KR102579305B1 - Apparatus for treating substrate and method for treating substrate - Google Patents

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a stage provided with a substrate, an inkjet head disposed on the stage and providing a chemical solution to the substrate, a housing having a chemical discharge groove formed on a lower surface into which the inkjet head is inserted, and installed in the housing, and the inkjet head. It includes a cover that moves to the lower part of the head and closes the chemical discharge groove.

Description

Substrate processing apparatus and substrate processing method {Apparatus for treating substrate and method for treating substrate}

The present invention relates to a substrate processing apparatus and a substrate processing method.

To manufacture a semiconductor device or liquid crystal display, various processes such as photolithography, etching, ion implantation, deposition, and cleaning are performed by supplying a chemical solution onto the substrate. Among these processes, the photolithography process forms a desired pattern on the substrate.

The photolithography process includes a coating process of applying a photoresist such as a photoresist on a substrate, an exposure process of forming a specific pattern on the applied photoresist film, and a development process of removing a specific area from the exposed photoresist film. Among these processes, in the coating process, a chemical liquid is discharged from a nozzle onto the substrate while the substrate is being transported in one direction.

The movement of the substrate occurs in a state where the support member provides gas pressure and vacuum pressure to the bottom of the substrate to levitate the substrate. In this case, there is a problem that the nozzle is dried due to gas pressure and vacuum pressure, resulting in a decrease in the lifespan of the inkjet head and process defects due to nozzle clogging.

The problem to be solved by the present invention is to selectively open the nozzle only when the substrate is positioned on the stage, thereby preventing the inkjet head from drying out and causing a decrease in the lifespan of the inkjet head and process defects due to inkjet head clogging. To provide a processing device and a substrate processing method.

Another problem that the present invention aims to solve is to prevent the inkjet head from clogging by storing a small amount of the chemical discharged through the inkjet head in the drain storage unit through the drain pipe while the chemical discharge groove is closed, thereby extending the life of the inkjet head. To provide a substrate processing device and a substrate processing method that prevents degradation and process defects from occurring.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

One aspect of the substrate processing apparatus of the present invention for achieving the above object is a stage provided with a substrate, an inkjet head disposed on the stage and providing a chemical solution to the substrate, and the inkjet head is inserted into the lower surface. It includes a housing having a chemical discharge groove formed therein, and a cover installed on the housing and moving to a lower portion of the inkjet head to close the chemical discharge groove.

The cover has a flat shape and can move in the horizontal direction to close the chemical discharge groove.

The cover may be inserted into the interior of the housing.

The inkjet head includes a first inkjet head and a second inkjet head, and the chemical discharge groove includes a first chemical discharge groove into which the first inkjet head is inserted and a second chemical discharge groove into which the second inkjet head is inserted. It can be included.

The cover includes a first cover that moves to the bottom of the first inkjet head and closes the first chemical discharge groove, and a second cover that moves to the bottom of the second inkjet head and closes the second chemical discharge groove. may include.

It may further include a drain storage unit installed in the housing and storing a chemical liquid, and a drain pipe penetrating the housing and connecting the chemical liquid discharge groove and the drain storage unit.

The drain pipe exposed to the chemical discharge groove may be disposed between the inkjet head and the cover.

The drain pipe may have an inclined profile that is formed closer to the lower surface of the housing as it becomes closer to the drain storage part.

The cover may be arranged to have an acute angle with the lower surface of the housing.

The cover is installed on the lower surface of the housing and can move horizontally along the lower surface of the housing to close the chemical discharge groove.

It further includes a gas hole formed in the stage and providing gas pressure to the substrate, and an intake hole formed in the stage and providing vacuum pressure to the substrate, wherein the gas pressure and the vacuum pressure are used to provide gas pressure to the substrate. The substrate can be levitated.

Another aspect of the substrate processing apparatus of the present invention for achieving the above problem is to levitate a substrate using gas pressure and vacuum pressure, a loading portion where the substrate is loaded, an application portion where a chemical solution is provided to the substrate, and the substrate. A stage including a carrying out unit to be unloaded, disposed on the stage to provide the chemical solution to the substrate, open when the substrate is placed on the stage, and closed when the substrate is not placed on the stage. It includes a nozzle, a gas hole formed in the stage and providing the gas pressure to the substrate, and an intake hole formed in the stage and providing the vacuum pressure to the substrate.

The nozzle includes an inkjet head for supplying the chemical liquid to the substrate, a housing having a chemical liquid discharge groove formed on a lower surface into which the inkjet head is inserted, and the nozzle is installed in the housing and moves to the lower part of the inkjet head to form the chemical liquid discharge groove. It may include a cover that closes the.

