KR102502656B1 - Organic light emitting display device - Google Patents

Abstract

A first substrate and a thin film transistor disposed on the first substrate and including a gate electrode and source and drain electrodes, disposed on the same layer as the source and drain electrodes, and supplied with a first power supply voltage. and a first auxiliary electrode disposed on the same layer as the power lines and the gate electrode and electrically connected to the first power lines.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device.

An organic light emitting display device (OLED) is a self-emitting device that emits light by itself through an organic light emitting layer between an anode electrode and a cathode electrode, and has low power consumption, high speed response speed, high luminous efficiency, and high luminance. and has a wide viewing angle.

The organic light emitting display device is divided into a top emission type and a bottom emission type according to a transmission direction of light emitted through the organic light emitting element. The bottom emission method has a disadvantage in that the aperture ratio is lowered due to the circuit element because the circuit element is located between the light emitting layer and the image display surface, whereas the top emission method has no circuit element located between the light emitting layer and the image display surface. Therefore, there is an advantage in that the aperture ratio is improved.

Such a conventional organic light emitting display device includes a first substrate, a thin film transistor (TFT), an anode electrode, an organic light emitting layer, and a cathode electrode.

A gate line and a data line are arranged to cross each other on the first substrate to define a pixel area, and a thin film transistor is provided in each pixel area.

The anode electrode is connected to the thin film transistor, and the organic light emitting layer is disposed on the anode electrode.

The cathode electrode is disposed on the entire surface of the first substrate on the organic light emitting layer.

The first power lines are provided on the same layer as the source and drain electrodes of the thin film transistors, and apply the first power voltage EVDD supplied from an external voltage supply to each pixel. The second power lines are connected to the cathode electrode to apply the second power voltage EVSS to the cathode electrode. At this time, in order to lower the resistance of the cathode electrode, an auxiliary electrode electrically connected to the cathode electrode is formed, and the distance between the auxiliary electrode and the first power wire is close. Accordingly, when a current is applied to some of the first power supply wires, a burnt may occur between the auxiliary electrode and the first power supply wires, and thus the insulating layers between the auxiliary electrode and the first power supply wires may be destroyed. In this case, defects of the organic light emitting display device may be caused and reliability may be reduced.

The present invention has been made to solve the above problems, and a technical problem is to provide an organic light emitting display device having improved reliability.

The present invention for achieving the above technical problem is disposed on the first substrate and the first substrate, the thin film transistor including a gate electrode and source and drain electrodes and disposed on the same layer as the source and drain electrodes, An organic light emitting display device including first power lines to which one power supply voltage is supplied and a first auxiliary electrode disposed on the same layer as the gate electrode and electrically connected to the first power lines.

An organic light emitting diode display device according to an exemplary embodiment of the present invention prevents burnt from occurring by arranging a first auxiliary electrode to which a first power voltage is applied and a second auxiliary electrode to which a second power voltage is applied to be far apart from each other. Reliability of the light emitting display device may be prevented from being reduced.

Also, in the organic light emitting diode display according to an exemplary embodiment of the present invention, the first auxiliary electrode may be formed to have a sufficient area to lower the resistance of the first power line to which the first power voltage is supplied. Accordingly, the first power voltage can be supplied stably.

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below. .

1 is a perspective view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 2 is a plan view illustrating a display area and a non-display area of the first substrate of FIG. 1 , a gate driver, a source drive IC, a flexible film, a circuit board, and a timing controller.
3 is a cross-sectional view of a pixel of an organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 4 is a plan view of an organic light emitting display device according to an exemplary embodiment of the present invention, which is an enlarged view of area A of FIG. 2 .
FIG. 5 is a cross-sectional view of an organic light emitting display device according to an example of the present invention, taken along the line II′ of FIG. 4 .

The meaning of terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first” and “second” are used to distinguish one component from another, The scope of rights should not be limited by these terms. It should be understood that terms such as "comprise" or "having" do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It means a combination of all items that can be presented from one or more. The term "on" means not only the case where a certain component is formed directly on top of another component, but also the case where a third component is interposed between these components.

