KR102354978B1 - Organic light emitting display apparatus - Google Patents

Abstract

One embodiment of the present invention is a first substrate; an insulating layer formed on the first substrate; a signal wiring formed on the insulating layer; an organic light emitting device defining a display area on the first substrate and including a first electrode, a second electrode, and an intermediate layer provided between the first electrode and the second electrode; a passivation layer formed on the insulating layer; and a metal layer formed on the passivation layer outside the display area, spaced apart from the first electrode, and in contact with the second electrode and the signal wiring, wherein the passivation layer is disposed outside the display area. A first hole is formed, and the metal layer contacts the insulating layer through the first hole.

Description

Organic light emitting display apparatus

Embodiments of the present invention relate to an organic light emitting diode display.

An organic light emitting display device using an organic light emitting device has a faster response speed than the currently widely commercialized LCD, so it is possible to realize moving pictures, and by emitting light on its own, it has a wide viewing angle and high luminance, so it is in the spotlight as a next-generation display device. are receiving

The organic light emitting device includes a pixel electrode and a counter electrode facing each other, and a light emitting layer including an organic material interposed between the pixel electrode and the counter electrode. These organic light-emitting devices are very sensitive to moisture, oxygen, light, etc., and when they come into contact with them, a pixel shrinkage phenomenon in which the light-emitting area is gradually reduced or a dark spot is generated in the light-emitting area, which is an organic light-emitting device affect the lifespan and quality of

SUMMARY Embodiments of the present invention provide an organic light emitting diode display.

One embodiment of the present invention is a first substrate; an insulating layer formed on the first substrate; a signal wiring formed on the insulating layer; an organic light-emitting device defining a display area on the first substrate and including a first electrode, a second electrode, and an intermediate layer provided between the first electrode and the second electrode; a passivation layer formed on the insulating layer; and a metal layer formed on the passivation layer outside the display area, spaced apart from the first electrode, and in contact with the second electrode and the signal wiring, wherein the passivation layer is disposed outside the display area. A first hole is formed, and the metal layer contacts the insulating layer through the first hole.

In the present embodiment, a second hole is formed in the metal layer, and the second hole is formed outside the second electrode.

In this embodiment, a plurality of the second holes may be formed.

In the present embodiment, impurities generated in the passivation layer may be discharged through the second hole.

In this embodiment, the metal layer may be formed of the same material as the first electrode.

The present embodiment further includes a pixel defining layer covering a portion of the first electrode and a portion of the metal layer and in contact with the passivation layer, wherein the first hole may be formed outside the pixel defining layer.

In the present embodiment, as the metal layer contacts the second electrode and the signal line, the second electrode may be electrically connected to the metal layer.

In this embodiment, a built-in circuit unit may be disposed under the passivation layer.

In the present exemplary embodiment, impurities generated in the passivation layer formed outside the display area by the first hole may be prevented from diffusing into the display area.

a second substrate disposed on the second electrode in this embodiment; and a sealant formed between the first substrate and the second substrate and bonding the first substrate and the second substrate.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

According to one aspect of the present invention, the lifespan and reliability of the organic light emitting diode display may be improved by preventing pixel shrinkage.

1 is a plan view schematically illustrating a part of an organic light emitting diode display according to an exemplary embodiment.
FIG. 2 is a cross-sectional view taken along line II-II′ of the organic light emitting diode display of FIG. 1 .
3 is a plan view of a portion P1 of FIG. 2 .

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted. .

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility that one or more other features or components will be added is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a schematic plan view illustrating an organic light emitting display device 1 according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II' of the organic light emitting display device 1 of FIG. 1 . And, FIG. 3 is a plan view of a portion P1 of FIG. 2 .

1 to 2 , in the organic light emitting diode display 1 according to an exemplary embodiment of the present invention, a first substrate 101 , an insulating layer 20 formed on the first substrate 101 , and insulation The signal wiring 300 formed on the layer 20 , the organic light emitting diode OLED defining the display area AA on the first substrate 101 , and the passivation layer 208 formed on the insulating layer 20 . and a metal layer 400 formed on the passivation layer 208 outside the display area AA.

The first substrate 101 may be a flexible substrate, and may be made of plastic having excellent heat resistance and durability. However, the present invention is not limited thereto, and the first substrate 101 may be made of various materials such as metal or glass.