The cover has a flat shape and can move in the horizontal direction to close the chemical discharge groove.

It may further include a drain storage unit installed in the housing and storing the chemical liquid in a state in which the chemical liquid discharge groove is closed, and a drain pipe penetrating the housing and connecting the chemical liquid discharge groove and the drain storage unit. there is.

The drain pipe exposed to the chemical discharge groove may be disposed between the inkjet head and the cover.

One aspect of the substrate processing method of the present invention for achieving the above problem is loading a substrate on a stage, opening a nozzle disposed on the stage, applying a chemical solution to the substrate through the nozzle, and applying a chemical solution to the substrate through the nozzle. Including closing the nozzle, an inkjet head for providing the chemical solution to the substrate, a housing having a chemical discharge groove formed on a lower surface into which the inkjet head is inserted, and installed in the housing, the lower part of the inkjet head It includes a cover that moves to close the chemical discharge groove.

The stage includes a carrying part where the substrate is loaded, an application part where the chemical solution is provided to the substrate, and a carrying out part where the substrate is unloaded, and the cover opens the nozzle after the substrate is loaded into the carrying part. and the cover may close the nozzle after the substrate is unloaded from the carrying unit.

The stage includes an inlet part where the substrate is loaded, an application part where the chemical solution is provided to the substrate, and a carryout part where the substrate is unloaded, and the cover covers the nozzle after the substrate is moved onto the applicator. After opening, the cover may close the nozzle before the substrate is moved onto the carrying unit.

The nozzle is installed in the housing and includes a drain storage portion that stores the chemical liquid in a state in which the chemical liquid discharge groove is closed, and a drain pipe that penetrates the housing and connects the chemical liquid discharge groove and the drain storage portion. More may be included.

Specific details of other embodiments are included in the detailed description and drawings.

1 is a perspective view illustrating a substrate processing apparatus according to some embodiments of the present invention.
Figure 2 is a plan view for explaining a substrate processing apparatus according to some embodiments of the present invention.
Figure 3 is a cross-sectional view taken along line AA' of Figure 2.
FIG. 4 is a diagram illustrating a lower surface of a nozzle of a substrate processing apparatus according to some embodiments of the present invention.
Figure 5 is a cross-sectional view taken along line BB' in Figure 4.
FIGS. 6 and 7 are views for explaining the operation of a nozzle of a substrate processing apparatus according to some embodiments of the present invention. FIG. 6 is a view for explaining the lower surface of the nozzle, and FIG. 7 is a view taken along line BB′ of FIG. 6. This is a cross-sectional view cut along .
Figure 8 is a flowchart for explaining a substrate processing method according to some embodiments of the present invention.
Figure 9 is a flowchart for explaining a substrate processing method according to some other embodiments of the present invention.
10 and 11 are views for explaining the lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention.
FIG. 12 is a view illustrating a lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention.
FIGS. 13 and 14 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention, and are cross-sectional views taken along line CC' of FIG. 12.
FIGS. 15 and 16 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention, and are cross-sectional views taken along line CC' of FIG. 12.
FIG. 17 is a view illustrating the lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention.
Figure 18 is a cross-sectional view taken along line DD' in Figure 17.
FIGS. 19 and 20 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention. FIG. 19 is a diagram for explaining the lower surface of the nozzle, and FIG. 20 is a diagram DD of FIG. 19. ' This is a cross-sectional view cut along a line.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. The present embodiments are merely intended to ensure that the disclosure of the present invention is complete and to provide common knowledge in the technical field to which the present invention pertains. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Spatially relative terms such as “below”, “beneath”, “lower”, “above”, “upper”, etc. are used as a single term as shown in the drawing. It can be used to easily describe the correlation between elements or components and other elements or components. Spatially relative terms should be understood as terms that include different directions of the element during use or operation in addition to the direction shown in the drawings. For example, if an element shown in the drawings is turned over, an element described as “below” or “beneath” another element may be placed “above” the other element. Accordingly, the illustrative term “down” may include both downward and upward directions. Elements can also be oriented in other directions, so spatially relative terms can be interpreted according to orientation.

Although first, second, etc. are used to describe various elements, elements and/or sections, it is understood that these elements, elements and/or sections are not limited by these terms. These terms are merely used to distinguish one element, element, or section from other elements, elements, or sections. Therefore, it goes without saying that the first element, first element, or first section mentioned below may also be a second element, second element, or second section within the technical spirit of the present invention.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used herein, “comprises” and/or “comprising” refers to the presence of one or more other components, steps, operations and/or elements. or does not rule out addition.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components will be assigned the same reference numbers regardless of the reference numerals, and overlapping The explanation will be omitted.

