KR102579164B1 - Substrate liquid processing apparatus and recording medium - Google Patents

Abstract

The concentration of the treatment liquid is appropriately changed. The substrate liquid processing device A1 includes a processing liquid storage unit 38 for storing a processing liquid, a processing liquid discharge unit 41 for discharging the processing liquid from the processing liquid storage unit 38, and a processing liquid discharge unit ( It is provided with a control unit 7 that controls 41), wherein the control unit 7 performs first control in a constant concentration mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is adjusted to a predetermined set concentration, and processing. A second control in a concentration change mode in which the concentration of the processing liquid in the liquid reservoir 38 is changed is executed, and in the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and the concentration is changed. When the set concentration after the concentration change is lower than the previous set concentration, the processing liquid discharge unit 41 is controlled to start discharging the processing liquid.

Description

Substrate liquid processing device and storage medium {SUBSTRATE LIQUID PROCESSING APPARATUS AND RECORDING MEDIUM}

This disclosure relates to a substrate liquid processing device and a storage medium.

Patent Document 1 discloses a substrate liquid that discharges a phosphoric acid solution from a storage portion of the processing liquid and supplies a phosphoric acid solution and water to the storage portion of the processing liquid so that the phosphoric acid concentration in the phosphoric acid solution, which is a processing liquid for etching of a semiconductor, is constant. A processing device is disclosed.

Japanese Patent Specification No. 6,118,739

As described above, in the substrate liquid processing apparatus described in Patent Document 1, processing is performed while adjusting the concentration of the processing liquid to a constant level. Here, in the substrate liquid processing apparatus, there are cases where it is desired to change the concentration of the processing liquid during processing in order to ensure processing flexibility.

Accordingly, the present disclosure aims to appropriately change the concentration of the processing liquid.

A substrate liquid processing apparatus according to the present disclosure includes a reservoir for storing a processing liquid, a discharge unit for discharging the processing liquid from the reservoir, and a control unit for controlling the discharge unit, wherein the control unit determines the concentration of the processing liquid in the reservoir. A first control is performed during a concentration period during which the concentration is adjusted to a predetermined set concentration, and a second control is performed during a concentration change period during which the concentration of the treatment liquid in the reservoir is changed. In the second control, the set concentration before the concentration change is performed. and the set concentration after the concentration change are compared, and when the set concentration after the concentration change is lower than the set concentration before the concentration change, the discharge unit is controlled so that discharge of the processing liquid is started.

According to the present disclosure, the concentration of the processing liquid can be appropriately changed.

1 is a plan view schematically showing a substrate liquid processing system.
Figure 2 is a schematic diagram of a substrate liquid processing device.
Figure 3 is a block diagram showing the functional configuration of the control unit.
Figure 4 is a table showing an example of a recipe.
Figure 5 is a time chart of substrate liquid processing.
6 is a flowchart of substrate liquid processing.
Figure 7 is a schematic diagram showing the configuration of a concentration increase accelerating unit according to a modification.
Figure 8 is a schematic diagram showing the configuration of a concentration increase accelerating unit according to a modified example.
FIG. 9 is a schematic diagram showing a more specific configuration example of the concentration increase accelerating portion of FIG. 8.
Figure 10 is a schematic diagram showing a specific example of a concentration sensor.
11 is a flowchart illustrating the supply sequence of a high-concentration treatment liquid.

Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same symbol is assigned to the same element or element having the same function, and redundant description is omitted. As shown in FIG. 1, the substrate liquid processing system 1A includes a carrier loading/unloading section 2, a lot forming section 3, a lot placing section 4, a lot conveying section 5, and a lot processing section. (6) and a control unit (7).

Among these, the carrier loading and unloading section 2 carries out loading and unloading of the carrier 9 that accommodates a plurality of substrates (silicon wafers) 8 (e.g., 25 sheets) arranged vertically in a horizontal position. This carrier loading/unloading section 2 includes a carrier stage 10 for arranging a plurality of carriers 9, a carrier transport mechanism 11 for transporting the carriers 9, and temporarily storing the carriers 9. Carrier stocks 12 and 13 for placing the carrier and a carrier placement table 14 for placing the carrier 9 are provided. Here, the carrier stock 12 temporarily stores the substrate 8, which becomes a product, before processing it in the lot processing unit 6. Additionally, the carrier stock 13 temporarily stores the substrate 8, which becomes a product, after processing it in the lot processing unit 6.

Then, the carrier loading/unloading unit 2 transfers the carrier 9 brought into the carrier stage 10 from the outside to the carrier stock 12 or the carrier placement table 14 using the carrier transport mechanism 11. Additionally, the carrier loading/unloading unit 2 transfers the carrier 9 placed on the carrier placement table 14 to the carrier stock 13 or carrier stage 10 using the carrier transport mechanism 11. The carrier 9 conveyed to the carrier stage 10 is carried out.

The lot forming unit 3 combines the substrates 8 accommodated in one or more carriers 9 to form a lot consisting of a plurality of substrates 8 (for example, 50 sheets) to be processed simultaneously. Additionally, when forming a lot, the lot may be formed so that the surfaces on which the pattern is formed on the surface of the substrate 8 face each other, or the surfaces on which the pattern is formed on the surface of the substrate 8 may all face one direction. Lots may be formed. This lot forming unit 3 is provided with a substrate transport mechanism 15 for transporting a plurality of substrates 8. Additionally, the substrate transport mechanism 15 can change the posture of the substrate 8 from the horizontal posture to the vertical posture and from the vertical posture to the horizontal posture during the transportation of the substrate 8.

Then, the lot forming unit 3 transfers the substrate 8 from the carrier 9 placed on the carrier placing table 14 to the lot placing unit 4 using the substrate transport mechanism 15, and forms a lot. The substrate 8 is placed in the lot placement unit 4. Additionally, the lot forming unit 3 transfers the lot placed on the lot placing unit 4 to the carrier 9 placed on the carrier placing table 14 using the substrate transport mechanism 15 . Additionally, the substrate transport mechanism 15 is a substrate support part for supporting a plurality of substrates 8, and is a pre-processing substrate support part that supports the substrates 8 before processing (before transport to the lot transport unit 5). There are two types of post-processed substrate support parts that support the substrate 8 after processing (after being transported to the lot transport unit 5). This prevents particles, etc. attached to the substrate 8 before processing from transferring to the substrate 8 after processing.

The lot placement unit 4 temporarily places (stands by) the lot being transported between the lot forming unit 3 and the lot processing unit 6 by the lot transfer unit 5 on the lot placement table 16 . This lot placement unit 4 includes a loading-side lot placement table 17 for placing lots before processing (before being transferred to the lot transfer unit 5) and after processing (after being transferred to the lot transfer unit 5). ) A lot placement table 18 on the carry-out side is provided to place lots. On the loading-in side lot placement table 17 and the unloading-side lot placement table 18, a plurality of substrates 8 for one lot are arranged back and forth in a vertical position.

Then, in the lot placement unit 4, the lot formed in the lot forming unit 3 is placed on the loading side lot placement table 17, and the lot is carried into the lot processing unit 6 via the lot transfer unit 5. do. Furthermore, in the lot placement unit 4, the lot transported from the lot processing unit 6 via the lot transfer unit 5 is placed on the lot placement table 18 on the delivery side, and the lot is transferred to the lot forming unit 3. do.

The lot transport unit 5 transports lots between the lot placement unit 4 and the lot processing unit 6 or within the lot processing unit 6. This lot transport unit 5 is provided with a lot transport mechanism 19 for transporting lots. The lot transfer mechanism 19 includes a lot placement unit 4, a rail 20 arranged along the lot processing unit 6, and a moving body that moves along the rail 20 while holding a plurality of substrates 8 ( 21). The mobile body 21 is provided with a substrate holding body 22 capable of advancing and retreating, which holds a plurality of substrates 8 arranged front and rear in a vertical position.

Then, the lot transfer unit 5 receives the lot placed on the loading-side lot placement table 17 to the substrate holding body 22 of the lot transfer mechanism 19, and transfers the lot to the lot processing unit 6. . Additionally, the lot transfer unit 5 receives the lot processed in the lot processing unit 6 to the substrate holding body 22 of the lot transfer mechanism 19 and transfers the lot to the lot placement table 18 on the delivery side. . Additionally, the lot transport unit 5 uses the lot transport mechanism 19 to transport lots within the lot processing unit 6.

The lot processing unit 6 performs processing such as etching, cleaning, or drying on a plurality of substrates 8 arranged back and forth in a vertical position as one lot. This lot processing unit 6 includes a drying processing device 23 for drying the substrate 8, a substrate holder cleaning device 24 for cleaning the substrate 8, and a substrate 8. A cleaning processing device 25 for performing a cleaning process and two etching processing devices 26 according to the present invention for performing an etching process on the substrate 8 are provided in an array.

The drying processing apparatus 23 includes a processing tank 27 and a substrate lifting mechanism 28 provided in the processing tank 27 to be capable of being raised and lowered. A processing gas for drying (IPA (isopropyl alcohol), etc.) is supplied to the treatment tank 27. In the substrate lifting mechanism 28, one lot of a plurality of substrates 8 is held arranged back and forth in a vertical position. The drying processing device 23 receives the lot from the substrate holding body 22 of the lot transfer mechanism 19 to the substrate lifting mechanism 28 and elevates the lot with the substrate lifting mechanism 28, thereby forming a processing tank ( The substrate 8 is dried using the drying process gas supplied to 27). Additionally, the drying processing device 23 transfers the lot from the substrate lifting mechanism 28 to the substrate holding body 22 of the lot transport mechanism 19.

The substrate holding body cleaning processing device 24 has a processing tank 29, and is capable of supplying a cleaning processing liquid and dry gas to the processing tank 29, and the substrate holding body of the lot transfer mechanism 19. After supplying the cleaning treatment liquid to 22, the substrate holding body 22 is cleaned by supplying dry gas.

The cleaning processing device 25 has a processing tank 30 for cleaning and a processing tank 31 for rinsing, and substrate lifting mechanisms 32 and 33 are provided in each processing tank 30 and 31 to be able to raise and lower the substrate. there is. A cleaning treatment liquid (SC-1, etc.) is stored in the cleaning treatment tank 30. A rinsing treatment liquid (pure water, etc.) is stored in the rinsing treatment tank 31.

The etching processing apparatus 26 has a processing tank 34 for etching and a processing tank 35 for rinsing, and substrate elevating mechanisms 36 and 37 are provided in each processing tank 34 and 35 to be capable of being raised and lowered. . An etching treatment liquid (phosphoric acid aqueous solution) is stored in the etching treatment tank 34 . A rinsing treatment liquid (pure water, etc.) is stored in the rinsing treatment tank 35.

