KR102406629B1 - A lens moving unit, and camera module and optical instrument including the same - Google Patents

Abstract

The embodiment is a housing including a groove portion disposed on the upper surface, a bobbin disposed inside the housing, a coil disposed on the bobbin, a coil chip disposed within the groove portion of the housing and generating an induced voltage according to mutual induction with the coil, disposed in the housing a magnet, a first upper spring and a second upper spring coupled to an upper portion of the bobbin and an upper portion of the housing, a circuit board disposed under the housing, and a support member electrically connecting the first and second upper springs to the circuit board includes

Description

A lens driving device, and a camera module and optical device including the same

The embodiment relates to a lens driving device, a camera module and an optical device including the same.

Since it is difficult to apply the technology of a voice coil motor (VCM) used in an existing general camera module to a camera module for ultra-small size and low power consumption, research related thereto has been actively conducted.

In the case of a camera module mounted on a small electronic product such as a smartphone, the camera module may frequently be impacted during use, and the camera module may be slightly shaken according to a user's hand shake while shooting. In consideration of this point, a technology for additionally installing an anti-shake means to a camera module has been recently developed. For details on the camera module, see Korean Patent Application Laid-Open No. 10-2015-0008662 (published on January 23, 2015). 1) and US Patent Publication No. US 2011/0141564 (published on June 16, 2011).

The embodiment can secure a high induced voltage, reduce the influence of the magnet to accurately detect the displacement of the bobbin, and improve the accuracy of AF feedback driving, and a camera module and optical including the same provide the device.

A lens driving device according to an embodiment includes a housing including a groove portion disposed on an upper surface; a bobbin disposed inside the housing; a coil disposed on the bobbin; a coil chip disposed in the groove of the housing and generating an induced voltage according to mutual induction with the coil; a magnet disposed on the housing; a first upper spring and a second upper spring coupled to an upper portion of the bobbin and an upper portion of the housing; a circuit board disposed under the housing; and a support member electrically connecting the first and second upper springs to the circuit board.

The coil chip includes a coil unit, a first electrode connected to one end of the coil unit, and a second electrode connected to the other end of the coil unit, wherein the first upper spring is connected to the first electrode; A second upper spring may be connected to the second electrode.

The housing may include corner portions and side portions disposed between the corner portions, and the groove portion may be disposed on any one of the corner portions or any one of the side portions.

The groove portion may be disposed on an inner surface of any one of the corner portions or an upper surface of any one of the side portions.

The coil chip may be disposed on the first coil, and the coil chip may not overlap the magnet in an optical axis direction.

In the initial position of the bobbin, the coil chip may not overlap the first coil in a direction perpendicular to the optical axis direction.

The coil chip may not overlap the magnet in a direction perpendicular to the optical axis direction.

The coil chip is disposed above the first coil, the coil chip overlaps the magnet in an optical axis direction, and in an initial position of the bobbin, the coil chip is disposed on the first coil in a direction perpendicular to the optical axis direction may not overlap.

each of the first upper spring and the second upper spring includes an inner frame connected to an upper portion of the bobbin; an outer frame connected to the upper portion of the housing; and a frame connection part connecting the inner frame and the outer frame, wherein the outer frame of the first upper spring includes a first extension part bonded to the first electrode, and the outer frame of the second upper spring includes the It may include a second extension portion bonded to the second electrode.

The coil part of the coil chip includes a ferrite part; and a coil having one end connected to the first electrode and the other end connected to the second electrode, wherein the ferrite part is a ferrite core around which the coil is wound, or a ferrite sheet in which the coil is patterned ( Ferrite Sheet).

In the embodiment, a high induced voltage may be secured, the displacement of the bobbin may be accurately detected by reducing the influence of the magnet, and the accuracy of the AF feedback driving may be improved.

1 is a perspective view of a lens driving device according to an embodiment.
FIG. 2 is an exploded view of the lens driving device shown in FIG. 1 .
3 is a view showing the coupling of the lens driving device of FIG. 1 except for the cover member.
4A is a perspective view of the bobbin shown in FIG. 2 ;
4B is a bottom perspective view of the bobbin and the first coil.
FIG. 5A is a first perspective view of the housing shown in FIG. 2 ;
Fig. 5b is a second perspective view of the housing shown in Fig. 5a;
6A is a perspective view of an upper elastic member;
6B is a perspective view of the lower elastic member.
7 shows the housing, the upper elastic member, and the coil chip.
FIG. 8 is an enlarged view of the coil chip shown in FIG. 7 .
9 is a perspective view illustrating an upper elastic member, a lower elastic member, a coil chip, a support member, a second coil, a circuit board, and a base of FIG. 2 .
10 is an exploded perspective view of a base, a circuit board, and a second coil of FIG. 2 .
11 is a cross-sectional view taken in the AB direction of the lens driving device shown in FIG. 3 .
12A illustrates a groove for mounting a coil chip according to another exemplary embodiment.
12B shows upper springs connected to the coil chip disposed in the groove of FIG. 12A .
13 illustrates an arrangement of a coil chip according to another exemplary embodiment.
FIG. 14 shows another embodiment of an upper elastic member for connection with the coil chip shown in FIG. 1 .
15 illustrates a connection relationship between the coil chip of FIG. 13 and the upper spring of FIG. 14 .
16 illustrates an arrangement of a coil chip according to another embodiment.
FIG. 17 shows first and second upper springs for connection with the coil chip of FIG. 16 according to another embodiment;
18 is an exploded perspective view of a camera module according to an embodiment.
19 is a perspective view of a portable terminal according to an embodiment.
20 is a block diagram of the portable terminal shown in FIG.

Hereinafter, embodiments of the present invention that can specifically realize the above object will be described with reference to the accompanying drawings.

In the description of the embodiment, in the case where it is described as being formed on "on or under" of each element, the upper (upper) or lower (lower) (on or under) is The two elements are in direct contact with each other or one or more other elements are disposed between the two elements indirectly. In addition, when expressed as "up (up) or down (on or under)", it may include the meaning of not only an upward direction but also a downward direction based on one element.

In addition, as used hereinafter, relational terms such as “first” and “second”, “upper/upper/above” and “lower/lower/below” refer to any physical or logical relationship or order between such entities or elements. may be used only to distinguish one entity or element from another, without necessarily requiring or implying that Also, like reference numerals refer to like elements throughout the description of the drawings.

In addition, terms such as "include", "compose", or "have" described above mean that the corresponding component may be embedded unless otherwise stated, so other components are excluded. Rather, it should be construed as being able to include other components further. Also, terms such as “corresponding” described above may include at least one of “opposite” and “overlapping” meanings.

For convenience of description, the lens driving apparatus according to the embodiment is described using a Cartesian coordinate system (x, y, z), but may be described using other coordinate systems, and the embodiment is not limited thereto. In each drawing, the x-axis and the y-axis mean a direction perpendicular to the z-axis, which is the optical axis direction, the optical axis or the z-axis direction parallel to the optical axis is called the 'first direction', and the x-axis direction is the 'second direction' ', and the y-axis direction may be referred to as a 'third direction'.

A 'shake correction device' applied to a small camera module of a mobile device such as a smartphone or tablet PC is a device that prevents the outline of the captured image from being clearly formed due to the vibration caused by the user's hand shake when shooting a still image. It may mean a device configured to be able to

In addition, the 'auto-focusing device' is a device for automatically focusing an image of a subject on an image sensor surface. Such an image stabilization device and auto-focusing device can be configured in various ways. The lens driving device according to the embodiment moves the optical module composed of at least one lens in a first direction parallel to the optical axis, or in the first direction A handshake correction operation and/or an auto-focusing operation may be performed by moving the surface formed by the second and third directions perpendicular to the .

1 is a perspective view of a lens driving device 100 according to an embodiment, FIG. 2 is an exploded view of the lens driving device 100 shown in FIG. 1 , and FIG. 3 is the lens of FIG. 1 excluding the cover member 300 . A coupling degree of the driving device 100 is shown.

1 to 3 , the lens driving device 100 includes a bobbin 110 , a first coil 120 , a magnet 130 , a housing 140 , an upper elastic member 150 , and a lower elastic member 160 . ) and a coil chip 170 may be included.

Also, the lens driving apparatus 100 may further include a first coil 120 and a circuit board 250 electrically connected to the coil chip 170 .

Also, the lens driving device 100 may further include a support member 220 and a base 210 .

In addition, the lens driving apparatus 100 may further include a second coil 230 for driving an optical image stabilizer (OIS), and may further include a position sensor 240 for driving an OIS feedback.

