KR102558421B1 - Transfer hand and substrate processing apparatus - Google Patents

Abstract

The present invention provides a conveying hand for conveying a substrate. The transfer hand includes a body on which the substrate is seated; a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and a ground pattern disposed between the body and the contact pad and electrically connected to the contact pad.

Description

Transfer hand and substrate processing device {TRANSFER HAND AND SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a transfer hand and a substrate processing apparatus.

Various processes such as a photolithography process, an etching process, an ashing process, a thin film deposition process, and a cleaning process are performed to manufacture a semiconductor device or a flat panel display panel. Among these processes, the photolithography process is a process in which a photoresist is supplied to a semiconductor substrate to form a coated film on the surface of the substrate, exposure treatment is performed on the formed coated film using a mask, and then a developer is supplied to obtain a desired pattern on the substrate. These processes are performed in each of the process chambers, and the substrate processing apparatus has a transfer robot that transfers the substrate to each of the process chambers.

1 is a view showing a state in which a substrate is seated in a transfer hand of a general transfer robot. Referring to FIG. 1 , a seating pad 4 is installed on the upper surface of the transfer hand 2 , and the seating pad 4 supports the lower surface of the substrate W. The conveying hand 2 is made of a ceramic material, and the seating pad 4 is made of a silicon carbide (SiC) material. In the process of processing the substrate W, frictional charges E may be charged due to friction with the treatment liquid supplied to the substrate W. However, the general transfer hand 2 cannot form a path through which the frictional charge E charged on the substrate W can be discharged to the outside. Accordingly, when the transfer hand 2 holds the substrate W charged with the frictional charge E, the frictional charge E charged on the substrate W may cause an arcing phenomenon, which may damage the pattern formed on the substrate W.

An object of the present invention is to provide a conveying hand and a substrate processing apparatus capable of efficiently conveying a substrate.

In addition, an object of the present invention is to provide a conveying hand and a substrate processing apparatus capable of minimizing the occurrence of an arcing phenomenon on a substrate when the conveying hand conveys the substrate.

In addition, an object of the present invention is to provide a transfer hand and a substrate processing apparatus capable of discharging charges charged on a substrate to the outside.

In addition, an object of the present invention is to provide a transfer hand and a substrate processing apparatus capable of minimizing damage to a substrate due to rapid discharge when discharging charges charged on a substrate to the outside.

The problem to be solved by the present invention is not limited to the above-mentioned problems, and problems not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

The present invention provides a conveying hand for conveying a substrate. The transfer hand includes a body on which the substrate is seated; a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and a ground pattern disposed between the body and the contact pad and electrically connected to the contact pad.

According to an embodiment, the lower surface of the contact pad may include a second region inserted into the groove; and a first region contacting the ground pattern.

According to an embodiment, the lower surface of the contact pad may be stepped because the heights of the first region and the second region are different from each other.

According to an embodiment, the ground pattern may include a contact portion having a shape surrounding the groove when viewed from above and contacting the contact pad; and a ground path part extending from the contact part to form a ground path.

According to an embodiment, the ground pattern may further include at least one fixing part extending from the contact part to increase a fixing force of the contact part with respect to the body.

According to an embodiment, the contact part may have a ring shape when viewed from above, and the fixing part may have a protrusion shape and be spaced apart from each other along a circumferential direction of the contact part.

According to one embodiment, the conveying hand may further include a coating portion covering at least a portion of the ground pattern.

According to an embodiment, the coating part may cover the contact part and the ground path part among the contact part, the ground path part, and the fixing part.

According to an embodiment, the transfer hand is provided in the body and further includes a vacuum line for vacuum suction of the lower surface of the substrate seated on the body,

According to an embodiment, a vacuum hole connected to the vacuum line may be formed in the contact pad.

According to an embodiment, the ground pattern may be provided with a material whose resistance is smaller than that of the contact pad.

According to one embodiment, the body may be provided with a material containing ceramic, and the ground pattern may be provided with a material containing metal.

In addition, the present invention provides an apparatus for processing a substrate. A substrate processing apparatus includes a process chamber in which a process of processing a substrate is performed; and a conveying hand for conveying a substrate carried in or out of the process chamber, wherein the conveying hand includes: a body on which the substrate is seated; a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and a ground pattern provided on an upper surface of the body and electrically connected to the contact pad.

According to an embodiment, the ground pattern may include a contact portion having a shape surrounding the groove when viewed from above and contacting the contact pad; and a ground path part extending from the contact part to form a ground path.

According to an embodiment, the ground pattern may further include a plurality of fixing parts extending from the contact part to increase a fixing force of the contact part with respect to the body.

According to an embodiment, the contact part may have a ring shape when viewed from above, and the fixing part may have a protrusion shape and be spaced apart from each other along a circumferential direction of the contact part.

According to an embodiment, the lower surface of the contact pad may include a second region inserted into the groove; and a first region having a height different from that of the second region and contacting the ground pattern.

According to an embodiment, the conveying hand may further include a coating part covering the contact part and the ground path part among the contact part, the ground path part, and the fixing part.

In addition, the present invention provides an apparatus for processing a substrate. A substrate processing apparatus includes an index module having a load pod in which a container in which a substrate is stored is seated; A processing module receiving the substrate stored in the container and performing a substrate processing process; and an interface module connecting the processing module to an exposure apparatus, wherein the index module and the interface module each include an index robot having a transfer hand and an interface robot, wherein the transfer hand includes: a body on which a substrate is seated; a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and a ground pattern disposed between the body and the contact pad and electrically connected to the contact pad.

According to an embodiment, the lower surface of the contact pad may include a second region inserted into the groove; and a first area contacting the ground pattern, wherein the ground pattern includes: a contact portion contacting the first area and having a ring shape when viewed from above; a ground path portion extending from the contact portion to form a ground path; and a plurality of fixing parts extending from the contact part to increase fixing force of the contact part.

According to one embodiment, the fixing parts may have a protruding shape and may be spaced apart from each other along a circumferential direction of the contact part.

