KR102408996B1 - Adhesive sheet, adhesive sheet with dicing sheet, and method of manufacturing semiconductor device - Google Patents

Abstract

(Project) An object of the present invention is to provide an adhesive sheet with a dicing sheet and an adhesive sheet that can be cured in a short time and can reduce poor bonding between a copper wire and a pad and cracking of a semiconductor chip.
(Solution) In the DSC curve drawn by DSC measurement under the condition that the temperature is raised from 25°C to 175°C for 3 minutes and then maintained at 175°C for 3 hours, from reaching 175°C until the reaction peak disappears The time is less than 30 minutes, and the tensile storage elastic modulus at 200 degreeC obtained by measuring the viscoelasticity of the hardened|cured material obtained by making it harden|cure by heating at 175 degreeC for 30 minutes at 10 Hz is 100 MPa or more. It relates to a dicing sheet provided with a base material and an adhesive layer disposed on the base material, and an adhesive sheet to which a dicing sheet is attached, having an adhesive sheet disposed on the pressure sensitive adhesive layer.

Description

An adhesive sheet, an adhesive sheet with a dicing sheet attached thereto, and a manufacturing method of a semiconductor device

The present invention relates to an adhesive sheet, an adhesive sheet with a dicing sheet, and a method for manufacturing a semiconductor device.

Regarding the method for manufacturing a semiconductor device, for example, a method for manufacturing a semiconductor device comprising a step of fixing a semiconductor chip to an adherend such as a lead frame with an adhesive sheet, a step of curing the adhesive sheet, and a step of wire bonding This is known (for example, refer patent document 1).

In recent years, the transition from wire bonding using a gold wire to wire bonding using an inexpensive copper wire is progressing. Moreover, in response to the request|requirement of miniaturization of a semiconductor device, miniaturization of a semiconductor chip is progressing.

Japanese Patent Laid-Open No. 2013-53190

Since the copper wire is easily oxidized, it is difficult to adhere to the pad of the semiconductor chip, and the molten ball is hard. Therefore, in wire bonding using a copper wire, the semiconductor chip tends to vibrate by the ultrasonic wave emitted from the wire bonding apparatus, and it is easy to generate|occur|produce the bad bonding of a copper wire and a pad, and a chip crack. Since a small semiconductor chip having a small area in contact with the lead frame is liable to vibrate, poor bonding and chip cracking are particularly likely to occur.

An object of the present invention is to provide an adhesive sheet with a dicing sheet and an adhesive sheet that can be cured in a short time and can reduce poor bonding between copper wires and pads and cracks in semiconductor chips by solving the above problems do it with Another object of the present invention is to provide a method for manufacturing a semiconductor device that can cure an adhesive sheet in a short time, and can reduce a bonding defect between a copper wire and a pad and cracking of a semiconductor chip.

The present invention relates to an adhesive sheet used for manufacturing a semiconductor device. The adhesive sheet of the present invention has the following properties. That is, in the DSC curve drawn by DSC measurement under the condition that the temperature is raised from 25°C to 175°C for 3 minutes and then maintained at 175°C for 3 hours, the time from reaching 175°C until the reaction peak disappears is less than 30 minutes. Since the time until the reaction peak disappears after reaching 175 degreeC is less than 30 minutes, it is possible to harden in a short time. The adhesive sheet of the present invention further has the following properties. That is, the 200 degreeC tensile storage elastic modulus obtained by measuring the viscoelasticity of the hardened|cured material obtained by making it harden|cure by heating at 175 degreeC for 30 minutes at 10 Hz is 100 MPa or more. Since the tensile storage elastic modulus of 200 degreeC is 100 MPa or more, it is possible to reduce the vibration of a semiconductor chip, and the bonding defect of a copper wire and a pad, and the crack of a semiconductor chip can be reduced.

The adhesive sheet of the present invention preferably further has the following properties. That is, it is preferable that the amount of reaction heat obtained by DSC measurement under the conditions of heating up the range of 25 degreeC - 300 degreeC at 10 degreeC per minute is 80 mJ/mg or more.

The adhesive sheet of the present invention preferably further has the following properties. That is, it is preferable that Tg of the hardened|cured material obtained by making it harden|cure by heating at 175 degreeC for 30 minutes is 150 degreeC or more.

The adhesive sheet of the present invention preferably contains a silica filler having a BET specific surface area of 4 m 2 /g or more. Content of a silica filler becomes like this. Preferably it is 50 weight% or more.

The adhesive sheet of this invention contains a resin component. Preferably, the resin component contains an epoxy resin, a phenol resin and an acrylic resin. More preferably, content of the acrylic resin in 100 weight% of resin components is 14 weight% or less. The hydroxyl equivalent of a phenol resin becomes like this. Preferably it is 120 g/eq. is below.

The present invention also relates to a dicing sheet comprising a base material and an adhesive layer disposed on the base material, and an adhesive sheet with a dicing sheet comprising an adhesive sheet disposed on the pressure sensitive adhesive layer.

The present invention also provides a process for preparing an adhesive sheet with a dicing sheet attached thereto; a process for pressing a semiconductor wafer to the adhesive sheet; A step of forming a die-bonding chip having an adhesive film disposed on a semiconductor chip; a step of forming an adherend to which the chip is attached by pressing the die-bonding chip to an adherend having a terminal portion; It includes a step of curing the adhesive film by heating the adherend, a step of bonding one end of a copper-containing wire to a pad, and a step of bonding the other end of the wire to a terminal portion, which is carried out after the step of curing the adhesive film It relates to a method of manufacturing a semiconductor device comprising the step of:

1 is a schematic cross-sectional view of an adhesive sheet.
Fig. 2 is a schematic cross-sectional view of an adhesive sheet with a dicing sheet attached thereto.
3 is a schematic cross-sectional view of an adhesive sheet with a dicing sheet according to a modification.
It is sectional drawing which shows the outline of a mode that the semiconductor wafer has been arrange|positioned on the adhesive sheet with a dicing sheet.
5 : is sectional drawing which shows the outline of a mode that the semiconductor wafer was divided into pieces.
6 is a schematic cross-sectional view of an adherend to which a semiconductor chip is attached.
7 is a schematic cross-sectional view of a semiconductor device.
Fig. 8 is a DSC curve of Example 2.

EMBODIMENT OF THE INVENTION Although an embodiment is given below and this invention is demonstrated in detail, this invention is not limited only to these embodiment.

[Embodiment 1]

(Adhesive sheet (3))

As shown in FIG. 1, the form of the adhesive sheet 3 is sheet-like. The adhesive sheet 3 has thermosetting properties.

