KR102576880B1 - 반도체 기판의 임계 치수 측정을 위한 딥 러닝 기반 적응적 관심 영역 - Google Patents

반도체 기판의 임계 치수 측정을 위한 딥 러닝 기반 적응적 관심 영역 Download PDF

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KR102576880B1
KR102576880B1 KR1020217013707A KR20217013707A KR102576880B1 KR 102576880 B1 KR102576880 B1 KR 102576880B1 KR 1020217013707 A KR1020217013707 A KR 1020217013707A KR 20217013707 A KR20217013707 A KR 20217013707A KR 102576880 B1 KR102576880 B1 KR 102576880B1
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아르핏 야티
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케이엘에이 코포레이션
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    • G06T2207/20104—Interactive definition of region of interest [ROI]
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    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
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    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
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KR1020217013707A 2018-10-08 2019-10-01 반도체 기판의 임계 치수 측정을 위한 딥 러닝 기반 적응적 관심 영역 Active KR102576880B1 (ko)

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Application Number Priority Date Filing Date Title
IN201841037993 2018-10-08
IN201841037993 2018-10-08
US201862770712P 2018-11-21 2018-11-21
US62/770,712 2018-11-21
US16/420,408 US11094053B2 (en) 2018-10-08 2019-05-23 Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
US16/420,408 2019-05-23
PCT/US2019/053922 WO2020076544A1 (en) 2018-10-08 2019-10-01 Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates

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KR102576880B1 true KR102576880B1 (ko) 2023-09-08

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CN116880134A (zh) * 2020-01-07 2023-10-13 诺威有限公司 用于ocd计量的方法
CN113809117B (zh) * 2020-06-16 2023-12-22 联华电子股份有限公司 半导体元件及其制作方法
US11967058B2 (en) 2020-06-24 2024-04-23 Kla Corporation Semiconductor overlay measurements using machine learning
CN113393447B (zh) * 2021-06-24 2022-08-02 四川启睿克科技有限公司 基于深度学习的针尖正位度检测方法及系统
US12223752B2 (en) 2021-09-30 2025-02-11 Fei Company Data acquisition in charged particle microscopy
WO2024049199A1 (ko) * 2022-08-31 2024-03-07 주식회사 엘지에너지솔루션 학습 모델 기반의 치수 측정 장치 및 방법
WO2024065645A1 (zh) * 2022-09-30 2024-04-04 北京京东方技术开发有限公司 图像文本匹配模型的训练方法、装置、设备及存储介质
US20240161264A1 (en) * 2022-11-15 2024-05-16 Micron Technology, Inc. Defect characterization in semiconductor devices based on image processing
US12449379B2 (en) 2023-05-25 2025-10-21 Applied Materials, Inc. Machine learning model training
US20240394509A1 (en) * 2023-05-25 2024-11-28 Applied Materials, Inc. Generating synthetic microspy images of substrates

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US11094053B2 (en) 2021-08-17
US20200111206A1 (en) 2020-04-09
TWI808265B (zh) 2023-07-11
KR20210057203A (ko) 2021-05-20
EP3853885B1 (en) 2025-07-30
TW202029371A (zh) 2020-08-01
JP2022504505A (ja) 2022-01-13
WO2020076544A1 (en) 2020-04-16
JP7284813B2 (ja) 2023-05-31
CN112823412A (zh) 2021-05-18
CN112823412B (zh) 2022-08-05
EP3853885A1 (en) 2021-07-28
EP3853885A4 (en) 2022-07-13

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