KR102342724B1 - Substrate for optical device, optical device package, manufacturing method of substrate for optical device and manufacturing method of ptical device package - Google Patents

Abstract

The present invention relates to a substrate for an optical device, an optical device package, a method for manufacturing a substrate for an optical device, and a method for manufacturing an optical device package, and in particular, self-aligning a mounted optical device while preventing a decrease in light reflection efficiency ) to improve the mounting precision of the optical device, to a substrate for an optical device, an optical device package, a method of manufacturing a substrate for an optical device, and a method of manufacturing an optical device package.

Description

A substrate for an optical device, an optical device package, a method for manufacturing a substrate for an optical device, and a method for manufacturing an optical device package

The present invention relates to a substrate for an optical device, an optical device package, a method for manufacturing a substrate for an optical device, and a method for manufacturing an optical device package, and in particular, a substrate for an optical device that is prevented from tilting when an optical device is mounted, an optical device package, and an optical device The present invention relates to a method for manufacturing a magnetic substrate and a method for manufacturing an optical device package.

The optical device package refers to a device in which an optical device is mounted to generate light. In this case, the optical device refers to a device that generates light by receiving an electrical signal. Among these optical devices, a light emitting diode (LED) is widely used in the display field because it has higher efficiency than conventional optical devices and can generate light with high luminance. The optical device package may be manufactured by installing an optical device or the like on a substrate for an optical device. The optical device of the present specification includes an infrared LED, a visible light LED, and an ultraviolet LED.

The conventional metal substrate on which the vertical insulating layer is formed, for example, in a state in which the metal substrate and the insulating layer are alternately stacked (or formed), it can be formed by cutting it up and down by a predetermined length (width). have. As a material of the metal substrate on which the vertical insulating layer is formed, aluminum or copper having good thermal and electrical conductivity, or an alloy including one or more thereof may be used. Further, on the upper surface of the metal substrate on which the vertical insulating layer is formed, a cavity 60 having an upper and lower narrow shape formed by mechanical processing or chemical etching is formed. On the other hand, in order to improve the reflective performance or bonding performance of the light generated by the optical device, a metal plating, for example, a silver (Ag) plating layer, is formed on the main cavity wall and the upper surface of the metal substrate by an electrolytic or electroless plating method or a sputtering method, The optical element is bonded to the upper part of the silver plating layer in the cavity with an Ag epoxy adhesive.

Ag epoxy of the above structure has good electrical conductivity and bonding properties, but has relatively low thermal conductivity and generates thermal resistance in a package in which a high-power optical device is mounted. This results in shortening the lifespan of the person. Moreover, if the optical device is an ultraviolet LED that generates more heat than an optical device in the visible region, the above-described problem will be more prominent.

In order to solve this problem, the present applicant invented a manufacturing method and structure for bonding optical device chips by Au/Sn soldering as disclosed in Korean Patent No. 10-1373710 (hereinafter referred to as 'prior invention'). . The prior invention comprises the steps of: forming one or more cavities in the bottom of which grooves reaching a predetermined depth in a metal substrate electrically separated by one or more vertical insulating layers and containing one or more vertical insulating layers; shadow-masking all surfaces except for a portion of the upper portion of the metal substrate formed in each cavity; removing the oxide film formed on the partial surface that is not masked; depositing an electrode layer on each of the partial surfaces from which the oxide film has been removed; removing the shadow mask; bonding the optical device chip by soldering Au/Sn on the electrode layer; and wire bonding one electrode of the optical device positioned on one side of the metal substrate with respect to each of the vertical insulating layers to the metal substrate positioned on the other side of each of the vertical insulating layers through a wire.

However, in the case of forming a deep cavity in that the electrode layer is formed in an island shape using a shadow mask, the prior invention has a limit in forming precision in forming an island-shaped electrode layer. There is a problem in that there is a limit to improving the reflection efficiency.

As such, when mounting an optical device in a conventional optical device package, there is a problem that it is difficult to accurately mount the optical device in the correct position. The need to precisely position the mounting position of an optical device while preventing a decrease in reflection efficiency has emerged.

Korean Patent No. 10-1373710

The present invention has been devised to solve the above problem, and it is possible to induce self-alignment of the mounted optical device while preventing a decrease in light reflection efficiency to improve the mounting precision of the optical device. An object of the present invention is to provide a device package, a method for manufacturing a substrate for an optical device, and a method for manufacturing an optical device package.

A substrate for an optical device according to one aspect of the present invention includes: first and second metal members bonded to each other with a vertical insulating part interposed therebetween; a first island plating layer formed on an upper surface of the first metal member; a space region formed outside the first island plating layer to expose an upper surface of the first metal member; a first peripheral plating layer formed on an upper surface of the first metal substrate except for the first island plating layer and the space region; and a second plating layer formed on the upper surface of the second metal member.

