KR102360952B1 - Method for manufacturing an adhesive film without a substrate having a pattern layer or a color layer - Google Patents

Abstract

In the present invention, the composition constituting the UV pattern layer is applied on the upper part of the base film, and the pattern is formed by pressing with a mold on which a predetermined pattern is formed, then UV (ultraviolet) is irradiated and the mold is removed to form the UV pattern layer. to do; Laminating a protective film on top of the UV pattern layer to form a protective film layer; removing the base film; and laminating the release film coated with the adhesive layer under the UV pattern layer; It relates to a method for manufacturing a base-free adhesive film comprising a, and it is possible to achieve a high yield in the manufacturing process.

Description

Method for manufacturing a non-substrate adhesive film having a pattern layer or color layer formed {METHOD FOR MANUFACTURING AN ADHESIVE FILM WITHOUT A SUBSTRATE HAVING A PATTERN LAYER OR A COLOR LAYER}

The present invention relates to a substrate-free adhesive film having a patterned layer capable of shortening a manufacturing process and realizing a high yield, and a manufacturing method thereof.

In general, a shatterproof film is used for the purpose of forming an exterior by applying a print or pattern to the exterior surface of electronic devices such as cameras, laptop computers, smartphones, and tablet PCs and preventing glass scattering upon impact.

Since consumers place importance on the design according to the purpose of the display, various designs of displays are being developed, and designs using metal materials are in the spotlight, but metal materials have disadvantages such as heavy weight and increased manufacturing cost.

In order to compensate for this, displays using tempered glass instead of metal materials are being developed. Recently, as tempered glass shaped as a 2D or 3D curved surface is applied to portable electronic products such as above, patterning is applied to the anti-shattering film used on the back side of the tempered glass. However, the use of an adhesive film laminated to a curved tempered glass by printing is increasing.

As in Korea Patent Registration No. 10-0773456, in general, an adhesive film uses a transparent PET film as a base film, an adhesive layer and a release film layer are formed on one side thereof, and a coating layer for decoration is formed on the opposite side. .

However, such a base film is made of PET, etc., but the PET material has a problem in that the water-repellent and dust-proof effect is reduced due to the elasticity to be restored after attaching to the curved part, and the base film may be damaged in the repeated bending environment. There is a problem that it can. To improve this, a substrate-free type adhesive film without a substrate is being manufactured, but there is a limitation in yield due to problems such as pattern breakage, partial peeling, and pressing during the process of peeling the UV pattern layer from the release film, and the process of laminating the adhesive layer There is a problem that is easy to generate air bubbles.

Korean Patent No. 10-0773456

The present invention has been devised to solve the above technical problems, and there is no base film such as PET, so it has excellent adhesion to curved parts, shortens the manufacturing process, and has a low defect rate, so a pattern layer that can realize a high yield An object of the present invention is to provide a substrate-free adhesive film formed.

In the first embodiment of the present invention, in the method for manufacturing a substrate-free pressure-sensitive adhesive film having a pattern layer, a composition constituting a UV pattern layer is applied on an upper portion of a base film, and compressed with a mold on which a predetermined pattern is formed to form a pattern After, forming a UV pattern layer by irradiating UV (ultraviolet) and removing the mold; Laminating a protective film on top of the UV pattern layer to form a protective film layer; removing the base film; and laminating the release film coated with the adhesive layer under the UV pattern layer; includes

In a specific example, the peel force of the base film is 20 to 40 gf, and the transmittance is 85 to 97%.

In a specific example, the thickness of the base film is 50 to 200 μm.

In a specific example, the protective film layer is made of polyethylene (PE) material.

In a specific example, the method of manufacturing a substrate-free adhesive film having a pattern layer formed thereon further includes, after forming the UV pattern layer, sequentially forming a deposition layer and a color layer on the UV pattern layer .

In a specific example, the method for manufacturing a base-free adhesive film having a pattern layer formed thereon according to the present invention further comprises the step of further irradiating UV after laminating the release film coated with the adhesive layer under the UV pattern layer do.

According to another embodiment of the present invention, there is provided a method for manufacturing a substrate-free pressure-sensitive adhesive film having a pattern layer formed thereon, the method comprising: forming a color layer on an upper portion of a base film; Forming a UV pattern layer by applying a composition constituting the UV pattern layer on top of the color layer, forming a pattern by pressing with a mold on which a predetermined pattern is formed, irradiating UV (ultraviolet) and removing the mold; Laminating a protective film on top of the UV pattern layer to form a protective film layer; removing the base film; and laminating the release film coated with the adhesive layer under the color layer; includes

In a specific example, the method of manufacturing a substrate-free adhesive film having a pattern layer formed thereon further includes, after forming the UV pattern layer, sequentially forming a deposition layer and a color layer on the UV pattern layer .

