KR102404005B1 - Display device and method of manufacturing the same - Google Patents

Abstract

The present specification discloses a display device and a manufacturing method thereof. A display device according to various embodiments of the present specification includes a display area in which pixels are disposed, a non-display area surrounding the display area, an alignment mark located at an edge of the non-display area, and a display arranged at a distance from the alignment mark other components of the device. In addition, since the alignment mark and other components are bent with a certain curvature at the edge portion, unlike the prior art in which the alignment mark becomes a penetration path of external oxygen and moisture, in the present invention, such moisture permeation can be prevented. .

Description

Display device and manufacturing method thereof

The present specification relates to a display device, and more particularly, to a display device and a method of manufacturing the same for reducing moisture penetration occurring in an edge portion of the display device and deterioration of reliability thereof.

The advent of the information age coincided with the development of display devices that display images. Recently, the development of display devices has led to various forms such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED). In particular, liquid crystal display devices and light emitting display devices are in the spotlight because of the advantages of mass production technology, ease of driving means, and realization of high quality.

Among display devices, the organic light emitting display device is a self-emission type display device, which has superior viewing angle and contrast ratio compared to a liquid crystal display device (LCD). . In addition, the organic light emitting display device can be driven with a low DC voltage, has a fast response speed, and has advantages of low manufacturing cost.

The organic light emitting diode display includes pixels each including an organic light emitting diode, and a bank dividing the pixels to define the pixels. The bank may serve as a pixel defining layer. The organic light emitting diode includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the organic light emitting layer to emit light.

The organic light emitting diode has a disadvantage in that it is easily deteriorated by external factors such as external moisture and oxygen. To prevent this, the organic light emitting display device forms an encapsulation film to prevent external moisture and oxygen from penetrating into the organic light emitting diode. In general, the encapsulation film minimizes penetration of moisture or oxygen into the organic light emitting device by including an inorganic layer and an organic layer.

This role of the encapsulation film does not prevent the fundamental penetration of moisture and oxygen originating from the outside. The size of the molecules constituting the encapsulation film is inevitably larger than the size of water molecules and oxygen molecules, and moisture and oxygen penetrating into the encapsulation film may flow into the display device after some time.

Therefore, in order to minimize the penetration of moisture and oxygen affecting the performance reliability of the display device, it is required to maximize the movement path through which moisture and oxygen flow into the display device.

1 is a view showing a display device according to the prior art. And FIG. 2 is an enlarged view of the corner X of FIG. 1 . Also, FIG. 3 is a cross-sectional view taken along line I-I' of FIG. 2 .

1 to 3 , a display device according to the related art is divided into a display area DA and a non-display area NDA, and pixels are formed in the display area DA. Each of the pixels may include an organic light emitting diode including a thin film transistor, a first electrode 131 , an organic light emitting layer 133 , and a second electrode 132 on the substrate 100 . Each of the pixels supplies a predetermined current to the organic light emitting diode according to the data voltage of the data line when a gate signal is input from the gate line using a thin film transistor. Accordingly, the organic light emitting device of each of the pixels may emit light with a predetermined brightness according to a predetermined current.

A pad area in which pads are formed, a dam 160 and an align mark may be disposed in the non-display area NDA.

The alignment mark is located at a point exposed to the outside of the substrate 100 so that it can be recognized by a camera or the like in a process before and after a cell process and a module process during the process, for example, It may be located at the outermost edge of the substrate 100 .

The alignment mark shows a specific shape by the first metal layer 170, and FIG. 2 shows an alignment mark in the shape of a cross by way of example. A, B, and C indicated in FIG. 2 indicate a portion of this shape, in the case of A, the cross portion in which the first metal layer 170 is embossed, and B and C indicate the periphery of the cross. The specific shape represented by the first metal layer 170 is not limited to the cross of FIG. 2 and may be represented in various forms.