The organic light emitting diode OLED defines an active area AA on the first substrate 101 and is electrically connected to the thin film transistor TFT. Meanwhile, the pad unit 10 is disposed around the display area AA to transmit an electrical signal from a power supply device (not shown) or a signal generator (not shown) to the display area AA.

Hereinafter, the internal structure will be described in more detail with reference to FIG. 2 .

An insulating layer 20 may be formed on the first substrate 101 . The insulating layer 20 may include a buffer layer 201 , a gate insulating layer 203 , and an interlayer insulating layer 205 .

A buffer layer 201 may be formed directly on the first substrate 101 . The buffer layer 201 may be formed on the entire surface of the first substrate 101 , that is, both of the display area AA and the outside of the display area AA. The buffer layer 201 prevents penetration of impurity elements through the first substrate 101 and provides a flat surface on the first substrate 101 , and may be formed of various materials capable of performing this role.

A thin film transistor (TFT) may be formed on the buffer layer 201 . The thin film transistor TFT may include an active layer 202 , a gate electrode 204 , a source electrode 206 , and a drain electrode 207 .

The active layer 202 may be formed of an inorganic semiconductor such as amorphous silicon or polysilicon, an organic semiconductor, or an oxide semiconductor and includes a source region, a drain region, and a channel region.

A gate insulating layer 203 is formed on the active layer 202 . The gate insulating layer 203 may be formed to correspond to the entire first substrate 101 . That is, the gate insulating layer 203 may be formed to correspond to both the display area AA and the periphery of the display area AA on the first substrate 101 . The gate insulating layer 203 is used to insulate the active layer 202 and the gate electrode 204 and may be formed of an organic material or an inorganic material such as SiNx or SiO2.

A gate electrode 204 is formed on the gate insulating film 203 . The gate electrode 204 may contain Au, Ag, Cu, Ni, Pt, Pd, Al, Mo, and may include an alloy such as Al:Nd, Mo:W alloy, etc., but is not limited thereto, and design conditions are Considering that, it can be formed of various materials.

An interlayer insulating film 205 is formed on the gate electrode 204 . The interlayer insulating layer 205 may be formed to correspond to the entire surface of the first substrate 101 . That is, it may be formed to correspond to both the display area AA and the periphery of the display area AA.

The interlayer insulating film 205 is disposed between the gate electrode 204 and the source electrode 206 and between the gate electrode 204 and the drain electrode 207 to insulate them, and may be formed of an inorganic material such as SiNx or SiO2. can

The signal wiring 300 may be formed on the insulating layer 20 . The signal wiring 300 may be formed on the interlayer insulating layer 205 . The signal wiring 300 may be formed outside the display area AA. The signal wire 300 may be electrically connected to the second electrode 215 to supply a signal to the second electrode 215 . The signal line 300 may be a cathode power line ELVSS. When the signal wiring 300 is the cathode power line ELVSS, the cathode power line ELVSS may be connected to a cathode power having a voltage lower than the common power voltage, for example, a ground voltage or a negative voltage. The signal wiring 300 may be formed of the same material as the source electrode 206 or the drain electrode 207 in the same process.

A source electrode 206 and a drain electrode 207 are formed on the interlayer insulating film 205 . Specifically, the interlayer insulating film 205 and the gate insulating film 203 are formed to expose the source region and the drain region of the active layer 202, and the source electrode ( 206 and a drain electrode 207 are formed.

On the other hand, FIG. 2 illustrates a top gate type thin film transistor (TFT) sequentially including an active layer 202, a gate electrode 204, and source and drain electrodes 206 and 207, but the present invention does not provide for this. The present invention is not limited thereto, and the gate electrode 204 may be disposed under the active layer 202 .

The thin film transistor TFT is electrically connected to the organic light emitting device OLED to drive the organic light emitting device OLED, and is covered and protected by the passivation layer 208 .

The passivation layer 208 may use an organic insulating film. Impurities may be generated in the passivation layer 208 . Impurities may be residual moisture generated during the process.

The passivation layer 208 may be formed on the insulating layer 20 . The passivation layer 208 may be formed on the interlayer insulating layer 205 . The passivation layer 208 may cover a portion of the signal line 300 .

