KR102354104B1 - Light source module and method of replacing light source using the same - Google Patents

Abstract

Disclosed is a light source module. The light source module of the present invention comprises: an integral light source unit coupled with at least one lead frame in a longitudinal direction including a plurality of LEDs including a self-radiating structure; a light arrangement setting unit coupled with at least one integral light source unit and including an opening unit corresponding to an area of the integral light source unit on a location corresponding to the integral light source unit; and a socket insertion unit formed to be coupled to correspond to a socket size of a pre-installed lighting device.

Description

Light source module and method of replacing light source using the same}

The present invention relates to a light source module and a light source replacement method using the same.

Mercury lamps, sodium lamps, and metal halide lamps have been mainly used for street lamps installed on roadside or residential streets. Conventional street lamps are generally operated by emitting cool light by high-pressure discharge, and the problem of heat dissipation is not significant. However, since it is not eco-friendly due to its short lifespan and low energy efficiency, an alternative technology to a light source using an LED (Light Emitting Diode) is being actively studied recently.

Lighting using an LED (Light Emitting Diode) is increasingly being used because it is superior to conventional incandescent or fluorescent lamps in terms of lifespan and power consumption.

The LED can be used in combination as a component of a mechanism called a lead frame. The lead frame refers to a metal substrate that serves as a frame for fixing a semiconductor chip such as an LED and a circuit to a wire connecting the circuit and the semiconductor chips to the substrate.

On the other hand, LEDs need to dissipate heat smoothly due to their heat-generating characteristics, and generally, a metal structure called a heat sink is used. The heat sink has a structure including a contact portion that receives heat from the LED and a heat dissipation portion that dissipates heat into the air by constituting a large surface area. The conventional structure of the heat sink has brought spatial restrictions to the installation and utilization of the LED. For example, if an LED is installed on the front substrate, it is structurally difficult to install another semiconductor substrate directly behind the LED substrate because most of the method is to install a heat sink on the rear substrate.

In order to improve this problem, the applicant has provided an invention in which the heat dissipation structure is remarkably improved by performing heat dissipation in the structure of the lead frame itself as Patent Registration No. 1340029.

Furthermore, the applicant came to develop the present invention in consideration of the cost burden of replacing the entire street lamp in order to replace the conventionally used lighting fixtures such as street lighting fixtures with LEDs.

The technical problem to be solved by the present invention is to provide a light source module and a light source replacement method using the same, which can easily replace only a light source while leaving other components as it is for a lighting lamp of a method in which a conventional light bulb is inserted and coupled with a socket.

In order to solve the above technical problem, a light source module according to an embodiment of the present invention includes: an integrated light source unit in which at least one lead frame including a plurality of LEDs including a self-heat dissipation structure is coupled in the longitudinal direction; a light arrangement setting unit to which at least one of the integrated light source units is coupled, the light arrangement setting unit including an opening corresponding to an area of the integrated light source unit at a position corresponding to the integrated light source unit; and a socket insertion unit formed to be coupled to the socket standard of an installed lighting device; but, the integrated light source unit may determine at least one of a coupling angle and a coupling portion to the light arrangement setting unit according to a predetermined light irradiation direction. have.

In one embodiment of the present invention, at least two or more of the integrated light source unit is coupled to the light arrangement setting unit, and some of the integrated light source units are coupled to face the same direction as the upper surface of the light arrangement setting unit, and among the integrated light source units The other part may be coupled to face the opposite direction to the light arrangement setting unit.

In an embodiment of the present invention, at least two or more of the integrated light source unit is coupled to the light arrangement setting unit, and some of the integrated light source units are coupled to face between the upper surface and one direction of the light arrangement setting unit, and the integrated light source unit The other part may be coupled to face between the upper surface of the light arrangement setting unit and the other side direction.

In an embodiment of the present invention, the socket inserting unit includes: a fastening unit including a coupling shape corresponding to the socket standard of a pre-installed lighting device; a body part connected to and supported by the fastening part at one end; and an insertion support portion rotatably coupled to the other end of the body portion and including a plurality of insertion holes, wherein the optical arrangement setting unit is inserted into and coupled to at least two insertion holes among the plurality of insertion holes formed in the insertion support portion. can

In an embodiment of the present invention, the socket inserting unit includes: a fastening unit including a coupling shape corresponding to the socket standard of a pre-installed lighting device; a body part connected to and supported by the fastening part at one end; and an insertion support portion coupled to the other end of the body portion and including a plurality of insertion holes, wherein the insertion support portion includes: a plurality of coupling auxiliary portions having fastening holes formed therein; a plurality of insertion auxiliary parts respectively formed adjacently between the coupling auxiliary parts, wherein the insertion hole is formed between the coupling auxiliary part and the insertion auxiliary part, and the optical arrangement setting part is inserted into the two insertion holes and the coupling It can be coupled by an auxiliary part.