The first organic layer 121 covers the first metal layer 170 and constitutes the alignment mark. Referring to FIG. 2 , the first organic layer 121 covers the first metal layer 170 in a rectangular shape and partially contacts the first electrode 131 and the second metal layer 140 . The shape of the first organic layer 121 is not limited to the square shown in FIG. 2 and may be represented in various shapes.

The structure of the non-display area according to the prior art makes it difficult to effectively prevent moisture and oxygen from permeating. In the outermost edge portion, moisture and oxygen reach the first organic layer 121 constituting the alignment mark first. Moisture and oxygen may permeate through the first organic layer 121 and penetrate into the first electrode 131 and the second metal layer 140 that are in contact with the first organic layer 121 . In this case, the distance from the distal end of the display device where the penetration of moisture and oxygen starts to the first organic layer 121 constituting the alignment mark does not have a sufficient distance to delay penetration of moisture and oxygen. The configuration of the outermost edge portion of the display device of the prior art is required to be changed to a new structure that prevents penetration of moisture and oxygen.

In order to improve the reliability of the thin film transistor by minimizing moisture permeation at the outermost edge portion of the display device, the inventors have derived a structure that maximizes the path through which external moisture and oxygen penetrate into the interior of the display device at the outermost edge portion. Specifically, in the alignment mark located at the outermost corner of the display device, the inventors have configured the components constituting the alignment mark to be disposed on the substrate at a position that maximizes the penetration path of oxygen or moisture. aims to secure the reliability of the thin film transistor device by minimizing the moisture vapor transmission defect through a sufficient vapor transmission path in the display device devised by the inventors.

The tasks of the present specification are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

According to the display device according to various embodiments of the present specification, it is intended to maximize the moisture permeation path in the outermost edge portion to prevent a decrease in reliability due to moisture permeation. The display device may include an alignment mark located at an outermost edge portion, a first metal layer constituting the alignment mark, a first organic layer covering the first metal layer, a source electrode, a drain electrode, and a ground electrode. A metal layer and a first electrode covering a portion of the second metal layer may be included.

A display device according to an exemplary embodiment of the present specification separates the alignment mark disposed on the outermost corner portion from the components of the display area and some non-display area, and in the prior art, the alignment mark is transmitted through the encapsulation film covering the alignment mark. In contrast to the fact that moisture and oxygen from the outside penetrated into the display device and lowered the performance reliability, even if moisture permeation occurred in the sealing film of the align mark, the align mark, the display area, and some non-display areas were configured to be separated. It is possible to prevent deterioration of performance reliability due to Furthermore, in order to maximize the moisture permeation path through which external moisture and oxygen penetrate into the inside of the display device, some of the non-display area components of the corner of the display device are changed to have a curvature, so that the non-display area of the corner, which was configured at a right angle in the prior art In contrast to components. The display device according to an exemplary embodiment of the present specification may be configured to have an embossed shape of the alignment mark, and unlike the display device according to another exemplary embodiment of the present disclosure, the shape of the alignment mark may be configured to be embossed. can

Specific details of other embodiments are included in the detailed description and drawings.

Embodiments of the present specification relate to a display device, and in order to prevent moisture permeation caused from the outside of the display device and a decrease in reliability of a thin film transistor due to such moisture permeation, an alignment mark located at a corner of the display device is isolated and disposed to form an alignment mark. It is possible to provide a display device that minimizes an increase in the moisture permeation path due to this, and a method for manufacturing the same.

Effects of the present specification are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a plan view of a display device according to an exemplary embodiment of the related art.
FIG. 2 is a plan view showing an enlarged representation of X, which is a corner portion of FIG. 1 .
3 is a cross-sectional view taken along line I-I' of FIG. 2 .
4 is a plan view of a display device including an exemplary embodiment and another exemplary embodiment of the present invention.
5 is a plan view of a display device according to an embodiment of the present invention, which is an enlarged representation of Y, which is a corner portion of FIG. 4 .
6 is a cross-sectional view of a display device according to an exemplary embodiment taken along line II-II′ of FIG. 5 .
FIG. 7 is a plan view of a display device according to another exemplary embodiment of the present invention, which is an enlarged representation of Y, which is a corner portion of FIG. 4 .
8 is a cross-sectional view of a display device according to another exemplary embodiment taken along line II-II′ of FIG. 7 .

