KR102555403B1 - Organic Light Emitting Diode Panel and Flexible Display Device Using the Same - Google Patents

Abstract

The present invention relates to an organic light emitting diode panel having reliability even in a plurality of folding operations by changing an internal panel structure and a flexible display device using the same. And, on the substrate, a first electrode divided for each subpixel, a bank having a light emitting opening for each subpixel, and a bank hole extending across the boundary of adjacent subpixels, and the light emitting opening and the upper part of the bank and the inside of the bank hole , and includes an organic layer including an organic light emitting layer and a second electrode covering an upper portion of the organic layer.

Description

Organic Light Emitting Diode Panel and Flexible Display Device Using the Same {Organic Light Emitting Diode Panel and Flexible Display Device Using the Same}

[0001] The present invention relates to a display device, and more particularly, to an organic light emitting diode (OLED) panel having reliability even after multiple folding operations by changing an internal panel structure and a flexible display device using the same.

Specific examples of the flat panel display device include a liquid crystal display device (LCD), an organic light emitting display device (Organic Emitting Display Device), a plasma display panel device (PDP), and a quantum dot display device (Quantum Dot Display Device). ), Field Emission Display device (FED), Electrophoretic Display Device (EPD), etc., which commonly use a flat panel display panel that implements an image as an essential component, A flat panel display panel has a structure in which a pair of transparent insulating substrates are bonded face-to-face with an inherent light emitting or polarizing or other optical material layer interposed therebetween.

Recently, demand for a flat display device that occupies less space has increased as display devices have increased in size, and as one of such flat display devices, technology related to an organic light emitting display device is rapidly developing.

An organic light emitting display device does not require a separate light source and displays by including self-emitting organic light emitting diodes in units of pixels therein. The advantages are great, and it is being considered as a next-generation display device.

The organic light emitting diode is a device that emits light while disappearing after electrons and holes form pairs when charge is injected into an organic film formed between an electron injection electrode (cathode) and a hole injection electrode (anode).

Meanwhile, display devices including the above-described organic light emitting display device have recently been demanded to be used in a flexible form, and there is an example implemented as a flexible display device.

The flexible display device has gradually become thinner and is being developed into a foldable type. However, flexible display devices up to now have a problem in that the folding portion is not turned on because the folding portion is damaged as the number of repeated folding operations increases.

1A and 1B are cross-sectional views illustrating an inner folding operation of a display device and a stress phenomenon in a folding portion after inner folding.

FIG. 1A shows an inner folding operation of the flexible display device, and FIG. 1B shows the most stressful point in the folding portion when it is folded in half.

That is, when the flexible display device is folded in half, a folding portion is generated in an area that divides the flexible display device into two parts vertically. Even after returning to the original state, there is a problem in that the region corresponding to the folding portion cannot be lit and cannot be used for display.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an organic light emitting diode panel having reliability even after multiple folding operations by changing an internal panel structure and a flexible display device using the same.

An organic light emitting diode panel of the present invention for achieving the above object is a substrate having a plurality of subpixels in a matrix form, a first electrode divided for each subpixel on the substrate, and a light emitting opening for each subpixel and a bank having a bank hole across the boundary of adjacent subpixels, an organic layer positioned above the light emitting opening, above the bank and inside the bank hole, and including an organic light emitting layer, and a second electrode covering the top of the organic layer. .

The first electrode may be divided from each other in adjacent subpixels with the bank hole as a boundary. The first electrode may be spaced apart from the bank hole in a plan view, and the organic layer may be separated from the inside of the bank hole and on the bank around the bank hole. In this case, the organic layer may not be provided on sidewalls of the bank hole.

In addition, a thin film transistor and a protective film covering the thin film transistor may be further included between the substrate and the first electrode. In this case, the organic layer may be in contact with the first electrode at the light emitting opening, and the organic layer may be in contact with the passivation layer at the bank hole.

Meanwhile, the bank hole may be provided in a plurality of subpixels located on the center line dividing the substrate vertically, and the bank hole may be provided within 10 rows adjacent to the row of subpixels corresponding to the center line dividing the substrate vertically. It may be selectively provided in subpixels of . This is because an external force is applied to this area during folding, and it is to improve the anti-peeling force at this area.

In addition, the bank hole may be located along the vertical direction of the substrate, may be located along the horizontal direction, or may be located along a long slit in both the vertical and horizontal directions of the substrate. In addition, a plurality of bank holes may be spaced apart from each other, corresponding to a single subpixel, at a boundary between adjacent subpixels.

Meanwhile, the organic layer may have a shape in which a hole injection layer, a hole transport layer, the organic light emitting layer, and an electron transport layer are stacked. In this case, the organic light emitting layer may be a white light emitting layer or a color light emitting layer having different light emitting colors corresponding to light emitting openings corresponding to each subpixel. In the latter case, color emission layers of adjacent subpixels may overlap each other in the bank hole. When adjacent subpixels have different color emitting layers corresponding to each other, regions can be separated by applying a different Fine Metal Mask (FMM) corresponding to each color emitting layer. can occur. However, in the organic light emitting diode panel of the present invention, even if the color light emitting layer overlaps at the subpixel boundary, the organic light emitting layer is separated along the bank hole through the bank hole provided at the boundary so that the organic layer is divided along the subpixel boundary, Even when an external force such as folding is applied, the peeling problem can be solved by dispersing the stress.

In addition, the bank may further include a spacer in each sub-pixel except for the bank hole.

Further, a barrier laminate in which one or more pairs of inorganic layers and organic layers are alternated may be further included to encapsulate the organic light emitting diode including the first and second electrodes and the organic layer above the organic light emitting diode.

A display device of the present invention for achieving the same object is a flexible substrate having a plurality of subpixels in a matrix form, and a thin film transistor array including one or more thin film transistors corresponding to each subpixel on the flexible substrate, and , A bank divided for each subpixel, having a first electrode connected to the thin film transistor, a light emitting opening for each subpixel, and a bank having a bank hole across the boundary of adjacent subpixels, the light emitting opening and the organic light inside the bank hole An organic light emitting diode array including an organic layer including a light emitting layer and a second electrode covering an upper portion of the organic layer, a barrier laminate in which one or more pairs of inorganic films and organic films are alternated covering the organic light emitting diode array, and one side of the flexible substrate It may include a driving unit connected to the thin film transistor array and a case covering the driving unit and mounting the flexible substrate.

