KR102446068B1 - Method for manufacturing display device using semiconductor light emitting device - Google Patents

Abstract

The present invention relates to a method of manufacturing a display device, and more particularly, to a method of manufacturing a display device using a semiconductor light emitting device. A method of manufacturing a display device according to the present invention comprises the steps of sequentially growing a first conductive semiconductor layer, an activation layer, and a second conductive semiconductor layer on a substrate, and etching a plurality of semiconductor light emitting devices on the substrate. and attaching the plurality of semiconductor light emitting devices to a wiring board using an anisotropic conductive film. The anisotropic conductive film is formed by mixing an anisotropic conductive medium with a liquid material to form a mixed solution, rolling the mixed solution using a roller so that the mixed solution forms a film, and using a magnetic field Controlling the arrangement of the anisotropic conductive medium in the film, and passing the film through a drying device may be prepared through the steps of drying the film.

Description

Method for manufacturing a display device using a semiconductor light emitting device

The present invention relates to a method of manufacturing a display device, and more particularly, to a method of manufacturing a flexible display device using a semiconductor light emitting device.

Recently, in the field of display technology, display devices having excellent characteristics, such as thin and flexible, have been developed. On the other hand, currently commercialized main displays are represented by LCD (Liguid Crystal Display) and AMOLED (Active Matrix Organic Light Emitting Diodes).

However, in the case of LCD, there are problems in that the response time is not fast and it is difficult to implement flexibility, and in the case of AMOLED, the lifespan is short, the mass production yield is not good, and there are weaknesses in that the degree of flexibility is weak.

Meanwhile, a light emitting diode (Light Emitting Diode: LED) is a well-known semiconductor light emitting device that converts electric current into light. It has been used as a light source for display images of electronic devices including communication devices. Accordingly, a method for solving the above problems by implementing a flexible display using the semiconductor light emitting device may be proposed.

In the flexible display using the semiconductor light emitting device, an anisotropic conductive film may be used when the semiconductor light emitting device and the electrode wiring are connected. An anisotropic conductive medium capable of conducting a conductive function is added to the anisotropic conductive film, and when the distribution of particles of the anisotropic conductive medium is non-uniform, a problem of reduced energization reliability may occur. For this example, a short circuit between electrodes may occur in a portion in which the anisotropic conductive medium is abundantly distributed, and connection resistance may increase in a portion in which the anisotropic conductive medium is insufficient. In order to solve this problem, the distribution of particles should be uniform, and thus, the present invention proposes a mechanism for uniform distribution of particles in the anisotropic conductive film.

SUMMARY OF THE INVENTION One object of the present invention is to provide a display device having energization reliability when a semiconductor light emitting device and an electrode wiring are connected.

Another object of the present invention is to provide a conductive layer adhesive layer having a uniform particle distribution and a method for manufacturing the same.

In the method for manufacturing a display device according to the present invention, a plurality of semiconductor light emitting devices are attached to a wiring board by using an anisotropic conductive film, and the method for manufacturing the anisotropic conductive film includes applying an anisotropic conductive medium to a liquid material. mixing to form a mixed solution, rolling the mixed solution using a roller so that the mixed solution forms a film, adjusting the arrangement of the anisotropic conductive medium in the film using a magnetic field, and the film and drying the film by passing it through a drying device.

In an embodiment, the magnetic field may be applied to the film by one or more electromagnets disposed between the roller and the drying device. The electromagnets are disposed to face each other from both sides based on the film, and have the same polarity.

In an embodiment, in the adjusting step, the arrangement of the anisotropic conductive medium may be adjusted by varying the strength of the magnetic field according to the physical properties or viscosity of the liquid material.

In an embodiment, by coating the dried film with an adhesive film that does not contain the anisotropic conductive medium and has adhesive force, the anisotropic conductive film may have multiple layers.

In the display device according to the present invention, when the anisotropic conductive medium is mixed with the conductive adhesive layer using only mechanical mixing, it is possible to solve the problem that the distribution becomes non-uniform. For example, in the anisotropic conductive film, it is possible to control the distribution or arrangement of the anisotropic conductive medium by using a magnetic field.

In addition, according to the present invention, since the distribution of the anisotropic conductive medium becomes uniform, it is possible to secure the improvement of the conventionally occurring short circuit between the electrodes and the stabilization of the connection resistance.

In addition, in the present invention, as the white pigment is added to the conductive adhesive layer, the light emitted from the semiconductor light emitting devices is guided upward. In this case, as the conductive adhesive layer includes a plurality of layers having different content of white pigment, a connection structure capable of maintaining adhesive strength while increasing reflectivity is implemented.

In addition, in the present invention, by adding a white pigment to only some of the layers of the conductive adhesive layer, the luminance of the display device can be improved despite a simple manufacturing method. In addition, by changing the material for the plurality of ladles, a conductive adhesive layer having both fluidity and viscosity required in relation to the surrounding structures may be implemented.

1 is a conceptual diagram illustrating an embodiment of a display device using a semiconductor light emitting device of the present invention.
FIG. 2 is a partially enlarged view of part A of FIG. 1 , and FIGS. 3A and 3B are cross-sectional views taken along lines BB and CC of FIG. 2 .
4 is a conceptual diagram illustrating the flip-chip type semiconductor light emitting device of FIG. 3 .
5A to 5C are conceptual views illustrating various forms of implementing colors in relation to a flip-chip type semiconductor light emitting device.
6 is a cross-sectional view illustrating a method of manufacturing a display device using a semiconductor light emitting device of the present invention.
7 is a perspective view illustrating another embodiment of a display device using the semiconductor light emitting device of the present invention.
FIG. 8 is a cross-sectional view taken along line DD of FIG. 7 ;
9 is a conceptual diagram illustrating the vertical semiconductor light emitting device of FIG. 8 .
10 is an enlarged view of portion A of FIG. 1 for explaining another embodiment of the present invention to which a semiconductor light emitting device of a new structure is applied.
11A is a cross-sectional view taken along line EE of FIG. 10 .
11B is a cross-sectional view taken along line FF of FIG. 11 .
12 is a conceptual diagram illustrating the flip chip type semiconductor light emitting device of FIG. 11A .
13 is an enlarged view of part A of FIG. 1 for explaining another embodiment of the present invention.
14 is a cross-sectional view taken along GG of FIG. 13 , and FIG. 15 is a cross-sectional view taken along HH of FIG. 13 .
16 is a conceptual diagram illustrating a method of manufacturing an embodiment of the anisotropic conductive film of FIG. 13 .
17 is a cross-sectional view for explaining another embodiment of the present invention.

Hereinafter, the embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and redundant description thereof will be omitted. The suffixes "module" and "part" for components used in the following description are given or mixed in consideration of only the ease of writing the specification, and do not have distinct meanings or roles by themselves. In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, it should be noted that the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and should not be construed as limiting the technical spirit disclosed in the present specification by the accompanying drawings.

It is also understood that when an element, such as a layer, region, or substrate, is referred to as being “on” another component, it may be directly on the other element or intervening elements in between. There will be.

The display device described in this specification includes a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation system, and a slate PC. , Tablet PC, Ultra Book, digital TV, desktop computer, and the like. However, it will be readily apparent to those skilled in the art that the configuration according to the embodiment described herein may be applied to a display capable device even in a new product form to be developed later.

1 is a conceptual diagram illustrating an embodiment of a display device using a semiconductor light emitting device of the present invention.

As illustrated, information processed by the control unit of the display apparatus 100 may be displayed using a flexible display.

The flexible display includes a display that can be bent, bent, twisted, folded, or rolled by an external force. For example, the flexible display may be a display manufactured on a thin and flexible substrate that can be bent, bent, folded, or rolled like paper while maintaining the display characteristics of a conventional flat panel display.

In a state in which the flexible display is not bent (eg, a state having an infinite radius of curvature, hereinafter referred to as a first state), the display area of the flexible display becomes a flat surface. In a state bent by an external force in the first state (for example, a state having a finite radius of curvature, hereinafter referred to as a second state), the display area may be a curved surface. As illustrated, the information displayed in the second state may be visual information output on the curved surface. Such visual information is implemented by independently controlling the light emission of sub-pixels arranged in a matrix form. The unit pixel means a minimum unit for realizing one color.

The unit pixel of the flexible display may be implemented by a semiconductor light emitting device. In the present invention, a light emitting diode (LED) is exemplified as a type of a semiconductor light emitting device that converts current into light. The light emitting diode is formed in a small size, so that it can serve as a unit pixel even in the second state.

Hereinafter, a flexible display implemented using the light emitting diode will be described in more detail with reference to the drawings.

