KR20210025392A - Atomic laser deposition system using continuously and independently transferred substrate - Google Patents

Abstract

An atomic layer deposition system using a continuously and independently transferred substrate comprises a rail unit, a plurality of transfer units, a plurality of substrate units, and a plurality of deposition units. The rail unit is extended along an atomic layer deposition process while forming a predetermined route. Each of the transfer units is independently transferred on the rail unit. The substrate units are respectively mounted on the transfer units to be transferred. The deposition units are fixated to different positions along the rail unit and enables an atomic layer to be deposited on each of the substrate units positioned in a lower side.

Description

Atomic layer deposition system using substrates that are continuously transferred individually {ATOMIC LASER DEPOSITION SYSTEM USING CONTINUOUSLY AND INDEPENDENTLY TRANSFERRED SUBSTRATE}

The present invention relates to an atomic layer deposition system, and more particularly, in an atomic layer deposition method of stacking a plurality of atomic layers, a plurality of substrates are continuously transferred independently of each other and as each stacking process is performed, a more effective atomic layer It relates to an atomic layer deposition system using a continuously individually transferred substrate capable of configuring various processes while performing deposition.

Atomic layer deposition (ALD) is a nano-thin film deposition technology using a phenomenon in which a monoatomic layer is chemically attached, and an oxide or metal thin film can be deposited on a substrate in units of atomic layers. It has the characteristic of being able to stack while changing the composition of atoms.

Such an atomic layer deposition method can produce various fine metal patterns by depositing a plurality of layers in atomic layer units. In particular, it is widely used as a process of depositing a thin film on a wafer in a semiconductor process.

However, in the atomic layer deposition method, an oxide or metal thin film must be deposited on an atomic layer basis, and when a plurality of layers are deposited, a reactive gas such as nitrogen must be supplied between the layers, and there is a problem that the process time is relatively increased. Various processes have been proposed as a solution to this.

For example, Korean Patent Registration No. 10-1885525 discloses a technology for increasing process efficiency by sequentially performing deposition with rotation in a state in which a plurality of substrates are fixed on a rotating rotating stage. Similarly, a technique for performing atomic layer deposition by mounting a plurality of substrates on a rotating wheel has been disclosed through Korean Patent No. 10-1888828 and the like.

However, even in the atomic layer deposition process developed up to now, it still takes a lot of process time, so a system that can further reduce the process time is required, and furthermore, it is linked to the pre-treatment or post-treatment process to implement more diverse processes. The demand for atomic layer deposition systems is increasing.

Korean Patent Registration No. 10-1885525 Korean Patent Registration No. 10-1888828

Accordingly, the technical problem of the present invention is conceived in this respect, and the object of the present invention is to reduce the process time in atomic layer deposition, as well as to implement more various processes in connection with the pre-treatment or post-treatment process, It is to provide an atomic layer deposition system using substrates that are continuously transferred individually, which can improve the deposition process efficiency.

An atomic layer deposition system according to an embodiment for realizing the above object of the present invention includes a rail unit, a plurality of transfer units, a plurality of substrate units, and a plurality of deposition units. The rail portion extends while forming a predetermined path according to an atomic layer deposition process. Each of the transfer units is independently transferred on the rail unit. The substrate portions are respectively mounted on and transferred on the transfer units. The deposition units are fixed at different positions along the rail part, and deposit an atomic layer on each of the lower substrate parts.

In one embodiment, the rail portion may include a straight portion or a curved portion to form a closed-loop or partially open-loop path.

In one embodiment, a supply unit positioned adjacent to the rail portion and supplying the substrate portion to each of the transfer units transported along the rail portion, and a supply unit positioned adjacent to the rail portion, transported along the rail portion, and It may further include a recovery unit for recovering the substrate portion on which the layer deposition process has been performed.

In one embodiment, an additional processing unit connected to any one of the rail unit, the supply unit, and the recovery unit may further include an additional processing unit for performing an additional processing process on the substrate unit.

In one embodiment, the deposition unit covers a spray unit for supplying a reactant material to the substrate portion located below, and the spray unit, and recovers the reactant material supplied to the substrate portion between the spray unit and the spray unit. It may include a deposition chamber to form a recovery space.

In an embodiment, when a reactant is supplied and recovered to the substrate through the deposition unit, the transfer unit mounting the substrate may be positioned in a stopped state.