In order to solve the above technical problem, a method for replacing a light source using the light source module according to an embodiment of the present invention includes: preparing the light source module in a state in which a light arrangement setting unit and a socket insertion unit are separated; coupling the socket insert to a socket of a pre-installed lighting device; and coupling the light arrangement setting unit to the socket insertion unit.

The present invention has the effect of being able to simply replace only the light source while leaving other components as it is with respect to the lighting lamp of the method of inserting and combining a conventionally used light bulb by socket insertion.

1 shows a light source module according to an embodiment of the present invention.
2 is an exploded view of the light source module of FIG. 1 according to an embodiment of the present invention.
3 shows a light source module according to an embodiment of the present invention.
4 is a view of the light source module of FIG. 3 from another angle according to an embodiment of the present invention.
5 shows a light source module according to an embodiment of the present invention.
6 is a view showing the coupling of the light source module according to an embodiment of the present invention to a wall lamp.
7 shows a light source module in which a coupling angle is gradually changed.
8 shows a method of replacing a light source using a light source module according to an embodiment of the present invention.
9 is a perspective view of a lead frame according to an embodiment of the present invention.
10 is a plan view of a leadframe according to an embodiment of the present invention.
11 is a bottom view of a leadframe according to an embodiment of the present invention.
12 is a side view and an enlarged side view of a lead frame according to an embodiment of the present invention.
13 shows a state in which electrodes are arranged in series according to an embodiment of the present invention.
14 shows a state in which electrodes are arranged in parallel according to an embodiment of the present invention.
15 shows the heat dissipation characteristics of the lead frame of the prior art and the present invention.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 shows a light source module 100 according to an embodiment of the present invention.

2 is an exploded view of the light source module 100 of FIG. 1 according to an embodiment of the present invention.

1 and 2 , the light source module 100 according to an embodiment of the present invention includes an integrated light source unit 110 , a light arrangement setting unit 120 , and a socket insertion unit 130 .

The integrated light source unit 110 is one in which at least one lead frame including a self-heating structure is coupled in the longitudinal direction. The unit lead frame constituting the integrated light source unit 110 will be described later. In an embodiment of the present invention, the integrated light source unit 110 in which three lead frames are continuously coupled in the longitudinal direction will be exemplified.

The light arrangement setting unit 120 may be formed in a thin rectangular plate shape.

The light arrangement setting unit 120 may be coupled to the socket insertion unit 130 while supporting the position of the integrated light source unit 110 .

In the light arrangement setting unit 120 , a plurality of integrated light source units 110 may be coupled, and the light irradiation direction may be set differently according to a coupling angle and a coupling site.

In the light arrangement setting unit 120 , a plurality of integrated light source units 110 may be coupled, and the light irradiation direction may be set differently according to a coupling angle and a coupling site. Having a coupling angle means that the integrated light source unit 110 is coupled while being inclined rather than parallel to the surface of the light arrangement setting unit 120 . The different coupling sites may mean that the integrated light source unit 110 is turned over and coupled.

Examples in which different binding sites are coupled are shown in FIGS. 3 and 4 , and examples in which binding angles are different are shown in FIGS. 5 and 7 .

A plurality of openings 122 are formed inside the light arrangement setting unit 120 .

The opening 122 is a through hole formed in a direction penetrating the surface of the light arrangement setting unit 120 corresponding to the shape of the unit lead frame constituting the integrated light source unit 110 . The opening 122 may be formed to have a size corresponding to the area of the lead frame, respectively.

1 and 2, 18 openings 122 are formed.

The opening 122 is formed so that heat radiation from the lead frame constituting the integrated light source unit 110 can be smoothly performed not only in the upper surface direction of the integrated light source unit 110 but also in the lower surface direction.

The first electrode unit 124 and the second electrode unit 126 are formed at both ends of the integrated light source unit 110 to mediate electrical connection with the integrated light source unit 110 .

The first electrode unit 124 and the second electrode unit 126 are electrically connected to the electrode connection unit 128 formed at one end of the light arrangement setting unit 120 , respectively.

The electrode connection unit 128 is formed at one end of the light arrangement setting unit 120 , and the distance between the two electrode connection units 128 may be formed to be smaller than the outer diameter of the insertion support unit 133 .

A fastening hole 129 for screw coupling may be formed at one end of the light arrangement setting unit 120 .

The socket insertion part 130 may include a fastening part 131 , a body part 132 , and an insertion support part 133 .

The fastening part 131 is formed of a screw thread and may include an electrode formed at an end thereof.