These cleaning processing devices 25 and etching processing devices 26 have the same configuration. Explaining the etching processing device 26, the substrate lifting mechanism 36 holds one lot of multiple substrates 8 arranged back and forth in a vertical position. In the etching processing device 26, the lot is received from the substrate holding body 22 of the lot transport mechanism 19 to the substrate lifting mechanism 36, and the lot is processed by raising and lowering the lot with the substrate lifting mechanism 36. The substrate 8 is subjected to an etching treatment by immersing the bath 34 in the etching treatment liquid. After this, the etching processing device 26 transfers the lot from the substrate lifting mechanism 36 to the substrate holding body 22 of the lot transport mechanism 19. In addition, the lot is received from the substrate holding body 22 of the lot transport mechanism 19 by the substrate lifting mechanism 37, and the lot is raised and lowered by the substrate lifting mechanism 37, so that the lot is used for rinsing in the treatment tank 35. The substrate 8 is rinsed by immersing it in the treatment liquid. Afterwards, the lot is transferred from the substrate lifting mechanism 37 to the substrate holding body 22 of the lot transport mechanism 19.

The control unit 7 controls each part of the substrate liquid processing system 1A (carrier loading/unloading unit 2, lot forming unit 3, lot placement unit 4, lot transfer unit 5, lot processing unit 6). ) controls the operation of This control unit 7 is made of, for example, a computer and is provided with a computer-readable storage medium 138. The storage medium 138 stores a program that controls various processes performed in the substrate liquid processing system 1A. The control unit 7 controls the operation of the substrate liquid processing system 1A by reading and executing the program stored in the storage medium 138. Additionally, the program may be stored in the computer-readable storage medium 138 or may be installed into the storage medium 138 of the control unit 7 from another storage medium. Examples of the computer-readable storage medium 138 include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

[Substrate liquid processing device]

Next, with reference to FIG. 2 , the substrate liquid processing device A1 included in the substrate liquid processing system 1A will be described in detail. As shown in FIG. 2 , the substrate liquid processing device A1 is configured to include an etching processing device 26 .

The etching treatment device 26 performs a liquid treatment (etching process) on the substrate 8 using an aqueous solution of a chemical (phosphoric acid) of a predetermined concentration (for example, an 88.3% by weight aqueous phosphoric acid solution) as an etching treatment liquid. In addition, the above-mentioned '88.3% by weight' represents an example of the concentration of the phosphoric acid aqueous solution when the concentration of the processing liquid is adjusted to a predetermined setting concentration (in the case of 'concentration constant mode', detailed later), and the concentration of the processing liquid When is changed (in the case of 'concentration change mode', details will be described later), the concentration of the phosphoric acid aqueous solution is not constant and is changed appropriately. As shown in FIG. 2 , the etching processing device 26 includes a processing liquid storage unit 38 (reservoir), a processing liquid supply unit 39 (concentration increase promotion unit), and a processing liquid circulation unit 40; It is provided with a treatment liquid discharge part 41 (discharge part).

The processing liquid storage unit 38 stores the processing liquid and processes the substrate 8. The treatment liquid storage unit 38 forms an open-top outer tank 42 around the upper part of the open-top treatment tank 34, and stores the treatment liquid in the treatment tank 34 and the outer tank 42. The processing tank 34 stores a processing liquid for treating the substrate 8 by immersing it using the substrate lifting mechanism 36 . The outer tank 42 stores the treatment liquid that overflowed from the treatment tank 34. The treatment liquid stored in the outer tank 42 is supplied to the treatment tank 34 by the treatment liquid circulation unit 40. A liquid level sensor 80 is provided in the outer tank 42. The liquid level sensor 80 is a sensor that detects the liquid level in the outer tank 42 of the processing liquid reservoir 38. As the liquid level sensor 80, various sensors capable of detecting the liquid level can be used. Below, the liquid level sensor 80 is explained as a sensor that detects the liquid level height from the voltage value. The liquid level sensor 80 outputs information indicating the detected liquid level to the control unit 7.

The processing liquid supply unit 39 supplies the processing liquid to the processing liquid storage unit 38 . The treatment liquid supply unit 39 includes an aqueous solution supply unit 43 and a water supply unit 44. The aqueous solution supply unit 43 has an aqueous solution source 45, a flow rate regulator 46, a water source 61, and a valve 62.

The aqueous solution supply source 45 supplies an aqueous phosphoric acid solution with a higher concentration than the aqueous phosphoric acid solution stored in the processing liquid storage unit 38 when the concentration of the processing liquid is adjusted to a predetermined set concentration (in the case of 'constant concentration mode'). The aqueous solution supply source 45 supplies, for example, an 88.3% by weight aqueous phosphoric acid solution at 25°C. The phosphoric acid aqueous solution supplied from the aqueous solution supply source 45 is supplied to the treatment liquid storage unit 38 through the flow path 43a.

The flow rate regulator 46 is provided on the downstream side of the aqueous solution supply source 45 in the flow path 43a. The flow rate regulator 46 is connected to the control section 7, and is controlled to open/close and flow rate by the control section 7. The water supply source 61 supplies water (pure water) at a predetermined temperature (25°C) to the flow path 43a. Water supplied from the water supply source 61 is supplied to the flow path 43a (specifically, the portion between the aqueous solution source 45 and the flow rate regulator 46 in the flow path 43a) through the flow path 60a. .

The valve 62 is provided on the downstream side of the water supply source 61 in the flow path 60a. The valve 62 is connected to the control unit 7 and is controlled to open and close by the control unit 7. When the valve 62 is opened by the control unit 7 (normal state), water supplied from the water supply source 61 through the flow path 60a flows into the flow path 43a, so that the aqueous solution source 45 When the concentration of the phosphoric acid aqueous solution supplied from the phosphoric acid solution is lowered and the concentration of the processing liquid is adjusted to the set concentration (in the case of 'constant concentration mode'), the processing liquid storage unit 38 stores A phosphoric acid aqueous solution of lower concentration than the phosphoric acid aqueous solution (for example, an 85% by weight phosphoric acid aqueous solution) is supplied.

On the other hand, when the valve 62 is closed by the control unit 7 (concentration increased state), the water supplied from the water supply source 61 does not flow into the flow path 43a, and therefore is supplied from the aqueous solution supply source 45. The high-concentration phosphoric acid aqueous solution is supplied as is to the treatment liquid reservoir 38. In this way, the aqueous solution supply unit 43 of the processing liquid supply unit 39 supplies an aqueous phosphoric acid solution having a higher concentration than the aqueous phosphoric acid solution stored in the processing liquid storage unit 38 to the processing liquid storage unit 38. It promotes the increase in concentration of the treatment liquid in (38) (detailed later).

The water supply unit 44 supplies water (pure water) to the treatment liquid storage unit 38. The water supply unit 44 connects a water supply source 47 for supplying pure water at a predetermined temperature (25°C) to the outer tank 42 of the treatment liquid storage unit 38 via a flow rate regulator 48. The flow rate regulator 48 is connected to the control unit 7, and is controlled to open/close and control the flow rate by the control unit 7.

The treatment liquid circulation unit 40 sends the treatment liquid in the outer tank 42 to the treatment tank 34. The treatment liquid circulation unit 40 includes a circulation passage 49, a pump 50, a heater 51, a filter 52, and a concentration meter 53. The circulation flow path 49 is a flow path extending from the bottom of the outer tank 42 of the treatment liquid storage portion 38 to the bottom of the treatment tank 34. In the circulation flow path 49, a pump 50, a heater 51, a filter 52, and a concentration meter 53 are provided in order from the upstream side (outer tank 42 side) to the downstream side (treatment tank 34 side). . The pump 50 and heater 51 are connected to the control unit 7 and are controlled to drive by the control unit 7. The pump 50 pumps the treatment liquid from the upstream side to the downstream side. The heater 51 heats the processing liquid to a set temperature (for example, 165°C). The filter 52 removes particles mixed in the treatment liquid. The density meter 53 measures the phosphoric acid concentration in the treatment liquid in the circulation passage 49. The densitometer 53 outputs the measured phosphoric acid concentration to the control unit 7.

The treatment liquid discharge unit 41 discharges the treatment liquid from the treatment tank 34. The processing liquid discharge portion 41 has, for example, a discharge passage 41A and a valve 41B. The drainage flow path 41A draws out the treated liquid in the treatment tank 34. One end of the drain flow path 41A is connected to the bottom of the treatment tank 34, and the other end of the drain flow path 41A is connected to a drain pipe (not shown) of the substrate liquid processing system 1A. The valve 41B is provided in the drainage passage 41A. The valve 41B is connected to the control unit 7 and is controlled to open and close by the control unit 7.

Next, with reference to FIG. 3, the control unit 7 that controls the etching processing device 26 will be described in detail. The control unit 7 provides first control in the concentration constant mode (concentration constant period) in which the concentration of the processing liquid in the processing liquid storage unit 38 is adjusted to a predetermined set concentration, and the processing liquid in the processing liquid storage unit 38. The second control is executed in the concentration change mode (concentration change period) in which the concentration is changed. In addition, both the constant concentration mode and the concentration change mode described below are modes of the substrate processing period in which the substrate 8 to be processed is immersed in the processing liquid in the processing liquid storage portion 38 and processed by the processing liquid. That is, the control unit 7 is configured to be able to execute the first control and the second control during the substrate processing period. Additionally, during the interval period when the substrate 8 is not immersed in the processing liquid in the processing liquid storage unit 38, the control unit 7 adjusts the concentration of the processing liquid in the processing liquid storage unit 38 to the constant concentration mode. Adjust to the set concentration.

In the second control, the control unit 7 compares the set concentration before the concentration change with the set concentration after the concentration change, and when the set concentration after the concentration change is lower than the set concentration before the concentration change, processing starts to discharge the processing liquid. The liquid discharge unit 41 (specifically, the valve 41B) is controlled.

Specifically, in the second control, the control unit 7 operates when the set concentration after the concentration change is lower than the set concentration before the concentration change and when the liquid level detected by the liquid level sensor 80 is higher than the set liquid level reference value, The processing liquid discharge unit 41 (specifically, the valve 41B) is controlled to start discharging the processing liquid.

Additionally, in the second control, the control unit 7 compares the set concentration before the concentration change with the set concentration after the concentration change, and when the set concentration after the concentration change is higher than the set concentration before the concentration change, the processing liquid storage unit 38 ) The aqueous solution supply section 43 of the processing liquid supply section 39 is controlled to promote an increase in the concentration of the processing liquid.