In an embodiment, in consideration of the atomic layer deposition state performed on each of the substrate portions, a controller may further include a control unit for controlling each of the transfer units to be independently transferred.

In one embodiment, the rail portion, the upper wall portion and the lower wall portion facing each other, the inner portion connecting the upper wall portion and the lower wall portion to form a side space at the center, and the side space is repeatedly mounted on the side space to form a stator It may include a coil module.

In one embodiment, the transfer unit, facing the upper wall portion, the base portion on which the substrate portion is mounted on an upper surface, a bottom portion facing the lower wall portion, and connects the base portion and the bottom surface portion, and is the stator It may include a mover facing the coil module.

In one embodiment, the coil module includes a coil yoke fixed on the inner part, and a coil wound around the coil yoke, and is converted into three phases by a three-phase alternating current applied to the coil to the coil yoke. The magnetic field can be formed or destroyed.

In one embodiment, the mover includes a magnetic yoke fixed on the mover, and a thrust magnet mounted on the magnet yoke to move the mover by interacting with a magnetic field formed or extinguished in the coil yoke. I can.

In one embodiment, three coil modules may form a unit coil module along the extending direction of the rail unit, and two thrust magnets may be disposed with respect to the unit coil module.

In one embodiment, the rail unit further includes a switching board including a Hall sensor extending along the lower wall to face the coil module and operating with a magnetic field corresponding to the thrust magnet to control phase switching of the coil module. Can include.

In one embodiment, the rail unit further includes a measurement board extending along the lower wall, and the transfer unit is fixed on the mover so as to face the measurement board, so that the location of the mover together with the measurement board is It may further include a measuring magnet to measure.

According to embodiments of the present invention, unlike a conventional space-division type atomic layer deposition technique, by applying a linear motor system, a continuous deposition process and an inspection process are performed together, thereby maximizing productivity.

That is, in the atomic layer deposition process, while the deposition unit is fixed, the substrate portion is transferred along the rail portion, and deposition can be sequentially performed through different reactants in each deposition unit. Since it is provided along the rail portion, it is possible to further improve the process efficiency of the atomic layer deposition process by performing atomic layer deposition in a plurality of layers on the plurality of substrate portions.

That is, in the case of performing atomic layer deposition by transferring a substrate in the past, it is possible to continuously transfer the substrate portion along the rail portion forming a predetermined path, out of the limit of simply reciprocating or rotating the substrate, and thus the number of substrate portions. A continuous deposition process can be performed irrespective of the process, and in particular, by adding a supply unit, a recovery unit, or an additional processing unit to the rail, continuous supply of the substrate, recovery of the substrate, and treatment during or before the deposition process of the substrate. Since the process can be performed continuously, the process efficiency of the overall atomic layer deposition process can be improved.

That is, the linear motor system can be easily extended, so that a deposition area can be easily added, and the deposited substrate is classified into a subsequent process through inspection, etc., and the productivity is dramatically improved by continuously providing additional substrates through a mover. I can make it.

In particular, considering that the substrate part is transferred from the bottom of the deposition unit, the deposition unit includes a deposition chamber covering the spray unit, so that the reactants sprayed from the deposition unit can be recovered, minimizing the influence of adjacent reactants. While the deposition process can be stably performed.

In addition, even if the deposition rate in each of the deposition units is different, the substrate portions can be independently transferred in consideration of the deposition rate, and the spacing between adjacent deposition units can be adjusted in consideration of the speed of these deposition units. It is possible to perform various deposition processes by overcoming the limitation of maintaining a constant deposition rate in each deposition unit by controlling only the transfer rate or rotation rate.

On the other hand, by forming a stator on the rail portion and implementing the transfer unit as a mover, it is possible to implement independent transfer of such substrate portions. In this case, by forming a switching board including a Hall sensor along the inner side of the rail unit, it is possible to easily perform three-phase switching control of the coil module, which is the stator.

That is, the linear motor system is a system to which a moving magnet type linear motor is applied, and it is possible to independently drive a plurality of movers, so that there is no section discarded in the deposition area. Continuous deposition is possible on a number of substrates, and it is very easy to change the transfer speed and position of the substrate for deposition.

