KR102392393B1 - Oin bonding device and bonding method for processing ultrasonic horn - Google Patents

Abstract

The present invention is an ultrasonic horn in the form of a square cross-section, a plate part located in the upper direction of the ultrasonic horn, the upper end is inserted with the lower surface of the plate part, and the lower end is a processing pin in contact with the upper surface of the ultrasonic horn and the ultrasonic horn located in the outer direction and the upper end is in contact with the lower surface of the arrangement part It includes a support, and provides an adhesive device in which the upper surface of the processing pin and the ultrasonic horn are spaced apart from each other by a predetermined reference distance by pressing the upper end of the support in the upward direction. According to the present invention, it is possible to induce uniform arrangement and erection of the processing pins, so that it is possible to more easily adhere and fix the ultrasonic horn and the processing pins. It is possible to prevent the occurrence of long holes on the raw material when drilling for the raw material, and the process pin can be unintentionally detached from the plate without a separate fixing means, so the process of adhering the processing pin It is possible to maximize the convenience and the quality of the bonding pin and ultrasonic horn.

Description

Device and bonding method for processing pin of ultrasonic horn

The present invention relates to an ultrasonic horn processing pin bonding device and bonding method. More particularly, it relates to an apparatus and method for minimizing the bending or damage of the processing pin in the process of bonding the processing pin installed in the ultrasonic horn.

A showerhead for semiconductor etching is equipment used to etch a wafer by spraying a plasma gas from a semiconductor manufacturing chamber to a silicon wafer. The showerhead has a plurality of gas injection holes, and the gas in a plasma state passes through the gas injection holes. In order to manufacture this, an ultrasonic horn with a processing pin is used and by applying ultrasonic vibration to the ultrasonic horn, precise ultrasonic drilling is performed on the showerhead, which is described in Prior Document 1 (Korea Utility Model Publication No. 20-2012). -0001876) is disclosed in a horn for an ultrasonic welding machine.

However, in the case of Prior Document 1 as described above, the processing pin installed in the horn is easily bent during the installation process, and the longer the length of the processing pin, the greater the load is applied in the processing and manufacturing process, which causes unintentional damage. There is a problem. In addition, in the conventional case, in the process of installing the processing pins to the ultrasonic horn, uniform force is not applied to the plurality of processing pins, so there is a problem in that the quality is deteriorated. Accordingly, by minimizing the load applied to the processing pin during the manufacturing process, there is a need for a technology capable of maximizing the processing capability during ultrasonic drilling using the same.

Prior Document 1: Republic of Korea Public Utility Model No. 20-2012-0001876 (published on March 13, 2012)

The technical problem of the present invention is to minimize the load applied to the processing pin to prevent bending.

In addition, an object of the present invention is to easily bond the processing pin of the ultrasonic horn capable of maximizing the processing capability.

In addition, the problem to be solved by the present invention is to maximize the quality by bonding to the ultrasonic horn with a uniform force for a plurality of processing pins.

To this end, the present invention provides an ultrasonic horn in the form of a square cross-section, a plate part located in the upper direction of the ultrasonic horn, the upper end is inserted with the lower surface of the plate part, and the lower end is located in the outer direction of the processing pin and the ultrasonic horn in contact with the upper surface of the ultrasonic horn, and the upper end is the lower surface of the arrangement part It includes a support part in contact with, and provides an adhesive device in which the upper surface of the processing pin and the ultrasonic horn are spaced apart from each other by a predetermined reference distance by pressing the upper end of the support part in the upward direction.

In addition, the present invention is an insertion step of inserting a processing pin into the lower surface of the plate portion provided with a through hole, the step of fixing the processing pin by positioning the holding portion on the upper surface of the plate portion, the step of applying an adhesive to the upper surface of the ultrasonic horn, the outer direction of the ultrasonic horn A support step of installing a support in the arranging step of arranging the plate portion in the upper direction of the support portion so that the lower end of the processing pin is spaced apart from the upper surface of the ultrasonic horn by a predetermined reference distance, a first removal step of removing the holding portion from the plate portion and the plate portion and a second removal step of removing the from the pin for processing.