The body 132 has one end connected to the fastening part 131 and supports the fastening part 131 .

The other end of the body part 132 is connected to the insertion support part 133 to mediate the connection between the fastening part 131 and the insertion support part 133 .

The insertion support part 133 may extend from the body part 132 and may have a partially hollow cylindrical shape.

The insertion support part 133 may be fixedly coupled to the body part 132 . The insertion support 133 may be coupled to the body 132 and rotatably coupled to the body 132 .

A plurality of insertion holes 138 into which the light arrangement setting unit 120 can be inserted may be formed in the insertion support unit 133 .

The insertion support portion 133 may include a coupling auxiliary portion 134 and an insertion auxiliary portion 136 formed adjacent to both sides of the insertion hole 138 .

The auxiliary coupling portion 134 is formed along a slightly longer perimeter than the auxiliary coupling portion 134 and may be formed in four each at intervals of 90 degrees along the circumference.

A fastening hole 139 for screw coupling may be formed in the coupling auxiliary part 134 .

The coupling auxiliary portion 134 may be disposed adjacent to both sides of the insertion auxiliary portion 136, respectively.

The insertion auxiliary part 136 is formed along a perimeter slightly shorter than the coupling auxiliary part 134, and four may be formed at intervals of 90 degrees along the circumference.

The insertion auxiliary part 136 may be disposed adjacent to both sides of the coupling auxiliary part 134 , respectively.

The insertion auxiliary part 136 may include a protrusion 137 formed toward the outside in a substantially hook shape at the distal end.

Although not shown in the drawings, the protrusion 137 may be inserted into a groove formed inside the connection medium formed so that the inner circumferential surface is in contact with the outer circumferential surface of the insertion auxiliary part 136 to support the coupling. The connection medium may be manufactured for various purposes, such as changing the fixed angle and changing the standard.

The insertion auxiliary portion 136, the coupling auxiliary portion 134 and the insertion hole 138 are composed of a plurality of light arrangement relatively freely regardless of the angle finally inserted when the socket insertion portion 130 is inserted into the socket of the lighting device. This is to set the angle at which the setting unit 120 is disposed.

The user may insert the light arrangement setting unit 120 by selecting any two points among the plurality of insertion holes 138 .

However, according to a preferred embodiment of the present invention, as shown in FIG. 1 , one coupling auxiliary unit 134 and two insertion auxiliary units 136 are disposed above the light arrangement setting unit 120 , and the light arrangement setting unit 120 is disposed. ), the insertion position of the optical arrangement setting unit 120 can be determined so that the three coupling auxiliary parts 134 and the two insertion auxiliary parts 136 can be arranged below.

When the light arrangement setting unit 120 is inserted in this way, the fastening hole 139 formed in the coupling auxiliary unit 134 and the fastening hole 129 formed in the light arrangement setting unit 120 are overlapped, and the socket insertion unit 130 through them. and the light arrangement setting unit 120 may be screwed together.

The coupling method of the socket insertion unit 130 and the light arrangement setting unit 120 is not necessarily limited by the above embodiment. For example, by inserting or attaching a magnet to at least one of the coupling auxiliary unit 134 and the insertion auxiliary unit 136 , respectively, the end of the optical arrangement setting unit 120 is inserted into the insertion hole 138 . If the metal is formed, it can be fastened and separated by magnetic force.

As described above, in the light source module 100 according to an embodiment of the present invention, after inserting the socket insertion unit 130 only into the socket of the pre-installed lighting device, and then combining the light arrangement setting unit 120, the replacement of the light source is completed. can be Therefore, there is an effect that only the light source can be replaced with the LED light source while using the conventional lighting equipment as it is. In addition, since the lead frame applied to the present invention has its own heat dissipation function, the size of the light arrangement setting unit 120 can be set very freely, so that the light source can be replaced regardless of the size of the conventionally installed lighting equipment. there is

Another advantageous effect of the present invention is that the irradiation direction of the light source can be freely set according to the method of combining the light arrangement setting unit 120 and the integrated light source unit 110 . This effect will be described with reference to FIGS. 3 to 5 .

3 shows a light source module 100 according to an embodiment of the present invention.

4 is a view of the light source module 100 of FIG. 3 from another angle according to an embodiment of the present invention.

3 and 4, the light source module 100 according to an embodiment of the present invention includes a first integrated fluorescent light source unit 112, a second integrated fluorescent light source unit 114, a light arrangement setting unit 120, and a socket insertion unit. (130). However, since the light arrangement setting unit 120 and the socket insertion unit 130 are the same as those described above, they will be omitted.