2 is a partially enlarged view of part A of FIG. 1, FIGS. 3A and 3B are cross-sectional views taken along lines B-B and C-C of FIG. 2, and FIG. 4 is a conceptual diagram illustrating the flip-chip type semiconductor light emitting device of FIG. 3A, 5A to 5C are conceptual views illustrating various forms of implementing colors in relation to a flip-chip type semiconductor light emitting device.

Referring to FIGS. 2, 3A and 3B , the display device 100 using a passive matrix (PM) type semiconductor light emitting device is exemplified as the display device 100 using a semiconductor light emitting device. However, the examples described below are also applicable to an active matrix (AM) type semiconductor light emitting device.

The display device 100 includes a substrate 110 , a first electrode 120 , a conductive adhesive layer 130 , a second electrode 140 , and a plurality of semiconductor light emitting devices 150 .

The substrate 110 may be a flexible substrate. For example, in order to implement a flexible display device, the substrate 110 may include glass or polyimide (PI). In addition, any material such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET) may be used as long as it has insulating properties and is flexible. In addition, the substrate 110 may be made of either a transparent material or an opaque material.

The substrate 110 may be a wiring substrate on which the first electrode 120 is disposed, and thus the first electrode 120 may be located on the substrate 110 .

As shown, the insulating layer 160 may be disposed on the substrate 110 on which the first electrode 120 is positioned, and the auxiliary electrode 170 may be positioned on the insulating layer 160 . In this case, a state in which the insulating layer 160 is laminated on the substrate 110 may be a single wiring board. More specifically, the insulating layer 160 is made of an insulating and flexible material such as polyimide (PI, Polyimide), PET, or PEN, and may be integrally formed with the substrate 110 to form a single substrate.

The auxiliary electrode 170 is an electrode that electrically connects the first electrode 120 and the semiconductor light emitting device 150 , is located on the insulating layer 160 , and is disposed to correspond to the position of the first electrode 120 . For example, the auxiliary electrode 170 may have a dot shape and may be electrically connected to the first electrode 120 by an electrode hole 171 penetrating the insulating layer 160 . The electrode hole 171 may be formed by filling the via hole with a conductive material.

Referring to the drawings, the conductive adhesive layer 130 is formed on one surface of the insulating layer 160 , but the present invention is not necessarily limited thereto. For example, a layer performing a specific function is formed between the insulating layer 160 and the conductive adhesive layer 130 , or the conductive adhesive layer 130 is disposed on the substrate 110 without the insulating layer 160 . is also possible In a structure in which the conductive adhesive layer 130 is disposed on the substrate 110 , the conductive adhesive layer 130 may serve as an insulating layer.

The conductive adhesive layer 130 may be a layer having adhesiveness and conductivity, and for this purpose, a material having conductivity and a material having adhesiveness may be mixed in the conductive adhesive layer 130 . In addition, the conductive adhesive layer 130 has ductility, thereby enabling a flexible function in the display device.

For this example, the conductive adhesive layer 130 may be an anisotropic conductive film (ACF), an anisotropic conductive paste, a solution containing conductive particles, or the like. The conductive adhesive layer 130 may be configured as a layer that allows electrical interconnection in the Z direction passing through the thickness, but has electrical insulation in the horizontal X-Y direction. Accordingly, the conductive adhesive layer 130 may be referred to as a Z-axis conductive layer (hereinafter, referred to as a 'conductive adhesive layer').

The anisotropic conductive film is a film in which an anisotropic conductive medium is mixed with an insulating base member, and when heat and pressure are applied, only a specific portion has conductivity by the anisotropic conductive medium. Hereinafter, it will be described that heat and pressure are applied to the anisotropic conductive film, but other methods are also possible in order for the anisotropic conductive film to have partial conductivity. In this method, for example, only one of the heat and pressure may be applied or UV curing may be performed.

In addition, the anisotropic conductive medium may be, for example, conductive balls or conductive particles. As shown, in this example, the anisotropic conductive film is a film in which conductive balls are mixed with an insulating base member, and when heat and pressure are applied, only a specific portion has conductivity by the conductive balls. The anisotropic conductive film may be in a state in which the core of the conductive material contains a plurality of particles covered by an insulating film made of a polymer material. . At this time, the shape of the core may be deformed to form a layer in contact with each other in the thickness direction of the film. As a more specific example, heat and pressure are applied as a whole to the anisotropic conductive film, and electrical connection in the Z-axis direction is partially formed due to a height difference of an object adhered by the anisotropic conductive film.

As another example, the anisotropic conductive film may be in a state in which an insulating core contains a plurality of particles coated with a conductive material. In this case, the conductive material is deformed (pressed) in the portion to which heat and pressure are applied, so that it has conductivity in the thickness direction of the film. As another example, a form in which the conductive material penetrates the insulating base member in the Z-axis direction to have conductivity in the thickness direction of the film is also possible. In this case, the conductive material may have a pointed end.

As shown, the anisotropic conductive film may be a fixed array anisotropic conductive film (ACF) in which conductive balls are inserted into one surface of the insulating base member. More specifically, the insulating base member is formed of a material having an adhesive property, and the conductive balls are intensively disposed on the bottom of the insulating base member, and when heat and pressure are applied from the base member, it is deformed together with the conductive balls. It has conductivity in the vertical direction.

However, the present invention is not necessarily limited thereto, and the anisotropic conductive film has a form in which conductive balls are randomly mixed in an insulating base member, or is composed of a plurality of layers and conductive balls are arranged on one layer (double- ACF) are all possible.

The anisotropic conductive paste is a combination of a paste and a conductive ball, and may be a paste in which a conductive ball is mixed with an insulating and adhesive base material. Also, a solution containing conductive particles may be a solution containing conductive particles or nano particles.

Referring back to the drawing, the second electrode 140 is spaced apart from the auxiliary electrode 170 and is positioned on the insulating layer 160 . That is, the conductive adhesive layer 130 is disposed on the insulating layer 160 in which the auxiliary electrode 170 and the second electrode 140 are located.

After the conductive adhesive layer 130 is formed in a state in which the auxiliary electrode 170 and the second electrode 140 are positioned on the insulating layer 160 , the semiconductor light emitting device 150 is connected in a flip-chip form by applying heat and pressure. In this case, the semiconductor light emitting device 150 is electrically connected to the first electrode 120 and the second electrode 140 .

Referring to FIG. 4 , the semiconductor light emitting device may be a flip chip type light emitting device.

For example, the semiconductor light emitting device includes a p-type electrode 156 , a p-type semiconductor layer 155 on which the p-type electrode 156 is formed, an active layer 154 formed on the p-type semiconductor layer 155 , an active layer ( It includes an n-type semiconductor layer 153 formed on the 154 , and an n-type electrode 152 spaced apart from the p-type electrode 156 in the horizontal direction on the n-type semiconductor layer 153 . In this case, the p-type electrode 156 may be electrically connected to the auxiliary electrode 170 and the conductive adhesive layer 130 , and the n-type electrode 152 may be electrically connected to the second electrode 140 .

Referring back to FIGS. 2 , 3A and 3B , the auxiliary electrode 170 is formed to be elongated in one direction, so that one auxiliary electrode can be electrically connected to the plurality of semiconductor light emitting devices 150 . For example, p-type electrodes of left and right semiconductor light emitting devices with respect to the auxiliary electrode may be electrically connected to one auxiliary electrode.

More specifically, the semiconductor light emitting device 150 is press-fitted into the conductive adhesive layer 130 by heat and pressure, and through this, between the p-type electrode 156 and the auxiliary electrode 170 of the semiconductor light emitting device 150 . Only a portion and a portion between the n-type electrode 152 and the second electrode 140 of the semiconductor light emitting device 150 have conductivity, and there is no press-fitting of the semiconductor light emitting device in the remaining portion, so that the semiconductor light emitting device does not have conductivity. As described above, the conductive adhesive layer 130 not only interconnects the semiconductor light emitting device 150 and the auxiliary electrode 170 and between the semiconductor light emitting device 150 and the second electrode 140 , but also forms an electrical connection.

In addition, the plurality of semiconductor light emitting devices 150 constitute a light emitting device array, and the phosphor layer 180 is formed on the light emitting device array.

The light emitting device array may include a plurality of semiconductor light emitting devices having different luminance values. Each semiconductor light emitting device 150 constitutes a unit pixel and is electrically connected to the first electrode 120 . For example, there may be a plurality of first electrodes 120 , the semiconductor light emitting devices may be arranged in, for example, several columns, and the semiconductor light emitting devices in each column may be electrically connected to any one of the plurality of first electrodes.

In addition, since the semiconductor light emitting devices are connected in a flip-chip form, semiconductor light emitting devices grown on a transparent dielectric substrate can be used. In addition, the semiconductor light emitting devices may be, for example, nitride semiconductor light emitting devices. Since the semiconductor light emitting device 150 has excellent luminance, individual unit pixels can be configured even with a small size.