In a specific example, the peel force of the base film is 20 to 40 gf, and the transmittance is 85 to 97%.

In a specific example, the thickness of the base film is 50 to 200 μm.

In a specific example, the protective film layer is made of polyethylene (PE) material.

In addition, the method of manufacturing the substrate-free pressure-sensitive adhesive film having the pattern layer formed thereon may further include a step of further irradiating UV after laminating the release film coated with the pressure-sensitive adhesive layer under the UV pattern layer.

The manufacturing method of the substrate-free pressure-sensitive adhesive film having a pattern layer formed thereon according to the present invention has excellent adhesion to the curved portion, the manufacturing process is shortened, and a high yield can be realized due to a low defect rate.

1 is a flowchart illustrating a method of manufacturing a base material-free adhesive film having a pattern layer formed thereon according to an embodiment of the present invention.
2 is a cross-sectional view of a substrate-free pressure-sensitive adhesive film having a pattern layer formed thereon according to an embodiment of the present invention.
3 is a cross-sectional view of a base-free adhesive film in which a deposition layer and a color layer are formed on the UV pattern layer in one embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a base material-free adhesive film having a pattern layer formed thereon according to another embodiment of the present invention.
5 is a cross-sectional view of a substrate-free pressure-sensitive adhesive film having a pattern layer formed thereon according to another embodiment of the present invention.
6 is a cross-sectional view of a base-free adhesive film in which a deposition layer and a color layer are formed on the UV pattern layer in another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

Hereinafter, when an arbitrary component is formed on the "top (or bottom)" of the substrate, it not only means that the optional component is formed in contact with the top (or bottom) surface of the substrate, but also is formed on (or on) the substrate and the substrate. (under) the non-inclusive of other components between any components formed.

Hereinafter, the present invention will be described in detail.

1 is a flowchart illustrating a method of manufacturing a base-free adhesive film according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the base-free adhesive film according to an embodiment of the present invention.

Referring to FIG. 1, in the method for manufacturing a base-free adhesive film having a pattern layer according to the present invention, a composition constituting a UV pattern layer is applied on an upper portion of a base film, and the pattern is formed by pressing with a mold having a predetermined pattern formed thereon. After forming, irradiating UV (ultraviolet) and removing the mold to form a UV pattern layer (S10); Laminating a protective film on top of the UV pattern layer to form a protective film layer (S11); removing the base film (S12); and laminating the release film coated with the adhesive layer under the UV pattern layer (S13); includes

Accordingly, referring to FIG. 2 , the substrate-free adhesive film 10 having a patterned layer according to the present invention has a release film layer 11 , an adhesive layer 12 , a UV pattern layer 13 , and a protective film layer 14 . ) includes a sequentially stacked structure.

In the conventional adhesive film, a base film for supporting a UV pattern layer, etc., was laminated between an adhesive layer and a release film layer. Such a base film is mainly made of PET, etc., but due to the base film, the flexibility of the adhesive film is reduced, and the adhesive force to the adhesive object having a small radius of curvature is reduced, so that the adhesive film is lifted from the adhesive object.

In contrast, the adhesive film according to the present invention has a structure in which the body of the film including the UV pattern layer is directly attached to the object to be adhered without a base film, and the protective film layer is disposed on the top layer of the film, so it has excellent adhesion to curved surfaces And it has the advantage of excellent durability even in repeated bending, and the scattering prevention function can be improved.

1 and 2 , a base film is used to form the UV pattern layer. The UV pattern layer is a layer in which a plurality of patterns are formed to represent a three-dimensional effect of color, and the base film is removed during the film manufacturing process as to temporarily support the UV pattern layer during the manufacturing process of the film.

The base film may be a polycarbonate or polyester material, and the peeling force may be 20 to 40 gf. When the peeling force is in the above range, the base film may be easily removed from the base film-free adhesive film. If the peeling force is less than 20gf, the peeling force is lower than that of the mold, and when the mold is removed, the UV pattern layer or the color layer to be described later may be torn on both sides or lifted from the mold. On the other hand, when the peeling force of the base film exceeds 40 gf, the UV pattern layer of the film body, the color layer and the protective film layer to be described later may be lifted or damaged when the base film is removed in the subsequent process. At this time, the peel force of the base film may be measured according to ASTM-3330.

