KR102531501B1 - Biometric smart card and Method for manufacturing thereof - Google Patents

Abstract

Biometrics with a structure that precisely exposes exposed parts to the outside even by lamination after automatically aligning surface-exposed parts such as biometric sensors and e-paper displays mounted on flexible printed circuit boards with cavities and exposure windows formed in overlays. A smart card and a manufacturing method thereof are provided. The smart card forms a circumference and includes an inlay having a receiving hole formed with a step/stair surface of a height from the surface of the inner center toward the inside; a substrate on which an exposed part is mounted and inserted into the step surface of the receiving hole of the inlay to be seated and coupled; a front-side overlay (FSO) attached to the front surface of the substrate and the inlay and having an exposed portion formed thereon to expose or expose the exposed part to the outside of the smart card; and a backside overlay (BSO) attached to the backside of the substrate and inlay.

Description

Biometric smart card and method for manufacturing the same {Biometric smart card and Method for manufacturing its}

The present invention relates to a smart card and a manufacturing method thereof, and more particularly, to a flexible printed circuit board (FPCB), a biometric sensor embedded in a flexible printed circuit board (FPCB), and an E-paper display (E-Paper Display). Paper Display: A structure in which surface exposed parts such as 'EPD') are automatically aligned to the cavity formed in the overlay and exposed windows so that the exposed parts are precisely exposed to the outside even after lamination. It relates to a biometric smart card having and a manufacturing method thereof.

A smart card is a plastic card with a built-in microprocessor and is used for electronic processes such as financial transactions, personal identification, authentication, and data storage. Such a smart card has been developed into a built-in biometric sensor such as a fingerprint sensor (FPS) in order to increase the accuracy of financial transactions or personal authentication.

The function and structure of a smart card (Biometric Smart Card: BSC) with a biometric recognition device and its manufacturing method are mentioned in detail in the prior art literature below.

1 is a configuration of a BSC (1) described in prior art literature, on one side, for example, on the front side, a power button (2), a micro module IC (Micro module IC) (3), and an FPS (4) and an EPD (5). Among the above configurations, the micromodule IC (4), FPS (4), and EPD (5) are exposed parts exposed to the surface of the overlay on the front side, and the micromodule IC (4) and FPS (4) are used in the entire process of card lamination. It may be formed by pre-step or post-step milling. The size of the smart card having the configuration shown in FIG. 1 is 85.60 × 53.98 mm in length and width and 0.76 mm in thickness, like a general credit card.

FIG. 2 is an exploded perspective view of the BSC 1 shown in FIG. 1, and FIG. 3 is an A-A or B-B cross-sectional view of FIG. 1 for explaining a manufacturing process of the BSC 1 according to the prior art. In FIG. 3, 'a' to 'c' are views for explaining a card lamination process, and 'd' and 'e' in FIG. 3 are views for explaining errors in card lamination.

Referring to FIGS. 2 and 3 , the BSC 1 is accommodated by putting a substrate 20 into a hole 11 formed in the center of an inlay 10 ( FIG. 3 a ). The substrate 20 has a flexible printed surface on which surface exposed parts 20, such as a micro module IC (3), an FPS (4) and an EPD (5), a microprocessor (16), and a battery (7) are mounted. It is a flexible printed circuit board (FPCB). In addition, the inlay 10 forms a card frame by guiding the position of the substrate 20 , and deformation of the substrate 20 can be prevented.

After a BSO (Back Side Overlay) 40 is attached to the back side of the inlay 10 including the substrate 20 (FIG. 3 b), urethane is placed in the front space of the substrate 20 ) or epoxy (epoxy), the entire surface is flattened by filling the resin solution (50). It is preferable to use a gel-state solution having a certain conductive viscosity as the filling resin solution.

Thereafter, after aligning the exposed part 36 of the FSO (Front Side Overlay) 30 to the exposed part 22 of the substrate 20, using a hot or cold lamination apparatus, the inlay ( 10), the BSO 20 and the FSO 30 are laminated (c in FIG. 3) to complete the BSC 1.

In the above, the exposed part 22 of the board 20 may be a micro module IC 3, FPS 4 or EPD 5 mounted on the board 20 shown in FIG. 2, and the exposed part 36 may be an IC cavity 33, an FPS cavity 34, or an exposure window 35 formed in the FSO 30 of FIG. 2 .