Advantages and features of the present specification, and a method for achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present specification are exemplary, and thus the present specification is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, when a temporal relationship is described in terms of 'after', 'following', 'after', 'before', etc., 'immediately' or 'directly' Unless ' is used, cases that are not continuous may be included.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

In describing the components of the present specification, terms such as first, second, A, and B may be used. These terms are only for distinguishing the elements from other elements, and the nature, order, order, or number of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but other components may be interposed between each component. It should be understood that each component may be “interposed” or “connected”, “coupled” or “connected” through another component.

Each feature of the various embodiments of the present invention can be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or implemented together in a related relationship. may be

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 and 5 are diagrams illustrating a display device according to an embodiment of the present invention. In particular, FIG. 5 is an enlarged view of Y, which is an edge portion of FIG. 4 .

Referring to FIG. 5 , the display device of the present invention includes a display area DA and a non-display area NDA surrounding the display area, and the non-display area may include an edge portion of the display device.

FIG. 6 is a view illustrating a display device taken along line II-II' of FIG. 5 . The line II-II' is the line crossing the alignment mark, the curvature edge part component. It was arranged to cross the shape of the alignment mark and to pass through the center of the shape.

Referring to FIG. 6 , in the display device according to an embodiment of the present invention, a substrate 210 , a passivation layer 210 disposed on the substrate 210 , and a display area DA disposed on the passivation layer 210 . ) and the alignment mark forming a part of the non-display area NDA and disposed in the non-display area NDA.

The substrate 210 may be a plastic film or a glass substrate.

The passivation layer 210 is disposed on the entire surface of the substrate 210 . The protective film 210 may serve as an insulating film and may be formed of an inorganic film, for example, a silicon oxide film, a silicon nitride film, or a multilayer thereof.

The alignment mark includes the first metal layer 270 and the first organic layer 221 . The first metal layer 270 may have a shape recognizable by the naked eye or by an optical device in constituting the alignment mark, and may have a embossed shape. The first metal layer 270 may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Or it may be a single layer or multiple layers made of an alloy thereof, but is not limited thereto.

The first organic layer 221 may be formed to cover an edge of the first metal layer 270 to separate the alignment mark from other components. The first organic film 221 is an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc. can be formed.

The first metal layer 270 and the first organic layer 221 may be disposed on the substrate 210 at a position that maximizes the penetration path of oxygen or moisture.

Components forming a part of the display area DA and the non-display area NDA and to be protected from penetration of external oxygen and moisture include a second metal layer 240 , a second organic layer 220 , and the second The first electrode 231 disposed on the metal layer 240 and the second organic layer 220 , the dam 260 disposed on the first electrode 231 on the non-display area NDA, the The organic light emitting diode 230 is disposed on the first electrode 231 in the display area DA.

The second metal layer 240 is one of a source electrode, a drain electrode, and a ground electrode, and is disposed on one surface of the passivation layer 210 . Such a source electrode, a drain electrode, and a ground electrode may be used as components of a thin film transistor (TFT) not shown in the drawing. The thin film transistor supplies a predetermined current to the organic light emitting diode according to the data voltage of the data line when a gate signal is input from the gate line in the pixel. Accordingly, the organic light emitting device of each of the pixels may emit light with a predetermined brightness according to a predetermined current. In the thin film transistor, a top gate (top gate) method in which a gate electrode is positioned on the active layer, a bottom gate (bottom gate) method in which a gate electrode is positioned under the active layer, or a gate electrode is active It may be formed in a double gate method positioned both above and below the layer. The source electrode, drain electrode, and ground electrode are each of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or a multilayer made of any one or an alloy thereof, but is not limited thereto. In addition, the second metal layer 240 is not limited to the source electrode, the drain electrode, and the ground electrode, and may be used for other electrodes and other purposes.

