KR102556399B1 - High resistance adhesives using ionic compounds and products using them - Google Patents

High resistance adhesives using ionic compounds and products using them Download PDF

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KR102556399B1
KR102556399B1 KR1020160153671A KR20160153671A KR102556399B1 KR 102556399 B1 KR102556399 B1 KR 102556399B1 KR 1020160153671 A KR1020160153671 A KR 1020160153671A KR 20160153671 A KR20160153671 A KR 20160153671A KR 102556399 B1 KR102556399 B1 KR 102556399B1
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이종영
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(주)티엘머티리얼
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66Substances characterised by their function in the composition
    • C08L2666/84Flame-proofing or flame-retarding additives
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    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66Substances characterised by their function in the composition
    • C08L2666/86Antistatics

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Abstract

본 발명은 이온성화합물을 이용한 고저항 접착제 및 도료, 이를 응용한 제품에 관한 것으로, 보다 상세하게는 겨울철 습도가 낮은 환경이나 크린룸과 같은 습도가 낮은 환경에서는 전기를 사용하는 기기(제품)에서의 전기장이나 마찰력에 의하여 정전기가 발생하는 것을 개선시켜 주며, 고저항에 의한 전기장 감쇄, 항균, 방미, 난연성을 부여하여 괘적한 환경을 조성하는데 목적이 있다.
이를 위하여 본 발명에서는 주첨가제로 이온성화합물을 사용하고, 접착성을 부여하기 위하여 수용성 접착제 및 도료와 함께 혼합하여 제조하였다.
The present invention relates to high-resistance adhesives and paints using ionic compounds, and products to which they are applied, and more particularly, to devices (products) that use electricity in low-humidity environments such as winter or clean rooms. It improves the generation of static electricity by electric field or frictional force, and aims to create a pleasant environment by attenuating the electric field by high resistance and imparting antibacterial, anti-mildew, and flame retardancy.
To this end, in the present invention, an ionic compound was used as a main additive and mixed with a water-soluble adhesive and paint to impart adhesiveness.

Figure 112016112508301-pat00001
Figure 112016112508301-pat00001

Description

이온성화합물을 이용한 고저항 접착제 조성물 및 이를 응용한 제품{High resistance adhesives using ionic compounds and products using them}High resistance adhesive composition using ionic compounds and products applied thereto {High resistance adhesives using ionic compounds and products using them}

본 발명은 이온성화합물의 특성을 이용하여 대전방지 특성과 항균특성, 방미특성(항곰팡이), 난연특성을 부여하는데 목적이 있다.An object of the present invention is to impart antistatic properties, antibacterial properties, antifungal properties (antifungal), and flame retardant properties by using the properties of ionic compounds.

화학은 크게 물리화학, 유기화학, 무기화학, 분석화학 분야로 대별되어지지만, 20세기 후반부터 각 세부 분야의 학제간 연구와 응용이 넓어짐에 따라 경계가 많이 사라졌다. 21세기 들어서는 상기 분야에 고분자화학을 포함시켜 핵심영역(core area), 그리고 농업, 환경, 지구화학, 생명화학, 재료·나노화학 등의 학제간 영역(Mmultidisciplinary area) 등으로 나눈다. 여기서 이온성화합물은 유기화학에서 다루지 않는 화합물로써 무기화학에 속하며, 서로 반대되는 전하를 가진 이온들의 순차적인 배열로 구성된 화합물로, 이온들의 비율은 화합물이 전기적인 중성이 되도록 결합하지만, 이온적인 성질에 의하여 고유 저항과 항균특성, 방미특성, 난연특성을 가져 대전방지 기능과 대장균과 같은 세균이나 곰팡이 균주에 대한 항균 및 방미 기능과 발화시 소화작용에 의한 난연기능도 발휘하게끔 하는데 있다.Chemistry is broadly classified into physical chemistry, organic chemistry, inorganic chemistry, and analytical chemistry, but since the late 20th century, as interdisciplinary research and application in each specific field has expanded, the boundaries have largely disappeared. In the 21st century, polymer chemistry is included in the above fields to be divided into core areas and multidisciplinary areas such as agriculture, environment, geochemistry, biochemistry, and material/nanochemistry. Here, ionic compounds belong to inorganic chemistry as compounds not dealt with in organic chemistry, and are compounds composed of sequential arrangements of ions having opposite charges. It has inherent resistance, antibacterial properties, antimicrobial properties, and flame retardant properties, so that antistatic function, antibacterial and antimicrobial functions against bacteria or mold strains such as Escherichia coli, and flame retardant function by digestion during ignition are also exhibited.

본 발명의 주제인 이온성화합물은 정전기력에 의해 서로 반대되는 전하를 가진 이온들이 이온결합을 통해 구성된 화합물로, 이 화합물은 전기적으로 중성이 되도록 결합하고 있다. 이 화합물에 H2O가 들어가면 양이온과 음이온으로 용해되어 해리된다. An ionic compound, which is a subject of the present invention, is a compound composed of ions having opposite charges by electrostatic force through ionic bonding, and the compound is electrically neutral. When H 2 O enters this compound, it dissolves and dissociates into cations and anions.

상기와 같은 원리에 의해, 대전방지 기능과 항균, 방미, 난연기능을 복합적으로 발휘하게 된다.According to the above principle, antistatic function, antibacterial, anti-mildew, and flame retardant functions are exhibited in a complex manner.

발명의 배경이 되는 기술로는 먼저 수용성 접착제는 접착성과 작업성을 높이는데 주안점을 두고 있었으나, 접착제와 같은 고분자물질은 대부분 절연재료로서 각종 건축, 전기·전자 부품에 널리 사용되고 있으나, 이러한 절연특성은 플라스틱 표면에 정전기를 축적하여 대전현상을 유발하게 된다. 이 대전현상은 먼지나 오물을 흡착하여 산업분야의 생산 장해 및 재해로도 이어질 수 있다. 이러한 플라스틱의 대전현상을 방지하기 위한 기존 기술에는 도전성 filler나 대전방지제, 계면활성제, 전도성고분자를 첨가하고 있으나, 절연체인 플라스틱에서의 정전기 장해를 극복하는 여러가지 방법중에서 계면활성제 및 전도성고분자를 이용하는 방법이 가장 효율적이라고 알려져 왔다. 그러나 종전 상업화되어진 제품중에서 표면저항이 높아 대전방지 성능이 현저히 떨어지거나, 범용화하기엔 첨가제의 가격이 비싼 단점을 안고 있는 실정이다. 표 1에 표면저항에 따른 적용 가능한 분야를 나타내었다.As the technology behind the invention, first, water-soluble adhesives focused on improving adhesion and workability, but polymeric substances such as adhesives are mostly insulating materials and are widely used in various construction and electrical/electronic parts. Static electricity accumulates on the plastic surface, causing an electrification phenomenon. This electrification phenomenon adsorbs dust or dirt and can lead to production failure and disasters in the industrial field. Conventional technologies for preventing electrification of plastics include adding conductive fillers, antistatic agents, surfactants, and conductive polymers. known to be the most efficient. However, among the products commercialized in the past, surface resistance is high, and antistatic performance is remarkably deteriorated, or the price of additives is high for general use. Table 1 shows applicable fields according to surface resistance.

