KR102362823B1 - Post treatment composition for chip seal and maintenance method using the same - Google Patents
Post treatment composition for chip seal and maintenance method using the same Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/4857—Other macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B41/4876—Polystyrene
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/488—Other macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C04B41/4884—Polyurethanes; Polyisocyanates
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D109/00—Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09D109/06—Copolymers with styrene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D111/00—Coating compositions based on homopolymers or copolymers of chloroprene
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C19/00—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving
- E01C19/12—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving for distributing granular or liquid materials
- E01C19/21—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving for distributing granular or liquid materials for simultaneously but separately applying liquid material and granular or pulverulent material, e.g. bitumen and grit, with or without spreading ; for filling grooves and gritting the filling
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C23/00—Auxiliary devices or arrangements for constructing, repairing, reconditioning, or taking-up road or like surfaces
- E01C23/06—Devices or arrangements for working the finished surface; Devices for repairing or reconditioning the surface of damaged paving; Recycling in place or on the road
- E01C23/12—Devices or arrangements for working the finished surface; Devices for repairing or reconditioning the surface of damaged paving; Recycling in place or on the road for taking-up, tearing-up, or full-depth breaking-up paving, e.g. sett extractor
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C7/00—Coherent pavings made in situ
- E01C7/08—Coherent pavings made in situ made of road-metal and binders
- E01C7/18—Coherent pavings made in situ made of road-metal and binders of road-metal and bituminous binders
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Abstract
Description
본 발명은 건설 기술분야에 관한 것으로서, 상세하게는 칩씰용 음이온계 후처리 조성물 및 그 제조방법에 관한 것이다.The present invention relates to the field of construction technology, and more particularly, to an anionic post-treatment composition for a chip seal and a method for manufacturing the same.
칩씰(Chip Seal) 공법이란, 기존 아스팔트 도로포장의 표면에 유화 아스팔트를 도포하고, 그 위에 골재를 살포하여 보강하는 도로포장의 유지보수공법을 말한다.The chip seal method refers to a road pavement maintenance method in which emulsified asphalt is applied to the surface of the existing asphalt pavement, and aggregate is sprayed on it to reinforce it.
이는 노후 도로포장을 전면 재포장하는 방법에 비해 경제적이라는 점, 교통개방이 빠른 시간 내에 가능하다는 점 등의 장점이 있다. This has advantages in that it is economical compared to the method of completely repaving the old pavement and that it is possible to open traffic in a short time.
기본적인 칩씰 공법은 유화 아스팔트의 도포 및 골재의 살포를 1회씩 실시하는데, 내구성과 강도를 더욱 증대시키기 위하여, 다음과 같이 다양한 칩씰 공법이 개발되어 있다.The basic chip sealing method is to apply the emulsified asphalt and spray the aggregate once. In order to further increase durability and strength, various chip sealing methods have been developed as follows.
더블칩씰(Dobule Chip Seal)은 유화 아스팔트의 도포 및 골재의 살포를 2회씩 실시하는 공법이다.Double Chip Seal is a method of applying emulsified asphalt and spraying aggregates twice.
락인씰(Racked in Seal)은 1차로 소입경의 골재(Small aggregate)를 살포하고, 2차로 대입경의 골재(Large aggregate)를 살포하는 공법이다.Locked in Seal is a construction method that firstly sprays small aggregate and secondly sprays large aggregate.
케이프 씰(Cape Seal)은 기본적인 칩씰 공법의 시공 이후, 슬러리실(Slurry Seal)을 실시하는 공법이다.Cape Seal is a method of implementing a slurry seal after the basic chip sealing method is installed.
슬러리실(Slurry Seal)이란, 7mm 이하 골재와 유화 아스팔트를 혼합한 슬러리를 아스팔트 도로포장의 표면에 도포하는 표면처리 공법을 말한다.Slurry Seal refers to a surface treatment method in which a slurry of 7 mm or less aggregate and emulsified asphalt is applied to the surface of the asphalt road pavement.
이와 같이 개선된 칩씰 공법은 보강된 도로포장의 내구성과 강도를 어느 정도 증대시키지만, 시공비용이 증가한다는 단점이 있다.The improved chip seal method increases the durability and strength of the reinforced road pavement to some extent, but has a disadvantage in that the construction cost increases.
칩씰 공법에 의해 보강된 도로포장의 내구성 및 강도의 평가에서 가장 중요한 것은 골재의 손실률(탈리 정도)이라 할 수 있다.The most important factor in evaluating the durability and strength of road pavement reinforced by the chip seal method is the loss rate (desorption degree) of aggregates.
그런데, 종래의 칩씰 공법은 위와 같이 다양한 공법이 개발되었음에 불구하고, 여전히 골재의 손실률이 크다는 문제가 제기되어 왔다.However, in the conventional chip seal method, although various methods have been developed as described above, there has been a problem that the loss rate of aggregate is still large.
나아가, 더블칩씰, 락인씰, 케이프 씰과 같이 종래의 개선된 칩씰 공법은 시공비용이 증가함에 불구하고, 여전히 골재의 손실률이 크게 개선되지 않는다는 문제가 있다.Furthermore, the conventional improved chip seal method, such as a double chip seal, a lock-in seal, and a cape seal, has a problem in that, despite an increase in construction cost, the loss rate of aggregate is still not significantly improved.
