KR102494725B1 - Display device - Google Patents

Abstract

The present invention relates to a driving chip mounted on a COF film to face the rear surface of a cover bottom, a chip protection unit that is coupled to the COF film to surround the driving chip and separates the driving chip from the cover bottom, and a rear surface attached to the rear surface of the COF film. A display device including a reinforcement part is provided.

Description

Display device {Display device}

The present invention relates to a display device, and more particularly, to a display device capable of implementing a narrow bezel.

In the recent information society, the importance of a display device or display device as a visual information transmission medium is being emphasized, and in order to occupy an important position in the future, it is necessary to meet requirements such as low power consumption, thinning, light weight, and high definition. .

The display is a cathode ray tube (CRT) that emits light itself, an electro luminescence (EL), a light emitting diode (LED), a vacuum fluorescent display (VFD), and an electric field emission device. Displays (Field Emission Display; FED), Plasma Display Panel (Plasma Display Panel; PDP), such as light-emitting type, such as liquid crystal display (Liquid Crystal Display; LCD) can be divided into a non-emissive type that itself does not emit light.

Among these various displays, the liquid crystal display is a device that expresses images by using the optical anisotropy of liquid crystals. It is popular as a display.

Such a liquid crystal display can implement an image by placing a light source under the liquid crystal and controlling the arrangement of the liquid crystal by applying an electric field to the liquid crystal, thereby adjusting the transmittance of light generated from the light source. Liquid crystal displays are applied to various electronic equipment such as smartphones and tablet PCs. In particular, the liquid crystal display device includes a cover bottom in which a liquid crystal panel is disposed under a cover glass, a backlight unit is disposed under the liquid crystal panel, and the liquid crystal panel or the backlight unit is accommodated or supported. .

However, as the recent trend is towards slim bezels and ultra-thin displays, the demand for thin and light display devices is increasing.

Recently, displays have gone beyond slim bezels to realize narrow bezels, which reduce the width of bezels as thin as possible.

An object of the present invention is to provide a display device capable of preventing cracks by protecting a driver Ic of a COF film from external impact while implementing a narrow bezel.

In order to solve the above problems, the present invention provides a driving chip mounted on a COF film so as to face the rear surface of a cover bottom, a chip protection unit coupled to the COF film to separate the driving chip from the cover bottom while surrounding the driving chip, and A display device including a rear reinforcement part attached to the rear surface of a COF film is provided.

In addition, the present invention relates to a COF film bonded to the rear surface of the cover bottom while one side is coupled to the liquid crystal panel and bent, a driving chip mounted on the rear surface of the COF film to face the rear surface of the cover bottom, and a chip cover portion covering the driving chip. It provides a display device that includes.

In addition, the present invention provides a cover bottom supporting a backlight unit and a liquid crystal panel and having an insertion groove formed on the rear surface, a COF film adhered to the rear surface of the cover bottom while being bent while one side is coupled to the liquid crystal panel, and facing the rear surface of the cover bottom. A display device including a driving chip mounted on a COF film and inserted into an insertion groove of a cover bottom for viewing, and a chip protection unit coupled to the COF film to surround the driving chip and separate the driving chip from the cover bottom.

According to the display device of the present invention, while realizing a narrow bezel, the driving chip of the COF film can be protected from external impact, high temperature, cold temperature, etc. through the chip protection part and the rear reinforcement part, so that the driving chip cracks, malfunction, It can prevent damage such as line breakage.

In addition, since the display device of the present invention is provided with a chip cover, it is not necessary to use a reinforcement part on the rear surface, so thickness and cost reduction can be expected, and the driving chip of the COF film is protected from external impact, high temperature, cold temperature, etc. coming from the rear surface. By doing so, damage such as cracks, poor operation, and line reduction can be prevented.

In addition, according to the display device of the present invention, thickness reduction can be expected through the chip cover portion inserted into the cover bottom, and the COF film is free from external impact, high temperature, cold temperature, and touch noise coming from the rear surface. By protecting the drive chip, it is possible to prevent damage such as cracks, poor operation, and shrinkage.