Figure 3 is a block diagram disclosing the functional configuration of the control unit 7. As shown in FIG. 3, the control unit 7 is a functional configuration (function module) and includes a recipe storage unit 71, an aqueous solution adjustment unit 72, a water adjustment unit 73, and a drainage control unit 74. do.

The recipe storage unit 71 functions to store preset recipes (work instructions). The recipe storage unit 71 stores, for example, a recipe set by the user in advance. The control unit 7 performs processing (control) determined according to the recipe. Figure 4 is a table showing an example of a recipe (RP). As shown in FIG. 4, at least a step number, a processing mode, and a set concentration are set in the recipe RP. A step number is information that uniquely identifies a step in processing that is performed continuously. Step numbers that are consecutive to each other (for example, '001' and '002') indicate consecutive steps. Additionally, the smaller the step number (degree), the step is executed first. In the example shown in FIG. 4, processing is performed in the following order: the step number '001', the step '002', the step '003', and the step '004'.

The processing mode is information indicating a processing mode related to adjusting the concentration of the processing liquid in the processing liquid storage unit 38. As processing modes during the substrate processing period, 'concentration constant mode' and 'concentration change mode' can be set. The constant concentration mode is a mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is adjusted to a predetermined set concentration. The concentration change mode is a mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is changed (changeable). As shown in FIG. 4, in the recipe (RP), steps indicated by step number '001' are set as the constant concentration mode, and steps indicated by step numbers '002', '003', and '004' are set as the concentration change mode. Multiple steps are set. The set concentration is the target concentration value of the processing liquid in the corresponding step. As shown in Fig. 4, individual set concentrations are set for each of the plurality of steps. The control unit 7 performs various controls by the aqueous solution control unit 72, the water control unit 73, and the drainage control unit 74 so that the concentration in each step is the set concentration.

The aqueous solution control unit 72 controls the aqueous solution supply unit 43 (specifically, the flow rate regulator 46 and the valve 62) so that the phosphoric acid aqueous solution is supplied according to the recipe stored in the recipe storage unit 71. Specifically, the aqueous solution adjusting unit 72 performs first control in the constant concentration mode and second control in the concentration change mode. The aqueous solution adjustment unit 72 refers to the recipe stored in the recipe storage unit 71 and performs first control when the processing mode of the current step is the constant concentration mode, and performs second control when the processing mode of the current step is the concentration change mode.

In the first control (first control by the aqueous solution adjusting unit 72), the aqueous solution adjusting unit 72 controls the phosphoric acid aqueous solution with a lower concentration than the phosphoric acid aqueous solution stored in the processing liquid storage unit 38 (for example, 85% by weight of phosphoric acid). The aqueous solution supply unit 43 is controlled so that the aqueous solution is supplied to the processing liquid storage unit 38. Specifically, the aqueous solution adjusting unit 72 opens the valve 62 of the aqueous solution supply unit 43 so that water supplied from the water supply source 61 flows into the flow path 43a through the flow path 60a. As a result, a phosphoric acid aqueous solution with a lower concentration than the phosphoric acid aqueous solution stored in the processing liquid storage portion 38 (a phosphoric acid aqueous solution whose concentration has been diluted by the water flowing in through the flow path 60a) flows through the flow path 43a. Then, the aqueous solution adjusting unit 72 adjusts the concentration of the processing liquid to the set concentration based on the measured value of the phosphoric acid concentration in the processing liquid obtained from the density meter 53 and the set concentration in the recipe stored in the recipe storage unit 71. Control the flow regulator 46 to get closer. That is, the aqueous solution adjusting unit 72 controls the flow rate regulator 46 so that the phosphoric acid aqueous solution at an appropriate flow rate, where the concentration of the processing liquid approaches the set concentration, is supplied from the flow path 43a to the processing liquid storage unit 38.

In the second control (second control by the aqueous solution adjusting unit 72), when a predetermined condition is met, the aqueous solution adjusting unit 72 controls the concentration higher than the aqueous phosphoric acid solution stored in the processing liquid storage unit 38 in the constant concentration mode. The aqueous solution supply unit 43 is controlled so that a concentrated phosphoric acid aqueous solution (for example, a 93% by weight phosphoric acid aqueous solution) is supplied to the treatment liquid storage unit 38. When the predetermined conditions are not met, the aqueous solution adjusting unit 72 performs, for example, the same control as the above-described first control also in the second control. The aqueous solution adjustment unit 72 first refers to the recipe stored in the recipe storage unit 71 and compares the set concentration of the current step (set concentration after the concentration change) with the set concentration of the one previous step (set concentration before the concentration change). Thus, it is determined whether the set density of the current step is lower than the set density of the one previous step. When the aqueous solution adjusting unit 72 determines that the set concentration of the current step is not lower than the set concentration of the one previous step (the set concentration of the current step is more than the set concentration of the one previous step), the processing liquid is sent from the liquid level sensor 80. The liquid level of the treatment liquid in the outer tank 42 of the reservoir 38 is acquired, and it is determined whether the liquid level is higher than or equal to a predetermined liquid level reference value (lower limit control start value). The liquid level reference value (lower limit control start value) becomes a value higher than the liquid level lower limit value, which is the liquid level at which the temperature adjustment function is damaged when the liquid level becomes lower than that, by a predetermined buffer amount. The liquid level reference value is, for example, the height of the liquid level derived from the voltage value measured by the liquid level sensor 80 before the substrate 8 is accommodated in the processing liquid storage unit 38. It is derived in advance by adding the increase in liquid level according to the number of boards 8.

When the aqueous solution adjustment unit 72 determines that the liquid level is not higher than the liquid level reference value (lower limit control start value) (the liquid level is lower than the liquid level reference value), the phosphoric acid stored in the processing liquid storage unit 38 in the constant concentration mode The aqueous solution supply unit 43 is controlled so that an aqueous phosphoric acid solution with a higher concentration than the aqueous solution (for example, an aqueous phosphoric acid solution of 93% by weight) is supplied to the treatment liquid storage unit 38. That is, the aqueous solution adjusting unit 72 stores the processing liquid in the constant concentration mode when the set conditions of 'the set concentration of the current step is higher than the set concentration of the previous step and the liquid level height is lower than the liquid level reference value' are met. The aqueous solution supply unit 43 is controlled so that an aqueous phosphoric acid solution with a higher concentration than the aqueous phosphoric acid solution stored in the unit 38 is supplied to the treatment liquid storage unit 38 .

Specifically, the aqueous solution adjusting unit 72 closes the valve 62 of the aqueous solution supply unit 43 to prevent water supplied from the water supply source 61 from flowing into the flow path 43a through the flow path 60a. As a result, an aqueous phosphoric acid solution with a higher concentration than the aqueous phosphoric acid solution stored in the processing liquid reservoir 38 flows in the flow path 43a in the constant concentration mode. Then, the aqueous solution adjusting unit 72 controls the flow rate regulator 46 so that a predetermined flow rate of the phosphoric acid aqueous solution is supplied from the flow path 43a to the processing liquid storage unit 38. The aqueous solution adjusting unit 72 continues to supply the high-concentration phosphoric acid aqueous solution to the processing liquid storage unit 38 until the liquid level of the processing liquid obtained from the liquid level sensor 80 becomes higher than the liquid level reference value (lower limit control start value). . When the liquid level of the processing liquid obtained from the liquid level sensor 80 becomes higher than the liquid level reference value (lower limit control start value), the aqueous solution adjusting unit 72 adjusts the phosphoric acid concentration in the processing liquid obtained from the densitometer 53 to the set concentration of the current step. It is determined whether has been reached, and if it has been reached, the second control is terminated. After the phosphoric acid concentration in the processing liquid reaches the set concentration, the aqueous solution adjusting unit 72 performs, for example, the first control described above.

The water regulator 73 controls the water supply unit 44 (specifically, the flow rate regulator 48) so that water is supplied according to the recipe stored in the recipe memory unit 71. Specifically, the water adjustment unit 73 performs first control in the constant concentration mode and second control in the concentration change mode. The water adjustment unit 73 refers to the recipe stored in the recipe storage unit 71 and performs first control when the processing mode of the current step is the constant concentration mode, and performs second control when the processing mode of the current step is the concentration change mode.

In the first control (first control by the water adjustment unit 73), the water adjustment unit 73 determines the measured value of the phosphoric acid concentration in the processing liquid obtained from the concentration meter 53 and the recipe stored in the recipe storage unit 71. Based on the set concentration, the flow rate regulator 48 is controlled so that the concentration of the processing liquid approaches the set concentration. That is, the water adjusting unit 73 operates the flow rate regulator 48 so that the concentration of the processing liquid approaches the set concentration (the amount of pure water in the phosphoric acid aqueous solution becomes constant) and water at an appropriate flow rate is supplied to the processing liquid storage unit 38. Control.

In the second control (second control by the water adjustment unit 73), the water adjustment unit 73 supplies water to the processing liquid storage unit 38 according to the set concentration in the recipe stored in the recipe storage unit 71. The water supply unit 44 is controlled so that the water quantity changes. The water adjustment unit 73 refers to the recipe stored in the recipe storage unit 71 and compares the set concentration of the current step (set concentration after the concentration change) with the set concentration of the one previous step (set concentration before the concentration change). When the water adjusting unit 73 determines that the set concentration of the current step is higher than the set concentration of the one previous step, it controls the flow rate regulator 48 to decrease the water supply amount. If the set concentration of the current step is lower than the set concentration of the previous step, the water adjusting unit 73 controls the flow rate regulator 48 to increase the water supply amount. The water adjustment unit 73 determines whether the phosphoric acid concentration in the processing liquid obtained from the concentration meter 53 has reached the set concentration of the current step, and if so, ends the second control. After the phosphoric acid concentration in the processing liquid reaches the set concentration, the water adjustment unit 73 performs, for example, the first control described above.

The discharge control unit 74 controls the treatment liquid discharge unit 41 (specifically, the valve 41B) so that the treatment liquid is discharged from the treatment tank 34 according to the recipe stored in the recipe storage unit 71. . Specifically, the drainage control unit 74 performs first control in the constant concentration mode and second control in the concentration change mode. The drainage control unit 74 refers to the recipe stored in the recipe storage unit 71 and performs first control when the processing mode of the current step is the constant concentration mode, and performs second control when the processing mode of the current step is the concentration change mode.

In the first control (first control by the drainage control unit 74), the drainage control unit 74 closes the valve 41B to prevent the treatment liquid from being discharged from the treatment tank 34, for example. Additionally, the drainage control unit 74 may control the valve 41B to be slightly opened in the first control so that a small amount of liquid (a small amount compared to the second control) is discharged.