The adhesive sheet 3 further has the following properties. That is, in the DSC curve drawn by DSC measurement under the condition that the temperature is raised from 25°C to 175°C for 3 minutes and then maintained at 175°C for 3 hours, the time from reaching 175°C until the reaction peak disappears is less than 30 minutes. Since the time until the reaction peak disappears after reaching 175 degreeC is less than 30 minutes, it is possible to harden in a short time. Moreover, it is possible to completely or substantially completely harden under standard wire bonding conditions, and it can reduce the vibration of a semiconductor chip. The time from reaching 175 degreeC until the reaction peak disappears becomes like this. Preferably it is less than 25 minutes. On the other hand, the lower limit of the time from reaching 175°C until the reaction peak disappears is, for example, 5 minutes, 10 minutes, 15 minutes, or the like.

"The reaction peak disappears" means that the difference in the input of thermal energy per unit time applied to the sample for measurement and the sample for reference becomes constant so that the temperature of the sample for measurement and the sample for reference become the same.

Time until the reaction peak disappears after reaching 175 degreeC is controllable with the kind of hardening accelerator, content of a hardening accelerator, the kind of resin, etc.

Preferably, the adhesive sheet 3 further has the following properties. That is, the amount of heat of reaction obtained by DSC measurement under the condition that the temperature in the range of 25°C to 300°C is raised at 10°C per minute is 80 mJ/mg or more, more preferably 85 mJ/mg or more. On the other hand, the heat of reaction is preferably 300 mJ/mg or less, and more preferably 200 mJ/mg or less.

The "reaction calorific value" is a value calculated by dividing the calorific value measured by DSC measurement under the condition that the temperature in the range of 25°C to 300°C is raised at 10°C per minute by the weight of the test piece.

The tensile storage elastic modulus at 200 degreeC obtained by measuring the viscoelasticity of the hardened|cured material obtained by hardening the adhesive sheet 3 at 10 Hz is 100 MPa or more, Preferably it is 200 MPa or more. Since it is 100 MPa or more, it is possible to reduce the vibration of a semiconductor chip, and it can reduce the bonding defect of a copper wire and a pad, and the crack of a semiconductor chip. The tensile storage modulus at 200°C becomes like this. Preferably it is 1000 MPa or less, More preferably, it is 700 MPa or less. As an upper limit of a 200 degreeC tensile storage elastic modulus, 500 MPa, 400 MPa, etc. can also be illustrated, for example.

In addition, hardened|cured material is obtained by heating and hardening the adhesive sheet 3 at 175 degreeC for 30 minutes.

The 200 degreeC tensile storage elastic modulus of hardened|cured material is controllable with the hydroxyl equivalent of a phenol resin, content of a silica filler, the particle diameter of a silica filler, etc. For example, a 200 degreeC tensile storage elastic modulus can be raised by using a phenol resin with a small hydroxyl equivalent, increasing content of a silica filler, and using a silica filler with a small particle size.

Tg of hardened|cured material becomes like this. Preferably it is 150 degreeC or more, More preferably, it is 180 degreeC or more. If it is 150 degreeC or more, it will be easy to set the 200 degreeC tensile storage elastic modulus of hardened|cured material to 100 MPa or more. On the other hand, Tg of hardened|cured material becomes like this. Preferably it is 250 degrees C or less, More preferably, it is 220 degrees C or less.

Tg ("glass transition temperature") of hardened|cured material is controllable by the hydroxyl equivalent of a phenol resin, etc.

The adhesive sheet 3 contains a resin component. As a resin component, an acrylic resin, an epoxy resin, a phenol resin, etc. are mentioned.

The acrylic resin is not particularly limited, and a polymer containing as a component one or two or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms, particularly having 4 to 18 carbon atoms (acrylic copolymer) synthesis) and the like. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, an amyl group, an isoamyl group, a hexyl group, a heptyl group, a cyclohexyl group, 2 -Ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group, or dodecyl group and the like.

Moreover, it does not specifically limit as another monomer which forms a polymer (acrylic copolymer), For example, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, or crotonic acid carboxyl group-containing monomers such as, etc., acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, (meth)acrylic acid 4-hydroxybutyl, ( (meth)acrylic acid 6-hydroxyhexyl, (meth)acrylic acid 8-hydroxyoctyl, (meth)acrylic acid 10-hydroxydecyl, (meth)acrylic acid 12-hydroxylauryl or (4-hydroxymethylcyclohexyl)- Hydroxyl group-containing monomers such as methyl acrylate, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate or (meth) sulfonic acid group-containing monomers such as acryloyloxynaphthalenesulfonic acid, or phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate.

Among acrylic resins, it is preferable that a weight average molecular weight is 100,000 or more, It is more preferable that it is 300,000-3 million, It is still more preferable that it is 500,000-2 million. It is because it is excellent in adhesiveness and heat resistance as it is in this numerical range. In addition, a weight average molecular weight is the value computed by polystyrene conversion by measuring by GPC (gel permeation chromatography).

It is preferable that an acrylic resin contains the functional group which can react with an epoxy group. Thereby, an acrylic resin can be bridge|crosslinked with an epoxy resin.

As a functional group which can react with an epoxy group, a carboxyl group, a hydroxyl group, etc. are mentioned, for example. Especially, since the reactivity with an epoxy group is high, a carboxyl group is preferable.

The acid value of the acrylic resin is preferably 5 mgKOH/g or more, and more preferably 10 mgKOH/g or more. On the other hand, the acid value of an acrylic resin becomes like this. Preferably it is 40 mgKOH/g or less, More preferably, it is 25 mgKOH/g or less.

In addition, an acid value can be measured by the neutralization titration method prescribed|regulated to JISK0070-1992.

Content of the acrylic resin in 100 weight% of resin components becomes like this. Preferably it is 14 weight% or less, More preferably, it is 12 weight% or less, More preferably, it is 11 weight% or less. If it is 14 weight% or less, a 200 degreeC tensile storage elastic modulus can be raised. Content of the acrylic resin in 100 weight% of resin components becomes like this. Preferably it is 5 weight% or more, More preferably, it is 7 weight% or more.

The epoxy resin is not particularly limited, and for example, bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol furnace Bifunctional epoxy resins and polyfunctional epoxy resins such as bolac type, ortho cresol novolak type, trishydroxyphenylmethane type, tetraphenylethane type, or hydantoin type, trisglycidyl isocyanurate type, or glycyrrhizin Epoxy resins, such as a dilamine type, are used. Among these epoxy resins, a novolak-type epoxy resin, a biphenyl-type epoxy resin, a trishydroxyphenylmethane-type resin, or a tetraphenylolethane-type epoxy resin is particularly preferable. It is because these epoxy resins are rich in reactivity with the phenol resin as a hardening|curing agent, and are excellent in heat resistance etc.