Here, the flexible display device may further include a touch electrode array in contact with the barrier laminate. In addition, the flexible substrate may include a plastic film and a multi-layered inorganic film on an upper surface thereof, and the thin film transistor array and the driver may be placed in contact with the multi-layered inorganic film.

The organic light emitting diode panel and the flexible display device according to the present invention have the following effects.

When the bank defining the light emitting aperture is formed, a bank hole having a substantially vertical sidewall taper is further provided corresponding to the boundary of the subpixel, so that an organic layer formed thereafter is disconnected around the bank hole, so that the organic layer can act on a subpixel basis. Therefore, when an external force is applied at the folding line, it is possible to prevent the organic layer from being peeled off by dispersing the external force. Accordingly, it is possible to prevent a lighting defect occurring in the folding line when an external force is applied. Accordingly, reliability of the organic light emitting diode panel and the flexible display device using the same can be improved.

In addition, since the taper of the sidewall of the bank hole of the present invention is substantially vertical and no organic layer remains on the sidewall of the bank hole, the bank hole has a structure in which the inside of the bank hole and the organic layer above the bank can be separated from each other. This has the effect of dividing the organic layer, including the organic light-emitting layer, regardless of whether or not a mask is provided during the deposition process, and also places an area without an organic layer on the sidewall of the bank hole so that the inorganic layer material and the bank are in contact at the sidewall of the bank hole. can improve interfacial adhesion. In addition, the portions with improved interfacial adhesiveness may be provided at a plurality of locations along the folding line to improve the fixing force of the entire organic light emitting diode panel.

1A and 1B are cross-sectional views illustrating a stress phenomenon in a folding portion after an inner folding operation of a display device and a plurality of times of inner folding;
Figure 2 is a plan view of the organic light emitting diode panel of the present invention
3 is a basic circuit diagram of each subpixel of FIG. 2
Figure 4 is a schematic cross-sectional view of Figure 2
5 is a cross-sectional view showing a connection between the thin film transistor of FIG. 4 and an organic light emitting diode;
6a is a cross-sectional view showing a state of organic layer deposition between adjacent banks according to a comparative example;
FIG. 6B is a cross-sectional view showing a state of organic layer deposition between adjacent banks of the organic light emitting diode panel according to the first embodiment of the present invention along lines II to I' of FIG. 2;
7 is a plan view illustrating banks of subpixels corresponding to folding lines of an organic light emitting diode panel according to the present invention;
8A and 8B are process plan views illustrating a method of manufacturing an organic light emitting diode panel according to a first embodiment of the present invention.
9 is a cross-sectional view showing a state in which an organic layer is deposited between adjacent banks of an organic light emitting diode panel according to a second embodiment of the present invention.
10A to 10C are process plan views illustrating a method of manufacturing an organic light emitting diode panel according to a second embodiment of the present invention.
11a and 11b are cross-sectional views showing organic light emitting diode panels according to third and fourth embodiments of the present invention.
12a and 12b are plan views of organic light emitting diode panels according to third and fourth embodiments of the present invention.
13A to 13E are cross-sectional views showing modified examples of bank holes of the organic light emitting diode panel according to the present invention.
14 is a cross-sectional view showing an organic light emitting diode panel according to a second embodiment of the present invention.
15A to 15C are cross-sectional views illustrating various embodiments of a flexible display device according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numbers throughout the specification indicate substantially the same elements. In the following description, if it is determined that a detailed description of a known technology or configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the component names used in the following description are selected in consideration of the ease of writing the specification, and may be different from the part names of the actual product.

2 is a plan view of an organic light emitting diode panel of the present invention, FIG. 3 is a basic circuit diagram of each subpixel of FIG. 2 , and FIG. 4 is a schematic cross-sectional view of FIG. 2 . Also, FIG. 5 is a cross-sectional view showing a connection portion between the thin film transistor of FIG. 4 and the organic light emitting diode.

As shown in FIG. 4, the organic light emitting diode panel of the present invention has a thin film transistor array 130 and an organic light emitting diode array 150 on a flexible substrate 100, and these arrays 130 and 150 The thickness of the entire organic light emitting diode panel 1000 including the is smaller than that of a single glass substrate and is within about 300 μm, and the entire panel is foldable or rollable. In addition, the organic light emitting diode array 150 is covered with the barrier laminate 200 so as to cover all sides as well as the top to prevent external moisture or air from entering. The barrier laminate 200 has a shape in which an edge of one side of the substrate 100 having a pad portion (not shown, connected to the driver portion) including the driving portion 250 on the substrate 100 is exposed.

In addition, the substrate 100 may be, for example, a plastic film or a thin glass substrate obtained by etching a glass substrate to a thin thickness, and in the case of a plastic substrate, polyester or a copolymer containing polyester. , polyimide or a copolymer containing polyimide, an olefinic copolymer, polyacrylic acid or a copolymer containing polyacrylic acid, a copolymer containing polystyrene or polysterin, poly polysulfate or copolymers containing polysulfate, polycarbonate or copolymers containing polycarbonate, polyamic acid or copolymers containing polyamic acid, polyamines and polyamic acids It may include at least one polymer compound selected from the group consisting of a copolymer, polyvinylalcohol, and polyallylamine. At this time, the substrate 100 may have a thickness of 5 μm to 150 μm, preferably 50 μm or less. In addition, in order to prevent the substrate 100 from being curled or damaged by heat or pressure when directly performing an array process of the thin film transistor array 130 or the organic light emitting diode array 150, multiple layers are formed on the glass substrate. After the buffer layer 110 and the active buffer layer 120 are further provided, the thin film transistor array 130 and the organic light emitting diode array 150 are formed. In this case, the glass substrate used during the process is removed after applying the array formation process, and the substrate 100 remains on the surface of the entire organic light emitting diode panel. In some cases, the substrate 100 may be bonded after removing the glass substrate. In addition, the plurality of buffer layers 110 and the active buffer layer 120 may be partially omitted.

In some cases, if the array formation process is possible even with a low-temperature process of about 240° C. or less, the array formation process may be performed directly on the substrate 100. In this case, the substrate 100 and the thin film transistor array may come into contact or Excluding the active buffer layer 120, the multi-layer buffer layer 110 may be formed with only a single buffer layer.

The multi-layered buffer layer 110 may be an inorganic film laminate such as a silicon oxide film or a silicon nitride film.

