KR102546576B1 - Manufacturing Method of SUS Plate for manufacturing Copper Foil - Google Patents

Manufacturing Method of SUS Plate for manufacturing Copper Foil Download PDF

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KR102546576B1
KR102546576B1 KR1020230029774A KR20230029774A KR102546576B1 KR 102546576 B1 KR102546576 B1 KR 102546576B1 KR 1020230029774 A KR1020230029774 A KR 1020230029774A KR 20230029774 A KR20230029774 A KR 20230029774A KR 102546576 B1 KR102546576 B1 KR 102546576B1
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조용덕
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주식회사 디디글로벌
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    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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Abstract

본 발명은 동박제조용 서스플레이트의 제조방법에 관한 것으로, 서스플레이트를 레이저 절단하는 단계(단계 1); 상기 레이저 절단한 서스플레이트를 라운드 가공하는 단계(단계 2); 상기 라운드 가공한 서스플레이트를 연마 가공하는 단계(단계 3); 및 상기 연마 가공한 서스플레이트를 부식방지 조성물에 침지하여 피막처리하는 단계(단계 4); 를 포함하는 것을 기술적 특징으로 하며, 증기 및 가스에 의해 녹이 발생되는 것을 방지하므로써 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있으며, 일정기간 경과 후 변형이 발생하는 것을 방지할 수 있으므로 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다.The present invention relates to a method for manufacturing a copper foil substrate, comprising the steps of laser cutting the substrate (step 1); Round processing the laser-cut substrate (step 2); polishing the rounded substrate (step 3); and immersing the polished substrate in an anti-corrosion composition to coat it (step 4); It is a technical feature to include, and has the advantage of extending the service life of the copper foil manufacturing support plate by preventing rust from being generated by steam and gas, and preventing the occurrence of deformation after a certain period of time, so that the copper foil There is an advantage in that the shelf life of the manufacturing substrate can be extended.

Description

동박제조용 서스플레이트의 제조방법{Manufacturing Method of SUS Plate for manufacturing Copper Foil}Method of manufacturing a support plate for manufacturing copper foil {Manufacturing Method of SUS Plate for manufacturing Copper Foil}

본 발명은 동박제조용 서스플레이트의 제조방법에 관한 것으로, 보다 상세하게는 증기 및 가스에 의해 녹이 발생되는 것을 방지할 수 있으며, 일정기간 경과 후 변형이 발생하는 것을 방지할 수 있는, 동박제조용 서스플레이트의 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a copper foil manufacturing substrate, and more particularly, to a copper foil manufacturing substrate capable of preventing rust from being generated by steam and gas and preventing deformation after a certain period of time has elapsed. It is about the manufacturing method of.

전자통신기술의 발전으로 스마트폰이나 태블릿PC, 노트북 컴퓨터 또는 디지털 카메라 등의 각종 전자통신기기들은 다양한 센싱 기능과 멀티미디어 기능을 탑재하고 있는데, 이러한 센싱 및 멀티미디어 기능의 실현을 위한 핵심 부품으로써 각종 센서모듈과 화상입력수단인 초소형 카메라 모듈 등의 중요성이 더욱 높아지고 있다. 특히 스마트폰은 휴대가 용이하도록 작은 사이즈를 가지면서도 다양한 기능구현이 필요할 뿐만 아니라 선명한 멀티미디어 컨텐츠를 즐기고자 하는 소비자의 욕구 등을 감안하여 초소형이면서도 고성능을 발휘하는 각종 센서모듈과 고화질의 초소형 카메라모듈 등을 포함해야 하는 요구가 더욱 증가하고 있다.With the development of electronic communication technology, various electronic communication devices such as smart phones, tablet PCs, notebook computers, or digital cameras are equipped with various sensing functions and multimedia functions. Various sensor modules are key components for realizing these sensing and multimedia functions. The importance of image input means such as ultra-small camera modules is increasing. In particular, smart phones not only have a small size for easy portability, but also need to implement various functions, as well as various sensor modules that exhibit high performance and various sensor modules that exhibit high performance in consideration of consumers' desire to enjoy clear multimedia contents, and high-resolution subminiature camera modules. The demand to include is increasing.

이와 같이 초소형의 센서모듈이나 카메라모듈은 각종 센서칩 또는 CCD나 CMOS의 이미지 센서 칩을 소정패턴의 회로가 인쇄된 얇은 필름상의 PCB에 접합하여 제작하게 되는데, 그 동작의 안정성을 담보하기 위해서는 전원을 공급함과 동시에 신호를 전달하는 PCB의 역할이 매우 중요하다. 한편 초소형의 센서 또는 카메라 모듈용 PCB는 제작의 편의상 일정크기의 필름원판 상에 다수 개의 단위 PCB를 한꺼번에 인쇄한 다음, 낱개로 절단하여 제작하는 어레이 방식을 취하는 것이 일반적이다. 이와 같은 어레이 PCB는 두께가 매우 얇고 유연하기 때문에 각각의 단위 PCB에 대한 센서 칩들의 접합 시, 평탄도가 좋지 않으면 접합 불량이 빈발하고, 이는 결국 센서모듈의 불량으로 이어지는 문제를 초래하여 왔다. 이와 같은 문제를 해결하기 위하여, 접착제가 이재된 금속박판 위에 어레이 PCB를 접합함으로써 센서 칩과의 접합 시 어레이 PCB의 평탄도를 향상시키는 방법이 사용되고 있기도 하다. 이 때 사용되는 금속박판으로는 일명 서스(SUS, Steel Use Stainless)플레이트라고 불리우는 스테인레스 플레이트가 적용된다.In this way, the subminiature sensor module or camera module is manufactured by bonding various sensor chips or CCD or CMOS image sensor chips to a PCB on a thin film on which a circuit of a predetermined pattern is printed. The role of the PCB, which supplies and transmits signals at the same time, is very important. On the other hand, it is common to take an array method of printing a plurality of unit PCBs on a film original plate of a certain size at once and then cutting them individually for the convenience of manufacturing a micro-sized sensor or camera module PCB. Since such an array PCB is very thin and flexible, when bonding sensor chips to each unit PCB, if the flatness is not good, bonding defects frequently occur, which eventually leads to defects in the sensor module. In order to solve this problem, a method of improving flatness of the array PCB at the time of bonding with the sensor chip by bonding the array PCB on a thin metal plate with an adhesive is also used. The thin metal plate used at this time is a stainless plate called a so-called SUS (Steel Use Stainless) plate.