Hereinafter, a preferred example of an organic light emitting display device according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to components of each drawing, the same components may have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

1 is a perspective view showing an organic light emitting display device according to an example of the present invention, and FIG. 2 is a display area and a non-display area of a first substrate of FIG. 1 , a gate driver, a source driver IC, a flexible film, a circuit board, and It is a plan view showing the timing control unit.

Referring to FIG. 1 , an organic light emitting display device according to an exemplary embodiment of the present invention includes a display panel 11, a gate driver 12, a source drive integrated circuit (hereinafter referred to as “IC”) 13, and a flexible It includes a film 14, a circuit board 15, and a timing controller 16. Components not visible in the perspective view of FIG. 1 and the plan view of FIG. 2 are shown by dotted lines.

In the display area DA of the display panel 11 , gate lines, data lines, and pixels P disposed at crossing areas of the gate lines and data lines are formed. The pixels P of the display area DA may display an image.

The gate driver 12 supplies gate signals to gate lines according to a gate control signal input from the timing controller 16 . The gate driver 12 is formed in the non-display area DA outside one or both sides of the display area DA of the display panel 11 by a gate driver in panel (GIP) method or manufactured as a driving chip. It may be mounted on a flexible film and attached to the non-display area DA outside one side or both sides of the display area DA of the display panel 11 by a tape automated bonding (TAB) method.

The source drive IC 13 receives digital video data and a source control signal from the timing controller 16. The source driver IC 13 converts digital video data into analog data voltages according to a source control signal and supplies them to data lines. When the source drive IC 13 is manufactured as a driving chip, it may be mounted on the flexible film 14 in a chip on film (COF) or chip on plastic (COP) method.

Since the size of the first substrate 100 is greater than that of the second substrate 300 , a portion of the first substrate 100 may be exposed without being covered by the second substrate 300 . In this way, pads such as data pads are provided on a portion of the first substrate 100 that is exposed and not covered by the second substrate 300 .

Wires connecting pads and the source drive IC 13 and wires connecting pads and wires of the circuit board 15 may be formed on the flexible film 14 . The flexible film 14 is attached on the pads by using an anisotropic conducting film, so that the pads and wires of the flexible film 14 can be connected.

The circuit board 15 may be attached to flexible films 14 . Such a circuit board 15 may be mounted with a plurality of circuits implemented as driving chips. For example, the timing controller 16 may be mounted on the circuit board 15 . In this case, the circuit board 15 may be a printed circuit board or a flexible printed circuit board.

The timing controller 16 receives digital video data and timing signals from an external system board (not shown). At this time, the timing controller 60 generates a gate control signal for controlling the operation timing of the gate driver 12 and a source control signal for controlling the source drive ICs 13 based on the timing signal. The timing controller 60 supplies gate control signals to the gate driver 12 and source control signals to the source drive ICs 30 .

3 is a cross-sectional view of a pixel of an organic light emitting display device according to an exemplary embodiment of the present invention.

Referring to FIG. 3 , the pixel of the organic light emitting diode display according to an exemplary embodiment of the present invention includes a first substrate 100, a buffer layer 110, a thin film transistor T, a protective layer 170, and a first planarization layer 180. ), second planarization layer 200, first anode electrode 210, bank 220, organic light emitting layer 230, cathode electrode 240, encapsulation layer 250, light blocking layer 270, color filter ( 280), and a second substrate 300.

Glass is mainly used for the first substrate 100, but transparent plastic that can be bent or bent, such as polyimide, may be used. When using the polyimide as a material of the first substrate 100, considering that a high-temperature deposition process is performed on the first substrate 100, polyimide having excellent heat resistance that can withstand high temperatures can be used. .

The buffer layer 110 is disposed on the first substrate 100 . The buffer layer 110 prevents external moisture or moisture from penetrating into the organic light emitting display device. In this case, the buffer layer 110 may be made of silicon oxide or silicon nitride.