According to the present invention, it is possible to induce a uniform arrangement and erection of the pin for processing, so that it is possible to more easily adhere to the ultrasonic horn and the pin for processing.

In addition, according to the present invention, it is possible to prevent inclination and bending because the pin for processing does not receive a load by the support part during the arrangement process, and thus it is possible to prevent the occurrence of long holes on the raw material when drilling the raw material.

In addition, the present invention can make it possible to unintentionally separate the processing pin from the plate part without a separate fixing means, thereby maximizing the convenience of the bonding process of the processing pin and the quality of the bonding processing pin and the ultrasonic horn.

1 is a view showing an overall bonding apparatus according to an embodiment of the present invention.
2 is a view showing an ultrasonic horn, a plate portion and a pin for processing according to an embodiment of the present invention.
3 is a view showing a plate portion and a holding portion according to an embodiment of the present invention.
4 is a view showing the detachment of the plate part and the ultrasonic horn according to the holding part according to an embodiment of the present invention.
5 is a view showing a support according to an embodiment of the present invention.
6 is a view showing a first height, a second height, a first thickness, and a second thickness according to an embodiment of the present invention.
7 is a diagram illustrating a reference distance according to an embodiment of the present invention.
8 is a view showing an overall bonding method according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily implement them. However, the present invention may be implemented in various different forms, and is not limited to the embodiments described below or illustrated in the drawings. In addition, in order to clearly explain the present invention in the drawings, parts irrelevant to the present invention are omitted, and the same or similar symbols in the drawings indicate the same or similar components.

Objects and effects of the present invention can be naturally understood or more clearly understood by the following description, and the objects and effects of the present invention are not limited only by the following description.

Prior to describing the present invention in detail, the terms defining the direction such as “upward direction” and “downward direction” are described as an example in which the ultrasonic horn according to the present invention is erected on a flat ground, etc., and there is no other mention It will be described based on one drawing.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. 1 is a view showing an overall bonding apparatus according to an embodiment of the present invention. The bonding device according to the present invention is located in the upper direction of the ultrasonic horn 110 and the ultrasonic horn 110 to provide an installation space for the processing pin 150 to be installed. It includes a support portion 170 for preventing the processing pin 150, the processing pin 150 provided for this from receiving an excessive load.

Figure 2 is a view showing the ultrasonic horn 110, the plate portion 140 and the processing pin 150 according to an embodiment of the present invention, Figure 3 is a plate portion 140 and the holding portion according to an embodiment of the present invention. It is a view showing 160, and FIG. 4 is a view showing detachment of the plate unit 140 and the ultrasonic horn 110 according to the holding unit 160 according to an embodiment of the present invention.

The ultrasonic horn 110 is a main body of ultrasonic drilling, and is configured for drilling by generating ultrasonic vibration to vibrate the raw material. To this end, the ultrasonic horn 110 has a rectangular cross-sectional shape and a processing pin 150 to be described later is disposed on the upper surface. Here, the cross-sectional shape of the ultrasonic horn 110 is not limited to a quadrangle and may be variously provided in a pentagonal, hexagonal, circular, or the like.

The adhesive part 120 assists so that the processing pin 150 to be described later can be easily fixed by being applied to the ultrasonic horn 110 . To this end, the bonding unit 120 is provided with bonding means such as a bond, and is applied to the upper surface of the ultrasonic horn 110 . As will be described later, the adhesive part 120 is located on the upper surface of the ultrasonic horn 110 and is provided with a thickness greater than or equal to the reference distance d0. Thereafter, the processing pin 150 is disposed in the upper direction of the bonding unit 120 , and the bonding unit 120 is dried and hardened, thereby completing the fixing of the ultrasonic horn 110 and the processing pin 150 .

