KR102328599B1 - Atomic laser deposition system using continuously and independently transferred substrate - Google Patents

Abstract

An atomic layer deposition system using a sequentially individually transferred substrate includes a rail unit, a plurality of transfer units, a plurality of substrate units, and a plurality of deposition units. The rail unit extends while forming a predetermined path along the atomic layer deposition process. The transfer units are each independently transferred on the rail unit. The substrate parts are respectively mounted on the transfer units and transferred. The deposition units are fixed at different positions along the rail portion, and atomic layers are deposited on each of the lower substrate portions.

Description

ATOMIC LASER DEPOSITION SYSTEM USING CONTINUOUSLY AND INDEPENDENTLY TRANSFERRED SUBSTRATE

The present invention relates to an atomic layer deposition system, and more particularly, in an atomic layer deposition method for stacking a plurality of atomic layers, a plurality of substrates are continuously transported independently of each other and as each deposition process is performed, a more effective atomic layer deposition method It relates to an atomic layer deposition system using a continuously individually transferred substrate that can configure various processes while performing deposition.

Atomic layer deposition (ALD) is a nano-thin film deposition technology that uses the chemical attachment of monoatomic layers. It is possible to deposit an oxide or metal thin film on a substrate in units of atomic layers, resulting in a relatively thin thickness. It has the characteristic of being able to stack and change the composition of atoms.

Such an atomic layer deposition method can be performed by depositing a plurality of layers in units of atomic layers, so that various fine metal patterns can be manufactured, and in particular, it is often used as a process for depositing a thin film on a wafer in a semiconductor process.

However, in the atomic layer deposition method, it is necessary to deposit an oxide or metal thin film in units of atomic layers, and when a plurality of layers are deposited, a reactive gas such as nitrogen must be supplied between the layers, which has a problem in that the process time is relatively increased. As a solution to this, various processes have been proposed.

For example, Korean Patent Registration No. 10-1885525 discloses a technique for increasing process efficiency by sequentially performing deposition with rotation in a state in which a plurality of substrates are fixed on a rotating rotating stage, Similarly, a technique for performing atomic layer deposition by mounting a plurality of substrates on a rotating wheel has been disclosed through Korean Patent Registration No. 10-1888828 and the like.

However, even in the atomic layer deposition process developed so far, it still takes a lot of process time, so a system capable of further reducing the process time is required, and furthermore, it is possible to implement a more diverse process in connection with the pre-treatment or post-treatment process. Demand for atomic layer deposition systems is increasing.

Republic of Korea Patent Registration No. 10-1885525 Republic of Korea Patent No. 10-1888828

Accordingly, the technical problem of the present invention was conceived in this regard, and an object of the present invention is to reduce the process time in atomic layer deposition, as well as to implement more various processes in connection with the pre-treatment or post-treatment process to implement the atomic layer deposition process. To provide an atomic layer deposition system using continuously individually transferred substrates, which can improve deposition process efficiency.

An atomic layer deposition system according to an embodiment for realizing the object of the present invention includes a rail unit, a plurality of transfer units, a plurality of substrate units, and a plurality of deposition units. The rail unit extends while forming a predetermined path along the atomic layer deposition process. The transfer units are each independently transferred on the rail unit. The substrate parts are respectively mounted on the transfer units and transferred. The deposition units are fixed at different positions along the rail portion, and atomic layers are deposited on each of the lower substrate portions.

In one embodiment, the rail part may form a closed-loop or partially open loop path including a straight part or a curved part.

In one embodiment, positioned adjacent to the rail part, a supply unit for supplying the substrate part to each of the transfer units transported along the rail part, and positioned adjacent to the rail part, being transported along the rail part It may further include a recovery unit for recovering the substrate portion on which the layer deposition process has been performed.

In one embodiment, it may further include an additional processing unit connected to any one of the rail unit, the supply unit, and the recovery unit to perform an additional processing process on the substrate unit.

In an embodiment, the deposition unit includes a spraying unit for supplying a reactant to the substrate located below, and a spraying unit covering the spraying unit, and recovering the reactant supplied to the substrate between the spraying unit and the spraying unit. It may include a deposition chamber for forming a recovery space.

In an embodiment, when the reactant is supplied to and recovered from the substrate unit through the deposition unit, the transfer unit on which the substrate unit is mounted may be positioned in a stationary state.

