KR102493152B1 - Dummy Land and Printed Circuit Board Comprising The Same - Google Patents

Abstract

The present invention relates to a dummy land connected to a solder land.
According to the present embodiment, a dummy land is connected to a solder land formed at regular intervals around a hole into which a pin provided in an electric device is inserted, and includes at least a part of an unsoldered region therein.

Description

Dummy land and printed circuit board containing it {Dummy Land and Printed Circuit Board Comprising The Same}

The present invention relates to a printed circuit board having a mesh-shaped dummy land for preventing a lead short between pins included in a dual in-line package (DIP) component mounted on a printed circuit board during a soldering process.

In a process of producing a mass-produced printed circuit board, it is possible to form a connection between an electronic device and a board by wave soldering.

Wave soldering is mainly used for substrates with hole type parts. The circuit board is first preheated to a predetermined temperature and then heated to a predetermined temperature for soldering, and passes through a lead bath containing molten solder. In the holes of the circuit board, pins of the connector protrude downward from the bottom surface of the circuit board, and soldering is performed to the pins by a wave soldering method. In this case, since the soldering proceeds in the opposite direction to the direction in which the circuit board is moved by the conveyor, the holes in front of the pattern wired on the circuit board prevent the flow of lead in the opposite direction from the circuit board. A phenomenon occurs that does not proceed smoothly.

The conventional solder land solves this problem by using a dummy land connected to the solder land, but the shape of the conventional dummy land is a simple circular or polygonal shape without any markings on the inside of the lead in the dummy area such as a circle. There was a problem of short phenomenon caused by clumping and excessive soldering.

When such a short circuit occurs, manpower must be input after the soldering process to be accompanied by a process of removing the shorted part, resulting in a loss of manpower and time and a decrease in productivity.

It relates to the design of a mesh-shaped dummy land to prevent lead shorts between pins of DIP (Dual In-line Package) components mounted on a printed circuit board during the soldering process. to improve the short-circuit phenomenon caused by

The area of the dummy land is formed wider than the size of the connector pin to prevent shorting of multiple pins due to over-soldering in the process of transferring the lead to the pin. At this time, the dummy land has a mesh shape to maximize the spread of lead. Productivity and quality can be improved.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a dummy land according to an embodiment of the present invention is connected to a solder land formed at regular intervals around a hole formed to insert a pin provided in an electric device, and a portion of the inside is not soldered. include

The inside of the non-soldered regions may be uniformly arranged in a plurality of regions at regular intervals, and the regions to be soldered may form a mesh shape.

It may be connected to the solder land parallel to the direction of the soldering process.

The exterior includes upper and lower straight parts formed parallel to the direction of the soldering process, solder land connection parts connected to the solder land at one end of each of the upper and lower straight parts, and side parts connecting the other ends of the upper and lower straight parts separated from the solder land. A distance between the upper and lower straight portions is the same as a diameter of the solder land, and a distance between the solder land connection part and the side part is longer than the diameter of the solder land.

The side portion may be curved at a portion meeting the upper and lower straight portions.

In order to achieve the above object, a printed circuit board according to an embodiment of the present invention includes a plurality of holes formed parallel to the direction of the soldering process so that pins provided in electric devices are inserted; a plurality of solder lands formed at regular intervals around the plurality of holes; and a dummy land connected to a solder land disposed at the end of the plurality of solder lands in the direction in which the soldering process proceeds.

The dummy land may be formed at a rear portion of the solder land in a direction in which the soldering process proceeds.

In order to achieve the above object, a printed circuit board according to another embodiment of the present invention includes a plurality of holes formed perpendicular to the direction of the soldering process so that pins provided in electric devices are inserted; a plurality of solder lands formed at regular intervals around the plurality of holes; and a dummy land according to any one of claims 1 to 6 connected to at least one of the plurality of solder lands.

The dummy land may be formed at a rear portion of the solder land in a direction in which the soldering process proceeds.

In order to achieve the above object, a printed circuit board according to another embodiment of the present invention includes a plurality of holes formed perpendicular to the direction of the soldering process so that pins provided in electric devices are inserted; a plurality of solder lands formed at regular intervals around the plurality of holes; and a plurality of dummy lands according to any one of claims 1 to 6 connected to each of the plurality of solder lands in parallel with the direction of the soldering process, wherein each of the dummy lands is closest to the connected solder land. A dummy land connected to an adjacent solder land may be connected to the solder land in an opposite direction to each other.