According to one embodiment of the present invention, the substrate can be efficiently conveyed.

In addition, according to an embodiment of the present invention, it is possible to minimize the occurrence of an arcing phenomenon on the substrate when the transfer hand transfers the substrate.

In addition, according to an embodiment of the present invention, the electric charge charged on the substrate can be discharged to the outside.

In addition, according to an embodiment of the present invention, when discharging charges charged on the substrate to the outside, it is possible to minimize damage to the substrate due to rapid discharge.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a view showing a state in which a substrate is seated in a transfer hand of a general transfer robot.
2 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view of the substrate processing apparatus showing the application block or developing block of FIG. 2 .
FIG. 4 is a plan view of the substrate processing apparatus of FIG. 2 .
FIG. 5 is a view showing an example of a hand provided in the transfer chamber of FIG. 4 .
FIG. 6 is a plan view schematically showing an example of the heat treatment chamber of FIG. 4 .
7 is a front view of the thermal treatment chamber of FIG. 6;
FIG. 8 is a diagram schematically showing an example of the liquid processing chamber of FIG. 4 .
9 is a plan view of the liquid processing chamber of FIG. 8 .
10 is a perspective view showing an appearance of a conveying hand according to an embodiment of the present invention.
Fig. 11 is a plan view of the conveying hand of Fig. 10;
FIG. 12 is a view showing the ground pattern of FIG. 10 .
FIG. 13 is a view showing the contact pad of FIG. 10 .
14 is a cross-sectional view showing a state in which a substrate is seated in the transfer hand of FIG. 10 .
FIG. 15 is a view showing how charges charged on a substrate seated in the transfer hand of FIG. 10 are discharged.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

'Including' a certain component means that other components may be further included, rather than excluding other components unless otherwise stated. Specifically, the terms "comprise" or "have" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but it should be understood that the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof is not excluded in advance.

Singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described in detail. 2 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 3 is a cross-sectional view of the substrate processing apparatus showing an application block or developing block of FIG. 2, and FIG. 4 is a plan view of the substrate processing apparatus of FIG. 2.

2 to 4, the substrate processing apparatus 10 according to an embodiment of the present invention includes an index module 100, a treating module 300, and an interface module 500. An interface module. According to one embodiment, the index module 100, the processing module 300, and the interface module 500 are sequentially arranged in a line. Hereinafter, the direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is referred to as a first direction 12, and a direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as a third direction 16.

The index module 100 transports the substrate W from the container F containing the substrate W to the processing module 300 and stores the processed substrate W into the container F. The longitudinal direction of the index module 100 is provided in the second direction 14 . The index module 100 has a load port 110 and an index frame 130 . Based on the index frame 130, the load port 110 is located on the opposite side of the processing module 300. The container F in which the substrates W are stored is placed in the load port 110 . A plurality of load ports 110 may be provided, and the plurality of load ports 110 may be disposed along the second direction 14 .

As the container F, an airtight container F such as a Front Open Unified Pod (FOUP) may be used. The container F may be placed in the load port 110 by an operator or a transportation means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle.

An index robot 132 is provided inside the index frame 130 . A guide rail 136 having a longitudinal direction in the second direction 14 is provided within the index frame 130 , and the index robot 132 may be provided to be movable on the guide rail 136 . The index robot 132 includes a hand on which the substrate W is placed, and the hand can move forward and backward, rotate about the third direction 16 as an axis, and move along the third direction 16 .

The processing module 300 may perform a coating process and a developing process on the substrate (W). The processing module 300 may receive the substrate W stored in the container F and perform a substrate processing process. The processing module 300 has an application block 300a and a developing block 300b. The coating block 300a performs a coating process on the substrate W, and the developing block 300b performs a developing process on the substrate W. A plurality of application blocks 300a are provided, and they are provided to be stacked on each other. A plurality of developing blocks 300b are provided, and the developing blocks 300b are provided stacked on top of each other. According to the embodiment of FIG. 2 , two application blocks 300a are provided and two developing blocks 300b are provided. The application blocks 300a may be disposed below the developing blocks 300b. According to one example, the two application blocks 300a may perform the same process and may be provided with the same structure. Also, the two developing blocks 300b may perform the same process and have the same structure.

Referring to FIG. 4 , the application block 300a has a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 performs a heat treatment process on the substrate (W). The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 360 supplies liquid to the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The transfer chamber 350 transfers the substrate W between the heat processing chamber 320 and the liquid processing chamber 360 within the coating block 300a.

The conveyance chamber 350 is provided with its longitudinal direction parallel to the first direction 12 . A transfer robot 352 is provided in the transfer chamber 350 . The transfer robot 352 transfers substrates between the thermal processing chamber 320 , the liquid processing chamber 360 , and the buffer chambers 312 and 316 . According to one example, the transfer robot 352 has a hand 354 on which the substrate W is placed, and the hand 354 can move forward and backward, rotate about an axis in the third direction 16, and move along the third direction 16. A guide rail 356 whose longitudinal direction is parallel to the first direction 12 is provided in the transfer chamber 350 , and the transfer robot 352 can be provided to be movable on the guide rail 356 .

FIG. 5 is a view showing an example of a hand provided in the transfer chamber of FIG. 4 . Referring to FIG. 5 , a hand 354 has a base 3541 and a support protrusion 3543 . The base 3541 may have an annular ring shape in which a part of the circumference is bent. The base 3541 has an inner diameter larger than the diameter of the substrate W. The support protrusion 3543 extends from the base 3541 inwardly. A plurality of support protrusions 3543 are provided and support the edge area of the substrate W. According to an example, four support protrusions 3543 may be provided at equal intervals.

A plurality of heat treatment chambers 320 are provided. The thermal treatment chambers 320 are arranged in series along the first direction 12 . Heat treatment chambers 320 are located on one side of the transfer chamber 350 .

FIG. 6 is a plan view schematically illustrating an example of the heat treatment chamber of FIG. 4 , and FIG. 7 is a front view of the heat treatment chamber of FIG. 6 . Referring to FIGS. 6 and 7 , the heat treatment chamber 320 includes a housing 3210, a cooling unit 3220, a heating unit 3230, and a transfer plate 3240.