The epoxy equivalent of the epoxy resin is preferably 120 g/eq. above, more preferably 140 g/eq. or more, more preferably 150 g/eq. More than that. On the other hand, the epoxy equivalent of an epoxy resin becomes like this. Preferably it is 250 g/eq. Below, more preferably 200 g/eq. is below.

In addition, the epoxy equivalent of an epoxy resin can be measured by the method prescribed|regulated to JISK7236-2009.

A phenol resin acts as a hardening|curing agent of an epoxy resin, For example, Novolak types, such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, tert- butylphenol novolak resin, a nonylphenol novolak resin. Polyoxystyrene, such as a phenol resin, a resol type phenol resin, and polyparaoxystyrene, etc. are mentioned. Among these phenol resins, a phenol novolak resin and a phenol aralkyl resin are particularly preferable. This is because the connection reliability of the semiconductor device can be improved.

The hydroxyl equivalent of a phenol resin becomes like this. Preferably it is 120 g/eq. Hereinafter, more preferably 110 g/eq. is below. 120 g/eq. If it is below, it is possible to raise a crosslinking density, and a 200 degreeC tensile storage elastic modulus can be raised. On the other hand, the hydroxyl equivalent of a phenol resin becomes like this. Preferably it is 80 g/eq. or more, more preferably 90 g/eq. More than that.

It is preferable to mix|blend so that the compounding ratio of an epoxy resin and a phenol resin may become 0.5-2.0 equivalent of the hydroxyl group in a phenol resin per 1 equivalent of epoxy groups in an epoxy resin component, for example. More preferably, it is 0.8-1.2 equivalent. That is, when the mixing ratio of both is out of this range, it is because sufficient hardening reaction does not advance and the characteristic of hardened|cured material deteriorates easily.

The total content of the epoxy resin and the phenol resin in 100% by weight of the resin component is preferably 86% by weight or more, more preferably 88% by weight or more, still more preferably 89% by weight or more. If it is 86 weight% or more, a 200 degreeC tensile storage elastic modulus can be raised. On the other hand, total content of an epoxy resin and a phenol resin becomes like this. Preferably it is 95 weight% or less, More preferably, it is 93 weight% or less.

It is preferable that the adhesive sheet 3 contains a silica filler with a BET specific surface area of 4 m<2>/g or more.

The BET specific surface area of the silica filler is preferably 15 m 2 /g or more. On the other hand, the BET specific surface area of the silica filler is preferably 100 m 2 /g or less, more preferably 50 m 2 /g or less.

The BET specific surface area is measured by the BET adsorption method (multipoint method). Specifically, the adhesive sheet 3 is incinerated by heating at 700°C for 2 hours in an atmospheric atmosphere. After vacuum degassing of the obtained ash content at 110 degreeC and 6 hours or more, it measures under the temperature of 77.35 K in nitrogen gas using the Quantachrome 4-type specific surface area and pore distribution measuring apparatus "NOVA-4200e type".

The new Mohs hardness of the silica filler is preferably 4 or more. If it is 4 or more, a 200 degreeC tensile storage elastic modulus can be raised effectively. Although the upper limit of the New Mohs' Hardness of a silica filler is not specifically limited, For example, it is 10.

Content of the silica filler in the adhesive sheet 3 becomes like this. Preferably it is 50 weight% or more, More preferably, it is 51 weight% or more. If it is 50 weight% or more, a 200 degreeC tensile storage elastic modulus can be raised. On the other hand, content of a silica filler becomes like this. Preferably it is 70 weight% or less, More preferably, it is 65 weight% or less.

The adhesive sheet 3 preferably contains a curing accelerator. To [ content of a hardening accelerator / 100 weight part of resin components ], Preferably it is 0.1-5 weight part, More preferably, it is 0.1-3 weight part. If it is 0.1 weight part or more, it is possible to harden in a short time.

It does not specifically limit as a hardening accelerator, For example, an imidazole type compound, a triphenylphosphine type compound, an amine type compound, a triphenylborane type compound, a trihalogen borane type compound, etc. are mentioned.

Examples of the imidazole-based compound include 2-methylimidazole (trade name; 2MZ), 2-undecylimidazole (trade name; C11Z), 2-heptadecylimidazole (trade name; C17Z), and 1,2-dimethyl Midazole (trade name; 1.2 DMZ), 2-ethyl-4-methylimidazole (trade name; 2E4MZ), 2-phenylimidazole (trade name; 2PZ), 2-phenyl-4-methylimidazole (trade name; 2P4MZ), 1-benzyl-2-methylimidazole (trade name; 1B2MZ), 1-benzyl-2-phenylimidazole (trade name; 1B2PZ), 1-cyanoethyl-2-methylimidazole (trade name; 2MZ-CN), 1-cyanoethyl-2-undecylimidazole (trade name; C11Z-CN), 1-cyanoethyl-2-phenylimidazolium trimellitate (trade name; 2PZCNS-PW), 2 ,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine (trade name; 2MZ-A), 2,4-diamino-6-[2'- Undecylimidazolyl-(1')]-ethyl-s-triazine (trade name; C11Z-A), 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-( 1')]-ethyl-s-triazine (trade name; 2E4MZ-A), 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazineisocia Nuric acid adduct (trade name; 2MA-OK), 2-phenyl-4,5-dihydroxymethylimidazole (trade name; 2PHZ-PW), 2-phenyl-4-methyl-5-hydroxymethylimida Sol (brand name; 2P4MHZ-PW) etc. are mentioned (all are Shikoku Chemical Co., Ltd. product).

The triphenylphosphine-based compound is not particularly limited, and for example, triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, tri(nonylphenyl)phosphine, diphenyltolylphosphine, etc. Organophosphine, tetraphenylphosphonium bromide (trade name; TPP-PB), methyltriphenylphosphonium (trade name; TPP-MB), methyltriphenylphosphonium chloride (trade name; TPP-MC), methoxymethyltriphenylphosphine Phonium (trade name; TPP-MOC), benzyl triphenyl phosphonium chloride (trade name; TPP-ZC), etc. are mentioned (all are the Hokko Chemical company make).

It does not specifically limit as a triphenylborane type compound, For example, tri(p-methylphenyl)phosphine etc. are mentioned. Moreover, as a triphenylborane type compound, what has a triphenylphosphine structure is also contained. It does not specifically limit as a compound which has a triphenylphosphine structure and a triphenylborane structure, For example, tetraphenylphosphonium tetraphenylborate (trade name; TPP-K), tetraphenylphosphonium tetra-p-triborate (trade name) ; TPP-MK), benzyl triphenylphosphonium tetraphenyl borate (trade name; TPP-ZK), and triphenylphosphine triphenylborane (trade name; TPP-S) (all manufactured by Hokko Chemical Corporation).