The partition part 130 is configured to assist the adhesive part 120 to be applied at a uniform height. To this end, the partition unit 130 is provided to correspond to the upper surface of the ultrasonic horn 110 . In more detail, the partition unit 130 is provided in the form of a frame corresponding to the cross-sectional shape of the ultrasonic horn 110 , thereby being provided along the periphery of the ultrasonic horn 110 . In addition, the partition 130 is formed to protrude from the upper surface of the ultrasonic horn 110 . Here, the height in the upper direction of the partition part 130 may be provided to be higher than the height at which the adhesive part 120 is applied. It is possible to prevent the adhesive part 120 from overflowing on the upper surface of the ultrasonic horn 110 through the partitioning part 130 . In addition, since the adhesive part 120 is positioned in the inner direction through the partition part 130, it can be provided with a more uniform height, so that the ultrasonic horn 110 and the processing pin 150 can be fixed with a more uniform force. Do.

The plate unit 140 provides a space for the processing pin 150 to be disposed and fixed on the ultrasonic horn 110 . In detail, the plate unit 140 assists the processing pin 150 to be uniformly positioned in the upper direction of the ultrasonic horn 110 and to be accurately erected. To this end, the plate portion 140 is provided in the form of a plate and the processing pin 150 is positioned in the lower direction. Specifically, the plate portion 140 is positioned in the upper direction of the ultrasonic wave, the through hole 141 is formed in the lower surface. Here, the through hole 141 may be formed in a circular shape to correspond to the shape of the processing pin 150 , and the through hole 141 corresponds to the processing pin 150 one-to-one. In addition, the through hole 141 may be provided so that the position of the upper end of the inserted processing pin 150 may be located on the same height line as the upper surface of the plate unit 140 . Through this, the upper end of the processing pin 150 is inserted into the through hole 141 in the lower direction of the plate 140 , so that the processing pin 150 may be connected to the plate 140 . In addition, the first thickness d1 , the second thickness d2 , and the reference distance d0 described later in FIGS. 6 and 7 may be easily calculated through the through hole 141 as described above.

The processing pin 150 is a configuration that directly performs drilling in contact with the raw material, and is coupled with the ultrasonic horn 110 . To this end, a plurality of processing pins 150 are provided in the form of a cylindrical pin shape. Here, the shape of the processing pin 150 may be variously provided in the form of a cone, a polygonal pyramid, etc. as well as a cylindrical shape. In addition, the processing pin 150 has both ends facing the upper direction and the lower direction, respectively, the upper end facing the upper direction is inserted into the aforementioned through hole 141, and the lower end facing the lower direction is provided to face the ultrasonic horn 110 do. In addition, the plurality of processing pins 150 may be provided to have a pattern such as a predetermined circle in response to the user's design. In addition, the processing pin 150 maintains the upper end inserted into the lower surface of the plate unit 140 by the magnetic force of the holding unit 160 to be described later, and in this state, first disposed on the upper surface of the ultrasonic horn 110 . By making contact with the contact part, the coupling with the ultrasonic horn 110 is completed.

The holding part 160 prevents separation of the processing pin 150 by using magnetic force. In detail, the holding part 160 prevents the processing pin 150 from being separated from the plate part 140 in a state where the upper end of the processing pin 150 is inserted into the through hole 141 . That is, the holding part 160 prevents the unintentional separation of the processing pin 150 from the plate part 140 . To this end, the holding part 160 is provided with a magnetic material, is formed in a plate shape so as to uniformly affect the plurality of processing pins 150 , and is located in the upper direction of the plate part 140 . That is, the plate portion 140 forms an arrangement positioned between the holding portion 160 in the upper direction and the processing pin 150 in the lower direction. As shown in FIG. 4A , when the holding part 160 is not close to the plate part 140 , the processing pin 150 and the plate part 140 may be freely separated from each other. On the other hand, as shown in FIG. 4B , when the plate part 140 and the holding part 160 are in contact with each other, a plurality of processing pins 150 by the magnetic force of the holding part 160 in which the lower surface is in contact with the upper surface of the plate part 140 . ) continuously maintains the state inserted into the through hole (141). In this state, the upper surfaces of the processing pin 150 and the ultrasonic horn 110 are spaced apart by a predetermined reference distance d0 by the supporting part 170 to be described later, and the processing pin 150 and the ultrasonic horn 110 by the adhesive part 120 (110) is bonded to be coupled to each other. By having the holding unit 160 as described above, the present invention can selectively fix and detach the processing pin 150 compared to the prior art in which the holding unit 160 is not provided, thereby significantly lowering the difficulty related to the bonding process. quality can be maximized. In addition, since it is possible to block a situation in which the processing pin 150 is unintentionally pressed to the side during the bonding process, the bending of the processing pin 150 can be prevented in advance.

