KR102569320B1 - A Method of Surface Treatment for Packaged Implant through Plasma and Surface Treatment System for Packaged Implant - Google Patents

Abstract

The present invention relates to a method for modifying the surface of an implant through plasma and a system for modifying the surface of a packaged implant, and more particularly, to provide an implant packaging body in a plasma discharge device having an inner space and having a plasma discharge device in the inner space. A step of providing an implant, a step of dropping air pressure from the inner space through an air outlet connected to the inner space of the plasma discharge device, a step of applying a current to generate plasma by applying a current to the plasma discharge device, and a step of applying a current to generate plasma by applying a current to the plasma discharge device. And a modification step of modifying the surface of the implant to be hydrophilic, wherein the implant packaging body includes at least one implant, but the implant is packaged and sealed by modifying the surface without contacting the inner surface of the plasma discharge device. By modifying the surface of the implant to be hydrophilic while in the present state, the bone and/or surrounding tissue easily adheres to the implant, shortening the bone union period and improving the initial stability of the implant. It relates to a method for modifying the surface of an implant through plasma and a system for modifying the surface of a packaged implant.

Description

A Method of Surface Treatment for Packaged Implant through Plasma and Surface Treatment System for Packaged Implant

The present invention relates to a method for modifying the surface of an implant through plasma and a system for modifying the surface of a packaged implant, and more particularly, to provide an implant packaging body in a plasma discharge device having an inner space and having a plasma discharge device in the inner space. A step of providing an implant, a step of dropping air pressure from the inner space through an air outlet connected to the inner space of the plasma discharge device, a step of applying a current to generate plasma by applying a current to the plasma discharge device, and a step of applying a current to generate plasma by applying a current to the plasma discharge device. And a modification step of modifying the surface of the implant to be hydrophilic, wherein the implant packaging body includes at least one implant, but the implant is packaged and sealed by modifying the surface without contacting the inner surface of the plasma discharge device. By modifying the surface of the implant to be hydrophilic while in the present state, the bone and/or surrounding tissue easily adheres to the implant, shortening the bone union period and improving the initial stability of the implant. It relates to a method for modifying the surface of an implant through plasma and a system for modifying the surface of a packaged implant.

Dental implants or implants used for artificial joints are fixed to the body and assist movement of joints around the implants. Such an implant secures initial stability by mechanical fixation, and secures long-term stability by adherence to the implant or osseointegration coupled with the implant while the bone or surrounding tissue is restored. 1 is a view showing the stability of an implant after placement. The dotted line in FIG. 1 represents the stability of the implant by mechanical fixation, and the dotted line represents the stability by osseointegration. Referring to FIG. 1, although the strength due to mechanical fixation decreases over time, the bone adheres to the surface of the implant and is supported by the bone and surrounding muscle tissue, so that the supporting force due to osseointegration increases over time. This ensures long-term stability.

The material mainly used for implants is titanium. In the body, titanium forms a titanium oxide film on the surface, and the titanium oxide film has the property of a negative electrode and has hydrophilicity. Hydrophilicity, which enables easy contact with water, can be expressed as a contact angle of a liquid with respect to a metal substrate when an arbitrary liquid contacts a metal substrate. The contact angle is the angle formed by the free surface of the liquid and the plane of the solid when the liquid is in contact with the solid, and is determined by the cohesive force between liquid molecules and the adhesive force between the liquid and the solid. When the contact angle of the liquid with the solid plane exceeds 90˚, the solid plane can be defined as hydrophobicity, which is a property of less affinity with water, and the solid when the contact angle of the liquid with the solid plane is less than 90˚. A plane can be defined as hydrophilicity, a property that has an affinity for water.

When titanium is left in the air, carbon in the air combines with titanium oxide to suppress the hydrophilicity of the titanium film, and the hydrophilicity of the titanium film decreases, which is called biological aging. If the hydrophilicity of the implant decreases, the ability of the bone to osseointegrate decreases and the initial stability of the implant decreases, so there is a problem that the initial exercise capacity of the implanted patient decreases. After rehabilitation, the initial rehabilitation has a great effect on the long-term patient's exercise ability.

Therefore, a surface treatment method is required to maintain the hydrophilicity of the surface of the implant. In order to prevent exposure to the air, there is a method of supplying the implant by putting it in saline, but when the saline is contaminated, the shelf life of the saline is short if the quality of the implant deteriorates.

Next, as in Korean Patent Registration No. 10-1196171, the titanium surface of the implant may be irradiated with ultraviolet rays to perform hydrophilic surface modification. However, in the case of hydrophilic surface modification through UV, the material of the packaging material must be quartz glass in order for ultraviolet rays to pass through the packaging material surrounding the implant. In the case of small-sized dental implants, the implant can be supplied to the operation room by putting the implant in a quartz glass housing or case. It has the disadvantage of high cost and low economic feasibility.

In addition, implants are usually supplied surrounded by packaging materials to prevent contamination. However, when hydrophilic treatment is performed on the surface of the implant through ultraviolet (UV), the packaging of the implant must be removed, so the sterilization state is released and contamination is a problem. there is

Meanwhile, the surface of a material may be modified by colliding particles having high energy in a plasma state with the surface of the material. Plasma consists of electrons, ions, and neutral particles (atoms and molecules) generated by applying high temperature and high pressure through arc discharge, glow plasma in which air is ionized by discharge by passing current through gas in a state close to vacuum, and arc discharge. It can be classified as partially ionized thermal plasma, etc., and is a collection of electrically charged particles with physical conductivity, which collectively reacts to an external electromagnetic field.

