KR102378315B1 - 피복 강 부재, 피복 강판 및 그것들의 제조 방법 - Google Patents
피복 강 부재, 피복 강판 및 그것들의 제조 방법 Download PDFInfo
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- KR102378315B1 KR102378315B1 KR1020217007801A KR20217007801A KR102378315B1 KR 102378315 B1 KR102378315 B1 KR 102378315B1 KR 1020217007801 A KR1020217007801 A KR 1020217007801A KR 20217007801 A KR20217007801 A KR 20217007801A KR 102378315 B1 KR102378315 B1 KR 102378315B1
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- coated steel
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- 229910052727 yttrium Inorganic materials 0.000 description 1
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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Abstract
Description
Claims (12)
- 인장 강도가 1500MPa 초과이며,
표면에 Al-Fe계 피복을 구비하고,
상기 Al-Fe계 피복은, Cu, 그리고, Mo, Ni, Mn 및 Cr의 1종 이상을 질량%로 합계 0.12% 이상 함유하고,
Cu, Mo, Ni, Mn 및 Cr의 함유량이, 질량%로,
Cu+0.01×63.5(Mo/95.9+Ni/58.7+Mn/54.9+Cr/52.0)≥0.12%를
만족시키는 것을 특징으로 하는 핫 스탬프 부재. - 제1항에 있어서, 상기 Al-Fe계 피복의 두께가 10 내지 100㎛이고,
상기 Al-Fe계 피복의 화학 조성이, 질량%로,
Al 함유량의 두께 방향의 평균값: 20.0% 이상,
Fe 함유량의 두께 방향의 평균값: 50.0% 이상,
Cu 함유량의 두께 방향의 최솟값: 0.06% 이상,
Cu 함유량의 두께 방향의 최댓값과 최솟값의 비: 1.4 이상을
만족시키는 핫 스탬프 부재. - 제1항 또는 제2항에 있어서, 상기 핫 스탬프 부재의 상기 Al-Fe계 피복을 제외한 부분의 화학 조성이, 질량%로,
C: 0.25 내지 0.60%,
Si: 0.25 내지 2.00%,
Mn: 0.30 내지 3.00%,
P: 0.050% 이하,
S: 0.0100% 이하,
N: 0.010% 이하,
Ti: 0.010 내지 0.100%,
B: 0.0005 내지 0.0100%,
Mo: 0.10 내지 1.00%,
Cu: 0.01 내지 1.00%,
Cr: 0 내지 1.00%,
Ni: 0 내지 1.00%,
V: 0 내지 1.00%,
Ca: 0 내지 0.010%,
Al: 0 내지 1.00%,
Nb: 0 내지 0.10%,
Sn: 0 내지 1.00%,
W: 0 내지 1.00%,
Sb: 0 내지 1.00%,
REM: 0 내지 0.30%
잔부: Fe 및 불순물인
것을 특징으로 하는 핫 스탬프 부재. - 제1항 또는 제2항에 있어서, 상기 Al-Fe계 피복이, 질량%로, Si를 1 내지 20% 함유하는 것을 특징으로 하는 핫 스탬프 부재.
- 강판의 표면에 Cu가 농화한 층을 갖고, 상기 Cu가 농화한 층에 있어서의 Cu 표면 농화도가 1.2 이상이고,
상기 Cu가 농화한 층 상에, 또한, Al계 피복을 갖고,
강판의 평균 결정 입경이 30㎛ 이하인
것을 특징으로 하는 핫 스탬프용 피복 강판.
여기서, Cu 표면 농화도는, (강판의 표면으로부터 깊이 0 내지 30㎛의 범위에 있어서의 Cu의 최대 함유량)/(강판의 표면으로부터 깊이 200㎛에 있어서의 Cu의 평균 함유량)의 비를 나타내고, 강판의 표면이란, 피복 강판의 표면으로부터 판 두께 방향으로 GDS를 행하여, Fe 함유량이 90%가 되는 깊이의 위치를 말한다. - 강판과,
상기 강판의 표면 상에 위치하는 중간층과,
상기 중간층의 표면 상에 위치하는 Al계 피복으로
이루어지고,
상기 중간층에 Cu를 함유하고,
상기 중간층이, Cu, 그리고, Mo, Ni, Mn 및 Cr의 1종 이상을, 질량%로 합계 30% 이상 함유하는
것을 특징으로 하는 핫 스탬프용 피복 강판. - 제5항 또는 제6항에 있어서, 상기 강판의 화학 조성이, 질량%로,
C: 0.25 내지 0.60%,
Si: 0.25 내지 2.00%,
Mn: 0.30 내지 3.00%,
P: 0.050% 이하,
S: 0.0100% 이하,
N: 0.010% 이하,
Ti: 0.010 내지 0.100%,