Meanwhile, as shown in FIG. 2 , the substrate 100 has a plurality of sub-pixels SP in a matrix, and as shown in FIG. 3 , each sub-pixel SP has at least one thin film transistor S-Tr, D- Tr), a storage capacitor (Cst), and a circuit unit including an organic light emitting diode (OLED) connected to the storage capacitor (Cst) and the thin film transistor (D-Tr). 3 shows an example in which a selection thin film transistor (S-Tr) and a driving thin film transistor (D-Tr) are provided as two thin film transistors, and thin film transistors may be further added as needed. Among them, the driving thin film transistor D-Tr is electrically connected to the first electrode of the organic light emitting diode, and the storage capacitor Cst is connected to the gate electrode of the driving thin film transistor D-Tr and the driving thin film transistor D -Tr) is connected between the first electrode of the organic light emitting diode (OLED) and the connecting terminal connected thereto. The connection terminal may be a source electrode or a drain electrode of the driving thin film transistor D-Tr, and when the drain electrode is a connection terminal, the source electrode is connected to the driving current line VDL to receive a driving voltage. When the source electrode is a connection terminal, the drain electrode is connected to the driving current line VDL.

Also, the circuit unit is provided on a gate line GL and a data line DL that cross each other, and the driving current line VDL is parallel to the data line DL. In addition, the second electrode of the organic light emitting diode (OLED) is formed to cover all of the subpixels and is commonly connected to a ground line or a Vss line provided at an edge of the substrate 100 . The selection thin film transistor S-Tr is between the gate line GL and the data line DL, and is connected to the gate electrode of the driving thin film transistor D-Tr connected to the storage capacitor, so that a predetermined sub-pixel is According to the selective driving of the selection thin film transistor (S-Tr), a current is transferred to the organic light emitting diode through the driving thin film transistor (D-Tr) to control on/off of the provided organic light emitting diode.

Meanwhile, the selection thin film transistor (S-Tr) and the driving thin film transistor (D-Tr) each have a semiconductor layer (see 131 in FIG. 5) having a channel between a source electrode and a drain electrode. The semiconductor layer includes amorphous silicon, It may be polysilicon or an oxide semiconductor. In the case of polysilicon, a high-temperature process of about 400° C. or more is required for crystallization, and in this case, the active buffer layer 120 may be essential.

Also, the gate line GL and the data line DL crossing each other are positioned to correspond to the boundaries of the subpixels of FIG. 2 .

The above-described thin film transistor array 130 is not limited to the illustrated shape, and the position of each layer may be changed or the width thereof may be adjusted as necessary, and the number of thin film transistors provided for each sub-pixel may also be changed.

Referring to FIG. 5, the connection between the thin film transistor and the organic light emitting diode will be described.

The thin film transistor array 130 includes one or more thin film transistors shown in FIG. 5 corresponding to each subpixel. The illustrated thin film transistor represents a driving thin film transistor connected to the first electrode of the organic light emitting diode.

Each thin film transistor is located on top of the active layer 131 formed on a predetermined portion between the active layer 131 formed on a predetermined portion of the substrate 100 and the gate insulating film 132 covering the active layer 131. A source electrode 135a and a drain electrode 135b connected to both sides of the gate electrode 133 and the active layer 131 are included.

An interlayer insulating film 134 is positioned between the gate electrode 133 and the source/drain electrodes 135a and 135b, and penetrates the interlayer insulating film 134 and the gate insulating film 132, and the source electrode 135a and first and second contact holes 134a and 134b connecting the drain electrode 135b and the active layer 131 are provided.

Meanwhile, the thin film transistor array 130 is formed on the interlayer insulating film 134 on which the source/drain electrodes 135a and 135b are formed in order to stabilize the electrical and interfacial characteristics of the region excluding the connection between the thin film transistor and the organic light emitting diode. , an inorganic protective film 136 and an organic protective film 137 are sequentially formed. Here, the organic passivation layer 137 is made of an organic material capable of flattening the surface, and the organic passivation layer 137 and the inorganic passivation layer 136 form a third contact hole 137a exposing the drain electrode 135b. to provide

Meanwhile, the inorganic protective layer 136 may be omitted.

Therefore, the first electrode 151 of the organic light emitting diode is connected to the drain electrode 135b of the thin film transistor through the third contact hole 137a, occupies at least the light emitting opening and is on the organic passivation layer 137. Located.

In addition, the organic light emitting diode (OLED) includes the first electrode 151, a bank 152 exposing a light emitting opening on top of the first electrode 151, and an organic light emitting layer corresponding to at least the light emitting opening. The second electrode 154 is formed on the organic layer 153 and then on the organic layer positioned above the bank 152 and the first electrode 151 .

In the organic light emitting diode (OLED), the bank 152 does not have a circuit function, but the organic light emitting layer selectively functions between the first and second electrodes 151 and 154, meaning to separate the light emitting area am.

On the other hand, the organic light emitting diode panel of the present invention has improved adhesive properties at the interface where the organic layer 153 is deposited by changing the shape of the bank 152 or/and the first electrode 151. explain according to

*First Embodiment*

Figure 6a is a cross-sectional view showing a state of organic layer deposition between adjacent banks according to a comparative example, and Figure 6b is a cross-sectional view showing a state of organic layer deposition between adjacent banks of the organic light emitting diode panel according to the first embodiment of the present invention along the line I to I' in FIG. 7 is a plan view showing banks of subpixels corresponding to folding lines of the organic light emitting diode panel according to the present invention.

As shown in FIGS. 6B and 7 , the organic light emitting diode panel according to the first embodiment of the present invention includes a substrate having a plurality of subpixels in a matrix (see 100 in FIGS. 4 and 5 ), and the substrate 100 On the top, a first electrode 151 divided for each sub-pixel, a bank 152 having a light emitting opening 1520a for each sub-pixel and a bank hole 1520b across the boundary of adjacent sub-pixels, and the light emitting It is located in the opening 1520a, above the bank 152 and inside the bank hole 1520b, and includes an organic layer 153 including an organic emission layer and a second electrode 154 covering the upper portion of the organic layer 153. Here, the light emitting opening 1520a and the bank hole 1520b are separated by a predetermined interval, and a bank 152 exists between the light emitting opening 1520a and the bank hole 1520b to divide these areas.

The organic light emitting diode panel of the present invention is different from the comparative example of FIG. 6A in that the bank 152 further includes a bank hole 1520b in addition to the light emitting opening 1520a.