Applying a high voltage to a gas makes it possible to ionize atoms or molecules even at low temperatures. For example, in the case of argon (Ar) gas, plasma can be generated even with an electric field of 100 V or more per 1 cm at a pressure between 1 mTorr and 100 Torr. When gas containing oxygen is converted into plasma, positive and negative ions, single oxygen atoms, ozone, and ionized oxygen atoms are generated. The hydrophilicity of the implant can be improved by removing carbon adsorbed on the surface of the implant by plasma (radical).

Therefore, in the art, a surface modification method capable of modifying the surface of an implant in a packaged state to prevent contamination by air exposure while securing initial stability during implant procedure by modifying the surface of the implant to be hydrophilic through plasma has been developed. are demanding

Korean Registered Patent Publication No. 10-1196171 (2012.10.24)

The present invention has been made to solve the above problems,

An object of the present invention is an implant providing step of providing an implant packaging body in a plasma discharge equipment provided to have a first conductor and a second conductor in the internal space and to discharge plasma in the internal space, the plasma discharge equipment An air pressure lowering step of removing air from the inner space through an air outlet connected to the inner space, a current applying step of generating plasma by applying a current to the plasma discharge equipment, and a reforming step of modifying the surface of the implant to be hydrophilic by the discharged plasma. The implant packaging body includes at least one implant, but the surface of the implant is modified in a state where the implant does not come into contact with the inner surface of the plasma discharge device, and the surface of the implant is modified to be hydrophilic in a state in which the implant is wrapped and sealed. , Plasma-based implantation, which can prevent the implant from being exposed to air and contaminated during the process of surface modification of the implant, while improving the initial stability of the implant by shortening the osteosynthesis period as the bone and/or surrounding tissue easily adheres to the implant It is to provide a surface modification method.

An object of the present invention is to provide the implant in the plasma discharge device by providing the implant package, which further includes a first package, at least a portion of which is provided so that plasma can pass therethrough and which surrounds the implant, in the first package. It is to provide a method of modifying the surface of an implant through plasma so that the surface of the implant can be modified without contamination from the outside.

An object of the present invention is to include a plasma penetrating part through which plasma formed in the first package can pass and a plasma shielding part through which plasma cannot pass, and the step of providing the implant includes the plasma penetrating part in the inner space of the plasma discharge equipment. It is to provide a method of modifying the surface of an implant through plasma, which is provided so as to face the first conductor or the second conductor so that the plasma moving according to the electric field can efficiently proceed to the implant in the package.

It is an object of the present invention, in the implant providing step, to provide an implant package further including a second package surrounding the first package from the outside of the first package into a plasma discharge device, the second package through which plasma passes. It is to provide a method of modifying the surface of an implant through plasma to prevent contamination of the implant, including a plasma permeable portion provided to allow plasma penetration and a plasma shield portion through which plasma cannot pass.

An object of the present invention is that the implant providing step includes the step of removing the second package from the implant package, providing the first package and the implant therein into a plasma discharge device, so that the first package in a clean state is subjected to plasma discharge. It is to provide a method of modifying the surface of an implant through plasma that is provided into the equipment and prevents contamination during a surgical procedure.

An object of the present invention is to provide a method for modifying the surface of an implant through plasma, in which the surface of the implant can be easily modified in a state in which the implant is packaged by providing the second packaging, the first packaging, and the implant in the plasma discharge equipment in the implant providing step. will be.

An object of the present invention is to provide a method of modifying the surface of an implant through plasma, in which, in the reforming step, oxygen in the inner space is ionized and plasma containing ozone modifies the surface of the implant made of titanium to be hydrophilic.

An object of the present invention is to include at least one implant accommodated inside, a first packaging surrounding the implant and closing the inside, and a second packaging covering the first packaging from the outside of the first packaging and closing the inside. and wherein at least a portion of the first packaging is provided to allow plasma to pass through, the first packaging surrounds at least a portion of the implant and includes a plasma-transmitting portion provided to allow plasma to pass through, and at least another portion of the implant. An implant packaging body including a plasma shielding unit enclosing and preventing plasma from passing therethrough can be modified to have a hydrophilic surface of an implant accommodated therein in a state in which the implant is not contaminated.

An object of the present invention is that the implant packaging body further includes a fixing member for fixing the implant in the first package, the fixing member has a structure through which plasma can pass, and the structure through which the plasma can pass It is to provide an implant package in which plasma can proceed to the implant surface from the outside of the first package facing the plasma transmission unit.

An object of the present invention is to provide an implant package in which at least a portion of the plasma transmission part and the plasma shielding part are provided to be detachable from each other so that the implant after surface modification can be easily taken out.

An object of the present invention is that at least a part of the second package is provided to allow plasma to pass through, a plasma-transmitting portion formed to surround at least a portion of the first package and allow plasma to pass therethrough, and at least a portion of the first package It is to provide an implant package that can easily perform plasma surface modification while the implant is double-wrapped, including a plasma shielding portion surrounding another part and formed to prevent plasma from passing therethrough.

