KR102524811B1 - Led module and led lamp including the same - Google Patents

Abstract

An embodiment of the present disclosure is a flexible substrate having a first surface on which a circuit pattern is disposed and a second surface opposite to the first surface, and is mounted on the first surface of the flexible substrate, on the circuit pattern. A plurality of light emitting diode (LED) chips electrically connected to each other, an insulating reflective layer disposed on the first surface of the flexible substrate and covering a portion of the circuit pattern, disposed on both ends of the flexible substrate, and connected to the circuit pattern. Connected first and second connection terminals, covering the plurality of LED chips, and a wavelength conversion unit surrounding the flexible substrate; provides an LED module including.

Description

LED module and LED lamp including the same {LED MODULE AND LED LAMP INCLUDING THE SAME}

The present invention relates to an LED module and an LED lamp including the same.

In general, incandescent lamps or fluorescent lamps are widely used as indoor or outdoor lighting, but these incandescent lamps or fluorescent lamps have a short lifespan and have to be frequently replaced.

In order to solve this problem, a lighting device using a light emitting diode (LED) having a high photoelectric conversion efficiency and an excellent lifespan is in the limelight. In addition, the LED provides various advantages in that it is not only stronger against impact than conventional bulb-type lamps or fluorescent lamps, but also consumes less power, has a semi-permanent service life, and can produce lighting effects of various colors.

As such, as the demand for the adoption of LEDs in the lighting field increases, various demands such as processability and light distribution characteristics are also increasing.

One of the problems to be solved by the present invention is to provide a filament type LED module with excellent workability in which light distribution characteristics are adjusted and luminous flux is improved.

One of the problems to be solved by the present invention is to provide an LED lamp including a filament type LED module with excellent workability in which light distribution characteristics are adjusted and luminous flux is improved.

An embodiment of the present disclosure is a flexible substrate having a first surface on which a circuit pattern is disposed and a second surface opposite to the first surface, and is mounted on the first surface of the flexible substrate, on the circuit pattern. A plurality of light emitting diode (LED) chips electrically connected to each other, an insulating reflective layer disposed on the first surface of the flexible substrate and covering a portion of the circuit pattern, disposed on both ends of the flexible substrate, and connected to the circuit pattern. Connected first and second connection terminals, covering the plurality of LED chips, and a wavelength conversion unit surrounding the flexible substrate; provides an LED module including.

An embodiment of the present disclosure includes a flexible substrate having first and second surfaces opposite to each other and having a bar shape, a pad area disposed on the first surface of the flexible substrate, and a pad area in the pad area. A circuit pattern having a connected connection pattern and a dummy pattern protruding from the connection pattern, arranged on the first surface of the flexible substrate along the length direction of the flexible substrate, and electrically connected to a pad region of the circuit pattern. A plurality of LED chips, an insulating reflective layer mounted on a first surface of the flexible substrate and covering a part of the circuit pattern, and first and second connections disposed on both ends of the flexible substrate and connected to the circuit pattern. An LED module including a terminal and a wavelength converter covering the plurality of LED chips and surrounding the flexible board is provided.

An embodiment of the present disclosure relates to a flexible substrate having first and second surfaces opposite to each other and having a bar shape, a circuit pattern disposed on the first surface of the flexible substrate, and on the first surface of the flexible substrate. a plurality of LED chips arranged along the longitudinal direction of the flexible substrate and electrically connected to the circuit pattern, mounted on the first surface of the flexible substrate, covering a part of the circuit pattern and extending along the longitudinal direction; an insulating reflective layer including a plurality of separated patterns arranged on both ends of the flexible substrate and covering first and second connection terminals connected to the circuit pattern and the plurality of LED chips; It provides an LED module including a wavelength conversion unit surrounding a substrate.

One embodiment of the present disclosure includes a base, a lamp cover mounted on the base and having an internal space, and at least one LED module disposed in the internal space of the lamp cover, wherein the at least one LED module, A flexible substrate having first and second surfaces opposite to each other and having a bar shape, a circuit pattern disposed on the first surface of the flexible substrate, and a circuit pattern disposed on the first surface of the flexible substrate. A plurality of LED chips arranged along the length direction and electrically connected to the circuit pattern, and an insulating reflective layer mounted on the first surface of the flexible substrate and covering a part of the circuit pattern to surround the plurality of LED chips, respectively. and first and second connection terminals disposed at both ends of the flexible substrate and connected to the circuit pattern, and a wavelength converter covering the plurality of LED chips and surrounding the flexible substrate. to provide.

According to the above-described embodiment, the luminous flux can be improved by providing an insulating reflective layer on the upper surface of the flexible substrate to cover a part of the circuit pattern. In particular, the light distribution characteristics (variance in the amount of light on the front and rear surfaces) can be adjusted by adjusting the formation region of the insulating reflective layer.