In the second control (second control by the drainage control unit 74), the drainage control unit 74 opens the valve 41B to start discharging the treatment liquid from the treatment tank 34 when a predetermined condition is met. Open. In addition, 'opening the valve 41B to start discharging the treatment liquid' refers not only to the case of opening the valve 41B in a completely closed state, but also to the case of wide opening the valve 41B in a slightly open state (during the first control and (Increasing the drainage amount by comparison) is also included. If the specified conditions are not met, the drainage control unit 74 performs the same control as the first control described above in the second control, for example.

The drainage control unit 74 first refers to the recipe stored in the recipe storage unit 71 and compares the set concentration of the current step (set concentration after the concentration change) with the set concentration of the one previous step (set concentration before the concentration change). Thus, it is determined whether the set density of the current step is lower than the set density of the one previous step. When the drainage control unit 74 determines that the set concentration of the current step is lower than the set concentration of the previous step, the liquid level sensor 80 detects the liquid level of the processing liquid in the outer tank 42 of the processing liquid storage unit 38. The height is acquired, and it is determined whether the liquid level height is higher than the specified liquid level reference value (upper limit control start value). The liquid level reference value (upper limit control start value) becomes a value lower than the liquid level upper limit value by a predetermined buffer amount, which is the liquid level at which the phosphoric acid aqueous solution may overflow from the processing liquid storage portion 38 when the liquid level becomes higher than that level.

When the discharge control unit 74 determines that the liquid level is higher than the liquid level reference value (upper limit control start value), it controls the treatment liquid discharge unit 41 to start discharging the treatment liquid. In other words, the discharge control unit 74 processes to start discharging the treatment liquid when the set conditions of 'the set concentration of the current step is lower than the set concentration of the previous step and the liquid level is higher than the liquid level reference value' are met. Controls the liquid discharge unit (41).

Specifically, the discharge control unit 74 opens the valve 41B so that discharge of the treatment liquid from the treatment tank 34 begins. Accordingly, in the case of lowering the concentration, the amount of water supplied to the processing liquid storage unit 38 increases under the control of the water adjustment unit 73, and the liquid level in the processing liquid storage unit 38 rises. Thus, further rise of the liquid level is suppressed. The discharge control unit 74 continues discharging the treatment liquid from the treatment tank 34 until the liquid level of the treatment liquid obtained from the liquid level sensor 80 becomes below the liquid level reference value (upper limit control start value). When the liquid level of the processing liquid obtained from the liquid level sensor 80 becomes below the liquid level reference value (upper limit control start value), the drainage control unit 74 adjusts the phosphoric acid concentration in the processing liquid acquired from the density meter 53 to the set concentration of the current step. It is determined whether has been reached, and if it has been reached, the second control is terminated. After the phosphoric acid concentration in the treatment liquid reaches the set concentration, the drainage control unit 74 performs, for example, the first control described above.

[Substrate liquid processing method]

Next, an example of a substrate liquid processing method will be described with reference to the time chart in FIG. 5 and the flow chart in FIG. 6. First, with reference to the time chart in FIG. 5, processing images of a plurality of consecutive steps will be described. In Figure 5, processing according to time series for a plurality of consecutive steps (a plurality of steps respectively indicated by step numbers '001', '002', '003', and '004') is shown. Each step shown in FIG. 5 corresponds to each step of the recipe RP shown in FIG. 4 , and the substrate 8 to be processed is immersed in the processing liquid in the processing liquid storage portion 38 and processed by the processing liquid. This is a step in the substrate processing period. Only the steps indicated by step number '001' are in constant concentration mode, and the steps indicated by step numbers '002', '003', and '004' are in concentration change mode. In addition, the set concentration of the steps indicated by step numbers '001' and '003' is '88.5% by weight', and the set concentration of the steps indicated by step numbers '002' and '004' is '86% by weight'. In addition, hereinafter, the steps of step numbers '001' to '004' are indicated as steps (001) to (004), respectively.

As shown in Fig. 5, step 001 starts at time t0. In step 001, which is the constant concentration mode, the control unit 7 performs first control to adjust the concentration of the processing liquid in the processing liquid storage unit 38 to be constant (88.5% by weight). Next, at time t1, step 001 ends and step 002 begins. Step (002) is a concentration change mode and the set concentration is 86% by weight. In this way, when the set concentration of step 002, which is the current step, is lower than the set concentration of step 001, which is the previous step, the flow rate regulator 48 is controlled by the control unit 7 to increase the amount of water supplied. Therefore, in step 002, the liquid level in the processing liquid reservoir 38 gradually increases with the passage of time.

Then, when the liquid level becomes higher than the liquid level reference value (upper limit control start value) at time t2, the valve 41B is opened by the control unit 7 to start discharging the treatment liquid (drainage control). The drainage control is continuously performed until the liquid level level becomes below the liquid level reference value (upper limit control start value) at time t3. Even when drainage control is once completed, the water supply amount is set to be high until the set concentration is reached, so the liquid level is again higher than the liquid level reference value (upper limit control start value) at time t4. In this case, drainage control is performed again until the liquid level becomes below the liquid level reference value (upper limit control start value).

Next, at time t5, the liquid level becomes below the liquid level reference value (upper limit control start value), step 002 ends, and step 003 starts. Step (003) is a concentration change mode and the set concentration is 88.5% by weight. In this way, when the set concentration of step 003, which is the current step, is higher than the set concentration of step 002, which is the previous step, the flow rate regulator 48 is controlled by the control unit 7 to reduce the amount of water supplied. , In step 003, the liquid level in the processing liquid reservoir 38 gradually decreases with the passage of time.

Then, when the liquid level becomes lower than the liquid level reference value (lower limit control start value) at time t6, the valve 62 of the aqueous solution supply unit 43 is closed by the control unit 7, and the high concentration phosphoric acid aqueous solution is supplied to the treatment liquid reservoir. (38) (high concentration phosphoric acid supply). The high-concentration phosphoric acid supply is continuously performed until the liquid level becomes higher than the liquid level reference value (lower limit control start value) at time t7.

Next, at time t8, step 003 ends and step 004 begins. Step (004) is a concentration change mode and the set concentration is 86% by weight. In this way, when the set concentration of step 004, which is the current step, is lower than the set concentration of step 003, which is the previous step, the flow rate regulator 48 is controlled by the control unit 7 to increase the amount of water supplied. , In step 004, the liquid level in the processing liquid reservoir 38 gradually increases with the passage of time. Then, when the liquid level becomes higher than the liquid level reference value (upper limit control start value) at time t9, the control unit 7 opens the valve 41B to start discharging the treatment liquid (drainage control). The drainage control is continuously performed until the liquid level level becomes below the liquid level reference value (upper limit control start value) at time t10. Even if drainage control is once completed, the amount of water supplied increases until the set concentration is reached, so at time t11, the liquid level is again higher than the liquid level reference value (upper limit control start value). In this case, drainage control is performed again until the liquid level becomes below the liquid level reference value (upper limit control start value). At time t12, the liquid level becomes below the liquid level reference value (upper limit control start value), and step 004 ends. Additionally, during a period (interval period) during which each step of the substrate processing period is completed and the substrate 8 is not immersed in the processing liquid in the processing liquid storage unit 38, processing is performed by the control unit 7. The concentration of the processing liquid in the liquid reservoir 38 is adjusted to the same concentration as the set concentration in the constant concentration mode described above. Therefore, if there is a change in the set concentration in the constant concentration mode, the concentration of the processing liquid in the constant concentration mode before entering the interval period and the concentration of the processing liquid in the constant concentration mode in the next substrate processing period will be different from each other. .

Next, with reference to the flowchart in FIG. 6, details of the processing of the control unit 7 in one step will be described. As shown in FIG. 6, first, the control unit 7 (specifically, the aqueous solution control unit 72, the water control unit 73, and the drainage control unit 74) controls the recipe stored in the recipe storage unit 71 (e.g. The recipe (RP) shown in FIG. 4 is acquired (step S1), and the current step is specified (step S2).

Next, the control unit 7 determines whether the specific current step is in the concentration change mode (step S3). In step S3, if the current step is not in the concentration change mode, the control unit 7 performs first control in the concentration constant mode to constantly adjust the concentration of the processing liquid until the end timing of the current step (step (S10)).

On the other hand, in step S3, when the current step is in the concentration change mode, the control unit 7 performs a second control to enable the concentration change of the processing liquid. Specifically, the control unit 7 compares the set concentration of the current step (set concentration after the concentration change) with the set concentration of the step one previous step (set concentration before the concentration change), and sets the current step concentration higher than the set concentration of the step one previous step. Determine whether the concentration is low (step S4).

If it is determined in step S4 that the set concentration of the current step is lower than the set concentration of the previous step, the control unit 7 (specifically, the water adjustment unit 73) determines the amount of water supplied to the processing liquid storage unit 38. The flow rate regulator 48 is controlled to increase, thereby thinning the concentration of the processing liquid in the processing liquid reservoir 38 (step S5). Additionally, the control unit 7 (specifically, the drainage control unit 74) acquires the liquid level of the processing liquid in the outer tank 42 of the processing liquid storage unit 38 from the liquid level sensor 80 (step S6 )).

Next, the control unit 7 (specifically, the drainage control unit 74) determines whether the acquired liquid level height is below the predetermined liquid level reference value (upper limit control start value) (step S7). If it is determined in step S7 that the liquid level is not lower than the set liquid level reference value (upper limit control start value) (the liquid level is higher than the set liquid level reference value (upper limit control start value)), the control unit 7 (specifically, the drain The control unit 74 starts drainage control (step S8). Specifically, the control unit 7 opens the valve 41B to start discharging the treatment liquid from the treatment tank 34. After performing drainage control for the time determined in step S8, the control unit 7 executes the process in step S7 again.

On the other hand, when it is determined in step S7 that the liquid level is below the predetermined liquid level reference value (upper limit control start value), the above-described drainage control is not performed, and the control unit 7 determines that the phosphoric acid concentration in the treatment liquid obtained from the concentration meter 53 is It is determined whether the set concentration of the current step has been reached (step S9). If it is determined in step S9 that the phosphoric acid concentration in the processing liquid has not reached the concentration set in the current step, the processing in step S7 is performed again. On the other hand, when it is determined in step S9 that the phosphoric acid concentration in the processing liquid has reached the set concentration of the current step, the control unit 7 sets the concentration constant to constantly adjust the concentration of the processing liquid until the end timing of the current step. The first control of the mode is performed (step S10).