In one embodiment, in consideration of the state of the atomic layer deposition performed on each of the substrate parts, the control unit may further include a control unit for controlling each of the transfer units to be transferred independently.

In one embodiment, the rail unit includes an upper wall and a lower wall facing each other, an inner portion connecting the upper wall and the lower wall to form a side space in the center, and repeatedly mounted on the side space to form a stator It may include a coil module.

In one embodiment, the transfer unit, facing the upper wall portion, the upper surface is a base portion on which the substrate portion is mounted, a bottom portion facing the lower wall portion, and connecting the base portion and the bottom surface portion, the stator It may include a mover facing the coil module.

In an embodiment, the coil module includes a coil yoke fixed on the inner side, and a coil wound around the coil yoke, and is converted into three phases by a three-phase alternating current applied to the coil to be connected to the coil yoke. A magnetic field can be formed or dissipated.

In one embodiment, the mover may include a magnetic yoke fixed on the mover, and a thrust magnet mounted on the magnetic yoke, and interacting with a magnetic field formed or extinguished in the coil yoke to move the mover. can

In one embodiment, three coil modules may form a unit coil module along the extending direction of the rail part, and two thrust magnets may be disposed with respect to the unit coil module.

In one embodiment, the rail part extends along the lower wall part to face the coil module, and a switching board including a Hall sensor operating with a magnetic field corresponding to the thrust magnet to control phase change of the coil module. may include

In an embodiment, the rail part further includes a measuring board extending along the lower wall part, and the transfer unit is fixed on the mover to face the measuring board, and determines the position of the mover together with the measuring board. It may further include a measuring magnet for measuring.

According to the embodiments of the present invention, unlike the conventional space-division atomic layer deposition technology, by applying a linear motor system, there is an effect of maximizing productivity by performing a continuous deposition process and an inspection process together.

That is, in the atomic layer deposition process, in a state in which the deposition unit is fixed, the substrate part is transferred along the rail part and deposition can be sequentially performed through different reactants in each deposition unit. Since it is provided along the rail, process efficiency of the atomic layer deposition process may be further improved by performing atomic layer deposition as a plurality of layers on the plurality of substrate parts.

That is, in the case of performing atomic layer deposition by transferring a substrate in the prior art, it is possible to continuously transfer the substrate portion along the rail portion forming a predetermined path, out of the limit of simply reciprocating or rotating the substrate, so that the number of substrate portions It is possible to perform a continuous deposition process regardless of Since the process may be continuously performed, the process efficiency of the overall atomic layer deposition process may be improved.

That is, the expansion of the linear motor system is easy, so a deposition area can be easily added, and the deposited substrate is classified into a subsequent process through inspection, etc., and the productivity is dramatically improved by continuously providing additional substrates through the mover. can do it

In particular, considering that the substrate is transferred from the lower part of the deposition unit, the deposition unit includes a deposition chamber that covers the spray unit, so that the reactants sprayed from the deposition unit can be recovered, thereby minimizing the influence of the adjacent reactants. while the deposition process can be stably performed.

In addition, even if the deposition rates in each of the deposition units are different, the substrate portions may be independently transported in consideration of the deposition rates, and since the spacing between adjacent deposition units may be adjusted in consideration of the speeds of these deposition units, a conventional constant Various deposition processes can be performed by overcoming the limitation of maintaining a constant deposition rate in each deposition unit by controlling only the transport speed or the rotation speed.

On the other hand, by forming a stator in the rail part and implementing the transfer unit as a mover, it is possible to implement independent transfer of these substrate parts. In this case, by forming the switching board including the hall sensor along the inner side of the rail, it is possible to easily perform three-phase switching control of the coil module, which is the stator.

That is, the linear motor system is a system to which a moving magnet type linear motor is applied, and independent individual driving of a plurality of movers is possible, so that there is no wasted section in the deposition area. Continuous deposition is possible on a plurality of substrates, and it is very easy to change the transfer speed and position of the substrate for deposition.