특히, 시공 완료 후, 유화 아스팔트 양생이 완전히 이루어지지 않은 초기 상태의 경우, 골재 탈리가 가장 많이 발생한다는 점, 기존 도로포장 및 골재에 대한 유화 아스팔트의 흡수량이 적어 보강효과가 작다는 점 등의 문제가 있다.In particular, in the case of the initial state in which curing of the emulsified asphalt is not completely completed after construction, the most common problems such as desorption of aggregate occur and the fact that the reinforcing effect is small due to the small amount of absorption of the emulsified asphalt for the existing road pavement and aggregate there is
본 발명은 상기와 같은 문제점을 해결하기 위하여 도출된 것으로서, 초기 골재의 탈리를 방지할 수 있고, 기존 도로포장 및 골재에 대한 흡수량을 증대시켜 도로 공용성을 향상시킬 수 있도록 하는 칩씰용 음이온계 후처리 조성물 및 이를 이용한 도로포장의 유지보수공법을 제시하는 것을 그 목적으로 한다.The present invention was derived to solve the above problems, and anionic post-treatment for chip seals that can prevent initial aggregate desorption and improve road utility by increasing absorption for existing road pavements and aggregates Its purpose is to present a composition and a method for maintenance and repair of road pavement using the same.
상기 과제의 해결을 위하여, 본 발명은 메타크릴산에테르, 아크릴산에테르, 아크릴우레탄수지, SBR(stylen butatien rubber), 폴리클로로프렌(polychloroprene) 중 하나 또는 2 이상의 혼합에 의해 형성된 음이온계 후처리제 40~60 중량%; 물 40~60 중량%;를 포함하는 것을 특징으로 하는 칩씰용 음이온계 후처리 조성물을 제시한다.In order to solve the above problems, the present invention provides an anionic post-treatment agent 40 to 60 formed by mixing one or two or more of methacrylic acid ether, acrylic acid ether, acrylic urethane resin, SBR (stylen butatien rubber), and polychloroprene weight%; 40 to 60% by weight of water; presents an anionic post-treatment composition for chipseal, characterized in that it comprises.
상기 음이온계 후처리제는, 분자량이 80,000~150,000g/mol인 고분자량 음이온계 후처리제를 포함하는 것이 바람직하다.The anionic post-treatment agent preferably includes a high molecular weight anionic post-treatment agent having a molecular weight of 80,000 to 150,000 g/mol.
상기 음이온계 후처리제는, 분자량이 10,000~30,000g/mol인 저분자량 음이온계 후처리제를 더 포함하는 것이 바람직하다.The anionic post-treatment agent preferably further includes a low molecular weight anionic post-treatment agent having a molecular weight of 10,000 to 30,000 g/mol.
상기 음이온계 후처리제는, 상기 고분자량 음이온계 후처리제 85~95 중량%; 상기 저분자량 음이온계 후처리제 5~15 중량%;를 포함하는 것이 바람직하다.The anionic post-treatment agent, 85 to 95 wt% of the high molecular weight anionic post-treatment agent; It is preferable to include; 5 to 15% by weight of the low molecular weight anionic post-treatment agent.
본 발명은 상기 음이온계 후처리 조성물의 제조방법으로서, 상기 고분자량 음이온계 후처리제와 물을 교반하여 1차 조성물을 제조하는 단계; 상기 1차 조성물과 저분자량 음이온계 후처리제를 교반하여 상기 음이온계 후처리 조성물을 제조하는 단계;를 포함하는 것을 특징으로 하는 음이온계 후처리 조성물의 제조방법을 제시한다.The present invention provides a method for preparing the anionic post-treatment composition, comprising the steps of: preparing a first composition by stirring the high molecular weight anionic post-treatment agent and water; Preparing the anionic post-treatment composition by stirring the first composition and the low molecular weight anionic post-treatment agent; provides a method for producing an anionic post-treatment composition comprising a.
본 발명은 상기 음이온계 후처리 조성물을 이용한 도로포장의 유지보수공법으로서, 기존 도로포장의 표면을 청소하는 단계; 상기 청소된 기존 도로포장의 표면에 양이온계 유화 아스팔트 조성물을 도포함과 아울러, 골재를 살포하는 단계; 상기 골재가 살포된 기존 도로포장의 표면에 상기 음이온계 후처리 조성물을 1회 또는 복수회 도포하는 단계;를 포함하는 것을 특징으로 하는 도로포장의 유지보수공법을 제시한다.The present invention provides a road pavement maintenance method using the anionic post-treatment composition, comprising: cleaning the surface of the existing road pavement; Applying a cationic emulsified asphalt composition to the surface of the cleaned existing road pavement, as well as spraying aggregate; We present a road pavement maintenance and repair method comprising the step of applying the anionic post-treatment composition once or plural times to the surface of the existing road pavement on which the aggregate is sprayed.
본 발명은 상기 음이온계 후처리 조성물을 이용한 도로포장공법으로서, 노면을 고르게 다짐하고 청소하는 단계; 상기 청소된 노면에 양이온계 유화 아스팔트 조성물을 도포함과 아울러, 골재를 살포하는 단계; 상기 골재가 살포된 노면에 상기 음이온계 후처리 조성물을 1회 또는 복수회 도포하는 단계;를 포함하는 것을 특징으로 하는 도로포장공법을 제시한다.The present invention provides a road paving method using the anionic post-treatment composition, comprising: evenly compacting and cleaning the road surface; While applying the cationic emulsified asphalt composition to the cleaned road surface, spraying aggregate; Applying the anionic post-treatment composition once or a plurality of times to the road surface on which the aggregate has been sprayed; provides a road paving method comprising a.