The second organic layer 220 covers a portion of the second metal layer 240 and is disposed on one surface of the passivation layer 210 . The second organic layer 220 may be formed as a planarization layer for flattening a step caused by the thin film transistor. The second organic film 220 is an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc. can be formed.

The first electrode 231 may be formed to cover the second organic layer 220 , the passivation layer 210 , and the second metal layer 240 disposed in the non-display area NDA. The first electrode 231 may be an anode electrode. The first electrode 231 is connected to a drain electrode of the thin film transistor (not shown) through a contact hole penetrating the passivation layer 210 and the second organic layer 220 . The first electrode 231 has a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/ APC/ITO) may be formed of a high reflectance metal material. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 234 may be formed to cover a portion of the first electrode 231 on the second organic layer 220 in order to partition an emission region. The bank 234 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. have.

The organic light emitting device 230 is formed on the second organic layer and the first electrode 231 . The organic light emitting device 230 includes the first electrode 231 , the second electrode 232 , and an organic light emitting layer 233 . The second electrode 232 may be a cathode electrode. The organic light emitting layer 233 is formed on the first electrode 231 and the dam 234 . The organic light emitting layer 233 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the first electrode 231 and the second electrode 232 , holes and electrons move to the emission layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the emission layer to emit light.

The organic light emitting layer 233 may be formed of a white light emitting layer emitting white light. In this case, it may be formed to cover the first electrode 231 and the bank 234 . In this case, a color filter not shown in the drawing may be formed on the substrate 200 .

The organic emission layer 233 may include a red emission layer emitting red light, a green emission layer emitting green light, or a blue emission layer emitting blue light. In this case, the organic light emitting layer 233 may be formed in a region corresponding to the first electrode 231 , and a color filter may not be formed on the substrate 200 .

The second electrode 232 is formed on the organic light emitting layer 233 . When the organic light emitting display device is formed in a top emission structure, the second electrode 232 is a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or magnesium (Mg). ), silver (Ag), or may be formed of a semi-transmissive conductive material such as an alloy of magnesium (Mg) and silver (Ag). A capping layer may be formed on the second electrode 232 .

The encapsulation layer 250 is formed to cover the organic light emitting device 230 formed in the display area DA to prevent oxygen or moisture from penetrating into the organic light emitting device 230 . In this case, the encapsulation layer 250 includes at least one inorganic layer and at least one organic layer. For example, the encapsulation film 290 may include a first encapsulation film 251 , a second encapsulation film 252 , and a third encapsulation film 253 , and the first encapsulation film 251 and the third encapsulation film 251 . The encapsulation layer 253 may be formed as an inorganic layer, and the second encapsulation layer 252 may be formed as an organic layer. In this case, the first encapsulation layer 251 is formed to cover the second electrode 232 . The second encapsulation film 252 is formed on the first encapsulation film 251 , and the third encapsulation film 253 is formed to cover the second encapsulation film 252 .

The first encapsulation layer 251 and the third encapsulation layer 253 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first encapsulation layer 251 and the third encapsulation layer 253 may be deposited using a chemical vapor deposition (CVD) technique or an atomic layer deposition (ALD) technique, but is not limited thereto.

The second encapsulation layer 252 may be formed to be transparent to allow light emitted from the organic light emitting layer 253 to pass therethrough. The second encapsulation layer 252 is formed of an organic material capable of passing 99% or more of the light emitted from the organic light emitting layer 253, for example, an acrylic resin, an epoxy resin, or a phenolic resin. ), polyamide resin or polyimide resin. The organic layer 292 may be formed by, but not limited to, vapor deposition, printing, or slit coating using an organic material, and the second encapsulation layer 252 may be formed by ink jetting. It can also be formed by an (ink-jet) process.

The dam 260 is formed to surround the periphery of the display area DA to block the flow of the second encapsulation film 252 constituting the encapsulation film 250 . In addition, the dam 260 is disposed between the display area DA and the pad area to prevent the second encapsulation film 252 constituting the encapsulation film 250 from encroaching on the pad area. Block the flow of (252). Accordingly, the dam 260 may prevent the second encapsulation film 252 from being exposed to the outside of the display device or from encroaching on the pad area.