Hereinafter, a substrate processing apparatus according to some embodiments of the present invention will be described with reference to FIGS. 1 to 7.

1 is a perspective view illustrating a substrate processing apparatus according to some embodiments of the present invention. Figure 2 is a plan view for explaining a substrate processing apparatus according to some embodiments of the present invention. Figure 3 is a cross-sectional view taken along line A-A' in Figure 2. FIG. 4 is a diagram illustrating a lower surface of a nozzle of a substrate processing apparatus according to some embodiments of the present invention. Figure 5 is a cross-sectional view taken along line B-B' in Figure 4. FIGS. 6 and 7 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some embodiments of the present invention. FIG. 6 is a diagram for explaining the lower surface of the nozzle, and FIG. 7 is a diagram taken along line B-B' of FIG. 6. This is a cross-sectional view cut along .

1 to 7, a substrate processing apparatus according to some embodiments of the present invention includes a stage 100, a plurality of holes 110, a gripper 120, a first guide rail 125, and a nozzle 130. ), a second guide rail 141, a vertical frame 142, a support 143, a gas providing unit 150, a gas providing line 155, a gas intake unit 160, and a gas intake line 165. do.

The stage 100 may extend in the first horizontal direction DR1. The substrate W may be provided on the stage 100. The stage 100 can levitate the substrate W.

The stage 100 may include, for example, an input portion 101, an application portion 102, and an output portion 103. The carrying-in part 101, the application part 102, and the carrying-out part 103 may be arranged to be sequentially adjacent to each other in the first horizontal direction DR1. However, the technical idea of the present invention is not limited thereto. In some other embodiments, each of the loading section 101, the application section 102, and the carrying out section 103 may be comprised of separate stages.

A substrate W may be loaded into the loading unit 101. The applicator 102 may provide the chemical solution 10 to the substrate W. The substrate W may be unloaded from the stage 100 through the carrying unit 103. The substrate W moved to the carrying unit 103 may be moved using a separate transfer unit.

A plurality of holes 110 penetrating the inside of the stage 100 may be formed. For example, a plurality of holes 110 penetrating the inside of each of the loading unit 101, the application unit 102, and the carrying out unit 103 may be formed. Each of the plurality of holes 110 may be arranged to be spaced apart from each other on a plane defined by the first horizontal direction DR1 and the second horizontal direction DR2 perpendicular to the first horizontal direction DR1.

The plurality of holes 110 may include a gas hole 111, an intake hole 112, and an exhaust hole 113. Gas pressure may be provided toward the upper part of the stage 100 through the gas hole 111. Vacuum pressure can be provided to the upper part of the stage 100 through the intake hole 112. That is, the gas existing at the top of the stage 100 can be sucked in through the intake hole 112. Gas existing in the upper part of the stage 100 may be exhausted to the lower part of the stage 100 through the exhaust hole 113.

The gas hole 111 may be formed in each of the introduction part 101, the application part 102, and the discharge part 103. Gas pressure may be continuously provided toward the upper part of the stage 100 through the gas hole 111 from before the substrate W is loaded on the stage 100 until it is unloaded from the stage 100.

The intake hole 112 may be formed in the application portion 102. For example, the intake hole 112 may not be formed in each of the loading part 101 and the carrying out part 103. However, the technical idea of the present invention is not limited thereto. In some other embodiments, the intake hole 112 may also be formed in each of the carrying-in part 101 and the carrying-out part 103.

Vacuum pressure may be provided to the upper part of the stage 100 through the intake hole 112 from the time the substrate W is loaded on the stage 100 until the substrate W is unloaded from the stage 100 . That is, from the time the substrate W is loaded on the stage 100 until the substrate W is unloaded from the stage 100, the gas present in the upper part of the stage 100 can be sucked in through the intake hole 112.

The exhaust hole 113 may be formed in each of the carrying-in part 101 and the carrying-out part 103. From before the substrate W is loaded on the stage 100 until it is unloaded from the stage 100, the gas present in the upper part of the stage 100 continuously flows into the lower part of the stage 100 through the exhaust hole 113. can be exhausted.

The first guide rail 125 may be disposed on both sides of the stage 100 in the second horizontal direction DR2. The first guide rail 125 may extend in the first horizontal direction DR1.