The housing 3210 is generally provided in the shape of a rectangular parallelepiped. An entrance (not shown) through which the substrate W is taken in and out is formed on the sidewall of the housing 3210 . The intake port may remain open. A door (not shown) may be provided to selectively open and close the carry-in port. A cooling unit 3220 , a heating unit 3230 , and a transfer plate 3240 are provided within a housing 3210 . A cooling unit 3220 and a heating unit 3230 are provided side by side along the second direction 14 . According to one example, the cooling unit 3220 may be located closer to the transfer chamber 350 than the heating unit 3230 .

The cooling unit 3220 has a cooling plate 3222. The cooling plate 3222 may have a substantially circular shape when viewed from above. The cooling plate 3222 is provided with a cooling member 3224. According to an example, the cooling member 3224 is formed inside the cooling plate 3222 and may be provided as a passage through which cooling fluid flows.

The heating unit 3230 has a heating plate 3232, a cover 3234, and a heater 3233. The heating plate 3232 has a substantially circular shape when viewed from above. The heating plate 3232 has a larger diameter than the substrate W. A heater 3233 is installed on the heating plate 3232. The heater 3233 may be provided as a heating resistor to which current is applied. The heating plate 3232 is provided with lift pins 3238 that can be driven vertically along the third direction 16 . The lift pins 3238 receive the substrate W from a conveyance means outside the heating unit 3230 and put it down on the heating plate 3232 or lift the substrate W from the heating plate 3232 and hand it over to the conveyance means outside the heating unit 3230. According to one example, three lift pins 3238 may be provided. The cover 3234 has an open bottom space therein. The cover 3234 is positioned on top of the heating plate 3232 and is moved up and down by an actuator 3236. When the cover 3234 is moved, the space formed by the cover 3234 and the heating plate 3232 serves as a heating space for heating the substrate W.

The transfer plate 3240 is generally provided in a disk shape and has a diameter corresponding to that of the substrate W. A notch 3244 is formed at an edge of the conveying plate 3240 . The notch 3244 may have a shape corresponding to the protrusion 3543 formed on the hand 354 of the transfer robot 352 described above. In addition, the notch 3244 is provided in a number corresponding to the protrusion 3543 formed on the hand 354 and is formed at a position corresponding to the protrusion 3543 . When the vertical position of the hand 354 and the transfer plate 3240 is changed at a position where the hand 354 and the transfer plate 3240 are vertically aligned, the substrate W is transferred between the hand 354 and the transfer plate 3240. The transport plate 3240 is mounted on the guide rail 3249 and can be moved between the first area 3212 and the second area 3214 along the guide rail 3249 by the driver 3246 . A plurality of slit-shaped guide grooves 3242 are provided in the transport plate 3240 . The guide groove 3242 extends from the end of the transport plate 3240 to the inside of the transport plate 3240 . The guide grooves 3242 are provided along the second direction 14 in their longitudinal direction, and the guide grooves 3242 are spaced apart from each other along the first direction 12 . The guide groove 3242 prevents the transfer plate 3240 and the lift pins 3238 from interfering with each other when the transfer of the substrate W is performed between the transfer plate 3240 and the heating unit 3230 .

Cooling of the substrate W is performed in a state where the transfer plate 3240 on which the substrate W is placed is in contact with the cooling plate 3222 . The carrier plate 3240 is made of a material with high thermal conductivity so that heat can be easily transferred between the cooling plate 3222 and the substrate W. According to one example, the transport plate 3240 may be made of a metal material.

The heating unit 3230 provided in some of the heat treatment chambers 320 may improve the adhesion rate of the photoresist to the substrate W by supplying gas while the substrate W is heated. According to one example, the gas may be hexamethyldisilane gas.

A plurality of liquid processing chambers 360 are provided. Some of the liquid processing chambers 360 may be stacked on top of each other. The liquid processing chambers 360 are disposed on one side of the transfer chamber 350 . The liquid processing chambers 360 are arranged side by side along the first direction 12 . Some of the liquid processing chambers 360 are provided adjacent to the index module 100 . Hereinafter, these liquid processing chambers 360 are referred to as front liquid treating chambers 362 (front liquid treating chambers). Other portions of the liquid processing chambers 360 are provided adjacent to the interface module 500 . Hereinafter, these liquid processing chambers 360 are referred to as rear heat treating chambers 364 .

The previous liquid processing chamber 362 applies the first liquid on the substrate W, and the subsequent liquid processing chamber 364 applies the second liquid on the substrate W. The first liquid and the second liquid may be different types of liquids. According to an embodiment, the first liquid is an antireflection film, and the second liquid is a photoresist. The photoresist may be applied on the substrate W coated with the anti-reflection film. Optionally, the first liquid may be a photoresist and the second liquid may be an antireflection film. In this case, the anti-reflection film may be applied on the substrate W to which the photoresist is applied. Optionally, the first liquid and the second liquid are the same type of liquid, and they may both be photoresists.

FIG. 8 is a diagram schematically illustrating an example of the liquid processing chamber of FIG. 4 , and FIG. 9 is a plan view of the liquid processing chamber of FIG. 8 . Referring to FIGS. 8 and 9 , the substrate processing apparatus 1000 processing the substrate W may be provided in the liquid processing chamber 360 . The substrate processing apparatus 1000 performing liquid processing on the substrate W may be provided in the liquid processing chamber 360 .

The substrate processing apparatus 1000 provided in the liquid processing chamber 360 may include a housing 1100, a processing container 1200, a support unit 1300, an air supply unit 1400, a liquid supply unit 1500, and a controller 1900.

The housing 1100 may have an interior space 1102 . The housing 1100 may be provided in a rectangular cylindrical shape having an inner space 1102 . An opening (not shown) may be formed on one side of the housing 1100 . The opening may function as an entrance through which the substrate W is carried into the inner space 1102 or taken out of the inner space 1102 . In addition, in order to selectively seal the opening, a door (not shown) may be installed in an area adjacent to the opening. The door may close the opening to seal the inner space 1102 while the substrate W brought into the inner space 1102 is being processed.