1 is a side sectional view of a display device having a COF film of a first embodiment.
FIG. 2 is a perspective view showing a driving chip region mounted on an inner surface of the COF film of FIG. 1 .
FIG. 3 is a perspective view showing a rear reinforcing part region mounted on the rear surface of the COF film of FIG. 1 .
4 is a side cross-sectional view of a display device having a COF film according to a second embodiment.
FIG. 5 is a view showing a process of forming a chip cover part in the driving chip of FIG. 4 .
6 is a cross-sectional side view of a display device having a COF film according to a third embodiment.
FIG. 7 is a perspective view showing a chip protection area mounted on the rear surface of the COF film of FIG. 6;

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and description of the embodiments. In the description of the embodiment, each layer (film), region, pattern or structure is “on” or “under” the substrate, each layer (film), region, pad or pattern. In the case where it is described as being formed in, "up / on" and "under / under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criterion for the upper/upper or lower/lower of each layer will be described based on the drawings.

In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of explanation. Also, the size of each component does not fully reflect the actual size. Also, like reference numerals denote like elements throughout the description of the drawings. Hereinafter, embodiments will be described with reference to the accompanying drawings.

1 is a cross-sectional side view of a display device having a COF film of a first embodiment, FIG. 2 is a perspective view showing a driving chip region mounted on an inner surface of the COF film of FIG. 1, and FIG. 3 is a view of the COF film of FIG. It is a perspective view showing the area of the rear reinforcement part mounted on the rear side.

1 to 3, the display device 1 according to the first embodiment of the present invention includes a cover glass 110, a liquid crystal panel 130, a backlight unit 140, and a cover bottom 200. , a COF film 300, a chip protection unit 400, and a rear reinforcement unit 500.

A protective film (not shown) may be provided on the upper surface of the cover glass 110 . In addition, the cover glass 110 may include a touch panel (not shown). This touch panel has a pressure-sensitive type that densely installs sensor lines that respond to pressure applied to the surface to find out the location as coordinates when pressure is applied, and a touch panel after charging the surface of the cover glass 110 and installing sensors around it. It can be applied as a capacitive method that detects the amount of charge lost when contact is made.

In the liquid crystal panel 130, pixels are arranged in a matrix form to output an image, and the color filter substrate 131, the array substrate 133, and the color filter substrate 131 are bonded to each other so as to maintain a uniform cell gap. and a liquid layer (not shown) in which a cell gap is formed between the array substrate 133 .

The color filter substrate 131 is a color filter composed of a plurality of sub-color filters that implement red, green, and blue (RGB) colors, and a black color filter that distinguishes between the sub-color filters and blocks light passing through the liquid crystal layer. It may consist of a matrix, and an overcoat layer formed on the color filter and the black matrix.

On the array substrate 133, gate lines and data lines are formed that are vertically and horizontally arranged to define pixel areas, and thin film transistors (TFTs), which are switching elements, are formed in the intersection area of the gate lines and data lines. . The thin film transistor is composed of a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode.

A common electrode and a pixel electrode are formed in the liquid crystal panel 130 where the color filter substrate 131 and the array substrate 133 are bonded together to apply an electric field to the liquid crystal layer, and apply an electric field to the pixel electrode while voltage is applied to the common electrode. It is possible to control the voltage of the data signal to be. Then, the liquid crystal of the liquid crystal layer is rotated by dielectric anisotropy according to the electric field between the common electrode and the pixel electrode, so that each pixel transmits or blocks light to display characters or images. At this time, in order to control the voltage of the data signal applied to the pixel electrode for each pixel, switching elements such as thin film transistors are individually provided in the pixels.

Polarizers 120 and 121 may be attached to outer upper and lower portions of the color filter substrate 131 and the array substrate 133 , respectively. At this time, the lower polarizer 121 polarizes the light passing through the backlight unit 140 toward the array substrate 133, and the upper polarizing plate 120 polarizes the light passing through the liquid crystal panel 130.

An OCR film 115 for increasing luminance may be provided between the cover glass 110 and the liquid crystal panel 130 . Also, a lower edge of the liquid crystal panel 130 may be supported by a mold or a guide panel 180 , and the backlight unit 140 is accommodated inside the guide panel 180 .

The backlight unit 140 includes a light guide plate 150 disposed under the liquid crystal panel 130, an LED 160 as a light source disposed on one side of the light guide plate 150 to generate light, and an LED driving the LED 160. FPCB 170, a fixing tape 175 for fixing LED 160 and LED FPCB 170, and a reflector (not shown) may be included.