본 발명은 초기 골재의 탈리를 방지할 수 있고, 기존 도로포장 및 골재에 대한 흡수량을 증대시켜 도로 공용성을 향상시킬 수 있도록 하는 칩씰용 음이온계 후처리 조성물 및 이를 이용한 도로포장의 유지보수공법을 제시한다.The present invention provides an anionic post-treatment composition for chip seals that can prevent the desorption of initial aggregate and improve road utility by increasing the absorption of existing road pavement and aggregate, and a road pavement maintenance method using the same do.
도 1 이하는 본 발명의 실시예를 도시한 것으로서,
도 1,2는 도로포장의 유지보수공법의 공정도.1 shows an embodiment of the present invention,
1 and 2 are process diagrams of a road pavement maintenance method.
이하, 첨부도면을 참조하여 본 발명의 실시예에 관하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1,2에 도시된 바와 같이, 본 발명에 의한 도로포장의 유지보수공법은 기본적으로, 다음 공정에 의해 이루어진다.As shown in Figures 1 and 2, the maintenance method of the road pavement according to the present invention is basically made by the following process.
기존 도로포장(1)의 표면을 청소한다.Clean the surface of the existing road pavement (1).
청소된 기존 도로포장(1)의 표면에 양이온계 유화 아스팔트 조성물(10)을 도포함과 아울러, 골재(20)를 살포한다.While applying the cationic emulsified
골재(20)가 살포된 기존 도로포장(1)의 표면에 음이온계 후처리 조성물(30)을 1회 또는 복수회 도포한다.The
본 발명에 의한 음이온계 후처리 조성물을 이용한 도로포장공법은 기본적으로, 다음 공정에 의해 이루어진다.The road paving method using the anionic post-treatment composition according to the present invention is basically made by the following process.
노면(2)을 고르게 다짐하고 청소한다.Evenly compact the road surface (2) and clean it.
청소된 노면(2)에 양이온계 유화 아스팔트 조성물(10)을 도포함과 아울러, 골재(20)를 살포한다.While the cationic emulsified
골재(20)가 살포된 노면(2)에 음이온계 후처리 조성물(30)을 1회 또는 복수회 도포한다.The
이는 다음과 같은 효과가 있다.This has the following effects.
첫째, 초기 골재의 탈리를 방지하여 도로포장의 내구성 및 강도를 증대시킨다.First, it increases the durability and strength of the road pavement by preventing the desorption of the initial aggregate.
양이온계 유화 아스팔트(CRS-1, CRS-2 등)와 음이온계 후처리 조성물이 만나면 브레이킹에 의해 강한 부착력을 발휘하므로, 시공 완료 후, 유화 아스팔트 양생이 완전히 이루어지지 않은 초기 상태라 하더라도, 골재의 탈리를 방지할 수 있다.When cationic emulsified asphalt (CRS-1, CRS-2, etc.) and anionic post-treatment composition meet, strong adhesion is exerted by breaking. Detachment can be prevented.
둘째, 기존 도로포장 및 골재에 대한 유화 아스팔트의 흡수량을 증대시켜 도로 공용성을 향상시킨다.Second, it improves road utility by increasing the absorption of emulsified asphalt for existing road pavements and aggregates.
양이온계 유화 아스팔트의 표면이 음이온계 후처리 조성물에 의해 코팅되어 보호되므로, 기존 도로포장 및 골재에 대한 유화 아스팔트의 흡수량이 증대되고, 이는 도로포장의 내구성 및 강도 증진, 도로 공용성의 향상 등의 효과를 얻도록 한다.Since the surface of the cationic emulsified asphalt is coated and protected by the anionic post-treatment composition, the absorption of the emulsified asphalt to the existing road pavement and aggregate is increased, which has the effect of improving the durability and strength of the road pavement, and improving road utility. to get
셋째, 경제성이 우수하다.Third, the economic feasibility is excellent.
더블칩씰, 락인씰, 케이프 씰과 같이 종래의 개선된 칩씰 공법에 비해, 공정이 간단하므로 시공비용이 저렴하면서도, 골재의 손실률을 크게 개선할 수 있다.Compared to conventional improved chip seal methods such as double chip seal, lock-in seal, and cape seal, the process is simple, so the construction cost is low, and the loss rate of aggregate can be greatly improved.
위 칩씰용 음이온계 후처리 조성물은, 메타크릴산에테르, 아크릴산에테르, 아크릴우레탄수지, SBR(stylen butatien rubber), 폴리클로로프렌 (polychloroprene) 중 하나 또는 2 이상의 혼합에 의해 형성된 음이온계 후처리제 40~60 중량%; 물 40~60 중량%;를 포함하여 구성된다.The anionic post-treatment composition for chip seal above is an anionic post-treatment agent formed by mixing one or two or more of methacrylic acid ether, acrylic acid ether, acrylic urethane resin, SBR (stylen butatien rubber), and polychloroprene 40 to 60 weight%; 40 to 60% by weight of water;
이는 양이온계 유화 아스팔트과 만나 브레이킹(경화)을 일으켜 표면을 양생시키고, 초기 골재 탈리를 방지하며, 골재 및 양이온계 유화 아스팔트와 결합해 내구성을 증가시키고, 내유성, 내수성 등의 성질을 가지므로 도로포장의 내구성을 개선한다.It meets with cationic emulsified asphalt and causes breaking (hardening) to cure the surface, prevent initial aggregate desorption, increase durability by combining with aggregate and cationic emulsified asphalt, and have properties such as oil resistance and water resistance improve durability;
음이온계 후처리제는 구체적으로, 분자량이 80,000~150,000g/mol인 고분자량 음이온계 후처리제를 사용하는 것이 도로포장의 내구성 개선 측면에서 바람직하다.Specifically, the anionic post-treatment agent is preferably a high molecular weight anionic post-treatment agent having a molecular weight of 80,000 to 150,000 g/mol in terms of improving the durability of the road pavement.
