KR102500663B1 - Hybrid pin board - Google Patents

Abstract

The present invention discloses a hybrid pin board, which includes: a pin board body; a printed circuit board coupled to the pin board body and outputting an AVI inspection signal and a TSP inspection signal; an AVI block which is combined with the pin board body and inputs an AVI inspection signal to the AVI pad on a subject to be inspected; and a TSP block which is combined with the pin board body and inputs a TSP test signal to a TSP pad on the subject to be inspected. According to the present invention, an AVI probe pin for pixel inspection and a TSP probe pin for touch inspection can be stably fixed to a slit.

Description

Hybrid Pin Board {HYBRID PIN BOARD}

The present invention relates to a hybrid pin board, and more particularly, to a pin board suitable for both image inspection and touch inspection.

A probe device refers to a device that tests the quality and performance of a test subject by inputting a test signal to an electronic component such as a display panel. The probe device is configured to contact a terminal of an object to be inspected using a probe pin.

A pin board, which is a type of probe device, includes a printed circuit board generating a test signal and a probe pin for inputting the test signal, and can be driven by being coupled to a jig corresponding to a driving device through a pin board adapter.

A display panel corresponding to an object to be inspected may include an input function in addition to an output function, and a touch screen panel corresponds to this. The performance test for a touch screen panel (TSP) includes a pixel test (automotive vision inspection, AVI) and a touch (TSP) test. AVI means pixel inspection, and TSP inspection means touch inspection and is often used.

As a technology related to the present invention, a probe apparatus for inspecting a flat panel display panel disclosed in Korean Registered Patent Publication includes a probe block having a first contact part, a second contact part, a plurality of needles, and a first guide block and a second guide block. However, in this related art, a plurality of needles are all in contact with the same terminal for pixel inspection to transmit electrical signals, and the present invention configured to be suitable for both pixel inspection and touch inspection and the purpose, configuration, and effect of the present invention distinct from each other

Republic of Korea Patent Registration No. 10-0602154 (Announced on July 19, 2006)

One problem to be solved by the present invention is to provide a probe device that can be applied to both pixel inspection and touch inspection.

One problem to be solved by the present invention is to provide a probe device having a structure in which a probe pin and an FPC can stably contact.

One problem to be solved by the present invention is to provide a probe device equipped with a slit for stably fixing a probe pin for pixel inspection and a probe pin for touch inspection.

One problem to be solved by the present invention is to provide a probe device equipped with a probe pin having a shape suitable for a shock absorber function.

A hybrid pin board according to an embodiment of the present invention includes a pin board body 110; At least one printed circuit board 120 coupled to the pin board body 110 and outputting an automotive vision inspection (AVI) inspection signal required for pixel inspection and a touch screen panel (TSP) inspection signal required for touch inspection; an AVI block 130 coupled to the pin board body 110 and inputting the AVI inspection signal to an AVI pad on the object to be inspected; and a TSP block 140 coupled to the pin board body and inputting the TSP test signal to a TSP pad on the test subject.

In addition, the hybrid pin board includes an FPC base 142 on which a TSP flexible circuit (FPC) electrically connecting the TSP block 140 and the printed circuit board 120 is seated; and an FPC spring 144 disposed between the FPC base 142 and the TSP flexible circuit to electrically contact a terminal of the TSP flexible circuit to the TSP block 140 using elasticity. .

In addition, the AVI block 130 and the TSP block 140 may be configured to be coupled to any one of the top and bottom surfaces of the pin board body 110, respectively.

In addition, the AVI block 130 includes an AVI probe pin 131 in contact with the AVI pad and an AVI slot 133 in which the AVI probe pin is seated. , and the AVI probe pin 131 may be configured to be inserted into the AVI slot 133 from the lower side to the upper side of the AVI slot 133 .

In addition, the AVI slot 133 may be configured to include a downwardly open vertical AVI slot 133d and a backwardly opened horizontal AVI slot 143b.