It does not specifically limit as an amino-type compound, For example, monoethanolamine trifluoroborate (made by Steracemipha Co., Ltd.), dicyandiamide (made by Nakaraitesk Co., Ltd.), etc. are mentioned.

It does not specifically limit as a trihalogen borane type compound, For example, trichloroborane etc. are mentioned.

The adhesive sheet 3 may contain suitably the compounding agent generally used for film manufacture, for example, a crosslinking agent, etc. other than the said component.

The adhesive sheet 3 can be manufactured by a conventional method. For example, by preparing an adhesive composition solution containing each of the above components, applying the adhesive composition solution to a predetermined thickness on a substrate separator to form a coating film, and drying the coating film, the adhesive sheet 3 can be produced have.

Although it does not specifically limit as a solvent used for an adhesive composition solution, The organic solvent which can melt|dissolve, knead|mix, or disperse|distribute each said component uniformly is preferable. For example, ketone solvents, such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetone, methyl ethyl ketone, and cyclohexanone, toluene, xylene, etc. are mentioned. The coating method is not specifically limited. As a method of solvent coating, a die coater, a gravure coater, a roll coater, a reverse coater, a comma coater, a pipe doctor coater, screen printing etc. are mentioned, for example. Especially, a die-coater is preferable at the point with high uniformity of application|coating thickness.

As the substrate separator, a plastic film or paper surface coated with a release agent such as polyethylene terephthalate (PET), polyethylene, polypropylene, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent can be used. As a coating method of an adhesive composition solution, roll coating, screen coating, gravure coating, etc. are mentioned, for example. Moreover, the drying conditions of a coating film are not specifically limited, For example, it can implement by 70-160 degreeC of drying temperature, and 1 to 5 minutes of drying time.

As a manufacturing method of the adhesive sheet 3, for example, the method of mixing each said component with a mixer, press-molding the obtained mixture, and manufacturing the adhesive sheet 3 etc. are also preferable. A planetary mixer etc. are mentioned as a mixer.

Although the thickness of the adhesive sheet 3 is not specifically limited, 5 micrometers or more are preferable, and 15 micrometers or more are more preferable. If it is less than 5 micrometers, the point which does not adhere|attach with the semiconductor wafer or semiconductor chip which a curvature arose may generate|occur|produce, and an adhesion|attachment area may become unstable. Moreover, 100 micrometers or less are preferable and, as for the thickness of the adhesive sheet 3, 50 micrometers or less are more preferable. When it exceeds 100 micrometers, the adhesive sheet 3 may protrude excessively by the load of a die attach, and may contaminate a pad.

The adhesive sheet 3 is used for manufacture of a semiconductor device. Specifically, it is used as a film for adhering a semiconductor chip and an adherend such as a lead frame (hereinafter referred to as a "die attach film"). A lead frame, an interposer, a semiconductor chip, etc. are mentioned as a to-be-adhered body.

It is preferable to use the adhesive sheet 3 in the form of the adhesive sheet with a dicing sheet.

(Adhesive sheet (10) with dicing sheet attached)

The adhesive sheet 10 with a dicing sheet is demonstrated.

As shown in FIG. 2 , the adhesive sheet 10 with a dicing sheet is provided with the dicing sheet 1 and the adhesive sheet 3 arrange|positioned on the dicing sheet 1 . The dicing sheet 1 is provided with the base material 11 and the adhesive layer 12 arrange|positioned on the base material 11. As shown in FIG. The adhesive sheet 3 is disposed on the pressure-sensitive adhesive layer 12 .

As shown in FIG. 3, the adhesive sheet 10 with a dicing sheet may have the structure in which the adhesive sheet 3 was formed only in the work piece (semiconductor wafer 4 etc.) pasting part.

The base material 11 serves as a strength matrix of the adhesive sheet 10 with a dicing sheet, and it is preferable to have ultraviolet transmittance. As the base material 11, for example, low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo polypropylene, polybutene, polymethylpentene, etc. of polyolefin, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, Polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfide, aramid (paper) , glass, glass cloth, fluororesin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil), paper, and the like.

The surface of the base material 11 is subjected to a conventional surface treatment, for example, chemical treatment such as chromic acid treatment, ozone exposure, flame exposure, high-pressure electric shock exposure, and ionizing radiation treatment, in order to improve adhesion to an adjacent layer, retainability, etc. Physical treatment and coating treatment with a primer (for example, an adhesive material to be described later) may be performed.

Although the thickness in particular of the base material 11 is not restrict|limited and can determine suitably, Generally, it is about 5-200 micrometers.

It does not restrict|limit especially as an adhesive used for formation of the adhesive layer 12, For example, common pressure-sensitive adhesives, such as an acrylic adhesive and a rubber-type adhesive, can be used. As the pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferable from the viewpoints of cleaning properties with organic solvents such as ultrapure water and alcohol for electronic components that are reluctant to contamination of semiconductor wafers and glass.

As the acrylic polymer, for example, (meth)acrylic acid alkyl ester (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester) Ester, isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester , hexadecyl ester, octadecyl ester, eicosyl ester, etc. of an alkyl group having 1 to 30 carbon atoms, especially a linear or branched chain alkyl ester having 4 to 18 carbon atoms) and (meth)acrylic acid cycloalkyl esters (for example, For example, the acrylic polymer etc. which used 1 type, or 2 or more types of cyclopentyl ester, cyclohexyl ester, etc.) as a monomer component are mentioned. In addition, (meth)acrylic acid ester refers to an acrylic acid ester and/or a methacrylic acid ester, and (meth) in the present invention has the same meaning.

The acrylic polymer may contain a unit corresponding to another monomer component copolymerizable with the (meth)acrylic acid alkyl ester or cycloalkyl ester if necessary for the purpose of modifying cohesive strength and heat resistance. Examples of such a monomer component include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers, such as itaconic acid anhydride; (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, (meth)acrylic acid 4-hydroxybutyl, (meth)acrylic acid 6-hydroxyhexyl , (meth)acrylic acid 8-hydroxyoctyl, (meth)acrylic acid 10-hydroxydecyl, (meth)acrylic acid 12-hydroxylauryl, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc. Monomer containing a hydroxyl group; Styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid Sulfonic acid group containing monomers, such as; Phosphoric acid group containing monomers, such as 2-hydroxyethyl acryloyl phosphate; Acrylamide, acrylonitrile, etc. are mentioned. These copolymerizable monomer components can be used 1 type or 2 or more types. As for the usage-amount of these copolymerizable monomers, 40 weight% or less of all the monomer components is preferable.