1 is a schematic diagram showing an atomic layer deposition system according to an embodiment of the present invention.
2 is an enlarged view showing an enlarged deposition unit and a transfer unit of FIG. 1.
3 is a perspective view illustrating an example in which the rail unit of FIG. 1 is implemented in a rotary rotation method.
4 is a perspective view of a portion'A' of FIG. 3 observed from a side.
5 is a cross-sectional view taken along line II′ of FIG. 4.
6 is a cross-sectional view taken along line II-II' of FIG. 5.
7 is a schematic diagram showing an atomic layer deposition system according to another embodiment of the present invention.

The present invention will be described in detail in the text, since various modifications can be made and various forms can be obtained. However, this is not intended to limit the present invention to a specific form disclosed, it should be understood to include all changes, equivalents, or substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals have been used for similar elements. Terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms.

In the present application, terms such as "comprise" or "consist of" are intended to designate the presence of features, numbers, steps, actions, elements, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of being added.

Unless otherwise defined, all terms used herein including technical or scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessive formal meaning unless explicitly defined in this application. Does not.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a schematic diagram showing an atomic layer deposition system according to an embodiment of the present invention. 2 is an enlarged view showing an enlarged deposition unit and a transfer unit of FIG. 1.

1 and 2, the atomic layer deposition system 10 according to the present embodiment includes a rail unit 100, a plurality of transfer units 200, 201, 202, 203, and a plurality of substrate units 400, It includes 401, 402, 403, a plurality of deposition units 300, 301, 302, 303, a chamber unit 500, and a control unit 600.

Although the rail part 100 is illustrated to extend in a straight line in one direction in FIG. 1, this is only showing a part of the rail part 100, and in this embodiment, the rail part 100, It extends to form a predetermined path according to the atomic layer deposition process.

In this case, the path formed by the rail unit 100 may be a closed-loop or a partially open open loop, and the shape of the closed loop or the open loop is circular, elliptical, It may be configured in various ways, including a curved portion, a straight portion or a curved portion.

In addition, in consideration of various process variables such as the number of processes constituting the atomic layer deposition process to be performed, process speed, and space for performing the process, the length or area of the rail unit 100 is also formed in various ways. Can be.

An example of the rail unit 100 will be described later with reference to FIG. 3 below, and a part of the rail unit 100 is shown in FIG. 1 to describe the overall configuration of the atomic layer deposition system 10.

The transfer units 200, 201, 202, 203 are located on the rail unit 100 and are transferred on the rail unit 100 along the extending direction of the rail unit 100.

In this case, the transfer units 200, 201, 202, and 203 are each driven by the control unit 600, that is, transfer is controlled, and each transfer unit is controlled individually. It may be transported at different speeds on the part 100, and accordingly, may be positioned at different intervals on the rail part 100.

Of course, under the control of the control unit 600, all of the transfer units on the rail unit 100 are driven at the same speed, and the same distance may be maintained.

The transfer units 200, 201, 202, and 203 have the same configuration, except that each of the transfer units 200, 201, 202, and 203 are driven independently of each other, as described above, so that only the transfer unit 200 will be described below.

The transfer unit 200 will be described in more detail with reference to FIGS. 4 to 6, but includes a base unit 210 and a mover 220.

In this case, the base portion 210 forms an upper surface of the transfer unit 200 and has a plate shape. Thus, each of the substrate portions 400, 401, 402, and 403 is mounted on the upper surface of the base portion 210.

That is, each of the substrate parts 400, 401, 402, 403 is mounted on each of the transfer units 200, 201, 202, 203, and is transferred on the rail part 100 according to the transfer of the transfer unit. do.

Consequently, controlling the transfer of the transfer units 200, 201, 202, 203 in the control unit 600 means controlling the transfer of the substrate parts 400, 401, 402, and 403.

In each of the substrate portions 400, 401, 402, and 403, an atomic layer deposition process is performed by the deposition units 300, 301, 302, 303, and accordingly, the substrate portions 400, 401, 402 , 403), at least one atomic layer is deposited to form a predetermined pattern.

In this case, the atomic layer deposition process performed on each of the substrate portions 400, 401, 402, and 403 may be the same or different from each other, and atoms performed on each of the substrate portions 400, 401, 402, and 403 If the layer deposition processes are different from each other, the deposition units 300, 301, 302, and 303 to be described later perform a deposition process by selecting only some deposition units according to respective substrate parts, and some deposition units are It can be controlled not to perform the deposition process.