표면저항surface resistance 현상phenomenon 특성 및 응용분야Characteristics and Applications >1013 >10 13 전하 축적됨charge accumulated 절연Isolation 1013 ~ 1012 10 13 ~ 10 12 대전함battleship 정적 상태에서의 장해방지Prevention of interference in static state 1012 ~ 1010 10 12 ~ 10 10 대전하지만 감쇄charged but attenuated 동적 상태에서의 잔해방지Debris protection in dynamic conditions 1010 ~ 108 10 10 ~ 10 8 거의 대전하지 않음hardly ever fight 대전방지I(대전방지 성능있음)Antistatic I (with antistatic performance) 108 ~ 105 10 8 to 10 5 거의 대전하지 않음hardly ever fight 대전방지II(일정부분 전자파차폐)Antistatic II (partial electromagnetic wave shielding) <105 <10 5 대전하지 않음do not charge 전자파차폐, 전자파차단electromagnetic wave shield, electromagnetic wave blocking

항균 및 방미의 경우에서는 실내공기중의 미세먼지, 세균, 곰팡이 등이 알레르기성 질환이나 호흡기 질환을 유발할 뿐만 아니라, 때로는 폐결핵이나 전염성 질환을 야기시키기도 한다. 이를 예방하려고 항균기능을 부여하는 종전의 방법에서는 플라스틱에 초기 항균억제력이 우수한 유기항균제를 사용하거나 열안정성이 우수한 무기항균제를 사용하고 있지만, Escherichia coli에 대하여 높은 항균성능을 발휘하지만, 곰팡이균에 대해서는 방미특성이 떨어지고 있는 실정이다.In the case of antibacterial and anti-mildew, fine dust, bacteria, mold, etc. in indoor air not only cause allergic diseases or respiratory diseases, but also sometimes cause pulmonary tuberculosis or infectious diseases. To prevent this, in the previous method of imparting antibacterial function, organic antimicrobial agents with excellent initial antibacterial inhibition or inorganic antimicrobial agents with excellent thermal stability were used in plastics, but they exhibit high antibacterial performance against Escherichia coli, but against fungi The anti-fog properties are declining.

따라서 본 발명의 이온성화합물 성분내에는 (+), (-)이온성질을 동시에 가져 대전방지(전기장 감쇄 포함), 항균 및 방미, 난연 효과를 발휘할 것으로 기대한다.Therefore, it is expected that the ionic compound component of the present invention has (+) and (-) ionic properties at the same time to exhibit antistatic (including electric field attenuation), antibacterial and antifog, and flame retardant effects.

본 발명은 이온성화합물의 특성을 이용하여 대전방지 특성과 항균 및 방미특성, 난연특성을 부여하는데 목적이 있다.An object of the present invention is to impart antistatic properties, antibacterial and antiseptic properties, and flame retardant properties by using the properties of ionic compounds.

대전에 의해 정전기가 발생하며, 순간적인 방전으로 제품을 손상시키거나, 먼지 부착이 용이해지므로 대전방지 특성이 요구된다. 따라서 대전방지를 위하여 정전기(전하)의 분리를 막는 것이 중요하다. 전하 분리는 외력의 작용을 받아서 이동하는 것을 의미하며, 전하 분리에 의해 생기는 전기장을 작게 하기 위해 유전율이 높은 물질을 사용하거나, 전하의 속도를 빠르게 하여 대전 방지를 하기 위해 전도율이 좋은 물질을 사용하거나, 전하가 흡습되기 쉬운 물질을 사용해야 한다. 현재 널리 사용되고 있는 대전방지제로 계면활성제내지 전도성고분자 등을 사용하여 대전방지 처리를 하고 있으나, 상용화된 계면활성제의 코팅액으로 처리된 필림은 표면저항이 109~1012Ω/□으로저항이 높은 편이며, 단독으로 전도성고분자를 사용하는 경우 현재까지는 비싼 원료가격으로 인한 범용화의 장애 요인이 되고 있다. Static electricity is generated by electrification, and instantaneous discharge damages products or facilitates dust adhesion, so antistatic properties are required. Therefore, it is important to prevent separation of static electricity (charge) to prevent static electricity. Charge separation means movement under the action of an external force, and materials with high dielectric constant are used to reduce the electric field caused by charge separation, or materials with good conductivity are used to prevent charging by increasing the speed of charges. However, materials that are easily absorbed by charge should be used. Currently, antistatic treatment is performed using surfactants or conductive polymers as widely used antistatic agents, but films treated with commercially available surfactant coating solutions have a high surface resistance of 10 9 ~10 12 Ω/□ In the case of using a conductive polymer alone, it has been an obstacle to generalization due to expensive raw material prices so far.

그리고 알려진 항균 메카니즘을 살펴보면, ① 단백질을 구성하고 있는 아미노산의 하나인 시스테인(cysteine)의 -SH기와 이온이 반응하여 이온-S 형성으로 인하여 미생물의 증식을 억제시키는 메커니즘이 알려져 있고, ② 미생물의 물질대사에서 활성산소의 생성을 유도하여 항균작용을 한다는 메카니즘, ③ 이온이 미생물의 막에 있는 이온을 방출시켜 불활성화를 한다는 메카니즘, ④ 미생물에 존재하는 염기와 반응하여 세포분열을 막는 메카니즘이 알려져 있다(출처: Korean J. Microbiol. Biotechnol. Vol. 39, No. 1, 18 (2011). 그리고 상기 언급된 균주뿐만 아니라, 미생물의 일종인 일반 거주 환경에서 발생하는 곰팡이 종류는 약 300여종에 달한다고 알려지고 있다. 그 중에서 사람에 가장 해를 끼치는 곰팡이는 검은 곰팡이로서 곰팡이 포자가 공기 중 부유도 용이하고, 사람이 거주하는 실내온도가 곰팡이 번식에 최적 20~30℃에서 포자 상태의 곰팡이가 순식간에 늘어나 포자가루를 퍼뜨려 번식하는 특징이 있다. 일반적으로 곰팡이는 80~90%RH에서 기본적인 생육을 시작하고 90%RH 이상에서는 왕성한 번식을 시작한다. 또한 곰팡이는 건축용 고분자를 구성하는 주요성분인 탄소와 질소를 영양분으로 번식하는 경우가 많고, 욕실에서 사용하는 각종 비누 성분에도 곰팡이가 좋아하는 영양소가 풍부하며, 사람에서 발생되는 각종 각질 등도 곰팡이의 영양소라고 한다. 또한 미생물에 속하는 황색포도상구균은 구토와 설사를 유발하는 균이며, 대장균은 식중독의 원인균으로 알려져 있고, 이들 균들과 생활 속에서 함께 살아가고 있다. 이들 균을 예방하기 위하여 항생제이나 금속계 항균물질을 이용하여 억제시키려는 연구와 개발이 이어져 왔다.And looking at the known antibacterial mechanisms, ① a mechanism is known to inhibit the growth of microorganisms due to the formation of ions-S by reacting with -SH groups of cysteine, one of the amino acids constituting proteins, and ions, and ② substances of microorganisms. The mechanism of inducing the generation of active oxygen in metabolism to act as an antibacterial, ③ the mechanism of inactivation by releasing ions in the membrane of microorganisms by ions, and the mechanism of preventing cell division by reacting with bases present in microorganisms are known. (Source: Korean J. Microbiol. Biotechnol. Vol. 39, No. 1, 18 (2011). In addition to the strains mentioned above, it is known that there are about 300 types of fungi that occur in general living environments, which are a type of microorganisms. Among them, the most harmful mold to humans is black mold, and mold spores can easily float in the air, and when the indoor temperature where people live is 20 ~ 30 ℃, which is optimal for mold growth, mold in a spore state rapidly grows. Characteristic of propagation by spreading spores.Generally, fungi start basic growth at 80~90%RH and vigorously grow at 90%RH or higher.In addition, molds are characterized by carbon and nitrogen, which are the main components of building polymers. It is often propagated as a nutrient, various soap ingredients used in the bathroom are rich in nutrients that mold likes, and various dead skin cells generated from humans are also said to be nutrients of mold. E. coli is known as the cause of food poisoning, and lives with these bacteria in daily life.To prevent these bacteria, research and development have been conducted to suppress them using antibiotics or metal-based antibacterial substances.