In addition, the AVI probe pin 131 includes a L-shaped latch 131f inserted into the vertical and horizontal intersections of the AVI slot 133 to prevent upward and forward departure; and a protrusion 131s preventing the AVI probe pin 131 from coming off backward by resisting the vertical surface of the AVI slot 133.

In addition, the AVI block 130 further includes a contact block 135 for contacting the AVI probe pin 131 to the terminal of the AVI flexible circuit, and the contact block 135 is at the rear of the AVI probe pin 131. It may be configured to be coupled to the pin board body 110 at a position preventing separation.

In addition, the TSP block 140 includes a TSP probe pin 141 in contact with the TSP pad, and a TSP slot 143 on which the TSP probe pin 141 is seated, and the TSP block 140 is the pin board. It is coupled to the top surface of the body 110, and the TSP probe pin 141 may be configured to be inserted into the TSP slot 143 from the upper side to the lower side of the TSP slot 143.

In addition, the TSP slot 143 may be configured to include a vertical TSP slot 143u open upwardly and a horizontal TSP slot 143f open forward.

In addition, the TSP block 140 is configured to further include at least one of a cover 145u preventing the TSP probe pin 141 from moving upward from the TSP slot 143 and a cover 145f preventing the TSP probe pin 141 from moving forward. It can be.

Details of other embodiments are included in the "specific details for carrying out the invention" and the accompanying "drawings".

Advantages and/or features of the present invention, and methods of achieving them, will become apparent with reference to the various embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited only to the configuration of each embodiment disclosed below, but may also be implemented in various other forms, and each embodiment disclosed herein only makes the disclosure of the present invention complete, and the present invention It is provided to completely inform those skilled in the art of the scope of the present invention, and it should be noted that the present invention is only defined by the scope of each claim of the claims.

According to the present invention, both pixel inspection and touch inspection can be performed using one probe device.

In addition, the probe pin and the FPC can be stably contacted.

In addition, the probe pin for pixel inspection and the probe pin for touch inspection can be stably fixed to the slit.

1 is an exploded view of a hybrid pinboard according to an embodiment of the present invention.
2 is an exemplary view of a hybrid pin board according to an embodiment of the present invention.
3 is a right side view of a hybrid pin board according to an embodiment of the present invention.
4 is an exemplary diagram of an AVI block and a TSP block of a hybrid pinboard according to an embodiment of the present invention.
5 is an exemplary view of a TSP block of a hybrid pinboard according to an embodiment of the present invention.
6 is an exemplary view of a slot and a probe pin of a hybrid pin board according to an embodiment of the present invention.
7 is an exemplary view of slots and probe pins of a hybrid pin board according to an embodiment of the present invention.
8 is an exemplary diagram of an AVI block of a hybrid pinboard according to an embodiment of the present invention.

Before explaining the present invention in detail, the terms or words used in this specification should not be construed unconditionally in a conventional or dictionary sense, and in order for the inventor of the present invention to explain his/her invention in the best way It should be noted that concepts of various terms may be appropriately defined and used, and furthermore, these terms or words should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention.

That is, the terms used in this specification are only used to describe preferred embodiments of the present invention, and are not intended to specifically limit the contents of the present invention, and these terms represent various possibilities of the present invention. It should be noted that it is a defined term.

In addition, it should be noted that in this specification, singular expressions may include plural expressions unless the context clearly indicates otherwise, and similarly, even if they are expressed in plural numbers, they may include singular meanings. .

Throughout this specification, when a component is described as "including" another component, it does not exclude any other component, but further includes any other component, unless otherwise stated. It can mean you can do it.

Furthermore, when a component is described as “existing inside or connected to and installed” of another component, this component may be directly connected to or installed in contact with the other component, and a certain It may be installed at a distance, and when it is installed at a certain distance, a third component or means for fixing or connecting the corresponding component to another component may exist, and now It should be noted that the description of the components or means of 3 may be omitted.