5 is a view showing a support unit 170 according to an embodiment of the present invention.

The support unit 170 is provided for the purpose of minimizing the load that may be applied to the processing pin 150 while the plate unit 140 is disposed so that the ultrasonic horn 110 and the processing pin 150 are close to each other. In detail, the support unit 170 prevents in advance that the lower end of the processing pin 150 and the upper surface of the ultrasonic horn 110 excessively contact the processing pin 150 from being bent or not standing upright. To this end, the support unit 170 may be located in the outer direction of the ultrasonic horn 110 to be located at the vertex portion, and is provided in plurality. In detail, the support unit 170 is provided in plurality and arranged along the circumference of the ultrasonic horn 110 , and the upper end is in contact with the lower surface of the arrangement unit and the lower end is in contact with the ground. Here, the central portion of the support portion 170 may have a variable length in the upward direction through a screw movement. Accordingly, the support 170 can adjust the length in the vertical direction in response to the size of the ultrasonic horn 110, thereby maximizing versatility.

6 is a view showing a first height (h1), a second height (h2), a first thickness (d1), and a second thickness (d2) according to an embodiment of the present invention, Figure 6a is a first height ( h1) and the second height h2, and FIG. 6B is a view showing the first thickness d1 and the second thickness d2. Ultimately, FIG. 6 shows a first height h1 , a second height h2 , a first thickness d1 , and a second thickness d2 provided to calculate a reference distance d0 according to FIG. 7 to be described later. to express In addition, in FIG. 6B , only one of the processing pins 150 among the plurality of processing pins 150 is expressed in a state inserted into the plate portion 140 so that a clearer second thickness d2 can be grasped.

The first height h1 is a height from the lower end to the upper end of the support unit 170 , and more specifically, the height in the vertical direction of the support unit 170 , and more specifically, the ground surface where the lower surface of the ultrasonic horn 110 is in contact. It means the height from the upper end to the lower surface of the plate portion 140 in contact. That is, the support unit 170 is erected in the vertical direction, but is provided with a first height (h1) and is located between the ground and the plate unit 140, and is inserted into the plate unit 140 and the plate unit 140 in the lower direction for processing. The pin 150 is supported in an upward direction.

The second height h2 is a height in the vertical direction of the ultrasonic horn 110 , and more specifically, refers to a height from the ground in contact with the lower surface of the ultrasonic horn 110 to the upper surface of the ultrasonic horn 110 . Here, the upper end of the support unit 170 is located in the upper direction than the upper surface of the ultrasonic horn 110 for supporting the plate unit 140 in the upward direction, the first height (h1) is higher than the second height (h2). preferably greater than or equal to.

The first thickness d1 is a height in the vertical direction of the plate part 140 , and specifically, the first thickness d1 means a height from the upper surface to the lower surface of the plate part 140 . In addition, the second thickness d2 is a height in the vertical direction of the processing pin 150 , and means the height from the upper end to the lower end of the processing pin 150 . Here, the upper end of the processing pin 150 inserted into the through hole 141 as described above may be located on the same height as the upper surface of the plate unit 140 . This easily calculates the length of only the processing pin 150 exposed in the downward direction of the plate portion 140, thereby easily obtaining the reference distance d0 between the lower end of the processing pin 150 and the upper surface of the ultrasonic horn 110. have a possible effect.

The first height (h1) and the second height (h2) are provided with reference to the ground in which the lower surface of the ultrasonic horn 110 and the lower end of the support unit 170 are in contact with each other, and the first thickness (d1) and the second thickness (d2) Since is provided based on the upper surface of the plate portion 140, it is possible to more easily and accurately calculate the reference distance (d0).

7 is a diagram illustrating a reference distance d0 according to an embodiment of the present invention.