그러나 본 발명에서는 상기 물질이외에 이온성물질을 이용하여 항균능력을 발휘토록 하고자 한다. 이온성물질은 무독성으로 인체에 해가 없고, 미생물의 신진대사 기능을 억제하여 항균효과를 발휘할 것으로 기대한다. 또한 이온의 전기적 특성으로 미생물의 생식기능에 영향을 주어 항균 및 방미작용을 할 것으로 기대한다. However, in the present invention, it is intended to exert antibacterial ability by using ionic materials in addition to the above materials. The ionic material is non-toxic and harmless to the human body, and is expected to exert an antibacterial effect by suppressing the metabolic function of microorganisms. In addition, it is expected to have antibacterial and antibacterial effects by affecting the reproductive function of microorganisms due to the electrical characteristics of ions.

또한 본 발명에서 추구하는 또하나의 특성으로 난연특성이 있다. 현재 건축용 재료 및 고분자(플라스틱) 난연수지 제조시 할로겐계, 안티몬계, 무기계, 인계 및 질소-인계 등을 주성분으로 하는 난연제를 사용하고 있다. 고분자물질은 대부분 유기물로 구성되어 있어 연소하기 쉬운 성질을 가지고 있다. 고분자의 난연특성 부여를 위해, 상기 열거된 난연제는 다음과 같은 메카지즘으로 난연특성을 발휘한다고 한다. ① 할로겐계 난연제; 할로겐계 난연제는 기체상으로 작용하는데, 연소의 추진역할을 하는 활성라디칼인 -OH, -H을 할로겐 화합물인 HX가 연소과정에서 포착함으로서 그 난연효과를 발휘한다. 또한 HX는 불연성가스를 발생시키므로써 가연성가스를 희석시키고, 산소도 차단하는 효과를 가진다. 또한 할로겐 함유 난연제는 고체상에서도 난연효과를 나타내며, HX는 가연성 물질의 산화촉매로 작용하여 산화된 물질은 환 구조화되어 결과적으로는 탄소화합물을 생성하게 되고, 생성된 탄소화합물은 산소 및 잠열을 차단하여 가연성 물질이 연소영역 이하에 있도록 도와주는 역할을 한다. ② 인계 난연제; 고체상 반응에서 우수한 난연효과를 가지며, 특히 산소를 다량 함유하고 있는 플라스틱에서 효과가 우수하다. 먼저 열분해에 의하여 폴리인산이 생성되고 이것은 에스테르화 및 탈수소화하여 숯을 생성하며 이렇게 생성된 숯이 산소와 열을 차단하는 것으로 알려져 있다. 독성이 없고 열적으로 안정하나 물과 접촉할 경우 독성이 강하고 밀폐공간에서 폭발위험이 있는 포스핀 가스를 방출하여 주의가 필요하다. ③ 무기계 난연제; 수산화알루미늄, 산화안티몬, 수산화마그네슘 등이 있다. 열에 의해 휘발되지 않으며 분해되어 물, 이산화탄소, 이산화황, 염화수소와 같은 불연성 기체를 방출하게 되며 대부분 흡열반응, 기체상에서는 가연성 기체를 희석시켜 플라스틱 표면을 도포하여 산소의 접근 방지하는 동시에 고체상 표면에서 흡열반응을 통하여 플라스틱 냉각 및 열분해 생성물의 생성을 감소시키는 효과를 가진다. ④ 난연상승제; ⓐ silicone-based additives; 열가소성 또는 열경화성 폴리머에 실리콘계 첨가제 1~5% 첨가시 난연 상승효과가 있다고 알려져 있다. 실리콘계 첨가제는 열 방출, 일산화탄소와 같은 유독성 기체 및 연기의 방출을 감소시킨다. 폴리스티렌에 실리콘계 첨가제를 투입하면 열방출량이 줄어든다고 한다. ⓑ P/Br 화합물; PC/PBT(2:1)에 적용한 결과 우수한 난연효과가 있었다고 하며, 각각의 플라스틱이 UL94 V-0의 난연성을 나타내기 위해서는 12~13%의 난연제가 필요하지만, P/Br화합물의 경우 6~7%의 난연제만으로도 난연성 부여가 가능하다고 알려져 있다. ⓒ Zinc borate; 경질 PVC에 Zinc borate 및 알루미늄트리하이드레이트 첨가시 연기발생을 현저히 감소시킬 수 있다고 한다. 이 경우 최대 연기 발생 밀도를 563에서 285로 낮출수 있다고 한다. ⑤ 염소계 난연제; 염소화파라핀, 염소화폴리에틸렌, 지방족 염소계 난연제등이 있다. 염소계 파라핀 및 폴리에틸렌의 경우, 가격이 저렴하지만 열안정성이 취약하다. 지방족 난연제의 경우 가격 경쟁력이 떨어지는 단점과 브롬계에 비해 난연 효율성이 떨어진다. (출처; http://eunsungfc.com/main.htm) 상기 난연제중 브롬계 및 염소계 난연제는 독성가스 배출로 인하여 새로운 친환경 난연제 개발 필요성 대두되고 있어, 따라서 본 발명은 상기와 같은 효과를 복합적으로 발휘하면서, 인체친화성을 가지며 쾌적한 실내환경 조성이 가능하도록 하는데 있다.In addition, there is a flame retardant property as another property pursued in the present invention. Currently, flame retardants containing halogen-based, antimony-based, inorganic-based, phosphorus-based, and nitrogen-phosphorus-based flame retardants as main components are used in the manufacture of building materials and polymer (plastic) flame retardant resins. Most of the polymer materials are composed of organic materials, so they are easily combustible. In order to impart flame retardant properties to polymers, the above-listed flame retardants are said to exhibit flame retardant properties by the following mechanism. ① Halogen-based flame retardant; Halogen-based flame retardants act in the gaseous phase, and -OH, -H, which are active radicals that play a role in propulsion of combustion, are captured by HX, a halogen compound, in the combustion process to exert their flame retardant effect. HX also has the effect of diluting combustible gas and blocking oxygen by generating incombustible gas. In addition, halogen-containing flame retardants show a flame retardant effect even in the solid phase, and HX acts as an oxidation catalyst for combustible materials, and the oxidized materials form a ring structure, resulting in the production of carbon compounds, which block oxygen and latent heat. It serves to help keep combustible materials below the combustion zone. ② phosphorus-based flame retardant; It has an excellent flame retardant effect in solid phase reactions, and is particularly effective in plastics containing a large amount of oxygen. First, polyphosphoric acid is produced by thermal decomposition, which is esterified and dehydrogenated to produce charcoal, and it is known that the charcoal thus produced blocks oxygen and heat. It is non-toxic and thermally stable, but when in contact with water, it is highly toxic and releases phosphine gas, which is explosive in confined spaces, so care is required. ③ Inorganic flame retardant; There are aluminum hydroxide, antimony oxide, magnesium hydroxide, etc. It is not volatilized by heat and decomposes to release incombustible gases such as water, carbon dioxide, sulfur dioxide, and hydrogen chloride. Most of the endothermic reactions, in the gas phase, flammable gases are diluted and applied to the plastic surface to prevent access of oxygen and at the same time, an endothermic reaction on the solid surface. Through this, it has the effect of reducing the formation of plastic cooling and thermal decomposition products. ④ flame retardant enhancer; ⓐ silicone-based additives; It is known that when 1 to 5% of silicone-based additives are added to thermoplastic or thermosetting polymers, there is a synergistic effect on flame retardancy. Silicone-based additives reduce heat emission, emission of toxic gases such as carbon monoxide and smoke. It is said that the amount of heat released is reduced when silicone-based additives are added to polystyrene. ⓑ P/Br compounds; As a result of application to PC/PBT (2:1), it is said that there was an excellent flame retardant effect. In order for each plastic to exhibit flame retardancy of UL94 V-0, 12~13% of flame retardant is required, but in the case of P/Br compound, 6~ It is known that flame retardancy can be imparted with only 7% of the flame retardant. © Zinc borate; When zinc borate and aluminum trihydrate are added to hard PVC, smoke generation can be significantly reduced. In this case, it is said that the maximum smoke generation density can be lowered from 563 to 285. ⑤ chlorine-based flame retardant; There are chlorinated paraffin, chlorinated polyethylene, and aliphatic chlorine-based flame retardants. In the case of chlorine-based paraffin and polyethylene, the price is low, but thermal stability is weak. In the case of aliphatic flame retardants, the price competitiveness is low and the flame retardant efficiency is low compared to brominated flame retardants. (Source; http://eunsungfc.com/main.htm) Among the flame retardants, brominated and chlorinated flame retardants are emerging as a necessity to develop new eco-friendly flame retardants due to the emission of toxic gases, and therefore, the present invention exhibits the above effects in combination. While doing so, it is human body-friendly and makes it possible to create a pleasant indoor environment.