The first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 include at least one lead frame including a self-heating structure coupled in the longitudinal direction. A unit lead frame constituting the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 will be described later. In an embodiment of the present invention, the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 will be exemplified in a form in which three lead frames are sequentially coupled in the longitudinal direction.

The first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 are coupled to the opening 122 formed in the light arrangement setting unit 120 (to be precise, the light arrangement setting unit 120 corresponding to the position of the opening 122) ) is coupled to at least a portion of the inner peripheral surface), the first integrated fluorescent light source unit 112 is coupled so that light is irradiated toward the top, and the second integrated fluorescent light source unit 114 is turned over so that light is irradiated toward the bottom.

By disposing the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 in this way, the light source module 100 capable of irradiating light directly from both sides can be configured.

The light source module 100 may be installed on a wall lamp irradiating light in the vertical direction. 6 is a view showing a form in which the light source module 100 shown in FIGS. 3 and 4 is coupled to the inside of the wall lamp to irradiate light in the vertical direction.

The light source module 100 according to an embodiment of the present invention may be coupled to the socket unit 200, and may receive power from the power supply unit 210 to irradiate the LED light in the vertical direction.

The cover 300 may include a transmissive part 310 that surrounds the exterior of the wall lamp and emits the irradiated light.

The transmission part 310 is configured to be transparent or open so that the irradiated light can advance.

6 shows that the direction perpendicular to the plane of the light arrangement setting unit 120 is the light irradiation direction, the direction perpendicular to the plane of the light arrangement setting unit 120 may be arranged to face the front. In this case, the thickness of the wall lamp can be configured to be very thin, so that it can be reduced by the thickness of the socket. If the socket can be made thin, it will be possible to reduce the thickness of the wall lamp to less than 2cm. On the other hand, in this arrangement, each integrated light source unit 110 is vertically coupled to the light arrangement setting unit 120 (it may be coupled to have a specific angle) so that the light irradiation direction can be set to be the transmission direction.

A form in which the integrated light source unit 110 is inclined and coupled with respect to the light arrangement setting unit 120 will be described with reference to FIG. 5 .

5 shows a light source module 100 according to an embodiment of the present invention.

Referring to FIG. 5 , the light source module 100 according to an embodiment of the present invention includes a first integrated fluorescent light source unit 112 , a second integrated fluorescent light source unit 114 , a light arrangement setting unit 120 , and a socket insertion unit 130 . includes However, since the light arrangement setting unit 120 and the socket insertion unit 130 are the same as those described above, they will be omitted.

The first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 include at least one lead frame including a self-heating structure coupled in the longitudinal direction. A unit lead frame constituting the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 will be described later. In an embodiment of the present invention, the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 will be exemplified in a form in which three lead frames are sequentially coupled in the longitudinal direction.

The first integrated fluorescent light source unit 112 is coupled to the open portion 122 formed of the light arrangement setting unit 120 , but the first integrated fluorescent light source unit 112 is inclined in the lateral direction of the light arrangement setting unit 120 and is coupled. . Accordingly, the light irradiation direction is inclined by about 45 degrees in the lateral direction from the direction perpendicular to the plane direction.

The second integrated fluorescent light source unit 114 is coupled to a portion to which the second integrated fluorescent light source unit 114 is not coupled among the open portions 122 formed in the light arrangement setting unit 120, but the second integrated fluorescent light source unit 114 is configured to set the light arrangement The portion 120 is coupled at an angle in the lateral direction. Accordingly, the light irradiation direction is inclined by about 45 degrees from the direction perpendicular to the plane direction to the lateral direction (the second integrated light source unit 114 is inclined in the opposite direction to the direction in which the first integrated light source unit 112 is tilted). will lose

By disposing the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 in this way, the light source module 100 for irradiating light that spreads about 45 degrees to both sides can be configured. Since the light source module 100 according to an embodiment of the present invention excludes light irradiated in an unwanted direction as much as possible, there is an effect of minimizing energy loss due to reflection or the like.

The above-described inclination angles of the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 may be set to be gradually changed.

7 is a view showing a partial configuration of the light source module 100 according to an embodiment of the present invention as viewed from the front.

Referring to FIG. 7 , it can be seen that the angles of the plurality of first integrated fluorescent light source units 112 are increased from the inside to the outside. In FIG. 7 , the first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 are each shown to be six. The increased angle is an angle in a direction perpendicular to the plane direction from a direction toward the left from the center of the light arrangement setting unit 120 . The angle can be increased to 45 degrees.

The first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114, which are not parallel to the surface of the light arrangement setting unit 120 and are inclinedly coupled, may be coupled to one side of the open unit 122 by giving a certain angle. , bonding by soldering may be performed.