Also, the lens driving device 100 may further include a cover member 300 .

The cover member 300 will be described.

The cover member 300 accommodates the other components 110 , 120 , 130 , 140 , 150 , 160 , 170 , 220 , 230 , and 250 in an accommodating space formed together with the base 210 .

The cover member 300 has an open lower portion, and may be in the form of a box including an upper plate and side plates, and a lower portion of the cover member 300 may be coupled to the base 210 . The shape of the upper plate of the cover member 300 may be a polygon, for example, a square or an octagon.

The cover member 300 may have an opening in the upper plate for exposing a lens (not shown) coupled to the bobbin 110 to external light. The material of the cover member 300 may be a non-magnetic material such as SUS to prevent sticking to the magnet 130 , but it is formed of a magnetic material and electromagnetic force due to the interaction between the first coil 120 and the magnet 130 . It can also function as a yoke to increase the

Next, the bobbin 110 will be described.

The bobbin 110 may be equipped with a lens or a lens barrel, and is disposed in the housing 140 . The bobbin 110 may have a structure having an opening for mounting a lens or a lens barrel. The shape of the opening may be a circle, an ellipse, or a polygon, but is not limited thereto.

4A is a perspective view of the bobbin 110 shown in FIG. 2 , and FIG. 4B is a bottom perspective view of the bobbin 110 and the first coil 120 .

4A and 4B , the bobbin 110 has a first protrusion 111 protruding from an upper surface in a first direction, and a second and/or third direction from an outer surface 110b of the bobbin 110 . It may include a protruding second protrusion 112 .

The bobbin 110 may include first side portions 110b - 1 and second side portions 110b - 2 .

The first side portions 110b - 1 of the bobbin 110 may correspond to or face the magnet 130 . Each of the second side portions 110b - 2 of the bobbin 110 may be disposed between two adjacent first side portions.

The first protrusion 111 of the bobbin 110 may include a first guide part 111a and a first stopper 1111b. The first guide part 111a of the bobbin 110 guides the installation position of the first frame connection part 153 of the upper elastic member 150 or is located between the first frame connection part 153 and the bobbin 110 . It can serve to support the damper.

The second protrusion 112 of the bobbin 110 protrudes in a direction perpendicular to the optical axis OA from the outer surface of the first side portions 110b-1 of the bobbin 110 or in a second and/or third direction. can be formed.

When the bobbin 110 moves in the first direction for the auto-focusing function, the first stopper 111b and the second protrusion 112 of the bobbin 110 exceed the range specified by the bobbin 110 due to an external impact or the like. Even if it moves, the upper surface and/or the side surface of the bobbin 110 may serve to prevent a direct collision with the inner side of the cover member 300 .

The bobbin 110 may include a third protrusion 115 protruding from the outer surface of the second side portions 110b - 2 in a direction perpendicular to the optical axis OA. For example, the bobbin 110 may have two third protrusions 115 provided on the two second side portions 110b - 2 facing each other.

The third protrusion 115 of the bobbin 110 corresponds to the groove portion 25a of the housing 140 , and may be inserted or disposed in the groove portion 25a of the housing 140 , and the bobbin 110 is centered on the optical axis. rotation over a certain range can be suppressed or prevented.

The bobbin 110 may include a second stopper 116 that protrudes from a lower surface of the bobbin, and the second stopper 116 causes the bobbin 110 to move in the first direction for the auto-focusing function. Even if 110 moves beyond a prescribed range, the lower surface of the bobbin 110 may serve to prevent direct collision with the base 210 , the second coil 230 , or the circuit board 250 .

The bobbin 110 may have at least one groove (not shown) for the first coil in which the first coil 120 is disposed or installed on the outer surface 110b. For example, the groove for the first coil may be provided in the first side portions 110b-1 and the second side portions 110b-2 of the bobbin 110, but is not limited thereto.

The shape and number of grooves for the first coil may correspond to the shape and number of the first coil 120 disposed on the outer surface 110b of the bobbin 110 . For example, the groove for the first coil provided in the first side portions 110b-1 and the second side portions 110b-2 of the bobbin 110 may have a ring shape, but is not limited thereto.

Also, the bobbin 110 may include a first groove 12a and a second groove 12b that are provided on the outer surface and are spaced apart from each other. For example, the first groove 12a and the second groove 12b may be provided on the outer surface of the first side portion or the outer surface of the second side portion.

The first groove 12a and the second groove 12b may be located above the first coil 120 disposed on the bobbin 110 , and may be connected to the groove for the first coil.

A first portion extending from one end of the first coil 120 disposed on the outer surface of the bobbin 110 may be disposed in the first groove 12a, and the first coil disposed on the outer surface of the bobbin 110 . A second portion extending from the other end of the 120 may be disposed in the second groove 12b.

In this case, the first portion of the first coil 120 may extend to the upper surface of the bobbin 110 in order to be connected to the first outer frame 151 of the first upper spring 150-1, and the first coil 120 ) may extend to the upper surface of the bobbin 110 in order to be connected to the second outer frame 151 of the second upper spring 150-2.

In the embodiment, the first coil 120 extends to the upper surface of the bobbin 110 for electrical connection with the first and second upper springs, but is not limited thereto. In another embodiment, the first and second grooves described above may be located under the coil 120 , and the first and second portions of the coil may extend to the lower surface of the bobbin 110 , and the lower elastic member It may be electrically connected to the lower springs of

In another embodiment, the bobbin 110 may not have a groove for the first coil, and the first coil 120 may be directly wound and fixed to the outer surface 110b of the bobbin 110 .

In addition, a first upper protrusion 113 coupled to the hole 151a of the first inner frame 151 of the upper elastic member 150 may be provided on the upper surface of the bobbin 110 .

The first upper protrusion 113 may be provided on the upper surface of the first side portions 110b-1 of the bobbin 110, but is not limited thereto.

The bobbin 110 may have a first lower protrusion 117 coupled to and fixed to the hole 161a of the lower elastic member 160 on its lower surface.

A screw thread 11 for coupling with a lens or a lens barrel may be provided on the inner surface 110a of the bobbin 110 . In a state in which the bobbin 110 is fixed by a jig or the like, a thread 11 may be formed on the inner surface 110a of the bobbin 110, and the upper surface of the bobbin 110 has a jig fixing groove ( 15a, 15b) may be provided. For example, the grooves 15a and 15b for fixing the jig may be provided on the upper surfaces of the second side portions 110b-2 facing each other of the bobbin 110 in which the third protrusions 115 are disposed. it is not

Next, the first coil 120 will be described.

The first coil 120 may be a driving coil disposed on the outer surface 110b of the bobbin 110 and electromagnetically interacting with the magnet 130 disposed on the housing 140 .

A driving signal (eg, a driving current or voltage) may be applied to the first coil 120 to generate an electromagnetic force by interaction with the magnet 130 .

The driving signal applied to the first coil 120 may be a DC signal and an AC signal. For example, the driving signal may be in the form of current or voltage.

In order to generate an induced voltage in the coil chip 170 by mutual induction between the first coil 120 and the coil chip 170 , the driving signal applied to the first coil 120 may include an AC signal.

For example, the driving signal may be a sine wave signal or a pulse signal (eg, a pulse width modulation (PWM) signal).

Alternatively, in another embodiment, the driving signal applied to the first coil 120 may be an AC signal.

The AF movable unit may move in a first direction, for example, in an upward direction (+Z-axis direction) or a downward direction (-Z-axis direction) by electromagnetic force due to the interaction between the first coil 120 and the magnet 130 . By controlling the intensity and/or polarity (eg, the direction in which current flows) of the driving signal applied to the first coil 120 , the intensity of electromagnetic force due to the interaction between the first coil 120 and the magnet 130 and/or By adjusting the direction, it is possible to control the movement of the AF movable unit in the first direction, thereby performing the auto-focusing function.

The AF movable part may include a bobbin 110 elastically supported by the upper elastic member 150 and the lower elastic member 160 , and components mounted on the bobbin 110 to move together with the bobbin 110 . For example, the AF movable unit may include a bobbin 110 and a first coil 120 . Also, for example, the AF movable unit may further include a lens (not shown) mounted on the bobbin 110 .

The first coil 120 may be disposed on the bobbin 110 to have a closed loop shape. For example, the first coil 120 may be wound around the optical axis in a clockwise or counterclockwise direction outside the bobbin 110 . It may be wound or disposed on the side surface (110b). In another embodiment, the first coil 120 may be implemented in the form of a coil ring wound or disposed in a clockwise or counterclockwise direction about an axis perpendicular to the optical axis OA, and the number of coil rings is the magnet 130 . may be the same as the number of , but is not limited thereto.