Moreover, in order to bridge|crosslink an acrylic polymer, a polyfunctional monomer etc. can also be contained as a monomer component for copolymerization as needed. As such a polyfunctional monomer, for example, hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) ) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylic a rate, polyester (meth)acrylate, urethane (meth)acrylate, etc. are mentioned. These polyfunctional monomers can also be used 1 type or 2 or more types. As for the usage-amount of a polyfunctional monomer, from points, such as an adhesive characteristic, 30 weight% or less of all the monomer components is preferable.

The acrylic polymer is obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization. Superposition|polymerization can also be implemented by any method, such as solution polymerization, emulsion polymerization, block polymerization, and suspension polymerization. From the viewpoint of preventing contamination on a clean adherend, it is preferable that the content of the low-molecular-weight substance is small. From this point, the number average molecular weight of the acrylic polymer is preferably 300,000 or more, and more preferably about 400,000 to 3,000,000.

Moreover, in order to raise the number average molecular weight of the acrylic polymer etc. which are a base polymer to the said adhesive, an external crosslinking agent can also be employ|adopted suitably. As a specific means of an external crosslinking method, the method of adding so-called crosslinking agents, such as a polyisocyanate compound, an epoxy compound, an aziridine compound, and a melamine type crosslinking agent, and making it react is mentioned. When using an external crosslinking agent, the usage-amount is suitably determined by the balance with the base polymer to be bridge|crosslinked, Furthermore, by the use use as an adhesive. Generally, it is about 5 weight part or less with respect to 100 weight part of said base polymers, Furthermore, it is preferable to mix|blend 0.1-5 weight part. In addition, you may use additives, such as conventionally well-known various tackifiers and antioxidant, other than the said component as needed for an adhesive.

The pressure-sensitive adhesive layer 12 can be formed with a radiation-curing pressure-sensitive adhesive. The radiation-curing pressure-sensitive adhesive can increase the degree of crosslinking by irradiation with radiation such as ultraviolet rays, thereby reducing the adhesive strength easily.

By irradiating only the part 12a corresponding to the work affixing part of the adhesive layer 12 shown in FIG. 2 with radiation, the difference of adhesive force with the other part 12b can be formed. In this case, the said portion 12b formed of an uncured radiation-curing pressure-sensitive adhesive is adhered to the adhesive sheet 3, so that the holding force at the time of dicing can be ensured.

Moreover, by hardening the radiation-curing adhesive layer 12 according to the adhesive sheet 3 shown in FIG. 3, the said part 12a in which adhesive force fell remarkably can be formed. In this case, the wafer ring can be fixed to the said part 12b which is formed by the uncured radiation-curable adhesive.

In other words, when the pressure-sensitive adhesive layer 12 is formed with a radiation-curing pressure-sensitive adhesive, the portion 12a is formed such that the adhesive force of the portion 12a in the pressure-sensitive adhesive layer 12 < the adhesive force of the other portions 12b. Irradiation is preferable.

A radiation-curable pressure-sensitive adhesive having a radiation-curable functional group such as a carbon-carbon double bond and exhibiting adhesiveness can be used without particular limitation. Examples of the radiation-curable pressure-sensitive adhesive include an addition-type radiation-curable pressure-sensitive adhesive in which a radiation curable monomer component or an oligomer component is blended with a general pressure-sensitive adhesive such as the acrylic pressure-sensitive adhesive or rubber pressure-sensitive adhesive.

As the radiation-curable monomer component to be blended, for example, urethane oligomer, urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth) ) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate and the like. The radiation-curable oligomer component includes various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and the molecular weight is suitably in the range of about 100 to 30000. The compounding quantity of a radiation-curable monomer component and an oligomer component can determine suitably the quantity which can reduce the adhesive force of an adhesive layer according to the kind of the said adhesive layer. Generally, it is 5-500 weight part with respect to 100 weight part of base polymers, such as an acrylic polymer which comprises an adhesive, Preferably it is about 40-150 weight part.

Further, as the radiation-curable pressure-sensitive adhesive, in addition to the additive-type radiation-curable pressure-sensitive adhesive described above, an internal type radiation-curable pressure-sensitive adhesive using a base polymer having a carbon-carbon double bond in the polymer side chain or main chain or at the end of the main chain can be mentioned. have. The built-in radiation-curable pressure-sensitive adhesive does not contain, or contains most of, the oligomer component, which is a low-molecular component. It is preferable because it can form a layer.

As the base polymer having a carbon-carbon double bond, a base polymer having a carbon-carbon double bond and adhesiveness may be used without particular limitation. As such a base polymer, it is preferable to use an acrylic polymer as a basic skeleton. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

The method of introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods may be employed. However, introducing the carbon-carbon double bond into the side chain of the polymer is easy for molecular design. For example, after copolymerizing a monomer having a functional group with an acrylic polymer in advance, a compound having a functional group capable of reacting with this functional group and a carbon-carbon double bond is condensed while maintaining the radiation curability of the carbon-carbon double bond. Or the method of making an addition reaction is mentioned.

Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, and a hydroxyl group and an isocyanate group. Among the combinations of these functional groups, a combination of a hydroxyl group and an isocyanate group is preferable from the viewpoint of easiness of reaction tracking. In addition, as long as the combination of these functional groups produces the acrylic polymer having the carbon-carbon double bond, the functional group may be on either side of the acrylic polymer or the compound. In the above preferred combination, the acrylic polymer is hydroxyl It has a real group, and the case where the said compound has an isocyanate group is preferable. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, and the like. can Moreover, as an acryl-type polymer, what copolymerized the ether compound of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethyleneglucol monovinyl ether, etc. with the hydroxyl-group containing monomer illustrated above is used.

For the built-in radiation-curable pressure-sensitive adhesive, the base polymer having a carbon-carbon double bond (especially an acrylic polymer) may be used alone, but the radiation-curable monomer component or oligomer component may be blended to such an extent that the properties are not deteriorated. have. The amount of the radiation-curable oligomer component is usually in the range of 30 parts by weight, preferably in the range of 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

The said radiation-curable adhesive is made to contain a photoinitiator, when hardening by an ultraviolet-ray etc. As a photoinitiator, 4-(2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, 2-methyl- α-ketol compounds such as 2-hydroxypropiophenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 2,2-diethoxyacetophenone Acetophenone compounds such as , 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropane-1; benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether, etc. Benzoin ether compounds; Ketal compounds such as benzyldimethyl ketal; Aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl) ) Photoactive oxime compounds such as oxime; Benzophenone compounds such as benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthi Tea such as oxanthone, 2,4-dimethyl thioxanthone, isopropyl thioxanthone, 2,4-dichlorothioxanthone, 2,4-diethyl thioxanthone, and 2,4-diisopropyl thioxanthone Oxanthone type compound; Camphorquinone; Halogenated ketone; Acyl phosphinoxide; Acyl phosphonate, etc. are mentioned. The compounding quantity of a photoinitiator is about 0.05-20 weight part with respect to 100 weight part of base polymers, such as an acrylic polymer which comprises an adhesive, for example.