The processing vessel 1200 may be disposed in the interior space 1102 . The processing vessel 1200 may have a processing space 1202 . That is, the processing vessel 1200 may be a bowl having a processing space 1202 . Accordingly, the inner space 1102 may be provided to surround the processing space 1202 . The processing vessel 1200 may have a cup shape with an open top. The processing space 1202 of the processing container 1200 may be a space in which a support unit 1300 to be described later supports and rotates the substrate W. The treatment space 1202 may be a space in which the liquid supply unit 1500 and the wet unit 1600 respectively supply a treatment medium to process the substrate W.

The processing vessel 1200 may include an inner cup 1210 and an outer cup 1230 . The outer cup 1230 is provided to surround the support unit 1300 , and the inner cup 1210 may be positioned inside the outer cup 1230 . Each of the inner cup 1210 and the outer cup 1230 may have an annular ring shape when viewed from above. A space between the inner cup 1210 and the outer cup 1230 may function as a recovery path through which the treatment medium introduced into the treatment space 1202 is recovered.

When viewed from above, the inner cup 1230 may be provided in a shape that surrounds a rotation shaft 1330 of the support unit 1300 to be described later. For example, the inner cup 1230 may be provided in a circular plate shape surrounding the rotating shaft 1330 when viewed from above. When viewed from above, the inner cup 1230 may be positioned to overlap the exhaust port 1120 coupled to the housing 1100 . The inner cup 1230 may have an inner portion and an outer portion. Upper surfaces of each of the inner and outer parts may be provided to have different angles with respect to a virtual horizontal line. For example, when viewed from above, the inner portion may be positioned to overlap the support plate 1310 of the support unit 1300 to be described later. The inner portion may be positioned facing the axis of rotation 1330 . The upper surface of the inner portion faces an upwardly inclined direction as the distance from the abductor axis 1330 increases, and the outer portion may extend outward from the inner portion. The upper surface of the outer portion may be inclined downward as the distance from the rotation axis 1330 increases. An upper end of the inner portion may coincide with a side end of the substrate W in a vertical direction. According to one example, a point where the outer part and the inner part meet may be at a position lower than an upper end of the inner part. A point where the inner portion and the outer portion meet each other may be provided to be rounded. The outer portion may be combined with the outer cup 1230 to form a recovery path through which a treatment medium such as a treatment liquid or a wet medium is recovered.

The outer cup 1230 may be provided in a cup shape surrounding the support unit 1300 and the inner cup 1210 . The outer cup 1230 may have a bottom portion 1232 , a side portion 1234 , and an inclined portion 1236 . The bottom portion 1232 may have a circular plate shape having a hollow. A recovery line 1238 may be connected to the bottom part 1232 . The recovery line 1238 may recover the processing medium supplied to the substrate W. Processed media recovered by the return line 1238 may be reused by an external recycling system. The side portion 1234 may have an annular ring shape surrounding the support unit 1300 . The side portion 1234 may extend from the side end of the bottom portion 1232 in a vertical direction. Side portion 1234 may extend upwardly from bottom portion 1232 .

The inclined portion 1236 may extend from the top of the side portion 1234 toward the central axis of the outer cup 1230. An inner surface of the inclined portion 1236 may be inclined upward to approach the support unit 1300 . The inclined portion 1236 may be provided to have a ring shape. During the processing of the substrate W, an upper end of the inclined portion 1236 may be positioned higher than the substrate W supported by the support unit 1300 .

The inner lifting member 1242 and the outer lifting member 1244 may move the inner cup 1210 and the outer cup 1230 up and down, respectively. The inner lifting member 1242 is coupled to the inner cup 1210, and the outer lifting member 1244 is coupled to the outer cup 1230 to lift and move the inner cup 1210 and the outer cup 1230, respectively.

The support unit 1300 may support and rotate the substrate W. The support unit 1300 may be a chuck that supports and rotates the substrate W. The support unit 1300 may include a support plate 1310 , a rotation shaft 1330 , and a rotation actuator 1350 . The support plate 1310 may have a seating surface on which the substrate W is seated. The support plate 1310 may have a circular shape when viewed from above. When viewed from the top, the supporting plate 1310 may have a diameter smaller than that of the substrate W. Adsorption holes (not shown) are formed in the support plate 1310 to chuck the substrate W using a vacuum adsorption method. Optionally, an electrostatic plate (not shown) is provided on the support plate 1310 to chuck the substrate W by an electrostatic adsorption method using static electricity. Optionally, support pins for supporting the substrate W may be provided on the support plate 1310 so that the support pins and the substrate W may physically contact each other to chuck the substrate W.

The rotation shaft 1330 may be coupled to the support plate 1310 . The rotating shaft 1330 may be coupled to the lower surface of the support plate 1310 . The rotation shaft 1330 may be provided so that its longitudinal direction is directed in a vertical direction. The rotation shaft 1330 may be rotated by receiving power from the rotation driver 1350 . Thus, the rotating shaft 1330 may rotate the support plate 1310 . The rotation actuator 1350 may vary the rotational speed of the rotation shaft 1330 . The rotation driver 1350 may be a motor that provides a driving force. However, it is not limited thereto, and the rotary driver 1350 may be variously modified as a known device providing a driving force.

The air flow supply unit 1400 may supply air flow to the inner space 1102 . The air flow supply unit 1400 may supply a descending air flow to the inner space 1102 . The airflow supply unit 1400 may supply airflow in which temperature and/or humidity are controlled to the interior space 1102 . The air flow supply unit 1400 may be installed in the housing 1100 . The air flow supply unit 1400 may be installed above the processing container 1200 and the support unit 1300 . The air flow supply unit 1400 may include a fan 1410 , an air flow supply line 1430 , and a filter 1450 . The air flow supply line 1430 may supply an external air flow in which temperature and/or humidity are controlled to the inner space 1102 . A filter 1450 is installed in the air flow supply line 1430 to remove impurities from external air flow flowing through the air flow supply line 1430 . In addition, when the fan 1410 is driven, the external air flow supplied by the air flow supply line 1430 may be uniformly transferred to the inner space 1102 .