In addition, the first island plating layer is formed in a polygonal shape, and the space region is formed between the first island plating layer and the first peripheral plating layer so that the first island plating layer and the first peripheral plating layer are not connected to each other. characterized in that

In addition, the first island plating layer, the first peripheral plating layer, and the second plating layer may be formed of the same metal.

In addition, a first peripheral plating layer, a space region, and a first island plating layer are formed on one side based on the vertical insulation portion, and a second plating layer is formed on the other side based on the vertical insulation portion, along a line crossing the vertical insulation portion , the second plating layer, the vertical insulation portion, the first peripheral plating layer, the space region, and the first island plating layer are sequentially positioned.

Meanwhile, a substrate for an optical device according to one aspect of the present invention includes: first and second metal members bonded to each other with a vertical insulating part interposed therebetween; a first island plating layer formed on an upper surface of the first metal member; a first space region formed outside the first island plating layer to expose an upper surface of the first metal member; a first peripheral plating layer formed on an upper surface of the first metal substrate except for the first island plating layer and the first space region; a second island plating layer formed on an upper surface of the second metal member; a second space region formed outside the second island plating layer to expose an upper surface of the second metal member; and a second peripheral plating layer formed on the upper surface of the second metal substrate except for the second island plating layer and the second spatial region.

In addition, the first spatial region has an inverted 'c' shape, the second spatial region has a 'c' shape, and a vertical insulating portion is positioned between the first and second spatial regions facing each other.

Meanwhile, an optical device package according to one aspect of the present invention includes: first and second metal members joined to each other by interposing a vertical insulating part therebetween; a first island plating layer formed on an upper surface of the first metal member; a space region formed outside the first island plating layer to expose an upper surface of the first metal member; and a first peripheral plating layer formed on an upper surface of the first metal substrate except for the first island plating layer and the space region; a second plating layer formed on an upper surface of the second metal substrate; solder formed on the first island plating layer; an optical element formed on the solder and having a first terminal electrically connected to the first metal member; and a wire electrically connecting the second terminal of the optical device to the second metal member.

In addition, the first and second metal members are characterized in that the solder non-affinity metal.

Meanwhile, an optical device package according to one aspect of the present invention includes: first and second metal members joined to each other by interposing a vertical insulating part therebetween; a first island plating layer formed on an upper surface of the first metal member; a first space region formed outside the first island plating layer to expose an upper surface of the first metal member; a first peripheral plating layer formed on an upper surface of the first metal substrate except for the first island plating layer and the first space region; a second island plating layer formed on an upper surface of the second metal member; a second space region formed outside the second island plating layer to expose an upper surface of the second metal member; a second peripheral plating layer formed on an upper surface of the second metal substrate except for the second island plating layer and the second spatial region; a first solder formed on the first island plating layer; a second solder formed on the second island plating layer; and an optical element in which a first terminal provided on the first solder is electrically connected to the first metal member, and a second terminal provided on the second solder is electrically connected to the second metal member; includes

According to a preferred embodiment of the present invention, it is possible to improve the mounting precision of the optical device by inducing self-alignment of the mounted optical device while preventing a decrease in light reflection efficiency.

1(a) to 1(c) are views of a substrate for an optical device on which a vertical insulating part and a cavity are formed according to a first preferred embodiment of the present invention;
2(a) to 2(c) are views showing a plating layer formed in FIGS. 1(a) to 1(c);
3(a) to 3(c) are views in which a spatial region is formed in FIGS. 2(a) to 2(c);
4(a) to 4(c) are views in which solder is formed in FIGS. 3(a) to 3(c).
Figs. 5(a) to 5(c) are views of bonding the optical elements in Figs. 4(a) to 4(c).
6(a) to 6(c) are views of a substrate for an optical device on which a vertical insulating part and a cavity are formed according to a second preferred embodiment of the present invention;
7(a) to 7(c) are views showing a plating layer formed in FIGS. 6(a) to 6(c).
8(a) to 8(c) are views in which spatial regions are formed in FIGS. 7(a) to 7(c);
9(a) to 9(c) are views in which solder is formed in FIGS. 8(a) to 8(c);
Figs. 10(a) to 10(c) are views of bonding the optical elements in Figs. 9(a) to 9(c);
In the above, FIG. (b) in each drawing is a cross-section A-A' of FIG. (a), and FIG. (c) is a plan view of FIG. (a).

The following is merely illustrative of the principles of the invention. Therefore, those skilled in the art can devise various devices that, although not explicitly described or shown herein, embody the principles of the invention and are included in the spirit and scope of the invention. Moreover, it should be understood that all conditional terms and examples listed herein are, in principle, expressly intended only for the purpose of understanding the inventive concept, and not limited to the specifically enumerated embodiments and states as such. do.

The above-described objects, features and advantages will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the invention pertains will be able to easily practice the technical idea of the invention. .

Hereinafter, a unit substrate for an optical device according to a preferred embodiment of the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings. In describing various embodiments, the same names and reference numerals will be given to components performing the same functions for convenience even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.