The light guide plate 150 receives light from the light source 160 and guides the light toward the liquid crystal panel 130 . The light guide plate 150 may be made of a plastic material such as PMMA or PC.

A plurality of optical sheets 145 are provided on the upper surface of the light guide plate 150 to improve the efficiency of light emitted from the light guide plate 150 and radiate the light to the liquid crystal panel 130 .

The optical sheet 145 includes a diffusion sheet and a prism sheet, and a luminance enhancing film such as DBEF and a protective sheet may be added. The optical sheet 145 may be provided between the upper surface of the light guide plate 150 and the rear surface of the liquid crystal panel 130 .

The upper side of the LED FPCB 170 may be attached to the upper side of the guide panel 180 through the light blocking tape 141 . The light blocking tape 141 may have a bottom surface attached to an upper surface of the LED FPCB 170 and one end thereof positioned on an upper surface of the optical sheet 145 . Therefore, the light-shielding tape 141 together with the LED FPCB 170 may perform a function of guiding the coupling position of the optical sheet 145 while fixing the optical sheet 145 . In addition, the light blocking tape 141 attaches the liquid crystal panel 130 and the LED FPCB 170, and is disposed adjacent to one end of the lower polarizer 121 provided on the lower side of the liquid crystal panel 130. Accordingly, it is possible to prevent a step from occurring between the liquid crystal panel 130 and the backlight unit 140 .

The lower side of the LED FPCB 170 may be attached to a part of the light source 160 and the light guide plate 150 through the double-sided tape 175 . Also, the double-sided tape 175 attaching the LED FPCB 170 to the light guide plate 150 may be made of black color. Then, the light emitted from the light source 160 can be reflected more uniformly by the diffusion sheet (which extends further toward the light entering part), and at the same time, light leakage can be prevented through the black double-sided tape 175. In addition, the black double-sided tape 175 absorbs some of the light in the light entrance area, thereby reducing the occurrence of hot spots around the light entrance area.

The reflector 190 is positioned between the cover bottom 200 and the rear surface of the light guide plate 150 . The reflector 190 reflects the light emitted from the light source 160 and the light reflected from the light guide plate 150 toward the liquid crystal panel 130 . Light emitted from the light source 160 is incident on the side of the light guide plate 150 made of a transparent material, and the reflector 190 disposed on the rear surface of the light guide plate 150 transmits the light transmitted to the rear surface of the light guide plate 150 through the light guide plate 150. The light is reflected in the direction of the optical sheet 145 on the upper surface to reduce loss of light and improve uniformity of luminance.

The backlight unit 140 including the above configuration is accommodated inside the cover bottom 200 . The backlight unit 140 is not limited to the above structure, and any structure of the backlight unit 140 may be applied to the display device 1 according to the present invention.

The cover bottom 200 may accommodate the backlight unit 140 and the guide panel 180 therein and support the liquid crystal panel 130 described above. For example, the cover bottom 200 may have a structure consisting of only a bottom part and a side part in order to minimize and slim the bezel area. That is, the cover bottom 200 may include a rectangular plate-shaped bottom portion and a side portion protruding upward at a predetermined height from one side of the bottom portion. Of course, the above-described cover bottom 200 is only exemplary, and even cover bottoms 200 having various shapes can be applied to the display device 1 according to the present invention.

Meanwhile, a driver IC for driving the liquid crystal panel 130 is mounted inside the display device 1, and the driver IC may be connected to a circuit board to operate.

In general, the driving chip (not shown) inside the display device 1 is a COG (Chip On Glass) type that is connected to a flexible circuit board (film) on one side of the liquid crystal panel 130, that is, on the upper surface of the glass. Mounting method was mainly used.

However, since the COG mounting method of the driving chip has limitations such as the inability to reduce the space where the driving chip is located for slimming the bezel area and realizing a narrow bezel, in this embodiment, the driving chip is a flexible circuit to implement a narrow bezel It uses a COF (Chip On Film) method that is directly mounted on a substrate (film).

The COF film 300 may include a driving chip 310 and a circuit capable of driving the driving chip 310 and may have a film shape having a predetermined length and thickness. One end of the COF film 300 may be coupled to one side of the liquid crystal panel 130 and attached to the rear surface of the cover bottom 200 by a double-sided tape (not shown) while being bent.