The dam 260 may be formed simultaneously with the second organic layer 220 or the bank 234 of the pixel, and may be made of the same material as the second organic layer 220 or the bank 234 . have. In this case, the dam 260 is formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. can be formed with

The encapsulation layer 250 covers the display area DA, the dam 260 and the alignment mark. More specifically, since the flow of the second encapsulation film 252 constituting the encapsulation film 250 is blocked by the dam 260 , it has the same shape as the dam 260 .

On the other hand, since the first encapsulation film 251 and the third encapsulation film 253 constituting the encapsulation film 250 are deposited by a CVD method or an ALD method using a mask, the shape of the mask depends on the shape of the mask. The formation area varies accordingly. For example, when the second encapsulation layer 253 is deposited by a CVD method, a mask is disposed on the substrate on which the second encapsulation layer 252 is formed, and an element constituting the third encapsulation layer 253 is included. gas is supplied to the substrate. The supplied gas undergoes a chemical reaction on the surface of the substrate in the region where the mask is not formed, that is, in the region corresponding to the open region of the mask. Accordingly, the third encapsulation layer 253 is formed in the region corresponding to the open region of the mask. formed on the surface of the substrate. That is, the second encapsulation layer 253 has the same shape as the open area of the mask.

The mask is generally manufactured by a wet etching method. The mask may be manufactured in the shape of a right angle or a convex curved edge portion of the open region.

Referring to FIG. 6 , in order to prevent deterioration in performance of the display device due to infiltration of external oxygen and moisture, the encapsulation film 250 may be configured to have different left and right widths and vertical thicknesses. Unlike in FIG. 6 , the upper and lower thicknesses of the encapsulation layer 250 may be sufficiently thick to suppress penetration of oxygen and moisture from the upper side of the display device. However, the left and right width adjustment of the encapsulation layer 250 is limited due to the limited width of the non-display area NDA. Accordingly, it is difficult to suppress the penetration of oxygen and moisture into the first metal layer 270 and the first organic layer 221 constituting the alignment mark. However, according to various embodiments of the present disclosure, the first metal layer 270 and the first organic layer 221 constituting the alignment mark are oxygenated on the substrate despite the penetration of oxygen and moisture into the alignment mark. Alternatively, it may be disposed at a position that maximizes the penetration path of moisture. The oxygen and moisture permeation path may be defined as a path between the encapsulation layer 250 and the first organic layer 221 . Increasing the moisture permeation distance to the dam 260 , the second metal layer 240 , and the first electrode 231 may suppress penetration of moisture and oxygen into the organic light emitting device 230 , and the organic light emitting device 230 . ) to prevent deterioration due to moisture permeation.

Referring to FIG. 5 , the dam 260 , the second metal layer 240 , and the first electrode 231 have a rounded rectangular shape at the edge to maximize the moisture permeation distance. More specifically, the dam 260 has a structure in which a first straight structure formed in a first direction and a second linear structure formed in a second direction perpendicular to the first direction are connected, and a structure having a constant curvature is formed at the connection point. . As a result, the dam 260 has a rectangular shape with rounded edges.

The second metal layer 240 and the first electrode 231 may be disposed under the dam 260 . Just as the dam 260 has a rounded rectangular shape at the edge, the second metal layer 240 and the first electrode 231 may also have a rounded rectangular shape at the edge. Referring to FIG. 5 , the dam 260 , the second metal layer 240 , and the first electrode 231 may be bent while having a curvature at an edge thereof.

The second organic layer 220 has a curved shape with an edge portion having a first curvature. In this case, the first curvature is greater than zero.