The first coil 120 may be electrically connected to at least one of the upper elastic member 150 and the lower elastic member 160 , and the upper elastic member 150 or the lower elastic member 160 , and the support member 220 . may be electrically connected to the circuit board 250 through

For example, the first coil 120 may be connected to the first inner frame 151 of the third and fourth upper springs 150-3 and 150-4 by a conductive adhesive member such as solder, and the third and fourth The fourth support members 220 - 3 and 220 - 4 may be electrically connected to the circuit board 250 .

Next, the housing 140 will be described.

The housing 140 accommodates the bobbin 110 on which the first coil 120 is mounted or disposed therein.

5A is a first perspective view of the housing 140 shown in FIG. 2 , FIG. 5B is a second perspective view of the housing 140 shown in FIG. 5A , and FIG. 6A is a perspective view of the upper elastic member 150 , FIG. 6b is a perspective view of the lower elastic member 160, FIG. 7 shows the housing 140, the upper elastic member 150, and the coil chip 170, and FIG. 8 is the coil chip 170 shown in FIG. 9 is an enlarged view of the upper elastic member 150, the lower elastic member 150, the coil chip 170, the support member 220, the second coil 230, the circuit board 250 of FIG. and a perspective view of the base 250, FIG. 10 is an exploded perspective view of the base 210, the circuit board 250, and the second coil of FIG. 2, and FIG. 11 is the lens driving device 100 shown in FIG. is a cross-sectional view in the AB direction.

5A and 5B , the housing 140 may have an opening pillar shape as a whole, and may include a plurality of first side portions 141 and second side portions 142 forming an opening.

For example, the housing 140 may include first side portions 141 spaced apart from each other and second sides 142 spaced apart from each other, each of the first sides 141 being two adjacent second sides. It may be disposed or positioned between the two sides 142 , and the second side portions 142 may be connected to each other.

The second side portions 142 of the housing 140 are referred to as “corner members” in that their positions correspond to the corner regions of the housing 140 . can be expressed

For example, in FIG. 5A , the first side portions 141 of the housing 140 may include a first side, a second side, a third side, and a fourth side, and the corner portions of the housing 140 are first It may include a corner part 501a, a second corner part 501b, a third corner part 501c, and a fourth corner part 501d.

The first sides 141 of the housing 140 may correspond to the first sides 110b - 1 of the bobbin 110 , and the second sides 142 of the housing 140 are of the bobbin 110 . It may correspond to the second side portions 110b - 2 , but is not limited thereto.

The magnets 130 ( 130 - 1 to 130 - 4 ) may be disposed or installed on the first side portions 141 of the housing 140 , and the support member 220 is provided on the second side portions 141 of the housing 140 . ; 220-1 to 220-4) may be arranged.

The housing 140 may include magnet seating portions 141a provided on inner surfaces of the first side portions 141 to support or accommodate the magnets 130 - 1 to 130 - 4 .

The first side portions 141 of the housing 140 may have grooves or holes 61 for injecting an adhesive for attaching the magnets 130 to the magnet seating portion 141a of the housing 140 . . For example, the hole 61 may be a through hole.

The first side portions 141 of the housing 140 may be disposed parallel to the side plate of the cover member 300 . Holes 147a through which the support member 220 passes may be provided in the second side portions 142 of the housing 140 .

For example, in order to easily apply the damper, the diameter of the hole 147a may be gradually increased in the direction from the top to the bottom of the housing 140, but is not limited thereto. In another embodiment, the hole 147a has a diameter This may be constant.

In addition, in order to prevent direct collision with the inner surface of the cover member 300 , a second stopper 144 may be provided on the upper surface of the housing 140 . For example, the second stopper 144 may be disposed at each corner of the first to fourth corner parts 501a to 501d of the housing 140 , but is not limited thereto.

Also, when the upper elastic member 150 is disposed on the upper surface of the housing 140 , it guides the installation position of the first outer frame 152 of the upper elastic member 150 , and directly collides with the inner surface of the cover member 300 . In order to prevent this, the housing 140 may have a second guide part 146 on its upper surface. Referring to FIG. 11 , the height of the second guide part 146 is greater than the height of the second stopper 144 , but the present invention is not limited thereto. In another embodiment, the height of the second guide part and the height of the second stopper are Alternatively, the height of the second stopper may be greater than the height of the second guide unit.

The second guide part 146 may be disposed at the corner parts 501a to 501d of the housing 140 to be spaced apart from the second stopper 144 . For example, the second guide part 146 and the second stopper 144 may face each other in a diagonal direction. Here, the diagonal direction may be a direction from the center of the housing 140 toward the second stopper 144 .

The housing 140 has at least one second upper protrusion ( 143) can be provided.

The second upper protrusion 143 may be disposed on an upper surface of at least one of the first to fourth corner portions 501a to 501d of the housing 140 .

The second upper protrusion 143 may be disposed on at least one of one side and the other side of the second guide part 146 of the housing 140 .

In addition, the housing 140 has at least one second lower protrusion provided on the lower surface of the second side parts 142 for coupling and fixing with the hole 162a of the second outer frame 162 of the lower elastic member 160 . (145) may be provided. For example, the second lower protrusion 145 may be disposed on a lower surface of at least one of the first to fourth corner portions 501a to 501d of the housing 140 , but is not limited thereto.

In order to secure a path through which the support member 220 passes, as well as to secure a space for filling silicon that can serve as a damping member, the housing 140 has a recess 142a provided in the lower portion of the second side portion 142 . ) can be provided. For example, damping silicon may be filled in the recess 142a of the housing 140 .

The housing 140 may include a third stopper 143 provided on an outer surface of at least one of the first side portions 141 . For example, the third stopper 143 may protrude in a direction perpendicular to the outer surface of the at least one first side of the housing 140 . The third stopper 149 is configured such that, when the housing 140 moves in the second direction and/or the third direction, the outer surface of the first side portion 141 of the housing 140 is the inner surface of the side plate of the cover member 300 . This is to avoid direct collision with

In order to prevent the bottom surface of the housing 140 from colliding with the base 210 , the second coil 230 , and/or the circuit board 250 to be described later, the housing 140 has a fourth stopper ( (not shown) may be further provided.

In order to avoid spatial interference with the coil chip 170, the housing 140 may include a first groove portion 24a provided on the inner surface of any one (eg, 501a) of the corner portions 501a to 501d. have.

The first groove portion 24a of the housing 140 may include openings open to the inner surface and the upper surface of any one corner portion 501a of the housing 140 .

The first groove portion 24a may be disposed on the upper surface of the corner portion 501a of the housing 140 corresponding to a position between the first upper spring 150-1 and the second upper spring 150-2, which will be described later. have.

For example, the first groove portion 24a is a housing ( 140 may be disposed on the upper surface of the corner portion 501a.

As shown in FIG. 7 , the transverse length of the first groove portion 24a of the housing 140 is greater than the transverse length of the coil chip 170 , and The length in the longitudinal direction may be greater than the length in the longitudinal direction of the coil chip 170 . The horizontal direction of the first groove portion 24a may be a direction parallel to the horizontal direction of the inner surface of any one corner portion 501a of the housing 140, and the vertical direction of the first groove portion 24a is the housing ( 140 may be in a direction parallel to the longitudinal direction of the inner surface of any one corner portion 501a.

The housing 140 may include a second groove portion 25a provided on the inner surface of the second side portions 141 or the corner portions 501a to 501d corresponding to the third protrusion 115 of the bobbin 110 . have.

For example, the second groove portion 25a of the housing 140 may be provided on each of inner surfaces of the two corner portions 501b and 501d facing each other among the corner portions 501a to 501d. The second groove portion 25a may be formed in corner portions 501b and 501d different from the corner portion 501a of the housing 140 in which the first groove portion 24a is formed.

In the embodiment shown in FIG. 5A , the first groove portion 24a and the second groove portion 25a may have the same shape, but the present invention is not limited thereto. In another embodiment, the first groove portion 24a and the second groove portion 25a are different from each other. It may have a shape.

The housing 140 may further include a third groove portion 26a provided on an inner surface of the corner portion 501c facing the corner portion 501a in which the first groove portion 24a is formed. The third groove portion 26a may have the same shape as the first groove portion 24a in order to balance the weight with the first groove portion 24a, and may be disposed at positions corresponding to each other, but may be omitted in the embodiment. .

Next, the magnet 130 will be described.