On the other hand, when it is described that a certain element is "directly connected" to another element, or is "directly connected", it should be understood that no third element or means exists.

Similarly, other expressions describing the relationship between components, such as "between" and "directly between", or "adjacent to" and "directly adjacent to" have the same meaning. should be interpreted as

In addition, in this specification, the terms "one side", "the other side", "one side", "the other side", "first", "second", etc., if used, refer to one component It is used to be clearly distinguished from other components, and it should be noted that the meaning of the corresponding component is not limitedly used by such a term.

In addition, in this specification, terms related to positions such as "top", "bottom", "left", and "right", if used, should be understood as indicating a relative position in the drawing with respect to the corresponding component, Unless an absolute position is specified for these positions, these positional terms should not be understood as referring to an absolute position.

In addition, in this specification, in specifying the reference numerals for each component of each drawing, for the same component, even if the component is displayed in different drawings, it has the same reference numeral, that is, the same reference throughout the specification. Symbols indicate identical components.

In the drawings accompanying this specification, the size, position, coupling relationship, etc. of each component constituting the present invention is partially exaggerated, reduced, or omitted in order to sufficiently clearly convey the spirit of the present invention or for convenience of explanation. may be described, and therefore the proportions or scale may not be exact.

In addition, in the following description of the present invention, a detailed description of a configuration that is determined to unnecessarily obscure the subject matter of the present invention, for example, a known technology including the prior art, may be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to related drawings.

In the xyz coordinate axes shown in each figure, the x-axis direction is determined as the width direction of the hybrid pinboard 100, the y-axis direction is determined as the length direction, and the z-axis direction is determined as the height direction.

The hybrid pinboard 100 according to an embodiment of the present invention is characterized in that it can be applied to both pixel inspection and touch inspection for a touch screen panel (TSP).

1 is an exploded view of a hybrid pinboard according to an embodiment of the present invention.

2 is an exemplary view of a hybrid pin board according to an embodiment of the present invention.

1 depicts the components of the hybrid pinboard 100 independently in an exploded state, and FIG. 2 depicts the components in a coupled state.

Referring to FIGS. 1 and 2 together, the hybrid pin board 100 includes a pin board body 110 corresponding to a frame and a printed circuit board (PCB) that outputs a test signal. ) 120, an AVI block (automotive vision inspection block) 130 with a pixel inspection function, and a touch screen panel block (TSP block) 140 with a touch inspection function.

A plurality of AVI blocks 130 and TSP blocks 140 aligned in the width (X-axis) direction may be coupled to the pinboard body 110 . Accordingly, the pin board body 110 may be formed long in the width (X-axis) direction. The pin board body 110 may be implemented with a material having high rigidity, for example, a metal alloy or synthetic resin. The pin board body 110 may be connected to a driving jig (not shown) via a pin board adapter (not shown).

The PCB 120 has a function of generating a test signal for an object to be inspected, for example, a touch screen panel (TSP). The inspection of the touch screen panel may include a pixel inspection of pixels and a touch inspection of the touch panel. Therefore, the pixel (AVI) inspection signal and the touch (TSP) inspection signal are required as inspection signals, and the PCB 120 can generate the AVI inspection signal and the TSP inspection signal. PCB 120 may consist of one or two units. That is, both the AVI signal and the TSP signal are output from the PCB 120 of one unit, or the AVI inspection signal is output from the PCBs 121 and 123 of the two units, that is, the AVI PCB 121, and the TSP PCB 123 A TSP signal can be output from Hereinafter, a hybrid pinboard 100 including two unit PCBs 121 and 123 will be described.

An alignment mark for vision inspection may be displayed on the lower surface of the pin board body 110 . Positions of the hybrid pinboard 100 and the AVI probe pins 131 and TSP probe pins 141 may be confirmed in the XY plane through the camera.