The liquid supply unit 1500 may supply a treatment liquid to the substrate W supported by the support unit 1300 . The treatment liquid PR supplied to the substrate W by the liquid supply unit 1500 may be a coating liquid. For example, the coating liquid may be a photosensitive liquid such as photoresist. Also, the liquid supply unit 1500 may supply pre-wet liquid to the substrate W supported by the support unit 1300 . The pre-wet liquid TH supplied from the liquid supply unit 1500 to the substrate W may be a liquid capable of changing the surface properties of the substrate W. For example, the pre-wet liquid TH may be a thinner capable of changing the surface properties of the substrate W to have hydrophobic properties.

The liquid supply unit 1500 may include a pre-wet nozzle 1510, a treatment liquid nozzle 1530, an arm 1540, a guide rail 1550, and an actuator 1560.

The pre-wet nozzle 1510 may supply the above-described pre-wet liquid TH to the substrate W. The pre-wet nozzle 1510 may supply the pre-wet liquid TH to the substrate W in a stream manner. The treatment liquid nozzle 1530 may supply the above-described treatment liquid PR to the substrate W. The treatment liquid nozzle 1530 may be a coating liquid nozzle that supplies a coating liquid such as the photoresist described above. The treatment liquid nozzle 1530 may supply the treatment liquid PR to the substrate W in a stream manner.

The arm 1540 may support the pre-wet nozzle 1510 and the treatment liquid nozzle 1530 . A pre-wet nozzle 1510 and a treatment liquid nozzle 1530 may be installed at one end of the arm 1540 . A pre-wet nozzle 1510 and a treatment liquid nozzle 1530 may be respectively installed on one lower surface of the arm 1540 . When viewed from above, the pre-wet nozzle 1510 and the treatment liquid nozzle 1530 may be arranged in a direction parallel to the longitudinal direction of a guide rail 1550 to be described later. The other end of the arm 1540 may be coupled to the actuator 1560. The arm 1540 may be moved by an actuator 1560 that moves the arm 1540. Accordingly, the positions of the pre-wet nozzle 1510 installed on the arm 1540 and the treatment liquid nozzle 1530 may be changed. The moving direction of the arm 1540 may be guided along the guide rail 1550 on which the driver 1560 is installed. The guide rail 1550 may be provided so that its longitudinal direction is directed in a horizontal direction. For example, the guide rail 1550 may be provided so that its longitudinal direction faces a direction parallel to the first direction 12 . Optionally, the arm 1540 can be rotated by being coupled to a rotational axis whose longitudinal direction is directed in the third direction 16 . The rotating shaft may be rotated by an actuator. Accordingly, the positions of the pre-wet nozzle 1510 and the treatment liquid nozzle 1530 installed on the arm 1540 may be changed.

The controller 1900 may control the substrate processing apparatus 10 . For example, the controller 1900 may control the substrate processing apparatus 1000 provided in the liquid processing chamber 360 . The controller 1900 may control the substrate processing apparatus 1000 to perform a liquid processing process on the substrate W in the liquid processing chamber 360 . The controller 1900 may control the substrate processing apparatus 1000 to perform a coating process of forming a liquid film on the substrate W in the liquid processing chamber 360 .

Referring back to FIGS. 3 and 4 , a plurality of buffer chambers 312 and 316 are provided. Some of the buffer chambers 312 and 316 are disposed between the index module 100 and the transfer chamber 350 . Hereinafter, these buffer chambers are referred to as a front buffer 312 (front buffer). The front buffers 312 are provided in plural numbers and are stacked on top of each other in the vertical direction. Other portions of the buffer chambers 312 and 316 are disposed between the transfer chamber 350 and the interface module 500 below. These buffer chambers are referred to as rear buffers 316 . The rear buffers 316 are provided in plural numbers and are stacked on top of each other in the vertical direction. Each of the front buffers 312 and the rear buffers 316 temporarily stores a plurality of substrates (W). The substrates W stored in the shearing buffer 312 are carried in or out by the indexing robot 132 and the transfer robot 352 . The substrate W stored in the rear buffer 316 is carried in or out by the transfer robot 352 and the first robot 552 . Also, a front buffer robot 314 for transporting the substrate W between the front buffers 312 may be provided on one side of the front buffer 312 . In addition, a rear buffer robot 318 for transporting the substrate W between the rear buffers 316 may be provided on one side of the rear buffer 316 .

The developing block 300b has a heat treatment chamber 320, a transfer chamber 350, and a liquid treatment chamber 360. Since the heat treatment chamber 320 and the transfer chamber 350 of the developing block 300b have structures and arrangements substantially similar to those of the heat treatment chamber 320 and the transfer chamber 350 of the application block 300a, description thereof will be omitted.

In the developing block 300b, all of the liquid processing chambers 360 are provided as developing chambers 360 that develop a substrate by supplying a developing solution in the same way.

The interface module 500 connects the processing module 300 to an external exposure apparatus 700 . The interface module 500 includes an interface frame 510 , an additional process chamber 520 , an interface buffer 530 , and an interface robot 550 .

A fan filter unit forming a downdraft therein may be provided at the upper end of the interface frame 510 . The additional process chamber 520 , the interface buffer 530 , and the interface robot 550 are disposed inside the interface frame 510 . The additional process chamber 520 may perform a predetermined additional process before the substrate W, the process of which has been completed in the application block 300a, is carried into the exposure apparatus 700 . Optionally, the additional process chamber 520 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 700, is transferred to the developing block 300b. According to an example, the additional process may be an edge exposure process of exposing the edge area of the substrate W, an upper surface cleaning process of cleaning the upper surface of the substrate W, or a lower surface cleaning process of cleaning the lower surface of the substrate W. A plurality of additional process chambers 520 may be provided, and they may be stacked on top of each other. Additional process chambers 520 may all be provided to perform the same process. Optionally, some of the additional process chambers 520 may be provided to perform different processes.