As illustrated, a barrier rib 190 may be formed between the semiconductor light emitting devices 150 . In this case, the partition wall 190 may serve to separate individual unit pixels from each other, and may be integrally formed with the conductive adhesive layer 130 . For example, by inserting the semiconductor light emitting device 150 into the anisotropic conductive film, the base member of the anisotropic conductive film may form the partition wall.

In addition, when the base member of the anisotropic conductive film is black, the barrier rib 190 may have reflective properties and increase contrast even without a separate black insulator.

As another example, a reflective barrier rib may be separately provided as the barrier rib 190 . In this case, the barrier rib 190 may include a black or white insulator depending on the purpose of the display device. When the barrier ribs made of a white insulator are used, reflectivity may be increased, and when the barrier ribs made of a black insulator are used, it is possible to have reflective properties and increase contrast.

The phosphor layer 180 may be located on the outer surface of the semiconductor light emitting device 150 . For example, the semiconductor light emitting device 150 is a blue semiconductor light emitting device that emits blue (B) light, and the phosphor layer 180 performs a function of converting the blue (B) light into a color of a unit pixel. The phosphor layer 180 may be a red phosphor 181 or a green phosphor 182 constituting an individual pixel.

That is, a red phosphor 181 capable of converting blue light into red (R) light may be stacked on the blue semiconductor light emitting device 151 at a position forming a unit pixel of red color, and a position constituting a unit pixel of green color In , a green phosphor 182 capable of converting blue light into green (G) light may be stacked on the blue semiconductor light emitting device 151 . In addition, only the blue semiconductor light emitting device 151 may be used alone in the portion constituting the blue unit pixel. In this case, unit pixels of red (R), green (G), and blue (B) may form one pixel. More specifically, a phosphor of one color may be stacked along each line of the first electrode 120 . Accordingly, one line in the first electrode 120 may be an electrode for controlling one color. That is, red (R), green (G), and blue (B) may be sequentially disposed along the second electrode 140 , thereby realizing a unit pixel.

However, the present invention is not necessarily limited thereto, and instead of the phosphor, the semiconductor light emitting device 150 and the quantum dot (QD) are combined to implement unit pixels of red (R), green (G), and blue (B). have.

In addition, a black matrix 191 may be disposed between each of the phosphor layers to improve contrast. That is, the black matrix 191 may improve contrast of light and dark.

However, the present invention is not necessarily limited thereto, and other structures for implementing blue, red, and green colors may be applied.

Referring to FIG. 5A , each semiconductor light emitting device 150 mainly uses gallium nitride (GaN), and indium (In) and/or aluminum (Al) are added together to emit a variety of light including blue light. It can be implemented as a device.

In this case, the semiconductor light emitting device 150 may be a red, green, and blue semiconductor light emitting device to form a sub-pixel, respectively. For example, red, green, and blue semiconductor light emitting devices R, G, and B are alternately disposed, and unit pixels of red, green, and blue are formed by the red, green and blue semiconductor light emitting devices. The pixels form one pixel, through which a full-color display can be realized.

Referring to FIG. 5B , the semiconductor light emitting device may include a white light emitting device W in which a yellow phosphor layer is provided for each device. In this case, a red phosphor layer 181 , a green phosphor layer 182 , and a blue phosphor layer 183 may be provided on the white light emitting device W to form a unit pixel. In addition, a unit pixel may be formed on the white light emitting device W by using a color filter in which red, green, and blue are repeated.

Referring to FIG. 5C , a structure in which a red phosphor layer 181 , a green phosphor layer 182 , and a blue phosphor layer 183 are provided on the ultraviolet light emitting device UV is also possible. In this way, the semiconductor light emitting device can be used in the entire range of visible light as well as ultraviolet (UV) light, and can be extended to the form of a semiconductor light emitting device in which ultraviolet (UV) can be used as an excitation source of the upper phosphor. .

Referring back to this example, the semiconductor light emitting device 150 is positioned on the conductive adhesive layer 130 to constitute a unit pixel in the display device. Since the semiconductor light emitting device 150 has excellent luminance, individual unit pixels can be configured even with a small size. The size of the individual semiconductor light emitting device 150 may have a side length of 80 μm or less, and may be a rectangular or square device. In the case of a rectangular shape, the size may be 20X80㎛ or less.

In addition, even when a square semiconductor light emitting device 150 having a side length of 10 μm is used as a unit pixel, sufficient brightness to form a display device appears. Accordingly, for example, when the unit pixel is a rectangular pixel having one side of 600 μm and the other side of 300 μm, the distance between the semiconductor light emitting devices is relatively large. Accordingly, in this case, it is possible to implement a flexible display device having HD image quality.

The display device using the semiconductor light emitting device described above can be manufactured by a new type of manufacturing method. Hereinafter, the manufacturing method will be described with reference to FIG. 6 .

6 is a cross-sectional view illustrating a method of manufacturing a display device using a semiconductor light emitting device of the present invention.

Referring to this figure, first, a conductive adhesive layer 130 is formed on the insulating layer 160 on which the auxiliary electrode 170 and the second electrode 140 are positioned. An insulating layer 160 is laminated on the first substrate 110 to form one substrate (or wiring board), and the wiring substrate includes a first electrode 120 , an auxiliary electrode 170 , and a second electrode 140 . this is placed In this case, the first electrode 120 and the second electrode 140 may be disposed in a mutually orthogonal direction. In addition, in order to implement a flexible display device, the first substrate 110 and the insulating layer 160 may each include glass or polyimide (PI).

The conductive adhesive layer 130 may be implemented by, for example, an anisotropic conductive film, and for this purpose, the anisotropic conductive film may be applied to the substrate on which the insulating layer 160 is positioned.

Next, the second substrate 112 corresponding to the positions of the auxiliary electrode 170 and the second electrodes 140 and on which the plurality of semiconductor light emitting devices 150 constituting individual pixels are located is formed with the semiconductor light emitting device 150 . ) is disposed to face the auxiliary electrode 170 and the second electrode 140 .

In this case, the second substrate 112 is a growth substrate on which the semiconductor light emitting device 150 is grown, and may be a sapphire substrate or a silicon substrate.

When the semiconductor light emitting device is formed in a wafer unit, the semiconductor light emitting device can be effectively used in a display device by having an interval and a size that can form a display device.

Then, the wiring board and the second board 112 are thermocompression-bonded. For example, the wiring substrate and the second substrate 112 may be thermocompression-bonded by applying an ACF press head. The wiring substrate and the second substrate 112 are bonded by the thermocompression bonding. Due to the properties of the anisotropic conductive film having conductivity by thermocompression bonding, only a portion between the semiconductor light emitting device 150 and the auxiliary electrode 170 and the second electrode 140 has conductivity, and through this, the electrodes and the semiconductor light emission. The device 150 may be electrically connected. At this time, the semiconductor light emitting device 150 is inserted into the anisotropic conductive film, through which a barrier rib may be formed between the semiconductor light emitting devices 150 .

Then, the second substrate 112 is removed. For example, the second substrate 112 may be removed using a laser lift-off (LLO) method or a chemical lift-off (CLO) method.

Finally, the second substrate 112 is removed to expose the semiconductor light emitting devices 150 to the outside. If necessary, a transparent insulating layer (not shown) may be formed by coating silicon oxide (SiOx) or the like on the wiring board to which the semiconductor light emitting device 150 is coupled.

In addition, the method may further include forming a phosphor layer on one surface of the semiconductor light emitting device 150 . For example, the semiconductor light emitting device 150 is a blue semiconductor light emitting device that emits blue (B) light, and a red or green phosphor for converting the blue (B) light into the color of a unit pixel is the blue semiconductor light emitting device. A layer may be formed on one surface of the device.

The manufacturing method or structure of the display device using the semiconductor light emitting device described above may be modified in various forms. As an example, a vertical semiconductor light emitting device may also be applied to the display device described above. Hereinafter, a vertical structure will be described with reference to FIGS. 5 and 6 .

In addition, in the modification or embodiment described below, the same or similar reference numerals are assigned to the same or similar components as those of the preceding example, and the description is replaced with the first description.

7 is a perspective view showing another embodiment of a display device using the semiconductor light emitting device of the present invention, FIG. 8 is a cross-sectional view taken along line D-D of FIG. 7 , and FIG. 9 is a conceptual view showing the vertical semiconductor light emitting device of FIG. 8 to be.

Referring to the drawings, the display device may be a display device using a passive matrix (PM) type vertical semiconductor light emitting device.

The display device includes a substrate 210 , a first electrode 220 , a conductive adhesive layer 230 , a second electrode 240 , and a plurality of semiconductor light emitting devices 250 .

