FR3019077B1 - Feutre de polissage mecano-chimique avec fenetre souple et apte au traitement - Google Patents
Feutre de polissage mecano-chimique avec fenetre souple et apte au traitement Download PDFInfo
- Publication number
- FR3019077B1 FR3019077B1 FR1552552A FR1552552A FR3019077B1 FR 3019077 B1 FR3019077 B1 FR 3019077B1 FR 1552552 A FR1552552 A FR 1552552A FR 1552552 A FR1552552 A FR 1552552A FR 3019077 B1 FR3019077 B1 FR 3019077B1
- Authority
- FR
- France
- Prior art keywords
- mecano
- friendly
- treatment
- chemical polishing
- flexible window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polyurethanes Or Polyureas (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/228,744 US9064806B1 (en) | 2014-03-28 | 2014-03-28 | Soft and conditionable chemical mechanical polishing pad with window |
US14228744 | 2014-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3019077A1 FR3019077A1 (fr) | 2015-10-02 |
FR3019077B1 true FR3019077B1 (fr) | 2018-08-17 |
Family
ID=53397220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1552552A Active FR3019077B1 (fr) | 2014-03-28 | 2015-03-26 | Feutre de polissage mecano-chimique avec fenetre souple et apte au traitement |
Country Status (6)
Country | Link |
---|---|
US (1) | US9064806B1 (fr) |
JP (1) | JP6538397B2 (fr) |
KR (1) | KR102411323B1 (fr) |
CN (1) | CN104942700B (fr) |
DE (1) | DE102015003200A1 (fr) |
FR (1) | FR3019077B1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
USD785339S1 (en) * | 2014-10-23 | 2017-05-02 | Griot's Garage, Inc. | Hand applicator buffing pad |
US20160144477A1 (en) * | 2014-11-21 | 2016-05-26 | Diane Scott | Coated compressive subpad for chemical mechanical polishing |
US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
TWI793073B (zh) | 2016-05-10 | 2023-02-21 | 美商陶氏全球科技有限責任公司 | 包括胺引發的多元醇的雙組分無溶劑黏著劑組合物 |
US20180281149A1 (en) * | 2017-03-31 | 2018-10-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
KR101945878B1 (ko) | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
CN112720282B (zh) * | 2020-12-31 | 2022-04-08 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
CN115194641B (zh) * | 2022-07-29 | 2023-08-11 | 安徽禾臣新材料有限公司 | 一种用于半导体抛光的高平坦性的白垫及其制备工艺 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6106662A (en) | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6171181B1 (en) | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
JP2002001647A (ja) | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
JP2004259728A (ja) * | 2003-02-24 | 2004-09-16 | Toray Ind Inc | 研磨パッド |
US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7195539B2 (en) | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7101275B2 (en) * | 2003-09-26 | 2006-09-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Resilient polishing pad for chemical mechanical polishing |
US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
US7258602B2 (en) | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
US6984163B2 (en) | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
US7018581B2 (en) | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
KR101107044B1 (ko) * | 2004-12-10 | 2012-01-25 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
JP5110677B2 (ja) | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2007307639A (ja) | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP5145683B2 (ja) * | 2006-07-20 | 2013-02-20 | 東レ株式会社 | 研磨方法、研磨パッド、研磨パッドの製造方法 |
US8118641B2 (en) * | 2009-03-04 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having window with integral identification feature |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
US8257544B2 (en) | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
JP5715770B2 (ja) * | 2010-06-17 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 |
US8257545B2 (en) * | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
US8512427B2 (en) | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
-
2014
- 2014-03-28 US US14/228,744 patent/US9064806B1/en active Active
-
2015
- 2015-03-12 DE DE102015003200.3A patent/DE102015003200A1/de active Pending
- 2015-03-25 KR KR1020150041554A patent/KR102411323B1/ko active IP Right Grant
- 2015-03-26 FR FR1552552A patent/FR3019077B1/fr active Active
- 2015-03-27 JP JP2015066482A patent/JP6538397B2/ja active Active
- 2015-03-30 CN CN201510144406.1A patent/CN104942700B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
FR3019077A1 (fr) | 2015-10-02 |
JP6538397B2 (ja) | 2019-07-03 |
CN104942700B (zh) | 2017-09-12 |
KR20150112853A (ko) | 2015-10-07 |
KR102411323B1 (ko) | 2022-06-22 |
JP2015189003A (ja) | 2015-11-02 |
US9064806B1 (en) | 2015-06-23 |
CN104942700A (zh) | 2015-09-30 |
DE102015003200A1 (de) | 2015-10-01 |
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