1 to 5 are views illustrating a method of manufacturing a substrate for an optical device and an optical device package according to a first preferred embodiment of the present invention.

As shown in FIG. 1 , first, first and second metal members 110a and 110b joined to each other are formed by interposing a vertical insulating part 130 therebetween, and upper surfaces of the first and second metal members 110a and 110b are formed. A cavity 140 formed to a predetermined depth is formed in the region including the vertical insulating portion 130 in the

In the substrate for an optical device shown in FIG. 1 , the first and second metal members 110a and 110b are bonded to each other to form the metal member 110 . That is, the first metal member 110a, the second metal member 110b positioned on the side of the first metal member 110a and coupled to the first metal member 110a, and the first metal member 110a and A vertical insulator 130 is formed at the junction of the second metal member 110b and electrically insulates the first metal member 110a and the second metal member 11b.

The first and second metal members 110a and 110b are preferably made of solder non-affinity metal, and as a preferred embodiment of the present invention, the first and second metal members 110a and 110b are made of aluminum or an aluminum alloy.

The vertical insulator 130 may be implemented with an insulating material. The vertical insulating portion 130 may be formed using an insulating liquid bonding agent. When bonding the first and second metal members 110a and 110b and the vertical insulating portion 130 using a liquid bonding agent, etc., bonding may be performed with a bonding film made of a synthetic resin interposed therebetween in order to enhance bonding strength. On the other hand, at least one surface of the first and second metal plates 110a and 110b may be anodized and bonded to each other in a state where the anodized surfaces face each other. That is, when the first and second metal members 110a and 110b are made of an aluminum (or aluminum alloy) material, at least one surface may be anodized before the bonding revolution to be included in the vertical insulating part 130 .

In the upper surface of the substrate 100 for an optical device, a cavity 140 including a groove reaching a predetermined depth is formed in the region including the vertical insulating portion 130 . The cavity 140 has a shape structure of the upper and lower narrows, the upper part is open, and the lower part is composed of a flat bottom surface (170).

The vertical insulating portion 130 is formed eccentrically from the center line of the metal member 110 toward the first metal member 110a by a predetermined distance. Accordingly, the area of the bottom surface 170 of the cavity 140 between the vertical insulating part 130 and the first metal member 110a is equal to the area of the cavity 140 between the vertical insulating part 130 and the second metal member 110b. ) is formed larger than the area of the bottom surface.

Next, a plating layer 200 is formed on the bottom surface 170 of the cavity 140 as shown in FIG. 2 using the substrate for an optical device shown in FIG. 1 .

The plating layer 200 is not formed on the upper surface of the vertical insulating part 130, but is formed on the upper surface of the first plating layer 210 and the second metal member 110b formed on the upper surface of the first metal member 110a. It is composed of two plating layers 230 . The area of the first plating layer 210 is formed to be larger than the area of the second plating layer 230 .

The first and second plating layers 210 are integrally formed by a single plating process, and are formed of the same metal. In addition, the metal material having a higher light reflectance than the first and second metal main materials 110a and 110b is preferable, and more preferably, it is formed by gold or silver plating.

Next, using the substrate for an optical device shown in FIG. 2 , as shown in FIG. 3 , the plating layer is patterned using a laser. In other words, the first plating layer 210 formed on the cavity bottom surface 170 of the first metal member 110a is patterned using a laser to expose the upper surface of the first metal member 110a. However, the first island plating layer 210a is formed on the inside of the spatial region 300 and the first peripheral plating layer 210b is formed on the outside of the spatial region 300 .

Since the first island plating layer 210a provides a mounting area in which the optical device 500 is mounted, the first island plating layer 210a has a shape corresponding to the horizontal cross-sectional shape of the optical device 500 . For example, when the horizontal cross-section of the optical device 500 has a polygonal shape, the horizontal cross-section of the first island plating layer 210a is also formed in a polygonal shape.

The area of the first plating layer 210 to which the laser is irradiated is removed to expose the upper surface of the first metal member 110a to form the spatial area 300 . The space region 300 is formed between the first island plating layer 210a and the first peripheral plating layer 210b to become a space in which the first island plating layer 210a and the first peripheral plating layer 210b are not connected to each other.

The spatial region 300 may be formed in a 'ㅁ' shape. In this case, the first island plating layer 210a and the first peripheral plating layer 210b are formed to be spaced apart from each other with the space region 300 having a 'ㅁ' shape interposed therebetween.

Referring to FIG. 3 , a first peripheral plating layer 210b, a space region 300 and a first island plating layer 210a are formed on one side of the vertical insulating part 130 as a reference, and the vertical insulating part 130 is formed on one side. A second plating layer 230 is formed on the other side as a reference. In other words, from left to right along a line crossing the vertical insulating part 130, the second plating layer 230, the vertical insulating part 130, the first peripheral plating layer 210b, the space region 300, and the first The one-island plating layers 210a are sequentially positioned.