The substrate 210 is a wiring substrate on which the first electrode 220 is disposed, and may include polyimide (PI) to implement a flexible display device. In addition, any material that has insulating properties and is flexible may be used.

The first electrode 220 is positioned on the substrate 210 and may be formed as a bar-shaped electrode long in one direction. The first electrode 220 may serve as a data electrode.

The conductive adhesive layer 230 is formed on the substrate 210 on which the first electrode 220 is positioned. Like a display device to which a flip chip type light emitting device is applied, the conductive adhesive layer 230 may include an anisotropic conductive film (ACF), an anisotropic conductive paste, and a solution containing conductive particles. ), and so on. However, in this embodiment as well, a case in which the conductive adhesive layer 230 is implemented by an anisotropic conductive film is exemplified.

After the anisotropic conductive film is positioned on the substrate 210 in a state where the first electrode 220 is positioned, when the semiconductor light emitting device 250 is connected by applying heat and pressure, the semiconductor light emitting device 250 becomes the first It is electrically connected to the electrode 220 . In this case, the semiconductor light emitting device 250 is preferably disposed on the first electrode 220 .

The electrical connection is created because, as described above, the anisotropic conductive film partially has conductivity in the thickness direction when heat and pressure are applied thereto. Accordingly, the anisotropic conductive film is divided into a conductive portion 231 and a non-conductive portion 232 in the thickness direction.

In addition, since the anisotropic conductive film contains an adhesive component, the conductive adhesive layer 230 implements not only electrical connection but also mechanical bonding between the semiconductor light emitting device 250 and the first electrode 220 .

As described above, the semiconductor light emitting device 250 is positioned on the conductive adhesive layer 230 and constitutes individual pixels in the display device through this. Since the semiconductor light emitting device 250 has excellent luminance, individual unit pixels can be configured even with a small size. The size of such an individual semiconductor light emitting device 250 may have a side length of 80 μm or less, and may be a rectangular or square device. In the case of a rectangular shape, the size may be 20X80㎛ or less.

The semiconductor light emitting device 250 may have a vertical structure.

A plurality of second electrodes 240 disposed in a direction crossing the longitudinal direction of the first electrode 220 and electrically connected to the vertical semiconductor light emitting device 250 are positioned between the vertical semiconductor light emitting devices.

Referring to FIG. 9 , the vertical semiconductor light emitting device includes a p-type electrode 256 , a p-type semiconductor layer 255 formed on the p-type electrode 256 , and an active layer 254 formed on the p-type semiconductor layer 255 . ), an n-type semiconductor layer 253 formed on the active layer 254 , and an n-type electrode 252 formed on the n-type semiconductor layer 253 . In this case, the lower p-type electrode 256 may be electrically connected to the first electrode 220 and the conductive adhesive layer 230 , and the upper n-type electrode 252 may be a second electrode 240 to be described later. ) can be electrically connected to. The vertical semiconductor light emitting device 250 has a great advantage in that it can reduce the chip size because electrodes can be arranged up and down.

Referring back to FIG. 8 , a phosphor layer 280 may be formed on one surface of the semiconductor light emitting device 250 . For example, the semiconductor light emitting device 250 is a blue semiconductor light emitting device 251 that emits blue (B) light, and a phosphor layer 280 for converting the blue (B) light into the color of a unit pixel is provided. can be In this case, the phosphor layer 280 may be a red phosphor 281 and a green phosphor 282 constituting individual pixels.

That is, a red phosphor 281 capable of converting blue light into red (R) light may be stacked on the blue semiconductor light emitting device 251 at a position constituting a unit pixel of red color, and a position constituting a unit pixel of green color In , a green phosphor 282 capable of converting blue light into green (G) light may be stacked on the blue semiconductor light emitting device 251 . In addition, only the blue semiconductor light emitting device 251 may be used alone in the portion constituting the blue unit pixel. In this case, unit pixels of red (R), green (G), and blue (B) may form one pixel.

However, the present invention is not necessarily limited thereto, and as described above in a display device to which a flip chip type light emitting device is applied, other structures for implementing blue, red, and green colors may be applied.

Referring back to this embodiment, the second electrode 240 is positioned between the semiconductor light emitting devices 250 and is electrically connected to the semiconductor light emitting devices 250 . For example, the semiconductor light emitting devices 250 may be arranged in a plurality of columns, and the second electrode 240 may be located between the columns of the semiconductor light emitting devices 250 .

Since the distance between the semiconductor light emitting devices 250 constituting individual pixels is sufficiently large, the second electrode 240 may be positioned between the semiconductor light emitting devices 250 .

The second electrode 240 may be formed as a bar-shaped electrode long in one direction, and may be disposed in a direction perpendicular to the first electrode.

Also, the second electrode 240 and the semiconductor light emitting device 250 may be electrically connected to each other by a connection electrode protruding from the second electrode 240 . More specifically, the connection electrode may be an n-type electrode of the semiconductor light emitting device 250 . For example, the n-type electrode is formed as an ohmic electrode for ohmic contact, and the second electrode covers at least a portion of the ohmic electrode by printing or deposition. Through this, the second electrode 240 and the n-type electrode of the semiconductor light emitting device 250 may be electrically connected.

As illustrated, the second electrode 240 may be positioned on the conductive adhesive layer 230 . In some cases, a transparent insulating layer (not shown) including silicon oxide (SiOx) may be formed on the substrate 210 on which the semiconductor light emitting device 250 is formed. When the second electrode 240 is positioned after the transparent insulating layer is formed, the second electrode 240 is positioned on the transparent insulating layer. In addition, the second electrode 240 may be formed to be spaced apart from the conductive adhesive layer 230 or the transparent insulating layer.

If a transparent electrode such as indium tin oxide (ITO) is used to position the second electrode 240 on the semiconductor light emitting device 250 , the ITO material has a problem of poor adhesion to the n-type semiconductor layer. have. Accordingly, the present invention has the advantage of not using a transparent electrode such as ITO by locating the second electrode 240 between the semiconductor light emitting devices 250 . Therefore, it is possible to improve light extraction efficiency by using a conductive material having good adhesion to the n-type semiconductor layer as a horizontal electrode without being limited by the selection of a transparent material.

As illustrated, a barrier rib 290 may be positioned between the semiconductor light emitting devices 250 . That is, a barrier rib 290 may be disposed between the vertical semiconductor light emitting devices 250 to isolate the semiconductor light emitting devices 250 constituting individual pixels. In this case, the partition wall 290 may serve to separate individual unit pixels from each other, and may be integrally formed with the conductive adhesive layer 230 . For example, by inserting the semiconductor light emitting device 250 into the anisotropic conductive film, the base member of the anisotropic conductive film may form the partition wall.

In addition, when the base member of the anisotropic conductive film is black, the barrier rib 290 may have reflective properties and increase contrast even without a separate black insulator.

As another example, as the barrier rib 190 , a reflective barrier rib may be separately provided. The barrier rib 290 may include a black or white insulator depending on the purpose of the display device.

If the second electrode 240 is directly positioned on the conductive adhesive layer 230 between the semiconductor light emitting devices 250 , the barrier rib 290 is formed between the vertical semiconductor light emitting device 250 and the second electrode 240 . can be located between Accordingly, individual unit pixels can be configured even with a small size using the semiconductor light emitting device 250 , and the distance between the semiconductor light emitting devices 250 is relatively large enough to connect the second electrode 240 to the semiconductor light emitting device 250 . ), and there is an effect of realizing a flexible display device having HD image quality.

Also, as illustrated, a black matrix 291 may be disposed between each phosphor in order to improve a contrast ratio. That is, the black matrix 291 may improve contrast of light and dark.

As described above, the semiconductor light emitting device 250 is positioned on the conductive adhesive layer 230 and constitutes individual pixels in the display device through this. Since the semiconductor light emitting device 250 has excellent luminance, individual unit pixels can be configured even with a small size. Accordingly, a full-color display in which unit pixels of red (R), green (G), and blue (B) constitute one pixel may be implemented by the semiconductor light emitting device.

10 is an enlarged view of part A of FIG. 1 for explaining another embodiment of the present invention to which a semiconductor light emitting device of a new structure is applied, FIG. 11A is a cross-sectional view taken along line E-E of FIG. 10, and FIG. 11B is FIG. 11 is a cross-sectional view taken along line F-F, and FIG. 12 is a conceptual diagram illustrating the flip-chip type semiconductor light emitting device of FIG. 11A.

10, 11A, and 11B , the display device 1000 using a passive matrix (PM) type semiconductor light emitting device is exemplified as the display device 1000 using a semiconductor light emitting device. However, the examples described below are also applicable to an active matrix (AM) type semiconductor light emitting device.