1 is a schematic diagram illustrating an atomic layer deposition system according to an embodiment of the present invention.
FIG. 2 is an enlarged view illustrating the deposition unit and the transfer unit of FIG. 1 in an enlarged manner.
3 is a perspective view illustrating an example in which the rail of FIG. 1 is implemented in a rotary rotation manner.
4 is a perspective view of the portion 'A' of FIG. 3 observed from the side.
FIG. 5 is a cross-sectional view taken along line I-I' of FIG. 4 .
6 is a cross-sectional view taken along line II-II' of FIG. 5 .
7 is a schematic diagram illustrating an atomic layer deposition system according to another embodiment of the present invention.

Since the present invention may have various changes and may have various forms, embodiments will be described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms.

In the present application, terms such as "comprises" or "consisting of" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a schematic diagram illustrating an atomic layer deposition system according to an embodiment of the present invention. FIG. 2 is an enlarged view illustrating the deposition unit and the transfer unit of FIG. 1 in an enlarged manner.

1 and 2 , the atomic layer deposition system 10 according to the present embodiment includes a rail unit 100 , a plurality of transfer units 200 , 201 , 202 , 203 , a plurality of substrate units 400 , 401 , 402 , 403 , a plurality of deposition units 300 , 301 , 302 , 303 , a chamber unit 500 and a control unit 600 .

The rail part 100 is illustrated as extending in a straight line in one direction in FIG. 1, but this is only a part of the rail part 100, and in this embodiment, the rail part 100 is, It extends along the atomic layer deposition process to form a predetermined path.

In this case, the path formed by the rail unit 100 may be a closed-loop or an open loop in which a part is opened, and the shape of the closed loop or the open loop is a circle, an ellipse, It may be variously configured, including a curved type, a straight part, or a curved part.

In addition, in consideration of various process variables such as the number of each process constituting the atomic layer deposition process to be performed, process speed, and space for performing the process, the length or area of the rail part 100 is also formed in various ways. can be

An example of the rail part 100 will be described later with reference to FIG. 3 , and FIG. 1 shows a part of the rail part 100 to describe the overall configuration of the atomic layer deposition system 10 .

The transfer units 200 , 201 , 202 , and 203 are located on the rail part 100 and are transferred on the rail part 100 along the extending direction of the rail part 100 .

In this case, each of the transfer units 200 , 201 , 202 , 203 is driven by the control unit 600 , that is, the transfer is controlled, and as each transfer unit is individually driven, the re The portion 100 may be transported at different speeds, and thus may be positioned at different intervals on the rail unit 100 .

Of course, under the control of the control unit 600, the transfer units on the rail unit 100 are all driven at the same speed and may maintain the same distance.

The transfer units 200 , 201 , 202 , and 203 have the same configuration as described above, except that each of them is driven independently of each other. Therefore, only the transfer unit 200 will be described below.

The transfer unit 200 includes a base portion 210 and a mover 220, although a more detailed configuration will be described with reference to FIGS. 4 to 6 .

In this case, the base part 210 forms the upper surface of the transfer unit 200 and has a plate shape. Thus, each of the substrate parts 400 , 401 , 402 , and 403 is mounted on the upper surface of the base part 210 .

That is, each of the substrate parts 400 , 401 , 402 , 403 is mounted on each of the transfer units 200 , 201 , 202 , 203 , and is transferred on the rail unit 100 according to the transfer of the transfer unit. do.

As a result, when the control unit 600 controls the transfer of the transfer units 200 , 201 , 202 , and 203 , it means controlling the transfer of the substrate parts 400 , 401 , 402 and 403 .

An atomic layer deposition process is performed on each of the substrate parts 400 , 401 , 402 , and 403 by the deposition units 300 , 301 , 302 , 303 , and accordingly, the substrate parts 400 , 401 , 402 . , 403), at least one or more atomic layers may be deposited, respectively, to form a predetermined pattern.

In this case, the atomic layer deposition process performed on each of the substrate parts 400 , 401 , 402 , and 403 may be the same or different from each other, and the atomic layer deposition process performed on each of the substrate parts 400 , 401 , 402 , 403 may be performed. If the layer deposition processes are different from each other, in the deposition units 300 , 301 , 302 , and 303 to be described later, only some deposition units are selected according to respective substrate parts to perform the deposition process, and some deposition units are separate It can be controlled not to perform the deposition process.

The deposition units 300 , 301 , 302 , and 303 are disposed on the rail part 100 , and individual processes of atomic layer deposition are performed on each of the substrate parts 400 , 401 , 402 , 403 .