이에 추가로, 분자량이 10,000~30,000g/mol인 저분자량 음이온계 후처리제를 더 혼합하는 경우, 후술하는 바와 같이 더욱 안정적인 내구성 개선효과를 얻을 수 있다.In addition to this, when a low molecular weight anionic post-treatment agent having a molecular weight of 10,000 to 30,000 g/mol is further mixed, a more stable durability improvement effect can be obtained as will be described later.
다만, 저분자량 음이온계 후처리제의 혼입량이 10%를 초과하는 경우, 오히려 내구성 저하를 일으킬 수 있다.However, when the mixing amount of the low molecular weight anionic post-treatment agent exceeds 10%, durability may be reduced on the contrary.
따라서 음이온계 후처리제는, 고분자량 음이온계 후처리제 85~95 중량%; 저분자량 음이온계 후처리제 5~15 중량%;에 의해 구성되는 것이 바람직하다.Therefore, the anionic post-treatment agent, 85 to 95% by weight of the high molecular weight anionic post-treatment agent; It is preferable to be constituted by 5 to 15% by weight of a low molecular weight anionic post-treatment agent.
이러한 음이온계 후처리제는 1회 도포하는 것만으로도 상술한 효과를 얻을 수 있으나, 복수회 도포하는 경우, 더욱 우수한 내구성 개선효과를 얻을 수 있다.Such an anionic post-treatment agent can obtain the above-described effect only by one application, but when applied multiple times, a more excellent durability improvement effect can be obtained.
음이온계 후처리제의 도포량은 0.3 ~ 0.5ℓ/m2 가 적절하다.The application amount of the anionic post-treatment agent is preferably 0.3 to 0.5 L/m 2 .
위 음이온계 후처리 조성물은 다음 공정에 의해 제조되는 것이 바람직하다.The above anionic post-treatment composition is preferably prepared by the following process.
먼저, 고분자량 음이온계 후처리제와 물을 액상교반기에 의해 약 100 rpm으로 10분간 교반하여 1차 조성물을 제조한다.First, a primary composition is prepared by stirring a high molecular weight anionic post-treatment agent and water at about 100 rpm for 10 minutes using a liquid stirrer.
1차 조성물과 저분자량 음이온계 후처리제를 액상교반기에 의해 약 100 rpm으로 10분간 더 교반하여 음이온계 후처리 조성물을 제조한다.The primary composition and the low molecular weight anionic post-treatment agent are further stirred at about 100 rpm for 10 minutes by a liquid stirrer to prepare an anionic post-treatment composition.
이하, 본 발명에 의한 음이온계 후처리 조성물의 물성 및 공법의 효과를 입증하기 위한 시험결과에 관하여 설명한다.Hereinafter, test results for demonstrating the effects of the physical properties and method of the anionic post-treatment composition according to the present invention will be described.
비교예 1은 아스팔트 도로포장의 공시체의 표면에 양이온계 유화 아스팔트(CRS-2)를 도포하고, 그 위에 골재를 살포한 시험체이다.Comparative Example 1 is a test body in which cationic emulsified asphalt (CRS-2) is applied to the surface of an asphalt road pavement specimen, and aggregate is sprayed thereon.
본 발명의 실시예 1,2,3 및 비교예 2,3,4는 위 비교예 1의 시험체의 표면에 추가로 음이온계 후처리 조성물을 도포한 것으로서, 그 음이온계 후처리 조성물은 아크릴우레탄수지와 물을 45 : 55의 중량비로 혼합하여 제조한 것이다.In Examples 1, 2, 3 and Comparative Examples 2, 3, 4 of the present invention, an anionic post-treatment composition was additionally applied to the surface of the test body of Comparative Example 1, and the anionic post-treatment composition was an acrylic urethane resin It was prepared by mixing and water in a weight ratio of 45:55.
구체적으로, 본 발명의 실시예 1의 음이온계 후처리 조성물은 고분자량 음이온계 후처리제(100,000g/mol)만으로 제조한 것이고, 실시예 2의 음이온계 후처리 조성물은 고분자량 음이온계 후처리제(100,000g/mol) 90 중량%와 저분자량 음이온계 후처리제(20,000g/mol) 10 중량%의 혼합에 의해 제조한 것이다.Specifically, the anionic post-treatment composition of Example 1 of the present invention was prepared only with a high molecular weight anionic post-treatment agent (100,000 g/mol), and the anionic post-treatment composition of Example 2 contains a high molecular weight anionic post-treatment agent ( It is prepared by mixing 90 wt% of 100,000 g/mol) and 10 wt% of a low molecular weight anionic post-treatment agent (20,000 g/mol).
또한, 본 발명의 실시예 1,2는 위 배합비에 의한 음이온계 후처리 조성물을 비교예 1의 시험체의 표면에 1회 도포한 것이고, 실시예 3은 2회 도포한 것이다.In addition, in Examples 1 and 2 of the present invention, the anionic post-treatment composition according to the above compounding ratio was applied once to the surface of the test body of Comparative Example 1, and in Example 3 was applied twice.
비교예 2는 음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 15 중량%를 초과하는 경우(과도하게 많은 경우)에 관한 것으로서, 고분자량 음이온계 후처리제(100,000g/mol) 80 중량%와 저분자량 음이온계 후처리제(20,000g/mol) 20 중량%의 혼합에 의해 제조한 것이다.Comparative Example 2 relates to a case in which the mixing ratio of the low molecular weight anionic post-treatment agent in the anionic post-treatment composition exceeds 15% by weight (excessively large amount), and a high molecular weight anionic post-treatment agent (100,000 g/mol) 80 It is prepared by mixing 20% by weight and 20% by weight of a low molecular weight anionic post-treatment agent (20,000 g/mol).