As shown in FIG. 6A, in the comparative example, since only the light emitting opening 52a corresponding to the center of each subpixel is provided in a groove shape, the upper part of the bank 52 and the light emitting opening ( 52a) as well as the organic layer 53 remaining on the gentle slope of the side of the bank 52.

Actual organic layers are more often provided with common layers on the lower and upper portions than when formed as a single layer.

For example, the organic layers 53 and 153 include, in order from the bottom, a hole injection layer (HIL), a hole transport layer (HTL), an organic light emitting layer (EML), and an electron transport layer (ETL). Then, the organic layers 53 and 153 are successively deposited by changing the vapor deposition material in the vapor deposition equipment in order to form the vapor deposition (evaporation).

Here, the hole injection layer (HIL), the hole transport layer (HTL), and the electron transport layer (ETL) are common layers and are formed over the entire area without dividing subpixels.

In the case of the organic light emitting layer (EML), whether or not a mask (Fine Metal Mask, a type of shadow mask) is provided varies depending on whether it is a white light emitting layer or a color light emitting layer. Each color light emitting layer is deposited by providing a shadow mask for depositing a color light emitting layer. The color light emitting layer may be, for example, a red, green, or blue light emitting layer. After forming the first color light emitting layer through the opening of the shadow mask, shifting the shadow mask by one subpixel to form a second color light emitting layer, and then shifting the shadow mask by one subpixel to form a third color light emitting layer. can When the white light emitting layer is an organic light emitting layer (EML), the white light emitting layer is commonly formed in all subpixels. In this case, the white light emitting layer may be a single white light emitting layer, or a plurality of light emitting layers may be stacked to realize white light emitting.

In addition, when the color light emitting layer is formed, the upper and lower hole injection layer (HIL), hole transport layer (HTL), and electron transport layer (ETL) layers are selectively formed together with a mask having light emitting openings corresponding to color subpixels to be formed. It can also be divided and formed in each sub-pixel by using.

However, not only when an organic layer is formed in common without a mask, but also when an organic layer is formed by dividing an area with a mask, the deposition material overlaps with each other at the boundary of adjacent subpixels due to the limit of resolution, As shown in FIG. 6A, the organic layer 53 is observed deposited over the entire area of the sub-pixels. That is, the organic layer 53 is deposited not only on the upper surface of the bank 52 and the light emitting opening 52a but also on the side of the bank 52 . In addition, the organic layer 53 is formed to a thin thickness of 0.1 μm or less by vaporizing the material, and the surface adhesiveness is very low. Therefore, when an external force that bends the surface is applied from the outside, peeling may occur at the interface between the surface of the bank 52 having low adhesiveness and the organic layer 53 .

In this case, the second electrode 54 is formed on the top where the organic layer 53 is deposited. When peeled off by an external force, the second electrode 54 is lifted together with the organic layer 53, and the corresponding sub The pixel has a problem of not lighting up.

On the other hand, in the case of the color light emitting layer, a mask is used to form the color light emitting layer by dividing each subpixel, but as the size of the subpixel gets smaller, there is a process margin problem, so the color light emitting layer cannot be completely formed into the light emitting opening. There is a problem that adjacent color light emitting layers may overlap at the boundary of .

In the case of implementing the flexible display device, it was explained that a plurality of times of folding experiments were carried out, and that lighting failures appeared in sub-pixels in weak areas as the experiments were repeated.

As a result of analyzing the cause of the lighting failure, the inventors of the present invention confirmed that the organic layer of Comparative Example and the interface where the organic layer is deposited had weak adhesive properties and thus peeling occurred.

The cause is due to the characteristics of the material for depositing the organic layer and the deposition method. For example, in the case of a bank defining a region of a light emitting opening, after coating a liquid material, using a photo mask to expose and develop, The organic layer is deposited on the surface of a gaseous material, and can be easily peeled off when stress is applied from the outside due to low adhesion on the surface to which the deposition material comes in contact.

In addition, the bank is formed to a thickness of about 1 μm to 3 μm, and even if both the organic light emitting layer and the common layer are included, the organic layer having a thickness of about 0.1 μm is less than 1/10 of the thickness of the bank, and is easily peeled off. It can be.

In addition, structurally, it can be expected that the bank has a lower deposition rate of vapor phase material on the gently inclined side than on the flat part, and in particular, the bank is vulnerable to external stress at the inclined portion.

As shown in FIG. 6B, in the organic light emitting diode according to the first embodiment of the present invention, a region defining a light emitting region within a bank 152 includes a bank hole 1520b in addition to a light emitting opening 1520a at a boundary between subpixels. , the slope of the side of the bank 152 corresponding to the bank hole 1520b is made almost vertical, so that the organic layer 153 to be deposited later is not deposited on the side of the bank 152 surrounding the bank hole 1520b. This is to separate the organic layer 153 between pixels. In this case, each organic layer 153 has an effect of being divided into subpixels by having the bank hole 1520b, and an external force applied at the folding line is distributed to each subpixel, thereby preventing organic layer separation at the folding line.

In addition, the upper surface of the bank 152 and the inside of the bank hole 1520b are separated from the side of the bank 152 around the bank hole 1520b of the organic light emitting diode panel according to the first embodiment of the present invention. Even when the organic layer 153 on the organic passivation layer 137 is divided and the organic layer 153 is formed as a color light emitting layer, overlapping of color light emitting layers in adjacent subpixels may be prevented, thereby preventing color mixing. Here, the organic layer 153 is electrically insulated from the organic light emitting diode of the sub-pixel because there is no first electrode 151 inside the bank hole 1520b even if different color emission layers partially overlap each other inside the bank hole 1520b. It has no effect on the display at all, and it does not affect the lighting of sub-pixels.

On the other hand, the second electrode 154 is positioned on the organic layer 153, and the light emitting opening 1520a and the bank hole 1520b except for the sidewall of the bank 152 where the taper of the bank 152 is almost vertical It can be seen that the second electrode 154 is also formed on the surface of the internal organic layer 153 and the sidewall of the bank 152 having a gentle taper around the light emitting opening 1520a. For example, the second electrode 154 may be formed as a transparent electrode or a reflective electrode by a sputtering method. In this case, the second electrode 154 is a barrier layer formed thereon for encapsulation. The material of the sieve 200 and adhesion are good. In addition, as shown, even if the second electrode 154 is selectively absent corresponding to the sidewall of the bank hole 1520b, since this absence region is a kind of hole shape, the second electrode 154 corresponding to all sub-pixels There is no problem in forming a voltage in common.

