KR102338838B1 - Method for manufacturing antiviral film with copper deposited thereon and antiviral film deposited with copper manufactured using the same - Google Patents

Abstract

A method of manufacturing an antiviral film on which copper (Cu) or an alloy thereof is deposited includes: preparing a substrate made of a flexible material; and forming a copper deposition layer including copper on the substrate by a physical vapor deposition method by sputtering using a target material made of copper or a copper alloy. In this case, the copper deposition layer has a thickness of 50 nm to 500 nm, and the copper deposition layer includes a first sputtering layer formed on the substrate, and a second sputtering layer formed on the first sputtering layer. In addition, the second sputtering layer includes more than 60% by weight of copper. The antiviral film on which copper or its alloy is deposited, manufactured by the above manufacturing method, is formed with a copper deposition layer having a high copper content on a substrate made of paper, synthetic resin, or other flexible material. , There is an advantage of being able to use the antiviral effect of copper by processing it into various shapes, such as a toilet cover, and attaching it to the existing members.

Description

Method for manufacturing a copper-deposited antiviral film and an antiviral film on which copper is deposited

The embodiments relate to a method of manufacturing an antiviral film on which copper (Cu) or an alloy thereof is deposited, and an antiviral film on which copper or an alloy thereof is deposited. More specifically, embodiments provide a film having a high copper content by depositing copper or a copper alloy on a substrate made of paper, synthetic resin, or other flexible material, and using such a film for a handle cover, a toilet seat cover, and an air circulation passage It is about a manufacturing technology of an antiviral film that utilizes the antiviral effect of copper by processing it into various shapes, such as attaching it to existing members.

Recently, outbreaks of new pathogens such as severe acute respiratory syndrome (SARS, so-called SARS), Middle East respiratory syndrome (MERS, so-called MERS), and novel coronavirus (COVID-19) that occur worldwide are emerging as serious problems. New pathogens are causing huge numbers of victims every day around the world. Accordingly, items capable of preventing or preventing viruses or bacteria from penetrating into the human body in daily life, including masks worn over the nose and mouth, are attracting attention.

On the other hand, it is known that the virus can survive on various surfaces, but is rapidly destroyed on copper (Cu). This is due to the fact that the copper surface is an environment unsuitable for the survival of viruses and bacteria, such as when copper comes in contact with viruses or bacteria, copper components are absorbed by viruses or bacteria and disturb the movement. This has been studied For example, published Utility Model Publication No. 1998-062364 discloses a shoe midsole with antibacterial and odor functions by bonding copper mesh fibers coated with copper to a reticular polyester yarn to a foamed urethane sheet. do.

However, the technique disclosed in Unexamined Utility Model Publication No. 1998-062364 is a method of attaching copper-coated fibers to a surface, and has a limitation in that it is difficult to apply to a surface that does not use fibers. In addition, recent attempts have been made to cover surfaces touched by the hand, such as buttons, with an antiviral film containing copper due to the influence of the virus that is spreading around the world. There have been disadvantages in that it is difficult to trust the efficacy, and it is difficult to process it according to the shape of the surface to be attached or to maintain a deformed state.

Public Utility Model Publication No. 1998-062364

According to one aspect of the present invention, a film having a high copper content is manufactured by depositing copper (Cu) or a copper alloy on a substrate made of paper, synthetic resin, or other flexible material, and such a film is used for a handle cover, a toilet seat cover, etc. It is possible to provide a method for manufacturing an antiviral film on which copper is deposited so as to utilize the antiviral effect of copper by processing it into various shapes and attaching it on existing members.

The method for manufacturing an antiviral film on which copper is deposited according to an aspect of the present invention is a surface that is frequently touched by people, such as a door handle or a toilet cover, or a surface that is difficult to clean, such as the inner surface of an air circulation duct. It aims to prevent infectious diseases by changing the surface of copper to a copper surface, an environment in which bacteria or viruses cannot survive.

In addition, according to an aspect of the present invention, it is possible to provide an antiviral film on which copper is deposited including a flexible substrate and a copper deposition layer configured as described above.