The spatial region 300 is formed by being spaced apart from the vertical insulating part 130 by a predetermined interval (referring to FIGS. . The first island plating layer 210a is located inside the spatial region 300 , and the first peripheral plating layer 210b is on one side of the vertical insulating portion 130 (refer to FIGS. 3(a) to 3(c) ). It is located on the right side of the vertical insulator 130 ) and is formed on the cavity bottom surface 170 except for the spatial region 300 and the first island plating layer 210a.

Since the laser is not irradiated to the second plating layer 230 formed on the other side of the vertical insulating part 130 (referring to FIGS. 3(a) to (c), the left side of the vertical insulating part 130), it is shown in FIG. The second plating layer 230 as described above remains as it is. As such, the plating layer 200 remains as it is, except for the spatial region 300 among the plating layers 200 as shown in FIG. 2 . Through this, the loss of the purpose and purpose of forming the plating layer 200 on the cavity bottom surface 170 is minimized, and the reduction of light reflection efficiency through the configuration of the first peripheral plating layer 210b and the second plating layer 230 is reduced. can be prevented

A substrate for an optical device is manufactured through the process shown in FIGS. 1 to 3 .

Next, referring to FIGS. 4 and 5, referring to the manufacturing process of the optical device package on which the optical device is mounted. First, as shown in FIG. 4, the first island plating layer 210a is formed using the optical device substrate shown in FIG. Solder 400 is formed on the Then, as shown in FIG. 5 , the optical device 500 is bonded on the solder 400 .

The solder 400 may be Au-Sn solder, Sn-Ag solder, Sn-Ag-Cu solder, Sn-Zn solder, Sn-Pb solder, or Sn-Cu solder. Meanwhile, the solder 400 may be cream solder, and the solder 400 may be melted and soldered by passing through a reflow machine to preheat each section in the reflow machine. In the reflow machine, preheating, flux melting and drying inside the solder 400 is performed, and the optical element 500 is bonded and the final cooling is performed while the lead component of the solder 400 is melted in the reflow section. In the process of bonding the optical device 500 as described above, a wetting phenomenon occurs in the molten solder 400 spreading on the surface of the first island plating layer 210a. 210a) is evenly spread over the phase.

When the optical device 500 is mounted on the solder 400 , even if there is an alignment error of the optical device 500 , the wetting phenomenon also reacts with the metal layer of the optical device 500 so that the optical device 500 is formed with the first island plating layer. Since it is self-aligned to a shape corresponding to the shape of 210a, an effect of correcting an alignment error of the optical device 500 is exhibited.

On the other hand, in order to condense the light emitted from the optical device 500 and configure the optical path to be long, it is necessary to form a depth longer than the cross-sectional width of the cavity. However, when the island plating layer is formed by patterning through a photo process using a mask, the distance between the mask and the bottom surface of the cavity becomes long, which makes precise patterning difficult and the precise formation of the island plating layer difficult. For this reason, even when the island plating layer is formed, the effect of correcting the alignment error during mounting is insignificant. On the other hand, according to the configuration in which the island plating layer is formed by irradiating a laser to remove a part of the plating layer according to the preferred embodiment of the present invention, it is possible to form a precise island plating layer even when it is necessary to form a deep cavity. It is possible to exert the effect of correcting the alignment error that occurred during mounting.

In addition, even if the solder 400 overflows on the first island plating layer 210a, the configuration of the spatial region 300 prevents the solder 400 from spreading onto the first peripheral plating layer 210b. It is possible to prevent the solder 400 from being formed in a shape different from the surface shape of the first island plating layer 210a.

When the first and second metal members 110a and 110b are solder-affinity metals (eg, copper or copper alloy), when the solder 400 overflows from the first island plating layer 210a, the solder 400 ) spreads to the upper surfaces of the first and second metal members 110a and 110b, the effect of self-aligning with the cross-sectional shape of the first island plating layer 210a is not exerted. However, according to a preferred embodiment of the present invention, the first and second metal members 110a and 110b are a solder non-affinity metal (for example, aluminum or an aluminum alloy), and a space area is provided around the first island plating layer 210a. Since 300 is formed and exposed on the upper surfaces of the first and second metal members 110a and 110b, even if the solder 400 overflows on the first island plating layer 210a, the first island plating layer 210a It only spreads to the top and side surfaces of the , and does not spread to the top surfaces of the first and second metal members 110a and 110b. Accordingly, the tilted optical device 500 is self-aligned to the cross-sectional shape of the first island plating layer 210a.

In addition, since the optical device 500 is soldered on the first island plating layer 210a, the height difference between the optical device 500 and the first peripheral plating layer 210b and the second plating layer 230 is minimized, so that the optical device 500 is placed in the cavity. It becomes possible to install more closely to the bottom surface (170). Through this, the light emitted from the optical device 500 and directed toward the cavity bottom surface 170 is reflected by the first peripheral plating layer 210b and the second plating layer 230, so that not only the reflection efficiency can be improved, but also the bottom surface Since the path of the reflected light by 170 can be reduced, the efficiency of the optical device package can be improved.