In addition, the thickness of the base film may be 50 to 200㎛, specifically, may be 100 to 188㎛. If the thickness of the base film is less than 50㎛, the base film may be easily contracted, and distortion, wrinkles, curls, etc. may occur. On the other hand, if the thickness of the base film exceeds 200㎛, the base film is too thick, it is difficult to remove the base film in the subsequent process, and the film body such as the UV pattern layer may be damaged.

In addition, by forming a rough surface such as sanding or hairline on the edge of the base film, it improves the adhesion between the film body including the UV pattern layer and the base film, and prevents the UV pattern layer from separating from the base film during post-processing. And it is possible to prevent the shrinkage of the UV pattern layer.

That is, in the method for manufacturing a base-free adhesive film according to the present invention, by using a base film having a thickness and peeling force within a specific range, phenomena such as pattern breakage, partial peeling, and pressing during the process can be prevented, and yield can be improved will be.

Meanwhile, the UV pattern layer may be composed of a photocurable resin, a diluent, a photoinitiator, and various additives. For example, among the additives used in the UV pattern layer, the photocurable resin is an important component that determines the physical properties of the resin, and may form a polymer bond through a polymerization reaction to form a cured film. The photocurable resin may be classified into polyester-based, epoxy-based, urethane-based, polyether-based, polyacrylic-based acrylates, and the like according to the structure of the skeleton molecule, and urethane acrylate is most preferred. The photocurable resin may be in the form of an oligomer.

The urethane acrylate oligomer is not particularly limited, but the weight ratio of the polyurethane resin and the acrylic monomer may be about 1:9 to 9:1, more preferably about 2:8 to 8:2. This is because, when the weight ratio of the polyurethane resin and the acrylic monomer satisfies the above numerical range, it is easy to secure transparency and has excellent coating properties, so that it is easy to form a coating layer.

The weight average molecular weight of the urethane acrylate resin may be 5000 to 30,000 or less, and more specifically, 10000 to 20000. If the weight average molecular weight is less than 5000, the scratch resistance and the like are excellent, but since curing shrinkage increases, wrinkles may occur after coating. If a urethane acrylate resin having a weight average molecular weight of more than 30,000 is used, the viscosity increases excessively, and tack may occur after curing, and the coating function of the film is deteriorated, and the scratch resistance and film strength are not excellent.

As another example, among the additives used in the UV pattern layer, a reactive diluent (monomer) serves as a crosslinking agent and a diluent for the reactive oligomer, and may be polymerized to form a cured film. As another example, among the additives used in the UV pattern layer, the photopolymerization initiator is the most basic raw material of the UV curing resin, and the photopolymerization initiator absorbs ultraviolet rays to generate radicals or cations to initiate polymerization. It can be used by adding a mixture of ~3 types. As another example, as other additives used in the UV pattern layer, a photosensitizer, a colorant, a thickener, a polymerization inhibitor, etc. may be added according to the use.

In the method for manufacturing a substrate-free adhesive film having a pattern layer according to the present invention, in order to form a UV pattern layer, the composition constituting the UV pattern layer as described above is applied on top of the base film, and then a predetermined pattern is formed in a mold is pressed to form a pattern. At this time, the mold should be a water-repellent treatment as a soft mold. If the mold is not water-repellent, the mold may not be removed or a problem of partial peeling may occur.

When the pattern is formed by the mold, UV is irradiated to cure the composition constituting the UV pattern layer. The light source used for UV irradiation may be one or two selected from the group consisting of LEDs and bulbs. The irradiation amount of UV may be 800 to 1000mJ/cm ² .

At this time, it is preferable that the composition is uniformly cured upon UV irradiation, which means that the deep curing rate and the surface curing rate of the UV pattern layer are the same. For this purpose, the transmittance of the base film is preferably 85 to 97%. When the composition is cured through UV irradiation, the UV pattern layer is completed by removing the mold.

The thickness of the UV pattern layer may be 5 to 30 μm, specifically 10 to 20 μm, or 10 to 15 μm.

When the UV pattern layer is formed, a protective film layer is formed by laminating a protective film on the UV pattern layer to protect the UV pattern layer. The protective film is preferably a polyethylene (PE) material, and the polyethylene material may be at least one selected from the group consisting of high-density polyethylene (HDPE), low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE). When polyethylene is used as a protective film layer, it serves to prevent distortion and wrinkling of the internal UV pattern layer as in the case of using PET, but is more flexible than a substrate such as PET. It has the advantage that it does not cause floatation, air bubbles, or wrinkles when dried.