A method for manufacturing an antiviral film on which copper (Cu) is deposited according to an aspect of the present invention comprises: preparing a substrate made of a flexible material; and forming a copper deposition layer including copper on the substrate by a physical vapor deposition method by sputtering using a target material made of copper or a copper alloy.

In this case, the copper deposition layer may have a thickness of 50 nm to 500 nm, and the copper deposition layer may include a first sputtering layer formed on the substrate, and a second sputtering layer formed on the first sputtering layer. . In addition, the second sputtering layer may include copper in an amount exceeding 60 wt%.

According to an embodiment, in the method of manufacturing an antiviral film on which copper is deposited, after forming the copper deposition layer, copper is plated on the copper deposition layer by an electrolytic plating method using a plating solution containing copper ions. further comprising the step of

According to an embodiment, in the method for manufacturing an antiviral film on which copper is deposited, before the step of forming the copper deposition layer, the hardness of the target material is from the hardness of the copper plating layer formed by the step of plating the copper in advance The method further includes determining a composition of at least one of the target material and the plating solution to fall within a set range.

In an embodiment, the forming of the copper deposition layer further includes irradiating an ion beam onto the surface of the substrate on which copper or copper alloy is to be deposited.

According to an embodiment, the method for manufacturing an antiviral film on which copper is deposited further includes, before the step of forming the copper deposition layer, a step of primer-treating the surface of the substrate on which copper or copper alloy is to be deposited. do.

According to an embodiment, the method of manufacturing an antiviral film on which copper is deposited further includes forming an adhesive layer on the substrate.

Copper-deposited antiviral film according to another aspect of the present invention, a substrate made of a flexible material; and a copper deposition layer deposited on the substrate by physical vapor deposition by sputtering using a target material made of copper or a copper alloy.

In this case, the copper deposition layer may have a thickness of 50 nm to 500 nm, and the copper deposition layer may include a first sputtering layer formed on the substrate and a second sputtering layer formed on the first sputtering layer. In addition, the second sputtering layer may include copper in an amount exceeding 60 wt%.

According to an embodiment, the copper-deposited antiviral film further includes an adhesive layer positioned on the substrate.

In an embodiment, the first sputtering layer includes nickel chromium (NiCr).

The antiviral film on which copper (Cu) or copper alloy is deposited according to an aspect of the present invention is a physical vapor deposition method on a synthetic resin substrate such as polyethylene terephthalate (PET), polypropylene (PP), etc. It has a higher copper content than conventional copper-based films, and it suppresses the propagation of viruses or bacteria by changing the surface of the location where the antiviral film is applied to a copper surface where bacteria or viruses cannot survive. effect can be achieved.

In addition, the antiviral film on which copper or copper alloy is deposited according to an aspect of the present invention can be manufactured to a thin thickness of about tens to hundreds of micrometers (㎛), so that a handle cover or toilet cover frequently used in daily life, Alternatively, the antiviral film is processed into the shape of various members, such as an air circulation duct, which is difficult to clean, and the antiviral film is attached to the existing members in a corresponding shape using an adhesive, etc. to increase the antiviral efficacy of copper. There are advantages available.

1 is a flowchart showing each step of the method for manufacturing a copper-deposited antiviral film according to an embodiment.
Figures 2a to 2d is a cross-sectional view of the antiviral film showing each step of the manufacturing method of the copper-deposited antiviral film according to an embodiment.
3 is a conceptual diagram illustrating a form in which an antiviral film on which copper is deposited according to an embodiment is applied to a door handle.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

When a part is referred to as being “above” another part in the present specification, it may be directly on the other part or the other part may be involved in between. In contrast, when a part refers to being "directly above" another part, no other part is involved in between.

The terms first, second, third, etc. are used herein to describe, but are not limited to, various parts, components, regions, layers and/or sections. These terms are used only to distinguish one part, component, region, layer or section from another part, component, region, layer or section. Accordingly, a first part, component, region, layer or section described below may be referred to as a second part, component, region, layer or section without departing from the scope of the present invention.