At this time, the IC cavity 33 and the FPS cavity 34 formed in the FSO 30 may be formed by punching the FSO 30 sheet, mechanical milling, laser processing, or injection molding of the FSO 30 sheet. . In addition, the exposure window 35 formed on the FSO 30 can be formed on the front surface of the FSO 30 by a method of not applying ink when printing a specific picture, company logo, text, etc. on a screen or as an option.

Among the above configurations, the FSO 30 and the BSO 40 may be bonded and fixed to the upper and lower surfaces of the inlay 10 using an adhesive and then sheet laminated using a lamination device.

The length of the FPCB 20 inserted into the receiving hole 11 in the center of the inlay 10 is approximately equal to the length of the hole 11 formed through the top and bottom inside the inlay 10 for smooth assembly with the inlay 10. equal or 0.1±0.05mm shorter.

In order to accurately align the exposed part 22 of the substrate 20 to the lower surface of the exposed part 36 of the FSO 30 by attaching the FSO 30 to the upper part of the inlay 10 as shown in FIG. The position of the substrate 20 had to be adjusted using the left and right or top and bottom gaps g1 and g2 between the substrate 20 and the inlay 10 to be inserted into the central accommodation hole 11 of the inlay 10.

Therefore, if the left and right or top and bottom gaps g1 and 1g2 of the central receiving hole 11 of the inlay 10 are adjusted differently and biased in one direction, they are mounted on the board 20 as shown in 'd' or 'e' of FIG. The mismatch between the exposed portion of the exposed part 22 and the exposed portion 36 formed on the FSO 30 causes many problems in the use of the BSC 1.

For example, when the exposed part 22 is the EPD 5 mounted on the board 20 and the exposed part 36 is the exposure window 35 formed on the FSO 30, the Some of the letters are not visible or the left and right margins of the displayed letters are different, so it is not good to see, and the marketability is poor. In addition, when the exposed part 22 is the FPS 4 mounted on the board 20 and the exposed part 36 is the FPS cavity 34 formed in the FSO 30, the FPS 4 and the FPS cavity 34 Fingerprint recognition may not be performed because the positions of the are not matched.

In the case of manufacturing a plurality of BSCs (1) by the process shown in FIGS. 2 and 3, there is no great difficulty, but many problems arise in manufacturing a large amount of BSCs (1).
A process of manufacturing a large amount of BSC 1 will be described with reference to FIG. 4 . In FIG. 4 , reference numeral 20 denotes the previously described substrate, and reference numeral 100 denotes an inlay sheet on which a plurality of inlays 10 are aligned. And, reference number 300 is a FSOS (Front Side Overlay sheet) in which a plurality of FSOs 30 in which an IC cavity 33, an FPS cavity 34, and an exposure window 35 are formed are aligned, and reference number 400 is a plurality of BSOs. 40 is a BSOS (Back Side Overlay sheet) 400 formed in alignment.

In BSC manufacturing, as shown in FIG. 4, in the lamination process, at least several tens of substrates 20 are formed on an inlay sheet 100 as shown in FIGS. 3 (a) to (c) ( 10) into the central accommodating hole 11 and positioned at the center of the accommodating hole 11. Thereafter, the FSOS 300 and the BSOS 400 are attached to the front and rear surfaces of the inlay sheet 100 in which the plurality of substrates 20 are accommodated, and laminated.

During the lamination process, when the substrates 20 put into the receiving holes 11 of each inlay 10 of the inlay sheet 100 are moved and distorted at the central position, the defects described above occur, which is expensive. Since the board 20 on which the chips are mounted has to be discarded, a huge cost loss has occurred.

The Rise of Biometric Cards state of the art and future challenges for card manufacturers, Antonio D'Albore, Embedded Security News, 5-6 October 2017, Milan-Italy

The present invention has been made to solve the above problems, and is to provide a smart card that is easy to manufacture and a method for manufacturing the same.

Another object of the present invention is to provide a smart card having a structure for accurately matching and aligning an exposed part mounted on a board with an exposure window or exposure cavity formed in an FSO coupled to the front surface of the board and a manufacturing method thereof. .

Another object of the present invention is to provide an inlay sheet having a structure capable of minimizing a defect rate when manufacturing a smart card and a method for manufacturing a smart card using the same.