The reference distance d0 is a distance between the upper surface of the ultrasonic horn 110 and the processing pin 150, and the processing pin 150 is spaced apart enough to prevent bending in excessive contact with the ultrasonic horn 110. means distance. To this end, the reference distance d0 may be provided as a difference between the sum of the first height h1 and the first thickness d1 and the sum of the second height h2 and the second thickness d2. In detail, the reference distance d0 may be provided as a value obtained by subtracting the difference between the first height h1 and the second height h2 and the first thickness d1 and the second thickness d2. That is, the reference distance d0 is the difference between the first height h1 and the second height h2, which means the length from the upper surface of the ultrasonic horn 110 to the lower surface of the plate unit 140 , and the plate unit 140 . It is a value obtained by subtracting the difference between the first thickness (d1) and the second thickness (d2), which is the length of the exposed processing pin 150 . In other words, the reference distance d0 is a value obtained by subtracting only the pure height of the exposed processing pin 150 from the distance to the upper surface of the ultrasonic horn 110 and the lower surface of the plate unit 140 .

As a more preferred embodiment, the reference distance d0 may be provided in a range of 0.06 mm to 0.46 mm. In detail, as a result of testing the capability process (CP) of the ultrasonic horn 110 according to the variation of the reference distance d0, the reference distance d0 between the processing pin 150 and the ultrasonic horn 110 is When it was 0.06 mm to 0.46 mm, it was possible to obtain a satisfactory process capability value. The experimental data for this is shown in Table 1 below. Here, the process capability is an example when the upper control limit (UCL) for the drilling process of the ultrasonic horn 110 is 0.9 and the lower control limit (LCL) is 0.87, and the experiment is performed while increasing the reference distance (d0). was carried out in such a way as to obtain In addition, the first thickness (d1) that is the height of the plate portion 140 is 21mm, the second thickness (d2) that is the length of the processing pin 150 is 28.54mm, the second height (h2) that is the height of the ultrasonic horn (110) ) was fixed to 117.mm and the experiment was carried out.

TEST test 1 TEST 2 TEST 3 TEST 4 TEST 5 TEST 6 test 7 TEST 8 TEST 9 difference condition support height Unapplied Unapplied 124.90 125.00 125.10 125.20 125.30 125.40 125.50 reference distance 0 0 0.06 0.16 0.26 0.36 0.46 0.56 0.66 Process capability (CP)
(Upper limit: 0.9, lower limit: 0.8) 1.491 1.608 1.733 2.055 1.943 1.974 2.230 1.550 1.566

Through the above experiment, the processing capability increases when the support portion 170 is supported in the upper direction of the plate portion 140, and in particular, the reference distance (d0) from TEST 3, where 0.06mm is the reference distance ( In TEST 7 where d0) is 0.46mm, it can be seen that the process capability is maximized, and when the reference distance (d0) exceeds 0.46mm, the process capability is lowered again. Through this, it can be confirmed that when the reference distance d0 is set within 0.06 mm to 0.46 mm, the highest process efficiency is obtained.

8 is a view showing an overall bonding method according to an embodiment of the present invention. The bonding method according to the present invention includes an insertion step of inserting the processing pin 150 into the plate portion 140 (s110), a fixing step of fixing the processing pin 150 (s120), an application step of applying the adhesive portion 120 ( s130), a supporting step of installing the support unit 170 (s140), an arrangement step of raising the plate unit 140 on the supporting unit 170 (s150), a first removing step of removing the holding unit 160 (s160), and It includes a second removal step (s170) of removing the plate portion 140 from the processing pin (150).

The insertion step (s110) is a step of performing preliminary preparation for installing the processing pin 150, and installs the processing pin 150 in the lower direction of the plate portion 140. In detail, in the insertion step (s110), one end of the processing pin 150 is inserted into the through hole 141 formed on the lower surface of the plate unit 140 . Here, the height of one end of the inserted processing pin 150 is provided to be positioned at the same height as the upper surface of the plate unit 140 .