That is, each of the deposition units 300 , 301 , 302 , and 303 performs a predetermined atomic layer deposition process on each of the substrate parts, and the individual deposition process performed by each deposition unit is preset. In this case, each of the deposition units 300 , 301 , 302 , and 303 performs a predetermined individual deposition process with respect to the substrate located thereunder.

For example, if deposition is required in the order of reactant A, reactant B, and reactant C, and an atomic layer deposition process that requires treatment of the deposition surface with nitrogen gas before deposition of each reactant is performed , the first deposition unit 300 deposits the reactant A to the substrate portion, the second deposition unit 301 deposits nitrogen gas to the substrate portion, and the third deposition unit 302 deposits the reactant B to the substrate portion, and , the fourth deposition unit 303 may be configured to deposit nitrogen gas onto the substrate portion, and the fifth deposition unit (not shown) may be configured to deposit the reactant C onto the substrate portion.

In addition, the deposition units 300 , 301 , 302 , and 303 may be fixed to a preset position, in this case, the preset position is a process time of an individual deposition process of the atomic layer deposition process; In consideration of the transfer time of the substrate parts, they may be set at the same interval or may be set at different intervals.

Meanwhile, as shown in FIG. 1 , the deposition units 300 , 301 , 302 , and 303 are disposed inside the chamber 500 covering all of the deposition units 300 , 301 , 302 and 303 . It may be located in the space 501, and in this case, the inner space 501 may be controlled to improve the efficiency of the atomic layer deposition process, such as in a vacuum state, if necessary.

In this case, even when the inner space 501 is controlled, such as in the vacuum state, the rail part 100 may be located outside the chamber part 500 , so that it is separate from the chamber part 500 . can be configured.

The deposition units 300 , 301 , 302 , and 303 may all have the same structure as shown in FIG. 2 , except that different reactants may be sprayed and may be disposed at different intervals. have. Accordingly, one deposition unit 300 will be described below.

More specifically, as shown in FIG. 2 , the deposition unit 300 includes a deposition chamber 310 and a spray unit 320 .

The injection unit 320 is provided with a plurality of injection units 321 therein, and supplies the reaction material stored in the injection unit 320 to the upper surface of the substrate portion 400, and the substrate portion 400 Deposit the reactant on top.

The deposition chamber 310 covers the outside of the spray unit 320 , and forms a recovery space 311 between it and the spray unit 320 .

Thus, the reaction material supplied to the substrate unit 400 through the injection unit 320 is recovered through the recovery space 311 , and a recovery unit located at an upper side or one side of the deposition chamber 310 . It can be removed via 312 .

In the present embodiment, the substrate 400 is transferred by the transfer unit 200 , and different substrate portions are continuously positioned under the spray unit 320 . Accordingly, a predetermined gap for transferring the substrate 400 is required between the upper surface of the substrate 400 and the lower or lower ends of the jetting unit 320 and the deposition chamber 310 . do.

Accordingly, since the reaction material injected through the injection unit 320 may flow out through the gap, the deposition chamber 310 is additionally provided on the outside of the injection unit 320 , By recovering the reactant material through the recovery space 311, it is possible to improve the safety and reliability of the process equipment.

In this case, for more effective recovery of the leaking reaction material, a separate suction unit capable of sucking and removing the reaction material is provided in the recovery unit 312 , and is sprayed onto the substrate unit 400 . The reaction material may be naturally removed to the recovery unit 312 along the recovery space 311 in a flow as shown by an arrow in FIG. 2 .

3 is a perspective view illustrating an example in which the rail unit of FIG. 1 is implemented in a rotary rotation manner.

As described above, the rail part 100 may be formed in an open loop or a closed loop including a straight part or a curved part to form a predetermined path. An example formed by a closed loop including all parts is shown.

That is, as shown in FIG. 3 , when the rail part 100 is formed as a closed loop by connecting a straight part and a curved part to each other, a plurality of transfer units 200 , 201 , 202 are formed on the rail part 100 . , 203) are transferred.

In this case, the transfer units are illustratively shown as four, the number of the transfer units is not limited.

In addition, each of the transfer units extends in a vertical direction from the base parts 210 , 211 , 212 , 213 positioned to move along the upper surface of the rail part 100 , and one end of the base part, It is configured to include the movers 220 , 221 , 222 , 223 covering the side surface of the rail unit 100 .