Although not shown in the drawings, the optical device 500 illustrated in FIG. 5 may be an optical device having a first terminal formed on a lower portion and a second terminal formed on an upper portion. Such an optical device is electrically connected to the first metal member 110a through the first island plating layer 210a while the first terminal is soldered, and the second terminal is electrically connected to the second metal member 110b through a wire. do.

On the other hand, a substrate cover (not shown) is installed on the upper surface of the metal member 110, and the substrate cover is formed of a transparent material. .

6 to 10 are views illustrating a method of manufacturing a substrate for an optical device and an optical device package according to a second preferred embodiment of the present invention.

As shown in FIG. 6 , first and second metal members 110a and 110b joined to each other are formed by interposing the vertical insulating part 130 therebetween, and upper surfaces of the first and second metal members 110a and 110b are formed. A cavity 140 formed to a predetermined depth is formed in the region including the vertical insulating portion 130 in the

In the substrate for an optical device shown in FIG. 6 , the first and second metal members 110a and 110b are bonded to each other to form the metal member 110 . That is, the first metal member 110a, the second metal member 110b positioned on the side of the first metal member 110a and coupled to the first metal member 110a, and the first metal member 110a and A vertical insulator 130 is formed at the junction of the second metal member 110b and electrically insulates the first metal member 110a and the second metal member 11b.

The first and second metal members 110a and 110b are preferably made of solder non-affinity metal, and as a preferred embodiment of the present invention, the first and second metal members 110a and 110b are made of aluminum or an aluminum alloy.

The vertical insulator 130 may be implemented with an insulating material. The vertical insulating portion 130 may be formed using an insulating liquid bonding agent. When bonding the first and second metal members 110a and 110b and the vertical insulating portion 130 using a liquid bonding agent, etc., bonding may be performed with a bonding film made of a synthetic resin interposed therebetween in order to enhance bonding strength. On the other hand, at least one surface of the first and second metal plates 110a and 110b may be anodized and bonded to each other in a state where the anodized surfaces face each other. That is, when the first and second metal members 110a and 110b are made of an aluminum (or aluminum alloy) material, at least one surface may be anodized before the bonding revolution to be included in the vertical insulating part 130 .

In the upper surface of the substrate 100 for an optical device, a cavity 140 including a groove reaching a predetermined depth is formed in the region including the vertical insulating portion 130 . The cavity 140 has a shape structure of the upper and lower narrows, the upper part is open, and the lower part is composed of a flat bottom surface (170).

The vertical insulator 130 crosses the center of the metal member 110 . Accordingly, the area of the bottom surface 170 of the cavity 140 between the vertical insulating part 130 and the first metal member 110a is the cavity 140 between the vertical insulating part 130 and the second metal member 110b. ) is substantially equal to the area of the bottom surface of

Next, using the substrate for an optical device shown in FIG. 6 , as shown in FIG. 7 , a plating layer 200 is formed on the bottom surface 170 of the cavity 140 .

The plating layer 200 is not formed on the upper surface of the vertical insulating part 130, but is formed on the upper surface of the first plating layer 211 and the second metal member 110b formed on the upper surface of the first metal member 110a. It is composed of two plating layers 231 .

The first and second plating layers 21 and 31 are integrally formed by a single plating process, and are formed of the same metal. In addition, the metal material having a higher light reflectance than the first and second metal main materials 110a and 110b is preferable, and more preferably, it is formed by gold or silver plating.

Next, using the substrate for an optical device shown in FIG. 7 , as shown in FIG. 8 , the plating layer 200 is patterned using a laser. In other words, the plating layer 200 formed on the bottom surface 170 of the cavity of the first and second metal members 110a and 110b is patterned using a laser so that the upper surfaces of the first and second metal members 110a and 110b are formed. The first and second spatial regions 310 and 330 are respectively formed so as to be exposed, and the first island plating layer 211a is formed inside the first spatial region 310 and the second space region 310 is formed outside the first spatial region 310 . A first peripheral plating layer 211b is formed, a second island plating layer 231a is formed inside the second spatial region 330 , and a second peripheral plating layer 231b is formed outside the second spatial region 330 . ) to form.

The first island plating layer 211a and the second island plating layer 231a provide a mounting area in which the optical device 500 is mounted, and thus have a shape corresponding to the horizontal cross-sectional shape of the optical device 500 . For example, when the horizontal cross-sectional shape of the optical device 500 is a polygonal shape, the horizontal cross-sectional shape of the first island plating layer 211a and the second island plating layer 231a is formed in a polygonal shape, respectively. At this time, since the vertical insulating portion 130 exists between the first island plating layer 211a and the second island plating layer 231a, the sum of the horizontal cross-sectional areas of the first island plating layer 211a and the second island plating layer 231a is, It is formed to be smaller than the horizontal cross-section of the optical device 500 .