Details of other embodiments are included in the detailed description and drawings.

According to the printed circuit board including the solder portion connected to the mesh-type dummy land of the present invention, one or more of the following effects are provided.

First, the dummy land is formed in a mesh shape to minimize elements that may cause short circuits during soldering of DIP components. It has the effect of improving the productivity and quality of the printed circuit board at the time of product sample or mass production, and reducing the time and cost invested in modification.

Second, there is an advantage of maximizing short circuit prevention between pins during a soldering wave process of a component on a printed circuit board due to manufacturing environment or soldering management deviation.

Third, the board on which the components are mounted is flowed into the soldering machine in the DIP direction to be soldered, and the pad near the start of soldering is opened in a vertical or horizontal direction so that the solder can be soldered according to the flow of lead. A dummy land to be formed is formed on the last pin. At this time, the dummy land has an effect of dispersing the agglomerated superwax by spreading over a wide area rather than in an agglomerated form according to the flow of lead.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a view for explaining a dummy land in the form of a net connected to a solder unit according to an embodiment of the present invention.
2 is a view for explaining a plurality of holes and solder lands formed parallel to a soldering process progress direction and a dummy land connected thereto according to an embodiment of the present invention.
FIG. 3 is a view for explaining a plurality of holes and solder lands formed perpendicular to a soldering process progress direction and a dummy land connected thereto according to an embodiment of the present invention.
FIG. 4 is a view for explaining a plurality of holes and solder lands formed perpendicularly to the direction in which a soldering process proceeds and a dummy land connected thereto according to another embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to completely inform the person who has the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

Hereinafter, the present invention will be described with reference to drawings for explaining a dummy land and a printed circuit board including the dummy land according to embodiments of the present invention.

1 is a view for explaining a dummy land in the form of a net connected to a solder unit according to an embodiment of the present invention.

Referring to FIG. 1, the dummy land 130 according to the present embodiment is connected to the solder land 120 formed at regular intervals around the hole 110 formed to insert the pin provided in the electric device, and the inside is soldered. Preferably, the non-soldering area 140 including a portion of the area not being soldered is uniformly arranged in a plurality of areas at regular intervals, and the area to be soldered may form a mesh shape.

The dummy land 130 is connected to the solder land 120 to spread lead that can be agglomerated around the hole 110 during the wave soldering process over a wide area of the dummy land to disperse the agglomerated lead. do.

The mesh-shaped dummy land 130 reduces the size of an area where molten lead can be clumped together and appropriately distributes the excess solder, thereby maximizing the spread of the accumulated lead compared to a general round dummy land having the same area size. Therefore, productivity and quality improvement can be expected.

The dummy lands 130 may have different intervals between the grids forming a net shape depending on each dummy land, but the intervals between the grids included in one dummy land are the same. It is preferable because it can appropriately disperse excess solder.

The dummy land 130 is connected to the solder land 120 parallel to the direction (a) of the soldering process, and is preferably formed at the rear of the solder land 120 in the direction (a) of the soldering process. In the soldering process, when a certain amount of lead is attached to the solder part 100, the remaining amount of lead is to be accumulated in the dummy land 130 leading in the direction of the soldering process.

In the specific form of the dummy land, the exterior of the dummy land 130 has upper and lower straight portions 132 and 134 formed parallel to the soldering process progress direction (a), and one end of each of the upper and lower straight portions is connected to the solder land 120. A solder land connection part 136 and a side part 138 connecting the other ends of the upper and lower straight parts 132 and 134 apart from the solder land 120 are included. The upper and lower straight parts 132 and 134 may include an upper straight part 132 and a lower straight part 134 . Each of the upper straight portion 132 and the lower straight portion 134 is connected to the solder land in parallel with the direction of the soldering process.

The solder land connection portion 136 may be a part of the solder land 120 forming a ring shape around the hole 110 or a part in contact with a part.