In the initial position of the bobbin 110 , the magnet 130 is positioned so that at least a portion of the first coil 120 and the first coil 120 overlap in a direction perpendicular to the optical axis OA or in a second direction or a third direction of the first of the housing 140 . It may be disposed on the side portions 141 . For example, the magnet 130 may be inserted or disposed in the seating portion 141a of the housing 140 .

Here, the initial position of the bobbin 110 is the initial position of the AF movable part (eg, bobbin) in a state where no power or a driving signal is applied to the first coil 120 , and the upper elastic member 150 and the lower elastic member ( 160) may be a position at which the AF movable part is placed as the AF movable part is elastically deformed only by the weight of the AF movable part.

In addition, the initial position of the bobbin 110 is a position where the AF movable part is placed when gravity acts in the direction from the bobbin 110 to the base 210 , or conversely, when gravity acts in the direction from the base 210 to the bobbin 110 . can be

In another embodiment, the magnet 130 may be disposed on the outer surface of the first side portion 141 of the housing 140 . Alternatively, in another embodiment, it may be disposed on the inner surface or the outer surface of the second side portion 142 of the housing 140 .

The shape of the magnet 130 may be a rectangular parallelepiped shape corresponding to the first side 141 of the housing 140, but is not limited thereto, and the surface facing the first coil 120 is the first coil ( 120) may be formed to correspond to or coincide with the curvature of the corresponding surface.

The magnet 130 may be a unipolar magnetizing magnet or a bipolar magnetizing magnet disposed so that a first surface facing the first coil 120 is an N pole, and a second surface opposite to the first surface is an S pole. However, the present invention is not limited thereto, and the reverse configuration is also possible.

Alternatively, in another embodiment, each of the first and second surfaces of the magnet 130 may be divided into an N pole and an S pole.

For example, the magnet 130 may be a bipolar magnetizing magnet divided into two in a direction perpendicular to the optical axis. In this case, the magnet 130 may be implemented with ferrite, alnico, a rare earth magnet, or the like.

For example, the magnet 130 may include a first magnet unit, a second magnet unit, and a non-magnetic barrier rib. The first magnet part and the second magnet part may be spaced apart from each other, and the non-magnetic partition wall may be positioned between the first magnet part and the second magnet part.

The non-magnetic barrier rib may include a section having little polarity as a portion having substantially no magnetism, and may be filled with air or made of a non-magnetic material.

In the embodiment, the number of the magnets 130 is four, but is not limited thereto, and the number of the magnets 130 may be at least two or more, and the first surface of the magnet 130 facing the first coil 120 . may be a flat surface, but is not limited thereto, and may be a curved surface.

At least two or more magnets 130 may be disposed on first sides of the housing 140 facing each other, and may be disposed to face each other.

For example, magnets 130 - 1 to 130 - 4 may be disposed on the first side portions 141 of the housing 140 . Two pairs of magnets 130 - 1 to 130 - 4 facing each other to cross may be disposed on the first side portions 141 of the housing 140 . In this case, the plane of each of the magnets 130-1 to 130-4 may have a substantially rectangular shape, or, alternatively, may have a triangular shape or a rhombus shape.

In the embodiment shown in FIG. 3 , the magnets 130 - 1 to 130 - 4 are disposed in the housing 140 , but the present invention is not limited thereto.

In another embodiment, the housing 140 may be omitted, and the magnets 130 - 1 to 130 - 4 may be disposed on the cover member 300 . In another embodiment, the housing 140 is not omitted, and the magnets 130 - 1 to 130 - 4 may be disposed on the cover member 300 .

For example, in another embodiment, the magnets 130 - 1 to 130 - 4 may be disposed on the side plates of the cover member 300 , for example, on inner surfaces of the side plates.

Next, the coil chip 170 will be described.

The coil chip 170 is also referred to as a “chip inductor”, is disposed in the housing 140 , and is coupled to the upper elastic member 150 .

For example, the coil chip 170 may be disposed at any one corner portion 501a of the housing 140 . That is, the coil chip 170 may be located in the first groove portion 24a provided in the corner portion 501a of the housing 140 .

Referring to FIG. 7 , in the initial position of the bobbin 110 , the coil chip 170 may be positioned above the first coil 120 with respect to the lower surface of the bobbin 110 .

In the initial position of the bobbin 110 , the coil chip 170 may not overlap the first coil 120 in the optical axis direction or the first direction.

Also, in the initial position of the bobbin 110 , the coil chip 170 may not overlap the first coil 120 in a direction perpendicular to the optical axis.

Also, the coil chip 170 may be positioned below the first outer frame 152 of the upper springs 150 - 1 and 150 - 2 .

The coil chip 170 may not overlap the magnet 130 in the optical axis direction or the first direction. Also, the coil chip 170 may not overlap the magnet 130 in a direction perpendicular to the optical axis. This is to reduce interference between the induced voltage generated in the coil chip 170 by mutual induction with the first coil 120 and the magnetic force lines of the magnet 130 .

That is, by arranging the magnet on the first side of the housing 140 and arranging the coil chip 170 at the corner of the housing 140 , the coil chip 170 and the magnet 130 can be spatially separated from each other. Due to this, the embodiment can reduce the effect of the magnetic force line of the magnet 130 on the induced voltage of the coil chip 170, thereby improving the AF operation performance.

In another embodiment, the coil chip 170 may overlap the magnet 130 in a direction perpendicular to the optical axis.

Referring to FIG. 8 , the coil chip 170 includes a coil unit 171 including a coil and ferrite, and a first electrode 172a and a second electrode connected to one end of the coil of the coil unit 71 . (172b). In the first electrode 172a and the second electrode 172b, an “electrode” may be expressed as a “pad”, a terminal, or a lead.

The coil unit 171 may have a structure in which a coil is wound around a ferrite core or a structure in which a coil is patterned on a ferrite sheet, but is not limited thereto, and may be implemented in various forms.

The first electrode 172a may be connected to one end of the coil unit 171 , and the second electrode 172b may be connected to the other end of the coil unit 171 .

The coil chip 170 may secure high inductance by ferrite, and increase the magnitude of the induced voltage induced in the coil chip 170 by the high inductance. Since a high induced voltage can be secured, the displacement of the bobbin 110 can be detected more accurately, AF driving control can be easily controlled, and the accuracy of AF feedback driving can be improved.

The frequency of the driving signal applied to the first coil 120 , for example, the frequency of the AC signal included in the driving signal, may be set to be lower than the self-resonance frequency of the coil chip 170 .

An induced voltage is generated in the coil chip 170 by a mutual induction action between the first coil 120 and the coil chip 170 to which a driving signal (eg, a driving current) is applied.

The first coil 120 may move together with the bobbin 110 in the first direction by the electromagnetic force generated by the electromagnetic interaction between the current flowing through the first coil 120 according to the driving signal and the magnet 130 .

As the first coil 120 moves in the first direction, the separation distance between the first coil 120 and the coil chip 170 changes, and as the separation distance changes, the magnitude of the voltage induced in the coil chip 170 can change

For example, as the separation distance between the first coil 120 and the coil chip 170 decreases, the induced voltage generated in the coil chip 170 may increase. The induced voltage can be reduced.

Based on the magnitude of the voltage induced in the coil chip 170 , the displacement of the bobbin 110 may be sensed, and the displacement or driving signal of the bobbin 110 is feedback control based on the detected displacement of the bobbin 110 . can be

The first electrode 172a and the second electrode 172b of the coil chip 170 are connected to the first and second upper springs 150-1 and 150-2 of the upper elastic member 150 by a conductive member such as solder. ) may be connected or bonded to the first outer frame 152 of the .

Next, the upper elastic member 150 , the lower elastic member 160 , and the supporting member 220 will be described.

The upper elastic member 150 and the lower elastic member 160 are coupled to the bobbin 110 and the housing 140 , and support the bobbin 110 .

For example, the upper elastic member 150 may be coupled to the upper part, the upper surface, or the upper end of the bobbin 110 and the upper part, the upper surface, or the upper part of the housing 140 , and the lower elastic member 160 is the bobbin 110 . It may be combined with the lower part, the lower surface, or the lower part and the lower part, the lower surface, or the lower part of the housing 140 .

The support member 220 may support the housing 140 with respect to the base 210 , and may electrically connect at least one of the upper elastic member 150 or the lower elastic member 160 to the circuit board 250 . .

6A and 6B , at least one of the upper elastic member 150 and the lower elastic member 160 may be divided or separated into two or more.

For example, the upper elastic member 150 may include first to fourth upper springs 150-1 to 150-4 spaced apart or separated from each other.