The protective film layer may have an average thickness of 50 to 200 μm, and specifically, 100 to 150 μm. If the thickness of the protective film is less than 50um, it is difficult to protect the pattern layer during post-processing such as base film removal and adhesive lamination, so defects such as pattern breakage and pressing may occur. Due to the lack of over-adhesion, air bubbles and lifting may occur, which may cause stains on the pattern layer. In addition, the protective film constituting the protective film layer may be a self-adhesive film or a film coated with an adhesive, and the adhesive strength is about 2 to 20 gf. When the adhesive strength of the protective film layer is within the above range, the protective film layer may be stably adhered to the upper portion of the UV pattern layer.

When the protective film layer is formed, the base film located under the UV pattern layer is removed, and the release film coated with the adhesive layer is laminated on the spot where the base film is removed.

The release film is formed on one surface of the adhesive layer to protect the adhesive layer. The release film may use various films such as PET film, and may have a release force of 1-50 gf/inch, specifically 5-20 gf/inch, and a thickness of 20- 50 gf/inch for easier release. 200 μm, more specifically 50 to 100 μm. The release film may be a polyester film such as polyethylene terephthalate, polyethylene naphthalate, polypropylene terephthalate, polybutyrene terephthalate and/or polypropylene naphthalate.

Meanwhile, the adhesive layer is an optical clear adhesive (OCA) layer formed of an optically transparent adhesive material. Such an adhesive layer maintains interlayer interfacial adhesion, but removes an air layer that may be formed at the interface, and maintains visibility of the adhesive film.

The adhesive layer may include a polymer resin. The polymer resin includes at least one selected from the group consisting of a polyester resin, an acrylic resin, a urethane resin, an alkyd resin, and an amino resin. The polymer resin may be used alone, or two or more types of copolymers or mixtures may be used. Among them, an acrylic resin or a urethane resin having excellent optical properties, weather resistance, and adhesion to a substrate is most preferred. In this case, the refractive index of the acrylic resin or the urethane resin may be 1.40 to 1.60, and more specifically, 1.45 to 1.50.

Specifically, the acrylic resin may be constituted by polymerization of an acrylic monomer, or may be copolymerized with an acrylic monomer and other copolymerizable monomers. For example, as the acrylic monomer, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth)acrylate, sec-butyl (meth)acrylate, pentyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate , isooctyl (meth) acrylate, (meth) isononyl acrylate, lauryl (meth) acrylate, and at least one selected from tetradecyl (meth) acrylate may be used, but is not limited thereto.

In addition, other monomers copolymerizable therewith include alkyl methacrylate having an alkyl group having 2 to 18 carbon atoms, alkyl acrylate having an alkyl group having 1 to 18 carbon atoms, α,β-unsaturated acids such as acrylic acid and methacrylic acid, maleic unsaturated group-containing divalent carboxylic acids such as acid, fumaric acid and itaconic acid; aromatic vinyl compounds such as styrene, α-methylstyrene and nuclear substituted styrene; α,β-unsaturated nitriles such as acrylonitrile and methacrylonitrile; Maleic anhydride, maleimide, N-substituted maleimide, and the like may be used, but are not limited thereto.

In the case of a vinyl copolymer, it can be prepared by polymerizing a vinyl monomer, and such vinyl monomers include ethyl methacrylate, butyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, glycidyl methacrylate, meta methacrylic acid esters such as epoxycyclohexylmethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, and isoboronyl methacrylate; acrylic acid esters such as methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, glycidyl acrylate, epoxycyclohexylmethyl acrylate, 2-hydroxyethyl acrylate, and 2-hydroxypropyl acrylate; Carboxylic acids, such as methacrylic acid and acrylic acid, and its esters: Vinyl cyanides, such as acrylonitrile and methacrylonitrile; vinylarenes such as styrene, α-methylstyrene, monochlorostyrene, and dichlorostyrene; maleic acid, fumaric acid and their esters; vinyl halides such as vinyl chloride, vinyl bromide, and chloroprene; vinyl acetate; alkenes such as ethylene, propylene, butylene, butadiene, and isobutylene; and the like.