The gripper 120 may be connected to the first guide rail 125. The gripping portion 120 may be disposed on both sides of the stage 100 in the second horizontal direction DR2. The gripper 120 may be moved in the first horizontal direction DR1 along the first guide rail 125. The gripping portion 120 may be disposed on both sides of the stage 100 in the second horizontal direction DR2.

The gripper 120 may include a first part 121 connected to the first guide rail 125 and a second part 122 protruding from the first part 121 toward the stage 100. The substrate W loaded on the stage 100 may be held on the stage 100 by the gripper 120 . The substrate W may be moved in the first horizontal direction DR1 while being held by the gripper 120 .

The second guide rail 141 may be disposed on both sides of the stage 100 in the second horizontal direction DR2. The first guide rail 125 may be disposed between the second guide rail 141 and the stage 100. The second guide rail 141 may extend in the first horizontal direction DR1.

The vertical frame 142 may be disposed on both sides of the stage 100 in the second horizontal direction DR2. The vertical frame 142 may be connected to the second guide rail 141. The vertical frame 142 may be moved in the first horizontal direction DR1 along the second guide rail 141. The support 143 may connect between two vertical frames 142. The support 143 may extend on the stage 100 in the second horizontal direction DR2.

The gas providing unit 150 may be connected to the gas hole 111 through the gas providing line 155. The gas provider 150 may provide gas pressure to the upper part of the stage 100 through the gas hole 111.

The gas intake unit 160 may be connected to the intake hole 112 through a gas intake line 165. The gas intake unit 160 may provide vacuum pressure to the upper part of the stage 100 through the intake hole 112.

The stage 100 may levitate the substrate W using the gas pressure provided from the gas provider 150 and the vacuum pressure provided from the gas intake portion 160.

The nozzles 130 may be arranged to be spaced apart in the vertical direction DR3 on the stage 100 . For example, the nozzle 130 may be disposed on the applicator 102. The nozzle 130 may be connected to the support 143. The nozzle 130 may be moved along the support 143 in the second horizontal direction DR2. The nozzle 130 may be connected to the support 143 and moved in the first horizontal direction DR1 along the second guide rail 141.

The nozzle 130 may provide the chemical solution 10 to the substrate W positioned on the applicator 102 . The chemical solution 10 may be, for example, a photosensitive solution used in a photoresist process. However, the technical idea of the present invention is not limited thereto.

The nozzle 130 may include a housing 131, a chemical discharge groove 132, an inkjet head 133, and a cover 134.

Housing 131 may be connected to support 143. The housing 131 may function as an outer frame in which a plurality of components are placed.

The chemical discharge groove 132 may be formed on the lower surface (131a) of the housing 131 facing the stage 100. The chemical discharge groove 132 may be formed to be recessed from the lower surface 131a of the housing 131 in the vertical direction DR3.

A plurality of chemical discharge grooves 132 may be formed. Each of the chemical liquid discharge grooves 132 may be spaced apart from each other in, for example, the first horizontal direction DR1 and the second horizontal direction DR2. However, the technical idea of the present invention is not limited thereto.

For example, the chemical discharge groove 132 may include a first chemical discharge groove 132_1 and a second chemical discharge groove 132_2 spaced apart from the first chemical discharge groove 132_1 in the second horizontal direction DR2. You can. The first chemical discharge grooves 132_1 may be aligned and spaced apart from each other in the first horizontal direction DR1. The second chemical discharge grooves 132_2 may be aligned and spaced apart from each other in the first horizontal direction DR1.

The inkjet head 133 may be inserted into each chemical liquid discharge groove 132. A plurality of inkjet heads 133 may be inserted into one chemical liquid discharge groove 132 . 4 and 5 show that five inkjet heads 133 are inserted into one chemical discharge groove 132, but this is an example, and the inkjet heads 133 inserted into one chemical discharge groove 132 ) the number is not limited.

For example, the inkjet head 133 may include a first inkjet head 133_1 and a second inkjet head 133_2. The first inkjet head 133_1 may be inserted into the first chemical liquid discharge groove 132_1. The second inkjet head 133_2 may be inserted into the second chemical liquid discharge groove 132_2.

The lower surface of the inkjet head 133 may be formed to be higher than the lower surface (131a) of the housing 131. That is, the lower surface of the inkjet head 133 may be formed closer to the support 143 than the lower surface 131a of the housing 131. The inkjet head 133 may discharge the chemical liquid 10. The chemical liquid 10 discharged from the inkjet head 133 may be provided to the substrate W.

Cover 134 may be installed on housing 131. For example, the cover 134 may be inserted into the housing 131. The cover 134 may open and close the chemical discharge groove 132 by moving in the opposite direction of the second horizontal direction DR2 or in the second horizontal direction DR2. The cover 134 may have a flat shape, for example. However, the technical idea of the present invention is not limited thereto.