Moreover, as a radiation-curable adhesive, for example, the addition-polymerizable compound which has two or more unsaturated bonds which are disclosed in Unexamined-Japanese-Patent No. 60-196956, photopolymerizable compounds, such as the alkoxysilane which has an epoxy group, Carr and rubber-based pressure-sensitive adhesives and acrylic pressure-sensitive adhesives containing a photopolymerization initiator such as a bornyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.

The radiation-curable pressure-sensitive adhesive layer 12 may contain a compound colored by radiation as needed. By containing the compound to be colored by irradiation with radiation in the pressure-sensitive adhesive layer 12, only the portion irradiated with radiation can be colored. The compound colored by irradiation with radiation is colorless or pale before irradiation, but is a compound that becomes colored by irradiation with radiation, and examples thereof include leuco dye. The use ratio of the compound colored by irradiation with radiation can be set suitably.

Although the thickness of the adhesive layer 12 is not specifically limited, It is preferable that it is about 1-50 micrometers from points, such as loss prevention of a chip|tip cut surface, compatibility of fixing hold|maintenance of the adhesive sheet 3, etc. Preferably it is 2-30 micrometers, Furthermore, 5-25 micrometers is preferable.

It is preferable that the adhesive sheet 10 with a dicing sheet is protected with a separator (not shown). That is, it is preferable that the separator is arrange|positioned on the adhesive sheet 3 . A separator has a function as a protective material which protects the adhesive sheet 3 until it uses for practical use. The separator is peeled off when sticking a work on the adhesive sheet 3 . As the separator, a plastic film or paper surface coated with a release agent such as polyethylene terephthalate (PET), polyethylene, polypropylene, a fluorine-based release agent or a long-chain alkyl acrylate-based release agent can be used.

The adhesive sheet 10 with a dicing sheet can be manufactured by a conventional method. For example, by bonding the adhesive layer 12 and the adhesive sheet 3 of the dicing sheet 1 together, the adhesive sheet 10 with a dicing sheet can be manufactured.

The peeling force when the adhesive sheet 3 is peeled off from the dicing sheet 1 under conditions of a peeling temperature of 25 degreeC and a peeling rate of 300 mm/min becomes like this. Preferably it is 0.1 N/10mm or more. If it is less than 0.1 N/10 mm, there exists a possibility that chip|tip scattering may generate|occur|produce. On the other hand, the peeling force becomes like this. Preferably it is 0.2 N/10 mm or less. When it exceeds 0.2 N/10 mm, there exists a tendency for a pickup to become difficult.

(Method for manufacturing semiconductor device)

As shown in FIG. 4, the semiconductor wafer 4 is crimped|bonded with the adhesive sheet 10 with a dicing sheet. As the semiconductor wafer 4, a silicon wafer, a silicon carbide wafer, a compound semiconductor wafer, etc. are mentioned. As a compound semiconductor wafer, a gallium nitride wafer etc. are mentioned.

As a crimping|compression-bonding method, the method of pressurization by press means, such as a crimping|compression-bonding roll, etc. are mentioned, for example.

35 degreeC or more is preferable and, as for the crimping|compression-bonding temperature (sticking temperature), 37 degreeC or more is more preferable. The upper limit of the crimping temperature is preferably low, preferably 50°C or lower, more preferably 45°C or lower. By crimping at a low temperature, it is possible to prevent thermal influence on the semiconductor wafer 4 , and curvature of the semiconductor wafer 4 can be suppressed. Moreover, it is preferable that they are 1x10 ⁵ Pa - 1x10 ⁷ Pa, and, as for a pressure, it is more preferable that they are 2x10 ⁵ Pa - 8x10 ⁶ Pa.

As shown in FIG. 5 , the die bonding chip 41 is formed by dicing the semiconductor wafer 4 . The die bonding chip 41 includes a semiconductor chip 5 and an adhesive film 31 disposed on the semiconductor chip 5 . The semiconductor chip 5 includes a chip body 502 and a pad 501 disposed on the chip body 502 . The pad 501 is an electrode pad. As a material of the pad 501, aluminum etc. are mentioned. In this process, the cutting method etc. called full cut which cut to the adhesive sheet 10 with a dicing sheet are employable. It does not specifically limit as a dicing apparatus, A conventionally well-known thing can be used. Moreover, since the semiconductor wafer 4 is adhesively fixed by the adhesive sheet 10 with a dicing sheet, chip|tip defect and chip scattering can be suppressed, and damage to the semiconductor wafer 4 can also be suppressed. can

The die bonding chip 41 is picked up. It does not specifically limit as a method of pickup, A conventionally well-known various method is employable. For example, a method in which the individual semiconductor chips 5 are pushed up by a needle from the side of the adhesive sheet 10 to which the dicing sheet is attached, and then the die bonding chips 41 are picked up by a pickup device, etc. can

When the adhesive layer 12 is an ultraviolet curing type, it picks up after irradiating an ultraviolet-ray to the adhesive layer 12. Thereby, since the adhesive force with respect to the chip|tip 41 for die bonding of the adhesive layer 12 falls, the chip|tip 41 for die bonding can be picked up easily. Conditions, such as irradiation intensity at the time of ultraviolet irradiation, irradiation time, are not specifically limited, What is necessary is just to set suitably as needed.

As shown in FIG. 6, the to-be-adhered body 61 with a semiconductor chip is obtained by crimping|bonding the die-bonding chip 41 to the to-be-adhered body 6. As shown in FIG. An adherend 61 with a semiconductor chip includes an adherend 6 , an adhesive film 31 disposed on the adherend 6 , and a semiconductor chip 5 disposed on the adhesive film 31 . . The adherend 6 includes a body portion 602 and a terminal portion 601 disposed on the body portion 602 .

The temperature at which the die bonding chip 41 is pressed against the adherend 6 (hereinafter referred to as "die attach temperature") is preferably 80°C or higher, more preferably 90°C or higher. Further, the die attach temperature is preferably 150°C or less, and more preferably 130°C or less.