비교예 3은 저분자량 음이온계 후처리제로서 과도하게 분자량이 큰 것을 사용한 경우에 관한 것으로서, 고분자량 음이온계 후처리제(100,000g/mol) 90 중량%와 저분자량 음이온계 후처리제(50,000g/mol) 10 중량%의 혼합에 의해 제조한 것이다.Comparative Example 3 relates to a case where an excessively large molecular weight was used as a low molecular weight anionic post-treatment agent, and 90 wt% of a high molecular weight anionic post-treatment agent (100,000 g/mol) and a low molecular weight anionic post-treatment agent (50,000 g/mol) were used. ) by mixing 10% by weight.
비교예 4는 한 종류의 분자량(92,000g/mol)을 갖는 음이온계 후처리제에 의해 음이온계 후처리 조성물을 제조한 경우에 관한 것이다.Comparative Example 4 relates to a case in which an anionic post-treatment composition was prepared by an anionic post-treatment agent having one type of molecular weight (92,000 g/mol).
위 분자량은 실시예 2(고분자량 음이온계 후처리제(100,000g/mol) 90 중량%와 저분자량 음이온계 후처리제(20,000g/mol) 10 중량%의 혼합사용)의 평균 분자량((10,000*0.9) + (20,000*0.1) = 92,000g/mol)과 동일한 것이다.The above molecular weight is the average molecular weight ((10,000*0.9) of Example 2 (a mixture of 90 wt% of a high molecular weight anionic post-treatment agent (100,000 g/mol) and 10 wt% of a low-molecular-weight anionic post-treatment agent (20,000 g/mol)) ) + (20,000*0.1) = 92,000 g/mol).
즉, 실시예 2와 비교예 4는 동일한 평균 분자량을 갖는 음이온계 후처리제를 사용한 경우로서, 실시예 2는 고분자량 음이온계 후처리제와 저분자량 음이온계 후처리제를 혼합사용한 경우이고, 비교예 4는 한 종류의 분자량을 갖는 음이온계 후처리제를 사용한 경우에 관한 것이다.That is, in Example 2 and Comparative Example 4, an anionic post-treatment agent having the same average molecular weight was used, and in Example 2, a high molecular weight anionic post-treatment agent and a low molecular weight anionic post-treatment agent were mixed and used, and Comparative Example 4 relates to the case of using an anionic post-treatment agent having one type of molecular weight.
표 1 내지 3은 Vialit plate shock 시험(En 12272-3)의 결과인 골재 손실률을 나타낸 것이다.Tables 1 to 3 show the aggregate loss rate as a result of the Vialit plate shock test (En 12272-3).
표 1은 본 발명의 실시예 1과 비교예 1의 골재 손실률을 나타낸 것이다.Table 1 shows the aggregate loss rate of Example 1 and Comparative Example 1 of the present invention.
비교예 1(음이온계 후처리 조성물이 도포되지 않은 경우)에 비해, 본 발명의 실시예 1(음이온계 후처리 조성물이 도포된 경우)의 골재 손실률이 대폭 낮은 것으로 나타났다.Compared to Comparative Example 1 (when the anionic post-treatment composition was not applied), it was found that the aggregate loss rate of Example 1 (when the anionic post-treatment composition was applied) of the present invention was significantly lower.
표 2는 본 발명의 실시예 2와 비교예 2의 골재 손실률을 나타낸 것이다.Table 2 shows the aggregate loss rate of Example 2 and Comparative Example 2 of the present invention.
비교예 2(음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 15 중량%를 초과하는 경우)에 비해, 본 발명의 실시예 2(음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 15 중량% 이하인 경우)의 골재 손실률이 낮은 것으로 나타났다.Compared to Comparative Example 2 (when the mixing ratio of the low molecular weight anionic post-treatment agent in the anionic post-treatment composition exceeds 15% by weight), Example 2 of the present invention (low molecular weight anionic post-treatment agent in the anionic post-treatment composition) of 15 wt% or less) showed a low aggregate loss rate.
표 3은 본 발명의 실시예 3의 골재 손실률을 나타낸 것이다.Table 3 shows the aggregate loss rate of Example 3 of the present invention.
표 1,2에 나타난 본 발명의 실시예 1,2(음이온계 후처리 조성물을 1회 도포한 경우)에 비해, 본 발명의 실시예 3(음이온계 후처리 조성물을 2회 도포한 경우)의 골재 손실률이 낮은 것으로 나타났다.Compared to Examples 1 and 2 (when an anionic post-treatment composition is applied once) of the present invention shown in Tables 1 and 2, Example 3 (when an anionic post-treatment composition is applied twice) of the present invention The aggregate loss rate was found to be low.
위 시험 결과를 통해 음이온계 후처리 조성물을 사용하는 경우가 사용하지 않은 경우에 비해 낮은 골재 손실률을 나타냄을 확인할 수 있었다. From the above test results, it was confirmed that the case of using the anionic post-treatment composition exhibited a lower aggregate loss rate compared to the case of not using the anionic post-treatment composition.
또한, 고분자량 음이온계 후처리제만을 사용하는 경우에 비해, 추가로 저분자량 음이온계 후처리제를 혼합하여 사용하는 경우, 접착력과 결합강도가 최적화되어 골재 손실률이 개선되는 것을 확인할 수 있다. In addition, compared to the case of using only the high molecular weight anionic post-treatment agent, it can be confirmed that the aggregate loss rate is improved by optimizing the adhesion and bonding strength when a low molecular weight anionic post-treatment agent is additionally mixed.