Here, the driving chip 310 may be mounted on the inner surface of the COF film 300 to face the rear surface of the cover bottom 200 . For example, as shown in FIG. 2 , the driving chip 310 may be disposed long along the width direction of the COF film 300 . Since the driving chip 310 has a long bar shape, when the display device is dropped or an impact is applied from the outside, the driving chip 310 cracks or malfunctions due to the impact, shrinkage phenomenon, etc. There is a risk of damage.

To protect the driving chip 310 from being damaged, a chip protection unit 400 may be installed. The chip protection unit 400 is coupled to the inner surface of the COF film 300 and may have a shape surrounding the driving chip 310 . For example, as shown in FIG. 2 , the chip protection unit 400 may have a shape surrounding the driving chip 310 while being spaced apart from the driving chip 310 by a predetermined distance. In addition, the chip protection unit 400 may have a height greater than that of the driving chip 310 and separate the driving chip 310 from the cover bottom 200 .

In this way, the chip protection unit 400 wraps around the driving chip 310 and prevents it from contacting the cover bottom 200, thereby preventing damage from impact.

However, in a state in which the COF film 300 is bent on the back surface of the cover bottom 200, the drive chip 310 may be damaged by an external impact from the rear surface of the COF film 300. Accordingly, it is necessary to further prevent impact of the driving chip 310 while protecting the rear surface of the COF film 300 .

To this end, a rear reinforcement part 500 may be attached to the rear surface of the COF film 300 .

The back surface reinforcement part 500 may be attached to a position opposite to the aforementioned chip protection part 400, that is, to the COF film 300 that is bent and positioned outside the cover bottom 200.

In more detail, the rear reinforcing part 500 may include a double-sided tape 510 and a reinforcing member 520 .

The double-sided tape 510 may be attached to the back surface of the COF film 300 so that the reinforcing member 520 is attached thereto. For example, the double-sided tape 510 may be long attached along the width direction of the COF film 300 as shown in FIG. 3 .

The reinforcing member 520 may have a certain thickness and be attached to the double-sided tape 510 . For example, the reinforcing member 520 may have a long bar shape like the double-sided tape 510 or a plate shape having a certain area.

In addition, the reinforcing member 520 may have a length L2 equal to or smaller than the length L1 of the COF film 300 in the width direction. As such, the rear reinforcement part 500 shown in FIG. 3 is merely illustrative and can be modified in various forms.

The aforementioned rear reinforcement part 500 may include a polyimide (PI) film. For example, both the double-sided tape 510 and the reinforcing member 520 have a polyimide (PI) material, and the double-sided tape 510 and the reinforcing member 520 are laminated to each other, and the rear reinforcing part 500 is can be carried out.

Polyimide is a material with excellent heat resistance and can withstand high temperatures of over 400 degrees Celsius and low temperatures of minus 269 degrees Celsius. In addition, since it is thin, has excellent flexibility, and has excellent chemical resistance and abrasion resistance, stable performance can be maintained even in harsh environments.

The rear reinforcing part 500 having a poly image material having such characteristics may have superior performance than a COG film reinforcing member (not shown) made of stainless steel (STS), and is easily applied to the COF film 300. do. That is, since the COF film 300 is a material vulnerable to heat, it is difficult to use a heat-welded reinforcing member made of stainless steel like a COG film (not shown).

As described above, the display device of the present embodiment having the chip protection unit 400 and the rear reinforcing unit 500 protects the driving chip 310 of the COF film 300 from external impact, high temperature, cold temperature, etc. ) can prevent damage such as cracks, poor operation, and shrinkage.

4 is a cross-sectional side view of a display device having a COF film according to a second embodiment, and FIG. 5 is a view showing a process of forming a chip cover part in the driving chip of FIG. 4 .

As shown in FIGS. 4 and 5 , the position of the driving chip 310a in the COF film 300a is different in the display device 1a of the second embodiment, unlike the display device 1 of the foregoing embodiment. That is, in this embodiment, the driving chip 310a is mounted on the rear surface of the COF film 300a to face the rear surface of the cover bottom 200 .

When the COF film 300a having the arrangement structure of the driving chip 310a is bent and brought into close contact with the cover bottom 200, the thickness of the COF film 300a can be further reduced. However, as described above, in a state in which the COF film 300a is bent on the rear surface of the cover bottom 200, the driving chip 310a may be damaged by an external impact from the rear surface of the COF film 300a. Accordingly, it is necessary to further prevent damage to the driving chip 310a while protecting the rear surface of the COF film 300a.