본 발명은 이온성화합물을 이용한 고저항 접착제 및 도료, 이를 응용한 제품에 관한 것으로, 고저항에 의한 대전방지와 전기장 감쇄, 항균, 방미, 난연성을 부여하여 쾌적한 환경을 조성하는 것이 목적이다.The present invention relates to a high-resistance adhesive and paint using an ionic compound, and to a product applying the same, and an object of the present invention is to create a comfortable environment by imparting antistatic and electric field attenuation, antibacterial, anti-fog, and flame retardant properties due to high resistance.

이를 위하여 고형분 5~59중량% 수용성 접착물질로서 아크릴 에멀젼계 접착제(Acrylic emulsion)이나 에폭시 에멀젼계 접착제(epoxy emulsion), 폴리비닐아세테이트 및 에멀젼계 접착제(Poly Vinyl Acetate and emulsion), 우레탄계 접착제(Urethane), 실리콘(Silicone)계 접착제, EVA(Ethylene Vinyl Acetate)계 접착제, 레조르시노르계 접착제(Resorcinol), α-올레핀계 접착제(α-Olefin), 염화 비닐 수지계 접착제(Polyvinyl chloride), 이소시아네이트계 접착제(Isocyanate), 페놀 수지계 접착제(Phenolic)를 단독 또는 둘 이상을 10~95중량% 혼합한 조성물(I), To this end, acrylic emulsion-based adhesives (Acrylic emulsion), epoxy emulsion-based adhesives (epoxy emulsion), polyvinyl acetate and emulsion-based adhesives (Poly Vinyl Acetate and emulsion), and urethane-based adhesives (Urethane) are used as water-soluble adhesives with a solid content of 5 to 59% by weight , Silicone adhesive, EVA (Ethylene Vinyl Acetate) adhesive, resorcinol adhesive (Resorcinol), α-olefin adhesive (α-Olefin), vinyl chloride resin adhesive (Polyvinyl chloride), isocyanate adhesive ( Isocyanate), a composition (I) in which 10 to 95% by weight of a phenolic resin adhesive (Phenolic) is mixed alone or two or more,

쌀, 밀, 밀기울, 옥수수, 감자, 덱스트린과 같은 곡물로 제조된 고형분 15~40중량% 풀을 단독 또는 둘 이상을 5~95중량% 혼합한 조성물(II), Rice, wheat, bran, corn, potato, 15 to 40% by weight of solids grass made of grains such as dextrin alone or 5 to 95% by weight of a mixture of two or more compositions (II),

조성물(I)에 조성물(II)을 비율 1: 0.2~10으로 10~95중량% 혼합한 조성물(III),Composition (III) obtained by mixing 10 to 95% by weight of composition (II) with composition (I) at a ratio of 1: 0.2 to 10;

용매로는 무독성인 물이나 알코올을 0~50중량% 사용하고, As a solvent, non-toxic water or alcohol is used in an amount of 0 to 50% by weight,

이들 조성물들에 고형분 5~80중량% 이온성화합물I으로 - 본 발명에서 사용한 이온성화합물은 금속 양이온과 비금속 음이온이 정전기적 인력에 의해 결합되어 있는데, 전하의 합이 전기적으로 중성이다.- +2가 이상의 양이온 금속원소는 Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba 등으로 이루어진 군에서 하나 이상을 들 수 있고, 음이온 원소는 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온 등으로 이루어진 군에서 선택되는 하나 이상을 들 수 있다. 장비의 부식, 용액 안정성을 고려해서 암모늄염을 추가로 포함할 수도 있고, 수화물 형태, 수용액 형태로 이들의 물질 단독 혹은 둘 이상 2~50중량% 사용하였다. 고형분 5~80중량% 이온성화합물II는 +1가 양이온 금속과 -1가 또는 -2가 음이온을 사용한 바, 여기에 속하는 양이온 금속원소는 Li, Na, K 등으로 이루어진 군에서 선택되는 하나 이상을 들 수 있고, 음이온 원소는 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온 등으로 이루어진 군에서 선택되는 하나 이상을 포함하였고, 수화물 형태, 수용액 형태로 이들의 물질 단독 혹은 둘 이상 2~50중량% 사용하고, 고형분 0.1~50중량% 전도성고분자(Conductive Polymer; Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole), 고형분 100% 실리카 및 알루미나, 이들의 물질 단독 혹은 둘 이상 2~50중량% 혼합한 접착 조성물을 In these compositions, solid content of 5 to 80% by weight of ionic compound I - In the ionic compound used in the present invention, metal cations and non-metal anions are bound by electrostatic attraction, and the sum of charges is electrically neutral. - + The divalent or higher cation metal element may include one or more from the group consisting of Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba, etc., and the anion element may be fluoride anion, bromide anion, Iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromate anion, dichromate anion, halogen anion, hydrochloric acid and at least one selected from the group consisting of anions, organic acid anions, and the like. Ammonium salts may be additionally included in consideration of corrosion of equipment and solution stability, and 2 to 50% by weight of these materials alone or two or more in the form of hydrates or aqueous solutions are used. Ionic Compound II with a solid content of 5 to 80% by weight uses a +monovalent cation metal and a -monovalent or -divalent anion, and the cationic metal element belonging thereto is one or more selected from the group consisting of Li, Na, K, etc. The anion element may be fluoride anion, bromide anion, iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogen carbonate It contains at least one selected from the group consisting of anion, boric acid anion, chromic acid anion, dichromate anion, halogen anion, hydrochloric acid anion, organic acid anion, etc., and 2 to 50% by weight of these substances alone or two or more in the form of a hydrate or an aqueous solution 0.1 to 50% by weight of a solid conductive polymer (Conductive Polymer; Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole), 100% solid silica and alumina, and an adhesive composition containing 2 to 50% by weight of these materials alone or a mixture of two or more