다만, 저분자량 음이온계 후처리제의 혼입량이 너무 많은 경우, 오히려 강도가 약해져 골재 손실률이 커짐을 알 수 있었다.However, it was found that when the mixing amount of the low molecular weight anionic post-treatment agent is too large, the strength is rather weakened and the aggregate loss rate is increased.
음이온계 후처리 조성물을 2회 도포한 경우, 골재 손실률이 낮아졌고, 골재 크기에 따른 손실률 차이가 크지 않았다.When the anionic post-treatment composition was applied twice, the aggregate loss rate was lowered, and the difference in the loss rate according to the size of the aggregate was not large.
표 4,5는 본 발명의 실시예와 비교예의 Sweep test 결과에 관한 것이다.Tables 4,5 relate to the sweep test results of Examples and Comparative Examples of the present invention.
Sweep test는 칩씰 처리된 포장 표면의 상부에 브러쉬를 회전시켜 골재손실률을 평가하는 시험이다.The sweep test is a test to evaluate the aggregate loss rate by rotating a brush on the top of the chip-sealed pavement surface.
표 4는 본 발명의 실시예 1과 비교예 1의 Sweep test 결과에 관한 것이다.Table 4 relates to the sweep test results of Example 1 and Comparative Example 1 of the present invention.
비교예 1(음이온계 후처리 조성물이 도포되지 않은 경우)에 비해, 본 발명의 실시예 1(음이온계 후처리 조성물이 도포된 경우)의 골재 손실률이 대폭 낮은 것으로 나타났다.Compared to Comparative Example 1 (when the anionic post-treatment composition was not applied), it was found that the aggregate loss rate of Example 1 (when the anionic post-treatment composition was applied) of the present invention was significantly lower.
즉, Vialit plate shock 시험(En 12272-3)의 결과와, Sweep test의 결과가 동일한 결론(음이온계 후처리 조성물의 내구성 개선효과)을 도출하도록 한다.That is, the result of the Vialit plate shock test (En 12272-3) and the result of the sweep test are to draw the same conclusion (the effect of improving the durability of the anionic post-treatment composition).
표 5는 본 발명의 실시예 2와 비교예 2,3,4의 Sweep test 결과에 관한 것이다.Table 5 relates to the sweep test results of Example 2 and Comparative Examples 2, 3, and 4 of the present invention.
상술한 바와 같이, 본 발명의 실시예 2의 음이온계 후처리 조성물은 고분자량 음이온계 후처리제(100,000g/mol) 90 중량%와 저분자량 음이온계 후처리제(20,000g/mol) 10 중량%의 혼합에 의해 제조한 것이다.As described above, the anionic post-treatment composition of Example 2 of the present invention contains 90 wt% of a high molecular weight anionic post-treatment agent (100,000 g/mol) and 10 wt% of a low molecular weight anionic post-treatment agent (20,000 g/mol) It is prepared by mixing.
비교예 2는 음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 15 중량%를 초과하는 경우(과도하게 많은 경우)에 관한 것으로서, 고분자량 음이온계 후처리제(100,000g/mol) 80 중량%와 저분자량 음이온계 후처리제(20,000g/mol) 20 중량%의 혼합에 의해 제조한 것이다.Comparative Example 2 relates to a case in which the mixing ratio of the low molecular weight anionic post-treatment agent in the anionic post-treatment composition exceeds 15% by weight (excessively large amount), and a high molecular weight anionic post-treatment agent (100,000 g/mol) 80 It is prepared by mixing 20% by weight and 20% by weight of a low molecular weight anionic post-treatment agent (20,000 g/mol).
비교예 3은 저분자량 음이온계 후처리제로서 과도하게 분자량이 큰 것을 사용한 경우에 관한 것으로서, 고분자량 음이온계 후처리제(100,000g/mol) 90 중량%와 저분자량 음이온계 후처리제(50,000g/mol) 10 중량%의 혼합에 의해 제조한 것이다.Comparative Example 3 relates to a case where an excessively large molecular weight was used as a low molecular weight anionic post-treatment agent, and 90 wt% of a high molecular weight anionic post-treatment agent (100,000 g/mol) and a low molecular weight anionic post-treatment agent (50,000 g/mol) were used. ) by mixing 10% by weight.
비교예 4는 한 종류의 분자량(92,000g/mol)을 갖는 음이온계 후처리제에 의해 음이온계 후처리 조성물을 제조한 경우에 관한 것이다.Comparative Example 4 relates to a case in which an anionic post-treatment composition was prepared by an anionic post-treatment agent having one type of molecular weight (92,000 g/mol).
즉, 비교예 2(음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 10 중량%를 초과하는 경우), 비교예 3(음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 분자량이 30,000g/mol을 초과하는 경우), 비교예 4(실시예 2와 평균분자량이 동일한 한 종류의 분자량을 갖는 음이온계 후처리제를 사용한 경우)에 비해, 본 발명의 실시예 2(음이온계 후처리 조성물 중 저분자량 음이온계 후처리제의 배합비율이 15 중량% 이하이고, 분자량이 30,000g/mol 이하인 경우)의 골재 손실률이 낮은 것으로 나타났다.That is, Comparative Example 2 (when the blending ratio of the low-molecular-weight anionic post-treatment agent in the anionic post-treatment composition exceeds 10% by weight), Comparative Example 3 (the molecular weight of the low-molecular-weight anionic post-treatment agent in the anionic post-treatment composition is In case of exceeding 30,000 g/mol), Comparative Example 4 (in the case of using an anionic post-treatment agent having one type of molecular weight the same as that of Example 2), Example 2 (anionic post-treatment) of the present invention When the mixing ratio of the low molecular weight anionic post-treatment agent in the composition is 15 wt% or less and the molecular weight is 30,000 g/mol or less), it was found that the aggregate loss rate was low.