The pressure-sensitive adhesive resin constituting the pressure-sensitive adhesive layer may be prepared according to a conventional method for producing pressure-sensitive adhesives. The adhesive resin is generally formed by polymerization of monomers. Specifically, it can be prepared by mixing a monomer, a photoinitiator and an additive for forming the adhesive polymer resin, adding a filler as necessary, and then polymerizing it. It goes without saying that a polymerization initiator and a crosslinking agent may be added during the manufacturing process of the pressure-sensitive adhesive composition. Preferably, in order to allow the filler and other additives to be uniformly dispersed in the pressure-sensitive adhesive composition, a monomer for forming the pressure-sensitive adhesive polymer resin is first prepolymerized to form a syrup state, and then the filler and other additives, etc. is added, stirred uniformly, and then polymerization is carried out. In addition, the pressure-sensitive adhesive composition according to the present invention may undergo a curing step through heat or light irradiation.

When the pressure-sensitive adhesive composition is photocured, the pressure-sensitive adhesive composition may include a photoinitiator together with the above monomers. Such a photoinitiator serves to initiate a curing reaction of the pressure-sensitive adhesive composition by reacting by irradiation with ultraviolet rays or the like during the manufacturing process of the pressure-sensitive adhesive layer.

The type of photoinitiator that can be used in the present invention is not particularly limited, and examples thereof include α-hydroxyketone-based compounds, phenylglyoxylate-based compounds, benzyldimethylketal-based compounds, and α-aminoketone-based compounds. However, the present invention is not limited thereto. The weight ratio of the photoinitiator may be 0.01 to 10, specifically 0.01 to 5. By adjusting the weight ratio of the initiator to the above range, excellent physical properties and productivity can be secured.

The pressure-sensitive adhesive composition of the present invention may further include a silane coupling agent if necessary. The silane coupling agent may increase the adhesive strength of the pressure-sensitive adhesive film prepared from the pressure-sensitive adhesive composition. The silane coupling agent may include a conventional pressure-sensitive adhesive known to those skilled in the art. Specifically, the silane coupling agent is a silane compound containing an epoxy group such as 3-glycidoxypropyltrimethoxysilane and 3-glycidoxypropylmethyldimethoxysilane, vinyltrimethoxysilane, (meth)acryloyloxypropyltrimethyl Polymerizable unsaturated group-containing silane compound such as oxysilane, 3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, etc. amino group-containing silane compound 3-mercaptopropyltrimethyl It may include at least one of mercapto group-containing silane compounds such as oxysilane.

The pressure-sensitive adhesive composition of the present invention may further include conventional additives included in the pressure-sensitive adhesive composition. Additives may include, but are not limited to, defoamers, leveling agents, antistatic agents, and the like. The additive may be included in an amount of 0.0001 parts by weight to 5 parts by weight, specifically 0.001 parts by weight to 1 part by weight, based on 100 parts by weight of a mixture of the (meth)acrylic copolymer and the (meth)acrylic monomer. In the above range, the adhesive film made of the pressure-sensitive adhesive composition may have good adhesion.

The adhesive layer may have an adhesive force of 10 N/inch or more to the glass in order to prevent scattering of the glass when the glass is broken. Specifically, the adhesive layer may have an adhesive force of 10 to 20 N/inch to glass. When the adhesive force of the adhesive layer is within the above range, there is a sufficient scattering prevention effect and an easy rework process for recycling the glass when the process is defective.

In addition, the adhesive layer may be in the range of 1 to 40㎛, specifically 15 to 30㎛. When the thickness of the adhesive layer is within the above range, the occurrence of defects due to pressing may be prevented and the adhesive force of the adhesive layer may be properly maintained.

In addition, in the method for producing a base film according to the present invention, when the release film coated with the adhesive layer is laminated, a step of additionally irradiating UV may be performed. This is for curing the adhesive layer and further curing the UV pattern layer. In this way, when UV is additionally irradiated, the bonding strength between the adhesive layer and the UV pattern layer may be improved while the adhesive layer and the UV pattern layer are cured at the same time.

On the other hand, the substrate-free adhesive film according to the present invention may further include a color layer in addition to the UV pattern layer as a means for realizing a color or pattern. Such a color layer may be formed on one or both surfaces of the UV pattern layer, for example.

3 is a cross-sectional view of a base-free adhesive film in which a deposition layer and a color layer are formed on the UV pattern layer in one embodiment of the present invention.

Referring to Figure 3, the substrate-free adhesive tape with a pattern layer according to the present invention, after the step of forming the UV pattern layer, the step of sequentially forming a deposition layer and a color layer on top of the UV pattern layer may include more. In this case, the deposition layer and the color layer are formed between the UV pattern layer and the protective film layer, and the base-free adhesive film 20 includes a release film layer 21 , an adhesive layer 22 , a UV pattern layer 23 , and a deposition layer. (24), the color layer 25 and the protective film layer 26 are sequentially laminated structure.