The upper elastic member 150 and the lower elastic member 160 may be implemented as a leaf spring, but is not limited thereto, and may be implemented as a coil spring, a suspension wire, or the like.

Each of the first to fourth upper springs 150-1 to 150-4 includes a first inner frame 151 coupled to an upper portion, an upper surface, or an upper end of the bobbin 110, an upper portion, an upper surface of the housing 140, Alternatively, it may include a first outer frame 152 coupled to the upper end, and a first frame connecting portion 153 connecting the first inner frame 151 and the first outer frame 152 .

A hole 151a through which the first upper protrusion 113 of the bobbin 110 is coupled may be provided in the first inner frame 151 , and the hole 151a is formed of at least one hole through which an adhesive member or a damper permeates. It may have a cutout 16 .

The first outer frame 152 of each of the first to fourth upper springs 150-1 to 150-4 includes a first coupling part 510 coupled to the support members 220-1 to 220-6, the housing A second coupling part 520 coupled to at least one of the corner parts 501a to 501d of 140 and/or the adjacent side thereof, and the first coupling part 510 and the second coupling part 520 are connected. It may include a connection unit 530 that

The second coupling portion 520 may include at least one coupling region coupled to the corner portions 501a to 501d (eg, the second upper protrusion 143 ) of the housing 140 . For example, the at least one coupling region may include holes 152a and 152b.

For example, the second coupling part 520 includes a first coupling area positioned on one side of the second guide part 146 of the housing 140 and a second coupling area positioned on the other side of the second guide part 146 . may include, but is not limited thereto.

In the embodiment of Figure 6a, each of the coupling regions of the second coupling portion 520 of the first to fourth upper springs 150-1 to 150-4 is implemented to include a hole, but is not limited thereto, In another embodiment, the coupling regions may be implemented in various shapes sufficient to couple with the housing 140 , for example, a groove shape.

For example, the holes 152a and 152b of the second coupling part 520 are formed between the second upper protrusion 143 and the holes 152a and 152b at least one cutout 21 for the adhesive member or damper to permeate. can have

The first coupling part 510 may have a hole 52 through which the supporting members 220 - 1 to 220 - 4 pass. One end of the support members 220-1 to 220-5 passing through the hole 52 may be coupled to the first coupling part 510 by a conductive adhesive member or solder 910, and the first coupling part 510 ) and the support members 220-1 to 220-4 may be electrically connected.

The first coupling part 510 is a region where the solder 910 is disposed, and may include a hole 52 and a region around the hole 52 .

The connection part 530 may connect the coupling region of the second coupling part 520 disposed at the corner parts 501a to 501d and the first coupling part 510 .

For example, the connection part 530 is a first coupling part connecting the first coupling area and the first coupling part 510 of the second coupling part 520 of each of the first to fourth upper springs 150-1 to 150-4. It may include a first connection part 530-1, and a second connection part 530-2 connecting the second coupling region of the second coupling part 520 to the first coupling part 510.

The connection part 530 may include a bent part bent at least once or a curved part bent at least once, but is not limited thereto, and may have a straight shape in another embodiment.

The width of the connection part 530 may be narrower than the width of the second coupling part 520 , and thus the connection part 530 may be easily moved in the first direction, and thus the connection part 530 may be applied to the upper elastic member 150 . The stress and the stress applied to the support member 220 may be dispersed.

In addition, in order to support the housing 140 in a balanced manner so as not to be biased to either side, the connection part 530 may be symmetrical with respect to the reference line 102 , but is not limited thereto, and may not be symmetrical in other embodiments. have.

The reference line 102 may be a straight line passing through the center point 101 (refer to FIG. 6A ) and a corresponding one of the corners 501a to 501d of the housing 140 . Here, the central point 101 may be the center of the housing 140 .

The first outer frame 152 of each of the first and second upper springs 150 - 1 and 150 - 2 is a corresponding one of the first and second electrodes 172a and 172b of the coil chip 170 . Extension parts P1 and P2 that are in contact with or connected to one may be provided.

Each of the first and second upper springs 150 - 1 and 150 - 2 extends from the coupling area of the second coupling part 520 to the coil chip 170 disposed in the corner part 501a of the housing 140 . It may be provided with extension parts (P1, P2) that become.

For example, the first extension P1 may be in direct contact with the first electrode 172a of the coil chip 170 , may be coupled or bonded to the first electrode 172a by solder or the like, and the second extension portion may be in direct contact with the first electrode 172a. P2 may be in direct contact with the second electrode 172b of the coil chip 170 , and may be coupled or bonded to the second electrode 172b by solder or the like.

Since the first and second upper springs 150 - 1 and 150 - 2 and the first electrode 172a and the second electrode 172b of the coil chip 170 are bonded by solder, the coil chip 170 . It is possible to improve the coupling force between the and the upper elastic member 150, it is possible to prevent disconnection.

The lower elastic member 160 is a second inner frame 161 coupled to the lower, lower, or lower end of the bobbin 110 , and a second outer frame 162 coupled to the lower, lower, or lower end of the housing 140 . , and a second frame connection part 163 connecting the second inner frame 161 and the second outer frame 162 .

In addition, the lower elastic member 160 is disposed on the second inner frame 161, a hole 161a coupled to the first lower coupling groove 117 of the bobbin 110 by solder or a conductive adhesive member, and a second A hole 162a disposed on the outer frame 162 and coupled to the second lower protrusion 147 of the housing 140 may be provided.

Each of the first and second frame connection parts 153 and 163 of the upper and lower elastic members 150 and 160 may be bent or curved (or curved) at least once to form a pattern of a predetermined shape. . The bobbin 110 may be elastically (or elastically) supported by the rising and/or lowering motions in the first direction through a change in the position of the first and second frame connection parts 153 and 163 and micro-deformation.

In order to absorb and buffer the vibration of the bobbin 110 , the lens driving device 100 includes a first damper (not shown) disposed between each of the upper springs 150 - 1 to 150 - 4 and the housing 140 . more can be provided.

For example, a first damper (not shown) may be disposed in a space between the first frame connection part 153 and the housing 140 of each of the upper springs 150 - 1 to 150 - 4 .

Also, for example, the lens driving device 100 may further include a second damper (not shown) disposed between the second frame connection part 163 of the lower elastic member 160 and the housing 140 .

Also, for example, the lens driving device 100 may further include a third damper (not shown) disposed between the support member 220 and the hole 147a of the housing 140 .

Also, for example, the lens driving apparatus 100 may further include a fourth damper (not shown) disposed at one end of the first coupling part 510 and the support member 220 , and the other end of the support member 220 and A fifth damper (not shown) disposed on the circuit board 250 may be further included.

Also, for example, a damper (not shown) may be further disposed between the inner surface of the housing 140 and the outer peripheral surface of the bobbin 110 .

Next, the support member 220 will be described.

One end of the support member 220 may be coupled to the first outer frame 151 of the upper elastic member 150 by solder or a conductive adhesive member, and the other end of the support member 220 is coupled to the circuit board 250 . can be

There may be a plurality of support members 220 , and each of the plurality of support members 220 - 1 to 220 - 6 is a corresponding one of the upper springs 150 - 1 to 150 - 4 through solder 901 . It may be coupled to the first coupling part 510 of the , and may be electrically connected to the first coupling part 510 . For example, each of the plurality of support members 220-1 to 220-4 may be disposed at a corresponding one of the four corner parts 501a to 501d.

The plurality of support members 220-1 to 220-4 may support the bobbin 110 and the housing 140 so that the bobbin 110 and the housing 140 are movable in a direction perpendicular to the first direction. . In FIGS. 3 and 9 , one support member is disposed on each of the second side portions 142 or the corner portions 501a to 501d of the housing 140 , but the present invention is not limited thereto.

In another embodiment, two or more support members may be disposed on at least one of the second side surfaces of the housing 140 .

Each of the plurality of support members 220-1 to 220-4 may be spaced apart from the housing 140, and is not fixed to the housing 140, but is provided by the upper springs 150-1 to 150-4, respectively. It may be directly connected to the first coupling part 510 of the first outer frame 152 .

In another embodiment, the support member 220 may be disposed on the first side portion 141 of the housing 140 in the form of a leaf spring.

A driving signal may be transmitted from the circuit board 250 to the first coil 120 through the plurality of support members 220-1 to 220-4 and the upper springs 150-1 to 150-4, The induced voltage of the coil chip 170 may be transferred to the circuit board 250 .

For example, the induced voltage of the coil chip 170 through the first and second upper springs 150 - 1 and 150 - 2 and the first and second support members 220 - 1 and 220 - 2 is a circuit may be transferred to the substrate 250 .