The fixing step (s120) is provided to prevent in advance that the processing pin 150 is bent or separated from the plate unit 140 in the process of being disposed on the ultrasonic horn 110 . To this end, the holding unit 160 is positioned on the upper surface of the plate unit 140 in the fixing step (s120). Here, the holding unit 160 is disposed on the plate unit 140 through a separate arrangement means provided with a jig, a rail, a crane, or the like. As the holding part 160 is provided with a magnetic material, the pin 150 for processing by using magnetic force is prevented from being separated from the through hole 141 . Since the fixing step (s120) is provided, it is possible to omit fixing the plate portion 140 to the processing pin 150 using a separate fixing means or a user's hand, thereby maximizing process convenience. In addition, since the holding unit 160 uniformly fixes the plurality of processing pins 150 using magnetic force, uniform arrangement of all processing pins 150 is possible, thereby remarkably improving the quality.

The application step (s130) is a step of performing preliminary preparation for inducing the fixing of the processing pin 150 and the ultrasonic horn 110. To this end, the application step (s130) is performed after the fixing step (s120). In addition, in the application step (s130), the adhesive part 120 is disposed on the upper surface of the ultrasonic horn 110 through the arrangement means. As a more preferred embodiment, in the application step (s130), the partition part 130 having a band shape is disposed along the circumference of the upper surface of the ultrasonic horn 110, and then the adhesive part 120 on the upper surface of the ultrasonic horn 110. may be provided. In the application step (s130), prior to the arrangement of the adhesive part 120, the partition part 130 is positioned first, so that the adhesive part 120 is separated from the upper surface of the ultrasonic horn 110 and flows down or the surface is not uniformly disposed. It can be prevented in advance, and as a result, it is possible to assist in the arrangement of the pin 150 for easy processing.

The supporting step (s140) is a step of performing prior preparation for installing the plate unit 140, which is performed before an arrangement step (s150) to be described later. To this end, in the supporting step (s140), a plurality of supporting parts 170 are installed through a separate arrangement means. In detail, in the supporting step ( s140 ), the supporting part 170 is disposed in the outer direction of the ultrasonic horn 110 . Here, the support 170 may be disposed to have a first height h1.

The arrangement step (s150) is a step of combining the processing pin 150 and the ultrasonic horn 110. In detail, in the arrangement step (s150), the processing pin 150 is adhered to the upper surface of the ultrasonic horn 110 . To this end, the plate unit 140 is placed on the support unit 170 through a separate arrangement means in the arrangement step (s150). In detail, the plate part 140 is positioned in the upper direction of the support part 170 so that the processing pin 150 is directed downward. Here, the lower end of the processing pin 150 and the upper surface of the ultrasonic horn 110 are arranged to be spaced apart by a predetermined reference distance d0. Through this, the processing pin 150 is not in contact with the upper surface of the ultrasonic horn 110, the lower end is disposed inside the bonding portion (120). That is, the processing pin 150 has a lower end spaced upward by a reference distance d0 from the upper surface of the ultrasonic horn 110 , the lower end is fixed to the adhesive unit 120 , and the upper end is fixed through the holding unit 160 . The vertical position is fixed. As a more preferred embodiment, a drying step of drying the adhesive part 120 for a predetermined time period is additionally performed after the disposing step (s150), so that the first removing step (s160) and the second removing step (s170) to be described later are When it is performed, it is possible to prevent in advance that the processing pin 150 is tilted.

The first removing step (s160) is provided for the purpose of releasing the fixing with respect to the upper end of the processing pin 150 as a step carried out after the arrangement step (s150). To this end, in the first removal step (s160), the holding unit 160 is moved upwardly through a separate arrangement means to separate it from the plate unit 140 . Here, as the holding part 160 having a magnetic force moves upward, the attractive force between the holding part 160 and the processing pin 150 is removed.

The second removal step (s170) is provided for the purpose of completing the adhesion of the ultrasonic horn 110 and the processing pin 150 by finally releasing the fixing of the upper end of the processing pin (150). To this end, in the second removing step (s170), the plate unit 140 is moved upwardly through a separate arrangement means. Here, in the case of the plate part 140, the magnetic force of the holding part 160 is removed through the above-described first removing step (s160), so that the upward movement can be easily performed. As the plate portion 140 moves in the upward direction, the upper end of the pin 150 for processing to which the lower end is fixed is separated from the through hole 141 and exposed to the outside.