교반속도 30~20,000rpm, 교반시간 5분~3시간 혼합하여 제조되어진 대전방지, 항균, 방미, 난연성을 가진 조성물 제조하여 접착제, 도료, 벽지, 가구, 바닥제, 커튼, 블라인드와 같은 다양한 제품에 적용하는 것을 특징으로 한다.Anti-static, anti-bacterial, anti-mildew, flame retardant composition prepared by mixing at a stirring speed of 30 to 20,000 rpm and a stirring time of 5 minutes to 3 hours, and applied to various products such as adhesives, paints, wallpaper, furniture, flooring, curtains, and blinds. It is characterized by doing.

이상과 같이 본 발명의 이온성화합물을 이용한 고저항 접착제 및 도료, 이를 응용한 제품은 투명내지 반투명하면서도 대전방지 성능과 전기장 감쇄효과를 아울러 발휘함과 동시에, 항균특성, 방미특성, 난연특성을 가진 복합적 기능을 발휘하는 것이 특징이다..As described above, the high-resistance adhesive and paint using the ionic compound of the present invention, and products applied thereto, are transparent or translucent, yet exhibit antistatic performance and electric field attenuation effect, and at the same time have antibacterial properties, anti-mildew properties, and flame retardant properties. It is characterized by a combination of functions.

도 1은 본 발명에 의해 제조된 시트에 대한 표면저항 측정결과.
도 2는 본 발명에 의해 제조된 시트에 대한 표면저항 측정 결과.
도 3는 종전 접착제로 도배후 전기장 측정결과(E-tester).
도 4는 본 발명에 의하여 제조된 접착제으로 도배후 전기장 측정결과(E-tester).
도 5는 본 발명에 의해 제조된 시트에 대한 항균시험 결과.
도 6은 종전 벽지와 본 발명의 접착제로 코팅되어진 벽지에 대한 연소 시험을 동영상으로 촬영되어진 것을 사진으로 순차적으로 도시함.
도 7은 도 6에 이어서 순차적으로 도시함.
1 is a surface resistance measurement result for a sheet manufactured by the present invention.
Figure 2 is the surface resistance measurement results for the sheet produced by the present invention.
Figure 3 is an electric field measurement result (E-tester) after coating with a conventional adhesive.
4 is an electric field measurement result (E-tester) after coating with an adhesive prepared according to the present invention.
Figure 5 is an antibacterial test result for the sheet produced by the present invention.
FIG. 6 sequentially shows pictures taken as motion pictures of a combustion test for a conventional wallpaper and a wallpaper coated with the adhesive of the present invention.
Figure 7 is sequentially shown following Figure 6.

본 발명은, 고형분 5~59중량% 수용성 접착물질인 아크릴 에멀젼계 접착제(Acrylic emulsion)이나 에폭시 에멀젼계 접착제(epoxy emulsion), 폴리비닐아세테이트 및 에멀젼계 접착제(Poly Vinyl Acetate and emulsion), 우레탄계 접착제(Urethane), 실리콘계 접착제(Silicone), EVA(Ethylene Vinyl Acetate)계 접착제, 레조르시노르계 접착제(Resorcinol), α-올레핀계 접착제(α-Olefin), 염화 비닐 수지계 접착제(Polyvinyl chloride), 이소시아네이트계 접착제(Isocyanate), 페놀 수지계 접착제(Phenolic)를 단독 또는 둘 이상을 10~95중량% 혼합한 조성물(I), 쌀, 밀, 밀기울, 옥수수, 감자, 덱스트린과 같은 곡물로 제조된 고형분 15~40중량% 풀을 단독 또는 둘 이상을 5~95중량% 혼합한 조성물(II), 조성물(I)에 조성물(II)을 비율 1: 0.2~10으로 10~95중량% 혼합한 조성물(III), 이들 조성물들에 고형분 5~80중량% 이온성화합물I 2~50중량%, 고형분 5~80중량% 이온성화합물II 2~50중량%, 고형분 0.1~50중량% 전도성고분자(Conductive Polymer; Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole), 고형분 100% 실리카 및 알루미나, 이들의 물질 단독 혹은 둘 이상 2~50중량% 혼합한 접착 조성물을 교반속도 30~20,000rpm, 교반시간 5분~3시간 혼합하는 조성물을 제조하였다. The present invention is a water-soluble adhesive material having a solid content of 5 to 59% by weight, such as acrylic emulsion or epoxy emulsion adhesive, polyvinyl acetate and emulsion adhesive (Poly Vinyl Acetate and emulsion), urethane adhesive ( Urethane), silicone adhesive (Silicone), EVA (Ethylene Vinyl Acetate) adhesive, resorcinol adhesive (Resorcinol), α-olefin adhesive (α-Olefin), polyvinyl chloride adhesive, isocyanate adhesive (Isocyanate), 10 to 95% by weight of a phenolic resin adhesive (Phenolic) alone or a mixture of two or more (I), 15 to 40% by weight of solids made of grains such as rice, wheat, bran, corn, potato, and dextrin Composition (II) obtained by mixing % pools alone or 5 to 95% by weight of two or more, composition (III) obtained by mixing 10 to 95% by weight of composition (II) with composition (I) at a ratio of 1: 0.2 to 10, and these In the composition, solid content 5-80% by weight ionic compound I 2-50%, solid content 5-80% ionic compound II 2-50% by weight, solid content 0.1-50% by weight Conductive polymer (Polythiophene, PEDOT) -PSS, Polyaniline, Polypyrrole), 100% solid silica and alumina, a composition in which an adhesive composition mixed with 2 to 50% by weight of these materials alone or two or more is mixed at a stirring speed of 30 to 20,000 rpm and a stirring time of 5 minutes to 3 hours manufactured.

이온성화합물I은 +2가 이상의 양이온 금속원소 Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba 등으로 이루어진 군에서 하나 이상을 들 수 있고, 음이온 원소는 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온 등으로 이루어진 군에서 선택되는 하나 이상을 사용하였고, 이온성화합물II는 +1가 양이온 금속과 -1가 또는 -2가 음이온을 사용한 바, 여기에 속하는 양이온 금속원소 Li, Na, K 등으로 이루어진 군에서 선택되는 하나 이상을 들 수 있고, 음이온 원소는 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온 등으로 이루어진 군에서 선택되는 하나 이상을 포함하고 있는 것을 사용하였다. The ionic compound I may include one or more from the group consisting of +2-valent or higher cation metal elements Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba, etc., and the anion element is fluorinated anion, bromide anion, iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromate anion, dichromate anion , At least one selected from the group consisting of halogen anion, hydrochloric acid anion, organic acid anion, etc. was used, and the ionic compound II used a +monovalent cation metal and a -monovalent or -divalent anion, a cationic metal belonging thereto and at least one selected from the group consisting of elements Li, Na, K, etc., and the anion element is fluoride anion, bromide anion, iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion , nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogen carbonate anion, borate anion, chromic acid anion, dichromate anion, halogen anion, hydrochloric acid anion, organic acid anion, etc. .