Accordingly, in the method of manufacturing a base-free adhesive tape, a composition constituting a UV pattern layer is applied on an upper portion of a base film, and a pattern is formed by pressing with a mold on which a predetermined pattern is formed, followed by irradiation with UV (ultraviolet) and forming a UV pattern layer by removing the mold; sequentially forming a deposition layer and a color layer on the UV pattern layer; Laminating a protective film on top of the color layer to form a protective film layer; removing the base film; and laminating the release film coated with the adhesive layer under the UV pattern layer; includes

The color layer is for expressing characters and patterns having various colors, and gradation, patterned colors, and various colors may be implemented. The color layer may be implemented as a single layer or a plurality of layers, and may include various inks, dyes, pigments, and the like to implement colors. Specifically, the dyes and pigments include SiO ₂ , Nb ₂ O ₅ , Ta ₂ O ₅ , BST{(Ba,Sr)TiO ₃ }, PZT{Pb(Zr,Ti)O ₃ }, Al ₂ O ₃ , HfO ₂ , ZrO ₂ , La ₂ O ₃ , In, TiO ₂ , Ti ₃ O ₅ , may be at least one selected from the group consisting of aluminates, and silicates.

The color layer may be formed on the base film through a printing method such as offset, silk screen, digital printing, multi-deposition, and slit coating, and the thickness of the color layer may be 5 to 50 μm, preferably 10 to 20 μm. and more preferably 10 to 15 μm.

In the present invention, the color layer is formed through printing or the like on the deposition surface formed on one surface of the UV pattern layer. The deposition layer may be formed on a surface on which a pattern is formed in the UV pattern layer. This is to prevent the pattern layer formed on the UV pattern layer from being filled by the color layer when the color layer is directly formed on the UV pattern layer.

The deposition layer is to implement the necessary gloss and color, and to maintain the pattern formed on the UV pattern layer. The deposition layer is formed by depositing a material necessary to obtain the required luster and color. For example, when the material is metal, it is possible to scatter curved light by making it have a metallic luster to implement a shiny pattern.

The thickness of the deposition layer may be 0.01 to 0.05 μm, and when within the above range, an appropriate level of metallic luster may be obtained without lowering adhesion.

Meanwhile, the color layer may be formed between the UV pattern layer and the adhesive layer.

4 is a flowchart illustrating a method of manufacturing a substrate-free adhesive film having a pattern layer formed thereon according to another embodiment of the present invention, and FIG. 5 is a cross-sectional view of a substrate-free adhesive film having a pattern layer formed thereon according to another embodiment of the present invention.

4 and 5, the manufacturing method of the base film without a pattern layer is formed according to the present invention, the step of forming a color layer on the upper portion of the base film (S20); Forming a UV pattern layer by applying a composition constituting the UV pattern layer on top of the color layer, forming a pattern by pressing with a mold on which a predetermined pattern is formed, irradiating UV (ultraviolet) and removing the mold ( S21); Laminating a protective film on top of the UV pattern layer to form a protective film layer (S22); removing the base film (S23); and laminating the release film coated with the adhesive layer under the color layer (S24); includes In this case, the color layer is formed below the UV pattern layer, that is, between the UV pattern layer and the adhesive layer, and the non-substrate adhesive film 30 has a release film layer 31 , an adhesive layer 32 , and a color as shown in FIG. 5 . The layer 33, the UV pattern layer 34, and the protective film layer 35 are sequentially stacked.

That is, according to the method for manufacturing a base-free adhesive film according to the present invention, by appropriately disposing a color layer on one or both sides of the UV pattern layer, a desired color and pattern effect can be achieved with the same material.

Referring to FIG. 4 , a color layer is formed on the base film through a method such as printing. After sequentially forming a UV pattern layer and a protective film layer on the color layer, as described above, the base film is removed and the release film coated with the adhesive layer is laminated to complete the substrate-free adhesive film. The configuration and manufacturing method of the UV pattern layer, the adhesive layer, and the release film are the same as described above.

Similarly, as described above, the base film is a film that is removed in the film manufacturing process as to temporarily support the UV pattern layer in the manufacturing process of the film.

In addition, the base film may be a polycarbonate or polyester material, and the peeling force may be 20 to 40 gf. In addition, the thickness of the base film may be 50 to 200㎛, specifically, may be 100 to 188㎛.