A smart card according to an embodiment of the present invention forms the circumference of the smart card and includes an inlay having a receiving hole formed with a stepped surface of a height from the surface of the inner center toward the inside; a substrate on which an exposed part is mounted and inserted into the step/stair surface of the receiving hole of the inlay to be seated and coupled; a flat part filled with a resin solution to flatten the entire surface of the substrate fitted into the receiving hole of the inlay; a front-side overlay (FSO) attached to the front surface of the substrate and the inlay, having an exposed portion formed thereon to expose or expose the exposed part to the outside of the smart card; and a backside overlay (BSO) attached to the backside of the substrate and inlay.

The exposed part is characterized in that any one of a display such as an EPD and a fingerprint sensor (FPS).

The exposure part may be an exposure window for exposing the display state of the display to the outside or a cavity (hole) for exposing the surface of the fingerprint sensor to the outside.

The substrate is a flexible printed circuit board (FPCB), and the height difference of the step/stair surface formed on the inlay is the same as the thickness of the FPCB.

It is characterized in that the receiving hole formed in the inlay and the stepped surface are formed by any one of mechanical milling, laser milling, and injection molding.

A smart card manufacturing method according to another aspect of the present invention includes preparing at least one substrate on which a micromodule IC, a fingerprint sensor, and exposed parts of a display are mounted; inserting the substrates into the accommodating holes of an inlay sheet in which accommodating holes having stepped/stair surfaces are formed at regular intervals from the surface toward the inside, and seating and coupling the substrates to the stepped/stair surfaces; flattening the entire surface of the inlay sheet in which the substrates are inserted by putting a resin solution on top of the substrate; A front-side overlay sheet and a rear-side overlay in which an exposure window is formed at regular intervals to expose the micromodule IC and fingerprint recognition sensor to the outside of the smart card, the IC cavity, the fingerprint recognition sensor cavity, and the display to be viewed from the outside of the smart card. laminating the sheets using a lamination apparatus by placing sheets on the front and rear surfaces of the substrates and the overlay sheet; and collecting unit cards by sheet punching between the receiving holes of the laminated sheet.

The coupling step is characterized in that the adhesive is applied between the substrate and the receiving hole by being inserted into the receiving hole of the inlay sheet.

It is characterized in that it includes the step of flattening by filling the receiving hole of the inlay sheet in which the substrate on which the exposed part is mounted is filled with urethane or epoxy resin.

It is characterized in that the stepped surface of the stepped surface of the inlay sheet forms a groove inclined downward from the inside to the outside of the accommodating hole, and an adhesive for bonding the substrate to the inlay sheet is accommodated in the groove.

The coupling step is characterized in that the receiving hole and the stepped surface are formed by any one of mechanical milling, laser milling, and injection molding.

According to the smart card and its manufacturing method according to an embodiment of the present invention, a board with exposed parts mounted thereon is formed by forming a step/stair surface on the inner side of a board accommodating hole drilled in an inlay sheet forming the circumferential surface of the smart card. It is possible to shorten the working time for aligning the positions of the exposed part (exposure window or exposure cavity) formed on the front side overlay sheet and the exposed parts of the board, and improve the quality of the smart card.

1 is a diagram showing a plan configuration of a general smart card;
Figure 2 is an exploded perspective view of the smart card of Figure 1;
3 is a view for explaining a manufacturing process of the smart card of FIG. 1;
Figure 4 is a view showing the combination of sheets (sheets) and a substrate for the manufacture of a smart card according to the prior art.
5 is a view showing front and rear views of an inlay sheet according to an embodiment of the present invention;
6 is a view showing a combination of sheets and a substrate for manufacturing a smart card according to an embodiment of the present invention.
7 is a cross-sectional view showing a manufacturing process of a smart card according to an embodiment of the present invention.
8 is a diagram showing a cross-sectional structure of a smart card according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

In the following description of the invention, detailed descriptions of components that are widely known and used in the technical field to which the present invention belongs or does not belong will be described or omitted as little as possible, which will omit unnecessary descriptions and the present invention according to this in order to more clearly convey the gist of

In an embodiment of the present invention, a smart card may have a rectangular shape as shown in FIG. 1, and a specific picture, company logo, text, etc. may be printed on the screen or as an option on the front surface of the front side overlay (FSO) constituting the front surface of the smart card. It can be. In addition, the exposure window (transparent window) 35 formed on the front surface of the front side overlay (FSO) and exposing the contents of the EPD 5 mounted on the substrate 20 to the outside is a method of not applying ink during printing. , and the cavity 34 exposing the fingerprint sensor 4 mounted on the substrate 20 to the outside of the smart card 1 may be formed by milling or the like.