A space region 300 is formed in the plating layer 200 irradiated with the laser. In other words, the region of the first plating layer 210 to which the laser is irradiated is removed to expose the upper surface of the first metal member 110a to form a first spatial region 310 , and the second plating layer 230 to which the laser is irradiated is removed. ) is removed to expose the upper surface of the second metal member 110b to form a second space region 330 .

The first spatial region 310 is located on one side (the right side of the vertical insulating part 130 with reference to FIGS. 8(a) to (c)) with respect to the vertical insulating part 130, and the second spatial region 330 ) is present on the other side of the vertical insulator 130 (refer to FIGS.

The first peripheral plating layer 211b is located on one side (the right side of the vertical insulating part 130 with reference to FIGS. 8(a) to (c)) with respect to the vertical insulating part 130 and the first spatial region 310. and on the cavity bottom surface 170 except for the first island plating layer 211a. The second peripheral plating layer 231b is located on the other side of the vertical insulating part 130 (refer to FIGS. 8(a) to (c), the left side of the vertical insulating part 130) and the second spatial region 330. It is formed on the cavity bottom surface 170 except for the second island plating layer 231a.

The first space region 310 is formed between the first island plating layer 211a and the first peripheral plating layer 211b, so that the first island plating layer 211a and the first peripheral plating layer 211b are not connected to each other. do. In addition, the second space region 330 is formed between the second island plating layer 231a and the second peripheral plating layer 231b to prevent the second island plating layer 231a and the second peripheral plating layer 231b from being connected to each other. becomes this

As shown in FIG. 8 , the first spatial region 310 may be formed in an inverted 'C' shape, and the second spatial region 330 may be formed in a 'C' shape. Alternatively, the first and second spatial regions 310 and 330 may be formed in a 'ㅁ' shape, respectively.

As shown in FIG. 8 , the vertical insulator 130 is positioned directly adjacent to each other between the first spatial region 310 and the second spatial region 330 . Unlike this, a first peripheral plating layer 211b may be present on the upper surface of the first metal member 110a between the first spatial region 310 and the vertical insulating portion 130 , and may be vertically insulated from the second spatial region 330 . A second peripheral plating layer 231b may be present on the upper surface of the second metal member 110b between the portions 130 .

As such, the plating layer 200 remains as it is except for the spatial region 300 among the plating layers 200 as shown in FIG. 7 . Through this, the loss of the purpose and purpose of forming the plating layer 200 on the cavity bottom surface 170 is minimized, and the light reflection efficiency is reduced through the configuration of the first peripheral plating layer 211b and the second peripheral plating layer 231b. can be prevented.

A substrate for an optical device is manufactured through the process shown in FIGS. 6 to 8 .

Next, referring to FIGS. 9 and 10 , referring to the manufacturing process of the optical device package on which the optical device is mounted, first, the solder 400 is formed as shown in FIG. 9 using the optical device substrate shown in FIG. 8 . In other words, the first solder 410 is formed on the first island plating layer 211a and the second solder 430 is formed on the second island plating layer 231a. Then, as shown in FIG. 10 , the optical device 500 is bonded on the first and second solders 410 and 430 .

The first and second solders 410 and 430 may be Au-Sn solder, Sn-Ag solder, Sn-Ag-Cu solder, Sn-Zn solder, Sn-Pb solder, or Sn-Cu solder. Meanwhile, the first and second solders 410 and 430 may be cream solder, and the first and second solders 410 and 430 may be melted and soldered by passing through a reflow machine and preheating for each section in the reflow machine. have. In the reflow machine, preheating, flux melting and drying inside the first and second solders 410 and 430 is performed, and the optical element 500 is bonded while the lead component of the first and second solders 410 and 430 is melted in the reflow section. A final cooling takes place. In the process of bonding the optical device 500 as described above, the molten first and second solders 410 and 430 cause a wetting phenomenon that spreads on the surfaces of the first island plating layer 211a and the second island plating layer 231a. Accordingly, the first and second solders 410 and 430 are evenly spread on the first island plating layer 211a and the second island plating layer 231a.

Even if there is an alignment error of the optical device 500 when the optical device 500 is mounted on the first and second solders 410 and 430 , the wetting phenomenon also reacts with the metal layer of the optical device 500 to react with the optical device 500 . ) is self-aligned in a shape corresponding to the overall shape of the first island plating layer 211a and the second island plating layer 231a, so that the alignment error of the optical device 500 is corrected.