An align mark is positioned at the lower left side of the edge part. The alignment mark may be located not only on the edge portion shown in FIG. 5 but also on other edge portions. The alignment mark is formed by a first metal layer 270 and a first organic layer 221 covering the first metal layer. The first metal layer 270 may have a shape recognizable by the naked eye or by an optical device in constituting the alignment mark, and the first metal layer 270 according to an embodiment of the present invention is embossed ( The shape is indicated by embossed engraving. That is, the first metal layer 270 is positioned and embossed inside the cross shape shown in FIG. 5 , and the first organic layer 221 covers this shape.

As shown in FIG. 5 , it may have a second curvature different from the first curvature and greater than the first curvature and may be configured in a circular shape.

7 to 8 are the display device according to another embodiment of the present invention, and in the case of the same content as the components shown in FIGS. 4 to 6 , a description thereof will be omitted below.

FIG. 7 is an enlarged view of an edge portion B of the display device not shown in FIG. 4 . In the non-display area NDA of FIG. 7 , a pad area in which pads are formed, a dam 260 and an align mark may be disposed.

The alignment mark may be located at the outermost edge of the substrate 200 . The alignment mark is constituted by a first metal layer 270, and the first metal layer 270 represents a shape recognizable by the naked eye or by an optical device in constituting the alignment mark, FIG. 7 is an example It was shown in the shape of a cross. In the display device according to another embodiment of the present invention, when the first metal layer 270 represents the shape, the first metal layer 270 may be positioned on the edge of the shape, and the shape may be represented by an intaglio through the edge part. The specific shape represented by the first metal layer 270 is not limited to the cross of FIG. 7 and may be represented in various forms.

FIG. 8 is a view illustrating a display device taken along line III-III' of FIG. 7 . The line III-III' is the line crossing the alignment mark, the curvature edge part component. In particular, the alignment marks were arranged to cross the shape of the alignment mark and pass through the center of the shape.

Referring to FIG. 8 , a display device according to another exemplary embodiment includes a substrate 210 , a protective layer 210 disposed on the substrate 210 , and a non-display area NDA of the substrate 210 . The alignment mark and the alignment mark disposed on the substrate may be configured to have a position that maximizes the penetration path of oxygen or moisture on the substrate.

Although not shown, the display device according to various embodiments of the present disclosure may have a characteristic manufacturing process.

The alignment mark may be formed in the non-display area NDA on the substrate 200 . At this time, the first metal layer 270 is used to form the shape of the alignment mark, and after forming the first conductive layer, the first conductive layer is selectively patterned using a photolithography process. The first metal layer 270 is formed on the substrate 200 .

Here, as the first conductive layer, for example, low-resistance conductive material such as aluminum (Al), aluminum alloy (Al alloy), tungsten (W), copper (Cu), chromium (Cr), or molybdenum (Mo). It can be made of material.

Additionally, the process of forming the first metal layer 270 may be referred to as a first process for convenience.

In the first process, not only the first metal layer 270 located in the non-display area NDA, but also the second metal layer 240 having a separation distance from the alignment mark and used as source, drain, and ground electrodes is performed. It may include a forming process.

In the first process, a photolithography process is performed after forming the first conductive layer, and not only the first metal layer 270 but also the second metal layer 240 may be selectively formed.

The first metal layer 270 and the second metal layer 240 may be formed at the same time and may be made of the same material.

Next, after the first process, a second conductive film is formed on the entire surface of the substrate 200 on which the first metal layer 270 is formed, and then the second conductive film is selectively patterned using a photolithography process. The first organic layers 221 and 22 including the second conductive layer may be formed on the first metal layer 270 .

Here, the second conductive layer may be formed of, for example, an organic material having excellent planarization characteristics and photosensitivity.

Additionally, the process of forming the first organic layers 221 and 222 may be referred to as a second process for convenience.

In the second process, the second organic layer covering the second metal layer 240 as well as the first organic layers 221 and 222 positioned in the non-display area NDA and having a separation distance from the alignment mark ( 220) may include a process of forming.

