KR102493151B1 - Printed Circuit Board - Google Patents

Abstract

In the present invention, in a polygonal solder land formed around a hole formed on a printed circuit board to insert a pin provided in an electric device, the left and right sides of a virtual rectangle having the same center as the hole and formed outside the hole, respectively. It relates to a polygonal solder land formed including four first lines starting from , having the same center as the hole and being larger than the hole, and extending while contacting a virtual auxiliary circle formed inside the virtual rectangle.

Description

Printed Circuit Board {Printed Circuit Board}

The present invention relates to a printed circuit board including a solder land, and more particularly, to a solder capable of preventing short-circuiting of an electric device by improving lead flow in a solder process. It's about Rand.

In general, electric devices use printed circuit boards to form circuits of control panels for operating various systems. In order to construct a predetermined circuit on the printed circuit board, various types of components or elements are mounted on the board at predetermined locations or inserted into predetermined holes on the board, and then the lead pins of the components or elements are electrically contacted by soldering. It is firmly fixed with this room.

In the printed circuit board soldering device, molten lead is ejected upward by a pump through an automatic soldering nozzle. And, by passing the printed circuit board on it by a conveyor, the molten lead is attached to the solder land around the copper foil pattern and the lead pin, and then solidified in the process to fix the parts to the printed circuit board and form electrical contact. A certain circuit is formed.

The spacing between solder lands is determined considering the diameter of the hole into which the pin of the electronic device is inserted and the thickness of the solder land where soldering is performed. Leads between the lands come into contact, resulting in a short circuit.

Conventionally used solder lands have circular or elliptical solder lands formed around the holes, but compared to circular ones, elliptical solder lands are effective in preventing short circuits between pins by distributing the solder flow up and down, In the case of the elliptical solder land, there is a high possibility that the molten solder may be contacted and shorted because the range of the portion forming the minimum separation distance between adjacent solder lands is large.

The problem to be solved by the present invention is to secure an appropriate range for securing the joint quality and reliability of the solder land product by forming the solder land formed around the hole in an octagonal shape, and at the same time, spacing of more than a certain distance between adjacent solder lands An object of the present invention is to provide a solder land of a printed circuit board that minimizes the attraction between adjacent leads that may occur during a soldering process by maintaining a distance and minimizing an area corresponding to a minimum separation distance between adjacent solder lands.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a polygonal solder land according to an embodiment of the present invention is a polygonal solder land formed around a hole formed in a printed circuit board for inserting a pin provided in an electric device,

Starting from each of the left and right sides of a virtual rectangle having the same center as the hole and formed outside the hole, having the same center as the hole and being larger than the hole, extending while touching a virtual auxiliary circle formed inside the virtual rectangle It is formed by including four first lines.

The first line may depart from a point on the left side and a point on the right side of the imaginary rectangle by two, and preferably, the first line departs from the center of each of the left and right sides of the imaginary rectangle. do.

The first line may form a hexagon with upper and lower surfaces of the imaginary rectangle.

the four first lines; two second lines departing from a point on the upper surface of the imaginary rectangle; And two third lines departing from a point on the lower surface of the imaginary rectangle may form an octagon.

The second line departs from the center of the upper surface, the third line departs from the center of the lower surface, and the second line and the third line may extend while contacting or not contacting the virtual auxiliary circle. can

Each of the four first lines may depart from two points on the left side and two points on the right side of the imaginary rectangle, and preferably each of the first lines departs from the left side and right side of the imaginary rectangle. The position is a symmetrical position at the center of the left and right sides of the imaginary rectangle.

Two of the first lines converge at one point on the upper surface of the imaginary rectangle and converge at one point on the lower surface, and the first line may form a hexagon with the left and right sides of the imaginary rectangle. .

The first line may converge to the center of the upper surface and the lower surface of the virtual rectangle.

The first lines converge to two points on the upper surface and two points on the lower surface of the imaginary rectangle by two, and the first line may form an octagon with the upper, lower, left and right sides of the imaginary rectangle. there is.

Each of the first lines may be parallel to each of four virtual auxiliary lines starting from the center of the left and right sides of the virtual rectangle and converging to the center of the upper and lower sides.

The left and right sides of the imaginary rectangle are planes located between the holes, and the straight line distance from the top surface to the bottom surface of the virtual rectangle is longer than the straight line distance from the left side to the right side, and the hole may be formed to have a minimum diameter necessary for inserting the pin of the electric element, and a distance between the hole and the virtual auxiliary circle may be formed as a minimum distance for soldering the pin.

The distance between the left and right sides of the imaginary rectangle may be formed by subtracting the minimum separation distance between adjacent solder lands from the distance between the centers of the adjacent holes.

Details of other embodiments are included in the detailed description and drawings.