In this case, since the shape, structure, and drive mechanism of each of the transfer units are the same, hereinafter, one transfer unit 200 will be exemplified and the shape, structure and drive mechanism will be described in detail.

4 is a perspective view of the portion 'A' of FIG. 3 observed from the side. FIG. 5 is a cross-sectional view taken along line I-I' of FIG. 4 . 6 is a cross-sectional view taken along line II-II' of FIG. 5 .

In this case, FIG. 4 is shown by cutting a part of the straight part of the rail part 100 of FIG. 3 for convenience of explanation, and the side of the rail part 100 faces the upper part, The base part 210 and the mover 220 respectively located on the upper surface and the side surface of 100) are illustrated to be located on the side surface and the upper surface in FIG. 4 .

4 to 6 , the transfer unit 200 includes a base portion 210 and a mover 220 as described above. In addition, the rail unit 100 includes a frame having a 'C' shape and a coil module 120 provided inside the frame.

In this case, the frame of the rail part 100 includes a lower wall part 111 , an upper wall part 112 , and an inner part 113 connecting the lower wall part 111 and the upper wall part 112 from one side. In this case, between the lower wall part 111, the inner part 113, and the upper wall part 112, the side part opened to one side (corresponding to the upper side in FIG. 5, but corresponding to the outer side in the actual rail part) A space 114 is formed.

In addition, the coil module 120 is disposed in the side space 114 .

More specifically, the base portion 210 is disposed to face each other while maintaining a predetermined distance from the upper wall portion 112 , and as described above, the substrate portion 400 is disposed on the upper surface of the base portion 210 . is mounted

In this case, the encoder head 250 is provided on the bottom surface of the base part 210 , and the encoder scale 150 is provided on the upper surface of the upper wall part 112 to face the encoder head 250 , the transfer The transfer state of the unit 200 is checked, and accordingly, the control unit 600 can control a more precise transfer of the transfer unit 200 .

The mover 220 is formed to be longer than the length of the side of the rail part 100 so as to cover all of the lower wall part 111 from the upper wall part 112 of the rail part 100, and the upper wall part 112 and It is positioned to be spaced apart from the lower wall part 111 by a predetermined distance.

In this case, the mover 220 is formed to have a predetermined width, and accordingly, only when the mover 220 is positioned, the coil module 120 of the rail unit 100 is connected with the mover 220 . transfer between them.

First, a guide rail 130 is continuously extended along the extending direction of the rail part 100 on the lower wall part 111 , and the guide rail 130 is also on the upper wall part 112 on the rail part ( 100) is continuously extended along the extension direction.

In addition, on the inner surface of the mover 220 , a block 240 is formed so as to contact the guide rail 130 formed on the lower wall portion 111 and the guide rail 130 formed on the upper wall portion 112 . pair is formed.

In this case, although not shown in detail, a predetermined sliding guide may be formed on the surface of the block 240 and the guide rail 130 in contact with each other, and accordingly, the block 240 is the guide rail 130 . ) can be slid on. Thus, the mover 220 is able to move along the guide rail 130 on the rail unit 100 .

On the other hand, the coil module 120 is located on the side space 114, the coil yoke 121 fixed on the inner part 113 and the coil yoke 121 on the coil yoke 121. It includes a coil 122 which is wound and fixed.

In addition, a thrust magnet 260 is disposed on the inner surface of the mover 220 at a position facing the coil 122 , and a magnet is disposed between the thrust magnet 260 and the inner surface of the mover 220 . A yoke 261 is interposed.

In this embodiment, the coil module 120 forms a so-called stator, and the mover 220 is configured to include the thrust magnet 260 , and the mover 220 is mounted on the coil module 120 . The transfer is implemented.

As shown in FIG. 4 , the coil module 120 is repeatedly disposed along the side surface of the rail part 100 to form a stator, and in this case, three are formed as a pair so as to be operated by three-phase alternating current. It is repeatedly arranged, and is continuously arranged along the rail part 100 as a whole.

That is, a magnetic field is formed or disappears in the coil yoke 121 as the three-phase is switched by the three-phase alternating current applied to the coil 122 .

In this case, the thrust magnet 260 moves the mover 220 while interacting with a magnetic field formed or destroyed according to the three-phase conversion of the coil module 120 .

As described above, the controller 600 eventually controls the three-phase switching of the coil module 120 , thereby controlling the driving of the mover 220 moving on the coil module 120 .