For example, the cover 134 may include a first cover 134_1 and a second cover 134_2. The first covers 134_1 may be aligned and spaced apart from each other in the first horizontal direction DR1. The second covers 134_2 may be aligned and spaced apart from each other in the first horizontal direction DR1.

The first cover 134_1 may move to the lower part of the first inkjet head 133_1 to close the first chemical discharge groove 132_1. For example, the first cover 134_1 may move in a direction opposite to the second horizontal direction DR2 to close the first chemical discharge groove 132_1. The first cover 134_1 may move in the second horizontal direction DR2 to open the first chemical discharge groove 132_1.

The second cover 134_2 may move to the lower part of the second inkjet head 133_2 to close the second chemical discharge groove 132_2. For example, the second cover 134_2 may move in the second horizontal direction DR2 to close the second chemical discharge groove 132_2. The second cover 134_2 may move in the opposite direction of the second horizontal direction DR2 to open the second chemical discharge groove 132_2.

When the substrate W is placed on the stage 100, the cover 134 may move in the horizontal direction to open the chemical discharge groove 132. Additionally, when the substrate W is not placed on the stage 100, the cover 134 may move in the horizontal direction to close the chemical discharge groove 132.

Hereinafter, a substrate processing method according to some embodiments of the present invention will be described with reference to FIGS. 1 to 8.

Figure 8 is a flowchart for explaining a substrate processing method according to some embodiments of the present invention.

Referring to FIGS. 1 to 8 , in the substrate processing method according to some embodiments of the present invention, a substrate W may be loaded onto the loading portion 101 of the stage 100 (S110). Next, the cover 134 of the nozzle 130 may move in the horizontal direction to open the chemical liquid discharge groove 132 (S120). Due to this, the inkjet head 133 may be exposed through the chemical liquid discharge groove 132.

Subsequently, the substrate W may be moved onto the coating portion 102 of the stage 100 (S130). Subsequently, the chemical solution 10 discharged from the inkjet head 133 may be applied to the substrate W located on the application unit 102 of the stage 100 (S140).

Subsequently, the substrate W onto which the chemical solution 10 is applied may be moved onto the carrying out portion 103 of the stage 100 (S150). Subsequently, the substrate W onto which the chemical solution 10 is applied may be unloaded from the delivery unit 103 of the stage 100 (S160). Next, the cover 134 of the nozzle 130 may move in the horizontal direction to close the chemical liquid discharge groove 132 (S170).

The substrate processing apparatus and substrate processing method according to some embodiments of the present invention selectively opens the nozzle 130 only when the substrate W is positioned on the stage 100, so that the inkjet head 133 dries and the inkjet head 133 is dried. It is possible to prevent a decrease in the lifespan of the inkjet head 133 and process defects due to clogging of the head 133.

Hereinafter, a substrate processing method according to several other embodiments of the present invention will be described with reference to FIGS. 1 to 7 and 9.

Figure 9 is a flowchart for explaining a substrate processing method according to some other embodiments of the present invention.

Referring to FIGS. 1 to 7 and 9 , in the substrate processing method according to some other embodiments of the present invention, a substrate W may be loaded onto the loading portion 101 of the stage 100 (S210). Subsequently, the substrate W may be moved onto the coating unit 102 of the stage 100 (S220).

Next, the cover 134 of the nozzle 130 may move in the horizontal direction to open the chemical liquid discharge groove 132 (S230). Due to this, the inkjet head 133 may be exposed through the chemical liquid discharge groove 132.

Subsequently, the chemical solution 10 discharged from the inkjet head 133 may be applied to the substrate W located on the application unit 102 of the stage 100 (S240). Next, the cover 134 of the nozzle 130 may move in the horizontal direction to close the chemical discharge groove 132 (S250).

Subsequently, the substrate W on which the chemical solution 10 is applied may be moved onto the carrying out portion 103 of the stage 100 (S260). Subsequently, the substrate W onto which the chemical solution 10 is applied may be unloaded from the delivery unit 103 of the stage 100 (S270).

Hereinafter, a substrate processing apparatus according to several other embodiments of the present invention will be described with reference to FIGS. 10 and 11. The description will focus on differences from the substrate processing apparatus shown in FIGS. 1 to 7.

10 and 11 are views for explaining the lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention.

Referring to Figures 10 and 11, in the substrate processing apparatus according to some other embodiments of the present invention, one cover (234_1) opens and closes the first chemical discharge groove (132_1), and one cover (234_2) opens and closes the second chemical discharge groove (132_1). The chemical discharge groove (132_2) can be opened and closed.