In some embodiments, by configuring the insulating reflective layer with a plurality of patterns separated from each other in the longitudinal direction, peeling of the insulating reflective layer can be prevented even when bent and mounted by utilizing the characteristics of a flexible substrate in an LED lamp.

The various beneficial advantages and effects of the present invention are not limited to the above, and will be more easily understood in the process of describing specific embodiments of the present invention.

1 is a side cross-sectional view showing a light emitting diode (LED) module according to an embodiment of the present invention.
FIG. 2 is a top plan view of a substrate employed in the LED module shown in FIG. 1 .
FIG. 3 is a cross-sectional side view of an LED chip employable in the LED module shown in FIG. 1 .
FIG. 4 is a cross-sectional side view of the LED module shown in FIG. 1 cut along line I-I'.
5 is a cross-sectional side view of an LED module according to an embodiment of the present invention.
6 is a top plan view of a substrate employed in an LED module according to an embodiment of the present invention.
7A and 7B are cross-sectional views showing examples of an insulating reflective layer applied to the substrate shown in FIG. 6, respectively.
8 is a graph showing an improvement in light quantity of an LED module according to various embodiments.
9a and 9b are pictures taken of circuit patterns according to whether or not Sn plating is applied as embodiments of the present invention.
10 is a graph showing light reflectivity of the embodiment shown in FIGS. 9A and 9B .
11 is a top plan view of a substrate employed in an LED module according to an embodiment of the present invention.
12a and 12b are top plan views of a substrate employed in an LED module according to various embodiments of the present invention.
13 is a perspective view showing an LED lamp according to an embodiment of the present invention, and FIG. 14 is a top plan view showing the LED lamp shown in FIG. 13 .
15 is a front view showing an LED lamp according to an embodiment of the present invention.
16a and 16b are perspective views illustrating an LED lamp according to various embodiments of the present disclosure, respectively.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional side view showing an LED module according to this embodiment, and FIG. 2 is a plan view showing the LED module shown in FIG.

Referring to Figures 1 and 2, the LED module 200 according to this embodiment, a flexible substrate 110 having a first surface (110A) and a second surface (110B) located opposite to each other, and the flexible substrate A plurality of light emitting diode (LED) chips 150 mounted on the first surface 110A of 110, an insulating reflective layer 120 disposed on the first surface 110A of the flexible substrate 110, , Connected to the plurality of LED chips 150 and covering the first and second connection terminals 270a and 270b for applying a driving voltage, and the plurality of LED chips 150 and the flexible substrate 110 It includes the surrounding wavelength converter 190.

The flexible substrate 110 includes a circuit pattern 115 disposed on the first surface 110A. The plurality of LED chips 150 may be electrically connected to the circuit pattern 115 . For example, the plurality of LED chips 150 may be connected to the circuit pattern 115 by a flip-chip bonding method. Specifically, the first and second electrodes 159a and 159b of the plurality of LED chips 150 may be respectively connected to the circuit pattern 115 by conductive bumps such as solder.

The insulating reflective layer 120 is formed to cover a portion of the circuit pattern 115 . The insulating reflective layer 120 employed in this embodiment can contribute to improving the luminous flux by preventing light absorption by the circuit pattern 115 such as copper.

As shown in FIG. 2 , the insulating reflective layer 120 may be formed to cover other areas except for the pad area 115a connected to the first and second electrodes 159a and 159b of the LED chip 150. can The insulating reflective layer 120 may be used as a means for adjusting light distribution characteristics (luminous flux ratio of front and rear surfaces). In this embodiment, since the insulating reflective layer 120 is formed along the arrangement of the circuit patterns 115, other regions of the first surface 110A of the flexible substrate may be exposed. Therefore, it is possible to relatively increase the ratio of the luminous flux to the rear side.

The insulating reflective layer 120 may be a white reflective layer. For example, the white reflective layer may be a resin layer containing white-photo solder resist (W-PSR) or white ceramic powder. The white ceramic powder may include at least one selected from TiO ₂ , Al ₂ O ₃ , Nb ₂ O ₅ , and ZnO.

The flexible substrate 110 employed in this embodiment may have flexibility (flexibilty) that can be processed into various shapes within a lamp. For example, the flexible substrate 110 may include polyimide (PI), polyamide imide (PAI), polyethylene terephthalate (PET), polyethylene naphthalene (PEN), and silicon (silicone). ) may contain a material selected from the group consisting of

In some embodiments, since the flexible substrate 110 uses a flexible material having a light transmittance of 80% or more, rear light distribution can be greatly improved. For example, conventional aromatic polyimide has low light transmittance (eg, 70% or less) because it is colored like yellowish polyimide, whereas colorless polyimide (which has high light transmittance by additional treatment) When used as colorless polyimide), it may have a light transmittance of 80% or more, and even more than 90%. Aromatic polyimide has a low light transmittance in the visible light band (especially less than 70% at 550 nm or less) because it is colored such as yellow, whereas colorless polyimide has a high light transmittance overall in the visible light band, and average The light transmittance may be 80% or more, or approximately 90%. In the case of using such colorless polyimide, rear light distribution can be greatly increased.