5 is a view showing the front and rear surfaces of an inlay sheet according to an embodiment of the present invention. Referring to this, the inlay sheet 100 according to an embodiment of the present invention has a plurality of substrate receiving holes 11 at regular intervals. It is formed by penetrating up and down.

A substrate receiving hole 11 having a width and length of "w × l" on the front side of the inlay sheet 100 and a substrate receiving hole 11 having a width and length of "W × L" and a depth of 'h' on the rear side of the inlay sheet 100 It is formed by drilling at regular intervals (where W>w and L>l).

That is, the accommodation hole 11 formed in the inlay sheet 100 has a stepped surface with a height from the surface of the inner center toward the inside, as shown in "S" of FIG. 5 . In FIG. 6 , an inlay 10 to which one substrate 20 is coupled is formed between the receiving holes 11 and the receiving holes 11 .

The depth h of the step/step surface S shown in FIG. 5 is formed to be the same as the thickness of the substrate 20 . The receiving hole 11 shown in FIG. 5 and the step/step surface S formed on the inner circumferential surface thereof are formed by any one of mechanical milling, laser milling, and injection molding. can be formed by

FIG. 6 is a view showing the combination of sheets and a substrate for manufacturing a smart card according to an embodiment of the present invention, and the receiving hole 11 formed in the inlay sheet 100 is a step/stairway as shown in FIG. The rest of the configuration is the same as in FIG. 4, except that it has the stepped surface 13 with the surface S.

7 is a cross-sectional view showing a manufacturing process of a smart card according to an embodiment of the present invention. It should be noted that FIG. 7 shows only the A-A cross section of one inlay 10 marked on the inlay sheet 100 shown in FIG. 5 or 6 for convenience of description.

The substrate 20 used in the embodiment of the present invention is the same as that described in FIGS. 1 to 3 is used. That is, the substrate is a flexible printed circuit board (FPCB), and the exposed parts are a display 5 such as an EPD and a fingerprint sensor (FPS) 4. The substrate 20 as above should be prepared in the number that is coupled to the accommodating hole 11 of the inlay sheet 100 configured as shown in FIG. 6 .

As shown in (a) of FIG. 7, the rear surface of the inlay sheet 100 having the receiving hole 11 having the stepped surface 13 on which the stepped surface S is formed is turned upside down and shown in FIG. 7 (b) As described above, the substrate 20 on which the exposed parts 22 are mounted is seated on the stepped surface 13 of the stepped/stair surface S and coupled thereto. Due to this step-difference surface coupling, there is no gap between the receiving hole 11 of the inlay 10 and the substrate 20, so the coupling is stable.

Thereafter, for a firm connection between the inlay 10 and the substrate 20, an adhesive is dotted on the joint between the two to form a bonding surface 15, and then the upper portion is flattened as shown in FIG. 7(c) .

After the board 20 is accommodated in the receiving hole 11 and the attached inlay 10 is turned over as shown in FIG. 7(d), the exposed part 22 mounted on the board 20 faces upward, (20) Fill the upper surface, more specifically, the receiving hole 11 of the inlay sheet 100 in which the substrate 20 on which the exposed part 22 is mounted is filled with urethane, epoxy resin, or a solution to fill the inlay sheet ( 100) and the surface of the substrate 20 are flattened so that they have the same height.

In addition, the FSO 30 is connected to the inlay 10 and the substrate so that the exposed part 36 that exposes or exposes the exposed part 22 to the outside of the smart card 1 coincides with the upper part of the exposed part 22. Attached to the front of (20).

In addition, the BSO 40 shown in (d) of FIG. 7 is attached to the rear surface of the inlay 10 to which the substrate 20 is fixed.

The exposed part 36 is an exposure window 35 that exposes the display state of the display 5 mounted on the substrate 20 to the outside, or a cavity that exposes the surface of the fingerprint sensor 4 to the outside. ; hole) (34).

As described above, the sheet to which the FSO 30 and the BSO 40 are attached to the front and rear surfaces of the inlay 10 in which the substrate 20 is coupled to the stepped surface 13 of the step/stair surface S has a lamination device. It is produced as a lamination sheet cured by the lamination process used.

Thereafter, the sheet is punched between the receiving holes of the laminated sheet to collect cured unit cards (Cards Gathering).