서스플레이트는 어레이 PCB의 평탄도를 개선하기 위하여 PCB와 접합되는 것이기 때문에, 서스플레이트 자체의 표면 평탄도와 정밀도가 매우 높게 가공되어야 한다. 따라서 매우 고운 표면 거칠기를 가지는 연마포나 연마석으로 마무리되어야 한다. 그러나 연마작업에 있어 표면 거칠기가 매우 고운 연마석이나 연마포로만 가공하게 되는 경우, 시간이 매우 오래 걸릴 뿐만 아니라 오히려 평탄도가 좋아지지 않게 되는 문제점이 있으며, 연마석이나 연마포의 낭비가 심해지는 문제점도 발생하게 된다. 따라서 표면 거칠기가 거칠은 연마석이나 연마포로부터 점진적으로 고와지는 연마포로 교체해 가면서 연마작업을 해주어야 한다.Since the substrate is bonded to the PCB in order to improve the flatness of the array PCB, the surface flatness and precision of the substrate itself must be processed very high. Therefore, it must be finished with an abrasive cloth or abrasive stone having a very fine surface roughness. However, if the polishing work is processed only with abrasive stones or polishing cloths with very fine surface roughness, it takes a very long time and the flatness does not improve, and the waste of the polishing stones or polishing cloths becomes severe. It happens. Therefore, it is necessary to perform the polishing operation while changing from an abrasive stone or abrasive cloth having a rough surface to an abrasive cloth having a finer surface gradually.

대한민국등록특허공보 제10-2142828호(2020.08.07.)에는 PCB용 서스플레이트 연마장치의 연계이송수단이 개시되어 있다.Korean Registered Patent Publication No. 10-2142828 (2020.08.07.) discloses a linked transfer means of a substrate polishing device for PCB.

상기 PCB용 서스플레이트 연마장치의 연계이송수단은 복수의 연마장치를 순차적으로 배치하고, 서스플레이트를 차례로 통과시키면서 연마할 수 있도록 함으로써, 일련의 연속공정을 통하여 서스플레이트를 연마할 수 있기 때문에, 연마장치에 서스플레이트를 공급 및 회수를 하는 동안에도 연마공정의 수행이 중단되는 일이 없고 이로 인하여 단시간 내에 대량생산이 가능한 연마장치를 제공할 수 있는 효과가 있지만, 증기 및 가스에 의해 녹이 발생하는 단점이 있다.Since the linkage transfer means of the substrate polishing device for PCB can polish the substrate through a series of continuous processes by sequentially arranging a plurality of polishing devices and polishing while passing the substrate in turn, the polishing Even during the supply and recovery of the support plate to the device, the polishing process does not stop, and as a result, there is an effect of providing a polishing device that can be mass-produced in a short time, but the disadvantage of rust caused by steam and gas there is

KRKR 10-2142828 10-2142828 B1B1 2020.08.07.2020.08.07.

본 발명의 목적은, 증기 및 가스에 의해 녹이 발생되는 것을 방지할 수 있는, 동박제조용 서스플레이트의 제조방법을 제공하는 것이다.An object of the present invention is to provide a method for manufacturing a copper foil substrate capable of preventing rust from being generated by steam and gas.

본 발명의 다른 목적은, 일정기간 경과 후 변형이 발생하는 것을 방지할 수 있는, 동박제조용 서스플레이트의 제조방법을 제공하는 것이다.Another object of the present invention is to provide a method for manufacturing a copper foil substrate that can prevent deformation after a certain period of time.

상기 목적을 달성하기 위하여 본 발명은 다음과 같은 수단을 제공한다.In order to achieve the above object, the present invention provides the following means.

본 발명은, 서스플레이트를 레이저 절단하는 단계(단계 1); 상기 레이저 절단한 서스플레이트를 라운드 가공하는 단계(단계 2); 상기 라운드 가공한 서스플레이트를 연마 가공하는 단계(단계 3); 및 상기 연마 가공한 서스플레이트를 부식방지 조성물에 침지하여 피막처리하는 단계(단계 4); 를 포함하는, 동박제조용 서스플레이트의 제조방법을 제공한다.The present invention includes the steps of laser cutting the substrate (step 1); Round processing the laser-cut substrate (step 2); polishing the rounded substrate (step 3); and immersing the polished substrate in an anti-corrosion composition to coat it (step 4); Including, it provides a method for manufacturing a substrate for manufacturing copper foil.

상기 단계 4는 상기 연마 가공한 서스플레이트를 80~90℃에서 탈지(Detreasing)하고, 수세(Water Rinse)하고, 40~60℃에서 산세(Acid Cleaning)하고, 수세(Water Rinse)하고, 상온에서 활성화(Activation)하고, 70~90℃에서 5~45분 동안 부식방지 조성물에 침지한 후에 수세(Water Rinse)하되, 상기 부식방지 조성물은 에탄올 80중량%, 아연 포스페이트 10중량%, 1-옥타데칸티올 2중량%, 구연산 2중량%, 실리케이트 2중량%, 알킬페놀알콕시레이트 2중량% 및 폴리오르가노실록산 2중량% 를 포함한다. In step 4, the polished substrate is degreased at 80 to 90 ° C, washed with water, acid cleaned at 40 to 60 ° C, washed with water, and then washed at room temperature. After activation, immersion in an anticorrosive composition at 70 to 90 ° C. for 5 to 45 minutes, followed by water rinse, the anticorrosive composition is 80% by weight of ethanol, 10% by weight of zinc phosphate, 1-octadecane 2% by weight of thiol, 2% by weight of citric acid, 2% by weight of silicate, 2% by weight of alkylphenol alkoxylate and 2% by weight of polyorganosiloxane.

상기 단계 3 이전에, 상기 라운드 가공한 서스플레이트에 표면편차 감소 조성물을 분사하는 단계를 추가적으로 포함하되, 상기 표면편차 감소 조성물은 파라핀왁스 50중량%, 카본블랙 10중량%, 산화아연 10중량%, 산화세륨 10중량%, 에틸카비톨 10중량% 및 퓸드실리카 10중량%를 포함한다.Before the step 3, further comprising spraying a surface deviation reducing composition on the round-processed substrate, wherein the surface deviation reducing composition contains 50% by weight of paraffin wax, 10% by weight of carbon black, 10% by weight of zinc oxide, It includes 10% by weight of cerium oxide, 10% by weight of ethyl carbitol and 10% by weight of fumed silica.