The terminology used herein is for the purpose of referring to specific embodiments only, and is not intended to limit the present invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. The meaning of "comprising," as used herein, specifies a particular characteristic, region, integer, step, operation, element and/or component, and includes the presence or absence of another characteristic, region, integer, step, operation, element and/or component. It does not exclude additions.

In this specification, terms indicating a relative space such as “below” and “above” may be used to more easily describe the relationship of one part shown in the drawings to another part. These terms are intended to include other meanings or operations of the device in use with the meanings intended in the drawings. For example, if the device in the drawings is turned over, some parts described as being "below" other parts are described as being "above" other parts. Thus, the exemplary term “down” includes both the up and down directions. The device may be rotated 90 degrees or at other angles, and terms denoting relative space are interpreted accordingly.

Although not defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Commonly used terms defined in the dictionary are additionally interpreted as having a meaning consistent with the related technical literature and the presently disclosed content, and unless defined, are not interpreted in an ideal or very formal meaning.

1 is a flowchart showing each step of the method for manufacturing an antiviral film on which copper is deposited according to an embodiment, FIGS. 2a to 2d are each step of the method for manufacturing an antiviral film on which copper is deposited according to an embodiment It is sectional drawing of the antiviral film shown.

1 and 2a, the antiviral film according to embodiments of the present invention is formed using a substrate 100 made of a flexible material. The substrate 100 may be a synthetic resin such as polyethylene terephthalate (PET) or polypropylene (PP), but is not limited thereto, and may be made of paper or other suitable material. Also, the substrate 100 may be made of a non-conductive material.

The thickness of the substrate 100 may be several to several tens of μm. For example, the thickness of the substrate 100 may be about 75 to 125 μm. However, the thickness of the substrate 100 is not limited thereto, and the thickness of the substrate 100 may be appropriately determined depending on the target to which the antiviral film is to be applied. Also, in one embodiment, the substrate 100 may be made of an optically transparent or translucent material.

Embodiments of the present invention are configured to form a copper deposition layer on the substrate 100 by a physical vapor deposition (PVD) method. In an embodiment, the surface of the substrate 100 may be primed prior to forming the copper deposition layer (S1).

In the present specification, the primer treatment refers to coating the surface of the substrate 100 with a layer (not shown) having a primer, thereby increasing the surface tension of the substrate 100 to increase adhesion between the substrate 100 and other materials, and the substrate (100) refers to a pretreatment process to increase the utility. Primer treatment may include a primer coating agent such as a polyester-based or trichloroacetic acid (TCA)-based viscous liquid, or an adhesive organic material soluble in water-soluble and/or organic solvents, etc. It is not limited.

1 and 2B , a deposition layer by a PVD process may be formed on a substrate 100 using a target material as a PVD process. In this case, as the PVD process, a sputtering process using a target material may be performed. For example, by applying a negative voltage to the target material in an inert gas atmosphere such as argon to collide the ions of the inert gas on the surface of the target material, the particles separated from the target material are deposited on the substrate 100 . layer can be formed.

In this case, the deposition layer may be formed of two or more types of material composition. That is, first, the first sputtering layer 200 by the primary sputtering process may be formed on the substrate 100 (S2). The first sputtering layer 200 is a layer serving to combine copper or a copper alloy to be formed later with the substrate 100 , and for example, the first sputtering layer 200 may be made of nickel chromium (NiCr). In one embodiment, the first sputtering layer 200 may include nickel (Ni) and chromium (Cr) having a weight ratio of about 8:2, but the composition of the first sputtering layer 200 is limited thereto. no.

Referring to FIGS. 1 and 2C , the second sputtering layer 300 may be formed on the first sputtering layer 200 by secondary sputtering using copper or a copper alloy material as a target material (S3). ). The second sputtering layer 300 is formed by performing secondary sputtering using a target material including copper or an alloy thereof on the primary sputtered surface. The second sputtering layer 300 is copper (Cu) with zinc (Zn), nickel (Ni), tin (Sn), and other impurity ions, such as brass (Cu-Zn), cupronickel (Cu-Ni), bronze ( Cu—Sn) and the like. Depending on the type of impurities, the color of the second sputtering layer 300 may be the same metallic color, white, yellow, or the like.