An object of the present invention is to include an implant package, a plasma discharge device for accommodating the implant package in an inner space and discharging plasma into the inner space to modify the surface of the implant in the implant package, the plasma discharge device Is connected to the first conductor provided to face the inner space on one side of the inner space, the second conductor provided to face the first conductor on the other side of the inner space, and the inner space to remove air from the inner space. and an air outlet provided so as to provide a packaged implant surface modification system in which a current is applied to the first conductor and the second conductor to generate plasma in an internal space.

An object of the present invention is to provide a packaged implant surface modification system in which the implant packaging body is accommodated so that the plasma transmission part faces the first conductor or the second conductor so that the plasma generated in the inner space proceeds into the implant packaging body will be.

The present invention is implemented by an embodiment having the following configuration in order to achieve the above object.

According to one embodiment of the present invention, the present invention provides an implant that provides an implant package in a plasma discharge equipment provided to have a first conductor and a second conductor in the inner space and to discharge plasma in the inner space. Step, a pressure drop step of extracting air from the inner space through an air outlet connected to the inner space of the plasma discharge device, a current applying step of generating plasma by applying a current to the plasma discharge device, and the discharged plasma hitting the surface of the implant. It includes a modification step of modifying to be hydrophilic, and the implant packaging body includes at least one implant, but the implant is characterized in that the surface is modified in a state in which the implant does not contact the inner surface of the plasma discharge device.

According to an embodiment of the present invention, in the implant providing step, at least a portion of the implant packaging body further including a first package surrounding the implant is provided to allow plasma to pass through the plasma discharge device. It is characterized by providing within.

According to one embodiment of the present invention, the present invention includes a plasma transmission part through which plasma formed in the first packaging can pass and a plasma shielding part through which plasma cannot pass, and the implant providing step comprises the plasma transmission part. It is characterized in that it is provided so as to face the first conductor or the second conductor in the inner space of the plasma discharge equipment.

According to one embodiment of the present invention, the implant providing step provides an implant package further including a second package surrounding the first package from the outside of the first package into the plasma discharge equipment, The second package is characterized in that it includes a plasma transmission part provided to allow plasma to pass through and a plasma shielding part through which plasma cannot pass.

According to one embodiment of the present invention, the implant providing step includes removing the second package from the implant package, and providing the first package and the implant therein into a plasma discharge device. to be characterized

According to one embodiment of the present invention, the implant providing step is characterized in that the second package, the first package and the implant are provided into the plasma discharge equipment.

According to one embodiment of the present invention, the reforming step is characterized in that oxygen in the inner space is ionized and plasma containing ozone modifies the surface of the titanium implant to be hydrophilic.

According to one embodiment of the present invention, at least one implant accommodated inside, a first package surrounding the implant and closing the inside, and surrounding the first package from the outside of the first package and covering the inside It includes a second package that occludes, and at least a portion of the first package is characterized in that it is provided to allow plasma to pass through.

According to one embodiment of the present invention, the first package surrounds at least a portion of the implant and is provided to allow plasma to pass through the plasma transmission part, and surrounds at least another portion of the implant and allows plasma to pass through. It is characterized in that it comprises a plasma shield provided so as not to be able to.

According to an embodiment of the present invention, the implant packaging body further includes a fixing member for fixing the implant in the first package, the fixing member has a structure through which plasma can pass, and the plasma The structure through which can pass is characterized in that plasma can proceed to the implant surface from the outside of the first package facing the plasma transmission part.

According to one embodiment of the present invention, the plasma transmission part is formed of a flexible membrane, and the plasma shielding part is made of plastic.

According to an embodiment of the present invention, the present invention is characterized in that at least a portion of the plasma transmission part and the plasma shielding part are provided to be detachable from each other.

According to an embodiment of the present invention, the second package is provided to allow plasma to pass through at least a portion thereof, and the plasma transmission unit is formed to surround at least a portion of the first package and allow plasma to pass therethrough. , It is characterized in that it includes a plasma shielding portion formed to surround at least another portion of the first package and prevent plasma from passing therethrough.

According to one embodiment of the present invention, the present invention provides an implant package, a plasma discharge device for accommodating the implant package in an inner space and discharging plasma into the inner space to modify the surface of the implant in the implant package. The plasma discharge device includes a first conductor provided to face the inner space on one side of the inner space, a second conductor provided to face the first conductor on the other side of the inner space and connected to the inner space. and an air outlet provided to extract air from the inner space, and a current is applied to the first conductor and the second conductor to generate plasma in the inner space.

According to one embodiment of the present invention, the implant package body is accommodated so that the plasma transmission part faces the first conductor or the second conductor, so that the plasma generated in the internal space proceeds into the implant package body. to be

The present invention can obtain the following effects by combining and using the above embodiments and configurations to be described below.