상기 단계 4이후에 상기 피막처리한 서스플레이트를 변형방지 조성물에 10~11시간 동안 침지하는 단계를 추가적으로 포함하되, 상기 변형방지 조성물은 산소수 70중량%, 다이머 변성 에폭시(Dimer modified epoxy) 수지 10중량%, 칼슘설포알루미네이트 10중량%, 디메틸폴리실록산 5중량%, 폴리티오펜(PEDOT) 4중량% 및 천연 계면활성제 1중량%를 포함하며, 상기 산소수는, 정제수를 활성화 처리하고, 상기 활성화 처리된 정제수에 산소를 주입하여 제조하며, 상기 활성화 처리는 정제수를 세라믹 볼이 구비된 탱크를 통과시키며, 상기 세라믹 볼은 혼합물 100중량부에 물 10중량부를 가하고 1,300℃에서 10시간 동안 소성하고 분말화한 세라믹분말 100중량부에 결합제인 폴리비닐알코올(PVA) 5중량부를 가하고 제환기를 이용하여 세라믹 볼 형태로 성형한 후 1,350℃에서 5시간 동안 소성하여 제조하며, 상기 혼합물은 산화규소(SiO2) 40중량%, 알루미나(Al2O3) 19.5중량%, 지르코니아(ZrO2) 13.5중량%, 타이타니아(TiO2) 5.5중량%, 산화제2철(Fe2O3) 4.5중량%, 산화망간(MnO2) 4.0중량%, 산화동(CuO) 3.5중량%, 산화리튬(LiO2) 4.5중량% 및 탄산바륨(BaCO3) 5.0중량%를 포함하며, 상기 천연계면활성제는 복숭아발효액 80중량%, 산약추출액 10중량% 및 코코넛추출액 10중량%를 포함하며, 상기 복숭아발효액은, 복숭아 100중량부에 정제수 600중량부를 가하고 95℃에서 1시간 동안 가열하여 복숭아추출액을 수득하고, 상기 복숭아추출액 100중량부에 플루라나제 2중량부를 가하고 40℃에서 2시간 동안 효소처리하고, 상기 효소처리한 복숭아추출액 100중량부에 아로니아 발효액 2중량부를 가하고 25℃에서 24시간 동안 발효시킨 후 여과한 것을 사용하며, 상기 아로니아 발효액은 아로니아 50중량%, 프락토올리고당 30중량%, 자일로스 10중량% 및 황토지장수 10중량%를 혼합한 후 25℃에서 2일 동안 발효시킨 것을 사용하며, 상기 황토지장수는 물 100중량부에 황토 20중량부를 1시간 동안 교반 혼합한 후, 이를 10시간 동안 침지시켜 제조한 것을 사용하며, 상기 산약추출액은, 산약 1중량부에 90%(v/v) 에탄올 20중량부를 첨가하여 교반한 후 환류추출기를 사용하여 80℃에서 4시간 동안 환류 추출한 후 여과하여 수득하며, 상기 코코넛추출액은, 코코넛 1중량부에 90%(v/v) 에탄올 10중량부를 첨가하여 순환추출기를 이용하여 80℃에서 2시간 동안 추출한 후 여과하여 수득한다.Further comprising the step of immersing the coated substrate in an anti-deformation composition for 10 to 11 hours after step 4, wherein the anti-deformation composition contains 70% by weight of oxygen water and 10% of dimer modified epoxy resin. % by weight, including 10% by weight of calcium sulfoaluminate, 5% by weight of dimethylpolysiloxane, 4% by weight of polythiophene (PEDOT), and 1% by weight of natural surfactant, wherein the oxygenated water is activated by purified water, and the activation It is prepared by injecting oxygen into the treated purified water, and in the activation treatment, the purified water is passed through a tank equipped with a ceramic ball. It is prepared by adding 5 parts by weight of polyvinyl alcohol (PVA) as a binder to 100 parts by weight of the cured ceramic powder, molding it into a ceramic ball shape using a ventilator, and firing it at 1,350 ° C. for 5 hours. The mixture is silicon oxide (SiO 2 ) 40 wt%, alumina (Al 2 O 3 ) 19.5 wt%, zirconia (ZrO 2 ) 13.5 wt%, titania (TiO 2 ) 5.5 wt%, ferric oxide (Fe 2 O 3 ) 4.5 wt%, manganese oxide (MnO 2 ) 4.0% by weight, copper oxide (CuO) 3.5% by weight, lithium oxide (LiO 2 ) 4.5% by weight, and barium carbonate (BaCO 3 ) 5.0% by weight, the natural surfactant is 80% by weight of peach fermented liquid, It contains 10% by weight of acid medicine extract and 10% by weight of coconut extract, and the peach fermented liquid is obtained by adding 600 parts by weight of purified water to 100 parts by weight of peach and heating at 95 ° C. for 1 hour to obtain a peach extract, and 100 parts by weight of peach extract 2 parts by weight of pullulanase was added, enzymatic treatment was performed at 40 ° C for 2 hours, 2 parts by weight of aronia fermented liquid was added to 100 parts by weight of the enzyme-treated peach extract, fermented at 25 ° C for 24 hours, and then filtered. The fermented aronia broth is prepared by mixing 50% by weight of aronia, 30% by weight of fructo-oligosaccharide, 10% by weight of xylose and 10% by weight of loess longevity, and fermented at 25 ° C for 2 days. After stirring and mixing 20 parts by weight of loess for 100 parts by weight for 1 hour, it is prepared by immersing it for 10 hours. After stirring, it is obtained by reflux extraction at 80 ° C. for 4 hours using a reflux extractor, followed by filtration. The coconut extract is obtained by adding 10 parts by weight of 90% (v / v) ethanol to 1 part by weight of coconut using a circulation extractor. After extraction at 80 ° C. for 2 hours, it is obtained by filtration.

본 발명에 따른 동박제조용 서스플레이트의 제조방법은 증기 및 가스에 의해 녹이 발생되는 것을 방지하므로써 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다. The method for manufacturing a copper foil support plate according to the present invention has the advantage of extending the service life of the copper foil support plate by preventing rust from being generated by steam and gas.