If it is determined in step S4 that the set concentration of the current step is not lower than the set concentration of the previous step, the control unit 7 (specifically, the water adjusting unit 73) determines the amount of water supplied to the processing liquid storage unit 38. The flow rate regulator 48 is controlled to reduce this, thereby increasing the concentration of the processing liquid in the processing liquid storage unit 38 (step S13). In this case, the control unit 7 (specifically, the discharge control unit 74) may open the valve 41B to start discharging the treatment liquid from the treatment tank 34. The control unit 7 (specifically, the aqueous solution adjustment unit 72) acquires the liquid level of the processing liquid in the outer tank 42 of the processing liquid storage unit 38 from the liquid level sensor 80 (step S14). .

Next, the control unit 7 (specifically, the aqueous solution adjustment unit 72) determines whether the acquired liquid level height is equal to or higher than the predetermined liquid level reference value (lower limit control start value) (step S15). If it is determined in step S15 that the liquid level is not higher than the set liquid level reference value (lower limit control start value) (the liquid level is lower than the set liquid level reference value (lower limit control start value)), the control unit 7 (specifically, the aqueous solution The adjusting unit 72 starts supplying high-concentration phosphoric acid (step S16). Specifically, the control unit 7 closes the valve 62 of the aqueous solution supply unit 43 so that a high-concentration phosphoric acid aqueous solution is supplied to the treatment liquid storage unit 38. After supplying high-concentration phosphoric acid for a fixed time in step S16, the control unit 7 performs the process in step S15 again.

On the other hand, when it is determined in step S15 that the liquid level is higher than the predetermined liquid level reference value (lower limit control start value), the above-described high-concentration phosphoric acid supply is not performed, and the control unit 7 determines the phosphoric acid concentration in the processing liquid obtained from the density meter 53. It is determined whether has reached the set concentration of the current step (step S17). If it is determined in step S17 that the phosphoric acid concentration in the processing liquid has not reached the concentration set in the current step, the processing in step S15 is performed again. On the other hand, when it is determined in step S17 that the phosphoric acid concentration in the processing liquid has reached the set concentration of the current step, the control unit 7 sets the concentration constant to constantly adjust the concentration of the processing liquid until the end timing of the current step. The first control of the mode is performed (step S10).

When step S10 is completed (the current step is completed), the control unit 7 refers to the recipe and determines whether there is a next step (step S11). If it is determined in step S11 that there is a next step, the control unit 7 specifies the next step as the new current step (step S12) and executes the processing from step S3 again. On the other hand, when it is determined in step S11 that there is no next step (all steps in the recipe have been completed), the series of processes ends.

[Action effect]

In a substrate liquid processing apparatus, when the phosphoric acid concentration of the phosphoric acid aqueous solution, which is a processing liquid, is changed, the amount of water in the processing liquid storage portion changes, causing the liquid level to rise or fall. For example, when the phosphoric acid concentration of the phosphoric acid aqueous solution, which is the processing liquid, is lowered, the amount of water supplied to the processing liquid storage portion increases, so the liquid level in the processing liquid storage portion rises, and the phosphoric acid aqueous solution flows from the processing liquid storage portion. There is a risk of this overflowing. As a result, there is a risk that changing the concentration of the processing liquid (specifically, changing the concentration when lowering the concentration) cannot be appropriately performed.

In this regard, the substrate liquid processing device A1 includes a processing liquid storage unit 38 for storing the processing liquid, a processing liquid discharge unit 41 for discharging the processing liquid from the processing liquid storage unit 38, and discharging the processing liquid. It is provided with a control unit 7 that controls the unit 41, wherein the control unit 7 includes first control in a constant concentration mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is adjusted to a predetermined set concentration; A second control in a concentration change mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is changed is executed, and in the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and the concentration is changed. When the set concentration after the concentration change is lower than the set concentration before the change, the processing liquid discharge unit 41 is controlled to start discharging the processing liquid.

According to this substrate liquid processing apparatus A1, in the second control of the concentration change mode, when the set concentration after the concentration change becomes lower than the set concentration before the concentration change, discharge of the aqueous phosphoric acid solution, which is a processing liquid, is started. For this reason, even when the amount of water supplied to the processing liquid storage unit 38 is increased when the phosphoric acid concentration is lowered, the phosphoric acid aqueous solution is discharged from the processing liquid storage unit 38, causing the liquid level in the processing liquid storage unit 38 to rise. It is possible to prevent the aqueous phosphoric acid solution from overflowing from the processing liquid reservoir 38. From the above, according to the substrate liquid processing apparatus A1 according to the present embodiment, it is possible to appropriately change the concentration of the processing liquid (specifically, change the concentration when lowering the concentration).

The substrate liquid processing device A1 further includes a liquid level sensor 80 that detects the height of the liquid level in the processing liquid storage unit 38, and the control unit 7 controls, in the second control, the set concentration before the concentration change. When the set concentration after the concentration change is lower and the liquid level detected by the liquid level sensor 80 is higher than the set liquid level reference value, the processing liquid discharge unit 41 is controlled to start discharging the processing liquid. As a result, discharge of the treatment liquid can be started based on the fact that the liquid level has actually increased due to the supply of water to lower the concentration. As a result, discharge of the processing liquid can be started at an appropriate timing, and overflow of the processing liquid can be prevented more reliably.

The density change mode may include a plurality of steps capable of individually setting the set density. Thereby, since the set density is set for each of the plurality of steps in the density change mode, the density can be set more delicately according to each process in the density change mode.

Here, in the substrate liquid processing apparatus, when the phosphoric acid concentration of the phosphoric acid aqueous solution as the processing liquid is increased, the amount of water supplied to the processing liquid storage portion is reduced, and the water is evaporated. This process of evaporating water to increase concentration takes time. As a result, there is a risk that changing the concentration of the processing liquid (specifically, changing the concentration when increasing the concentration) cannot be properly performed.

In this regard, the substrate liquid processing apparatus A1 is provided with a processing liquid supply unit 39 as a concentration increase promoting unit that promotes an increase in the concentration of the processing liquid in the processing liquid storage unit 38, and the control unit 7 A first control in a constant concentration mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is adjusted to a predetermined set concentration, and a concentration change mode in which the concentration of the processing liquid in the processing liquid storage unit 38 is changed. Executing the second control, in the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and if the set concentration after the concentration change is higher than the set concentration before the concentration change, the processing liquid storage unit ( The processing liquid supply unit 39 is controlled to promote an increase in the concentration of the processing liquid in step 38).

According to the substrate liquid processing apparatus A1, in the second control of the concentration change mode, when the set concentration after the concentration change becomes higher than the set concentration before the concentration change, the processing liquid supply unit 39, which is a concentration increase accelerating unit, supplies the processing liquid. The increase in concentration is promoted. As a result, the time required to increase the concentration can be shortened compared to the case of simply evaporating water. From the above, according to the substrate liquid processing apparatus A1 according to the present embodiment, it is possible to appropriately change the concentration of the processing liquid (specifically, change the concentration when increasing the concentration).

Specifically, the processing liquid supply unit 39, which is a concentration increase promoting unit, supplies the processing liquid with a higher concentration than the processing liquid stored in the processing liquid storage unit 38 to the processing liquid storage unit 38. ) promotes an increase in the concentration of the treatment liquid. When the concentration is increased, the water evaporates and the liquid level in the processing liquid reservoir 38 decreases, which may deteriorate the temperature control function (circulating temperature control) of the substrate liquid processing device. In this regard, by supplying a high-concentration processing liquid to the processing liquid storage unit 38, the concentration can be appropriately increased while a drop in the liquid level (i.e., a decrease in the temperature regulation function) can be suppressed.

The control unit 7 executes the first control and the second control during a substrate processing period in which the substrate 8 to be processed is immersed in the processing liquid of the processing liquid reservoir 38 and processed by the processing liquid. Additionally, during the interval period when the substrate 8 is not immersed in the processing liquid in the processing liquid storage unit 38, the control unit 7 adjusts the concentration of the processing liquid in the processing liquid storage unit 38 to the constant concentration mode. Adjust to the set concentration. As a result, the concentration of the processing liquid can be appropriately changed in the substrate processing period, and the concentration can be appropriately adjusted to a predetermined set concentration also in the interval period.

Although the embodiments have been described above, the present disclosure is not limited to the above embodiments.

For example, the processing liquid supply unit 39 will be described as an example of the concentration increase accelerating unit, and the processing liquid supply unit 39 supplies high concentration processing liquid to increase the concentration of the processing liquid in the processing liquid storage unit 38. Although an example of accelerating the increase has been described, the configuration of the concentration increase accelerating portion is not limited to this. In a general etching processing apparatus, the substrate is immersed in a processing liquid in a processing tank, and the etching process of the substrate is performed with the upper part of the processing liquid storage portion closed by a cover (bus lead). During the etching process, it is usually necessary to keep the bus lead closed from the viewpoint of stabilizing the temperature. The bus lid is normally closed and is generally opened only when the substrate is immersed in the processing liquid. In this regard, for example, as shown in FIG. 7, even in the interval period between processes that are not in progress, by opening the bus lid 150, the amount of water evaporation can be increased compared to the case where the bus lid 150 is closed. there is. As a result, an increase in the concentration of the processing liquid can be promoted, and the concentration of the processing liquid can be changed more appropriately (specifically, the concentration change when the concentration is increased).

In addition, in the above-described embodiment, as a configuration according to the concentration increase promotion unit, the opening and closing of the valve 62 of the aqueous solution supply unit 43 is switched, so that not only a normal concentration aqueous solution of phosphoric acid but also a high concentration aqueous solution of phosphoric acid can be easily processed. Although the configuration for supplying a high-concentration phosphoric acid aqueous solution has been described, the configuration for supplying a high-concentration phosphoric acid aqueous solution is not limited to this. For example, as shown in FIG. 8, a high-concentration processing liquid storage portion 170 that stores a high-concentration phosphoric acid aqueous solution is provided outside the processing liquid storage portion 38, and this high-concentration processing liquid storage portion 170 A configuration may be adopted in which the processing liquid with increased concentration is supplied to the processing liquid storage unit 38 via the flow path 160. Even in the case of adopting this configuration, a high-concentration phosphoric acid aqueous solution can be appropriately supplied to appropriately increase the concentration while suppressing a drop in the liquid level (i.e., a decrease in the temperature regulation function). Additionally, the high-concentration processing liquid storage unit 170 shown in FIG. 8 may be configured to always maintain a high temperature by heating the supplied aqueous phosphoric acid solution. As a result, a high-temperature and high-concentration phosphoric acid aqueous solution is supplied to the processing liquid storage unit 38, and the heating time of the processing liquid can be shortened. Additionally, in the above-described embodiment, the processing liquid discharge unit 41 is provided in the processing liquid storage unit 38, but the processing liquid discharge unit is not limited to this and may be installed as a branch from the processing liquid circulation unit 40. Additionally, although the treatment liquid storage unit 38 is comprised of the treatment tank 34 and the outer tank 42, the configuration of the treatment liquid storage unit is not limited to this. For example, an aqueous solution supply section, a water supply section, and a discharge section may be connected to the treatment tank 34 to form a treatment liquid storage section, and an external tank may not be provided.