The first integrated fluorescent light source unit 112 and the second integrated fluorescent light source unit 114 and the first electrode unit 124 and the second electrode unit 126 may be coupled by soldering or welding. have.

The light source module 100 according to an embodiment of the present invention may be used in a light source replacement method using the light source module 100 .

8 shows a light source replacement method using the light source module 100 according to an embodiment of the present invention. The light source replacement method using the light source module 100 according to an embodiment of the present invention can be applied to a lighting host having a socket to which the socket insertion unit 130 of the light source module 100 can be coupled among pre-installed lighting fixtures. have. Of course, in the light source module 100 according to an embodiment of the present invention, it is preferable to manufacture the socket inserting unit 130 in accordance with the socket standard of the pre-installed lighting equipment.

Referring to FIG. 8 , the light source module 100 is prepared in step S801. The light source module 100 may be the light source module 100 according to any one of the above-described embodiments of the present invention.

Meanwhile, the light source module 100 may be prepared in a state in which the light arrangement setting unit 120 and the socket insertion unit 130 are disassembled as shown in FIG. 2 .

In step S803, the socket insertion unit 130 of the light source module 100 is coupled to the socket of the lighting device. This operation simply rotates the socket and inserts it into the socket.

In step S805 , the light arrangement setting unit 120 of the light source module 100 is coupled to the socket insertion unit 130 .

In step S807 , a terminal is connected to the light source module 100 . The terminal may be a power supply terminal provided in advance in the lighting device, and the terminal may be connected to the electrode connection unit 128 provided in the light arrangement setting unit 120 . The connection method can be connected by selecting any one of the conventionally used methods such as solder bonding and bonding using metal tongs.

If the ballast is installed in the pre-installed lighting equipment, it may further include the step of removing the ballast and installing a converter (converter) for the LED. These two steps may be performed before or after connection of the terminals.

9 to 11 show a lead frame constituting an integrated light source unit according to an embodiment of the present invention.

9 to 11 , the leadframe according to an embodiment of the present invention has one or more positive electrodes 10 and one or more negative electrodes 20 that are spaced apart from each other (not shown in FIGS. 9 to 11 ). ; a molding part 30 sealing the anode 10 and the cathode 20; It includes terminal portions 90 and 91 disposed at respective ends of the positive electrode 10 and the negative electrode 20 .

As shown in FIGS. 9 to 10 , a chip attachment part 50 is formed on the upper part of the lead frame, that is, on the front part, so that a semiconductor chip can be attached thereto. In an embodiment of the present invention, the semiconductor chip is an LED having the above-described function. A heat dissipation hole 40 for dissipating heat is formed in an upper portion of the lead frame. In addition, as shown in FIGS. 9 to 10 , at the upper portion of the lead frame, one or more upper openings 70 and 71 exposing the anode 10 and the cathode 20 to the outside without being sealed by the molding part 30 . ) is formed. Separate fastening holes 95 and 96 are formed in the electrodes at both ends of the lead frame so that the lead frames can be connected to each other. Electrode separation holes 45 , 46 , 47 for electrically separating the positive electrode 10 and the negative electrode 20 are preferably formed in the upper portion of the lead frame.

As shown in FIG. 11 , a lower first opening 60 is formed at a position corresponding to the upper chip attaching part 50 in the lower part of the lead frame, that is, in the rear part. The lower first opening 60 is a region that is not sealed by the molding part 30 and exposes the anode 10 to the outside. The heat dissipation opening 60 is for dissipating heat generated from the semiconductor chip, and is preferably formed in a larger area than the chip attaching unit 50 so as to include all the regions corresponding to the chip attaching unit 50 . do.

In addition, a heat dissipation hole 40 formed through the molding unit 30 and the electrodes 10 and 20 from the upper portion is provided at the lower portion of the lead frame as shown in FIG. 12 .

In addition, a lower second opening 80 through which the electrodes 10 and 20 are not molded and exposed is further formed around the heat dissipation hole 40 under the lead frame. The lower first opening 60 and the lower second opening 80 together with the heat dissipation hole 60 allow heat generated from the semiconductor chip 55 to be more easily dissipated.

As shown in FIG. 11 , it is preferable that electrode separation holes 45 and 48 are formed in the lower portion of the lead frame to penetrate from the upper portion to electrically separate the positive electrode 10 and the negative electrode 20 .

Hereinafter, each component of the lead frame according to an embodiment of the present invention will be described.

Anode (10) and cathode (20)

In the present invention, one or more positive electrode 10 and negative electrode 20 may be used.

Various conductive metals may be used as the anode 10 and the cathode 20 , and the type is not particularly limited, and for example, copper, aluminum, or the like may be used. Other graphene, ceramic, etc. may also be used. Also, they may be mixed and used.