8A and 8B are process plan views illustrating a method of manufacturing an organic light emitting diode panel according to a first embodiment of the present invention, and in particular, a plan view illustrating a change in shape of a bank 152 .

As shown in FIG. 8A, in the method of manufacturing an organic light emitting diode panel according to the first embodiment of the present invention, first, a bank forming material such as photo acryl or polyimide is firstly formed into an organic passivation layer (emission opening 1520a of FIG. 6b). After forming the entire surface on the image, prepare a photo mask (not shown, the same shape as or reversed to the shape of the bank 152 of FIG. 8A) to correspond to the bank forming material, and then proceed with exposure and development processes, A bank 152 having a light emitting opening 1520a is formed, and sidewalls of the bank 152 surrounding the light emitting opening 1520a may have a smooth shape, as shown in FIG.

When the bank forming material is a photoreactive material, patterning is possible directly in the exposure and development process without a separate photoresist film. Otherwise, after applying a photoresist film on top of the bank forming material, After forming a photoresist film pattern in which a region corresponding to the light emitting opening 1520a is removed through exposure and development processes on a photo mask, a bank forming material may be etched along the photoresist film pattern to form the bank 152 . In the patterning process, when the bank formation material is a light-reactive material, a developer directly corresponds to the bank formation material, and an etchant is supplied to the bank formation material in the patterning process after forming a photoresist film pattern on the bank formation material. During wet etching, the etchant (or developer) acts isotropically, so that the sidewall of the bank 152 around the light emitting opening 1520a has a gentle slope.

Then, in order to separate the organic layer at the boundary of the sub-pixel, as shown in FIG. 8B, a mask (not shown) having a separate hole is prepared to selectively remove a predetermined region of the boundary of the sub-pixel, and plasma is applied to the hole. Gas is supplied to dry-etch the bank 152 to form a bank hole 1520b at the dry-etched portion.

As shown in FIG. 6B, the sidewall of the bank 152 around the bank hole 1520b is dry etched to have a profile substantially perpendicular to the surface of the substrate 100, so that in the subsequent organic layer deposition process, Since the organic layer 153 does not remain on the sidewall of the bank 152 around the bank hole 1520b, the organic layer 153 may be separated from the bank hole 1520b. That is, the organic layer 153 may be separated from the upper portion of the bank 152 in and around the bank hole 1520b. In this case, the organic layer 153 is not provided on the sidewall of the bank hole 1520b. In this case, the bank 152 corresponding to the sidewall of the bank hole 1520b can come into contact with the barrier laminate 200 to be formed later, and relatively chemical vapor deposition (CVD: atomic layer) or atomic layer The barrier laminate 200 deposited by atomic layer deposition has good deposition uniformity and excellent adhesion at the formed interface, particularly good interfacial adhesion with the exposed bank 152 .

In this case, the first electrode 151 under the bank 152 may be divided into adjacent sub-pixels with the bank hole 1520b as a boundary.

Meanwhile, as described above, in the first electrode 151, the top surface of the thin film transistor array 130 formed on the substrate 100 is the organic passivation layer 137, and the organic layer deposited inside the bank hole 1520b 153 may directly contact the organic passivation layer 137 therebelow. In addition, the first electrode 151 is mainly located in the center of each sub-pixel, is separated from each sub-pixel, and has a shape at least equal to or larger than the light emitting opening 1520a.

In addition, the organic layer 153 in the bank hole 1520b may be laterally connected to the first electrodes 151 of adjacent sub-pixels.

Meanwhile, the bank hole 1520b may be provided in a plurality of sub-pixels located on the center line of the substrate 100 considering that the folding line is generally located on the center line that divides the substrate into two halves. Alternatively, the bank hole 1520b may be selectively provided in subpixels within 10 rows adjacent to a row of subpixels corresponding to a center line that divides the substrate vertically. In the latter case, this is because the area to which the external force is applied during folding can be applied to the adjacent rows of a plurality of subpixels, and the arrangement of the bank hole 1520b is made in consideration of the arrangement of the folding lines and the area of the folding lines. can In a rollable display device that does not have a structure in which only a specific area is folded, the bank hole 1520b may be provided in all subpixels.

The reason why the bank hole 1520b is further provided is that an external force is applied to a portion corresponding to the bank hole 1520b during folding, and to improve peeling prevention force at this portion.

Meanwhile, since the sidewall of the bank 152 around the bank hole 1520b of the present invention has a substantially vertical taper, no organic layer remains in the subsequent organic layer deposition process. Regardless of whether the organic light emitting layer included in the organic layer is a white light emitting layer or a color light emitting layer, a phenomenon in which the organic layer is separated at the boundary of the bank hole 1520b can be obtained, and through this, stress resistance against external force applied to the folding line can be increased. there will be

*Second Embodiment*

9 is a cross-sectional view showing a state of organic layer deposition between adjacent banks of an organic light emitting diode panel according to a second embodiment of the present invention, and FIGS. 10A to 10C are manufacturing of an organic light emitting diode panel according to a second embodiment of the present invention. It is a process plan showing the method.

As shown in FIG. 9 , the organic light emitting diode panel according to the second embodiment of the present invention has the above-described first embodiment in that the first electrode 251 is spaced apart from the sidewall around the bank hole 1520b in a planar manner. Yes and have a difference. In the case of the second embodiment, the first electrode 251 does not come into contact with the organic layer 253 to be formed inside the bank hole 1520b at all on the side, so that the separation effect of the organic layer 253 inside the bank hole 1520b is good night. In addition, the organic layer 253 inside the bank hole 1520b has no effect on the function of the organic light emitting diode and is electrically insulated from adjacent subpixels.

In this case, the first electrode 251 is spaced apart from the sidewall of the bank 152 around the bank hole 1520b by a first distance a, which is an etching process for forming the first electrode 251 , it is possible by adjusting the width of the opening of the mask.

Alternatively, as shown in FIG. 10A, after forming the first electrode 251 having the same shape as the first embodiment, forming a bank 152 having a light emitting opening 1520a through an exposure and developing process through a photo mask, As shown in FIG. 10B, a bank hole 1520b having a substantially vertical taper on the sidewall is formed by dry etching, and then wet etching is performed as shown in FIG. 10C while holding the bank hole forming mask. The width of the first gap a of the first electrode 251 around the bank hole 1520b may be removed.