The AVI PCB 121 and the TSP PCB 123 may be divided and coupled to the top and bottom surfaces of the pin board body 110, respectively. The location of the PCB 120 is related to the location of the inspection block. That is, among the top and bottom surfaces of the hybrid pinboard 110, parts related to the AVI block 130 are disposed on the bottom surface of the pinboard body 110, and parts related to the TSP block 140 are disposed on the pinboard body 110. It may be configured to be disposed on the top surface of. Of course, combinations of the above and vice versa are also possible. Accordingly, the AVI PCB 121 and the TSP PCB 123 may be respectively disposed corresponding to the top and bottom surfaces of the pin board body 110 to which the AVI block 130 and the TSP block 140 are coupled.

The AVI block 130 has a function of inputting the AVI signal output from the PCB 120 to an object to be inspected, that is, an AVI panel on the object to be inspected. The AVI block 130 may be coupled to the bottom of the pin board body 110. Also, the AVI block 130 may be electrically connected to the AVI PCB 121 through an AVI FPC (not shown).

The AVI block 130 may be configured to include an AVI probe pin 131 in contact with the inspected object and an AVI slot 133 in which the AVI probe pin is seated.

The TSP block 140 has a function of inputting the TSP signal output from the PCB 120 to the TSP pad of the test subject and the test subject on the side. The TSP block 140 may be coupled to the top surface of the pin board body 110 . Also, the TSP block 140 may be electrically connected to the TSP PCB 123 via a TSP FPC (not shown).

The TSP block 140 may be configured to include a TSP probe pin 141 in contact with the inspected object and a TSP slot 143 in which the TSP probe pin 141 is seated.

The AVI pad and the TSP pad correspond to a set of input terminals disposed on the touch screen panel corresponding to the subject to be inspected. At least one AVI input terminal forms one AVI pad, and a plurality of AVI pads may be disposed on the touch screen panel. Similarly, at least one TSP input terminal forms a TSP pad, and a plurality of TSP pads may be disposed on the touch screen panel. Since the plurality of AVI pads and TSP pads are related to the XY coordinates of the corresponding touch screen panel, the number of AVI pads and TSP pads may be proportional to the area of the touch screen panel.

The positions of the AVI block 130 and the TSP block 140 are related to the position of the pad on the subject to be inspected. An AVI pad to which an AVI signal is input and a TSP pad to which a TSP signal is input may be divided into a plurality and disposed on the object to be inspected. Positions of the AVI block 130 and the TSP block 140 may be determined to correspond to positions of a plurality of AVI pads and TSP pads.

Referring back to FIG. 2 , a plurality of AVI blocks 130 and a plurality of TSP blocks 140 may be coupled to the pinboard body 110 of the hybrid pinboard 100 . The AVI block 130 and the TSP block 140 may be disposed on the surface of the hybrid pinboard 100 to correspond to the positions of the AVI pad and the TSP pad and be combined.

The positions of the AVI pad and the TSP pad tend to be arranged close to each other on the touch screen panel corresponding to the subject to be inspected, and accordingly, the AVI block 130 and the TSP block 140 are close to each other on the pin board body 110 can be placed.

Referring again to FIG. 2, a plurality of AVI blocks 130 are coupled to the bottom of the pinboard body 110 at regular intervals, and the TSP blocks 140 are mutually connected to the AVI blocks 130 in the width and height directions. They may be arranged overlapping. That is, the AVI block 130 is disposed on the bottom of the pinboard body 110 so as to come into contact with the edge in the X-axis direction formed on the front surface, and the TSP block 140 is disposed on the AVI block 130. It may be arranged to be in contact with the front surface and the top surface of the pin board body 110 at the same time.

If the AVI pad and the TSP pad on the test subject are not at the same height, the heights of the peaks of the AVI probe pins included in the AVI block and the TSP probe pins included in the TSP block are different from each other, so that the AVI block and the TSP block It must be combined with the pin board body (110).

3 is a right side view of a hybrid pin board according to an embodiment of the present invention.