Specifically, in aromatic polyimide, π electrons of benzene present in the main chain of imide are transferred through intermolecular bonding, and the energy level is lowered to absorb long-wavelength regions of visible light, resulting in a yellow color. . On the other hand, in the case of the embodiment, a colorless poly having high light transmittance by limiting π electron movement by introducing a functional structure containing an element with strong electronegativity or reducing π electron density by introducing a cyclic structure other than benzene. Mead can be provided.

As another example, the flexible substrate 110 may include a silicone resin composition in which polyorganosiloxane, a silicone resin, a crosslinking agent, and a catalyst are mixed.

As shown in FIG. 2 , a plurality of LED chips 150 are arranged in one column and may be connected in series by the circuit pattern 115 . The first and second connection terminals 270a and 270b may be disposed on both ends of the flexible substrate 110 to be connected to the circuit pattern 115 . Unlike the present embodiment, the plurality of LED chips 150 may be arranged in a plurality of columns and partially connected in parallel. For example, when arranged in a plurality of columns, each column may be connected in series, and the plurality of columns may be connected in parallel to each other by being connected to the first and second connection terminals 270a and 270b.

As described above, the LED chip 150 employed in this embodiment may be a flip chip structured LED. FIG. 3 is a cross-sectional view showing an example of an LED chip employable in the LED module shown in FIG. 1 .

Referring to FIG. 3 , the LED chip 150 includes the light-transmitting substrate 151, a first conductive semiconductor layer 154 sequentially disposed on the substrate 151, an active layer 155, and a second conductive layer. A type semiconductor layer 156 is included. A buffer layer 152 may be disposed between the substrate 151 and the first conductivity type semiconductor layer 154 .

The substrate 151 may be an insulating substrate such as sapphire. However, it is not limited thereto, and the substrate 151 may be a conductive or semiconductor substrate in addition to insulating. For example, the substrate 151 may be SiC, Si, MgAl ₂ O ₄ , MgO, LiAlO ₂ , LiGaO ₂ , or GaN in addition to sapphire. An irregularity C may be formed on the upper surface of the substrate 151 . The unevenness (C) can improve the quality of the grown single crystal while improving the light extraction efficiency.

The buffer layer 152 may be In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1). For example, the buffer layer 152 may be GaN, AlN, AlGaN, or InGaN. If necessary, a plurality of layers may be combined or the composition may be gradually changed and used.

The first conductivity-type semiconductor layer 154 is a nitride semiconductor that satisfies n-type In _x Al _y Ga _{1 -x- y} N (0≤x<1, 0≤y<1, 0≤x+y<1) , and the n-type impurity may be Si. For example, the first conductivity-type semiconductor layer 154 may include n-type GaN. The second conductive semiconductor layer 156 is a nitride semiconductor that satisfies p-type In _x Al _y Ga _{1 -x- y} N (0≤x<1, 0≤y<1, 0≤x+y<1) layer, and the p-type impurity may be Mg. For example, the second conductivity type semiconductor layer 156 may be implemented as a single-layer structure, but may have a multi-layer structure having different compositions, as in this example. The active layer 155 may have a multiple quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, the quantum well layer and the quantum barrier layer have different compositions In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can In a specific example, the quantum well layer may be In _x Ga _{1 - x} N (0<x≤1), and the quantum barrier layer may be GaN or AlGaN. Each of the quantum well layer and the quantum barrier layer may have a thickness in the range of 1 nm to 50 nm. The active layer 155 is not limited to a multi-quantum well structure and may have a single quantum well structure.

The first and second electrodes 159a and 159b may be respectively disposed in the mesa-etched region of the first conductivity-type semiconductor layer 154 and the second conductivity-type semiconductor layer 156 so as to be positioned on the same surface. can The first electrode 159a is not limited thereto, but may include a material such as Ag, Ni, Al, Cr, Rh, Pd, Ir, Ru, Mg, Zn, Pt, or Au, and may have a single layer or a double layer. The above structure can be employed. If necessary, the second electrode 159b may be a transparent electrode such as a transparent conductive oxide or a transparent conductive nitride, or may include graphene. The second electrode 159b may include at least one of Al, Au, Cr, Ni, Ti, and Sn.

The wavelength conversion unit 190 may include a wavelength conversion material P such as a phosphor or a quantum dot and a transparent resin 190S containing the same. The wavelength conversion material P may convert some of the light generated from the plurality of LED chips 150 into light having a converted wavelength. The wavelength conversion material P may be composed of at least one wavelength conversion material so that final emission light is obtained as white light. For example, when the wavelength conversion material P includes two or more wavelength conversion materials, it may include at least one of a yellow phosphor, a green phosphor, and a red phosphor.

