KR102462188B1 - Heater for heat treatment of substrate - Google Patents

Abstract

According to an embodiment of the present invention, a heater for heat treatment of a substrate includes: an upper plate having an inner space with an open lower portion; a plurality of partition walls installed to be spaced apart from each other in the lateral direction in the inner space and partitioning the inner space into a plurality of convection spaces; a heating element for generating the heat so that heat is transferred to the upper plate; and a lower plate disposed under the upper plate and coupled to the upper plate, and the heating element is fixed to the upper surface.

Description

Heater for substrate heat treatment

The present invention relates to a heater for substrate heat treatment that improves the temperature uniformity of the surface by forming an air layer between the upper plate and the lower plate and using the heat transfer method of air convection and radiation.

In general, since a flat panel display device has a multi-layered thin film and wiring pattern on a substrate, thin film deposition and photolithography processes are required, so a heat supply device for the substrate is important.

As the size of the substrate increases, not only the temperature uniformity of the heat supply device is difficult, but also the temperature deviation thereof is significantly reduced. For this reason, recently, a susceptor or flat plate heater, which has a structure in which a heat wire and an aluminum upper/lower plate with high heat conduction are in contact, is used.

However, in the above case, since the principle of heat conduction is used, the thickness of the upper and lower plates becomes thick, and thus there is a problem in that the weight and cost increase.

In addition, since high-level technology is required to weld the upper and lower plates and the hot wire, there is a problem of high cost and low production volume.

In addition, since the density of the heat transfer portion is large, there is a problem in that the heater capacity is increased.

Republic of Korea Patent Publication No. 10-1522561 (2015.05.26.) Republic of Korea Patent Publication No. 10-1464207 (2014.11.24.)

The problem to be solved by the present invention is to provide a heater for heat treatment of a substrate capable of reducing the weight of the product by thinning the thickness of the upper and lower plates.

Another problem to be solved by the present invention is to provide a heater for substrate heat treatment that can use a low-capacity heater because it is not necessary to increase the density of the heat transfer part.

Another problem to be solved by the present invention is to provide a heater for heat treatment of a substrate that is economical in manufacturing cost because there is no need to weld the upper, lower plate and hot wire.

Still other problems to be solved by the present invention will become more apparent from the following detailed description and drawings.

According to an embodiment of the present invention, the heater for heat treatment of a substrate, an upper plate having an open lower portion of the inner space; a plurality of partition walls installed to be spaced apart from each other in the lateral direction in the inner space and partitioning the inner space into a plurality of convection spaces; a heating element for generating the heat so that heat is transferred to the upper plate; and a lower plate disposed under the upper plate and coupled to the upper plate, and the heating element is fixed to the upper surface.

In this case, it is preferable that the distance between the plurality of partition walls adjacent to each other is shorter from the central portion of the upper plate to both ends of the upper plate.

In addition, the heating element is provided with a plurality of linear heating wires disposed below the convection space and spaced apart from each other, and the adjacent heating wires are electrically connected to each other.

In addition, the lower plate is formed through a plurality of ventilation holes in the vertical direction. Here, the ventilation hole is preferably disposed at a position on the lower plate corresponding to the partition wall.

In addition, the lower surface of the upper plate may be coated with a carbon composite.

On the other hand, the heater for heat treatment of the substrate, an intermediate plate disposed between the partition wall and the heating element, the upper surface is connected to the partition wall and the lower surface is connected to the heating element; further includes.

The heater for substrate heat treatment according to the present invention has the following effects.

First, there is an advantage in that the temperature uniformity of the surface can be improved by forming an air layer between the upper plate and the lower plate and using the heat transfer method of air convection and radiation.

Second, by using a structure in which the lower space of the upper plate is separated by a plurality of bulkheads, an air layer that acts as a buffer for heat transfer is inserted, and the reflected radiant heat of the bulkhead is reabsorbed to the upper plate. There are advantages such as low capacity and reduction in manufacturing cost.

1 is a view showing a heater for heat treatment of a substrate according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view of the heater for heat treatment of the substrate of FIG. 1 .
3 is a detailed configuration view of the upper plate and the bulkhead of FIG. 2 .
4 is a cross-sectional perspective view of the heater for heat treatment of the substrate of FIG. 1 .
FIG. 5 is a view showing an operating state of the heater for heat treatment of the substrate of FIG. 1 .
6 is an exploded perspective view of a heater for substrate heat treatment according to a second embodiment of the present invention.
7 is a cross-sectional view of the heater for substrate heat treatment of FIG. 6 .
8 is an exploded perspective view of a heater for substrate heat treatment according to a third embodiment of the present invention.
9 is a cross-sectional view of the heater for substrate heat treatment of FIG. 8 .
10 is an exploded perspective view of a heater for substrate heat treatment according to a fourth embodiment of the present invention.
11 is a cross-sectional view of the heater for substrate heat treatment of FIG. 10 .

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements.

Terms such as first, second, A, and B may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but it is understood that other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that this does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

1 is a view showing a heater for heat treatment of a substrate according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the heater for heat treatment of a substrate of FIG. 1, and FIG. 3 is a detailed configuration diagram of the upper plate and the partition wall of FIG. 4 is a cross-sectional perspective view of the heater for heat treatment of the substrate of FIG. 1 , and FIG. 5 is a view showing the operating state of the heater for heat treatment of the substrate of FIG. 1 .

1 to 5 , the heater 1 for heat treatment of a substrate according to the first embodiment of the present invention includes an upper plate 10 , a partition wall 20 , a heating element 30 and a lower plate 40 . .