The thin film transistor T is disposed on the buffer layer 110 . The thin film transistor T includes an active layer 120, a gate insulating layer 130, a gate electrode 140, an interlayer insulating layer 150, a source electrode 160a, and a drain electrode 160b.

The active layer 120 is disposed on the buffer layer 110 to overlap the gate electrode 140 .

The gate insulating layer 130 is disposed on the active layer 120 . The gate insulating layer 130 insulates the active layer 120 and the gate electrode 140 . In this case, the gate insulating layer 130 may be formed of an inorganic insulating material, for example, silicon oxide (SiOX), silicon nitride (SiNX), or multiple layers thereof, but is not limited thereto.

The gate electrode 140 is disposed on the gate insulating layer 130 . At this time, the gate electrode 140 is disposed to overlap the active layer 120 with the gate insulating layer 130 interposed therebetween. The gate electrode 140 may be any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Or it may be a single layer or multi-layer made of an alloy thereof, but is not limited thereto.

The interlayer insulating layer 150 is disposed on the gate electrode 140 . The interlayer insulating layer 150 may be formed of the same inorganic insulating material as the gate insulating layer 130, for example, silicon oxide (SiOX), silicon nitride (SiNX), or a multilayer thereof, but is necessarily limited thereto. it is not going to be

The source electrode 160a and the drain electrode 160b are spaced apart from each other while facing each other on the interlayer insulating layer 150 . At this time, each of the source electrode 160a and the drain electrode 160b is connected to the active layer 120 through a contact hole formed in the interlayer insulating layer 150 . The source electrode 160a and the drain electrode 160b are made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper It may be made of (Cu), or an alloy thereof, and may be made of a single layer or a multi-layer of two or more layers of the metal or alloy, but is not limited thereto.

The thin film transistor T configured as described above may be formed in each pixel area on the first substrate 100 . In addition, the configuration of the thin film transistor T is not limited to the above-described example, and can be variously modified into a known configuration that can be easily implemented by those skilled in the art.

The protective layer 170 is entirely disposed on the interlayer insulating layer 150, the source electrode 160a, and the drain electrode 160b. The protective layer 170 may be made of an inorganic insulating material such as silicon oxide or silicon nitride, but is not necessarily limited thereto, and may be made of an organic insulating material such as photo acryl or benzocyclobutene (BCB). may be

The first planarization layer 180 is disposed on the protective layer 170 , and the second planarization layer 200 is disposed on the first planarization layer 180 . The first planarization layer 180 planarizes the upper portion of the protective layer 170 , and the second planarization layer 200 planarizes the upper portion of the first planarization layer 180 . At this time, the first and second planarization layers 180 and 200 may be, for example, acrylic resin, epoxy resin, phenolic resin, polyamides resin, or polyimide resin. It may be made of a mid-based resin (polyimides resin) or the like.

The first anode electrode 210 is disposed on the second planarization layer 200 . The first anode electrode 210 is connected to the exposed drain electrode 160b through the contact hole.

The bank 220 is disposed on the second planarization layer 200 . In this case, the bank 220 may overlap one side and the other side of the first anode electrode 210 . Such a bank 220 may serve to define an area of the pixel P. Such a bank 220 may be formed of an organic layer such as polyimide resin, acryl resin, or benzocyclobutene (BCB).

The organic emission layer 230 is disposed on the first anode electrode 210 . The organic light emitting layer 230 is a combination of a hole injecting layer, a hole transporting layer, an emitting layer, an electron transporting layer, and an electron injecting layer. It may consist of, but is not necessarily limited thereto, and may be changed to various structures known in the art.

The cathode electrode 240 is disposed on the organic light emitting layer 230 . In this case, the cathode electrode 240 extends from the organic light emitting layer 230 and may also be disposed on the bank 200 . The cathode electrode 240 is formed of a transparent conductive metal in a top emission organic light emitting display device. Since such a transparent conductive metal has high resistance, it is electrically connected to the second auxiliary electrode 190 through the second anode electrode 215 to be described later to lower the resistance.