Also, for example, the first coil ( 120), a driving signal may be provided.

The plurality of support members 220-1 to 220-4 may be formed as a member separate from the upper elastic member 150, and may be supported by an elastic member, for example, a leaf spring or a coil. It may be implemented as a spring (coil spring), suspension wire, or the like. Also, in another embodiment, the support members 220-1 to 220-4 may be integrally formed with the upper elastic member 150.

Next, the base 210 , the circuit board 250 , the second coil 230 , and the position sensor 240 will be described.

The base 210 may have an opening of the bobbin 110 and/or an opening corresponding to the opening of the housing 140 , and may have a shape that coincides with or corresponds to the cover member 300 , for example, a rectangular shape. .

Referring to FIG. 10 , the base 210 may include a step 211 to which an adhesive may be applied when the cover member 300 is adhesively fixed. At this time, the step 211 may guide the cover member 300 coupled to the upper side, and may face the lower end of the side plate of the cover member 300 .

The base 210 may be disposed under the bobbin 110 and the housing 140 , and a support groove or a support part 255 may be formed on the side facing the portion where the terminal 251 is formed of the circuit board 250 . can The support part 255 of the base 210 may support the terminal surface 253 of the circuit board 250 .

An edge of the base 210 may have a recess 212 . When the edge of the cover member 300 has a protruding shape, the protrusion of the cover member 300 may be engaged with the base 210 in the recess 212, but is not limited thereto, and in another embodiment, the base ( 210 may not have the groove 212 .

Seating grooves 215 - 1 and 215 - 2 in which the position sensor 240 mounted on the circuit board 250 may be disposed or seated may be provided on the upper surface of the base 210 . According to an embodiment, the base 210 may be provided with two seating grooves 215-1 and 215-2.

Based on the circuit board 250 , the second coil 230 may be disposed on the upper portion and the position sensor 240 may be disposed on the lower portion of the circuit board 250 .

For example, the position sensor 240 may be mounted on the lower surface of the circuit board 250 , and the lower surface of the circuit board 250 may be a surface facing the upper surface of the base 210 .

The circuit board 250 is located under the housing 140 , and may be disposed on the upper surface of the base 210 , the opening of the bobbin 110 , the opening of the housing 140 , or/and the opening of the base 210 . An opening corresponding to may be provided. The shape of the outer peripheral surface of the circuit board 250 may match or correspond to the upper surface of the base 210 , for example, a rectangular shape.

The circuit board 250 may be bent from an upper surface and include at least one terminal surface 253 provided with a plurality of terminals 251 or pins for electrical connection to the outside.

A plurality of terminals 251 may be installed on the terminal surface 253 of the circuit board 250 . For example, a driving signal for driving the first coil 120 , the second coil 230 , and the position sensor 240 through the plurality of terminals 251 installed on the terminal surface 253 of the circuit board 250 . may be received, and the induced voltage of the coil chip 170 may be output to the outside through the terminals 251 .

According to an embodiment, the circuit board 250 may be provided as an FPCB, but the present invention is not limited thereto, and the terminals of the circuit board 250 may be directly formed on the surface of the base 210 using a surface electrode method or the like. do.

The circuit board 250 may include a hole 250a through which the supporting members 220 - 1 to 220 - 4 pass. The position and number of the holes 250a may correspond to or coincide with the position and number of the supporting members 220-1 to 220-4. Each of the support members 220 - 1 to 220 - 4 may be disposed to be spaced apart from the inner surface of the hole 250a of the corresponding circuit board 250 .

The support members 220 - 1 to 220 - 4 may pass through the hole 250a of the circuit board 250 and may be electrically connected to a circuit pattern disposed on the lower surface of the circuit board 250 through soldering or the like.

In addition, in another embodiment, the circuit board 250 may not have a hole, and the support members 220 - 1 to 220 - 4 are soldered to a circuit pattern or pad formed on the upper surface of the circuit board 250 . It may be electrically connected through

The second coil 230 may be disposed under the housing 140 and disposed above the circuit board 250 to correspond to the magnet 130 disposed on the housing 140 .

For example, the second coil 230 may include four OIS coils 230-1 to 230-4 disposed to correspond to each of the four sides of the circuit board 250, but is not limited thereto. , one for the second direction, one for the third direction, etc. It is also possible to install only two, or four or more may be installed.

In FIG. 10 , the second coil 230 is implemented in a form provided in a circuit member 231 separate from the circuit board 250 , but is not limited thereto. In another embodiment, the second coil 230 is a circuit board It may be implemented in the form of a circuit pattern formed at 250 .

Alternatively, in another embodiment, the circuit member 231 may be omitted, and the second coil 230 may be implemented in the form of a ring-shaped coil block separately from the circuit board 250 , or may be implemented in the form of an FP coil. .

An escape groove 23 may be provided at an edge of the circuit member 231 in which the second coil 230 is provided, and the escape groove 23 may have a shape in which a corner portion of the circuit member 231 is chamfered. Also, in another embodiment, a hole through which the support member 220 passes may be provided at the edge of the circuit member 231 .

As described above, due to the interaction between the corresponding magnets 130 and the second coil 230 , the housing 140 moves in the second and/or third directions to perform handshake correction.

The position sensor 240 detects the strength of the magnetic field of the magnet 130 disposed in the housing 140 as the housing 140 moves in a direction perpendicular to the optical axis, and an output signal (eg, an output voltage) can be output.

Based on the output signal of the position sensor 240 , the displacement of the housing 140 with respect to the base 210 in a direction (eg, X-axis or Y-axis) perpendicular to the optical axis (eg, Z-axis) may be detected. .

The position sensor 240 is for two OIS in order to detect the displacement of the housing 140 in a second direction (eg, X-axis) perpendicular to the optical axis, and in a third direction (eg, Y-axis) perpendicular to the optical axis. It may include position sensors 240a and 240b.

For example, the OIS position sensor 240a may detect the strength of the magnetic field of the magnet 130 according to the movement of the housing 140 , and output a first output signal according to the sensed result, and the OIS position sensor ( 240b) may sense the strength of the magnetic field of the magnet 130 according to the movement of the housing 140 and output a second output signal according to the sensed result. The controller 830 of the camera module or the controller 780 of the portable terminal 200A may detect the displacement of the housing 140 based on the first output signal and the second output signal, and the detected displacement of the housing 140 may be OIS feedback driving may be performed based on the displacement.

Each of the position sensors 240a and 240b for OIS may be provided as a Hall sensor, and any sensor capable of detecting a magnetic field strength may be used. For example, each of the position sensors 240 for OIS may be implemented in the form of a driver including a Hall sensor, or may be implemented as a single position detection sensor such as a Hall sensor.

Each of the position sensors 240a and 240b for OIS is mounted on the circuit board 250 , and the circuit board 250 may include terminals electrically connected to the position sensors 240a and 240b for OIS.

A coupling protrusion (not shown) may be provided on the upper surface of the base 210 for coupling between the circuit board 250 and the base 210 , and a hole for coupling with the coupling protrusion of the base 210 is provided in the circuit board 250 . (not shown) may be provided, or may be fixed with an adhesive member such as heat sealing or epoxy.

In addition, a protrusion 29 may be provided on an upper surface around the opening of the base 210 , into which the opening of the circuit board 250 and the opening of the circuit member 231 may be inserted.

In general, for AF (Auto Focus) feedback control, a separate power connection structure for driving an AF moving part, for example, an AF position sensor capable of detecting the displacement of a bobbin, a sensing magnet, and an AF position sensor is required. The structure of the driving device becomes complicated, and a price increase and difficulty in manufacturing operation may occur.

Also, a linear section of the graph between the moving distance of the bobbin and the magnetic flux of the sensing magnet sensed by the position sensor (hereinafter referred to as a “first linear section”) may be constrained by the positional relationship between the sensing magnet and the position sensor.

In the embodiment, since a separate position sensor for detecting the displacement of the bobbin 110 is not required, it is possible to reduce the cost of the lens driving device and improve the easiness of the manufacturing operation.

When the AF position sensor is used, six supporting members are required for electrical connection between the first coil and the AF position sensor and the circuit board. On the other hand, in the embodiment, since the position sensor and the sensing magnet are omitted, and the AF feedback control is performed using the coil chip 170, a driving signal is provided to the first coil 120 using four supporting members. Also, the induced voltage of the coil chip 170 may be transferred to the circuit board 250 .