또한, 본 발명의 동박제조용 서스플레이트의 제조방법은, 일정기간 경과 후 변형이 발생하는 것을 방지할 수 있으므로 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다.In addition, the manufacturing method of the copper foil support plate of the present invention has the advantage of extending the service life of the copper foil support plate because it can prevent deformation after a certain period of time.

도 1은 비교예 1에서 제조한 서스플레이트를 프레스실에서 한달 동안 사용한 후의 사진이다.
도 2는 실시예 1에서 제조한 서스플레이트를 프레스실에서 한달 동안 사용한 후의 사진이다.
1 is a photograph after using the substrate prepared in Comparative Example 1 in a press room for one month.
2 is a photograph after using the substrate manufactured in Example 1 in the press room for one month.

이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

먼저, 본 발명에 따른 동박제조용 서스플레이트의 제조방법을 설명한다.First, the manufacturing method of the copper foil manufacturing substrate according to the present invention will be described.

본 발명의 동박제조용 서스플레이트의 제조방법은,The manufacturing method of the copper foil manufacturing support plate of the present invention,

서스플레이트를 레이저 절단하는 단계(단계 1);laser cutting the substrate (step 1);

상기 레이저 절단한 서스플레이트를 라운드 가공하는 단계(단계 2);Round processing the laser-cut substrate (step 2);

상기 라운드 가공한 서스플레이트를 연마 가공하는 단계(단계 3); 및polishing the rounded substrate (step 3); and

상기 연마 가공한 서스플레이트를 부식방지 조성물에 침지하여 피막처리하는 단계(단계 4);immersing the polished substrate in an anti-corrosion composition to coat it (step 4);

를 포함한다.includes

상기 단계 1에서 상기 서스플레이트는 하독스(Hardox) 450을 사용할 수 있다.In step 1, Hardox 450 may be used as the substrate.

상기 하독스(Hardox) 450은 공칭 경도가 450 HBW인 SSAB 회사의 내마모강재이다. 상기 하독스(Hardox) 450은 탁월한 절곡성과 용접성을 기자고 있다. 상기 하독스(Hardox) 450은 마모 환경에 노풀되는 다양한 부품과 구조물에 사용할 수 있다. 상기 하독스(Hardox) 450은 내덴트성, 내마멸성 및 마모 수명이 우수하다. The Hardox 450 is SSAB's wear-resistant steel with a nominal hardness of 450 HBW. The Hardox 450 has excellent bendability and weldability. The Hardox 450 can be used for a variety of parts and structures exposed to abrasion environments. The Hardox 450 has excellent dent resistance, abrasion resistance and wear life.

종래 동박제조용 서스플레이트는 SUS630을 사용하는데, 본 발명에서는 하독스(Hardox) 450을 사용하면서 부식방지 처리함으로써, 증기 및 가스에 의해 녹이 발생되는 것을 방지하여 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다.Conventional copper foil manufacturing uses SUS630, but in the present invention, by using Hardox 450 and anti-corrosive treatment, rust generation by steam and gas can be prevented and the service life of the copper foil manufacturing can be extended. There are advantages to being

상기 단계 3 이전에, 상기 라운드 가공한 서스플레이트에 표면편차 감소 조성물을 분사하는 단계를 추가적으로 포함할 수 있다.Prior to step 3, a step of spraying a surface deviation reducing composition on the rounded substrate may be additionally included.

상기 라운드 가공한 서스플레이트에 표면편차 감소 조성물을 분사함으로써 평탄도를 개선할 수 있는 장점이 있다.There is an advantage in that flatness can be improved by spraying the surface deviation reducing composition on the round-processed substrate.

상기 표면편차 감소 조성물은 파라핀왁스 50중량%, 카본블랙 10중량%, 산화아연 10중량%, 산화세륨 10중량%, 에틸카비톨 10중량% 및 퓸드실리카 10중량%를 포함한다. The surface deviation reducing composition includes 50% by weight of paraffin wax, 10% by weight of carbon black, 10% by weight of zinc oxide, 10% by weight of cerium oxide, 10% by weight of ethyl carbitol, and 10% by weight of fumed silica.

상기 단계 3은 상기 라운드 가공한 서스플레이트의 상하면을 사포를 이용하여 벨트 연마하는 단계이다. Step 3 is a step of belt polishing the upper and lower surfaces of the rounded support plate using sandpaper.

상기 단계 4는 상기 연마 가공한 서스플레이트를 80~90℃에서 탈지(Detreasing)하고, 수세(Water Rinse)하고, 40~60℃에서 산세(Acid Cleaning)하고, 수세(Water Rinse)하고, 상온에서 활성화(Activation)하고, 70~90℃에서 5~45분 동안 부식방지 조성물에 침지한 후에 수세(Water Rinse)하는 단계이다. In Step 4, the polished substrate is degreased at 80 to 90 ° C, washed with water, acid cleaned at 40 to 60 ° C, washed with water, and then washed at room temperature. It is a step of activating, immersing in the anti-corrosion composition for 5 to 45 minutes at 70 ~ 90 ℃, and then washing with water (Water Rinse).

상기 부식방지 조성물은 에탄올 80중량%, 아연 포스페이트 10중량%, 1-옥타데칸티올 2중량%, 구연산 2중량%, 실리케이트 2중량%, 알킬페놀알콕시레이트 2중량% 및 폴리오르가노실록산 2중량% 를 포함한다. The anti-corrosion composition contains 80% by weight of ethanol, 10% by weight of zinc phosphate, 2% by weight of 1-octadecanethiol, 2% by weight of citric acid, 2% by weight of silicate, 2% by weight of alkylphenol alkoxylate and 2% by weight of polyorganosiloxane. includes

본 발명은 서스플레이트를 부식방지 조성물에 침지하여 피막처리함으로써 증기 및 가스에 의해 녹이 발생되는 것을 방지할 수 있어, 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다. The present invention has the advantage of prolonging the service life of the copper foil manufacturing substrate by preventing rust from being generated by steam and gas by immersing the substrate in an anticorrosive composition and treating it with a film.