It is preferable that the anode 10 and the cathode 20 are formed of a single layer having a flat plate shape.

The positive electrode 10 and the negative electrode 20 may be fastened by various methods known in the art. The method of fastening the anode 10 and the cathode 20 is not limited, such as a screw fastening method, a male-female fastening method, etc., but is preferably made by a male and female fastening method. This is because a separate screw is not required, so the operation is much simpler and the manufacturing cost can be reduced.

Molding part (30)

The molding part 30 is an injection molding that seals the anode 10 and the cathode 20 . That is, the anode 10 and the cathode 20 are inserted into the molding part 30 .

Terminal part (90, 91)

The terminals 90 and 91 for applying power are exposed on the electrodes at both ends of the lead frame without being molded. The lead frame may conduct electricity with the outside through the terminal portions 90 and 91 . The terminal portions 90 and 91 at both ends of the lead frame have a male and female structure, so that the lead frames can be connected to each other by a male and female fastening method. It is preferable that fastening holes 95 and 96 are formed in the terminal portions 90 and 91, respectively. Since the fastening holes 95 and 96 can radiate the heat accumulated in the terminal parts 90 and 91 to the outside, these holes can also be referred to as a kind of heat dissipation hole.

heat sink (40)

9 to 12, the heat dissipation hole 40 penetrates through the upper and lower portions of the lead frame according to an embodiment of the present invention, that is, molding with at least one of the anode 10 and the cathode 20. It is formed through the portion 30 . The lead frame according to an embodiment of the present invention includes one or more heat dissipation holes 40 . Heat of the lead frame may be radiated to the outside through the heat dissipation hole 40 . In particular, since the heat dissipation hole 40 is formed through the upper and lower portions, heat can be radiated to both the upper and lower portions, thereby enhancing the heat dissipation effect.

At least one of the heat dissipation holes 40 is formed through the upper opening 71 and the lower second opening 80 (refer to FIG. 12 ). Since the heat dissipation hole 40 is formed to pass through the openings 71 and 80 , a flow of air may be formed, and heat may be emitted in both directions, thereby improving the effect of temperature improvement. For this, the heat dissipation hole 40 is preferably formed in the center of the upper opening 71 .

Electrode separation hole (45, 46, 47)

The electrode separation hole 45 for electrically separating the positive electrode and the negative electrode is formed in a portion where the positive electrode 10 and the negative electrode 20 are adjacent to each other, and at least one of the positive electrode 10 and the negative electrode 20 and the molding part 30 are formed. formed at the same time through

The size and number of the electrode separation holes 45 can be adjusted according to the purpose, such as serial arrangement and parallel arrangement. For example, by providing two or more electrode separation holes per package, it is possible to easily arrange the electrodes in series and in parallel without changing the lead frame. In addition, the diameter of the electrode separation hole 45 is not limited, but is preferably 5 mm or less. 9 shows a lead frame having three electrode separation holes as a lead frame according to an embodiment of the present invention (shown as 45, 46, and 47, respectively), but optionally having one or two electrode separation holes It can also be formed so as to have a dog.

Chip Attachment (50)

The chip attachment part 50 is connected to the semiconductor chip and serves to conduct electricity. 9 and 10 , the lead frame according to an embodiment of the present invention includes one or more chip attachment portions 50 having a larger surface area than the semiconductor chip 55 to be attached thereon. Here, the surface area of the chip attachment part 50 may be adjusted according to the heat dissipation characteristics of the semiconductor chip 55 to be attached. The surface area of the chip attachment part 50 is preferably 2.5 times or more larger than the surface area of the semiconductor chip 55 to be attached.

The chip attachment part 50 corresponds to a heat generating part as a part to which a semiconductor chip or an LED chip that generates heat is attached. In an embodiment of the present invention, by increasing the mounting area of the semiconductor chip 55, it is used as a direct heat dissipation means. More specifically, in one embodiment of the present invention, for example, by increasing the surface area of the metal electrode portion to have a high thermal conductivity and better movement of free electrons, that is, by expanding the mounting area of the semiconductor chip 55 , heat By increasing the resistance, the heat dissipation effect can be increased. Here, thermal resistance is proportional to thermal conductivity and area.

As described above, in the present invention, since the chip attaching unit 50 is a heat generating unit and a heat dissipating unit, heat can quickly escape to the outside. That is, the present invention is characterized in that the heat resistor itself is removed by integrating the heat generating unit and the heat dissipating unit.