B: 0.0005 내지 0.0100%,
Mo: 0.10 내지 1.00%,
Cu: 0.01 내지 1.00%,
Cr: 0 내지 1.00%,
Ni: 0 내지 1.00%,
V: 0 내지 1.00%,
Ca: 0 내지 0.010%,
Al: 0 내지 1.00%,
Nb: 0 내지 0.10%,
Sn: 0 내지 1.00%,
W: 0 내지 1.00%,
Sb: 0 내지 1.00%,
REM: 0 내지 0.30%
잔부: Fe 및 불순물인
것을 특징으로 하는 핫 스탬프용 피복 강판. - 제5항에 기재된 핫 스탬프용 피복 강판을 제조하는 방법이며,
1100 내지 1350℃에서 슬래브를 가열하는 공정,
조압연 종료로부터 마무리 압연 개시까지의 시간 t1(hr), 조압연 종료로부터 마무리 압연 개시까지의 조 바의 평균 온도 T1(℃)로 했을 때, (T1+273)×(logt1+20)≥20000, 마무리 압연 종료 온도가 Ar3점 내지 1000℃가 되는 조건에서, 가열된 상기 슬래브를 열간 압연하여 열연 강판으로 하는 공정,
상기 열연 강판을 평균 냉각 속도 10℃/s로 냉각하는 공정, 및
냉각 후의 강판을 700℃ 이하에서 권취하는 공정,
권취 후의 강판에 산세를 실시하는 공정,
산세 후의 강판을 냉간 압연하여 냉연 강판으로 하는 공정,
냉연 강판에 Al계 피복을 실시하는 공정을
구비하고,
상기 산세는, 염산 또는 황산을 사용하고, 산세 온도가 80 내지 90℃이고, 산 농도 α(%), 산세 시간 t(s)가,
6≤α<14,
0<t≤420-30×α를
만족시키는
것을 특징으로 하는 핫 스탬프용 피복 강판의 제조 방법. - 제1항 또는 제2항에 기재된 핫 스탬프 부재의 제조 방법이며,
(A) 강판의 표면에 Cu가 농화한 층을 갖고, 상기 Cu가 농화한 층에 있어서의 Cu 표면 농화도가 1.2 이상이고, 상기 Cu가 농화한 층 상에, 또한, Al계 피복을 갖고, 강판의 평균 결정 입경이 30㎛ 이하인 핫 스탬프용 피복 강판,
(B) 강판과, 상기 강판의 표면 상에 위치하는 중간층과, 상기 중간층의 표면 상에 위치하는 Al계 피복으로 이루어지고, 상기 중간층에 Cu를 함유하고, 상기 중간층이 Cu, 그리고, Mo, Ni, Mn 및 Cr의 1종 이상을, 질량%로 합계 30% 이상 함유하는 핫 스탬프용 피복 강판,
(C) 강판과, 상기 강판의 표면 상에 위치하는 Al계 피복으로 이루어지고, 상기 Al계 피복에 Cu를 함유하고, 상기 Al계 피복이 Cu, 그리고, Mo, Ni, Mn 및 Cr의 1종 이상을, 질량%로 합계 1.0% 이상 함유하는 핫 스탬프용 피복 강판,
및
(D) 상기 강판의 화학 조성이, 질량%로, C: 0.25 내지 0.60%, Si: 0.25 내지 2.00%, Mn: 0.30 내지 3.00%, P: 0.050% 이하, S: 0.0100% 이하, N: 0.010% 이하, Ti: 0.010 내지 0.100%, B: 0.0005 내지 0.0100%, Mo: 0.10 내지 1.00%, Cu: 0.01 내지 1.00%, Cr: 0 내지 1.00%, Ni: 0 내지 1.00%, V: 0 내지 1.00%, Ca: 0 내지 0.010%, Al: 0 내지 1.00%, Nb: 0 내지 0.10%, Sn: 0 내지 1.00%, W: 0 내지 1.00%, Sb: 0 내지 1.00%, REM: 0 내지 0.30%, 잔부: Fe 및 불순물인 (A), (B) 및 (C) 중 어느 하나의 핫 스탬프용 피복 강판으로부터
선택되는 핫 스탬프용 피복 강판을,
도달 온도를 T2(℃), 핫 스탬프 용 피복 강판의 온도가 T2(℃)보다 10℃ 낮은 온도에 도달하고 나서 냉각 개시까지의 시간을 t2(hr)로 했을 때, (T2+273-10)×(logt2+20)≥19000, Ac3점≤T2≤(Ac3점+300)℃, 평균 승온 속도 5 내지 1000℃/s가 되는 조건에서 가열하는 공정, 및
가열된 핫 스탬프용 피복 강판을 Ms점까지, 평균 냉각 속도를 상부 임계 냉각 속도 이상으로 하여 냉각하고, 계속하여 Ms점으로부터 100℃ 이하까지 평균 냉각 속도 5℃/s 이상으로 냉각하는 공정을
구비하는 것을 특징으로 하는 핫 스탬프 부재의 제조 방법.
여기서, Cu 표면 농화도는, (강판의 표면으로부터 깊이 0 내지 30㎛의 범위에 있어서의 Cu의 최대 함유량)/(강판의 표면으로부터 깊이 200㎛에 있어서의 Cu의 평균 함유량)의 비를 나타내고, 강판의 표면이란, 피복 강판의 표면으로부터 판 두께 방향으로 GDS를 행하여, Fe 함유량이 90%가 되는 깊이의 위치를 말한다. - 제9항에 있어서, 상기 Ms점까지의 냉각과 동시에, 상기 핫 스탬프용 피복 강판에 열간 성형을 실시하는 것을 특징으로 하는 핫 스탬프 부재의 제조 방법.
- 삭제
- 삭제
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