However, the composition of the target material is determined so that the proportion of copper (Cu) in the second sputtering layer 300 always exceeds 60 wt%. As a result, in the copper deposition layers 200 and 300 formed as described above, the upper surface for human hand contact is made of a copper surface, which is an environment in which bacteria or viruses are difficult to survive due to the second sputtering layer 300, The antiviral effect of copper can be used to prevent the spread of infectious diseases.

In an embodiment, the thickness of the first sputtering layer 200 made of nickel chromium (NiCr) may be 5 to 50 nm, and the thickness of the second sputtering layer 300 made of copper (Cu) or a copper alloy is 50 to 400 nm. Also, in one embodiment, the thickness of the first sputtering layer 200 may be 10 to 40 nm, and the thickness of the second sputtering layer 300 may be 80 to 200 nm. Further, in an embodiment, the thickness of the first sputtering layer 200 may be 15 to 35 nm, and the thickness of the second sputtering layer 300 may be 100 to 150 nm.

Also, in one embodiment, the entire deposition layers 200 and 300 formed on the surface of the substrate 100 by the above process may have a thickness in the range of about 10 nm to 10,000 nm. Also, in one embodiment, the deposition layers 200 and 300 may have a thickness of about 50 to 500 nm. Further, in an embodiment, the deposition layers 200 and 300 may have a thickness of about 100 to 250 nm. On the other hand, the thickness of the deposition layers 200 and 300 may be appropriately determined according to the thickness or characteristics of the copper deposition layer to be formed, or the desired thickness or characteristics of the entire antiviral film. In addition, the pressure of the gas atmosphere or the voltage applied to the target material in the PVD process may be adjusted according to the thickness of the deposition layers 200 and 300 to be formed.

In an embodiment, the deposition layers 200 and 300 may be formed by a sputtering method further using ion-beam assisted deposition during the PVD process. In this case, the sputtering process may be performed while irradiating an ion beam to the surface of the substrate 100 on which the deposition layers 200 and 300 are to be formed. When the ion beam of appropriate energy and current density is irradiated, the surface of the substrate 100 can be washed before the deposition layers 200 and 300 are formed, thereby increasing the adhesion between the substrate 100 and the deposition layers 200 and 300 . In the process of forming the deposition layers 200 and 300 , the deposition layers 200 and 300 with high density can be formed as the deposition structure is collapsed by the impact of the ion beam.

In an embodiment, a copper plating layer (not shown) may be formed by plating copper on the substrate 100 on which the deposition layers 200 and 300 are formed by the above-described pretreatment process ( S4 ). For example, the copper plating layer may be formed on the substrate 100 by an electrolytic plating method using a plating solution containing copper ions. In the present specification below, that any substrate or film is plated with copper means that a layer including at least copper is formed by plating, and is not limited to being plated with only pure copper. That is, even if it has a plating layer made of a copper alloy or a plating layer further containing other impurities in copper or copper alloy, the copper-deposited film of the present specification may be applicable.

The plating solution for the electrolytic plating process _{may include, but is not limited to, copper sulfate (CuSO 4} -5H ₂ O), sulfuric acid (H ₂ SO ₄ ), chlorine (Cl 2 ), organic chemicals, and brighteners. In addition, the plating solution may further include impurity ions such as zinc (Zn), nickel (Ni), and tin (Sn) for forming a copper alloy in addition to pure copper. In addition, the plating process for forming the copper plating layer is not limited to the electroplating process, and the copper plating layer may be formed using electro solder plating or other different plating methods.

At this time, if there is a difference in the hardness of the material in the PVD process and the plating process, the durability of the plating layer may be adversely affected. can decide In other words, a material having a hardness that falls within a certain range from the hardness of the copper plating layer to be formed through the plating process may be used as a target material for the PVD process, thereby increasing the durability of the plating layer.