Referring to FIG. 1 , the wavelength converter 190 may be formed to surround the flexible substrate 110 while covering the plurality of LED chips 150 . Accordingly, all of the lights L1 and L2 emitted to the front and rear surfaces of the LED module 100 may pass through the wavelength converter 190 and be converted into desired light.

The wavelength converter 190 employed in this embodiment may be described in detail with reference to FIG. 4 . FIG. 4 is a cross-sectional view of the LED module shown in FIG. 1 cut along line I-I'.

Referring to FIG. 4 , the wavelength converter 190 includes a first wavelength converter 190A disposed on a first surface 110A where a plurality of LED chips 150 are located, and a second wavelength converter 190A of a flexible substrate 110. A second wavelength converter 190B disposed on the surface 110B may be included.

In this embodiment, the wavelength converter 190 is a surface where the mounting surface P−P′ (or first surface) of the flexible substrate 110 passes through the center C0 of the wavelength converter 190 (CP). -CP') may be formed to be located lower than. In this structure, the surface area of the first wavelength converter 190A located on the front side may be larger than the surface area of the second wavelength converter 190B located on the rear side.

The amount of front light and the amount of back light can be adjusted using this structure and arrangement. As in the present embodiment, the thickness t1 of the first wavelength conversion part 190A is the thickness of the second wavelength conversion part 190B ( t2) may be greater. As such, when the thickness t2 of the second wavelength converter 190B is formed thin, the front light amount L1 and deviation can be reduced, so that the color of light emitted from the front and rear surfaces can be uniformly adjusted. .

5 is a cross-sectional view showing an LED module according to an embodiment of the present invention.

Referring to FIG. 5, the LED module 200' according to the present embodiment has a substantially rectangular cross section, except that the second surface 110B of the flexible substrate 110 has irregularities 110P formed thereon. It can be understood as a structure similar to the LED module 200 shown in FIG. Description of the components of this embodiment may refer to descriptions of the same or similar components of the LED module 200 shown in FIGS. 1, 2 and 4 unless otherwise stated.

The wavelength converter 190' according to the present embodiment includes a first wavelength converter 190A' disposed on the front surface of the flexible substrate 110 and a second wavelength converter disposed on the rear surface of the flexible substrate 110 ( 190B′), and the first wavelength converter 190A′ and the second wavelength converter 190B′ may be formed by separate processes.

As such, since the first wavelength conversion part 190A' and the second wavelength conversion part 190B' are formed using different processes such as dispensing, different types of wavelength conversion materials P1 and P2 or different content ratios It may include a wavelength conversion material (P1, P2) of. Accordingly, scattering by the wavelength conversion materials P1 and P2 in the second wavelength conversion part 190B' is reduced compared to that in the first wavelength conversion part 190A', thereby increasing the amount of back light L2. It can reduce front light amount (L1) and deviation. For example, the content ratio of the wavelength conversion materials P1 and P2 of the first wavelength conversion part 190A' is greater than the content ratio of the wavelength conversion materials P1 and P2 of the second wavelength conversion part 190B'. can be big

The wavelength conversion unit 190' may include first and second wavelength conversion materials P1 and P2. When the plurality of LED chips 150 emit blue light, the first and second wavelength conversion materials P1 and P2 may include at least one of a green phosphor and a red phosphor, or a yellow phosphor and green and red phosphors, respectively. can

Similar to the previous embodiment, by making the thickness t1 of the first wavelength conversion part 190A' larger than the thickness t2 of the second wavelength conversion part 190B', the front light amount L1 and the back light amount Variation in the amount of light L2 can be reduced. In addition to the shape illustrated in this embodiment, the cross section of the wavelength converter 190' may have other various shapes.

In addition, the unevenness 110P formed on the second surface 110B of the flexible substrate 110 can greatly improve the extraction efficiency of light extracted to the rear surface. In this way, in addition to adding the irregularities 110P to the second surface 110B of the flexible substrate 110, the luminous flux and light distribution characteristics from the back side can be designed in various ways by using other optical treatments (matte and scattering layers, etc.). can

6 is a top plan view of a substrate employed in an LED module according to an embodiment of the present invention.

Referring to FIG. 6, the flexible substrate 110 employed in the LED module according to the present embodiment is shown in FIG. 2 except that the shape of the circuit pattern 115' and the formation area of the insulating reflective layer 120' are different. It can be understood as a structure similar to the flexible substrate of the LED module 200. Description of the components of this embodiment may refer to the description of the same or similar components of the flexible substrate of the LED module shown in FIG. 2 unless otherwise stated.