용매는 무독성인 물이나 알코올 등을 0~50중량% 사용하였다.As the solvent, 0 to 50% by weight of non-toxic water or alcohol was used.

이와 같이 제조되어진 본 발명은 표면저항이 104~9 Ω/□으로 형광등, 전구 등지에서 발생하는 전자파 감쇄, 항균, 방미, 난연 기능을 발휘한다.The present invention prepared as described above has a surface resistance of 10 4 to 9 Ω/□, and exhibits functions of attenuating electromagnetic waves generated from fluorescent lamps and light bulbs, as well as antibacterial, anti-mildew, and flame retardant functions.

이하 상기 열거되어진 물질중에 고형분과 함량에 따른 본 발명에서 추구하는 목적을 실시예를 바탕으로 표면저항, 항균, 방미, 난연 성능을 설명코자 한다. Hereinafter, surface resistance, antibacterial, antifog, and flame retardant performance will be described based on examples of the object pursued in the present invention according to the solid content and content among the materials listed above.

본 발명의 전자파감쇄 기능을 보유한 접착제는 고형분 19중량% 수용성 접착물질 57중량%에 고형분 50중량% 이온성 화합물I 13증량%와 고형분 20중량% 이온성화합물II 15중량%, 물 15중량%를 첨가하여 혼합 제조함에 있어 교반속도 500rpm, 1시간 혼합하여 제조하였다. 제조되어진 접착제의 표면저항은 측정조건 20.4±2℃, 23±2%RH, 시험장비 Surface Resistance Meter SRM110(serial No. 20148096), D1=17cm, D2=17cm에서 측정한 결과로서 도1에 도시한 바와 같이 107Ω/□이었다.The adhesive having the electromagnetic wave attenuation function of the present invention contains 19% by weight of solid content, 57% by weight of water-soluble adhesive material, 50% by weight of solid content, 13% by weight of ionic compound I, 20% by weight of solid content, 15% by weight of ionic compound II, and 15% by weight of water. It was prepared by mixing at a stirring speed of 500 rpm and mixing for 1 hour. The surface resistance of the prepared adhesive is measured as a result of measurement under measurement conditions 20.4±2℃, 23±2%RH, test equipment Surface Resistance Meter SRM 110 (serial No. 20148096), D 1 =17cm, D 2 =17cm. As shown in Fig. 1, it was 10 7 Ω/□.

실시예 1과 동일한 방법으로,본 발명의 전자파감쇄 기능을 보유한 접착제는 고형분 23중량% 수용성 접착물질 66중량%에 고형분 50중량% 이온성 화합물I 14중량%와 고형분 20중량% 이온성화합물II 20중량%를 첨가하여 제조되어진 접착제의 표면저항은 측정조건 19.9±2℃, 25±2% RH, 시험장비 Surface Resistance Meter SRM110(serial No. 20148096), D1=17cm, D2=17cm에서 측정한 결과로서 107Ω/□이었고, 도 2에 도시하였다.In the same manner as in Example 1, the adhesive having the electromagnetic wave attenuation function of the present invention was prepared by adding 23 wt% of solids to 66 wt% of water-soluble adhesive material, 50 wt% of solids to 14 wt% of ionic compound I and 20 wt% of solids to 20 wt% of ionic compound II. The surface resistance of the adhesive prepared by adding weight% was measured at 19.9 ± 2 ℃, 25 ± 2% RH, test equipment Surface Resistance Meter SRM 110 (serial No. 20148096), D 1 = 17cm, D 2 = 17cm As a result of the measurement, it was 10 7 Ω/□, and is shown in FIG. 2 .

본 발명의 접착제로 도포한 후 전등에서 발생하는 전기장 감쇄 정도를 눈으로 확인할 목적으로, 나무 박스에 도포하지 않고 벽지를 바른 경우(도 3)와 도포후 벽지를 바른 경우(도 4)에 대한 시험을 실시하였다. 측정조건 19.9±2℃, 25±2% RH, 시험장비는 (주)펄스에서 제조한 E-Tester를 사용하여 측정하였다. 도 3, 4에서 보여 주는 바와 같이 본 발명의 접착제를 사용하지 않은 박스는 130V/m를 나타내고 있으나, 본 발명으로 도포되어진 박스는 0V/m으로 감쇄되는 것으로 측정되었다..For the purpose of visually checking the degree of electric field attenuation generated by the lamp after application with the adhesive of the present invention, a test on the case of applying wallpaper without applying to a wooden box (FIG. 3) and the case of applying wallpaper after application (FIG. 4) was carried out. Measurement conditions 19.9 ± 2 ℃, 25 ± 2% RH, test equipment was measured using an E-Tester manufactured by Pulse. As shown in Figures 3 and 4, the box without the adhesive of the present invention shows 130V / m, but the box coated with the present invention was measured to be attenuated to 0V / m.

실시예 2에 의거 제조된 접착제, 본 발명에서의 또다른 목적인 항균효과를 검증하기 위하여 시험기관에 의뢰하여 대장균 등에 대하여 균주 시험을 실시하였다. 본 실험은 시험규격 JIS Z 2801-2010, 표준필름 sterilized PP film, 접종균액의 양 0.1mL에서 황색포도상구균(Staphyococcus aureus ATCC 658P)의 항균활성치는 2.55이었으며, 대장균(Escherichia coli ATCC 8739)일 때는 3.1로서 항균 결과를 도 5에 나타내었다. 균이 99% 이상 소멸되는 것으로 보아 본 발명에서 사용한 이온성화합물에 대한 항균 성능이 있음을 확인할 수 있었다. In order to verify the antibacterial effect of the adhesive prepared in Example 2, which is another object of the present invention, a strain test was conducted on Escherichia coli and the like by requesting a test institute. In this experiment, the antibacterial activity value of Staphyococcus aureus ATCC 658P was 2.55 in the test standard JIS Z 2801-2010, standard film sterilized PP film, and 0.1mL of inoculum solution, and 3.1 for E. coli (Escherichia coli ATCC 8739). As shown in Figure 5 antibacterial results. It was confirmed that the ionic compound used in the present invention had antibacterial performance, as the bacteria were destroyed by more than 99%.

그리고 곰팡이 억제 여부를 시험하기 위하여 빵을 사용하여 실험한 결과, 도 6에 도시한 바와 같이 방미효과도 있음이 확인되었다.In addition, as a result of the experiment using bread to test whether or not to suppress mold, it was confirmed that there is also an anti-mildew effect as shown in FIG. 6.