Referring to FIG. 3, the relative positions of the AVI probe pin 131 and AVI slot 133 constituting the AVI block 130 and the TSP probe pin 141 and TSP slot 143 constituting the TSP block 140 The pinboard body 110 is depicted transparently so that is revealed.

In the hybrid pinboard 100, the AVI slot 133 is coupled in common with the inner and bottom surfaces 113, which are the back surfaces of the front of the pinboard body 110, and the TSP slot 143 is connected to the pinboard body 110. It may be configured to be coupled in common with the top surface 111 and the front surface of. Accordingly, the AVI probe pin 131 inserted into the AVI slot 133 and the TSP probe pin 141 inserted into the TSP slot 143 may be disposed close to each other. The AVI PCB 121 may be coupled to the bottom surface 113 of the pin board body 110, and the TSP PCB 123 may be coupled to the top surface 111 of the pin board body 110, respectively.

The hybrid pinboard 100 may be configured to include an upper cover 145u covering the TSP slot 143 from above and a front cover 145f covering the front.

4 is an exemplary diagram of an AVI block and a TSP block of a hybrid pinboard according to an embodiment of the present invention.

Referring to FIG. 4, the TSP slot 143 covered by an upper cover 145u and a front cover 145f is depicted. A plurality of AVI blocks 130 are arranged on the bottom of the pinboard body 110 in the X-axis direction, and among them, the TSP block 140 is overlapped with one AVI block 130 in the Z-axis direction and the Y-axis direction. It may be disposed over the top surface and the front surface of the pin board body 110 .

Referring back to FIG. 4 , at least a portion of the FPC base 142 and the FPC spring 144 may be disposed on the top surface of the pin board body 110 to have the same X coordinate value as that of the TSP block 140. there is. On the FPC base 142, a TSP flexible circuit (FPC) electrically connecting the TSP block 140 and the printed circuit board 120 is seated. Also, the FPC spring 144 is disposed between the FPC base 142 and the TSP flexible circuit to electrically contact the terminal of the TSP flexible circuit with the TSP block 140 using elasticity. That is, the coupling part at the rear end disposed close to the TSP PCB 123 in the Y-axis direction fixes the FPC spring 144 to the FPC base 142, and the front end of the FPC spring 144 is formed higher than the horizontal rear end. In this case, the TSP flexible circuit and the TSP probe pin 141 can be brought into contact without a gap.

Referring back to FIG. 4 , a top hole 112 may be formed on the top surface of the pin board body 110 . Since the contact surface where the AVI probe pin 131 contacts the FPC through the contact block 135 is exposed upward through the top hole 112, whether or not the contact portion 131c has poor contact can be monitored through a vision camera or the naked eye.

5 is an exemplary view of a TSP block of a hybrid pinboard according to an embodiment of the present invention.

Referring to FIG. 5, the TSP block 140 in a state in which the TSP probe pin 141 and the TSP slot 143 are exposed by the removal of the upper cover 145u and the front cover 145f is It is described. The TSP block 140 and the AVI block 130 are individually combined with the pin board body 110, or either the TSP block 140 or the AVI block 130 is combined with the pin board body 110. It is also possible to combine the other one with the object coupled to the pin board body 110.

The TSP probe pin 141 may be fixed to the TSP slot 143 through fitting. The hybrid pin board 100 may be configured so that the TSP probe pin 141 is inserted into the TSP slot 143 from the upper side to the lower side of the TSP slot 143 . That is, to fix the TSP probe pin 141, the TSP slot 143 may include a horizontal slot 143u and a vertical slot 143f. A vertical portion of the TSP probe pin 141 may be fitted into the horizontal slot 143u, and a horizontal portion of the TSP probe pin 141 may be fitted into the vertical slot 143f. The TSP slot 143 may be formed such that the horizontal slot 143u is opened upward and the vertical slot 143f is opened toward the front. Accordingly, the TSP probe pin 141 may be coupled to the TSP slot 143 from the upper side of the TSP block 140 to the lower side.