In addition, since mutual induction between the first coil 120 and the coil chip 170 is used, the second linear section of the correlation graph between the moving distance of the bobbin 110 and the induced voltage of the coil chip 170 is the first linear section could be wider. Due to this, the embodiment can secure the linearity of a wide section, improve the process defect rate, and perform more accurate AF feedback control.

In general, since the magnitude of the induced voltage induced in the coil chip 170 changes according to the change in ambient temperature, a temperature compensation algorithm is performed in the camera module or optical device in order to suppress the occurrence of malfunction of AF drive according to the change in ambient temperature. can be

A change in ambient temperature for temperature compensation may be measured using the resistance value of the coil chip 170 .

A resistance value of the coil chip 170 may be changed according to a change in ambient temperature. A change in the ambient temperature for a temperature compensation algorithm may be measured by using a change in the resistance value of the coil chip 170 according to the change in ambient temperature. For example, by applying a driving signal for temperature compensation, for example, alternating current or direct current, to the coil chip 170 , and measuring a change in voltage of the coil chip 170 by the driving signal for temperature compensation, ambient temperature change can be measured.

The embodiment described with reference to FIGS. 1 to 11 exemplifies that one coil chip 170 is provided, but is not limited thereto. A lens driving device according to another embodiment is disposed on the inner surface of the corner portion 501c facing the corner portion 501a of the housing 140 disposed on the coil chip 170 (referred to as a “first coil chip”). It may include another coil chip (referred to as a “second coil chip”). In this case, the upper elastic member may include first to sixth upper springs, and the support member may include first to sixth support members.

The first and second upper springs may be electrically connected to the first coil chip, and the first and second upper springs are connected to the first and second terminals of the circuit board 250 through the first and second support members. may be electrically connected.

The third and fourth upper springs may be electrically connected to the second coil chip, and the third and fourth upper springs are connected to the third and fourth terminals of the circuit board 250 through the third and fourth supporting members. may be electrically connected.

The first coil 120 may be electrically connected to fifth and sixth upper springs, and the fifth and sixth upper springs are connected to the fifth and sixth upper springs of the circuit board 250 through the fifth and sixth support members. It may be electrically connected to the terminals.

12A shows a groove portion 24a1 for mounting the coil chip 170 according to another embodiment, and FIG. 12B is an upper spring 150- connected to the coil chip 170 disposed in the groove portion 24a1 of FIG. 12A. 1 to 150-4).

12A and 12B, the groove part 24a shown in FIG. 7A is spaced apart from the coil chip 170, but the groove part 24a1 shown in FIGS. 12A and 12B is in contact with the coil chip 170, The coil chip 170 may be supported. For example, the coil chip 170 may be fixed to the groove portion 24a1 by an adhesive member. For example, the groove portion 24a1 and the coil chip 170 may be fixed to the groove portion 24a1 , whereby the coil chip 170 may be stably fixed to the housing 140 .

FIG. 13 shows the arrangement of the coil chip 170 according to another embodiment, and FIG. 14 shows another embodiment of the upper elastic member 150 to be connected to the coil chip 170 shown in FIG. 1 , and FIG. 15 shows a connection relationship between the coil chip 170 of FIG. 13 and the upper springs of FIG. 14 .

13 to 15 , the housing 140 may include a groove portion 62a provided on an upper surface of any one of the side portions 141 for mounting the coil chip 170 . In this case, the first groove portion 24a and the third groove portion 26a described with reference to FIG. 5A may be provided in the housing 140, but in another embodiment, the first groove portion 24a and the third groove portion 26a may be omitted.

For example, the groove 62a may be disposed on the upper surface of the housing 140 corresponding to a position between the first upper spring 150a and the second upper spring 150b.

For example, the groove portion 62a may be disposed on the upper surface of the housing 140 corresponding to a position between the extension portion 55a of the first upper spring 150a and the extension portion 55b of the second upper spring 150b. have.

The groove portion 62a of the housing 140 may have an opening opened to the upper surface of the one first side portion of the housing 140 .

In order to balance the weight of the housing 140 , the housing 140 may additionally include a groove portion 62b corresponding to the groove portion 62a.

The groove portion 62a of the housing 140 may have a shape corresponding to the coil chip 170 , and the coil chip 170 may be disposed or seated in the groove portion 62a. The first electrode 172a and the second electrode 172b of the coil chip 170 may be exposed through the opening of the groove portion 62a. That is, the first electrode 172a and the second electrode 172b of the coil chip 170 disposed in the groove 62a may be exposed to the upper surface of the first side of the housing 140 .

The coil chip 170 disposed in the groove portion 62a may not protrude from the upper surface of the first side portion of the housing 140 in which the groove portion 62a is provided.

The upper elastic member shown in FIG. 14 may include upper springs 150a to 150d. The upper springs 150a to 150d shown in FIG. 14 may have a structure similar to that of the first to fourth upper springs 150-1 to 150-4 shown in FIG. 6A . In FIG. 14 , the extension parts P1 and P2 illustrated in FIG. 6A may be omitted.

The first outer frame 152 of the first upper spring 150a may include an extension 55a extending from the coupling area of the second coupling part 520 to any one first side of the housing 140 . have.

In addition, the second upper spring 150b may include an extension part 55b extending from the coupling area of the second coupling part 520 of the first outer frame 152 to the one first side of the housing. .

The extension portion 55a of the first upper spring 150a may be coupled or bonded to the first electrode 172a of the coil chip 170 exposed from the groove portion 62a by a conductive adhesive member such as solder.

In addition, the extension portion 55b of the second upper spring 150b may be coupled or bonded to the second electrode 172b of the coil chip 170 exposed from the groove portion 62a by a conductive adhesive member such as solder.

Since the coil chip 170 is disposed in the groove portion 62a, it does not spatially interfere with the first and second upper springs 150a and 150b, and the first and second upper springs 150a and 150b are formed by soldering. ) can be directly bonded to

The coil chip 170 shown in FIG. 15 may be disposed on a magnet (eg, 130-3), and may overlap the magnet (eg, 130-3) in the optical axis direction.

The coil chip 170 of FIG. 15 may not overlap the magnet 130 in a direction perpendicular to the optical axis. This is to reduce interference between the induced voltage generated in the coil chip 170 by mutual induction with the first coil 120 and the magnetic force lines of the magnet 130 .

16 shows the arrangement of the coil chip 170 according to another embodiment, and FIG. 17 is first and second upper springs 150a according to another embodiment to be connected to the coil chip 170 of FIG. 16 . -1, 150b-1).

The first and second upper springs 150a - 1 and 150b - 1 of FIG. 17 may be modified examples of the first and second upper springs 150a and 150b of FIG. 14 .

16 and 17 , a groove portion 63a provided on an inner surface of the first side portion 141 of the housing 140 may be provided. The groove portion 63a of FIG. 16 may have an opening that is opened to the inner surface of the first side portion of the housing 140 .

The coil chip 170 may be disposed or seated in the groove portion 63a of the housing 140 , and the first electrode 172a and the second electrode 172b of the coil chip 170 disposed in the groove portion 63a. Silver may be exposed through the opening of the groove portion 63a. That is, the first electrode 172a and the second electrode 172b of the coil chip 170 disposed in the groove portion 63a may be exposed to the inner surface of the first side portion of the housing 140 .

The first outer frame 152 of the first upper spring 150a - 1 may include a first bent portion 56a bent from the extension portion 55a to the inner surface of the housing 140 .

The first bent portion 56a may be connected to one side of the extension portion 55a, and may be bent and extended to the first electrode 172a of the coil chip 170 disposed in the groove portion 63a.

The first bent portion 56a may be connected to or bonded to the first electrode 172a of the coil chip 170 by a conductive adhesive member such as solder.

The first outer frame 152 of the second upper spring 150b - 1 may include a second bent portion 56b bent from the extension portion 55b to the inner surface of the housing 140 .

The second bent portion 56b may be connected to one side of the extension portion 55b, and may be bent and extended to the second electrode 172b of the coil chip 170 disposed in the groove portion 63a.

The second bent portion 56b may be connected to or bonded to the second electrode 172b of the coil chip 170 by a conductive adhesive member such as solder.

In the initial position of the bobbin 110 , the coil chip 170 of FIGS. 15 and 17 may be positioned above the first coil 120 with respect to the lower surface of the bobbin 110 .

In the initial position of the bobbin 110 , the coil chip 170 of FIGS. 15 and 17 may not overlap the first coil 120 in the optical axis direction or the first direction.

Also, the coil chip 170 of FIGS. 15 and 17 may be positioned below the first outer frame 152 of the upper springs 150a and 150b.