The display apparatus 1000 includes a substrate 1010 , a first electrode 1020 , a conductive adhesive layer 1030 , a second electrode 1040 , and a plurality of semiconductor light emitting devices 1050 . Here, the first electrode 1020 and the second electrode 1040 may each include a plurality of electrode lines.

The substrate 1010 is a wiring substrate on which the first electrode 1020 is disposed, and may include polyimide (PI) to implement a flexible display device. In addition, any material that has insulating properties and is flexible may be used.

The first electrode 1020 is positioned on the substrate 1010 and may be formed as a bar-shaped electrode long in one direction. The first electrode 1020 may serve as a data electrode.

The conductive adhesive layer 1030 is formed on the substrate 1010 on which the first electrode 1020 is positioned. Like the display device to which the above-described flip chip type light emitting element is applied, the conductive adhesive layer 1030 is an anisotropic conductive film (ACF), an anisotropic conductive paste, and a solution containing conductive particles. (solution), etc. However, in this embodiment, the conductive adhesive layer 1030 may be replaced with an adhesive layer. For example, if the first electrode 1020 is not positioned on the substrate 1010 and is integrally formed with the conductive electrode of the semiconductor light emitting device, the adhesive layer may not need to be conductive.

A plurality of second electrodes 1040 disposed in a direction crossing the longitudinal direction of the first electrode 1020 and electrically connected to the semiconductor light emitting device 1050 are positioned between the semiconductor light emitting devices.

As illustrated, the second electrode 1040 may be positioned on the conductive adhesive layer 1030 . That is, the conductive adhesive layer 1030 is disposed between the wiring board and the second electrode 1040 . The second electrode 1040 may be electrically connected to the semiconductor light emitting device 1050 by contact.

With the structure described above, the plurality of semiconductor light emitting devices 1050 are coupled to the conductive adhesive layer 1030 and electrically connected to the first electrode 1020 and the second electrode 1040 .

In some cases, a transparent insulating layer (not shown) including silicon oxide (SiOx) may be formed on the substrate 1010 on which the semiconductor light emitting device 1050 is formed. When the second electrode 1040 is positioned after the transparent insulating layer is formed, the second electrode 1040 is positioned on the transparent insulating layer. In addition, the second electrode 1040 may be formed to be spaced apart from the conductive adhesive layer 1030 or the transparent insulating layer.

As shown, the plurality of semiconductor light emitting devices 1050 may form a plurality of columns in a direction parallel to a plurality of electrode lines provided in the first electrode 1020 . However, the present invention is not necessarily limited thereto. For example, the plurality of semiconductor light emitting devices 1050 may form a plurality of columns along the second electrode 1040 .

Furthermore, the display apparatus 1000 may further include a phosphor layer 1080 formed on one surface of the plurality of semiconductor light emitting devices 1050 . For example, the semiconductor light emitting device 1050 is a blue semiconductor light emitting device that emits blue (B) light, and the phosphor layer 1080 converts the blue (B) light into a color of a unit pixel. The phosphor layer 1080 may be a red phosphor 1081 or a green phosphor 1082 constituting individual pixels. That is, a red phosphor 1081 capable of converting blue light into red (R) light may be stacked on the blue semiconductor light emitting device 1051a at a position constituting a unit pixel of red color, and a position constituting a unit pixel of green color In , a green phosphor 1082 capable of converting blue light into green (G) light may be stacked on the blue semiconductor light emitting device 1051b. In addition, only the blue semiconductor light emitting device 1051c may be used alone in the portion constituting the blue unit pixel. In this case, unit pixels of red (R), green (G), and blue (B) may form one pixel. More specifically, a phosphor of one color may be stacked along each line of the first electrode 1020 . Accordingly, one line in the first electrode 1020 may be an electrode for controlling one color. That is, red (R), green (G), and blue (B) may be sequentially disposed along the second electrode 1040 , thereby realizing a unit pixel. However, the present invention is not necessarily limited thereto, and instead of a phosphor, a unit pixel emitting red (R), green (G), and blue (B) is formed by combining the semiconductor light emitting device 1050 and quantum dots (QD). can be implemented

Meanwhile, in order to improve the contrast ratio of the phosphor layer 1080, the display device may further include a black matrix 1091 disposed between the respective phosphors. The black matrix 1091 may be formed in such a way that a gap is formed between the phosphor dots, and a black material fills the gap. Through this, the black matrix 1091 may absorb external light reflection and improve contrast of light and dark. The black matrix 1091 is positioned between the respective phosphor layers along the first electrode 1020 in the direction in which the phosphor layers 1080 are stacked. In this case, a phosphor layer is not formed at a position corresponding to the blue semiconductor light emitting device 1051 , but the black matrix 1091 is formed with a space without the phosphor layer therebetween (or the blue semiconductor light emitting device 1051c is interposed therebetween). to) can be formed on both sides.

Again, looking at the semiconductor light emitting device 1050 of this example, the semiconductor light emitting device 1050 in this example has a great advantage of reducing the chip size because electrodes can be arranged up and down. However, although the electrodes are arranged vertically, the semiconductor light emitting device of the present invention may be a flip chip type light emitting device.

Referring to FIG. 12 , for example, the semiconductor light emitting device 1050 includes a first conductive electrode 1156 and a first conductive semiconductor layer 1155 on which the first conductive electrode 1156 is formed; The active layer 1154 formed on the first conductivity type semiconductor layer 1155, the second conductivity type semiconductor layer 1153 formed on the active layer 1154, and the second conductivity type semiconductor layer 1153 formed on the second conductivity type semiconductor layer 1153 A conductive electrode 1152 is included.

More specifically, the first conductivity type electrode 1156 and the first conductivity type semiconductor layer 1155 may be a p-type electrode and a p-type semiconductor layer, respectively, and the second conductivity type electrode 1152 and the second conductivity type electrode 1152 , respectively. The conductive semiconductor layer 1153 may be an n-type electrode and an n-type semiconductor layer, respectively. However, the present invention is not necessarily limited thereto, and examples in which the first conductivity type is n-type and the second conductivity type is p-type are also possible.

More specifically, the first conductivity type electrode 1156 is formed on one surface of the first conductivity type semiconductor layer 1155 , and the active layer 1154 is formed on the other surface of the first conductivity type semiconductor layer 1155 and the It is formed between one surface of the second conductivity type semiconductor layer 1153 , and the second conductivity type electrode 1152 is formed on one surface of the second conductivity type semiconductor layer 1153 .

In this case, the second conductivity type electrode is disposed on one surface of the second conductivity type semiconductor layer 1153 , and an undoped semiconductor layer 1153a is formed on the other surface of the second conductivity type semiconductor layer 1153 . ) can be formed.

12 together with FIGS. 10 to 11B , one surface of the second conductivity type semiconductor layer may be the surface closest to the wiring board, and the other surface of the second conductivity type semiconductor layer is closest to the wiring board. It can be on the far side.

In addition, the first conductive electrode 1156 and the second conductive electrode 1152 have a height difference from each other in the width direction and the vertical direction (or thickness direction) at positions spaced apart from each other along the width direction of the semiconductor light emitting device. made to have

The second conductive electrode 1152 is formed on the second conductive semiconductor layer 1153 using the height difference, but is disposed adjacent to the second electrode 1040 positioned above the semiconductor light emitting device. . For example, at least a portion of the second conductivity type electrode 1152 is in the width direction from the side surface of the second conductivity type semiconductor layer 1153 (or the side surface of the undoped semiconductor layer 1153a). protrudes along As described above, since the second conductive electrode 1152 protrudes from the side surface, the second conductive electrode 1152 may be exposed to the upper side of the semiconductor light emitting device. Through this, the second conductive electrode 1152 is disposed at a position overlapping with the second electrode 1040 disposed on the upper side of the conductive adhesive layer 1030 .

More specifically, the semiconductor light emitting device has protrusions 1152a extending from the second conductive electrode 1152 and protruding from side surfaces of the plurality of semiconductor light emitting devices. In this case, when looking at the protrusion 1152a as a reference, the first conductive electrode 1156 and the second conductive electrode 1152 are disposed at positions spaced apart along the protrusion direction of the protrusion 1152a, It can be expressed as being formed to have a height difference from each other in a direction perpendicular to the protrusion direction.

The protrusion 1152a extends laterally from one surface of the second conductivity type semiconductor layer 1153 , and is an upper surface of the second conductivity type semiconductor layer 1153 , more specifically, an undoped semiconductor layer. (1153a). The protrusion 1152a protrudes along the width direction from the side surface of the undoped semiconductor layer 1153a. Accordingly, the protrusion 1152a may be electrically connected to the second electrode 1040 on the opposite side of the first conductivity type electrode with respect to the second conductivity type semiconductor layer.