6 is an exemplary view of a slot and a probe pin of a hybrid pin board according to an embodiment of the present invention.

The AVI block 130 may be coupled to the bottom surface of the pin board body 110, and the AVI probe pin 131 may be inserted into the AVI slot 133 from the bottom to the top of the AVI slot 9133. The AVI slot 133 may include a horizontal AVI slot 133d open downward and a vertical AVI slot 133d open backward.

Referring to FIG. 6, the tip of the TSP probe pin 141 in contact with the TSP panel on the subject and the tip of the AVI probe pin 131 in contact with the AVI panel of the subject are spaced at a predetermined interval in the forward and backward (Y-axis) direction. (w) may be spaced apart.

In addition, the peaks of the TSP probe pin and the AVI probe pin may be disposed at different heights with a predetermined height difference (h) in the vertical (Z-axis) direction. This is due to the relative positions of the TSP panel and the AVI panel, which are spaced apart in the front-back (Y-axis) direction and arranged with a height difference in the vertical (Z-axis) direction.

An AVI inspection signal for inspecting an operation related to a pixel of an object to be inspected is input to the AVI pad on the touch screen panel through the AVI probe pin 131 . In the same way, the TSP inspection signal for inspecting the operation related to the touch of the subject is input to the TSP pad on the touch screen panel through the TSP probe pin 141. The AVI inspection signal and the TSP inspection signal may be input simultaneously or simultaneously.

The hybrid pinboard 100 according to an embodiment of the present invention is characterized in that both the AVI inspection signal and the TSP inspection signal can be input to the AVI pad and the TSP pad of the object to be inspected without replacing the pinboard. Therefore, in the inspection using the hybrid pinboard 100, both the pixel inspection and the touch inspection can be performed in one inspection process, so the inspection speed can be improved.

The AVI probe pin 131 may be largely composed of a tip 131t, bodies 131h and 131v, and a contact portion 131c. The AVI probe pin 131 brings the tip 131t into contact with the AVI pad, uses the bodies 131h and 131v to absorb the impact transmitted from the tip 131t using elasticity in the vertical and horizontal directions, and 131c) is used to contact the FPC. The bodies 131h and 131v of the AVI probe pin 131 may include a horizontal portion 131h and a vertical portion 131v. The horizontal portion 131h connects the tip 131t and the contact portion 131c in the horizontal direction, and the vertical portion 131v connects the tip 131t and the contact portion 131c in the vertical direction.

Referring back to FIG. 6, the AVI probe pin 131 is inserted into the vertical and horizontal intersection of the AVI slot 133 to prevent upward and forward departure. It is configured to form a L-shaped latch (131f) It can be. The AVI probe pin 131 can be fixed to the AVI slot 133 upward, downward, and forward by combining the L-shaped clasp 131f and the L-shaped valley formed in the AVI slot 133.

In addition, the AVI probe pin 131 may be configured to have a protrusion 131s that resists the vertical surface of the AVI slot 133 and prevents the AVI probe pin 1311 from coming off backward. The protrusion 131s protrudes upward in a state where the AVI probe pin 131 is inserted into the AVI slot 133, and may be configured to fit into a valley formed on a bottom surface of the AVI slot 133. Accordingly, the protrusion 131s prevents the AVI probe pin 131 from being separated from the AVI slot 133 backward.

In addition, the AVI probe pin 131 may be configured to include a latch 131L as an area cut from the contact portion 131c. The latch 131L contacts the top surface of the AVI slot 133 to fix the AVI probe pin 131 downward.

Overall, the AVI probe pin 131 is fixed in the X-axis direction by the horizontal slot 133d and the vertical slot 133b of the AVI slot 133, and forward in the Y-axis direction by the latch 131f, It may be fixed by the protrusion 131s backward, and fixed by the AVI slot 133 and the latch 131L in the Z-axis direction.