The adhesive film 31 is cured by heating the adherend 61 to which the semiconductor chip is attached under pressure. Thereby, the semiconductor chip 5 is fixed to the to-be-adhered body 6 . By curing the adhesive film 31 under pressure, it is possible to eliminate voids existing between the adhesive film 31 and the adherend 6 , so that the area in which the adhesive film 31 is in contact with the adherend 6 . can be obtained

As a method of heating under pressure, the method of heating the to-be-adhered body 61 with a semiconductor chip arrange|positioned in the chamber filled with inert gas, etc. are mentioned, for example. The pressure of the pressurized atmosphere is preferably 0.5 kg/cm2 (4.9×10 ^-2 MPa) or more, more preferably 1 kg/cm2 (9.8×10 ^-2 MPa) or more, still more preferably 5 kg/cm2 (9.8×10 -2 MPa) or more. cm2 (4.9 × 10 ^-1 MPa) or more. If it is 0.5 kg/cm2 or more, the void existing between the adhesive film 31 and the to-be-adhered body 6 can be extinguished easily. The pressure of the pressurized atmosphere is preferably 20 kg/cm2 (1.96 MPa) or less, more preferably 18 kg/cm2 (1.77 MPa) or less, still more preferably 15 kg/cm2 (1.47 MPa) or less. . If it is 20 kg/cm2 or less, the protrusion of the adhesive film 31 by excessive pressurization can be suppressed.

The heating temperature is preferably 80°C or higher, more preferably 120°C or higher, still more preferably 150°C or higher, and particularly preferably 170°C or higher. It is possible to make the adhesive film 31 into moderate hardness as it is 80 degreeC or more, and a pressurization cure can lose|disappear a void effectively. Heating temperature becomes like this. Preferably it is 260 degrees C or less, More preferably, it is 200 degrees C or less, More preferably, it is 180 degrees C or less. Decomposition of the adhesive film 31 can be prevented as it is 260 degrees C or less.

Heating time becomes like this. Preferably it is 0.1 hour or more, More preferably, it is 0.2 hour or more. The heating time is preferably 24 hours or less, more preferably 3 hours or less, still more preferably 1 hour or less, particularly preferably 30 minutes or less.

As shown in FIG. 7 , a wire bonding step of electrically connecting the pad 501 and the terminal portion 601 with the bonding wire 7 is performed. As a material of the bonding wire 7, copper etc. are mentioned.

The wire bonding step includes a step of bonding one end of the bonding wire 7 to the pad 501 , a step bonding the other end of the bonding wire 7 to the terminal portion 601 , and the like.

The step of joining one end of the bonding wire 7 and the pad 501 is specifically, by applying an ultrasonic wave to the bonding wire 7 while pressing the one end of the bonding wire 7 to the pad 501, whereby the bonding wire (7) and the pad 501 are joined together.

Preferably it is 175 degreeC or more, More preferably, it joins at 200 degreeC or more. On the other hand, preferably, it is 300 degrees C or less, More preferably, it joins at 260 degrees C or less.

Specifically, the step of joining the other end of the bonding wire 7 and the terminal portion 601 is by applying ultrasonic waves to the bonding wire 7 while pressing the other end of the bonding wire 7 to the terminal portion 601 . (7) and the terminal portion 601 are joined together.

After implementing a wire bonding process, the sealing process of sealing the semiconductor chip 5 with the sealing resin 8 is implemented. This step is carried out in order to protect the semiconductor chip 5 and the bonding wire 7 mounted on the adherend 6 . This process is performed by shape|molding resin for sealing with a metal mold|die. As the sealing resin 8, epoxy-type resin is used, for example. The heating temperature at the time of resin encapsulation is preferably 165°C or higher, more preferably 170°C or higher, and the heating temperature is preferably 185°C or lower, more preferably 180°C or lower.

If necessary, you may further heat after sealing (post-curing process). Thereby, the sealing resin 8 of insufficient hardening can be completely hardened by a sealing process. The heating temperature can be appropriately set.

As mentioned above, the process of preparing the adhesive sheet 10 with a dicing sheet, the process of crimping|bonding the semiconductor wafer 4 to the adhesive sheet 3, and the semiconductor wafer arrange|positioned on the adhesive sheet 3 ( 4) forming a die bonding chip 41 comprising a semiconductor chip 5 having a pad 501 and an adhesive film 31 disposed on the semiconductor chip 5 by dicing 4); A step of forming a chip-attached adherend 61 by pressing the die-bonding chip 41 against an adherend 6 having a terminal portion 601, and heating the chip-attached adherend 61 A step of curing the adhesive film (31), a step of bonding one end of a copper-containing wire (7) to a pad (501), and a step of bonding the other end of the wire (7) to a terminal portion (601), A semiconductor device can be manufactured by the method including the process performed after the process of hardening the adhesive film 31 .

Example

Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the following examples unless there is a departure from the gist of the present invention.

The component used in the Example is demonstrated.

Acrylic rubber: Teisan resin SG-708-6 manufactured by Nagase Chemtex Co., Ltd. (acrylic acid ester copolymer containing a carboxyl group and a hydroxyl group, Mw: 700,000, acid value: 9 mgKOH/g, glass transition temperature: 4°C)

Epoxy resin 1: EPPN-501HY manufactured by Nippon Kayaku Co., Ltd. (epoxy resin having an epoxy equivalent weight of 169 g/eq.)

Epoxy resin 2: EOCN-1020 manufactured by Nippon Kayaku Co., Ltd. (epoxy resin having an epoxy equivalent of 198 g/eq.)

Epoxy resin 3: jER828 manufactured by Mitsubishi Chemical Corporation (epoxy resin having an epoxy equivalent of 190 g/eq.)

Phenolic resin 1: MEH-7851S manufactured by Meiwa Chemicals (a phenol resin having a hydroxyl equivalent weight of 209 g/eq.)

Phenolic resin 2: P-180 by Arakawa Chemical Co., Ltd. (phenol resin having a hydroxyl equivalent weight of 105 g/eq.)

Silica filler: SO-25R manufactured by Admatex (BET specific surface area of 6.5 m 2 /g, spherical silica having New Mohs hardness of 7)

Catalyst: TPP-MK (tetraphenylphosphonium tetra-p-tolyl borate) manufactured by Hokko Chemical Industry Co., Ltd.

[Production of adhesive sheet and dicing sheet attached adhesive sheet]

According to the compounding ratio shown in Table 1, each component and solvent (methyl ethyl ketone) shown in Table 1 were placed in a stirring pot of a hybrid mixer (HM-500 manufactured by Keyence), and stirred and mixed for 3 minutes in a stirring mode. After apply|coating the obtained varnish to the mold release process film (MRA50 by Mitsubishi Resin Co., Ltd. product) with a die coater, it was made to dry and the 20-micrometer-thick adhesive sheet was obtained. A circular adhesive sheet having a diameter of 230 mm was cut from the adhesive sheet, and the circular adhesive sheet was affixed to the adhesive layer of a dicing sheet (P2130G manufactured by Nitto Denko Co., Ltd.) at 25° C., and the dicing sheet was attached to the adhesive sheet. made

[evaluation]

The following evaluation was performed about the obtained adhesive sheet and the adhesive sheet with a dicing sheet. A result is shown in Table 1.