In this case, as shown in FIG. 9, the organic layer 253 entering the inside of the bank hole 1520b is spaced apart from the surrounding first electrodes 251, so that even if the first electrodes 251 and the light emitting material are included electrically, , not used for luminescence.

In addition, considering that there was a problem in that the organic layer was vulnerable to peeling when an external force was applied at the folding line, especially on the gently sloping side of the bank, the bank hole was provided and the organic layer 253 was removed from the inner sidewall of the bank hole Thus, it is possible to eliminate the cause of the problem and solve the problem of non-illumination of the corresponding sub-pixel, which is caused by the peeling of the organic layer due to folding.

11A and 11B are cross-sectional views illustrating organic light emitting diode panels according to third and fourth embodiments of the present invention, and FIGS. 12A and 12B are cross-sectional views of organic light emitting diode panels according to third and fourth embodiments of the present invention. it is flat

*Third Embodiment*

As shown in FIGS. 11A and 12A, in forming the bank hole 1520b in the third embodiment of the present invention, a separate dry etching is not performed, and the light emitting opening 1520a and the bank hole 1520b are masked once. It indicates that it is formed through a process.

Compared to the first embodiment, that is, as shown in FIG. 11A, an open mask (not shown) is prepared to correspond to the bank hole 1520b and the light emitting opening 1520a, and dry plasma is applied to the open area, so that all The difference is that the bank 352 is formed with a high slope of the side wall taper. In this case, the sidewalls of the bank 352 of the bank hole 1520b and the light emitting opening 1520a have the same inclination, and the inclination of the sidewall with respect to the surface of the substrate (see 100 in FIG. 4) is approximately 75° to 90°. In degrees, after the formation of the bank 352 having the bank hole 1520b and the light emitting opening 1520a, when the organic layer 353 is deposited, almost no organic layer material remains on the sidewall of the bank 352, which is almost vertical. A small amount may remain. Accordingly, an organic layer 353 is deposited on the upper surface of the first electrode 351 of the flat light emitting opening 1520a, inside the bank hole 1520b, and on the upper surface of the bank 352, and on the sidewall of each bank 352, the organic layer (353) can be separated.

And, as shown, if the taper of the sidewall of the bank 352 is not completely perpendicular to the surface of the substrate 100, the second electrode 354 is formed on the sidewall of the light emitting opening 1520a and the bank hole 1520b. It may remain thin compared to a relatively flat portion. Even in this case, the second electrode 354 made of metal remains on the sidewall of the bank hole 1520b, compared to the case in which the organic layer was formed entirely around the bank and its surroundings in the comparative example. Adhesion to the peripheral sidewall of 1520 may be improved.

*Fourth Embodiment*

As shown in FIGS. 11B and 12B , in forming the bank hole 1520b in the fourth embodiment of the present invention, a separate dry etching is not performed, and the light emitting opening 1520a and the bank hole 1520b are masked once. It indicates that it is formed through a process.

Compared to the third embodiment, that is, as shown in FIG. 11B, the difference is that the first electrode 451 is spaced apart from the bank hole 1520b by a first distance (a). In this case, as shown in FIG. 12B Similarly, when forming the first electrode 451, it is formed in advance to be spaced apart from the bank hole 1520b.

In common in the first to fourth embodiments described above, the organic layer is broken around the bank hole, so that the organic layer has an effect of being deposited in sub-pixel units, so that the external force applied to the folding line is dispersed so that the organic layer is not separated from the interface. don't let

This effect may be applicable to both the case where color light emitting layers of different colors are formed for each sub-pixel of the organic light emitting layer included in the organic layer, and when the white light emitting layer is commonly formed. The almost vertical taper of the sidewall of the bank hole prevents organic materials deposited in the vapor phase from remaining structurally without the application of a mask, and can be applied regardless of the method of forming the light emitting layer, which is divided according to whether or not a mask is applied.

Meanwhile, when different color emitting layers are formed for each subpixel, color emitting layers of adjacent subpixels in the bank hole may overlap each other. When adjacent subpixels have different color emitting layers corresponding to each other, regions can be separated by applying a shadow mask corresponding to each color emitting layer, but as the resolution increases, regions where color emitting layers overlap in adjacent regions may occur. . However, in the organic light emitting diode panel of the present invention, even if the color light emitting layer overlaps at the subpixel boundary, the organic light emitting layer is separated along the bank hole through the bank hole provided at the boundary so that the organic layer is divided along the subpixel boundary, Even when an external force such as folding is applied, the peeling problem can be solved by dispersing the stress.

The organic layer 153 includes a hole injection layer (HIL), a hole transport layer (HTL), an organic light emitting layer (EML), and an electron transport layer (ETL).

On the other hand, in some cases, an electron injection layer is further provided below the second electrode 154, but the electron injection layer is mostly an inorganic compound doped with a metal rather than an organic material, so in the process of forming the second electrode 154, A thin film is deposited before forming the second electrode 154, and the second electrode 154 is subsequently deposited.

13A to 13E are cross-sectional views showing modified examples of bank holes of the organic light emitting diode panel according to the present invention.

On the other hand, the shape of the bank hole may be a single small hole corresponding to a sub-pixel at a predetermined portion of the boundary of the sub-pixel as shown in FIG. .

Alternatively, as shown in FIG. 13B, it may be a plurality of bank holes 1520b spaced apart from each other in the vertical direction in a unit sub-pixel.

In some cases, as shown in FIG. 13c, the bank hole 1520b may have a horizontally long slit shape, and as shown in FIG. 13d, the bank hole 1520b surrounds the light emitting opening 1520a and has a plurality of horizontal , may be provided as a vertical slit. In both cases of FIGS. 13C and 13D , a plurality of bank holes 1520b may be spaced apart from each other in each direction.

Also, in some cases, the bank hole 1520b may have a closed loop shape along the boundary of a subpixel, as shown in FIG. 13E. In this case, the closed-loop bank hole 1520b has a shape connected to adjacent sub-pixels.

Meanwhile, in the above-described embodiments, protruding spacers are formed on the upper portions of the banks 152, 252, and 352 in order to prevent collapse of the pattern of the banks 152, 252, and 352 due to a load applied to the mask used when depositing the organic layer. can include more. Such a spacer may be located anywhere on the bank 152, 252, 352 region except for the bank hole 1520b.