The encapsulation layer 250 is entirely disposed on the cathode electrode 240 . The encapsulation layer 250 prevents deterioration of the organic light emitting layer 230 by preventing penetration of moisture that may be introduced from the outside. At this time, the encapsulation layer 250 may be made of metals such as copper (Cu) and aluminum (Al) or alloys thereof, but not necessarily, various materials known in the art may be used.

The light blocking layer 270 is disposed between the encapsulation layer 250 and the second substrate 300 . The light blocking layer 270 is disposed on the side of the color filter 280 so as not to overlap with the organic light emitting layer 230, and prevents light from leaking into the non-display area.

The color filter 280 is disposed between the encapsulation layer 250 and the second substrate 300 . The color filter 280 is disposed on the organic light emitting layer 230 to change the color of light emitted from the organic light emitting layer 230 . In this case, the color filter 280 may include a red color filter, a green color filter, and a blue color filter.

FIG. 4 is a plan view of an organic light emitting display device according to an exemplary embodiment of the present invention, which is an enlarged view of area A of FIG. 2 , and FIG. It is a cross-sectional view along the line II'.

Referring to FIGS. 4 and 5 , an organic light emitting display device according to an exemplary embodiment of the present invention includes a first substrate 100, a buffer layer 110, a first auxiliary electrode 145, a protective layer 170, and a first power source. wiring 165, first planarization layer 180, second auxiliary electrode 190, second power supply wiring 195, second planarization layer 200, second anode electrode 215, lower dam 225a, 225b), a cathode electrode 240, an encapsulation layer 250, a sealant 260, a light blocking layer 270, upper dams 290a and 290b, and a second substrate 300. At this time, redundant description of the same configuration as that of FIG. 3 will be omitted.

A buffer layer 110 is disposed on the first substrate 100 , and a first auxiliary electrode 145 is disposed on the buffer layer 110 . The first auxiliary electrode 145 is simultaneously prepared through the same process as the gate electrode 140 , and the first auxiliary electrode 145 may be made of the same material as the gate electrode 140 . For example, the gate electrode 140 is selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto. Therefore, in the organic light emitting diode display according to an example of the present invention, the first auxiliary electrode 145 and the gate electrode 140 may be formed in one process.

One side of the first auxiliary electrode 145 may be electrically connected to a first power supply wire 165 to be described later, and the other side may extend to the lower portion of the sealant 260 and the lower dam 215b to be described later. . Accordingly, the first auxiliary electrode 145 may be formed with a large area to lower the resistance of the first power supply wire 165 . In addition, since the first auxiliary electrode 145 is disposed far from the second auxiliary electrode 190 described later, when the current is directed to one side of the second auxiliary electrode 190 or the first auxiliary electrode 145 Even burnt does not occur. Therefore, in the organic light emitting diode display according to an exemplary embodiment of the present invention, the first auxiliary electrode 145 is disposed far apart from the second auxiliary electrode 190 to prevent burnt and improve the reliability of the organic light emitting display. decline can be prevented. Also, in the organic light emitting diode display according to an example of the present invention, the first auxiliary electrode 145 is formed to have a sufficient area so that the first power voltage EVDD can be stably supplied without being affected by resistance.

The interlayer insulating layer 150 is disposed on the first auxiliary electrode 145 to space the first auxiliary electrode 145 and the second auxiliary electrode 190 apart.