A first hole H1 may be formed in the passivation layer 200 . The first hole H1 may be formed outside the display area AA. The first hole H1 may be formed in a valley shape. As the first hole H1 is formed, impurities generated in the passivation layer 208 formed outside the first hole H1 or the passivation layer 208 formed outside the display area AA are transferred into the display area AA. can be prevented from becoming Accordingly, the lifetime and reliability of the organic light emitting diode display may be improved by preventing pixel shrinkage.

A metal layer 400 may be formed on the passivation layer 208 . The metal layer 400 may contact the second electrode 215 . The metal layer 400 may contact the signal wiring 300 . When the metal layer 400 contacts the signal line 300 , the second electrode 215 and the signal line 300 may be electrically connected. The metal layer 400 may be formed of the same material as the first electrode in the same process.

The metal layer 400 may contact the insulating layer 20 through the first hole H1 . The metal layer 400 may contact the interlayer insulating layer 205 through the first hole H1 . Accordingly, the passivation layer 208 may have a shape that is completely spaced apart with the first hole H1 therebetween.

A second hole H2 may be formed in the metal layer 400 . The second hole H2 may be formed outside the second electrode 215 . A plurality of second holes H2 may be formed. The impurity generated in the passivation layer 208 under the metal layer 400 by the second hole H2 is allowed to escape through the second hole H2 to prevent the impurity from being transferred into the display area AA. can Accordingly, the lifetime and reliability of the organic light emitting diode display may be improved by preventing pixel shrinkage.

An organic light emitting device (OLED) is formed on the passivation layer 208 , and the organic light emitting device (OLED) may include a first electrode 211 , an intermediate layer 214 , and a second electrode 215 .

The first electrode 211 is formed on the passivation layer 208 . More specifically, the passivation layer 208 may be formed to expose a predetermined region without covering the entire drain electrode 207 , and the first electrode 211 may be formed to be connected to the exposed drain electrode 207 . .

In this embodiment, the first electrode 211 may be a reflective electrode.

The second electrode 215 disposed to face the first electrode 211 may be a transparent or semi-transparent electrode.

Accordingly, the second electrode 215 may transmit light emitted from the organic emission layer included in the intermediate layer 214 . That is, light emitted from the organic light emitting layer may be reflected by the first electrode 211 configured as a direct or reflective electrode, and may be emitted toward the second electrode 215 .

However, the organic light emitting diode display 1 of the present exemplary embodiment is not limited to a top emission type, and may be a bottom emission type in which light emitted from the organic emission layer is emitted toward the first substrate 101 . In this case, the first electrode 211 may be configured as a transparent or translucent electrode, and the second electrode 215 may be configured as a reflective electrode. Also, the organic light emitting diode display 1 according to the present exemplary embodiment may be a double-sided emission type that emits light in both front and rear directions.

Meanwhile, a pixel defining layer 213 is formed of an insulating material on the first electrode 211 .

The pixel defining layer 213 may cover a portion of the metal layer 400 . The pixel defining layer 213 may cover a portion of the first electrode 211 . The first hole H1 formed in the passivation layer 208 may be formed outside the pixel defining layer 213 . The pixel defining layer 213 may contact the passivation layer 208 underneath. However, the pixel defining layer 213 may contact the passivation layer 208 formed inside the first hole H1 . Accordingly, impurities generated in the passivation layer 208 formed outside the first hole H1 may be prevented from flowing into the display area A through the pixel defining layer 213 .

The second electrode 215 may be electrically connected to the signal wire 300 through the metal layer 400 .

The pixel defining layer 213 exposes a predetermined region of the first electrode 211 , and the intermediate layer 214 is positioned in the exposed region.

The intermediate layer 214 includes an organic light emitting layer. As another optional example, the intermediate layer includes an organic emission layer, in addition to a hole injection layer (HIL), a hole transport layer, an electron transport layer and an electron injection layer. It may further include at least one of (electron injection layer). The present embodiment is not limited thereto, and the intermediate layer 214 includes an organic light emitting layer and may further include various other functional layers.

The embedded circuit unit 600 may be formed under the passivation layer 208 . The built-in circuit unit 600 may be formed outside the display area AA. The built-in circuit unit 600 may be formed of a plurality of thin film transistors (TFTs).

The second substrate 102 is disposed on the second electrode 215 . The second substrate 102 may be a flexible substrate and may be made of plastic having excellent heat resistance and durability. However, the present invention is not limited thereto, and the second substrate 102 may be made of various materials such as metal or glass.