Through a series of configurations and methods as described above, a plurality of processing pins 150 can be easily disposed on the ultrasonic horn 110, and since a uniform upright arrangement for all processing pins 150 is possible, the slope is It is possible to prevent in advance the occurrence of long holes on the raw material by the processing pins 150 disposed in the existing state. In addition, in the case of the present invention, since the lower end does not receive any load in the downward direction when the processing pin 150 is disposed, the bending phenomenon itself of the processing pin 150 can be blocked, thereby maximizing the quality. That is, by preventing the lower end of the processing pin 150 and the ultrasonic horn 110 from excessively contacting, it is possible to prevent tilting or bending due to the intrinsic elasticity of the processing pin 150, thereby not causing the generation of long holes in the raw material. In addition, the present invention has the effect of maximizing the processing capability for the processing pin 150 and the ultrasonic horn 110, while bonding the processing pin 150 uniformly and easily, the adhesion is completed.

Although the present invention has been described with reference to a preferred embodiment, this is only an embodiment, and those of ordinary skill in the art may be able to make various modifications and equivalent other embodiments therefrom. Accordingly, the scope of the present invention is not limited by the above embodiments and the accompanying drawings.

Claims (6)

Ultrasonic horn 110 in the form of a square cross-section;
a plate portion 140 positioned in the upper direction of the ultrasonic horn 110;
The upper end is inserted into the lower surface of the plate unit 140 and the lower end is a processing pin 150 positioned on the upper surface of the ultrasonic horn 110; and
It is located in the outer direction of the ultrasonic horn 110, the upper end of the support portion 170 in contact with the lower surface of the plate portion 140; includes;
By the upper end of the support portion 170 supporting the plate portion 140 in the upward direction, the upper surfaces of the processing pin 150 and the ultrasonic horn 110 are spaced apart by a predetermined reference distance d0,
The support unit 170 is provided at a first height h1 in the vertical direction from the ground, the ultrasonic horn 110 is provided at a second height h2 in the vertical direction from the ground, and the plate unit 140 is vertically has a first thickness (d1) in the direction, the pin for processing 150 has a second thickness (d2) in the vertical direction,
The reference distance d0 is the difference between the sum of the first height h1 and the first thickness d1 and the sum of the second height h2 and the second thickness d2. of the processing pin 150 adhesive device.
delete The method of claim 1,
The reference distance (d0) is 0.06mm to 0.46mm processing pin 150 of the ultrasonic horn 110, characterized in that the bonding device.
The method of claim 1,
Further comprising an adhesive portion 120 applied to the upper direction of the ultrasonic horn 110 to a thickness greater than or equal to the reference distance d0,
Adhesive apparatus, characterized in that the ultrasonic horn (110) and the processing pin (150) are connected to each other by the bonding part (120).
The method of claim 1,
The ultrasonic horn 110, which is located in the upper direction of the plate part 140, further comprising a holding part 160 made of a magnetic material for fixing the processing pin 150 to the plate part 140 through magnetic force. ) of the processing pin 150 adhesive device.
Insertion step (s110) of inserting the processing pin 150 into the lower surface of the plate portion 140 provided with the through hole 141 (s110);
A fixing step (s120) of positioning the holding part 160 on the upper surface of the plate part 140 to fix the processing pin 150;
an application step (s130) of applying the adhesive part 120 to the upper surface of the ultrasonic horn 110;
a supporting step (s140) of installing a support unit 170 in an outer direction of the ultrasonic horn 110;
Placing the plate part 140 in the upper direction of the support part 170 and disposing the lower end of the processing pin 150 to be spaced apart from the upper surface of the ultrasonic horn 110 by a predetermined reference distance d0 (s150) );
a first removing step (s160) of removing the holding part 160 from the plate part 140; and
A second removal step (s170) of removing the plate portion 140 from the pin 150 for processing (s170);

Images