The number of semiconductor chips 55 to be attached is not particularly limited, and this is determined in consideration of the amount of light and heat dissipation effect. In order to use the lead frame mass production equipment used in the existing package technology as it is, the number of semiconductor chips can be appropriately adjusted.

upper opening (70, 71)

As shown in Figs. 9 and 10, the lead frame according to an embodiment of the present invention is not sealed by the molding part 30 on its upper part and is one that exposes the anode 10 or the cathode 20 to the outside. The above upper openings 70 and 71 are provided. The heat dissipation effect may be improved by allowing the electrode to come into direct contact with the external atmosphere through the upper openings 70 and 71 . Conventionally, there has been a lead frame having an opening at the bottom, but the lead frame according to an embodiment of the present invention has upper openings 70 and 71 in addition to the lower opening, so that heat can be radiated in both directions. The effect has been significantly improved. When the heat generated from the semiconductor chip or LED device is transferred to the anode or cathode, the heat can be emitted not only in the downward direction but also in the upward direction, thereby maximizing the heat dissipation effect.

A heat dissipation hole 40 may be formed in one of the upper openings 71 . Through this, the heat dissipation effect can be further increased. Since the heat dissipation hole 40 is formed to pass through the opening 71 , a flow of air may be formed, and heat may be dissipated in both directions, thereby improving the effect of temperature improvement.

lower first opening 60

11 , the lead frame according to an embodiment of the present invention is not sealed by the molding unit 30 at a position corresponding to the chip attaching unit 50 at the lower portion thereof, and the anode 10 is externally provided. and at least one lower first opening 60 exposing it.

As described above, the chip attaching unit 50 corresponds to a heat generating unit that generates heat. According to an embodiment of the present invention, since the lower first opening 60 is provided at a position corresponding to the chip attaching part 50 as shown in FIGS. 10 and 11 , heat generated from the chip is transmitted through the lower first opening. It may be discharged to the lower part of the lead frame through (60). Accordingly, the lower first opening 60 also serves to increase the heat dissipation effect.

lower second opening 80

As shown in FIG. 11 , the lead frame according to an embodiment of the present invention is not sealed by the molding part 30 at a position corresponding to the upper openings 70 and 71 in the lower portion thereof, but the anode 10 and the cathode At least one lower second opening 80 exposing the 20 to the outside is provided.

The lower second opening 80 also serves to increase the heat dissipation effect by exposing the anode 10 and the cathode 20 to the outside. Since the lower second opening 80 is disposed at positions corresponding to the two upper openings 70 and 71, it is preferable to have a larger area than the upper openings 70 and 71, respectively.

Here, the area of the lower first opening 60 and the lower second opening 80 is preferably 2.5 times or more of the device.

In an embodiment of the present invention, it is preferable that the upper openings 70 and 71 and the lower openings 60 and 80 have an area sufficient to dissipate heat generated when power is applied so that they themselves can act as a heat sink. In this case, a separate heat dissipation means such as a heat sink is not required in the lead frame of the present invention.

The lead frame according to an embodiment of the present invention is modularized so that several semiconductor chips (epi diode) can be attached by connecting several electrodes to each other. Conventionally, it has been difficult to selectively implement both the series arrangement and the parallel arrangement of electrodes using a single substrate as a module without using a circuit board. However, in the lead frame according to an embodiment of the present invention, both the series and parallel arrangement of electrodes can be realized through the special lead frame processing form and precision processing, and the circuit board and the heat sink can be integrated.

Both series and parallel arrangement of electrodes can be implemented with one module. 13 shows a state in which electrodes are arranged in series in a leadframe according to an embodiment of the present invention, and FIG. 14 shows a state in which electrodes are arranged in parallel in a leadframe according to an embodiment of the present invention. In the present invention, by adding an electrode separation hole and specializing the internal pattern, series separation and parallel separation are possible using the position of the electrode separation hole. Accordingly, there is no need to separately make a series separation circuit and a parallel separation circuit unlike the related art. Specifically, as shown in FIG. 13 , the electrode separation hole 47 is formed by cutting the portion where the positive electrode 10 and the negative electrode 20 are connected, and thereafter, two electrode separation holes 45 and 46 per one electrode. When forming , the anode and the cathode are sequentially connected to form a series circuit. Meanwhile, as shown in FIG. 14 , when one electrode separation hole 47 is formed per one electrode, the anode and the cathode are connected in parallel to each other to form a parallel circuit. As described above, in an embodiment of the present invention, a series circuit and a parallel circuit can be easily formed by adjusting the position and number of electrode separation holes.

heat dissipation characteristics

15 shows the heat dissipation characteristics of the conventional lead frame and the lead frame of the present invention.