According to the solder land of the printed board of the present invention, one or more of the following effects are provided.

The shape of the solder land is octagonal to secure an appropriate range to secure the joint quality and reliability of the product, and at the same time minimize the area corresponding to the minimum separation distance between adjacent solder lands, which can occur during the soldering process. It has the advantage of maximizing short circuit prevention by minimizing contact with molten solder.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a view showing a printed circuit board including octagonal solder lands according to an embodiment of the present invention.
2(a) is a view for explaining an octagonal solder land according to an embodiment of the present invention.
2(b) is a diagram illustrating a diamond-shaped solder land according to a comparative example of the present invention.
FIG. 3(a) is a diagram illustrating a distance between solder lands when a plurality of solder lands of FIG. 2(a) are arranged.
FIG. 3(b) is a diagram illustrating a distance between solder lands when a plurality of elliptical solder lands are arranged according to a comparative example of the present invention.
4 is a view for explaining a hexagonal solder land according to another embodiment of the present invention.
5 is a view for explaining a hexagonal solder land according to another embodiment of the present invention.
6 is a view for explaining an octagonal solder land according to another embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to completely inform the person who has the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

Hereinafter, the present invention will be described with reference to drawings for explaining a solder land of a printed circuit board according to embodiments of the present invention.

1 is a view showing a printed circuit board including octagonal solder lands according to an embodiment of the present invention.

Referring to FIG. 1, the printed circuit board 10 on which the integrated circuit of the dual in-line package is mounted has a very narrow gap between the pins of the dual in-line package, so that the solder of the printed circuit board corresponding thereto The spacing between the lands 100 is also formed to be very narrow. Therefore, during the soldering process, molten solder between the solder lands 100 adjacent to each other comes into contact with each other, and a short circuit may occur.

Accordingly, in the present invention, the solder land has a polygonal shape to minimize the problem of contact of leads between the solder lands during the soldering process and to secure the reliability of the product after soldering.

Hereinafter, a specific form of the solder land shown in FIG. 1 will be described.

2 is a diagram for explaining an octagonal solder land and a diamond-shaped solder land according to an embodiment of the present invention. FIG. 3 is a diagram illustrating a distance between solder lands when a plurality of octagonal solder lands are arranged and when a plurality of elliptical solder lands are arranged.

Referring to FIG. 2, a solder land according to an embodiment of the present invention is a polygonal solder land 100 formed around a hole 110 formed in a printed circuit board to insert a pin provided in an electric device, and the hole The hole 110 is concentric with the hole 110 and is concentric with the hole 110 starting from the left side 122 and the right side 124 of the imaginary rectangle 120 formed outside the hole 110, respectively. ) and is formed including four first lines extending while contacting the virtual auxiliary circle 130 formed inside the virtual rectangle 120.

Specifically, the first line 140 departs from one point on the left side 122 and one point on the right side 124 of the imaginary rectangle 120 by two, and preferably, the first line is the imaginary rectangle 120. It starts at the center of each of the left side 122 and right side 124 of the rectangle.

The four first lines 140 are two second lines 150 departing from a point on the upper surface of the imaginary rectangle and two third lines 160 departing from a point on the lower surface of the imaginary rectangle and 8 Forming an angle, preferably, the second line 150 departs from the center of the upper surface 126, the third line 160 departs from the center of the lower surface 128, and the second line 150 and the third The line 160 extends while contacting the virtual auxiliary circle 130 or extends without contacting the virtual auxiliary circle 130 .

The left side 122 and the right side 124 of the imaginary rectangle 120 are planes located between adjacent holes 110, and the tension of the solder land distributes the solder flow up and down to prevent short circuit between pins. For this reason, the straight line distance f from the upper surface 126 to the lower surface 128 of the imaginary rectangle 120 is longer than the straight line distance e from the left side 122 to the right side 124.

In the case of using a dual serial package integrated circuit product with a certain distance between pins, when soldering on a printed circuit board, the distance between pins is too close, resulting in a short circuit of more than 90%, lowering product quality and acting as a factor that may cause a fire. do.

In order to solve this problem, the minimum separation distance (h) between the solder lands should be spaced as much as possible, but considering the pin spacing, it is practically difficult to separate them beyond a certain distance.

As an example, in the case of using a dual serial package integrated circuit product having a pin spacing of 1.778 mm, it is difficult to separate the solder lands by 0.4 mm or more, so that the minimum spacing h is preferably set to 0.4 mm.

In the state where the minimum separation distance (h) is maintained between the solder lands, the portion corresponding to the minimum separation distance should be minimized. As shown in (b) of FIG. 3, in the elliptical solder land, the portion (g) corresponding to the minimum separation distance (h) between adjacent solder lands 100 is parallel or smooth, forming a minimum separation distance in a wide range. There is a high possibility of short circuit due to attraction of molten solder between adjacent solder lands.