The interface buffer 530 provides a space in which the substrate W transported between the coating block 300a, the additional process chamber 520, the exposure apparatus 700, and the developing block 300b temporarily stays during transport. A plurality of interface buffers 530 may be provided, and the plurality of interface buffers 530 may be stacked on top of each other.

According to an example, the additional process chamber 520 may be disposed on one side of the extension line of the transfer chamber 350 in the longitudinal direction, and the interface buffer 530 may be disposed on the other side.

The interface robot 550 transports the substrate W between the coating block 300a, the additional process chamber 520, the exposure apparatus 700, and the developing block 300b. The interface robot 550 may be provided as one or a plurality of robots. According to an example, the interface robot 550 includes a first robot 552 and a second robot 554 . The first robot 552 may transfer the substrate W between the application block 300a, the additional process chamber 520, and the interface buffer 530, the second robot 554 may transfer the substrate W between the interface buffer 530 and the exposure apparatus 700, and the second robot 4604 may transfer the substrate W between the interface buffer 530 and the developing block 300b.

The first robot 552 and the second robot 554 each include a hand on which the substrate W is placed, and the hand can move forward and backward, rotate about an axis parallel to the third direction 16, and move along the third direction 16.

The hands of the index robot 132 and the interface robot 550 may have the same shape as each other. Optionally, the hand of the index robot 132 and the interface robot 550 may have a different shape from the hand 354 of the transfer robot 352 . Optionally, hands of the index robot 132 , the first robot 552 , and the second robot 554 may have a different shape from the hand 354 of the transfer robot 352 .

Hereinafter, a transfer hand according to an embodiment of the present invention will be described. The transfer hand 2000 according to an embodiment of the present invention may be a hand possessed by the index robot 132 and/or the interface robot 550. However, it is not limited thereto, and the transfer hand 2000 may be a hand of the front buffer robot 314 and/or the rear buffer robot 318.

FIG. 10 is a perspective view showing a conveying hand according to an embodiment of the present invention, and FIG. 11 is a plan view of the conveying hand of FIG. 10 . Referring to FIGS. 10 and 11 , the transfer hand 2000 may transfer the substrate W. The transfer hand 2000 may support the substrate W. The transfer hand 2000 may support the substrate W in a vacuum suction method. The transfer hand 2000 may include a body 2100, a guide pin 2200, a ground pattern 2300, a contact pad 2500, and a vacuum line 2600.

The body 2100 may have a seating surface supporting the substrate (W). The body 2100 may be provided with a material that generally includes a dielectric. For example, the body 2100 may be made of a material including ceramic.

In addition, a guide pin groove 2110 into which the guide pin 2200 is inserted may be formed in the body 2100 . At least one guide pin groove 2110 may be formed in the body 2100 . For example, a plurality of guide pin grooves 2110 may be formed in the body 2100 . The guide pin grooves 2110 may be provided spaced apart from each other. For example, when viewed from above, the guide pin grooves 2110 may be spaced apart from each other along the circumferential direction of an imaginary circle (first circle). The imaginary circle (first circle) may be a circle concentric with the substrate W seated on the body 2100 . In addition, guide pins 2200 may be inserted into each of the guide pin grooves 2110 . Also, the guide pins 2200 may come into contact with the side of the substrate W seated on the body 2100 . Thus, the substrate W can be stably supported by the transfer hand 2000 .

In addition, a pad groove 2130 into which a contact pad 2500 described later is inserted may be formed in the body 2100 . The pad groove 2130 may be formed by being recessed in a downward direction from the upper surface of the body 2100 . The pad groove 2130 may have a circular shape when viewed from above. At least one pad groove 2130 may be provided. For example, a plurality of pad grooves 2130 may be provided. The pad grooves 2130 may be spaced apart from each other. For example, when viewed from above, the pad grooves 2130 may be spaced apart from each other along the circumferential direction of an imaginary circle (second circle). The imaginary circle (second circle) may be a circle concentric with the substrate W seated on the body 2100 . Also, the second circle may be a circle having concentricity with the above-described first circle. Also, the second circle may be a circle having a diameter smaller than that of the aforementioned first circle.

In addition, a coupling hole 2150 for coupling the transfer hand 2000 to the index robot 132 and/or the interface robot 550 may be formed in the body 2100 . At least one coupling hole 2150 may be formed. For example, a plurality of coupling holes 2150 may be provided. The coupling holes 2150 may be spaced apart from each other. For example, the coupling hole 2150 may be provided at a vertex of an imaginary quadrangle when viewed from above. Also, one of the coupling holes 2150 may overlap a hole 2332 of the ground pattern 2300 described later. Accordingly, one coupling means may be inserted into any one of the coupling holes 2150 and the hole 2332 of the ground pattern 2300, and thus, the body 2100 may be coupled to the index robot 132 and/or the interface robot 550. Also, the index robot 132 and/or the interface robot 550 may be grounded. In other words, the ground pattern 2300 may be grounded. Accordingly, the contact pad 2500 and the ground pattern 2300 may form a ground path through which frictional charges E, which will be described later, are discharged.

The ground pattern 2300 may be electrically connected to a contact pad 2500 to be described later to form a ground path. The ground pattern 2300 may be electrically connected to one of contact pads 2500 to be described later. Also, the ground pattern 2300 may be provided on an upper surface of the body 2100 . The ground pattern 2300 may be disposed between the body 2100 and a contact pad 2500 described later. The ground pattern 2300 may be provided with a conductive material. The ground pattern 2300 may be provided with a material including metal.

FIG. 12 is a view showing the ground pattern of FIG. 10 . Referring to FIG. 12 , a ground pattern 2300 may include a contact portion 2310 , a ground path portion 2330 , a fixing portion 2350 , and a coating portion 2370 . The contact portion 2310 may be a portion in contact with a contact pad 2500 to be described later. The contact portion 2310 may have a ring shape when viewed from the top. The contact portion 2310 may have a shape surrounding the pad groove 2130 when viewed from above. The contact portion 2310 may have a ring shape having a larger diameter than the pad groove 2130 when viewed from above. The contact portion 2310 may be made of a conductive material. The contact part 2310 may be provided with a material including metal.