In one embodiment, the copper plating layer may be made of 100% by weight of copper. However, in another embodiment, the copper plating layer may be formed of a copper alloy in which an alloy material including at least one of zinc (Zn), nickel (Ni), and tin (Sn) is further added to copper. In this case, the copper plating layer preferably has a copper content of at least 70% by weight or more for the expression of antiviral efficacy. For example, in one embodiment, the copper plating layer may be made of a copper alloy including 73 to 99% by weight of copper, and 1 to 27% by weight of the aforementioned alloy material. Also, in one embodiment, the copper plating layer may be made of a copper alloy including 73 to 83% by weight of copper, and 17 to 27% by weight of the aforementioned alloy material. However, the numerical range is exemplary, and the composition of the copper plating layer is not limited thereto.

In one embodiment, the copper plating layer formed by the above process has a thickness of greater than 0 and less than or equal to 2 μm. Copper alloy has relatively low ductility compared to pure copper and can be broken. Also, in the case of pure copper, if the copper plating is thick and the curvature of the attachment surface to which the antiviral film will be attached is high, the plated part may be broken and dangerous. Therefore, the copper plating layer preferably has a thickness of 2 μm or less.

However, the embodiment shown in FIG. 1 is exemplary, and in another embodiment, the antiviral effect may be exhibited by the copper deposition layers 200 and 300 formed by sputtering without a plating process, in which case the copper plating of FIG. Step S4 may be omitted.

By the above process, an antiviral film including a substrate 100 made of a flexible material, and a copper deposition layer formed by a PVD method on the substrate 100 may be manufactured. In this case, the copper deposition layer may include a first sputtering layer 200 and a second sputtering layer 300 positioned on the first sputtering layer 200 . The first sputtering layer 200 and the second sputtering layer 300 may be made of pure copper or a copper alloy as described above, and in the embodiments of the present specification, copper is sometimes a copper alloy in addition to pure copper. used in the sense of including

In the antiviral film including the copper deposition layers 200 and 300 prepared as described above, it is difficult for the virus to survive due to the copper component of the copper deposition layers 200 and 300 (particularly, the second sputtering layer 300). It has antiviral properties by being destroyed or rapidly destroyed. However, the target to which the efficacy of the antiviral film according to the embodiments is exerted is not limited to viruses, and the same principle may be applied to bacteria (bacteria) or other microorganism-type pathogens. As used herein, the term antiviral is intended to collectively refer to the effect of delaying or suppressing or annihilating the activity of any biological material capable of harming the body of a human or animal.

Meanwhile, referring to FIGS. 1 and 2D , in an embodiment, an adhesive layer 400 may be further formed on the substrate 100 on which copper is deposited ( S5 ). The adhesive layer 400 is a portion for attaching the copper-deposited antiviral film to the surface of the member when bonding it to another member such as a button or a door handle, and is made of any adhesive material. For example, the adhesive layer 400 may be a double-sided tape, but is not limited thereto.

In an embodiment, the adhesive layer 400 may be formed on the surface of the substrate 100 opposite to the surface on which the copper deposition layers 200 and 300 are formed. For example, when the copper deposition layers 200 and 300 are formed on the upper surface of the substrate 100 , the adhesive layer 400 may be positioned on the lower surface of the substrate 100 . Before using the copper-deposited anti-viral film, a release paper (not shown) is attached on the adhesive layer 400, and if you want to use an anti-viral film, remove the release paper and use the adhesive layer 400 to remove the anti-viral film. It can be attached on the surface of another member.

Meanwhile, a protective film (not shown) may be further formed on the surface on which the copper deposition layers 200 and 300 are formed on the surface of the substrate 100 ( S5 ). The protective film refers to a member formed or attached to the copper deposition layers 200 and 300 for the purpose of protecting the copper deposition layers 200 and 300 until the antiviral film is used, and the copper deposited antiviral film At the time of use, it can be removed together with the release paper.

3 is a conceptual diagram illustrating a form in which an antiviral film on which copper is deposited according to an embodiment is applied to a door handle.