In the method for manufacturing a base-free adhesive film according to the present invention, by using a base film having a thickness and peeling force within a specific range, phenomena such as pattern breakage, partial peeling, and pressing during the process can be prevented, and yield can be improved.

6 is a cross-sectional view of a non-substrate adhesive film in which a deposition layer and a color layer are formed on the UV pattern layer in another embodiment of the present invention.

Referring to Figure 6, the substrate-free adhesive tape with a pattern layer according to the present invention, after the step of forming the UV pattern layer, the step of sequentially forming a deposition layer and a color layer on top of the UV pattern layer may include more. In this case, the manufacturing method of the base-free adhesive film comprises the steps of: forming a color layer on the base film; Forming a UV pattern layer by applying a composition constituting the UV pattern layer on top of the color layer, forming a pattern by pressing with a mold on which a predetermined pattern is formed, irradiating UV (ultraviolet) and removing the mold; sequentially forming a deposition layer and a color layer on the UV pattern layer; Laminating a protective film on top of the color layer to form a protective film layer; removing the base film; and laminating the release film coated with the adhesive layer under the color layer; includes Accordingly, the substrate-free adhesive film 40 includes a release film layer 41 , an adhesive layer 42 , a color layer 43 , a UV pattern layer 44 , a deposition layer 45 , a color layer 46 , and a protective film. It has a structure in which the layers 47 are sequentially stacked.

As such, in the method for manufacturing a base-free adhesive film according to the present invention, a UV pattern layer and a color layer are appropriately arranged without using a base film such as PET to variously implement gradation and patterned colors, and It is possible to obtain a substrate-free pressure-sensitive adhesive film having an improved adhesive ability.

In addition, by using a base film having a thickness and peeling force within a specific range, it is possible to prevent phenomena such as pattern breakage, partial peeling, and pressing during the process, and improve the yield.

Hereinafter, the present invention will be described in detail through examples. However, the following examples only illustrate the present invention, and the present invention is not limited by the following examples.

[Example 1]

A urethane acrylate resin was applied on a base film made of a PET material having a thickness of 100 μm and a peeling force of 20 gf, and then pressed with a water-repellent pattern forming mold to form a UV pattern layer with a thickness of 15 μm. A PE film having a thickness of 100 μm and an adhesive strength of 20 gf was laminated on the UV pattern layer.

Thereafter, the base film was removed, and a release film made of PET coated with an acrylic adhesive resin was laminated under the UV pattern layer to prepare an adhesive film.

[Example 2]

An adhesive film was prepared in the same manner as in Example 1, except that a base film having a peeling force of 40 gf was used.

[Example 3]

After forming a deposition layer on the UV pattern layer, printing ink on the deposition layer to form a color layer, and then laminating a PE film on the color layer, an adhesive film was prepared in the same manner as in Example 1 prepared.

[Example 4]

An adhesive film was prepared in the same manner as in Example 3, except that a base film having a peeling force of 40 gf was used.

[Example 5]

A color layer was formed by printing ink on a base film having a thickness of 100 μm and a peeling force of 20 gf. After coating a urethane acrylate resin on the color layer, it was compressed with a water-repellent treated pattern forming mold to form a UV pattern layer with a thickness of 15 μm. A PE film having a thickness of 100 μm and an adhesive strength of 20 gf was laminated on the UV pattern layer.

Thereafter, the base film was removed, and a PET release film coated with an acrylic adhesive resin to a thickness of 15 μm was laminated under the UV pattern layer to prepare an adhesive film.

[Example 6]

An adhesive film was prepared in the same manner as in Example 5, except that a base film having a peeling force of 40 gf was used.

[Example 7]

After forming a deposition layer on the UV pattern layer, and printing ink on the deposition layer to form a color layer, an adhesive film was prepared in the same manner as in Example 5 except that a PE film was laminated on the color layer. prepared.

[Example 8]

An adhesive film was prepared in the same manner as in Example 7, except that a base film having a peeling force of 40 gf was used.

[Comparative Example 1]

An adhesive film was prepared in the same manner as in Example 1, except that a base film having a peeling force of 15 gf was used.

[Comparative Example 2]

An adhesive film was prepared in the same manner as in Example 1, except that a base film having a peeling force of 45 gf was used.

[Comparative Example 3]

An adhesive film was prepared in the same manner as in Example 3, except that a base film having a peeling force of 15 gf was used.

[Comparative Example 4]

An adhesive film was prepared in the same manner as in Example 3, except that a base film having a peeling force of 45 gf was used.