The deposition units 300, 301, 302, 303 are disposed above the rail part 100, and perform individual processes of atomic layer deposition on each of the substrate parts 400, 401, 402, and 403.

That is, each of the deposition units 300, 301, 302, 303, in order to perform a predetermined atomic layer deposition process on each of the substrates, the individual deposition process performed by each of the deposition units is preset. Accordingly, each of the deposition units 300, 301, 302, and 303 performs a predetermined individual deposition process on the substrate portion located below.

For example, if deposition of reactant A, reactant B, and reactant C is required in this order, and an atomic layer deposition process that requires treatment of the deposition surface with nitrogen gas, etc. is performed before the deposition of each reactant material. , The first deposition unit 300 deposits the reactive material A onto the substrate, the second deposition unit 301 deposits nitrogen gas onto the substrate, and the third deposition unit 302 deposits the reactant B onto the substrate. , The fourth deposition unit 303 may be configured to deposit nitrogen gas onto the substrate, and the fifth deposition unit (not shown) may be configured to deposit the reactant C onto the substrate.

In addition, the deposition units (300, 301, 302, 303) may be fixed to a predetermined position, in this case, the predetermined position is the process time of the individual deposition process of the atomic layer deposition process, In consideration of the transfer time of the substrate portions, etc., they may be set at the same interval or different intervals.

On the other hand, as shown in Figure 1, the deposition units (300, 301, 302, 303), the interior of the chamber unit 500 covering all of the deposition units (300, 301, 302, 303) It may be located in the space 501, and in this case, the internal space 501 may be controlled to improve the efficiency of the atomic layer deposition process, such as in a vacuum state, if necessary.

In this case, even when the inner space 501 is controlled, such as in the vacuum state, the rail unit 100 may be located outside the chamber unit 500, so that it is separate from the chamber unit 500. Can be configured.

The deposition units 300, 301, 302, and 303 may all have the same structure as shown in FIG. 2, except that different reactants may be sprayed and may be disposed at different intervals. have. Accordingly, one deposition unit 300 will be described below.

More specifically, as shown in FIG. 2, the deposition unit 300 includes a deposition chamber 310 and a spray unit 320.

The injection unit 320 is provided with a plurality of injection units 321 therein, and supplies a reactive material stored in the injection unit 320 to the upper surface of the substrate unit 400, and the substrate unit 400 The reaction material is deposited on the top.

The deposition chamber 310 covers the outside of the injection unit 320 and forms a recovery space 311 between the injection unit 320.

Thus, the reactant material supplied to the substrate unit 400 through the spray unit 320 is recovered through the recovery space 311 and is located above or at one side of the deposition chamber 310 Can be removed via 312.

In this embodiment, the substrate portion 400 is transferred by the transfer unit 200, and different substrate portions are continuously positioned under the spray unit 320. Accordingly, a predetermined gap is required between the upper surface of the substrate unit 400 and the lower surface or lower end of the spray unit 320 and the deposition chamber 310 for transporting the substrate unit 400 Do.

Therefore, the reactant material injected through the injection unit 320 may be discharged to the outside through the gap, so that the deposition chamber 310 is additionally provided outside the injection unit 320, and the discharge By recovering the reacted material through the recovery space 311, it is possible to improve the safety and reliability of the process equipment.

In this case, for more effective recovery of the outflowing reactant, the recovery unit 312 is provided with a separate suction unit capable of suctioning and removing the reactant material, and the The reaction material may be naturally removed to the recovery unit 312 along the recovery space 311 in a flow as shown by an arrow in FIG. 2.

3 is a perspective view illustrating an example in which the rail unit of FIG. 1 is implemented in a rotary rotation method.

As described above, the rail part 100 may be formed of an open or closed loop including a straight part or a curved part to form a predetermined path. FIG. 3 shows that the rail part 100 is a straight part and a curved part. It shows an example formed by a closed loop including all of the parts.

That is, as shown in FIG. 3, when the rail part 100 is formed as a closed loop by connecting a straight part and a curved part to each other, a plurality of transfer units 200, 201, 202 on the rail part 100 , 203) is transferred.

In this case, four transfer units are illustrated by way of example, and the number of transfer units is not limited.

In addition, each of the transfer units, the base portion (210, 211, 212, 213) positioned to be moved along the upper surface of the rail portion 100, and extends in a vertical direction from one end of the base portion, the It is configured to include movers 220, 221, 222, 223 covering the side surfaces of the rail unit 100.