Referring to FIG. 3 , the antiviral film 20 on which copper is deposited in this embodiment is applied to the handle 4 of the door 3 and may be arranged to cover the surface of at least a portion of the handle 4 . . For example, the handle 4 comprises one or more connections 42 connected to the door 3 and a bar 41 connected to the one or more connections 42 and configured to be held by a person, The anti-viral film 20 may be coupled to the handle 4 in the form of a cover covering the bar-shaped bar 41 part that is frequently touched by a person's hand. However, this is an example, and the shape of the handle to which the copper-deposited antiviral film 20 is applied, or the location or size of the region where the antiviral film 20 is attached to the handle is limited by the examples shown in the drawings. doesn't happen

In addition, in the drawings of the present specification, an antiviral film on which copper is deposited is exemplarily shown in a form applied to elevator buttons and door handles. However, the type of member or surface to which the copper-deposited anti-viral film can be applied is not limited thereto, and the copper-deposited anti-viral film can be applied to any human touch in life. It can be used in the absence of or applied to a surface to exert antiviral efficacy.

Although the present invention as described above has been described with reference to the embodiments shown in the drawings, it will be understood that these are merely exemplary, and that various modifications and variations of the embodiments are possible therefrom by those of ordinary skill in the art. However, such modifications should be considered to be within the technical protection scope of the present invention. Accordingly, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

Claims (9)

Preparing a substrate made of a flexible material; and
By sputtering using a target material made of copper or a copper alloy, comprising the step of forming a copper deposition layer containing copper on the substrate in a physical vapor deposition method,
The thickness of the copper deposition layer is 50 nm to 500 nm,
The copper deposition layer includes a first sputtering layer formed on the substrate, and a second sputtering layer formed on the first sputtering layer, wherein the second sputtering layer contains copper in excess of 60% by weight,
After forming the copper deposition layer, the method further comprising the step of plating copper on the copper deposition layer by an electrolytic plating method using a plating solution containing copper ions,
The step of plating the copper includes determining the composition of the plating solution so that the hardness of the target material falls within a preset range from the hardness of the copper plating layer formed by the step of plating the copper,
The copper plating layer,
73 to 99% by weight of copper, and 1 to 27% by weight of an alloying material comprising at least one of zinc (Zn), nickel (Ni), and tin (Sn);
A method for producing a copper-deposited antiviral film having a thickness greater than 0 and less than or equal to 2 μm.
delete delete According to claim 1,
Forming the copper deposition layer, copper or copper alloy manufacturing method of the antiviral film is deposited further comprising the step of irradiating an ion beam on the surface of the substrate to be deposited.
According to claim 1,
Before forming the copper deposition layer, the method of manufacturing a copper-deposited antiviral film further comprising the step of primer-treating the surface of the substrate on which copper or copper alloy is to be deposited.
According to claim 1,
Method for producing a copper-deposited antiviral film further comprising the step of forming an adhesive layer on the substrate.
a substrate made of a flexible material;
a copper deposition layer deposited by physical vapor deposition by sputtering using a target material made of copper or a copper alloy and positioned on the substrate; and
A copper plating layer formed on the copper deposition layer by an electrolytic plating method using a plating solution containing copper ions,
The thickness of the copper deposition layer is 50 nm to 500 nm,
The copper deposition layer includes a first sputtering layer formed on the substrate and a second sputtering layer formed on the first sputtering layer,
the second sputtering layer comprises more than 60% by weight copper;
The hardness of the target material is within a preset range from the hardness of the copper plating layer,
The copper plating layer,
73 to 99% by weight of copper, and 1 to 27% by weight of an alloying material comprising at least one of zinc (Zn), nickel (Ni), and tin (Sn);
An antiviral film deposited with copper having a thickness greater than 0 and less than or equal to 2 μm.
8. The method of claim 7,
Copper-deposited antiviral film further comprising an adhesive layer positioned on the substrate.
8. The method of claim 7,
The first sputtering layer is an antiviral film on which copper containing nickel chromium (NiCr) is deposited.

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