On the other hand, in order to condense the light emitted from the optical device 500 and configure the optical path to be long, it is necessary to form a depth longer than the cross-sectional width of the cavity. However, when the island plating layer is formed by patterning through a photo process using a mask, the distance between the mask and the bottom surface of the cavity becomes long, which makes precise patterning difficult and the precise formation of the island plating layer difficult. For this reason, even when the island plating layer is formed, the effect of correcting the alignment error during mounting is insignificant. On the other hand, according to the configuration in which the island plating layer is formed by irradiating a laser to remove a part of the plating layer according to the preferred embodiment of the present invention, it is possible to form a precise island plating layer even when it is necessary to form a deep cavity. It is possible to exert the effect of correcting the alignment error that occurred during mounting.

In addition, the configuration of the spatial region 300 prevents the first and second solders 410 and 430 from spreading onto the first and second peripheral plating layers 211b and 231b, and the vertical insulating portion 130 also has incompatibility with the solder. Therefore, the first and second solders 410 and 430 are prevented from spreading onto the vertical insulating portion 130 . Accordingly, even if the first and second solders 410 and 430 overflow on the first and second island plating layers 211a and 231a, the first and second solders 410 and 430 are formed on the first and second island plating layers 211a and 231a. It becomes possible to prevent formation of a shape different from the surface shape.

When the first and second metal members 110a and 110b are solder-affinity metals (eg, copper or copper alloy), the first and second solders 410 and 430 overflow from the first and second island plating layers 211a and 231a. When overflowed, the first and second solders 410 and 430 spread to the upper surfaces of the first and second metal members 110a and 110b, so that the first and second island plating layers 211a and 231a are self-aligned ( The self-aligning effect will not be properly exhibited. However, according to a preferred embodiment of the present invention, the first and second metal members 110a and 110b are solder non-affinity metals (for example, aluminum or aluminum alloy), and the periphery of the first and second island plating layers 211a and 231a Since the spatial region 300 is formed and exposed on the upper surfaces of the first and second metal members 110a and 110b, the first and second solders 410 and 430 overflow on the first and second island plating layers 211a and 231a. Even if it overflows, it only spreads to the upper surfaces and side surfaces of the first and second island plating layers 211a and 231a and does not spread to the upper surfaces of the first and second metal members 110a and 110b. Accordingly, the tilted optical device 500 is self-aligned with the cross-sectional shape of the first and second island plating layers 211a and 231a.

In addition, since the optical device 500 is soldered on the first island plating layer 211a and the second island plating layer 231a, there is a difference in height between the optical device 500 and the first peripheral plating layer 211b and the second peripheral plating layer 231b. It is minimized and it is possible to install the optical element 500 closer to the cavity bottom surface 170 . Through this, the light emitted from the optical device 500 and directed toward the cavity bottom surface 170 is reflected by the first peripheral plating layer 211b and the second peripheral plating layer 231b, so that not only the reflection efficiency can be improved but also the bottom surface Since the path of the reflected light by the surface 170 can be reduced, the efficiency of the optical device package can be improved.

Although not shown in the drawings, the optical device 500 illustrated in FIG. 10 may be an optical device having first and second terminals formed thereunder. Such an optical device is electrically connected to the first metal member 110a through the first island plating layer 211a while the first terminal is soldered, and the second terminal is also soldered to the second metal through the second island plating layer 231a. It is electrically connected to the member 110b.

On the other hand, a substrate cover (not shown) is installed on the upper surface of the metal member 110 , and the substrate cover is formed of a transparent material. The material may vary depending on the type of optical element, and for example, may be made of a quartz material.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify or modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. can be carried out.

110a: first metal member 110b: second metal member
130: vertical insulation 140: cavity
170: bottom surface 200: plating layer
300: space area 400: solder
500: optical element

Claims (9)