On the other hand, as shown in (a) of FIG. 3, the octagonal solder land is bent by forming a corner at the portion forming the minimum separation distance (h), which corresponds to the minimum separation distance (h) between the solder lands 100 By minimizing the range g, the possibility of occurrence of a short between solder lands is very low compared to that of the elliptical solder lands.

However, in order to further reduce the possibility of short circuit between adjacent solder lands, as shown in FIG. In the case of forming a diamond-shaped solder land, the minimum distance (d) required for soldering is not satisfied in some areas of the solder land, so through holes ( Through Hole) Filling rate and through-hole wetting rate are not satisfied, so the joint quality and reliability of the product cannot be secured.

Referring to (a) of FIG. 2, the octagonal solder land 100 as in the present embodiment maintains the distance from the hole 110 to the auxiliary circle 130 to a minimum distance suitable for soldering, so that the IPC- Both the through-hole filling rate and through-hole wetting rate according to the A-610 standard are satisfied, so that the joint quality and reliability of the product are secured, and the range (g) corresponding to the minimum separation distance (h) between adjacent solder lands (100) By minimizing , the possibility of short circuit between adjacent solder lands is also very low.

The hole 110 is formed with a minimum diameter (c) required for inserting the pin of the electric element, and the distance (d) between the hole 110 and the virtual assistant 130 is formed as the minimum distance for soldering the pin, , The distance (e) between the left side 122 and the right side 124 of the imaginary rectangle 120 is the minimum separation distance (h) between adjacent solder lands at the distance (i) between the centers of adjacent holes 110. ) is formed by subtracting the distance.

As an example, in a dual serial package integrated circuit with a pin spacing of 1.778 mm, the distance (i) between the centers of adjacent holes 110 is 1.778 mm, and the minimum separation distance (h) between adjacent solder lands is 0.4 mm, the distance e between the left side 122 and the right side 124 of the imaginary rectangle 120 is 1.378 mm.

In this case, if the diameter (c) of the hole 110 is 0.9 mm, the distance (d) from the hole 110 to the virtual auxiliary circle 130 is preferably set to 0.2 mm.

In the case of forming an octagonal solder land as in the embodiment of the present invention, it has a minimum thickness for soldering, so it is an optimal form of solder land that does not come into contact with adjacent solder lands while securing product reliability.

In addition, during the soldering process, the area where the solder land 100 is actually formed due to the surface tension of the molten lead is gently bent inward than the left and right sides of the virtual rectangle to form a solder land in a range similar to that of the auxiliary circle 130, Since the minimum separation distance (h) between pins becomes wider, the possibility of short circuit between pins is lowered.

4 to 6 are views for explaining a hexagonal or octagonal solder land according to another embodiment of the present invention.

Referring to FIG. 4, the shape of a solder land 100 according to another embodiment of the present invention is a polygonal solder land 100 formed around a hole 110 formed in a printed circuit board to insert a pin provided in an electric device. ), the center of which is the same as the hole 110 and the center of the hole 110 starting from the left side 122 and the right side 124 of the virtual rectangle 120 formed outside the hole 110, respectively. It is equal to and larger than the hole 110 and is formed including four first lines extending while contacting the virtual auxiliary circle 130 formed inside the virtual rectangle 120.

Specifically, the first line 140 departs from one point on the left side 122 and one point on the right side 124 of the imaginary rectangle 120 by two, and preferably, the first line is the imaginary rectangle 120. Starting from the center of each of the left side 122 and right side 124 of the rectangle, the four first lines 140 form a hexagon with the top side 126 and the bottom side 128 of the imaginary rectangle 120.

In the solder land 100 according to the present embodiment, since the first wire extends in contact with the auxiliary source 130 maintaining a certain interval around the hole to solder the pin inserted into the hole 110, the joint quality and reliability of the product are secured. And, by minimizing the range (g) corresponding to the minimum separation distance (h) between adjacent solder lands 100, the possibility of short circuit between adjacent solder lands is also very low.

Referring to FIG. 5, the shape of a solder land according to another embodiment of the present invention is a polygonal solder land 100 formed around a hole 110 formed in a printed circuit board for inserting a pin provided in an electric device. ), the center of which is the same as the hole 110 and the center of the hole 110 starting from the left side 122 and the right side 124 of the virtual rectangle 120 formed outside the hole 110, respectively. It is equal to and larger than the hole 110 and is formed including four first lines extending while contacting the virtual auxiliary circle 130 formed inside the virtual rectangle 120.