The structure including the protrusion 1152a may be a structure that can utilize the advantages of the above-described horizontal type semiconductor light emitting device and vertical type semiconductor light emitting device. Meanwhile, in the undoped semiconductor layer 1153a, microgrooves may be formed on the top surface furthest from the first conductive type electrode 1156 by roughing.

In addition, the semiconductor light emitting device 1050 may include an insulating portion 1158 formed to cover the second conductive electrode 1152 . The insulating part 1158 may be formed to cover a portion of the first conductivity type semiconductor layer 1155 together with the second conductivity type electrode 1152 .

In this case, the second conductive electrode 1152 and the active layer 1154 are formed on one surface of the second conductive semiconductor layer 1153 and are spaced apart in one direction with the insulating part 1158 interposed therebetween. do. Here, one direction (or horizontal direction) may be a width direction of the semiconductor light emitting device, and a vertical direction may be a thickness direction of the semiconductor light emitting device.

In addition, the first conductivity type electrode 1156 may be formed in a portion of the first conductivity type semiconductor layer 1155 that is not covered by the insulating portion 1158 and is exposed. Accordingly, the first conductive electrode 1156 penetrates the insulating portion 1158 and is exposed to the outside.

As described above, since the first conductive electrode and the second conductive electrode 1156 and 1152 are spaced apart by the insulating part 1058, the n-type electrode and the p-type electrode of the semiconductor light emitting device may be insulated.

In addition, the display apparatus 1000 may further include a phosphor layer 1080 (refer to FIG. 11B ) formed on one surface of the plurality of semiconductor light emitting devices 1050 . In this case, light output from the semiconductor light emitting devices is excited using a phosphor to realize red (R) and green (G). In addition, the aforementioned black matrices 191, 291, and 1091 (refer to FIGS. 3B, 8 and 11B) serve as barrier ribs that prevent color mixing between phosphors.

Furthermore, in the present invention, the structure and manufacturing method of the display device are simple, but the mechanism of increasing the luminance is proposed.

Hereinafter, the structure of the display device of the present invention for increasing luminance will be described in detail with the accompanying drawings. 13 is an enlarged view of part A of FIG. 1 for explaining another embodiment of the present invention, FIG. 14 is a cross-sectional view taken along G-G of FIG. 13, and FIG. 15 is a cross-sectional view taken along H-H of FIG. 13 .

13, 14 and 15 , a display device 2000 using the flip chip type semiconductor light emitting device described with reference to FIGS. 10 to 12 is exemplified as a display device using a semiconductor light emitting device. More specifically, in the flip chip type semiconductor light emitting device described with reference to FIGS. 10 to 12 , a case in which a mechanism for increasing luminance is added is exemplified. In this case, the arrows shown in Fig. 14 indicate the path of the light that increases the luminance.

In this example to be described below, the same or similar reference numerals are assigned to the same or similar components as those of the examples described with reference to FIGS. 10 to 12 above, and the description is replaced with the first description. For example, the display device 2000 includes a substrate 2010 , a first electrode 2020 , a second electrode 2040 , and a plurality of semiconductor light emitting devices 2050 , and descriptions thereof are described in FIGS. 10 to 10 to The description with reference to FIG. 12 is replaced.

In this case, the semiconductor light emitting device 2050 includes a first conductivity type electrode 2156 , a first conductivity type semiconductor layer 2155 on which the first conductivity type electrode 2156 is formed, and a first conductivity type semiconductor layer An active layer 2154 formed on 2155, a second conductivity type semiconductor layer 2153 formed on the active layer 2154, and a second conductivity type electrode 2152 formed on the second conductivity type semiconductor layer 2153 including, and a description thereof is replaced by the description with reference to FIG. 12 above.

In addition, as described above with reference to FIG. 12 , the protrusion 2152a extends from one surface of the second conductivity type semiconductor layer 2153 to the side, and to the upper surface of the second conductivity type semiconductor layer 2153 , more Specifically, it extends to the undoped semiconductor layer 2153a. Accordingly, the protrusion 2152a may be electrically connected to the second electrode 2040 on the opposite side of the first conductivity type electrode with respect to the second conductivity type semiconductor layer.

In addition, the semiconductor light emitting device 2050 may include an insulating portion 2158 formed to cover the second conductive electrode 2152 . The insulating portion 2158 may be formed to cover a portion of the first conductivity type semiconductor layer 2155 together with the second conductivity type electrode 2152 .

In addition, the first conductivity type electrode 2156 may be formed in a portion of the first conductivity type semiconductor layer 2155 that is not covered by the insulating portion 2158 and is exposed. Accordingly, the first conductive electrode 2156 penetrates the insulating portion 2158 and is exposed to the outside.

In addition, the display apparatus 2000 may further include a phosphor layer 2080 formed on one surface of the plurality of semiconductor light emitting devices 2050 . For example, the semiconductor light emitting device 2050 is a blue semiconductor light emitting device that emits blue (B) light, and the phosphor layer 2080 performs a function of converting the blue (B) light into a color of a unit pixel. In this case, the light output from the semiconductor light emitting devices 2050 is excited using a phosphor to realize red (R) and green (G). Meanwhile, the phosphor layer 2080 may be replaced with a color filter or quantum dot. In addition, the aforementioned black matrices 191, 291, and 1091 (refer to FIGS. 3B, 8 and 11B) serve as barrier ribs that prevent color mixing between phosphors.

Referring to the drawings, the conductive adhesive layer 2030 electrically connects the substrate 2010 and the semiconductor light emitting devices 2050 while attaching the semiconductor light emitting devices 2050 to the substrate 2010 (a wiring board). Connect. In this case, the conductive adhesive layer 2030 may be an anisotropic conductive film.

For example, the first electrode 2020 is disposed on the substrate 2010, and thus may be a wiring electrode. The first electrode 2020 is electrically connected to the semiconductor light emitting device 2050 through the anisotropic conductive medium 2034 of the conductive adhesive layer 2030 and may be driven as a data electrode for transmitting a data signal.

In contrast, the second electrode 2040 may be positioned on the conductive adhesive layer 2030 . That is, the conductive adhesive layer 2030 is disposed between the wiring board and the second electrode 2040 . The second electrode 2040 may be electrically connected to the semiconductor light emitting device 2050 by contact, and may be driven as a scan electrode that transmits a scan signal. However, the present invention is not necessarily limited thereto, and the first electrode 2020 may be a scan electrode and the second electrode 2040 may be a data electrode.

In this example, the conductive adhesive layer 2030 includes a plurality of layers 2031 , 2032 , and 2033 , and a white pigment 2060 is added to at least one of the plurality of layers. The white pigment 2060 is incorporated into the conductive adhesive layer 2030 to reflect light emitted from the semiconductor light emitting devices 2050 .

In this case, the white pigment 2060 may include at least one of titanium oxide, alumina, magnesium oxide, antimony oxide, zirconium oxide, and silica.

More specifically, the conductive adhesive layer 2030 includes a first layer 2031 , a second layer 2032 , and a third layer 2033 .

The first layer 2031 is a layer disposed on the substrate 2010 and has an adhesive force to which the substrate 2010 is attached. In addition, the first layer may be formed of a material having good fluidity to be suitable for the bonding process.

Meanwhile, since the first layer 2031 does not directly contact the semiconductor light emitting device, it may not include a white pigment. As such, as the white pigment is not included, a decrease in adhesion of the first layer 2031 may be alleviated or prevented.

The second layer 2032 is a layer stacked on the first layer 2031 , and may be a layer on which the anisotropic conductive medium 2034 is disposed. At least a portion of the semiconductor light emitting device may be inserted into at least a portion of the second layer 2032 . Through this, the anisotropic conductive medium 2034 comes into contact with the first conductive electrode 2156 of the semiconductor light emitting device, and the light emitting device and the wiring electrode of the substrate conduct electricity.

In this case, the second layer 2032 includes the white pigment 2060 to reflect light emitted from the semiconductor light emitting devices 2050 . For this example, the white pigment 2060 may penetrate into the insulating base member or the base material of the conductive adhesive layer 2030 .

The second layer may be made of a material having a higher viscosity in a molten state than the first layer 2031 . Unlike the first layer 2031 , the second layer 2032 is effective to suppress the flow of the anisotropic conductive medium as much as possible, and has a high melt viscosity for this purpose.