In this case, since the shape, structure, and driving mechanism of each of the transfer units are all the same, the shape, structure, and drive mechanism will be described in detail below by exemplifying one transfer unit 200.

4 is a perspective view of a portion'A' of FIG. 3 observed from a side. 5 is a cross-sectional view taken along line II′ of FIG. 4. 6 is a cross-sectional view taken along line II-II' of FIG. 5.

In this case, FIG. 4 is a part of the straight portion of the rail portion 100 of FIG. 3 cut and illustrated for convenience of explanation, and the side of the rail portion 100 faces the upper portion, and the actual rail portion ( In FIG. 4, the base portion 210 and the mover 220 positioned on the top and side surfaces of 100) are shown to be positioned on the side and the top surface, respectively.

4 to 6, the transfer unit 200 includes a base unit 210 and a mover 220, as described above. In addition, the rail unit 100 includes a frame having a'C' shape and a coil module 120 provided inside the frame.

In this case, the frame of the rail part 100 includes a lower wall part 111, an upper wall part 112, and an inner part 113 connecting the lower wall part 111 and the upper wall part 112 at one side. In this case, between the lower wall part 111, the inner part 113, and the upper wall part 112, the side opened to one side (corresponding to the upper side in FIG. 5, but corresponds to the outside in the actual rail part) The space 114 is formed.

In addition, the coil module 120 is disposed in the side space 114.

More specifically, the base portion 210 is arranged to face each other while maintaining a predetermined distance from the upper wall portion 112, and as described above, the substrate portion 400 is disposed on the upper surface of the base portion 210 It is implemented.

In this case, an encoder head 250 is provided on the bottom surface of the base part 210, and an encoder scale 150 is provided on the upper surface of the upper wall part 112 to face the encoder head 250, and the transfer The transfer state of the unit 200 is checked, and accordingly, the control unit 600 may control more precise transfer of the transfer unit 200.

The mover 220 is formed to be longer than the length of the side portion of the rail portion 100 so as to cover all of the lower wall portion 111 from the upper wall portion 112 of the rail portion 100, and the upper wall portion 112 and It is positioned so as to be spaced apart from the lower wall part 111 by a predetermined distance.

In this case, the mover 220 is formed to have a predetermined width, and accordingly, only when the mover 220 is positioned, the coil module 120 of the rail unit 100 is It performs a transfer action between.

First, the guide rail 130 is continuously extended along the extending direction of the rail part 100 on the lower wall part 111, and the guide rail 130 is also on the upper wall part 112. It extends continuously along the extension direction of 100).

In addition, on the inner surface of the mover 220, a block 240 is provided so as to contact each other with the guide rail 130 formed on the lower wall part 111 and the guide rail 130 formed on the upper wall part 112. Are formed in pairs.

In this case, although not shown in detail, a predetermined sliding guide may be formed on a surface of the block 240 and the guide rail 130 in contact with each other, and accordingly, the block 240 is the guide rail 130 ) Can be slid on. Thus, the mover 220 can move along the guide rail 130 on the rail part 100.

On the other hand, the coil module 120 is located on the side space 114, the coil yoke 121 fixed on the inner part 113 and the coil yoke 121 on the coil yoke 121 It includes a coil 122 that is wound and fixed.

In addition, on the inner surface of the mover 220, a thrust magnet 260 is disposed at a position facing the coil 122, and a magnet between the thrust magnet 260 and the inner surface of the mover 220 The yoke 261 is interposed.

In this embodiment, the coil module 120 forms a so-called stator, and the mover 220 is configured to include the thrust magnet 260, and the mover 220 is on the coil module 120 Transfer is implemented.

As shown in FIG. 4, the coil module 120 is repeatedly disposed along the side surface of the rail unit 100 to form a stator, and in this case, three coil modules 120 are formed as a pair so as to operate with a three-phase AC current. It is repeatedly arranged, and as a whole, it is continuously arranged along the rail unit 100.

That is, a magnetic field is formed or extinguished in the coil yoke 121 while the three-phase is switched by the three-phase AC current applied to the coil 122.

In this case, the thrust magnet 260 moves the mover 220 while interacting with a magnetic field formed or extinguished according to the three-phase conversion of the coil module 120.

