KR102411323B1 - 윈도우를 갖는 연질의 컨디셔닝가능한 화학 기계적 연마 패드 - Google Patents

윈도우를 갖는 연질의 컨디셔닝가능한 화학 기계적 연마 패드 Download PDF

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Publication number
KR102411323B1
KR102411323B1 KR1020150041554A KR20150041554A KR102411323B1 KR 102411323 B1 KR102411323 B1 KR 102411323B1 KR 1020150041554 A KR1020150041554 A KR 1020150041554A KR 20150041554 A KR20150041554 A KR 20150041554A KR 102411323 B1 KR102411323 B1 KR 102411323B1
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South Korea
Prior art keywords
abrasive layer
window
curing agent
abrasive
weight
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English (en)
Korean (ko)
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KR20150112853A (ko
Inventor
바이니안 첸
마티 더블유 데그루트
미셸 케이 젠센
제임스 머난
제프리 제이 헨드런
존 지 놀런드
데이비드 비 제임스
펑지 예
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
다우 글로벌 테크놀로지스 엘엘씨
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Publication of KR20150112853A publication Critical patent/KR20150112853A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/10—Cutting tools with special provision for cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/16—Milling-cutters characterised by physical features other than shape
    • B23C5/20—Milling-cutters characterised by physical features other than shape with removable cutter bits or teeth or cutting inserts
    • B23C5/22—Securing arrangements for bits or teeth or cutting inserts
    • B23C5/2265—Securing arrangements for bits or teeth or cutting inserts by means of a wedge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/16—Milling-cutters characterised by physical features other than shape
    • B23C5/20—Milling-cutters characterised by physical features other than shape with removable cutter bits or teeth or cutting inserts
    • B23C5/22—Securing arrangements for bits or teeth or cutting inserts
    • B23C5/2265—Securing arrangements for bits or teeth or cutting inserts by means of a wedge
    • B23C5/2269—Securing arrangements for bits or teeth or cutting inserts by means of a wedge for plate-like cutting inserts 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/28—Features relating to lubricating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H01L21/02024—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2250/00—Compensating adverse effects during turning, boring or drilling
    • B23B2250/12—Cooling and lubrication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2260/00—Details of constructional elements
    • B23B2260/146—Wedges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C2210/00—Details of milling cutters
    • B23C2210/16—Fixation of inserts or cutting bits in the tool
    • H01L2224/03602—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T407/00—Cutters, for shaping
    • Y10T407/14—Cutters, for shaping with means to apply fluid to cutting tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T407/00—Cutters, for shaping
    • Y10T407/22—Cutters, for shaping including holder having seat for inserted tool
    • Y10T407/2272—Cutters, for shaping including holder having seat for inserted tool with separate means to fasten tool to holder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR1020150041554A 2014-03-28 2015-03-25 윈도우를 갖는 연질의 컨디셔닝가능한 화학 기계적 연마 패드 Active KR102411323B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/228,744 US9064806B1 (en) 2014-03-28 2014-03-28 Soft and conditionable chemical mechanical polishing pad with window
US14/228,744 2014-03-28

Publications (2)

Publication Number Publication Date
KR20150112853A KR20150112853A (ko) 2015-10-07
KR102411323B1 true KR102411323B1 (ko) 2022-06-22

Family

ID=53397220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150041554A Active KR102411323B1 (ko) 2014-03-28 2015-03-25 윈도우를 갖는 연질의 컨디셔닝가능한 화학 기계적 연마 패드

Country Status (7)

Country Link
US (1) US9064806B1 (https=)
JP (1) JP6538397B2 (https=)
KR (1) KR102411323B1 (https=)
CN (1) CN104942700B (https=)
DE (1) DE102015003200A1 (https=)
FR (1) FR3019077B1 (https=)
TW (1) TWI590919B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
TWI793073B (zh) 2016-05-10 2023-02-21 美商陶氏全球科技有限責任公司 包括胺引發的多元醇的雙組分無溶劑黏著劑組合物
US20180281149A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
KR101945878B1 (ko) 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
CN115194641B (zh) * 2022-07-29 2023-08-11 安徽禾臣新材料有限公司 一种用于半导体抛光的高平坦性的白垫及其制备工艺

Citations (1)

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JP2012071416A (ja) 2010-09-29 2012-04-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 光安定性ポリマー終点検出窓を有するケミカルメカニカルポリッシングパッドおよびそれを用いた研磨方法

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US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6106662A (en) 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
JP2002001647A (ja) 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
JP2004259728A (ja) * 2003-02-24 2004-09-16 Toray Ind Inc 研磨パッド
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US7258602B2 (en) 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7018581B2 (en) 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7871309B2 (en) * 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP5145683B2 (ja) * 2006-07-20 2013-02-20 東レ株式会社 研磨方法、研磨パッド、研磨パッドの製造方法
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
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JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2012071416A (ja) 2010-09-29 2012-04-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 光安定性ポリマー終点検出窓を有するケミカルメカニカルポリッシングパッドおよびそれを用いた研磨方法

Also Published As

Publication number Publication date
TW201603956A (zh) 2016-02-01
FR3019077B1 (fr) 2018-08-17
FR3019077A1 (fr) 2015-10-02
JP6538397B2 (ja) 2019-07-03
KR20150112853A (ko) 2015-10-07
DE102015003200A1 (de) 2015-10-01
JP2015189003A (ja) 2015-11-02
US9064806B1 (en) 2015-06-23
CN104942700A (zh) 2015-09-30
TWI590919B (zh) 2017-07-11
CN104942700B (zh) 2017-09-12

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