The ground path portion 2330 may be a portion forming a ground path. The ground path portion 2330 may extend from the contact portion 2310 to form a ground path. One end of the ground path part 2330 may be connected to the contact part 2310 and the other end may be connected to the coupling hole 2150 . A hole 2332 overlapping the coupling hole 2150 when viewed from above may be formed at the other end of the ground path portion 2330 connected to the coupling hole 2150 . Also, when viewed from above, the thickness of the ground path portion 2330 may be greater than that of the contact portion 2310 . When the frictional charge E charged on the substrate W is rapidly discharged, damage may be applied to the pattern formed on the substrate W. According to an embodiment of the present invention, the thickness of the ground path portion 2330 is provided to increase the resistance value of the ground path portion 2330, thereby minimizing the rapid discharge of the frictional charge E.

Also, the coating portion 2370 may cover at least a portion of the ground pattern 2300 . The coating portion 2370 may prevent the ground pattern 2300 from being contaminated or the frictional charge E from being discharged through an unwanted path. In addition, the coating unit 2370 may allow the ground pattern 2300 to be properly attached to the upper surface of the body 2100 . The coating unit 2370 may be provided with a material including epoxy. In addition, the coating portion 2370 may cover the ground pattern 2300 except for the contact portion 2310 described above. For example, the coating portion 2370 may cover the ground path portion 2330 except for the contact portion 2310 . This is because the upper surface of the contact portion 2310 is in contact with the lower surface of the contact pattern 3500 to be described later. In this case, it may be difficult to properly attach the contact part 2310 to the upper surface of the body 2100 . Thus, the ground pattern 2300 according to an embodiment of the present invention may further include a fixing part 2350.

The fixing part 2350 may extend from the contact part 2310 . The fixing part 2350 may extend from the contact part 2310 to increase the fixing force of the contact part 2310 with respect to the body 2100 . For example, the fixing part 2350 may have a protruding shape extending from the contact part 2310 . Also, at least one fixing unit 2350 may be provided. For example, a plurality of fixing units 2350 may be provided. Also, the fixing part 2350 may have a protruding shape. Also, the coating part 2370 may cover the fixing part 2350 . In other words, the coating portion 2370 may cover the ground path portion 2330 and the fixing portion 2350 among the contact portion 2310 , the ground path portion 2330 , and the fixing portion 2350 . That is, the fixing part 2350 extends from the contact part 2310 and is fixed to the upper surface of the body 2100, so that the contact part 2310 can be properly fixed to the upper surface of the body 2100. In addition, since the coating part 2370 covers the fixing part 2350, as a result, the contact part 2310 can be properly attached to the upper surface of the body 2100.

FIG. 13 is a view showing the contact pad of FIG. 10 , and FIG. 14 is a cross-sectional view showing a state in which a substrate is seated in the transfer hand of FIG. 10 . Referring to FIGS. 13 and 14 , when viewed from the top, the contact pad 2500 may have a substantially circular shape. An upper surface of the contact pad 2500 may include a central area and an edge area. An edge area of the upper surface of the contact pad 2500 may have an upwardly inclined surface from an outside to a central area. In addition, a recessed groove 2530 recessed downward from the upper surface of the contact pad 2500 may be formed in a central region of the upper surface of the contact pad 2500 . In addition, a vacuum hole 2540 may be formed in the contact pad 2500 . The vacuum hole 2540 may be formed to extend from the recessed groove 2530 to the lower surface of the contact pad 2500 . Also, a vacuum line 2600 may be provided in the body 2100 . The vacuum line 2600 may vacuum the lower surface of the substrate W seated on the body 2100 . The vacuum line 2600 may vacuum the lower surface of the substrate W by applying pressure to the vacuum hole 2540 and the recessed groove 2530 .

A lower surface of the contact pad 2500 may include a central area and an edge area. When an edge region of the lower surface of the contact pad 2500 is referred to as a first region 2510 and a central region of the lower surface of the contact pad 2500 is referred to as a second region 2520, the first region 2510 and the second region may have different heights. That is, the lower surface of the contact pad 2500 may be stepped because the heights of the first region 2510 and the second region 2520 are different from each other. Also, the first region 2510 may contact the upper surface of the contact portion 2510 of the ground pattern 2500 described above. Accordingly, the contact pad 2500 may be electrically connected to the ground pattern 2500 . Also, the second region 2520 may be inserted into the pad groove 2130 described above. In addition, the lower surface of the contact pad 2500 may be adhered to the pad groove 2130 by an adhesive S. The adhesive S may be an epoxy adhesive containing epoxy.

The contact pad 2500 may be made of a conductive material. The contact pad 2500 may be provided with a material including PEEK. For example, contact pad 2500 can be PEEK ESD. Also, the resistance of the contact pad 2500 may be greater than that of the ground pattern 2300 . In other words, the ground pattern 2300 may be provided with a material whose resistance is smaller than that of the contact pad 2500 .

FIG. 15 is a view showing how charges charged on a substrate seated in the transfer hand of FIG. 10 are discharged. Referring to FIG. 15 , in the process of processing the substrate W, the frictional charge E charged on the substrate W can be discharged along a ground path formed by electrically connecting the contact pad 2500 and the ground pattern 2300 to each other. According to an embodiment of the present invention, the contact portion 2310 of the ground pattern 2300 is provided on the upper surface of the body 2100 instead of the pad groove 2130 . Accordingly, the diameter of the contact portion 2310 may be greater than that in the case where the ground pattern 2300 is provided in the pad groove 2130 . As the diameter of the contact portion 2310 increases, the contact area between the contact portion 2310 and the contact pad 2500 increases, and thus the efficiency of discharging the frictional charge E is further increased.