To this end, a chip cover unit 600 covering the driving chip 310a may be provided. Since the chip cover part 600 serves to protect the driving chip 310a, it may be called a chip protection part.

In more detail, the chip cover part 600 may include glue 620 applied to the upper and side surfaces of the driving chip 310a. For example, the glue 620 may include any one of a resin, an adhesive, and a UV curing liquid that is applied using a liquid or viscoelastic material.

As an example of forming the chip cover part 600, as shown in FIG. 5, in a state where the back surface of the COF film 300a is positioned upward, using a glue gun 610, the upper part of the driving chip 310a Glue 620 may be sprayed toward the surface. The driving chip 310a to which the glue 620 is applied has increased rigidity and elasticity, so that impact from external force can be alleviated.

That is, the chip cover part 600 may be formed by applying the glue 620 along the longitudinal direction of the driving chip 310a, and the glue 620 is applied to the upper and side surfaces of the driving chip 310a and the COF film ( 300a) may be applied together on the back side.

In addition, the dimensions and width of the chip cover unit 600, as described above, are only illustrative, and can be modified into various sizes, positions, and shapes.

As described above, the display device of this embodiment having the chip cover part 600 does not need to use the rear reinforcing part 500 of the above-described embodiment, so thickness and cost reduction can be expected, and external impact from the rear surface, high temperature, cold temperature By protecting the driving chip 310a of the COF film 300a from others, damage such as cracks, poor operation, and shrinkage may be prevented.

6 is a cross-sectional side view of a display device having a COF film according to a third embodiment, and FIG. 7 is a perspective view showing a chip protection area mounted on the rear surface of the COF film of FIG. 6 .

As shown in FIGS. 6 and 7 , the display device 1b of this embodiment has a structure in which the driving chip 310b is disposed on the inner surface of the COF film 300b like the first embodiment described above.

However, an insertion groove 203 having a space into which the driving chip 310b can be inserted may be recessed on the rear surface of the cover bottom 200b. As shown in FIG. 7 , the insertion groove 203 may have a size and shape into which a chip protection unit 400b to be described later may be inserted.

The chip protection unit 400b may separate the cover bottom 200b from the driving chip 310b while surrounding the driving chip 310b. Therefore, it is possible to protect the driving chip 310b from an external force while not contacting the cover bottom 200b upon impact.

In more detail, the chip protection unit 400b may include a conductive tape 410 , an outer mold 420 , and a mold cover 430 .

As shown in FIG. 6 , the conductive tape 410 may be attached to an inner surface of the COF film 300b while surrounding the driving chip 310b to be spaced apart from the driving chip 310b. The conductive tape 410 prevents direct contact or interference of the cover bottom 200b, which is a conductor, with the COF film 300b.

The outer mold 420 may be attached to the conductive tape 410 to protect the driving chip 310b. For example, as shown in FIG. 7 , the outer mold 420 may have a shape surrounding the driving chip 310b at a distance from the circumference of the driving chip 310b. The outer mold 420 may be called a support member because the driving chip 310b is supported in the insertion groove 203 of the cover bottom 200b.

The mold cover 430 may cover an upper portion of the outer mold 420, that is, an inner space in which the driving chip 310b is accommodated. The mold cover 430 may be called a shield because it protects the aforementioned outer mold 420 and the driving chip 310b.

When the COF film 300b is bent and adhered to the cover bottom 200b, the chip protection unit 400b having the above-described configuration may be inserted and seated in the insertion groove 203 of the cover bottom 200b. . Accordingly, since the COF film 300b can be adhered to the cover bottom 200b after being bent, the thickness of the display device can be further reduced.

Also, the height of the chip protection portion 400b may be smaller than the groove depth of the insertion groove 203 of the cover bottom 200b. Accordingly, by maintaining a gap between the chip protection unit 400b and the cover bottom 200b, touch noise caused by contact and interference of the driving chip 310b can be reduced. For reference, since touch line wiring may be included in the COF film 300b of the in-cell touch type, it is necessary to prevent touch noise due to contact and interference.

To efficiently maintain the gap between the chip protection unit 400b and the cover bottom 200b, the outer mold 420 of the chip protection unit 400b is made of polycarbonate (PC, PolyCarbonate), and the mold cover ( 430) may have a polyethylene (PE, PolyEthylene) material. In addition, the mold cover 430 may have a transparent material so that the internal state of the driving chip 310b can be grasped.

