR ), a sensing transistor (SEN _TR ), a capacitor (C _ST ), a gate wire (GATE), and a data wire ( DATA) includes reference wiring (REF) and sensing wiring (SENS). This structure can be classified into a 3T1C structure consisting of three transistors and one capacitor.

The second image signal (C-Data2) compensated by the image signal compensator 550 is applied to the gate electrode (G) of the driving transistor (D _TR ). Therefore, the potential difference between the gate electrode (G) and the source electrode (S), that is, the gate electrode-source electrode potential difference (Vgs), can be compensated. Therefore, since the potential difference between the gate electrode and the source electrode is compensated, luminance uniformity can be further improved.

Additionally, because the sub-pixel 612 has a 3T1C structure, even if the cathode voltage (ELVSS) increases as in FIG. 5B, the voltage compensation data is not directly proportional to the cathode voltage increase (ΔELVSS). Specifically, the voltage compensation data is a value that reflects the ratio of the intrinsic capacitance (C _OLED ) of the organic light emitting diode and the capacitance (C _st ) of the capacitor (C _ST ) to the cathode voltage increase (ΔELVSS).

For example, the second image signal C-Data2 compensated according to the voltage compensation data applied to one sub-pixel 612 can be described with reference to [Equation 3].

[Equation 3]

C-Data2 is a compensated video signal applied through the data wire. The video signal in Equation 2 is an analog video signal obtained by converting a digital video signal input from an external system into a voltage value by the data driving circuit 618. The cathode voltage increase (-ELVSS) refers to the voltage value increased by wiring resistance. C _OLED is the intrinsic capacitance of organic light emitting diode. C _ST is the capacitance of the capacitor (C _ST ).

To elaborate, in the 3T1C structure, a sensing transistor (SEN _TR ) is further disposed to compensate for the threshold voltage deviation (ΔVth) of the driving transistor (D _TR ). And the sensing transistor (SEN _TR ) transfers the threshold voltage deviation (ΔVth) information of each driving transistor (D _TR ) to the reference wire (REF) by the signal applied to the sensing wire (SENS). The reference wire (REF) may be connected to the data driving circuit 618. At this time, the data driving circuit 618 may detect the threshold voltage deviation (ΔVth) of the driving transistor (D _TR ), and a threshold voltage deviation compensation circuit may be configured to compensate for the detected deviation.

FIG. 6C is a schematic graph illustrating the potential difference between the anode and cathode of each sub-pixel of an organic light emitting display device according to another embodiment of the present invention and a compensated image signal.

The compensated second image signal (C-Data2) shown in FIG. 6C is the cathode voltage (ELVSS) rise value corresponding to each sub-pixel 612 in the 3T1C sub-pixel 612 structure. It shows compensation data that increases the voltage of the video signal applied to 612. Here, the image signals before compensation must have the same voltage because they all display the same luminance, but since the cathode voltage (ELVSS) has increased, the compensated second image signal (C-Data1) has an increased cathode voltage (ELVSS) and organic light emission. It is characterized by compensation according to the ratio of the capacitance of the diode and the capacitor.

That is, the image signal compensator 550 increases the cathode voltage (ELVSS) of a random sub-pixel 112 by 0.1 V, and the image signal applied to the random sub-pixel 112 also emits organic light at 0.1 V. The voltage value of the image signal is varied using voltage compensation data that reflects the ratio of the intrinsic capacitance of the diode (C _OLED ) and the capacitance of the capacitor (C _ST ). Therefore, luminance uniformity can be further improved by voltage compensation data.

In some embodiments, the compensated second image signal C-Data2 in the data driving circuit 618 has a compensation value for an increase in the cathode voltage ELVSS and a threshold voltage deviation ΔVth of the driving transistor D _TR . ) may be configured to include all compensation values that compensate for.

For example, the compensated image signal C-Data3 according to the voltage compensation data applied to one sub-pixel 612 can be explained with reference to [Equation 4].

[Equation 4]

Except for the parts described above, the organic light emitting display device 600 according to another embodiment of the present invention is the same as the organic light emitting display device 500 according to an embodiment of the present invention, so description of overlapping content is omitted. do.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100, 200, 300, 400, 500: Organic light emitting display device
110, 210, 310, 410: Organic light emitting display panel
112, 612: Sub-pixel
114: Gate driving circuit
116: Gate wiring
118, 618: data driving circuit
120: data wiring
130: first anode wiring
130a: second anode wiring
134, 334, 434: first cathode wiring
134a, 434a: second cathode wiring
136: cathode
140: data circuit board
142: control circuit board
144: first flexible circuit board
146: second flexible circuit board
148: flexible cable
160: lower substrate
162: Driving transistor
164: Organic light emitting diode
168: active layer
170: Gate electrode
172: source electrode
174: drain electrode
176: Gate insulating film
178: Interlayer insulating film
178a: first contact hole
180: Transistor insulation film
182: Organic layer
182a: second contact hole
184: anode
186: bank
188: Organic light emitting layer
188a: Organic light-emitting layer residue
190: cathode
190a: cathode residue
192: Bulkhead
214: Panel-embedded gate driving circuit
437: Jump wiring
434b: second cathode first wiring
434c: second cathode second wiring
434d: third contact hole
550: Video signal compensation unit
AA: Pixel area
PA: Peripheral area