The conventional lead frame shown on the left in FIG. 15 views a semiconductor device (chip) and the lead frame as one package, designs a printed circuit board (PCB) made of a metal or ceramic material with high thermal conductivity, and then uses the metal behind the PCB. It has a structure with a heat sink attached to it. When heat is generated in the leadframe package by applying external power, the heat is generated in the order of semiconductor chip -> leadframe -> solder -> PCB solder pad -> PCB -> TIM (Thermal Interface Material) -> heat sink moved to and released to the outside. Here, TIM refers to a material for reducing contact resistance and improving thermal conduction, such as thermal grease. As such, in the conventional lead frame, heat generated in the package may be discharged to the atmosphere through the PCB and the heat sink.

On the other hand, the lead frame according to an embodiment of the present invention shown on the right side in FIG. 15 is provided with a heat dissipation hole and openings are provided at the upper and lower portions of the lead frame, so that heat can be directly radiated to the outside. When heat is generated in the leadframe package by applying power from the outside, the heat moves in the order of semiconductor chip -> leadframe and is emitted to the outside. Specifically, heat is radiated to the upper part of the lead frame through the upper opening and the heat dissipation hole, and heat is radiated to the lower part through the first lower opening, the second lower opening, and the heat dissipation hole. This is because a portion of the anode 10 and the cathode 20 is in direct contact with the atmosphere through the opening and the heat dissipation hole. Accordingly, the lead frame of the present invention can easily dissipate heat without a PCB and a heat sink, and in particular, it is very effective in that it can dissipate heat to both the top and bottom.

In addition, in the lead frame according to an embodiment of the present invention, heat dissipation efficiency is increased by increasing the mounting area of the chip attachment part 50 , which is a portion where heat is generated the most. Therefore, the lead frame according to an aspect of the present invention has high thermal conductivity and low thermal resistance, and has excellent heat dissipation characteristics. That is, the lead frame according to an embodiment of the present invention can rapidly dissipate heat from a semiconductor device to the atmosphere by minimizing thermal resistance, improving heat transfer rate, and optimizing a heat dissipation area.

Since the lead frame according to an embodiment of the present invention serves as a heat dissipation means by itself, it is not necessary to separately provide a heat dissipation means or a heat sink, and may have excellent heat dissipation properties by itself. Accordingly, it is possible to reduce the cost and simplify the manufacturing process when manufacturing the lead frame. In addition, since it is possible to prevent deterioration and voltage drop of the semiconductor device by dissipating heat by itself without a separate heat dissipation structure such as a heat sink, reliability and efficiency can be guaranteed even for long-term use.

In addition, since the lead frame according to an embodiment of the present invention does not require a separate heat dissipation means, a PCB, etc., there is no restriction on the shape of the product, and thus various types of products can be made.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that this does not preclude the possibility of addition or existence of numbers, steps, operations, components, parts, or combinations thereof.

100: light source module
110: integrated light source unit
112: first integrated fluorescent light source unit
114: second integrated fluorescent light source unit
120: light arrangement setting unit
122: opening
124: first electrode part
126: second electrode part
128: electrode connection part
129: fastener
130: socket insert
131: fastening part
132: body
133: insertion support
134: coupling auxiliary part
136: insertion auxiliary part
137: protrusion
138: insertion hole
139: fastener
200: socket part
210: power supply
300: cover
310: transmission part

Claims (6)

delete delete delete delete An integrated light source unit to which at least one lead frame including a plurality of LEDs including a self-heating structure is coupled in the longitudinal direction;
a light arrangement setting unit to which at least one integrated light source unit is coupled, an opening corresponding to an area of the integrated light source unit at a position corresponding to the integrated light source unit, and a fastening hole formed therein; and
Including; a socket insert formed to be coupled to correspond to the socket standard of the previously installed lighting equipment;
The socket insertion part,
A fastening unit including a coupling shape corresponding to the socket standard of the pre-installed lighting fixtures;
a body part connected to and supported by the fastening part at one end; and
and an insertion support portion rotatably coupled to the other end of the body portion and including a plurality of insertion holes;
The insertion support portion,
Four coupling auxiliary parts having fastening holes formed and arranged at intervals of 90 degrees along the circumferential direction;
It includes; adjacent between the coupling auxiliary parts, four insertion auxiliary parts arranged at intervals of 90 degrees;
The insertion hole is formed between the auxiliary coupling portion and the insertion auxiliary portion,
The light arrangement setting unit is a light source module, characterized in that two insertion holes are selected and inserted among the eight insertion holes, and the fastening holes formed in the light arrangement setting unit and the fastening holes formed in the coupling auxiliary unit are overlapped side by side and screwed together.
In the method of replacing the light source using the light source module of claim 5,
preparing the light source module in a state in which the light arrangement setting unit and the socket insertion unit are separated;
coupling the socket insert to a socket of a pre-installed lighting device; and
and coupling the light arrangement setting unit to the socket insertion unit.

Images