Specifically, each of the four first lines 140 departs from two points on the left side 122 and two points on the right side 124 of the imaginary rectangle 120, and preferably each of the first lines 140 Positions starting from the left side 122 and the right side 124 of the imaginary rectangle 120 are symmetrical at the center of the left side 122 and the right side 124 of the imaginary rectangle 120 .

The first lines 140 converge at one point on the upper surface 126 of the imaginary rectangle 120 and converge at one point on the lower surface 128 of the imaginary rectangle 120, and the first line 140 is the imaginary rectangle 120. ) forms a hexagon with the left side 122 and the right side 124, and preferably the first line 140 converges to the center of the upper side 126 and the lower side 128 of the imaginary rectangle 120.

In the solder land 100 according to the present embodiment, since the auxiliary line 520 extends in contact with the auxiliary circle 120 maintaining a certain interval around the hole to solder the pin inserted into the hole 110, the joint quality and reliability of the product This is secured, and the range forming the minimum separation distance (h) between adjacent solder lands is smaller than that of the elliptical solder lands, so the possibility of short circuit between adjacent solder lands is also reduced.

Referring to FIG. 6, the shape of a solder land according to another embodiment of the present invention is a polygonal solder land 100 formed around a hole 110 formed in a printed circuit board for inserting a pin provided in an electric device. ), the center of which is the same as the hole 110 and the center of the hole 110 starting from the left side 122 and the right side 124 of the virtual rectangle 120 formed outside the hole 110, respectively. It is equal to and larger than the hole 110 and is formed including four first lines extending while contacting the virtual auxiliary circle 130 formed inside the virtual rectangle 120.

Specifically, each of the four first lines 140 departs from two points on the left side 122 and the right side 124 of the imaginary rectangle 120, and preferably, each of the first lines 140 is imaginary. Positions starting from the left side 122 and right side 124 of the rectangle 120 are symmetrical at the center of the left side 122 and right side 124 of the imaginary rectangle 120 .

The first line 140 converges to two points on the upper surface 126 of the imaginary rectangle 120 and two points on the lower surface 128 of the imaginary rectangle 120, and the first line 140 is the upper surface 126 of the imaginary rectangle. , bottom face 128, left face 122 and right face 124 form an octagon, preferably each of the first line 140 is the left face 122 and right face 124 of the imaginary rectangle 120 It is formed parallel to each of four virtual auxiliary lines 510 starting from the center of the upper surface 126 and converging to the center of the lower surface 128.

In the solder land 100 according to the present embodiment, since the auxiliary line 520 extends in contact with the auxiliary circle 120 maintaining a certain interval around the hole to solder the pin inserted into the hole 110, the joint quality and reliability of the product This is secured, and the range forming the minimum separation distance (h) between adjacent solder lands is smaller than that of the elliptical solder lands, so the possibility of short circuit between adjacent solder lands is also reduced.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific embodiments described above, and in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. Various modifications and implementations are possible by those skilled in the art, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

100: solder land 110: hole
120: imaginary rectangle 130: auxiliary circle
140: first line

Claims (15)

A polygonal solder land formed around a hole formed to insert a pin provided in an electric device,
The solder land starts from each of the left and right sides of a virtual rectangle concentric with the hole and formed outside the hole, and is concentric with the hole and larger than the virtual auxiliary circle formed inside the virtual rectangle. 4 first lines extending while touching;
two second lines departing from a point on the upper surface of the imaginary rectangle; and
A printed circuit board in which two third lines departing from a point on the lower surface of the imaginary rectangle form an octagon. According to claim 1,
The first line departs from one point on the left side and one point on the right side of the imaginary rectangle, two by two. According to claim 1,
The first line departs from the center of each of the left and right sides of the imaginary rectangle. delete delete According to claim 1,
The second line departs from the center of the upper surface,
The third line departs from the center of the lower surface,
The second line and the third line extend while contacting the virtual auxiliary circle or extend without contacting the printed circuit board. According to claim 1,
Each of the four first lines departs from two points on the left side and two points on the right side of the imaginary rectangle. According to claim 7,
Where each of the first lines departs from the left and right sides of the imaginary rectangle is a symmetrical position at the center of the left and right sides of the imaginary rectangle. delete delete delete delete According to claim 1,
The left and right sides of the imaginary rectangle are faces located between adjacent holes,
A straight line distance from the upper surface of the imaginary rectangle to the lower surface is longer than a straight line distance from the left side to the right side of the imaginary rectangle. According to claim 1,
The hole is formed with a minimum diameter necessary for inserting the pin of the electric element,
A distance between the hole and the virtual assistant is formed as a minimum distance for soldering the pin. According to claim 1,
The distance between the left and right sides of the virtual rectangle is formed by subtracting the minimum separation distance between adjacent solder lands from the distance between the centers of the adjacent holes.

Images