7 is an exemplary view of slots and probe pins of a hybrid pin board according to an embodiment of the present invention.

Referring to FIGS. 6 and 7 together, the AVI probe pin 131 and the TSP probe pin 141 may be configured to form various types of incision patterns in order to buffer an impact transmitted from the peak.

The AVI probe pin 131 includes a tip 131t, a horizontal portion 131h, a vertical portion 131v, and a contact portion 131c, and a bent portion 1 is formed between the tip 131t and the horizontal portion 131h. The bent portion 2 may be formed between the horizontal portion 131h and the vertical portion 131v, and the bent portion 3 may be formed between the vertical portion 131v and the contact portion 131c. That is, the vertical peak 131t may be connected to the horizontal contact portion 131c via the three bent portions 1, 2, and 3.

The horizontal portion 131h of the AVI probe pin 131 can absorb impact in the vertical and horizontal directions, that is, in the Z-axis direction and the Y-axis direction, through horizontal and vertical incision patterns. For example, the AVI probe pin 131 may be formed to include an arc-shaped incision pattern in an area following the peak 131t. The arc-shaped incision pattern may include a horizontal pattern 13, a vertical pattern 14, an inner hole 15, and an arc center 11. The horizontal pattern 13 may buffer impact in the vertical direction, and the vertical pattern 14 may buffer impact in the horizontal direction. The inner hole 15 may also be formed in a horizontal direction and a vertical direction, that is, an arc shape. Based on the arc center 11, the horizontal pattern 13 and the vertical pattern 14 may be smoothly connected.

The vertical portion 131v of the AVI probe pin 131 may absorb shock in the horizontal direction, that is, in the Y-axis direction, through the vertical pattern 19 in the Z-axis direction. Since the vertical portion 131v is connected to the contact portion 131c by using the vertical pattern 19, it may be configured to absorb shock transmitted to the contact portion 131c vertically contacting the FPC.

Like the AVI probe pin 131, the TSP probe pin 141 may be formed to include a peak 141t, a vertical portion 141v, a horizontal portion 141h, and a contact portion 141c. The horizontal portion 141h of the TSP probe pin 141 may be configured to include a horizontal pattern 17 formed in the Y-axis direction in order to buffer an impact in the Z-axis direction transmitted from the peak 141t.

Wings 141w may be formed in the contact portion 141c with the horizontal incision 18 interposed therebetween. The wing 141w serves to increase the rigidity of the contact portion 141c. Since the wing 141w is formed to protrude in the reverse direction, a space necessary for bending the horizontal portion 141h may be formed through a cutout pattern.

8 is an exemplary diagram of an AVI block of a hybrid pinboard according to an embodiment of the present invention.

Referring to FIG. 8 , the bottom surface of the AVI block 130 including the AVI probe pin 131 in contact with the AVI pad on the test subject and the AVI slot 133 in which the AVI probe pin 131 is seated is depicted.

The horizontal portion 131h of the AVI probe pin 131 is inserted into the horizontal slot 133d to prevent upward separation, and the vertical portion 131v is inserted into the vertical slot 133b to prevent forward separation. can be prevented

As described above, according to an embodiment of the present invention, both pixel inspection and touch inspection may be performed using one probe device.

In addition, the probe pin and the FPC can be stably contacted.

In addition, the probe pin for pixel inspection and the probe pin for touch inspection can be stably fixed to the slit.

In the above, various preferred embodiments of the present invention have been described with some examples, but the description of various embodiments described in the "Specific Contents for Carrying Out the Invention" section is only exemplary, and the present invention Those skilled in the art will understand from the above description that the present invention can be practiced with various modifications or equivalent implementations of the present invention can be performed.

In addition, since the present invention can be implemented in various other forms, the present invention is not limited by the above description, and the above description is intended to complete the disclosure of the present invention and is common in the technical field to which the present invention belongs. It is only provided to completely inform those skilled in the art of the scope of the present invention, and it should be noted that the present invention is only defined by each claim of the claims.