In addition, when the resistance of the contact pad 2500 is too small, the frictional charge E charged on the substrate W is rapidly discharged, and this rapid discharge may damage the pattern formed on the substrate W. However, according to an embodiment of the present invention, the resistance of the contact pad 2500 directly contacting the lower surface of the substrate W is greater than that of the ground pattern 2300 . That is, the contact pad 2500 that is in direct contact with the substrate W suppresses the frictional charge E from rapidly escaping, but when the frictional charge E reaches the ground pattern 2300 spaced apart from the substrate W, the frictional charge E is discharged at a relatively high speed, thereby maximizing the static elimination efficiency.

In the above example, it has been described that the ground pattern 2300 is electrically connected to one of the plurality of contact pads 2500 as an example, but is not limited thereto. For example, the ground pattern 2300 may be electrically connected to each of the plurality of contact pads 2500 .

In the above example, it has been described that one ground pattern 2300 is provided as an example, but is not limited thereto. For example, a plurality of ground patterns 2300 may be provided, and each of the plurality of ground patterns 2300 may be electrically connected to a plurality of contact pads 2500 and each other.

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

Bounce Hand: 2
Seating Pads: 4
Frictional Charge: E
Bounce Hand: 2000
Body: 2100
Guide pin groove: 2110
Pad Home: 2130
Combined Hall: 2150
Guide pin: 2200
Ground Pattern: 2300
Contact Part:2310
Ground Path Division: 2330
Hall: 2332
Fixed part: 2350
Coating Unit: 2370
Contact Pad: 2500
Area 1: 2510
Area 2: 2520
Glue: S
Indented Home: 2530
Vacuum Hall: 2540
Vacuum line: 2600

Claims (20)

In the conveying hand for conveying the substrate,
a body on which a substrate is seated;
a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and
a ground pattern disposed between the body and the contact pad and electrically connected to the contact pad; Including,
The lower surface of the contact pad includes a second region inserted into the groove and a first region in contact with the ground pattern;
The conveying hand where the ground pattern is disposed and brought into contact between the first region and the body. delete According to claim 1,
The lower surface of the contact pad,
The conveying hand is stepped because the heights of the first area and the second area are different from each other. According to claim 1,
The ground pattern,
When viewed from above, a contact portion having a shape surrounding the groove and contacting the contact pad; and
and a ground path portion extending from the contact portion to form a ground path. In the conveying hand for conveying the substrate,
a body on which a substrate is seated;
a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and
a ground pattern electrically connected to the contact pad; Including,
The ground pattern has a shape surrounding the groove when viewed from the top, and includes a contact portion that contacts the contact pad, a ground path portion that extends from the contact portion and forms a ground path, and at least one fixing portion that extends from the contact portion and increases a fixing force of the contact portion with respect to the body. According to claim 5,
The contact part,
It has a ring shape when viewed from the top,
The fixed part,
Conveying hands having a protruding shape and spaced apart from each other along the circumferential direction of the contact portion. According to claim 5,
The conveying hand,
The conveyance hand further comprising a coating portion covering at least a portion of the ground pattern. According to claim 7,
The coating part,
A transfer hand covering the contact portion and the ground path portion among the contact portion, the ground path portion, and the fixing portion. According to claim 1,
The conveying hand,
It is provided in the body and further includes a vacuum line for vacuum adsorbing the lower surface of the substrate seated on the body,
On the contact pad,
A transfer hand in which a vacuum hole connected to the vacuum line is formed. The method of any one of claims 1 and 3 to 9,
The ground pattern,
A conveyance hand provided with a material whose resistance is smaller than that of the contact pad. The method of any one of claims 1 and 3 to 9,
The body is provided with a material containing ceramic,
Wherein the ground pattern is provided with a material containing metal. In the apparatus for processing the substrate,
a process chamber in which a process of processing a substrate is performed;
A conveyance hand for conveying substrates carried in or out of the process chamber;
The conveying hand,
a body on which a substrate is seated;
a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and
a ground pattern provided on an upper surface of the body and electrically connected to the contact pad; Including,
The lower surface of the contact pad includes a second region inserted into the groove and a first region in contact with the ground pattern;
A substrate processing apparatus in which the ground pattern is disposed and brought into contact between the first region and the body. According to claim 12,
The ground pattern,
When viewed from above, a contact portion having a shape surrounding the groove and contacting the contact pad; and
A substrate processing apparatus comprising a ground path portion extending from the contact portion to form a ground path. According to claim 13,
The ground pattern,
A substrate processing apparatus further comprising a plurality of fixing parts extending from the contact part and increasing a fixing force of the contact part with respect to the body. According to claim 14,
The contact part,
It has a ring shape when viewed from the top,
The fixed part,
A substrate processing apparatus having a protruding shape and provided spaced apart from each other along the circumferential direction of the contact portion. According to claim 12,
The first area and the second area have different heights from each other. According to any one of claims 14 to 16,
The conveying hand,
The substrate processing apparatus further comprises a coating part covering the contact part and the ground path part among the contact part, the ground path part, and the fixing part. In the apparatus for processing the substrate,
an index module having a load pod in which a container containing a substrate is seated;
A processing module receiving the substrate stored in the container and performing a substrate processing process; and
An interface module connecting the processing module to an exposure device;
The index module and the interface module each include an index robot having a transfer hand and an interface robot,
The conveying hand,
a body on which a substrate is seated;
a contact pad inserted into a groove formed in the body and brought into contact with the lower surface of the substrate seated on the body; and
a ground pattern disposed between the body and the contact pad and electrically connected to the contact pad; Including,
The lower surface of the contact pad includes a second region inserted into the groove and a first region in contact with the ground pattern;
A substrate processing apparatus in which the ground pattern is disposed and brought into contact between the first region and the body. According to claim 18,
The ground pattern,
a contact portion contacting the first area and having a ring shape when viewed from above;
a ground path portion extending from the contact portion to form a ground path; and
a plurality of fixing parts extending from the contact part to increase the fixing force of the contact part; A substrate processing apparatus comprising a. According to claim 19,
The fixed part,
A substrate processing apparatus having a protruding shape and provided spaced apart from each other along the circumferential direction of the contact portion.

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