The circuit pattern 115' employed in this embodiment may further include a dummy pattern 115c in addition to the pad region 115a and the connection pattern 115b connecting the pad region 115a. The dummy pattern 115c protrudes from the connection pattern 115b regardless of electrical connection. The dummy pattern 115c serves to expand a heat dissipation area.

The dummy pattern 115c according to the present embodiment may extend from the connection pattern 115b between the mounting regions of the LED chips or may extend along the length direction from the periphery of the flexible board 110 .

In addition, the insulating reflective layer 120 ′ employed in this embodiment may be formed to cover regions of the circuit pattern 115 other than the pad region 115a. As shown in FIG. 6 , the insulating reflective layer 120 ′ may be formed such that both corner regions of the upper surface of the substrate 110 are exposed.

The insulating reflective layer 120 may be provided in various types of white reflective layers. For example, the insulating reflective layer 120 may be cured after applying a coating layer or provided using an adhesive sheet.

7A and 7B are cross-sectional views illustrating examples of an insulating reflective layer applied to the substrate (II-II′ direction) shown in FIG. 6, respectively.

Referring to FIG. 7A , the insulating reflective layer 120 ′ may be formed by applying a white photo solder resist (W-PSR) or a resin layer containing white ceramic powder to a desired area and then curing it.

In another example, as in the insulating reflective layer 120" shown in FIG. 7B, a white reflective film is formed by using the white photo solder resist (W-PSR) or a white ceramic powder-containing resin on a transparent sheet 125 such as polyimide. (120') may be formed in advance and bonded using the adhesive layer 121 provided on the lower surface of the transparent sheet 125.

Hereinafter, in order to confirm the change in the luminous flux improvement and light distribution characteristics of the LED modules according to the present embodiments, after manufacturing various LED modules according to the conditions in Table 1, the luminous flux and light distribution characteristics were evaluated.

Comparative Examples A1, A2 and Example A were designed with circuit patterns similar to those of FIG. 2, and the materials of each substrate were different from Eloish Polyimide (PI) and Colorless Polyimide (CPI). Comparative Examples B1, B2 and Examples B1, B2, and B3 were designed with circuit patterns similar to those of FIG. 6, and the materials of each substrate were also different from Eloish Polyimide (PI) and Colorless Polyimide (CPI).

In addition, as the insulating reflective layer, a white photo solder resist (W-PSR) having a thickness of 25 μm was applied only to Examples A, B1, B2 and B3, but was formed in areas similar to those of FIG. 6 (excluding both corner areas). In Example B3, the W-PSR layer was also applied to the lower surface of the flexible substrate in the same manner.

division circuit pattern design flexible substrate material insulating reflective layer Comparative Example A1 Figure 2 PI 25㎛ Unapplied Comparative Example A2 Figure 2 CPI 30㎛ Unapplied Example A Figure 2 CPI 30㎛ W-PSR 25㎛ / top surface application Comparative Example B1 Figure 6 PI 25㎛ Unapplied Comparative Example B2 Figure 6 CPI 30㎛ Unapplied Example B1 Figure 6 PI 25㎛ W-PSR 25㎛ / top surface application Example B2 Figure 6 CPI 30㎛ W-PSR 25㎛ / top surface application Example B3 Figure 6 CPI 30㎛ W-PSR 25㎛ / top and bottom application

In this way, the luminous flux and light distribution characteristics of variously manufactured LED modules were measured, and the results are shown in Table 2 and the graph of FIG. 8.

division full beam front beam ratio rear beam ratio Comparative Example A1 100% (Ref) 64.6% 35.4% Comparative Example A2 112.6% 60.4% 39.6% Example A 116.9% 65.6% 34.4% Comparative Example B1 99.5% 67.9% 32.1% Comparative Example B2 109.3% 64.0% 36.0% Example B1 117.6% 79.6% 20.4% Example B2 122.6% 76.6% 23.4% Example B3 122.0% 78.1% 21.9%

Referring to Table 2 and FIG. 8, the LED module according to this embodiment (Example A, Example B1, B2, B3) increased the overall luminous flux compared to Comparative Example A1 (reference), and the material and insulation of the flexible substrate It can be seen that the light distribution characteristics can be variously changed by adjusting the formation area of the reflective layer.

9A and 9B are photographs of circuit patterns according to whether or not Sn plating is applied as embodiments of the present invention, and FIG. 10 is a graph showing light reflectivity of the embodiment shown in FIGS. 9A and 9B.

In this embodiment, it is also possible to improve the reflectance of the circuit pattern itself. In the case of a Cu pattern mainly used as a circuit pattern (see FIG. 9A), it shows a relatively low reflectance (eg, 50% or less) in the range of 400 to 550 nm. On the other hand, by applying tin (Sn) plating to the surface of the Cu pattern to give it a white color and to have a relatively high reflectance in the entire wavelength band, it can contribute to overall luminous flux improvement (eg, +1.8%). Improvement of reflectance through additional plating of the circuit pattern may be applied to the LED module alone, but may also be implemented in combination with the insulating reflective layer according to the foregoing embodiment.