100: hybrid pinboard
110: pin board body
111: top surface
112: top hole
113: bottom
114: front
115: alignment mark
120: printed circuit board
121: AVI printed circuit board
123: TSP printed circuit board
130: AVI block
131: AVI probe pin
132: clasp
134: projection
133: AVI slot
133d: lower slot
133b: rear slot
135: contact block
140: TSP block
142: FPC base
144: FPC spring
141: TSP probe pin
143: TSP slot
143u: upper slot
143f: front slot
145: cover
145u: upper cover
145f: front cover

Claims (10)

a pin board body (110);
At least one printed circuit board 120 coupled to the pin board body 110 and outputting an automotive vision inspection (AVI) inspection signal required for pixel inspection and a touch screen panel (TSP) inspection signal required for touch inspection;
an AVI block 130 coupled to the pin board body 110 and inputting the AVI inspection signal to an AVI pad on the subject to be inspected;
a TSP block 140 coupled to the pin board body and inputting the TSP test signal to a TSP pad on the test subject;
an FPC base 142 on which a TSP flexible circuit (FPC) electrically connecting the TSP block 140 and the printed circuit board 120 is seated; and
An FPC spring 144 disposed between the FPC base 142 and the TSP flexible circuit to electrically contact the terminal of the TSP flexible circuit with the TSP block 140 using elasticity,
The pinboard body 110 is configured to simultaneously input the AVI inspection signal to the AVI pad and the TSP inspection signal to the TSP block using the AVI block and the TSP block,
Hybrid Pinboard. delete The method according to claim 1, wherein the AVI block 130 and the TSP block 140,
It is configured to be coupled to any one of the top and bottom surfaces of the pinboard body 110, respectively.
Hybrid Pinboard. The method according to claim 1, wherein the AVI block 130,
An AVI probe pin 131 in contact with the AVI pad and an AVI slot 133 in which the AVI probe pin 131 is seated,
The AVI block 130 is coupled to the bottom surface of the pin board body 110,
The AVI probe pin 131 is configured to be inserted into the AVI slot 133 from the lower side to the upper side of the AVI slot 133.
Hybrid Pinboard. The method according to claim 4, wherein the AVI slot 133,
It is configured to include a horizontal AVI slot 133d open downward and a vertical AVI slot 133b open backward.
Hybrid Pinboard. The method according to claim 4, wherein the AVI probe pin 131,
A L-shaped latch (131f) inserted into the intersection of vertical and horizontal surfaces of the AVI slot 133 to prevent upward and forward departure; and
Constructed to form a protrusion 131s that resists the vertical surface of the AVI slot 133 and prevents the AVI probe pin 131 from departing backward.
Hybrid Pinboard. The method according to claim 4, wherein the AVI block 130,
Further comprising a contact block 135 for contacting the AVI probe pin 131 to a terminal of an AVI flexible circuit,
The contact block 135 is configured to be coupled to the pinboard body 110 at a position preventing the AVI probe pin 131 from coming off backward.
Hybrid Pinboard. The method according to claim 1, wherein the TSP block 140,
A TSP probe pin 141 in contact with the TSP pad, and a TSP slot 143 in which the TSP probe pin 141 is seated,
The TSP block 140 is coupled to the top surface of the pin board body 110,
The TSP probe pin 141 is configured to be inserted into the TSP slot 143 from the upper side to the lower side of the TSP slot 143.
Hybrid Pinboard. The method according to claim 8, wherein the TSP slot 143,
It is configured to include a horizontal TSP slot 143u open upwards and a vertical TSP slot 143f open forward.
Hybrid Pinboard. The method according to claim 8, wherein the TSP block 140,
At least one of a cover 145u preventing the TSP probe pin 141 from moving upward from the TSP slot 143 and a cover 145f preventing the TSP probe pin 141 from moving forward,
Hybrid Pinboard.

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