The distance between the upper and lower straight portions 132 and 134 is the same as the diameter of the solder land 120, and the distance between the solder land connection part 136 and the side part 138 is longer than the diameter of the solder land, preferably wider. It is preferable to increase the area of the dummy land 130 by forming it 1.5 times or more in length so that the lead spreads within the range. A distance between the upper straight portion 132 and the lower straight portion 134 may be the same as the diameter of the solder land 120 .

In the case of mounting a dual in-line package, which is a kind of integrated circuit package, on the printed circuit board 10, the dual in-line package is placed on both sides at regular intervals along both ends of the rectangular housing. Pins are attached in two rows, and these pins can be inserted into the holes 110 of the printed circuit board and soldered by a wave soldering process.

The pins of the dual serial package may be mounted on the printed circuit board parallel to or perpendicular to the direction of the soldering process of the printed circuit board. When the dual-serial package is mounted parallel to the direction (a) of the soldering process, the holes 110 and the solder lands 120 are arranged parallel to the direction of the soldering process on the printed circuit board 10 to correspond thereto.

In addition, when the pins of the dual serial package are mounted on the printed circuit board perpendicularly to the direction of the soldering process, the holes 110 and the solder lands 120 are vertically arranged on the printed circuit board 10 to correspond thereto.

If the arrangement of the holes 110 and the solder lands 120 is different with respect to the direction of the soldering process, the solder lands 120 and dummy lands 130 included therein may be differently connected. Referring to FIG. 4, a connection method of the dummy land 130 when the arrangement methods of the holes 110 and the solder lands 120 are different will be described.

2 is a view for explaining a plurality of holes and solder lands formed parallel to a soldering process progress direction and a dummy land connected thereto according to an embodiment of the present invention.

Referring to FIG. 2 , a printed circuit board 10 including a dummy land according to the present embodiment includes a plurality of holes 110 formed parallel to the direction of a soldering process through which pins provided in electric devices are inserted; a plurality of solder lands 120 formed at regular intervals around the plurality of holes; and a dummy land 130 connected to the solder land 120 disposed at the end of the plurality of solder lands 120 in the direction (a) of the soldering process.

As described above, the dummy land 130 includes at least some unsoldered regions 140 therein, and the unsoldered regions 140 are uniformly arranged at regular intervals in a plurality of regions, so that the soldered regions are It can form the shape of a mesh.

Connecting the solder land 120 and the dummy land 130 disposed at the end of the soldering process progress direction (a) is to apply a certain amount of lead to the first solder land 120a located at the beginning in the soldering process progress direction (a). When this is attached, the remaining amount of lead is transferred to the next second solder land 120b to attach a certain amount of lead, and in this way, the lead remaining in the last third solder land 120c is moved Since there is no point, they remain concentrated in the third solder land 120c.

In this case, the third solder land 120c is formed around the hole 110 disposed at the end of the soldering process progress direction (a) because excessive lead is attached to cause a short circuit between holes around the third solder land ( 120c), the remaining lead is dispersed to the dummy land 130 to prevent the occurrence of a short circuit.

The dummy land 130 is formed at the rear of the solder land 120 in the direction (a) of the soldering process, and lead accumulated in the third solder land 120c is naturally dispersed to the dummy land 130, and the dummy land 130 is formed in the form of a net and effectively disperses the agglomerated supernatant around the third solder land 120c.

FIG. 3 is a view for explaining a plurality of holes and solder lands formed perpendicular to a soldering process progress direction and a dummy land connected thereto according to an embodiment of the present invention. FIG. 4 is a view for explaining a plurality of holes and solder lands formed perpendicularly to the direction in which a soldering process proceeds and a dummy land connected thereto according to another embodiment of the present invention.

Referring to FIG. 3 , the printed circuit board including the dummy land according to the present embodiment includes a plurality of holes 110 formed perpendicular to the direction of the soldering process through which pins provided in electric devices are inserted; A plurality of solder lands 120 formed at regular intervals around the plurality of holes 110; and a dummy land 130 connected to at least one of the plurality of solder lands 120 .

As described above, the dummy land 130 includes at least some unsoldered regions 140 therein, and the unsoldered regions 140 are uniformly arranged at regular intervals in a plurality of regions, so that the soldered regions are It can form the shape of a mesh.