[A specific example of a configuration including a high-concentration treatment liquid reservoir]

Here, the configuration of the concentration increase acceleration unit having the high concentration processing liquid storage unit 170 will be described in more detail. The concentration increase accelerator 39A shown in FIG. 9 supplies a high-concentration processing liquid to a liquid processing section (e.g., the processing liquid storage section 38) that accommodates the processing liquid and the substrate to be immersed in the processing liquid. do. For example, the concentration increase promotion unit 39A includes a high-concentration processing liquid storage unit 170, a processing liquid replenishment unit 210, a diluting liquid replenishment unit 220, a gas supply unit 230, and a heating unit 240. ), a processing liquid supply unit 250, and a concentration sensor 260.

As described above, the high-concentration processing liquid storage unit 170 (supply liquid storage unit) stores processing liquid to be supplied to the processing liquid storage unit 38. The high-concentration processing liquid storage unit 170 is provided at a location away from the processing liquid storage unit 38.

The processing liquid replenishment unit 210 replenishes the high-concentration processing liquid storage unit 170 with a processing liquid (for example, the aqueous phosphoric acid solution). For example, the processing liquid replenishment unit 210 has a processing liquid supply source 211 and a valve 212 . The processing liquid supply source 211 includes, for example, a tank (not shown) of processing liquid for replenishment, and a pump (not shown) that pumps the processing liquid from the tank to the high-concentration processing liquid storage unit 170 . The valve 212 opens and closes the flow path of the processing liquid sent from the processing liquid supply source 211 to the high-concentration processing liquid storage unit 170 according to a control command.

The diluent replenishment unit 220 supplies a diluted liquid (e.g., pure water, deionized water, etc.) with a lower concentration than the processing liquid that the processing liquid replenishment unit 210 replenishes in the high-concentration processing liquid storage unit 170 ( 170). A concentration lower than that of the treatment liquid means that the concentration of components contributing to the treatment content targeted by the treatment liquid is low. For example, the diluting liquid replenishment unit 220 has a diluting liquid supply source 221 and a valve 222. The diluted liquid supply source 221 has, for example, a tank (not shown) of diluted liquid for replenishment, and a pump (not shown) that pumps the diluted liquid from the tank to the high-concentration processing liquid storage unit 170. The valve 222 opens and closes the flow path of the diluted liquid sent from the diluted liquid supply source 221 to the high-concentration treatment liquid reservoir 170 according to a control command.

The gas supply unit 230 supplies an inert gas (for example, nitrogen gas) for promoting moisture evaporation into the processing liquid from the lower part of the high-concentration processing liquid storage unit 170. When the gas supply unit 230 supplies an inert gas, bubbles are generated in the processing liquid, thereby increasing the contact area between the processing liquid and the gas. For this reason, evaporation of moisture in the treatment liquid is promoted. For example, the gas supply unit 230 has a gas supply source 231 and a valve 232. The gas source 231 has, for example, a tank (not shown) of compressed inert gas. The valve 232 opens and closes the flow path of the inert gas sent from the gas supply source 231 to the high-concentration processing liquid reservoir 170 according to a control command.

The heating unit 240 heats the processing liquid in the high-concentration processing liquid storage unit 170. The heating unit 240 may be configured to heat the processing liquid drawn from the lower portion of the high-concentration processing liquid storage portion 170 and return it to the upper portion of the high-concentration processing liquid storage portion 170 . For example, the heating unit 240 has a flow path 245, a pump 241, a filter 242, and a heater 243. The flow path 245 draws the processing liquid from the lower portion of the high-concentration processing liquid storage portion 170 and guides it to the upper portion of the high-concentration processing liquid storage portion 170 . A pump 241, a filter 242, and a heater 243 are provided in the flow path 245. The pump 241 pumps the processing liquid from the lower side to the upper side of the high-concentration processing liquid reservoir 170. The filter 242 removes foreign substances, etc. from the treatment liquid. The heater 243 heats the processing liquid.

The processing liquid supply unit 250 supplies processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 . For example, the processing liquid supply unit 250 has a flow path 252 and valves 251 and 253. The flow path 252 branches off from the flow path 245 on the downstream side of the pump 241, filter 242, and heater 243 (upper side of the high-concentration treatment liquid reservoir 170). The processing liquid is guided to the processing liquid storage unit 38. The valve 251 opens and closes the flow path 252 according to the control command. The valve 253 opens and closes the flow path 245 between the flow path 252 and the upper part of the high-concentration treatment liquid reservoir 170. When the valve 251 closes the flow path 252 and the valve 253 opens the flow path 245, the processing liquid pumped by the pump 241 flows from the bottom of the high-concentration processing liquid reservoir 170 to the upper part. reflux to Hereinafter, this state is referred to as 'circulation state'. Meanwhile, when the valve 251 opens the flow path 252 and the valve 253 closes the flow path 245, the processing liquid pumped by the pump 241 is supplied to the processing liquid storage unit 38. Hereinafter, this state is referred to as 'supply state'.

The concentration sensor 260 detects information about the concentration of the processing liquid in the high-concentration processing liquid reservoir 170. As information about the concentration of the processing liquid, the concentration sensor 260 may detect information about the height of the liquid surface of the processing liquid in the high-concentration processing liquid reservoir 170. For example, the level of the liquid level of the processing liquid is determined by the replenishment of the processing liquid by the processing liquid replenishment unit 210, the replenishment of the diluted liquid by the diluting liquid replenishing unit 220, the volatilization of moisture in the processing liquid, and the high-concentration processing liquid. It varies depending on the supply of processing liquid from the storage unit 170 to the processing liquid storage unit 38. Accordingly, in the state in which the replenishment of the processing liquid by the processing liquid replenishment unit 210 is stopped and the above-mentioned circulation state is maintained, the main cause of the decrease in the liquid level of the processing liquid is moisture volatilization, so the lowering of the liquid level of the processing liquid and the processing It is related to the increase in concentration of the liquid. Similarly, in a state in which replenishment of the processing liquid by the processing liquid replenishment unit 210 is stopped and the above-described circulation state is maintained, the main cause of the rise in the liquid level of the processing liquid is the replenishment of the diluent, so the rise in the liquid level of the processing liquid and the processing It is related to the decrease in concentration of the liquid. In this way, when the replenishment of the processing liquid by the processing liquid replenishment unit 210 is stopped and the circulation state is maintained, the height of the liquid surface of the processing liquid can be information about the concentration of the processing liquid.

As shown in Fig. 10, for example, the concentration sensor 260 has a control sensor 261 and a monitor sensor 262. The control sensor 261 is a sensor that detects control information of the processing liquid replenishment unit 210, the diluent replenishment unit 220, and the processing liquid supply unit 250. The monitor sensor 262 is a sensor for monitoring and recording the concentration of the processing liquid in the high-concentration processing liquid storage unit 170.

The control sensor 261 includes a plurality of liquid level sensors that respectively detect the vertical relationship between the height of a plurality of measurement objects with different heights and the liquid level of the processing liquid. For example, the control sensor 261 includes four liquid level sensors (263, 264, 265, 266). The measurement target height (H1) is the upper limit of the liquid level height allowed in the high-concentration treatment liquid reservoir 170. The measurement target height H2 (first height) is the target height of the liquid surface when replenishing the processing liquid by the processing liquid replenishment unit 210. The measurement target height H3 (second height) is the target height of the liquid surface in the process of concentrating the treatment liquid. The measurement target height (H4) is the lower limit of the liquid level height allowed in the high-concentration treatment liquid reservoir 170.

The liquid level sensors 263, 264, 265, and 266, for example, based on the pressure for supplying inert gas for measurement (for example, nitrogen gas) to the measurement target heights H1, H2, H3, and H4, The vertical relationship between the height of the measurement target (H1, H2, H3, H4) and the liquid level of the treatment liquid is detected. For example, for each of the measurement target heights (H1, H2, H3, H4), there is a difference between the pressure when the liquid level is above the measurement target height and the pressure when the liquid level is below the measurement target height. By setting the threshold, it is possible to detect the vertical relationship between the height of the measurement target and the liquid level based on whether the pressure exceeds the threshold. In addition, the configuration of the liquid level sensors 263, 264, 265, and 266 described above is only an example. The liquid level sensors 263, 264, 265, and 266 may be of any type as long as they can detect the vertical relationship between the height of the measurement object (H1, H2, H3, H4) and the liquid level of the processing liquid. For example, the liquid level sensors 263, 264, 265, and 266 may be capacitive liquid level sensors.

The monitoring sensor 262, for example, measures the pressure (hereinafter simply referred to as 'supply pressure') for supplying an inert gas (for example, nitrogen gas) into the processing liquid from the lower part of the high-concentration processing liquid reservoir 170. Based on this, an estimated value of the height of the liquid level is derived. Here, the supply pressure may also vary depending on other factors such as the liquid level of the processing liquid. Specific examples of other factors include the boiling level of the treatment liquid. Therefore, the monitor sensor 262 may further include a configuration that reduces the influence of the boiling level and improves the detection accuracy of the liquid level. Under situations where the variation in liquid level is small, it is possible to detect the boiling level based on the supply pressure of the inert gas for measurement. Accordingly, in a period when the liquid level cannot vary significantly, it is possible to detect the boiling level based on the supply pressure and use the detection result to reduce the influence of the boiling level. Additionally, since the boiling level and the concentration of the processing liquid have a correlation, it is also possible to calculate the concentration of the processing liquid from the detected value of the boiling level. In addition, since the range of supply pressure fluctuations due to differences in boiling levels and the fluctuation range of supply pressures due to changes in liquid level height are different, a supply pressure measuring system is used to detect fluctuations in liquid level height and to detect fluctuations in boiling level. You can divide it and adjust each measurement range individually.

In addition, the configuration of the concentration sensor 260 described above is only an example. The concentration sensor 260 may be any type as long as it can detect information about the concentration of the processing liquid. For example, the concentration sensor 260 does not need to have a monitor sensor 262. Additionally, the concentration sensor 260 may detect the concentration of the processing liquid regardless of the height of the liquid surface of the processing liquid. Specific examples of sensors that detect the concentration of the processing liquid regardless of the height of the liquid surface of the processing liquid include, for example, ultrasonic or optical concentration sensors.