실시예 1과 2에 의해 제조된 접착제들은 난연특성을 가졌다. 본 발명에서 사용하는 접착제에 이온성화합물I, II는 액체 상태뿐만 아니라, 고체 분말로도 혼합 가능하고, 본 발명의 또다른 목적인 난연 작용을 가진 접착제도 가능하였다. 상기 이온성화합물은 화염에 접촉하면 물질 자체 고유 특성으로 화염의 지연 효과를 갖는 재료임에 의하여 난연 작용을 발휘할 수 있게 된다. The adhesives prepared by Examples 1 and 2 had flame retardant properties. In the adhesive used in the present invention, ionic compounds I and II can be mixed not only in a liquid state but also in a solid powder form, and an adhesive having a flame retardant action, which is another object of the present invention, was also possible. When the ionic compound comes into contact with a flame, it is possible to exhibit a flame retardant action by being a material having a flame retardant effect due to the inherent properties of the material itself.

난연성과 표면저항의 연관성을 판별하기 위하여. 측정조건 19.9℃, 25% RH, 시험장비 Surface Resistance Meter SRMⓡ110를 사용하여 측정한 결과, 이온성화합물 I 3중량% 미만, 이온성화합물 II 3중량% 미만일 때 표면저항 109~11Ω/□으로 대전방지성 및 발화 지연이 떨어졌고, 이온성화합물I 18중량%, 이온성화합물II 3중량%에서 104~5Ω/□으로 대전방지성과 발화 지연이 우수하였으나 약간 접착강도가 떨어지는 단점이 있었다. 따라서 이온성화합물I 3~18중량%, 이온성화합물II 3~10중량%로 혼합하게 되며, 특히 이온성화합물I 4~12중량%, 이온성화합물II 4~7중량%로 적용함이 바람직하게 된다.To determine the correlation between flame retardancy and surface resistance. As a result of measurement using the measurement conditions 19.9℃, 25% RH, test equipment Surface Resistance Meter SRMⓡ110, surface resistance 10 9~11 Ω/ when less than 3% by weight of ionic compound I and less than 3% by weight of ionic compound II Antistatic properties and ignition delay were poor with □, and antistatic properties and ignition delay were excellent at 18% by weight of ionic compound I and 3% by weight of ionic compound II at 10 4 ~ 5 Ω / □, but the adhesive strength was slightly lowered. there was Therefore, 3 to 18% by weight of ionic compound I and 3 to 10% by weight of ionic compound II are mixed. In particular, it is preferable to apply 4 to 12% by weight of ionic compound I and 4 to 7% by weight of ionic compound II. will do

상기 실시예 1에 의거, 제조된 접착제로 종이벽지의 표면에 도포하고, 발화 시험을 수행하였다, 도 7과 8에 무코팅 종이벽지와 종이벽지에 본 발명의 접착제로 도포한 것을 동일한 조건에서 발화시킨 결과, 종이벽지는 완전히 전소되었으나, 본 발명에 의한 것은 발화후 바로 끄졌다. 따라서 본 발명의 우수한 난연성을 확인할 수 있었다. Based on Example 1, the prepared adhesive was applied to the surface of the paper wallpaper, and an ignition test was performed. In FIGS. 7 and 8, the uncoated paper wallpaper and the paper wallpaper coated with the adhesive of the present invention were ignited under the same conditions. As a result, the paper wallpaper was completely burned down, but the one according to the present invention was turned off immediately after ignition. Therefore, the excellent flame retardancy of the present invention could be confirmed.

Claims (5)