The plurality of solder lands 120 perpendicular to the soldering process progress direction (a) do not have additional solder lands 120 leading to the soldering process progress direction (a). Therefore, when a certain amount of lead is attached to the solder lands 120 according to the present embodiment, there is no proximity point where the remaining amount of lead is moved, so that the plurality of solder lands 120 are attached with an excess amount of lead to the surrounding solder lands. Since a short circuit may occur between the solder lands 120, it is preferable that one or more solder lands 120 be connected to the dummy land 130.

Referring to FIG. 4 , the printed circuit board 10 including the dummy land according to the present embodiment includes a plurality of holes 110 formed perpendicularly to the direction of the soldering process through which pins provided in electric devices are inserted; A plurality of solder lands 120 formed at regular intervals around the plurality of holes 110; and a plurality of dummy lands 130 connected in parallel to the soldering process progress direction (a) to each of the plurality of solder lands 120, and each of the dummy lands 130 is the solder closest to the connected solder land 120. It is preferable that the dummy land connected to the land is connected to the solder land in the opposite direction to each other.

As described above, the dummy land 130 includes at least some unsoldered regions 140 therein, and the unsoldered regions 140 are uniformly arranged at regular intervals in a plurality of regions, so that the soldered regions are It can form the shape of a mesh.

If all of the dummy lands 130 are connected to the rear part of the soldering process direction of the solder unit 100, each dummy land 130 may come into contact with an adjacent dummy land to cause a short circuit, so to prevent contact between the dummy lands. For this purpose, it is preferable that the dummy land is connected to the solder land 120 in the opposite direction to the dummy land 130 connected to the solder land 120 and the solder land 120 closest to each other.

Each of the plurality of solder lands 120 is connected to each of the plurality of dummy lands 130 to disperse excess lead accumulated in the solder lands 120, and the dummy lands 130 connected to the solder lands 120 are respectively Since the dummy land 130 is formed in the opposite direction to the dummy land 130 connected to the adjacent solder land 120, a short circuit due to contact between the dummy lands 130 can be prevented.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific embodiments described above, and in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. Various modifications and implementations are possible by those skilled in the art, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

10: printed circuit board 110: hole
120: Solder Land 130: Dummy Land
140: non-soldering area

Claims (11)

a plurality of holes formed to insert pins provided in the electric element;
a plurality of solder lands formed at regular intervals around the plurality of holes; and
A dummy land connected to at least one of the plurality of solder lands;
The dummy land,
An upper straight portion formed parallel to the direction of the soldering process;
a lower straight portion disposed parallel to the upper straight portion and formed parallel to the direction in which the soldering process proceeds;
A solder land connection portion connected to the solder land at one end of each of the upper straight portion and the lower straight portion;
A side part spaced apart from the solder land and connecting the other ends of the upper straight part and the lower straight part,
A region in which the soldering is not formed is formed between the upper straight portion and the lower straight portion. According to claim 1,
The printed circuit board of claim 1 , wherein the non-soldered regions of the inside are uniformly arranged in a plurality of regions at regular intervals, and the regions to be soldered form a mesh shape. According to claim 1,
The upper linear portion and the lower linear portion are connected to the solder land in parallel with the direction of the soldering process. According to claim 1,
A distance between the upper straight portion and the lower straight portion is equal to a diameter of the solder land. According to claim 4,
A distance between the solder land connection portion and the side portion is longer than a diameter of the solder land printed circuit board. According to claim 1,
A gap between the solder land connection portion and the side portion is formed longer than a diameter of the solder land, and the side portion is curved at a portion meeting the upper and lower straight portions,
A printed circuit board formed at a rear portion of the solder land in the direction of the soldering process. According to claim 1,
The dummy land is connected to a solder land disposed at the end of the plurality of solder lands in the direction of the soldering process. According to claim 7,
The dummy land is formed at a rear portion of the solder land in a direction in which the soldering process proceeds. According to claim 1,
The dummy land is connected to at least one of the plurality of solder lands. According to claim 9,
The dummy land is formed at a rear portion of the solder land in a direction in which the soldering process proceeds. According to claim 1,
The dummy land includes a plurality of dummy lands connected to each of the plurality of solder lands in parallel with the direction of the soldering process;
Each of the plurality of dummy lands is connected to the solder land in an opposite direction to a dummy land connected to the solder land closest to the connected solder land.

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