The concentration increase acceleration unit 39A illustrated above can be controlled by the control unit 7, for example. For example, the control unit 7 further executes a third control in which the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 is adjusted to a supply concentration higher than the concentration of the processing liquid in the processing liquid storage unit 38. For example, the control unit 7 further includes a pre-supply concentration control unit 75. In the third control, the pre-supply concentration control unit 75 controls the processing liquid replenishment unit 210 to replenish the processing liquid into the high-concentration processing liquid storage unit 170 and supplies the processing liquid from the high-concentration processing liquid storage unit 170. The processing liquid replenishment unit 210 is controlled to supply the processing liquid to the processing liquid storage unit 38, and the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 is replenished by the processing liquid replenishing unit 210. The processing liquid supply unit 250 is controlled to prohibit the supply of the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 until a supply concentration higher than the concentration of the processing liquid is reached.

For example, the pre-supply concentration control unit 75 includes a processing liquid replenishment control unit 76, a heating control unit 79, a supply control unit 78, and a diluent replenishment control unit 77. The processing liquid replenishment control unit 76 controls the processing liquid replenishment unit 210 to replenish the high concentration processing liquid storage unit 170 with processing liquid. For example, the pre-supply concentration control unit 75 starts replenishing the processing liquid in a state where no processing liquid is in the high-concentration processing liquid storage unit 170, and the height of the liquid surface of the processing liquid is measured at the target height (H2). The processing liquid replenishment unit 210 is controlled to stop replenishment of the processing liquid when it reaches ). More specifically, the pre-supply concentration control unit 75 controls the processing liquid replenishment unit 210 to open the valve 212 in a state where no processing liquid is contained in the high-concentration processing liquid storage unit 170. Afterwards, the pre-supply concentration control unit 75 repeatedly acquires information indicating whether the height of the liquid surface of the processing liquid has reached the height of the measurement target (H2) from the liquid level sensor 264, and the height of the liquid surface of the processing liquid reaches the measurement target height (H2). When it is determined that the height H2 has been reached, the treatment liquid replenishment unit 210 is controlled to close the valve 212.

The heating control unit 79 controls the heating unit 240 to heat the processing liquid replenished in the high-concentration processing liquid storage unit 170 by the processing liquid replenishment unit 210 . For example, the heating control unit 79 controls the heating unit 240 to pump the liquid drawn from the lower part of the high-concentration processing liquid storage unit 170 to the heater 243 by the pump 241.

The supply control unit 78 controls the processing liquid supply unit 250 to supply the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 . For example, when the supply control unit 78 promotes an increase in the concentration of the processing liquid in the processing liquid storage unit 38 in executing the second control, the circulation state (the valve 253 is opened and the valve ( The processing liquid supply unit 250 is controlled to change the supply state (the closed state 251) to the supply state (the valve 253 is closed and the valve 251 is open).

However, the supply control unit 78 stores the high-concentration processing liquid until the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 reaches a supply concentration higher than the concentration of the processing liquid replenished by the processing liquid replenishment unit 210. The processing liquid supply unit 250 is controlled to prohibit the supply of processing liquid from the unit 170 to the processing liquid storage unit 38 . For example, the supply control unit 78 supplies the processing liquid in the circulation state until the liquid level of the processing liquid in the high-concentration processing liquid reservoir 170, which has reached the measurement target height H2, falls to the measurement target height H3. The processing liquid supply unit 250 is controlled to prohibit transition to this state.

After the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 reaches the supply concentration, when the concentration of the processing liquid further increases, the diluting solution replenishment control unit 77 adjusts the diluting solution in an amount to bring the concentration closer to the supply concentration. The diluent replenishment unit 220 is controlled to replenish the high concentration treatment liquid storage unit 170. For example, the diluent replenishment control unit 77 adjusts the liquid level to the measurement target height ( The diluent replenishment unit 220 is controlled to replenish the high-concentration treatment liquid storage unit 170 with the diluent in an amount close to H3). More specifically, the diluent replenishment control unit 77 controls the diluent replenishment unit 220 to open the valve 222 until the liquid level of the processing liquid reaches the measurement target height H3.

Next, the control sequence executed by the control unit 7 having the pre-supply concentration control unit 75 will be illustrated in more detail. As shown in Fig. 11, the control unit 7 first executes steps S21, S22, and S23. In step S21, the processing liquid replenishment control unit 76 controls the processing liquid replenishment unit 210 to start replenishing the processing liquid in a state where no processing liquid is contained in the high-concentration processing liquid storage unit 170. In step S22, the processing liquid replenishment control unit 76 controls the processing liquid replenishment unit 210 until the liquid level sensor 264 detects that the height of the liquid surface of the processing liquid reaches the measurement target height H2. Continue replenishing the treatment liquid. In step S23, the processing liquid replenishment control unit 76 controls the processing liquid replenishment unit 210 to stop replenishment of the processing liquid.

Next, the control unit 7 executes steps S24, S25, S26, and S27. In step S24, the supply control unit 78 prohibits the processing liquid supply unit 250 from switching from the circulation state to the supply state. Thereafter, the circulation state is maintained by the processing liquid supply unit 250 until a change from the circulation state to the supply state is permitted. In step S25, the heating control unit 79 starts pumping the processing liquid by the pump 241 and controls the heating unit 240 to start heating the processing liquid. In step S26, the supply control unit 78 prohibits switching from the circulation state to the supply state until the liquid level sensor 265 detects that the liquid level of the processing liquid has decreased to the measurement target height H3. maintain. In step S27, the supply control unit 78 permits a change from the circulation state to the supply state. Afterwards, it becomes possible to switch the circulation state to the supply state as needed.

Next, the control unit 7 executes step S28. In step S28, the supply control unit 78 determines whether supply of processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 is required (e.g., processing liquid storage in execution of the second control). Check whether it is necessary to accelerate the increase in concentration of the treatment liquid in unit 38.

In step S28, when it is determined that supply of the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 is unnecessary, the control unit 7 executes step S29. In step S29, the diluent replenishment control unit 77 checks whether a further drop in the liquid level from the measurement target height H3 has been detected by the liquid level sensor 265. If it is determined in step S29 that a further drop in the liquid level from the measurement object height H3 has not been detected, the control unit 7 returns the process to step S28.

In step S29, when it is determined that a further drop in the liquid level from the measurement object height H3 has been detected, the control unit 7 executes steps S31, S32, and S33. In step S31, the diluent replenishment control unit 77 controls the diluent replenishment unit 220 to open the valve 222 and start replenishment of the diluent to the high concentration processing liquid storage unit 170. In step S32, the diluent replenishment control unit 77 continues replenishment of the diluent by the diluent replenishment unit 220 until the return of the liquid level to the measurement target height H3 is detected by the liquid level sensor 265. In step S33, the diluent replenishment control unit 77 controls the diluent replenishment unit 220 to stop replenishment of the diluent. After this, the control unit 7 returns the process to step S28. Thereafter, while replenishing the diluent as necessary, confirmation of whether supply of the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 is repeated is repeated.

In step S28, when it is determined that supply of processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 is necessary, the control unit 7 executes steps S34 and S35. In step S34, the supply control unit 78 switches the circulation state to the supply state, so that the processing liquid supply unit 250 supplies the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38. ) is controlled. In step S35, the pump 241 stops pumping the processing liquid, and the heating unit 240 is controlled to stop heating the processing liquid. This completes the control sequence for supplying the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38. Additionally, steps S34 and S35 do not need to be executed in this order, and the order may be reversed.

The configuration illustrated above includes a high-concentration processing liquid storage unit 170 that stores processing liquid for supply to the processing liquid storage unit 38, and a processing liquid replenishment unit that replenishes the processing liquid to the high-concentration processing liquid storage unit 170. A heating unit 240 for heating the processing liquid in the unit 210 and the high-concentration processing liquid storage unit 170, and a process for supplying the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38. It is provided with a liquid supply unit (250).

According to this configuration, the concentration of the processing liquid is increased in advance in the high-concentration processing liquid storage unit 170 prior to the supply timing of the processing liquid to the processing liquid storage unit 38, so that the high-concentration processing liquid is processed at the supply timing. It can be quickly supplied to the liquid reservoir (38). In addition, according to the configuration in which an increase in the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 is promoted by heating, the heated processing liquid can be supplied to the processing liquid storage unit 38, so that the processing liquid storage unit ( The heating time of the treatment liquid in 38) can also be shortened. Therefore, it is effective in speeding up the concentration control of the processing liquid in the processing liquid storage unit 38.

The concentration increase accelerating unit 39A may further include a concentration sensor 260 that detects information regarding the concentration of the processing liquid in the high-concentration processing liquid storage unit 170. In this case, the concentration of the processing liquid preceding the supply timing can be adjusted with higher precision. Therefore, it is effective in further speeding up the concentration control of the processing liquid in the processing liquid storage unit 38.

The concentration sensor 260 may detect information about the height of the liquid surface of the processing liquid in the high-concentration processing liquid storage unit 170 as information about the concentration of the processing liquid. In this case, compared to a sensor that measures the concentration itself, the configuration of the concentration sensor 260 can be simplified.

The concentration sensor 260 may include a plurality of liquid level sensors 263, 264, 265, and 266 that respectively detect the vertical relationship between the liquid level and the height of a plurality of measurement objects with different heights. In this case, further simplification of the configuration of the concentration sensor 260 is possible. In addition, since the vertical relationship between a plurality of different measurement target heights and the liquid level can be determined binary, it is difficult to be influenced by measurement error factors such as noise. For this reason, the configuration that detects the vertical relationship between the height of the measurement target and the liquid level is also effective in improving the reliability of information about concentration.

The concentration increase promotion unit 39A is a diluent replenishment unit ( 220) may be further provided. In this case, the concentration of the treatment liquid can be easily maintained at an appropriate level.

The heating unit 240 may be configured to heat the processing liquid drawn from the lower portion of the high-concentration processing liquid storage portion 170 and return it to the upper portion of the high-concentration processing liquid storage portion 170 . In this case, by improving the uniformity of the temperature of the processing liquid within the high-concentration processing liquid storage unit 170, the bias in the concentration increase can be suppressed.

The control unit 7 controls the processing liquid replenishment unit 210 to replenish the processing liquid into the high-concentration processing liquid storage unit 170, and supplies the processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38. Controlling the processing liquid supply unit 250 to supply, and when the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 reaches a supply concentration higher than the concentration of the processing liquid replenished by the processing liquid replenishment unit 210 The processing liquid supply unit 250 may be controlled to prohibit the supply of processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38. In this case, the concentration of the processing liquid can be adjusted automatically prior to the supply timing.