위 시험 결과를 통해서도, 음이온계 후처리 조성물을 사용하는 경우가 사용하지 않은 경우에 비해 낮은 골재 손실률을 나타냄을 확인할 수 있었다. Also through the above test results, it was confirmed that the case in which the anionic post-treatment composition was used exhibited a lower aggregate loss rate compared to the case in which the anionic post-treatment composition was not used.
또한, 고분자량 음이온계 후처리제만을 사용하는 경우에 비해, 추가로 저분자량 음이온계 후처리제를 혼합하여 사용하는 경우, 접착력과 결합강도가 최적화되어 골재 손실률이 개선되는 것을 확인할 수 있다. In addition, compared to the case of using only the high molecular weight anionic post-treatment agent, it can be confirmed that the aggregate loss rate is improved by optimizing the adhesion and bonding strength when a low molecular weight anionic post-treatment agent is additionally mixed.
다만, 저분자량 음이온계 후처리제로서 분자량이 너무 큰 것을 사용하거나, 그 양이 너무 많은 경우, 접착력 및 강도가 최적화 되지 않아 골재 손실률이 커짐을 알 수 있었다.However, it was found that when a low molecular weight anionic post-treatment agent with too large a molecular weight is used or the amount thereof is too large, the adhesive strength and strength are not optimized, and thus the aggregate loss rate increases.
표 6은 LA 마모시험(골재)의 결과인 골재 손실률을 나타낸 것이다.Table 6 shows the aggregate loss rate as a result of the LA abrasion test (aggregate).
비교예 1(음이온계 후처리 조성물이 도포되지 않은 경우)에 비해, 본 발명의 실시예 1(음이온계 후처리 조성물이 도포된 경우)의 골재 마모율이 낮은 것으로 나타났다.Compared to Comparative Example 1 (when the anionic post-treatment composition was not applied), it was found that the aggregate wear rate of Example 1 (when the anionic post-treatment composition was applied) of the present invention was low.
표 7은 고온성능(DSR)의 평가시험 결과를 나타낸 것이다.Table 7 shows the evaluation test results of high temperature performance (DSR).
비교예 1(음이온계 후처리 조성물이 도포되지 않은 경우)에 비해, 본 발명의 실시예 1(음이온계 후처리 조성물이 도포된 경우)의 고온성능 또한 우수함을 확인할 수 있다.Compared to Comparative Example 1 (when the anionic post-treatment composition is not applied), it can be confirmed that the high temperature performance of Example 1 (when the anionic post-treatment composition is applied) of the present invention is also excellent.
표 8은 촉진내후성(Xenon Arc, 1000h)의 평가시험 결과를 나타낸 것으로서, 온도 60℃, 습도 60%, 조도 350nm의 조건에서 시험을 실시한 것이다.Table 8 shows the evaluation test results of accelerated weather resistance (Xenon Arc, 1000h), and the test was conducted under the conditions of a temperature of 60° C., a humidity of 60%, and an illuminance of 350 nm.
비교예 1(음이온계 후처리 조성물이 도포되지 않은 경우)의 시료에는 균열이 발생하였으나, 본 발명의 실시예 1(음이온계 후처리 조성물이 도포된 경우)의 시료에는 균열이 발생하지 않음을 확인할 수 있다.It was confirmed that cracks occurred in the sample of Comparative Example 1 (when the anionic post-treatment composition was not applied), but cracks did not occur in the sample of Example 1 (when the anionic post-treatment composition was applied) of the present invention. can
본 발명에 의한 칩씰용 음이온계 후처리 조성물 및 이를 이용한 도로포장의 유지보수공법은 칩씰 시공 후 경화액을 살포하는 공법으로서, 골재의 살포면을 코팅하여 골재 내구성을 향상시키는 것은 물론, 골재 하부의 유화 아스팔트와 breaking을 일으켜 초기 유화 아스팔트와 골재의 부착강도를 향상시킬 수 있다. The anionic post-treatment composition for chip seals according to the present invention and the maintenance method of road pavement using the same is a method of spraying hardened liquid after chip seal construction. By causing breaking with emulsified asphalt, it is possible to improve the adhesion strength of the initial emulsified asphalt and aggregate.
또한, 브레이킹에 의해 하부 유화 아스팔트의 잔유 기간이 늘어나므로, 골재에 유화 아스팔트가 침투하는 시간을 늘어남에 따라 부착력이 증대되고, 이를 통해 칩씰 공법에 의한 도로포장의 내구성을 향상시킬 수 있다. In addition, since the residual oil period of the lower emulsified asphalt is increased by breaking, the adhesion strength increases as the time for the emulsified asphalt to penetrate into the aggregate increases, and through this, the durability of the road pavement by the chip seal method can be improved.
음이온계 후처리 조성물은 자외선, 온도변화, 수분에 대한 저항성능을 갖고 있다. The anionic post-treatment composition has resistance to UV rays, temperature changes, and moisture.
칩씰 공법은 경제적인 이유로 동남아 지역에서 많이 사용되고 있는데, 위와 같은 음이온계 후처리 조성물의 장점은 동남아 지역에 대한 적용 시 더욱 유리한 효과를 얻을 수 있을것으로 판단된다. The chip seal method is widely used in Southeast Asia for economic reasons.