The sealant 500 is provided between the first substrate 101 and the second substrate 102 . The sealant 500 may be formed on the insulating layer 20 . The sealant 500 bonds the first substrate 101 and the second substrate 102 to each other. The sealant 500 may be formed outside the display area AA. The sealant 500 may include a frit. The sealant 500 may serve as a main blocking layer that prevents deformation of the organic material of the organic light emitting diode (OLED) from impurities such as external oxygen and moisture.

Hereinafter, the first hole H1 and the second hole H2 will be described in more detail with reference to FIG. 3 .

Referring to FIG. 3 , a metal layer 400 may be formed on the passivation layer 208 . A second hole H2 may be formed in the metal layer 400 . The second hole H2 may be formed outside the end line CE of the second electrode 215 . A plurality of second holes H2 may be formed. As the second hole H2 is formed, impurities generated in the passivation layer 208 may escape through the second hole H2 . Accordingly, impurities may be prevented from flowing into the display area AA, thereby improving the lifespan of the organic light emitting device.

A first hole H1 may be formed in the passivation layer 208 . The first hole H1 may be formed in a valley shape. As the first hole H1 is formed, it may have a structure in which the passivation layer 208 is spaced apart, and by this spaced structure, foreign substances generated in the passivation layer 208 outside the first hole H1 are defined as pixels. By preventing the film 213 from penetrating into the organic light emitting diode (OLED), the lifespan of the organic light emitting device may be improved. In addition, as the metal layer 400 and the insulating layer 20 come into contact with each other by the first hole H1 , the passivation layer 208 may have a more completely spaced apart structure.

As described above, the present invention has been described with reference to one embodiment shown in the drawings, but it will be understood that various modifications and variations of the embodiments are possible therefrom by those of ordinary skill in the art. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

101: first substrate AA: display area
20: insulating layer OLED: organic light emitting device
102: second substrate 300: signal wiring
400: metal layer 500: sealant

Claims (15)

Board;
a first insulating layer positioned on the substrate;
a signal line positioned on the first insulating layer;
a second insulating layer disposed on the substrate and including a first hole and separated by the first hole;
an organic light emitting device positioned on the second insulating layer, defining a display area, and including a first electrode, a second electrode, and an intermediate layer positioned between the first electrode and the second electrode;
a conductive layer on a second insulating layer outside the display area;
a third insulating layer covering a portion of the first electrode; and
a circuit part positioned below the second insulating layer and outside the display area and including a plurality of thin film transistors;
and the second electrode extends outside the first hole, is directly disposed on the conductive layer, and does not overlap the signal line. According to claim 1,
and the first hole and the second electrode overlap in a plan view. According to claim 1,
and the first hole and the conductive layer overlap in a plan view. According to claim 1,
and the first hole, the second electrode, and the conductive layer overlap in a plan view. According to claim 1,
and the first hole is located in the second insulating layer outside the display area. According to claim 1,
and the conductive layer includes the same material as the first electrode. According to claim 1,
and the second electrode and the conductive layer are in direct contact with the first hole. According to claim 1,
and the conductive layer overlaps the signal wiring in a plan view. According to claim 1,
The conductive layer includes a plurality of second holes. 10. The method of claim 9,
The plurality of second holes is disposed along an end of the second electrode. 10. The method of claim 9,
and the plurality of second holes are spaced apart from each other. According to claim 1,
and an end of the third insulating layer is closer to the display area than an end of the second electrode. According to claim 1,
The signal line is a power line electrically connected to the second electrode to supply a signal to the second electrode. According to claim 1,
The signal line directly contacts the conductive layer, and the conductive layer directly contacts the second electrode. Board;
a first insulating layer positioned on the substrate;
a signal line positioned on the first insulating layer;
a second insulating layer disposed on the substrate and including a first hole and separated by the first hole;
an organic light emitting device positioned on the second insulating layer, defining a display area, and including a first electrode, a second electrode, and an intermediate layer positioned between the first electrode and the second electrode;
a conductive layer positioned on a second insulating layer outside the display area and in contact with the first insulating layer in the first hole;
a third insulating layer covering a portion of the first electrode; and
a circuit part positioned below the second insulating layer and outside the display area, the circuit part including a plurality of thin film transistors;
and the second electrode extends outside the first hole and is directly disposed on the conductive layer and does not overlap the signal line.

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