The first power wiring 165 is disposed on the interlayer insulating layer 150 . The first power wiring 165 applies the first power voltage EVDD supplied from an external voltage supply to each pixel P. In this case, the first power wiring 165 is spaced apart from each other on the same layer as the source and drain electrodes 160a and 160b. The first power supply wire 165 is provided through the same process as the source and drain electrodes 160a and 160b, and the first power supply wire 165 is made of the same material as the source and drain electrodes 160a and 160b. It can be. For example, the first power wire 165 may include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). ) It may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto. In this case, the first power wire 165 may be arranged so as not to overlap the second auxiliary electrode 190 and the second power wire 195 to which the second power voltage EVSS is applied. Therefore, in the organic light emitting diode display according to an exemplary embodiment of the present invention, burnt does not occur even when current flows to one side of the first power supply wire 165 or the second power supply wire 195 . In addition, one side of the first power wire 165 passes through the interlayer insulating layer 150 covering the first auxiliary electrode 145 and is connected to the first auxiliary electrode 145 through a contact hole. Therefore, even when current flows to one side of the first power wire 165 , resistance can be reduced through the first auxiliary electrode 145 .

The first planarization layer 180 is disposed on the interlayer insulating layer 150 and the first power supply wire 165 to planarize the upper part of the first power supply wire 165, and the first auxiliary electrode 145 and the 2 Space the auxiliary electrodes 190 apart.

The second auxiliary electrode 190 is disposed on the first planarization layer 180 . The second auxiliary electrode 190 is electrically connected to the cathode electrode 240 to which the second power supply voltage EVSS is applied, and lowers the resistance of the cathode electrode 240 . In this case, the second auxiliary electrode 190 may be disposed so as not to overlap the first power line 165 through which the first power voltage EVDD flows. In addition, the second auxiliary electrode 190 overlaps the first auxiliary electrode 145 with the interlayer insulating layer 150 , the protective layer 170 , and the first planarization layer 180 interposed therebetween. Accordingly, in the organic light emitting diode display according to an exemplary embodiment of the present invention, the second auxiliary electrode 190 and the first auxiliary electrode 145 form an interlayer insulating layer 150, a protective layer 170, and a first planarization layer 180. ) in between, burnt does not occur even when current flows to one side of the first power supply line 165 or the second auxiliary electrode 190, and thus the reliability of the organic light emitting display device is reduced. can prevent doing so.

The second power wire 195 extends from the second auxiliary electrode 190 and is disposed parallel to the first power wire 165 . In this case, the second power wiring 195 does not overlap the first power wiring 165 . Therefore, the organic light emitting diode display according to an example of the present invention does not generate a burnt even when current is directed to one side of the first power supply wire 165 or the second power wire 195, and the reliability of the organic light emitting display device is improved. decline can be prevented. The second power supply line 195 is supplied with a second power supply voltage EVSS lower than the first power supply voltage EVDD. At this time, the second power wire 195 is electrically connected to the second auxiliary electrode 190 and the cathode electrode 240 and supplies the second power voltage EVSS to the cathode electrode 240 . The second power wire 195 may be connected to the second auxiliary electrode 190 to lower resistance. Therefore, the second power supply wire 195 can stably supply the second power supply voltage EVSS to the cathode electrode 240 without being affected by resistance.

The second planarization layer 200 is disposed on the first planarization layer 180 and may partially overlap the second auxiliary electrode 190 . The second planarization layer 200 planarizes the top of the first planarization layer 160 .

The second anode electrode 215 is spaced apart from the first anode electrode 210 and disposed on the second auxiliary electrode 190 . In this case, the second anode electrode 215 may extend from the second auxiliary electrode 190 and may also be disposed on the second planarization layer 200 .

The lower dams 225a and 225b are disposed in a frame shape surrounding the periphery of the first substrate 100 . At this time, the lower dams 225a and 225b include a first lower dam 225a and a second lower dam 225b. The first lower dam 225a is disposed on the second anode electrode 215 and is disposed on one side of a sealant 260 to be described later.

The second lower dam 225b is disposed on the protective layer 170 and is disposed on the other side of the sealant 260 .

The lower dams 225a and 225b prevent the sealant 260 from spreading into the organic light emitting diode display.