8 is a diagram showing a cross-sectional structure of a smart card according to another embodiment of the present invention. Referring to FIG. 8, the stepped surface 13 of the stepped/stair surface S formed in the accommodating hole 11 of the inlay 10 (or inlay sheet 100) slopes downward from the inside of the accommodating hole 11 to the outside. It is formed as a photo groove (12).

An adhesive is applied or accommodated in the groove 12, and when the board 20 on which the exposed part 22 is mounted is put into the board receiving hole 11 of the inlay 10 and combined, the board 20 is attached to the inlay. Attach firmly to (10).

The configuration and operation other than that are the same as in FIG. 7 .

As described above, the present invention forms a step/stair surface on the inner side of the board accommodating hole drilled in the inlay sheet forming the circumferential surface of the smart card to easily fix the board on which the exposed part is mounted to the inlay sheet, thereby removing the exposed part. Even if the top side overlay sheet and the back side overlay sheet having exposed parts exposed to the outside are arranged and attached to the front and back of the inlay sheet and laminated, it is possible to prevent the exposed part and the exposed part from being distorted, thereby improving the quality of the card. productivity can be increased.

Reference Numerals 1: BSC, 2: power button, 4: fingerprint sensor, 5: display, 10: inlay, 11: receiving hole, 12: groove, 13: stepped surface, 15: bonding surface, 20: substrate, 22: exposed part, 30: front side overlay, 34: cavity, 35: exposure window, 36: exposure part, 40: rear side overlay, 50: resin solution, 100: inlay sheet, 300: front side overlay sheet, 400; rear side overlay sheet,

Claims (10)

A smart card comprising: an inlay forming a circumference of the smart card and having a receiving hole formed with a stepped/stair surface of a height from a surface of an inner center toward an inner side; a substrate on which a micro module IC, a fingerprint recognition sensor, and exposed parts of a display are mounted and inserted into the surface of the steps and stairs of the receiving hole of the inlay to be seated and coupled; a flat part in which a resin solution is filled on top of the substrate inserted into the receiving hole of the inlay and the entire surface of the substrate and the inlay is flattened; An IC cavity and a fingerprint recognition sensor cavity for exposing the micro module IC and fingerprint recognition sensor to the outside of the smart card, and an exposure window allowing the display to be seen outside the smart card are formed to flatten the front surface of the substrate and the inlay. a front side overlay attached to the front side; A smart card comprising a rear side overlay attached to the back side of the substrate and the inlay.
The smart card according to claim 1, wherein the receiving hole and the stepped surface formed in the inlay are formed by any one of mechanical milling, laser milling, and injection molding.
The smart card according to claim 1, wherein the substrate is a flexible printed circuit board (FPCB), and a difference in height of the surface of the steps formed on the inlay is equal to the thickness of the FPCB.
delete delete A method for manufacturing a smart card, comprising: preparing at least one substrate on which a micromodule IC, a fingerprint sensor, and exposed parts of a display are mounted; inserting the substrates into the accommodating holes of an inlay sheet in which accommodating holes having stepped/stair surfaces are formed at regular intervals from the surface toward the inside, and seating and coupling the substrates to the stepped/stair surfaces; flattening the entire surface of the inlay sheet in which the substrates are inserted by putting a resin solution on top of the substrate; A front-side overlay sheet and a rear-side overlay in which an exposure window is formed at regular intervals to expose the micromodule IC and fingerprint recognition sensor to the outside of the smart card, the IC cavity, the fingerprint recognition sensor cavity, and the display to be viewed from the outside of the smart card. laminating the sheets using a lamination apparatus by placing sheets on the front and rear surfaces of the substrates and the overlay sheet; and collecting unit cards by sheet punching between the receiving holes of the laminated sheet.
[Claim 7] The method of claim 6, wherein, in the coupling step, an adhesive is applied between the substrate and the receiving hole by being inserted into the receiving hole of the inlay sheet.
The method of claim 6, wherein the step surface of the stepped surface of the inlay sheet forms a groove inclined downward from the inside to the outside of the receiving hole, and an adhesive for bonding the substrate to the inlay sheet is accommodated in the groove. A smart card manufacturing method.
The method of claim 7 or 8, further comprising the step of flattening the receiving hole of the inlay sheet in which the substrate on which the exposed part is mounted is filled with urethane or epoxy resin.
[Claim 10] The method of claim 9, wherein the coupling step is formed by any one of mechanical milling, laser milling, and injection molding of the receiving hole and the surface of the step/step.

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