The present invention is an implant providing step of providing an implant package in a plasma discharge equipment having an internal space and a first conductor and a second conductor therein so as to discharge plasma in the internal space, the internal space of the plasma discharge equipment An air pressure lowering step of extracting air from the inner space through an air outlet connected to, a current applying step of generating plasma by applying a current to the plasma discharge equipment, and a reforming step of modifying the surface of the implant to be hydrophilic by the discharged plasma, , The implant packaging body includes at least one implant, but the surface of the implant is modified in a state in which the implant does not come into contact with the inner surface of the plasma discharge device, so that the surface of the implant is modified to be hydrophilic in a state in which the implant is wrapped and sealed. And/or the surrounding tissue easily adheres to the implant, thereby shortening the osteosynthesis period, thereby improving the initial stability of the implant, and at the same time preventing the implant from being exposed to air and being contaminated during the surface modification process of the implant.

In the present invention, in the implant providing step, the implant package body further including a first package surrounding the implant, at least a portion of which is provided to allow plasma to pass therethrough, is provided in the plasma discharge device so that the implant in the first package is formed. There is an effect of allowing the surface to be modified without contamination from the outside.

The present invention includes a plasma penetrating part through which plasma formed in the first packaging can pass and a plasma shielding part through which plasma cannot pass, and the step of providing the implant is a first step in the plasma penetrating part in the inner space of the plasma discharge equipment. It is provided to face the conductor or the second conductor so that the plasma moving according to the electric field can efficiently proceed to the implant in the package.

In the present invention, the implant providing step provides an implant package further including a second package surrounding the first package from the outside of the first package into the plasma discharge equipment, the second package to allow plasma to pass through. Contamination of the implant may be prevented by including the provided plasma penetrating portion and the plasma shielding portion through which plasma cannot pass.

In the present invention, the implant providing step includes the step of removing the second package from the implant package, and providing the first package and the implant therein into the plasma discharge equipment, so that the first package in a clean state is inserted into the plasma discharge equipment. It is provided to prevent contamination during the surgical procedure.

In the present invention, in the implant providing step, the second packaging, the first packaging, and the implant are provided in the plasma discharge equipment, thereby obtaining an effect that enables the surface modification of the implant to be easily performed in a state in which the implant is packaged.

In the present invention, the reforming step is accompanied by an effect of providing a method of modifying the surface of the implant through plasma in which oxygen in the inner space is ionized and plasma containing ozone modifies the surface of the implant made of titanium to be hydrophilic.

The present invention includes at least one implant accommodated inside, a first package surrounding the implant and closing the inside, and a second package surrounding the first package from the outside of the first package and closing the inside, At least a portion of the first packaging is provided to allow plasma to pass through, the first packaging surrounds at least a portion of the implant and surrounds a plasma transmission portion provided to allow plasma to pass through, and at least another portion of the implant; In a state where the implant is not contaminated, including the plasma shielding portion provided to prevent plasma from passing therein, the implant surface accommodated therein may be modified to be hydrophilic.

In the present invention, the implant packaging body further includes a fixing member for fixing the implant in the first package, the fixing member has a structure through which the plasma can pass, and the structure through which the plasma can pass is the plasma. Facing the permeable portion, an effect of plasma advancing from the outside of the first package to the surface of the implant can be obtained.

In the present invention, at least a portion of the plasma transmission part and the plasma shielding part are provided to be detachable from each other, so that the implant after surface modification can be easily taken out.

In the present invention, at least a part of the second package is provided to allow plasma to pass through, a plasma transmission part surrounding at least a portion of the first package and allowing plasma to pass therethrough, and at least another part of the first package. Plasma surface modification can be conveniently performed while the implant is double-wrapped, including a plasma shielding portion surrounding the implant and preventing plasma from passing therethrough.

The present invention includes an implant package and a plasma discharge device for accommodating the implant package in an inner space and discharging plasma into the inner space to modify the surface of the implant in the implant package, wherein the plasma discharge device is A first conductor provided to face the inner space on one side, a second conductor provided to face the first conductor on the other side of the inner space, and connected to the inner space to remove air from the inner space. and an air outlet, wherein current is applied to the first conductor and the second conductor to generate plasma in the inner space.

In the present invention, the implant packaging body has an effect of providing a packaged implant surface modification system in which the plasma transmission part is accommodated so as to face the first conductor or the second conductor so that the plasma generated in the inner space proceeds into the implant packaging body. there is.

1 is a view showing the stability after implant placement
2 is a flow chart of a method for modifying the surface of an implant through plasma according to the present invention;
3 is a view showing that the implant package 30 is provided to the plasma discharge equipment 10 in the implant surface modification method (S) through plasma according to the present invention
Figure 4 is a cross-sectional view of the plasma discharge equipment 10 according to an embodiment of the present invention
5 is a perspective view of an implant package 30 according to an embodiment of the present invention
6 is a cross-sectional view of an implant package 30 according to an embodiment of the present invention
7 is a view showing an implant package 30 according to another embodiment of the present invention
Figure 8 is a flow chart of the implant providing step (S10) according to an embodiment of the present invention
9 is a view showing that plasma proceeds to the surface of the implant 31 in the reforming step (S7) according to an embodiment of the present invention.
10 is a diagram showing that plasma removes carbon (C) from the titanium surface
11 is a view showing that the initial stability due to osseointegration is increased according to the present invention
12 is a view comparing the height at which water is supported on the surface of a surface-treated implant and an untreated implant according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the implant surface modification method through plasma according to the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. Unless there is a special definition, all terms in this specification are the same as the general meaning of the term understood by a person skilled in the art to which the present invention belongs, and if it conflicts with the meaning of the terms used in this specification, Follow the definitions used in the specification.