As such, the display device of the present embodiment having the chip cover portion inserted into the cover bottom 200b can be expected to reduce the thickness, and the COF film can be protected from external impact, high temperature, cold temperature, touch noise, etc. coming from the rear surface. By protecting the driving chip 310b of (300b), it is possible to prevent damage such as cracks, poor operation, and shrinkage.

The display device according to the above-described embodiment of the present invention may be applied to various electronic devices such as TVs, smart phones, and tablet PCs.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

1, 10: display device 110: cover glass
120, 121: polarizing film 130: liquid crystal panel
131: color filter substrate 133: array substrate
140: backlight unit 141: light blocking tape
145: optical sheet 150: light guide plate
160: LED 170: LED FPCB
175: fixed tape 180: mold (guide panel)
190: reflector 200, 200b: cover bottom
203: insertion groove 300, 300a, 300b: COF film
310, 310a, 310b: Driver IC 400, 400b: Chip protection unit
410: conductive tape 420: outer mold
430: mold cover 500: rear reinforcement
510: double-sided tape 520: stiffener
600: chip cover part 610: glue gun
620: Glue

Claims (15)

liquid crystal panel;
a backlight unit disposed below the liquid crystal panel;
a cover bottom supporting the backlight unit and the liquid crystal panel;
a COF film having one side coupled to the liquid crystal panel and adhered to the rear surface of the cover bottom while being bent;
a driving chip mounted on the COF film to face the rear surface of the cover bottom;
a chip protection unit coupled to the COF film and spaced apart from the cover bottom and the driving chip while surrounding the driving chip; and
A display device comprising a; rear reinforcement part attached to the rear surface of the COF film. According to claim 1,
The rear surface reinforcement part is attached to a position opposite to the chip protection part, the display device. According to claim 2,
The rear reinforcement part
a double-sided tape attached to the back surface of the COF film; and
A display device comprising a reinforcing member attached to the double-sided tape. According to claim 3,
The rear reinforcement part includes a polyimide (PI, Polyimide) film, the display device. According to any one of claims 3 and 4,
The reinforcing member has a length equal to or smaller than the length of the COF film in the width direction of the display device. liquid crystal panel;
a backlight unit disposed under the liquid crystal panel;
a cover bottom supporting the backlight unit and the liquid crystal panel;
a COF film having one side coupled to the liquid crystal panel and adhered to the rear surface of the cover bottom while being bent;
a driving chip mounted on a rear surface of the COF film to face the rear surface of the cover bottom; and
A chip cover portion covering the driving chip; includes,
The chip cover portion is directly formed on the top and side surfaces of the driving chip. According to claim 6,
The chip cover part includes glue applied to upper and side surfaces of the driving chip. According to claim 7,
Wherein the glue includes at least one of resin, adhesive, and UV curing liquid. According to claim 7 or 8,
The display device, wherein the glue is applied along the longitudinal direction of the driving chip through a glue gun. liquid crystal panel;
a backlight unit disposed under the liquid crystal panel;
a cover bottom supporting the backlight unit and the liquid crystal panel and having an insertion groove formed on a rear surface thereof;
a COF film having one side coupled to the liquid crystal panel and adhered to the rear surface of the cover bottom while being bent;
a drive chip mounted on the COF film to face the rear surface of the cover bottom and inserted into an insertion groove of the cover bottom; and
a chip protection unit coupled to the COF film and spaced apart from the cover bottom and the driving chip while surrounding the driving chip; Including, display device. According to claim 10,
The chip protection unit
a conductive tape attached to the COF film while surrounding the driving chip to be spaced apart from the driving chip;
an outer mold attached to the conductive tape to surround and protect the driving chip so as to be spaced apart from each other; and
A display device comprising a mold cover covering an upper portion of the outer mold. According to claim 11,
The outer mold is a polycarbonate (PC, PolyCarbonate) material, a display device. According to claim 11,
The mold cover is a polyethylene (PE, PolyEthylene) material, a display device. According to claim 13,
The mold cover is a transparent material, the display device. According to any one of claims 11 to 14,
The height of the chip protection portion is smaller than the depth of the insertion groove of the cover bottom, the display device.

Images