수용성 접착제를 포함하는 조성물(I)과 곡물로 제조된 풀을 포함하는 조성물(II)을 1: 0.2~10 중량비로 혼합한 조성물(III)에 대하여,
+2가 이상의 금속 양이온과 비금속 음이온이 결합되며, 수용액 형태로 첨가되는 이온성화합물I 3~18중량%,
+1가 이상의 금속 양이온과 -1가 또는 -2가 음이온이 결합된 것이며, 수용액 형태로 첨가되는 이온성화합물II 3~10중량%,
전도성고분자 0.1~50중량% 를 혼합하여 제조된 것이며,
상기 수용성 접착제는 아크릴 에멀젼계 접착제(Acrylic emulsion), 에폭시 에멀젼계 접착제(epoxy emulsion), 폴리비닐아세테이트 및 에멀젼계 접착제(Poly Vinyl Acetate and emulsion), 우레탄계 접착제(Urethane), 실리콘(Silicone)계 접착제, EVA(Ethylene Vinyl Acetate)계 접착제, 레조르시노르계 접착제(Resorcinol), α-올레핀계 접착제(α-Olefin), 염화 비닐 수지계 접착제(Polyvinyl chloride), 이소시아네이트계 접착제(Isocyanate), 페놀 수지계 접착제(Phenolic) 단독 또는 둘 이상을 포함하며,
상기 곡물로 제조된 풀은 쌀, 밀, 밀기울, 옥수수, 감자, 덱스트린 단독 또는 둘 이상을 포함하며,
상기 이온성화합물I의 +2가 이상의 금속 양이온은 Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba로 이루어진 군에서 선택되는 하나 이상이며, 상기 비금속 음이온은 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온으로 이루어진 군에서 선택되는 하나 이상이고,
상기 이온성화합물II의 +1가 이상의 금속 양이온은 Li, Na, K 로 이루어진 군에서 선택되는 하나 이상이며, -1가 또는 -2가 음이온은 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온으로 이루어진 군에서 선택되는 하나 이상이며,
상기 전도성 고분자는 Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole 단독 또는 둘 이상을 포함하는 것을 특징으로 하는
이온성화합물을 이용한 고저항 접착제 조성물.
Regarding the composition (III) in which the composition (I) containing the water-soluble adhesive and the composition (II) containing the grass made of grain were mixed in a weight ratio of 1: 0.2 to 10,
3 to 18% by weight of ionic compound I, which combines metal cations with +2 or higher valence and non-metal anions, and is added in the form of an aqueous solution;
3 to 10% by weight of Ionic Compound II, which is a combination of +1 or more valent metal cations and -1 or -2 valent anions, added in the form of an aqueous solution;
It is prepared by mixing 0.1 to 50% by weight of a conductive polymer,
The water-soluble adhesive includes acrylic emulsion, epoxy emulsion, polyvinyl acetate and emulsion, urethane, silicone adhesive, EVA (Ethylene Vinyl Acetate)-based adhesive, resorcinol-based adhesive (Resorcinol), α-olefin-based adhesive (α-Olefin), vinyl chloride resin-based adhesive (Polyvinyl chloride), isocyanate-based adhesive (Isocyanate), phenol resin-based adhesive (Phenolic ) alone or in combination,
Grasses made from the above grains include rice, wheat, bran, corn, potato, dextrin alone or two or more,
The +2 or higher valent metal cation of the ionic compound I is at least one selected from the group consisting of Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, and Ba, and the non-metal anion is fluorinated anion, bromide anion, iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromate anion, dichromate anion , At least one selected from the group consisting of halogen anions, hydrochloric acid anions, and organic acid anions,
In the ionic compound II, the metal cation having a valence of +1 or more is at least one selected from the group consisting of Li, Na, and K, and the -1 or -2 valent anion is a fluoride anion, a bromide anion, an iodide anion, a sulfide anion, Chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromic acid anion, dichromate anion, halogen anion, hydrochloric acid anion, and organic acid anion At least one selected from the group,
The conductive polymer is characterized in that it contains Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole alone or two or more
High-resistance adhesive composition using an ionic compound.
제 1항에 있어서,
상기 이온성화합물I 은 양이온으로 Ca, 음이온으로 염화 음이온을 포함하며,
상기 이온성화합물II 은 양이온으로 Na, 음이온으로 염화 음이온을 포함하는 것을 특징으로 하는
이온성화합물을 이용한 고저항 접착제 조성물.
According to claim 1,
The ionic compound I includes Ca as a cation and chloride anion as an anion,
The ionic compound II is characterized in that it contains Na as a cation and chloride anion as an anion
High-resistance adhesive composition using an ionic compound.
수용성 접착제를 포함하는 조성물(I)과 곡물로 제조된 풀을 포함하는 조성물(II)을 1: 0.2~10 중량비로 혼합한 조성물(III)에 대하여,
+2가 이상의 금속 양이온과 비금속 음이온이 결합되며, 수용액 형태로 첨가되는 이온성화합물I 3~18중량%,
+1가 이상의 금속 양이온과 -1가 또는 -2가 음이온이 결합된 것이며, 수용액 형태로 첨가되는 이온성화합물II 3~10중량%,
전도성고분자 0.1~50중량% 를 교반속도 30~20,000rpm, 교반시간 5분~3시간 혼합하여 제조된 것이며,
상기 수용성 접착제는 아크릴 에멀젼계 접착제(Acrylic emulsion), 에폭시 에멀젼계 접착제(epoxy emulsion), 폴리비닐아세테이트 및 에멀젼계 접착제(Poly Vinyl Acetate and emulsion), 우레탄계 접착제(Urethane), 실리콘(Silicone)계 접착제, EVA(Ethylene Vinyl Acetate)계 접착제, 레조르시노르계 접착제(Resorcinol), α-올레핀계 접착제(α-Olefin), 염화 비닐 수지계 접착제(Polyvinyl chloride), 이소시아네이트계 접착제(Isocyanate), 페놀 수지계 접착제(Phenolic) 단독 또는 둘 이상을 포함하며,
상기 곡물로 제조된 풀은 쌀, 밀, 밀기울, 옥수수, 감자, 덱스트린 단독 또는 둘 이상을 포함하며,
상기 이온성화합물I의 +2가 이상의 금속 양이온은 Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, Ba로 이루어진 군에서 선택되는 하나 이상이며, 상기 비금속 음이온은 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온으로 이루어진 군에서 선택되는 하나 이상이고,
상기 이온성화합물II의 +1가 이상의 금속 양이온은 Li, Na, K 로 이루어진 군에서 선택되는 하나 이상이며, -1가 또는 -2가 음이온은 플루오르화 음이온, 브롬화 음이온, 요오드화 음이온, 황화 음이온, 염화 음이온, 암모늄 음이온, 수산화 음이온, 황산 음이온, 탄산 음이온, 질산 음이온, 인산 음이온, 과망간산 음이온, 아세트산 이온, 탄산수소 음이온, 붕산 음이온, 크롬산 음이온, 중크롬산 음이온, 할로겐 음이온, 염산 음이온, 유기산 음이온으로 이루어진 군에서 선택되는 하나 이상이며,
상기 전도성 고분자는 Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole 단독 또는 둘 이상을 포함하는 것을 특징으로 하는
이온성화합물을 이용한 고저항 접착제 조성물의 제조방법.
Regarding the composition (III) in which the composition (I) containing the water-soluble adhesive and the composition (II) containing the grass made of grain were mixed in a weight ratio of 1: 0.2 to 10,
3 to 18% by weight of ionic compound I, which combines metal cations with +2 or higher valence and non-metal anions, and is added in the form of an aqueous solution;
3 to 10% by weight of Ionic Compound II, which is a combination of +1 or more valent metal cations and -1 or -2 valent anions, added in the form of an aqueous solution;
It is prepared by mixing 0.1 to 50% by weight of conductive polymer at a stirring speed of 30 to 20,000 rpm and a stirring time of 5 minutes to 3 hours,
The water-soluble adhesive includes acrylic emulsion, epoxy emulsion, polyvinyl acetate and emulsion, urethane, silicone adhesive, EVA (Ethylene Vinyl Acetate)-based adhesive, resorcinol-based adhesive (Resorcinol), α-olefin-based adhesive (α-Olefin), vinyl chloride resin-based adhesive (Polyvinyl chloride), isocyanate-based adhesive (Isocyanate), phenol resin-based adhesive (Phenolic ) alone or in combination,
Grasses made from the above grains include rice, wheat, bran, corn, potato, dextrin alone or two or more,
The +2 or higher valent metal cation of the ionic compound I is at least one selected from the group consisting of Co, Cu, Ni, Mn, Zn, Fe, Al, Be, Mg, Ca, and Ba, and the non-metal anion is fluorinated anion, bromide anion, iodide anion, sulfide anion, chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromate anion, dichromate anion , At least one selected from the group consisting of halogen anions, hydrochloric acid anions, and organic acid anions,
In the ionic compound II, the metal cation having a valence of +1 or more is at least one selected from the group consisting of Li, Na, and K, and the -1 or -2 valent anion is a fluoride anion, a bromide anion, an iodide anion, a sulfide anion, Chloride anion, ammonium anion, hydroxide anion, sulfate anion, carbonate anion, nitrate anion, phosphate anion, permanganate anion, acetate ion, hydrogencarbonate anion, borate anion, chromic acid anion, dichromate anion, halogen anion, hydrochloric acid anion, and organic acid anion At least one selected from the group,
The conductive polymer is characterized in that it contains Polythiophene, PEDOT-PSS, Polyaniline, Polypyrrole alone or two or more
Method for producing a high-resistance adhesive composition using an ionic compound.
제 1항 또는 제2항의 고저항 접착제 조성물이 적용된 제품.
A product to which the high-resistance adhesive composition of claim 1 or 2 is applied.
제 4항에 있어서,
상기 제품은 도료, 벽지, 가구, 바닥제, 커튼, 블라인드 중 어느 하나인 것임을 특징으로 하는 고저항 접착제 조성물이 적용된 제품.
According to claim 4,
The product is a product applied with a high resistance adhesive composition, characterized in that any one of paint, wallpaper, furniture, flooring, curtains, blinds.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355468B1 (en) 1994-10-21 2003-05-17 이. 카소기 인더스트리스,엘엘씨 Foamed starch compositions, articles and methods
KR100684035B1 (en) * 2003-05-19 2007-02-16 이종영 The anti-static adhesives by using chloride, and applicable products thereof
JP2009167581A (en) * 2008-01-12 2009-07-30 Shinrin Kenkyusho:Kk Charcoal coated paper
JP2010513608A (en) 2006-12-20 2010-04-30 コロプラスト アクティーゼルスカブ Adhesive composition containing salt

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160086164A (en) * 2015-01-09 2016-07-19 가톨릭대학교 산학협력단 Iontophoresis System

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355468B1 (en) 1994-10-21 2003-05-17 이. 카소기 인더스트리스,엘엘씨 Foamed starch compositions, articles and methods
KR100684035B1 (en) * 2003-05-19 2007-02-16 이종영 The anti-static adhesives by using chloride, and applicable products thereof
JP2010513608A (en) 2006-12-20 2010-04-30 コロプラスト アクティーゼルスカブ Adhesive composition containing salt
JP2009167581A (en) * 2008-01-12 2009-07-30 Shinrin Kenkyusho:Kk Charcoal coated paper

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