Throughout the specification, when a part is said to "include" a certain element, this means that it does not exclude other elements unless otherwise stated, and may further include other elements, and the specification Terms such as “~unit” described herein mean a unit that processes at least one function or operation. In addition, when it is said that certain components are "connected", this is not limited to being in direct contact with each other and fastening, but includes fastening through other components, and even if they are not fastened, a predetermined force or energy can be transmitted. It can mean that it is arranged so that Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings.

2 is a flowchart of a method (S) for modifying the surface of an implant through plasma according to an embodiment of the present invention. The implant surface modification method (S) through plasma improves the initial stability of the implant by modifying the surface of the implant to be hydrophilic while the implant is wrapped and sealed, so that the bone and/or surrounding tissue easily adheres to the implant and shortens the bone union period. At the same time, it is possible to prevent the implant from being exposed to air and contaminated during the surface modification process of the implant. The implant surface modification method (S) through the plasma includes an implant providing step (S1), an air pressure lowering step (S3), a current applying step (S5), and a modifying step (S7).

Prior to the description of the implant surface modification method (S) through plasma below, referring to FIGS. 3 to 7, the plasma discharge equipment 10 and the implant package 30 used in the implant surface modification method (S) through plasma ) will be explained. The plasma discharge device 10 is provided to discharge plasma into the inner space and can accommodate the implant package 30 to modify the surface of the implant to be hydrophilic through plasma discharge inside. As shown in FIG. 3, the implant packaging body 30 is accommodated inside the plasma discharge equipment 10 during surface modification, and the surface of at least one implant can be modified to be hydrophilic within the plasma discharge equipment 10, Preferably, the implant may be provided into the plasma discharge device 10 while being packaged. The plasma discharge device 10 includes a housing 11, an inner space 12, a discharge electrode 13 and an air outlet 15.

Referring to FIGS. 3 and 4, the housing 11 constitutes the overall appearance of the plasma discharge device 10, and forms an opening on one side, and closes the opening by operating a button to close the opening to the inside. The space 12 may be provided to be sealed. The inner space 12 may be sealed by the housing 11 and function as a chamber in which plasma is discharged. The housing 11 preferably has a predetermined size so that the implant package 30 used for artificial joint procedures is accommodated therein.

The inner space 12 is defined as the inside of the plasma discharge device 10, and can function as a chamber blocked from the outside by being sealed by the housing 11. The implant packaging body 30 to be described later is accommodated in the inner space 12, and plasma is discharged by current in the inner space 12 to modify the surface of the implant to be hydrophilic. The air pressure of the inner space 12 can be lowered to close to vacuum by an air outlet 15 to be described later, and preferably, a pressure of around 3 torr can be maintained.

The discharge electrode 13 is provided so that a current can be applied inside the plasma discharge device 10 . The discharge electrode 13 is made of a conductor through which current can flow, and preferably has a metal plate having a predetermined width or a bent metal plate. In a preferred embodiment of the present invention, the implant package 30 is accommodated in the inner space 12, which corresponds to the plane of the implant package 30 or the area obtained by orthogonally projecting the implant package 30, or has a size larger than that. A discharge electrode having may be provided. When a current is applied to the discharge electrode 13 through an external power source, plasma can be discharged in the inner space 12 by functioning as an electrode. The discharge electrode 13 includes a first conductor 131 and a second conductor 133.

The first conductor 131 is provided to face the inner space 12 on one side of the inside of the plasma discharge device 10 . The second conductor 133 is provided so as to face the inner space 12 on the other side of the inside of the plasma discharge equipment 10. When current is applied, the first conductor 131 and the second conductor 133 function as an anode and a cathode, and the gas in the internal space under a predetermined pressure is ionized into plasma. The first conductor 131 and the second conductor 133 may be made of metal.

The plasma discharge may be DC glow discharge through direct current or AC or RF glow discharge through application of an AC voltage. In a preferred embodiment of the present invention, a high-voltage current is applied as an alternating current to the first conductor 131 and the second conductor 133 so that plasma can be discharged in the inner space 12 in a state close to vacuum.

The first conductor 131 may be provided to face and face the second conductor 133 . In one embodiment of the present invention, the first conductor 131 is provided while facing the bottom from the upper side of the inner space 12, and the second conductor 133 faces the first conductor 131 in the inner space 12 In another embodiment of the present invention, if the first conductor 131 is provided on one side of the side surface of the inner space 12, the second conductor 133 is the inner space 12 It may be provided while facing the inside on the opposite side surface of the. In another embodiment of the present invention, the first conductor 131 and the second conductor 133 may be provided so as not to face each other.