Meanwhile, the lens driving apparatus according to the above-described embodiment may be used in various fields, for example, a camera module or an optical device.

For example, the lens driving device 100 according to the embodiment forms an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., which are characteristics of light, and aims to increase the visual power of the eye, It may be included in an optical instrument for the purpose of recording and reproducing an image by a lens, or for optical measurement, propagation or transmission of an image, and the like. For example, the optical device according to the embodiment may include a smartphone and a portable terminal equipped with a camera.

18 is an exploded perspective view of the camera module 200 according to the embodiment.

Referring to FIG. 18 , the camera module 200 includes a lens or lens barrel 400 , a lens driving device 100 , an adhesive member 612 , a filter 610 , a first holder 600 , and a second holder 800 . ), an image sensor 810 , a motion sensor 820 , a controller 830 , and a connector 840 .

The lens or lens barrel 400 may be mounted on the bobbin 110 of the lens driving device 100 .

The first holder 600 may be disposed under the base 210 of the lens driving device 100 . The filter 610 is mounted on the first holder 600 , and the first holder 600 may include a protrusion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lens driving device 100 to the first holder 600 . The adhesive member 612 may serve to prevent foreign substances from being introduced into the lens driving device 100 in addition to the above-described bonding role.

For example, the adhesive member 612 may be an epoxy, a thermosetting adhesive, or an ultraviolet curable adhesive.

The filter 610 may serve to block light of a specific frequency band in light passing through the lens barrel 400 from being incident on the image sensor 810 . The filter 610 may be an infrared cut filter, but is not limited thereto. In this case, the filter 610 may be disposed to be parallel to the x-y plane.

An opening may be formed in a portion of the first holder 600 on which the filter 610 is mounted so that light passing through the filter 610 may be incident on the image sensor 810 .

The second holder 800 may be disposed under the first holder 600 , and the image sensor 810 may be mounted on the second holder 600 . The image sensor 810 is a region on which the light passing through the filter 610 is incident to form an image included in the light.

The second holder 800 may include various circuits, elements, control units, etc. to convert an image formed on the image sensor 810 into an electrical signal and transmit it to an external device.

The second holder 800 may be implemented as a circuit board on which an image sensor may be mounted, a circuit pattern may be formed, and various elements may be coupled thereto.

The image sensor 810 may receive an image included in light incident through the lens driving device 100 and convert the received image into an electrical signal.

The filter 610 and the image sensor 810 may be spaced apart to face each other in the first direction.

The motion sensor 820 may be mounted on the second holder 800 , and may be electrically connected to the controller 830 through a circuit pattern provided on the second holder 800 .

The motion sensor 820 outputs rotational angular velocity information due to the movement of the camera module 200 . The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

The control unit 830 is mounted on the second holder 800 . The second holder 800 may be electrically connected to the lens driving device 100 . For example, the second holder 800 may be electrically connected to the first coil 120 , the second coil 230 , the position sensor 240 , and the coil chip 170 of the lens driving device 100 .

For example, a driving signal may be provided to each of the first coil 120 , the second coil 230 , and the position sensor 240 through the second holder 800 , and an output signal (eg, the coil chip 170 ) , induced voltage) may be transmitted to the second holder 800 .

The connector 840 is electrically connected to the second holder 800 and may include a port for electrically connecting to an external device.

19 is a perspective view of a portable terminal 200A according to an embodiment, and FIG. 20 is a configuration diagram of the portable terminal 200A shown in FIG. 19 .

19 and 20, the portable terminal 200A (hereinafter referred to as "terminal") has a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, and input/ It may include an output unit 750 , a memory unit 760 , an interface unit 770 , a control unit 780 , and a power supply unit 790 .

The body 850 shown in FIG. 19 has a bar shape, but is not limited thereto, and a slide type, a folder type, and a swing type in which two or more sub-bodies are coupled to be movable relative to each other. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) forming an exterior. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in a space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711 , a mobile communication module 712 , a wireless Internet module 713 , a short-range communication module 714 , and a location information module 715 . have.

The A/V (Audio/Video) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 , a microphone 722 , and the like.

The camera 721 may include the camera module 200 according to the embodiment shown in FIG. 18 .

The sensing unit 740 detects the current state of the terminal 200A, such as the opening/closing state of the terminal 200A, the position of the terminal 200A, the presence or absence of user contact, the orientation of the terminal 200A, acceleration/deceleration of the terminal 200A, etc. It is possible to generate a sensing signal for controlling the operation of the terminal 200A by sensing. For example, when the terminal 200A is in the form of a slide phone, it is possible to sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether the power supply unit 790 is supplied with power, whether the interface unit 770 is coupled to an external device, and the like.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for operation control of the terminal 200A, and may also display information processed by the terminal 200A.

The input/output unit 750 may include a keypad unit 730 , a display module 751 , a sound output module 752 , and a touch screen panel 753 . The keypad unit 730 may generate input data in response to a keypad input.

The display module 751 may include a plurality of pixels whose color changes according to an electrical signal. For example, the display module 751 is a liquid crystal display (liquid crystal display), a thin film transistor-liquid crystal display (thin film transistor-liquid crystal display), an organic light-emitting diode (organic light-emitting diode), a flexible display (flexible display), three-dimensional It may include at least one of a display (3D display).

The sound output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760 . Audio data can be output.

The touch screen panel 753 may convert a change in capacitance generated due to a user's touch on a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store a program for processing and control of the controller 780, and stores input/output data (eg, phone book, message, audio, still image, photo, video, etc.) Can be temporarily saved. For example, the memory unit 760 may store an image captured by the camera 721 , for example, a photo or a moving picture.

The interface unit 770 serves as a passage for connecting to an external device connected to the terminal 200A. The interface unit 770 receives data from an external device, receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device having an identification module, and an audio I/O (Input/O) Output) port, video I/O (Input/Output) port, and may include an earphone port, and the like.

The controller 780 may control the overall operation of the terminal 200A. For example, the controller 780 may perform related control and processing for a voice call, data communication, video call, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the controller 180 or may be implemented separately from the controller 780 .

The controller 780 may perform a pattern recognition process capable of recognizing a handwriting input or a drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power required for operation of each component.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by a person skilled in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

Claims (10)

a housing including a groove portion disposed on the upper surface;
a bobbin disposed inside the housing;
a first coil disposed on the bobbin;
a coil chip disposed in the groove portion of the housing and generating an induced voltage according to mutual induction with the first coil;
a magnet disposed on the housing;
a first upper spring and a second upper spring coupled to an upper portion of the bobbin and an upper portion of the housing;
a circuit board disposed under the housing; and
a support member electrically connecting the first and second upper springs to the circuit board;
The coil chip includes a coil unit, a first electrode connected to one end of the coil unit, and a second electrode connected to the other end of the coil unit,
The first upper spring is connected to the first electrode, and the second upper spring is connected to the second electrode. According to claim 1,
The induced voltage is transmitted to the circuit board through the first and second upper springs and the support member. According to claim 1,
The housing includes corner portions and side portions disposed between the corner portions, and the groove portion is disposed on any one of the corner portions or any one of the side portions. 4. The method of claim 3,
The groove portion is disposed on an inner surface of any one of the corner portions or the groove portion is disposed on an upper surface of any one of the side portions. 5. The method according to any one of claims 1 to 4,
The coil chip is disposed on the first coil,
The coil chip does not overlap the magnet in the optical axis direction. 6. The method of claim 5,
In the initial position of the bobbin, the coil chip does not overlap the first coil in a direction perpendicular to the optical axis direction. 6. The method of claim 5,
The coil chip does not overlap the magnet in a direction perpendicular to the optical axis direction. 5. The method according to any one of claims 1 to 4,
The coil chip is disposed on the first coil,
The coil chip overlaps the magnet in the optical axis direction,
In the initial position of the bobbin, the coil chip does not overlap the first coil in a direction perpendicular to the optical axis direction. According to claim 1, wherein each of the first upper spring and the second upper spring,
an inner frame connected to an upper portion of the bobbin;
an outer frame connected to the upper portion of the housing; and
and a frame connecting portion connecting the inner frame and the outer frame,
The outer frame of the first upper spring includes a first extension portion bonded to the first electrode,
The outer frame of the second upper spring includes a second extension portion bonded to the second electrode. According to claim 1, wherein the coil portion of the coil chip,
ferrite part; and
and a coil having one end connected to the first electrode and the other end connected to the second electrode,
The ferrite part is a ferrite core on which the coil is wound, or a lens driving device in which the coil is a patterned ferrite sheet.

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