(Measurement of storage modulus and Tg)

The adhesive sheet was bonded together at 60 degreeC, and the 400-micrometer-thick laminated sheet was obtained. A processed product was obtained by processing the lamination sheet into a size of 10 mm × 30 mm × 400 μm. The workpiece was cured by heating at 175°C for 30 minutes. After curing, the viscoelasticity of the processed product was measured using a dynamic viscoelasticity measuring device (RSA III manufactured by TA Instruments). Measurement conditions were implemented in the temperature range of -10 degreeC - 285 degreeC, the temperature increase rate of 10 degreeC/min, the distance between chuck|zippers 22.5 mm, and 10 Hz. From the obtained storage elastic modulus data, the 200 degreeC storage elastic modulus was read. Moreover, the temperature of the obtained peak of tan-delta was made into Tg.

(Measurement of heat of reaction)

A 10 mg test piece was cut from the adhesive sheet. A measurement sample was prepared by sandwiching the test piece with an aluminum pan. A reference sample made of only an aluminum pan was also prepared. Using a differential scanning calorimetry apparatus (DSC6220 manufactured by Seiko Instruments), it measured at a temperature increase rate of 10°C/min and a temperature range of 25°C to 300°C. The amount of heat of reaction was calculated by dividing the heat amount of the obtained exothermic reaction peak by the weight of the sample.

(Measurement of peak dissipation time)

A 10 mg test piece was cut from the adhesive sheet. A sample for measurement was prepared by sandwiching the test piece with an aluminum pan. A reference sample made of only an aluminum pan was also prepared. Using the differential operating calorimetry apparatus (the Seiko Instruments make, DSC6220), the temperature was raised from 25 degreeC to 175 degreeC for 3 minutes, and DSC measurement was carried out on the conditions which hold|maintain 175 degreeC next for 3 hours. The time until the reaction peak disappears after reaching 175 degreeC was read from the DSC curve. In addition, "reaction peak disappears" means that the difference in the input of thermal energy per unit time applied to both the sample for measurement and the sample for reference so that the temperature of the sample for reference becomes the same becomes constant. The DSC curve of Example 2 is shown in FIG.

(Wire Bonding)

The 100-micrometer-thick wafer for dicing was obtained by grinding the wafer which carried out aluminum vapor deposition on one side. A chip with an adhesive sheet was obtained by affixing the wafer for dicing to the adhesive sheet with a dicing sheet, and then dicing to 2 mm wide. The chip to which the adhesive sheet was attached was die-attached on a Cu lead frame under the conditions of 120 degreeC, 0.1 MPa, and 1 second. The adhesive sheet was hardened by heating at 175 degreeC for 30 minutes. Five Cu wires having a wire diameter of 20 µm were bonded to one chip using a wire bonding apparatus (Maxum Plus manufactured by K&S Corporation). A Cu wire was bonded to a Cu lead frame under the conditions of an output of 80 Amp, a time of 10 ms, and a load of 50 g. A Cu wire was bonded to the chip under conditions of 200°C, an output of 125 Amp, a time of 10 ms, and a load of 80 g. The case where one or more of 5 Cu wires could not be joined to a chip|tip was judged as x, and the case where 5 of 5 Cu wires could be joined to a chip|tip was determined as (circle).

10: adhesive sheet with dicing sheet attached
1: Dicing sheet
11: description
12: adhesive layer
3: adhesive sheet
4: semiconductor wafer
5: semiconductor chip
501: pad
502: chip body
41: die bonding chip
6: adherend
601: terminal part
602: body part
61: an adherend to which a semiconductor chip is attached
7: bonding wire
8: encapsulating resin

Claims (9)

In the DSC curve drawn by DSC (Differential Scanning Calorimetry) measurement under the condition that the temperature is raised from 25°C to 175°C for 3 minutes and then maintained at 175°C for 3 hours, from reaching 175°C until the reaction peak disappears time is less than 30 minutes,
The adhesive sheet used for manufacture of a semiconductor device whose tensile storage elastic modulus at 200 degreeC obtained by measuring the viscoelasticity of the hardened|cured material obtained by making it harden|cure by heating at 175 degreeC for 30 minutes at 10 Hz is 100 MPa or more. The method of claim 1,
The adhesive sheet in which the amount of reaction heat obtained by DSC measurement under the conditions which heats up the range of 25 degreeC - 300 degreeC at 10 degreeC per minute is 80 mJ/mg or more. The method of claim 1,
The adhesive sheet whose glass transition temperature (Tg) of the hardened|cured material obtained by making it harden|cure by heating at 175 degreeC for 30 minutes is 150 degreeC or more. The method of claim 1,
It contains a silica filler with a Brunauer-Emmett-Teller (BET) specific surface area of 4 m 2 /g or more,
The adhesive sheet whose content of the said silica filler is 50 weight% or more. The method of claim 1,
A hydroxyl equivalent of 120 g/eq. The adhesive sheet containing the following phenol resins. The method of claim 1,
contains a resin component,
The resin component contains an epoxy resin, a phenol resin and an acrylic resin,
The adhesive sheet, wherein the content of the acrylic resin in 100% by weight of the resin component is 14% by weight or less. 7. The method of claim 6,
The hydroxyl equivalent of the phenol resin is 120 g/eq. Below, the adhesive sheet. A dicing sheet comprising a substrate and a pressure-sensitive adhesive layer disposed on the substrate;
The adhesive sheet with a dicing sheet provided with the adhesive sheet of Claim 1 arrange|positioned on the said adhesive layer. A step of preparing the adhesive sheet with the dicing sheet according to claim 8;
a step of pressing the semiconductor wafer to the adhesive sheet;
forming a die bonding chip comprising a semiconductor chip having a pad and an adhesive film disposed on the semiconductor chip by dicing the semiconductor wafer disposed on the adhesive sheet;
forming an adherend to which the chip is attached by pressing the die-bonding chip to an adherend having a terminal portion;
curing the adhesive film by heating the adherend to which the chip is attached;
Including a wire bonding process carried out after the process of curing the adhesive film,
The method of manufacturing a semiconductor device, wherein the wire bonding step includes bonding one end of a copper-containing wire to the pad, and bonding the other end of the wire to the terminal portion.

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