The first conductor 131 or the second conductor 133 may have a shape corresponding to an outer surface of the implant package 30 to be described later. In one embodiment of the present invention, as will be described later, when the implant package 30 is accommodated in the plasma discharge equipment 10, the implant 31 and the first package 33 surrounding the implant and through which plasma can pass This can be accommodated. The first conductor 131 or the second conductor 133 has a shape substantially complementary to the outer surface of the first package 33 so that the discharged plasma can efficiently proceed into the first package 33. can

The air outlet 15 is connected to the inner space 12 of the plasma discharge equipment to take out or supply air from the inner space 12 . The air outlet 15 is formed of a tube and is connected to the inner space 12 in fluid communication. The air outlet 15 draws gas from the inner space 12 to the outside or to a space separately from the inner space 12 through a vacuum pump, etc., so that the air pressure in the inner space 12 can be lowered close to vacuum. . Gas in the inner space 12 whose air pressure is lowered by the air outlet 15 can be ionized into plasma when current is applied to the first conductor 131 and the second conductor 133 .

Next, the implant package 30 accommodated in the plasma discharge device 10 of the present invention will be described with reference to FIGS. 5 to 7 . The implant packaging body 30 is provided in the plasma discharge equipment 10 and the surface of the implant can be modified to be hydrophilic by plasma discharged in the inner space 12 . The implant packaging body 30 may include at least one implant 31 , a fixing member 32 , a first package 33 and a second package 35 . In a preferred embodiment of the present invention, the implant package 30 accommodated in the plasma discharge equipment 10 is provided with the implant 31 accommodated therein so that the implant 31 is not contaminated by external contaminants. It can be.

The implant 31 is provided to the plasma discharge equipment 10 within the implant packaging body 30, and the surface of the implant 31 is modified by the implant surface modification method (S) through plasma according to the present invention. The implant 31 may be a dental implant or an implant used for an artificial joint. The implant may preferably have a titanium surface. Implant 31 may have a porous surface. At this time, the surface of the implant 31 may be modified without contacting the inner surface of the plasma discharge device 10 . As can be seen in FIG. 5, the implant 31 is housed in a first package 33, and contamination from external contaminants is prevented by allowing the first package 33 to surround the outside of the implant 31. can be prevented The implant 31 may be double wrapped by the second packaging 35.

The fixing member 32 may be provided to fix the implant 31 between the implant 31 and the first packaging 33 to be described later. The fixing member 32 may be composed of a plurality of elements, but as a single element connected to each other, the implant 31 is fixed between the implant 31 and the first package 33 that wraps the implant 31. You may. The fixing member 32 prevents movement or shaking of the implant 31 such as a filling material or a reinforcing material. A porous structure may be formed on at least a part of the surface of the implant 31, and as the implant 31 is shaken within the first pavement 33 or collides with the first pavement 33, a house is formed on the surface. or the porous structure may be damaged. The fixing member 32 can prevent damage to the implant 31 by fixing the implant 31 within the first package 33 .

The fixing member 32 may be formed while having a structure through which plasma can pass. As can be seen in FIGS. 6 and 7 , the fixing member 32 is formed as a set of a plurality of elements spaced apart from each other, so that plasma can flow into the space between the fixing members, and the fixing members can be provided with each other. Even if it is integrally formed, it may have air gaps and/or empty spaces so that plasma can communicate from the outside of the fixing member to the implant 31 inside. The structure through which the plasma formed in this way preferably faces the plasma transmission part 331 and allows the plasma introduced into the first package 33 through the plasma transmission part 331 to be described later to modify the implant surface. .

The first package 33 may be formed to surround the implant 31 . A first packaging 33 may be provided to prevent contamination of the implant 31 . The first package 33 may be provided into the plasma discharge device 10 while accommodating the implant 31 therein. After the surface of the implant 31 is modified, contamination of the implant by the first packaging 33 can be prevented. The first package 33 may include a plasma transmission part 331 and a plasma shielding part 333 .

The plasma transmission part 331 surrounds at least a portion of the implant 31 and is provided to configure the packaging of the implant 31 . The plasma transmission part 331 may be formed of a material through which plasma can pass. The plasma transmission part 331 may form the entirety of the first package 33 . In a preferred embodiment of the present invention, the plasma transmission part 331 may be formed of a flexible membrane. The plasma transmission unit 331 may be provided so that foreign substances such as germs and dust do not pass through the inside and outside of the implant package 30 while allowing air to pass therethrough. The plasma transmission unit 331 may be formed to prevent external moisture from entering the inside while discharging internal moisture to the outside. The plasma transmission part 331 may be provided with a moisture-permeable paper. Internal moisture may be released to the outside, and the discharged plasma may pass through the moisture-permeable paper and proceed toward the implant 31 . In another embodiment of the present invention, the plasma transmission part 331 may be provided on both sides of the implant instead of being provided in one direction. If the plasma transmission part 331 is provided on both sides of the implant 31, for example, the upper and lower sides, the plasma transmission part 331 may be provided to face the first conductor 131 and the second conductor 133, so that the plasma surface modification can be further promoted. In this case, the plasma generated by the ionization of air in the inner space 12 may progress to the inside of the implant package 31 through the plasma transmission unit 331 to modify the surface of the implant 31 .

The plasma shielding part 333 surrounds another part of the implant 31 and constitutes a packaging of the implant 31 . The plasma shielding unit 333 may be made of plastic through which plasma cannot pass, and preferably may be a blister package made of a polyethylene terephthalate (PET) or polyvinyl chloride (PVC) plastic material. The second packaging 333 is relatively hard compared to the first packaging 331 and may be provided to maintain the overall appearance of the first packaging 33 . As shown in FIG. 7 , the plasma shielding unit 333 may have an atypical shape or may have a shape substantially complementary to that of the implant 31 accommodated therein.