As the molecular weight increases, the melt viscosity increases, so that the second layer 2032 may be formed of a thermoplastic resin having a higher molecular weight than the first layer 2031 . For this example, the second layer 2032 is styrene-butadiene rubber, SEBS (Stylene-Etylene-Btylene-Stylene) ethylene-vinyl acetate copolymer, carboxyl-modified ethylene-vinyl acetate copolymer, ethylene-isobutyl acrylate. Copolymer, polyamide, polyimide, polyester, polyvinyl ether, polyvinyl butyral, polyurethane, SBS (Stylene-Butadiene-Stylene) block copolymer, carboxyl-modified SBS copolymer, SIS copolymer, SEBS copolymer , Maleic acid-modified SEBS copolymer, polybutadiene rubber, chloroprene rubber, carboxyl-modified chloroprene rubber, styrene-butadiene rubber, isobutylene-isoprene copolymer, acrylonitrile-butadiene rubber, carboxyl-modified acrylonitrile-butadiene At least one of rubber and amine-modified acrylonitrile-butadiene rubber may be included.

The third layer 2033 is a layer stacked on the second layer 2032 , and may be a layer in which the anisotropic conductive medium is not disposed. In addition, the second electrode 2040 may be disposed on one surface of the third layer 2033 .

As illustrated, a second layer 2032 is disposed between the first layer 2031 and the third layer 2033 , and the semiconductor light emitting device may be attached to the third layer 2033 . In this case, the first layer 2031 and the third layer may be formed of the same material, and the second layer 2032 may be formed of a material different from that of the first layer 2031 and the third layer.

As illustrated, at least a portion of the semiconductor light emitting device is formed to pass through the third layer 2033 , and thus the semiconductor light emitting device directly faces the third layer 2033 . In this case, the white pigment 2060 may be included in the third layer 2033 to reflect the light emitted from the semiconductor light emitting device. As such, the third layer also increases the reflectivity of light generated from the light emitting device through the white pigment 2060 .

Since the white pigment 2060 is added only to the second layer 2032 and the third layer 2033, the luminance improvement effect can be expressed by giving a reflective effect only to the layer in direct contact with the semiconductor light emitting device in the conductive adhesive layer. have.

Meanwhile, the white pigment 2060 may serve to re-reflect light reflected from the phosphor layer 2080 toward the inside of the display device to the phosphor layer 2080 . In this case, the white pigment of the third layer 2033 may mainly play a role of re-reflecting light directed to the inside of the display device by being reflected from the phosphor layer 2080 .

In addition, since the white pigment 2060 is added only to the second layer 2032 and the third layer 2033, a layer attached to the substrate among the plurality of layers may have a higher adhesive strength than other layers. . The biggest function of the first layer 2031 is to improve filling properties or adhesion due to the unevenness of the electrodes on the wiring board rather than the reflection effect, so that the white pigment is not added. However, the present invention is not necessarily limited thereto, and a small amount of white pigment may be added to the first layer 2031 . In this case, the weight ratio of the white pigment added to the second layer 2032 or the third layer 2033 may be greater than that of the first layer 2031 .

Table 1 below shows the results of experiments using the structure of this example while varying the content of the white pigment.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 White pigment content 3rd layer 10 25 40 0 5 2nd layer 10 25 40 0 5 1st layer 0 0 0 0 0 Reflectivity (%) 24.5% 31.3% 37.7% 7.8% 13.1% luminous efficiency 134% 156% 176% 100% 108%

In this case, the weight ratio of the white pigment included in the second layer 2032 may be 10 to 80 wt% based on the total weight of the second layer. In addition, the weight ratio of the white pigment included in the third layer may be 10 to 80 wt% based on the total weight of the third layer. According to the experimental results, the reflectivity sharply increases according to the addition of the white pigment up to 10 wt%, and thereafter, it tends to increase proportionally. However, since it is technically significant to increase the luminous efficiency by 50% or more, it is preferable that the weight ratio of the white pigment is 20 wt% or more. In addition, if too much of the white pigment is added, fluidity may be reduced and surface defects may occur due to particles. Therefore, the weight ratio of the white pigment is preferably 60 wt% or less. Therefore, in the present invention, the weight ratio of the white pigment included in the second layer 2032 is 20 to 60 wt%, and the weight ratio of the white pigment included in the third layer 2033 is 20 to 60 wt%. can

As described above, in this example, the structure of the conductive adhesive layer and the content of the white pigment are clarified to implement a connection structure capable of maintaining adhesive strength while increasing reflectivity in a display device using a semiconductor light emitting device.

The display device described above includes the steps of sequentially growing a first conductivity type semiconductor layer, an activation layer, and a second conductivity type semiconductor layer on a substrate, and forming a plurality of semiconductor light emitting devices on the substrate through etching , and attaching the plurality of semiconductor light emitting devices to a wiring board using an anisotropic conductive film.

First, according to the manufacturing method, a second conductivity type semiconductor layer, an active layer, and a first conductivity type semiconductor layer are grown on a growth substrate (W or a semiconductor wafer, respectively).

After the second conductivity type semiconductor layer is grown, an active layer is grown on the first conductivity type semiconductor layer, and then a first conductivity type semiconductor layer is grown on the active layer. In this way, the second conductivity type semiconductor layer, the active layer, and the first conductivity type semiconductor layer are sequentially formed. The second conductive semiconductor layer is an n-type semiconductor layer, and may be a nitride semiconductor layer such as n-Gan.

The growth substrate W may be formed of a material having a light-transmitting property, for example, any one of sapphire (Al2O3), GaN, ZnO, and AlO, but is not limited thereto. In addition, the growth substrate W may be formed of a material suitable for semiconductor material growth, a carrier wafer. It may be formed of a material having excellent thermal conductivity, and, including a conductive substrate or an insulating substrate, for example, a SiC substrate having higher thermal conductivity than a sapphire (Al2O3) substrate or at least one of Si, GaAs, GaP, InP, Ga2O3 Can be used.

Next, the steps of forming a plurality of semiconductor light emitting devices on the substrate through etching and forming a conductive electrode on the conductive semiconductor layer may be performed. For example, an etching process is performed to separate a p-type semiconductor and an n-type semiconductor, and to form a plurality of semiconductor light emitting devices isolated from each other on the substrate. That is, the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer are etched to isolate the semiconductor light emitting devices on the substrate.

Next, at least one conductive electrode is formed on the semiconductor light emitting devices. More specifically, the first conductivity type electrode is formed on one surface of the first conductivity type semiconductor layer. In this case, a second conductivity type electrode may be stacked on the second conductivity type semiconductor layer.

Next, the semiconductor light emitting devices are bonded to the wiring board using a conductive adhesive layer, and the growth substrate is removed. A description of this process is replaced with a description of a method of manufacturing a display device using the semiconductor light emitting device described with reference to FIG. 6 .

In this case, as described above, an anisotropic conductive film may be used for the conductive adhesive layer of the present invention, and when the distribution of particles of the anisotropic conductive medium is non-uniform, a problem of reduced energization reliability may occur. Accordingly, the present invention proposes a manufacturing method capable of uniform distribution of particles in the anisotropic conductive film.

Hereinafter, a method of manufacturing an anisotropic conductive film having a uniform distribution of anisotropic conductive medium will be described with reference to FIG. 16 . 16 is a conceptual diagram illustrating a method of manufacturing an embodiment of the anisotropic conductive film of FIG. 13 .

According to the figure, first, a step of mixing an anisotropic conductive medium with a liquid material to form a mixed solution is performed.

The anisotropic conductive film is a film in which an anisotropic conductive medium is mixed with an insulating base member, and when heat, pressure or UV is applied, only a specific portion has conductivity by the anisotropic conductive medium.

The liquid material is cured to form at least a portion of the insulating base member. In this case, the liquid material is formed of a polymeric thermoplastic resin, and the concentration of the mixed solution may be 5,000 cps or less. The thermoplastic resin of the polymer is styrene-butadiene rubber, SEBS (Stylene-Etylene-Btylene-Stylene) ethylene-vinyl acetate copolymer, carboxyl-modified ethylene-vinyl acetate copolymer, ethylene-isobutyl acrylate copolymer, polyamide, Polyimide, polyester, polyvinyl ether, polyvinyl butyral, polyurethane, SBS (Stylene-Butadiene-Stylene) block copolymer, carboxyl-modified SBS copolymer, SIS copolymer, SEBS copolymer, maleic acid-modified SEBS copolymer Copolymer, polybutadiene rubber, chloroprene rubber, carboxyl-modified chloroprene rubber, styrene-butadiene rubber, isobutylene-isoprene copolymer, acrylonitrile-butadiene rubber, carboxyl-modified acrylonitrile-butadiene rubber, amine-modified acryloni It may include at least one of trill-butadiene rubber.

The anisotropic conductive medium may be, for example, a conductive ball, and the particle size may be 2 to 5 micrometers. A detailed description of the conductive ball is substituted for the above. In addition, the above-described white pigment may be included in the mixed solution to reflect light emitted from the semiconductor light emitting devices.