The control unit 7 controls the processing liquid replenishment unit 210 to replenish the processing liquid until the liquid level of the processing liquid in the high-concentration processing liquid storage unit 170 reaches the measurement target height (H2), and then stores the high-concentration processing liquid. A processing liquid supply unit 250 is configured to prohibit the supply of processing liquid from the high-concentration processing liquid storage unit 170 to the processing liquid storage unit 38 until the liquid level of the processing liquid in the unit 170 falls to the measurement target height H3. ) can be controlled. In this case, during adjustment of the concentration based on the height of the liquid level, the correlation between the height of the liquid level and the concentration is approximately maintained. For this reason, simple concentration adjustment based on the height of the liquid level can be performed with high reliability.

The control unit 7 controls the diluent replenishment unit 220 to replenish the high-concentration processing liquid storage unit 170 with the diluted liquid in an amount that makes the concentration of the processing liquid in the high-concentration processing liquid storage unit 170 close to the supply concentration. It may be configured to run more. In this case, maintenance of the concentration of the treatment liquid can be continued automatically.

Additionally, the above-described specific example includes the following configuration.

(Appendix 1)

a liquid processing unit that accommodates a processing liquid and a substrate to be immersed in the processing liquid;

a supply liquid storage unit that stores the processing liquid to be supplied to the liquid processing unit;

a processing liquid replenishment unit that replenishes the processing liquid into the supply liquid storage unit;

a heating unit that heats the processing liquid in the supply liquid storage unit;

A substrate liquid processing device comprising a processing liquid supply unit that supplies the processing liquid from the supply liquid storage unit to the liquid processing unit.

(Appendix 2)

The substrate liquid processing device according to Supplementary Note 1, further comprising a concentration sensor that detects information regarding the concentration of the processing liquid in the supply liquid storage portion.

(Appendix 3)

The substrate liquid processing device according to Supplementary Note 2, wherein the concentration sensor detects information about the height of the liquid surface of the processing liquid in the supply liquid storage portion as information about the concentration of the processing liquid.

(Appendix 4)

The substrate liquid processing device according to Supplementary Note 3, wherein the concentration sensor includes a plurality of liquid level sensors that respectively detect the vertical relationship between the heights of a plurality of measurement objects having different heights and the liquid level.

(Appendix 5)

The substrate liquid processing device according to any one of Appendices 1 to 4, further comprising a diluent replenishment unit that replenishes the supply liquid reservoir with a diluent having a lower concentration than the processing liquid replenished in the supply liquid reservoir.

(Appendix 6)

The substrate liquid processing device according to any one of Appendices 1 to 4, wherein the heating unit is configured to heat the processing liquid drawn out from the lower portion of the supply liquid storage portion and return it to the upper portion of the supply liquid storage portion.

(Appendix 7)

Controlling the processing liquid replenishment unit to replenish the processing liquid into the supply liquid storage unit;

controlling the processing liquid supply unit to supply the processing liquid from the supply liquid storage unit to the liquid processing unit;

Supply of the processing liquid from the supply liquid storage unit to the liquid processing unit until the concentration of the processing liquid in the supply liquid storage unit reaches a supply concentration higher than the concentration of the processing liquid replenished by the processing liquid replenishment unit. The substrate liquid processing device according to any one of Appendices 1 to 6, further comprising a control unit configured to control the processing liquid supply unit to prohibit.

(Appendix 8)

Controlling the processing liquid replenishment unit to replenish the processing liquid into the supply liquid storage unit;

controlling the processing liquid supply unit to supply the processing liquid from the supply liquid storage unit to the liquid processing unit;

Supply of the processing liquid from the supply liquid storage unit to the liquid processing unit until the concentration of the processing liquid in the supply liquid storage unit reaches a supply concentration higher than the concentration of the processing liquid replenished by the processing liquid replenishment unit. further comprising a control unit configured to control the processing liquid supply unit to prohibit;

The plurality of measurement target heights include a first height and a second height lower than the first height,

The control unit controls the processing liquid replenishment unit to replenish the processing liquid until the liquid level of the processing liquid in the supply liquid storage portion reaches the first height, and then, the liquid level of the processing liquid in the supply liquid storage portion reaches the second height. The substrate liquid processing device according to Supplementary Note 4, wherein the processing liquid supply unit is controlled to prohibit supply of the processing liquid from the supply liquid storage unit to the liquid processing unit until the height decreases.

(Appendix 9)

Controlling the processing liquid replenishment unit to replenish the processing liquid into the supply liquid storage unit;

controlling the processing liquid supply unit to supply the processing liquid from the supply liquid storage unit to the liquid processing unit;

Supply of the processing liquid from the supply liquid storage unit to the liquid processing unit until the concentration of the processing liquid in the supply liquid storage unit reaches a supply concentration higher than the concentration of the processing liquid replenished by the processing liquid replenishment unit. Controlling the treatment liquid supply unit to prohibit,

The substrate liquid according to Appendix 5, further comprising a control unit configured to control the diluent replenishment unit to replenish the supply liquid reservoir with the diluent in an amount that makes the concentration of the processing liquid in the supply liquid reservoir close to the supply concentration. processing unit.

A1: Substrate liquid processing device
7: Control unit
38: Treatment liquid reservoir (reservoir)
39: Treatment liquid supply unit (concentration increase promotion unit)
39A: Concentration increase promotion unit
41: Treatment liquid discharge unit (discharge unit)
80, 263, 264, 265, 266: Liquid level sensor
210: Treatment liquid replenishment unit
240: heating unit
260: Concentration sensor
H2: Measurement target height (first height)
H3: Measurement target height (second height)

Claims (15)

A reservoir for storing the treatment liquid,
a discharge portion discharging the treatment liquid from the storage portion;
A control unit that controls the discharge unit,
Equipped with a liquid level sensor that detects the liquid level in the reservoir,
The control unit,
Executing a first control in a concentration constant period in which the concentration of the processing liquid in the reservoir is adjusted to a predetermined set concentration and a second control in a concentration change period in which the concentration of the processing liquid in the reservoir is changed,
In the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and the set concentration after the concentration change is lower than the set concentration before the concentration change, and the liquid level detected by the liquid level sensor A substrate liquid processing device that controls the discharge unit to start discharging the processing liquid when is higher than a predetermined liquid level reference value. delete A reservoir for storing the treatment liquid,
a concentration increase promoting unit that promotes an increase in the concentration of the processing liquid in the storage unit;
It has a control unit that controls the concentration increase accelerating unit,
The control unit,
Executing a first control in a concentration constant period in which the concentration of the processing liquid in the reservoir is adjusted to a predetermined set concentration and a second control in a concentration change period in which the concentration of the processing liquid in the reservoir is changed,
In the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and when the set concentration after the concentration change is higher than the set concentration before the concentration change, the treatment liquid in the storage portion is Controlling the concentration increase promoting unit to promote concentration increase,
The concentration increase promoting unit,
a supply liquid reservoir that stores the processing liquid to be supplied to the reservoir;
a processing liquid replenishment unit that replenishes the processing liquid into the supply liquid storage unit;
a heating unit that heats the processing liquid in the supply liquid storage unit;
a processing liquid supply unit that supplies the processing liquid from the supply liquid storage unit to the storage unit;
It has a concentration sensor that detects information about the concentration of the processing liquid in the supply liquid reservoir,
Supplying the processing liquid having a higher concentration than the processing liquid stored in the storage portion to the storage portion,
The concentration sensor is a substrate liquid processing device that includes a plurality of liquid level sensors that each detect a vertical relationship between a plurality of measurement target heights having different heights and a liquid level. delete According to claim 1 or 3,
A substrate liquid processing device, wherein the concentration change period includes a plurality of steps capable of individually setting the set concentration. According to claim 1 or 3,
The substrate liquid processing apparatus, wherein the control unit executes the first control and the second control during a substrate processing period in which a substrate to be processed is immersed in the processing liquid in the reservoir and processed by the processing liquid. According to claim 6,
The control unit further adjusts the concentration of the processing liquid in the reservoir to the predetermined set concentration in the concentration constant period during an interval period in which the substrate is not immersed in the processing liquid in the reservoir. Consisting of a substrate liquid processing device. delete delete delete According to claim 3,
The control unit,
Further performing a third control in which the concentration of the processing liquid in the supply liquid storage portion is adjusted to a supply concentration higher than the concentration of the processing liquid in the storage portion,
In the third control,
Controlling the processing liquid replenishment unit to replenish the processing liquid into the supply liquid storage unit;
controlling the processing liquid supply unit to supply the processing liquid from the supply liquid storage unit to the storage unit;
Controlling the processing liquid supply unit to prohibit supply of the processing liquid from the supply liquid storage unit to the storage unit until the concentration of the processing liquid in the supply liquid storage unit reaches the supply concentration. According to claim 3,
The plurality of measurement target heights include a first height and a second height lower than the first height,
The control unit,
Further performing a third control in which the concentration of the processing liquid in the supply liquid storage portion is adjusted to a supply concentration higher than the concentration of the processing liquid in the storage portion,
In the third control,
Controlling the processing liquid replenishment unit to replenish the processing liquid into the supply liquid storage portion until the liquid level of the processing liquid in the supply liquid storage portion reaches the first height;
controlling the processing liquid supply unit to supply the processing liquid from the supply liquid storage unit to the storage unit;
Controlling the processing liquid supply unit to prohibit the supply of the processing liquid from the supply liquid storage unit to the storage unit until the liquid level of the processing liquid in the supply liquid storage unit, which has reached the first height, falls to the second height. Executing a substrate liquid processing device. A computer-readable storage medium storing a substrate liquid processing program for performing the control according to claim 1 or 3. A first control for adjusting the concentration of the processing liquid in a storage portion for storing the processing liquid to a predetermined set concentration in a certain concentration period;
A second control for changing the concentration of the treatment liquid in the storage portion in the concentration change period.
Including,
In the second control, the set concentration before the concentration change is compared with the set concentration after the concentration change, and the set concentration after the concentration change is lower than the set concentration before the concentration change, and the liquid level in the reservoir is lower than the set concentration before the concentration change. A substrate liquid processing method, wherein discharge of the processing liquid from the storage portion is started when the liquid level is higher than a predetermined reference value. replenishing the processing liquid into a supply liquid reservoir that stores the processing liquid for supplying it to a reservoir that stores the processing liquid;
heating the treatment liquid in the supply liquid reservoir;
Detecting information about the concentration of the processing liquid in the supply liquid reservoir by a plurality of liquid level sensors that respectively detect the vertical relationship between the liquid level and a plurality of measurement target heights of different heights;
prohibiting the supply of the processing liquid from the supply liquid storage portion to the storage portion until the concentration of the processing liquid in the supply liquid storage portion reaches a supply concentration higher than the concentration of the processing liquid stored in the storage portion;
Supplying the treatment liquid that has reached the supply concentration from the supply liquid storage unit to the storage unit.
A substrate liquid processing method comprising:

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