As described above, the controller 600 finally controls the three-phase switching of the coil module 120, thereby controlling the driving of the mover 220 moving on the coil module 120.

On the other hand, in order for the mover 220 to be transported on the rail part 100 by interaction with the coil module 120, for example, the thrust magnet 260 and the thrust magnet 260 in an arrangement as shown in FIG. The coil module 120 may be disposed.

That is, as shown in FIG. 6, assuming that three coil modules 120 each having a pitch (Pmm) as a unit coil module, the thrust with respect to the pitch (Pt=3Pmm) occupied by the unit coil module Two magnets 260 may be disposed. Thus, the pitch Pm between the two thrust magnets may be set to half (Pt=2Pm) of the pitch Pt of the unit coil module.

In addition, the two thrust magnets 260 are arranged to have different polarities toward the coil module 120 as shown. Accordingly, as the phases of the neighboring coil modules are switched, the thrust magnets having different polarities interact with each other.

That is, between the coil module and the thrust magnets arranged as described above, according to the three-phase conversion of the coil module 120, attractive force and repulsive force are generated between the coil module 120 and the thrust magnet 260, and While extinguishing, the mover 220 to which the thrust magnet 260 is mounted moves along the rail part 100 in the extending direction of the rail part 100.

However, the arrangement of the coil module 120 and the thrust magnet 260 may be variously changed in addition to the above-described arrangement, and the coil module 120 is phase-switched as a stator, and the mover 220 It is sufficient to control to move along the coil module 120.

Meanwhile, the rail unit 100 further includes a switching board 180 extending along the lower wall portion toward the coil module.

In FIG. 5, the switching board 180 is shown only extending along the lower wall portion 111 while having a predetermined area, but a plurality of Hall sensors may be arranged therein, and the Hall sensor is the coil module It operates with a magnetic field corresponding to the thrust magnet 260 to control the phase change of 120.

That is, the Hall sensor switches according to the interaction with the thrust magnet 260, and is turned on when the strength of the magnetic field is greater than or equal to the set value, and is turned off when the strength of the magnetic field is less than the set value, thereby generating the on/off signal. It is provided to the control unit 600. Thus, the control unit 600 controls the phase change of the coil module 120 based on the signal from the Hall sensor.

In this case, although not shown, the spacing between the Hall sensors may be set equal to the pitch Pmm of each of the coil modules 120 in the previous example.

Further, the rail part 100 further includes a measurement board 185 extending along the lower wall part 111, and the transfer unit 200 faces the measurement board 185 so that the mover 220 It further includes a measurement magnet 280 extending on the inner surface of the.

That is, the measurement magnet 280 is disposed to face the measurement board 185, and together with the measurement board 185, the position of the mover 220 is measured, and the measured position of the mover 220 Location information is provided to the control unit 600.

7 is a schematic diagram showing an atomic layer deposition system according to another embodiment of the present invention.

The atomic layer deposition system 20 according to the present embodiment includes a supply unit 700, an additional processing unit 800, and a recovery unit 900 in the atomic layer deposition system 10 described with reference to FIGS. 1 to 6. It is characterized in that it is additionally provided.

Accordingly, in the atomic layer deposition system 20 in the present embodiment, only the added components will be described, and redundant descriptions will be omitted.

Referring to FIG. 7, in the atomic layer deposition system 20 in this embodiment, in the atomic layer deposition system 10 forming a closed loop type path illustrated in FIG. 3, the rail unit 100 A supply unit 700 for supplying a substrate to a furnace, a recovery unit 900 for recovering a substrate from the rail 100, and an additional process for recovering and resupplying the substrate from the rail 100 An additional processing unit 800 for performing the process is further provided.

The supply unit 700 is disposed on one side of the rail part 100 so as to be adjacent to the rail part 100, and supplies the substrate part 404 to the rail part 100.

Since the transfer unit is in a state in which the transfer unit is transferred on the rail part 100, the supply unit 700 is a transfer unit 211 in which a substrate part is not provided on the rail part 100, and the substrate part 404 is Will be supplied. Thus, the substrate portion 404 is mounted on the transfer unit 211, and a subsequent atomic layer deposition process may be performed.

Meanwhile, the recovery unit 900 is disposed on the other side of the rail unit 100 so as to be adjacent to the rail unit 100, and recovers the substrate unit 406 from the rail unit 100.