Claims (19)

a plurality of sub-pixels disposed in the pixel area and including an anode and a cathode;
an anode wiring configured to supply an anode voltage to the anode and including a first anode wiring and a second anode wiring;
a cathode wiring configured to supply a cathode voltage to the cathode and including a first cathode wiring and a second cathode wiring; and
jump wiring; and
Comprising a flexible circuit board that receives the anode voltage and the cathode voltage from a data circuit board and supplies them to the plurality of sub-pixels, and is arranged in plural numbers at a predetermined interval in a peripheral area,
One of the first anode wire and the first cathode wire is disposed to surround the peripheral area, the second anode wire is electrically connected to the first anode wire and extends to the pixel area, and the second anode wire is electrically connected to the first anode wire and extends to the pixel area. The other of the first anode wire and the first cathode wire is disposed along one side of the peripheral area, the second cathode wire is electrically connected to the first cathode wire and extends to the pixel area,
The anode wire and the cathode wire are made of the same material, one of the anode wire and the cathode wire is separated into at least two parts in the peripheral area, and the wire separated into the at least two parts is the Connected by jump wiring,
To reduce the potential difference between the anode and the cathode in each of the plurality of sub-pixels, the anode voltage input direction of the second anode wire and the cathode voltage input direction of the second cathode wire are different from each other and face each other. It is designed to be viewed,
The organic light emitting display device, wherein the flexible circuit board is disposed for each jump wire and is electrically connected to the anode wire and the cathode wire. According to paragraph 1,
The organic light emitting display device is configured such that the anode voltage of the anode wiring is gradually reduced along the anode voltage input direction,
The organic light emitting display device is configured such that the cathode voltage of the cathode wiring gradually increases along the cathode voltage input direction,
Organic light emitting device, characterized in that the degree of reduction of the anode voltage of the anode wiring with distance and the degree of increase with distance of the cathode voltage of the cathode wiring are respectively set by the wiring resistance of the anode wiring and the wiring resistance of the cathode wiring. display device. According to paragraph 2,
The organic light emitting display device is characterized in that the reduced anode voltage of the anode wire offsets the increased cathode voltage of the cathode wire, so that the potential difference between the anode and the cathode of the plurality of sub-pixels is compensated. made with an organic light emitting display device. According to paragraph 3,
An organic light emitting display device, characterized in that the difference between the wiring resistance of the anode wiring and the wiring resistance of the cathode wiring is within 10%. delete According to paragraph 1,
An organic light emitting display device, wherein the anode wire and the cathode wire are short-circuited at an end of the pixel area. According to paragraph 1,
The organic light emitting display device is characterized in that the second anode wire and the second cathode wire are arranged to stagger each other in the pixel area. a pixel area including a plurality of sub-pixels;
a peripheral area configured to surround the pixel area;
an anode wire disposed on one side of the peripheral area, extending from the one side to the other opposite side, and configured to supply an anode voltage to the pixel area;
a cathode wiring disposed on the other opposite side of the peripheral area, extending from the other facing side in a direction toward the one side, and configured to supply a cathode voltage to the pixel area; and
jump wiring and
comprising at least one circuit board,
One of the anode wire and the cathode wire is configured to surround the peripheral area,
The anode wiring and the cathode wiring are configured to receive voltage from the same side,
The anode wire and the cathode wire are made of the same material, one of the anode wire and the cathode wire is separated into at least two parts in the peripheral area, and the wire separated into the at least two parts is the Connected by jump wiring,
An organic light emitting display device, wherein the at least one circuit board is arranged not to overlap a back surface of the pixel area. According to clause 8,
Each of the plurality of sub-pixels,
A driving transistor including an active layer, a gate electrode, a source electrode, and a drain electrode;
a data line configured to apply an image signal to the driving transistor; and
It is driven by the driving transistor and includes an organic light-emitting diode including an anode, an organic light-emitting layer, and a cathode,
The data wire is electrically connected to the gate electrode of the driving transistor,
The anode wiring is electrically connected to the drain electrode of the driving transistor,
The cathode wiring is electrically connected to the cathode of the organic light emitting diode. According to clause 9,
An organic light emitting display device, wherein the image signal applied to the driving transistor through the data line is an image signal changed to compensate for the Vgs voltage according to an increase in the cathode voltage of the cathode of each of the plurality of sub-pixels. According to clause 8,
An organic light emitting display device, wherein the plurality of sub-pixels further include a transparent portion to provide transparency. delete delete delete According to clause 8,
The cathode wiring consists of at least two metal layers,
An organic light emitting display device, characterized in that the at least two metal layers are connected to each other through a contact hole. According to paragraph 1,
The organic light emitting display device wherein the second anode wire has a narrower width than the first anode wire, and the second cathode wire has a narrower width than the first cathode wire. According to paragraph 1,
The wiring length of the first cathode wiring is longer than the wiring length of the first anode wiring,
The organic light emitting display device wherein the width of the first cathode wiring is wider than the width of the first anode wiring. According to paragraph 1,
The organic light emitting diode display device wherein the first cathode wiring is arranged to surround the peripheral area in a ㅁ shape or a ring shape. According to paragraph 1,
The second cathode wiring includes a second cathode first wiring, a second cathode second wiring, and a contact hole, the second cathode first wiring is formed of the same material as the anode, and the second cathode second wiring is formed of the same material as the second anode wire, and the second cathode first wire and the second cathode second wire are connected to each other through the contact hole.

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