동박제조용 서스플레이트는 프레스실에서 진공상태에서 250℃에서 8시간 동안 1000ton 으로 가압된 후에 상온으로 냉각되고, 또다시 진공상태에서 250℃에서 8시간 동안 1000ton 으로 가압된 후에 상온으로 냉각되는 운전이 반복되므로 일정기간이 경과한 후에는 변형이 발생하는 문제가 있다.The copper foil manufacturing subplate is pressurized at 1000 ton for 8 hours at 250°C in a vacuum in the press room, then cooled to room temperature, then pressed at 1000 ton at 250°C for 8 hours in a vacuum and then cooled to room temperature. The operation is repeated. Therefore, there is a problem that deformation occurs after a certain period of time has elapsed.

본 발명은 상기 단계 4이후에 상기 피막처리한 서스플레이트를 변형방지 조성물에 10~11시간 동안 침지하는 단계를 추가적으로 포함할 수 있다. The present invention may further include, after step 4, immersing the coated substrate in an anti-deformation composition for 10 to 11 hours.

본 발명은 상기 피막처리한 서스플레이트를 변형방지 조성물에 침지하므로써 일정기간 경과 후에도 서스플레이트가 변형되는 것을 방지할 수 있는 장점이 있다.The present invention has the advantage of preventing the substrate from being deformed even after a certain period of time by immersing the coated substrate in the anti-deformation composition.

상기 변형방지 조성물은 산소수 70중량%, 다이머 변성 에폭시(Dimer modified epoxy) 수지 10중량%, 칼슘설포알루미네이트 10중량%, 디메틸폴리실록산 5중량%, 폴리티오펜(PEDOT) 4중량% 및 천연 계면활성제 1중량%를 포함한다.The anti-deformation composition contains 70% by weight of oxygen water, 10% by weight of dimer modified epoxy resin, 10% by weight of calcium sulfoaluminate, 5% by weight of dimethylpolysiloxane, 4% by weight of polythiophene (PEDOT), and a natural interface. Contains 1% by weight of the active agent.

상기 산소수는, 정제수를 활성화 처리하고, 상기 활성화 처리된 정제수에 산소를 주입하여 제조한다. The oxygenated water is prepared by activating purified water and injecting oxygen into the activated purified water.

상기 활성화 처리는 정제수를 세라믹 볼이 구비된 탱크를 통과시킨다.The activation process passes the purified water through a tank equipped with ceramic balls.

상기 세라믹 볼은 혼합물 100중량부에 물 10중량부를 가하고 1,300℃에서 10시간 동안 소성하고 분말화한 세라믹분말 100중량부에 결합제인 폴리비닐알코올(PVA) 5중량부를 가하고 제환기를 이용하여 세라믹 볼 형태로 성형한 후 1,350℃에서 5시간 동안 소성하여 제조한다.The ceramic ball is obtained by adding 10 parts by weight of water to 100 parts by weight of the mixture, calcined at 1,300 ° C. for 10 hours, and adding 5 parts by weight of polyvinyl alcohol (PVA) as a binder to 100 parts by weight of powdered ceramic powder. After molding into a shape, it is prepared by firing at 1,350 ° C for 5 hours.

상기 혼합물은 산화규소(SiO2) 40중량%, 알루미나(Al2O3) 19.5중량%, 지르코니아(ZrO2) 13.5중량%, 타이타니아(TiO2) 5.5중량%, 산화제2철(Fe2O3) 4.5중량%, 산화망간(MnO2) 4.0중량%, 산화동(CuO) 3.5중량%, 산화리튬(LiO2) 4.5중량% 및 탄산바륨(BaCO3) 5.0중량%를 포함한다.The mixture includes 40% by weight of silicon oxide (SiO 2 ), 19.5% by weight of alumina (Al 2 O 3 ), 13.5% by weight of zirconia (ZrO 2 ), 5.5% by weight of titania (TiO 2 ), and 5.5% by weight of ferric oxide (Fe 2 O 3 ) . ) 4.5 wt%, manganese oxide (MnO 2 ) 4.0 wt%, copper oxide (CuO) 3.5 wt%, lithium oxide (LiO 2 ) 4.5 wt%, and barium carbonate (BaCO 3 ) 5.0 wt%.

상기 천연계면활성제는 복숭아발효액 80중량%, 산약추출액 10중량% 및 코코넛추출액 10중량%를 포함한다. The natural surfactant includes 80% by weight of fermented peach, 10% by weight of acid medicine extract, and 10% by weight of coconut extract.

상기 복숭아발효액은, 복숭아 100중량부에 정제수 600중량부를 가하고 95℃에서 1시간 동안 가열하여 복숭아추출액을 수득하고, 상기 복숭아추출액 100중량부에 플루라나제 2중량부를 가하고 40℃에서 2시간 동안 효소처리하고, 상기 효소처리한 복숭아추출액 100중량부에 아로니아 발효액 2중량부를 가하고 25℃에서 24시간 동안 발효시킨 후 여과한 것을 사용한다.The peach fermented liquid is obtained by adding 600 parts by weight of purified water to 100 parts by weight of peaches and heating at 95 ° C. for 1 hour to obtain a peach extract, adding 2 parts by weight of pullulanase to 100 parts by weight of the peach extract and enzymatically at 40 ° C. for 2 hours After treatment, 2 parts by weight of aronia fermentation broth was added to 100 parts by weight of the enzyme-treated peach extract, fermented at 25 ° C for 24 hours, and filtered.

상기 아로니아 발효액은 아로니아 50중량%, 프락토올리고당 30중량%, 자일로스 10중량% 및 황토지장수 10중량%를 혼합한 후 25℃에서 2일 동안 발효시킨 것을 사용한다. The fermented aronia broth is used after mixing 50% by weight of aronia, 30% by weight of fructooligosaccharide, 10% by weight of xylose, and 10% by weight of red clay longevity, and then fermented at 25 ° C. for 2 days.

상기 황토지장수는 물 100중량부에 황토 20중량부를 1시간 동안 교반 혼합한 후, 이를 10시간 동안 침지시켜 제조한 것을 사용한다.The loess longevity is prepared by stirring and mixing 20 parts by weight of loess with 100 parts by weight of water for 1 hour and then immersing it for 10 hours.

상기 산약추출액은, 산약 1중량부에 90%(v/v) 에탄올 20중량부를 첨가하여 교반한 후 환류추출기를 사용하여 80℃에서 4시간 동안 환류 추출한 후 여과하여 수득한다.The acid medicine extract is obtained by adding 20 parts by weight of 90% (v/v) ethanol to 1 part by weight of the acid medicine, stirring, reflux extraction at 80 ° C. for 4 hours using a reflux extractor, and then filtering.