For example, two covers 234_1 and 234_2 may be placed on the nozzle 230. The cover 234 may include a first cover 234_1 and a second cover 234_2. One first cover 234_1 may move in a direction opposite to the second horizontal direction DR2 to close the first chemical discharge groove 132_1. One first cover 234_1 may move in the second horizontal direction DR2 to open the first chemical discharge groove 132_1.

Additionally, one second cover 234_2 may move in the second horizontal direction DR2 to close the second chemical discharge groove 132_2. One second cover 234_2 may move in a direction opposite to the second horizontal direction DR2 to open the second chemical discharge groove 132_2.

Hereinafter, a substrate processing apparatus according to some other embodiments of the present invention will be described with reference to FIGS. 12 to 14. The description will focus on differences from the substrate processing apparatus shown in FIGS. 1 to 7.

FIG. 12 is a view illustrating a lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention. FIGS. 13 and 14 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention, and are cross-sectional views taken along line C-C' of FIG. 12.

Referring to FIGS. 12 to 14 , in the substrate processing apparatus according to some other embodiments of the present invention, the nozzle 330 may include a drain storage unit 370 and a drain pipe 375.

The drain storage unit 370 may be installed in the housing 131. For example, the drain storage unit 370 may be connected to the lower side wall of the housing 131. For example, the drain storage unit 370 may be respectively connected to both side walls of the housing 131 in the second horizontal direction DR2.

The drain storage unit 370 may store the chemical liquid 10 discharged from the inkjet head 133 when the chemical liquid discharge groove 132 is closed. For example, the drain storage unit 370 connected to the side wall of the housing 131 adjacent to the first chemical discharge groove 132_1 may store the chemical liquid 10 discharged from the first inkjet head 133_1. Additionally, the drain storage unit 370 connected to the side wall of the housing 131 adjacent to the second chemical discharge groove 132_2 may store the chemical liquid 10 discharged from the second inkjet head 133_2.

The drain pipe 375 may penetrate the side wall of the housing 131 and connect each of the chemical discharge grooves 132 and the drain storage unit 370. For example, the drain pipe 375 may connect the first chemical discharge groove 132_1 and the drain storage unit 370 connected to the side wall of the housing 131 adjacent to the first chemical discharge groove 132_1. Additionally, the drain pipe 375 may connect the second chemical discharge groove 132_2 and the drain storage portion 370 connected to the side wall of the housing 131 adjacent to the second chemical discharge groove 132_2.

One end of the drain pipe 375 exposed to the chemical discharge groove 132 may be disposed between the inkjet head 133 and the cover 134. For example, one end of the drain pipe 375 exposed to the first chemical discharge groove 132_1 may be disposed between the first inkjet head 133_1 and the first cover 134_1. Additionally, one end of the drain pipe 375 exposed to the second chemical discharge groove 132_2 may be disposed between the second inkjet head 133_2 and the second cover 134_2.

Drain pipe 375 may have a sloped profile. For example, the drain pipe 375 may have an inclined profile formed closer to the lower surface 131a of the housing 131 as it becomes closer to the drain storage part 370. However, the technical idea of the present invention is not limited thereto. In some other embodiments, the drain pipe 375 may be formed parallel to the lower surface 131a of the housing 131.

In the substrate processing methods shown in FIGS. 8 and 9, the chemical liquid 10 discharged from the inkjet head 133 in a state in which the nozzle 130 is closed flows into the drain storage unit ( 370) can be effectively stored.

A substrate processing apparatus and a substrate processing method according to some other embodiments of the present invention allow a small amount of chemical liquid 10 discharged through the inkjet head 133 to be discharged through a drain pipe 375 in a state in which the chemical liquid discharge groove 132 is closed. By storing it in the drain storage unit 370, it is possible to prevent the inkjet head 133 from being clogged, thereby preventing a decrease in the lifespan of the inkjet head 133 and occurrence of process defects.

Hereinafter, a substrate processing apparatus according to some other embodiments of the present invention will be described with reference to FIGS. 15 and 16. The description will focus on differences from the substrate processing apparatus shown in FIGS. 12 to 14.

FIGS. 15 and 16 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention, and are cross-sectional views taken along line C-C' of FIG. 12.

Referring to FIGS. 15 and 16 , in the substrate processing apparatus according to some other embodiments of the present invention, the covers 434_1 and 434_2 installed on the nozzle 430 may be arranged to have an acute angle with the lower surface of the housing 131. .

