KR102388979B1 - 터치 센서 장치 - Google Patents

터치 센서 장치 Download PDF

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Publication number
KR102388979B1
KR102388979B1 KR1020167008753A KR20167008753A KR102388979B1 KR 102388979 B1 KR102388979 B1 KR 102388979B1 KR 1020167008753 A KR1020167008753 A KR 1020167008753A KR 20167008753 A KR20167008753 A KR 20167008753A KR 102388979 B1 KR102388979 B1 KR 102388979B1
Authority
KR
South Korea
Prior art keywords
touch sensor
sensor device
layer
contact structure
metal
Prior art date
Application number
KR1020167008753A
Other languages
English (en)
Korean (ko)
Other versions
KR20160067849A (ko
Inventor
하랄트 쾨슈텐바우어
도미니크 로렌츠
브루스 쳉
외르크 빈클러
Original Assignee
플란제 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 플란제 에스이 filed Critical 플란제 에스이
Publication of KR20160067849A publication Critical patent/KR20160067849A/ko
Application granted granted Critical
Publication of KR102388979B1 publication Critical patent/KR102388979B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Position Input By Displaying (AREA)
  • Physical Vapour Deposition (AREA)
KR1020167008753A 2013-10-04 2014-10-01 터치 센서 장치 KR102388979B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM319/2013 2013-10-04
ATGM319/2013U AT13879U1 (de) 2013-10-04 2013-10-04 Berührungssensoranordnung
PCT/AT2014/000178 WO2015048828A1 (de) 2013-10-04 2014-10-01 Berührungssensoranordnung

Publications (2)

Publication Number Publication Date
KR20160067849A KR20160067849A (ko) 2016-06-14
KR102388979B1 true KR102388979B1 (ko) 2022-04-20

Family

ID=51660823

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167008753A KR102388979B1 (ko) 2013-10-04 2014-10-01 터치 센서 장치

Country Status (6)

Country Link
JP (1) JP6747970B2 (zh)
KR (1) KR102388979B1 (zh)
CN (1) CN105593800B (zh)
AT (1) AT13879U1 (zh)
TW (1) TWI623871B (zh)
WO (1) WO2015048828A1 (zh)

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* Cited by examiner, † Cited by third party
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CN107428127B (zh) * 2015-03-27 2019-11-19 株式会社Lg化学 导电结构体、其制造方法以及包括导电结构体的电极
WO2017099476A1 (ko) * 2015-12-07 2017-06-15 주식회사 엘지화학 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극
JP6575601B2 (ja) * 2016-04-01 2019-09-18 凸版印刷株式会社 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法、ブックカバー、印刷体の表紙
TWI581158B (zh) * 2016-06-01 2017-05-01 友達光電股份有限公司 觸控面板及其製作方法
KR102573333B1 (ko) * 2016-06-28 2023-08-31 삼성디스플레이 주식회사 표시 장치
US10151953B2 (en) * 2017-02-22 2018-12-11 A. U. Vista, Inc. In-plane switching display having protrusion electrodes with metal enhanced adhesion
CN108121098B (zh) 2017-12-19 2019-08-06 友达光电股份有限公司 金属结构及其制作方法与应用的显示面板
CN110872687B (zh) * 2018-09-03 2022-07-19 大同特殊钢株式会社 层叠体及靶材
TWI722860B (zh) * 2020-04-08 2021-03-21 新唐科技股份有限公司 氣體感測材料與氣體感測器
CN114510167B (zh) * 2020-11-17 2024-04-12 瀚宇彩晶股份有限公司 触控感测面板
CN112680967B (zh) * 2020-12-15 2022-02-18 武汉纺织大学 具有单向导湿作用的压阻传感织物及其制备方法

Citations (1)

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WO2012134174A2 (ko) * 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 구조체， 터치패널 및 이의 제조방법

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JP4071849B2 (ja) * 1997-10-08 2008-04-02 アルバック成膜株式会社 ブランクス及びブラックマトリクス
US7378146B1 (en) * 1998-08-05 2008-05-27 International Business Machines Corporation Transparent hard coats for optical elements
JP3735814B2 (ja) * 2001-09-28 2006-01-18 Ｈｏｙａ株式会社 液晶表示パネル用対向基板、及び液晶表示パネル
US8243027B2 (en) 2006-06-09 2012-08-14 Apple Inc. Touch screen liquid crystal display
TWI450237B (zh) * 2010-01-14 2014-08-21 Wintek Corp 觸控顯示裝置
AT11941U1 (de) * 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
CN102243553B (zh) * 2010-05-16 2015-06-10 宸鸿科技(厦门)有限公司 电容式触控面板及降低其金属导体可见度的方法
EP2402481A1 (en) * 2010-06-29 2012-01-04 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
US8449817B2 (en) * 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
CN103168285B (zh) * 2010-10-19 2016-05-11 Lg化学株式会社 包括导电图形的触摸面板及其制备方法
KR101367569B1 (ko) * 2010-12-29 2014-02-28 주식회사 엘지화학 터치 스크린 및 이의 제조방법
JP2012173799A (ja) * 2011-02-17 2012-09-10 Sumitomo Chemical Co Ltd 透明導電性基板、それを用いた電子デバイスおよびタッチパネル
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TWM472245U (zh) * 2013-07-31 2014-02-11 Wintek Corp 觸控面板

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WO2012134174A2 (ko) * 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 구조체， 터치패널 및 이의 제조방법

Also Published As

Publication number Publication date
JP6747970B2 (ja) 2020-08-26
CN105593800A (zh) 2016-05-18
AT13879U1 (de) 2014-10-15
JP2016533562A (ja) 2016-10-27
CN105593800B (zh) 2019-11-08
KR20160067849A (ko) 2016-06-14
TWI623871B (zh) 2018-05-11
WO2015048828A1 (de) 2015-04-09
TW201528096A (zh) 2015-07-16

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