상기 코코넛추출액은, 코코넛 1중량부에 90%(v/v) 에탄올 10중량부를 첨가하여 순환추출기를 이용하여 80℃에서 2시간 동안 추출한 후 여과하여 수득한다.The coconut extract is obtained by adding 10 parts by weight of 90% (v/v) ethanol to 1 part by weight of coconut, extracting at 80° C. for 2 hours using a circulation extractor, and then filtering.

본 발명에 따른 동박제조용 서스플레이트의 제조방법은 증기 및 가스에 의해 녹이 발생되는 것을 방지하므로써 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다. The method for manufacturing a copper foil support plate according to the present invention has the advantage of extending the service life of the copper foil support plate by preventing rust from being generated by steam and gas.

또한, 본 발명의 동박제조용 서스플레이트의 제조방법은, 일정기간 경과 후 변형이 발생하는 것을 방지할 수 있으므로 동박제조용 서스플레이트의 사용연한을 연장할 수 있는 장점이 있다.In addition, the manufacturing method of the copper foil support plate of the present invention has the advantage of extending the service life of the copper foil support plate because it can prevent deformation after a certain period of time.

이하, 실시 예를 통하여 본 발명의 구성 및 효과를 더욱 상세히 설명하고자 한다. 이들 실시 예는 오로지 본 발명을 예시하기 위한 것일 뿐 본 발명의 범위가 이들 실시 예에 의해 제한되는 것은 아니다. Hereinafter, the configuration and effects of the present invention will be described in more detail through examples. These examples are only for illustrating the present invention, but the scope of the present invention is not limited by these examples.

[비교예 1][Comparative Example 1]

두께가 1.5㎜인 SUS630을 레이저 절단하였다. 상기 레이저 절단한 SUS630을 라운드 가공하였다. 상기 라운드 가공한 SUS630을 연마 가공하여 동박제조용 서스플레이트를 제조하였다.SUS630 with a thickness of 1.5 mm was laser cut. The laser-cut SUS630 was subjected to round processing. The round-processed SUS630 was polished to manufacture a copper foil manufacturing support plate.

두께가 1.5㎜인 하독스(Hardox) 450을 레이저 절단하였다. 상기 레이저 절단한 하독스(Hardox) 450을 라운드 가공하였다. 상기 라운드 가공한 하독스(Hardox) 450을 연마 가공하였다. 상기 연마 가공한 하독스(Hardox) 450을 90℃에서 탈지(Detreasing)하고, 수세(Water Rinse)하고, 50℃에서 산세(Acid Cleaning)하고, 수세(Water Rinse)하고, 상온에서 활성화(Activation)하고, 80℃에서 30분 동안 부식방지 조성물에 침지한 후에 수세(Water Rinse)하여 동박제조용 서스플레이트를 제조하였다. Hardox 450 with a thickness of 1.5 mm was laser cut. The laser cut Hardox 450 was processed round. The round-processed Hardox 450 was polished. The polished Hardox 450 was degreased at 90 ° C, washed with water, acid cleaned at 50 ° C, washed with water, and activated at room temperature. And, after being immersed in the anti-corrosion composition at 80 ° C. for 30 minutes, water rinse was performed to prepare a copper foil manufacturing substrate.

상기 부식방지 조성물은 에탄올 80중량%, 아연 포스페이트 10중량%, 1-옥타데칸티올 2중량%, 구연산 2중량%, 실리케이트 2중량%, 알킬페놀알콕시레이트 2중량% 및 폴리오르가노실록산 2중량% 를 혼합하여 제조하였다.The anti-corrosion composition contains 80% by weight of ethanol, 10% by weight of zinc phosphate, 2% by weight of 1-octadecanethiol, 2% by weight of citric acid, 2% by weight of silicate, 2% by weight of alkylphenol alkoxylate and 2% by weight of polyorganosiloxane. It was prepared by mixing.

[실험예 1][Experimental Example 1]

프레스실에 열판을 밑에 깔고 그 위에 Carrier Plate를 적층하고 그 위에 비교예 1 및 실시예 1에서 제조한 서스플레이트를 적층하고 그 위에 동박을 적층하는 방식으로 500층을 적층하고 가장 위에 열판을 적층한 후에 진공상태에서 250℃에서 8시간 동안 1000ton 으로 가압된 후에 상온으로 냉각되고, 또다시 진공상태에서 250℃에서 8시간 동안 1000ton 으로 가압된 후에 상온으로 냉각되는 운전을 한달 동안 반복한 후에 비교예 1의 서스플레이트의 사진을 도 1에 나타내었고, 실시예 1의 서스플레이트의 사진을 도 2에 나타내었다.A hot plate was placed in the press room, a carrier plate was laminated on top of it, the support plate manufactured in Comparative Example 1 and Example 1 was laminated on top of it, and 500 layers were laminated on top of the copper foil, and a hot plate was laminated on top. Comparative Example 1 A photograph of the substrate of FIG. 1 is shown, and a photograph of the substrate of Example 1 is shown in FIG. 2 .

도 1을 보면 비교예 1에서 제조한 서스플레이트는 녹이 발생한 반면에, 도 2를 보면 실시예 1에서 제조한 서스플레이트는 녹이 발생하지 않은 것을 알 수 있다.Referring to FIG. 1, it can be seen that the substrate manufactured in Comparative Example 1 is rusted, whereas the substrate manufactured in Example 1 is not rusted by looking at FIG. 2.

[비교예 2][Comparative Example 2]

오르토인산 수용액 100 중량부에 대하여, 이소프로필알코올 27 중량부, 염소산나트륨 1.8 중량부, 타닌산 25 중량부, 질산아연 0.09 중량부 및 무이온 불소계 계면활성제 0.27 중량부를 혼합한 후, 80℃ 하에서 교반 및 반응시켜서 부식방지제를 제조하였다.After mixing 27 parts by weight of isopropyl alcohol, 1.8 parts by weight of sodium chlorate, 25 parts by weight of tannic acid, 0.09 parts by weight of zinc nitrate and 0.27 parts by weight of a nonionic fluorine-based surfactant with respect to 100 parts by weight of an aqueous solution of orthophosphoric acid, stirring and A corrosion inhibitor was prepared by reacting.