On the other hand, in order for the mover 220 to be transported on the rail part 100 by interaction with the coil module 120, for example, the thrust magnet 260 and The coil module 120 may be disposed.

That is, as shown in FIG. 6 , assuming that three coil modules 120 each having a pitch (Pmm) are unit coil modules, the thrust with respect to the pitch (Pt=3Pmm) occupied by the unit coil modules Two magnets 260 may be disposed. Thus, the pitch Pm between the two thrust magnets may be set to half (Pt=2Pm) of the pitch Pt of the unit coil module.

In addition, the two thrust magnets 260 are arranged to have different polarities toward the coil module 120 as shown. Accordingly, as the phases of the neighboring coil modules are switched, the thrust magnets having different polarities interact with each other.

That is, between the coil module and the thrust magnets arranged as described above, according to the three-phase switching of the coil module 120, an attractive force and a repulsive force are generated between the coil module 120 and the thrust magnet 260, and While disappearing, the mover 220 on which the thrust magnet 260 is mounted moves along the rail part 100 in the extending direction of the rail part 100 .

However, the arrangement of the coil module 120 and the thrust magnet 260 may be variously changed in addition to the exemplified arrangement, the coil module 120 is phase-changed as a stator, and the mover 220 is It is sufficient to control it to move along the coil module 120 .

Meanwhile, the rail part 100 further includes a switching board 180 extending along the lower wall part to face the coil module.

Although the switching board 180 only extends along the lower wall portion 111 while having a predetermined area in FIG. 5 , a plurality of Hall sensors may be arranged therein, and the Hall sensor is the coil module. It operates with a magnetic field corresponding to the thrust magnet 260 to control the phase change of 120 .

That is, the Hall sensor performs a switching operation according to the interaction with the thrust magnet 260, and is turned on when the magnetic field strength is greater than or equal to a set value, and is turned off when it is less than a set value, thereby providing the on/off signal. It is provided to the control unit 600 . Thus, the control unit 600 controls the phase change of the coil module 120 based on the signal of the Hall sensor.

In this case, although not shown, the distance between the hall sensors may be set equal to the pitch (Pmm) of each of the coil modules 120 in the previous example.

Furthermore, the rail part 100 further includes a measuring board 185 extending along the lower wall part 111 , and the transfer unit 200 includes the mover 220 to face the measuring board 185 . It further includes a measuring magnet 280 extending to the inner surface of the.

That is, the measuring magnet 280 is disposed to face the measuring board 185 , and together with the measuring board 185 , the position of the mover 220 is measured, and the measured position of the mover 220 is The location information is provided to the control unit 600 .

7 is a schematic diagram illustrating an atomic layer deposition system according to another embodiment of the present invention.

The atomic layer deposition system 20 according to the present embodiment includes a supply unit 700 , an additional processing unit 800 , and a recovery unit 900 in the atomic layer deposition system 10 described with reference to FIGS. 1 to 6 . It is characterized in that it is additionally provided.

Accordingly, in the atomic layer deposition system 20 in the present embodiment, only the added components will be described, and overlapping descriptions will be omitted.

Referring to FIG. 7 , in the atomic layer deposition system 20 in this embodiment, in the atomic layer deposition system 10 forming a closed-loop path illustrated in FIG. 3 , the rail unit 100 A supply unit 700 for supplying a furnace substrate portion, a recovery unit 900 for recovering a substrate portion from the rail portion 100, and an additional process for recovering and re-supplying a substrate portion from the rail portion 100 and for the substrate portion An additional processing unit 800 to perform is further provided.

The supply unit 700 is disposed on one side of the rail part 100 so as to be adjacent to the rail part 100 , and supplies the substrate part 404 to the rail part 100 .

Since the transfer unit is being transferred on the rail part 100 , the supply unit 700 is a transfer unit 211 in which a substrate part is not provided on the rail part 100 , and the substrate part 404 is transferred to the rail part 100 . will supply Thus, the substrate unit 404 is mounted on the transfer unit 211 , and a subsequent atomic layer deposition process may be performed.

Meanwhile, the recovery unit 900 is disposed on the other side of the rail part 100 so as to be adjacent to the rail part 100 , and collects the substrate part 406 from the rail part 100 .