14 is a cross-sectional view showing an organic light emitting diode panel according to a second embodiment of the present invention.

As shown in FIG. 14, looking at the organic light emitting diode panel according to the second embodiment of the present invention in detail, in order from the bottom, a substrate 100, a plurality of buffer layers 110, and an active buffer layer 120 are provided, and the On the active buffer layer 20, a thin film transistor array 130 including the thin film transistor described in FIG. 5 is formed, and on the thin film transistor array 130, connected to the drain electrode 135b of the thin film transistor, each A first electrode 251 separated for each sub-pixel, a bank 252 having a light emitting opening 1520a and a bank hole 1520b on the first electrode 251, and an upper part of the bank 152, the bank hole 1520b) An organic light emitting diode array having organic light emitting diodes (OLEDs) including an organic layer 253 inside and in the light emitting opening 1520a, and a second electrode 254 on the organic layer 253, for each subpixel. (250) is formed.

Here, the organic layer 253 is formed by sequentially stacking a hole injection layer, a hole transport layer, an organic emission layer, and an electron transport layer, and at least the hole injection layer, the hole transport layer, and the electron transport layer may be commonly formed over all subpixels.

The first electrode 251 is formed on the (organic) passivation layer 137, excluding the connection portion with the drain electrode 135b of the thin film transistor, and the bank hole 1520 is spaced apart from each other at the boundary of adjacent subpixels. corresponding to the area of the first electrode 251. In addition, the edge of the first electrode 251 is spaced apart from the bank hole 1520 by a first distance (a), and a dry etching mask or photoresist film forming the bank hole is maintained when the bank hole is formed. A wet etching may be performed to remove a portion of the width a of the first electrode 251 only in the region around the bank hole, thereby defining the first gap a.

In addition, at least one pair of the inorganic film 210 and the organic film 220 are alternately formed on the above-described organic light emitting diode array 250 to encapsulate the organic light emitting diode (OLED) including the first and second electrodes and the organic layer. The barrier laminate 200 is further included.

Here, the inorganic film 210 may be a silicon nitride film (SiNx), a silicon oxide film (SiOx), or an aluminum oxide film (Al2O3), and deposited to a thickness of 0.01 μm to 1.5 μm, using an atomic layer deposition method (Atomic Layer Deposition). ), it can be formed with a thin thickness and good interfacial bonding. And, functionally, the inorganic film 210 functions to prevent passage of moisture or outside air.

In addition, the organic layer 220 is thicker than the inorganic layer 210 and formed to have good flatness, and may be formed to a thickness of about 1 to 5 μm. The organic layer 220 functions to confine the particles in a corresponding layer so that when particles of the organic light emitting diode panel are generated, the particles do not affect the organic light emitting diode or the thin film transistor.

In this case, the organic light emitting diode array 150 is sealed so that the organic light emitting diode array 150 is not exposed to the outside air by covering not only the upper part but also the side of the organic light emitting diode array 150 with the barrier laminate 200 .

Meanwhile, the inorganic film 210 among the components of the barrier laminate 200 is positioned on the top surface of the organic light emitting diode panel to prevent external moisture or air from entering the inside through the barrier laminate 200 .

In addition, a spacer having a shape in which a portion of the bank 252 protrudes is further provided, and functions to support non-openings of the shadow mask so as not to droop when the organic light emitting layer is formed using a shadow mask.

The spacer is optional, and whether or not it is provided may be applied in consideration of whether a shadow mask is applied and the size of the opening, and may be provided in all areas except for the light emitting opening 1520a and the bank hole 1520b, or (252) It may be limited to only a part of the upper region.

15A to 15C are cross-sectional views illustrating various embodiments of a flexible display device according to the present invention.

As shown in FIG. 15A, the flexible display device of the present invention, as shown in FIG. 4, sequentially includes a flexible substrate 100, a plurality of buffer layers 110, an active buffer layer 120, a thin film transistor array 130, and the above-described embodiments. An organic light emitting diode array 150 having first and second electrodes and an organic layer between the first and second electrode layers including a bank having a bank hole 1520b in addition to the light emitting openings 1520a and a barrier stacked thereon It includes an organic light emitting diode panel made of a sieve 200 and a case 400 accommodating them. Here, the components other than the case 400 among the illustrated components are included in the organic light emitting diode panel. And, as described above, the flexible substrate 100 may be a plastic film, the plurality of buffer layers 110 and the active buffer layer 120 may be inorganic films, and the thin film transistor array 130 and the driver (Fig. 250) is formed in contact with these inorganic films.

15A shows a case of top emission, and in case of bottom emission, the case 400 reverses the entire organic light emitting diode panel and uses the barrier laminate 200 as the bottom surface. , It may be formed in a shape that surrounds the bottom surface of the barrier laminate 200 and the sides of the formed layers. In addition, the driving unit 250 of FIG. 2 may be covered by the case 400, and a system (not shown) for supplying a source of timing and images may be further included in the case 400, and the system may include the above It may be connected to the driving unit 250 .

15B shows an example in which the touch electrode array 350 is formed after the organic light emitting diode array is formed, and then the barrier laminate 200 is formed.

At this time, the touch electrode array 350 has, for example, a form having a plurality of transparent X electrodes and Y electrodes crossing each other on a thin flexible substrate, so that the X electrode and the Y electrode face each other on the organic light emitting diode, It may be attached between the touch electrode array 350 and the organic light emitting diode through an adhesive layer (not shown). In this case, the transparent electrode constituting the X electrode and the Y electrode may be ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or ITZO (Indium Tin Zinc Oxide).

FIG. 15C is another embodiment in which the touch electrode array 350 is applied, and shows a structure in which the touch panel array 200 is formed on the barrier laminate 200 after being formed. It may have the same shape as the touch panel array described above with reference to FIG. 15B, or a plurality of transparent first and second electrodes may be directly formed on the surface of the barrier laminate 200 by removing the flexible substrate.

On the other hand, the present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be clear to those skilled in the art.