For example, the first cover 434_1 has an inclined profile formed adjacent to the lower surface 131a of the housing 131 as it approaches the drain storage portion 370 disposed on one side of the first chemical discharge groove 132_1. You can have The first cover 434_1 may have an acute angle with the lower surface 131a of the housing 131.

In addition, the second cover 434_2 has an inclined profile formed closer to the lower surface 131a of the housing 131 as it approaches the drain storage portion 370 disposed on one side of the second chemical discharge groove 132_2. You can. The second cover 434_2 may have an acute angle with the lower surface 131a of the housing 131. The first cover 434_1 and the second cover 434_2 may be arranged symmetrically to each other.

Hereinafter, a substrate processing apparatus according to some other embodiments of the present invention will be described with reference to FIGS. 17 to 20. The description will focus on differences from the substrate processing apparatus shown in FIGS. 1 to 7.

FIG. 17 is a view illustrating the lower surface of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention. FIG. 18 is a cross-sectional view taken along line D-D' of FIG. 17. FIGS. 19 and 20 are diagrams for explaining the operation of a nozzle of a substrate processing apparatus according to some other embodiments of the present invention. FIG. 19 is a diagram for explaining the lower surface of the nozzle, and FIG. 20 is a diagram illustrating the D-D of FIG. 19. ' This is a cross-sectional view cut along a line.

Referring to FIGS. 17 to 20 , in the substrate processing apparatus according to some other embodiments of the present invention, the cover 534 disposed on the nozzle 530 may be installed on the lower surface 131a of the housing 131. The cover 534 can move in the horizontal direction along the lower surface 131a of the housing 131 to open and close the chemical liquid discharge groove 132.

For example, the cover 534 may include a first cover 534_1 and a second cover 534_2. The first cover 534_1 may move in the opposite direction of the second horizontal direction DR2 along the lower surface 131a of the housing 131 to close the first chemical discharge groove 132_1. The first cover 534_1 may move in the second horizontal direction DR2 along the lower surface 131a of the housing 131 to open the first chemical discharge groove 132_1.

Additionally, the second cover 534_2 may move in the second horizontal direction DR2 along the lower surface 131a of the housing 131 to close the second chemical discharge groove 132_2. The second cover 534_2 may move in the opposite direction of the second horizontal direction DR2 along the lower surface 131a of the housing 131 to open the second chemical discharge groove 132_2.

Although embodiments of the present invention have been described with reference to the above and the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. You will understand that it exists. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

100: Stage 101: Import department
102: Applicator 103: Carry-out unit
111: gas hole 112: intake hole
113: exhaust hole 120: gripping part
125: first guide rail 130: nozzle
131: Housing 132: Chemical discharge groove
133: inkjet head 134: cover
141: second guide rail 150: gas providing unit
155: gas supply line 160: gas intake section
165: gas intake line

Claims (20)