[실험예 2][Experimental Example 2]

실시예 1에서 제조한 부식방지 조성물 및 비교예 2에서 제조한 부식방지제에 대하여 내부식 성능 시험을 실시하였다. Corrosion resistance performance tests were conducted on the anticorrosive composition prepared in Example 1 and the anticorrosive agent prepared in Comparative Example 2.

150mm x 70 mm x 3.2 T의 강판에 실시예 1에서 제조한 부식방지 조성물 및 비교예 2에서 제조한 부식방지제를 도포한 후 7일 동안 자연 건조시켜 시편을 제조하였다. 상기에서 제조된 시편을 KS D 9502(중성, 아세트산, 캐스분무시험)에 따라 실시하며, 300시간 시험 후 도막을 관찰하였다. 이때 도막의 녹 발생, 부풀음, 박리 등을 관찰 후 최저 1에서 최고 10의 수치로 표시하여 표 1에 나타내었다.The anti-corrosion composition prepared in Example 1 and the anti-corrosion agent prepared in Comparative Example 2 were applied to a steel plate of 150 mm x 70 mm x 3.2 T, and then naturally dried for 7 days to prepare a specimen. The specimen prepared above was carried out according to KS D 9502 (neutral, acetic acid, cas spray test), and the coating film was observed after 300 hours of testing. At this time, after observing the occurrence of rust, swelling, peeling, etc. of the coating film, the lowest value of 1 to the highest value of 10 is indicated in Table 1.

평가항목evaluation items 실시예 1Example 1 비교예 2Comparative Example 2 내부식 성능 시험Corrosion resistance performance test 1010 66

표 1에 의하면, 실시예 1에서 제조한 부식방지 조성물은 비교예 2에서 제조한 부식방지제에 비하여 내부식 성능이 우수한 것을 알 수 있다.According to Table 1, it can be seen that the anticorrosive composition prepared in Example 1 has excellent corrosion resistance performance compared to the anticorrosive agent prepared in Comparative Example 2.

Claims (4)