본 발명에 의한 공법은 시공 시 발생하는 비산먼지에 대한 억제 효과도 있으므로, 골재 및 도로에 존재하는 비산먼지, 시공장비에 의한 비산먼지를 억제할 수 있어 시공환경을 개선하는데 도움을 줄 수 있다.Since the method according to the present invention also has an inhibitory effect on scattering dust generated during construction, it is possible to suppress scattering dust present in aggregates and roads, and scattering dust caused by construction equipment, thereby helping to improve the construction environment.
이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께 하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.Since the above has only been described with respect to some of the preferred embodiments that can be implemented by the present invention, as noted, the scope of the present invention should not be construed as being limited to the above embodiments, and It will be said that the technical idea and the technical idea with the root are all included in the scope of the present invention.
1 : 기존 도로포장 2 : 노면
10 : 양이온계 유화 아스팔트 조성물 20 : 골재
30 : 음이온계 후처리 조성물1: Existing road pavement 2: Road surface
10: cationic emulsified asphalt composition 20: aggregate
30: anionic post-treatment composition
Claims (7)
물 40~60 중량%;를
포함하는 것을 특징으로 하는 칩씰용 음이온계 후처리 조성물.40 to 60% by weight of an anionic post-treatment agent formed by mixing one or two or more of methacrylic acid ether, acrylic acid ether, acrylic urethane resin, SBR (stylen butatien rubber), and polychloroprene;
40-60 wt% of water;
Anionic post-treatment composition for chipseal, characterized in that it comprises.
상기 음이온계 후처리제는,
분자량이 80,000~150,000g/mol인 고분자량 음이온계 후처리제를 포함하는 것을 특징으로 하는 칩씰용 음이온계 후처리 조성물.According to claim 1,
The anionic post-treatment agent,
An anionic post-treatment composition for chipseal, comprising a high molecular weight anionic post-treatment agent having a molecular weight of 80,000 to 150,000 g/mol.
상기 음이온계 후처리제는,
분자량이 10,000~30,000g/mol인 저분자량 음이온계 후처리제를 더 포함하는 것을 특징으로 하는 칩씰용 음이온계 후처리 조성물.3. The method of claim 2,
The anionic post-treatment agent,
Anionic post-treatment composition for chipseal, characterized in that it further comprises a low molecular weight anionic post-treatment agent having a molecular weight of 10,000 to 30,000 g/mol.
상기 음이온계 후처리제는,
상기 고분자량 음이온계 후처리제 85~95 중량%;
상기 저분자량 음이온계 후처리제 5~15 중량%;를
포함하는 것을 특징으로 하는 칩씰용 음이온계 후처리 조성물.4. The method of claim 3,
The anionic post-treatment agent,
85 to 95 wt% of the high molecular weight anionic post-treatment agent;
5 to 15% by weight of the low molecular weight anionic post-treatment agent;
Anionic post-treatment composition for chipseal, characterized in that it comprises.
상기 고분자량 음이온계 후처리제와 물을 교반하여 1차 조성물을 제조하는 단계;
상기 1차 조성물과 저분자량 음이온계 후처리제를 교반하여 상기 음이온계 후처리 조성물을 제조하는 단계;를
포함하는 것을 특징으로 하는 음이온계 후처리 조성물의 제조방법.As a method for preparing the anionic post-treatment composition of claim 3,
preparing a first composition by stirring the high molecular weight anionic post-treatment agent and water;
Preparing the anionic post-treatment composition by stirring the first composition and the low molecular weight anionic post-treatment agent;
Method for producing an anionic post-treatment composition, characterized in that it comprises.
기존 도로포장의 표면을 청소하는 단계;
상기 청소된 기존 도로포장의 표면에 양이온계 유화 아스팔트 조성물을 도포함과 아울러, 골재를 살포하는 단계;
상기 골재가 살포된 기존 도로포장의 표면에 상기 음이온계 후처리 조성물을 1회 또는 복수회 도포하는 단계;를
포함하는 것을 특징으로 하는 도로포장의 유지보수공법.As a road pavement maintenance method using the anionic post-treatment composition of any one of claims 1 to 4,
cleaning the surface of the existing road pavement;
Applying a cationic emulsified asphalt composition to the surface of the cleaned existing road pavement, as well as spraying aggregate;
Applying the anionic post-treatment composition once or multiple times to the surface of the existing road pavement on which the aggregate is sprayed;
Road pavement maintenance method comprising the.
노면을 고르게 다짐하고 청소하는 단계;
상기 청소된 노면에 양이온계 유화 아스팔트 조성물을 도포함과 아울러, 골재를 살포하는 단계;
상기 골재가 살포된 노면에 상기 음이온계 후처리 조성물을 1회 또는 복수회 도포하는 단계;를
포함하는 것을 특징으로 하는 도로포장공법.As a road paving method using the anionic post-treatment composition of any one of claims 1 to 4,
evenly compacting and cleaning the road surface;
While applying the cationic emulsified asphalt composition to the cleaned road surface, spraying aggregate;
Applying the anionic post-treatment composition once or multiple times to the road surface on which the aggregate is sprayed;
Road pavement method comprising the.
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| KR100984793B1 (en) * | 2010-05-07 | 2010-10-01 | (주)에스엔건설 | Deep penetrating asphalt sealer and multifunctional asphalt pavement repair and reinforcing method by using deep penetrating asphalt sealer |
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| KR102286406B1 (en) * | 2021-01-14 | 2021-08-05 | 원용한 | Plant-mix type additive composition and porous asphalt composition using the same |
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