That is, the substrate part 406 is transported along the rail part 100 by the transport unit and the predetermined atomic layer deposition process is completed, and is recovered by the recovery unit 900 .

In this way, when the substrate part 406 is recovered by the recovery unit 900, the transfer unit 213 may be continuously transported along the rail part 100 without mounting the substrate part, A new atomic layer deposition process may be performed on the substrate part 404 by receiving a new substrate part 404 from the supply unit 700 .

As described above, the supply unit 700 and the recovery unit 900 are arranged adjacent to the rail part 100, and by supplying and recovering the substrate part, respectively, atomic layer deposition is continuously performed on the new substrate part. process can be performed, and thus the process efficiency of the atomic layer deposition process can be greatly improved.

Meanwhile, the additional processing unit 800 is connected to a part of the rail part 100 , and receives the substrate part 400 from the rail part 100 , and performs an additional processing process for the substrate part 400 . After performing the above, the substrate unit 400 may be provided again as the rail unit 100 .

That is, an additional processing process separate from the atomic layer deposition process, for example, before depositing a predetermined reaction material, for the substrate part transferred along the rail part 100 and on which the atomic layer deposition process is performed. A pre-treatment process to be performed on the substrate part, or a post-processing process to be performed on the substrate part after depositing a predetermined reaction material may be necessary, and this additional processing process may be continuously performed through the deposition units. If this is not possible, the additional processing unit 800 may be additionally provided to perform a necessary additional processing process.

In this case, the additional processing unit 800 includes an additional rail unit 101 capable of continuously performing an additional processing process, separately from the rail unit 100 , and is disposed on the additional rail unit 101 . The process may be performed while transferring the substrate 400 .

In addition, through the additional processing unit 800 as described above, the substrate 400 on which the additional processing process has been performed is transferred back to the rail part 100 on which the atomic layer deposition process is performed, so that additional atoms A layer deposition process is then performed.

On the other hand, the additional processing unit 800, as shown in FIG. 7, in addition to being connected to the middle of the rail part 100, the front end or the rear end of the supply unit 700, as well as the recovery unit The front end or the rear end of 900 may also be connected according to the characteristics of the process.

As described above, through the atomic layer deposition system in this embodiment, various additional processes can be continuously performed in addition to the atomic layer deposition process, thereby greatly improving the process efficiency of the atomic layer deposition process. can do it

According to the embodiments of the present invention as described above, unlike the conventional space-division atomic layer deposition technology, by applying a linear motor system, there is an effect of maximizing productivity by performing a continuous deposition process and an inspection process together. .

That is, in the atomic layer deposition process, in a state in which the deposition unit is fixed, the substrate part is transferred along the rail part and deposition can be sequentially performed through different reactants in each deposition unit. Since it is provided along the rail, process efficiency of the atomic layer deposition process may be further improved by performing atomic layer deposition as a plurality of layers on the plurality of substrate parts.

That is, in the case of performing atomic layer deposition by transferring a substrate in the prior art, it is possible to continuously transfer the substrate portion along the rail portion forming a predetermined path, out of the limit of simply reciprocating or rotating the substrate, so that the number of substrate portions It is possible to perform a continuous deposition process regardless of Since the process may be continuously performed, the process efficiency of the overall atomic layer deposition process may be improved.

That is, the expansion of the linear motor system is easy, so a deposition area can be easily added, and the deposited substrate is classified into a subsequent process through inspection, etc., and the productivity is dramatically improved by continuously providing additional substrates through the mover. can do it

In particular, considering that the substrate is transferred from the lower part of the deposition unit, the deposition unit includes a deposition chamber covering the spray unit, so that the reactants sprayed from the deposition unit can be recovered, thereby minimizing the influence of the adjacent reactants. while the deposition process can be stably performed.

In addition, even if the deposition rates in each of the deposition units are different, the substrate portions may be independently transported in consideration of the deposition rates, and since the spacing between adjacent deposition units may be adjusted in consideration of the speeds of these deposition units, a conventional constant Various deposition processes can be performed by overcoming the limitation of maintaining a constant deposition rate in each deposition unit by controlling only the transport speed or the rotation speed.

On the other hand, by forming a stator in the rail part and implementing the transfer unit as a mover, it is possible to implement independent transfer of these substrate parts. In this case, by forming the switching board including the hall sensor along the inner side of the rail, it is possible to easily perform the three-phase switching control of the coil module, which is the stator.