That is, the substrate part 406 which is transferred by the transfer unit along the rail part 100 and has completed a predetermined atomic layer deposition process is recovered by the recovery unit 900.

In this way, when the substrate portion 406 is recovered by the recovery unit 900, the transfer unit 213 may be continuously transferred along the rail portion 100 without mounting the substrate portion, By receiving a new substrate portion 404 from the supply unit 700, a new atomic layer deposition process may be performed on the substrate portion 404.

As described above, the supply unit 700 and the recovery unit 900 are disposed to be adjacent to the rail unit 100, so that the supply and recovery of the substrate unit are respectively performed, thereby continuously depositing an atomic layer on a new substrate unit. The process can be performed, and through this, the process efficiency of the atomic layer deposition process can be greatly improved.

Meanwhile, the additional processing unit 800 is connected to a part of the rail unit 100 to receive the substrate unit 400 from the rail unit 100, and an additional processing process for the substrate unit 400 After performing, the substrate part 400 may be provided again as the rail part 100.

That is, for the substrate portion that is transported along the rail portion 100 and subjected to an atomic layer deposition process, an additional processing process separate from the atomic layer deposition process, for example, before depositing a predetermined reactive material. A pre-treatment process to be performed on the substrate portion, or a post-treatment process to be performed on the substrate portion after depositing a predetermined reaction material may be required, and such an additional processing process may be performed continuously through the deposition units. If this is not possible, the additional processing unit 800 may be additionally provided to perform a necessary additional processing process.

In this case, the additional processing unit 800 is provided with an additional rail unit 101 capable of continuously performing an additional processing process, separate from the rail unit 100, and the The process may be performed while transferring the substrate part 400.

In addition, through the additional processing unit 800 as described above, the substrate unit 400, which has been subjected to a separate additional processing process, is transferred back to the rail unit 100 where the atomic layer deposition process is performed, The layer deposition process is performed.

On the other hand, the additional processing unit 800, as shown in Figure 7, in addition to being connected to the middle of the rail unit 100, as well as the front end or the rear end of the supply unit 700, as well as the recovery unit The front end or the rear end of 900 may also be connected according to the characteristics of the process.

As described above, through the atomic layer deposition system in this embodiment, in addition to the atomic layer deposition process, various processes that can be added can be continuously performed, thereby greatly improving the process efficiency of the process using atomic layer deposition. I can make it.

According to the embodiments of the present invention as described above, unlike the conventional space division type atomic layer deposition technique, by applying a linear motor system, a continuous deposition process and an inspection process are performed together, thereby maximizing productivity. .

That is, in the atomic layer deposition process, while the deposition unit is fixed, the substrate portion is transferred along the rail portion, and deposition can be sequentially performed through different reactants in each deposition unit. Since it is provided along the rail portion, it is possible to further improve the process efficiency of the atomic layer deposition process by performing atomic layer deposition in a plurality of layers on the plurality of substrate portions.

That is, in the case of performing atomic layer deposition by transferring a substrate in the past, it is possible to continuously transfer the substrate portion along the rail portion forming a predetermined path, out of the limit of simply reciprocating or rotating the substrate, and thus the number of substrate portions. A continuous deposition process can be performed irrespective of the process, and in particular, by adding a supply unit, a recovery unit, or an additional processing unit to the rail, continuous supply of the substrate, recovery of the substrate, and treatment during or before the deposition process of the substrate. Since the process can be performed continuously, the process efficiency of the overall atomic layer deposition process can be improved.

That is, the linear motor system can be easily extended, so that a deposition area can be easily added, and the deposited substrate is classified into a subsequent process through inspection, etc., and the productivity is dramatically improved by continuously providing additional substrates through a mover. I can make it.

In particular, considering that the substrate part is transferred from the bottom of the deposition unit, the deposition unit includes a deposition chamber covering the spray unit, so that the reactants sprayed from the deposition unit can be recovered, minimizing the influence of adjacent reactants. While the deposition process can be stably performed.

In addition, even if the deposition rates in each of the deposition units are different, the substrate portions can be independently transferred in consideration of the deposition rate, and the spacing between adjacent deposition units can be adjusted in consideration of the rates of these deposition units. It is possible to perform various deposition processes by overcoming the limitation of maintaining a constant deposition rate in each deposition unit by being controlled only by the transfer speed or rotation speed.