The upper plate 10 can be placed on a substrate that requires heat treatment, and has an internal space S with an open lower portion in the form of a square plate. The lower surface of the upper plate 10 may be coated with a carbon composite having a high emissivity. By doing this, the reabsorption rate of radiant heat generated by the heating element 30 to be described later is reflected from the partition wall 20 and radiated to the upper plate 10 can be increased.

A plurality of partition walls 20 are installed to be spaced apart along the transverse direction of the upper plate (10). The plurality of partition walls 20 divide the inner space (S) of the upper plate (10) into a plurality of convection spaces (C). Accordingly, the plurality of partition walls 20 can adjust the volume of the air layer formed in the inner space S so that heat can be uniformly transferred to the upper plate 10 by convection. The separation distance between the partition walls 20 adjacent to each other may be adjusted. At this time, it is preferable that the separation distance between the partition walls 20 becomes shorter from the central portion of the upper plate 10 toward both ends.

The heating element 30 is disposed under the upper plate 10 to generate heat. The heating element 30 may be disposed below the convection space (C). The heating element 30 transfers the generated heat to the upper plate 10 by convection and radiation. The heating element 30 includes a plurality of linear heating wires 32 spaced apart from each other and a curved connection wire (not shown) connecting the adjacent heating wires 32 to each other. As the heating element 30 , a mineral insulated (MI) cable may be used, and the U-shaped heating wire 32 may be connected in a zigzag manner.

The lower plate 40 is disposed under the upper plate 10 in a rectangular shape and is coupled to the upper plate 40 . A heating element 30 is fixed to the upper surface of the lower plate 40 . The lower plate 40 is formed through a plurality of ventilation holes 42 in the vertical direction. Since the expanded air of the convection space (C) can escape through the ventilation hole (42), it is possible to prevent the volume expansion of the air layer of the convection space (C). The ventilation hole 42 is preferably formed at a position on the lower plate 40 corresponding to the partition wall 20 .

6 is an exploded perspective view of a heater for heat treatment of a substrate according to a second embodiment of the present invention, and FIG. 7 is a cross-sectional view of the heater for heat treatment of a substrate of FIG. 6 .

6 and 7, the upper plate 10' of the heater for substrate heat treatment according to the second embodiment is coupled to the upper surface of the plurality of partition walls 20' to the lower surface. The lower surfaces of the plurality of partition walls 20 ′ are coupled to the upper surface of the upper plate 10 . Therefore, the convection space (C') may form a plurality of air layer structures vertically together with the convection space (C).

8 is an exploded perspective view of a heater for heat treatment of a substrate according to a third embodiment of the present invention, and FIG. 9 is a cross-sectional view of the heater for heat treatment of a substrate of FIG. 8 .

8 and 9 , the intermediate plate 50 of the heater 3 for heat treatment of a substrate according to the third embodiment is inserted and installed between the partition wall 20 and the heating element 30 in a rectangular plate shape. The intermediate plate 50 can form a more closed convection space C together with the partition wall 20 and the upper plate 10 .

10 is an exploded perspective view of a heater for heat treatment of a substrate according to a fourth embodiment of the present invention, and FIG. 11 is a cross-sectional view of the heater for heat treatment of a substrate of FIG. 10 .

10 and 11, the heater 4 for substrate heat treatment according to the fourth embodiment of the present invention is a plurality of the upper surface of the upper plate 10 of the substrate heat treatment heater 3 according to the third embodiment. The lower surface of the partition wall 20' is coupled. The upper surface of the partition wall 20' is coupled to the lower surface of the upper plate 10'. Accordingly, the convection space (C') may form a vertically two-layered air layer structure together with the convection space (C).

As a result, the heater for substrate heat treatment according to the present invention forms an air layer between the upper plate and the lower plate to improve the temperature uniformity of the surface by using the heat transfer method of air convection and radiation, and the lower space of the upper plate Using a structure separated by a plurality of bulkheads, an air layer acting as a buffer for heat transfer is inserted, and the reflected radiant heat of the bulkhead is reabsorbed into the upper plate. has the effect of

Although the present invention has been described in detail through preferred embodiments, other embodiments are also possible. Therefore, the spirit and scope of the claims described below are not limited to the preferred embodiments.

1,2,3,4: Heater for substrate heat treatment
10: upper plate 20: bulkhead
22: carbon composite 30: heating element
32: heated wire 40: lower plate
42: ventilation hole 50: middle plate
C: convection space

Claims (7)

an upper plate having an open inner space and an inner surface coated with a carbon composite;
a plurality of partition walls installed to be spaced apart from each other in the transverse direction in the inner space and partitioning the inner space into a plurality of convection spaces;
A lower plate disposed under the upper plate and coupled to the upper plate, the upper surface of which is spaced apart from the lower surface of the partition wall and having a plurality of ventilation holes penetrated in the vertical direction at a position corresponding to the partition wall; And
It is disposed between the upper plate and the lower plate and is fixed to the upper surface of the lower plate, and a plurality of straight hot wires for generating the heat so that heat is transferred to the convection space, and a U-shaped connecting the adjacent hot wires A heating element having a connection line; including,
A first spacing distance between the plurality of partition walls adjacent to each other and a second spacing distance between the adjacent heating wires are shorter from the center portion to both ends of the upper plate, the heater for substrate heat treatment. delete The method of claim 1,
The heating wires adjacent to each other are electrically connected to each other, a heater for substrate heat treatment. delete delete delete The method of claim 1,
The heater for heat treatment of the substrate,
and an intermediate plate disposed between the partition wall and the heating element, an upper surface connected to the partition wall and a lower surface connected to the heating element.

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