That is, the linear motor system is a system to which a moving magnet type linear motor is applied, and independent individual driving of a plurality of movers is possible, so that there is no wasted section in the deposition area. Continuous deposition is possible on a plurality of substrates, and it is very easy to change the transfer speed and position of the substrate for deposition.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can.

10, 20: atomic layer deposition system 100: rail part
101: additional rail 120: coil module
130: guide rail 180: switching board
200, 201, 202, 203: transfer unit 210, 211, 212, 213: base part
220, 221, 222, 223: mover 240: block
260: magnetic yoke 261: thrust magnet
280: measuring magnet 300, 301, 302, 303: deposition unit
320: injection unit 400, 401, 402, 403: substrate part
500: chamber unit 600: control unit
700: supply unit 800: post-processing unit
900: recovery unit

Claims (14)

a rail portion extending while forming a predetermined path along the atomic layer deposition process;
a plurality of transfer units each independently transferred on the rail unit;
a plurality of substrate parts mounted on the transfer units and transferred; and
A plurality of deposition units fixed at different positions along the rail portion, maintaining a predetermined gap with the substrate portions located below, and depositing an atomic layer on each substrate portion,
The deposition unit is
a spraying unit for supplying a reactant to the substrate located at a lower portion; and
A deposition chamber that covers the spray unit so that the spray unit is located in the center, and forms a recovery space formed outside the spray unit to recover the reactant supplied to the substrate part so as not to flow into the gap Atomic layer deposition system characterized. According to claim 1, wherein the rail portion,
Atomic layer deposition system, characterized in that it forms a path of a closed-loop or a partly open loop including a straight part or a curved part. 3. The method of claim 2,
a supply unit positioned adjacent to the rail part and supplying the substrate part to each of the transfer units transported along the rail part; and
The atomic layer deposition system further comprising a recovery unit positioned adjacent to the rail part, transported along the rail part, and recovering the substrate part on which the atomic layer deposition process has been performed. 4. The method of claim 3,
The atomic layer deposition system further comprising an additional processing unit connected to any one of the rail unit, the supply unit, and the recovery unit to perform an additional processing process on the substrate unit. delete According to claim 1,
The atomic layer deposition system, characterized in that when the reactant is supplied to and recovered from the substrate portion through the deposition unit, the transfer unit mounting the substrate portion is positioned in a stationary state. According to claim 1,
The atomic layer deposition system further comprising a controller for controlling each of the transfer units to be independently transferred in consideration of the state of the atomic layer deposition performed on each of the substrate parts. According to claim 1, wherein the rail portion,
an upper wall portion and a lower wall portion facing each other;
an inner part connecting the upper wall part and the lower wall part and forming a side space in the center; and
and a coil module that is repeatedly mounted on the side space to form a stator. According to claim 8, wherein the transfer unit,
a base portion facing the upper wall portion, the upper surface of which the substrate portion is mounted;
a bottom portion facing the lower wall portion; and
An atomic layer deposition system comprising a mover connecting the base part and the bottom part and facing the coil module which is the stator. 10. The method of claim 9, wherein the coil module,
a coil yoke fixed on the inner part; and
It includes a coil wound around the coil yoke,
Atomic layer deposition system, characterized in that the three-phase is switched by the three-phase alternating current applied to the coil to form or disappear a magnetic field in the coil yoke. The method of claim 10, wherein the mover,
a magnetic yoke fixed on the mover; and
and a thrust magnet mounted on the magnetic yoke and interacting with a magnetic field formed or extinguished in the coil yoke to move the mover. 12. The method of claim 11,
Three coil modules form a unit coil module along the extending direction of the rail part,
The atomic layer deposition system, characterized in that two thrust magnets are disposed with respect to the unit coil module. The method of claim 11, wherein the rail unit,
Atomic layer deposition, further comprising a switching board extending along the lower wall portion to face the coil module and comprising a Hall sensor operating with a magnetic field corresponding to the thrust magnet to control phase change of the coil module system. 12. The method of claim 11,
The rail part further includes a measuring board extending along the lower wall part,
The transfer unit is fixed on the mover to face the measuring board, the atomic layer deposition system, characterized in that it further comprises a measuring magnet for measuring the position of the mover together with the measuring board.

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