Embodiments according to the present invention are not limited to tin plating, and the reflectance of the circuit pattern can be improved by plating a metal having a high reflectivity, such as Ag.

11 is a top plan view of a substrate employed in an LED module according to an embodiment of the present invention.

The flexible substrate 110 employed in the LED module according to the present embodiment is similar to the flexible substrate of the LED module shown in FIG. 2 except that the shape of the circuit pattern 115 and the formation area of the insulating reflective layer 220 are different. structure can be understood. Description of the components of this embodiment may refer to the description of the same or similar components of the flexible substrate of the LED module shown in FIG. 2 unless otherwise stated.

The circuit pattern 115 employed in this embodiment may include a pad region 115a and a connection pattern 115b connecting the pad region 115a. In addition, the circuit pattern 115 may further include a relatively small dummy pattern 115c protruding from the connection pattern 115b. A portion of the dummy pattern 115c may not be covered by the insulating reflective layer 220 . Accordingly, heat dissipation performance using the dummy pattern 115c may be improved.

The insulating reflective layer 220 employed in this embodiment may have a plurality of patterns separated along the length direction of the substrate 110 . Since the LED module according to the present embodiment is bent in the longitudinal direction of the substrate 110 , the insulating reflective layer 220 may be easily cracked or broken and separated from the substrate 110 . In order to prevent such damage, as in the present embodiment, the insulating reflective layer 220 may be formed in a pattern separated by two mounting areas.

12a and 12b are top plan views of a substrate employed in an LED module according to various embodiments of the present invention.

The flexible substrate 110 used in the LED module according to the present embodiment can be understood as a structure similar to that of the flexible substrate of the LED module shown in FIG. 2 except that insulating reflective layers 220A and 220B of various different patterns are employed. there is. Description of the components of this embodiment may refer to the description of the same or similar components of the flexible substrate of the LED module shown in FIG. 2 unless otherwise stated.

The circuit pattern 115″ employed in the present embodiments also includes a pad region 115a, a connection pattern 115b connecting the pad region 115a, and a dummy pattern 115c protruding from the connection pattern 115b.

Referring to FIG. 12A , the insulating reflective layer 220A employed in the present embodiment is separated along the length direction of the substrate 110 and may have a plurality of T-shaped separated patterns. The plurality of separated patterns may have a T-shape, but may be alternately arranged with an inverted T-shape. With this arrangement, the insulating reflective layer 220A may be formed to substantially surround each mounting region (a pair of pad regions 115a) of the LED chip.

Referring to FIG. 12B , the insulating reflective layer 220B employed in this embodiment is separated along the length direction of the substrate 110 and may have a plurality of separated I-shaped patterns. By arranging the I-shaped separation patterns side by side as shown in FIG. 12B , the insulating reflective layer 220B may be formed to substantially surround each mounting area of the LED chip.

As such, the insulating reflective layers 220A and 220B employed in the present embodiment are arranged to be separated along the longitudinal direction in various patterns, so that even when the substrate 110 is bent in the longitudinal direction, the insulating reflective layers 220A and 220B are formed on the substrate ( 110) can be prevented from being peeled off or broken, and the reflection effect can be further improved by arranging them to surround the mounting area of the LED chip by adopting an appropriate shape.

13 is a perspective view showing an LED lamp according to an embodiment of the present invention, and FIG. 14 is a top plan view showing the LED lamp shown in FIG. 13, viewed from the C1 direction.

13 and 14, the LED lamp 1000 according to this embodiment includes a base 600 having a socket structure, a lamp cover 800 mounted on the base 600 and having an internal space, A plurality (eg, four) LED modules 200 disposed in the inner space of the lamp cover 800 may be included.

When the connection frame 420 or the first and electrode frames 410a and 410b are interlocked with each other, the main emitting surface (ie, upper surface) of the LED module 200 naturally faces the lamp cover 800 direction. and the opposite surface 110b may be disposed toward the central axis C1.

The lamp cover 800 may be a transparent, opaque, matte, or colored bulb cover made of glass, hard glass, quartz glass, or light-transmitting resin. The lamp cover 800 may be of various types. For example, A-type, G-type, R-type, PAR-type, T-type, S-type, candle type, P-type, PS type, BR type, ER type, BRL type, etc. It may be one of the existing bulb-type covers.

The base 600 is combined with the lamp cover 800 to form the exterior of the LED lamp 1000, and to be replaced with the existing lighting device, E40, E27, E26, E14, GU, B22, BX, BA, It can be composed of sockets such as EP, EX, GY, GX, GR, GZ, and G types.