The cathode electrode 240 is disposed on the second anode electrode 215 . The cathode electrode 240 is made of a transparent conductive metal in a top emission organic light emitting display device. Accordingly, since resistance of the cathode electrode 240 may be increased, resistance may be reduced by electrically connecting to the second auxiliary electrode 190 .

The encapsulation layer 250 is disposed on the cathode electrode 240, and the sealant 260 is disposed between the first and second substrates 100 and 300 to cover the first and second substrates 100 and 300. coalesce In this case, the sealant 260 may be disposed in a frame shape. Since lower dams 225a and 225b and upper dams 290a and 290b to be described below are disposed on both sides of the sealant 260, the sealant 260 does not spread inside the organic light emitting display device.

The light blocking layer 270 is disposed between the encapsulation layer 250 and the second substrate 300 to prevent light leakage.

The upper dams 290a and 290b are disposed between the encapsulation layer 250 and the second substrate 300 and are disposed in a frame shape surrounding the periphery of the first substrate 100 . At this time, the upper dams 290a and 290b include a first upper dam 290a and a second upper dam 290b. The first upper dam 290a is disposed on one side of the sealant 260, and the second upper dam 290b is disposed on the other side of the sealant 260. The upper dams 290a and 290b prevent the sealant 260 from spreading into the organic light emitting diode display.

In the organic light emitting diode display according to an example of the present invention, the first auxiliary electrode 145 is formed to have a sufficient area to lower the resistance of the first power line 165 to which the first power voltage EVDD is supplied. Therefore, the first power voltage EVDD can be stably supplied. In addition, the organic light emitting diode display according to an example of the present invention includes a first auxiliary electrode 145 to which a first power voltage EVDD is applied and a second auxiliary electrode 190 to which a second power voltage EVSS is applied. By disposing them far apart from each other, it is possible to prevent burnt occurrence and decrease in reliability of the organic light emitting diode display.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the scope of the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100, 300: first and second substrates T: thin film transistors
145: first auxiliary electrode 165: first power wiring
180, 200: first and second planarization layers 190: second auxiliary electrode
210, 215: first and second anode electrodes 220: bank
230: organic light emitting layer 240: cathode electrode
250: encapsulation layer

Claims (9)

a first substrate;
a thin film transistor disposed on the first substrate and including a gate electrode and source and drain electrodes;
first power lines disposed on the same layer as the source and drain electrodes and to which a first power voltage is supplied; and
a first auxiliary electrode disposed on the same layer as the gate electrode and electrically connected to the first power lines;
a second auxiliary electrode disposed on the source and drain electrodes and overlapping the first auxiliary electrode;
A plurality of insulating layers are disposed between the first auxiliary electrode and the second auxiliary electrode, and the first auxiliary electrode and the second auxiliary electrode are spaced apart from each other. delete According to claim 1,
an interlayer insulating layer covering the gate electrode and the first auxiliary electrode;
a protective layer covering the source and drain electrodes; and
Further comprising a first planarization layer on the protective layer,
The interlayer insulating layer, the passivation layer, and the first planarization layer are disposed between the first auxiliary electrode and the second auxiliary electrode. According to claim 1,
and a second power supply wire extending from the second auxiliary electrode, disposed in parallel with the first power supply wire, and supplied with a second power supply voltage lower than the first power supply voltage. According to claim 4,
wherein the first power lines do not overlap the second power line and the second auxiliary electrode. According to claim 1,
A dam in the form of a frame surrounding the periphery of the first substrate is disposed,
The first auxiliary electrode is disposed to overlap the dam. According to claim 3,
an anode electrode disposed on a second planarization layer covering the second auxiliary electrode;
an organic light emitting layer disposed on the anode electrode; and
The organic light emitting display device further comprises a cathode electrode covering the organic light emitting layer. According to claim 1,
The organic light emitting display device of claim 1 , wherein the gate electrode and the first auxiliary electrode are made of the same material. According to claim 1,
Each of the first power lines is connected to the first auxiliary electrode through a contact hole exposing the first auxiliary electrode through at least one insulating layer covering the first auxiliary electrode.

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