A stage provided with a substrate;
an inkjet head disposed on the stage and providing a chemical solution to the substrate;
a housing having a chemical discharge groove formed on its lower surface into which the inkjet head is inserted; and
A cover installed on the housing and moving to a lower portion of the inkjet head to close the chemical discharge groove,
The inkjet head includes a first inkjet head and a second inkjet head,
The chemical discharge groove includes a first chemical discharge groove into which the first inkjet head is inserted and a second chemical discharge groove into which the second inkjet head is inserted,
The cover is,
It includes a first cover that moves to the bottom of the first inkjet head to close the first chemical discharge groove, and a second cover that moves to the bottom of the second inkjet head to close the second chemical discharge groove,
The first inkjet head and the second inkjet head are spaced apart from each other to face each other,
The first cover and the second cover are located adjacent to the middle area between the first inkjet head and the second inkjet head,
The first cover moves forward and backward from the middle area to the bottom of the first inkjet head, and the second cover moves back and forth from the middle area to the bottom of the second inkjet head, so that the first inkjet head and the second inkjet head A substrate processing device that allows opening and closing of each head. According to paragraph 1,
A substrate processing device in which the cover has a flat shape and moves in a horizontal direction to close the chemical discharge groove. According to paragraph 1,
A substrate processing device wherein the cover is inserted into the interior of the housing. delete delete According to paragraph 1,
a drain storage unit installed in the housing and storing a chemical solution;
The substrate processing apparatus further includes a drain pipe penetrating the housing and connecting the chemical discharge groove and the drain storage unit. According to clause 6,
The drain pipe exposed to the chemical discharge groove is disposed between the inkjet head and the cover. According to clause 6,
The drain pipe has an inclined profile formed closer to the lower surface of the housing as it approaches the drain storage unit. According to paragraph 1,
A substrate processing device wherein the cover is arranged to have an acute angle with the lower surface of the housing. delete According to paragraph 1,
a gas hole formed in the stage and providing gas pressure to the substrate;
It is formed on the stage and further includes an intake hole that provides vacuum pressure to the substrate,
A substrate processing device that levitates the substrate on the stage using the gas pressure and the vacuum pressure. A stage that levitates a substrate using gas pressure and vacuum pressure and includes a carrying part where the substrate is loaded, an application part where a chemical solution is provided to the substrate, and a carrying part where the substrate is unloaded;
a nozzle disposed on the stage to provide the chemical solution to the substrate, open when the substrate is placed on the stage, and closed when the substrate is not placed on the stage;
a gas hole formed in the stage and providing the gas pressure to the substrate; and
It is formed on the stage and includes an intake hole that provides the vacuum pressure to the substrate,
The nozzle is,
An inkjet head that provides the chemical solution to the substrate, a housing having a chemical discharge groove formed on a lower surface into which the inkjet head is inserted, and a cover installed on the housing and moving to the lower part of the inkjet head to close the chemical discharge groove. Including,
The inkjet head includes a first inkjet head and a second inkjet head,
The chemical discharge groove includes a first chemical discharge groove into which the first inkjet head is inserted and a second chemical discharge groove into which the second inkjet head is inserted,
The cover is,
It includes a first cover that moves to the bottom of the first inkjet head to close the first chemical discharge groove, and a second cover that moves to the bottom of the second inkjet head to close the second chemical discharge groove,
The first inkjet head and the second inkjet head are positioned to be spaced apart from each other, and the first cover and the second cover are positioned adjacent to an intermediate area between the first inkjet head and the second inkjet head. ,
The first cover moves forward and backward from the middle area to the bottom of the first inkjet head, and the second cover moves back and forth from the middle area to the bottom of the second inkjet head, so that the first inkjet head and the second inkjet head A substrate processing device that allows opening and closing of each head. delete According to clause 12,
A substrate processing device in which the cover has a flat shape and moves in a horizontal direction to close the chemical discharge groove. According to clause 12,
a drain storage unit installed in the housing and storing the chemical solution in a state in which the chemical liquid discharge groove is closed;
The substrate processing apparatus further includes a drain pipe penetrating the housing and connecting the chemical discharge groove and the drain storage unit. According to clause 15,
The drain pipe exposed to the chemical discharge groove is disposed between the inkjet head and the cover. Loading a substrate on a stage, opening a nozzle disposed on the stage, applying a chemical solution to the substrate through the nozzle, and closing the nozzle,
The nozzle is,
An inkjet head that provides the chemical solution to the substrate, a housing having a chemical discharge groove formed on a lower surface into which the inkjet head is inserted, and a cover installed on the housing and moving to the lower part of the inkjet head to close the chemical discharge groove. Including,
The inkjet head includes a first inkjet head and a second inkjet head,
The chemical discharge groove includes a first chemical discharge groove into which the first inkjet head is inserted and a second chemical discharge groove into which the second inkjet head is inserted,
The cover is,
It includes a first cover that moves below the first inkjet head to close the first chemical discharge groove, and a second cover that moves to the bottom of the second inkjet head to close the second chemical discharge groove,
The first inkjet head and the second inkjet head are spaced apart from each other to face each other,
The first cover and the second cover are located adjacent to the middle area between the first inkjet head and the second inkjet head,
The first cover moves forward and backward from the middle area to the bottom of the first inkjet head, and the second cover moves back and forth from the middle area to the bottom of the second inkjet head, so that the first inkjet head and the second inkjet head A method of processing a substrate, allowing opening and closing of each head. According to clause 17,
The stage includes an inlet part where the substrate is loaded, an application part where the chemical solution is provided to the substrate, and an unloader part where the substrate is unloaded.
The cover opens the nozzle after the substrate is loaded into the loading unit,
The cover closes the nozzle after the substrate is unloaded from the carrying unit. According to clause 17,
The stage includes an inlet part where the substrate is loaded, an application part where the chemical solution is provided to the substrate, and an unloader part where the substrate is unloaded.
The cover opens the nozzle after the substrate is moved onto the applicator,
The cover closes the nozzle before the substrate is moved onto the carrying unit. According to clause 17,
The nozzle is,
a drain storage unit installed in the housing and storing the chemical solution in a state in which the chemical liquid discharge groove is closed;
A substrate processing method further comprising a drain pipe penetrating the housing and connecting the chemical discharge groove and the drain storage unit.

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