[Comparative Example 5]

An adhesive film was prepared in the same manner as in Example 5, except that a base film having a peeling force of 15 gf was used.

[Comparative Example 6]

An adhesive film was prepared in the same manner as in Example 5, except that a base film having a peel force of 45 gf was used.

[Comparative Example 7]

An adhesive film was prepared in the same manner as in Example 7, except that a base film having a peeling force of 15 gf was used.

[Comparative Example 8]

An adhesive film was prepared in the same manner as in Example 7, except that a base film having a peeling force of 45 gf was used.

[Experimental example]

Five adhesive films according to Examples 1 to 8 and Comparative Examples 1 to 8 were prepared, respectively. For these adhesive films, it was checked whether the UV pattern layer or color layer was torn, or whether lifting, bubbles, wrinkles, etc. occurred in the UV pattern layer or color layer. Among the five adhesive films, a case in which at least two damage to the UV pattern layer or color layer occurred was marked as bad, and the case where it was not was marked as good. The results are shown in Table 1.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Whether there is a defect Good Good Good Good Good Good Good Good Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Whether there is a defect error error error error error error error error

Referring to Table 1, in Examples 1 to 8, wherein the peel force of the base film is 20 to 40 gf in the manufacturing process of the adhesive film as in the present invention, Comparative Example 1 in which the peel force of the base film is less than 20 gf or exceeds 40 gf Since damage to the UV pattern layer or color layer does not occur compared to 8 to 8, it can be seen that a high yield can be realized in the manufacturing process.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art or those having ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be defined by the claims.

10, 20, 30, 40: adhesive film
11, 21, 31, 41: release film layer
12, 22, 32, 42: adhesive layer
13, 23, 34, 44: UV pattern layer
24, 45: deposition layer
25, 33, 43, 46: color layer
14, 26, 35, 47: protective film layer

Claims (12)

Forming a UV pattern layer by applying a composition constituting the UV pattern layer on the upper portion of the base film, forming a pattern by pressing with a mold on which a predetermined pattern is formed, irradiating UV (ultraviolet) and removing the mold;
Laminating a protective film on top of the UV pattern layer to form a protective film layer;
removing the base film; and
Laminating the release film coated with the adhesive layer under the UV pattern layer; including,
The protective film layer is a method of manufacturing a substrate-free adhesive film with a pattern layer, characterized in that the polyethylene (PE) material.
According to claim 1,
The peeling force of the base film is 20 to 40 gf, the transmittance is 85 to 97% of the pattern layer is formed a method of manufacturing a base-free adhesive film.
According to claim 1,
The thickness of the base film is 50 to 200 ㎛ method of manufacturing a substrate-free pressure-sensitive adhesive film formed with a pattern layer.
delete According to claim 1,
After the step of laminating the release film coated with the adhesive layer under the UV pattern layer,
A method for producing a substrate-free adhesive film with a pattern layer further comprising the step of further irradiating UV.
According to claim 1,
After forming the UV pattern layer,
The method of manufacturing a substrate-free adhesive film with a pattern layer further comprising the step of sequentially forming a deposition layer and a color layer on the UV pattern layer.
forming a color layer on the base film;
Forming a UV pattern layer by applying a composition constituting the UV pattern layer on top of the color layer, forming a pattern by pressing with a mold on which a predetermined pattern is formed, irradiating UV (ultraviolet) and removing the mold;
Laminating a protective film on top of the UV pattern layer to form a protective film layer;
removing the base film; and
Comprising the step of laminating the release film coated with the adhesive layer on the lower part of the color layer,
The protective film layer is a method of manufacturing a substrate-free adhesive film with a pattern layer, characterized in that the polyethylene (PE) material.
8. The method of claim 7,
After forming the UV pattern layer,
The method of manufacturing a substrate-free adhesive film with a pattern layer further comprising the step of sequentially forming a deposition layer and a color layer on the UV pattern layer.
8. The method of claim 7,
The peeling force of the base film is 20 to 40 gf, the transmittance is 85 to 97% of the pattern layer is formed a method of manufacturing a base-free adhesive film.
8. The method of claim 7,
The thickness of the base film is 50 to 200㎛ method of manufacturing a substrate-free pressure-sensitive adhesive film formed with a pattern layer.
delete 8. The method of claim 1 or 7,
The adhesive layer is a method of manufacturing a base-free adhesive film having a pattern layer comprising an acrylic resin or a urethane-based resin.

Images