Next, the mixed solution is rolled using a roller so that the mixed solution forms a film. Through the rolling of the mixture, the basic structure of the anisotropic conductive film in which the anisotropic conductive medium is mixed in the base member can be implemented. In this case, the thickness of the film may be compressed to 3 to 5 micrometers.

At this time, the mixed solution may be applied to one surface of the base film and compressed together with the base film by the roller. This base film is a film for protecting the anisotropic conductive film, and is made to be detachable from the anisotropic conductive film.

Next, a step of adjusting the arrangement of the anisotropic conductive medium in the film by using a magnetic field is performed.

The magnetic field may be applied to the film by one or more electromagnets disposed between the roller and the drying device. For this example, the electromagnets may be disposed to face each other from both sides with respect to the film.

Also, the electromagnets may have the same polarity. For example, if the upper electromagnet is an N pole, the lower electromagnet may also be an N pole, and if the upper electromagnet is an S pole, the lower electromagnet may also be the S pole. However, the present invention is not necessarily limited thereto. For example, in order to bias the anisotropic conductive medium on one side boundary of the film, it is possible that the upper electromagnet and the lower electromagnet have different polarities.

In this case, the closer the distance between the electromagnet and the film, the greater the influence of the magnetic field, and the greater the distance, the less the influence of the magnetic field. Therefore, after determining the optimized position through distance control, the arrangement of the particles is maintained using the electromagnets arranged at these positions. In addition, the strength of the magnetic field may be 500 to 5000 gauss, and may vary depending on the physical properties or viscosity of the liquid material, and through this, the arrangement of the anisotropic conductive medium may be controlled. As such, according to this example, it is possible to implement an optimal particle arrangement state by using the distance between the electromagnets, the strength of the magnetic field, and the physical properties or viscosity of the liquid material.

Next, a step of drying the film by passing the film through a drying device is performed. The liquid material may be cured through the drying. As such, in this example, by applying a magnetic field at the top and bottom of the film between the coating roller and the dry zone for coating, the uniformity of the particles is ensured.

In this case, by coating the dried film with an adhesive film that does not contain the anisotropic conductive medium and has adhesive force, the anisotropic conductive film has multi-layers. The base member may be the first layer in the conductive adhesive layer described above with reference to FIGS. 13, 14, and 15 . In this case, the dried film may be a second layer, and the adhesive film may be coated on one surface of the dried film.

The adhesive film has an adhesive force to which the substrate is attached, and may be formed of a material having good fluidity to be suitable for the bonding process. On the other hand, the adhesive film may not contain a white pigment because it is not a part in direct contact with the semiconductor light emitting device. As such, as the white pigment is not included, a decrease in adhesive strength in the adhesive film may be alleviated or prevented.

In addition, in order to implement the third layer in the conductive adhesive layer described above with reference to FIGS. 13, 14 and 15 , another adhesive film may be coated on the other surface of the dried film. At this time, the anisotropic conductive medium is not mixed in the adhesive film, but a white pigment may be included.

According to the manufacturing method of the present invention described above, in order to make the distribution of the anisotropic conductive medium injected into the anisotropic conductive film uniform, a magnetic field (electromagnet) is used immediately after the mixed solution is coated through a roller, Before entering the film, a magnetic field is applied to the anisotropic conducting medium in the film so that non-uniform particles can be uniformly distributed.

On the other hand, although the anisotropic conductive film of the present invention described above has been described based on the three-layer structure, it may be modified into other forms. As such an example, a configuration in a two-layer structure is also possible. In the manufacturing method of such a two-layer structure, the step of coating another adhesive film on the other surface of the dried film is omitted, and an anisotropic conductive film can be completed.

Hereinafter, the structure of the display device having the anisotropic conductive film having these two layers will be described. 17 is a cross-sectional view for explaining another embodiment of the present invention.

Referring to FIG. 17 , the anisotropic conductive film 3030 is composed of two layers, and the semiconductor light emitting devices 3050 are attached to the substrate 3010 (wiring board), while the substrate 3010 and the The semiconductor light emitting devices 3050 are electrically connected.

In this example, the anisotropic conductive film 3030 includes a plurality of layers 3031 and 3032 , and a white pigment 3060 is added to one of the plurality of layers and not to the other.

In this case, the white pigment 3060 may include at least one of titanium oxide, alumina, magnesium oxide, antimony oxide, zirconium oxide, and silica.

More specifically, the anisotropic conductive film 3030 includes a first layer 3031 and a second layer 2032 .

The first layer 3031 is a layer disposed on the substrate 3010 and has an adhesive force to which the substrate 3010 is attached. In addition, the first layer 3031 may be formed of a material having good fluidity to be suitable for the bonding process.

Meanwhile, the first layer 3031 may not include a white pigment because it is not a part in direct contact with the semiconductor light emitting device. As such, as the white pigment is not included, a decrease in adhesion of the first layer 3031 may be alleviated or prevented.

The second layer 3032 is a layer stacked on the first layer 3031 and may be a layer on which the anisotropic conductive medium 3034 is disposed. In addition, a semiconductor on one surface of the second layer 3032 A second electrode (not shown) electrically connected to a second conductive electrode (not shown) of the light emitting device may be disposed.

As illustrated, at least a portion of the semiconductor light emitting device may be inserted into at least a portion of the second layer 3032 . Through this, the anisotropic conductive medium 3034 comes into contact with the first conductive electrode 3156 of the semiconductor light emitting device, and the light emitting device and the wiring electrode of the substrate conduct electricity.

In order to conduct electricity, the anisotropic conductive medium needs to be disposed to be biased toward the first conductive type electrode 3156 . Therefore, in this case, in the method of manufacturing the anisotropic conductive film, the arrangement of the electromagnets may be different from the three-layer structure. As an example, the electromagnets have opposite polarities to uniformly distribute the anisotropic conductive medium to one side, or one of the electromagnets makes the distance from the film greater than the other so that the anisotropic conductive medium is biased to one side and uniformly distributed. have.

In this case, the second layer 3032 includes the white pigment 3060 to reflect light emitted from the semiconductor light emitting devices 3050 . For this example, the white pigment 3060 may penetrate into the insulating base member or the base material of the second layer 3032 .

As described above, since the white pigment 3060 is added only to the second layer 3032 , the luminance improvement effect can be expressed by giving a reflective effect only to the layer in direct contact with the semiconductor light emitting device in the conductive adhesive layer.

In this case, since the white pigment 3060 is added only to the second layer 3032 , the first layer 3031 may have a higher adhesive strength than the second layer 3032 . The biggest function of the first layer 3031 is to improve filling properties or adhesion due to the unevenness of the electrodes on the wiring board rather than the reflection effect, so that the white pigment is not added. However, the present invention is not necessarily limited thereto, and a small amount of white pigment may be added to the first layer 3031 . In this case, the weight ratio of the white pigment added to the second layer 3032 may be greater than that of the first layer 3031 .

As described above, the structure of the anisotropic conductive film of the present invention may also be composed of two layers.

The display device using the semiconductor light emitting device described above is not limited to the configuration and method of the above-described embodiments, but all or part of each embodiment may be selectively combined so that various modifications may be made. may be

Claims (6)

sequentially growing a first conductivity type semiconductor layer, an activation layer, and a second conductivity type semiconductor layer on a substrate;
forming a plurality of semiconductor light emitting devices on the substrate through etching; and
Attaching the plurality of semiconductor light emitting devices to a wiring board using an anisotropic conductive film,
The anisotropic conductive film,
forming a mixed solution by mixing an anisotropic conductive medium with a liquid material;
rolling the mixed solution using a roller so that the mixed solution forms a film;
adjusting the arrangement of the anisotropic conductive medium in the film using a magnetic field; and
A method of manufacturing a display device, characterized in that manufactured through the step of drying the film by passing the film through a drying device. The method of claim 1,
The method of claim 1, wherein the magnetic field is applied to the film by one or more electromagnets disposed between the roller and the drying device. 3. The method of claim 2,
The electromagnets are disposed to face each other from both sides based on the film, and have the same polarity. The method of claim 1,
The adjusting comprises adjusting the arrangement of the anisotropic conductive medium by varying the strength of the magnetic field according to the properties or viscosity of the liquid material. The method of claim 1,
By coating the dried film with an adhesive film that does not contain the anisotropic conductive medium and has an adhesive force, the anisotropic conductive film comprises multiple layers. forming a mixed solution by mixing an anisotropic conductive medium with a liquid material;
rolling the mixed solution using a roller so that the mixed solution forms a film;
adjusting the arrangement of the anisotropic conductive medium in the film using a magnetic field; and
A method for producing an anisotropic conductive film comprising the step of passing the film through a drying device to dry the film.

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