1000: organic light emitting diode panel 100: substrate
110: buffer layer 120: active buffer layer
130: thin film transistor array 131: active layer
132: gate insulating film 133: gate electrode
134: interlayer insulating film 134a, 134b: first and second contact holes
135a: source electrode 135b: drain electrode
136: inorganic protective film 137: organic protective film
150: organic light emitting diode array 151: first electrode
152 Bank 1520a Light emitting aperture
1520b: bank hole 153: organic layer
154: second electrode 200: barrier laminate
210: inorganic layer 220: organic layer
350: touch electrode array 400: case

Claims (25)

a substrate having a plurality of sub-pixels in a matrix;
a first electrode divided for each sub-pixel on the substrate;
a bank having a light emitting opening for each subpixel and having a bank hole spaced apart from the light emitting opening and extending over a boundary between adjacent subpixels;
an organic layer disposed in the light emitting opening, above the bank, and inside the bank hole, and including an organic light emitting layer;
a second electrode covering an upper portion of the organic layer; and
Covering the second electrode, including a barrier laminate in which at least one pair of inorganic and organic layers are alternated;
In the bank hole, the entire thickness of the bank is removed,
an organic layer positioned inside the bank hole is positioned on a passivation layer having the same height as the first electrode of the light emitting opening;
An edge of the first electrode positioned below the bank and an organic layer inside the bank hole are spaced apart from the bottom of the bank at the outer circumference of the bank hole,
The organic light emitting diode panel of claim 1 , wherein the inorganic film of the barrier laminate is in contact with a sidewall inside the bank hole. According to claim 1,
The organic light emitting diode panel of According to claim 1,
The bank hole has a length shorter than the length of the first electrode;
The OLED panel of claim 1 , wherein a distance between the first electrodes in a portion with the bank hole is greater than a distance between the first electrodes in a portion without the bank hole, between adjacent subpixels. According to claim 1,
The organic layer is separated on the bank inside and around the bank hole. According to claim 4,
The organic light emitting diode panel of claim 1 , wherein a sidewall of the bank surrounding the bank hole has a taper perpendicular to a surface of the substrate. According to claim 4,
The organic layer is not provided on sidewalls around the bank hole. According to claim 1,
The protective film is located between the layers between the substrate and the first electrode and covers the thin film transistor. According to claim 7,
In the light emitting opening, the organic layer is in contact with the first electrode;
In the bank hole, the organic layer is in contact with the passivation layer. According to claim 1,
The bank hole is provided in a plurality of sub-pixels located on a center line dividing the substrate into two upper and lower portions. According to claim 1,
The bank hole is provided in subpixels within 10 rows adjacent to a row of subpixels corresponding to a center line dividing the substrate into upper and lower portions. According to claim 1,
The bank hole is positioned at a boundary between adjacent subpixels along the vertical direction of the substrate.
delete According to claim 1,
The organic light emitting diode panel of claim 1 , wherein the bank holes are located at boundaries of subpixels adjacent to each other in vertical and horizontal directions of the substrate.
delete According to claim 1,
The organic layer is an organic light emitting diode panel in which a hole injection layer, a hole transport layer, the organic light emitting layer, and an electron transport layer are sequentially stacked. According to claim 15,
The organic light emitting layer is a white light emitting layer organic light emitting diode panel. According to claim 15,
The organic light-emitting layer is a color light-emitting layer having different light-emitting colors corresponding to the light-emitting openings of each sub-pixel;
An organic light emitting diode panel in which color light emitting layers of adjacent subpixels overlap each other in the bank hole. According to claim 1,
The organic light emitting diode panel of claim 1 , wherein the bank further includes a spacer in each sub-pixel except for the bank hole. delete A flexible substrate having a plurality of sub-pixels in a matrix;
a thin film transistor array including one or more thin film transistors corresponding to each sub-pixel on the flexible substrate;
a bank having a first electrode divided for each subpixel and connected to the thin film transistor, a light emitting opening for each subpixel, and a bank hole extending across a boundary of adjacent subpixels, the light emitting opening, an upper portion of the bank, and the bank hole; an organic light emitting diode array including an organic layer including an organic light emitting layer therein and a second electrode covering an upper portion of the organic layer;
a barrier laminate in which one or more pairs of inorganic layers and organic layers are alternated to cover the organic light emitting diode array;
a driving unit connected to the thin film transistor array at one side of the flexible substrate; and
And a case covering the driving unit and mounting the flexible substrate,
In the bank hole, the entire thickness of the bank is removed,
an organic layer positioned inside the bank hole is positioned on a passivation layer having the same height as the first electrode of the light emitting opening;
An edge of the first electrode positioned below the bank and an organic layer inside the bank hole are spaced apart from the bottom of the bank at the outer circumference of the bank hole,
The flexible display device of claim 1 , wherein the inorganic film of the barrier laminate is in contact with a sidewall inside the bank hole. 21. The method of claim 20,
The flexible display device further includes a touch electrode array in contact with an upper portion of the barrier laminate. 21. The method of claim 20,
The bank hole is provided along a folding line of a flexible substrate. 23. The method of claim 22,
The organic layer is separated between an upper surface of the bank adjacent to the bank hole and a sidewall of the bank hole in the folding line. A flexible substrate having a plurality of sub-pixels in a matrix;
a thin film transistor array including one or more thin film transistors corresponding to each sub-pixel on the flexible substrate;
A first electrode divided for each subpixel and connected to the thin film transistor, each subpixel having a light emitting opening, and surrounded by a side wall having a greater inclination angle with respect to the flexible substrate than the side of the light emitting opening across the boundary of adjacent subpixels. an organic light emitting diode array including a bank having a bank hole, the light emitting opening, an organic layer including an organic light emitting layer disposed above the bank and inside the bank hole, and a second electrode covering an upper portion of the organic layer;
a barrier laminate in which one or more pairs of inorganic layers and organic layers are alternated to cover the organic light emitting diode array; and
A driving unit connected to the thin film transistor array at one side of the flexible substrate,
The flexible substrate has one or more folding lines along one direction, the bank hole is provided along the folding line of the flexible substrate,
In the bank hole, the entire thickness of the bank is removed,
an organic layer positioned inside the bank hole is positioned on a passivation layer having the same height as the first electrode of the light emitting opening;
An edge of the first electrode positioned below the bank and an organic layer inside the bank hole are spaced apart from the bottom of the bank at the outer circumference of the bank hole,
The flexible display device of claim 1 , wherein an inorganic film positioned at a lowermost layer of the barrier laminate is in contact with a side of the bank hole. 25. The method of claim 24,
The organic layer,
The flexible display device is separated between an upper surface of the bank adjacent to the bank hole and a sidewall of the bank hole.

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