Power applied to the LED lamp 1000 may be applied through the base 600 . A power supply unit 700 may be disposed in the inner space of the socket 600 to AC-DC convert power applied through the base 600 or change the voltage to be provided to the LED module 200 .

One end of the support 300 is installed to be fixed to the central axis C1 of the base 600, and a frame 400 for fixing the LED module 200 may be disposed on the support 300. . The post 300 covers the open area of the lamp cover 800 and is welded through high-temperature heat treatment to form a sealed inner space. Therefore, the LED module 200 disposed in the inner space of the lamp cover 800 can be blocked from external moisture.

The frame 400 may be made of a metal material to fix the LED module 200 and supply power, and may include a connection frame 420 connecting a plurality of LED modules 200 and a device for supplying power. First and second electrode frames 410a and 410b may be included. A mounting portion 310 for fixing the connecting frame 420 may be formed at the other end of the holding part 300 . The first and second electrode frames 410a and 410b are installed to be fixed to the middle of the support 300, and a plurality of LED modules 200 welded to the first and second electrode frames 410a and 410b are installed. can support The first and second electrode frames 410a and 410b are connected to the first and second wires 500a and 500b buried in the holding 300, respectively, and power supplied from the power supply unit 700 may be applied. .

A plurality of LED modules 200 may be accommodated in the inner space of the lamp cover 800 . Since the LED module 200 is manufactured in a shape similar to a filament of a conventional incandescent light bulb and emits linear light like a filament when power is applied, it is also called an LED filament.

Referring to FIG. 14 , the LED modules 200 may be radially arranged such that a first surface of each LED module is adjacent to the lamp cover 800 . When viewed from the top of the LED lamp 1000, the base 600 may be disposed in a rotationally symmetrical shape with respect to the central axis C1. Specifically, in the inner space of the lamp cover 800, the main light emission direction L1 of each LED module 200 is disposed rotationally symmetrically around the support 300 so as to face the lamp cover 800. It can be. In this arrangement, not only the front emission of the LED module 200 is directly emitted through the lamp cover 800, but also the back emission of the LED module 200 can contribute to the total light output.

The frame and electrical connection structure employable in this embodiment are not limited thereto and may be implemented in various structures. In particular, since the LED module 200 according to the present embodiment includes a flexible substrate, it may be mounted in various shapes such as a shape bent to have a curved surface. In addition, the LED module 200 according to this embodiment is not limited to a specific direction (the first surface faces the lamp cover) according to light distribution characteristics and may be arranged to face in various directions.

15 is a front view showing an LED lamp according to an embodiment of the present invention.

Referring to FIG. 15, the LED lamp 1000' according to the present embodiment is the LED lamp 1000 shown in FIG. ) can be understood as similar to Description of the components of this embodiment may refer to descriptions of the same or similar components of the LED module 1000 shown in FIGS. 13 and 14 unless otherwise stated.

Unlike the lamp cover 800 employed in the previous embodiment, the lamp cover 800' may have a slightly extended shape in the axial direction. Both ends of the LED module 200 employed in this embodiment are connected to first and second electrode frames 410a' and 410b', respectively, and spirally wraps the first electrode frame 410a' located along the axial direction. can be placed in a row. In this way, since the LED module 200 is provided with a flexible substrate, it can be disposed in various curved forms. This embodiment is illustrated as a form employing one LED module 200, but in other embodiments, A plurality of LED modules may be employed.

16a and 16b are perspective views showing an LED lamp according to various embodiments of the present invention, respectively.

Referring to FIG. 16A, the LED lamp 2000 according to the present embodiment includes a lamp cover 2420 having a shape of a long bar in one direction, and a plurality of LED modules 200 disposed in the lamp cover 2420. and a pair of sockets 2470a and 2470b disposed at both ends of the lamp cover 2420.

In this embodiment, the plurality of LED modules 200 are illustrated as four LED modules. As the four LED modules 200 are arranged in series by two, these two columns are arranged in parallel. The two rows of LED modules 200 connected in parallel may be arranged so that the front light L1 having a large light emission amount is emitted through both opposing surfaces. The first and second wires 2450a and 2450b respectively connected to both ends of the four LED modules 200 may be respectively connected to a pair of sockets 2470a and 2470b.

Referring to FIG. 16B , an LED lamp 2000' according to this embodiment includes a lamp cover 2420 similar to the previous embodiment, but includes one socket 2700. In addition, the LED lamp 2000' according to this embodiment includes three LED modules 200 connected in series.

The socket 2700 employed in this embodiment has a standard different from that of other lamps in the previous embodiment, and includes two polarity connection terminals to the first and second wires 2450a' and 2450b'. Each may be configured to be connected.

The present invention is not limited by the above-described embodiments and accompanying drawings, but is intended to be limited by the appended claims. Therefore, various forms of substitution, modification, and change will be possible by those skilled in the art within the scope of the technical spirit of the present invention described in the claims, which also falls within the scope of the present invention. something to do.