서스플레이트를 레이저 절단하는 단계(단계 1);
상기 레이저 절단한 서스플레이트를 라운드 가공하는 단계(단계 2);
상기 라운드 가공한 서스플레이트를 연마 가공하는 단계(단계 3); 및
상기 연마 가공한 서스플레이트를 부식방지 조성물에 침지하여 피막처리하는 단계(단계 4);
를 포함하되,
상기 단계 4는 상기 연마 가공한 서스플레이트를 80~90℃에서 탈지(Detreasing)하고, 수세(Water Rinse)하고, 40~60℃에서 산세(Acid Cleaning)하고, 수세(Water Rinse)하고, 상온에서 활성화(Activation)하고, 70~90℃에서 5~45분 동안 부식방지 조성물에 침지한 후에 수세(Water Rinse)하며,
상기 부식방지 조성물은 에탄올 80중량%, 아연 포스페이트 10중량%, 1-옥타데칸티올 2중량%, 구연산 2중량%, 실리케이트 2중량%, 알킬페놀알콕시레이트 2중량% 및 폴리오르가노실록산 2중량% 를 포함하는,
동박제조용 서스플레이트의 제조방법.
laser cutting the substrate (step 1);
Round processing the laser-cut substrate (step 2);
polishing the rounded substrate (step 3); and
immersing the polished substrate in an anti-corrosion composition to coat it (step 4);
Including,
In Step 4, the polished substrate is degreased at 80 to 90 ° C, washed with water, acid cleaned at 40 to 60 ° C, washed with water, and then washed at room temperature. Activation, immersion in the anti-corrosion composition at 70 to 90 ° C. for 5 to 45 minutes, followed by water rinse,
The anti-corrosion composition contains 80% by weight of ethanol, 10% by weight of zinc phosphate, 2% by weight of 1-octadecanethiol, 2% by weight of citric acid, 2% by weight of silicate, 2% by weight of alkylphenol alkoxylate and 2% by weight of polyorganosiloxane. including,
Method for manufacturing a copper foil support plate.
삭제delete 제 1항에 있어서,
상기 단계 3 이전에, 상기 라운드 가공한 서스플레이트에 표면편차 감소 조성물을 분사하는 단계를 추가적으로 포함하되,
상기 표면편차 감소 조성물은 파라핀왁스 50중량%, 카본블랙 10중량%, 산화아연 10중량%, 산화세륨 10중량%, 에틸카비톨 10중량% 및 퓸드실리카 10중량%를 포함하는,
동박제조용 서스플레이트의 제조방법.
According to claim 1,
Prior to step 3, further comprising spraying a surface deviation reducing composition on the rounded substrate,
The surface deviation reduction composition includes 50% by weight of paraffin wax, 10% by weight of carbon black, 10% by weight of zinc oxide, 10% by weight of cerium oxide, 10% by weight of ethyl carbitol and 10% by weight of fumed silica,
Method for manufacturing a copper foil support plate.
제 1항에 있어서,
상기 단계 4이후에 상기 피막처리한 서스플레이트를 변형방지 조성물에 10~11시간 동안 침지하는 단계를 추가적으로 포함하되,
상기 변형방지 조성물은 산소수 70중량%, 다이머 변성 에폭시(Dimer modified epoxy) 수지 10중량%, 칼슘설포알루미네이트 10중량%, 디메틸폴리실록산 5중량%, 폴리티오펜(PEDOT) 4중량% 및 천연 계면활성제 1중량%를 포함하며,
상기 산소수는, 정제수를 활성화 처리하고, 상기 활성화 처리된 정제수에 산소를 주입하여 제조하며,
상기 활성화 처리는 정제수를 세라믹 볼이 구비된 탱크를 통과시키며,
상기 세라믹 볼은 혼합물 100중량부에 물 10중량부를 가하고 1,300℃에서 10시간 동안 소성하고 분말화한 세라믹분말 100중량부에 결합제인 폴리비닐알코올(PVA) 5중량부를 가하고 제환기를 이용하여 세라믹 볼 형태로 성형한 후 1,350℃에서 5시간 동안 소성하여 제조하며,
상기 혼합물은 산화규소(SiO2) 40중량%, 알루미나(Al2O3) 19.5중량%, 지르코니아(ZrO2) 13.5중량%, 타이타니아(TiO2) 5.5중량%, 산화제2철(Fe2O3) 4.5중량%, 산화망간(MnO2) 4.0중량%, 산화동(CuO) 3.5중량%, 산화리튬(LiO2) 4.5중량% 및 탄산바륨(BaCO3) 5.0중량%를 포함하며,
상기 천연계면활성제는 복숭아발효액 80중량%, 산약추출액 10중량% 및 코코넛추출액 10중량%를 포함하며,
상기 복숭아발효액은, 복숭아 100중량부에 정제수 600중량부를 가하고 95℃에서 1시간 동안 가열하여 복숭아추출액을 수득하고, 상기 복숭아추출액 100중량부에 플루라나제 2중량부를 가하고 40℃에서 2시간 동안 효소처리하고, 상기 효소처리한 복숭아추출액 100중량부에 아로니아 발효액 2중량부를 가하고 25℃에서 24시간 동안 발효시킨 후 여과한 것을 사용하며,
상기 아로니아 발효액은 아로니아 50중량%, 프락토올리고당 30중량%, 자일로스 10중량% 및 황토지장수 10중량%를 혼합한 후 25℃에서 2일 동안 발효시킨 것을 사용하며,
상기 황토지장수는 물 100중량부에 황토 20중량부를 1시간 동안 교반 혼합한 후, 이를 10시간 동안 침지시켜 제조한 것을 사용하며,
상기 산약추출액은, 산약 1중량부에 90%(v/v) 에탄올 20중량부를 첨가하여 교반한 후 환류추출기를 사용하여 80℃에서 4시간 동안 환류 추출한 후 여과하여 수득하며,
상기 코코넛추출액은, 코코넛 1중량부에 90%(v/v) 에탄올 10중량부를 첨가하여 순환추출기를 이용하여 80℃에서 2시간 동안 추출한 후 여과하여 수득하는,
동박제조용 서스플레이트의 제조방법.
According to claim 1,
Further comprising the step of immersing the coated substrate in an anti-deformation composition for 10 to 11 hours after step 4,
The anti-deformation composition contains 70% by weight of oxygen water, 10% by weight of dimer modified epoxy resin, 10% by weight of calcium sulfoaluminate, 5% by weight of dimethylpolysiloxane, 4% by weight of polythiophene (PEDOT), and a natural interface. Contains 1% by weight of the active agent,
The oxygenated water is prepared by activating purified water and injecting oxygen into the activated purified water,
The activation process passes the purified water through a tank equipped with ceramic balls,
The ceramic ball is obtained by adding 10 parts by weight of water to 100 parts by weight of the mixture, calcined at 1,300 ° C. for 10 hours, and adding 5 parts by weight of polyvinyl alcohol (PVA) as a binder to 100 parts by weight of powdered ceramic powder. After molding into a shape, it is prepared by firing at 1,350 ° C for 5 hours,
The mixture includes 40% by weight of silicon oxide (SiO 2 ), 19.5% by weight of alumina (Al 2 O 3 ), 13.5% by weight of zirconia (ZrO 2 ), 5.5% by weight of titania (TiO 2 ), and 5.5% by weight of ferric oxide (Fe 2 O 3 ) . ) 4.5% by weight, manganese oxide (MnO 2 ) 4.0% by weight, copper oxide (CuO) 3.5% by weight, lithium oxide (LiO 2 ) 4.5% by weight and barium carbonate (BaCO 3 ) 5.0% by weight,
The natural surfactant contains 80% by weight of peach fermented liquid, 10% by weight of acid medicine extract and 10% by weight of coconut extract,
The peach fermented liquid is obtained by adding 600 parts by weight of purified water to 100 parts by weight of peaches and heating at 95 ° C. for 1 hour to obtain a peach extract, adding 2 parts by weight of pullulanase to 100 parts by weight of the peach extract and enzymatically at 40 ° C. for 2 hours 2 parts by weight of aronia fermented liquid was added to 100 parts by weight of the enzyme-treated peach extract, fermented at 25 ° C for 24 hours, and then filtered.
The fermented aronia broth is fermented at 25 ° C. for 2 days after mixing 50% by weight of aronia, 30% by weight of fructooligosaccharide, 10% by weight of xylose, and 10% by weight of red clay longevity,
The loess longevity is prepared by stirring and mixing 20 parts by weight of loess with 100 parts by weight of water for 1 hour and then immersing it for 10 hours,
The acid medicine extract is obtained by adding 20 parts by weight of 90% (v / v) ethanol to 1 part by weight of the acid medicine, stirring, reflux extraction at 80 ° C. for 4 hours using a reflux extractor, and then filtering,
The coconut extract is obtained by adding 10 parts by weight of 90% (v / v) ethanol to 1 part by weight of coconut, extracting at 80 ° C. for 2 hours using a circulation extractor, and then filtering.
Method for manufacturing a copper foil support plate.
KR1020230029774A 2023-03-07 2023-03-07 Manufacturing Method of SUS Plate for manufacturing Copper Foil KR102546576B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070006153A (en) * 2005-07-07 2007-01-11 박광수 Method for manufacturing multi-layered printed circuit board
KR102142828B1 (en) 2020-03-13 2020-08-07 조성해 Moving Device of Polishing Apparatus for PCB SUS Plate
CN112062469A (en) * 2020-08-28 2020-12-11 浙江开尔新材料股份有限公司 Bottom glaze material of stainless steel enamel plate and preparation method and application thereof
CN113290898A (en) * 2021-05-25 2021-08-24 安徽杰蓝特新材料有限公司 Corrosion-resistant drainage pipeline and preparation method thereof
KR102372509B1 (en) * 2021-11-17 2022-03-10 (주)미래기업 High functional coating composition for protecting metal surface having excellent formability and metal panel coated by the same
JP7164063B1 (en) * 2021-10-14 2022-11-01 Jfeスチール株式会社 Steel plate and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070006153A (en) * 2005-07-07 2007-01-11 박광수 Method for manufacturing multi-layered printed circuit board
KR102142828B1 (en) 2020-03-13 2020-08-07 조성해 Moving Device of Polishing Apparatus for PCB SUS Plate
CN112062469A (en) * 2020-08-28 2020-12-11 浙江开尔新材料股份有限公司 Bottom glaze material of stainless steel enamel plate and preparation method and application thereof
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JP7164063B1 (en) * 2021-10-14 2022-11-01 Jfeスチール株式会社 Steel plate and its manufacturing method
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