At least a portion of the plasma transmission unit 331 and the plasma shielding unit 333 may be detachable from each other. In a preferred embodiment of the present invention, the plasma transmission part 331 formed of a moisture-permeable paper is provided so that it can be removed from the plasma shielding part 333 formed of plastic, so that after surface modification of the implant, the implant 31 is first packaged ( 33) can be taken out from within.

The second package 35 may be formed to surround the first package 33 . A second wrapper 35 may be provided to prevent contamination of the implant 31 as in the case of the first wrapper 33 . In the operating room, it is important to prevent the patient's body from being contaminated. To this end, the first packaging 33 and the implant 31 may be provided in the operating room while being accommodated in the second packaging 35, and in the operating room, the second packaging ( 35) is removed, the first package 33 and the implant 31 may be provided to the plasma discharge device 10. In another embodiment of the present invention, the first package 33 and the second package 35 for packaging the implant 31 may also be provided to the plasma discharge device 10 together. The second package 35 may include a plasma transmission part 351 and a plasma shielding part 353 .

The plasma transmission part 351 surrounds at least a portion of the first package 33 and is provided to configure the outer packaging of the implant 31 . The plasma transmission unit 351 may be formed of a material through which plasma can pass. In a preferred embodiment of the present invention, the plasma transmission part 351 may be provided with a moisture-permeable paper. The plasma transmission part 351 may be configured to face the plasma transmission part 331 of the first package. In another embodiment of the present invention, the plasma transmission part 351 may be provided on both sides of the implant instead of being provided in one direction.

The plasma shielding part 353 surrounds another part of the first package 33 and constitutes an outer package of the implant 31 . The plasma shielding unit 353 may be made of plastic through which plasma cannot pass, and preferably may be a blister package made of a polyethylene terephthalate (PET) or polyvinyl chloride (PVC) plastic material. As in the case of the first package 33, at least a portion of the plasma transmission part 351 and the plasma shielding part 353 may be detachable from each other.

Referring back to FIG. 2, the implant providing step (S1) is a step of providing the implant package 30 in the plasma discharge equipment 10, and as described above, at least one implant 31 is a plasma discharge equipment ( 10) can be hydrophilic surface modification in In this case, the plasma transmission part 331 may be provided to face the first conductor 131 or the second conductor 133 in the inner space 12 . The plasma transmission part 331 is preferably provided in the inner space 12 so as to face upward in the implant providing step (S1) so that the discharged plasma can proceed into the first package 33 through the plasma transmission part 331. . In one embodiment of the present invention, the implant providing step (S1) is provided to allow plasma to pass through at least a portion of the implant package body 30 further including a first package 33 surrounding the implant 31. ) can be provided in the plasma discharge equipment 10. In addition, in the implant providing step (S1), the plasma transmission part 331 of the first package 33 may be provided to face the first conductor 131 or the second conductor 133 in the inner space of the plasma discharge equipment. .

Referring to FIG. 8, the implant providing step (S1) includes removing the second package from the implant package (S11) and providing the first package and the implant inside the plasma discharge device (S13) as described above. ), the surface of the implant 31 in the first package 33 can be modified after the second package 35 is removed. In another embodiment of the present invention, the second package 35 is provided in the plasma discharge equipment 10 together with the first package 33 and the implant 31 without going through the step of removing the second package (S11). You may.

The air pressure lowering step (S3) is a process of extracting air from the inner space 12 through the air outlet 15 connected to the inner space of the plasma discharge equipment 10, and the inner space 12 has an air pressure close to vacuum. Air is removed so as to facilitate the generation of plasma. In a preferred embodiment of the present invention, the air outlet 15 allows the inner space 12 to have a pressure of about 3 torr.

The current applying step (S5) is a process of generating plasma by applying a current to the plasma discharge equipment. By applying a current to the first conductor 131 and the second conductor 133, the gas in the inner space 12 in a near-vacuum state is ionized into plasma. DC glow discharge through direct current or AC or RF glow discharge through application of AC voltage may be performed. In a preferred embodiment of the present invention, high voltage current is applied to the first conductor 131 and the second conductor 133. Plasma can be discharged in the inner space 12 in a state close to vacuum by applying an alternating current.

The reforming step (S7) is a process in which the discharged plasma modifies the surface of the implant 31 to be hydrophilic. As shown in FIG. 9, the plasma formed by ionizing the gas in the inner space 12 flows between the first conductor 131 and the second conductor 133 by an electric field. Since plasma can pass through the plasma transmission part 331 , plasma can proceed to the inside of the first package 33 . In a preferred embodiment of the present invention, oxygen in the inner space 12 is ionized to generate plasma containing ozone. As shown in FIG. 10 , the surface of the implant can be modified to be hydrophilic by removing carbon from the titanium surface in the interior of the first package 33 . Furthermore, as can be seen in FIG. 9, the plasma shielding unit 333 is formed of a material through which plasma cannot pass, so that the surface of the implant can be further modified by the plasma returning after colliding with the plasma shielding unit 333. can

Accordingly, as shown in FIG. 11 , the initial stability of the implant can be secured by enabling bone and surrounding tissues growing around the implant to more quickly fuse with the implant.