Claims (20)

a flexible substrate having a first surface on which circuit patterns are disposed and a second surface opposite to the first surface;
a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate and electrically connected to the circuit pattern;
an insulating reflective layer disposed on the first surface of the flexible substrate and covering a portion of the circuit pattern;
first and second connection terminals disposed on both ends of the flexible substrate and connected to the circuit pattern; and
A wavelength converter covering the plurality of LED chips and surrounding the flexible substrate; includes,
The circuit pattern includes a pad region connected to each of the plurality of LED chips, a connection pattern connected to the pad region, and a dummy pattern protruding from the connection pattern.
According to claim 1,
The insulating reflective layer is disposed on an area of the upper surface of the flexible substrate except for areas adjacent to both corners of the LED module.
According to claim 1,
The insulating reflective layer is disposed to surround each of the plurality of LED chips.
According to claim 1,
The insulating reflective layer includes a plurality of separated patterns arranged along the length direction of the flexible substrate LED module.
According to claim 4,
The plurality of separated patterns are LED modules each having a T-shape or an I-shape.
delete According to claim 1,
The insulating reflective layer is disposed to cover an area of the circuit pattern excluding at least a portion of the dummy pattern and the pad area.
According to claim 1,
The circuit pattern further comprises a copper layer and a tin (Sn) layer formed on the copper layer.
According to claim 1,
The insulating reflective layer includes a white-photo solder resist (white-photo solder resist) LED module.
According to claim 1,
The insulating reflective layer is an LED module comprising a resin containing white ceramic powder.
According to claim 10,
The white ceramic powder includes at least one selected from TiO ₂ , Al ₂ O ₃ , Nb ₂ O ₅ and ZnO LED module.
a flexible substrate having first and second surfaces opposite to each other and having a bar shape;
a circuit pattern disposed on the first surface of the flexible substrate and having a pad area, a connection pattern connected to the pad area, and a dummy pattern protruding from the connection pattern;
a plurality of LED chips arranged on the first surface of the flexible substrate along the length direction of the flexible substrate and electrically connected to the pad area of the circuit pattern;
an insulating reflective layer mounted on the first surface of the flexible substrate and covering a portion of the circuit pattern;
first and second connection terminals disposed on both ends of the flexible substrate and connected to the circuit pattern; and
A LED module comprising a; wavelength converter covering the plurality of LED chips and surrounding the flexible substrate.
According to claim 12,
The insulating reflective layer is disposed to cover an area of the circuit pattern excluding at least a portion of the dummy pattern and the pad area.
According to claim 13,
The insulating reflective layer includes a plurality of separated patterns arranged along the length direction of the flexible substrate LED module.
According to claim 14,
The plurality of separated patterns are LED modules each having a T-shape or an I-shape.
According to claim 12,
The insulating reflective layer is disposed to surround each of the plurality of LED chips in an area except for areas adjacent to both corners of the upper surface of the flexible substrate.
According to claim 12,
The insulating reflective layer comprises a sheet containing a white photo solder resist or white ceramic powder and an adhesive layer disposed on a lower surface of the sheet.
According to claim 12,
Wherein the wavelength conversion unit has a first wavelength conversion unit located on the first surface of the flexible substrate and a second wavelength conversion unit located on the second surface of the flexible substrate LED module.
a flexible substrate having first and second surfaces opposite to each other and having a bar shape;
a circuit pattern disposed on the first surface of the flexible board;
a plurality of LED chips arranged on the first surface of the flexible substrate along the length direction of the flexible substrate and electrically connected to the circuit pattern;
an insulating reflective layer disposed on the first surface of the flexible substrate, covering a portion of the circuit pattern, and including a plurality of patterns arranged to be separated from each other along the length direction of the flexible substrate;
first and second connection terminals disposed on both ends of the flexible substrate and connected to the circuit pattern; and
A LED module comprising a; wavelength converter covering the plurality of LED chips and surrounding the flexible substrate.
Base; a lamp cover mounted on the base and having an internal space; And at least one LED module disposed in the inner space of the lamp cover; includes,
The at least one LED module,
A flexible substrate having first and second surfaces opposite to each other and having a bar shape;
a circuit pattern disposed on a first surface of the flexible substrate;
a plurality of LED chips arranged on the first surface of the flexible substrate along the longitudinal direction of the flexible substrate and electrically connected to the circuit pattern;
an insulating reflective layer mounted on the first surface of the flexible substrate and covering a part of the circuit pattern to surround the plurality of LED chips;
first and second connection terminals disposed on both ends of the flexible substrate and connected to the circuit pattern;
A wavelength converter covering the plurality of LED chips and surrounding the flexible substrate;
The circuit pattern includes a pad region connected to the plurality of LED chips, a connection pattern connected to the pad region, and a dummy pattern protruding from the connection pattern.

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