In the second process, a photolithography process is performed after forming the second conductive film, and the first organic films 221 and 222 are selectively formed as well as the second organic film 220 is selectively formed. can

The first organic layers 221 and 222 and the second organic layer 220 may be formed at the same time, and may be made of the same material.

Although the embodiments of the present specification have been described in detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit thereof. Therefore, the embodiments disclosed in the present specification are for explanation rather than limiting the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically variously linked and operated by those skilled in the art, and each embodiment may be implemented independently of each other or together in a related relationship. may be carried out. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: substrate
110: shield
121: first organic layer
122: second organic layer
131: first electrode
132: second electrode
133: organic light emitting layer
134: bank
140: second metal layer
151: first encapsulation film
152: second encapsulation film
153: third encapsulation film
160: dam
170: first metal layer
200: substrate
210: Shield
220: second organic film
221, 222: first organic layer
231: first electrode
232: second electrode
233: organic light emitting layer
234 : bank
240: second metal layer
251: first encapsulation film
252: second encapsulation film
253: third encapsulation film
260: dam
270: first metal layer

Claims (16)

a substrate including a display area on which pixels are disposed and a non-display area surrounding the display area;
a first metal layer disposed in a non-display area of the substrate;
a first organic layer covering the first metal layer; and
a second organic layer covering a portion of the substrate;
The first metal layer and the first organic layer constitute an align mark,
The first metal layer and the first organic layer of the alignment mark have a position on the substrate to maximize the penetration path of oxygen or moisture,
The second organic layer has a plurality of edge portions on a plane, and has a first curvature at at least one edge portion adjacent to the alignment mark;
The display device of claim 1, wherein the first organic layer has a second curvature different from the first curvature on a plane. According to claim 1,
Further comprising an encapsulation film covering the substrate,
The encapsulation layer covers the first organic layer, and the permeation path of the oxygen or moisture is defined as a path between the encapsulation layer and the first organic layer. According to claim 1,
The first metal layer has a shape recognizable by the naked eye or by an optical device in constituting the alignment mark. 3. The method of claim 2,
The first metal layer is embossed engraving to indicate the shape of the alignment mark. 3. The method of claim 2,
In representing the shape of the alignment mark, the first metal layer is positioned on an edge of the shape of the alignment mark, and the display device represents the shape of the alignment mark by depressed engraving through the edge. 3. The method of claim 2,
a second metal layer disposed on the display area of the substrate and used as source, drain, and ground electrodes; and
The first metal layer has the same configuration as the second metal layer. a substrate including a display area on which pixels are disposed and a non-display area surrounding the display area;
an align mark disposed on the non-display area;
a first metal layer constituting a shape of the alignment mark;
a first organic layer covering the first metal layer;
a second organic layer covering a portion of the substrate except for the alignment mark; and
The second organic layer has a plurality of edge portions on a plane, and has a first curvature at at least one edge portion adjacent to the alignment mark;
The first organic layer has a second curvature different from the first curvature in a plan view. 8. The method of claim 7,
The first organic layer covers the substrate so as not to contact the second organic layer. delete 8. The method of claim 7,
The first organic layer is curved at the second curvature on a plane to have a circular shape. 8. The method of claim 7,
The first curvature has a curvature greater than zero. 8. The method of claim 7,
a second metal layer that can be used as a source, drain, and ground electrode of the substrate;
a first electrode covering a portion of the second metal layer; and
and a dam disposed in the non-display area. 13. The method of claim 12,
The second metal layer, the first electrode, and the dam have a curvature at the edge portion and are bent. A first metal layer used to form an alignment mark shape is formed in a non-display area on a substrate, and a second metal layer that is spaced apart from the first metal layer and can be used as source, drain, and ground electrodes is formed on the substrate. a first process; and
a second step of forming a first organic layer covering the first metal layer after the first step and forming a second organic layer covering a part of the second metal layer;
The second organic layer has a plurality of edge portions on a plane, and has a first curvature at at least one edge portion adjacent to the alignment mark;
The method of manufacturing a display device, wherein the first organic layer has a second curvature different from the first curvature on a plane. delete delete

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