On the other hand, by forming a stator on the rail portion and implementing the transfer unit as a mover, it is possible to implement independent transfer of such substrate portions. In this case, by forming a switching board including a Hall sensor along the inner side of the rail unit, it is possible to easily perform three-phase switching control of the coil module, which is the stator.

That is, the linear motor system is a system to which a moving magnet type linear motor is applied, and it is possible to independently drive a plurality of movers, so that there is no section discarded in the deposition area. Continuous deposition is possible on a number of substrates, and it is very easy to change the transfer speed and position of the substrate for deposition.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that you can.

10, 20: atomic layer deposition system 100: rail unit
101: additional rail part 120: coil module
130: guide rail 180: switching board
200, 201, 202, 203: transfer unit 210, 211, 212, 213: base
220, 221, 222, 223: mover 240: block
260: magnetic yoke 261: thrust magnet
280: measurement magnet 300, 301, 302, 303: evaporation unit
320: spray unit 400, 401, 402, 403: substrate portion
500: chamber part 600: control unit
700: supply unit 800: post-treatment unit
900: recovery unit

Claims (14)

A rail portion extending and forming a predetermined path according to an atomic layer deposition process;
A plurality of transfer units each independently transferred on the rail part;
A plurality of substrate portions mounted and transferred on the transfer units, respectively; And
An atomic layer deposition system comprising a plurality of deposition units fixed at different positions along the rail part and depositing an atomic layer on each of the lower substrate parts. The method of claim 1, wherein the rail portion,
An atomic layer deposition system comprising a straight portion or a curved portion to form a closed-loop or partially open-loop path. The method of claim 2,
A supply unit positioned adjacent to the rail unit and supplying the substrate unit to each of the transfer units transported along the rail unit; And
An atomic layer deposition system further comprising a recovery unit positioned adjacent to the rail portion, transported along the rail portion, and recovering the substrate portion subjected to an atomic layer deposition process. The method of claim 3,
An atomic layer deposition system further comprising an additional processing unit connected to one of the rail unit, the supply unit, and the recovery unit to perform an additional processing process on the substrate unit. The method of claim 1, wherein the deposition unit,
A spray unit for supplying a reactant to the substrate portion located below; And
And a deposition chamber that covers the spray unit and forms a recovery space between the spray unit and for recovering the reactant material supplied to the substrate. The method of claim 5,
When the reactant is supplied and recovered to the substrate through the deposition unit, the transfer unit on which the substrate is mounted is positioned in a stopped state. The method of claim 1,
An atomic layer deposition system further comprising a control unit for controlling each of the transfer units to be independently transferred in consideration of the atomic layer deposition state performed on each of the substrate units. The method of claim 1, wherein the rail portion,
An upper wall portion and a lower wall portion facing each other;
An inner portion connecting the upper wall portion and the lower wall portion and forming a side space at the center; And
And a coil module formed as a stator by being repeatedly mounted on the side space. The method of claim 8, wherein the transfer unit,
A base portion facing the upper wall portion and on which the substrate portion is mounted;
A bottom portion facing the lower wall portion; And
An atomic layer deposition system comprising a mover connecting the base part and the bottom part and facing the coil module which is the stator. The method of claim 9, wherein the coil module,
A coil yoke fixed on the inner part; And
It includes a coil wound around the coil yoke,
Atomic layer deposition system, characterized in that the three-phase conversion by the three-phase alternating current applied to the coil to form or dissipate a magnetic field in the coil yoke. The method of claim 10, wherein the mover,
A magnetic yoke fixed on the mover; And
An atomic layer deposition system comprising a thrust magnet mounted on the magnetic yoke and moving the mover by interacting with a magnetic field formed or extinguished in the coil yoke. The method of claim 11,
Three coil modules form a unit coil module along the extending direction of the rail part,
The atomic layer deposition system, characterized in that two thrust magnets are disposed with respect to the unit coil module. The method of claim 11, wherein the rail portion,
Atomic layer deposition, characterized in that it further comprises a switching board extending along the lower wall to face the coil module and including a Hall sensor operating with a magnetic field corresponding to the thrust magnet to control phase switching of the coil module. system. The method of claim 11,
The rail part further comprises a measuring board extending along the lower wall part,
The transfer unit further comprises a measurement magnet fixed on the mover so as to face the measurement board to measure a position of the mover together with the measurement board.

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