first and second metal members joined to each other by interposing a vertical insulator therebetween;
a first plating layer that provides a region in which an optical device is mounted, and is formed on an upper surface of the first metal member;
a second plating layer formed on an upper surface of the second metal member; and
a space region formed by patterning the first plating layer so that the upper surface of the first metal member is exposed;
The first plating layer,
a first island plating layer formed on an upper surface of the first metal member to be located inside the spatial region; and
a first peripheral plating layer formed on the upper surface of the first metal member to be located outside the spatial region; and
A cavity is formed to form a deep groove in an area including the vertical insulating layer on the upper surfaces of the first and second metal members,
The first and second plating layers are made of the same metal, and are formed on a flat bottom surface of the cavity except for the vertical insulating layer and the space region,
The first metal member is made of a solder non-affinity metal,
The space region is formed around the first island plating layer to expose an upper surface of the first metal member,
and the space region is formed between the first island plating layer and the first plating layer so that the first island plating layer and the first peripheral plating layer are not connected to each other.
According to claim 1,
The substrate for an optical device, characterized in that the first island plating layer is formed in a polygonal shape.
delete According to claim 1,
A first peripheral plating layer, a space region, and a first island plating layer are formed on one side of the vertical insulating part,
A second plating layer is formed on the other side based on the vertical insulating part,
A second plating layer, a vertical insulation portion, a first peripheral plating layer, a space region, and a first island plating layer are sequentially positioned along a line crossing the vertical insulation portion in order.
first and second metal members joined to each other by interposing a vertical insulator therebetween;
a first plating layer that provides a region in which an optical device is mounted, and is formed on an upper surface of the first metal member;
a second plating layer formed on an upper surface of the second metal member;
a first space region formed by patterning the first plating layer to expose an upper surface of the first metal member; and
a second space region formed by patterning the second plating layer so that the upper surface of the second metal member is exposed;
The first plating layer,
a first island plating layer formed on an upper surface of the first metal member to be located inside the first spatial region; and
a first peripheral plating layer formed on the upper surface of the first metal member to be located outside the first spatial region; and
The second plating layer,
a second island plating layer formed on the upper surface of the second metal member to be located inside the second spatial region; and
a second peripheral plating layer formed on the upper surface of the second metal member so as to be located outside the second spatial region; and
On the upper surfaces of the first and second metal members, the cavity is formed to form a deep groove in the region including the vertical insulating portion,
The first and second plating layers are made of the same metal, and are formed on a flat bottom surface of the cavity except for the vertical insulating portion, the first spatial region, and the second spatial region,
The first and second metal members are made of a solder non-affinity metal,
The first space region is formed around the first island plating layer to expose an upper surface of the first metal member,
The second space region is formed around the second island plating layer to expose an upper surface of the second metal member,
The first space region is formed between the first island plating layer and the first plating layer so that the first island plating layer and the first peripheral plating layer are not connected to each other;
and the second space region is formed between the second island plating layer and the second plating layer so that the second island plating layer and the second peripheral plating layer are not connected to each other.
6. The method of claim 5,
The first spatial region has an inverted 'C' shape,
The second spatial region is in the shape of a 'C'.
A substrate for an optical device, characterized in that a vertical insulator is positioned between the first and second spatial regions facing each other.
first and second metal members joined to each other by interposing a vertical insulator therebetween;
a first plating layer that provides a region in which an optical device is mounted, and is formed on an upper surface of the first metal member;
a second plating layer formed on an upper surface of the second metal member; and
a space region formed by patterning the first plating layer so that the upper surface of the first metal member is exposed;
The first plating layer,
a first island plating layer formed on an upper surface of the first metal member to be located inside the spatial region; and
a first peripheral plating layer formed on the upper surface of the first metal member to be located outside the spatial region; and
solder formed on the first island plating layer;
an optical element formed on the solder and having a first terminal electrically connected to the first metal member; and
a wire electrically connecting the second terminal of the optical element to the second metal member;
On the upper surfaces of the first and second metal members, the cavity is formed to form a deep groove in the region including the vertical insulating portion,
The first and second plating layers are formed of the same metal, and are formed on a flat bottom surface of the cavity except for the vertical insulating portion and the space region,
The first metal member is made of a solder non-affinity metal,
The space region is formed around the first island plating layer to expose an upper surface of the first metal member,
and the space region is formed between the first island plating layer and the first plating layer to prevent the first island plating layer and the first peripheral plating layer from being connected to each other.
delete first and second metal members joined to each other by interposing a vertical insulator therebetween;
a first plating layer that provides a region in which an optical device is mounted, and is formed on an upper surface of the first metal member;
a second plating layer formed on an upper surface of the second metal member;
a first space region formed by patterning the first plating layer to expose an upper surface of the first metal member; and
a second space region formed by patterning the second plating layer so that the upper surface of the second metal member is exposed;
The first plating layer,
a first island plating layer formed on an upper surface of the first metal member to be located inside the first spatial region; and
a first peripheral plating layer formed on the upper surface of the first metal member to be located outside the first spatial region; and
The second plating layer,
a second island plating layer formed on the upper surface of the second metal member to be located inside the second spatial region; and
a second peripheral plating layer formed on the upper surface of the second metal member so as to be located outside the second spatial region; and
a first solder formed on the first island plating layer;
a second solder formed on the second island plating layer; and
An optical device in which a first terminal provided on the first solder is electrically connected to the first metal member, and a second terminal provided on the second solder is electrically connected to the second metal member; including,
On the upper surfaces of the first and second metal members, the cavity is formed to form a deep groove in the region including the vertical insulating portion,
The first and second plating layers are made of the same metal, and are formed on a flat bottom surface of the cavity except for the vertical insulating portion, the first spatial region, and the second spatial region,
The first and second metal members are made of a solder non-affinity metal,
The first space region is formed around the first island plating layer to expose an upper surface of the first metal member,
The second space region is formed around the second island plating layer to expose an upper surface of the second metal member,
The first space region is formed between the first island plating layer and the first plating layer so that the first island plating layer and the first peripheral plating layer are not connected to each other;
and the second space region is formed between the second island plating layer and the second plating layer so that the second island plating layer and the second peripheral plating layer are not connected to each other.

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