Hereinafter, the effects of the present invention will be described in detail through examples. However, these examples are intended to illustrate one or more specific examples, and the scope of the invention is not limited to these examples.

The implant 31 having a machined titanium surface is supplied into the plasma discharge equipment 10 while being accommodated in the first package 33, and after the internal space 12 has a pressure of 3 torr, the current is applied for 120 seconds. was applied to modify the surface of the implant. The carbon content and the height at which water is supported on the implant surface of the implant surface-treated and the implant without surface treatment through the method (S) of implant surface modification through plasma were compared. The surface carbon content of the surface-treated implant and the non-surface-treated implant is shown in Table 1 below, and the height at which water is supported is shown in FIG. 12. As can be seen in Table 1 and FIG. 12, the carbon content of the surface was reduced by about 50%, and it was supported to a height of about 4 cm from the water surface.

Carbon Ratio (XPS) (%) Decreased Ratio(%) no surface treatment 32.28 - Surface treatment for 120 seconds 16.28 50%

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

S: Implant surface modification method through plasma
S1: Implant provision step S3: Air pressure drop step
S5: current application step S7: reforming step
10: plasma discharge equipment 11: housing
12: inner space 12, 13: discharge electrode
131: first conductor 133: second conductor
15: air outlet
30: implant packaging body 31: implant
32: fixing member 33: first packaging
331: plasma transmission unit 333: plasma shielding unit
35: second packaging 351: plasma transmission part
353: plasma shield

Claims (17)

An implant providing step of providing an implant packaging body in a plasma discharge equipment provided to have a first conductor and a second conductor in the inner space and to discharge plasma in the inner space,
A current applying step of generating plasma by applying a current to the plasma discharge equipment, and
A reforming step in which the discharged plasma modifies the surface of the implant to be hydrophilic,
The implant package includes at least one implant, at least a portion of which is provided to allow plasma to pass through, a first package surrounding the implant, and a second package surrounding the first package outside the first package, The second package includes a plasma transmission part provided to allow plasma to pass through and a plasma shielding part through which plasma cannot pass through,
Implant surface modification method through plasma, characterized in that the surface of the implant is modified without contact with the inner surface of the plasma discharge equipment. delete The method of claim 1, wherein the step of providing the implant comprises providing a plasma-transmitting portion through which plasma formed in the first packaging faces the first conductor or the second conductor in the inner space of the plasma discharge equipment. Implant surface modification method through plasma. delete The method of claim 1, wherein the step of providing the implant comprises removing the second package from the implant package, and providing the first package and the implant therein into a plasma discharge device. Surface modification method. The method of claim 1, wherein the step of providing the implant provides the second package, the first package, and the implant into a plasma discharge device. The method of claim 1, wherein the method of modifying the surface of the implant through plasma further comprises an air pressure lowering step of extracting air from the inner space through an air outlet connected to the inner space of the plasma discharge device before the current applying step,
In the reforming step, oxygen in the inner space is ionized and plasma containing ozone modifies the surface of the implant made of titanium to be hydrophilic. An implant whose surface is hydrophilically modified by the method of any one of claims 1, 3, and 5 to 7. delete At least one implant accommodated inside, a first package surrounding the implant and closing the inside, and a second package surrounding the first package from the outside of the first package and closing the inside,
The first package includes a plasma transmission part surrounding at least a part of the implant and provided to allow plasma to pass through, and a plasma shielding part surrounding at least another part of the implant and preventing plasma from passing through. implant packaging. 11. The method of claim 10, wherein the implant packaging body further comprises a fixing member for fixing the implant in the first packaging, the fixing member has a structure through which plasma can pass,
The structure through which the plasma can pass faces the plasma transmission part so that the plasma can proceed from the outside of the first package to the surface of the implant. 11. The implant package according to claim 10, wherein the plasma transmission part is formed of a flexible membrane, and the plasma shielding part is made of plastic. [Claim 13] The implant package according to claim 12, wherein at least a portion of the plasma transmission part and the plasma shielding part are detachably provided from each other. At least one implant accommodated inside, at least a portion of which is provided to allow plasma to pass through, a first package surrounding the implant and blocking the inside, and a first package surrounding the first package from the outside of the first package and closing the inside Including a second package;
At least a part of the second packaging is provided so that plasma can pass through,
The implant characterized in that it comprises a plasma transmission part surrounding at least a part of the first package and formed to allow plasma to pass through, and a plasma shielding part surrounding at least another part of the first package and preventing plasma from passing therethrough. package. The implant package according to any one of claims 10 to 14,
A packaged implant surface modification system comprising a plasma discharge device for accommodating the implant package in an inner space and discharging plasma into the inner space to modify the surface of the implant in the implant package. The method of claim 15, wherein the plasma discharge device is connected to the first conductor provided to face the inner space on one side of the inside, the second conductor provided to face the inner space on the other side, and the inner space Including an air outlet provided to extract air from,
The packaged implant surface modification system, characterized in that the plasma is generated in the inner space by applying a current to the first conductor and the second conductor. [Claim 17] The method of claim 16, wherein the implant packaging body is accommodated so that the plasma transmission part faces the first conductor or the second conductor so that the plasma generated in the internal space proceeds into the implant packaging body. system.

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